Planarization device, planarization method, and manufacturing method for article

Abstract

To provide a configuration in which a planarization member to be used for planarization can be separated stably from a composition on a substrate using a pressing member.SOLUTION: In a state where a planarization member held in a member holding section is not in contact with a composition on a substrate held in a substrate holding section, whether to perform a planarization process is determined by protruding a pressing member. By determining whether the planarization process is carried out in this way, the planarization member used for planarization can be stably separated from the composition on the substrate.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a planarizing apparatus, a planarizing method, and a method for manufacturing an article. [Background technology]

[0002] As the demand for miniaturization of semiconductor devices increases, in addition to conventional photolithography technology, attention is being paid to a microfabrication technology in which an uncured composition on a substrate is molded with a member (also called a mold), cured, and a pattern of the composition is formed on the substrate. This technology is called an imprint technology, and it is possible to form a fine pattern on the order of several nanometers on the substrate.

[0003] In addition, in recent years, a technique for planarizing a substrate using an imprint technique has been proposed (Patent Document 1). The technique disclosed in Patent Document 1 involves dropping a curable composition based on the steps of the substrate, and curing the curable composition in a state where a planarizing member (also called a superstrate) having a flat surface is brought into contact with the dropped curable composition, thereby forming a flat surface on the substrate. In such planarization techniques, a method using a member of the same size as the substrate is common, and a large force is required in the separation process for separating the planarizing member from the substrate. Therefore, a technique has been proposed in which a push pin (also called a pressing member) is abutted against the planarizing member through a cutout portion (notch or orientation flat) of the substrate from the substrate stage side during separation after curing to assist the separation (Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2011-529626 [Patent Document 2] Special Publication No. 2022-544891 Summary of the Invention [Problem to be solved by the invention]

[0005] In the flattening technique disclosed in Patent Document 2, the positions of the notch of the substrate and the push pin on the substrate holder must match. If these positions do not match, the push pin may not reach the flattening member and may not be able to assist the separation. Similarly, if there is no part of the flattening member at the position of the push pin, the push pin may not be able to assist the separation. That is, if the substrate or the flattening member is bonded in a state where it is misaligned with respect to the push pin, it cannot be separated, and the bonded flattening member and substrate become defective products. Furthermore, there may be cases where it is difficult to automatically carry out the bonded flattening member and substrate, and in such cases, it is assumed that the operator will stop the flattening device and carry them out manually, which will cause a decrease in productivity of the device.

[0006] In view of the above problems, an object of this embodiment is to provide a configuration that allows a member to be stably separated from a composition on a substrate. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention provides a planarization device for planarizing a composition on a substrate using a planarization member, the planarization device comprising: a substrate holding part for holding the substrate; a member holding part for holding the planarization member; The present invention is characterized in that it comprises a pressing member that protrudes from the substrate in a direction toward the planarizing member, and a control unit that determines whether to perform a planarizing process including a step of bringing the substrate and the planarizing member into contact with each other via the composition by protruding the pressing member while the planarizing member is not in contact with the composition. Effect of the Invention

[0008] According to the present invention, it is possible to provide a configuration that can stably separate a member from a composition on a substrate. [Brief description of the drawings]

[0009] [Figure 1]FIG. 2 is a schematic diagram showing a configuration of a planarization device. [Diagram 2] FIG. 2 is a diagram for explaining a planarization process in a planarization device. [Diagram 3] 13 is a flowchart showing the flow of a flattening process. [Figure 4] 13 is a flowchart showing a process for confirming the positions of a substrate and a planarizing member in a planarizing process. [Diagram 5] 4 is a diagram showing the positional relationship between a flattening member, a substrate, a cutout portion, and a pressing member. FIG. [Figure 6] FIG. 13 is a diagram illustrating a separation process. [Figure 7] 13A and 13B are diagrams showing an example in which the pressing member cannot assist separation. [Figure 8] 11A to 11C are diagrams illustrating a process for checking the positions of a substrate and a planarizing member in a planarizing process. [Figure 9] 13 is a flowchart showing a process for confirming the positions of a substrate and a planarizing member in a planarizing process. [Figure 10] 13A and 13B are diagrams illustrating how the operation of the pressing member is confirmed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each drawing, the same reference numerals are used to refer to the same components, and duplicated explanations will be omitted.

[0011] FIG. 1 is a schematic diagram showing the configuration of a flattening apparatus 100 (molding apparatus). FIG. 1(a) is a diagram showing the flattening apparatus 100 as viewed from the Y-axis side, FIG. 1(b) is a diagram showing the flattening apparatus 100 as viewed from the X-axis side, and FIG. 1(c) is a diagram showing a substrate holding unit 2 and a substrate stage 4 of a second processing unit 102 described below. The flattening apparatus 100 is configured to perform a molding process for molding a curable composition on a substrate 1. Specifically, the flattening apparatus 100 is configured of a first processing unit 101, a second processing unit 102, a substrate transport processing unit 220, and a member transport processing unit 320.

[0012] The first processing unit 101 performs a coating step of coating a curable composition on the substrate 1. The second processing unit 102 performs a contact step of contacting the curable composition on the substrate 1 with the planarizing member 11, a curing step of curing the curable composition while in contact with the planarizing member 11, and a separation step of separating the cured curable composition from the planarizing member 11. In the planarizing layer forming process, the above steps are performed sequentially. Note that, in the present invention, an example using the first processing unit 101 and the second processing unit 102 will be described, but the steps may be performed in a single processing unit.

[0013] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which the direction parallel to the surface of the substrate 1 is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and the rotation around the X-axis, the Y axis, and the Z axis are θX, θY, and θZ, respectively. Control or drive regarding the X-axis, Y-axis, and Z-axis means control or drive regarding the direction parallel to the X-axis direction, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. Furthermore, control or drive regarding the θX-axis, θY-axis, and θZ-axis means control or drive regarding the rotation around an axis parallel to the X-axis, the rotation around an axis parallel to the Y axis, and the rotation around an axis parallel to the Z axis, respectively. Furthermore, the position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and the attitude is information that can be specified by the values ​​of the θX-axis, θY-axis, and θZ-axis. Alignment means controlling the position and / or attitude. The alignment in this embodiment may include control for correcting or changing the shape of at least one of the substrate 1 and the planarizing member 11.

[0014] The curable composition is a curable composition (sometimes called an uncured resin) that is cured by applying energy for curing. The energy for curing may be electromagnetic waves, heat, or the like. The electromagnetic waves may be, for example, infrared rays, visible light, ultraviolet rays, or other light having a wavelength selected from the range of 10 nm to 1 mm.

[0015] The curable composition is a composition that is cured by irradiation with light or by heating. Among them, the photocurable composition that is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internally added separating agent, a surfactant, an antioxidant, and a polymer component. The curable composition is applied in the form of a film on the substrate by a spin coater or a slit coater. Alternatively, the curable composition may be applied in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets, by a liquid jet head. The viscosity of the curable composition (viscosity at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] The planarizing apparatus 100 uses a planarizing member (also called a mold or superstrate) having a flat surface 11a, and can form a planarizing film (planarizing layer) on the substrate 1 using a curable composition. In this case, the curable composition is cured in a state where the flat surface 11a is in contact with the curable composition. In such a planarizing apparatus, planarizing films are formed collectively for multiple shot regions on a substrate provided by another imprinting apparatus, etc., and it is preferable that the planarizing member and the substrate are provided to have approximately the same size.

[0017] The substrate 1 is typically a silicon wafer, but is not limited thereto. The substrate 1 can be selected from among those known as substrates for semiconductor devices, such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. The substrate 1 may be a substrate having improved adhesion to the curable composition by forming an adhesive layer through surface treatment such as silane coupling treatment, silazane treatment, and formation of an organic thin film. The substrate 1 is typically a circle having a diameter of 300 mm, but is not limited thereto.

[0018] When light is used as the curing energy, the planarizing member 11 needs to be made of a material that transmits the curing light. The planarizing member 11 is made of at least one of glass, quartz, a light-transmitting resin such as PMMA (Polymethyl methacrylate) or polycarbonate resin, a transparent metal deposition film, a flexible film such as polydimethylsiloxane, a photocurable film, and a metal film.

[0019] The flattening member 11 is preferably a circle with a diameter of 300 mm, which is approximately the same as the size of the substrate, but may be slightly larger than the substrate or may have a rectangular outer shape, but is not limited thereto. The thickness of the flattening member 11 may be, for example, 0.25 mm or more and less than 2 mm, but is not limited thereto as long as it has the rigidity to conform to the surface shape when placed on the substrate. Furthermore, the flattening member 11 has a flat surface that comes into contact with the curable composition on the substrate 1 and conforms to the surface shape of the substrate 1, and the flat surface has a size equal to or larger than that of the substrate 1.

[0020] Next, the structures of the first processing unit 101 and the second processing unit 102 will be described with reference to Fig. 1. The following description will be given using an example in which UV light is used as the energy for curing. In this case, the curable composition may be, for example, a monomer such as acrylate or methacrylate.

[0021] As shown in FIG. 1, each of the first processing section 101 and the second processing section 102 has a substrate holding section 2 (substrate chuck), a stage driving section 31, a base surface plate 5, a support column 6, and a top plate 7.

[0022] The first processing section 101 further includes a substrate stage 3, a dispenser 20 (droplet supply section), and a detection section 300. The second processing section 102 further includes a substrate stage 4, a guide bar plate 8, a guide bar 9, a head driving section 10, a flattening member holding section 12, and a head 13. The second processing section 102 also includes an exposure section 23 (curing section) and a light source 24. The second processing section 102 also includes a push pin 41 (pressing member) on the substrate stage 4. The planarization apparatus 100 further includes a substrate transport processing section 220, a substrate transport section 25, a member transport processing section 320, and a control section 200.

[0023] The substrate holder 2 includes a chuck such as a vacuum chuck or an electrostatic chuck, and holds the substrate 1 by the chuck. The substrate stage 3 and the substrate stage 4 are supported by a base surface plate 5 and hold the substrate holder 2. The substrate stage 3 and the substrate stage 4 are driven in the X-axis direction and the Y-axis direction to position the substrate 1 held by the substrate holder 2 at a predetermined position. The stage driver 31 includes, for example, a linear motor or an air cylinder, and drives the substrate stage 3 and the substrate stage 4 at least in the X-axis direction and the Y-axis direction. The stage driver 31 may also have a function of driving the substrate stage 3 and the substrate stage 4 in two or more axial directions (for example, six axial directions). The stage driver 31 includes a rotation mechanism and drives the substrate holder 2 or the substrate stage 3 and the substrate stage 4 about the θZ axis.

[0024] The flattening member holding unit 12 includes a chuck such as a vacuum chuck or an electrostatic chuck, and holds the flattening member 11 by the chuck. The head 13 holds the flattening member holding unit 12 (member holding unit). The head driving unit 10 drives the head 13 to drive the flattening member holding unit 12 and thus the flattening member 11. The head driving unit 10 may be configured to drive the flattening member 11 about multiple axes.

[0025] A support 6 for supporting a top plate 7 is disposed on the base surface plate 5. A guide bar 9 configured in the second processing unit 102 is disposed so as to penetrate the top plate 7, one end of the guide bar 9 is fixed to the guide bar plate 8, and the other end is fixed to the head 13. The head driving unit 10 drives the guide bar 9 to drive the head 13 in the Z-axis direction. This allows the flattening member 11 held by the flattening member holding unit 12 to come into contact with the curable composition on the substrate 1, or to separate the flattening member 11 from the curable composition on the substrate 1. The head driving unit 10 may include a mechanism for driving the head 13 about an axis other than the Z-axis. Alternatively, the head driving unit 10 may include a mechanism for driving the head 13 about multiple axes (for example, three axes of the θX axis, the θY axis, and the Z axis, or six axes of the X axis, the Y axis, the Z axis, the θX axis, the θY axis, and the θZ axis).

[0026] The substrate transport processing section 220 has a substrate transport section 25 including a transport hand and a substrate storage shelf (not shown) capable of temporarily storing substrates carried in from outside the planarization apparatus 100 and substrates processed in the processing section. The substrate transport section 25 is provided so as to be able to transport substrates between the substrate storage shelf and the first processing section 101 and the second processing section 102.

[0027] The flattening member 11 may be carried in from outside the flattening apparatus 100 by a flattening member transport unit 32 including a transport hand or the like, transported to and positioned in the flattening member holding unit 12 via the member transport processing unit 320, and held by the flattening member holding unit 12. The member transport processing unit 320 may include a storage shelf capable of storing the flattening member 11. Instead of the storage shelf, a transportable flattening member storage unit may be configured.

[0028] The dispenser 20 (supply unit) provided in the first processing unit 101 places or supplies an uncured (liquid) curable composition on the substrate 1. The dispenser 20 may include, for example, an outlet (nozzle) for discharging the curable composition. The dispenser 20 supplies droplets of the curable composition of a minute volume (for example, 1 picoliter) onto the substrate 1 by, for example, a piezo-jet system or a microsoleoloid system. The number of outlets provided in the dispenser 20 is not limited to a specific number, and may be one or more. In one example, the dispenser 20 has 100 or more outlets. Such multiple outlets are arranged, for example, in one or more lines.

[0029] As shown in FIG. 1(c), the substrate stage 4 in the second processing section 102 is provided with a push pin (pressing member) 14 that protrudes from the substrate holding section 2 toward the substrate 1. The push pin 41 serves as an auxiliary function when separating the flattening member 11 from the curable composition on the substrate 1. Specifically, when separating the flattening member 11, the push pin 41 protrudes toward the flattening member 11 from a gap area of ​​a cutout portion such as a notch or an orientation flat of the substrate 1. By protruding the push pin 41 and pressing the flattening member while the substrate is held by the substrate holding section, a force is applied in the direction in which the flattening member 11 moves away from the substrate 1, and the separation process of the flattening member 11 can be assisted. Furthermore, the second processing section 102 is provided with a push pin contact detection means 43 that detects the contact state between the push pin 41 and an object such as the substrate 1 or the flattening member 11.

[0030] The detection unit 300 of the first processing unit 101 can detect the position of a cutout portion such as a notch or an orientation flat of the substrate 1 held by the substrate holding unit 2. Specifically, the detection unit 300 can be composed of an optical sensor that can detect the outer profile of the substrate 1, a small camera that can directly observe the shape of the substrate 1, or the like.

[0031] The exposure unit 23 is provided with a window that allows the passage of curing energy (e.g., light such as UV light) provided from the light source 24. The curable composition can be cured by irradiating light when the substrate stage 4, which holds the substrate in contact with the planarizing member 11 via the curable composition, faces the exposure unit 23 (curing position).

[0032] The control unit 200 includes a processing unit and a storage unit such as a memory, and controls the entire planarization apparatus 100. For example, it may be a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), an ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a built-in program, or it may be a combination of all or part of these. The control unit 200 functions as a processing unit that performs planarization processing by comprehensively controlling each unit of the planarization apparatus 100.

[0033] The planarization process is an example of a molding process for molding the curable composition on the substrate 1, and is a process for molding a film having a planarized surface by a cured product of the curable composition. More specifically, in the planarization process, the flat surface 11a of the planarization member 11 is brought into contact with the curable composition on the substrate 1 to conform to the surface shape of the substrate 1, thereby planarizing the curable composition. The planarization process is generally performed on a lot-by-lot basis, that is, for each of the multiple substrates included in the same lot.

[0034] Next, an overview of the overall flow of the planarization process in the present invention will be described with reference to Figures 2(a) to 2(c). Here, a process in which a composition is dropped onto the entire surface of a substrate and the composition is brought into contact with a planarization member to planarize the composition will be described, but the composition on a partial region of the substrate may also be brought into contact with a planarization member to planarize the composition.

[0035] First, as shown in Fig. 2(a), a curable composition IM is supplied or placed on a substrate 1 having a base pattern 1a by a dispenser 20 configured in a first processing unit 101. Fig. 2(a) shows a state before the curable composition IM is supplied onto the substrate 1 and the flattening member 11 (flat surface 11a) is brought into contact with the curable composition IM. Next, the substrate 1 is transported from the first processing unit 101 to the second processing unit 102 by a substrate transport unit 25.

[0036] 2(b), the distance between the substrate 1 and the planarizing member 11 is adjusted by the head driving unit 10 so that the curable composition IM on the substrate 1 comes into contact with the planarizing member 11 (the flat surface 11a) (contact step). FIG. 2(b) shows a state in which the planarizing member 11 is released from the planarizing member holding unit, the flat surface 11a of the planarizing member 11 comes into complete contact with the curable composition IM on the substrate 1, and the flat surface 11a of the planarizing member 11 follows the surface shape of the substrate 1.

[0037] 2(b), the substrate stage 4 is driven to the position of the exposure unit 23. There, the light source 24 irradiates the curable composition IM on the substrate with energy for curing through the flattening member 11, thereby curing the curable composition IM (curing step).

[0038] Next, the substrate stage 4 is driven to the position of the head driving unit 10, and the head driving unit 10 adjusts the distance between the substrate 1 and the planarizing member 11 so that the planarizing member 11 is separated from the cured curable composition IM on the substrate 1. Thereafter, the planarizing member 11 is held by the planarizing member holding unit 12, and in this state, the substrate 1 and the planarizing member 11 are separated in the Z-axis direction, whereby the planarizing member 11 is separated from the cured composition IM on the substrate (separation step). At this time, assistance is provided by a push pin.

[0039] This allows a layer (planarizing layer) of the curable composition IM having a uniform thickness to be formed over the entire area of ​​the substrate 1. FIG. 2(c) shows a state in which a planarizing layer made of a cured product of the curable composition IM has been formed on the substrate 1. In other words, by using the planarizing member 11, a planarizing layer (planarizing film) having a locally planarized surface can be formed from the cured product of the curable composition IM. In the planarizing method as described above, by using the planarizing member 11 having an area covering the entire area of ​​the multiple shot regions of the substrate 1, a planarizing layer can be formed over the entire area of ​​the substrate 1 in one go.

[0040] Next, the separation step of separating the planarizing member 11 from the cured curable composition IM on the substrate 1 using a push pin in the above-mentioned planarizing treatment will be described in detail with reference to FIGS.

[0041] As described above, the flattening member 11 is brought into contact with the entire surface of the substrate 1 to harden the curable composition, and therefore separation may require a large force. In this regard, a technique for assisting separation is effective, in which a push pin 41 is provided on the stage to pass through a notch in the substrate and apply a force to the flattening member when the flattening member 11 is bonded to the substrate 1 after curing. FIG. 5 is a diagram showing the positional relationship between the substrate 1 and the push pin 41, and the notch in the substrate is an example of a notch. If the alignment is performed correctly, the notch in the substrate 1 will be located at the position of the push pin 41. Furthermore, at the timing of the separation process when the flattening member 11 and the substrate 1 are bonded together, a part of the flattening member 11 will be located at the position of the push pin 41.

[0042] FIG. 6 is a diagram for explaining the flow of the separation process using a push pin. FIG. 6(a) is a diagram showing a state in which the flat surface of the flattening member 11 is in contact with the surface shape of the substrate 1 before the start of separation, and the curable composition on the substrate 1 is cured. Next, FIG. 6(b) is a diagram showing the operation during separation. The flattening member 11 is raised by the head driving unit 10, and the flattening member 11 is separated from the cured curable composition on the substrate 1. At this time, the push pin 41 provided on the substrate stage 4 is protruded through the cutout portion 42 of the substrate 1 and pressed against the flattening member 11 to assist the separation. FIG. 6(c) shows the state after separation. The flattening member 11 is completely separated from the cured curable composition on the substrate 1.

[0043] When the substrate 1 and the flattening member 11 are approximately the same size, it is necessary to make the position of the push pin 41 coincide with the position of the notch of the substrate held by the substrate holder when pushing up the flattening member 11 from the substrate side. On the other hand, if the shape of the flattening member 11 is made slightly larger than the substrate 1, it is not necessary to make the position of the notch of the substrate coincide with the position of the push pin 41. However, when pushing up the flattening member 11 from the substrate 1 side, it is necessary for the push pin 41 to be positioned at a predetermined position where the push pin 41 does not hit the substrate 1 and can push up the flattening member 11. FIG. 7 is a diagram showing an example in which the push pin cannot assist separation. In FIG. 7, the curable composition IM on the substrate 1 is omitted.

[0044] In the method of using the push pin 41 to assist the separation, if the notch 42 of the substrate and the push pin 41 are not aligned when the substrate 1 is placed on the substrate holder 2, the push pin 41 and the substrate 1 come into contact as shown in FIG. 7(a), and separation assistance cannot be performed. Also, if the push pin 41 is not at the position where it presses the flattening member (the flattening member is misaligned with respect to the substrate) as shown in FIG. 7(b), separation assistance cannot be performed. However, there are cases where the flattening member 11 cannot be held at the desired position due to misalignment, and in such a state, separation assistance by the push pin 41 may not be received. In this way, if separation assistance by the push pin 41 cannot be performed and the flattening member 11 and the substrate 1 cannot be separated, the bonded substrate and flattening member become defective products. In addition, there may be cases where the flattening member and the substrate that remain bonded together are difficult to automatically carry out from the flattening device 100. In such a case, it is assumed that the operator will stop the device and carry out the flattening member and the substrate 1 manually, and the device cannot be used normally, which causes a decrease in productivity of the device. Furthermore, the discharged bonded substrate and planarizing member must be subjected to a recycling process or the like.

[0045] Therefore, as will be described in detail in the following embodiment, in this embodiment, before bonding the substrate 1 and the planarizing member 11 together, the push pin 41 is driven to confirm in advance whether the holding positions of the substrate and the planarizing member are correct. That is, by confirming in advance whether the positional relationship between the substrate and / or the planarizing member and the push pin is one that can assist in separation, the push pin can stably separate the planarizing member 11 from the curable composition on the substrate.

[0046] (First embodiment) The flow of the planarization process in this embodiment will be described with reference to the flowcharts of Figures 3 and 4. The process shown in the flowcharts of Figures 3 and 4 is realized by the control unit 200 comprehensively controlling each unit of the planarization apparatus 100. The following description will be given starting from a state in which the planarization member 11 is held by the planarization member holding unit 12 of the second processing unit 102.

[0047] 3, the control unit 200 causes the substrate transport unit 25 to carry the substrate 1 into the planarization apparatus 100 and places it on the substrate holder 2 of the first processing unit 101. The control unit 200 causes the detection unit 300 to measure the rotation of the substrate 1 about the Z axis, and adjusts the rotation of the substrate W about the Z axis to a target angle based on the result.

[0048] In S102, the control unit 200 applies the curable composition to the substrate 1 by dropping droplets of the curable composition onto the substrate 1 placed on the substrate holder 2 using the dispenser 20 (application step). At this time, the application amount of the curable composition may be adjusted based on step information based on a pattern or the like already configured on the substrate 1.

[0049] In S103, the control unit 200 transports the substrate 1 from the first processing unit 101 to the second processing unit 102, and places and holds the substrate 1 on the substrate holding unit 2 of the second processing unit 102. In S104, the control unit 200 checks the holding position of the substrate 1 on the substrate holding unit 2 and the position of the planarizing member 11 relative to the substrate 1. Details of the process will be described later in detail with reference to FIG.

[0050] In S105, the control unit 200 performs a contact process (contact step) in which the flattening member 11 held by the flattening member holding unit 12 is brought into contact with the curable composition on the substrate. Specifically, the head 13 is lowered to lower the flattening member 11 held by the flattening member holding unit 12, and the flattening member 11 starts to come into contact with the curable composition on the substrate 1. At this time, the control unit 200 gradually releases the flattening member 11 from the flattening member holding unit 12 so that no air bubbles remain between the flattening member 11 and the substrate 1. Then, the flattening member 11 is finally completely released from the flattening member holding unit 12 to place the flattening member 11 on the curable composition. The curable composition on the substrate comes into contact with the flattening member 11 over the entire surface, and the flat portion of the flattening member 11 follows the surface shape of the substrate 1.

[0051] In S106, the control unit 200 drives the substrate stage 4 to move the substrate 1 to below the exposure unit 23. Next, the control unit 200 irradiates the curable composition with curing light (ultraviolet light) from the light source 24 through the flattening member 11, thereby curing the curable composition (exposure step). Note that, although the light source 24 functions as the curing means in this embodiment, a means other than the light source may be used as the curing means.

[0052] In S107, the control unit 200 drives the substrate stage 4 to move the substrate 1 under the flattening member holding unit 12 again, and while controlling the position of the flattening member holding unit 12 in the Z direction, the flattening member 11 is again adsorbed and held by the flattening member holding unit 12. Thereafter, the flattening member 11 is separated from the cured curable composition on the substrate (separation step). At this time, if the head 13 is simply raised in the vertical direction (Z-axis direction) to separate the flattening member 11 from the curable composition, a large force of several hundred N (Newtons) is required. If such a large force is applied to the flattening member 11 or the substrate 1, damage to the pattern on the substrate 1, peeling of the curable composition, damage to the flattening member 11, etc. may occur. Therefore, the separation step is performed using the push pin 41 as described above.

[0053] In S108, the control unit 200 determines that the planarization process of one substrate by the planarization apparatus 100 has been completed, and causes the substrate 1 held by the substrate holding unit 2 to be removed from the planarization apparatus 100 by the substrate transport unit 25 and returned to a substrate transport container or the like.

[0054] In S109, the control unit 200 judges whether any substrates 1 to be processed remain, and if so, starts the processing again from step S101.

[0055] The planarization process described using the above flowchart is merely one example, and an example of applying the curable composition inside the planarization apparatus 100 has been described, but the planarization process may also be performed using a substrate 1 applied outside the apparatus.

[0056] 4, the process of confirming the positions of the substrate 1 and the planarizing member 11 in S104 will be described. The processes shown in S201 to S204 are processes for confirming the holding position of the substrate 1 by the substrate holding unit 2 by confirming the positions of the substrate and the push pins 41. By performing at least the processes from S201 to S204 before the processes from S105 onwards, the planarizing process can be performed at the correct substrate position.

[0057] Furthermore, the processes shown in S205 to S208 are processes for confirming the position of the flattening member 11 relative to the substrate 1 by confirming the positions of the flattening member 11 and the push pins 41. That is, by performing the process of confirming the holding position of the substrate 1 and the position of the flattening member in S104, the control unit 200 can prevent the processes from S105 onwards from being performed in a state in which separation assistance cannot be performed.

[0058] In S201, the control unit 200 starts to raise the push pin 41 provided on the substrate stage 4 in the Z-axis direction. The target position for raising the push pin 41 is set to a position above the position in the Z-axis direction where the flattening member 11 starts to come into contact with the curable composition on the substrate 1 in step S105 of FIG.

[0059] Fig. 8 is a side view of the push pin 41, the substrate 1, and the flattening member 11 during such processing. Note that the curable composition is also omitted in Fig. 8. Fig. 8(a) shows the state after the substrate 1 is placed on the substrate stage 4 and before the push pin 41 is raised.

[0060] In S202, the control unit 200 judges whether the tip of the push pin 41 contacts the bottom surface of the substrate 1 before the push pin 41 reaches the target position. That is, the push pin 41 is protruded in a state where the flattening member 11 is not in contact with the curable composition on the substrate 1, and it is confirmed whether the tip of the push pin 41 contacts the bottom surface of the substrate 1. If it is judged that the tip of the push pin 41 contacts the bottom surface of the substrate 1, there is a possibility that the substrate 1 is misaligned as shown in FIG. 7(a), so the lifting of the push pin 41 is immediately stopped. Specifically, the contact with the substrate 1 can be detected by the push pin contact detection means 43.

[0061] In S202, if the control unit 200 determines that the push pin 41 has come into contact with the substrate 1, it determines that the position of the substrate held by the substrate stage is incorrect, and stops the lifting of the push pin 41. In S203, the push pin 41 is lowered and stored in the substrate stage 4. Then, in S204, the control unit 200 causes the substrate transport unit 25 to re-mount the substrate 1 on the substrate stage 4 in order to correct the positional deviation of the substrate 1. Thereafter, the process returns to S201, and the push pin is lifted again. Then, the processes of S201 to S204 are repeated in order until the push pin 41 reaches the target position without coming into contact with the substrate 1. As a result, the substrate held by the substrate holder in the correct position proceeds to the processes in S105 and onward.

[0062] If it is determined in S202 that the tip of the push pin 41 has come into contact with the bottom surface of the substrate 1 before the push pin 41 reaches the target position, the control unit 200 may display information on the occurrence of misalignment on a display unit (not shown) to notify the operator. In addition, this information may be notified from an external notification unit (not shown) to an external device connected to the notification unit, or both may be performed. Not only the occurrence of misalignment but also the absence of misalignment may be notified as the determination result of the process performed in S202. Note that if the substrate cannot be placed correctly even after repeating the processes of S201 to S204 a predetermined number of times, it is preferable to stop the process as an error.

[0063] If it is determined in S202 that the push pin 41 has risen to the target position without coming into contact with the substrate 1 as shown in Fig. 8(b), the process proceeds to S205. In S205, the control unit 200 stops the push pin 41 at the target position and lowers the head 13 in the Z-axis direction so as to lower the flattening member 11, which is attracted and held by the flattening member holding unit 12, toward the substrate 1 as shown in Fig. 8(c). As a method for determining whether the push pin 41 has risen to a specific target position, a sensor such as an encoder for detecting the Z-direction position of the push pin 41 is provided, so that the predetermined position of the push pin 41 can be grasped.

[0064] In S206, the control unit 200 determines whether the head 13 will come into contact with the push pin 41 during the process of descending until the Z axis position of the surface of the flattening member 11 reliably reaches the Z axis position of the tip of the push pin 41. Note that even if the head 13 is lowered to the Z axis position of the tip of the push pin 41, the curable composition on the substrate 1 and the flattening member 11 will not come into contact with each other.

[0065] If it is detected that the flattening member 11 has come into contact with the push pin 41 before the head 13 reaches a predetermined position where the tip of the push pin 41 will surely come into contact with the surface of the flattening member 11, the separation process will be performed correctly when the flattening process is started, that is, the flattening member 11 is in the correct position, and the process proceeds to S209. On the other hand, if the head 13 does not come into contact with the push pin 41 before the head 13 reaches the predetermined position, the descent of the head 13 is stopped. In that case, as shown in FIG. 7(b), there is a possibility that the push pin 41 and the flattening member 11 are misaligned. Therefore, the descent of the head 13 is stopped, and in S207, the head 13 is raised to the position before the head 13 started to descend. Then, in S208, the flattening member 11 is aligned with the substrate 1 in terms of the X and Y axes. Specifically, the head 13 is adjusted in the X and Y axes by driving the head drive unit 10, thereby aligning the flattening member 11 with the substrate 1.

[0066] Thereafter, the flattening member is lowered again in S205, and S205 to S208 are repeated in sequence until the flattening member 11 comes into contact with the push pin 41.

[0067] If it is determined in S206 that the push pin 41 has not come into contact with the flattening member 11, the control unit 200 may display this information on a display unit (not shown) to notify the operator. Also, this information may be notified from an external notification unit (not shown) to an external device, or both may be performed.

[0068] In S209, the control unit 200 temporarily stops the descent of the head 13, and as shown in Fig. 8(d), lowers the push pin 41 to the position it was in before it started to rise, and stores it in the substrate stage 4. After that, the process proceeds to S105, where the flattening process is started.

[0069] As described above, before the substrate 1 and the planarizing member 11 are brought into contact with each other to perform the planarizing process, the push pin 41 is driven to confirm in advance whether the positions of the substrate and the planarizing member are in a positional relationship that allows for separation assistance. In other words, the push pin 41 is driven in a state where the planarizing member is not in contact with the composition to confirm in advance whether at least the substrate is in a positional relationship that allows for separation assistance, and it is determined whether or not to perform the planarizing process according to the detection result of the prior confirmation. This allows the push pin to stably separate the planarizing member 11 from the curable composition on the substrate.

[0070] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. For example, in this embodiment, an example was described in which the positions of the substrate and the flattening member are confirmed using a push pin contact detection means and a sensor such as an encoder for detecting the Z-direction position of the push pin 41. In addition, the driving force of the push pin 41 may be detected from the current value of the motor that drives the push pin 41, and the contact state of the push pin 41 may be detected from the amount of change in the driving force and the position of the push pin 41. In addition, the contact of the push pin 41 with the flattening member 11 may be detected not only by the means attached to the push pin 41 but also by the state of the head 13 (head position and driving force to the head). Alternatively, these may be appropriately combined to confirm the substrate position and the flattening member position. Furthermore, in this embodiment, the position of the flattening member is confirmed by lowering the flattening member, but it may be detected by further raising the push pin. That is, when narrowing the distance between the tip of the push pin and the flattening member, as long as the push pin contact detection means can detect contact between the member 11 and the push pin 41, it does not matter whether the push pin is raised or the flattening member is lowered.

[0071] Second Embodiment In the first embodiment, the position of the member 11 is always confirmed after the holding position of the substrate in the substrate holding unit 2 is confirmed. The holding position of the substrate in the substrate holding unit 2 changes every time the substrate 1 is carried into the substrate holding unit 2, so the processes of S201 to S204 are required every time the substrate 1 is carried in. However, the same flattening member 11 is generally used for a plurality of substrates 1. Usually, the position of the flattening member 11 relative to the flattening member holding unit 12 changes only when the flattening member is replaced, so the processes of S205 to S208 do not necessarily have to be performed every time. However, the operation of separating the flattening member 11 from the substrate 1 exerts a large force on the flattening member, so the position of the flattening member 11 on the flattening member holding unit 12 may be shifted.

[0072] Therefore, in this embodiment, when the same planarizing member 11 is used for the next process, it is determined whether it is necessary to check the position of the planarizing member, and if it is necessary, the positions of the planarizing member 11 and the push pin 41 are checked to check the position of the planarizing member 11 relative to the substrate 1.

[0073] The flow of the flattening process in this embodiment will be described with reference to the flowchart of Fig. 9. The process shown in the flowchart of Fig. 9 is realized by the control unit 200 comprehensively controlling each unit of the flattening apparatus 100. Furthermore, the process of Fig. 9 is the same as Fig. 4 in steps S201 to S209, and therefore description thereof will be omitted.

[0074] 9, in the processes of S201 to S204, the control unit 200 checks the position of the substrate 1 held by the substrate holding unit 2 by checking the positions of the substrate and the push pin 41. Next, in S301, the control unit 200 determines whether it is necessary to check the position of the flattening member 11 relative to the substrate 1. Specifically, this may be the case when the flattening member 11 is held by suction on the first substrate 1 immediately after it is held by the flattening member holding unit 12, or after the flattening process has been performed on a predetermined number of substrates 1.

[0075] Furthermore, when the magnitude of any one of the forces (separation forces) in the X-direction, Y-direction, and Z-direction applied to the planarizing member 11 during the separation process of the planarizing member 11 and the substrate 1 in the immediately previous planarizing process is equal to or greater than a predetermined value, it may be determined in S301 that it is necessary to check the position of the planarizing member 11. One example of a means for measuring the magnitude of the separation force is a force sensor (separation force acquisition unit; not shown) provided in the planarizing member holding unit 12. That is, when the separation force required to separate the planarizing member 11 from the substrate 1 in the immediately previous planarizing process step is greater than a predetermined value, it is determined that it is necessary to check the position of the planarizing member 11 before performing the next planarizing process.

[0076] If it is determined in S301 that position confirmation is necessary, the position of the flattening member is confirmed in S205 to S209. On the other hand, if it is determined in S301 that position confirmation is not necessary, in S209 the control unit 200 lowers the push pin 41 to the position before the push pin started to rise, and stores it in the substrate stage 4. Then, the process proceeds to S105, and flattening processing is started.

[0077] In this manner, in this embodiment, the processes of S205 to S209 are performed only when it is determined that it is necessary to check the position of the flattening member, thereby preventing the position of the flattening member from being checked more than necessary, and improving the productivity of the flattening apparatus.

[0078] In the process of confirming the holding position of the substrate, instead of the method of having the substrate transport unit 25 re-place the substrate 1 on the substrate stage 4 as shown in S204, the substrate 1 may be transported to the first processing unit 101 and re-positioned by the detection unit 300. Furthermore, the substrate 1 may be transported to the second processing unit 102 or outside the planarization apparatus 100, and then the substrate position may be adjusted.

[0079] In addition, due to changes over time (e.g., volatilization) of the curable composition on the substrate 1, the desired curing result may not be obtained in the subsequent curing process, resulting in a defective product. Therefore, when the substrate 1 is carried out to the outside of the second processing unit 102 or the flattening apparatus 100, it is preferable to remove (rework) the applied curable composition and perform the process again from the application step of S102.

[0080] That is, even if it is determined in S202 that the holding position of the substrate 1 is correct, it may be determined whether to unload the substrate 1 depending on the elapsed time after the substrate 1 is subjected to the coating treatment of the curable composition.

[0081] Incidentally, also in the process of checking the position of the planarizing member 11, instead of the method of adjusting the X-axis and Y-axis of the head 13 shown in S208, the planarizing member 11 may be adjusted by transporting it outside the second processing unit 102 or the planarizing apparatus 100. That is, the planarizing member 11 may be held by the planarizing member transport unit 32 and then placed again on the planarizing member holding unit 12, thereby adjusting the holding position of the planarizing member in the planarizing member holding unit 12. This corrects the relative position between the planarizing member holding unit 12 and the planarizing member 11, making it possible to align it with respect to the substrate 1.

[0082] Furthermore, if it is determined that the substrate or flattening member 11 is misaligned in the substrate holding position check and flattening member position check in Figures 4 and 9, a step may be provided to check whether the push pin 41 is being driven correctly (push pin drive check).

[0083] Fig. 10 is a diagram showing the push pin drive confirmation step. Fig. 10(a) is an example of a confirmation process performed after it is determined that the substrate is misaligned in the substrate holding position confirmation, and it is confirmed that the push pin 41 is operating when the substrate 1 is carried out for position adjustment. Specifically, after the push pin 41 is raised as in S201, the flattening member is lowered as in S206, and it is confirmed whether the push pin 41 and the flattening member 11 are in contact as in S206. If the push pin contact detection means 43 detects that the push pin 41 and the flattening member 11 are in contact, it can be determined that the push pin 41 is operating correctly.

[0084] FIG. 10(b) is an example of a confirmation process performed after it is determined that the flattening member is misaligned by checking the position of the flattening member. The flattening member 11 is moved parallel to the surface of the substrate 1 so that the flattening member 11 is always located at the position of the push pin 41, and then it is confirmed whether the push pin 41 and the flattening member 11 come into contact with each other as in S206. This makes it possible to determine that the push pin 41 is operating correctly. Specifically, after the flattening member 11 is moved parallel to the surface of the substrate 1, the push pin is raised as in S201 (if it is operating correctly, it will rise). Then, the flattening member 11 is lowered as in S205, and it is confirmed that the push pin and the flattening member are in contact with each other as in S203. If it is determined that the push pin and the flattening member come into contact with each other, it can be determined that the push pin is operating correctly.

[0085] According to the embodiment described above, it is possible to confirm whether the holding position of the substrate and the position of the planarizing member are correct by driving the push pin 41 in advance before bonding the substrate 1 and the planarizing member 11. In other words, by performing the planarizing process after confirming in advance whether the substrate and the planarizing member are in a positional relationship that allows for separation assistance, it is possible to stably separate the planarizing member 11 from the curable composition on the substrate, and it is expected that a decrease in productivity of the planarizing apparatus will be prevented.

[0086] (Article manufacturing method) Next, a method for manufacturing an article (such as a semiconductor IC element, a liquid crystal display element, a color filter, or a MEMS) using the above-mentioned planarization device or planarization method will be described. The manufacturing method includes a step of using the above-mentioned planarization device to bring a composition arranged on a substrate (such as a wafer or a glass substrate) into contact with a planarization member to planarize the substrate, harden the composition, and then separate the composition from the planarization member. Then, the substrate having the planarized composition is subjected to a process such as forming a pattern using a lithography device, and the processed substrate is subjected to other well-known processing steps to manufacture an article. Other well-known processes include etching, resist stripping, dicing, bonding, packaging, and the like. According to this manufacturing method, it is possible to manufacture an article of higher quality than before.

[0087] Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0088] <Summary of the embodiment> The disclosure of the present specification includes at least the following configurations.

[0089] (Item 1) A planarization apparatus for planarizing a composition on a substrate using a planarization member, comprising: A substrate holder for holding a substrate; A member holding portion that holds a flattening member; a pressing member protruding from the substrate toward the planarizing member; a control unit that determines whether or not to perform a planarization process including a step of contacting the substrate and the planarization member via the composition by protruding the pressing member in a state in which the planarization member is not in contact with the composition; A planarization apparatus comprising:

[0090] (Item 2) The control unit determines whether the holding position of the substrate held by the substrate holding unit is correct by protruding the pressing member while the planarizing member is not in contact with the composition, and determines whether to perform the planarizing process based on the result of the determination.

[0091] (Item 3) The pressing member further includes a contact detection unit for detecting contact between the pressing member and an object. 3. The planarization apparatus according to item 2, wherein the control unit determines that the position of the substrate held by the substrate holding unit is incorrect when the contact detection means determines that the pressing member has come into contact with the substrate when the pressing member is protruded while the planarization member is not in contact with the composition.

[0092] (Item 4) 4. The planarization apparatus according to item 2 or 3, characterized in that the control unit controls to adjust the position of the substrate held by the substrate holding unit when it is determined that the holding position of the substrate is incorrect.

[0093] (Item 5) 5. The planarization apparatus according to any one of items 2 to 4, wherein when the control unit determines that the holding position of the substrate is correct, the control unit determines whether the position of the planarization member held by the member holding unit is correct by protruding the pressing member in a state in which the planarization member is not in contact with the composition.

[0094] (Item 6) The method further includes: acquiring a separation force when the planarizing member is separated from the substrate in a planarizing process; The flattening device described in item 5, characterized in that the control unit performs control to determine whether the position of the flattening member held by the member holding unit is correct when the separation force acquired by the acquisition unit in the immediately preceding flattening process is greater than a predetermined value.

[0095] (Item 7) The pressing member further includes a contact detection unit for detecting contact between the pressing member and an object. The flattening device described in item 5 or 6, characterized in that when the contact detection means detects contact when narrowing the distance between the pressing member and the flattening member, the control unit determines that the holding position of the flattening member held by the member holding unit is correct.

[0096] (Item 8) 8. The planarization apparatus according to any one of items 1 to 7, wherein the pressing member is a member used to assist in separation of the substrate and the planarization member that are in contact with each other via the composition.

[0097] (Item 9) The flattening device according to any one of items 1 to 8, characterized in that the control unit notifies at least one of a display unit and an external device connected to the flattening device of the result of the judgment as to whether or not to perform the flattening process.

[0098] (Item 10) A planarization apparatus for planarizing a composition on a substrate using a planarization member, comprising: A substrate holder for holding a substrate; A member holding portion that holds a flattening member; a pressing member protruding from the substrate toward the planarizing member; The pressing member further includes a contact detection unit for detecting contact between the pressing member and an object. a control unit that protrudes the pressing member while the planarizing member is not in contact with the composition, and controls at least one of the pressing member, the substrate holding unit, and the member holding unit in accordance with a detection result by the contact detection means; A planarization apparatus comprising:

[0099] (Item 11) A planarization method for planarizing a composition on a substrate using a planarization member, comprising the steps of: a first protruding step of protruding a pressing member from the substrate toward the flattening member while the flattening member held by the member holding part is not in contact with a composition on the substrate held by the substrate holding part; a detection step of detecting whether the pressing member protruded in the first protrusion step has come into contact with the substrate; a determination step of determining whether the holding position of the substrate held by the substrate holding unit is correct based on a result of the detection step; A planarization method comprising the steps of:

[0100] (Item 12) Item 12. The planarization method according to item 11, further comprising an adjustment step of adjusting a holding position of the substrate when it is determined in the determination step that the holding position of the substrate is incorrect.

[0101] (Item 13) a second protruding step of protruding a pressing member from the substrate toward the planarizing member in a direction from the substrate toward the planarizing member when the holding position of the substrate is determined to be correct in the determining step; and a second detection step of detecting whether the pressing member protruded by the second protrusion step has come into contact with the flattening member; a second determination step of determining whether a planarization process can be performed using the planarization member held by the member holding unit based on a result of the second detection step; 13. The planarization method according to item 11 or 12, further comprising:

[0102] (Item 14) After the determination step, contacting the planarizing member with the composition; curing the composition while the planarizing member is in contact with the composition; and and separating the planarizing member from the cured composition, 14. The planarization method according to any one of items 11 to 13, wherein the pressing member assists separation in the separation step by pressing up the planarization member in a direction from the substrate toward the planarization member.

[0103] (Item 15) 15. The planarization method according to any one of items 11 to 14, characterized in that, if it is determined in the determination step that the holding position of the substrate is incorrect, a planarization process in which the substrate and the planarization member are brought into contact with each other via the composition is not performed.

[0104] (Item 16) A step of planarizing a composition on a substrate using the planarization apparatus according to any one of items 1 to 10; and processing the substrate having the composition planarized by the process; A method for manufacturing an article, comprising the steps of: manufacturing an article from the processed substrate.

Claims

1. A planarizing apparatus for planarizing a composition on a substrate using a planarizing member, A substrate holding section that holds the substrate, A member holding part that holds the flattening member, A pressing member protruding in the direction toward the planarizing member from the substrate, A control unit that determines whether or not to perform a planarization process which includes the step of bringing the substrate and the planarization member into contact via the composition by extending the pressing member while the planarization member is not in contact with the composition, A planarizing apparatus characterized by having the following features.

2. The planarizing apparatus according to claim 1, characterized in that the control unit determines whether the holding position of the substrate held by the substrate holding unit is correct by making the pressing member protrude when the planarizing member is not in contact with the composition, and determines whether to perform the planarizing process according to the result of the determination.

3. The system further includes contact detection means for detecting contact between the pressing member and the object, The planarizing apparatus according to claim 2, characterized in that the control unit determines that the position of the substrate held by the substrate holding portion is incorrect when the contact detection means determines that the pressing member has come into contact with the substrate when the planarizing member is not in contact with the composition.

4. The planarizing apparatus according to claim 2, characterized in that the control unit controls the position of the substrate held by the substrate holding unit to adjust the position of the substrate when it determines that the holding position of the substrate is incorrect.

5. The planarizing apparatus according to claim 2, characterized in that when the control unit determines that the holding position of the substrate is correct, it determines whether the position of the planarizing member held by the member holding portion is correct by causing the pressing member to protrude while the planarizing member is not in contact with the composition.

6. The planarization process further includes an acquisition unit that acquires the separation force when separating the planarization member from the substrate, The planarizing apparatus according to claim 5, characterized in that the control unit performs control to determine whether the position of the planarizing member held by the member holding unit is correct when the separation force obtained by the acquisition unit in the immediately preceding planarizing process is greater than a predetermined value.

7. The system further includes contact detection means for detecting contact between the pressing member and the object, The flattening apparatus according to claim 5, characterized in that when the control unit narrows the distance between the pressing member and the flattening member, the contact detection means determines that the holding position of the flattening member held by the member holding unit is correct.

8. The planarizing apparatus according to claim 1, characterized in that the pressing member is a member used to assist in separating the substrate and the planarizing member that have come into contact via the composition.

9. The flattening apparatus according to claim 1, characterized in that the control unit notifies at least one of the display unit and an external device connected to the flattening apparatus of the result of the determination of whether or not to perform the flattening process.

10. A planarizing apparatus for planarizing a composition on a substrate using a planarizing member, A substrate holding section that holds the substrate, A member holding part that holds the flattening member, A pressing member protruding in the direction toward the planarizing member from the substrate, The system further includes contact detection means for detecting contact between the pressing member and the object, With the flattening member not in contact with the composition, the pressing member is made to protrude, and a control unit controls at least the pressing member, the substrate holding portion, and the member holding portion according to the detection result by the contact detection means, A planarizing apparatus characterized by having the following features.

11. A planarization method for planarizing a composition on a substrate using a planarizing member, A first protrusion step involves causing a pressing member to protrude in a direction toward the flattening member from the substrate, while the flattening member held by the member holding portion is not in contact with the composition on the substrate held by the substrate holding portion. A detection step for detecting whether the pressing member protruding by the first protrusion step has come into contact with the substrate, Based on the results of the detection step, a determination step is made to determine whether the holding position of the substrate held by the substrate holding part is correct. A method for flattening, characterized by having the following features.

12. The planarization method according to claim 11, further comprising an adjustment step to adjust the holding position of the substrate if it is determined in the determination step that the holding position of the substrate is incorrect.

13. If, in the determination step, it is determined that the holding position of the substrate is correct, a second protrusion step is performed in which the pressing member is made to protrude from the substrate toward the flattening member while the flattening member is not in contact with the composition, The process detects whether the pressing member, which was protruded by the second protrusion step, has come into contact with the flattening member. The second detection step, Based on the results of the second detection step, the planarizing member held by the member holding part is planarized. A second decision step to determine whether processing can be performed, The planarization method according to claim 11, further comprising the features.

14. After the aforementioned determination step, A contact step of bringing the planarizing member into contact with the composition, A curing step in which the composition is cured while the planarizing member is in contact with the composition, The process includes a separation step of separating the planarized member from the cured composition, The planarization method according to claim 11, characterized in that the pressing member assists in the separation step by pushing the planarization member upward in the direction from the substrate toward the planarization member.

15. The planarization method according to claim 11, characterized in that if it is determined in the determination step that the holding position of the substrate is incorrect, the planarization process of bringing the substrate and the planarization member into contact via the composition is not performed.

16. A step of flattening a composition on a substrate using a planarization apparatus according to any one of claims 1 to 10, The process includes processing the substrate having the composition that has been flattened in the above step, A method for manufacturing an article, characterized by manufacturing an article from the processed substrate.

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