Main body sheet for vapor chamber, vapor chamber, and electronic device

Abstract

To provide a main body sheet for a vapor chamber, a vapor chamber, and an electronic device that can provide improved transportability of the vapor chamber.SOLUTION: A vapor chamber 1 includes: a main body sheet having a first main body surface 31a and a second main body surface 31b disposed on the opposite side of the first main body surface; a space part 50 disposed on the first main body surface of the main body sheet; a first sheet layered on the first main body surface of the main body sheet to cover the space part; and a drawn-in part drawn toward the space part relative to the main body sheet or the outer periphery of a first sheet in plan view.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a main body sheet for a vapor chamber, a vapor chamber, and an electronic device. [Background technology]

[0002] Devices that generate heat, such as central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors used in mobile devices such as mobile terminals and tablet terminals, are cooled by heat dissipation members such as heat pipes (see, for example, Patent Document 1). In recent years, there has been a demand for thinner heat dissipation members in order to make mobile terminals thinner, and vapor chambers that can be made thinner than heat pipes have been developed. A working fluid is sealed inside the vapor chamber, and the working fluid absorbs and disperses the heat of the device, thereby cooling the device.

[0003] More specifically, the working fluid in the vapor chamber receives heat from the device in a portion (evaporation section) close to the device and evaporates to become vapor (working vapor). The working vapor diffuses in the vapor passage section in a direction away from the evaporation section, is cooled, and condenses to become liquid. A liquid passage section having a capillary structure (wick) is provided in the vapor chamber, and the liquid of the working fluid (working liquid) enters the liquid passage section from the vapor passage section and flows through the liquid passage section to be transported toward the evaporation section. The working liquid then receives heat again in the evaporation section and evaporates. In this way, the working fluid circulates through the vapor chamber while repeatedly changing phases, that is, evaporating and condensing, thereby transferring heat from the device and increasing the heat dissipation efficiency. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2008-82698 A Summary of the Invention [Problem to be solved by the invention]

[0005] The manufactured vapor chamber is placed and stored in a predetermined location, and then removed from the placement location and transported when shipping or mounting the vapor chamber in a device.

[0006] However, the vapor chamber is thin, the side surface of the vapor chamber is vertical, and there is no part to hold when transporting the vapor chamber, which can make it difficult to transport the vapor chamber.

[0007] In consideration of these points, the present disclosure aims to provide a main body sheet for a vapor chamber, a vapor chamber, and an electronic device that can improve the transportability of the vapor chamber. [Means for solving the problem]

[0008] A first aspect of the present disclosure is A vapor chamber containing a working fluid, a main body sheet having a first main body surface and a second main body surface provided on the opposite side to the first main body surface; a space provided on the first main body surface of the main body sheet; a first sheet laminated on the first main body surface of the main body sheet to cover the space; The vapor chamber has a recessed portion that, in a plan view, is recessed toward the space portion relative to the outer peripheral edge of the main body sheet or the first sheet.

[0009] A second aspect of the present disclosure is a vapor chamber according to the first aspect, The retraction portion may include a first retraction portion provided in the first sheet, the first retraction portion being retracted toward the space portion relative to an outer circumferential edge of the main body sheet in a plan view.

[0010] A third aspect of the present disclosure is a vapor chamber according to the first aspect, The retraction portion may include a main sheet retraction portion provided on the main sheet, the main sheet retraction portion being retracted toward the space portion relative to an outer peripheral edge of the first sheet in a plan view.

[0011] A fourth aspect of the present disclosure is a vapor chamber according to any one of the first to third aspects described above, The first sheet may have, in a plan view, a pair of first side edges extending in a first direction and a pair of second side edges extending in a second direction perpendicular to the first direction, The recessed portions may be provided on a pair of the first side edges and a pair of the second side edges, respectively.

[0012] A fifth aspect of the present disclosure is a vapor chamber according to any one of the first to third aspects described above, The first sheet may have, in a plan view, a pair of first side edges extending in a first direction and a pair of second side edges extending in a second direction perpendicular to the first direction, The recessed portion may be provided on at least one of the pair of first side edges.

[0013] A sixth aspect of the present disclosure is a vapor chamber according to the fifth aspect, The recessed portions may be provided on both of the pair of first side edges.

[0014] A seventh aspect of the present disclosure is a vapor chamber according to each of the fifth aspect and the sixth aspect, The recess may be provided on a portion of the first side edge.

[0015] An eighth aspect of the present disclosure is a vapor chamber according to the fifth aspect, The recessed portion may be provided on one of the pair of first side edges and also on one of the pair of second side edges.

[0016] A ninth aspect of the present disclosure is a vapor chamber according to any one of the first to eighth aspects described above, The recessed portion may be recessed to a position that is 10 μm or more and 1000 μm or less away from the outer circumferential edge of the main body sheet in a plan view.

[0017] A tenth aspect of the present disclosure is a vapor chamber according to any one of the first to ninth aspects described above, The recess may be provided at a position 30 μm or more away from the space in a plan view.

[0018] An eleventh aspect of the present disclosure is a vapor chamber according to any one of the first to tenth aspects described above, A second sheet is provided which is laminated on the second main body surface of the main body sheet, The space portion penetrates from the first body surface to the second body surface, the second sheet covers the space on the second main body surface, The retraction portion may include a second retraction portion provided on the second sheet, the second retraction portion being retracted toward the space portion relative to an outer peripheral edge of the main body sheet in a plan view.

[0019] A twelfth aspect of the present disclosure is a method for manufacturing a semiconductor device comprising: A vapor chamber containing a working fluid, a main body sheet having a first main body surface and a second main body surface provided on the opposite side to the first main body surface; a space provided on the first main body surface of the main body sheet; a first sheet laminated on the first main body surface of the main body sheet to cover the space; a through hole penetrating the main body sheet and the first sheet; The vapor chamber is provided with a recessed portion that, in a plan view, is recessed toward the opposite side of the through hole from an inner peripheral edge that defines the through hole of the main body sheet or the first sheet.

[0020] A thirteenth aspect of the present disclosure is a vapor chamber according to the twelfth aspect, The retraction portion may include a first retraction portion provided on the first sheet, which, when viewed in a plan view, is retracted toward the opposite side of the through hole from the inner peripheral edge that defines the through hole of the main body sheet.

[0021] A fourteenth aspect of the present disclosure is a vapor chamber according to each of the twelfth aspect and the thirteenth aspect, A second sheet is provided which is laminated on the second main body surface of the main body sheet, The space portion penetrates from the first body surface to the second body surface, the second sheet covers the space on the second main body surface, the through hole penetrates the main body sheet, the first sheet, and the second sheet, The retraction portion may include a second retraction portion provided on the second sheet, which, when viewed in a plan view, is retracted toward the opposite side of the through hole from the inner peripheral edge that defines the through hole of the main body sheet.

[0022] A fifteenth aspect of the present disclosure is a vapor chamber according to the twelfth aspect, The retraction portion may be a main sheet retraction portion provided on the main sheet, and may include a main sheet retraction portion that, in a planar view, is retracted on the side opposite the through hole from the inner peripheral edge that defines the through hole of the first sheet.

[0023] A sixteenth aspect of the present disclosure is a method for manufacturing a semiconductor device comprising: Housing and a device contained within the housing; and and a vapor chamber according to any one of the first to fifteenth aspects described above, in thermal contact with the device.

[0024] A seventeenth aspect of the present disclosure is a method for producing a semiconductor device comprising: A main body sheet for a vapor chamber in which a working fluid is sealed, A first body surface; a second body surface provided on the opposite side to the first body surface; A space provided on the first main body surface; An outer periphery in a plan view; This is a main body sheet for a vapor chamber, which is provided with a recessed portion recessed from the outer peripheral edge toward the space portion when viewed in a cross-sectional view along the thickness direction.

[0025] An eighteenth aspect of the present disclosure is a main body sheet for a vapor chamber according to the seventeenth aspect described above, In the cross-sectional view, the lead-in portion may have a lead-in edge extending from the outer circumferential edge, The outer circumferential edge may be located on the second body surface side, The lead-in edge may extend from the outer circumferential edge to the first body surface, The leading edge may be curved concavely toward the space.

[0026] A nineteenth aspect of the present disclosure is a main body sheet for a vapor chamber according to the seventeenth aspect described above, In the cross-sectional view, the lead-in portion may have a lead-in edge extending from the outer circumferential edge, The outer circumferential edge may be located on the second body surface side, The lead-in edge may extend from the outer circumferential edge to the first body surface, The leading edge may be inclined with respect to the thickness direction.

[0027] A twentieth aspect of the present disclosure is a main body sheet for a vapor chamber according to the seventeenth aspect described above, In the cross-sectional view, the lead-in portion may have a lead-in edge extending from the outer circumferential edge, The outer circumferential edge may be located on the second body surface side, The lead-in edge may extend from the outer circumferential edge to the first body surface, The leading edge may be curved convexly toward the opposite side to the space.

[0028] A twenty-first aspect of the present disclosure is a main body sheet for a vapor chamber according to any one of the eighteenth to twentieth aspects described above, The leading edge may be formed so as to approach the space portion as it approaches the first body surface.

[0029] A twenty-second aspect of the present disclosure is a main body sheet for a vapor chamber according to the seventeenth aspect described above, In the cross-sectional view, the lead-in portion may have a lead-in edge extending from the outer circumferential edge, The outer circumferential edge may be located on the second body surface side, The lead-in edge may include a first lead-in edge extending from the first body surface toward the second body surface side, a second lead-in edge extending from the second body surface toward the first body surface side, and a step connecting edge connecting the first lead-in edge and the second lead-in edge.

[0030] A twenty-third aspect of the present disclosure is a main body sheet for a vapor chamber according to the eighteenth aspect described above, The lead-in edge may extend from the outer circumferential edge through a relay point to the first body surface, The lead-in edge may be formed so as to approach the space portion as it approaches the relay point from the outer peripheral edge, and so as to move away from the space portion as it approaches the first main body surface from the relay point.

[0031] A twenty-fourth aspect of the present disclosure is a main body sheet for a vapor chamber according to the seventeenth aspect described above, The retraction portion may include a first body surface side retraction portion provided on the first body surface side and a second body surface side retraction portion provided on the second body surface side, The outer periphery may be located between the first body surface and the second body surface.

[0032] A twenty-fifth aspect of the present disclosure is a main body sheet for a vapor chamber according to the twenty-fourth aspect described above, In the cross-sectional view, the first main body surface side lead-in portion may have a first main body surface side lead-in edge extending from the outer circumferential edge to the first main body surface, The first body surface side lead-in edge may be concavely curved toward the space portion so as to approach the first body surface and the space portion, In the cross-sectional view, the second main body surface side lead-in portion may have a second main body surface side lead-in edge extending from the outer circumferential edge to the second main body surface, The second body surface side lead-in edge may be curved concavely towards the space portion so as to approach the second body surface and approach the space portion.

[0033] A twenty-sixth aspect of the present disclosure is a main body sheet for a vapor chamber according to any one of the seventeenth to twenty-fifth aspects described above, In the plan view, the outer circumferential edge may have a pair of first side edges extending in a first direction and a pair of second side edges extending in a second direction perpendicular to the first direction, The recessed portions may be recessed from a pair of the first side edges and a pair of the second side edges, respectively.

[0034] A twenty-seventh aspect of the present disclosure is a main body sheet for a vapor chamber according to each of the seventeenth to twenty-fifth aspects described above, In the plan view, the outer circumferential edge may have a pair of first side edges extending in a first direction and a pair of second side edges extending in a second direction perpendicular to the first direction, The recessed portion may be recessed from at least one of the pair of first side edges.

[0035] A twenty-eighth aspect of the present disclosure is a main body sheet for a vapor chamber according to the twenty-seventh aspect described above, The retracted portion may be retracted from one of the pair of first side edges and also from one of the pair of second side edges.

[0036] A twenty-ninth aspect of the present disclosure is a main body sheet for a vapor chamber according to any one of the twenty-sixth to twenty-eighth aspects described above, The recessed portion may be recessed from a portion of the first side edge.

[0037] A thirtieth aspect of the present disclosure is a method for producing a semiconductor device comprising the steps of: A main body sheet for a vapor chamber according to any one of the seventeenth to twenty-ninth aspects described above; A vapor chamber comprising a first sheet laminated on the first main body surface and covering the space.

[0038] A thirty-first aspect of the present disclosure is a vapor chamber according to the thirtieth aspect, and a second sheet laminated to the second body surface, The space may extend from the first body surface to the second body surface. The second sheet may cover the space on the second main body surface.

[0039] A thirty-second aspect of the present disclosure is a method for producing a semiconductor device comprising the steps of: Housing and a device contained within the housing; and and a vapor chamber according to the twenty-ninth aspect or the thirtieth aspect, in thermal contact with the device. Effect of the Invention

[0040] According to the present disclosure, the transportability of the vapor chamber can be improved. [Brief description of the drawings]

[0041] [Figure 1] FIG. 1 is a schematic perspective view illustrating an electronic device according to a first embodiment. [Diagram 2] FIG. 2 is a top view showing the vapor chamber according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. [Figure 4] FIG. 4 is a top view of the lower sheet of FIG. [Diagram 5] FIG. 5 is a bottom view of the upper sheet of FIG. [Figure 6] FIG. 6 is a top view of the wick sheet of FIG. [Figure 7] FIG. 7 is a partially enlarged cross-sectional view of FIG. [Figure 8] FIG. 8 is a partially enlarged bottom view of the liquid flow path portion shown in FIG. [Figure 9] FIG. 9 is a view for explaining a material sheet preparing step in the manufacturing method of the vapor chamber according to the first embodiment. [Figure 10] FIG. 10 is a view for explaining an etching step in the method for manufacturing the vapor chamber according to the first embodiment. [Figure 11] FIG. 11 is a view for explaining a bonding step in the manufacturing method of the vapor chamber according to the first embodiment. [Figure 12] FIG. 12 is a diagram showing a state in which vapor chambers manufactured by the vapor chamber manufacturing method according to the first embodiment are stacked and placed on top of each other. [Figure 13] FIG. 13 is a diagram for explaining a method of transporting the vapor chamber in FIG. 12, showing a state in which the claw portion of the hanging device is inserted into the lower sheet lead-in portion. [Figure 14] FIG. 14 is a diagram for explaining a method for transporting the vapor chamber in FIG. 12, showing a state in which the vapor chamber is suspended by a suspension device. [Figure 15] FIG. 15 is a diagram for explaining a general vapor chamber transport method. [Figure 16] FIG. 16 shows a modification (first modification) of FIG. [Figure 17] FIG. 17 is a cross-sectional view taken along line BB in FIG. [Figure 18] FIG. 18 shows a modification (second modification) of FIG. [Figure 19]FIG. 19 shows a modification (third modification) of FIG. [Figure 20] FIG. 20 shows a modification (fourth modification) of FIG. [Figure 21] FIG. 21 shows a modification (fifth modification) of FIG. [Figure 22] FIG. 22 shows a modification (sixth modification) of FIG. [Figure 23] FIG. 23 shows a modified example (seventh modified example) of FIG. [Figure 24] FIG. 24 shows a modified example (eighth modified example) of FIG. [Diagram 25] FIG. 25 is a cross-sectional view taken along line CC in FIG. [Figure 26] FIG. 26 is a diagram for explaining a transfer method of the vapor chamber of FIG. [Figure 27] FIG. 27 shows a modification (ninth modification) of FIG. [Figure 28] FIG. 28 is a top view showing the vapor chamber according to the second embodiment. [Figure 29] FIG. 29 is a cross-sectional view taken along line A'-A' in FIG. [Diagram 30] FIG. 30 is a diagram for explaining a transfer method of the vapor chamber of FIG. [Diagram 31] FIG. 31 shows a modification (fifth modification) of FIG. [Diagram 32] FIG. 32 shows a modification (eighth modification) of FIG. [Diagram 33] FIG. 33 is a cross-sectional view taken along line C'-C' in FIG. [Diagram 34] FIG. 34 is a diagram for explaining a transfer method of the vapor chamber of FIG. [Diagram 35] FIG. 35 is a top view showing the vapor chamber according to the third embodiment. [Diagram 36] FIG. 36 is a cross-sectional view taken along line AA-AA in FIG. [Figure 37] FIG. 37 is a top view of the lower sheet of FIG. [Figure 38]FIG. 38 is a bottom view of the upper sheet of FIG. [Figure 39] FIG. 39 is a top view of the wick sheet of FIG. [Diagram 40] FIG. 40 is a partially enlarged cross-sectional view of FIG. [Diagram 41] FIG. 41 is a partially enlarged bottom view of the liquid flow path portion shown in FIG. [Diagram 42] FIG. 42 is a view for explaining a material sheet preparing step in the manufacturing method for a vapor chamber according to the third embodiment. [Diagram 43] FIG. 43 is a view for explaining an etching step in the manufacturing method of the vapor chamber according to the third embodiment. [Diagram 44] FIG. 44 is a view for explaining a bonding step in the manufacturing method of the vapor chamber according to the third embodiment. [Diagram 45] FIG. 45 is a diagram showing a state in which vapor chambers manufactured by the vapor chamber manufacturing method according to the third embodiment are stacked and placed on top of each other. [Diagram 46] FIG. 46 is a diagram for explaining a method of transporting the vapor chamber in FIG. 45, showing a state in which the claw portion of the hanging device is engaged with the retraction portion. [Figure 47] FIG. 47 is a diagram for explaining a method for transporting the vapor chamber of FIG. 45, showing a state in which the vapor chamber is suspended by a suspension device. [Figure 48] FIG. 48 is a diagram for explaining a general vapor chamber transport method. [Figure 49] FIG. 49 shows a modification (first modification) of FIG. [Figure 50] FIG. 50 shows a modification (second modification) of FIG. [Figure 51] FIG. 51 shows a modification (third modification) of FIG. [Figure 52] FIG. 52 shows a modification (fourth modification) of FIG. [Diagram 53]FIG. 53 shows a modification (fifth modification) of FIG. [Figure 54] FIG. 54 shows a modification (sixth modification) of FIG. [Figure 55] FIG. 55 is a cross-sectional view taken along line BB-BB in FIG. [Figure 56] FIG. 56 shows a modified example (seventh modified example) of FIG. [Figure 57] FIG. 57 shows a modification (eighth modification) of FIG. [Figure 58] FIG. 58 shows a modification (tenth modification) of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0042] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings attached to this specification, the scale and aspect ratios are appropriately changed and exaggerated from those of the actual objects for the convenience of illustration and understanding.

[0043] In addition, terms such as "parallel," "orthogonal," and "same," which specify the shape, geometric conditions, and physical characteristics and their degree, as well as the values ​​of lengths, angles, and physical characteristics, used in this specification, are to be interpreted including the range in which similar functions can be expected without being bound by strict meanings. Furthermore, in the drawings, the shapes of multiple parts that can be expected to have similar functions are regularly described for clarity, but the shapes of the parts may be different from each other within the range in which the functions can be expected without being bound by strict meanings. In addition, in the drawings, the boundary lines indicating the joint surfaces between members are shown as simple straight lines for convenience, but the shape of the boundary lines is arbitrary within the range in which the desired joint performance can be expected without being bound by strict straight lines. In addition, there may be cases in which the boundary lines are lost due to the joining of members.

[0044] (First embodiment) A vapor chamber and an electronic device according to a first embodiment will be described with reference to Figs. 1 to 8. The vapor chamber 1 according to this embodiment is a device mounted on an electronic device E in order to cool a device D (a device to be cooled) as a heat generating body housed in the electronic device E. Examples of the electronic device E include mobile terminals such as portable terminals and tablet terminals. Examples of the device D include electronic devices that generate heat, such as a central processing unit (CPU), a light emitting diode (LED), and a power semiconductor.

[0045] Here, first, an electronic device E equipped with the vapor chamber 1 according to the present embodiment will be described by taking a tablet terminal as an example. As shown in FIG. 1, the electronic device E (tablet terminal) includes a housing H, a device D accommodated in the housing H, and a vapor chamber 1. In the electronic device E shown in FIG. 1, a touch panel display TD is provided on the front surface of the housing H. The vapor chamber 1 is accommodated in the housing H and arranged so as to be in thermal contact with the device D. This allows the vapor chamber 1 to receive heat generated in the device D when the electronic device E is used. The heat received by the vapor chamber 1 is released to the outside of the vapor chamber 1 via the working fluids 2a and 2b described later. In this way, the device D is effectively cooled. When the electronic device E is a tablet terminal, the device D corresponds to a central processing unit or the like.

[0046] Next, the vapor chamber 1 according to the present embodiment will be described. As shown in Fig. 2 and Fig. 3, the vapor chamber 1 has a sealed space 3 in which working fluids 2a and 2b are sealed. The working fluids 2a and 2b in the sealed space 3 repeatedly undergo phase changes, thereby cooling the device D of the electronic device E described above. Examples of the working fluids 2a and 2b include pure water, ethanol, methanol, acetone, etc., and mixtures thereof.

[0047] 2 and 3, the vapor chamber 1 includes a lower sheet 10 (first sheet), an upper sheet 20 (second sheet), and a wick sheet 30 (main body sheet) for the vapor chamber interposed between the lower sheet 10 and the upper sheet 20. In this embodiment, the vapor chamber 1 includes one wick sheet 30. In the vapor chamber 1 according to this embodiment, the lower sheet 10, the wick sheet 30, and the upper sheet 20 are laminated and joined in this order.

[0048] The vapor chamber 1 is generally formed in a thin flat plate shape. The planar shape of the vapor chamber 1 is arbitrary, but may be a rectangle as shown in FIG. 2. The planar shape of the vapor chamber 1 may be, for example, a rectangle with one side being 1 cm and the other side being 3 cm, or a square with one side being 15 cm, and the planar dimensions of the vapor chamber 1 are arbitrary. In this embodiment, as an example, an example in which the planar shape of the vapor chamber 1 is a rectangle with the X direction as the longitudinal direction will be described. Note that the planar shape of the vapor chamber 1 is not limited to a rectangle, and may be any shape, such as a circle, an ellipse, an L-shape, or a T-shape.

[0049] As shown in FIG. 2, the vapor chamber 1 has an evaporation region SR where the working fluids 2a and 2b evaporate, and a condensation region CR where the working fluids 2a and 2b condense.

[0050] The evaporation region SR is a region that overlaps with the device D in a planar view, and is a region where the device D is attached. The evaporation region SR can be disposed at any location in the vapor chamber 1. In this embodiment, the evaporation region SR is formed on one side in the X direction of the vapor chamber 1 (the left side in FIG. 2). Heat from the device D is transferred to the evaporation region SR, and this heat causes the liquid of the working fluid (suitably referred to as working liquid 2b) to evaporate in the evaporation region SR. The heat from the device D can be transferred not only to the region that overlaps with the device D in a planar view, but also to the periphery of that region. For this reason, the evaporation region SR includes the region that overlaps with the device D in a planar view and the periphery of that region. Here, a planar view refers to a state in which the vapor chamber 1 is viewed from a direction perpendicular to the surface that receives heat from the device D (the first lower sheet surface 10a of the lower sheet 10 described later) and the surface that releases the received heat (the second upper sheet surface 20b of the upper sheet 20 described later), and corresponds to, for example, the state in which the vapor chamber 1 is viewed from above or below, as shown in Figure 2.

[0051] The condensation region CR is a region that does not overlap with the device D in a plan view, and is a region where the vapor of the working fluid (suitably referred to as working vapor 2a) mainly releases heat and condenses. The condensation region CR can also be said to be a region surrounding the evaporation region SR. In this embodiment, the condensation region CR is formed on the other side in the X direction of the vapor chamber 1 (the right side in FIG. 2). In the condensation region CR, heat from the working vapor 2a is released to the upper sheet 20, and the working vapor 2a is cooled and condensed in the condensation region CR.

[0052] When the vapor chamber 1 is installed inside a mobile terminal, the up-down relationship may be lost depending on the attitude of the mobile terminal. However, in this embodiment, for convenience, the sheet that receives heat from the device D is referred to as the above-mentioned lower sheet 10, and the sheet that dissipates the received heat is referred to as the above-mentioned upper sheet 20. For this reason, the following description will be given with the lower sheet 10 disposed on the lower side and the upper sheet 20 disposed on the upper side.

[0053] First, the lower sheet 10 will be described.

[0054] 3, the lower sheet 10 has a first lower sheet surface 10a provided on the side opposite the wick sheet 30, and a second lower sheet surface 10b provided on the side opposite the first lower sheet surface 10a (i.e., the side of the wick sheet 30). The lower sheet 10 may be formed to be generally flat, or may have a uniform thickness overall. The above-mentioned device D is attached to this first lower sheet surface 10a.

[0055] As shown in FIG. 4, the planar shape of the lower sheet 10 may be generally rectangular. More specifically, the lower sheet 10 may have a pair of longitudinal side edges 11a, 11b (first side edges) extending in the X direction (first direction) and a pair of lateral side edges 11c, 11d (second side edges) extending in the Y direction (second direction) perpendicular to the X direction in a plan view. The pair of longitudinal side edges 11a, 11b are provided on both sides in the Y direction. The longitudinal side edge 11a is provided on one side in the Y direction (lower side in FIG. 4), and the longitudinal side edge 11b is provided on the other side in the Y direction (upper side in FIG. 4). The pair of lateral side edges 11c, 11d are provided on both sides in the X direction. The short-side edge 11c is provided on one side in the X direction (the left side in FIG. 4), and the short-side edge 11d is provided on the other side in the X direction (the right side in FIG. 4). As described later, the lower sheet 10 is formed smaller than the wick sheet 30 as a whole in a plan view. For this reason, the outer peripheral edge 11o of the lower sheet 10, i.e., the pair of longitudinal side edges 11a, 11b and the pair of short-side side edges 11c, 11d, are provided with lower-sheet retractions 15a, 15b, 15c, and 15d (first retractions) described later, respectively.

[0056] As shown in Fig. 4, the lower sheet 10 may have a rectangular lower sheet main body 11 and a lower sheet injection protrusion 13 protruding outward from the lower sheet main body 11. In the example shown in Fig. 4, the lower sheet injection protrusion 13 is provided on the short side edge 11c and protrudes from the short side edge 11c to one side in the X direction (the left side in Fig. 4).

[0057] Also, as shown in Fig. 4, alignment holes 12 may be provided at the four corners of the lower sheet main body 11 of the lower sheet 10. In the example shown in Fig. 4, the planar shape of the alignment holes 12 is circular, but this is not limited to this. The alignment holes 12 may penetrate the lower sheet main body 11.

[0058] Next, the upper sheet 20 will be described.

[0059] As shown in Fig. 3, the upper sheet 20 has a first upper sheet surface 20a provided on the wick sheet 30 side and a second upper sheet surface 20b provided on the opposite side to the first upper sheet surface 20a. The upper sheet 20 may be formed flat overall, or may have a constant thickness overall. A housing member Ha constituting a part of a housing H of a mobile terminal or the like is attached to the second upper sheet surface 20b. The second upper sheet surface 20b may be entirely covered with the housing member Ha.

[0060] As shown in FIG. 5, the planar shape of the upper sheet 20 may be generally rectangular. More specifically, the upper sheet 20 may have a pair of longitudinal side edges 21a, 21b extending in the X direction and a pair of lateral side edges 21c, 21d extending in the Y direction in a plan view. The pair of longitudinal side edges 21a, 21b are provided on both sides in the Y direction. The longitudinal side edge 21a is provided on one side in the Y direction (the lower side in FIG. 5), and the longitudinal side edge 21b is provided on the other side in the Y direction (the upper side in FIG. 5). The pair of lateral side edges 21c, 21d are provided on both sides in the X direction. The lateral side edge 21c is provided on one side in the X direction (the left side in FIG. 5), and the lateral side edge 21d is provided on the other side in the X direction (the right side in FIG. 5). As described later, the upper sheet 20 is formed to be smaller overall than the wick sheet 30 in a plan view. For this reason, the outer peripheral edge 21o of the upper sheet 20, i.e., the pair of longitudinal side edges 21a, 21b and the pair of lateral side edges 21c, 21d, are provided with upper sheet retractions 25a, 25b, 25c, and 25d (second retractions) described later, respectively.

[0061] As shown in Fig. 5, the upper sheet 20 may have a rectangular upper sheet main body 21 and an upper sheet injection protrusion 23 protruding outward from the upper sheet main body 21. In the example shown in Fig. 5, the upper sheet injection protrusion 23 is provided on the short-side side edge 21c and protrudes from the short-side side edge 21c to one side in the X direction (the left side in Fig. 5).

[0062] 5, alignment holes 22 may be provided at the four corners of the upper sheet main body 21 of the upper sheet 20. In the example shown in FIG. 5, the planar shape of the alignment holes 22 is circular, but is not limited to this. The alignment holes 12 may penetrate the upper sheet main body 21.

[0063] Next, the wick sheet 30 will be described.

[0064] 3, the wick sheet 30 includes a sheet body 31 and a steam flow path portion 50 (space portion) provided in the sheet body 31. The sheet body 31 has a first body surface 31a and a second body surface 31b provided on the opposite side to the first body surface 31a. The first body surface 31a is disposed on the lower sheet 10 side, and the second body surface 31b is disposed on the upper sheet 20 side.

[0065] The second lower sheet surface 10b of the lower sheet 10 and the first main body surface 31a of the sheet main body 31 may be permanently joined to each other by thermocompression. Similarly, the first upper sheet surface 20a of the upper sheet 20 and the second main body surface 31b of the sheet main body 31 may be permanently joined to each other by thermocompression. An example of joining by thermocompression is diffusion bonding. However, the lower sheet 10, the upper sheet 20, and the wick sheet 30 may be joined by other methods such as brazing, instead of diffusion bonding, as long as they can be permanently joined. The term "permanently joined" is not limited to a strict meaning, and is used as a term to mean that the lower sheet 10 and the wick sheet 30 are joined to a degree that the sealing property of the sealed space 3 can be maintained during the operation of the vapor chamber 1, and that the upper sheet 20 and the wick sheet 30 are joined to a degree that the joining can be maintained.

[0066] As shown in FIG. 6, the outer shape of the wick sheet 30 may be generally rectangular in plan view. More specifically, the wick sheet 30 may have a pair of longitudinal side edges 32a, 32b extending in the X direction and a pair of lateral side edges 32c, 32d extending in the Y direction in plan view. The pair of longitudinal side edges 32a, 32b are provided on both sides in the Y direction. The longitudinal side edge 32a is provided on one side in the Y direction (lower side in FIG. 6), and the longitudinal side edge 32b is provided on the other side in the Y direction (upper side in FIG. 6). The pair of lateral side edges 32c, 32d are provided on both sides in the X direction. The lateral side edge 32c is provided on one side in the X direction (left side in FIG. 6), and the lateral side edge 32d is provided on the other side in the X direction (right side in FIG. 6).

[0067] As shown in Fig. 6, the wick sheet 30 may have a wick sheet injection protrusion 36 that protrudes outward from the frame body portion 32. In the example shown in Fig. 6, the wick sheet injection protrusion 36 is provided on the short side edge 32c and protrudes from the short side edge 32c to one side in the X direction (the left side in Fig. 6).

[0068] 6, alignment holes 35 may be provided at the four corners of the sheet body 31 of the wick sheet 30. In the example shown in FIG. 6, the planar shape of the alignment holes 35 is circular, but is not limited to this. The alignment holes 35 may penetrate the sheet body 31.

[0069] 3 and 6, the sheet body 31 of the wick sheet 30 according to this embodiment has a frame portion 32 formed in a rectangular frame shape in a plan view, and a plurality of land portions 33 provided within the frame portion 32. The frame portion 32 and the land portions 33 are portions that are not etched in the etching step described below, and the material of the wick sheet 30 remains.

[0070] In this embodiment, the frame portion 32 is formed in a rectangular frame shape in a plan view. A steam flow path portion 50 (space portion) is provided inside the frame portion 32. Each land portion 33 is provided in the steam flow path portion 50, and the working steam 2a flows around each land portion 33. That is, the steam flow path portion 50 includes the above-mentioned multiple land portions 33 and steam paths 51, 52, which are provided around each land portion 33 and will be described later and are paths through which the working steam 2a flows.

[0071] In this embodiment, the land portion 33 may extend in an elongated shape with the X direction (left-right direction in FIG. 6) as the longitudinal direction in a plan view, and the planar shape of the land portion 33 may be an elongated rectangular shape. The lands 33 may be arranged parallel to each other at equal intervals in the Y direction (up-down direction in FIG. 6) perpendicular to the X direction. The width w1 of the land portion 33 (see FIG. 7) may be, for example, 100 μm to 1500 μm. Here, the width w1 of the land portion 33 is the dimension of the land portion 33 in the Y direction, and means the dimension at the position where the penetrating portion 34 described later exists in the Z direction. Here, the Z direction corresponds to the up-down direction in FIG. 3 and FIG. 7, and corresponds to the thickness direction of the wick sheet 30.

[0072] The frame portion 32 and each land portion 33 are joined to the lower sheet 10 by thermocompression bonding, and are also joined to the upper sheet 20 by thermocompression bonding. A wall surface 53a of the lower steam flow path recess 53 and a wall surface 54a of the upper steam flow path recess 54 described below form side walls of the land portion 33. The first main body surface 31a and the second main body surface 31b of the sheet main body 31 may be formed flat across the frame portion 32 and each land portion 33.

[0073] The vapor flow path section 50 is a flow path through which the working vapor 2a mainly passes. The working liquid 2b may also pass through the vapor flow path section 50. As shown in Figs. 3 and 7, the vapor flow path section 50 may penetrate from the first main body surface 31a to the second main body surface 31b. That is, it may penetrate the sheet main body 31 of the wick sheet 30. The vapor flow path section 50 may be covered by the lower sheet 10 on the first main body surface 31a, and may be covered by the upper sheet 20 on the second main body surface 31b.

[0074] As shown in FIG. 6, the steam flow path section 50 in this embodiment has a first steam passage 51 and a plurality of second steam passages 52. The first steam passage 51 is formed between the frame body section 32 and the land section 33. The first steam passage 51 is formed inside the frame body section 32 and continuously outside the land section 33. The first steam passage 51 has a planar shape of a rectangular frame. The second steam passage 52 is formed between the adjacent land sections 33. The second steam passage 52 has a planar shape of an elongated rectangle. The steam flow path section 50 is divided into the first steam passage 51 and the plurality of second steam passages 52 by the plurality of land sections 33.

[0075] 3, the first steam passage 51 and the second steam passage 52 penetrate from the first main body surface 31a to the second main body surface 31b of the sheet main body 31. That is, they penetrate the wick sheet 30 in the Z direction. The first steam passage 51 and the second steam passage 52 are each formed by a lower steam flow path recess 53 provided in the first main body surface 31a and an upper steam flow path recess 54 provided in the second main body surface 31b. The lower steam flow path recess 53 and the upper steam flow path recess 54 are in communication with each other, and the first steam passage 51 and the second steam passage 52 of the steam flow path section 50 are formed to extend from the first main body surface 31a to the second main body surface 31b.

[0076] The lower steam flow path recess 53 is formed in a concave shape on the first main body surface 31a by etching from the first main body surface 31a of the wick sheet 30 in an etching step described below. As a result, the lower steam flow path recess 53 has a wall surface 53a formed in a curved shape, as shown in Fig. 7. This wall surface 53a defines the lower steam flow path recess 53, and in the cross section shown in Fig. 7, is curved so as to approach the opposing wall surface 53a as it proceeds toward the second main body surface 31b. Such a lower steam flow path recess 53 constitutes a part (lower half) of the first steam passage 51 and a part (lower half) of the second steam passage 52.

[0077] The upper steam flow path recess 54 is formed in a concave shape on the second main body surface 31b by etching from the second main body surface 31b of the wick sheet 30 in an etching step described below. As a result, the upper steam flow path recess 54 has a wall surface 54a formed in a curved shape, as shown in Fig. 7. This wall surface 54a defines the upper steam flow path recess 54, and in the cross section shown in Fig. 7, it is curved so as to approach the opposing wall surface 54a as it proceeds toward the first main body surface 31a. Such an upper steam flow path recess 54 constitutes a part (upper half) of the first steam passage 51 and a part (upper half) of the second steam passage 52.

[0078] As shown in FIG. 7, the wall surface 53a of the lower steam passage recess 53 and the wall surface 54a of the upper steam passage recess 54 are connected to each other to form the through-portion 34. The wall surface 53a and the wall surface 54a are curved toward the through-portion 34. As a result, the lower steam passage recess 53 and the upper steam passage recess 54 are connected to each other. In this embodiment, the planar shape of the through-portion 34 in the first steam passage 51 is a rectangular frame shape similar to the first steam passage 51, and the planar shape of the through-portion 34 in the second steam passage 52 is an elongated rectangular shape similar to the second steam passage 52. The through-portion 34 may be defined by a ridge line formed by joining the wall surface 53a of the lower steam passage recess 53 and the wall surface 54a of the upper steam passage recess 54 and projecting inward. The planar area of ​​the steam passage portion 50 is minimum at this through-portion 34. The widths w2, w2' of the through portion 34 (see FIG. 7) may be, for example, 400 μm to 1600 μm. Here, the width w2 of the through portion 34 corresponds to the gap between adjacent land portions 33 in the Y direction. Moreover, the width w2' of the through portion 34 corresponds to the gap between the frame portion 32 and the land portion 33 in the Y direction (or the X direction).

[0079] The position of the through-hole 34 in the Z direction may be an intermediate position between the first main body surface 31a and the second main body surface 31b, or may be a position shifted downward or upward from the intermediate position. The position of the through-hole 34 is arbitrary as long as the lower steam flow path recess 53 and the upper steam flow path recess 54 communicate with each other.

[0080] In the present embodiment, the cross-sectional shapes of the first steam passage 51 and the second steam passage 52 are formed to include the through-portion 34 defined by a ridge line formed to protrude inward, but are not limited to this. For example, the cross-sectional shapes of the first steam passage 51 and the second steam passage 52 may be trapezoidal or rectangular, or may be barrel-shaped.

[0081] The steam flow path portion 50 including the first steam passage 51 and the second steam passage 52 configured in this manner constitutes a part of the above-mentioned sealed space 3. Each of the steam passages 51, 52 has a relatively large flow path cross-sectional area so that the working steam 2a can pass through.

[0082] Here, in order to clarify the drawing, FIG. 3 shows the first steam passage 51 and the second steam passage 52, etc. in an enlarged manner, and the number and arrangement of these steam passages 51, 52, etc. are different from those in FIG. 2 and FIG. 6.

[0083] Incidentally, although not shown, a plurality of support parts for supporting the land part 33 on the frame part 32 may be provided in the steam flow passage part 50. Also, support parts for supporting adjacent land parts 33 may be provided. These support parts may be provided on both sides of the land part 33 in the X direction, or on both sides of the land part 33 in the Y direction. The support parts may be formed so as not to impede the flow of the working steam 2a diffusing through the steam flow passage part 50. For example, the support parts may be disposed on one side of the first main body surface 31a and the second main body surface 31b of the sheet main body 31 of the wick sheet 30, and a space forming a steam flow passage recess may be formed on the other side. This allows the thickness of the support parts to be thinner than the thickness of the sheet main body 31, and prevents the first steam passage 51 and the second steam passage 52 from being divided in the X direction and the Y direction.

[0084] As shown in FIG. 3, FIG. 6 and FIG. 7, the first main body surface 31a of the sheet body 31 of the wick sheet 30 is provided with a liquid flow path portion 60 (groove portion) through which mainly the working liquid 2b passes. More specifically, the liquid flow path portion 60 is provided on the first main body surface 31a of each land portion 33 of the wick sheet 30. The working steam 2a may also pass through the liquid flow path portion 60. This liquid flow path portion 60 constitutes a part of the above-mentioned sealed space 3 and communicates with the steam flow path portion 50. The liquid flow path portion 60 is configured as a capillary structure (wick) for transporting the working liquid 2b to the evaporation region SR. The liquid flow path portion 60 may be formed over the entire first main body surface 31a of each land portion 33. The liquid flow path portion 60 may not be provided on the second main body surface 31b of each land portion 33.

[0085] 8, the liquid flow path section 60 is composed of a plurality of grooves provided in the first main body surface 31a. More specifically, the liquid flow path section 60 has a plurality of liquid flow path main grooves 61 through which the working fluid 2b passes, and a plurality of liquid flow path connection grooves 65 that communicate with the liquid flow path main grooves 61.

[0086] Each liquid flow path mainstream groove 61 is formed to extend in the X direction as shown in Fig. 8. The liquid flow path mainstream groove 61 has a flow path cross-sectional area smaller than the first vapor passage 51 or the second vapor passage 52 of the vapor flow path section 50 so that the working liquid 2b flows mainly by capillary action. As a result, the liquid flow path mainstream groove 61 is configured to transport the working liquid 2b condensed from the working vapor 2a to the evaporation region SR. Each liquid flow path mainstream groove 61 may be disposed at equal intervals in the Y direction.

[0087] The liquid flow path mainstream groove 61 is formed by etching from the first main body surface 31a of the sheet body 31 of the wick sheet 30 in an etching process described below. As a result, the liquid flow path mainstream groove 61 has a wall surface 62 formed in a curved shape, as shown in Fig. 7. This wall surface 62 defines the liquid flow path mainstream groove 61, and is curved in a concave shape toward the second main body surface 31b.

[0088] The width w3 (dimension in the Y direction) of the liquid flow path mainstream groove 61 shown in Figures 7 and 8 may be, for example, 5 µm to 150 µm. Note that the width w3 of the liquid flow path mainstream groove 61 refers to the dimension at the first main body surface 31a. Also, the depth h1 (dimension in the Z direction) of the liquid flow path mainstream groove 61 shown in Figure 7 may be, for example, 3 µm to 150 µm.

[0089] As shown in FIG. 8, each liquid flow path communication groove 65 extends in a direction different from the X direction. In this embodiment, each liquid flow path communication groove 65 is formed to extend in the Y direction and perpendicular to the liquid flow path mainstream groove 61. Some liquid flow path communication grooves 65 are arranged to communicate adjacent liquid flow path mainstream grooves 61. Other liquid flow path communication grooves 65 are arranged to communicate the vapor flow path section 50 (first vapor passage 51 or second vapor passage 52) and the liquid flow path mainstream groove 61. That is, the liquid flow path communication groove 65 extends from the edge of the land portion 33 in the Y direction to the liquid flow path mainstream groove 61 adjacent to the edge. In this way, the first vapor passage 51 or the second vapor passage 52 of the vapor flow path section 50 and the liquid flow path mainstream groove 61 communicate with each other.

[0090] The liquid flow path communication groove 65 has a flow path cross-sectional area smaller than that of the first steam passage 51 or the second steam passage 52 of the steam flow path section 50 so that the working fluid 2b flows mainly by capillary action. The liquid flow path communication grooves 65 may be disposed at equal intervals in the X direction.

[0091] The liquid flow path connecting groove 65, like the liquid flow path mainstream groove 61, is also formed by etching, and has a wall surface (not shown) formed in a curved shape like the liquid flow path mainstream groove 61. The width w4 (dimension in the X direction) of the liquid flow path connecting groove 65 shown in Fig. 8 may be equal to the width w3 of the liquid flow path mainstream groove 61, or may be greater than or smaller than the width w3. The depth of the liquid flow path connecting groove 65 may be equal to the depth h1 of the liquid flow path mainstream groove 61, or may be greater than or smaller than the depth h1.

[0092] As shown in FIG. 8, the liquid flow path section 60 has a liquid flow path convex section row 63 provided on the first main body surface 31a of the sheet main body 31. The liquid flow path convex section row 63 is provided between adjacent liquid flow path mainstream grooves 61. Each liquid flow path convex section row 63 includes a plurality of liquid flow path convex sections 64 arranged in the X direction. The liquid flow path convex sections 64 are provided in the liquid flow path section 60 and abut against the second lower sheet surface 10b of the lower sheet 10. Each liquid flow path convex section 64 is formed in a rectangular shape such that the X direction is the longitudinal direction in a plan view. A liquid flow path mainstream groove 61 is interposed between the liquid flow path convex sections 64 adjacent to each other in the Y direction, and a liquid flow path communication groove 65 is interposed between the liquid flow path convex sections 64 adjacent to each other in the X direction. The liquid flow path communication groove 65 is formed to extend in the Y direction and communicates the liquid flow path mainstream grooves 61 adjacent to each other in the Y direction. This allows the hydraulic fluid 2b to move between these liquid flow path main grooves 61.

[0093] The liquid flow path convex portion 64 is a portion that is not etched in the etching process described below, and remains as the material of the wick sheet 30. In this embodiment, as shown in Fig. 8, the planar shape of the liquid flow path convex portion 64 (the shape at the position of the first main body surface 31a of the sheet main body 31 of the wick sheet 30) is rectangular.

[0094] In this embodiment, the liquid flow path convex portions 64 are arranged in a staggered manner. More specifically, the liquid flow path convex portions 64 of the liquid flow path convex portion rows 63 adjacent to each other in the Y direction are arranged to be shifted from each other in the X direction. This shift amount may be half the arrangement pitch of the liquid flow path convex portions 64 in the X direction. The width w5 (dimension in the Y direction) of the liquid flow path convex portion 64 shown in FIG. 8 may be, for example, 5 μm to 500 μm. Note that the width w5 of the liquid flow path convex portion 64 means the dimension on the first main body surface 31a. Note that the arrangement of the liquid flow path convex portions 64 is not limited to a staggered arrangement, and may be arranged in parallel. In this case, the liquid flow path convex portions 64 of the liquid flow path convex portion rows 63 adjacent to each other in the Y direction are also aligned in the X direction.

[0095] The liquid flow path mainstream groove 61 includes a liquid flow path intersection 66 that communicates with the liquid flow path communication groove 65. In the liquid flow path intersection 66, the liquid flow path mainstream groove 61 and the liquid flow path communication groove 65 communicate in a T-shape. As a result, in the liquid flow path intersection 66 where one liquid flow path mainstream groove 61 communicates with the liquid flow path communication groove 65 on one side (for example, the upper side in FIG. 8), the liquid flow path communication groove 65 on the other side (for example, the lower side in FIG. 8) can be prevented from communicating with the liquid flow path mainstream groove 61. As a result, in the liquid flow path intersection 66, the wall surface 62 of the liquid flow path mainstream groove 61 is prevented from being cut out on both sides (upper and lower sides in FIG. 8), and one side of the wall surface 62 can be left. Therefore, even in the liquid flow path intersection 66, the working fluid in the liquid flow path mainstream groove 61 can be given a capillary action, and the driving force of the working fluid 2b toward the evaporation region SR can be suppressed from decreasing in the liquid flow path intersection 66.

[0096] 2, the vapor chamber 1 may further include an injection part 4 for injecting the working fluid 2b into the sealed space 3 at a side edge on one side in the X direction (the left side in FIG. 2). In the example shown in FIG. 2, the injection part 4 is disposed on the evaporation region SR side and protrudes outward from the side edge on the evaporation region SR side.

[0097] The injection section 4 is configured by overlapping the lower sheet injection protrusion 13 (see FIG. 4) of the lower sheet 10, the upper sheet injection protrusion 23 (see FIG. 5) of the upper sheet 20, and the wick sheet injection protrusion 36 (see FIG. 6) of the wick sheet 30. In the illustrated example, the lower surface (first main body surface 31a) of the wick sheet injection protrusion 36 and the upper surface (second lower sheet surface 10b) of the lower sheet injection protrusion 13 overlap, and the upper surface (second main body surface 31b) of the wick sheet injection protrusion 36 and the lower surface (first upper sheet surface 20a) of the upper sheet injection protrusion 23 overlap. Among them, an injection flow path 37 may be formed in the wick sheet injection protrusion 36. This injection flow path 37 may penetrate from the first main body surface 31a to the second main body surface 31b of the sheet main body 31. That is, it may penetrate the sheet main body 31 (wick sheet injection protrusion 36) in the Z direction. The injection flow path 37 communicates with the first vapor passage 51, and the working fluid 2b may be injected into the first vapor passage 51 through the injection flow path 37. Depending on the arrangement of the liquid flow path section 60, the injection flow path 37 may be made to communicate with the liquid flow path section 60. The upper and lower surfaces of the wick sheet injection protrusion 36 may be formed flat, and the upper surface of the lower sheet injection protrusion 13 and the lower surface of the upper sheet injection protrusion 23 may also be formed flat. The planar shapes of the injection protrusions 13, 23, 36 may be the same.

[0098] In this embodiment, the injection part 4 is provided on one of a pair of side edges in the X direction of the vapor chamber 1, but the present invention is not limited thereto and may be provided at any position. The injection flow path 37 provided in the wick sheet injection protrusion 36 does not need to penetrate the sheet body 31 as long as the working liquid 2b can be injected. In this case, the injection flow path 37 communicating with the vapor flow path portion 50 can be formed by etching only from one of the first body surface 31a and the second body surface 31b of the sheet body 31. The injection part 4 may be cut and removed after the working liquid 2b is injected during the manufacture of the vapor chamber 1.

[0099] In the present embodiment, as described above, the lower sheet 10 is formed to be smaller overall than the wick sheet 30 in plan view. For this reason, as shown in Figures 2, 3 and 7, the outer peripheral edge 11o of the lower sheet 10 is positioned inside the outer peripheral edge 32o of the wick sheet 30, i.e., on the side of the steam flow path section 50. As a result, the lower sheet 10 is provided with lower sheet retraction sections 15a, 15b, 15c, and 15d that are retracted toward the steam flow path section 50 side relative to the outer peripheral edge 32o of the wick sheet 30 in plan view.

[0100] More specifically, the longitudinal side edge 11a of the lower sheet 10 is positioned closer to the steam flow path section 50 than the longitudinal side edge 32a of the wick sheet 30, and a lower sheet lead-in portion 15a is formed at the longitudinal side edge 11a of the lower sheet 10. Furthermore, the longitudinal side edge 11b of the lower sheet 10 is positioned closer to the steam flow path section 50 than the longitudinal side edge 32b of the wick sheet 30, and a lower sheet lead-in portion 15b is formed at the longitudinal side edge 11b of the lower sheet 10. Furthermore, the transverse side edge 11c of the lower sheet 10 is positioned closer to the steam flow path section 50 than the transverse side edge 32c of the wick sheet 30, and a lower sheet lead-in portion 15c is formed at the transverse side edge 11c of the lower sheet 10. Further, the short-side edge 11d of the lower sheet 10 is positioned closer to the steam flow path section 50 than the short-side edge 32d of the wick sheet 30, and a lower-side sheet lead-in section 15d is formed at the short-side edge 11d of the lower sheet 10. In this manner, the lower-side sheet lead-in sections 15a, 15b, 15c, and 15d are formed all around the outer peripheral edge 11o of the lower sheet 10 except for the portion where the lower-side sheet injection protrusion 13 is provided.

[0101] As described above, the planar shape of the vapor chamber 1 is not limited to a rectangle, and may be any shape such as a circle, an ellipse, an L-shape, a T-shape, etc. In this case, the lower sheet retractions 15a, 15b, 15c, and 15d may be formed around the entire outer peripheral edge 11o of the lower sheet 10, or may be formed at any position on the outer peripheral edge 11o of the lower sheet 10.

[0102] 7, the dimension w6 between the longitudinal side edge 11a of the lower sheet 10 and the longitudinal side edge 32a of the wick sheet 30 in the Y direction may be, for example, 10 μm to 1000 μm. The same is true for the dimension between the longitudinal side edge 11b of the lower sheet 10 and the longitudinal side edge 32b of the wick sheet 30 in the Y direction, the dimension between the lateral side edge 11c of the lower sheet 10 and the lateral side edge 32c of the wick sheet 30 in the X direction, and the dimension between the lateral side edge 11d of the lower sheet 10 and the lateral side edge 32d of the wick sheet 30 in the X direction. That is, each of the lower sheet retraction portions 15a, 15b, 15c, and 15d may be retracted to a position that is 10 μm to 1000 μm away from the outer peripheral edge 32o of the wick sheet 30 in a plan view.

[0103] 7, the dimension w7 between the longitudinal side edge 11a of the lower sheet 10 and the steam flow path section 50 (first steam passage 51) may be, for example, 30 μm to 3000 μm. Here, this dimension w7 means the dimension at the first main body surface 31a. The same is true for the dimension between the longitudinal side edge 11b of the lower sheet 10 and the steam flow path section 50 in the Y direction, the dimension between the lateral side edge 11c of the lower sheet 10 and the steam flow path section 50 in the X direction, and the dimension between the lateral side edge 11d of the lower sheet 10 and the steam flow path section 50 in the X direction. That is, each of the lower sheet lead-in sections 15a, 15b, 15c, and 15d may be provided at a position 30 μm or more and 3000 μm or less away from the steam flow path section 50 (first steam passage 51).

[0104] In the present embodiment, as described above, the upper sheet 20 is formed to be smaller than the wick sheet 30 overall in plan view. For this reason, as shown in Figs. 2, 3 and 7, the outer peripheral edge 21o of the upper sheet 20 is positioned inside the outer peripheral edge 32o of the wick sheet 30, i.e., on the side of the steam flow path section 50. As a result, the upper sheet 20 is provided with upper sheet retraction sections 25a, 25b, 25c, and 25d that are retracted toward the steam flow path section 50 side from the outer peripheral edge 32o of the wick sheet 30 in plan view. The upper sheet 20 may be the same size as the lower sheet 10 in plan view, or may be larger or smaller than the lower sheet 10.

[0105] More specifically, the longitudinal side edge 21a of the upper sheet 20 is positioned closer to the steam flow path section 50 than the longitudinal side edge 32a of the wick sheet 30, and an upper sheet lead-in portion 25a is formed at the longitudinal side edge 21a of the upper sheet 20. Moreover, the longitudinal side edge 21b of the upper sheet 20 is positioned closer to the steam flow path section 50 than the longitudinal side edge 32b of the wick sheet 30, and an upper sheet lead-in portion 25b is formed at the longitudinal side edge 21b of the upper sheet 20. Moreover, the lateral side edge 21c of the upper sheet 20 is positioned closer to the steam flow path section 50 than the lateral side edge 32c of the wick sheet 30, and an upper sheet lead-in portion 25c is formed at the lateral side edge 21c of the upper sheet 20. Further, the short-side edge 21d of the upper sheet 20 is positioned closer to the steam flow path section 50 than the short-side edge 32d of the wick sheet 30, and an upper sheet lead-in section 25d is formed at the short-side edge 21d of the upper sheet 20. In this manner, the upper sheet lead-in sections 25a, 25b, 25c, and 25d are formed all around the outer peripheral edge 21o of the upper sheet 20 except for the portion where the upper sheet injection protrusion 23 is provided.

[0106] As described above, the planar shape of the vapor chamber 1 is not limited to a rectangle, and may be any shape such as a circle, an ellipse, an L-shape, a T-shape, etc. In this case, the upper sheet lead-in portions 25a, 25b, 25c, and 25d may be formed around the entire outer peripheral edge 21o of the upper sheet 20, or may be formed at any position on the outer peripheral edge 21o of the upper sheet 20.

[0107] 7, the dimension w6' between the longitudinal side edge 21a of the upper sheet 20 and the longitudinal side edge 32a of the wick sheet 30 in the Y direction may be, for example, 10 μm to 1000 μm. The same is true for the dimension between the longitudinal side edge 21b of the upper sheet 20 and the longitudinal side edge 32b of the wick sheet 30 in the Y direction, the dimension between the lateral side edge 21c of the upper sheet 20 and the lateral side edge 32c of the wick sheet 30 in the X direction, and the dimension between the lateral side edge 21d of the upper sheet 20 and the lateral side edge 32d of the wick sheet 30 in the X direction. That is, each of the upper sheet retraction portions 25a, 25b, 25c, and 25d may be retracted to a position that is 10 μm to 1000 μm away from the outer peripheral edge 32o of the wick sheet 30 in a plan view. The dimension w6' may be equal to the dimension w6 described above, but may also be larger or smaller than the dimension w6 described above.

[0108] 7, the dimension w7' between the longitudinal side edge 21a of the upper sheet 20 and the steam flow path section 50 (first steam passage 51) may be, for example, 30 μm to 3000 μm. Here, this dimension w7' means the dimension at the second main body surface 31b. The same is true for the dimension between the longitudinal side edge 21b of the upper sheet 20 and the steam flow path section 50 in the Y direction, the dimension between the lateral side edge 21c of the upper sheet 20 and the steam flow path section 50 in the X direction, and the dimension between the lateral side edge 21d of the upper sheet 20 and the steam flow path section 50 in the X direction. That is, each of the upper sheet lead-in sections 25a, 25b, 25c, and 25d may be provided at a position 30 μm or more and 3000 μm or less away from the steam flow path section 50 (first steam passage 51). The dimension w7' may be equal to the dimension w7 described above, but may also be larger or smaller than the dimension w7 described above.

[0109] The materials constituting the lower sheet 10, the upper sheet 20, and the wick sheet 30 are not particularly limited as long as they have good thermal conductivity, but the lower sheet 10, the upper sheet 20, and the wick sheet 30 may contain, for example, copper or a copper alloy. In this case, the thermal conductivity of each of the sheets 10, 20, and 30 can be increased, and the heat dissipation efficiency of the vapor chamber 1 can be improved.

[0110] In particular, the wick sheet 30 may be made of a material having a lower strength than the material constituting the lower sheet 10 and the material constituting the upper sheet 20. In other words, the lower sheet 10 and the upper sheet 20 may be made of a material having a higher strength than the material constituting the wick sheet 30. The wick sheet 30 may be made of, for example, pure copper (or oxygen-free copper, C1020, etc.) or a copper alloy (for example, phosphor bronze). When the wick sheet 30 is made of pure copper, the lower sheet 10 and the upper sheet 20 may be made of, for example, a copper alloy. The lower sheet 10 and the upper sheet 20 may be made of the same material, or may be made of different materials.

[0111] 3 may be, for example, 100 μm to 1000 μm. By making the thickness t1 of the vapor chamber 1 100 μm or more, the vapor channel section 50 can be properly secured, and the vapor chamber 1 can properly function. On the other hand, by making the thickness t1 of the vapor chamber 1 1000 μm or less, the thickness t1 of the vapor chamber 1 can be prevented from becoming too thick.

[0112] The thickness t2 of the lower sheet 10 shown in FIG. 3 may be, for example, 6 μm to 100 μm. By setting the thickness t2 of the lower sheet 10 to 6 μm or more, the mechanical strength of the lower sheet 10 can be ensured. On the other hand, by setting the thickness t2 of the lower sheet 10 to 100 μm or less, the thickness t1 of the vapor chamber 1 can be prevented from becoming thick. Similarly, the thickness t3 of the upper sheet 20 shown in FIG. 3 may be set to be the same as the thickness t2 of the lower sheet 10. The thickness t3 of the upper sheet 20 and the thickness t2 of the lower sheet 10 may be different.

[0113] 3 may be, for example, 50 μm to 400 μm. By setting the thickness t4 of the wick sheet 30 to 50 μm or more, the vapor flow path portion 50 can be properly secured, and the wick sheet 30 can properly function as the vapor chamber 1. On the other hand, by setting the thickness t4 of the wick sheet 30 to 400 μm or less, the thickness t1 of the vapor chamber 1 can be prevented from becoming thick.

[0114] Next, a method for manufacturing the vapor chamber 1 having such a configuration will be described with reference to FIGS.

[0115] Here, we first explain the sheet preparation process for preparing the sheets 10, 20, and 30. This sheet preparation process includes a lower sheet preparation process for preparing the lower sheet 10, an upper sheet preparation process for preparing the upper sheet 20, and a wick sheet preparation process for preparing the wick sheet 30.

[0116] In the lower sheet preparation step, first, a lower sheet base material having a desired thickness is prepared. The lower sheet base material may be a rolled material. Then, the lower sheet base material is etched to form the lower sheet 10 having a desired planar shape. Alternatively, the lower sheet base material may be press-processed to form the lower sheet 10 having a desired planar shape. In this manner, the lower sheet 10 having an outer contour shape as shown in FIG. 4 can be prepared. That is, the lower sheet 10 having the above-mentioned outer peripheral edge 11o can be obtained.

[0117] In the upper sheet preparation step, as in the lower sheet preparation step, first, an upper sheet base material having a desired thickness is prepared. The upper sheet base material may be a rolled material. Then, the upper sheet base material is etched to form the upper sheet 20 having a desired planar shape. Alternatively, the upper sheet base material may be press-processed to form the upper sheet 20 having a desired planar shape. In this manner, the upper sheet 20 having an outer contour shape as shown in FIG. 5 can be prepared. That is, the upper sheet 20 having the above-mentioned outer peripheral edge 21o can be obtained.

[0118] The wick sheet preparation step includes a material sheet preparation step of preparing a metal material sheet M, and an etching step of etching the metal material sheet M.

[0119] First, in a material sheet preparation step, a flat metal material sheet M including a first material surface Ma and a second material surface Mb is prepared as shown in Fig. 9. The metal material sheet M may be formed of a rolled material having a desired thickness.

[0120] Next, in the etching step, as shown in FIG. 10, the metal material sheet M is etched from the first material surface Ma and the second material surface Mb to form the vapor flow path portion 50 and the liquid flow path portion 60.

[0121] More specifically, a patterned resist film (not shown) is formed on the first material surface Ma and the second material surface Mb of the metal material sheet M by photolithography. Then, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched through the openings of the patterned resist film. As a result, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched in a pattern to form a vapor flow path section 50 and a liquid flow path section 60 as shown in FIG. 10. For the etching solution, for example, an iron chloride-based etching solution such as an aqueous ferric chloride solution, or a copper chloride-based etching solution such as an aqueous copper chloride solution can be used.

[0122] The etching may be performed simultaneously on the first material surface Ma and the second material surface Mb of the metal material sheet M. However, this is not limited to the above, and the etching of the first material surface Ma and the second material surface Mb may be performed in separate steps. In addition, the vapor flow path portion 50 and the liquid flow path portion 60 may be formed by etching simultaneously, or may be formed in separate steps.

[0123] In the etching process, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched to obtain a predetermined outer contour shape as shown in Fig. 6. That is, the wick sheet 30 having the above-mentioned outer peripheral edge 32o can be obtained.

[0124] In this manner, the lower sheet 10, the upper sheet 20 and the wick sheet 30 according to the present embodiment are obtained.

[0125] After the preparation step, a joining step is performed in which the lower sheet 10, the upper sheet 20 and the wick sheet 30 are joined together as shown in FIG.

[0126] More specifically, first, the lower sheet 10, the wick sheet 30, and the upper sheet 20 are laminated in this order. In this case, the first main body surface 31a of the wick sheet 30 is superimposed on the second lower sheet surface 10b of the lower sheet 10, and the first upper sheet surface 20a of the upper sheet 20 is superimposed on the second main body surface 31b of the wick sheet 30. At this time, the alignment holes 12 of the lower sheet 10, the alignment holes 35 of the wick sheet 30, and the alignment holes 22 of the upper sheet 20 may be used to align the sheets 10, 20, and 30.

[0127] Next, the lower sheet 10, the wick sheet 30 and the upper sheet 20 are temporarily joined together. For example, these sheets 10, 20 and 30 may be temporarily joined together by spot resistance welding, or these sheets 10, 20 and 30 may be temporarily joined together by laser welding.

[0128] Next, the lower sheet 10, the wick sheet 30, and the upper sheet 20 are permanently bonded together by thermocompression. For example, the sheets 10, 20, and 30 may be permanently bonded together by diffusion bonding. Diffusion bonding is a method in which the lower sheet 10 and the wick sheet 30 are bonded together, and the wick sheet 30 and the upper sheet 20 are bonded together, and then pressure is applied in the stacking direction and heat is applied in a controlled atmosphere such as a vacuum or an inert gas, to bond them together by utilizing the diffusion of atoms that occurs at the bonding surface. In diffusion bonding, the material of each sheet 10, 20, and 30 is heated to a temperature close to the melting point, but since it is lower than the melting point, it is possible to prevent each sheet 10, 20, and 30 from melting and deforming. As a result, the first main body surface 31a of the frame body portion 32 and each land portion 33 of the wick sheet 30 is diffusion bonded to the second lower sheet surface 10b of the lower sheet 10. Further, the frame portion 32 of the wick sheet 30 and the second main body surface 31b of each land portion 33 are diffusion bonded to the first upper sheet surface 20a of the upper sheet 20. In this manner, the sheets 10, 20, 30 are diffusion bonded to form a sealed space 3 having a vapor flow path portion 50 and a liquid flow path portion 60 between the lower sheet 10 and the upper sheet 20. At this stage, the sealed space 3 is in communication with the outside via the injection flow path 37, as described above, without the injection flow path 37 being sealed.

[0129] After the joining step, the hydraulic fluid 2b is injected into the sealed space 3 from the injection flow path 37 of the injection section 4 as an injection step.

[0130] After the injection step, the injection flow path 37 is sealed as a sealing step. For example, the injection portion 4 may be partially melted to seal the injection flow path 37. This blocks communication between the sealed space 3 and the outside, and seals the sealed space 3. This provides a sealed space 3 filled with the working fluid 2b, and prevents the working fluid 2b in the sealed space 3 from leaking to the outside. After sealing the injection flow path 37, the injection portion 4 may be removed. The entire injection portion 4 may be removed. Alternatively, a portion of the injection portion 4 may be removed, with the remaining portion remaining.

[0131] In this manner, the vapor chamber 1 according to the present embodiment is obtained.

[0132] In this manner, the vapor chambers 1 according to the present embodiment can be manufactured one after another. The manufactured vapor chambers 1 can be stored by being stacked on a mounting surface 70 provided in a predetermined location, as shown in Fig. 12. Thereafter, the vapor chambers 1 are removed from this mounting location and transported when shipped or when mounted on the device D.

[0133] Next, a method for transporting the vapor chamber 1 thus manufactured will be described with reference to Fig. 13 and Fig. 14. Here, a method for removing the vapor chamber 1 from the state in which the vapor chambers 1 are stacked on top of each other and placed, as shown in Fig. 12, and transporting it will be described.

[0134] First, as shown in FIG. 13, the claws 82a, 82b of the first arm portion 81a and the second arm portion 81b of the suspension device 80 are inserted into the lower sheet retraction portions 15a, 15b of the lower sheet 10, respectively.

[0135] More specifically, first, the first arm portion 81a is moved in the vertical direction to position the first claw portion 82a provided at the tip of the first arm portion 81a at the same position in the Z direction as the position of the lower sheet retraction portion 15a of the vapor chamber 1 placed at the top. In addition, the second arm portion 81b is moved in the vertical direction to position the second claw portion 82b provided at the tip of the second arm portion 81b at the same position in the Z direction as the position of the lower sheet retraction portion 15b of the vapor chamber 1. Next, the first arm portion 81a is moved in the horizontal direction to cause the first claw portion 82a to enter the lower sheet retraction portion 15a. Similarly, the second arm portion 81b is moved in the horizontal direction to cause the second claw portion 82b to enter the lower sheet retraction portion 15b. This allows the first claw portion 82a and the second claw portion 82b to abut against the first main body surface 31a of the wick sheet 30, respectively.

[0136] Next, the vapor chamber 1 is suspended by a suspension device 80 as shown in FIG.

[0137] More specifically, the first arm portion 81a and the second arm portion 81b are each moved upward with the first claw portion 82a and the second claw portion 82b in contact with the first main body surface 31a of the wick sheet 30. As a result, the first main body surface 31a of the wick sheet 30 is supported by the first claw portion 82a and the second claw portion 82b, and the vapor chamber 1 is suspended by the suspension device 80.

[0138] Then, with the vapor chamber 1 suspended by the suspension device 80, the first arm portion 81a and the second arm portion 81b are moved in the horizontal direction to transport the vapor chamber 1 to a desired target position.

[0139] In this manner, the vapor chamber 1 according to this embodiment can be transported by the hanging device 80.

[0140] Here, a method for removing and transporting the vapor chamber 1 from a state in which the vapor chambers 1 are stacked on top of each other has been described. However, the present invention is not limited to this, and even if the vapor chamber 1 is directly placed on the placement surface 70, the vapor chamber 1 can be transported using the hanging device 80.

[0141] Here, a method for transporting a general vapor chamber 1' will be described. As shown in Fig. 15, the side of a general vapor chamber 1' is formed vertically, and unlike the vapor chamber 1 according to this embodiment, the lower sheet 10 does not have the lower sheet retractions 15a, 15b, 15c, and 15d. For this reason, the claws 82a and 82b of the suspension device 80 cannot enter the lower sheet retractions 15a and 15b, and it is difficult to transport the general vapor chamber 1' with the suspension device 80 described above.

[0142] A typical vapor chamber 1' can be removed and transported by an adsorption device 85, as shown in FIG. 15. More specifically, the adsorption device 85 has an adsorption pad 86 that generates an adsorption force by creating a negative pressure inside, and this adsorption pad 86 is pressed against the upper surface of the vapor chamber 1' to adsorb it to the vapor chamber 1'. Thereafter, with the vapor chamber 1' being adsorbed by the adsorption pad 86, the adsorption device 85 is moved upward to suspend the vapor chamber 1'. Then, the adsorption device 85 is moved horizontally to transport the vapor chamber 1' to a desired target position.

[0143] At this time, if the vapor chamber 1' has been thinned, there is a risk that the vapor chamber 1' will be deformed due to the suction force of the suction pad 86 acting on the upper surface of the vapor chamber 1'. For this reason, in order to suppress deformation of the vapor chamber 1', the thinning of the vapor chamber 1' may be suppressed.

[0144] In contrast, in this embodiment, the lower sheet 10 of the vapor chamber 1 is provided with the lower sheet retracting portions 15a, 15b, 15c, and 15d. This allows the claws 82a and 82b of the hanging device 80 to enter the lower sheet retracting portions 15a, 15b, 15c, and 15d of the placed vapor chamber 1. Therefore, the vapor chamber 1 can be suspended and transported by the hanging device 80, making it unnecessary to use the above-mentioned suction device 85. Therefore, deformation of the vapor chamber 1' can be suppressed. As a result, the vapor chamber 1' can be made even thinner.

[0145] The transportation of the vapor chamber 1 by the hanging device 80 described above is an example, and the vapor chamber 1 can be transported using any other device or the like. For example, the vapor chamber 1 may be transported using a tool with a sharp tip. More specifically, the tip of the tool may be inserted into the lower sheet retraction portion 15a, and then the tool may be moved upward to lift the vapor chamber 1. The lifted vapor chamber 1 may then be grasped by hand and transported. Also, for example, without using such a device or tool, the vapor chamber 1 may be lifted by inserting a finger into the lower sheet retraction portion 15a, and then the vapor chamber 1 may be grasped by hand and transported. Even in such a case, the lower sheet retraction portions 15a, 15b, 15c, and 15d are provided on the lower sheet 10, so that the vapor chamber 1 can be easily removed and transported.

[0146] Next, a method for operating the vapor chamber 1, that is, a method for cooling the device D, will be described.

[0147] The vapor chamber 1 transported as described above is installed in a housing H of a mobile terminal or the like at the transport destination, and the housing member Ha comes into contact with the second upper sheet surface 20b of the upper sheet 20. A device D such as a CPU, which is a device to be cooled, is attached to the first lower sheet surface 10a of the lower sheet 10 (or the vapor chamber 1 is attached to the device D), and the first lower sheet surface 10a of the lower sheet 10 comes into contact with the device D. The working fluid 2b in the sealed space 3 adheres to the wall surfaces of the sealed space 3, i.e., the wall surface 53a of the lower vapor flow recess 53, the wall surface 54a of the upper vapor flow recess 54, the wall surface 62 of the liquid flow path main groove 61 of the liquid flow path section 60, and the wall surface of the liquid flow path connecting groove 65, due to its surface tension. The working fluid 2b may also adhere to the parts of the second lower sheet surface 10b of the lower sheet 10 exposed to the lower vapor flow path recess 53, the liquid flow path main groove 61, and the liquid flow path connecting groove 65. Furthermore, the hydraulic fluid 2b may also adhere to a portion of the first upper sheet surface 20a of the upper sheet 20 that is exposed to the upper steam flow path recess 54.

[0148] In this state, when the device D generates heat, the working fluid 2b present in the evaporation region SR (see FIG. 6) receives heat from the device D. The received heat is absorbed as latent heat, and the working fluid 2b evaporates (vaporizes), generating working steam 2a. Most of the generated working steam 2a diffuses in the lower steam passage recess 53 and the upper steam passage recess 54 that form the sealed space 3 (see the solid arrows in FIG. 6). The working steam 2a in each of the steam passage recesses 53 and 54 leaves the evaporation region SR, and most of the working steam 2a is transported to the condensation region CR (the right part in FIG. 6) where the temperature is relatively low. In the condensation region CR, the working steam 2a is cooled by dissipating heat mainly to the upper sheet 20. The heat received by the upper sheet 20 from the working steam 2a is transferred to the outside air via the housing member Ha (see FIG. 3).

[0149] The working steam 2a radiates heat to the upper sheet 20 in the condensation region CR, and condenses in the evaporation region SR, losing the absorbed latent heat, to generate the working fluid 2b. The generated working fluid 2b adheres to the wall surfaces 53a, 54a of the vapor flow recesses 53, 54, the second lower sheet surface 10b of the lower sheet 10, and the first upper sheet surface 20a of the upper sheet 20. Here, since the working fluid 2b continues to evaporate in the evaporation region SR, the working fluid 2b in the region of the liquid flow path section 60 other than the evaporation region SR (i.e., the condensation region CR) is transported toward the evaporation region SR by the capillary action of each liquid flow path mainstream groove 61 (see the dashed arrow in FIG. 6). As a result, the working fluid 2b adhered to the wall surfaces 53a, 54a, the second lower sheet surface 10b, and the first upper sheet surface 20a moves to the liquid flow path section 60, passes through the liquid flow path connecting groove 65, and enters the liquid flow path mainstream groove 61. In this manner, the working fluid 2b is filled into each liquid flow path mainstream groove 61 and each liquid flow path connection groove 65. Therefore, the filled working fluid 2b obtains a propulsive force toward the evaporation region SR due to the capillary action of each liquid flow path mainstream groove 61, and is smoothly transported toward the evaporation region SR.

[0150] In the liquid flow path section 60, each liquid flow path mainstream groove 61 communicates with the adjacent other liquid flow path mainstream groove 61 via the corresponding liquid flow path connection groove 65. This allows the working fluid 2b to flow between the adjacent liquid flow path mainstream grooves 61, preventing the occurrence of dryout in the liquid flow path mainstream grooves 61. As a result, capillary action is imparted to the working fluid 2b in each liquid flow path mainstream groove 61, and the working fluid 2b is smoothly transported toward the evaporation region SR.

[0151] The working fluid 2b that has reached the evaporation region SR is evaporated by receiving heat from the device D again. The working vapor 2a that has evaporated from the working fluid 2b passes through the liquid flow path communication groove 65 in the evaporation region SR, moves to the lower vapor flow path recess 53 and the upper vapor flow path recess 54, which have a large flow path cross-sectional area, and diffuses in each of the vapor flow path recesses 53, 54. In this way, the working fluids 2a, 2b circulate within the sealed space 3 while repeatedly changing phases, i.e., evaporating and condensing, to transport and release the heat of the device D. As a result, the device D is cooled.

[0152] Thus, according to this embodiment, the lower sheet 10 is provided with lower sheet retraction portions 15a, 15b, 15c, and 15d that are retracted toward the vapor flow path portion 50 side from the outer peripheral edge 32o of the wick sheet 30 in a plan view. This allows the claw portions 82a, 82b, etc. of the hanging device 80 to enter the lower sheet retraction portions 15a, 15b, 15c, and 15d of the placed vapor chamber 1. This allows the vapor chamber 1 to be easily lifted, facilitating the transportation of the vapor chamber 1. As a result, the transportability of the vapor chamber 1 can be improved.

[0153] Furthermore, according to the present embodiment, it is possible to eliminate the need to use the adsorption device 85 for transporting the vapor chamber 1. This makes it possible to suppress deformation of the vapor chamber 1. As a result, it is possible to realize a further reduction in thickness of the vapor chamber 1.

[0154] Furthermore, according to this embodiment, the lower sheet 10 is provided with the lower sheet retractions 15a, 15b, 15c, and 15d, so that it is possible to prevent the end of the lower sheet 10 from contacting other components and damaging them during the manufacture or use of the vapor chamber 1. It is also possible to prevent the lower sheet 10 from peeling off from the wick sheet 30 due to the end of the lower sheet 10 coming into contact with other components, and thus preventing the working liquid 2b in the sealed space 3 from leaking. This improves the safety of the vapor chamber 1.

[0155] Further, according to this embodiment, the lower sheet retraction portions 15a, 15b, 15c, and 15d are provided on a pair of longitudinal side edges 11a, 11b and a pair of lateral side edges 11c, 11d of the lower sheet 10, respectively. As a result, the claws 82a, 82b, etc. of the hanging device 80 can be inserted into any of the lower sheet retraction portions 15a, 15b, 15c, and 15d from any direction in a plan view of the placed vapor chamber 1, thereby lifting the vapor chamber 1. This makes it even easier to lift the vapor chamber 1. As a result, the transportability of the vapor chamber 1 can be further improved.

[0156] Also, according to this embodiment, the lower sheet retraction parts 15a, 15b, 15c, and 15d are retracted to a position 10 μm or more and 1000 μm or less away from the outer peripheral edge 32o of the wick sheet 30 in a plan view. Since the lower sheet retraction parts 15a, 15b, 15c, and 15d are retracted by 10 μm or more in this manner, the first main body surface 31a of the wick sheet 30 can be firmly supported by the claw parts 82a, 82b, etc. of the hanging device 80. Therefore, the lifting of the vapor chamber 1 can be made even easier. As a result, the transportability of the vapor chamber 1 can be further improved. Also, since the lower sheet retraction parts 15a, 15b, 15c, and 15d are retracted by 1000 μm or less, the area of ​​the vapor chamber 1 can be effectively utilized. That is, the vapor flow path part 50 and the liquid flow path part 60 can be provided in a wider area of ​​the vapor chamber 1, and the performance of the vapor chamber 1 can be improved.

[0157] Furthermore, according to this embodiment, the lower sheet lead-in portions 15a, 15b, 15c, and 15d are provided at positions 30 μm or more away from the vapor flow path portion 50 in a plan view. Since the distance between the vapor flow path portion 50 and the lower sheet lead-in portions 15a, 15b, 15c, and 15d is 30 μm or more in this manner, the first main body surface 31a and the second lower sheet surface 10b can be firmly joined in the joining process during the manufacture of the vapor chamber 1. This makes it possible to suppress a decrease in the strength of the vapor chamber 1.

[0158] Furthermore, according to this embodiment, the vapor flow path portion 50 penetrates from the first main body surface 31a to the second main body surface 31b, and the upper sheet 20 covers the vapor flow path portion 50 at the second main body surface 31b. In this way, by configuring the vapor chamber 1 with the lower sheet 10, the upper sheet 20, and the wick sheet 30, the heat received by the lower sheet 10 from the device D can be released from the upper sheet 20. This allows the device D to be cooled effectively. As a result, the performance of the vapor chamber 1 can be improved.

[0159] Further, according to the present embodiment, the upper sheet 20 is provided with upper sheet retraction parts 25a, 25b, 25c, and 25d, which are retracted toward the vapor flow path part 50 side from the outer peripheral edge 32o of the wick sheet 30 in a plan view. This makes it easier to insert the claw parts 82a, 82b, etc. of the suspension device 80 into the lower sheet retraction parts 15a, 15b when the vapor chambers 1 are stacked on top of each other. That is, as shown in FIG. 13, when the upper sheet retraction parts 25a, 25b are provided on each vapor chamber 1, a larger space can be secured for the claw parts 82a, 82b, etc. of the suspension device 80 to enter, by combining the lower sheet retraction parts 15a, 15b of the vapor chamber 1 arranged at the top with the upper sheet retraction parts 25a, 25b of the vapor chamber 1 arranged below it. This makes it easier to lift the vapor chamber 1, and further improves the transportability of the vapor chamber 1. This also allows, for example, the thickness t2 of the lower sheet 10 to be thinner than the thickness (dimension in the Z direction) of the claws 82a, 82b of the hanging device 80. This allows the vapor chamber 1 to be made even thinner.

[0160] Furthermore, according to this embodiment, the upper sheet 20 is provided with the upper sheet retractions 25a, 25b, 25c, and 25d, so that it is possible to prevent the end of the upper sheet 20 from contacting other components and damaging them during the manufacture or use of the vapor chamber 1. It is also possible to prevent the upper sheet 20 from peeling off from the wick sheet 30 due to the end of the upper sheet 20 coming into contact with other components, and thus preventing the working liquid 2b in the sealed space 3 from leaking. This improves the safety of the vapor chamber 1.

[0161] According to this embodiment, the wick sheet 30 is made of a material having a lower strength than the material constituting the lower sheet 10 and the material constituting the upper sheet 20. As described above, in this embodiment, the lower sheet retraction parts 15a, 15b, 15c, and 15d are provided on the lower sheet 10, and the upper sheet retraction parts 25a, 25b, 25c, and 25d are provided on the upper sheet 20. As a result, when the vapor chamber 1 is installed in the housing H of a mobile terminal or the like, even if the vapor chamber 1 suddenly comes into contact with the housing H, it is possible to prevent the lower sheet 10 and the upper sheet 20, which have a relatively high strength, from coming into contact with the housing H. That is, the wick sheet 30, which has a relatively low strength, comes into contact with the housing H. Therefore, damage to the housing H can be suppressed, and foreign matter can be suppressed from falling into the housing H due to damage to the housing H. Damage to the vapor chamber 1 can also be suppressed, and foreign matter can be suppressed from falling into the housing H due to damage to the vapor chamber 1.

[0162] (First Modification of the First Embodiment) In the above-mentioned first embodiment, an example has been described in which the lower sheet retractions 15a, 15b, 15c, and 15d are provided on a pair of longitudinal side edges 11a, 11b and a pair of lateral side edges 11c, 11d of the lower sheet 10, respectively (see FIG. 2). However, this is not limited thereto, and the lower sheet retractions 15a and 15b may be provided on at least one of the pair of longitudinal side edges 11a and 11b of the lower sheet 10.

[0163] 16 and 17, a lower sheet lead-in portion 15a is provided on a longitudinal side edge 11a (the lower side in FIG. 16) of the lower sheet 10. Similarly, an upper sheet lead-in portion 25a is provided on a longitudinal side edge 21a (the lower side in FIG. 16) of the upper sheet 20.

[0164] Even in such a case, a specific device, tool, finger, etc. can be inserted into the lower sheet retraction portion 15a, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1. Furthermore, by limiting the area in which the lower sheet retraction portion 15a is provided, the area of ​​the vapor chamber 1 can be effectively utilized. In other words, the vapor flow path portion 50 and the liquid flow path portion 60 can be provided in a wider area of ​​the vapor chamber 1, improving the performance of the vapor chamber 1.

[0165] (Second Modification of the First Embodiment) In addition, the lower sheet retraction portions 15a, 15b, 15c, 15d may be provided on one of a pair of longitudinal side edges 11a, 11b of the lower sheet 10, and may also be provided on one of a pair of transverse side edges 11c, 11d of the lower sheet 10.

[0166] In the example shown in Fig. 18, a lower sheet retraction portion 15a is provided at the longitudinal side edge 11a (lower side in Fig. 18) of the lower sheet 10, and a lower sheet retraction portion 15c is provided at the lateral side edge 11c (left side in Fig. 18) of the lower sheet 10. Similarly, an upper sheet retraction portion 25a is provided at the longitudinal side edge 21a (lower side in Fig. 18) of the upper sheet 20, and an upper sheet retraction portion 25c is provided at the lateral side edge 21c (left side in Fig. 18) of the upper sheet 20.

[0167] Even in such a case, a specific device, tool, finger, etc. can be inserted into the lower sheet retractions 15a and 15c, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1. Furthermore, by limiting the area in which the lower sheet retractions 15a and 15c are provided, the area of ​​the vapor chamber 1 can be effectively utilized. In other words, the vapor flow path section 50 and the liquid flow path section 60 can be provided in a wider area of ​​the vapor chamber 1, improving the performance of the vapor chamber 1.

[0168] Furthermore, in the example shown in FIG. 18, the vapor chamber 1 can be transported by lifting the longitudinal side edge 11a and the lateral side edge 11c on which the lower sheet retractions 15a and 15c are provided, and the longitudinal side edge 11b and the lateral side edge 11d on which the lower sheet retractions 15a and 15c are not provided can be abutted against a predetermined wall surface. This makes it easy to position the vapor chamber 1 relative to the wall surface. Therefore, for example, when a laser beam is irradiated to a predetermined position of the vapor chamber 1 to print manufacturing information or the like, it is possible to print the information at an accurate position. In addition, even after the vapor chamber 1 is abutted against the wall surface, the longitudinal side edge 11a and the lateral side edge 11c of the vapor chamber 1 can be easily lifted. This improves the transportability of the vapor chamber 1.

[0169] (Third Modification of the First Embodiment) The lower sheet retractions 15a, 15b may be provided on both of the pair of longitudinal side edges 11a, 11b of the lower sheet 10. Furthermore, the lower sheet retractions 15a, 15b may be provided on parts of the pair of longitudinal side edges 11a, 11b of the lower sheet 10.

[0170] In the example shown in FIG. 19, the lower sheet retractions 15a, 15b are provided on both of the pair of longitudinal side edges 11a, 11b of the lower sheet 10, and each of the lower sheet retractions 15a, 15b is provided on a part of the longitudinal side edges 11a, 11b. Similarly, the upper sheet 20 has upper sheet retractions 25a, 25b provided on both of the pair of longitudinal side edges 21a, 21b of the upper sheet 20, and each of the upper sheet retractions 25a, 25b is provided on a part of the longitudinal side edges 21a, 21b. Each of the lower sheet retractions 15a, 15b may be provided in the center of the longitudinal side edges 11a, 11b. Also, each of the upper sheet retractions 25a, 25b may be provided in the center of the longitudinal side edges 11a, 11b.

[0171] In this case, the lower sheet retraction portion 15a and the lower sheet retraction portion 15b may be disposed in positions symmetrical to each other in a plan view with respect to the center of gravity of the vapor chamber 1. The upper sheet retraction portion 25a may be disposed in a position overlapping with the lower sheet retraction portion 15a in a plan view, and the upper sheet retraction portion 25b may be disposed in a position overlapping with the lower sheet retraction portion 15b in a plan view.

[0172] Even in such a case, the claws 82a, 82b, etc. of the hanging device 80 can be inserted into the lower sheet retractions 15a, 15b, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1. In addition, by further limiting the area in which the lower sheet retractions 15a, 15b are provided, the area of ​​the vapor chamber 1 can be used more effectively. In other words, the vapor flow path section 50 and the liquid flow path section 60 can be provided in a wider area of ​​the vapor chamber 1, and the performance of the vapor chamber 1 can be further improved.

[0173] In addition, by arranging the lower sheet retraction parts 15a and 15b at positions symmetrical to each other with respect to the center of gravity of the vapor chamber 1 in a plan view, the attitude of the vapor chamber 1 can be stabilized when suspended by the suspension device 80 or the like. This makes it easier to transport the vapor chamber 1. In addition, by arranging the upper sheet retraction parts 25a and 25b at positions overlapping the lower sheet retraction parts 15a and 15b in a plan view, it makes it easier to insert the claw parts 82a and 82b of the suspension device 80 into the lower sheet retraction parts 15a and 15b when the vapor chambers 1 are stacked on top of each other and placed on top of each other.

[0174] (Fourth Modification of the First Embodiment) The lower sheet retractions 15a, 15b may be provided at the corners of the lower sheet .

[0175] In the example shown in FIG. 20, a lower sheet retraction portion 15a is provided at a corner (lower right side in FIG. 20) on the side of the longitudinal side edge 11a and the lateral side edge 11d of the lower sheet 10. A lower sheet retraction portion 15b is provided at a corner (upper left side in FIG. 20) on the side of the longitudinal side edge 11b and the lateral side edge 11c of the lower sheet 10. Similarly, an upper sheet retraction portion 25a is provided at a corner (lower right side in FIG. 20) on the side of the longitudinal side edge 21a and the lateral side edge 21d of the upper sheet 20. An upper sheet retraction portion 25b is provided at a corner (upper left side in FIG. 20) on the side of the longitudinal side edge 21b and the lateral side edge 21c of the upper sheet 20.

[0176] In this case, the lower sheet retraction portion 15a and the lower sheet retraction portion 15b may be disposed in positions symmetrical to each other in a plan view with respect to the center of gravity of the vapor chamber 1. The upper sheet retraction portion 25a may be disposed in a position overlapping with the lower sheet retraction portion 15a in a plan view, and the upper sheet retraction portion 25b may be disposed in a position overlapping with the lower sheet retraction portion 15b in a plan view.

[0177] Even in such a case, the claws 82a, 82b, etc. of the hanging device 80 can be inserted into the lower sheet retractions 15a, 15b, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1. In addition, by further limiting the area in which the lower sheet retractions 15a, 15b are provided, the area of ​​the vapor chamber 1 can be used more effectively. In other words, the vapor flow path section 50 and the liquid flow path section 60 can be provided in a wider area of ​​the vapor chamber 1, and the performance of the vapor chamber 1 can be further improved.

[0178] In addition, by arranging the lower sheet retraction parts 15a and 15b at positions symmetrical to each other with respect to the center of gravity of the vapor chamber 1 in a plan view, the attitude of the vapor chamber 1 can be stabilized when suspended by the suspension device 80 or the like. This makes it easier to transport the vapor chamber 1. In addition, by arranging the upper sheet retraction parts 25a and 25b at positions overlapping the lower sheet retraction parts 15a and 15b in a plan view, it makes it easier to insert the claw parts 82a and 82b of the suspension device 80 into the lower sheet retraction parts 15a and 15b when the vapor chambers 1 are stacked on top of each other and placed on top of each other.

[0179] (Fifth Modification of the First Embodiment) In the above-described first embodiment, an example has been described in which the lower sheet 10 is provided with the lower sheet lead-in portions 15a, 15b, 15c, and 15d, and the upper sheet 20 is provided with the upper sheet lead-in portions 25a, 25b, 25c, and 25d (see FIG. 3). However, this is not limited to the above, and the lower sheet 10 does not necessarily have to be provided with the lower sheet lead-in portions 15a, 15b, 15c, and 15d. Alternatively, the upper sheet 20 does not necessarily have to be provided with the upper sheet lead-in portions 25a, 25b, 25c, and 25d.

[0180] In the example shown in FIG. 21, the lower sheet 10 is provided with lower sheet lead-ins 15a, 15b, 15c, and 15d, whereas the upper sheet 20 is not provided with upper sheet lead-ins 25a, 25b, 25c, and 25d.

[0181] Even in such a case, a specific device, tool, finger, etc. can be inserted into the lower sheet retraction portions 15a, 15b, 15c, and 15d, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1.

[0182] Furthermore, while the upper sheet 20 is provided with the upper sheet lead-in portions 25a, 25b, 25c, and 25d, the lower sheet 10 does not necessarily have to be provided with the lower sheet lead-in portions 15a, 15b, 15c, and 15d.

[0183] In this case, when the vapor chamber 1 is placed facing the opposite direction, i.e., when the second upper sheet surface 20b of the upper sheet 20 faces the placement surface 70, the vapor chamber 1 can be easily lifted by inserting a predetermined device, tool, finger, or the like into the upper sheet retractions 25a, 25b, 25c, and 25d. This improves the transportability of the vapor chamber 1.

[0184] (Sixth Modification of the First Embodiment) In the above-described first embodiment, an example has been described in which the liquid flow path section 60 is not provided between the lower sheet lead-in sections 15a, 15b, 15c, 15d and the steam flow path section 50 (see FIG. 3). However, this is not limited to this, and the liquid flow path section 60 may be provided between the lower sheet lead-in sections 15a, 15b, 15c, 15d and the steam flow path section 50.

[0185] 22, a liquid flow path section 60 is provided between the lower sheet lead-in sections 15a, 15b and the steam flow path section 50. That is, the liquid flow path section 60 is provided between the longitudinal side edge 11a of the lower sheet 10 and the first steam passage 51, and the liquid flow path section 60 is provided between the longitudinal side edge 11b of the lower sheet 10 and the first steam passage 51.

[0186] In this case, the dimension w8 between the longitudinal side edge 11a of the lower sheet 10 and the liquid flow path section 60 in the Y direction shown in Fig. 22 may be, for example, 30 µm to 3000 µm. Here, this dimension w8 means the dimension at the first main body surface 31a. The same applies to the dimension between the longitudinal side edge 11b of the lower sheet 10 and the liquid flow path section 60 in the Y direction. In other words, the lower sheet lead-in sections 15a, 15b may be provided at a position 30 µm to 3000 µm away from the liquid flow path section 60.

[0187] Even in such a case, a specific device, tool, finger, etc. can be inserted into the lower sheet retraction portions 15a, 15b, 15c, and 15d, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1.

[0188] In addition, since the distance between the liquid flow path portion 60 and the lower sheet lead-in portions 15a, 15b, 15c, and 15d is 30 μm or more, the first main body surface 31a and the second lower sheet surface 10b can be firmly joined in the joining process during the manufacture of the vapor chamber 1. This makes it possible to suppress a decrease in the strength of the vapor chamber 1.

[0189] (Seventh Modification of the First Embodiment) In the above-described first embodiment, an example has been described in which the vapor chamber 1 includes one wick sheet 30. However, the present invention is not limited to this, and the vapor chamber 1 may include a plurality of wick sheets 30.

[0190] In the example shown in FIG. 23, the vapor chamber 1 includes three wick sheets 30. Each wick sheet 30 is provided between the lower sheet 10 and the upper sheet 20. Each wick sheet 30 is formed larger than the lower sheet 10 and the upper sheet 20 as a whole in a plan view. In other words, the lower sheet 10 and the upper sheet 20 are formed smaller than each wick sheet 30 as a whole in a plan view. For this reason, the lower sheet 10 is provided with lower sheet retractions 15a, 15b, 15c, and 15d. In addition, the upper sheet 20 is provided with upper sheet retractions 25a, 25b, 25c, and 25d.

[0191] Even in such a case, a specific device, tool, finger, etc. can be inserted into the lower sheet retraction portion 15a, making it easy to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1.

[0192] 23, the wick sheets 30 have the same shape and dimensions, but this is not limited thereto, and the wick sheets 30 may have different shapes and dimensions. For example, although not shown, one wick sheet 30 may be formed smaller overall than the other wick sheets 30 in a plan view. Furthermore, the one wick sheet 30 may be formed smaller overall than the lower sheet 10 and the upper sheet 20 in a plan view.

[0193] 23, the vapor chamber 1 includes three wick sheets 30, but is not limited to this and may include any number of wick sheets 30. The vapor chamber 1 may include two wick sheets 30, or may include four or more wick sheets 30.

[0194] (Eighth Modification of the First Embodiment) The vapor chamber 1 may also have a through hole 90 .

[0195] In the example shown in FIGS. 24 and 25, the vapor chamber 1 has through-holes 90 penetrating the lower sheet 10, the wick sheet 30, and the upper sheet 20.

[0196] The through hole 90 has a lower sheet penetration portion 91 penetrating from the first lower sheet surface 10a to the second lower sheet surface 10b, a wick sheet penetration portion 92 penetrating from the first main body surface 31a to the second main body surface 31b, and an upper sheet penetration portion 93 penetrating from the first upper sheet surface 20a to the second upper sheet surface 20b. That is, the lower sheet penetration portion 91 penetrates the lower sheet 10, the wick sheet penetration portion 92 penetrates the wick sheet 30, and the upper sheet penetration portion 93 penetrates the upper sheet 20. A wall portion 94 is formed around the wick sheet penetration portion 92 so that the steam flow path portion 50 and the liquid flow path portion 60 do not communicate with the through hole 90. In the example shown in FIG. 24, an evaporation region SR is provided in the center of the vapor chamber 1 in the X direction, and condensation regions CR are provided on one and the other sides of the vapor chamber 1 in the X direction (the left and right sides in FIG. 24).

[0197] The lower sheet penetration portion 91 may be formed by etching the lower sheet base material in the above-mentioned lower sheet preparation step. Alternatively, the lower sheet base material may be formed by pressing. The upper sheet penetration portion 93 may be formed by etching the upper sheet base material in the above-mentioned upper sheet preparation step. Alternatively, the upper sheet base material may be formed by pressing. The wick sheet penetration portion 92 may be formed by etching the metal material sheet M in the etching step of the above-mentioned wick sheet preparation step. Note that in FIG. 25, the cross-sectional shape of the wick sheet penetration portion 92 is rectangular, but it may have a shape formed by communicating a lower recess formed in a concave shape on the first main body surface 31a with an upper recess formed in a concave shape on the second main body surface 31b, as in the above-mentioned first steam passage 51 and second steam passage 52. The same applies to the lower sheet penetration portion 91 and the upper sheet penetration portion 93.

[0198] 24 and 25, in plan view, the inner peripheral edge 10i that defines the lower sheet penetrating portion 91 of the lower sheet 10 is positioned outside the inner peripheral edge 31i that defines the wick sheet penetrating portion 92 of the wick sheet 30, i.e., on the opposite side to the through hole 90. As a result, the lower sheet 10 is provided with a lower sheet retraction portion 15i that is retracted toward the opposite side to the through hole 90 than the inner peripheral edge 31i that defines the through hole 90 of the wick sheet 30 in plan view.

[0199] 25, the dimension w9 between the inner peripheral edge 10i of the lower sheet 10 and the inner peripheral edge 31i of the wick sheet 30 in the Y direction may be, for example, 10 μm to 1000 μm. In other words, the lower sheet retraction portion 15i may be retracted to a position that is 10 μm to 1000 μm away from the inner peripheral edge 31i of the wick sheet 30 in a plan view.

[0200] 25, the dimension w10 between the inner peripheral edge 10i of the lower sheet 10 and the liquid flow path section 60 may be, for example, 30 μm to 3000 μm. Here, this dimension w10 refers to the dimension at the first main body surface 31a. That is, the lower sheet lead-in section 15i may be provided at a position 30 μm to 3000 μm away from the liquid flow path section 60. When the steam flow path section 50 is provided between the inner peripheral edge 10i of the lower sheet 10 and the liquid flow path section 60, the dimension in the Y direction between the inner peripheral edge 10i of the lower sheet 10 and the steam flow path section 50 may be 30 μm to 3000 μm.

[0201] 24 and 25, in plan view, the inner peripheral edge 20i that defines the upper sheet penetrating portion 93 of the upper sheet 20 is positioned outside the inner peripheral edge 31i that defines the wick sheet penetrating portion 92 of the wick sheet 30, i.e., on the opposite side to the through hole 90. As a result, the upper sheet 20 is provided with an upper sheet retraction portion 25i that is retracted toward the opposite side to the through hole 90 than the inner peripheral edge 31i that defines the through hole 90 of the wick sheet 30 in plan view.

[0202] 25, the dimension w9' between the inner peripheral edge 20i of the upper sheet 20 and the inner peripheral edge 31i of the wick sheet 30 in the Y direction may be, for example, 10 μm to 1000 μm. That is, the upper sheet retraction portion 25i may be retracted to a position that is 10 μm to 1000 μm away from the inner peripheral edge 31i of the wick sheet 30 in a plan view. Note that the dimension w9' may be equal to the above-mentioned dimension w9, or may be larger or smaller than the above-mentioned dimension w9.

[0203] 26, the first arm portion 81a and the second arm portion 81b of the hanging device 80 can be inserted into the lower sheet retraction portion 15i of the lower sheet 10, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1.

[0204] In addition, since the lower sheet retraction portion 15i is retracted by 10 μm or more, the first main body surface 31a of the wick sheet 30 can be firmly supported by the claws 82a, 82b, etc. of the hanging device 80. This makes it even easier to lift the vapor chamber 1. As a result, the transportability of the vapor chamber 1 can be further improved. In addition, since the lower sheet retraction portion 15i is retracted by 1000 μm or less, the area of ​​the vapor chamber 1 can be effectively utilized. In other words, the vapor flow path portion 50 and the liquid flow path portion 60 can be provided in a wider area of ​​the vapor chamber 1, and the performance of the vapor chamber 1 can be improved.

[0205] In addition, since the distance between the vapor flow path portion 50 and the lower sheet lead-in portion 15i is 30 μm or more, the first main body surface 31a and the second lower sheet surface 10b can be firmly joined in the joining process during the manufacture of the vapor chamber 1. This makes it possible to suppress a decrease in the strength of the vapor chamber 1.

[0206] Furthermore, by configuring the vapor chamber 1 with the lower sheet 10, the upper sheet 20, and the wick sheet 30, the heat received by the lower sheet 10 from the device D can be released from the upper sheet 20. This allows the device D to be cooled effectively. This improves the performance of the vapor chamber 1.

[0207] In addition, the upper sheet 20 is provided with an upper sheet retraction portion 25i that is retracted toward the opposite side of the through hole 90 from the inner peripheral edge 31i of the wick sheet 30 in a plan view. This makes it easier to insert the claws 82a, 82b, etc. of the suspension device 80 into the lower sheet retraction portion 15i when the vapor chambers 1 are stacked on top of each other. That is, as shown in FIG. 26, when the upper sheet retraction portion 25i is provided in each vapor chamber 1, the lower sheet retraction portion 15i of the vapor chamber 1 arranged at the top and the upper sheet retraction portion 25i of the vapor chamber 1 arranged below it can be combined to provide a larger space for the claws 82a, 82b, etc. of the suspension device 80 to enter. This makes it easier to lift the vapor chamber 1, and further improves the transportability of the vapor chamber 1. This also allows, for example, the thickness t2 of the lower sheet 10 to be thinner than the thickness (dimension in the Z direction) of the claws 82a, 82b of the hanging device 80. This allows the vapor chamber 1 to be made even thinner.

[0208] (Ninth Modification of the First Embodiment) In the above-mentioned first embodiment, an example has been described in which the vapor chamber 1 is composed of the lower sheet 10, the upper sheet 20, and the wick sheet 30. However, this is not limited to the above, and the vapor chamber 1 may be composed of the lower sheet 10 (first sheet) and the wick sheet 30 (main body sheet).

[0209] 27, the vapor chamber 1 includes a lower sheet 10 and a wick sheet 30, but does not include an upper sheet 20. A housing member Ha may be attached to the second main body surface 31b of the wick sheet 30. Heat of the working vapor 2a is transferred from the wick sheet 30 to the housing member Ha.

[0210] 27, the vapor flow path section 50 is provided on the first main body surface 31a, but does not extend to the second main body surface 31b, and does not penetrate the wick sheet 30. In other words, the first vapor passage 51 and the second vapor passage 52 of the vapor flow path section 50 are formed by a lower vapor passage recess 53, and the wick sheet 30 is not provided with an upper vapor passage recess 54.

[0211] The thickness t5 of the vapor chamber 1 shown in Fig. 27 may be, for example, 100 µm to 1000 µm. The thickness t6 of the lower sheet 10 shown in Fig. 27 may be, for example, 6 µm to 200 µm. The thickness t7 of the wick sheet 30 shown in Fig. 27 may be, for example, 50 µm to 800 µm.

[0212] 27, the vapor flow path portion 50 may be provided on the second lower sheet surface 10b of the lower sheet 10. In this case, the vapor flow path portion 50 of the lower sheet 10 may be provided at a position facing the vapor flow path portion 50 of the wick sheet 30. In addition, the liquid flow path portion 60 may be provided on the second lower sheet surface 10b of the lower sheet 10.

[0213] In this manner, the vapor chamber 1 may be composed of the lower sheet 10 and the wick sheet 30.

[0214] Even in such a case, the claws 82a, 82b, etc. of the hanging device 80 can be inserted into the lower sheet retraction portions 15a, 15b, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1.

[0215] (Second embodiment) Next, a vapor chamber and an electronic device according to a second embodiment will be described with reference to FIGS.

[0216] The second embodiment shown in Figures 28 to 30 differs mainly in that the main body sheet is provided with a main body sheet retraction portion that is retracted toward the space portion relative to the outer periphery of the first sheet in a plan view, and other configurations are substantially the same as those of the first embodiment shown in Figures 1 to 14. Note that in Figures 28 to 30, the same parts as those of the first embodiment shown in Figures 1 to 14 are denoted by the same reference numerals and detailed description thereof will be omitted.

[0217] In this embodiment, as shown in Figures 28 and 29, the wick sheet 30 (main body sheet) is formed to be smaller than the lower sheet 10 (second sheet) and the upper sheet 20 (first sheet) as a whole in a plan view. Therefore, the outer peripheral edge 32o of the wick sheet 30 is positioned inside the outer peripheral edge 11o of the lower sheet 10 and the outer peripheral edge 21o of the upper sheet 20, that is, on the side of the steam flow path section 50. As a result, the wick sheet 30 is provided with wick sheet retraction sections 38a, 38b, 38c, 38d (main body sheet retraction sections) that are retracted toward the steam flow path section 50 side relative to the outer peripheral edge 11o of the lower sheet 10 and the outer peripheral edge 21o of the upper sheet 20 in a plan view.

[0218] More specifically, the longitudinal side edge 32a of the wick sheet 30 is positioned closer to the steam flow path section 50 than the longitudinal side edge 11a of the lower sheet 10 and the longitudinal side edge 21a of the upper sheet 20, and a wick sheet inlet section 38a is formed at the longitudinal side edge 32a of the wick sheet 30. In addition, the longitudinal side edge 32b of the wick sheet 30 is positioned closer to the steam flow path section 50 than the longitudinal side edge 11b of the lower sheet 10 and the longitudinal side edge 21b of the upper sheet 20, and a wick sheet inlet section 38b is formed at the longitudinal side edge 32b of the wick sheet 30. Further, the short side edge 32c of the wick sheet 30 is positioned closer to the steam flow passage section 50 than the short side edge 11c of the lower sheet 10 and the short side edge 21c of the upper sheet 20, and a wick sheet inlet section 38c is formed at the short side edge 32c of the wick sheet 30. Further, the short side edge 32d of the wick sheet 30 is positioned closer to the steam flow passage section 50 than the short side edge 11d of the lower sheet 10 and the short side edge 21d of the upper sheet 20, and a wick sheet inlet section 38d is formed at the short side edge 32d of the wick sheet 30. In this manner, the wick sheet inlets 38a, 38b, 38c, 38d are formed all around the outer peripheral edge 32o of the wick sheet 30 except for the portion where the wick sheet injection protrusion 36 is provided.

[0219] 29, the dimension w11 between the longitudinal side edge 11a of the lower sheet 10 and the longitudinal side edge 32a of the wick sheet 30 in the Y direction may be, for example, 10 μm to 1000 μm. The same is true for the dimension between the longitudinal side edge 11b of the lower sheet 10 and the longitudinal side edge 32b of the wick sheet 30 in the Y direction, the dimension between the lateral side edge 11c of the lower sheet 10 and the lateral side edge 32c of the wick sheet 30 in the X direction, and the dimension between the lateral side edge 11d of the lower sheet 10 and the lateral side edge 32d of the wick sheet 30 in the X direction. That is, each of the wick sheet retraction portions 38a, 38b, 38c, and 38d may be retracted to a position that is 10 μm to 1000 μm away from the outer peripheral edge 11o of the lower sheet 10 in a plan view.

[0220] 29, the dimension w11' between the longitudinal side edge 21a of the upper sheet 20 and the longitudinal side edge 32a of the wick sheet 30 in the Y direction may be, for example, 10 μm to 1000 μm. The same is true for the dimension between the longitudinal side edge 21b of the upper sheet 20 and the longitudinal side edge 32b of the wick sheet 30 in the Y direction, the dimension between the lateral side edge 21c of the upper sheet 20 and the lateral side edge 32c of the wick sheet 30 in the X direction, and the dimension between the lateral side edge 21d of the upper sheet 20 and the lateral side edge 32d of the wick sheet 30 in the X direction. That is, each of the wick sheet retraction portions 38a, 38b, 38c, and 38d may be retracted to a position that is 10 μm to 1000 μm away from the outer peripheral edge 21o of the upper sheet 20 in a plan view. The dimension w11' may be equal to the dimension w11 described above, but may also be larger or smaller than the dimension w11 described above.

[0221] Also, the dimension w12 between the longitudinal side edge 32a of the wick sheet 30 and the steam flow path section 50 (first steam passage 51) in the Y direction shown in FIG. 29 may be, for example, 30 μm to 3000 μm. Here, this dimension w12 means the dimension on the first main body surface 31a or the second main body surface 31b. The same is true for the dimension between the longitudinal side edge 32b of the wick sheet 30 and the steam flow path section 50 in the Y direction, the dimension between the lateral side edge 32c of the wick sheet 30 and the steam flow path section 50 in the X direction, and the dimension between the lateral side edge 32d of the wick sheet 30 and the steam flow path section 50 in the X direction. That is, each of the wick sheet retractions 38a, 38b, 38c, and 38d may be provided at a position 30 μm or more and 3000 μm or less away from the steam flow path section 50 (first steam passage 51).

[0222] Next, a method for transporting the vapor chamber 1 according to this embodiment will be described with reference to Fig. 30. Here, a method for removing the vapor chamber 1 from a state in which the vapor chambers 1 are stacked on top of each other and transporting it will be described.

[0223] First, as shown in Figure 30, the claw portions 82a, 82b of the first arm portion 81a and the second arm portion 81b of the hanging device 80 are respectively inserted into the wick sheet retraction portions 38a, 38b of the wick sheet 30, and the first claw portion 82a and the second claw portion 82b are respectively abutted against the first upper sheet surface 20a of the upper sheet 20.

[0224] Next, the first arm portion 81a and the second arm portion 81b are each moved upward with the first claw portion 82a and the second claw portion 82b in contact with the first upper sheet surface 20a of the upper sheet 20. As a result, the first upper sheet surface 20a of the upper sheet 20 is supported by the first claw portion 82a and the second claw portion 82b, and the vapor chamber 1 is suspended by the suspension device 80.

[0225] Then, with the vapor chamber 1 suspended by the suspension device 80, the first arm portion 81a and the second arm portion 81b are moved in the horizontal direction to transport the vapor chamber 1 to a desired target position.

[0226] In this manner, the vapor chamber 1 according to this embodiment can be transported by the hanging device 80.

[0227] As in the first embodiment, the transportation of the vapor chamber 1 by the above-mentioned hanging device 80 is one example, and the vapor chamber 1 can be transported by using any other device or the like.

[0228] Thus, according to this embodiment, the wick sheet 30 is provided with wick sheet retraction portions 38a, 38b, 38c, and 38d that are retracted toward the vapor flow path portion 50 side from the outer peripheral edge 21o of the upper sheet 20 in a plan view. This allows the claw portions 82a, 82b, etc. of the hanging device 80 to enter the wick sheet retraction portions 38a, 38b, 38c, and 38d of the placed vapor chamber 1. This allows the vapor chamber 1 to be easily lifted, facilitating the transportation of the vapor chamber 1. As a result, the transportability of the vapor chamber 1 can be improved.

[0229] Furthermore, according to the present embodiment, it is possible to eliminate the need to use the adsorption device 85 for transporting the vapor chamber 1. This makes it possible to suppress deformation of the vapor chamber 1. As a result, it is possible to realize a further reduction in thickness of the vapor chamber 1.

[0230] Moreover, according to this embodiment, the wick sheet 30 is formed smaller overall than the lower sheet 10 and the upper sheet 20 in a plan view. This makes it possible to eliminate the need for strict alignment of the lower sheet 10, the wick sheet 30, and the upper sheet 20 in the joining process during the manufacture of the vapor chamber 1. That is, even if the lower sheet 10 and the upper sheet 20 are arranged out of alignment with respect to the wick sheet 30, the lower sheet 10 and the upper sheet 20 can cover the vapor flow path portion 50 provided in the wick sheet 30. This makes it possible to facilitate the manufacture of the vapor chamber 1.

[0231] Further, according to this embodiment, the wick sheet retracting portions 38a, 38b, 38c, and 38d are provided on a pair of longitudinal side edges 32a, 32b and a pair of lateral side edges 32c, 32d of the wick sheet 30, respectively. As a result, the claws 82a, 82b, etc. of the hanging device 80 can be inserted into any of the wick sheet retracting portions 38a, 38b, 38c, and 38d from any direction in a plan view of the placed vapor chamber 1, thereby lifting the vapor chamber 1. This makes it even easier to lift the vapor chamber 1. As a result, the transportability of the vapor chamber 1 can be further improved.

[0232] Further, according to the present embodiment, the wick sheet retraction parts 38a, 38b, 38c, 38d are retracted to a position 10 μm or more and 1000 μm or less away from the outer peripheral edge 21o of the upper sheet 20 in a plan view. Since the wick sheet retraction parts 38a, 38b, 38c, 38d are retracted by 10 μm or more in this manner, the first upper sheet surface 20a of the upper sheet 20 can be firmly supported by the claw parts 82a, 82b of the hanging device 80. Therefore, the lifting of the vapor chamber 1 can be made even easier. As a result, the transportability of the vapor chamber 1 can be further improved. Furthermore, since the wick sheet retraction parts 38a, 38b, 38c, 38d are retracted by 1000 μm or less, the area of ​​the vapor chamber 1 can be effectively utilized. That is, the vapor flow path part 50 and the liquid flow path part 60 can be provided in a wider area of ​​the vapor chamber 1, and the performance of the vapor chamber 1 can be improved.

[0233] Moreover, according to this embodiment, the wick sheet inlet portions 38a, 38b, 38c, and 38d are provided at positions 30 μm or more away from the vapor passage portion 50 in a plan view. Since the distance between the vapor passage portion 50 and the wick sheet inlet portions 38a, 38b, 38c, and 38d is 30 μm or more, the second main body surface 31b and the first upper sheet surface 20a can be firmly joined in the joining step during the manufacture of the vapor chamber 1. This makes it possible to suppress a decrease in the strength of the vapor chamber 1.

[0234] Furthermore, according to this embodiment, by configuring the vapor chamber 1 with the lower sheet 10, the upper sheet 20, and the wick sheet 30, the heat received by the lower sheet 10 from the device D can be released from the upper sheet 20. This allows the device D to be cooled effectively. This improves the performance of the vapor chamber 1.

[0235] Further, according to this embodiment, the wick sheet retraction parts 38a, 38b, 38c, and 38d are retracted toward the vapor flow path part 50 side from the outer peripheral edge 11o of the lower sheet 10 in a plan view. As a result, even if the vapor chamber 1 is placed in the opposite direction, that is, even if the second upper sheet surface 20b of the upper sheet 20 is placed facing the placement surface 70, the vapor chamber 1 can be easily lifted by abutting the claw parts 82a, 82b of the hanging device 80 against the second lower sheet surface 10b of the lower sheet 10 and moving it upward. Therefore, even if the vapor chamber 1 is placed in the opposite direction, the transportation of the vapor chamber 1 can be facilitated. As a result, the transportability of the vapor chamber 1 can be further improved.

[0236] Furthermore, according to this embodiment, the lower sheet 10 and the upper sheet 20 are made of a material stronger than the material constituting the wick sheet 30. This makes it possible to suppress deformation of the lower sheet 10 and the upper sheet 20 when the vapor chamber 1 is suspended by abutting the claws 82a, 82b, etc. of the suspension device 80 against the first upper sheet surface 20a of the upper sheet 20 or the second lower sheet surface 10b of the lower sheet 10.

[0237] (First modified example of the second embodiment) In the above-mentioned second embodiment, an example has been described in which the wick sheet retractions 38a, 38b, 38c, and 38d are provided on a pair of longitudinal side edges 32a, 32b and a pair of lateral side edges 32c, 32d of the wick sheet 30 (see FIG. 28). However, the present invention is not limited to this, and the wick sheet retractions 38a, 38b may be provided on at least one of the pair of longitudinal side edges 32a, 32b of the wick sheet 30, as in the first modified example of the above-mentioned first embodiment.

[0238] (Second modified example of the second embodiment) Furthermore, similar to the second modified example of the first embodiment described above, the wick sheet retraction portions 38a, 38b, 38c, 38d may be provided on one of a pair of longitudinal side edges 32a, 32b of the wick sheet 30, and may also be provided on one of a pair of lateral side edges 32c, 32d of the wick sheet 30.

[0239] (Third Modification of the Second Embodiment) Similarly to the third modified example of the first embodiment described above, the wick sheet retractions 38a, 38b may be provided on both of the pair of longitudinal side edges 32a, 32b of the wick sheet 30. Furthermore, the wick sheet retractions 38a, 38b may be provided on parts of the pair of longitudinal side edges 32a, 32b of the wick sheet 30.

[0240] (Fourth Modification of the Second Embodiment) Moreover, the wick sheet retractions 38a, 38b may be provided at the corners of the wick sheet 30, similarly to the fourth modified example of the first embodiment described above.

[0241] (Fifth Modification of the Second Embodiment) In the above-mentioned second embodiment, an example has been described in which the wick sheet retraction parts 38a, 38b, 38c, and 38d are retracted toward the steam flow path section 50 side from the outer peripheral edge 11o of the lower sheet 10 and are retracted toward the steam flow path section 50 side from the outer peripheral edge 21o of the upper sheet 20 in a plan view (see FIG. 29). However, this is not limited thereto, and the wick sheet retraction parts 38a, 38b, 38c, and 38d do not have to be retracted toward the steam flow path section 50 side from the outer peripheral edge 11o of the lower sheet 10 in a plan view. Alternatively, the wick sheet retraction parts 38a, 38b, 38c, and 38d do not have to be retracted toward the steam flow path section 50 side from the outer peripheral edge 21o of the upper sheet 20 in a plan view.

[0242] 31, the wick sheet 30 is formed smaller overall than the upper sheet 20 in a plan view, but is formed to be the same size as the lower sheet 10. That is, the wick sheet 30 and the lower sheet 10 are formed smaller overall than the upper sheet 20 in a plan view. As a result, the wick sheet 30 is provided with wick sheet retraction portions 38a, 38b, 38c, and 38d that are retracted toward the steam flow path portion 50 side relative to the outer circumferential edge 21o of the upper sheet 20 in a plan view.

[0243] Even in such a case, a predetermined device, tool, finger, etc. can be inserted into the wick sheet retraction portions 38a, 38b, 38c, and 38d, making it easy to lift the vapor chamber 1. Therefore, the transportability of the vapor chamber 1 can be improved.

[0244] Furthermore, the wick sheet 30 may be formed smaller overall than the lower sheet 10 in a plan view, but may be formed to be the same size as the upper sheet 20. That is, the wick sheet 30 and the upper sheet 20 may be formed smaller overall than the lower sheet 10 in a plan view. As a result, the wick sheet 30 may be provided with wick sheet retraction portions 38a, 38b, 38c, and 38d that are retracted toward the steam flow path portion 50 side relative to the outer circumferential edge 11o of the lower sheet 10 in a plan view.

[0245] In this case, when the vapor chamber 1 is placed facing the opposite direction, i.e., when the second upper sheet surface 20b of the upper sheet 20 faces the placement surface 70, the vapor chamber 1 can be easily lifted by inserting a predetermined device, tool, finger, or the like into the wick sheet retraction portions 38a, 38b, 38c, and 38d. This improves the transportability of the vapor chamber 1.

[0246] (Sixth Modification of the Second Embodiment) In the above-described second embodiment, an example has been described in which the liquid flow path section 60 is not provided between the wick sheet lead-in sections 38a, 38b, 38c, 38d and the steam flow path section 50 (see FIG. 29). However, this is not limited to this, and the liquid flow path section 60 may be provided between the wick sheet lead-in sections 38a, 38b, 38c, 38d and the steam flow path section 50, as in the sixth modified example of the above-described first embodiment.

[0247] (Seventh Modification of the Second Embodiment) In the above-described second embodiment, an example has been described in which the vapor chamber 1 includes one wick sheet 30 (see FIG. 29). However, the present invention is not limited to this, and the vapor chamber 1 may include multiple wick sheets 30, similar to the seventh modified example of the first embodiment.

[0248] (Eighth Modification of the Second Embodiment) Moreover, the vapor chamber 1 may have a through hole 90, similarly to the eighth modification of the first embodiment described above.

[0249] 32 and 33, in plan view, the inner peripheral edge 31i that defines the wick sheet penetration portion 92 of the wick sheet 30 is positioned outside the inner peripheral edge 10i that defines the lower sheet penetration portion 91 of the lower sheet 10 and the inner peripheral edge 20i that defines the upper sheet penetration portion 93 of the upper sheet 20, i.e., on the opposite side to the through hole 90. As a result, the wick sheet 30 is provided with a wick sheet retraction portion 38i that is retracted to the opposite side of the through hole 90 from the inner peripheral edge 10i that defines the through hole 90 of the lower sheet 10 and the inner peripheral edge 20i that defines the through hole 90 of the upper sheet 20 in plan view.

[0250] 33, the dimension w13 between the inner peripheral edge 10i of the lower sheet 10 and the inner peripheral edge 31i of the wick sheet 30 in the Y direction may be, for example, 10 μm to 1000 μm. In other words, the wick sheet retraction portion 38i may be retracted to a position that is 10 μm to 1000 μm away from the inner peripheral edge 10i of the lower sheet 10 in a plan view.

[0251] 33, the dimension w13' between the inner peripheral edge 20i of the upper sheet 20 and the inner peripheral edge 31i of the wick sheet 30 may be, for example, 10 μm to 1000 μm. That is, the wick sheet retraction portion 38i may be retracted to a position that is 10 μm to 1000 μm away from the inner peripheral edge 20i of the upper sheet 20 in a plan view. The dimension w13' may be equal to the dimension w13 described above, or may be larger or smaller than the dimension w13 described above.

[0252] Also, the dimension w14 between the inner periphery 31i of the wick sheet 30 and the liquid flow path section 60 in the Y direction shown in FIG. 33 may be, for example, 30 μm to 3000 μm. Here, this dimension w14 means the dimension on the first main body surface 31a or the second main body surface 31b. That is, the wick sheet retraction section 38i may be provided at a position 30 μm to 3000 μm away from the liquid flow path section 60. When the vapor flow path section 50 is provided between the inner periphery 31i of the wick sheet 30 and the liquid flow path section 60, the dimension between the inner periphery 31i of the wick sheet 30 and the vapor flow path section 50 in the Y direction may be 30 μm to 3000 μm.

[0253] 34, the first arm portion 81a and the second arm portion 81b of the hanging device 80 can be inserted into the wick sheet retraction portion 38i, making it easier to lift the vapor chamber 1. This improves the transportability of the vapor chamber 1.

[0254] In addition, since the wick sheet retraction portion 38i is retracted by 10 μm or more, the first upper sheet surface 20a of the upper sheet 20 can be firmly supported by the claws 82a, 82b, etc. of the hanging device 80. This makes it even easier to lift the vapor chamber 1. As a result, the transportability of the vapor chamber 1 can be further improved. In addition, since the wick sheet retraction portion 38i is retracted by 1000 μm or less, the area of ​​the vapor chamber 1 can be effectively utilized. In other words, the vapor flow path portion 50 and the liquid flow path portion 60 can be provided in a wider area of ​​the vapor chamber 1, and the performance of the vapor chamber 1 can be improved.

[0255] In addition, since the distance between the vapor flow path portion 50 and the wick sheet retraction portion 38i is 30 μm or more, the first main body surface 31a and the first upper sheet surface 20a can be firmly joined in the joining process during the manufacture of the vapor chamber 1. This makes it possible to suppress a decrease in the strength of the vapor chamber 1.

[0256] Furthermore, by configuring the vapor chamber 1 with the lower sheet 10, the upper sheet 20, and the wick sheet 30, the heat received by the lower sheet 10 from the device D can be released from the upper sheet 20. This allows the device D to be cooled effectively. This improves the performance of the vapor chamber 1.

[0257] In addition, the wick sheet retraction portion 38i is retracted toward the vapor flow path portion 50 side from the inner peripheral edge 10i of the lower sheet 10 in a plan view. As a result, even if the vapor chamber 1 is placed in the opposite direction, that is, even if the second upper sheet surface 20b of the upper sheet 20 is placed so as to face the placement surface 70, the vapor chamber 1 can be easily lifted by abutting the claw portions 82a, 82b of the hanging device 80 against the second lower sheet surface 10b of the lower sheet 10 and moving them upward. Therefore, even if the vapor chamber 1 is placed in the opposite direction, the transport of the vapor chamber 1 can be facilitated. As a result, the transportability of the vapor chamber 1 can be further improved.

[0258] (Ninth Modification of the Second Embodiment) In the above-described first embodiment, an example has been described in which the vapor chamber 1 is composed of the lower sheet 10, the upper sheet 20, and the wick sheet 30. However, the present invention is not limited to this, and the vapor chamber 1 may be composed of the lower sheet 10 (first sheet) and the wick sheet 30 (main body sheet) as in the ninth modified example of the first embodiment.

[0259] (Third embodiment) Next, a vapor chamber and an electronic device according to a third embodiment will be described with reference to FIGS.

[0260] 35 and 36, the vapor chamber 101 according to the present embodiment has a sealed space 103 in which the working fluids 2a and 2b are sealed. The working fluids 2a and 2b in the sealed space 103 repeatedly undergo phase changes, thereby cooling the device D of the electronic device E described above.

[0261] 35 and 36, the vapor chamber 101 includes a lower sheet 110 (first sheet), an upper sheet 120 (second sheet), and a wick sheet 130 (main body sheet) for the vapor chamber interposed between the lower sheet 110 and the upper sheet 120. In this embodiment, the vapor chamber 101 includes one wick sheet 130. In the vapor chamber 101 according to this embodiment, the lower sheet 110, the wick sheet 130, and the upper sheet 120 are laminated and joined in this order.

[0262] The vapor chamber 101 is generally formed in a thin flat plate shape. The planar shape of the vapor chamber 101 is arbitrary, and may be a rectangle as shown in FIG. 35. The planar shape of the vapor chamber 101 may be, for example, a rectangle with one side being 1 cm and the other side being 3 cm, or a square with one side being 15 cm, and the planar dimensions of the vapor chamber 101 are arbitrary. In this embodiment, as an example, an example in which the planar shape of the vapor chamber 101 is a rectangle with the X direction as the longitudinal direction will be described. Note that the planar shape of the vapor chamber 101 is not limited to a rectangle, and may be any shape, such as a circle, an ellipse, an L-shape, or a T-shape.

[0263] As shown in FIG. 35, the vapor chamber 101 has an evaporation region SSR where the working fluids 2a and 2b evaporate, and a condensation region CCR where the working fluids 2a and 2b condense.

[0264] The evaporation region SSR is a region that overlaps with the device D in a planar view, and is a region where the device D is attached. The evaporation region SSR can be disposed at any location in the vapor chamber 101. In this embodiment, the evaporation region SSR is formed on one side in the X direction of the vapor chamber 101 (the left side in FIG. 35). Heat from the device D is transferred to the evaporation region SSR, and this heat causes the liquid of the working fluid (working liquid 2b) to evaporate in the evaporation region SSR. The heat from the device D can be transferred not only to the region that overlaps with the device D in a planar view, but also to the periphery of that region. Therefore, the evaporation region SSR includes the region that overlaps with the device D in a planar view and the periphery of that region. Here, a planar view refers to a state in which the vapor chamber 101 is viewed from a direction perpendicular to the surface that receives heat from the device D (the first lower sheet surface 110a of the lower sheet 110 described later) and the surface that releases the received heat (the second upper sheet surface 120b of the upper sheet 120 described later), and corresponds to a state in which the vapor chamber 101 is viewed from above or below, as shown in FIG. 35, for example.

[0265] The condensation region CCR is a region that does not overlap with the device D in a plan view, and is a region where the vapor of the working fluid (working vapor 2a) mainly releases heat and condenses. The condensation region CCR can also be said to be a region surrounding the evaporation region SSR. In this embodiment, the condensation region CCR is formed on the other side in the X direction of the vapor chamber 101 (the right side in FIG. 35). In the condensation region CCR, heat from the working vapor 2a is released to the upper sheet 120, and the working vapor 2a is cooled and condensed in the condensation region CCR.

[0266] When vapor chamber 101 is installed inside a mobile terminal, the up-down relationship may be lost depending on the attitude of the mobile terminal. However, in this embodiment, for convenience, the sheet that receives heat from device D is referred to as lower sheet 110, and the sheet that dissipates the received heat is referred to as upper sheet 120. For this reason, the following description will be given with lower sheet 110 disposed on the lower side and upper sheet 120 disposed on the upper side.

[0267] First, the lower sheet 110 will be described.

[0268] 36, the lower sheet 110 has a first lower sheet surface 110a provided on the side opposite the wick sheet 130, and a second lower sheet surface 110b provided on the side opposite the first lower sheet surface 110a (i.e., the side of the wick sheet 130). The lower sheet 110 may be formed to be generally flat, or may have a uniform thickness overall. The above-mentioned device D is attached to this first lower sheet surface 110a.

[0269] As shown in FIG. 37, the planar shape of the lower sheet 110 may be generally rectangular. More specifically, the lower sheet 110 may have a pair of longitudinal side edges 111a, 111b (first side edges) extending in the X direction (first direction) and a pair of lateral side edges 111c, 111d (second side edges) extending in the Y direction (second direction) perpendicular to the X direction in a plan view. The pair of longitudinal side edges 111a, 111b are provided on both sides in the Y direction. The longitudinal side edge 111a is provided on one side in the Y direction (lower side in FIG. 37), and the longitudinal side edge 111b is provided on the other side in the Y direction (upper side in FIG. 37). The pair of lateral side edges 111c, 111d are provided on both sides in the X direction. The short-side edge 111c is provided on one side in the X direction (the left side in FIG. 37), and the short-side edge 111d is provided on the other side in the X direction (the right side in FIG. 37). The pair of longitudinal side edges 111a, 111b and the pair of short-side edges 111c, 111d form an outer peripheral edge 111o of the lower sheet 110 in a plan view.

[0270] 35 and 36, the lower sheet 110 is formed to be smaller overall than an upper sheet 120 described later in plan view. Therefore, in plan view, an outer peripheral edge 111o of the lower sheet 110 is positioned more inward (toward a steam flow path section 150 described later) than an outer peripheral edge 121o of the upper sheet 120. In other words, the longitudinal side edges 111a, 111b and the lateral side edges 111c, 111d of the lower sheet 110 are positioned more inward than the longitudinal side edges 121a, 121b and the lateral side edges 121c, 121d of the upper sheet 120 described later, respectively.

[0271] As shown in Fig. 37, the lower sheet 110 may have a rectangular lower sheet main body 111 and a lower sheet injection protrusion 113 protruding outward from the lower sheet main body 111. In the example shown in Fig. 37, the lower sheet injection protrusion 113 is provided on a short-side edge 111c and protrudes from the short-side edge 111c to one side in the X direction (the left side in Fig. 37).

[0272] 37, alignment holes 112 may be provided at the four corners of a lower sheet main body 111 of a lower sheet 110. In the example shown in FIG. 37, the planar shape of the alignment holes 112 is circular, but this is not limited thereto. The alignment holes 112 may penetrate the lower sheet main body 111.

[0273] Next, the upper sheet 120 will be described.

[0274] As shown in Fig. 36, the upper sheet 120 has a first upper sheet surface 120a provided on the wick sheet 130 side and a second upper sheet surface 120b provided on the opposite side to the first upper sheet surface 120a. The upper sheet 120 may be formed flat overall, or may have a constant thickness overall. A housing member Ha constituting a part of a housing H of a mobile terminal or the like is attached to the second upper sheet surface 120b. The second upper sheet surface 120b may be entirely covered with the housing member Ha.

[0275] As shown in Fig. 38, the planar shape of the upper sheet 120 may be generally rectangular. More specifically, the upper sheet 120 may have a pair of longitudinal side edges 121a, 121b extending in the X direction and a pair of lateral side edges 121c, 121d extending in the Y direction in a plan view. The pair of longitudinal side edges 121a, 121b are provided on both sides in the Y direction. The longitudinal side edge 121a is provided on one side in the Y direction (the lower side in Fig. 38), and the longitudinal side edge 121b is provided on the other side in the Y direction (the upper side in Fig. 38). The pair of lateral side edges 121c, 121d are provided on both sides in the X direction. The short-side edge 121c is provided on one side in the X direction (the left side in FIG. 38), and the short-side edge 121d is provided on the other side in the X direction (the right side in FIG. 38). The pair of longitudinal side edges 121a, 121b and the pair of short-side edges 121c, 121d form an outer peripheral edge 121o of the upper sheet 120 in a plan view.

[0276] 35 and 36, the upper sheet 120 is formed to be larger overall than the above-mentioned lower sheet 110 in plan view. Therefore, in plan view, the outer peripheral edge 121o of the upper sheet 120 is positioned outside (opposite the steam flow path section 150 described below) the outer peripheral edge 111o of the lower sheet 110. In other words, the longitudinal side edges 121a, 121b and the lateral side edges 121c, 121d of the upper sheet 120 are positioned outside the longitudinal side edges 111a, 111b and the lateral side edges 111c, 111d of the above-mentioned lower sheet 110, respectively.

[0277] As shown in Fig. 38, the upper sheet 120 may have a rectangular upper sheet main body 121 and an upper sheet injection protrusion 123 protruding outward from the upper sheet main body 121. In the example shown in Fig. 38, the upper sheet injection protrusion 123 is provided on a short-side edge 121c and protrudes from the short-side edge 121c to one side in the X direction (the left side in Fig. 38).

[0278] 38, alignment holes 122 may be provided at the four corners of an upper sheet main body 121 of an upper sheet 120. In the example shown in FIG. 38, the planar shape of the alignment holes 122 is circular, but is not limited to this. The alignment holes 112 may penetrate the upper sheet main body 121.

[0279] Next, the wick sheet 130 will be described.

[0280] 36, the wick sheet 130 includes a sheet body 131 and a steam flow path portion 150 (space portion) provided in the sheet body 131. The sheet body 131 has a first body surface 131a and a second body surface 131b provided on the opposite side to the first body surface 131a. The first body surface 131a is disposed on the lower sheet 110 side, and the second body surface 131b is disposed on the upper sheet 120 side.

[0281] The second lower sheet surface 110b of the lower sheet 110 and the first main body surface 131a of the sheet main body 131 may be permanently joined to each other by thermocompression. Similarly, the first upper sheet surface 120a of the upper sheet 120 and the second main body surface 131b of the sheet main body 131 may be permanently joined to each other by thermocompression. An example of joining by thermocompression is diffusion bonding. However, the lower sheet 110, the upper sheet 120, and the wick sheet 130 may be joined by other methods such as brazing, instead of diffusion bonding, as long as they can be permanently joined. The term "permanently joined" is not limited to a strict meaning, and is used as a term to mean that the lower sheet 110 and the wick sheet 130 are joined to a degree that the sealing property of the sealed space 3 can be maintained during the operation of the vapor chamber 101, and that the upper sheet 120 and the wick sheet 130 are joined to a degree that the joining can be maintained.

[0282] As shown in Fig. 39, the outer shape of the wick sheet 130 may be generally rectangular in plan view. More specifically, the wick sheet 130 may have a pair of longitudinal side edges 132a, 132b extending in the X direction and a pair of lateral side edges 132c, 132d extending in the Y direction in plan view. The pair of longitudinal side edges 132a, 132b are provided on both sides in the Y direction. The longitudinal side edge 132a is provided on one side in the Y direction (the lower side in Fig. 39), and the longitudinal side edge 132b is provided on the other side in the Y direction (the upper side in Fig. 39). The pair of lateral side edges 132c, 132d are provided on both sides in the X direction. The short-side edge 132c is provided on one side in the X direction (the left side in FIG. 39), and the short-side edge 132d is provided on the other side in the X direction (the right side in FIG. 39). The pair of longitudinal side edges 132a, 132b and the pair of short-side edges 132c, 132d form an outer peripheral edge 132o of the wick sheet 130 in a plan view.

[0283] 35 and 36, in a plan view, the outer peripheral edge 132o of the wick sheet 130 overlaps with the outer peripheral edge 121o of the upper sheet 120. That is, the longitudinal side edges 132a, 132b and the lateral side edges 132c, 132d of the wick sheet 130 overlap with the longitudinal side edges 121a, 121b and the lateral side edges 121c, 121d of the upper sheet 120, respectively. The wick sheet 130 also includes a retracted portion 170 retracted inward (toward the steam flow path portion 150, which will be described later) from the outer peripheral edge 132o. The retracted portion 170 will be described later in detail.

[0284] As shown in Fig. 39, the wick sheet 130 may have a wick sheet injection protrusion 136 that protrudes outward from a frame body portion 132 (described later). In the example shown in Fig. 39, the wick sheet injection protrusion 136 is provided on a short-side edge 132c and protrudes from the short-side edge 132c to one side in the X direction (the left side in Fig. 39).

[0285] 39, alignment holes 135 may be provided at the four corners of a sheet body 131 of a wick sheet 130. In the example shown in FIG. 39, the planar shape of the alignment holes 135 is circular, but is not limited to this. The alignment holes 135 may penetrate the sheet body 131.

[0286] 36 and 39, the sheet body 131 of the wick sheet 130 according to the present embodiment has a frame portion 132 formed in a rectangular frame shape in a plan view, and a plurality of land portions 133 provided in the frame portion 132. The frame portion 132 and the land portions 133 are portions that are not etched in the etching step described below, and the material of the wick sheet 130 remains.

[0287] In this embodiment, the frame portion 132 is formed in a rectangular frame shape in a plan view. A steam flow path portion 150 (space portion) is provided inside the frame portion 132. Each land portion 133 is provided within the steam flow path portion 150, and the working steam 2a flows around each land portion 133. That is, the steam flow path portion 150 includes the above-mentioned multiple land portions 133 and steam paths 151 and 152, which are provided around each land portion 133 and will be described later and are paths through which the working steam 2a flows.

[0288] In this embodiment, the land portion 133 may extend in an elongated shape with the X direction (left-right direction in FIG. 39) as the longitudinal direction in a plan view, and the planar shape of the land portion 133 may be an elongated rectangular shape. The lands 133 may be arranged parallel to each other at equal intervals in the Y direction (up-down direction in FIG. 39) perpendicular to the X direction. The width ww1 of the land portion 133 (see FIG. 40) may be, for example, 100 μm to 1500 μm. Here, the width ww1 of the land portion 133 is the dimension of the land portion 133 in the Y direction, and means the dimension at the position where the through portion 134 described later exists in the Z direction. Here, the Z direction corresponds to the up-down direction in FIG. 36 and FIG. 40, and corresponds to the thickness direction of the wick sheet 130.

[0289] The frame portion 132 and each land portion 133 are joined to the lower sheet 110 by thermocompression bonding, and are also joined to the upper sheet 120 by thermocompression bonding. A wall surface 153a of the lower steam flow path recess 153 and a wall surface 154a of the upper steam flow path recess 154 described below form the side walls of the land portion 133. The first main body surface 131a and the second main body surface 131b of the sheet main body 131 may be formed flat across the frame portion 132 and each land portion 133.

[0290] The vapor flow path section 150 is a flow path through which the working vapor 2a mainly passes. The working liquid 2b may also pass through the vapor flow path section 150. As shown in FIG. 36 and FIG. 40, the vapor flow path section 150 may penetrate from the first main body surface 131a to the second main body surface 131b. That is, it may penetrate the sheet main body 131 of the wick sheet 130. The vapor flow path section 150 may be covered by the lower sheet 110 on the first main body surface 131a, and may be covered by the upper sheet 120 on the second main body surface 131b.

[0291] As shown in FIG. 39, the steam flow path section 150 in this embodiment has a first steam passage 151 and a plurality of second steam passages 152. The first steam passage 151 is formed between the frame body section 132 and the land section 133. The first steam passage 151 is formed inside the frame body section 132 and continuously outside the land section 133. The first steam passage 151 has a planar shape of a rectangular frame. The second steam passage 152 is formed between the adjacent land sections 133. The second steam passage 152 has a planar shape of an elongated rectangle. The steam flow path section 150 is divided into the first steam passage 151 and a plurality of second steam passages 152 by the plurality of land sections 133.

[0292] As shown in Fig. 36, the first steam passage 151 and the second steam passage 152 penetrate from the first main body surface 131a to the second main body surface 131b of the sheet main body 131. That is, they penetrate the wick sheet 130 in the Z direction. The first steam passage 151 and the second steam passage 152 are each formed by a lower steam flow path recess 153 provided in the first main body surface 131a and an upper steam flow path recess 154 provided in the second main body surface 131b. The lower steam flow path recess 153 and the upper steam flow path recess 154 are in communication with each other, and the first steam passage 151 and the second steam passage 152 of the steam flow path section 150 are formed to extend from the first main body surface 131a to the second main body surface 131b.

[0293] The lower steam flow path recess 153 is formed in a concave shape on the first main body surface 131a by etching from the first main body surface 131a of the wick sheet 130 in an etching step described later. As a result, the lower steam flow path recess 153 has a wall surface 153a formed in a curved shape, as shown in Fig. 40. This wall surface 153a defines the lower steam flow path recess 153, and in the cross section shown in Fig. 40, is curved so as to approach the opposing wall surface 153a as it progresses toward the second main body surface 131b. Such a lower steam flow path recess 153 constitutes a part (lower half) of the first steam passage 151 and a part (lower half) of the second steam passage 152.

[0294] The upper steam flow path recess 154 is formed in a concave shape on the second main body surface 131b by etching from the second main body surface 131b of the wick sheet 130 in an etching step described later. As a result, the upper steam flow path recess 154 has a wall surface 154a formed in a curved shape, as shown in Fig. 40. This wall surface 154a defines the upper steam flow path recess 154, and in the cross section shown in Fig. 40, it is curved so as to approach the opposing wall surface 154a as it proceeds toward the first main body surface 131a. Such an upper steam flow path recess 154 constitutes a part (upper half) of the first steam passage 151 and a part (upper half) of the second steam passage 152.

[0295] As shown in FIG. 40, a wall surface 153a of the lower steam flow path recess 153 and a wall surface 154a of the upper steam flow path recess 154 are connected to each other to form a through-portion 134. The wall surfaces 153a and 154a are curved toward the through-portion 134. This allows the lower steam flow path recess 153 and the upper steam flow path recess 154 to communicate with each other. In this embodiment, the planar shape of the through-portion 134 in the first steam path 151 is a rectangular frame shape similar to the first steam path 151, and the planar shape of the through-portion 134 in the second steam path 152 is an elongated rectangular shape similar to the second steam path 152. The through-portion 134 may be defined by a ridge line formed by joining the wall surface 153a of the lower steam flow path recess 153 and the wall surface 154a of the upper steam flow path recess 154 and projecting inward. The planar area of ​​the steam flow path portion 150 is minimum at this through-portion 134. The widths ww2, ww2' of the through portion 134 (see FIG. 40) may be, for example, 400 μm to 1600 μm. Here, the width ww2 of the through portion 134 corresponds to the gap between adjacent land portions 133 in the Y direction. Moreover, the width ww2' of the through portion 134 corresponds to the gap between the frame portion 132 and the land portion 133 in the Y direction (or the X direction).

[0296] The position of the through-hole 134 in the Z direction may be an intermediate position between the first main body surface 131a and the second main body surface 131b, or may be a position shifted downward or upward from the intermediate position. The position of the through-hole 134 is arbitrary as long as the lower steam flow path recess 153 and the upper steam flow path recess 154 communicate with each other.

[0297] In the present embodiment, the cross-sectional shapes of first steam passage 151 and second steam passage 152 are formed to include through-hole 134 defined by a ridge line formed to protrude inward, but are not limited to this. For example, the cross-sectional shapes of first steam passage 151 and second steam passage 152 may be trapezoidal or rectangular, or may be barrel-shaped.

[0298] The steam flow path portion 150 including the first steam path 151 and the second steam path 152 configured in this manner constitutes a part of the above-mentioned sealed space 103. Each of the steam paths 151, 152 has a relatively large flow path cross-sectional area so that the working steam 2a can pass through.

[0299] Here, in order to clarify the drawing, FIG. 36 shows the first steam passage 151 and the second steam passage 152, etc. in an enlarged manner, and the number and arrangement of these steam passages 151, 152, etc. differ from those in FIG. 35 and FIG. 39.

[0300] Incidentally, although not shown, a plurality of support parts for supporting the land part 133 on the frame part 132 may be provided in the steam flow passage part 150. Also, support parts for supporting adjacent land parts 133 may be provided. These support parts may be provided on both sides of the land part 133 in the X direction, or on both sides of the land part 133 in the Y direction. The support parts may be formed so as not to impede the flow of the working steam 2a diffusing in the steam flow passage part 150. For example, the support parts may be disposed on one side of the first main body surface 131a and the second main body surface 131b of the sheet main body 131 of the wick sheet 130, and a space forming a steam flow passage recess may be formed on the other side. This allows the thickness of the support parts to be thinner than the thickness of the sheet main body 131, and prevents the first steam passage 151 and the second steam passage 152 from being divided in the X direction and the Y direction.

[0301] As shown in FIG. 36, FIG. 39, and FIG. 40, the first main body surface 131a of the sheet body 131 of the wick sheet 130 is provided with a liquid flow path portion 160 (groove portion) through which mainly the working liquid 2b passes. More specifically, the liquid flow path portion 160 is provided on the first main body surface 131a of each land portion 133 of the wick sheet 130. The working steam 2a may also pass through the liquid flow path portion 160. This liquid flow path portion 160 constitutes a part of the above-mentioned sealed space 103 and communicates with the steam flow path portion 150. The liquid flow path portion 160 is configured as a capillary structure (wick) for transporting the working liquid 2b to the evaporation region SSR. The liquid flow path portion 160 may be formed over the entire first main body surface 131a of each land portion 133. The liquid flow path portion 160 may not be provided on the second main body surface 131b of each land portion 133.

[0302] 41, the liquid flow path section 160 is composed of a plurality of grooves provided in the first main body surface 131a. More specifically, the liquid flow path section 160 has a plurality of liquid flow path main grooves 161 through which the working fluid 2b passes, and a plurality of liquid flow path connection grooves 165 that communicate with the liquid flow path main grooves 161.

[0303] Each liquid flow path mainstream groove 161 is formed to extend in the X direction as shown in Fig. 41. The liquid flow path mainstream groove 161 has a flow path cross-sectional area smaller than the first vapor passage 151 or the second vapor passage 152 of the vapor flow path section 150 so that the working fluid 2b flows mainly by capillary action. As a result, the liquid flow path mainstream groove 161 is configured to transport the working fluid 2b condensed from the working vapor 2a to the evaporation region SSR. Each liquid flow path mainstream groove 161 may be disposed at equal intervals in the Y direction.

[0304] The liquid flow path mainstream groove 161 is formed by etching from the first main body surface 131a of the sheet body 131 of the wick sheet 130 in an etching process described below. As a result, the liquid flow path mainstream groove 161 has a wall surface 162 formed in a curved shape, as shown in Fig. 40. This wall surface 162 defines the liquid flow path mainstream groove 161, and is curved concavely toward the second main body surface 131b.

[0305] The width ww3 (dimension in the Y direction) of the liquid flow path mainstream groove 161 shown in Figures 40 and 41 may be, for example, 5 µm to 150 µm. Note that the width ww3 of the liquid flow path mainstream groove 61 refers to the dimension at the first main body surface 131a. Also, the depth hh1 (dimension in the Z direction) of the liquid flow path mainstream groove 161 shown in Figure 40 may be, for example, 3 µm to 150 µm.

[0306] As shown in FIG. 41, each liquid flow path communication groove 165 extends in a direction different from the X direction. In this embodiment, each liquid flow path communication groove 165 is formed to extend in the Y direction and perpendicular to the liquid flow path mainstream groove 161. Some liquid flow path communication grooves 165 are arranged to communicate adjacent liquid flow path mainstream grooves 161 with each other. Other liquid flow path communication grooves 165 are arranged to communicate the vapor flow path section 150 (the first vapor passage 151 or the second vapor passage 152) with the liquid flow path mainstream groove 161. That is, the liquid flow path communication groove 165 extends from the edge of the land portion 133 in the Y direction to the liquid flow path mainstream groove 161 adjacent to the edge. In this way, the first vapor passage 151 or the second vapor passage 152 of the vapor flow path section 150 communicates with the liquid flow path mainstream groove 161.

[0307] The liquid flow path communication groove 165 has a flow path cross-sectional area smaller than that of the first steam passage 151 or the second steam passage 152 of the steam flow path section 150 so that the working fluid 2b flows mainly by capillary action. The liquid flow path communication grooves 165 may be disposed at equal intervals in the X direction.

[0308] Like the liquid flow path mainstream groove 161, the liquid flow path connecting groove 165 is also formed by etching, and has a wall surface (not shown) formed in a curved shape like the liquid flow path mainstream groove 161. The width ww4 (dimension in the X direction) of the liquid flow path connecting groove 165 shown in Fig. 41 may be equal to the width ww3 of the liquid flow path mainstream groove 161, or may be greater than or smaller than the width ww3. The depth of the liquid flow path connecting groove 165 may be equal to the depth hh1 of the liquid flow path mainstream groove 161, or may be greater than or smaller than the depth hh1.

[0309] As shown in FIG. 41, the liquid flow path section 160 has a liquid flow path convex section row 163 provided on the first main body surface 131a of the sheet main body 131. The liquid flow path convex section row 163 is provided between adjacent liquid flow path main stream grooves 161. Each liquid flow path convex section row 163 includes a plurality of liquid flow path convex sections 164 arranged in the X direction. The liquid flow path convex sections 164 are provided in the liquid flow path section 160 and abut against the second lower sheet surface 110b of the lower sheet 110. Each liquid flow path convex section 164 is formed in a rectangular shape such that the X direction is the longitudinal direction in a plan view. A liquid flow path main stream groove 161 is interposed between adjacent liquid flow path convex sections 164 in the Y direction, and a liquid flow path connection groove 165 is interposed between adjacent liquid flow path convex sections 164 in the X direction. The liquid flow path communication grooves 165 are formed to extend in the Y direction, and communicate with the liquid flow path mainstream grooves 161 adjacent to each other in the Y direction. This allows the hydraulic fluid 2b to move between these liquid flow path mainstream grooves 161.

[0310] The liquid flow path convex portion 164 is a portion that is not etched in the etching process described below, and the material of the wick sheet 130 remains. In the present embodiment, as shown in Fig. 41, the planar shape of the liquid flow path convex portion 164 (the shape at the position of the first main body surface 131a of the sheet main body 131 of the wick sheet 130) is rectangular.

[0311] In this embodiment, the liquid flow path convex portions 164 are arranged in a staggered manner. More specifically, the liquid flow path convex portions 164 of the liquid flow path convex portion rows 163 adjacent to each other in the Y direction are arranged to be shifted from each other in the X direction. This shift amount may be half the arrangement pitch of the liquid flow path convex portions 164 in the X direction. The width ww5 (dimension in the Y direction) of the liquid flow path convex portion 164 shown in FIG. 41 may be, for example, 5 μm to 500 μm. Note that the width ww5 of the liquid flow path convex portion 164 means the dimension on the first main body surface 131a. Note that the arrangement of the liquid flow path convex portions 164 is not limited to a staggered arrangement, and may be arranged in parallel. In this case, the liquid flow path convex portions 164 of the liquid flow path convex portion rows 163 adjacent to each other in the Y direction are also aligned in the X direction.

[0312] The liquid flow path mainstream groove 161 includes a liquid flow path intersection 166 that communicates with the liquid flow path communication groove 165. At the liquid flow path intersection 166, the liquid flow path mainstream groove 161 and the liquid flow path communication groove 165 communicate in a T-shape. This makes it possible to prevent the liquid flow path communication groove 165 on the other side (for example, the lower side in FIG. 41) from communicating with the liquid flow path mainstream groove 161 at the liquid flow path intersection 166, where one liquid flow path mainstream groove 161 communicates with the liquid flow path communication groove 165 on one side (for example, the upper side in FIG. 41). This makes it possible to prevent the wall surface 162 of the liquid flow path mainstream groove 161 from being cut out on both sides (upper and lower sides in FIG. 41) at the liquid flow path intersection 166, and to leave one side of the wall surface 162. As a result, even at the liquid flow path intersection 166, capillary action can be imparted to the working fluid in the liquid flow path main groove 161, and a decrease in the propulsion force of the working fluid 2b toward the evaporation region SSR at the liquid flow path intersection 166 can be suppressed.

[0313] 35, the vapor chamber 101 may further include an injection part 104 for injecting the working fluid 2b into the sealed space 103 at one side edge in the X direction (the left side in FIG. 35). In the example shown in FIG. 35, the injection part 104 is disposed on the evaporation region SSR side and protrudes outward from the side edge on the evaporation region SSR side.

[0314] The injection section 104 is configured by overlapping a lower sheet injection protrusion 113 (see FIG. 37) of the lower sheet 110, an upper sheet injection protrusion 123 (see FIG. 38) of the upper sheet 120, and a wick sheet injection protrusion 136 (see FIG. 39) of the wick sheet 130. In the illustrated example, the lower surface (first main body surface 131a) of the wick sheet injection protrusion 136 and the upper surface (second lower sheet surface 110b) of the lower sheet injection protrusion 113 overlap, and the upper surface (second main body surface 131b) of the wick sheet injection protrusion 136 and the lower surface (first upper sheet surface 120a) of the upper sheet injection protrusion 123 overlap. Of these, an injection flow path 137 may be formed in the wick sheet injection protrusion 136. The injection flow path 137 may penetrate from the first main body surface 131a to the second main body surface 131b of the sheet main body 131. That is, it may penetrate the sheet main body 131 (wick sheet injection protrusion 136) in the Z direction. The injection flow path 137 communicates with the first vapor passage 151, and the working fluid 2b may be injected into the first vapor passage 151 through the injection flow path 137. Depending on the arrangement of the liquid flow path section 160, the injection flow path 137 may be communicated with the liquid flow path section 160. The upper and lower surfaces of the wick sheet injection protrusion 136 may be formed flat, and the upper surface of the lower sheet injection protrusion 113 and the lower surface of the upper sheet injection protrusion 123 may also be formed flat. The planar shapes of the injection protrusions 113, 123, and 136 may be the same.

[0315] In the present embodiment, the injection part 104 is provided on one of a pair of side edges in the X direction of the vapor chamber 101, but the present invention is not limited thereto and may be provided at any position. The injection flow path 137 provided in the wick sheet injection protrusion 136 does not need to penetrate the sheet body 131 as long as the working liquid 2b can be injected. In this case, the injection flow path 137 communicating with the vapor flow path part 150 can be formed by etching only from one of the first body surface 131a and the second body surface 131b of the sheet body 131. The injection part 104 may be cut and removed after the working liquid 2b is injected during the manufacture of the vapor chamber 101.

[0316] As described above, the wick sheet 130 according to the present embodiment includes the retracted portion 170 retracted from the outer peripheral edge 132o toward the steam flow path portion 150. In the present embodiment, the retracted portion 170 is retracted from each of the pair of longitudinal side edges 132a, 132b and the pair of lateral side edges 132c, 132d of the wick sheet 130. That is, the retracted portion 170 is provided on each side of the pair of longitudinal side edges 132a, 132b and the pair of lateral side edges 132c, 132d. The retracted portion 170 may be retracted from the entire periphery of the outer peripheral edge 132o of the wick sheet 130 except for the portion where the wick sheet injection protrusion 136 is provided.

[0317] As described above, the planar shape of the vapor chamber 101 is not limited to a rectangular shape, and may be any shape such as a circular shape, an elliptical shape, an L-shape, a T-shape, etc. In this case, the retraction portion 170 may be formed around the entire outer peripheral edge 132o of the wick sheet, or may be formed at any position on the outer peripheral edge 132o of the wick sheet.

[0318] As shown in Fig. 36 and Fig. 40, in a cross-sectional view along the thickness direction (Z direction) of the wick sheet 130, the lead-in portion 170 has a lead-in edge 171 extending from the outer peripheral edge 132o (longitudinal side edges 132a, 132b and lateral side edges 132c, 132d) of the wick sheet. Here, the outer peripheral edge 132o is the outer peripheral edge of the wick sheet 130 in a plan view as shown in Fig. 39, and is located on the upper sheet 120 side. The lead-in edge 171 extends from the outer peripheral edge 132o to the first main body surface 131a, and is curved concavely toward the steam flow path portion 150. The lead-in edge 171 may be formed so as to approach the steam flow path portion 150 as it approaches the first main body surface 131a. In the illustrated example, the lead-in edge 171 extends from the outer periphery 121 o of the upper sheet 120 toward the outer periphery 111 o of the lower sheet 110 .

[0319] 40, the dimension ww6 between the outer circumferential edge 121o of the upper sheet 120 and the outer circumferential edge 111o of the lower sheet 110 in the Y direction may be, for example, 50 μm to 1000 μm. In other words, the recessed portion 170 may be recessed from the outer circumferential edge 132o by 50 μm or more and 1000 μm or less.

[0320] 40, the dimension ww7 between the longitudinal side edge 111a of the lower sheet 110 and the steam flow path portion 150 (first steam path 151) may be, for example, 30 μm to 3000 μm. Here, this dimension ww7 refers to the dimension on the first main body surface 131a. In other words, the retraction portion 170 may be provided at a position on the first main body surface 131a that is 30 μm or more and 3000 μm or less away from the steam flow path portion 150 (first steam path 151).

[0321] Such a recess 170 may be formed by etching from the first main body surface 131a of the sheet main body 131 of the wick sheet 130 in an etching step described below.

[0322] The materials constituting the lower sheet 110, the upper sheet 120, and the wick sheet 130 are not particularly limited as long as they have good thermal conductivity, but the lower sheet 110, the upper sheet 120, and the wick sheet 130 may contain, for example, copper or a copper alloy. In this case, the thermal conductivity of each of the sheets 110, 120, and 130 can be increased, and the heat dissipation efficiency of the vapor chamber 101 can be improved.

[0323] 36 may be, for example, 100 μm to 1000 μm. By making the thickness tt1 of the vapor chamber 101 100 μm or more, the vapor channel portion 150 can be properly secured, and the vapor chamber 101 can function properly. On the other hand, by making the thickness tt1 of the vapor chamber 101 1000 μm or less, the thickness tt1 of the vapor chamber 101 can be prevented from becoming thick.

[0324] The thickness tt2 of the lower sheet 110 shown in FIG. 36 may be, for example, 6 μm to 100 μm. By setting the thickness tt2 of the lower sheet 110 to 6 μm or more, the mechanical strength of the lower sheet 110 can be ensured. On the other hand, by setting the thickness tt2 of the lower sheet 110 to 100 μm or less, it is possible to prevent the thickness tt1 of the vapor chamber 101 from becoming thick. Similarly, the thickness tt3 of the upper sheet 120 shown in FIG. 36 may be set to be the same as the thickness tt2 of the lower sheet 110. The thickness tt3 of the upper sheet 120 and the thickness tt2 of the lower sheet 110 may be different from each other.

[0325] 36 may be, for example, 50 μm to 400 μm. By setting the thickness tt4 of the wick sheet 130 to 50 μm or more, the vapor channel portion 150 can be appropriately secured, and the vapor chamber 101 can operate appropriately. On the other hand, by setting the thickness tt4 of the wick sheet 130 to 400 μm or less, the thickness tt1 of the vapor chamber 101 can be prevented from becoming thick.

[0326] Next, a method for manufacturing the vapor chamber 101 having such a configuration will be described with reference to FIGS.

[0327] Here, we first explain the sheet preparation process for preparing the sheets 110, 120, and 130. This sheet preparation process includes a lower sheet preparation process for preparing the lower sheet 110, an upper sheet preparation process for preparing the upper sheet 120, and a wick sheet preparation process for preparing the wick sheet 130.

[0328] In the lower sheet preparation step, first, a lower sheet base material having a desired thickness is prepared. The lower sheet base material may be a rolled material. Then, the lower sheet base material is etched to form the lower sheet 110 having a desired planar shape. Alternatively, the lower sheet base material may be press-processed to form the lower sheet 110 having a desired planar shape. As described above, the lower sheet 110 is formed so as to be smaller overall than the upper sheet 120 in a plan view. In this manner, the lower sheet 110 having an outer contour shape as shown in FIG. 37 can be prepared.

[0329] In the upper sheet preparation step, as in the lower sheet preparation step, first, an upper sheet base material having a desired thickness is prepared. The upper sheet base material may be a rolled material. Then, the upper sheet base material is etched to form the upper sheet 120 having a desired planar shape. Alternatively, the upper sheet base material may be press-processed to form the upper sheet 120 having a desired planar shape. As described above, the upper sheet 120 is formed so as to be larger overall than the lower sheet 110 in a plan view. In this manner, the upper sheet 120 having an outer contour shape as shown in FIG. 38 can be prepared.

[0330] The wick sheet preparation step includes a material sheet preparation step of preparing a metal material sheet MM, and an etching step of etching the metal material sheet MM.

[0331] First, in a material sheet preparation step, a flat metal material sheet MM including a first material surface MMa and a second material surface MMb is prepared as shown in Fig. 42. The metal material sheet MM may be formed of a rolled material having a desired thickness.

[0332] Next, in the etching step, as shown in FIG. 43, the metal material sheet MM is etched from the first material surface MMa and the second material surface MMb to form the vapor flow path portion 150, the liquid flow path portion 160, and the inlet portion 170.

[0333] More specifically, a patterned resist film (not shown) is formed on the first material surface MMa and the second material surface MMb of the metal material sheet MM by photolithography. The pattern of this resist film includes the above-mentioned patterns of the vapor flow path portion 150, the liquid flow path portion 160, and the inlet portion 170. Next, the first material surface MMa and the second material surface MMb of the metal material sheet MM are etched through the openings of the patterned resist film. As a result, the first material surface MMa and the second material surface MMb of the metal material sheet MM are etched in a pattern to form the vapor flow path portion 150 and the liquid flow path portion 160 as shown in FIG. 43. In addition, the inlet portion 170 is also formed by this etching (etching from the first material surface MMa). Note that, for example, an iron chloride-based etching solution such as a ferric chloride aqueous solution, or a copper chloride-based etching solution such as a copper chloride aqueous solution can be used as the etching solution.

[0334] The etching may be performed by simultaneously etching the first material surface MMa and the second material surface MMb of the metal material sheet MM. However, this is not limited to this, and the etching of the first material surface MMa and the second material surface MMb may be performed in separate steps. In addition, the steam flow path portion 150, the liquid flow path portion 160, and the inlet portion 170 may be formed by etching simultaneously, or may be formed in separate steps.

[0335] In the etching process, the first material surface MMa and the second material surface MMb of the metal material sheet MM can be etched to obtain a predetermined outer contour shape as shown in Fig. 39. That is, the wick sheet 130 having the above-mentioned outer circumferential edge 132o can be obtained.

[0336] It should be noted that the formation of the recess 170 is not limited to etching, and may be formed, for example, by cutting the edge of the metal sheet MM after the etching process.

[0337] In this manner, the wick sheet 130 according to the present embodiment can be prepared.

[0338] After the preparation step, a joining step is performed in which the lower sheet 110, the upper sheet 120 and the wick sheet 130 are joined together as shown in FIG.

[0339] More specifically, first, the lower sheet 110, the wick sheet 130, and the upper sheet 120 are laminated in this order. In this case, the first main body surface 131a of the wick sheet 130 is superimposed on the second lower sheet surface 110b of the lower sheet 110, and the first upper sheet surface 120a of the upper sheet 120 is superimposed on the second main body surface 131b of the wick sheet 130. At this time, the sheets 110, 120, and 130 may be aligned using the alignment hole 112 of the lower sheet 110, the alignment hole 135 of the wick sheet 130, and the alignment hole 122 of the upper sheet 120.

[0340] Next, the lower sheet 110, the wick sheet 130, and the upper sheet 120 are temporarily joined together. For example, these sheets 110, 120, and 130 may be temporarily joined together by spot resistance welding, or these sheets 110, 120, and 130 may be temporarily joined together by laser welding.

[0341] Next, the lower sheet 110, the wick sheet 130, and the upper sheet 120 are permanently bonded together by thermocompression. For example, the sheets 110, 120, and 130 may be permanently bonded together by diffusion bonding. Diffusion bonding is a method in which the lower sheet 110 and the wick sheet 130 are bonded together, and the wick sheet 130 and the upper sheet 120 are bonded together, and then pressure is applied in the lamination direction and heat is applied in a controlled atmosphere such as a vacuum or an inert gas, to bond them together by utilizing the diffusion of atoms that occurs at the bonding surface. In diffusion bonding, the material of each sheet 110, 120, and 130 is heated to a temperature close to the melting point, but is lower than the melting point, so that it is possible to prevent each sheet 110, 120, and 130 from melting and deforming. As a result, the first main body surface 131a of the frame body portion 132 and each land portion 133 of the wick sheet 130 is diffusion bonded to the second lower sheet surface 110b of the lower sheet 110. Further, the frame portion 132 of the wick sheet 130 and the second main body surface 131b of each land portion 133 are diffusion bonded to the first upper sheet surface 120a of the upper sheet 120. In this manner, the sheets 110, 120, 130 are diffusion bonded to form a sealed space 103 having a vapor flow path portion 150 and a liquid flow path portion 160 between the lower sheet 110 and the upper sheet 120. At this stage, the sealed space 103 is in communication with the outside via the injection flow path 137, with the injection flow path 137 not being sealed.

[0342] After the joining step, the hydraulic fluid 2b is injected into the sealed space 103 from the injection flow path 137 of the injection section 104 as an injection step.

[0343] After the injection step, the injection flow path 137 is sealed as a sealing step. The injection part 104 may be partially melted to seal the injection flow path 137. This blocks communication between the sealed space 103 and the outside, and seals the sealed space 103. Therefore, the sealed space 103 filled with the working liquid 2b is obtained, and the working liquid 2b in the sealed space 103 is prevented from leaking to the outside. After sealing the injection flow path 137, the injection part 104 may be removed. The entire injection part 104 may be removed. Alternatively, a part of the injection part 104 may be removed, and the remaining part may remain.

[0344] In this manner, the vapor chamber 101 according to the present embodiment is obtained.

[0345] In this manner, vapor chambers 101 according to the present embodiment can be manufactured one after another. The manufactured vapor chambers 101 can be stored by being stacked on a mounting surface 179 provided in a predetermined location, as shown in Fig. 45. Thereafter, the vapor chambers 101 are removed from this mounting location and transported when shipped or when mounted on the device D.

[0346] Next, a method for transporting the vapor chamber 101 thus manufactured will be described with reference to Figures 46 and 47. Here, a method for removing the vapor chamber 101 from the state in which the vapor chambers 101 are stacked on top of each other and placed, as shown in Figure 45, and transporting it will be described.

[0347] First, as shown in FIG. 46, the claws 182a, 182b of the first arm portion 181a and the second arm portion 181b of the suspension device 180 are engaged with the retraction portion 170 of the wick sheet 130, respectively.

[0348] More specifically, first, the first arm portion 181a is moved in the vertical direction to position the first claw portion 182a provided at the tip of the first arm portion 181a at a position where the retraction portion 170 is provided in the Z direction of the vapor chamber 101 placed at the top. In addition, the second arm portion 181b is moved in the vertical direction to position the second claw portion 182b provided at the tip of the second arm portion 181b at a position where the retraction portion 170 is provided in the Z direction of the vapor chamber 101. Next, the first arm portion 181a is moved in the horizontal direction to bring the first claw portion 182a into contact with the retraction edge 171 of the retraction portion 170 provided on one side in the Y direction (the left side in FIG. 46). Similarly, the second arm portion 181b is moved horizontally so that the second claw portion 182b comes into contact with the retraction edge 171 of the retraction portion 170 provided on the other side in the Y direction (the right side in FIG. 46).

[0349] Next, as shown in FIG. 47, the vapor chamber 101 is suspended by a suspension device 180.

[0350] More specifically, the first arm portion 181a and the second arm portion 181b are moved upward in a state in which the first claw portion 182a and the second claw portion 182b are respectively in contact with the retraction edge 171 of the retraction portion 170. As a result, the wick sheet 130 is supported by the first claw portion 182a and the second claw portion 182b, and the vapor chamber 101 is suspended by the suspension device 180.

[0351] Then, with vapor chamber 101 suspended by suspension device 180, first arm portion 181a and second arm portion 181b are moved in the horizontal direction to transport vapor chamber 101 to a desired target position.

[0352] In this manner, the vapor chamber 101 according to this embodiment can be transported by the hanging device 180.

[0353] Here, a method for removing and transporting the vapor chambers 101 from a state in which the vapor chambers 101 are stacked on top of one another has been described. However, the present invention is not limited to this, and even if the vapor chambers 101 are directly placed on the placement surface 179, the vapor chambers 101 can be transported using the hanging device 180.

[0354] Here, a method for transporting a general vapor chamber 101' will be described. As shown in Fig. 48, the side of a general vapor chamber 101' is formed vertically, and unlike the vapor chamber 101 according to this embodiment, the retraction portion 170 is not formed in the wick sheet 30. For this reason, the claws 182a and 182b of the suspension device 180 cannot be engaged with the retraction portion 170, and it is difficult to transport the general vapor chamber 101' by the suspension device 180 described above.

[0355] A typical vapor chamber 101' can be removed and transported by an adsorption device 185, as shown in FIG. 48. More specifically, the adsorption device 185 has an adsorption pad 186 that generates an adsorption force by creating a negative pressure inside, and this adsorption pad 186 is pressed against the upper surface of the vapor chamber 101' to adsorb it to the vapor chamber 101'. Thereafter, with the vapor chamber 101' being adsorbed by the adsorption pad 186, the adsorption device 185 is moved upward to suspend the vapor chamber 101'. Then, the adsorption device 185 is moved horizontally to transport the vapor chamber 101' to a desired target position.

[0356] At this time, if the vapor chamber 101' has been thinned, there is a risk that the vapor chamber 101' will be deformed due to the suction force of the suction pad 186 acting on the upper surface of the vapor chamber 101'. For this reason, in order to suppress deformation of the vapor chamber 101', the thinning of the vapor chamber 101' may be suppressed.

[0357] In contrast to this, in this embodiment, the retraction portion 170 is provided on the wick sheet 130 of the vapor chamber 101. This allows the claws 182a and 182b of the hanging device 180 to engage with the retraction portion 170 of the wick sheet 130 of the placed vapor chamber 101. Therefore, the vapor chamber 101 can be suspended and transported by the hanging device 180, making it unnecessary to use the above-mentioned suction device 185. Therefore, deformation of the vapor chamber 101 can be suppressed. As a result, the vapor chamber 101 can be made even thinner.

[0358] The transportation of the vapor chamber 101 by the hanging device 180 described above is an example, and the vapor chamber 101 can be transported using any other device or the like. For example, the vapor chamber 101 may be transported using a tool having a sharp tip. More specifically, the tip of the tool may be brought into contact with the retraction edge 171 of the retraction portion 170, and then the tool may be moved upward to lift the vapor chamber 101. The lifted vapor chamber 101 may then be grasped by hand and transported. Also, for example, without using such a device or tool, the vapor chamber 101 may be lifted by bringing a finger into contact with the retraction edge 171 of the retraction portion 170, and then the vapor chamber 101 may be grasped and transported. Even in such a case, since the wick sheet 130 has the retraction portion 170, it is easy to remove and transport the vapor chamber 101.

[0359] Next, a method for operating the vapor chamber 101, that is, a method for cooling the device D, will be described.

[0360] The vapor chamber 101 transported as described above is installed in a housing H of a mobile terminal or the like at the transport destination, and the housing member Ha comes into contact with the second upper sheet surface 120b of the upper sheet 120. A device D such as a CPU, which is a device to be cooled, is attached to the first lower sheet surface 110a of the lower sheet 110 (or the vapor chamber 101 is attached to the device D), and the first lower sheet surface 110a of the lower sheet 110 comes into contact with the device D. The working fluid 2b in the sealed space 103 adheres to the wall surfaces of the sealed space 103, i.e., the wall surface 153a of the lower vapor flow path recess 153, the wall surface 154a of the upper vapor flow path recess 154, the wall surface 162 of the liquid flow path main groove 161 of the liquid flow path section 160, and the wall surface of the liquid flow path connection groove 165, due to its surface tension. The working fluid 2b may also adhere to portions of the second lower sheet surface 110b of the lower sheet 110 that are exposed to the lower vapor flow path recess 153, the liquid flow path main groove 161, and the liquid flow path connecting groove 165. Furthermore, the working fluid 2b may also adhere to portions of the first upper sheet surface 120a of the upper sheet 120 that are exposed to the upper vapor flow path recess 154.

[0361] In this state, when the device D generates heat, the working fluid 2b present in the evaporation region SSR (see FIG. 39) receives heat from the device D. The received heat is absorbed as latent heat, and the working fluid 2b evaporates (vaporizes), generating working steam 2a. Most of the generated working steam 2a diffuses in the lower steam passage recess 153 and the upper steam passage recess 154 that constitute the sealed space 103 (see the solid arrows in FIG. 39). The working steam 2a in each of the steam passage recesses 153 and 154 leaves the evaporation region SSR, and most of the working steam 2a is transported to the condensation region CCR (the right part in FIG. 39) where the temperature is relatively low. In the condensation region CCR, the working steam 2a is cooled by mainly dissipating heat to the upper sheet 120. The heat received by the upper sheet 120 from the working steam 2a is transferred to the outside air via the housing member Ha (see FIG. 36).

[0362] The working steam 2a dissipates heat to the upper sheet 120 in the condensation region CCR, and thereby loses the absorbed latent heat in the evaporation region SSR and condenses to generate working liquid 2b. The generated working liquid 2b adheres to the wall surfaces 153a, 154a of the vapor flow path recesses 153, 154, the second lower sheet surface 110b of the lower sheet 110, and the first upper sheet surface 120a of the upper sheet 120. Since the working liquid 2b continues to evaporate in the evaporation region SSR, the working liquid 2b in the region of the liquid flow path section 160 other than the evaporation region SSR (i.e., the condensation region CCR) is transported toward the evaporation region SSR by the capillary action of each liquid flow path mainstream groove 161 (see the dashed arrow in FIG. 39). As a result, the working fluid 2b adhering to each of the wall surfaces 153a, 154a, the second lower sheet surface 110b, and the first upper sheet surface 120a moves to the liquid flow path portion 160, passes through the liquid flow path communication groove 165, and enters the liquid flow path mainstream groove 161. In this manner, the working fluid 2b is filled into each of the liquid flow path mainstream grooves 161 and each of the liquid flow path communication grooves 165. Therefore, the filled working fluid 2b obtains a propulsive force toward the evaporation region SSR due to the capillary action of each of the liquid flow path mainstream grooves 161, and is smoothly transported toward the evaporation region SSR.

[0363] In the liquid flow path section 160, each liquid flow path mainstream groove 161 communicates with the adjacent other liquid flow path mainstream groove 161 via the corresponding liquid flow path connection groove 165. This allows the working fluid 2b to flow between the adjacent liquid flow path mainstream grooves 161, preventing the occurrence of dryout in the liquid flow path mainstream groove 161. As a result, a capillary action is imparted to the working fluid 2b in each liquid flow path mainstream groove 161, and the working fluid 2b is smoothly transported toward the evaporation region SSR.

[0364] The working fluid 2b that has reached the evaporation region SSR is evaporated by receiving heat again from the device D. The working vapor 2a that has evaporated from the working fluid 2b passes through the liquid flow path communication groove 165 in the evaporation region SSR, moves to the lower vapor flow path recess 153 and the upper vapor flow path recess 154, which have a large flow path cross-sectional area, and diffuses within each of the vapor flow path recesses 153, 154. In this way, the working fluids 2a, 2b circulate within the sealed space 103 while repeatedly changing phases, i.e., evaporating and condensing, to transport and release the heat of the device D. As a result, the device D is cooled.

[0365] Thus, according to this embodiment, the wick sheet 130 has the retracted portion 170 retracted from the outer circumferential edge 132o toward the vapor flow path portion 150. This allows the claws 182a, 182b, etc. of the hanging device 180 to engage with the retracted portion 170 of the wick sheet 130 of the placed vapor chamber 101. This allows the vapor chamber 101 to be easily lifted, facilitating the transportation of the vapor chamber 101. As a result, the transportability of the vapor chamber 101 can be improved.

[0366] Moreover, according to the present embodiment, it is possible to eliminate the need to use the suction device 185 for transporting the vapor chamber 101. This makes it possible to suppress deformation of the vapor chamber 101. As a result, it is possible to realize a further reduction in thickness of the vapor chamber 101.

[0367] Furthermore, according to this embodiment, since the retracted portion 170 is formed on the side surface of the wick sheet 130, when multiple vapor chambers 101 are stacked on top of each other, each vapor chamber 101 can be easily distinguished from the side surface. This makes it easier to individually remove and transport the vapor chambers 101. This improves the transportability of the vapor chambers 101.

[0368] Furthermore, according to this embodiment, since the retracted portion 170 is formed in the wick sheet 130, the vapor chamber 101 can be made lighter and more compact.

[0369] Furthermore, according to this embodiment, the leading edge 171 of the leading portion 170 is curved in a concave shape toward the vapor flow path portion 150. This allows the vapor chamber 101 to be firmly supported and lifted by the claws 182a, 182b, etc. of the hanging device 180. This further improves the transportability of the vapor chamber 101.

[0370] Furthermore, according to this embodiment, the leading edge 171 of the leading portion 170 is formed so as to approach the vapor flow path portion 150 as it approaches the first main body surface 131a. This allows the vapor chamber 101 to be more firmly supported and lifted by the claws 182a, 182b, etc. of the hanging device 180. This further improves the transportability of the vapor chamber 101.

[0371] Further, according to this embodiment, the retraction portion 170 is retracted from a pair of longitudinal side edges 132a, 132b and a pair of lateral side edges 132c, 132d of the wick sheet 130. This allows the hooks 182a, 182b, etc. of the hanging device 180 to engage with the retraction portion 170 of the wick sheet 130 from any direction in a plan view of the placed vapor chamber 101, thereby lifting the vapor chamber 101. This makes it even easier to lift the vapor chamber 101. As a result, the transportability of the vapor chamber 101 can be further improved.

[0372] Furthermore, according to this embodiment, the vapor flow path portion 150 penetrates from the first main body surface 131a to the second main body surface 131b, and the upper sheet 120 covers the vapor flow path portion 150 at the second main body surface 131b. In this manner, by configuring the vapor chamber 101 with the lower sheet 110, the upper sheet 120, and the wick sheet 130, the heat received by the lower sheet 110 from the device D can be released from the upper sheet 120. This allows the device D to be cooled effectively. This improves the performance of the vapor chamber 101.

[0373] The vapor chamber 101 may have a shape symmetrical to the above-mentioned shape in the Z direction. That is, the lower sheet 110 may be formed larger than the upper sheet 120 as a whole in a plan view, and the leading edge 171 of the leading portion 170 may extend from the outer peripheral edge 111o of the lower sheet 110 toward the outer peripheral edge 121o of the upper sheet 120. Even in such a case, when the vapor chamber 101 is placed in the opposite direction, that is, when the second upper sheet surface 120b of the upper sheet 120 is placed facing the placement surface 179, the claws 182a, 182b, etc. of the hanging device 180 are brought into contact with the leading edge 171 of the leading portion 170 and moved upward, so that the vapor chamber 101 can be easily lifted. Therefore, the transportation of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0374] (First modified example of the third embodiment) In the above-described third embodiment, an example has been described in which the leading edge 171 of the leading portion 170 is curved concavely toward the steam channel portion 150 (see FIG. 36). However, this is not limited thereto, and the leading edge 171 of the leading portion 170 may be inclined with respect to the Z direction as shown in FIG.

[0375] In the example shown in Fig. 49, the leading-in edge 171 extends from the outer peripheral edge 132o to the first main body surface 131a and is inclined with respect to the Z direction. The leading-in edge 171 is formed so as to approach the steam flow path portion 150 as it approaches the first main body surface 131a. The leading-in edge 171 extends linearly from the outer peripheral edge 121o of the upper sheet 120 to the outer peripheral edge 111o of the lower sheet 110. Therefore, in a cross-sectional view along the Z direction, the outer shape of the wick sheet 130 is an inverted trapezoid, as shown in Fig. 49.

[0376] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0377] In addition, since the leading edge 171 is inclined with respect to the Z direction, the vapor chamber 101 can be easily lifted by bringing the claws 182a, 182b, etc. of the hanging device 180 into contact with the leading edge 171 of the leading portion 170 and moving it upward. This makes it possible to further improve the transportability of the vapor chamber 101.

[0378] (Second modified example of the third embodiment) In the above-described third embodiment, an example has been described in which the leading edge 171 of the leading portion 170 is curved concavely toward the steam flow path portion 150 (see FIG. 36). However, this is not limited to this, and the leading edge 171 of the leading portion 170 may be curved convexly toward the side opposite the steam flow path portion 150, as shown in FIG.

[0379] 50, the leading-in edge 171 extends from the outer circumferential edge 132o to the first main body surface 131a, and is curved in a convex shape toward the opposite side to the steam flow path portion 150. The leading-in edge 171 is formed so as to approach the steam flow path portion 150 as it approaches the first main body surface 131a. The leading-in edge 171 extends from the outer circumferential edge 121o of the upper sheet 120 toward the outer circumferential edge 111o of the lower sheet 110.

[0380] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0381] (Third Modification of the Third Embodiment) In the above-mentioned third embodiment, an example has been described in which the leading-in edge 171 of the leading-in portion 170 is curved concavely toward the steam channel portion 150 (see FIG. 36). However, this is not limited to the above, and as shown in FIG. 51, the leading-in edge 171 of the leading-in portion 170 may include a first leading-in edge 171a extending from the first main body surface 131a toward the second main body surface 131b, a second leading-in edge 171b extending from the second main body surface 131b toward the first main body surface 131a, and a stepped connecting edge 171c connecting the first leading-in edge 171a and the second leading-in edge 171b.

[0382] In the example shown in FIG. 51, the leading edge 171 includes a first leading edge 171a, a second leading edge 171b, and a step connection edge 171c that connects the first leading edge 171a and the second leading edge 171b. The first leading edge 171a is provided on the first main body surface 131a side. The second leading edge 171b is provided on the second main body surface 131b side. The first leading edge 171a is located closer to the steam flow path section 150 than the second leading edge 171b. The first leading edge 171a extends linearly in the Z direction from the first main body surface 131a toward the second main body surface 131b side. The first leading edge 171a may extend to, for example, an intermediate position between the first main body surface 131a and the second main body surface 131b. The second lead-in edge 171b extends linearly in the Z direction from the second main body surface 131b toward the first main body surface 131a. The second lead-in edge 171b may extend, for example, to an intermediate position between the first main body surface 131a and the second main body surface 131b. The stepped connection edge 171c extends linearly from the first lead-in edge 171a toward the second lead-in edge 171b so as to connect the first lead-in edge 171a and the second lead-in edge 171b. Thus, in a cross-sectional view along the Z direction, the lead-in edge 171 of the lead-in portion 170 is formed in a stepped shape.

[0383] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0384] In addition, by providing the stepped connection edge 171c that connects the first leading edge 171a and the second leading edge 171b, the vapor chamber 101 can be firmly supported and lifted by the claws 182a, 182b, etc. of the hanging device 180. This further improves the transportability of the vapor chamber 101.

[0385] (Fourth Modification of the Third Embodiment) In the above-described third embodiment, an example has been described in which lead-in edge 171 of lead-in portion 170 is formed so as to approach steam flow path portion 150 as it approaches first main body surface 131a (see FIG. 36). However, this is not limited to the above, and as shown in FIG. 52, lead-in edge 171 of lead-in portion 170 may be formed so as to approach steam flow path portion 150 as it approaches relay point 172 from outer circumferential edge 132o, and so as to move away from steam flow path portion 150 as it approaches relay point 172 from first main body surface 131a.

[0386] 52, unlike the above-described embodiment, the lower sheet 110 and the upper sheet 120 are formed to have the same size in a plan view. In addition, in a plan view, the outer peripheral edge 111o of the lower sheet 110 and the outer peripheral edge 121o of the upper sheet 120 overlap each other. That is, in a plan view, the longitudinal side edges 111a, 111b and the lateral side edges 111c, 111d of the lower sheet 110 overlap the longitudinal side edges 121a, 121b and the lateral side edges 121c, 121d of the upper sheet 120, respectively.

[0387] In the example shown in FIG. 52, the outer peripheral edge 132o of the wick sheet 130 in plan view is located on the second main body surface 131b side. In this case, the lead-in edge 171 of the lead-in portion 170 extends from the outer peripheral edge 132o through the relay point 172 to the first main body surface 131a. The relay point 172 may be located at an intermediate position between the first main body surface 131a and the second main body surface 131b in the Z direction. The lead-in edge 171 is curved in a concave shape toward the steam flow path portion 150. The lead-in edge 171 is formed so as to approach the steam flow path portion 150 as it approaches the relay point 172 from the outer peripheral edge 132o, and is formed so as to move away from the steam flow path portion 150 as it approaches the relay point 172 from the outer peripheral edge 132o. By virtue of such a leading edge 171, the leading portion 170 has a shape recessed toward the steam flow path portion 150 at the center of the wick sheet .

[0388] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0389] In addition, since the leading edge 171 of the leading portion 170 is curved concavely toward the vapor passage portion 150, the vapor chamber 101 can be firmly supported and lifted by the claws 182a, 182b, etc. of the hanging device 180. This further improves the transportability of the vapor chamber 101.

[0390] Furthermore, even if the vapor chamber 101 is placed facing the opposite direction, i.e., even if the upper sheet 120 is placed so that the second upper sheet surface 120b faces the placement surface 179, the vapor chamber 101 can be easily lifted by abutting the claws 182a, 182b, etc. of the hanging device 180 against the retraction edge 171 of the retraction portion 170 and moving them upward. Therefore, even if the vapor chamber 101 is placed facing the opposite direction, the vapor chamber 101 can be easily transported. As a result, the transportability of the vapor chamber 101 can be further improved.

[0391] (Fifth Modification of the Third Embodiment) In the above-mentioned third embodiment, an example has been described in which the lead-in edge 171 of the lead-in portion 170 has the lead-in edge 171 extending from the outer peripheral edge 132o in a cross-sectional view along the Z direction (see FIG. 36). However, this is not limited thereto, and as shown in FIG. 53, the lead-in portion 170 may include a first main body surface side lead-in portion 174 and a second main body surface side lead-in portion 175, and the first main body surface side lead-in portion 174 may have a first main body surface side lead-in edge 176 and the second main body surface side lead-in portion 175 may have a second main body surface side lead-in edge 177 in a cross-sectional view along the Z direction.

[0392] 53, unlike the above-described embodiment, the lower sheet 110 and the upper sheet 120 are formed to have the same size in a plan view. In addition, in a plan view, the outer peripheral edge 111o of the lower sheet 110 and the outer peripheral edge 121o of the upper sheet 120 overlap each other. That is, in a plan view, the longitudinal side edges 111a, 111b and the lateral side edges 111c, 111d of the lower sheet 110 overlap the longitudinal side edges 121a, 121b and the lateral side edges 121c, 121d of the upper sheet 120, respectively.

[0393] 53, the retraction portion 170 includes a first main body surface side retraction portion 174 provided on the first main body surface 131a side and a second main body surface side retraction portion 175 provided on the second main body surface 131b side. The outer peripheral edge 132o of the wick sheet 130 in a plan view is located between the first main body surface 131a and the second main body surface 131b. The outer peripheral edge 132o may be located at an intermediate position between the first main body surface 131a and the second main body surface 131b. The outer peripheral edge 132o of the wick sheet 130 is formed so as to protrude outward from the outer peripheral edge 111o of the lower sheet 110 and the outer peripheral edge 121o of the upper sheet 120. The first body surface side retraction portion 174 is formed on the first body surface 131a side of this outer peripheral edge 132o, and the second body surface side retraction portion 175 is formed on the second body surface 131b side of this outer peripheral edge 132o.

[0394] In a cross-sectional view along the Z direction, first main body surface side lead-in portion 174 has first main body surface side lead-in edge 176 extending from outer peripheral edge 132o to first main body surface 131a. First main body surface side lead-in edge 176 is curved in a concave shape toward steam flow path portion 150 so as to approach steam flow path portion 150 as it approaches first main body surface 131a. As a result, first main body surface side lead-in portion 174 has a shape that is recessed toward steam flow path portion 150 on the side of first main body surface 131a.

[0395] In addition, in a cross-sectional view along the Z direction, second main body surface side lead-in portion 175 has second main body surface side lead-in edge 177 extending from outer peripheral edge 132o to second main body surface 131b. Second main body surface side lead-in edge 177 is curved in a concave shape toward steam flow path portion 150 so as to approach steam flow path portion 150 as it approaches second main body surface 131b. As a result, second main body surface side lead-in portion 175 has a shape that is recessed toward steam flow path portion 150 on the side of second main body surface 131b.

[0396] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the first main body surface side retraction portion 174. Therefore, the vapor chamber 101 can be easily lifted, and the vapor chamber 101 can be easily transported. As a result, the transportability of the vapor chamber 101 can be improved.

[0397] In addition, since the first main body surface side inlet edge 176 of the first main body surface side inlet portion 174 is curved concavely toward the vapor flow path portion 150, the vapor chamber 101 can be firmly supported and lifted by the claws 182a, 182b, etc. of the hanging device 180. This makes it possible to further improve the transportability of the vapor chamber 101.

[0398] Moreover, even if the vapor chamber 101 is placed facing the opposite direction, that is, even if the upper sheet 120 is placed so that the second upper sheet surface 120b faces the placement surface 179, the vapor chamber 101 can be easily lifted by abutting the claws 182a, 182b, etc. of the hanging device 180 against the second main body surface side retraction edge 177 of the second main body surface side retraction portion 175 and moving them upward. Therefore, even if the vapor chamber 101 is placed facing the opposite direction, the vapor chamber 101 can be easily transported. As a result, the transportability of the vapor chamber 101 can be further improved.

[0399] (Sixth Modification of the Third Embodiment) In the above-mentioned third embodiment, an example has been described in which the retraction portion 170 is retracted from each of the pair of longitudinal side edges 132a, 132b and the pair of lateral side edges 132c, 132d of the wick sheet 130 (see FIG. 35). However, this is not limited thereto, and the retraction portion 170 may be retracted from at least one of the pair of longitudinal side edges 132a, 132b of the wick sheet 130.

[0400] 54 and 55, the retraction portion 170 is retracted from the longitudinal side edge 132a (lower side in FIG. 54) of the wick sheet 130. That is, the retraction portion 170 is provided on the side of the longitudinal side edge 132a of the wick sheet 130. On the other hand, the retraction portion 170 is not retracted from the longitudinal side edge 132b (upper side in FIG. 54) and the lateral side edges 132c and 132d of the wick sheet 130.

[0401] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0402] Furthermore, by limiting the area where the draw-in portion 170 is provided, the area of ​​the vapor chamber 101 can be effectively utilized. That is, the vapor flow path portion 150 and the liquid flow path portion 160 can be provided in a wider area of ​​the wick sheet 130, and the performance of the vapor chamber 101 can be improved.

[0403] (Seventh Modification of the Third Embodiment) In addition, the retraction portion 170 may be retracted from one of the pair of longitudinal side edges 132a, 132b of the wick sheet 130 and also from one of the pair of lateral side edges 132c, 132d of the wick sheet 130.

[0404] In the example shown in Fig. 56, the retraction portion 170 is retracted from the longitudinal side edge 132a (lower side in Fig. 56) of the wick sheet 130, and also from the lateral side edge 132c (left side in Fig. 56) of the wick sheet 130. That is, the retraction portion 170 is provided on the longitudinal side edge 132a side of the wick sheet 130, and also on the lateral side edge 132c side of the wick sheet 130. On the other hand, the retraction portion 170 is not retracted from the longitudinal side edge 132b (upper side in Fig. 56) and the lateral side edge 132d (left side in Fig. 56) of the wick sheet 130.

[0405] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0406] Furthermore, by limiting the area where the draw-in portion 170 is provided, the area of ​​the vapor chamber 101 can be effectively utilized. That is, the vapor flow path portion 150 and the liquid flow path portion 160 can be provided in a wider area of ​​the wick sheet 130, and the performance of the vapor chamber 101 can be improved.

[0407] Furthermore, in the example shown in FIG. 56, the side of the vapor chamber 101 where the inlet portion 170 is provided (the side of the longitudinal side edge 132a and the lateral side edge 132c) can be lifted and transported, and the side of the vapor chamber 101 where the inlet portion 170 is not provided (the side of the longitudinal side edge 132b and the lateral side edge 132d) can be abutted against a predetermined wall surface. This makes it easy to position the vapor chamber 101 relative to the wall surface. Therefore, for example, when a laser beam is irradiated to a predetermined position of the vapor chamber 101 to print manufacturing information or the like, it is possible to print the information at an accurate position. In addition, even after the vapor chamber 101 is abutted against the wall surface, the vapor chamber 101 can be easily lifted from the side where the inlet portion 170 is provided. Therefore, the transportability of the vapor chamber 101 can be improved.

[0408] (Eighth Modification of the Third Embodiment) In addition, the retracted portion 170 may be retracted from a part of a pair of longitudinal side edges 132a, 132b of the wick sheet .

[0409] 57, the retraction portions 170 are retracted from both of the pair of longitudinal side edges 132a, 132b of the wick sheet 130. That is, the retraction portions 170 are provided on each side of the pair of longitudinal side edges 132a, 132b of the wick sheet 130. Also, each of the retraction portions 170 is retracted from a portion of the longitudinal side edges 132a, 132b.

[0410] The retracted portions 170 may be retracted from the center of the longitudinal side edges 132a, 132b. The retracted portions 170 may be disposed symmetrically with respect to the center of gravity of the vapor chamber 101 in a plan view.

[0411] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0412] Moreover, by further limiting the area in which the draw-in portion 170 is provided, it is possible to more effectively utilize the area of ​​the vapor chamber 101. In other words, the vapor flow path portion 150 and the liquid flow path portion 160 can be provided in a wider area of ​​the wick sheet 130, and the performance of the vapor chamber 101 can be further improved.

[0413] In addition, by arranging the retracting parts 170 at positions symmetrical to each other with respect to the center of gravity of the vapor chamber 101 in a plan view, the attitude of the vapor chamber 101 can be stabilized when suspended by the suspension device 180 or the like. This makes it easier to transport the vapor chamber 101.

[0414] (Ninth Modification of the Third Embodiment) In the above-described third embodiment, an example has been described in which the vapor chamber 101 includes one wick sheet 130 (see FIG. 36). However, the present invention is not limited to this, and the vapor chamber 101 may include a plurality of wick sheets 130.

[0415] The number of wick sheets 130 may be any number. The wick sheets 130 may have the same shape and dimensions, or may have different shapes and dimensions. For example, the wick sheets 130 may be formed to have the same size in a plan view. Also, for example, one wick sheet 130 may be formed to be smaller overall than the other wick sheets 130 in a plan view.

[0416] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0417] (Tenth Modification of the Third Embodiment) In the above-mentioned third embodiment, an example has been described in which the vapor chamber 101 is composed of the lower sheet 110, the upper sheet 120, and the wick sheet 130 (see FIG. 36). However, this is not limited thereto, and the vapor chamber 101 may be composed of the lower sheet 110 and the wick sheet 130.

[0418] 58, the vapor chamber 101 includes a lower sheet 110 and a wick sheet 130, but does not include an upper sheet 120. The housing member Ha may be attached to the second main body surface 131b of the wick sheet 130. Heat of the working vapor 2a is transferred from the wick sheet 130 to the housing member Ha.

[0419] 58, the vapor flow path section 150 is provided on the first main body surface 131a, but does not extend to the second main body surface 131b, and does not penetrate the wick sheet 130. In other words, the first vapor passage 151 and the second vapor passage 152 of the vapor flow path section 150 are formed by a lower vapor passage recess 153, and an upper vapor passage recess 154 is not provided in the wick sheet 130.

[0420] The thickness tt5 of the vapor chamber 101 shown in Fig. 58 may be, for example, 100 µm to 1000 µm. The thickness tt6 of the lower sheet 110 shown in Fig. 58 may be, for example, 6 µm to 200 µm. The thickness tt7 of the wick sheet 130 shown in Fig. 58 may be, for example, 50 µm to 800 µm.

[0421] 58, the vapor flow path portion 150 may be provided on the second lower sheet surface 110b of the lower sheet 110. In this case, the vapor flow path portion 150 of the lower sheet 110 may be provided at a position facing the vapor flow path portion 150 of the wick sheet 130. In addition, the liquid flow path portion 160 may be provided on the second lower sheet surface 110b of the lower sheet 110.

[0422] In this manner, the vapor chamber 101 may be composed of the lower sheet 110 and the wick sheet 130.

[0423] Even in such a case, the claws 182a, 182b, etc. of the hanging device 180 can be engaged with the retraction portion 170 of the wick sheet 130. Therefore, the vapor chamber 101 can be easily lifted, and the transport of the vapor chamber 101 can be facilitated. As a result, the transportability of the vapor chamber 101 can be improved.

[0424] According to the embodiment described above, the transportability of the vapor chamber can be improved.

[0425] The present invention is not limited to the above-mentioned embodiment and each modification, and the components can be modified and embodied in the implementation stage without departing from the gist of the invention. In addition, various inventions can be formed by appropriate combinations of the multiple components disclosed in the above-mentioned embodiment and each modification. Some components may be deleted from all the components shown in the above-mentioned embodiment and each modification.

Claims

1. A vapor chamber containing a working fluid, A first sheet; a second sheet laminated on the first sheet; A plurality of main body sheets provided between the first sheet and the second sheet; and a space portion provided in the plurality of main body sheets, A vapor chamber, wherein, in a plan view, the first sheet is recessed toward the space portion relative to an outer peripheral edge of one of the plurality of main body sheets.

2. The vapor chamber according to claim 1 , wherein the other main body sheets included in the plurality of main body sheets are smaller than the one main body sheet in a plan view.

3. The vapor chamber according to claim 2 , wherein the other main body sheet is smaller than the first sheet and / or the second sheet in a plan view.

4. A vapor chamber containing a working fluid, A first sheet; a second sheet laminated on the first sheet; A plurality of main body sheets provided between the first sheet and the second sheet; and a space portion provided in the plurality of main body sheets, A vapor chamber, wherein, in a plan view, one of the plurality of main body sheets is recessed toward the space portion relative to an outer peripheral edge of the first sheet.

5. The vapor chamber according to claim 4 , wherein the other main body sheets included in the plurality of main body sheets are larger than the one main body sheet in a plan view.

6. The vapor chamber according to claim 5 , wherein the other main body sheet is larger than the first sheet and / or the second sheet in a plan view.

7. The vapor chamber according to claim 1 , wherein the first sheet is larger than the second sheet in a plan view.

8. The vapor chamber according to claim 1 , wherein the first sheet is smaller than the second sheet in a plan view.

9. An electronic device comprising the vapor chamber according to any one of claims 1 to 8.

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