Blade, system and method for processing

Abstract

To provide a blade that can properly reduce resistance of the blade against a fluid.MEANS: A blade (BL) used in a fluid includes: a base material (BM); and a coating layer (TBC) formed on the base material. A plurality of first grooves (9) and a plurality of second grooves (7) are formed on a surface of the coating layer, where the plurality of first grooves has a pitch (P9) that is different from a pitch (P7) of the plurality of second grooves.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the technical field of blades, for example turbine blades, as well as machining systems and methods for machining blades. [Background technology]

[0002] An example of a blade is a turbine blade used in a turbine. For example, Patent Document 1 describes a turbine blade having a heat-resistant layer formed on the surface. Blades such as this turbine blade are required to appropriately reduce the resistance of the blade to a fluid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] European Patent No. 2283169 Summary of the Invention

[0004] According to a first aspect, there is provided a blade for use in a fluid, comprising a substrate and a coating layer formed on the substrate, the coating layer having a surface on which a plurality of first grooves and a plurality of second grooves are formed, the pitch of the plurality of first grooves being different from the pitch of the plurality of second grooves.

[0005] According to a second aspect, there is provided a blade for use in a fluid machine, comprising a substrate and a coating layer formed on the substrate, wherein a plurality of first grooves and a plurality of second grooves are formed on a surface of the coating layer, and the depth of the plurality of first grooves is different from the depth of the plurality of second grooves.

[0006] According to a third aspect, there is provided a blade for use in a fluid, comprising a substrate and a coating layer formed on the substrate, the coating layer having a surface on which a plurality of first grooves and a plurality of second grooves are formed, and the spacing between the plurality of first grooves is different from the spacing between the plurality of second grooves.

[0007] According to a fourth aspect, there is provided a processing system comprising: a beam irradiation device that irradiates an energy beam onto a surface of a coating layer formed on a substrate and having a plurality of second grooves formed thereon; and a control device that controls the beam irradiation device so as to form a plurality of first grooves on the surface of the coating layer at a pitch different from the pitch of the plurality of second grooves.

[0008] According to a fifth aspect, there is provided a processing method including forming a plurality of second grooves in a surface of a coating layer formed on a substrate, and forming a plurality of first grooves in the surface at a pitch different from the pitch of the plurality of second grooves.

[0009] According to a sixth aspect, there is provided a turbine blade for use in a fluid, the turbine blade comprising: a substrate; and a heat-resistant layer formed on the substrate, the heat-resistant layer having a riblet structure formed on a second surface opposite a first surface facing the substrate, and the heat-resistant layer reducing transfer of heat from the fluid to the substrate.

[0010] According to a seventh aspect, there is provided a processing system comprising a beam irradiation device that irradiates an energy beam onto a surface of a heat-resistant layer formed on a substrate to reduce transfer of heat from a fluid to the substrate, and a control device that controls the beam irradiation device to form a riblet structure on the surface.

[0011] According to an eighth aspect, there is provided a blade for use in a fluid, the blade comprising a riblet structure formed on the surface of a substrate and a coating layer formed on the surface on which the riblet structure is formed.

[0012] According to a ninth aspect, there is provided a blade for use in a fluid, the blade comprising a substrate having a riblet structure formed on its surface, and a coating layer formed on the surface on which the riblet structure is formed.

[0013] According to a tenth aspect, there is provided a blade for use in a fluid, comprising a substrate having a plurality of first grooves arranged in a first pitch direction in a first section on a surface of the substrate, and a plurality of second grooves arranged in a second pitch direction different from the first pitch direction in a second section adjacent to the first section on the surface of the substrate.

[0014] According to an eleventh aspect, there is provided a blade for use in a fluid, comprising a substrate and a coating layer formed on the substrate, wherein the coating layer has a plurality of first grooves arranged in a first pitch direction in a first section on a surface of the coating layer, and a plurality of second grooves arranged in a second pitch direction different from the first pitch direction in a second section adjacent to the first section on the surface of the coating layer.

[0015] According to a twelfth aspect, there is provided a processing method including forming a riblet structure on a surface of a substrate, and forming a coating layer on the surface on which the riblet structure is formed. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a cross-sectional view illustrating a schematic overall structure of a processing system according to the present embodiment. [Diagram 2] FIG. 2 is a system configuration diagram showing the system configuration of the machining system of this embodiment. [Diagram 3] FIG. 3 is a perspective view showing the appearance of the turbine. [Figure 4] FIG. 4 is a perspective view showing the appearance of a turbine blade. [Diagram 5] FIG. 5 is a cross-sectional view showing the structure of a turbine blade. [Figure 6]FIG. 6 is a cross-sectional view showing the structure of the machining head of the present embodiment. [Figure 7] FIG. 7 is a timing chart showing the measurement light incident on the detector and the interference light detected by the detector. [Figure 8] Figure 8(a) is an oblique view showing the riblet structure, Figure 8(b) is a cross-sectional view showing the riblet structure (cross-sectional view taken along VIII-VIII' in Figure 8(a)), and Figure 8(c) is a top view showing the riblet structure. [Figure 9] Figure 9(a) is a cross-sectional view showing the processing light EL irradiated onto the turbine blade to form a riblet structure, and Figure 9(b) is a plan view showing the movement trajectory of the irradiation position of the processing light on the surface of the turbine blade. [Figure 10] FIG. 10 is a perspective view showing a riblet structure. [Figure 11] FIG. 11 is a perspective view showing a riblet structure. [Figure 12] FIG. 12 is a cross-sectional view showing an example of a riblet structure formed in the first modified example. [Figure 13] FIG. 13 is a cross-sectional view showing an example of a riblet structure formed in the first modified example. [Figure 14] FIG. 14 is a cross-sectional view showing an example of a riblet structure formed in the first modified example. [Figure 15] FIG. 15 is a cross-sectional view showing an example of a riblet structure formed in the first modified example. [Figure 16] FIG. 16 is a cross-sectional view showing an example of a riblet structure formed in the first modified example. [Figure 17] FIG. 17 is a cross-sectional view showing an example of a riblet structure formed in the first modified example. [Figure 18] FIG. 18 is a cross-sectional view showing an example of a riblet structure formed in the first modified example. [Figure 19] FIG. 19(a) is a cross-sectional view showing a turbine blade in which a plurality of grooves are formed, and FIG. 19(b) is a top view showing a turbine blade in which a plurality of grooves are formed. [Figure 20]FIG. 20 is a cross-sectional view of a turbine blade having both grooves and riblet structures formed therein. [Figure 21] FIG. 21 is a perspective view of a turbine blade having both grooves and riblet structures formed therein. [Figure 22] FIG. 22 is a top view of a turbine blade having both grooves and riblet structures formed therein. [Figure 23] FIG. 23 is a perspective view showing a turbine blade having both a riblet structure and grooves that are shallower than the grooves of the riblet structure. [Figure 24] FIG. 24 is a top view of a turbine blade having both grooves and riblet structures formed therein. [Diagram 25] FIG. 25 is a top view of a turbine blade having both grooves and riblet structures formed therein. [Figure 26] FIG. 26 is a top view showing a turbine blade having a riblet structure formed thereon. [Figure 27] FIG. 27 is a perspective view showing a radial turbine blade on which a riblet structure is formed. [Figure 28] FIG. 28 is a diagram showing a turbine machine into which the turbine blade is incorporated. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, an embodiment of a blade, a processing system, and a processing method will be described with reference to the drawings. Hereinafter, an embodiment of a blade, a processing system, and a processing method will be described using a processing system SYS that performs processing using processing light EL. However, the present invention is not limited to the embodiment described below.

[0018] In the following description, the positional relationship of various components constituting the machining system SYS will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For convenience of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). The rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may be the horizontal direction.

[0019] (1) Structure of the machining system SYS First, the structure of the machining system SYS of the present embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view showing a schematic structure of the machining system SYS of the present embodiment. Fig. 2 is a system configuration diagram showing the system configuration of the machining system SYS of the present embodiment.

[0020] As shown in FIGS. 1 and 2, the processing system SYS includes a processing device 1, a processing light source 21, a measurement light source 22, a stage device 3, and a control device 4. At least a part of the processing device 1 and the stage device 3 are accommodated in the internal space of a housing 5. The internal space of the housing 5 may be purged with a purge gas such as nitrogen gas, or may not be purged with a purge gas. The internal space of the housing 5 may be evacuated, or may not be evacuated. However, the processing device 1 and the stage device 3 may not be accommodated in the internal space of the housing 5. In other words, the processing system SYS does not need to include a housing 5 that accommodates the processing device 1 and the stage device 3.

[0021] The processing device 1 is capable of processing a workpiece W, which is an object to be processed, under the control of the control device 4. The workpiece W may be, for example, a metal, an alloy (e.g., duralumin, etc.), a semiconductor (e.g., silicon), a resin, a composite material (e.g., at least one of CFRP (Carbon Fiber Reinforced Plastic) and paint (e.g., a paint layer applied to a base material), etc.), glass, or an object made of any other material.

[0022] In this embodiment, the processing device 1 may process a turbine blade BL, which is an example of a workpiece W. The turbine blade BL is a member used in a turbine T, which is an example of a fluid machine. Specifically, the turbine blade BL is a blade-shaped member constituting a vane of the turbine T. An example of the turbine T is shown in FIG. 3 and FIG. 4. FIG. 3 is a perspective view showing the appearance of the turbine T. FIG. 4 is a perspective view showing the appearance of the turbine blade BL. As shown in FIG. 3 and FIG. 4, the turbine T includes a plurality of turbine blades BL. The turbine blade BL includes a shank 91 and a blade body 92 coupled to the shank 91 and extending from the shank 91 to the outside in the radial direction of the turbine T. At least one of the shank 91 and the blade body 92 may be made of a single metal. At least one of the shank 91 and the blade body 92 may be made of a plurality of metals. At least one of the shank 91 and the blade body 92 may be manufactured by an existing manufacturing method (for example, a manufacturing method using at least one of casting, forging, additive processing, subtractive processing, and machining). The shank 91 and the blade body 92 may be manufactured integrally. Alternatively, the shank 91 and the blade body 92 manufactured separately may be joined by an existing joining method (for example, a joining method using at least one of welding, brazing, and adhesive). The multiple shanks 91 provided on the multiple turbine blades BL may be joined to each other. The joined multiple shanks 91 may constitute at least a part of a rotatable rotor RT.

[0023] The blade body 92 extends from a platform 911 of the shank 91 radially outward of the turbine T. The platform 911 includes a pressure side platform 9111 and a suction side platform 9112. The blade body 92 includes a pressure side 921, a suction side 922 facing the opposite side to the pressure side 921, a root portion 923 coupled to the shank 91, and a tip portion 924 constituting an end portion opposite to the root portion 923. The blade body 92 further includes a leading edge surface 925 located between the pressure side 921 and the suction side 922, and a trailing edge surface 926 located between the pressure side 921 and the suction side 922 on the opposite side to the leading edge surface 925. At least one surface of the pressure side 921, the suction side 922, the leading edge surface 925, and the trailing edge surface 926 may include a curved surface. For example, in the example shown in FIG. 4, at least the surfaces of the positive pressure side 921 and the negative pressure side 922 each include a curved surface.

[0024] Incidentally, the turbine T may be one in which the rotor RT and the turbine blades BL are integrally formed.

[0025] The turbine T can rotate using the flow of a fluid supplied to the turbine T. Specifically, the turbine T is supplied with a fluid (e.g., at least one of water, steam, air, and gas). The fluid supplied to the turbine T flows along the surfaces of each of the multiple turbine blades BL. Therefore, the turbine blades BL are used in the fluid. As a result, the kinetic energy of the fluid is converted into the rotational energy of the turbine T by the multiple turbine blades BL. An example of such a turbine T is at least one of a steam turbine that uses steam as the fluid and a gas turbine that uses gas as the fluid. Another example of such a turbine T is at least one of a hydraulic turbine that uses water as the fluid and a buoyancy turbine that uses air as the fluid. The turbine T may also generate a flow of a fluid by its rotation.

[0026] The temperature of the fluid supplied to the turbine blade BL may be high. For example, when the turbine blade BL is used in a jet engine (i.e., when the turbine blade BL is used in a gas turbine), high-temperature combustion gas is supplied to the turbine blade BL as a fluid. In this case, the turbine blade BL may be subjected to a heat-resistant treatment in order to reduce the influence of heat on the base material BM constituting the turbine blade BL. Specifically, as shown in FIG. 5, which is a cross-sectional view (IV-IV' cross-sectional view in FIG. 4) showing the structure of the turbine blade BL, the turbine blade BL may include a base material BM having a blade shape and a heat-resistant layer TBC formed on the surface of the base material BM. The heat-resistant layer TBC is formed on a portion of the surface of the base material BM that is affected by heat from the fluid. The heat-resistant layer TBC is a coating layer for reducing the transfer of heat from the fluid to the base material BM. For this reason, the turbine blade BL comes into contact with the fluid via the heat-resistant layer TBC during use of the turbine blade BL (i.e., during the period during which the fluid is supplied to the turbine blade BL). That is, during use of the turbine blade BL, the heat-resistant layer TBC (more specifically, the surface of the heat-resistant layer TBC that is opposite to the surface of the heat-resistant layer TBC facing the base material BM and is exposed to the outside) comes into contact with the fluid. As a result, the heat-resistant layer TBC that exists between the fluid and the base material BM reduces the transfer of heat from the fluid to the base material BM. This reduces the effect of heat on the base material BM. An example of such a heat-resistant layer TBC is a layer containing ceramic. The layer containing ceramic may be, for example, a layer formed of a porous material.

[0027] In the example shown in FIG. 5, since the positive pressure surface 921 and the negative pressure surface 922 each include a curved surface as described above, the surfaces of the base material BM and the heat resistant layer TBC also include a curved surface. That is, the surface of the base material BM facing the heat resistant layer TBC includes a curved surface. The surface of the heat resistant layer TBC exposed to the outside also includes a curved surface. However, regardless of whether the positive pressure surface 921 and the negative pressure surface 922 include a curved surface, the surfaces of the base material BM and the heat resistant layer TBC may or may not include a curved surface. The curved surface may be a curved surface in which the curvature of each point on the surface changes only along one direction, such as a part of a cylinder, or a curved surface in which the curvature of each point on the surface changes along two directions, such as a part of a sphere. The surfaces of the base material BM and the heat resistant layer TBC may be flat.

[0028] 1 and 2 again, the processing device 1 irradiates the processing light EL onto the workpiece W in order to process the workpiece W. For this reason, the processing device 1 may be referred to as a beam irradiation device. The processing light EL may be any type of light as long as it can process the workpiece W by irradiating it onto the workpiece W. In this embodiment, the processing light EL is described using an example in which the processing light EL is laser light, but the processing light EL may be a type of light other than laser light. Furthermore, the wavelength of the processing light EL may be any wavelength as long as it can process the workpiece W by irradiating it onto the workpiece W. For example, the processing light EL may be visible light or invisible light (for example, at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The processing light EL may include pulsed light (for example, pulsed light having an emission time of picoseconds or less). Alternatively, the processing light EL may not include pulsed light. In other words, the processing light EL may be continuous light.

[0029] The processing device 1 may perform a removal process to remove a part of the workpiece W by irradiating the workpiece W with processing light EL. When performing the removal process, the processing device 1 may form a riblet structure RB in the workpiece W, which will be described later in detail with reference to Figs. 8(a) to 8(c). The riblet structure RB is a structure that can reduce the resistance of the surface of the workpiece W to a fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). Note that the fluid here means a medium (e.g., at least one of gas and liquid) flowing relative to the surface of the workpiece W. For example, when the surface of the workpiece W moves relative to the medium while the medium itself is stationary, this medium may be called a fluid.

[0030] In addition to or instead of the removal processing, the processing apparatus 1 may perform additional processing, which adds a new structure to the workpiece W by irradiating the workpiece W with processing light EL. In this case, the processing apparatus 1 may perform the additional processing to form the above-mentioned riblet structure RB on the surface of the workpiece W. Alternatively, in addition to or instead of at least one of the removal processing and the additional processing, the processing apparatus 1 may perform machining, which processes the workpiece W by bringing a tool into contact with the workpiece W. In this case, the processing apparatus 1 may perform machining to form the above-mentioned riblet structure RB on the surface of the workpiece W.

[0031] The processing light EL is supplied from a processing light source 21 that generates the processing light EL to the processing device 1 via a light propagation member (e.g., at least one of an optical fiber and a mirror) (not shown). The processing device 1 irradiates the processing light EL supplied from the processing light source 21 onto the workpiece W.

[0032] The processing device 1 can further measure the workpiece W under the control of the control device 4. The processing device 1 irradiates the workpiece W with the measurement light ML in order to measure the workpiece W. The measurement light ML may be any type of light as long as it can measure the workpiece W by irradiating it on the workpiece W. In the present embodiment, the description will be given using an example in which the measurement light ML is laser light, but the measurement light ML may be a type of light other than laser light. Furthermore, the wavelength of the measurement light ML may be any wavelength as long as it can measure the workpiece W by irradiating it on the workpiece W. For example, the measurement light ML may be visible light or invisible light (for example, at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The measurement light ML may include pulsed light (for example, pulsed light having an emission time of picoseconds or less). Alternatively, the measurement light ML may not include pulsed light. In other words, the measurement light ML may be continuous light.

[0033] The wavelength of the measurement light ML may be different from the wavelength of the processing light EL. For example, the wavelength of the measurement light ML may be shorter than the wavelength of the processing light EL. As an example, light in the wavelength band of 266 nm or 355 nm may be used as the measurement light ML, and light in the wavelength band of 532 nm, 1 μm, or 10 μm may be used as the processing light EL. In this case, the spot diameter of the measurement light ML on the workpiece W is smaller than the spot diameter of the processing light EL on the workpiece W. As a result, the measurement resolution by the measurement light ML is higher than the processing resolution by the processing light EL. However, the wavelength of the measurement light ML does not have to be shorter than the wavelength of the processing light EL. The wavelength of the measurement light ML may be the same as the wavelength of the processing light EL.

[0034] The measurement light ML is supplied from a measurement light source 22, which is a generation source of the measurement light ML, to the processing device 1 via a light propagation member (e.g., at least one of an optical fiber and a mirror) (not shown). The processing device 1 irradiates the measurement light ML supplied from the measurement light source 22 onto the workpiece W.

[0035] In this embodiment, the measurement light source 22 may include an optical frequency comb light source. The optical frequency comb light source is a light source capable of generating light including frequency components equally spaced on the frequency axis (hereinafter referred to as an "optical frequency comb") as pulsed light. In this case, the measurement light source 22 emits pulsed light including frequency components equally spaced on the frequency axis as the measurement light ML. However, the measurement light source 22 may include a light source different from the optical frequency comb light source.

[0036] In the example shown in FIG. 2, the processing system SYS includes a plurality of measurement light sources 22. For example, the processing system SYS may include a measurement light source 22#1 and a measurement light source 22#2. The plurality of measurement light sources 22 each emit a plurality of measurement light beams ML that are phase-synchronized with each other and have coherence. For example, the plurality of measurement light sources 22 may have different oscillation frequencies. Therefore, the plurality of measurement light beams ML emitted by the plurality of measurement light sources 22 each become a plurality of measurement light beams ML with different pulse frequencies (for example, the number of pulse light beams per unit time, which is the reciprocal of the emission period of the pulse light). As an example, the measurement light source 22#1 may emit a measurement light ML#1 with a pulse frequency of 25 GHz, and the measurement light source 22#2 may emit a measurement light ML#2 with a pulse frequency of 25 GHz+α (for example, +100 kHz). However, the processing system SYS may include a single measurement light source 22.

[0037] The processing device 1 may be capable of measuring the state of the workpiece W using the measurement light ML. The state of the workpiece W may include the position of the workpiece W. The position of the workpiece W may include the position of the surface of the workpiece W. The position of the surface of the workpiece W may include the position of each surface portion obtained by dividing the surface of the workpiece W in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The position of the surface of the workpiece W may include the position of each surface portion obtained by dividing the surface of the workpiece W in at least one of the θX direction, the θY direction, and the θZ direction. Note that the position of each surface portion in at least one of the θX direction, the θY direction, and the θZ direction may be considered to be equivalent to the attitude of each surface portion (that is, the orientation of each surface portion (for example, the direction of the normal of each surface portion), which is substantially equivalent to the amount of inclination of each surface portion with respect to at least one of the X-axis, the Y-axis, and the Z-axis). In this case, it can be said that the state of the workpiece substantially includes the shape of the workpiece W (for example, a three-dimensional shape). The state of the workpiece W may also include the size of the workpiece W (for example, the size in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction).

[0038] In order to process and measure the workpiece W, the processing device 1 includes a processing head 11 that emits a processing light EL and a measurement light ML toward the workpiece W, a head drive system 12 that moves the processing head 11, and a position measurement device 13. Furthermore, the processing head 11 includes a processing optical system 111, a measurement optical system 112, and an emission optical system 113. The structure of the processing head 11 will be described in detail later.

[0039] The head drive system 12 moves the processing head 11 along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction under the control of the control device 4. Note that the head drive system 12 may move the processing head 11 along at least one of the θX direction, the θY direction, and the θZ direction in addition to or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0040] When the machining head 11 moves, the positional relationship between the machining head 11 and a stage 32 (and further, a workpiece W placed on the stage 32), which will be described later, changes. In other words, when the stage 32 moves, the relative positions of the stage 32, the workpiece W, and the machining head 11 change. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the machining head 11 changes, the positional relationship between the stage 32, the workpiece W, and each optical system (that is, at least one of the machining optical system 111, the measurement optical system 112, and the emission optical system 113) provided in the machining head 11 changes. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the machining head 11 changes, the irradiation positions of the machining light EL and the measurement light ML on the workpiece W change.

[0041] The position measuring device 13 is a sensor capable of measuring the position of the machining head 11. The position measuring device 13 may include, for example, at least one of an encoder and a laser interferometer. The control device 4 may move the machining head 11 based on the measurement result by the position measuring device 13. In other words, the control device 4 may change the positional relationship between the stage 32 and the workpiece W and the machining head 11 based on the measurement result by the position measuring device 13.

[0042] The stage device 3 includes a base plate 31, a stage 32, a stage drive system 33, and a position measurement device 34. The base plate 31 is placed on a support surface (not shown). The stage 32 is placed on the base plate 31. A vibration isolation device (not shown) may be installed between the support surface and the base plate 31 to reduce transmission of vibrations of the base plate 31 to the stage 32.

[0043] A workpiece W is placed on the stage 32. The stage 32 may hold the placed workpiece W. For example, the stage 32 may hold the workpiece W by vacuum adsorption and / or electrostatic adsorption of the workpiece W. Alternatively, the stage 32 may not hold the placed workpiece W.

[0044] The stage drive system 33 moves the stage 32 under the control of the control device 4. Specifically, the stage drive system 33 moves the stage 32 relative to at least one of the base 31 and the processing device 1. For example, the stage drive system 33 may move the stage 32 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction under the control of the control device 4.

[0045] When the stage 32 moves, the positional relationship between the stage 32 (and further, the workpiece W placed on the stage 32) and the processing head 11 changes. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the processing head 11 changes, the positional relationship between the stage 32, the workpiece W, and each optical system provided in the processing head 11 changes. Furthermore, when the positional relationship between the stage 32, the workpiece W, and the processing head 11 changes, the irradiation positions on the workpiece W of the processing light EL and the measurement light ML change.

[0046] The position measuring device 34 is a sensor capable of measuring the position of the stage 32. The position measuring device 34 may include, for example, at least one of an encoder and a laser interferometer. The control device 4 may move the stage 32 based on the measurement result by the position measuring device 34. In other words, the control device 4 may change the positional relationship between the stage 32 and the workpiece W and the machining head 11 based on the measurement result by the position measuring device 34.

[0047] The control device 4 controls the operation of the machining system SYS. For example, the control device 4 sets machining conditions for the workpiece W, and controls the machining device 1 and the stage device 3 so that the workpiece W is machined according to the set machining conditions. For example, the control device 4 sets measurement conditions for the workpiece W, and controls the machining device 1 and the stage device 3 so that the workpiece W is measured according to the set measurement conditions.

[0048] The control device 4 may include, for example, a calculation device and a storage device. The calculation device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The control device 4 functions as a device that controls the operation of the machining system SYS by the calculation device executing a computer program. This computer program is a computer program for making the control device 4 (for example, the calculation device) perform (i.e., execute) the operation to be performed by the control device 4, which will be described later. In other words, this computer program is a computer program for making the control device 4 function so as to make the machining system SYS perform the operation to be described later. The computer program executed by the calculation device may be recorded in a storage device (i.e., a recording medium) provided in the control device 4, or may be recorded in any storage medium (for example, a hard disk or a semiconductor memory) built into the control device 4 or externally attachable to the control device 4. Alternatively, the calculation device may download the computer program to be executed from a device external to the control device 4 via a network interface.

[0049] The control device 4 may not be provided inside the processing system SYS. For example, the control device 4 may be provided as a server or the like outside the processing system SYS. In this case, the control device 4 and the processing system SYS may be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface conforming to Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) may be mentioned. As the wireless network, a network using infrared rays may be used. A network using optical communication may be used as the wireless network. In this case, the control device 4 and the processing system SYS may be configured to be able to transmit and receive various information via the network. The control device 4 may also be able to transmit information such as commands and control parameters to the processing system SYS via the network. The processing system SYS may include a receiving device that receives information such as commands and control parameters from the control device 4 via the network. Alternatively, a first control device that performs a part of the processing performed by the control device 4 may be provided inside the processing system SYS, while a second control device that performs another part of the processing performed by the control device 4 may be provided outside the processing system SYS.

[0050] As a recording medium for recording the computer program executed by the arithmetic device, at least one of CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), magnetic medium such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control device 4 by the control device 4 (i.e., a computer) executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 4, or may be realized in a form in which a logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0051] (2) Structure of the machining head 11 Next, an example of the structure of the processing head 11 will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing an example of the structure of the processing head 11.

[0052] 6, the processing head 11 includes a processing optical system 111, a measurement optical system 112, and an emission optical system 113. The processing optical system 111, the measurement optical system 112, and the emission optical system 113 are housed in a housing 114. However, at least one of the processing optical system 111, the measurement optical system 112, and the emission optical system 113 does not have to be housed in the housing 114.

[0053] The processing optical system 111 is an optical system into which the processing light EL emitted from the processing light source 21 is incident. The processing optical system 111 is an optical system that emits the processing light EL incident on the processing optical system 111 toward the emission optical system 113. In other words, the processing optical system 111 is an optical system that guides the processing light EL emitted from the processing light source 21 to the emission optical system 113. The processing light EL emitted by the processing optical system 111 is irradiated onto the workpiece W via the emission optical system 113.

[0054] The processing optical system 111 may include, for example, a position adjustment optical system 1111 and an angle adjustment optical system 1112. The position adjustment optical system 1111 can adjust the emission position of the processing light EL from the processing optical system 111. The position adjustment optical system 1111 may include, for example, a parallel plane plate that can be tilted with respect to the traveling direction of the processing light EL, and the emission position of the processing light EL may be changed by changing the tilt angle of the parallel plane plate. The angle adjustment optical system 1112 can adjust the emission angle of the processing light EL from the processing optical system 111. The angle adjustment optical system 1112 may include, for example, a mirror that can be tilted with respect to the traveling direction of the processing light EL, and the emission angle of the processing light EL may be changed by changing the tilt angle of this mirror. However, the processing optical system 111 may not include at least one of the position adjustment optical system 1111 and the angle adjustment optical system 1112. The processing optical system 111 may include other optical elements or optical members in addition to or instead of at least one of the position adjustment optical system 1111 and the angle adjustment optical system 1112.

[0055] The processing light EL emitted from the processing optical system 111 is incident on the emission optical system 113. The emission optical system 113 includes a beam splitter (for example, a polarizing beam splitter) 1131, a galvanometer mirror 1132, and an fθ lens 1133.

[0056] The beam splitter 1131 emits the processing light EL incident on the beam splitter 1131 toward the galvanometer mirror 1132. In the example shown in Fig. 6, the processing light EL incident on the beam splitter 1131 passes through a polarization separation surface and is emitted toward the galvanometer mirror 1132. For this reason, in the example shown in Fig. 6, the processing light EL is incident on the polarization separation surface of the beam splitter 1131 in a state having a polarization direction that allows it to pass through the polarization separation surface (for example, a polarization direction that becomes p-polarized light with respect to the polarization separation surface).

[0057] The processing light EL emitted from the beam splitter 1131 is incident on the galvanometer mirror 1132. The galvanometer mirror 1132 deflects the processing light EL (i.e., changes the emission angle of the processing light EL) to change the irradiation position of the processing light EL on the workpiece W. For example, the galvanometer mirror 1132 includes an X-scanning mirror 1132X and a Y-scanning mirror 1132Y. Each of the X-scanning mirror 1132X and the Y-scanning mirror 1132Y is an inclination angle variable mirror whose angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1132 is changed. The X-scanning mirror 1132X deflects the processing light EL by swinging or rotating so as to change the irradiation position of the processing light EL on the workpiece W along the X-axis direction (i.e., changes the angle of the X-scanning mirror 1132X with respect to the optical path of the processing light EL). The Y-scanning mirror 1132Y deflects the processing light EL by swinging or rotating to change the irradiation position of the processing light EL on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror 1132Y relative to the optical path of the processing light EL).

[0058] The processing light EL from the galvanometer mirror 1132 is incident on the fθ lens 1133. The fθ lens 1133 is an optical system for irradiating the processing light EL from the galvanometer mirror 1132 onto the workpiece W. In particular, the fθ lens 1133 is an optical system for focusing the processing light EL from the galvanometer mirror 1132 on the workpiece W. Therefore, the fθ lens 1133 irradiates the workpiece W with the processing light EL in a convergent state. As a result, the workpiece W is processed by the processing light EL.

[0059] The measurement optical system 112 is an optical system into which the measurement light ML emitted from the measurement light source 22 is incident. The measurement optical system 112 is an optical system that emits the measurement light ML incident on the measurement optical system 112 toward the emission optical system 113. In other words, the measurement optical system 112 is an optical system that guides the measurement light ML emitted from the measurement light source 22 to the emission optical system 113. The measurement light ML emitted by the measurement optical system 112 is irradiated onto the workpiece W via the emission optical system 113.

[0060] The measurement optical system 112 includes, for example, a mirror 1120, a beam splitter 1121, a beam splitter 1122, a detector 1123, a beam splitter 1124, a mirror 1125, a detector 1126, and a mirror 1127.

[0061] The measurement light ML emitted from the measurement light source 22 is incident on the beam splitter 1121. Specifically, the measurement light ML emitted from the measurement light source 22#1 (hereinafter referred to as “measurement light ML#1”) is incident on the beam splitter 1121. The measurement light ML emitted from the measurement light source 22#2 (hereinafter referred to as “measurement light ML#2”) is incident on the beam splitter 1121 via the mirror 1120. The beam splitter 1121 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1121 toward the beam splitter 1122.

[0062] The beam splitter 1122 reflects measurement light ML#1-1, which is a part of measurement light ML#1 incident on the beam splitter 1122, toward the detector 1123. The beam splitter 1122 emits measurement light ML#1-2, which is the other part of measurement light ML#1 incident on the beam splitter 1122, toward the beam splitter 1124. The beam splitter 1122 reflects measurement light ML#2-1, which is a part of measurement light ML#2 incident on the beam splitter 1122, toward the detector 1123. The beam splitter 1122 emits measurement light ML#2-2, which is the other part of measurement light ML#2 incident on the beam splitter 1122, toward the beam splitter 1124.

[0063] The measurement beams ML#1-1 and ML#2-1 emitted from the beam splitter 1122 are incident on the detector 1123. The detector 1123 detects interference light generated by interference between the measurement beams ML#1-1 and ML#2-1. Specifically, the detector 1123 detects the interference light by receiving the interference light. For this reason, the detector 1123 may be provided with a light receiving element (light receiving unit, typically a photoelectric conversion element) capable of receiving light. The detection result of the detector 1123 is output to the control device 4.

[0064] The measurement beams ML#1-2 and ML#2-2 emitted from the beam splitter 1122 are incident on the beam splitter 1124. The beam splitter 1124 emits at least a portion of the measurement beam ML#1-2 incident on the beam splitter 1124 toward a mirror 1125. The beam splitter 1124 emits at least a portion of the measurement beam ML#2-2 incident on the beam splitter 1124 toward a mirror 1127.

[0065] The measurement light ML#1-2 emitted from the beam splitter 1124 is incident on the mirror 1125. The measurement light ML#1-2 incident on the mirror 1125 is reflected by a reflecting surface of the mirror 1125 (the reflecting surface may be referred to as a reference surface). Specifically, the mirror 1125 reflects the measurement light ML#1-2 incident on the mirror 1125 toward the beam splitter 1124. That is, the mirror 1125 emits the measurement light ML#1-2 incident on the mirror 1125 as the reflected light, that is, the measurement light ML#1-3, toward the beam splitter 1124. The measurement light ML#1-3 emitted from the mirror 1125 is incident on the beam splitter 1124. The beam splitter 1124 emits the measurement light ML#1-3 incident on the beam splitter 1124 toward the beam splitter 1122. The measuring beams ML#1-3 emitted from the beam splitter 1124 are incident on the beam splitter 1122. The beam splitter 1122 emits the measuring beams ML#1-3 incident on the beam splitter 1122 towards the detector 1126.

[0066] On the other hand, the measurement light ML#2-2 emitted from the beam splitter 1124 is incident on the mirror 1127. The mirror 1127 reflects the measurement light ML#2-2 incident on the mirror 1127 toward the emission optical system 113. In other words, the mirror 1127 emits the measurement light ML#2-2 incident on the mirror 1127 toward the emission optical system 113.

[0067] The measurement light ML#2-2 emitted from the mirror 1127 enters the emission optical system 113. The beam splitter 1131 of the emission optical system 113 emits the measurement light ML#2-2 incident on the beam splitter 1131 toward the galvanometer mirror 1132. In the example shown in Fig. 4, the measurement light ML#2-2 incident on the beam splitter 1131 is reflected on the polarization separation surface and is emitted toward the galvanometer mirror 1132. For this reason, in the example shown in Fig. 4, the measurement light ML#2-2 enters the polarization separation surface of the beam splitter 1131 in a state having a polarization direction that can be reflected on the polarization separation surface (for example, a polarization direction that becomes s-polarized light with respect to the polarization separation surface).

[0068] Here, as described above, the processing light EL is incident on the beam splitter 1131 in addition to the measurement light ML#2-2. That is, both the measurement light ML#2-2 and the processing light EL pass through the beam splitter 1131. The beam splitter 1131 emits the processing light EL and the measurement light ML#2-2, which are incident on the beam splitter 1131 from different directions, in the same direction (that is, toward the same galvanometer mirror 1132). Therefore, the beam splitter 1131 essentially functions as a synthesis optical system that synthesizes the processing light EL and the measurement light ML#2-2.

[0069] The measurement light ML#2-2 emitted from the beam splitter 1131 is incident on the galvanometer mirror 1132. The galvanometer mirror 1132 changes the irradiation position of the measurement light ML#2-2 on the workpiece W by deflecting the measurement light ML#2-2. For example, the X-scanning mirror 1132X deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 on the workpiece W along the X-axis direction (i.e., changing the angle of the X-scanning mirror 1132X with respect to the optical path of the measurement light ML#2-2). The Y-scanning mirror 1132Y deflects the measurement light ML#2-2 by swinging or rotating so as to change the irradiation position of the measurement light ML#2-2 on the workpiece W along the Y-axis direction (i.e., changing the angle of the Y-scanning mirror 1132Y with respect to the optical path of the measurement light ML#2-2).

[0070] The measurement light ML#2-2 from the galvanometer mirror 1132 is incident on the fθ lens 1133. The fθ lens 1133 is an optical system for focusing the measurement light ML#2-2 from the galvanometer mirror 1132 on the workpiece W. The fθ lens 1133 is an optical system for irradiating the measurement light ML#2-2 from the galvanometer mirror 1132 onto the workpiece W. The workpiece W is measured by the measurement light ML (specifically, the measurement light ML#2-2).

[0071] Here, as described above, the processing light EL is incident on the galvanometer mirror 1132 in addition to the measurement light ML#2-2. That is, the processing light EL and the measurement light ML#2-2 combined by the beam splitter 1131 are incident on the galvanometer mirror 1132. Therefore, both the measurement light ML#2-2 and the processing light EL pass through the same galvanometer mirror 1132. Therefore, the galvanometer mirror 1132 can synchronously change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W. That is, the galvanometer mirror 1132 can change the irradiation position of the processing light EL on the workpiece W and the irradiation position of the measurement light ML#2-2 on the workpiece W in conjunction with each other.

[0072] When the workpiece W is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is generated from the workpiece W. In other words, when the workpiece W is irradiated with the measurement light ML#2-2, light resulting from the irradiation of the measurement light ML#2-2 is emitted from the workpiece W. The light resulting from the irradiation of the measurement light ML#2-2 (in other words, light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2) may include at least one of the measurement light ML#2-2 reflected by the workpiece W (i.e., reflected light), the scattered light generated by the irradiation of the measurement light ML#2-2 to the workpiece W, the measurement light ML#2-2 diffracted by the workpiece W (i.e., diffracted light), and the measurement light ML#2-2 transmitted through the workpiece W (i.e., transmitted light).

[0073] At least a part of the light emitted from the workpiece W due to the irradiation of the measurement light ML#2-2 (hereinafter, this light is referred to as "measurement light ML#2-3") enters the emission optical system 113. The measurement light ML#2-3 that entered the emission optical system 113 enters the beam splitter 1131 via the fθ lens 1133 and the galvanometer mirror 1132. The beam splitter 1131 emits the measurement light ML#2-3 that entered the beam splitter 1131 toward the measurement optical system 112. In the example shown in FIG. 6, the measurement light ML#2-3 that entered the beam splitter 1131 is reflected at the polarization separation surface and is emitted toward the measurement optical system 112. For this reason, in the example shown in FIG. 6, the measurement light ML#2-3 enters the polarization separation surface of the beam splitter 1131 in a state in which it has a polarization direction that can be reflected at the polarization separation surface.

[0074] The measurement light ML#2-3 emitted from the beam splitter 1131 is incident on a mirror 1127 of the measurement optical system 112. The mirror 1127 reflects the measurement light ML#2-3 incident on the mirror 1127 toward the beam splitter 1124. The beam splitter 1124 emits at least a portion of the measurement light ML#2-3 incident on the beam splitter 1124 toward the beam splitter 1122. The beam splitter 1122 emits at least a portion of the measurement light ML#2-3 incident on the beam splitter 1122 toward the detector 1126.

[0075] As described above, in addition to the measurement light ML#2-3, the measurement light ML#1-3 is incident on the detector 1126. That is, the measurement light ML#2-3 directed toward the detector 1126 via the workpiece W and the measurement light ML#1-3 directed toward the detector 1126 without passing through the workpiece W are incident on the detector 1126. The measurement light ML#1-3 may be referred to as a reference light. The detector 1126 detects interference light generated by interference between the measurement light ML#1-3 and the measurement light ML#2-3. Specifically, the detector 1126 detects the interference light by receiving the interference light. For this reason, the detector 1126 may be provided with a light receiving element (light receiving unit) capable of receiving light. The detection result of the detector 1126 is output to the control device 4.

[0076] The control device 4 calculates the state of the workpiece W based on the detection results of the detector 1123 and the detector 1126. Here, the principle of calculating the state of the workpiece W based on the detection results of the detector 1123 and the detector 1126 will be described with reference to Fig. 7.

[0077] 7 is a timing chart showing the measurement light ML#1-1 incident on the detector 1123, the measurement light ML#2-1 incident on the detector 1123, the interference light detected by the detector 1123, the measurement light ML#1-3 incident on the detector 1126, the measurement light ML#2-3 incident on the detector 1126, and the interference light detected by the detector 1126. Since the pulse frequency of the measurement light ML#1 is different from the pulse frequency of the measurement light ML#2, the pulse frequency of the measurement light ML#1-1 is different from the pulse frequency of the measurement light ML#2-1. Therefore, the interference light between the measurement light ML#1-1 and the measurement light ML#2-1 becomes interference light in which the pulse light appears in synchronization with the timing when the pulse light constituting the measurement light ML#1-1 and the pulse light constituting the measurement light ML#2-1 are simultaneously incident on the detector 1123. Similarly, the pulse frequency of the measurement light ML#1-3 is different from the pulse frequency of the measurement light ML#2-3. Therefore, the interference light between measurement light ML#1-3 and measurement light ML#2-3 becomes interference light in which pulsed light appears in synchronization with the timing when the pulsed light constituting measurement light ML#1-3 and the pulsed light constituting measurement light ML#2-3 are simultaneously incident on detector 1126.

[0078] Here, the position (position on the time axis) of the pulsed light that creates the interference light detected by the detector 1126 varies based on the positional relationship between the processing head 11 and the workpiece W. This is because the interference light detected by the detector 1126 is interference light between the measurement light ML#2-3 that travels toward the detector 1126 via the workpiece W and the measurement light ML#1-3 that travels toward the detector 1126 without travelling through the workpiece W. On the other hand, the position (position on the time axis) of the pulsed light that creates the interference light detected by the detector 1123 does not vary based on the positional relationship between the processing head 11 and the workpiece W. For this reason, it can be said that the time difference between the pulsed light that creates the interference light detected by the detector 1126 and the pulsed light that creates the interference light detected by the detector 1123 indirectly indicates the positional relationship between the processing head 11 and the workpiece W (typically, the distance between the processing head 11 and the workpiece W). For this reason, the control device 4 can calculate the state of the workpiece W based on the time difference between the pulsed light that creates the interference light detected by the detector 1126 and the pulsed light that creates the interference light detected by the detector 1123. Specifically, the control device 4 can calculate the position of the portion of the workpiece W irradiated with the measurement light ML#2-2 based on the time difference between the pulsed light that creates the interference light detected by the detector 1126 and the pulsed light that creates the interference light detected by the detector 1123. That is, the control device 4 can obtain information on the position of the portion of the workpiece W irradiated with the measurement light ML#2-2. Furthermore, if the measurement light ML#2-2 is irradiated to multiple points on the workpiece W and / or if the measurement light ML#2-2 is irradiated so as to scan the surface of the workpiece W, the control device 4 can also calculate the shape of the workpiece W.

[0079] The calculated state of the workpiece W may be used to control the processing system SYS. Specifically, the calculated state of the workpiece W may be used to control the processing device 1. The calculated state of the workpiece W may be used to control the processing head 11. The calculated state of the workpiece W may be used to control the head drive system 12. The calculated state of the workpiece W may be used to control the stage device 3. The calculated state of the workpiece W may be used to control the stage drive system 33.

[0080] For example, the control device 4 may change the relative positional relationship between the workpiece W and the processing head 11 based on the calculated state of the workpiece W so that the relative positional relationship between the workpiece W and the processing head 11 becomes a desired positional relationship. In other words, the control device 4 may control a device capable of changing the relative positional relationship between the workpiece W and the processing head 11 so that the relative positional relationship between the workpiece W and the processing head 11 becomes a desired positional relationship based on the calculated state of the workpiece W. An example of a device capable of changing the relative positional relationship between the workpiece W and the processing head 11 is at least one of the head drive system 12 and the stage drive system 33. Note that an example of the "desired positional relationship" is a positional relationship in which the processing light EL and / or the measurement light ML is irradiated to a desired position on the workpiece W.

[0081] For example, the control device 4 may change the irradiation position of the processing light EL based on the calculated state of the workpiece W so that the processing light EL is irradiated to a desired position on the workpiece W. Examples of devices that can change the irradiation position of the processing light EL include the angle adjustment optical system 1112 of the processing optical system 111, the galvanometer mirror 1132 of the emission optical system 113, the head drive system 12, and the stage drive system 33.

[0082] For example, the control device 4 may change the irradiation position of the measurement light ML based on the calculated state of the workpiece W so that the measurement light ML is irradiated to a desired position on the workpiece W. Examples of devices capable of changing the irradiation position of the measurement light ML include the angle adjustment optical system 1112 of the processing optical system 111, the galvanometer mirror 1132 of the emission optical system 113, the head driving system 12, and the stage driving system 33.

[0083] (3) Riblet structure RB Next, with reference to Fig. 8(a) and Fig. 8(b), the riblet structure RB formed in the workpiece W by the machining system SYS will be described. Fig. 8(a) is a perspective view showing the riblet structure RB, Fig. 8(b) is a cross-sectional view (cross-sectional view VIII-VIII' in Fig. 8(a)) showing the riblet structure RB, and Fig. 8(c) is a top view showing the riblet structure RB. Note that, in particular, the following describes the riblet structure RB formed in a turbine blade BL, which is a specific example of the workpiece W. However, the riblet structure RB formed in a workpiece W other than the turbine blade BL may have a similar structure.

[0084] As shown in Figures 8(a) to 8(c), the riblet structure RB may include a structure in which a plurality of convex structures 8 extending along a first direction along the surface of the turbine blade BL (i.e., at least one surface of the substrate BM and the heat-resistant layer TBC) are arranged along a second direction along the surface of the turbine blade BL and intersecting the first direction. In the example shown in Figures 8(a) to 8(c), the riblet structure RB includes a structure in which a plurality of convex structures 8 extending along the X-axis direction are arranged along the Y-axis direction.

[0085] The convex structures 8 are structures that protrude along a direction intersecting both the direction in which the convex structures 8 extend and the direction in which the convex structures 8 are arranged. The convex structures 8 are structures that protrude from the surface of the turbine blade BL. In the example shown in Fig. 8(a) to Fig. 8(c), the convex structures 8 are structures that protrude along the Z-axis direction.

[0086] A groove 9 that is recessed compared to the surroundings is formed between adjacent convex structures 8. For this reason, the riblet structure RB may include a structure formed by a plurality of grooves 9 extending along a first direction along the surface of the turbine blade BL and arranged along a second direction that is along the surface of the turbine blade BL and intersects the first direction.

[0087] As described above, the processing system SYS of this embodiment forms the riblet structure RB by performing a removal process. For this reason, the processing system SYS may form the riblet structure RB by performing a removal process to remove a portion of the turbine blade BL where the grooves 9 are formed. In other words, the processing system SYS may form the riblet structure RB by performing a removal process to remove a part of the turbine blade BL so as to leave a portion of the turbine blade BL where the convex structures 8 are formed. For example, as shown in FIG. 9(a) which is a cross-sectional view showing the processing light EL irradiated to the turbine blade BL to form the riblet structure RB, and FIG. 9(b) which is a plan view showing the movement trajectory of the irradiation position of the processing light EL on the surface of the turbine blade BL, the processing system SYS may irradiate the processing light EL to the turbine blade BL so that the processing light EL is irradiated to the portion of the surface of the turbine blade BL where the grooves 9 are formed. Specifically, the processing system SYS may form the riblet structure RB by repeating a scanning operation in which the irradiation position of the processing light EL is moved along the X-axis direction along which the grooves 9 extend, while irradiating the surface of the turbine blade BL with the processing light EL, and a stepping operation in which the irradiation position of the processing light EL is moved along the Y-axis intersecting the X-axis direction along which the grooves 9 extend, without irradiating the surface of the turbine blade BL with the processing light EL. In this case, it can be said that the processing system SYS forms the riblet structure RB by forming the grooves 9 (i.e., forms the convex structures 8).

[0088] 8(a) to 8(c), the convex structure 8 has, for example, a pair of side surfaces 81 and 82 facing opposite each other. In the example shown in Fig. 8(a) to 8(c), the convex structure 8 has a side surface 81 facing the -Y side and a side surface 82 facing the +Y side. Each of the pair of side surfaces 81 and 82 is a flat surface. However, at least one of the pair of side surfaces 81 and 82 may include a curved surface.

[0089] The pair of side surfaces 81 and 82 may be non-parallel to each other. In this case, the pair of side surfaces 81 and 82 of the convex structure 8 may be connected via one end thereof (the upper end on the +Z side in the example shown in FIG. 8(a) to FIG. 8(c)). The part where the pair of side surfaces 81 and 82 of the convex structure 8 are connected constitutes the apex 83 of the convex structure 8. In this case, the pair of side surfaces 81 and 82 may be considered to be connected via the apex 83 of the convex structure 8. In the example shown in FIG. 8(a) to FIG. 8(c), the pair of side surfaces 81 and 82 are connected so that the upper end of the side surface 81 and the upper end of the side surface 82 are in contact with each other. In this case, the shape of the cross section including the Z axis of the convex structure 8 is a triangle. However, the shape of the cross section including the Z axis of the convex structure 8 may have any shape other than a triangle. The pair of side surfaces 81 and 82 may be parallel to each other.

[0090] The side surface 81 of one convex structure 8 and the side surface 82 of another convex structure 8 adjacent to the one convex structure 8 along the direction in which the convex structures 8 are arranged may be connected at their other ends (the lower end on the -Z side in the example shown in FIG. 8(a) to FIG. 8(c)). The part where the side surface 81 of the one convex structure 8 and the side surface 82 of the other convex structure 8 are connected constitutes a boundary portion 84 between the one convex structure 8 and the other convex structure 8. In other words, between two adjacent convex structures 8, there is a boundary portion 84 that corresponds to a concave region that is recessed compared to the surroundings. In this case, the two adjacent convex structures 8 may be considered to be connected via the boundary portion 84. In the example shown in FIG. 8(a) to FIG. 8(c), the two adjacent convex structures 8 are connected so that the lower end of the side surface 81 of the one convex structure 8 and the lower end of the side surface 82 of the other convex structure 8 are in contact with each other. In this case, the shape of the cross section of the groove 9 including the Z axis is an inverted triangle shape. However, the shape of the cross section of groove 9 including the Z axis may have any shape other than the inverted triangle shape.

[0091] When the turbine blade BL includes a base material BM and a heat-resistant layer TBC, the processing system SYS may form a riblet structure RB in the heat-resistant layer TBC as shown in Fig. 8(a) to Fig. 8(c). Specifically, the processing system SYS may form the riblet structure RB on the surface of the heat-resistant layer TBC facing away from the base material BM (the upper surface facing the +Z side in the example shown in Fig. 8(a) to Fig. 8(c)). The processing system SYS may form the riblet structure RB on the surface of the heat-resistant layer TBC opposite to the surface facing the base material BM. The processing system SYS may form the riblet structure RB on the surface of the heat-resistant layer TBC that contacts with a fluid during use of the turbine blade BL. In this case, since the processing system SYS does not directly process the base material BM, it is possible to relatively easily re-form the riblet structure RB. Specifically, when re-forming the riblet structure RB, first, the heat-resistant layer TBC on which the riblet structure RB is formed is peeled off once, and then a new heat-resistant layer TBC is formed. Thereafter, the processing system SYS may form a new riblet structure RB on the newly formed heat-resistant layer TBC. Therefore, deterioration of the riblet structure RB (e.g., damage, etc.) can be dealt with relatively easily by re-forming the riblet structure RB. Furthermore, since the processing system SYS does not directly process the substrate BM, it can form the riblet structure RB on the surface of the substrate BM where direct processing is difficult or where the riblet structure RB was not originally formed. In other words, if the processing system SYS processes the heat-resistant layer TBC after the heat-resistant layer TBC is formed on the surface of the substrate BM, the riblet structure RB can be formed relatively easily.

[0092] Alternatively, when the turbine blade BL includes a base material BM and a heat-resistant layer TBC, the processing system SYS may form the riblet structure RB on the base material BM, as shown in FIG. 10, which is a perspective view showing the riblet structure RB. Specifically, the processing system SYS may form the riblet structure RB on the surface of the base material BM facing the heat-resistant layer TBC (in the example shown in the figure, the upper surface facing the +Z side). In this case, as shown in FIG. 10, after the riblet structure RB is formed on the base material BM, the heat-resistant layer TBC may be formed on the surface of the base material BM (particularly, the surface on which the riblet structure RB is formed). Since the heat-resistant layer TBC covers the surface of the base material BM, the shape of the surface of the heat-resistant layer TBC may be approximately the same as the shape of the surface of the base material BM on which the heat-resistant layer TBC is formed. For this reason, the turbine blade BL in which the heat-resistant layer TBC is formed on the base material BM on which the riblet structure RB is formed may be considered to be substantially equivalent to the turbine blade BL in which the riblet structure RB is formed on the heat-resistant layer TBC.

[0093] Alternatively, even when the turbine blade BL has a base material BM but does not have a heat-resistant layer TBC, the processing system SYS may form the riblet structure RB in the base material BM, as shown in Fig. 11, which is a perspective view showing the riblet structure RB. In other words, the heat-resistant layer TBC does not necessarily have to be formed on the base material BM on which the riblet structure RB is formed.

[0094] (4) Modification of the operation for forming the riblet structure RB Next, a modified example of the operation for forming the riblet structure RB will be described.

[0095] (4-1) First modified example of the operation for forming the riblet structure RB In a first modified example, the processing system SYS may form a riblet structure RB in which the shape of at least one of the top 83 of the convex structure 8 and the boundary 84 of the convex structure 8 is different from the shapes shown in Figures 8(a) to 8(c) and Figures 10 to 11 described above. Hereinafter, the riblet structure RB formed in the first modified example will be described with reference to Figures 12 to 18. Each of Figures 12 to 18 is a cross-sectional view showing an example of the riblet structure RB formed in the first modified example.

[0096] As shown in FIG. 12, the processing system SYS may form the riblet structure RB such that the top 83 of the convex structure 8 includes a plane 831. The plane 831 connects one end of a pair of side surfaces 81 and 82 that the convex structure 8 has (in the example shown in FIG. 12, the upper end on the +Z side). That is, the pair of side surfaces 81 and 82 are connected via the plane 831 that constitutes the top 83. Therefore, in the example shown in FIG. 12, the upper end of the side surface 81 and the upper end of the side surface 82 do not directly contact each other. The plane 831 intersects with each of the pair of side surfaces 81 and 82. The plane 831 is a surface facing the opposite side to the substrate BM (in the example shown in FIG. 12, the +Z side, or upward). Therefore, the plane 831 may be referred to as an upper surface.

[0097] As shown in FIG. 13, the processing system SYS may form the riblet structure RB such that the top 83 of the convex structure 8 includes a curved surface 832. The curved surface 832 connects one end of a pair of side surfaces 81 and 82 that the convex structure 8 has (in the example shown in FIG. 13, the upper end on the +Z side). That is, the pair of side surfaces 81 and 82 are connected via the curved surface 832 that constitutes the top 83. Therefore, in the example shown in FIG. 13, the upper end of the side surface 81 and the upper end of the side surface 82 do not directly contact each other. The curved surface 832 intersects with each of the pair of side surfaces 81 and 82. The curved surface 832 is a surface facing the opposite side to the substrate BM (in the example shown in FIG. 13, the +Z side, or upward). Therefore, the curved surface 832 may be referred to as an upper surface. The curved surface 832 may be a curved surface that is convex on the opposite side to the substrate BM.

[0098] As shown in FIG. 14, the processing system SYS may form a riblet structure RB such that the top 83 of the convex structure 8 includes both a plane 831 and a curved surface 832. For example, the top 83 may include a plane 831 and a pair of curved surfaces 832 sandwiching the plane 831. One end of the pair of curved surfaces 832 is connected to one end (e.g., upper end) of a pair of side surfaces 81 and 82 provided on the convex structure 8. Furthermore, the plane 831 connects the other end of the pair of curved surfaces 832. That is, one of the pair of curved surfaces 832 connects the plane 831 and the side surface 81, and the other of the pair of curved surfaces 832 connects the plane 831 and the side surface 82. In this case, the pair of side surfaces 81 and 82 are connected via the plane 831 and the pair of curved surfaces 832 that constitute the top 83. For this reason, in the example shown in FIG. 14, the upper end of the side surface 81 and the upper end of the side surface 82 do not directly contact each other.

[0099] In the examples shown in FIG. 12 to FIG. 14, the size D83 of the top 83 may be set based on the pitch P8 of the convex structures 8. For example, the size D83 of the top 83 may be set to be within a range of at least 1% to 9% (i.e., several%) of the pitch P8 of the convex structures 8. For example, the size D83 of the top 83 may be set to be within a range of at least 1% to 6% of the pitch P8 of the convex structures 8. For example, the size D83 of the top 83 may be set to be within a range of at least 1% to 3% of the pitch P8 of the convex structures 8. Note that the "size D83 of the top 83" in this embodiment may mean the size (typically, the width) of the surface constituting the top 83 in the direction in which the convex structures 8 are arranged. In the example shown in FIG. 12, the size D83 of the top 83 may mean the size in the Y-axis direction of the plane 831 included in the top 83. In the example shown in FIG. 13, the size D83 of the apex 83 may mean the size in the Y-axis direction of the curved surface 832 included in the apex 83. In the example shown in FIG. 14, the size D83 of the apex 83 may mean the sum of the sizes in the Y-axis direction of the flat surface 831 and the pair of curved surfaces 832 included in the apex 83. In addition, the "pitch P8 of the convex structures 8" in this embodiment may mean the interval between two adjacent convex structures 8 in a direction (pitch direction) intersecting the direction in which the convex structures 8 extend. In the example shown in FIG. 12, the "pitch P8 of the convex structures 8" may mean the interval between two adjacent convex structures 8 in the Y-axis direction. Since the convex structures 8 and the grooves 9 are alternately formed in the direction intersecting the direction in which the convex structures 8 extend, the "pitch P8 of the convex structures 8" may be considered to be substantially the same as the "pitch P9 of the grooves 9". In the present embodiment, the "pitch P9 of the grooves 9" may refer to the distance between two adjacent grooves 9 in a direction (pitch direction) intersecting the extension direction of the grooves 9. In the example shown in Fig. 12, the "pitch P9 of the grooves 9" may refer to the distance between two adjacent grooves 9 in the Y-axis direction.

[0100] 13-14, the radius of curvature of curved surface 832 may be set to be within a range of 1 micrometer to 9 micrometers (i.e., several micrometers). The radius of curvature of curved surface 832 may be set to be within a range of 1 micrometer to 6 micrometers. The radius of curvature of curved surface 832 may be set to be within a range of 1 micrometer to 4 micrometers. The radius of curvature of curved surface 832 may be set to be within a range of 1 micrometer to 2 micrometers.

[0101] In this way, when the apex 83 includes at least one of the flat surface 831 and the curved surface 832, the angle of the corner formed at the apex 83 becomes gentler (i.e., larger) than when the apex 83 does not include the flat surface 831 and the curved surface 832 (as a result, the upper end of the side surface 81 and the upper end of the side surface 82 are in direct contact with each other). As a result, the possibility of cracks occurring at the apex 83 is reduced. Therefore, the processing system SYS can form a riblet structure RB with relatively high durability. In particular, the apex 83 including the curved surface 832 may be considered to be substantially equivalent to the apex 83 that has been subjected to chamfering. As a result, when the apex 83 includes the curved surface 832, the possibility of cracks occurring at the apex 83 is even smaller than when the apex 83 includes the flat surface 831. In other words, the processing system SYS can form a riblet structure RB with even higher durability.

[0102] As shown in FIG. 15, the processing system SYS may form the riblet structure RB such that the boundary 84 of the convex structure 8 includes a plane 841. The plane 841 connects two adjacent convex structures 8. That is, the two adjacent convex structures 8 are connected via the plane 841 that constitutes the boundary 84. Specifically, the plane 841 connects the lower end of the side surface 81 of one convex structure 8 to the lower end of the side surface 82 of another convex structure 8 adjacent to the one convex structure 8. For this reason, in the example shown in FIG. 15, the lower end of the side surface 81 of the one convex structure 8 and the lower end of the side surface 82 of the other convex structure 8 do not directly contact each other. The plane 841 intersects each of the pair of side surfaces 81 and 82. The plane 841 is a surface facing the opposite side to the substrate BM (the +Z side, or upward, in the example shown in FIG. 12). For this reason, the plane 841 may be referred to as an upper surface.

[0103] As shown in FIG. 16, the processing system SYS may form a riblet structure RB such that the boundary 84 of the convex structure 8 includes a curved surface 842. The curved surface 842 connects two adjacent convex structures 8. That is, the two adjacent convex structures 8 are connected via the curved surface 842 that constitutes the boundary 84. Specifically, the curved surface 842 connects the lower end of the side surface 81 of one convex structure 8 to the lower end of the side surface 82 of another convex structure 8 adjacent to the one convex structure 8. For this reason, in the example shown in FIG. 16, the lower end of the side surface 81 of one convex structure 8 and the lower end of the side surface 82 of the other convex structure 8 do not directly contact each other. The curved surface 842 intersects each of the pair of side surfaces 81 and 82. The curved surface 842 is a surface facing the opposite side to the substrate BM (the +Z side, or upward, in the example shown in FIG. 12). For this reason, the curved surface 842 may be referred to as an upper surface. The curved surface 842 may be a curved surface that is convex toward the substrate BM side.

[0104] As shown in FIG. 17, the processing system SYS may form a riblet structure RB such that the boundary 84 of the convex structure 8 includes both a plane 841 and a curved surface 842. For example, the boundary 84 may include a plane 841 and a pair of curved surfaces 842. One end of one of the pair of curved surfaces 842 is connected to the other end (e.g., the lower end) of the side surface 81 of the one convex structure 8. The other end of the pair of curved surfaces 842 is connected to the other end (e.g., the lower end) of the side surface 82 of the other convex structure 8 adjacent to the one convex structure 8. Furthermore, the plane 841 connects the other end of the pair of curved surfaces 842. In other words, one of the pair of curved surfaces 842 may connect the plane 841 and the side surface 81 of the one convex structure 8, and the other of the pair of curved surfaces 842 may connect the plane 841 and the side surface 82 of the other convex structure 8. In this case, two adjacent convex structures 8 are connected via a flat surface 841 and a pair of curved surfaces 842 that form the boundary portion 84. For this reason, in the example shown in Fig. 17, the lower end portion of the side surface 81 and the lower end portion of the side surface 82 do not come into direct contact with each other.

[0105] In the example shown in FIG. 17, the sum of the sizes D842 of the pair of curved surfaces 842 (i.e., 2×D842) may be set based on the pitch P8 of the convex structures 8. For example, the sum of the sizes D842 of the pair of curved surfaces 842 may be smaller than the pitch P8 of the convex structures 8. In addition, the "size D842 of the curved surface 842" in this embodiment may mean the size (typically, the width) of the curved surface 842 in the direction in which the convex structures 8 are arranged. In the example shown in FIG. 17, the size D842 of the curved surface 842 may mean the size of the curved surface 842 in the Y-axis direction. Also, in the examples shown in FIG. 16 and FIG. 17, the radius of curvature of the curved surface 842 may be set to be within a range of 1 micrometer to 9 micrometers (i.e., several micrometers). The radius of curvature of the curved surface 842 may be set to be within a range of 1 micrometer to 6 micrometers. The radius of curvature of the curved surface 842 may be set to be within a range of 1 micrometer to 4 micrometers. The radius of curvature of curved surface 842 may be set to be in the range of 1 micrometer to 2 micrometers.

[0106] In this way, when the boundary 84 includes at least one of the flat surface 841 and the curved surface 842, the angle of the corner formed at the boundary 84 becomes gentler than when the boundary 84 does not include the flat surface 841 and the curved surface 842 (as a result, the lower end of the side surface 81 and the lower end of the side surface 82 are in direct contact with each other). As a result, the possibility of cracks occurring at the boundary 84 is reduced. Therefore, the processing system SYS can form a riblet structure RB with relatively high durability. In particular, the boundary 84 including the curved surface 842 may be considered to be substantially equivalent to the boundary 84 that has been subjected to chamfering. As a result, when the boundary 84 includes the curved surface 842, the possibility of cracks occurring at the boundary 84 is further reduced than when the boundary 84 includes the flat surface 841. Therefore, the processing system SYS can form a riblet structure RB with even higher durability.

[0107] As shown in Fig. 18, the processing system SYS may form a riblet structure RB such that the top 83 of the convex structure 8 includes at least one of a flat surface 831 and a curved surface 832, and the boundary portion 84 of the convex structure 8 includes at least one of a flat surface 841 and a curved surface 842. Fig. 18 shows a riblet structure RB in which the top 83 includes a flat surface 831 and a pair of curved surfaces 832, and the boundary portion 84 includes a flat surface 841 and a pair of curved surfaces 842. Even in this case, the processing system SYS can form a riblet structure RB with even higher durability.

[0108] 12 to 18 show an example in which the processing system SYS forms a riblet structure RB in the heat-resistant layer TBC. However, the processing system SYS may form a riblet structure RB having a shape shown in Fig. 12 to 18 in the substrate BM. Even in this case, the processing system SYS can form a riblet structure RB with relatively high durability.

[0109] 12 to 18 is formed on the base material BM, the angle of the corner formed in at least one of the apex 83 and the boundary 84 of the convex structure 8 forming the riblet structure RB becomes gentle, as described above. As a result, the adhesion of the heat-resistant layer TBC to the corner is improved compared to when the angle of the corner formed in at least one of the apex 83 and the boundary 84 is relatively steep (i.e., relatively small).

[0110] In addition, when the angle of the corner formed at least one of the apex 83 and the boundary 84 is gentle, it is possible to obtain an effect that the surface treatment of the substrate BM on which the riblet structure RB is formed is more likely to be performed appropriately, compared with a case in which the angle of the corner formed at least one of the apex 83 and the boundary 84 is relatively steep. For example, it is possible to obtain an effect that the surface of the substrate BM on which the riblet structure RB is formed is more likely to be appropriately quenched, which is an example of surface treatment. As a result, when an arbitrary coating layer is formed on the substrate BM by performing a surface treatment such as quenching on the surface of the substrate BM as described later, it is possible to obtain an effect that the arbitrary coating layer is more likely to be appropriately formed on the substrate BM on which the riblet structure RB is formed.

[0111] (4-2) Second modified example of the operation for forming the riblet structure RB In a second modified example, the machining system SYS may form a riblet structure RB on a turbine blade BL in which grooves 7 different from the grooves 9 for forming the riblet structure RB are formed. Here, the turbine blade BL in which the grooves 7 are formed will be described with reference to Figures 19(a) and 19(b). Figure 19(a) is a cross-sectional view showing the turbine blade BL in which the grooves 7 are formed, and Figure 19(b) is a top view showing the turbine blade BL in which the grooves 7 are formed.

[0112] As shown in FIG. 19(a) and FIG. 19(b), the turbine blade BL may have a groove 7 formed therein that extends along a direction along the surface of the turbine blade BL. For example, the turbine blade BL may have a single groove 7 formed therein that extends along a third direction along the surface of the turbine blade BL. For example, the turbine blade BL may have a plurality of grooves 7 formed therein that extend along the third direction along the surface of the turbine blade BL. The plurality of grooves 7 extending along the third direction may be arranged along a fourth direction intersecting the third direction. For example, the turbine blade BL may have a plurality of grooves 7 formed therein that extend along a plurality of different directions along the surface of the turbine blade BL. For example, the turbine blade BL may have at least one groove 7 formed therein that extends along a third direction along the surface of the turbine blade BL, and at least one groove 7 formed therein that extends along a fourth direction that is a direction along the surface of the turbine blade BL and intersects the third direction. In the example shown in Figures 19(a) and 19(b), the turbine blade BL is formed with a plurality of grooves 7 extending along the X-axis direction and arranged along the Y-axis direction (hereinafter, the grooves 7 extending along the X-axis direction will be referred to as "grooves 7X"), and a plurality of grooves 7 extending along the Y-axis direction and arranged along the X-axis direction (hereinafter, the grooves 7 extending along the Y-axis direction will be referred to as "grooves 7Y").

[0113] The depth D7 of the groove 7 (in the example shown in FIG. 19(a), the size along the Z-axis direction) may be set based on the thickness D of the heat-resistant layer TBC in which the groove 7 is formed (in the example shown in FIG. 19(a), the size along the Z-axis direction). For example, the depth D7 of the groove 7 may be set to be smaller than the thickness D9 of the heat-resistant layer TBC. The depth D7 of the groove 7 may be set to be 30% or less of the thickness D9 of the heat-resistant layer TBC. For example, when the thickness D9 of the heat-resistant layer TBC is 300 micrometers to 1 millimeter, the depth D7 of the groove 7 may be set to be 90 micrometers (=300 micrometers×30%) to 300 micrometers (=1 millimeter×30%) or less.

[0114] When a plurality of grooves 7 are formed, the depths D7 of the plurality of grooves 7 may be the same as each other. Alternatively, the depths D7 of at least two of the plurality of grooves 7 may be different from each other. For example, the depth of the groove 7 formed in a first portion of the surface of the turbine blade BL may be different from the depth of the groove 7 formed in a second portion of the surface of the turbine blade BL. For example, the depth D7 of the groove 7 extending along the third direction may be different from the depth D7 of the groove 7 extending along a fourth direction intersecting the third direction.

[0115] When a plurality of grooves 7 are formed, the plurality of grooves 7 may be formed so as to be arranged at the same pitch P7. In addition, in the present embodiment, the "pitch P7 of the grooves 7" may mean the interval between two adjacent grooves 7 in a direction (pitch direction) intersecting the direction in which the grooves 7 extend. In the example shown in FIG. 19, the "pitch P7 of the grooves 7X" may mean the interval between two adjacent grooves 7X in the Y-axis direction. The "pitch P7 of the grooves 7Y" may mean the interval between two adjacent grooves 7X in the X-axis direction. Alternatively, the plurality of grooves 7 may be formed so as to be arranged at different pitches P7. For example, the pitch P7 of the grooves 7 extending along the third direction may be different from the pitch P7 of the grooves 7 extending along the fourth direction. For example, the pitch P7 of the grooves 7 formed in the third portion of the surface of the turbine blade BL may be different from the pitch P7 of the grooves 7 formed in the fourth portion of the turbine blade BL.

[0116] The groove 7 may be a groove capable of relaxing the stress of the turbine blade BL. That is, the groove 7 may have a function of relaxing the stress of the turbine blade BL. In particular, since the groove 7 is formed in the heat-resistant layer TBC, the groove 7 may be a groove capable of relaxing the stress of the heat-resistant layer TBC. For example, when the temperature of the heat-resistant layer TBC changes, the heat-resistant layer TBC may expand or contract. The groove 7 may be a groove that relaxes the stress generated in the heat-resistant layer TBC due to the expansion and contraction of the heat-resistant layer TBC. For example, in this case, if the heat-resistant layer TBC is deformed so that the width of the groove 7 changes according to the expansion and contraction of the heat-resistant layer TBC, the stress generated in the heat-resistant layer TBC due to the expansion and contraction of the heat-resistant layer TBC is involved. As a result, the possibility that the heat-resistant layer TBC is damaged by the stress is relatively small. Therefore, it is possible to manufacture a turbine blade BL having a relatively high resistance to stress and an appropriately reduced resistance to fluid.

[0117] The grooves 7 may be formed by a processing system different from the processing system SYS. For example, the grooves 7 may be formed by another processing system capable of forming the grooves 7 by laser cutting or laser etching. The processing system SYS may form the above-mentioned riblet structure RB on the turbine blade BL on which the grooves 7 have been formed by the other processing system under the control of the control device 4. In this case, the processing system SYS may form the riblet structure RB based on information on the grooves 7 that have already been formed. For example, the processing system SYS may measure the grooves 7 that have already been formed using the measurement light ML, and form the riblet structure RB based on information on the measurement results of the grooves 7 by the measurement light ML. As a specific example, the processing system SYS may identify the position of the grooves 7 on the surface of the turbine blade BL (for example, the surface of the heat-resistant layer TBC) based on information on the measurement results of the grooves 7 by the measurement light ML, and form the riblet structure RB by irradiating the processing light EL to a position that has a predetermined positional relationship with the identified position of the grooves 7. In other words, the information on the measurement results of the grooves 7 may be used as information for controlling the irradiation position of the processing light EL (so-called servo information).

[0118] Alternatively, the grooves 7 may be formed by the processing system SYS. That is, the processing system SYS may form the grooves 7 by removal processing using the processing light EL under the control of the control device 4, similar to the case of forming the grooves 9 for forming the riblet structure RB. In this case, the processing system SYS may form the riblet structure RB after forming the grooves 9 under the control of the control device 4. Alternatively, the processing system SYS may form the grooves 7 after forming the riblet structure RB under the control of the control device 4.

[0119] When forming a riblet structure RB on the turbine blade BL in which the grooves 7 are formed (or forming a riblet structure RB on the turbine blade BL before forming the grooves 7), the processing system SYS may form a riblet structure RB that satisfies the following structural conditions. Hereinafter, the structural conditions that the riblet structure RB should satisfy will be described with reference to Figs. 20 to 22. Fig. 20 is a cross-sectional view showing a turbine blade BL in which both the grooves 7 and the riblet structure RB are formed. Fig. 21 is a perspective view showing a turbine blade BL in which both the grooves 7 and the riblet structure RB are formed. Fig. 22 is a top view showing a turbine blade BL in which both the grooves 7 and the riblet structure RB are formed. In the example shown in Figs. 20 to 22, the processing system SYS forms a riblet structure RB in which the apex 83 includes a flat surface 831 and the boundary 84 includes a flat surface 841 and satisfies the structural conditions (i.e., a riblet structure RB that includes the apex 83 shown in Fig. 12 and the boundary 84 shown in Fig. 15 and satisfies the structural conditions). However, the processing system SYS may form a riblet structure RB that includes a top portion 83 having a shape different from the shape shown in FIG. 12 and / or a boundary portion 84 having a shape different from the shape shown in FIG. 15 and satisfies the structural conditions described below.

[0120] The structural condition may include a depth condition regarding the depth D9 of the groove 9 forming the riblet structure RB. For example, the depth condition may include a first depth condition regarding the depth D9 of the groove 9 itself. The first depth condition may include a condition that the depth D9 of the groove 9 is 1 micrometer to 99 micrometers (i.e., several micrometers to several tens of micrometers). For example, the depth condition may include a second depth condition regarding the relationship between the depth D9 of the groove 9 and the thickness D of the heat-resistant layer TBC in addition to or instead of the first depth condition. The second depth condition may include a condition that the depth D9 of the groove 9 is smaller than the thickness D of the heat-resistant layer TBC as shown in FIG. 20 and FIG. 21. The second depth condition may include a condition that the depth D9 of the groove 9 is 0.2% or more and 20% or less of the thickness D of the heat-resistant layer TBC. For example, the depth condition may include a third depth condition regarding the relationship between the depth D9 of the groove 9 and the depth D7 of the groove 7 in addition to or instead of at least one of the first and second depth conditions. The third depth condition may include a condition that the depth D9 of the groove 9 is different from the depth D7 of the groove 7, as shown in Figs. 20 and 21. The third depth condition may include a condition that the depth D9 of the groove 9 is smaller than the depth D7 of the groove 7 (i.e., the groove 9 is shallower than the groove 7), as shown in Figs. 20 and 21. In other words, the third depth condition may include a condition that the depth D7 of the groove 7 is larger than the depth D9 of the groove 9 (i.e., the groove 7 is deeper than the groove 9), as shown in Figs. 20 and 21. The third depth condition may include a condition that the depth D7 of the groove 7 is 1.5 times or more and 15 times or less than the depth D9 of the groove 9.

[0121] Here, when the third depth condition (particularly, the condition that the depth D9 of the groove 9 is smaller than the depth D7 of the groove 7) among the depth conditions is satisfied, the effect of the riblet structure RB (i.e., the effect of reducing the resistance of the surface of the turbine blade BL to the fluid) is less likely to be hindered by the groove 9. Specifically, as shown in FIG. 23, if the depth D9 of the groove 9 is larger than the depth D7 of the groove 7, the bottom 71 of the groove 7 is located higher than the bottom of the groove 9 (i.e., the boundary portion 84). As a result, a partition wall 72 with the bottom 71 of the groove 7 as the upper surface appears between the multiple convex structures 8. As shown in FIG. 23, this partition wall 72 may block the fluid flowing between the multiple convex structures 8 (i.e., inside the groove 9) along the multiple convex structures 8. In other words, the partition wall 72 may disturb the flow of the fluid along the convex structures 8 as shown in FIG. 23. In particular, when the extending direction of the convex structures 8 and the extending direction of the grooves 7 intersect, the partitions 72 are more likely to disturb the flow of the fluid along the convex structures 8. However, when the depth D9 of the grooves 9 is smaller than the depth D7 of the grooves 7, as shown in FIG. 21, the partitions 72 with the bottoms 71 of the grooves 7 as their upper surfaces do not appear between the multiple convex structures 8. As a result, as shown in FIG. 21, the flow of the fluid flowing between the multiple convex structures 8 (i.e., inside the grooves 9) along the multiple convex structures 8 is less likely to be disturbed by the partitions 72. Therefore, the effect of reducing the resistance of the surface of the turbine blade BL to the fluid by the riblet structure RB can be appropriately enjoyed. Note that when the extending direction of the convex structures 8 and the extending direction of the grooves 7 are parallel, the grooves 7 form parts of different heights (for example, structures with different heights from the convex structures 8) in the riblet structure RB composed of the multiple convex structures 8, and this may reduce the effect of the riblet structure RB.

[0122] The structural condition may include a pitch condition regarding the pitch P9 of the grooves 9 forming the riblet structure RB. The pitch condition may include a condition regarding the relationship between the pitch P9 of the grooves 9 and the pitch P7 of the grooves 7. In particular, the pitch condition may include a condition regarding the relationship between the pitch P9 of the grooves 9 in one direction and the pitch P7 of the grooves 7 in the same one direction. In the example shown in FIG. 20 and FIG. 22, the pitch condition may include a condition regarding the relationship between the pitch P9 of the grooves 9 in the Y-axis direction and the pitch P7 of the grooves 7 in the Y-axis direction. However, the pitch condition may include a condition regarding the relationship between the pitch P9 of the grooves 9 in one direction and the pitch P7 of the grooves 7 in another direction different from the one direction. In the example shown in FIG. 20 and FIG. 22, the pitch condition may include a condition regarding the relationship between the pitch P9 of the grooves 9 in the Y-axis direction and the pitch P7 of the grooves 7 in the X-axis direction. For example, the pitch condition may include a condition that the pitch P9 of the grooves 9 is different from the pitch P7 of the grooves 7. For example, the pitch condition may include a condition that the pitch P7 of the grooves 7 is greater than the pitch P9 of the grooves 9. For example, the pitch condition may include a condition that the pitch P7 of the grooves 7 is greater than or equal to twice the pitch P9 of the grooves 9. When the condition that the pitch P7 of the grooves 7 is greater than or equal to twice the pitch P9 of the grooves 9 is satisfied, as shown in Figs. 20 and 22, two or more grooves 9 are formed between two adjacent grooves 7 along a direction intersecting the direction in which the grooves 7 extend (i.e., the short direction of the grooves 7). In this case, the pitch condition may include a condition that the pitch P7 of the grooves 7 and the pitch P9 of the grooves 9 are set so that two or more grooves 9 are formed between two adjacent grooves 7 along a direction intersecting the direction in which the grooves 7 extend. For example, the pitch condition may include a condition that the pitch P7 of the grooves 7 is greater than or equal to 20 times and less than or equal to 30 times the pitch P9 of the grooves 9. In other words, the pitch condition may include a condition that the pitch P7 of the grooves 7 and the pitch P9 of the grooves 9 are set such that 20 to 30 grooves 9 are formed between two adjacent grooves 7 along a direction intersecting the extension direction of the grooves 7. For example, the pitch condition may include a condition that the pitch P7 of the grooves 7 is an integer multiple of the pitch P9 of the grooves 9.When the condition that the pitch P7 of the grooves 7 is an integer multiple of the pitch P9 of the grooves 9 is satisfied, an integer number of grooves 9 are formed between two adjacent grooves 7 along a direction intersecting the extension direction of the grooves 7. In this case, the machining system SYS can relatively easily form a riblet structure RB having a regular structure on the turbine blade BL in which the grooves 7 are formed.

[0123] The structural condition may include a width condition regarding the width W9 of the groove 9 forming the riblet structure RB. The width condition may include a condition regarding the relationship between the width W9 of the groove 9 and the width W7 of the groove 7. In addition, the "width W9 of the groove 9" in this embodiment may mean the size of the groove 9 in a direction intersecting the direction in which the groove 9 extends (i.e., the short-side direction of the groove 9). Similarly, the "width W7 of the groove 7" in this embodiment may mean the size of the groove 7 in a direction intersecting the direction in which the groove 7 extends (i.e., the short-side direction of the groove 7). For example, the width condition may include a condition that the width W9 of the groove 9 and the width W7 of the groove 7 are different. For example, the width condition may include a condition that the width W7 of the groove 7 is wider than the width W9 of the groove 9. For example, the width condition may include a condition that the width W7 of the groove 7 is in a range of 1 to 10 times the width W9 of the groove 9.

[0124] The structural condition may include an extension direction condition regarding the extension direction of the groove 9 forming the riblet structure RB. The extension direction condition may include a condition regarding the relationship between the extension direction of at least one groove 9 and the extension direction of at least one groove 7. In addition, the "extension direction of the groove 9" in this embodiment may mean the extension direction of the groove 9 along the surface of the turbine blade BL (for example, the surface of the heat-resistant layer TBC) on which the groove 9 is formed. Similarly, the "extension direction of the groove 7" in this embodiment may mean the extension direction of the groove 7 along the surface of the turbine blade BL (for example, the surface of the heat-resistant layer TBC) on which the groove 7 is formed. For example, the extension direction condition may include a condition that the extension direction of at least one groove 9 and the extension direction of at least one groove 7 are the same. In other words, the extension direction condition may include a condition that the extension direction of at least one groove 9 and the extension direction of at least one groove 7 are parallel to each other. For example, the extension direction condition may include a condition that the direction in which at least one groove 9 extends is different from the direction in which at least one groove 7 extends. In other words, the extension direction condition may include a condition that the direction in which at least one groove 9 extends intersects with the direction in which at least one groove 7 extends. In particular, the extension direction condition may include a condition that the direction in which at least one groove 9 extends is perpendicular to the direction in which at least one groove 7 extends. In the example shown in Fig. 21 and Fig. 22, the extension direction condition includes a condition that, in a situation in which at least one groove 7X extends along the X-axis direction and at least one groove 7Y extends along the Y-axis direction, the extension direction of each of the multiple grooves 9 is the same as the extension direction of the groove 7X (i.e., the X-axis direction). However, the extension direction condition may include a condition that, under a situation in which at least one groove 7 extends along the X-axis direction and at least one groove 7 extends along the Y-axis direction, at least one of the multiple grooves 9 extends along at least one of the X-axis direction and the Y-axis direction.

[0125] The structural condition may also include a pitch direction condition regarding the pitch direction of the grooves 9 forming the riblet structure RB. The pitch direction condition may include a condition regarding the relationship between the pitch direction of the grooves 9 and the pitch direction of the grooves 7. In addition, the "pitch direction of the grooves 9" in this embodiment may mean the pitch direction along the surface of the turbine blade BL (for example, the surface of the heat-resistant layer TBC) on which the grooves 9 are formed. Similarly, the "pitch direction of the grooves 7" in this embodiment may mean the pitch direction along the surface of the turbine blade BL (for example, the surface of the heat-resistant layer TBC) on which the grooves 7 are formed. For example, the pitch direction condition may include a condition that the pitch direction of the grooves 9 and the pitch direction of the grooves 7 are the same. In other words, the pitch direction condition may include a condition that the pitch direction of the grooves 9 and the pitch direction of the grooves 7 are parallel. For example, the pitch direction condition may include a condition that the pitch direction of the grooves 9 and the pitch direction of the grooves 7 are different. In other words, the pitch direction condition may include a condition that the pitch direction of the grooves 9 and the pitch direction of the grooves 7 intersect. In particular, the pitch direction condition may include a condition that the pitch direction of the plurality of grooves 9 is perpendicular to the pitch direction of the plurality of grooves 7. In the example shown in Fig. 21 and Fig. 22, the pitch direction condition includes a condition that, when the pitch direction of the plurality of grooves 7X is the Y-axis direction and the pitch direction of the plurality of grooves 7Y is the X-axis direction, the pitch direction of each of the plurality of grooves 9 is the same as the pitch direction of the groove 7X (i.e., the Y-axis direction). However, the pitch direction condition may also include a condition that, when the pitch direction of the plurality of grooves 7 is the X-axis direction and the pitch direction of the plurality of grooves 7 is the Y-axis direction, the pitch direction of the plurality of grooves 9 is the same as at least one of the X-axis direction and the Y-axis direction.

[0126] The above-described structural conditions are examples of conditions set from the viewpoint of manufacturing a turbine blade BL having a relatively high resistance to stress and an appropriately reduced resistance to fluids, for example. Therefore, when the structural conditions are satisfied, the turbine blade BL has a relatively high resistance to stress and / or has a low resistance to fluids, compared to when the structural conditions are not satisfied.

[0127] When a plurality of grooves 7 are formed, as shown in FIG. 22, the surface of the turbine blade BL (for example, the surface of the heat-resistant layer TBC) can be divided into a plurality of surface regions SA by the plurality of grooves 7. In this case, the structural conditions for the grooves 9 formed in the first surface region SA of the plurality of surface regions SA may be the same as the structural conditions for the grooves 9 formed in the second surface region SA different from the first surface region SA of the plurality of surface regions SA. As described above, the structural conditions are conditions for at least one of the depth W9, pitch P9, width W9, pitch direction, and extension direction of the grooves 9. At least one of the depth W9, pitch P9, width W9, pitch direction, and extension direction of the grooves 9 is an example of the characteristics of the grooves 9. Therefore, the characteristics of the grooves 9 formed in the first surface region SA of the plurality of surface regions SA may be the same as the characteristics of the grooves 9 formed in the second surface region SA of the plurality of surface regions SA. Note that FIG. 22 shows an example in which the structural conditions are the same in all of the plurality of surface regions SA.

[0128] Alternatively, the structural conditions for the grooves 9 formed in the first surface area SA of the multiple surface areas SA may be different from the structural conditions for the grooves 9 formed in the second surface area SA of the multiple surface areas SA. That is, the characteristics of the grooves 9 formed in the first surface area SA of the multiple surface areas SA may be different from the characteristics of the grooves 9 formed in the second surface area SA of the multiple surface areas SA. For example, as shown in FIG. 24, which is a top view showing a turbine blade BL on which both the grooves 7 and the riblet structure RB are formed, the pitch P9 of the grooves 9 formed in the surface areas SA#1 to SA#3 may be different from the pitch P9 of the grooves 9 formed in the surface areas SA#4 to SA#6. As shown in FIG. 24, the direction in which the grooves 9 formed in the surface areas SA#1 to SA#3 extend may be different from the direction in which the grooves 9 formed in the surface areas SA#4 to SA#6 extend. Furthermore, as shown in FIG. 24, the pitch direction of the plurality of grooves 9 formed in surface regions SA#1 to SA#3 may be different from the pitch direction of the plurality of grooves 9 formed in surface regions SA#4 to SA#6.

[0129] 25, which is a top view showing a turbine blade BL on which both the groove 7 and the riblet structure RB are formed, the pitch P9 of the grooves 9 formed in the surface region SA#1 may be different from the pitch P9 of the grooves 9 formed in the surface region SA#2 adjacent in the extension direction of the grooves 9 in the surface region SA#1. The extension direction (or pitch direction) of the grooves 9 formed in the surface region SA#2 may be different from the extension direction (or pitch direction) of the grooves 9 formed in the surface region SA#3 adjacent in the extension direction of the grooves 9 in the surface region SA#2. The extension direction (or pitch direction) of the grooves 9 formed in the surface region SA#2 may be different from the extension direction (or pitch direction) of the grooves 9 formed in the surface region SA#5 adjacent in the direction (pitch direction) intersecting the extension direction of the grooves 9 formed in the surface region SA#2. Furthermore, the extension direction (or pitch direction) and pitch P9 of the grooves 9 formed in the surface region SA#5 may be different from the extension direction (or pitch direction) and pitch P9 of the grooves 9 formed in the adjacent surface region SA#6 in the extension direction of the grooves 9 in the surface region SA#5.

[0130] The structural conditions applied to each surface region SA (in other words, the characteristics of the grooves 9) may be set according to the characteristics of the fluid in contact with each surface region SA. For example, the structural conditions applied to each surface region SA (in other words, the characteristics of the grooves 9) may be set to conditions (characteristics) that can reduce the resistance of each surface region SA to the fluid in contact with each surface region SA. As a result, it is possible to manufacture a turbine blade BL in which the resistance to the fluid is appropriately reduced, compared to a case in which the structural conditions applied to a plurality of surface regions SA (in other words, the characteristics of the grooves 9) are the same.

[0131] 19 to 24 show an example in which grooves 7 are formed in the heat-resistant layer TBC. However, the grooves 7 may be formed in the base material BM. In this case, the processing system SYS may form a riblet structure RB in the base material BM in which the grooves 7 are formed. Alternatively, the processing system SYS may form the riblet structure RB in the base material BM and then form the grooves 7 in the base material BM. Even in this case, the processing system SYS may form the riblet structure RB in the base material BM so as to satisfy the above-mentioned structural conditions.

[0132] Also, the heat-resistant layer TBC does not necessarily have to have the grooves 7 formed therein as shown in Fig. 26. In Fig. 26, lines indicating the boundaries between the surface regions SA#1 to SA#6 are shown for ease of understanding, but these lines are imaginary.

[0133] (5) Variations The processing system SYS may be provided with a processing head that irradiates the workpiece W with processing light EL but does not irradiate the workpiece W with measurement light ML, and a measurement head that irradiates the workpiece W with measurement light ML but does not irradiate the workpiece W with processing light EL.

[0134] In the above description, the processing system SYS is provided with an emission optical system 113 that emits both the processing light EL and the measurement light ML toward the workpiece W. However, the processing system SYS may be provided with a separate emission optical system 113 that emits the processing light EL toward the workpiece W, and an emission optical system 113 that emits the measurement light ML toward the workpiece W. In this case, each emission optical system 113 does not need to be provided with a beam splitter 1131 that combines the processing light EL and the measurement light ML.

[0135] In the above description, the processing apparatus 1 is capable of measuring the workpiece W. However, the processing apparatus 1 does not necessarily have to be capable of measuring the workpiece W. In this case, the processing apparatus 1 does not necessarily have to include the measurement optical system 112. The processing system SYS does not necessarily have to include the measurement light source 22.

[0136] In the above description, the processing apparatus 1 includes the head drive system 12. However, the processing apparatus 1 does not necessarily have to include the head drive system 12. In other words, the processing head 11 does not necessarily have to be movable. In this case, the processing apparatus 1 does not necessarily have to include the position measurement device 13.

[0137] In the above description, the stage device 3 is provided with the stage drive system 33. However, the stage device 3 does not have to be provided with the stage drive system 33. In other words, the stage 32 does not have to be movable. In this case, the stage device 3 does not have to be provided with the position measurement device 34.

[0138] In the above description, the processing system SYS processes a turbine blade BL including a substrate BM and a heat-resistant layer TBC. However, the processing system SYS may process a turbine blade BL including a substrate BM and an arbitrary coating layer formed on the substrate BM and different from the heat-resistant layer TBC. In this case, the processing system SYS may form a riblet structure RB in the arbitrary coating layer. For example, the processing system SYS may form a riblet structure RB including at least one of the apex 83 and the boundary 84 described with reference to Figs. 12 to 18 in the arbitrary coating layer. For example, the processing system SYS may form a riblet structure RB in an arbitrary coating layer in which a groove 9 different from the groove 7 forming the riblet structure RB is formed. For example, the processing system SYS may form a riblet structure RB and a groove 9 different from the groove 7 forming the riblet structure RB in an arbitrary coating layer. For example, an arbitrary coating layer may be formed on the substrate BM on which the processing system SYS has formed the riblet structure RB. Note that, as an example of an arbitrary coating layer, a protective layer for protecting the substrate BM may be given.

[0139] Any coating layer formed on the substrate BM may include a layer newly formed by adding a material to the substrate BM. Alternatively, any coating layer formed on the substrate BM may include a layer corresponding to a part of the substrate BM whose properties have been changed. In other words, any coating layer may include a layer corresponding to a part of the substrate BM whose properties have been changed, which is newly formed by changing the properties of a part of the substrate BM so as to be in contact with a part of the substrate BM whose properties have not been changed. In other words, the part of the substrate BM whose properties have been changed may be used as the coating layer, and the part of the substrate BM whose properties have not been changed may be used as the substrate BM. An example of a layer corresponding to a part of the substrate BM whose properties have been changed is a part whose properties have been changed by quenching. In this case, the coating layer may be formed by surface treatment of the surface of the substrate BM. An example of the surface treatment is quenching. The quenching may include at least one of, for example, high-frequency quenching, flame quenching, laser quenching, and electron beam quenching. The coating layer formed by such quenching is harder than the part of the substrate BM whose properties have not been changed by quenching. Quenching can be said to be a specific example of a surface hardening treatment for hardening the surface of the substrate BM. In this case, the coating layer can function as a protective layer for protecting the surface of the substrate BM.

[0140] In the above description, the processing system SYS processes an axial-flow turbine blade BL. However, as shown in Fig. 27, the processing system SYS may process a radial-flow turbine blade BL. In Fig. 27, as shown by arrows F1 and F2, a fluid enters the turbine blade BL parallel to the rotation axis 120 of the turbine blade BL and exits from the outlet portion 160 in a direction intersecting the rotation axis 120.

[0141] Even in this case, the riblet structure RB can be divided into a plurality of surface regions SA. The structural conditions for the grooves 9 formed in the first surface region SA#1 of the plurality of surface regions SA may be the same as the structural conditions for the grooves 9 formed in the second surface region SA#2 different from the first surface region SA#1 of the plurality of surface regions SA. As described above, the structural conditions are conditions for at least one of the depth W9, pitch P9, width W9, pitch direction, and extension direction of the grooves 9. At least one of the depth W9, pitch P9, width W9, pitch direction, and extension direction of the grooves 9 is an example of the characteristics of the grooves 9. Therefore, the characteristics of the grooves 9 formed in the first surface region SA of the plurality of surface regions SA may be the same as the characteristics of the grooves 9 formed in the second surface region SA of the plurality of surface regions SA. The structural conditions for the grooves 9 formed in the first surface region SA#1 of the plurality of surface regions SA may be different from the structural conditions for the grooves 9 formed in the third surface region SA#3 of the plurality of surface regions SA. Here, the partition shapes of the multiple surface areas SA#1 to SA#4 do not have to be rectangular as shown in FIG.

[0142] In the above description, the processing system SYS processes a turbine blade BL, which is an example of the workpiece W. However, the processing system SYS may process an arbitrary blade, which is different from the turbine blade BL and is another example of the workpiece W. The arbitrary blade may have a base material and an arbitrary coating layer formed on the surface of the base material, similar to the above-mentioned turbine blade BL. In this case, for example, the processing system SYS may form a riblet structure RB on an arbitrary blade different from the turbine blade BL. That is, the processing system SYS may form a riblet structure RB on at least one of the base material and the coating layer of the arbitrary blade. An example of the arbitrary blade is a blade that constitutes the blade of a propeller. A propeller is a member that converts a rotational force output from a prime mover, which includes at least one of an engine and a motor, into a propulsive force of a moving body, which includes at least one of an airplane and a ship.

[0143] Alternatively, the machining system SYS may machine an arbitrary object that is different from a blade and is another example of the workpiece W. The arbitrary object may include a substrate and an arbitrary coating layer formed on the surface of the substrate, similar to the above-mentioned turbine blade BL. In this case, for example, the machining system SYS may form a riblet structure RB on the arbitrary object. In other words, the machining system SYS may form a riblet structure RB on at least one of the substrate and the coating layer of the arbitrary object.

[0144] In the above description, the processing system SYS forms a riblet structure RB having a function of reducing the resistance of the surface of the workpiece W to the fluid. However, the processing system SYS may form a structure on the workpiece W having a function different from the function of reducing the resistance of the surface of the workpiece W to the fluid. For example, the processing system SYS may form on the workpiece W a riblet structure for reducing noise generated when the fluid and the surface of the workpiece W move relatively to each other. For example, the processing system SYS may form on the workpiece W a riblet structure that generates vortices in response to the flow of the fluid on the surface of the workpiece W. For example, the processing system SYS may form on the workpiece W a structure for imparting hydrophobicity to the surface of the workpiece W.

[0145] In the above description, the processing system SYS forms a riblet structure RB on the surface of the workpiece W. However, the processing system SYS may form any structure having any shape on the surface of the workpiece W. An example of the arbitrary structure is a fine texture structure (typically a concave-convex structure) of the micro-nanometer order formed regularly or irregularly. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure having a function of reducing resistance by a fluid (gas and / or liquid). The fine texture structure may include a lotus leaf surface structure having at least one of a liquid repellent function and a self-cleaning function (e.g., having a lotus effect). The fine texture structure may include at least one of a microprotrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function utilizing van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, a honeycomb structure having a droplet collecting function, and a concave-convex structure that improves adhesion with a layer formed on the surface.

[0146] In the above description, the processing system SYS processes the workpiece W by irradiating the workpiece W with the processing light EL. However, the processing system SYS may irradiate the workpiece W with any energy beam other than light to process the workpiece W. In this case, the processing system SYS may include a beam irradiation device capable of irradiating any energy beam in addition to or instead of the processing light source 21. An example of the any energy beam is at least one of a charged particle beam and an electromagnetic wave. An example of the charged particle beam is at least one of an electron beam and an ion beam.

[0147] In the above description, the turbine T may be referred to as a turbine machine. This turbine machine may include multiple turbines T. Also, as shown in FIG. 28, the turbine machine TM may be connected to a generator DY to drive the generator DY. In FIG. 28, the turbine machine TM includes a compressor CO that compresses air, a combustor BU that mixes fuel FU with the air compressed by the compressor CO and burns the mixture, a turbine unit TU that includes multiple turbines T, and a rotatable shaft SH that connects the compressor CO and the turbine unit TU. The turbine unit TU is rotated around the shaft SH by the combustion gas from the combustor BU. This rotational force is transmitted to the generator DY by the shaft SH, and is also transmitted to the compressor CO. Also, the turbine machine may include a jet engine.

[0148] The requirements of each of the above-described embodiments may be combined as appropriate. Some of the requirements of each of the above-described embodiments may not be used. The requirements of each of the above-described embodiments may be replaced with the requirements of other embodiments as appropriate. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents relating to the devices, etc. cited in each of the above-described embodiments are incorporated by reference into the present description.

[0149] Furthermore, the present invention can be modified as appropriate within the scope that does not contradict the gist or concept of the invention that can be read from the claims and the entire specification, and the blades, processing systems, and processing methods that involve such modifications are also included in the technical concept of the present invention. [Explanation of symbols]

[0150] 1 Processing equipment 11 Processing head 111 Processing optical system 112 Measurement Optical System 113 Exit optical system 4. Control device 8 Convex structure 81, 82 Side 83 Top 84 Boundary 7, 9 groove EL processing light ML measurement light SYS Machining System W work BL Turbine Blade BM base material TBC heat resistant layer RB riblet structure

Claims

1. A surface has a plurality of grooves for forming a riblet structure that reduces resistance to a fluid; The riblet structure has a plurality of convex structures formed along an arrangement direction in which the plurality of grooves are arranged, The groove is formed between adjacent ones of the plurality of convex structures, Each of the plurality of convex structures includes a pair of curved surfaces and a surface having a curvature smaller than that of the pair of curved surfaces and has an apex connected to the pair of curved surfaces. blade.

2. The blade according to claim 1, A blade, wherein each of the pair of curved surfaces of the plurality of convex structures is connected to side surfaces that form the plurality of grooves.

3. The blade according to claim 2, A blade, wherein a pair of the side surfaces connected to each of the pair of curved surfaces of the convex structure are not connected to each other.

4. A blade according to any one of claims 1 to 3, A blade, wherein the size of the apex in the arrangement direction is within a range of 1% to 9% of the arrangement pitch of the multiple convex structures formed along the arrangement direction.

5. A blade according to any one of claims 1 to 3, A blade, wherein the width of the apex and the pair of curved surfaces in the arrangement direction is within a range of 1% to 9% of the arrangement pitch of the multiple convex structures formed along the arrangement direction.

6. A blade according to any one of claims 1 to 5, A blade, wherein the pair of curved surfaces have a radius of curvature within a range of 1 micrometer to 9 micrometers.

7. A blade according to any one of claims 1 to 6, The apex includes a flat surface.

8. The blade according to claim 7, The flat surface of the apex is connected to the pair of curved surfaces.

9. A beam irradiation device that irradiates an energy beam onto a surface of the blade; a control device for controlling the beam irradiation device so as to form a plurality of grooves along an arrangement direction; Equipped with The control device controls the beam irradiation device so that the grooves are formed between a plurality of convex structures formed along an arrangement direction in which a plurality of grooves are arranged, and each of the plurality of convex structures includes a pair of curved surfaces and a surface having a smaller curvature than the pair of curved surfaces, and has an apex connected to the pair of curved surfaces.

10. A method of manufacturing a blade, comprising: irradiating a surface of the blade with an energy beam; forming a plurality of grooves along an arrangement direction by irradiating the energy beam; Including, The forming comprises: forming the grooves between a plurality of convex structures formed along a direction in which the plurality of grooves are arranged; irradiating the energy beam so that each of the plurality of convex structures has a pair of curved surfaces, a surface having a smaller curvature than the pair of curved surfaces, and an apex connected to the pair of curved surfaces; A processing method comprising:

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