Radiation detection device

Abstract

To provide a radiation detection device that suppresses the deterioration and failure of components due to radiation exposure.SOLUTION: A radiation detection device according to the present invention comprises: a plurality of direct detection system radiation detectors arranged planarly; a semiconductor integrated circuit for controlling the radiation detectors or processing signals from the radiation detectors. The semiconductor integrated circuit is arranged on the opposite side of a light-receiving surface of the radiation detectors so that it is included within an area of the radiation detectors when viewed in plan view from the light-receiving surface side of the radiation detectors.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a radiation detection device. [Background technology]

[0002] As a method of detecting X-rays, in addition to a method in which X-rays are made to enter a scintillator (phosphor) and converted into visible light, and the converted visible light is made to enter a semiconductor single crystal substrate to indirectly detect X-rays, a method has been proposed in which X-rays are made to enter a semiconductor single crystal substrate directly to detect them. Compared to the former method (indirect detection method), the latter method (direct detection method) does not use a scintillator, so it is not affected by scattered light and is expected to produce X-ray detection images with high sharpness.

[0003] In an indirect detection type radiation detector, a certain amount of X-rays pass through without being converted, but in a direct detection type radiation detector, the transmission of X-rays is suppressed. For this reason, in a direct detection type radiation detector, a semiconductor integrated circuit that performs various controls and signal processing may be placed on the back side of the light receiving surface. Patent Document 1 discloses a radiation detection device in which a plurality of radiation detectors are arranged (tiled), and a semiconductor integrated circuit such as an ASIC is placed on the side opposite the light receiving surface of the radiation detector. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2019 / 0339402 Summary of the Invention [Problem to be solved by the invention]

[0005] When multiple radiation detectors (chips) are tiled, radiation leaking from the boundaries between the chips and from the periphery of the chips can deteriorate the components arranged on the opposite side of the light receiving surface, which can cause failures. In the technology described in Patent Document 1, the ASIC is arranged across two chips, and there is a risk of degradation due to radiation leaking from the boundaries between the chips.

[0006] SUMMARY OF THE PRESENT EMBODIMENTS An object of the present invention is to provide a radiation detection device that suppresses deterioration and failure of components due to exposure to radiation. [Means for solving the problem]

[0007] The radiation detection device of the present invention comprises a plurality of direct detection type radiation detectors arranged in a plane, and a semiconductor integrated circuit for controlling the radiation detectors or processing signals from the radiation detectors, wherein the semiconductor integrated circuit is arranged on the opposite side to the light receiving surface so as to be included within the area of ​​the radiation detector when viewed in a planar manner from the light receiving surface side of the radiation detector.

[0008] The X-ray CT apparatus of the present invention is characterized by comprising an X-ray generating unit, the above-mentioned radiation detection device that detects X-rays irradiated from the X-ray generating unit, and a signal processing unit that processes signals output from the radiation detection device. Effect of the Invention

[0009] According to the present invention, it is possible to provide a radiation detection device that suppresses deterioration and failure of components due to irradiation with radiation. [Brief description of the drawings]

[0010] [Figure 1] 2 is a schematic diagram showing a configuration example of a detector unit according to the first embodiment. FIG. [Diagram 2] 10 is a schematic diagram showing a configuration example of a detector unit according to Modification 1. FIG. [Diagram 3] 11 is a schematic diagram showing a configuration example of a detector unit according to Modification 2. FIG. [Figure 4]10 is a schematic diagram showing a configuration example of a detector unit according to a second embodiment. FIG. [Diagram 5] FIG. 1 is a block diagram of an X-ray CT apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] <Embodiment 1> Hereinafter, an embodiment of the present invention will be described. The radiation detector in this embodiment is an element (chip) that detects radiation such as X-rays and gamma rays by directly incident it on a semiconductor single crystal substrate. Hereinafter, this method will be referred to as the "direct detection method." The semiconductor single crystal substrate of a radiation detector using the direct detection method is made of cadmium zinc telluride CdZnTe (Cd 1-x Zinc x It is made of single crystals of a Te (x is, for example, 0.5 or less) semiconductor. 1-x Zinc x Te semiconductor is also called CZT. Although the present embodiment will be described with a focus on CZT, the present invention is not limited to this embodiment and can be applied to a semiconductor single crystal substrate capable of directly detecting X-rays. For example, the present invention can be applied to a semiconductor single crystal substrate such as cadmium telluride CdTe, lead iodide PbI2, mercury iodide HgI2, bismuth iodide BiI3, and thallium bromide TlBr.

[0012] When a radiation detection device is constructed using the radiation detector of this embodiment, a plurality of radiation detectors are arranged in a plane (a plurality of radiation detectors are tiled). The arrangement pattern of the plurality of radiation detectors is not particularly limited, but the plurality of radiation detectors are arranged, for example, in a matrix (row and column directions). The plurality of radiation detectors arranged in the row direction and the members made of semiconductor integrated circuits or the like joined to these radiation detectors are hereinafter referred to as a detector unit. The radiation detection device is constructed by arranging the detector units in the column direction.

[0013] 1(a) and 1(b) are schematic diagrams showing an example of the configuration of a detector unit 10 according to embodiment 1. Fig. 1(a) is a top view of the detector unit 10. Fig. 1(b) is an AA cross-sectional view of the detector unit 10. The detector unit 10 includes two or more radiation detectors 100, a substrate 200, and an ASIC 300. In the following description, the surface of each component that receives X-rays will be referred to as the upper surface, and the opposite surface will be referred to as the lower surface.

[0014] The radiation detector 100 is a direct detection type radiation sensor that detects X-rays by directly incident them on a semiconductor single crystal substrate. The semiconductor single crystal substrate of the radiation detector 100 is made of, for example, cadmium zinc telluride (CZT). The radiation detector 100 applies a voltage to the semiconductor single crystal substrate to make it in a state that is easily ionized, thereby directly converting X-rays into an electrical signal. The thickness of the radiation detector 100 is, for example, 2000 μm or more and 3000 μm or less.

[0015] The detector unit 10 has at least two radiation detectors 100. In the example of Figures 1(a) and 1(b), the detector unit 10 has two radiation detectors 100, but the number of radiation detectors is not limited to two.

[0016] The substrate 200 may be a mounting substrate such as a glass epoxy substrate or a glass composite substrate. This mounting substrate may be provided with various elements (resistance elements, capacitance elements, transistors, etc.) and circuits. The upper surface of the substrate 200 is connected to the lower surface of the radiation detector 100 by solder bumps 600. The lower surface of the substrate 200 is connected to the upper surface of the ASIC 300 by substrate joints 610. The substrate 200 is preferably made of a material with higher thermal conductivity in order to dissipate heat generated by the ASIC 300.

[0017] As shown in FIG. 1(a), the substrate 200 is positioned so that, when viewed in a plan view from the top side (light receiving surface side) of the radiation detector 100, it is included within the area of ​​two radiation detectors 100 arranged in a plane.

[0018] The ASIC 300 is a semiconductor integrated circuit designed to control the radiation detector 100 or to process signals from the radiation detector 100. As shown in Fig. 1(a) , the ASIC 300 is arranged so as to be included within the area of ​​one radiation detector 100 when viewed in a plan view from the top surface side (light receiving surface side) of the radiation detector 100.

[0019] The ASIC 300 may be disposed so as to be included in an area excluding an area of ​​a predetermined width along the periphery of the radiation detector 100. The predetermined width may be determined to be a width such that radiation leaking from the periphery of the radiation detector 100 or from the boundary with an adjacent radiation detector 100 is not irradiated to the ASIC 300. The predetermined width may also be determined based on the thickness of the radiation detector 100, the type of radiation irradiated, the angle of incidence of the radiation, etc.

[0020] The solder bumps 600 join the radiation detector 100 and the substrate 200. The solder bumps 600 are low-temperature solders made of alloys containing, for example, tin (Sn), silver (Ag), bismuth (Bi), etc. To avoid damage and performance degradation of the radiation detector 100 due to heat, it is preferable that the melting point of the low-temperature solder is less than 150 degrees.

[0021] The substrate bonding portion 610 bonds the substrate 200 and the ASIC 300. In order to dissipate heat generated by the ASIC 300, the substrate bonding portion 610 is preferably an adhesive having thermal conductivity.

[0022] In the above-mentioned embodiment 1, the ASIC300 disposed on the lower surface side of the radiation detector 100 is included within the area of ​​one radiation detector 100 when viewed in a plan view from the upper surface side of the radiation detector 100. From another perspective, the ASIC300 does not have a portion located outside the radiation detector 100 when viewed in a plan view from the upper surface of the radiation detector 100. Also, when viewed in a plan view from the upper surface of the radiation detector 100, the outer periphery of the ASIC300 is entirely included within the area of ​​the radiation detector 100. Therefore, it is possible to prevent radiation leaking from the boundary and periphery of the radiation detector 100 from being irradiated to the ASIC300. Therefore, performance degradation and failure of the ASIC300 are suppressed.

[0023] (Variation 1) The detector unit 10 according to the first modification will be described with reference to Fig. 2. The first modification is an example in which a plurality of ASICs 300 are disposed on the lower surface of each of the radiation detectors 100 in the detector unit 10. Differences from the first embodiment will be described.

[0024] 2(a) and 2(b) are schematic diagrams showing a configuration example of the detector unit 10 according to Modification 1. Fig. 2(a) is a top view of the detector unit 10. Fig. 2(b) is a BB cross-sectional view of the detector unit 10. The ASICs 300 arranged on the underside of each radiation detector 100 do not need to have the same functions, and different functions may be implemented in each ASIC 300.

[0025] When the ASIC 300 has multiple functions, it may be divided into multiple ASICs 300 each having different functions implemented therein and disposed on the lower surface side of each radiation detector 100. By implementing the functions separately, each ASIC 300 can be made smaller.

[0026] As shown in FIG. 2(a), the ASIC 300 disposed on the lower surface of each radiation detector 100 is arranged so as to be included within the area of ​​the corresponding radiation detector 100 when viewed in a plan view from the upper surface side. The ASIC 300 may also be arranged so as to be included within an area excluding a predetermined width from the boundary and periphery of the radiation detector 100 as described in FIG.

[0027] (Variation 2) A detector unit 10 according to Modification 2 will be described with reference to Fig. 3. Modification 2 is an example in which different types of semiconductor integrated circuits are arranged on the lower surface of each radiation detector 100 included in the detector unit 10. Differences from the above-mentioned embodiment 1 and Modification 1 will be described.

[0028] 3(a) and 3(b) are schematic diagrams showing a configuration example of the detector unit 10 according to the second modification. FIG. 3(a) is a top view of the detector unit 10. FIG. 3(b) is a CC cross-sectional view of the detector unit 10. In the example of FIG. 3(b), an ASIC 300 and an LDO regulator 400 are disposed on the lower surface of each radiation detector 100. The LDO regulator 400 is a power supply circuit capable of outputting a constant voltage lower than an input voltage. Note that the semiconductor integrated circuit disposed on the lower surface of the radiation detector 100 is not limited to the ASIC 300 and the LDO regulator 400, and may be a semiconductor integrated circuit having other functions, such as a semiconductor memory such as a DRAM.

[0029] 3(a), the ASIC 300 and the LDO regulator 400 arranged on the underside of each radiation detector 100 are arranged so as to be included within the area of ​​the corresponding radiation detector 100 when viewed in a plan view from the top side. The ASIC 300 may also be arranged so as to be included within an area excluding a predetermined width from the boundary and periphery of the radiation detector 100 as described in FIG.

[0030] <Embodiment 2> In the first embodiment, a semiconductor integrated circuit such as the ASIC 300 is connected to the radiation detector 100 via a substrate 200. In contrast, in the second embodiment, the semiconductor integrated circuit is connected to the radiation detector 100 via an interposer.

[0031] When the number of bonding pads and signal lines increases, the wiring and routing becomes complicated, and when multiple chips are used in tiling as in the radiation detector 100, the routing of common signal lines such as power supply and output wiring becomes complicated. The interposer 500 can realize the routing of complex wiring with a thinner and finer pattern than when multi-layer wiring is used with the substrate 200. Therefore, by connecting the radiation detector 100 and the ASIC 300 via the interposer 500, the radiation detection device can be made smaller and the packaging density and area efficiency can be improved.

[0032] 4(a) and 4(b) are schematic diagrams showing a configuration example of the detector unit 20 according to embodiment 2. Fig. 4(a) is a top view of the detector unit 20. Fig. 4(b) is a DD cross-sectional view of the detector unit 20.

[0033] The detector unit 20 includes a radiation detector 100, an interposer 500, an ASIC 300, an LDO regulator 400, and a substrate 200. In the following description, the surface of each component that receives X-rays will be referred to as the upper surface, and the opposite surface will be referred to as the lower surface.

[0034] The lower surface of the radiation detector 100 is connected to the upper surface of the interposer 500 by solder bumps 600. The lower surface of the interposer 500 is connected to the upper surfaces of the ASIC 300 and the LDO regulator 400 by solder bumps 620. The lower surfaces of the ASIC 300 and the LDO regulator 400 are connected to the upper surface of the substrate 200. In addition, the upper surface of the substrate 200 is connected to the lower surface of the interposer 500 by copper core balls 630. Descriptions of configurations similar to those in the first embodiment will be omitted.

[0035] In the first embodiment, a signal from the ASIC 300 is transmitted to a downstream processing system via the substrate 200. In the second embodiment, with the configuration shown in Fig. 4(b), a signal from the ASIC 300 is transmitted to the substrate 200 via the interposer 500 and the copper core ball 630, and is further transmitted to a downstream processing system.

[0036] The interposer 500 is not limited to a semiconductor material such as silicon, but may be made of glass, polymer (flexible printed circuit board), ceramic, etc. The solder bump 620 is, for example, a low-temperature solder made of an alloy containing tin (Sn), silver (Ag), bismuth (Bi), etc. The copper core ball 630 is, for example, made by plating the low-temperature solder onto copper (Cu).

[0037] In the above-described second embodiment, similarly to the first embodiment, the semiconductor integrated circuits such as the ASIC 300 and the LDO regulator 400 are arranged so as to be included within the area of ​​one radiation detector 100. This makes it possible to prevent radiation leaking from the boundary and periphery of the radiation detector 100 from being irradiated onto the semiconductor integrated circuits, thereby suppressing deterioration and failure of the semiconductor integrated circuits.

[0038] Furthermore, in the second embodiment, the semiconductor integrated circuit is connected to the radiation detector 100 via the interposer 500, thereby realizing miniaturization of the radiation detection device and improving the packaging density and area efficiency.

[0039] <Embodiment 3> The radiation detection devices in the first and second embodiments are applicable to detectors of an X-ray CT device. Fig. 5 is a block diagram of the X-ray CT device in this embodiment. The X-ray CT device 30 in this embodiment includes an X-ray generation unit 310, a wedge 311, a collimator 312, an X-ray detection unit 320, a top plate 330, a rotating frame 340, a high-voltage generator 350, a data acquisition system (DAS) 351, a signal processing unit 352, a display unit 353, and a control unit 354.

[0040] The X-ray generating unit 310 is composed of, for example, a vacuum tube that generates X-rays. A high voltage and a filament current are supplied to the vacuum tube of the X-ray generating unit 310 from a high voltage generator 350. X-rays are generated by irradiating thermal electrons from the cathode (filament) toward the anode (target).

[0041] The wedge 311 is a filter that adjusts the amount of X-rays irradiated from the X-ray generation unit 310. The wedge 311 attenuates the amount of X-rays so that the X-rays irradiated from the X-ray generation unit 310 to the subject have a predetermined distribution. The collimator 312 is made of a lead plate or the like that narrows down the irradiation range of the X-rays that have passed through the wedge 311. The X-rays generated by the X-ray generation unit 310 are shaped into a cone beam via the collimator 312 and irradiated to the subject on the tabletop 330.

[0042] The X-ray detection unit 320 is configured using the radiation detection device in embodiment 1 and embodiment 2. The X-ray detection unit 320 detects X-rays that have passed through the subject from the X-ray generation unit 310, and outputs a signal corresponding to the X-ray dose to the DAS 351.

[0043] The rotating frame 340 has an annular shape and is configured to be rotatable. An X-ray generation unit 310 (wedge 311, collimator 312) and an X-ray detection unit 320 are arranged facing each other inside the rotating frame 340. The X-ray generation unit 310 and the X-ray detection unit 320 are rotatable together with the rotating frame 340.

[0044] The high voltage generator 350 includes a boost circuit, and outputs a high voltage to the X-ray generation unit 310. The DAS 351 includes an amplifier circuit and an A / D conversion circuit, and outputs a signal from the X-ray detection unit 320 to the signal processing unit 352 as digital data.

[0045] The signal processing unit 352 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory), and is capable of performing image processing on digital data. The display unit 353 includes a flat display device, and is capable of displaying X-ray images. The control unit 354 includes a CPU, a ROM, a RAM, and the like, and controls the operation of the entire X-ray CT device 30.

[0046] The above-described embodiment (including the modified examples) is merely an example, and the present invention also includes configurations obtained by appropriately modifying or changing the above-described configurations within the scope of the gist of the present invention. The present invention also includes configurations obtained by appropriately combining the above-described configurations.

[0047] The disclosure of this embodiment includes the following configuration. (Configuration 1) A plurality of direct detection type radiation detectors arranged in a plane; a semiconductor integrated circuit for controlling the radiation detector or for processing signals from the radiation detector; The semiconductor integrated circuit is disposed on the opposite side to the light receiving surface of the radiation detector so as to be included within the area of ​​the radiation detector when viewed in a plan view from the light receiving surface side of the radiation detector. A radiation detection device comprising: (Configuration 2) A plurality of direct detection type radiation detectors arranged in a plane; a semiconductor integrated circuit for controlling the radiation detector or for processing signals from the radiation detector; The semiconductor integrated circuit is disposed on the side opposite to the light receiving surface so that the outer periphery of the semiconductor integrated circuit is included within the area of ​​the radiation detector when viewed in a plan view from the light receiving surface side of the radiation detector. A radiation detection device comprising: (Configuration 3) A plurality of direct detection type radiation detectors arranged in a plane; a semiconductor integrated circuit for controlling the radiation detector or for processing signals from the radiation detector; The semiconductor integrated circuit is disposed on the opposite side to the light receiving surface of the radiation detector. The semiconductor integrated circuit does not have a portion located outside the region of the radiation detector when viewed in a plan view from the light receiving surface side. A radiation detection device comprising: (Configuration 4) The radiation detector and the semiconductor integrated circuit are connected via a mounting board. 4. The radiation detection device according to any one of configurations 1 to 3. (Configuration 5) The mounting substrate is a glass epoxy substrate or a glass composite substrate. 5. The radiation detection device according to configuration 4. (Configuration 6) Further equipped with an interposer, The radiation detector and the semiconductor integrated circuit are connected via the interposer. 4. The radiation detection device according to any one of configurations 1 to 3. (Configuration 7) When viewed in a plan view from the light receiving surface side of the radiation detector, the radiation detector is disposed so as to be included within an area excluding an area of ​​a predetermined width along the periphery of the radiation detector. 7. The radiation detection device according to any one of configurations 1 to 6, (Configuration 8) The predetermined width is determined based on at least one of the thickness of the radiation detector, the type of radiation irradiated, and the incidence angle of the radiation. 8. The radiation detection device according to claim 7, (Configuration 9) A plurality of the semiconductor integrated circuits each having different functions implemented therein are provided, The semiconductor integrated circuits are disposed in the radiation detectors, respectively. 9. The radiation detection device according to any one of configurations 1 to 8, (Configuration 10) The thickness of the radiation detector is 2000 μm or more and 3000 μm or less. 10. The radiation detection device according to any one of configurations 1 to 9, (Configuration 11) The radiation detector includes a semiconductor single crystal substrate, the semiconductor single crystal substrate including cadmium telluride. 11. The radiation detection device according to any one of configurations 1 to 10, (Configuration 12) The radiation detector includes a semiconductor single crystal substrate, the semiconductor single crystal substrate including cadmium zinc telluride. 11. The radiation detection device according to any one of configurations 1 to 10, (Configuration 13) The radiation detector includes a semiconductor single crystal substrate, and the semiconductor single crystal substrate includes any one of lead iodide, mercury iodide, bismuth iodide, and thallium bromide. 11. The radiation detection device according to any one of configurations 1 to 10, (Configuration 14) An X-ray generating unit; The radiation detection device according to any one of configurations 1 to 13, which detects X-rays irradiated from the X-ray generation unit; a signal processing unit that processes a signal output from the radiation detection device; An X-ray CT apparatus comprising: [Explanation of symbols]

[0048] 100: Radiation detector, 300: ASIC (semiconductor integrated circuit), 400: LDO regulator (semiconductor integrated circuit)

Claims

1. a plurality of direct detection type radiation detectors arranged in a plane; a semiconductor integrated circuit for controlling the radiation detector or for processing signals from the radiation detector, the radiation detector and the semiconductor integrated circuit are connected via a mounting substrate, the mounting board is connected to the plurality of radiation detectors and is arranged so as to overlap within areas of the plurality of radiation detectors when viewed in a plan view from the light receiving surface side of the plurality of radiation detectors; The semiconductor integrated circuit is disposed on the opposite side to the light-receiving surface so as to be included within a partial area of ​​one of the radiation detectors and a partial area of ​​the mounting substrate when viewed in a plan view from the light-receiving surface side. A radiation detection device characterized by:

2. The mounting substrate is a glass epoxy substrate or a glass composite substrate.

2. The radiation detection device according to claim 1.

3. A plurality of direct detection type radiation detectors arranged in a plane; a semiconductor integrated circuit for controlling the radiation detector or for processing signals from the radiation detector; an interposer; the radiation detector and the semiconductor integrated circuit are connected via the interposer, the interposer is connected to the plurality of radiation detectors and is arranged so as to overlap within areas of the plurality of radiation detectors when viewed in a plan view from the light receiving surface side of the plurality of radiation detectors; The semiconductor integrated circuit is disposed on the opposite side to the light-receiving surface so as to be included within a partial area of ​​one of the radiation detectors and a partial area of ​​the interposer when viewed in a plan view from the light-receiving surface side. A radiation detection device characterized by:

4. The semiconductor integrated circuit is arranged so as to be included within an area excluding an area of ​​a predetermined width along the periphery of the radiation detector when viewed in plan from the light receiving surface side.

2. The radiation detection device according to claim 1.

5. The predetermined width is determined based on at least one of the thickness of the radiation detector, the type of radiation irradiated, and the incident angle of the radiation.

5. The radiation detection device according to claim 4.

6. a plurality of the semiconductor integrated circuits each having different functions implemented therein; The plurality of semiconductor integrated circuits are disposed in the plurality of radiation detectors, respectively.

2. The radiation detection device according to claim 1.

7. The thickness of the radiation detector is 2000 μm or more and 3000 μm or less.

2. The radiation detection device according to claim 1.

8. The radiation detector includes a semiconductor single crystal substrate, and the semiconductor single crystal substrate includes cadmium telluride.

2. The radiation detection device according to claim 1.

9. The radiation detector includes a semiconductor single crystal substrate, the semiconductor single crystal substrate including cadmium zinc telluride.

2. The radiation detection device according to claim 1.

10. The radiation detector includes a semiconductor single crystal substrate, and the semiconductor single crystal substrate includes any one of lead iodide, mercury iodide, bismuth iodide, and thallium bromide.

2. The radiation detection device according to claim 1.

11. an X-ray generating unit; The radiation detection device according to any one of claims 1 to 10, which detects X-rays emitted from the X-ray generation unit; a signal processing unit that processes a signal output from the radiation detection device; An X-ray CT device comprising:

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