Molding mold, resin molding apparatus, method for manufacturing resin molded products, outer frame member, main body member, and intermediate mold

Abstract

To provide a molding mold capable of manufacturing an intermediate mold in a short time, a resin molding apparatus, and a method for manufacturing a resin molded product.SOLUTION: A molding mold includes a molding mold body that holds an object to be molded and has a cavity into which a resin material is supplied. The molding mold body has an upper mold, a lower mold including a pot block in which a pot into which the resin material is filled is formed, and an intermediate mold IM arranged between the upper and lower molds and having a first surface 81 facing the object to be molded. The intermediate mold IM has a main body member 86 having a gate 84 for supplying the resin material to the cavity, an outer frame member 87 arranged on a periphery of the main body member 86, and a holding mechanism 88 for holding the main body member 86 to the outer frame member 87. The main body member 86 and the outer frame member 87 are separable.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product. [Background technology]

[0002] Substrates with semiconductor chips fixed thereto are generally used as electronic components by being resin-sealed. Conventionally, resin molding devices equipped with a mold for transfer molding have been known as resin molding devices for resin-sealing substrates. Transfer molding includes a top gate method in which a resin material is supplied from a direction perpendicular to the substrate (see, for example, Patent Document 1).

[0003] The mold for top gate type transfer molding disclosed in Patent Document 1 is composed of an upper mold, a lower mold, and an intermediate mold (a middle mold in Patent Document 1) between them. In the mold disclosed in Patent Document 1, a runner is formed in the upper mold, a cavity and a gate are formed in the intermediate mold, and a cavity is formed in the lower mold. A runner may also be formed in the intermediate mold. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-196230 A Summary of the Invention [Problem to be solved by the invention]

[0005] In top-gate transfer molding dies, the cavity, gate, runner, etc. are formed in the intermediate die, so machining the intermediate die takes a long time when manufacturing the die. Also, if there is a machining error in the intermediate die or if any part of the intermediate die is damaged, the entire intermediate die becomes unusable.

[0006] Therefore, there is a demand for a molding tool, a resin molding device, and a method for manufacturing a resin molded product that are capable of manufacturing an intermediate mold in a short period of time. [Means for solving the problem]

[0007] A characteristic configuration of the molding die according to the present invention is that it comprises a molding die body that holds an object to be molded and has a cavity into which resin material is supplied, the molding die body having an upper die, a lower die including a pot block in which a pot into which the resin material is filled is formed, and an intermediate die that is arranged between the upper die and the lower die and has a first surface facing the object to be molded, the intermediate die having a main body member having a gate for supplying the resin material to the cavity, an outer frame member that is arranged on the periphery of the main body member, and a holding mechanism that holds the main body member to the outer frame member, and the main body member and the outer frame member are separable.

[0008] A resin molding apparatus according to the present invention is characterized in that it includes the above-described molding die and a mold clamping mechanism that clamps the molding die.

[0009] A feature of the manufacturing method for a resin molded product according to the present invention is that it is a manufacturing method for a resin molded product using the resin molding apparatus described above, and includes a supplying process of supplying the molding object and the resin material to the molding mold, a mold clamping process of clamping the molding mold with the mold clamping mechanism, and a molding process of resin molding the molding object by flowing the molten resin material from the pot through the gate into the cavity. Effect of the Invention

[0010] According to the present invention, it is possible to provide a molding tool, a resin molding device, and a method for manufacturing a resin molded product that are capable of manufacturing an intermediate mold in a short period of time. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic diagram illustrating a resin molding apparatus according to a first embodiment. [Diagram 2] FIG. 2 is a schematic diagram showing a mold clamping mechanism of the resin molding apparatus. [Diagram 3]FIG. 2 is a schematic diagram showing a molding process including a mold clamping process. [Figure 4] FIG. 2 is a schematic diagram showing a molding process including a mold clamping process. [Diagram 5] FIG. 2 is an exploded perspective view of an intermediate mold according to the first embodiment. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. [Figure 9] 9 is a cross-sectional view taken along line IX-IX in FIG. 7. [Figure 10] 8 is a cross-sectional view taken along line XX in FIG. 7. [Figure 11] 10 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12] FIG. 4 is a perspective view showing a first holding member. [Figure 13] FIG. 4 is a perspective view showing a second holding member. [Figure 14] FIG. 11 is a cross-sectional view showing an intermediate mold according to a second embodiment. [Figure 15] FIG. 11 is a cross-sectional view showing an intermediate mold according to a second embodiment. [Figure 16] FIG. 11 is a cross-sectional view showing an intermediate mold according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, embodiments of the molding die, the resin molding device, and the method for manufacturing a resin molded product according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0013] [Overall configuration of the device] Molding objects such as substrates on which semiconductor chips (hereinafter sometimes simply referred to as "chips") are fixed are resin-sealed and used as electronic components. These electronic components are used, for example, as high-frequency module substrates for mobile communication terminals, power control module substrates, and device control substrates. One of the techniques for resin-sealing molding objects is the transfer method, which resin-seals BGA (Ball Grid Array) substrates and the like to manufacture semiconductor packages. This transfer method is a method in which a substrate on which a chip is fixed is placed in a cavity of a molding die, a resin tablet made of solidified powdered resin is supplied to the pot of the molding die and heated and melted, and then the molten resin made by melting the resin tablet is supplied to the cavity with the molding die closed and hardened, and the die is opened to manufacture a resin molded product. Note that the transfer method in this embodiment uses a top gate method.

[0014] The powdered resin includes not only powdered resin but also resin tablets formed of solid resin compressed from powdered resin, and both melt when heated to become liquid molten resin. This powdered resin may be a thermoplastic resin or a thermosetting resin. When heated, the viscosity of the thermosetting resin decreases, and when further heated, it polymerizes and hardens to become a hardened resin. In the present embodiment, the powdered resin is preferably a resin tablet formed of a solid resin from the viewpoint of ease of handling. In addition, it is preferably a highly fluid thermosetting resin containing finely divided filler.

[0015] 1 shows a schematic configuration of a resin molding apparatus 100 according to this embodiment. The resin molding apparatus 100 is an apparatus that molds a pre-resin molding substrate Sa (an example of a molding target) with resin using a molding die C. In this embodiment, the pre-resin molding substrate Sa has a rectangular shape, and a semiconductor chip is fixed thereto in advance.

[0016] The resin molding apparatus 100 includes a CPU 1 as a central control device, a storage unit 8 that stores control information such as a control program, a molding mechanism 2 having a molding die C, a drive mechanism that drives each unit described below, and a touch panel 9 that receives inputs of operation commands and abnormality processing related information from an operator and displays various output information of the resin molding apparatus 100. The CPU 1 constitutes a control unit 10 that controls the operation of each unit of the resin molding apparatus 100 by executing the programs stored in the storage unit 8.

[0017] Unless otherwise specified, the operation of the resin molding apparatus 100 described below is performed based on the operational commands of the control unit 10. In the following description, the operational commands of the control unit 10 will be omitted in principle, and the operational commands of the control unit 10 will be described as necessary.

[0018] The resin molding apparatus 100 is configured by connecting, in this order, a supply module M1 having an in-magazine 7 for storing a plurality of pre-resin-molded substrates Sa, a molding module M2 having a molding die C, and a storage module M3 having an out-magazine 72 for storing resin-molded substrates Sb (an example of a resin molded product) after the pre-resin-molded substrates Sa have been molded with resin, as an integrated device. The supply module M1, the molding module M2, and the storage module M3 are provided with guides G arranged linearly across each of these modules. The guides G are rail-shaped members that allow a loader 40 and an unloader 44, which will be described later, to travel. The guides G are arranged on the rear side of each of the modules.

[0019] The modules are detachable from each other and can be increased or decreased in number. The resin molding apparatus 100 of this embodiment has two molding modules M2. The resin molding apparatus 100 may have only one molding module M2 or three or more molding modules M2.

[0020] [Drive mechanism] The drive mechanism includes a loader 40, a substrate supply unit 42, an unloader 44, a mold clamping mechanism 35, and a transfer mechanism, which will be described later.

[0021] The loader 40 is a transport mechanism that transports the pre-resin-molded substrate Sa into the molding die C. The substrate supply unit 42 is a transport mechanism that pushes out the pre-resin-molded substrate Sa from the in-magazine 7 and passes it to the alignment mechanism 70. The unloader 44 is a transport mechanism that transports the resin-molded substrate Sb from the molding die C. The transfer mechanism is a mechanism that supplies molten resin in the form of a resin tablet T (an example of a resin material) from a pot to a cavity in the molding die C. The mold clamping mechanism 35 is a mechanism that clamps the molding die C. The transfer mechanism is driven independently of the mold clamping mechanism 35.

[0022] The loader 40, the substrate supply unit 42, and the unloader 44 respectively have an actuator 40b, an actuator 42b, and an actuator 44b. The actuators 40b, 42b, and 44b are, for example, air cylinders according to their respective installation locations and the distances to drive each part.

[0023] [Substrate supply unit] The substrate supply unit 42 is a mechanism for pushing out the pre-resin-molding substrates Sa one by one from the in-magazine 7, which is a storage container that stores a plurality of pre-resin-molding substrates Sa at intervals in the vertical direction, and transporting them to the alignment mechanism 70. The substrate supply unit 42 has an actuator 42b. In this embodiment, the substrate supply unit 42 pushes out the pre-resin-molding substrates Sa from the in-magazine 7 by the actuator 42b, and moves them to the alignment mechanism 70 arranged adjacent to the in-magazine 7. The alignment mechanism 70 has a rotating disk 70a, and when the pre-resin-molding substrates Sa are placed, the alignment mechanism 70 rotates the rotating disk 70a to align the pre-resin-molding substrates Sa so that they are in a state suitable for picking up the pre-resin-molding substrates Sa by the loader 40. The substrate supply unit 42, the in-magazine 7, and the alignment mechanism 70 are provided in the supply module M1. The substrate supply unit 42, the in-magazine 7, and the alignment mechanism 70 are arranged on the front side of the guide G in the supply module M1.

[0024] 〔loader〕 The loader 40 is a transport mechanism that carries the resin pre-molding substrate Sa into the molding die C. The loader 40 is movable from the supply module M1 to the molding module M2 along the guide G. The loader 40 has a loader pickup unit 40a that picks up the resin pre-molding substrate Sa and the resin tablet T.

[0025] The loader pickup unit 40a has multiple pairs of claws (not shown) that extend downward. The loader pickup unit 40a drives the pairs of claws by an actuator (not shown) to pick up the pre-resin-molding substrate Sa from the alignment mechanism 70, transports it to above the lower mold LM of the molding die C, and places (carries) it on the lower mold LM. Hereinafter, the pick-up operation by the loader pickup unit 40a will be simply referred to as picking up.

[0026] The loader pickup unit 40a also drives a claw for holding the resin material by another actuator (not shown) to pick up the resin tablet T from the resin supply device 79. The pickup of the resin tablet T is performed in the same manner as the pickup of the pre-resin-molding substrate Sa. However, in this embodiment, one resin tablet T is picked up per one claw.

[0027] The loader pickup unit 40a can be advanced and retreated from the rear side to the front side in Fig. 1 by the actuator 40b. The loader 40 advances and retreats the loader pickup unit 40a to pick up the resin pre-molded substrate Sa from the alignment mechanism 70, and then moves along the guide G from the supply module M1 to the molding module M2 to carry the resin pre-molded substrate Sa into the molding die C. The loader 40 also advances and retreats the loader pickup unit 40a to receive a resin tablet T from the resin supply device 79, and moves from the supply module M1 to the molding module M2 to carry the resin tablet T into the molding die C.

[0028] [Unloader] The unloader 44 is a transport mechanism that transports the resin-molded substrate Sb out of the molding die C. The unloader 44 is movable along the guide G from the molding module M2 to the storage module M3. The unloader 44 has an unloader pickup section 44a that picks up the resin-molded substrate Sb and the like. The unloader pickup section 44a can be advanced and retreated from the rear side to the front side in FIG. 1 by an actuator 44b. The unloader 44 advances and retreats the unloader pickup section 44a to pick up the resin-molded substrate Sb from the lower die LM of the molding die C, moves from the molding module M2 to the storage module M3, and transports the resin-molded substrate Sb to the out-magazine 72 of the storage module M3 to store it there.

[0029] The unloader pickup section 44a has a plurality of pairs of claws (not shown) extending downward, similar to the loader pickup section 40a. The unloader pickup section 44a picks up the paper in the same manner as the loader pickup section 40a.

[0030] [Molding module] Next, the molding module M2 will be described in detail with reference to FIG. 2. As shown in FIG. 2, the molding module M2 has tie bars 32 erected at the four corners of a lower fixed platen 31 having a rectangular shape in plan view, and an upper fixed platen 33 having a rectangular shape in plan view is provided near the upper ends of the tie bars 32. A movable platen 34 having a rectangular shape in plan view is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 has holes at its four corners through which the tie bars 32 pass, and is movable up and down along the tie bars 32. A clamping mechanism 35, which is a device for moving the movable platen 34 up and down, is provided above the lower fixed platen 31. This clamping mechanism 35 includes an electric motor Ma consisting of a servo motor or the like as a drive source, and a load sensor Wa consisting of a strain gauge, a load cell, or the like for measuring the clamping force (hereinafter referred to as the "clamping force") of the molding die C. The mold clamping mechanism 35 can clamp the forming mold C by moving the movable platen 34 upward, and can open the forming mold C by moving the movable platen 34 downward.

[0031] The mold C includes a mold body M having a lower mold LM, an upper mold UM, and an intermediate mold IM. The lower mold LM, the upper mold UM, and the intermediate mold IM are configured with metal dies or the like, with the intermediate mold IM being disposed between the lower mold LM and the upper mold UM.

[0032] The lower mold LM is placed on the lower mold plate 38 placed on the movable platen 34. The lower mold LM includes a base block 51, a lower mold ejector block 52 and a lower mold cavity block 53 arranged on the base block 51, and a pot block 54. The lower mold ejector block 52 is movable in the up-down direction (hereinafter also referred to as the vertical direction) with respect to the base block 51 and the lower mold cavity block 53. The lower mold ejector block 52 houses a plurality of lower mold ejector pins (not shown), and ejects the resin-molded substrate Sb from the lower mold cavity block 53 by the lower mold ejector pins. The lower mold cavity block 53 is held by a lower mold holding block 38a extending upward from the lower mold plate 38 and a plurality of lower mold support pillars 51a. The lower mold holding block 38a has a lower mold holding claw 38b for holding the intermediate mold IM to the lower mold LM.

[0033] The resin pre-molding substrate Sa is placed on the upper surface of the lower die cavity block 53 with the surface on which the semiconductor chip Sc and the like are fixed facing up. In this embodiment, the lower die LM has two lower die cavity blocks 53, 53 arranged side by side on the left and right so that two resin pre-molding substrates Sa can be molded in one molding operation, and the pot block 54 is arranged at a position sandwiched between the two lower die cavity blocks 53, 53. The pot block 54 is formed with a pot 54b, which is a cylindrical recess, and the pot 54b is filled with a resin tablet T (resin that melts when heated). A plunger 54a driven by an electric motor Mb such as a servo motor is inserted below the pot block 54 so as to be movable up and down. An elastic member (not shown) is provided at the support portion of the plunger 54a, and the plunger 54a is slightly displaced by the elastic force of the elastic member to release excessive pressing force and to adapt to variations in the amount of resin when the resin tablet T melts during pressure retention. The lower die LM also has a load sensor Wb, which is configured with a strain gauge, a load cell, or the like, for measuring the force with which the plunger 54a pushes out the molten resin Ta (an example of a resin material).

[0034] The upper mold UM is disposed opposite the lower mold LM with the intermediate mold IM sandwiched therebetween. The upper mold UM includes a holder base 61 fixed to the lower surface of the upper fixed platen 33, a first upper mold ejector block 62 disposed below the holder base 61, a second upper mold ejector block 63, an upper mold cavity block 64, and a cull block 65. The cull block 65 is attached to the lower surface 68 of the upper mold cavity block 64. The first upper mold ejector block 62 and the second upper mold ejector block 63 are movable in the vertical direction relative to the holder base 61 and the upper mold cavity block 64. The first upper mold ejector block 62 houses a plurality of first upper mold ejector pins (not shown). The first upper die ejector pin has a Z-shape, and when the die is opened, it holds the unnecessary resin (hereinafter also referred to as the remaining resin Tb) remaining on the runner 83a, the runner 83, and the gate 84 and hardened in the upper die UM, and then separates the remaining resin Tb from the resin-molded substrate Sb and ejects it from the upper die cavity block 64. The second upper die ejector block 63 houses a plurality of second upper die ejector pins (not shown). The second upper die ejector pins eject the resin-molded substrate Sb from the intermediate die IM. The upper die cavity block 64 is held by an upper die holding block 61a and a plurality of upper die support pillars 61b extending downward from both ends of the holder base 61. The upper die holding block 61a is formed with upper die holding claws 61c for holding the intermediate die IM to the upper die UM.

[0035] The intermediate mold IM has a plate shape, and a runner 83 is formed on a second surface 82 facing the upper mold UM, and a cavity MC is formed on a first surface 81 facing the lower mold LM. Here, in the intermediate mold IM, the surface facing the resin pre-molding substrate Sa is called the molding surface, and the opposite surface is called the non-molding surface. In this embodiment, the second surface 82 is the non-molding surface, and the first surface 81 is the molding surface. The intermediate mold IM has a gate 84 formed from the second surface 82 to the first surface 81 to supply the molten resin Ta flowing through the runner 83 to the cavity MC. In FIG. 2, the intermediate mold IM has a cavity MC that accommodates a plurality of semiconductor chips Sc fixed to the resin pre-molding substrate Sa, and a through hole 85 through which the molten resin Ta flows from the pot 54b is formed in a portion corresponding to the pot 54b of the pot block 54. The molding mold body M of this embodiment is configured as a top gate type in which the gate 84 is arranged above the cavity MC.

[0036] [Method for manufacturing resin molded products] Next, a method for manufacturing a resin molded product will be described with reference to Figs. 1 to 4. The method for manufacturing a resin molded product (resin-molded substrate Sb) includes a supply step of supplying a pre-resin-molded substrate Sa and a resin tablet T to a molding die C, a clamping step of clamping the molding die C, and a molding step of resin-molding the pre-resin-molded substrate Sa by filling a cavity MC with molten resin Ta supplied from a gate 84. This molding step is a step in which the molding module M2 resin-moldes the pre-resin-molded substrate Sa during the period from when the pre-resin-molded substrate Sa is carried into the molding module M2 to when the resin-molded substrate Sb is carried out from the molding module M2, and this molding step includes a clamping step. The operation of the molding die C and the clamping mechanism 35 in the molding step is controlled by the control unit 10.

[0037] First, the supply step will be described. As shown in FIG. 1, the loader 40 is heated in advance with the storage space for the resin tablets T insulated. In addition, the mold body M is heated in advance by energizing a heater (not shown) (see also FIG. 2). Then, two pre-molded resin substrates Sa taken out from the in-magazine 7 are placed on the alignment mechanism 70. The alignment mechanism 70 has a rotating disk 70a, and when the pre-molded resin substrates Sa are placed, the alignment mechanism 70 rotates the rotating disk 70a to align the pre-molded resin substrates Sa so that they are in a state suitable for the loader 40 to pick up the pre-molded resin substrates Sa. The loader pickup unit 40a picks up the pre-molded resin substrates Sa from the alignment mechanism 70 by the actuator 40b and places them on the loader 40, and also receives the resin tablets T from the resin supply device 79 and stores them in the storage space for the resin tablets T of the loader 40. Then, the loader 40 transports the resin pre-molding substrate Sa to the molding module M2, places the resin pre-molding substrate Sa in the substrate setting portion of the lower mold LM with the side on which the semiconductor chip is fixed facing upward, and accommodates the resin tablet T in the pot 54b of the pot block 54 (see FIG. 2). By accommodating the resin tablet T in the pot 54b of the pot block 54, a heater (not shown) built in the lower mold LM heats the resin tablet T to become molten resin Ta.

[0038] 2, the intermediate mold IM is held by the upper mold holding claws 61c, and the second surface 82 is in contact with the lower surface 68 of the upper mold cavity block 64. This makes the intermediate mold IM integrated with the upper mold cavity block 64. At this time, the cull block 65 attached to the upper mold cavity block 64 is inserted into the through hole 85 of the intermediate mold IM, and a cull runner 83a (a resin passage in the cull portion) through which the molten resin Ta flows is formed between the inner peripheral surface of the through hole 85 and the outer peripheral surface of the cull block 65.

[0039] Next, a molding process including a mold clamping process will be described. First, the mold clamping mechanism 35 moves the movable platen 34 upward from the state shown in FIG. 2 to move the lower mold LM in the direction (vertical direction) of the upper mold UM and the intermediate mold IM, and as shown in FIG. 3, the lower mold cavity block 53 and the first surface 81 of the intermediate mold IM are brought into contact with each other. Furthermore, the mold clamping mechanism moves the movable platen 34 upward to further move the lower mold LM toward the upper mold UM, and the mold is clamped. After the mold clamping is completed, the electric motor Mb moves the plunger 54a upward to cause the molten resin Ta to flow from the pot 54b through the runner 83a and the runner 83 to the gate 84. Then, the supply of the molten resin Ta from the gate 84 to the cavity MC is started. After this, the transfer mechanism 39 including the plunger 54a is further raised, and the molten resin Ta in the pot 54b is filled into the cavity MC. After the filling of the cavity MC with the molten resin Ta is completed, a predetermined time is allowed to elapse, and the molten resin Ta is cured.

[0040] After the molten resin Ta has hardened, the control unit 10 moves the movable platen downward using the mold clamping mechanism to open the molding die C. At this time, the intermediate mold IM is held by the lower mold holding claws 38b and moves downward together with the lower mold LM, and the remaining resin Tb is released from the intermediate mold IM and remains in close contact with the upper mold cavity block 64. In other words, as the intermediate mold IM moves away from the upper mold UM, the remaining resin Tb is separated from the resin-molded substrate Sb (see FIG. 4).

[0041] Thereafter, the remaining resin Tb adhered to the upper mold cavity block 64 is released and unloaded from the upper mold cavity block 64 by a plurality of first upper mold ejector pins (not shown) that protrude downward from the upper mold cavity block 64 as the first upper mold ejector block 62 moves downward.

[0042] Next, the movable platen 34 is moved upward again by the mold clamping mechanism 35 to move the lower mold LM toward the upper mold UM and intermediate mold IM, and the lower mold cavity block 53 and the intermediate mold IM are brought into contact with each other. Then, the holding of the intermediate mold IM is switched from the lower mold holding jaws 38b to the upper mold holding jaws 61c. As a result, the intermediate mold IM is integrated with the upper mold UM again.

[0043] Thereafter, the control unit 10 moves the movable platen downward to open the molding die C. At this time, since the intermediate die IM is held by the upper die holding claws 61c, only the lower die LM moves downward. In conjunction with the downward movement of the lower die LM, the second upper die ejector block 63 (not shown) also moves downward, and the second upper die ejector pins protrude downward from the intermediate die IM while still in contact with the resin-molded substrate Sb. As a result, the resin-molded substrate Sb is released from the intermediate die IM and maintained in close contact with the lower die cavity block 53.

[0044] After the lower mold LM moves downward, the lower mold ejector block 52 moves relatively upward, and the lower mold ejector pins (not shown) also rise accordingly. This causes the resin-molded substrate Sb to be released from the lower mold LM, and the resin molding is completed. After that, the resin-molded substrate Sb is picked up by the unloader pickup section 44a of the unloader 44, and the unloader 44 moves the resin-molded substrate Sb from the molding module M2 to the storage module M3. Then, in the storage module M3, the resin-molded substrate Sb is stored in the out-magazine 72 (see FIG. 1).

[0045] [Intermediate type configuration] [First embodiment] As shown in Fig. 5 and Fig. 6, the intermediate mold IM of this embodiment includes a plurality of (two in this embodiment) main body members 86 and an outer frame member 87 arranged on the periphery of the main body member 86. The main body member 86 has a main body molding surface 81a (an example of a first surface) where the cavity MC is formed, a main body non-molding surface 82a (an example of a second surface) which is the surface opposite to the main body molding surface 81a, a runner 83, and a gate 84. The outer frame member 87 has an outer frame molding surface 81b (an example of a first surface), an outer frame non-molding surface 82b (an example of a second surface), and a through hole 85 (a runner 83a). The outer frame member 87 has two rectangular openings 87a, and the two main body members 86 are held by a holding mechanism 88 while being attached to the openings 87a, respectively. The main body member 86 and the outer frame member 87 are separable.

[0046] [Outer frame components] The outer frame member 87 is plate-shaped and has two rectangular openings 87a in a plan view (viewed in a direction perpendicular to the first surface 81; the same applies below). The outer frame member 87 has two short frames 87c and two long frames 87d that form the outer frame of the outer frame member 87, and one central frame 87e that spans the two short frames 87c. Each opening 87a is defined by the two short frames 87c, the one long frame 87d, and the one central frame 87e. A plurality of (five in this embodiment) through holes 85 and a runner 83 are formed in the central frame 87e. Since the two openings 87a have the same shape, only one of the openings 87a will be described below.

[0047] The opening 87a is configured with four inner sides. Specifically, there are two first inner sides 87f (an example of an inner side) formed by the two short frames 87c, a second inner side 87g (an example of an inner side) formed by the long frame 87d, and a third inner side 87h (an example of an inner side) formed by the center frame 87e. Of these, a step portion 87i is formed on each of the two first inner sides 87f. Specifically, the surface of the first inner side 87f adjacent to the outer frame molding surface 81b protrudes further inwardly of the opening 87a than the surface adjacent to the outer frame non-molding surface 82b to form the step portion 87i.

[0048] As shown in Fig. 7, the first inner side surface 87f and the second inner side surface 87g adjacent to the outer frame non-molding surface 82b of the outer frame member 87 are formed with tapers 87j that facilitate the attachment of the main body member 86 to the opening 87a (see also Fig. 8). That is, three tapers 87j are formed in the opening 87a. Also, as shown in Fig. 9, a plurality of (four in this embodiment) hexagon socket head bolts 87k (an example of set screws) are attached to the second inner side surface 87g of the outer frame member 87 in a manner that allows them to protrude from the second inner side surface 87g to the inside of the opening 87a (see also Fig. 5). With the main body member 86 attached to the opening 87a, the hexagon socket head bolts 87k are tightened to protrude from the second inner side surface 87g to the inside of the opening 87a, thereby pressing the main body member 86 against the third inner side surface 87h. This eliminates a gap between the main body non-molding surface 82a of the main body member 86 and the outer frame non-molding surface 82b of the central frame 87e of the outer frame member 87, and prevents the molten resin Ta flowing through the runner 83 from leaking out from between the main body member 86 and the central frame 87e during the manufacture of a resin molded product (resin-molded substrate Sb).

[0049] [Main body member] As shown in FIG. 5 and FIG. 6, the main body member 86 is a rectangular plate in a plan view, a cavity MC is formed in the main body molding surface 81a, and a runner 83 is formed in the main body non-molding surface 82a. A gate 84 is formed from the runner 83 to the cavity MC, penetrating the main body member 86 in the thickness direction. In the main body member 86, an outer side surface 86b facing the first inner side surface 87f of the short frame 87c of the outer frame member 87 is formed with a step portion 86c corresponding to the step portion 87i of the first inner side surface 87f. Specifically, the surface of the outer side surface 86b adjacent to the main body molding surface 81a is recessed more than the surface adjacent to the main body non-molding surface 82a. Therefore, when the main body member 86 is moved downward relative to the opening 87a of the outer frame member 87 with the main body molding surface 81a facing downward and attached, the step portion 86c of the main body member 86 comes into contact with the step portion 87i of the outer frame member 87. As a result, the main body molding surface 81a is held against the outer frame member 87 (see also FIG. 11). Note that, with the step 86c of the main body member 86 in contact with the step 87i of the outer frame member 87, the main body molding surface 81a of the main body member 86 and the outer frame molding surface 81b of the outer frame member 87 become flush with each other, and the main body non-molding surface 82a of the main body member 86 and the outer frame non-molding surface 82b of the outer frame member 87 become flush with each other.

[0050] [Holding mechanism] As shown in FIG. 5, the holding mechanism 88 in this embodiment has a first holding member 88a (an example of a holding member), a second holding member 88b (an example of a holding member), a main body groove 86a (an example of a groove), and an outer frame groove 87b (an example of a groove). The first holding member 88a and the second holding member 88b are fixed to the outer frame member 87 to hold the main body member 86. The main body groove 86a is formed in the main body member 86, and the outer frame groove 87b is formed in the outer frame member 87 at a position continuous from the main body groove 86a. The first holding member 88a is disposed on the first surface 81 side of the main body member 86, and the second holding member 88b is disposed on the second surface 82 side of the main body member 86. The main body member 86 is held relative to the outer frame member 87 by sandwiching the main body member 86 between the first holding member 88a and the second holding member 88b.

[0051] 8, 10, and 11, the first retaining member 88a and the second retaining member 88b are accommodated from the main body groove 86a to the outer frame groove 87b. The depth of the main body groove 86a from the main body molding surface 81a and the main body non-molding surface 82a is slightly deeper than the depth of the outer frame groove 87b from the outer frame molding surface 81b and the outer frame non-molding surface 82b. Furthermore, the outer frame groove 87b is deep enough that, when the first retaining member 88a and the second retaining member 88b are accommodated therein, the first retaining member 88a does not protrude beyond the outer frame molding surface 81b, and the second retaining member 88b does not protrude beyond the outer frame non-molding surface 82b.

[0052] As shown in Figures 12 and 13, the first holding member 88a and the second holding member 88b have the same shape except for the shape of the through hole, which will be described later. Therefore, only the first holding member 88a will be described below, and a description of the second holding member 88b will be omitted. The shape of the through hole will be described for each of the first holding member 88a and the second holding member 88b.

[0053] As shown in FIG. 12, the first holding member 88a has a fixing portion 88c and a holding portion 88d extending from the fixing portion 88c. The fixing portion 88c is accommodated in the outer frame groove portion 87b, and the holding portion 88d is accommodated in the main body groove portion 86a (see also FIG. 8). The first holding member 88a has a substantially D-shape in plan view, and the fixing portion 88c has the above-mentioned through hole formed therein. The through hole formed in the fixing portion 88c of the first holding member 88a is a female thread 88e. On the other hand, the through hole of the fixing portion 88c of the second holding member 88b is a countersunk hole 88f as shown in FIG. 13 (see also FIG. 10 and FIG. 11). A C-chamfer is formed on the end of the fixing portion 88c opposite to the holding portion 88d, and on the end of the holding portion 88d opposite to the fixing portion 88c. 8, 10, and 11, the first holding member 88a and the second holding member 88b are each fixed to the outer frame member 87 by a headed bolt 87l (an example of a bolt; hereinafter, simply referred to as bolt 87l). The fixing portion 88c of the first holding member 88a and the holding portion 88d have the same thickness in the direction along the central axis of the through-hole (female thread 88e).

[0054] As shown in FIG. 8, a through hole 87m is formed at the bottom of the outer frame groove 87b on the outer frame molding surface 81b side where the first holding member 88a is housed, and the through hole 87m is coaxial with the female thread 88e of the housed first holding member 88a, and a bolt 87l that can be fastened to the female thread 88e can be passed through the through hole 87m. Also, a counterbore 87o (an example of a recess) that can house the head 87p of the bolt 87l is formed at the outer frame non-molding surface 82b side of the through hole 87m. The depth of the counterbore 87o is deeper than the thickness of the head 87p of the bolt 87l. Also, as shown in FIG. 10 and FIG. 11, a female thread 87n that can be fastened to the bolt 87l is formed at the bottom of the outer frame groove 87b on the outer frame non-molding surface 82b side where the second holding member 88b is housed, and the female thread 87n is coaxial with the counterbore hole 88f that can house the bolt 87l in the housed second holding member 88b, and the female thread 87n can be fastened to the bolt 87l. In this embodiment, the female thread 87n does not penetrate all the way to the first surface 81, but it may penetrate all the way to the first surface 81. The depth of the countersink in the countersink hole 88f of the second holding member 88b is deeper than the thickness of the head 87p of the bolt 87l.

[0055] As shown in Fig. 5 and Fig. 6, the first holding member 88a is attached to two locations of the long frame 87d of the outer frame molding surface 81b. Also, as shown in Fig. 5 and Fig. 7, the second holding member 88b is attached to one location each of the two short frames 87c, two locations of the long frame 87d, and two locations of the central frame 87e on the outer frame non-molding surface 82b. As described above, on the first surface 81 side, the step 86c of the main body member 86 is held by the step 87i of the short frame 87c, so the first holding member 88a is not required for the short frame 87c on the first surface 81 side. Note that in Fig. 5, the depiction of the second holding member 88b attached to two locations of the central frame 87e is omitted.

[0056] 8, 10, and 11, the first holding member 88a housed on the first surface 81 side and the second holding member 88b housed on the second surface 82 side are both fastened by inserting bolt 87l from the second surface 82 side (outer frame non-molding surface 82b). By inserting bolt 87l from the second surface 82 side in this manner and fastening, the risk of accidentally damaging cavity MC formed in the first surface 81 during fastening or the like is reduced.

[0057] The main body member 86 and the outer frame member 87 have the same thickness. That is, the distance between the main body molding surface 81a and the main body non-molding surface 82a is the same as the distance between the outer frame molding surface 81b and the outer frame non-molding surface 82b. Also, as shown in Figs. 8, 10, and 11, the thicknesses of the first holding member 88a and the second holding member 88b in the direction along the central axis of the through holes (female thread 88e, counterbore 88f) of the fixing portion 88c and the holding portion 88d are the same. Furthermore, the depth of the main body groove 86a from the main body molding surface 81a and the main body non-molding surface 82a is slightly deeper than the depth of the outer frame groove 87b from the outer frame molding surface 81b and the outer frame non-molding surface 82b. Therefore, when the main body member 86 is attached to the outer frame member 87 and held by the first holding member 88a and the second holding member 88b, and the main body molding surface 81a of the main body member 86 is flush with the outer frame molding surface 81b of the outer frame member 87, a gap d exists between the bottom surface of the fixing portion 88c of each of the first holding member 88a and the second holding member 88b and the bottom of the main body groove portion 86a. Due to the existence of the gap d, the main body member 86 is movable by the gap d in the up-down direction (thickness direction of the main body member 86) relative to the outer frame member 87 (first holding member 88a, second holding member 88b).

[0058] If the depth of the main body groove 86a from the main body molding surface 81a and the main body non-molding surface 82a is the same as the depth of the outer frame groove 87b from the outer frame molding surface 81b and the outer frame non-molding surface 82b, the main body member 86 is fixed to the outer frame member 87 without any gap. In that case, even if the main body member 86 and the outer frame member 87 have the same thickness, the main body molding surface 81a of the main body member 86 and the outer frame molding surface 81b of the outer frame member 87 may not be flush with each other due to variations in the depth of the main body groove 86a and the outer frame groove 87b on the first surface 81 and the second surface 82. In that case, a step is generated on the surface of the intermediate mold IM by the main body member 86 and the outer frame member 87, and the mold clamping mechanism cannot properly clamp the molding die. However, as in this embodiment, if the main body member 86 is able to move vertically relative to the outer frame member 87, then simply processing the main body member 86 and the outer frame member 87 to have the same thickness allows the intermediate mold IM to be sandwiched between the upper and lower molds when clamping with the mold clamping mechanism 35, so that the main body member 86 moves vertically relative to the outer frame member 87 so that the main body molding surface 81a and the outer frame molding surface 81b are flush with each other, thereby enabling the molding die to be clamped correctly.

[0059] Second Embodiment Next, the configuration of an intermediate mold IM according to a second embodiment will be described with reference to Figures 14 and 15. In this embodiment, the method of holding the main body molding surface 81a of the main body member 86 with the first inner side surface 87f of the short frame 87c of the outer frame member 87 is different from that of the first embodiment, but the rest of the configuration is the same as that of the first embodiment. Therefore, in the description of this embodiment, the same reference numerals are used for the parts having the same configuration as the first embodiment, and detailed description of the same configuration will be omitted.

[0060] FIG. 14 is a cross-sectional view of the intermediate mold IM at a location where the first holding member 88a is cut perpendicularly to the extension direction of the short frame 87c, showing a cross section from the main body member 86 to the short frame 87c of the outer frame member 87. FIG. 15 is a cross-sectional view of the intermediate mold IM at a location where the second holding member 88b is cut perpendicularly to the extension direction of the short frame 87c, showing a cross section from the main body member 86 to the short frame 87c of the outer frame member 87. In this embodiment, the first inner side surface 87f of the short frame 87c of the outer frame member 87 does not have a step portion 87i formed thereon, and the first inner side surface 87f is flat. Also, the outer side surface 86b of the main body member 86 does not have a step portion 86c formed thereon, and the outer side surface 86b is flat. In the short frame 87c of this embodiment, the main body molding surface 81a is held by the first holding member 88a, and the main body non-molding surface 82a is held by the second holding member 88b.

[0061] Third Embodiment Next, the configuration of an intermediate mold IM according to a third embodiment will be described with reference to Fig. 16. In this embodiment, the method of holding the main body non-molding surface 82a of the main body member 86 with the first inner side surface 87f of the short frame 87c of the outer frame member 87 is different from that of the first embodiment, but the rest of the configuration is the same as that of the first embodiment. Therefore, in the description of this embodiment, the same reference numerals are used for the parts having the same configuration as the first embodiment, and detailed description of the same configuration will be omitted.

[0062] 16 is a cross-sectional view of the intermediate mold IM at a location where the bolt 87l is cut perpendicularly to the extension direction of the short frame 87c, and shows a cross section from the main body member 86 to the short frame 87c of the outer frame member 87. The main body molding surface 81a in this embodiment is held by contact between a step 87i formed on the first inner side surface 87f of the short frame 87c of the outer frame member 87 and a step 86c formed on the outer side surface 86b of the main body member 86. The main body non-molding surface 82a is fixed to the outer frame member 87 by a plurality of bolts 87l that fasten the step 86c and the step 87i. The bolt 87l is inserted from the side of the main body non-molding surface 82a toward the main body molding surface 81a. The head 87p of the bolt 87l is accommodated in the counterbore 87o.

[0063] [Another embodiment] Hereinafter, an embodiment different from the embodiment described above will be described. Note that, for ease of understanding, the same terms and reference numerals will be used for the same members as those in the embodiment described above.

[0064] <1> In the above-described embodiment, the mold is for molding two resin pre-molding substrates Sa in one molding operation, and the intermediate mold IM has two main body members 86, but the mold may be for molding one resin pre-molding substrate Sa in one molding operation, and the intermediate mold IM may have only one main body member 86.

[0065] <2> In the above-described embodiment, the main body member 86 of the intermediate IM is rectangular, but this is not limited thereto. For example, any shape, such as a circular shape, may be used. The size of the main body member 86 is also not limited.

[0066] <3> In the above-described embodiment, the cavity MC is formed only in the intermediate mold IM, but this is not limited to the above. The cavity MC may be formed in both the intermediate mold IM and the lower mold LM, or may be formed only in the lower mold LM.

[0067] <4> In the above-described embodiment, the runner 83 is formed only in the intermediate mold IM, but this is not limited to this. The runner 83 may be formed across the intermediate mold IM and the upper mold UM, or may be formed only in the upper mold UM.

[0068] <5> In the main body member 86 of the above-mentioned embodiment, the depth of the main body groove 86a from the main body molding surface 81a and the main body non-molding surface 82a is formed slightly deeper than the depth of the outer frame groove 87b from the outer frame molding surface 81b and the outer frame non-molding surface 82b. In addition, the thicknesses of the through holes (female thread 88e, countersunk hole 88f) of the fixing portion 88c and the holding portion 88d in the first holding member 88a and the second holding member 88b in the direction along the central axis are the same, but this is not limited to this. The depth of the main body groove 86a and the depth of the outer frame groove 87b may be made the same, and the thickness of the holding portion 88d in the first holding member 88a and the second holding member 88b may be made thinner than the thickness of the fixing portion 88c. In addition, the depth of the main body groove 86a may be made deeper than the depth of the outer frame groove 87b, and the thickness of the holding portion 88d in the first holding member 88a and the second holding member 88b may be made thinner than the thickness of the fixing portion 88c. As long as the main body member 86 is configured to be able to move relative to the outer frame member 87 in the vertical direction, any configuration can be adopted for the relationship between the depth of the main body groove portion 86a and the depth of the outer frame groove portion 87b, and the relationship between the thickness of the retaining portion 88d and the thickness of the fixing portion 88c in the first retaining member 88a and the second retaining member 88b.

[0069] <6> In the above-described embodiment, the number of first holding members 88a and second holding members 88b that hold the main body member 86 is not limited to the number disclosed in the embodiment. The number may be more or less than the number disclosed in the embodiment. In addition, the shape of the first holding member 88a and the second holding member 88b in the above-described embodiment is substantially D-shaped in a plan view, but is not particularly limited as long as it is a shape that is arranged across the main body groove portion 86a and the outer frame groove portion 87b, and may be, for example, a rectangular shape in a plan view.

[0070] <7> In the embodiment described above, when the main body member 86 is attached to the outer frame member 87, the step portion 86c of the main body member 86 contacts the step portion 87i of the outer frame member 87, but this is not limited to this. There may be a gap of about gap d between the step portion 86c of the main body member 86 and the step portion 87i of the outer frame member 87.

[0071] <8> In the first embodiment, as a configuration for holding the main body member 86 on the first inner side surface 87f of the short frame 87c of the outer frame member 87, a step portion 87i is provided on the first inner side surface 87f to hold the step portion 86c of the main body member 86, thereby holding the main body molding surface 81a, and the main body non-molding surface 82a is held by the second holding member 88b. In the second embodiment, the main body molding surface 81a of the main body member 86 is held by the first holding member 88a, and the main body non-molding surface 82a is held by the second holding member 88b. In the third embodiment, the first inner side surface 87f is provided with a step portion 87i to hold the step portion 86c of the main body member 86, thereby holding the main body molding surface 81a, and the main body non-molding surface 82a is held by fastening it with a bolt 87l. However, the method for holding the main body molding surface 81a and the main body non-molding surface 82a is not limited to this. In the outer frame member 87, instead of or in addition to the first inner side surface 87f, a step may be provided on the second inner side surface 87g and the third inner side surface 87h. In addition, the method of holding the main body non-molding surface 82a when the main body molding surface 81a of the main body member 86 is held by the step may be either the second holding member 88b or the bolt 87l, or both. These methods can be freely combined to the extent possible to hold the main body member 86.

[0072] <9> In the embodiment described above, the taper 87j is formed on the two first inner side surfaces 87f and the second inner side surface 87g (the three inner surfaces of the opening 87a) adjacent to the outer frame non-forming surface 82b of the outer frame member 87, but this is not limited thereto. The taper 87j may be formed on at least one of the three inner surfaces of the two first inner side surfaces 87f and the second inner side surface 87g.

[0073] <10> In the above-described embodiment, the mold is for top-gate transfer molding, and the gate is formed above the cavity, but this is not limited thereto. For example, the mold may be one in which the gate is formed below the cavity.

[0074] [Summary of the above embodiment] Hereinafter, an outline of the molding die C, the resin molding apparatus 100, and the method for producing the resin molded product (resin-molded substrate Sb) described in the above embodiment will be described.

[0075] (1) The characteristic configuration of the molding die C is that it comprises a molding die body M having a cavity MC which holds an object to be molded (a substrate before resin molding Sa) and into which a resin material (a resin tablet T, a molten resin Ta) is supplied, the molding die body M having an upper die UM, a lower die LM including a pot block 54 in which a pot 54b into which the resin material (a resin tablet T) is formed, and an intermediate die IM which is arranged between the upper die UM and the lower die LM and has a first surface 81 which faces the object to be molded (a substrate before resin molding Sa), the intermediate die IM having a main body member 86 having a gate 84 which supplies the resin material (molten resin Ta) to the cavity MC, an outer frame member 87 which is arranged on the periphery of the main body member 86, and a holding mechanism 88 which holds the main body member 86 to the outer frame member 87, and the main body member 86 and the outer frame member 87 are separable.

[0076] In the molding die C according to this characteristic configuration, the intermediate mold IM is composed of a main body member 86 and an outer frame member 87. The main body member 86 is held by a holding mechanism 88 relative to the outer frame member 87, and the main body member 86 and the outer frame member 87 are separable from each other. Therefore, the main body member 86 and the outer frame member 87 can be manufactured in parallel, thereby shortening the time required to manufacture the intermediate mold IM. In addition, since the main body member 86 and the outer frame member 87 are manufactured separately, even if a defect occurs in one manufacturing process and the other is discarded, this does not affect the other. Therefore, the intermediate mold IM can be manufactured efficiently.

[0077] (2) In the molding die C described in (1) above, the holding mechanism 88 may include holding members (first holding member 88a, second holding member 88b) fixed to the outer frame member 87 and holding the main body member 86, and groove portions (main body groove portion 86a, outer frame groove portion 87b) formed from the outer frame member 87 to the main body member 86 to accommodate the holding members (first holding member 88a, second holding member 88b).

[0078] With this configuration, the main body member 86 can be held relative to the outer frame member 87 simply by accommodating the holding members (first holding member 88a, second holding member 88b) in the grooves (main body groove 86a, outer frame groove 87b).

[0079] (3) In the molding die C described in (2) above, the main body member 86 may be movable in the up-down direction relative to the holding members (first holding member 88a, second holding member 88b) fixed to the outer frame member 87.

[0080] With this configuration, simply by processing the main body member 86 and the outer frame member 87 to have the same thickness, when the mold is clamped by the mold clamping mechanism 35, the intermediate mold IM is sandwiched between the upper mold UM and the lower mold LM, and the main body member 86 moves in the vertical direction relative to the outer frame member 87 so that the first surface 81 of the main body member 86 becomes flush with the first surface 81 of the outer frame member 87. This allows the molding die C to be clamped correctly.

[0081] (4) In the molding die C described in (2) or (3) above, the retaining members (first retaining member 88a, second retaining member 88b) are fixed to the outer frame member 87 by a bolt (headed bolt 87l), and a head 87p of the bolt (headed bolt 87l) may be accommodated in a recess (countersink 87o) formed on a second surface 82 of the outer frame member 87 opposite the first surface 81.

[0082] With this configuration, the head 87p of the bolt (headed bolt 87l) is accommodated in the recess (countersink 87o), so that when the mold is clamped by the mold clamping mechanism 35, the head 87p of the bolt (headed bolt 87l) does not interfere with the mold clamping.

[0083] (5) In the molding die C described in any one of (1) to (4) above, the outer frame member 87 is formed with a rectangular opening 87a to which the main body member 86 is attached, and a through hole 85 connected to the pot 54b, and at least one of the four inner surfaces (first inner surface 87f, second inner surface 87g, third inner surface 87h) constituting the opening 87a, except for one inner surface adjacent to the through hole 85, of the three inner surfaces (first inner surface 87f, second inner surface 87g, third inner surface 87h), is formed with a taper 87j.

[0084] With this configuration, the main body member 86 can be smoothly attached to the outer frame member 87 along the taper 87j.

[0085] (6) In the molding die C described in (5) above, the main body member 86 may be pressed against one of the inner surfaces of the opening 87a of the outer frame member 87 adjacent to the through-hole 85 by a setscrew (a hexagon socket head bolt 87k).

[0086] With this configuration, the main body member 86 is pressed against one of the inner surfaces of the opening 87a of the outer frame member 87 adjacent to the through hole 85 by a locking screw (hexagon socket bolt 87k), eliminating a gap between the main body member 86 and the outer frame member 87, and preventing molten resin Ta from leaking out from between the main body member 86 and the outer frame member 87 during the manufacture of a resin molded product (resin molded substrate Sb).

[0087] (7) In the molding die C described in any one of (1) to (6) above, the main body member 86 may have a cavity MC on a first surface 81 (main body molding surface 81a) and a runner 83 on a second surface 82 (non-main body molding surface 82a) opposite the first surface 81.

[0088] With this configuration, the top gate type molding die C can be constructed simply by processing the main body member 86.

[0089] (8) The resin molding apparatus 100 is characterized by including the molding die C according to any one of (1) to (7) above, and a clamping mechanism 35 that clamps the molding die C.

[0090] The resin molding apparatus 100 according to this characteristic configuration can manufacture a resin molded product (resin-molded substrate Sb) by using the molding die C described in any one of (1) to (7) above.

[0091] (9) The manufacturing method for a resin molded product (resin-molded substrate Sb) using the resin molding apparatus 100 described in (8) above is characterized in that it includes a supplying process of supplying the molding object (pre-resin-molded substrate Sa) and resin material (resin tablet T) to the molding mold C, a mold clamping process of clamping the molding mold C by the mold clamping mechanism 35, and a molding process of resin molding the molding object (pre-resin-molded substrate Sa) by flowing molten resin material (molten resin Ta) from the pot 54b through the gate 84 into the cavity MC.

[0092] In the manufacturing method of a resin molded product (resin-molded substrate Sb) having this characteristic, a molding object (substrate Sa before resin molding) and a resin material (resin tablet T) are supplied to the molding die C in a supplying step, and then the molding die C is clamped by the clamping mechanism 35 while the resin material (resin tablet T) is heated in a clamping step. Then, in a molding step, the resin material (molten resin Ta) is caused to flow from the pot 54b through the gate 84 into the cavity MC to perform resin molding of the molding object (substrate Sa before resin molding), thereby manufacturing a resin molded product (resin-molded substrate Sb) using the molding die C. [Industrial Applicability]

[0093] The present invention can be used in a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product. [Explanation of symbols]

[0094] 35: Clamping mechanism 54: Pot block 54b: Pot 81: 1st page 81a: Main body molding surface (first surface) 81b: Outer frame molding surface (first surface) 82: 2nd side 82a: Main body non-molding surface (second surface) 82b: Outer frame non-molding surface (2nd surface) 83: Runner 84: Gate 85: Through hole 86: Main body material 86a: Main body groove (groove) 87: Outer frame member 87a: Opening 87b: Outer frame groove (groove) 87f: 1st inner surface (inner surface) 87g: 2nd inner surface (inner surface) 87h: 3rd inner surface (inner surface) 87j :Taper 87k: Hexagon socket head bolt (set screw) 87l: Headed bolt (bolt) 87o: Counterbore (recess) 87p:Head 88: Holding mechanism 88a: First holding member (holding member) 88b: Second holding member (holding member) 100: Resin molding equipment C: Molding mold IM: intermediate type LM: Lower mold M:Mold body MC: Cavity Sa: Substrate before resin molding (object to be molded) Sb: Resin-molded board (resin molded product) T: Resin tablet (resin material) Ta: Molten resin (resin material) UM: Upper mold

Claims

1. The mold body comprises a cavity that holds the object to be molded and through which resin material is supplied, The aforementioned mold body is Upper mold and, A lower mold including a pot block in which a pot filled with the aforementioned resin material is formed, It comprises an intermediate mold positioned between the upper mold and the lower mold, having a first surface facing the object to be molded, The intermediate mold comprises a main body member having a gate for supplying the resin material to the cavity, an outer frame member disposed around the periphery of the main body member, and a holding mechanism for holding the main body member to the outer frame member. The main body member and the outer frame member are separable. The holding mechanism includes a holding member fixed to the outer frame member for holding the main body member, and a groove formed extending from the outer frame member to the main body member for accommodating the holding member.

2. The molding die according to claim 1, wherein the groove portion comprises an outer frame groove portion formed on the surface of the outer frame member and a main body groove portion formed on the surface of the main body member.

3. The molding die according to claim 2, wherein the retaining member has a fixing portion and a retaining portion extending from the fixing portion, and the retaining portion is housed in the groove portion of the main body.

4. The molding die according to claim 2, wherein the depth of the main body groove of the main body member from the first surface is greater than the depth of the outer frame groove of the outer frame member from the first surface, and the depth of the main body groove of the main body member from the second surface opposite to the first surface is greater than the depth of the outer frame groove of the outer frame member from the second surface.

5. The molding die according to claim 1, wherein the main body member is movable in the vertical direction relative to the holding member fixed to the outer frame member.

6. The retaining member is fixed to the outer frame member by bolts. The molding die according to claim 1, wherein the head of the bolt is housed in a recess formed on the second surface of the outer frame member opposite to the first surface.

7. The outer frame member has a rectangular opening into which the main body member is attached, and a through hole connected to the pot. The molding die according to any one of claims 1 to 6, wherein a taper is formed on at least one of the three inner surfaces of the four inner surfaces constituting the opening, excluding the one inner surface adjacent to the through hole.

8. The molding die according to claim 7, wherein the main body member is pressed against one of the inner surfaces of the outer frame member adjacent to the through hole in the opening by a set screw.

9. The mold according to claim 1, wherein the main body member has the cavity on the first surface and a runner on the second surface opposite to the first surface.

10. The mold described in claim 1, A resin molding apparatus comprising a mold clamping mechanism for clamping the aforementioned molding die.

11. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 10, A supply step of supplying the object to be molded and the resin material to the molded die, A mold clamping step in which the mold is clamped by the mold clamping mechanism, A method for manufacturing a resin molded product, comprising a molding step of performing resin molding of an object to be molded by flowing the molten resin material from the pot through the gate into the cavity.

12. An outer frame member constituting an intermediate mold incorporated into a mold body used for resin molding of an object to be molded, An opening into which a main body component with a cavity formed therein can be attached, It comprises a through hole leading to a pot filled with resin material, The main body member is an outer frame member that is detachably held by a holding mechanism.

13. The outer frame member has an outer frame groove for holding the main body member in the outer frame member, The outer frame member according to claim 12, wherein the outer frame groove is formed on the inner circumferential surface of the opening and at a position continuous with the main body groove formed on the outer circumferential surface of the main body member.

14. The outer frame groove is provided with through holes into which bolts are inserted for fixing a retaining member for holding the main body member to the outer frame member, The outer frame member according to claim 13, having a recess for accommodating the head of the bolt, formed on a second surface opposite to the first surface facing the object to be molded.

15. The outer frame member according to claim 12, wherein the opening is rectangular in shape, and at least one of the three inner surfaces constituting the opening, excluding the one inner surface adjacent to the through hole, has a taper formed on it.

16. The outer frame member according to claim 15, wherein the main body member can be pressed against one of the inner surfaces of the opening adjacent to the through hole by a set screw.

17. comprising two short frames, two long frames, and a central frame, The opening is formed in two rectangular shapes by dividing the outer frame, which is rectangular in plan view, by connecting the two short frames and the two long frames, with the central frame spanning between the two short frames. The outer frame member according to claim 12, wherein the main body member can be attached to each of the two openings.

18. comprising two short frames, two long frames, and a central frame, The opening is formed in two rectangular shapes by dividing the outer frame, which is rectangular in plan view, by connecting the two short frames and the two long frames, with the central frame spanning between the two short frames. The main body member can be attached to each of the two openings, The outer frame member according to claim 13, wherein the outer frame grooves are formed in the two short frames, the two long frames, and the central frame, respectively.

19. The central frame has a through hole formed therein that connects to the pot, The outer frame member according to claim 17 or 18, wherein a taper is formed on at least one of the inner surfaces of the two short frames and the two long frames that constitute the opening.

20. A main body member that constitutes an intermediate mold incorporated into a mold body used for resin molding of an object to be molded, Cavity and, A gate for supplying resin material to the cavity, The outer frame member has a through hole that connects to a pot, and a groove formed extending from the outer frame member to the main body member accommodates a retaining member for holding the outer frame member in the opening of the outer frame member, A main body member is detachably held by the aforementioned outer frame member.

21. The main body member according to claim 20, wherein the groove is formed on the outer circumferential surface of the main body member and at a position continuous with the outer frame groove formed on the inner circumferential surface of the opening of the outer frame member.

22. The main body member according to claim 20, having a stepped portion that contacts the outer frame member when attached to the outer frame member.

23. An intermediate mold disposed between an upper mold and a lower mold which includes a pot block in which a pot filled with the resin material is formed, comprising an upper mold which constitutes a mold body having a cavity for holding an object to be molded and for supplying resin material, The device comprises a main body member having a gate for supplying the resin material to the cavity, an outer frame member disposed on the periphery of the main body member, a first surface extending from the main body member to the outer frame member and facing the object to be molded, and a holding mechanism for holding the main body member to the outer frame member. An intermediate type in which the main body member and the outer frame member are separable.

24. The intermediate type according to claim 23, wherein the holding mechanism includes a holding member fixed to the outer frame member and holding the main body member, and a groove formed extending from the outer frame member to the main body member and accommodating the holding member.

25. The groove portion includes a main body groove portion formed on the surface of the main body member, There is a gap between the main body groove and the retaining member. The intermediate type according to claim 24, wherein the main body member is movable vertically by the length of the gap with respect to the holding member fixed to the outer frame member.

26. The retaining member is fixed to the outer frame member by bolts, The intermediate type according to claim 24, wherein the head of the bolt is housed in a recess formed on the second surface of the outer frame member opposite to the first surface.

27. ​​The outer frame member has a rectangular opening into which the main body member is attached, and a through hole connected to the pot, The intermediate type according to any one of claims 23 to 26, wherein a taper is formed on at least one of the three inner surfaces of the four inner surfaces constituting the opening, excluding the one inner surface adjacent to the through hole.

28. The intermediate type according to claim 27, wherein the main body member is pressed against one of the inner surfaces of the outer frame member adjacent to the through hole in the opening by a set screw.

29. The intermediate type according to claim 23, wherein the main body member has the cavity on the first surface and a runner on the second surface opposite to the first surface.

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