Temperature controller, lithography apparatus, and method of manufacturing article

Abstract

To provide a temperature controller that is capable of adjusting a temperature of an optical path while reducing local temperature change of an optical element of an optical system.SOLUTION: A temperature controller has a blowing part which blows temperature-adjusted gas onto an optical path of an optical system via openings, where the openings are holes provided for the blowing part, a shape of a circumference of the openings has recesses recessed inside further from a circumcircle of the openings. In the case where a position closest to the center of the circumcircle out of the recesses is any one of an intersection point of two straight line parts, an intersection point of two curve parts, or an intersection point of a straight line part and a curve part, an angle inside the openings at the intersection point is larger than 180 degrees. In the case where a position closest to the center of the circumcircle out of the recesses is a curve part, a diameter of the curve part is two-thirds or less the diameter of the circumcircle. In the case where a position closest to the center of the circumcircle out of the recesses is a straight line part, a length of the straight line part is one fifth or less the diameter of the circumcircle.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a temperature adjustment apparatus, a lithography apparatus, and a method for manufacturing an article. [Background technology]

[0002] Optical systems such as illumination optical systems, projection optical systems, and measurement optical systems are often used in the manufacturing processes of semiconductor devices, liquid crystal display devices, etc. If a temperature change occurs in the optical path of these optical systems, the performance of the optical systems will deteriorate due to the effect of the temperature change.

[0003] Patent Document 1 discloses a method for reducing temperature changes around the optical path of a measurement optical system by blowing gas from a blowing section toward the periphery of the optical path of the measurement optical system (measurement section). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-175879 A Summary of the Invention [Problem to be solved by the invention]

[0005] Here, when temperature-adjusted gas is blown onto the optical path of the optical system to reduce temperature changes in the optical path, the blown gas may spread in a direction perpendicular to the blowing direction, causing the gas to be blown onto the optical elements of the optical system, resulting in local temperature changes in the optical elements and degradation of the optical performance.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a temperature adjustment device capable of adjusting the temperature of an optical path while reducing local temperature changes in optical elements of an optical system. [Means for solving the problem]

[0007] In order to achieve the above object, a temperature control device according to one aspect of the present invention has a blowing section which blows temperature-adjusted gas onto an optical path of an optical system through an opening, the opening being a hole provided in the blowing section, the outer periphery of the opening having a recess which is recessed inwardly from the circumscribing circle of the opening, and if the position of the recess closest to the center of the circumscribing circle is either an intersection of two straight line sections, or an intersection of two curved sections, or an intersection of a straight line section and a curved section, the angle inside the opening at the intersection is greater than 180 degrees, if the position of the recess closest to the center of the circumscribing circle is a curved section, the diameter of the curved section is two-thirds or less of the diameter of the circumscribing circle, and if the position of the recess closest to the center of the circumscribing circle is a straight line section, the length of the straight line section is one-fifth or less of the diameter of the circumscribing circle.

[0008] Further objects or other aspects of the present invention will become apparent from the embodiments described below with reference to the drawings. Effect of the Invention

[0009] According to the present invention, it is possible to provide a temperature adjustment device capable of adjusting the temperature of the optical path while reducing local temperature changes in optical elements of an optical system. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic view showing a configuration of a substrate processing apparatus in a first embodiment. [Diagram 2] 5A and 5B are schematic diagrams showing a method for measuring the position of a fine movement stage by a laser interferometer. [Diagram 3] 4 is an example of an arrangement of temperature adjustment devices in the first embodiment. [Figure 4] FIG. 2 is a diagram showing a configuration of a speech bubble section in the first embodiment. [Diagram 5] 5 is a diagram showing the relationship between the maximum width of the optical path and the width where a plurality of openings are provided in the first embodiment. FIG. [Figure 6] 4 shows an example of an opening in the first embodiment. [Figure 7] 1 shows the results of simulating the flow rate of gas at the opening when gas is blown therethrough. [Figure 8] 4 shows the flow of gas blown from the blowing part through the opening. [Figure 9] 4 is an example of an opening according to the first embodiment. [Figure 10] 4 is a diagram showing the relationship between the size of the inscribed circle and the size of the circumscribed circle of an opening in the first embodiment. FIG. [Figure 11] 4 is a flowchart of a temperature adjustment method in the first embodiment. [Figure 12] 10 is a flowchart of a method for manufacturing an article in a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the following embodiment does not limit the invention according to the claims. Although the embodiment describes a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] In addition, in this specification and drawings, directions are basically indicated by an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are mutually orthogonal. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0013] A specific configuration will be described below for each embodiment.

[0014] First Embodiment FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 in this embodiment. In this embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate via a projection optical system by a step-and-repeat method or a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a drawing apparatus that draws on a substrate using an electron beam or an ion beam, etc., to form a pattern on the substrate. The substrate processing apparatus 1 may also be another lithography apparatus (substrate exposure apparatus), for example, an imprint apparatus that forms a pattern on the substrate by molding an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 1 may be another apparatus for processing a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, or a deposition apparatus. The substrate processing apparatus 1 may also be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0015] The substrate processing apparatus 1 has an illumination optical system 12 that irradiates light, a projection optical system 15, a reticle stage 14 that holds a reticle 13, a stage 20 that is movable while holding a substrate 16, an off-axis scope (OAS) 30, and a first control unit 11.

[0016] The stage 20 has an XY stage 23 that can move on the XY plane, a fine movement stage 22 that is placed on the XY stage 23 and can be finely moved, and a substrate chuck 21 that holds the substrate 16 while being held by the fine movement stage 22. The fine movement stage 22 can be moved (driven) in the X-axis direction, the Y-axis direction, the Z-axis direction (the optical axis direction of the projection optical system 15), the θx-axis direction, the θy-axis direction, and the θz-axis direction. In other words, the fine movement stage 22 can be moved (driven) in six axial directions. Here, the θx-axis direction is the rotation direction around the X-axis, the θy-axis direction is the rotation direction around the Y-axis, and the θz-axis direction is the rotation direction around the Z-axis. Also, the position in the θx-axis direction means the rotation angle around the X-axis, the position in the θy-axis direction is the rotation angle around the Y-axis, and the θz-axis direction is the rotation angle around the Z-axis.

[0017] The reticle 13 is an original plate on which a pattern (e.g., a circuit pattern) to be transferred is formed of chrome on the surface of, for example, quartz glass. The substrate 16 is, for example, single crystal silicon, and when the substrate processing apparatus 1 is an exposure apparatus, the substrate 16 conveyed to the substrate processing apparatus 1 has a photosensitive material (resist) applied on its surface. Here, the illumination optical system 12 is a pattern forming unit that forms a pattern on the substrate 16. Note that, in this embodiment, an example of a lithography apparatus that forms a pattern using light is shown, and the pattern forming unit is the illumination optical system 12, but it may also be a lithography apparatus that hardens a thermosetting material by heat. In that case, the pattern forming unit is, for example, a heating unit that heats the thermosetting material. The control unit 11 controls each part in the substrate processing apparatus 1.

[0018] The off-axis scope 30 is used to detect the position of the substrate 16 and the positions of multiple pattern areas on the substrate 16, and detects the relative position and attitude relationship between an alignment mark (not shown) formed on the substrate 16 and a reference mark (not shown) on the fine movement stage 22. The substrate processing apparatus 1 positions the stage 20 (substrate 16) based on the measurement results of the off-axis scope 30 and the measurement results using a laser interferometer and a bar mirror, which will be described later.

[0019] In the substrate processing apparatus 1, exposure light from a light source (not shown) passes through an illumination optical system 12 and illuminates a reticle 13 held on a reticle stage 14. The light transmitted through the reticle 13 passes through a projection optical system 15 and is irradiated onto a substrate 16. At this time, light from a pattern formed on the reticle 13 forms an image on the surface of the substrate 16. The substrate processing apparatus 1 exposes a shot area on the substrate 16 in this manner, and performs similar exposure on each of a plurality of shot areas.

[0020] 2 is a schematic diagram showing a method for measuring the position of fine movement stage 22 by a laser interferometer. The position of fine movement stage 22 in the X-axis direction is measured using X bar mirror 100 and laser interferometer 110. The position of fine movement stage 22 in the Y-axis direction is measured using Y bar mirror 200 and laser interferometer 210. X bar mirror 100 is provided on a side surface of fine movement stage 22 to extend in the Y-axis direction, and Y bar mirror 200 is provided on a side surface of fine movement stage 22 to extend in the X-axis direction.

[0021] First, a method for measuring the position of the fine movement stage 22 in the X-axis direction will be described. The laser interferometer 110 includes three laser interferometers. The laser interferometer 112 is disposed at the same horizontal position (same position in the X-axis and same position in the Y-axis) as the laser interferometer 111, and at a position spaced apart from the laser interferometer 111 in the height direction (Z-axis direction) by an interval Δz. From the measurement results of the laser interferometers 111 and 112, a deviation amount θy in the rotation direction around the Y-axis can be measured. The laser interferometer 113 is disposed at the same height (same position in the Z-axis) as the laser interferometer 111, and at a position spaced apart from the laser interferometer 111 in the horizontal direction (Y-axis direction) by an interval Δy. From the measurement results of the laser interferometers 111 and 113, a deviation amount θz in the rotation direction around the Z-axis in the XY plane can be measured.

[0022] Next, a method for measuring the position of the fine movement stage 22 in the Y-axis direction will be described. The laser interferometer 210 includes three laser interferometers. The laser interferometer 212 is disposed at the same horizontal position (same position in the X-axis and same position in the Y-axis) as the laser interferometer 211, and at a position spaced apart from the laser interferometer 211 in the height direction (Z-axis direction) by an interval Δz. From the measurement results of the laser interferometers 211 and 212, the deviation amount θx in the rotation direction around the X-axis can be measured. The laser interferometer 213 is disposed at the same height (same position in the Z-axis) as the laser interferometer 211, and at a position spaced apart from the laser interferometer 211 in the horizontal direction (X-axis direction) by an interval Δx. From the measurement results of the laser interferometers 211 and 213, the deviation amount θz in the rotation direction around the Z-axis in the XY plane can be measured. With the above-mentioned configuration, the position of the fine movement stage 22 is measured. In this embodiment, an example in which the bar mirror is installed on the side of the fine movement stage 22 has been shown, but the bar mirror may be installed on the top of the fine movement stage 22, and there is no particular limitation on the installation position. The off-axis scope 30 and the laser interferometers 110 and 210 form a measurement optical system.

[0023] Here, a temperature change may occur in the optical path of the optical system, such as the off-axis scope 30, the laser interferometer 110, the laser interferometer 210, the projection optical system 15, and the illumination optical system 12. This temperature change is caused, for example, by heat generated during substrate processing (for example, exposure heat during exposure), driving heat when the stage 20 is driven, and heat from a driving unit or an encoder provided in the measurement optical system. When a temperature change occurs, the performance of the optical system is deteriorated due to the influence of the temperature change. When a temperature-adjusted gas is blown onto the optical path to reduce the temperature change in this optical path, the blown gas may spread in a direction perpendicular to the blowing direction. As a result, the gas is blown onto the optical elements of the optical system, causing a local temperature change in the optical elements, and the optical performance is deteriorated. Furthermore, when the gas is blown onto the optical elements of the optical system or the substrate 16, the object onto which the gas is blown vibrates, and the optical performance and the measurement accuracy (measurement accuracy) are deteriorated. The temperature adjustment device of this embodiment can adjust the temperature of the optical path while reducing the local temperature change of the optical elements of the optical system and the vibration of the object caused by the gas being blown onto them. In this embodiment, the optical path of the optical system is an optical path including one or more light rays.

[0024] FIG. 3 shows an example of the arrangement of the temperature adjustment device in this embodiment. FIG. 3(a) shows a temperature adjustment device 50 that blows temperature-adjusted gas onto the optical path of the off-axis scope 30 in order to reduce temperature changes in the optical path of the off-axis scope 30. The temperature adjustment device 50 has a temperature adjustment unit 61 that adjusts the temperature of the gas, a blowing unit 52 that blows the gas through an opening (aperture), a pipe 60 that is a gas flow path that connects the blowing unit 52 and the temperature adjustment unit 61, and a second control unit 62 that controls the temperature adjustment device 50. The opening is a hole provided in the blowing unit 52. Note that a configuration in which the first control unit 11 that controls the substrate processing apparatus 1 controls the temperature adjustment device 50 may also be used.

[0025] If the temperature in the optical path of the off-axis scope 30 changes, an error occurs in the measurement result. The temperature adjustment device 50 of this embodiment blows temperature-adjusted gas onto this optical path. For example, the off-axis scope 30 does not perform measurement until the value of a sensor capable of measuring the temperature in the optical path of the off-axis scope 30 reaches a desired temperature, and the off-axis scope 30 performs measurement after the temperature in the optical path reaches the desired temperature. This can reduce errors in the measurement result of the off-axis scope 30. The temperature adjustment of the gas is performed by the temperature adjustment unit 61, and the gas whose temperature is adjusted by the temperature adjustment unit 61 is supplied to the blowing unit 52 via the piping 60. FIG. 3(b) shows the temperature adjustment device 50 blowing temperature-adjusted gas onto the optical paths of the laser interferometer 110 and the laser interferometer 210 in order to reduce temperature changes in the optical paths of the laser interferometer 110 and the laser interferometer 210. FIG. 3(c) shows a temperature adjustment device 50 that blows temperature-adjusted gas onto the optical path of the projection optical system 15 in order to reduce temperature changes in the optical path of the projection optical system 15. FIG. 3(d) shows a temperature adjustment device 50 that blows temperature-adjusted gas onto the optical path of the illumination optical system 12 in order to reduce temperature changes in the optical path of the illumination optical system 12. In FIG. 3(d), the temperature adjustment device 50 blows gas onto the upper region (+Z side region) of the reticle 13 and the lower region (−Z side region) of the reticle stage 14. In this way, the temperature adjustment device 50 of this embodiment blows temperature-adjusted gas onto the optical path of at least one of the optical systems (off-axis scope 30, laser interferometers 110 and 210, projection optical system 15, illumination optical system 12). Here, the arrangement example of the temperature adjustment device 50 is not limited to the example of FIG. 3, and there are no restrictions on the number of devices to be arranged and their positions. The temperature adjustment device 50 may be disposed in each of the optical paths of a plurality of optical systems as long as it is disposed so as to blow gas onto the optical path of at least one of the off-axis scope 30, the laser interferometer, the projection optical system 15, and the illumination optical system 12. In the example of Fig. 3(b), two temperature adjustment devices 50 are disposed so as to blow gas onto the optical paths of the laser interferometer 110 and the laser interferometer 210, respectively, but the temperature adjustment device 50 may be provided only for the optical path in which the temperature change is large.3(d) shows an example in which gas is blown by temperature adjustment device 50 onto each of the upper region (+Z side region) of reticle 13 and the lower region (-Z side region) of reticle stage 14, but gas may be blown onto only one of the regions. Also, in the example of FIG. 3(d), an example is shown in which two blowing units 52 are provided and piping 60 is branched to provide one temperature adjustment unit 61 and one second control unit 62, but piping 60 may not be branched and two temperature adjustment units 61 and two second control units 62 may be provided.

[0026] Fig. 4 is a diagram showing the configuration of blowing unit 52 in this embodiment. All of the cross-sectional shapes of the flow paths through which the gas flows in blowing unit 52 do not need to have the shape of opening 51, and the cross-sectional shape of the flow paths other than the vicinity of opening 51 (flow paths on the piping 60 side) may be circular or rectangular. Although the example in Fig. 4 shows an example in which a plurality of openings 51 of one type of shape are provided, openings of different shapes (a plurality of types of shapes) may be provided.

[0027] In addition, it is preferable that a plurality of openings 51 are provided for temperature control of the optical path region. It is preferable that the width where the plurality of openings 51 are provided is larger than the maximum width of the optical path in the direction perpendicular to the direction in which the gas is blown in the XY plane (the plane perpendicular to the optical path of the optical system). FIG. 5 is a diagram showing the relationship between the maximum width of the optical path and the width where the plurality of openings 51 are provided in this embodiment. FIG. 5(a) is a schematic diagram seen from the +X direction side when the temperature adjustment device 50 blows gas onto the optical path 31 of the off-axis scope 30. As shown in FIG. 5(a), the off-axis scope 30 has an optical path passing through the entire lower region (-Z direction side region) of the off-axis scope 30. FIG. 5(b) is a schematic diagram seen from the +Z direction side when the temperature adjustment device 50 blows gas onto the optical path 31 of the off-axis scope 30. The maximum width of the optical path 31 in the direction (X direction) perpendicular to the direction (Y direction) in which the gas is blown on the plane (XY plane) perpendicular to the optical path 31 of the optical system (off-axis scope 30) is width W1. The width in which the multiple openings 51 of the temperature adjustment device 50 are provided is width W2. In this case, the width W2 in which the multiple openings 51 are provided is larger than the maximum width W1 of the optical path in the direction perpendicular to the direction in which the gas is blown on the plane perpendicular to the optical path 31. This makes it possible to adjust the temperature of the entire optical path when the blowing unit 52 blows gas onto the optical path through the openings 51. Here, in this embodiment, an example is shown in which the temperature adjustment device 50 is arranged so that the multiple openings 51 are along the X axis or the Y axis, but the temperature adjustment device 50 may be arranged so that the multiple openings 51 are along the Z axis.

[0028] The temperature adjustment device 50 can form a complex shape of the opening 51 by using, for example, a 3D printer. Alternatively, the complex shape of the opening 51 can be formed by combining two or more parts after cutting them. Alternatively, the temperature adjustment device 50 can be manufactured by using means such as wire cutting, laser processing, and welding. In addition, when the temperature adjustment device 50 is manufactured by a 3D printer, unevenness may occur in the flow path through which the gas of the temperature adjustment device 50 flows, and the unevenness may peel off and be blown together with the gas, thereby contaminating the inside of the substrate processing apparatus 1 with particles. Therefore, when the temperature adjustment device 50 is manufactured by a 3D printer, it is preferable to perform a polishing process or a plating process on the inner wall surface of the flow path through which the gas of the temperature adjustment device 50 flows.

[0029] FIG. 6 is an example of the opening 51 in this embodiment. The outer periphery of the opening 51 of the temperature control device 50 in this embodiment has a recess 53 recessed inward from the outer periphery of the circumscribing circle 59 of the opening 51. The recess 53 has an intersection 55, a curved portion 56, or a straight portion 57 at a position closest to the center 54, which is the center of the circumscribing circle 59. Here, the center 54 is also the center of the opening 51. FIG. 6(a) is an example having an intersection 55 at a position closest to the center 54 of the circumscribing circle 59. FIG. 6(b) is an example having a curved portion 56 at a position closest to the center 54 of the circumscribing circle 59. FIG. 6(c) is an example having a straight portion 57 at a position closest to the center 54 of the circumscribing circle 59.

[0030] 6(a), when intersection 55 is located closest to center 54, intersection 55 is either an intersection of two straight line portions, an intersection of two curved line portions, or an intersection of a straight line portion and a curved line portion. The angle of intersection 55 on the inside of opening 51 is greater than 180 degrees.

[0031] 6(b), when curved portion 56 is located closest to center 54, the diameter of curved portion 56 is two-thirds or less of the diameter of circumscribing circle 59. Here, it is more preferable that the diameter of curved portion 56 is one-half or less (more preferably one-third or less) of the diameter of circumscribing circle 59.

[0032] 6(c), when straight line portion 57 is located closest to center 54, the length of straight line portion 57 is 1 / 5 or less of the diameter of circumscribing circle 59. Here, the length of straight line portion 57 is more preferably 1 / 10 or less (more preferably 1 / 20 or less) of the diameter of circumscribing circle 59.

[0033] Opening 51 of the present embodiment has the above-mentioned characteristics, and by blowing gas through opening 51 having such characteristics, the blown gas becomes a turbulent flow around intersection 55, curved portion 56, or straight portion 57. Then, at a position closer to center 54 of opening 51 than intersection 55, curved portion 56, or straight portion 57, the blown gas becomes a laminar flow with a high flow velocity and small variation in flow velocity.

[0034] FIG. 7 shows the results of simulating the gas flow rate at the opening when the gas is blown. In the upper diagram of FIG. 7, the darker parts indicate a faster gas flow rate, and the lighter parts indicate a slower gas flow rate. In the simulation shown in FIG. 7, the flow rate source condition is set to 10 L / min, and the gas flow rate at the opening 51 is colored in three stages. When the gas flow rate is fast (3 m / s or more), the color is the darkest, when the gas flow rate is medium (1.5 m / s or more and less than 3.0 m / s), the color is the second darkest, and when the gas flow rate is slow (less than 1.5 m / s), the color is the third darkest (lightest). And the lower diagram of FIG. 7 shows the relationship between the position at the dotted line position in the upper diagram of FIG. 7 and the gas flow rate.

[0035] FIG. 7(a) shows the result of simulating the gas flow velocity at the opening 51 of this embodiment. And FIG. 7(b) shows the result of simulating the gas flow velocity at a circular opening having no recess. The area of ​​the region where the gas flow velocity is fast (3 m / s or more) in FIG. 7(a) is larger than the area of ​​the region where the gas flow velocity is fast (3 m / s or more) in FIG. 7(b). That is, the area of ​​the region where the gas flow velocity is fast at the opening 51 of this embodiment is larger than the area of ​​the region where the gas flow velocity is fast at a circular opening. This is because in the opening 51 of this embodiment, turbulence occurs at the intersection 55, curved portion 56, or straight portion 57, and a laminar flow with a high speed flows at a position surrounded by the turbulent flow (near the center).

[0036] The gas being blown loses speed at the outer periphery (wall surface) of the opening due to frictional force (shear force). In the case of the circular opening in Fig. 7(b), the flow is generally laminar at the opening 51, and the gas speed is greatly lost at the outer periphery (wall surface) of the opening, so the area of ​​the region where the gas flow speed is fast is small. This also results in a large variation in the gas flow speed near the center of the opening.

[0037] The opening 51 of this embodiment generates turbulence at the intersection 55, curved section 56, or straight section 57, and a high-speed laminar flow flows in a position surrounded by the turbulent flow, so that the loss in the speed of the laminar flow near the center can be suppressed. As a result, the area of ​​the region where the gas flow speed is high (3 m / s or more) is increased near the center, and the variation in the gas flow speed near the center of the opening 51 can be reduced. In this way, by increasing the region where the gas flow speed is high and reducing the variation in the flow speed of the gas to be blown, the diffusion (spread) of the gas blown from the blowing section 52 through the opening 51 can be reduced.

[0038] FIG. 8 shows the flow of gas blown from the blowing part through the opening. FIG. 8(a) shows the flow of gas when gas is blown from the blowing part 52 through the opening 51 of this embodiment. FIG. 8(b) shows the flow of gas when gas is blown from the blowing part through a circular opening. FIG. 8(a), which shows the result of blowing gas through the opening 51 of this embodiment, shows that the diffusion (spread) of gas can be reduced compared to FIG. 8(b), which shows the result of blowing gas through a circular opening. In addition, when gas is blown through the opening 51 of this embodiment, not only can the diffusion of gas be reduced, but the directivity (straightness) can be increased. In addition, in a simulation of the gas flow, the diffusion of gas can be reduced by about 23% at a position 17 mm away from the opening 51 when the gas is blown from the circular opening and when the gas is blown from the opening 51 of this embodiment.

[0039] FIG. 9 is an example of the opening 51 of this embodiment. The opening 51 of this embodiment is not limited to the example of FIG. 9, and the shape of the outer periphery of the opening 51 may satisfy the following characteristics. The shape of the outer periphery of the opening 51 has a recess 53 recessed inward from the outer periphery of the circumscribing circle 59 of the opening 51. The recess 53 has an intersection 55, a curved portion 56, or a straight portion 57 at a position closest to the center 54 of the circumscribing circle 59. When the intersection 55 is located closest to the center 54 of the circumscribing circle 59, the intersection 55 is either an intersection of two straight portions, an intersection of two curved portions, or an intersection of a straight portion and a curved portion. The angle of the intersection 55 on the inside of the opening 51 may be greater than 180 degrees. When the curved portion 56 is located closest to the center 54 of the circumscribing circle 59, the diameter of the curved portion 56 may be two-thirds or less of the diameter of the circumscribing circle 59. Here, it is more preferable that the diameter of curved portion 56 is one-half or less (more preferably one-third or less) the diameter of circumscribing circle 59. When straight portion 57 is located closest to center 54 of circumscribing circle 59, the length of straight portion 57 is one-fifth or less the diameter of circumscribing circle 59. Here, it is more preferable that the length of straight portion 57 is one-tenth or less (more preferably one-twentieth or less) the diameter of circumscribing circle 59. Furthermore, recess 53 in this embodiment may have a shape in which a partition plate is inserted into a circular opening, as shown in, for example, FIG. 9(q) or FIG. 9(r).

[0040] FIG. 10 is a diagram showing the relationship between the size of the inscribed circle 58 and the circumscribed circle 59 of the opening 51 in this embodiment. In the opening 51 of this embodiment, the size of the diameter of the inscribed circle 58 of the opening 51 that is in contact with the intersections 55, the curved portions 56, or the straight portions 57 of the opening 51 and the diameter of the circumscribed circle 59 are related to the temperature adjustment performance of the temperature adjustment device 50. For example, as shown in FIG. 10(a), when the diameter of the inscribed circle 58 is larger than two-thirds of the diameter of the circumscribed circle 59, the laminar flow near the center cannot be enclosed by the turbulent flow generated at the intersections 55, the curved portions 56, or the straight portions 57. This reduces the effect of reducing the variation in the flow rate of the gas near the center of the opening 51 and the effect of reducing the diffusion of the sprayed gas. In other words, it is preferable that the diameter of the inscribed circle 58 of the opening 51 that is in contact with the intersections 55, the curved portions 56, or the straight portions 57 is two-thirds or less of the diameter of the circumscribed circle 59. Here, it is more preferable that the diameter of inscribed circle 58 of opening 51 is 3 / 5 or less (more preferably 1 / 2 or less) of the diameter of circumscribed circle 59.

[0041] 10(b), if the diameter of inscribed circle 58 is less than one-tenth of the diameter of circumscribed circle 59, the area in which laminar flow flows near the center surrounded by turbulent flow generated at intersection 55, curved portion 56, or straight portion 57 becomes smaller, and the effect of reducing temperature change in the optical path decreases. In other words, it is preferable that the diameter of inscribed circle 58 of opening 51 tangent to intersection 55, curved portion 56, or straight portion 57 is one-tenth or more (more preferably one-fourth or more) of the diameter of circumscribed circle 59.

[0042] Next, the timing of blowing gas from the blowing part 52 of the temperature control device 50 through the opening 51 in this embodiment will be described. For example, when the gas blown from the blowing part diffuses, the gas is blown onto the optical element, causing a local temperature change in the optical element. When the blowing of the gas is stopped, the temperature of the part where the temperature has locally changed returns to normal, so that the optical performance changes between when the gas is being blown and when the gas is not being blown. In order to reduce this change in optical performance, when the gas blown from the blowing part diffuses, it was necessary to blow gas constantly even during substrate replacement, etc. However, in the temperature control device 50 of this embodiment, the diffusion of gas can be reduced, so that no local temperature change is caused on the optical element, and even if the blowing of gas is stopped, the change in optical performance between when the gas is being blown and when the gas is not being blown is small. Therefore, the blowing of gas may be stopped during substrate replacement or maintenance, and gas may be blown only when the optical system of the optical path to which the gas is blown is used.

[0043] Also, the flow rate and temperature of the gas blown from the blowing unit 52 may be adjusted. For example, when a temperature sensor is attached to an optical element (e.g., an objective lens) corresponding to the optical path to which the gas is blown in order to set the optical element to a target temperature, the second control unit 62 may adjust the flow rate and temperature of the gas blown from the blowing unit 52 based on the value of the temperature sensor. Here, the temperature sensor may be disposed at a position where it can measure the temperature in the optical path, rather than measuring the temperature of the optical element. Alternatively, even if there is no temperature sensor, the second control unit 62 may predict a temperature change from the substrate processing conditions, etc., and based on the prediction result, adjust the flow rate and temperature of the gas blown from the blowing unit 52. Here, the second control unit 62 adjusting the temperature means controlling the temperature adjustment unit 61 so as to obtain a desired temperature. Furthermore, when there are multiple openings 51, the second control unit 62 may select the opening 51 to be used and control so that the gas is supplied through the selected opening 51.

[0044] 11 is a flow chart of the temperature adjustment method in this embodiment. First, the second control unit 62 sets a target temperature of the gas to be sprayed (step S110, target setting step). Next, the second control unit 62 controls the temperature adjustment unit 61 to adjust the temperature of the gas to the target temperature set in step S110 (step S120, temperature adjustment step). Next, the gas whose temperature has been adjusted in step S120 is sprayed through the opening 51 onto the optical path of the optical system (spraying step, S130). In this manner, temperature adjustment is performed in this embodiment. The outer periphery shape of the opening 51 of the temperature adjustment device 50 used in the spraying step has the above-mentioned characteristics.

[0045] As described above, in order to reduce the temperature change in the optical path by the temperature adjustment device 50 of this embodiment, the diffusion (spread) of the temperature-adjusted gas blown from the blowing unit 52 through the opening 51 is reduced. This reduces the gas blown from the blowing unit 52 through the opening 51 onto the optical elements of the optical system, and reduces the temperature change in the optical path while reducing the deterioration of the optical performance due to the local temperature change of the optical elements. Furthermore, the gas blown through the opening 51 onto the optical elements and the substrate 16 of the optical system can also reduce the vibration of the objects (optical elements and substrate 16) and the deterioration of the optical performance and measurement accuracy. In addition, by blowing the temperature-adjusted gas onto the optical path of the optical system, it is also possible to suppress the deformation of the objects (substrate 16, reticle 13, optical elements) around the optical path that deform (thermally expand) due to the temperature change. Note that, in the present embodiment, an example has been shown in which the gas blown from the temperature adjustment device 50 is temperature-adjusted, but the gas may be blown with the temperature and humidity adjusted.

[0046] <Second embodiment> The present embodiment is characterized in that an article is manufactured using the above-described temperature adjustment device.

[0047] FIG. 12 is a flow chart of the method for manufacturing an article in this embodiment. First, an exposure step (S210) is performed to expose a substrate using a lithography apparatus, and a development step (S220) is performed to develop the substrate 16 exposed in the exposure step. Then, a manufacturing step (S230) is performed to manufacture an article from the substrate 16 developed in the development step. Here, the lithography apparatus used in the exposure step has an illumination optical system 12 that illuminates a reticle (original) 13 with light from a light source, and a projection optical system 15 that projects light from the reticle (original) 13 onto the substrate 16. The lithography apparatus also has a measurement optical system that measures the position of a stage 20 that holds the substrate 16 or the substrate 16. Furthermore, the lithography apparatus has a temperature adjustment device 50 that has a blowing unit 52 that blows temperature-adjusted gas through an opening 51 onto the optical path of at least one optical system among the illumination optical system 12, the projection optical system 15, and the measurement optical system. The opening 51 is a hole provided in the blowing unit 52.

[0048] The outer periphery of the opening 51 has a recess 53 recessed inward from a circumscribing circle 59 of the opening 51. When the position of the recess 53 closest to the center of the circumscribing circle 59 is either an intersection of two straight line portions, an intersection of two curved line portions, or an intersection of a straight line portion and a curved line portion, the angle on the inside of the opening 51 at this intersection is greater than 180 degrees. When the position of the recess 53 closest to the center of the circumscribing circle 59 is a curved line portion, the diameter of the curved line portion is two-thirds or less of the diameter of the circumscribing circle 59. When the position of the recess 53 closest to the center of the circumscribing circle 59 is a straight line portion, the length of the straight line portion is one-fifth or less of the diameter of the circumscribing circle 59.

[0049] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, and the like.

[0050] The manufacturing process includes, for example, etching the developed substrate, stripping the resist, dicing, bonding, and packaging. According to this manufacturing method, it is possible to manufacture products of higher quality than before.

[0051] The disclosure of this specification includes the following temperature control apparatus, lithography apparatus, and method for manufacturing an article.

[0052] [Item 1] a blowing unit that blows the temperature-adjusted gas onto the optical path of the optical system through an opening, The opening is a hole provided in the blowing part, The outer periphery of the opening has a recess that is recessed inward from the circumscribing circle of the opening, When the position of the recess closest to the center of the circumscribing circle is an intersection of two straight line portions, or an intersection of two curved line portions, or an intersection of a straight line portion and a curved line portion, the angle of the intersection on the inside of the opening is greater than 180 degrees, When the recess is a curved portion at a position closest to the center of the circumscribing circle, the diameter of the curved portion is two-thirds or less of the diameter of the circumscribing circle, When the recess is located closest to the center of the circumscribing circle and is a straight line portion, the length of the straight line portion is equal to or less than one-fifth of the diameter of the circumscribing circle. A temperature control device characterized by:

[0053] [Item 2] The outer periphery of the opening has a plurality of recesses, 2. The temperature control device according to item 1, wherein the diameter of the inscribed circle of the opening tangent to the intersection, the curved portion, or the straight portion that is closest to the center of the circumscribed circle in each of the plurality of recesses is two-thirds or less of the diameter of the circumscribed circle.

[0054] [Item 3] The outer periphery of the opening has a plurality of recesses, 3. The temperature control device according to item 1 or 2, wherein a diameter of an inscribed circle of the opening tangent to the intersection, the curved portion, or the straight portion that is closest to a center of the circumscribed circle in each of the plurality of recesses is equal to or greater than one-tenth of the diameter of the circumscribed circle.

[0055] [Item 4] 4. The temperature adjusting device according to any one of items 1 to 3, wherein the outer periphery of the opening has a shape including at least three of the recesses.

[0056] [Item 5] The temperature control device described in any one of items 1 to 4, characterized in that the optical system is any one of an illumination optical system that illuminates an original, a projection optical system that projects light from the original onto a substrate, and a measurement optical system that measures the position of a stage that holds the substrate or the substrate.

[0057] [Item 6] 6. The temperature adjustment device according to any one of items 1 to 5, wherein the gas is blown onto the optical path through a plurality of the openings.

[0058] [Item 7] The temperature control device according to any one of items 1 to 6, wherein in a plane perpendicular to the optical path, a width in which the plurality of openings are provided is larger than a maximum width of the optical path in a direction perpendicular to the direction in which the gas is blown.

[0059] [Item 8] A temperature adjusting unit that adjusts the temperature of the gas blown by the blowing unit; a control unit that controls the temperature adjustment unit based on a result of measuring a temperature in an optical path of the optical system or a temperature of an optical element of the optical system; 8. The temperature control device according to any one of items 1 to 7, comprising:

[0060] [Item 9] The temperature control device according to any one of items 1 to 8, further comprising a control unit configured to adjust the flow rate of the gas to be blown based on a result of measuring a temperature in an optical path of the optical system or a temperature of an optical element of the optical system.

[0061] [Item 10] A temperature adjusting unit that adjusts the temperature of the gas blown by the blowing unit; a control unit that controls the temperature adjustment unit based on a predicted result of a temperature change in an optical path of the optical system; 8. The temperature control device according to any one of items 1 to 7, comprising:

[0062] [Item 11] The temperature control device according to any one of items 1 to 8, further comprising a control unit that adjusts the flow rate of the gas to be sprayed based on a prediction result of a temperature change in the optical path of the optical system.

[0063] [Item 12] 7. The temperature adjustment device according to item 6, wherein the plurality of openings include openings having different shapes.

[0064] [Item 13] 13. The temperature adjusting device according to any one of items 1 to 12, further comprising a control unit that selects an opening to be used from among the plurality of openings.

[0065] [Item 14] an illumination optical system that illuminates the original with light from a light source; a projection optical system that projects light from the original onto a substrate; a measurement optical system that measures the position of a stage that holds the substrate or the position of the substrate; 1. A lithographic apparatus comprising: a temperature control device having a blowing unit that blows a temperature-controlled gas through an opening onto an optical path of at least one of the illumination optical system, the projection optical system, and the measurement optical system; The opening is a hole provided in the blowing part, The outer periphery of the opening has a recess that is recessed inward from the circumscribing circle of the opening, When the position of the recess closest to the center of the circumscribing circle is an intersection of two straight line portions, or an intersection of two curved line portions, or an intersection of a straight line portion and a curved line portion, the angle of the intersection on the inside of the opening is greater than 180 degrees, When the recess is a curved portion at a position closest to the center of the circumscribing circle, the diameter of the curved portion is two-thirds or less of the diameter of the circumscribing circle, When the recess is located closest to the center of the circumscribing circle and is a straight line portion, the length of the straight line portion is equal to or less than one-fifth of the diameter of the circumscribing circle. 13. A lithography apparatus comprising:

[0066] [Item 15] exposing a substrate using a lithography apparatus; a developing step of developing the substrate exposed in the exposure step; A manufacturing process for manufacturing an article from the substrate developed in the developing process, the lithographic apparatus comprising: an illumination optical system that illuminates the original with light from a light source; a projection optical system that projects light from the original onto a substrate; a measurement optical system that measures the position of a stage that holds the substrate or the position of the substrate; a temperature control device having a blowing unit that blows a temperature-controlled gas through an opening onto an optical path of at least one of the illumination optical system, the projection optical system, and the measurement optical system; The opening is a hole provided in the blowing part, The outer periphery of the opening has a recess that is recessed inward from the circumscribing circle of the opening, When the position of the recess closest to the center of the circumscribing circle is an intersection of two straight line portions, or an intersection of two curved line portions, or an intersection of a straight line portion and a curved line portion, the angle of the intersection on the inside of the opening is greater than 180 degrees, When the recess is a curved portion at a position closest to the center of the circumscribing circle, the diameter of the curved portion is two-thirds or less of the diameter of the circumscribing circle, When the recess is located closest to the center of the circumscribing circle and is a straight line portion, the length of the straight line portion is equal to or less than one-fifth of the diameter of the circumscribing circle. A method for producing an article.

[0067] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. It has a blowing section that blows temperature-controlled gas into the optical path of the optical system through an opening, The shape of the outer circumference of the opening has a recess that is indented inward from the circumscribed circle of the opening. If the position of the recess closest to the center of the circumscribed circle is the intersection of two straight sections, or the intersection of two curved sections, or the intersection of a straight section and a curved section, then the angle inside the opening at the intersection is greater than 180 degrees. If the position of the recess closest to the center of the circumscribed circle is a curved portion, then the diameter of the curved portion is two-thirds or less of the diameter of the circumscribed circle. If the position of the recess closest to the center of the circumscribed circle is a straight section, then the length of the straight section is one-fifth or less of the diameter of the circumscribed circle. A temperature control device characterized by the following features.

2. The outer periphery of the opening has a plurality of recesses, The temperature control device according to claim 1, characterized in that the diameter of the inscribed circle of the opening that is tangent to the intersection point, curved portion, or straight portion at the position closest to the center of the circumscribed circle in each of the plurality of recesses is two-thirds or less of the diameter of the circumscribed circle.

3. The outer periphery of the opening has a plurality of recesses, The temperature control device according to claim 1, characterized in that the diameter of the inscribed circle of the opening that is tangent to the intersection point or the curved portion or the straight portion at the position closest to the center of the circumscribed circle in each of the plurality of recesses is one-tenth or more of the diameter of the circumscribed circle.

4. The temperature control device according to claim 1, characterized in that the shape of the outer circumference of the opening includes at least three recesses.

5. The temperature control device according to claim 1, characterized in that the optical system is any one of the following: an illumination optical system for illuminating a master plate; a projection optical system for projecting light from the master plate onto a substrate; and a stage for holding the substrate or a measurement optical system for measuring the position of the substrate.

6. The temperature control device according to claim 1, characterized in that the gas is blown into the optical path through a plurality of the openings.

7. The temperature control device according to claim 1, characterized in that, in a plane perpendicular to the optical path, the width of the multiple openings provided is greater than the maximum width of the optical path in a direction perpendicular to the direction in which the gas is blown.

8. A temperature adjustment unit that adjusts the temperature of the gas sprayed by the spraying unit, A control unit controls the temperature adjustment unit based on the results of measuring the temperature in the optical path of the optical system or the temperature of the optical elements of the optical system. A temperature control device according to claim 1, characterized by having the following features.

9. The temperature control device according to claim 1, characterized in that it has a control unit that controls the flow rate of the blown gas based on the result of measuring the temperature in the optical path of the optical system or the temperature of the optical elements of the optical system.

10. A temperature adjustment unit that adjusts the temperature of the gas sprayed by the spraying unit, A control unit controls the temperature adjustment unit based on the prediction result of the temperature change in the optical path of the optical system, A temperature control device according to claim 1, characterized by having the following features.

11. The temperature control device according to claim 1, characterized in that it has a control unit that controls the flow rate of the blown gas based on the prediction result of the temperature change in the optical path of the optical system.

12. The temperature control device according to claim 6, characterized in that the plurality of openings include openings of different shapes from each other.

13. The temperature control device according to claim 1, characterized in that it has a control unit that selects an opening to be used from among a plurality of the aforementioned openings.

14. An illumination optical system that illuminates the original plate with light from a light source, A projection optical system that projects light from the original plate onto a substrate, A stage for holding the substrate or a measuring optical system for measuring the position of the substrate, A lithography apparatus having, The temperature control device has a blowing section that blows a temperature-controlled gas through an opening onto the peripheral region of at least one of the optical systems, including the illumination optical system, the projection optical system, and the measurement optical system. The shape of the outer circumference of the opening has a recess that is indented inward from the circumscribed circle of the opening. If the position of the recess closest to the center of the circumscribed circle is the intersection of two straight sections, or the intersection of two curved sections, or the intersection of a straight section and a curved section, then the angle inside the opening at the intersection is greater than 180 degrees. If the position of the recess closest to the center of the circumscribed circle is a curved portion, then the diameter of the curved portion is two-thirds or less of the diameter of the circumscribed circle. If the position of the recess closest to the center of the circumscribed circle is a straight section, then the length of the straight section is one-fifth or less of the diameter of the circumscribed circle. A lithography apparatus characterized by the following features.

15. An exposure process in which a substrate is exposed using a lithography apparatus, A developing step for developing the substrate exposed in the exposure step, The process includes a manufacturing process for producing an article from the substrate developed in the above developing process, The lithography apparatus is An illumination optical system that illuminates the original plate with light from a light source, A projection optical system that projects light from the original plate onto a substrate, A stage for holding the substrate or a measuring optical system for measuring the position of the substrate, The device includes a temperature control unit having a blowing section that blows a temperature-controlled gas through an opening onto the peripheral region of at least one of the optical systems, including the illumination optical system, the projection optical system, and the measurement optical system. The shape of the outer circumference of the opening has a recess that is indented inward from the circumscribed circle of the opening. If the position of the recess closest to the center of the circumscribed circle is the intersection of two straight sections, or the intersection of two curved sections, or the intersection of a straight section and a curved section, then the angle inside the opening at the intersection is greater than 180 degrees. If the position of the recess closest to the center of the circumscribed circle is a curved portion, then the diameter of the curved portion is two-thirds or less of the diameter of the circumscribed circle. If the position of the recess closest to the center of the circumscribed circle is a straight section, then the length of the straight section is one-fifth or less of the diameter of the circumscribed circle. A method for manufacturing an article, characterized by the following:

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