Electrostatic chuck
JP2024175420APending Publication Date: 2024-12-18TOTO LTD
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Patent Information
- Application Number
- JP2023093199
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-06
- Publication Date
- 2024-12-18
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Abstract
To provide an electrostatic chuck capable of preventing peeling of a conductor plate which is bonded by a brazing material.SOLUTION: An electrostatic chuck 10 comprises: a dielectric substrate 100; an adsorption electrode 130 which is provided inside of the dielectric substrate 100; a conductor plate 410 which is electrically connected to the adsorption electrode 130 and exposed outside of the dielectric substrate 100; and a brazing material 420 which bonds the dielectric substrate 100 and the conductor plate 410. The conductor plate 410 includes: a first face 411 which is a face at a side of the dielectric substrate 100; and a second face 412 which is a face at an opposite side of the first face 411. The brazing material 420 includes a protrusion 421 protruding to a position which is a portion protruding to the outside of the conductor plate 410 and may be included in the second face 412 rather than in the first face 411.SELECTED DRAWING: Figure 2
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