Actuator and method for manufacturing actuator

Abstract

To provide an actuator that can be thinned, and to provide a method for manufacturing an actuator.SOLUTION: An actuator 100 includes a metal support layer 10, a first conductor pattern 30, an intermediate isolation layer 40 and a second conductor pattern 50. The first conductor pattern 30 has a coil shape. The first conductor pattern 30 is formed on the metal support layer 10. The second conductor pattern 50 has a coil shape. The second conductor pattern 50 is formed while facing the first conductor pattern 30 via the intermediate isolation layer 40.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an actuator and a method for manufacturing the actuator. [Background technology]

[0002] Products such as mobile devices may be equipped with an actuator that vibrates in response to a user's operation. For example, Patent Document 1 describes an actuator that includes a multilayer substrate, a magnet, and a movable body. The multilayer substrate includes a laminate and a coil formed in the laminate. When a predetermined current is applied to the coil, the magnetic field emitted from the coil displaces the magnet and the movable body in a direction perpendicular to the lamination direction of the laminate in the multilayer substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6913155 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, products equipped with actuators have become thinner. Therefore, there is a demand for thinner actuators. However, with the configuration of the actuator described in Patent Document 1, it is difficult to make the actuator thinner.

[0005] An object of the present invention is to provide an actuator that can be made thin, and a method for manufacturing the actuator. [Means for solving the problem]

[0006] An actuator according to one aspect of the present invention comprises a metal support layer, a first conductor pattern having a coil shape and formed on the metal support layer, an insulating layer, and a second conductor pattern having a coil shape and formed opposite the first conductor pattern via the insulating layer.

[0007] A method for manufacturing an actuator according to another aspect of the present invention includes forming a first conductor pattern having a coil shape on a metal support layer, forming an insulating layer, and forming a second conductor pattern having a coil shape opposite the first conductor pattern via the insulating layer. Effect of the Invention

[0008] According to the present invention, the actuator can be made thinner. [Brief description of the drawings]

[0009] [Figure 1] 1 is a plan view of an actuator according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the actuator shown in FIG. 1 taken along line AA. [Diagram 3] 2 is a cross-sectional view of the actuator shown in FIG. 1 taken along line BB. [Figure 4] FIG. 2 is a schematic perspective view of the actuator of FIG. [Diagram 5] 10A to 10C are cross-sectional process diagrams illustrating an example of a method for manufacturing an actuator. [Figure 6] 10A to 10C are cross-sectional process diagrams illustrating an example of a method for manufacturing an actuator. [Figure 7] 10A to 10C are cross-sectional process diagrams illustrating an example of a method for manufacturing an actuator. [Figure 8] 10A to 10C are cross-sectional process diagrams illustrating an example of a method for manufacturing an actuator. [Figure 9] 10A to 10C are cross-sectional process diagrams illustrating an example of a method for manufacturing an actuator. [Figure 10] 10A to 10C are cross-sectional process diagrams illustrating an example of a method for manufacturing an actuator. [Figure 11] 10A to 10C are cross-sectional process diagrams illustrating an example of a method for manufacturing the actuator. [Figure 12] FIG. 13 is a schematic perspective view of an actuator according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an actuator and a manufacturing method of the actuator according to an embodiment of the present invention will be described with reference to the drawings. The actuator is provided, for example, as a haptic (tactile technology) element in a touch pad of a mobile device. The touch pad is, for example, a capacitive touch panel, and has multiple electrodes for detecting a touch by a user or the like as a change in capacitance.

[0011] (1) Actuator Fig. 1 is a plan view of an actuator according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of the actuator 100 of Fig. 1 taken along line AA. Fig. 3 is a cross-sectional view of the actuator 100 of Fig. 1 taken along line BB. Fig. 4 is a schematic perspective view of the actuator 100 of Fig. 1. As shown in Fig. 1, the actuator 100 is connected to a driving circuit 110. The driving circuit 110 includes, for example, an integrated circuit. The driving circuit 110 may be mounted on the actuator 100.

[0012] As shown in Figures 1 to 4, the actuator 100 includes a metal support layer 10, a base insulating layer 20, a conductor pattern 30, an intermediate insulating layer 40, a conductor pattern 50, a cover insulating layer 60, and a connection conductor portion 70. Note that the base insulating layer 20, the intermediate insulating layer 40, and the cover insulating layer 60 are omitted from illustration in Figure 1. Also, the metal support layer 10, the base insulating layer 20, the intermediate insulating layer 40, and the cover insulating layer 60 are omitted from illustration in Figure 4.

[0013] The metal support layer 10 is made of, for example, a magnetic material. The magnetic material includes, for example, any one of SUS430, electromagnetic steel, silicon steel, iron, and permalloy. The magnetic material preferably includes a ferromagnetic material such as silicon steel, iron, or permalloy. The metal support layer 10 may include an amorphous material. The base insulating layer 20 is made of a resin such as polyimide, and is provided on the metal support layer 10. The conductor pattern 30 is made of, for example, copper, and is provided on the base insulating layer 20. The conductor pattern 30 has wiring wound in a coil shape.

[0014] The intermediate insulating layer 40 is made of polyimide, PTFE, polyethylene, epoxy resin, or the like, and is provided on the base insulating layer 20 so as to cover the conductive pattern 30. The elastic modulus of the intermediate insulating layer 40 is, for example, 10 MPa or more and 3000 MPa (3 GPa) or less, and preferably 800 MPa or more and 2000 MPa (2 GPa) or less. Such insulating materials include porous bodies (for example, porous polyimide), PTFE, low-density polyethylene, epoxy resin, and the like. Low-density polyethylene has a density of 0.90 g / cm 3 More than 0.93g / cm 3 The following polyethylene:

[0015] In addition, a precursor film having a phase separation structure of a resin precursor and a porosifier is prepared, and the porosifier is removed from the precursor film by supercritical extraction, whereby a porous body having an arbitrary average pore size and porosity can be produced. A porous body having an arbitrary elastic modulus can be produced by adjusting the average pore size and porosity of the porous body. In this example, the average pore size is, for example, 50 μm or less, preferably 30 μm or less, and more preferably 10 μm or less. The porosity is, for example, 60% or more, and preferably 70% or more.

[0016] The conductor pattern 50 has a similar configuration to the conductor pattern 30, and is provided on the intermediate insulating layer 40. That is, the conductor pattern 50 is made of, for example, copper, and has wiring wound in a coil shape. The cover insulating layer 60 is made of a resin such as polyimide, and is provided on the intermediate insulating layer 40 so as to cover the conductor pattern 50.

[0017] As shown in Fig. 4, the conductor patterns 30 and 50 are arranged such that their centers (centers of coils made of wiring) are substantially overlapped in the vertical direction. The number of turns of the coil of the conductor pattern 30 is substantially the same as that of the conductor pattern 50, but may be different. The connection conductor 70 is made of, for example, copper, and penetrates the intermediate insulating layer 40 in Fig. 3 in the thickness direction to electrically connect one end of the conductor pattern 30 to one end of the conductor pattern 50. The other end of the conductor pattern 30 and the other end of the conductor pattern 50 are connected to the drive circuit 110.

[0018] A user of the touchpad touches the surface of the touchpad. In this case, the capacitance between multiple electrodes (not shown) provided on the touchpad changes. When the drive circuit 110 detects a change in the capacitance between the electrodes, it passes an AC current through the conductor patterns 30 and 50. In this example, the directions of the currents flowing through the conductor patterns 30 and 50 are opposite to each other, so that the conductor patterns 30 and 50 generate magnetic fields in opposite directions to each other.

[0019] According to the above configuration, a repulsive force is generated between the conductor patterns 30, 50, causing the intermediate insulating layer 40 between the conductor patterns 30, 50 to elastically deform, displacing the conductor patterns 30, 50 in directions away from each other. The amount of displacement between the conductor patterns 30, 50 changes so as to follow the change over time in the absolute value of the current flowing through the conductor patterns 30, 50. As a result, the displacement of the conductor patterns 30, 50 is perceived by the user as vibration of the actuator 100.

[0020] (2) Actuator manufacturing method 5 to 11 are process cross-sectional views for explaining one example of a manufacturing method of the actuator 100. The process cross-sectional views of Fig. 5 to 11 correspond to the AA line cross-sectional view of the actuator 100 in Fig. 3. First, as shown in Fig. 5, a two-layer base material consisting of a metal support layer 10 and a base insulating layer 20 is prepared. The thickness of the metal support layer 10 is, for example, 10 µm or more and 500 µm or less, and is 100 µm in this example. The thickness of the base insulating layer 20 is, for example, 2 µm or more and 30 µm or less.

[0021] Next, as shown in Fig. 6, a coil-shaped conductor pattern 30 is formed on the base insulating layer 20. The conductor pattern 30 may be formed by an additive method, a semi-additive method, a subtractive method, or other methods. The thickness of the conductor pattern 30 is, for example, 5 µm or more and 30 µm or less. The width of the wiring of the conductor pattern 30 is, for example, 2 µm or more and 300 µm or less, preferably 10 µm or more and 300 µm or less.

[0022] 7, the intermediate insulating layer 40 is formed on the base insulating layer 20 so as to cover the conductive pattern 30. The intermediate insulating layer 40 is formed, for example, by applying the above-mentioned precursor film from which the porosifying agent has been removed onto the base insulating layer 20 and curing the precursor film. In this example, the intermediate insulating layer 40 has an elastic modulus of 200 MPa. The thickness of the intermediate insulating layer 40 is, for example, 2 μm or more and 1000 μm or less, and preferably 5 μm or more and 500 μm or less. In this example, the thickness of the intermediate insulating layer 40 is 50 μm.

[0023] Thereafter, as shown in Fig. 8, an opening 41 is formed through the intermediate insulating layer 40 in a portion overlapping one end of the conductor pattern 30 in the thickness direction. The opening 41 may be formed, for example, by laser processing or by chemical etching using an etching solution. Next, as shown in Fig. 9, a connection conductor 70 is formed in the opening 41 of the intermediate insulating layer 40. This electrically connects one end of the conductor pattern 30 and the connection conductor 70. The connection conductor 70 may be formed, for example, by copper plating.

[0024] 10, a coil-shaped conductor pattern 50 is formed on the intermediate insulating layer 40. The procedure for forming the conductor pattern 50 is the same as that for forming the conductor pattern 30. The thickness of the conductor pattern 50 is, for example, 5 μm or more and 30 μm or less. The width of the wiring of the conductor pattern 50 is, for example, 2 μm or more and 300 μm or less, and preferably 10 μm or more and 300 μm or less. One end of the conductor pattern 50 overlaps the opening 41 of the intermediate insulating layer 40. As a result, one end of the conductor pattern 50 and the connection conductor 70 are electrically connected.

[0025] Finally, as shown in FIG. 11, a cover insulating layer 60 is formed on the intermediate insulating layer 40 so as to cover the conductive pattern 50. The cover insulating layer 60 may be formed by applying a photosensitive resin precursor onto the intermediate insulating layer 40 and exposing the photosensitive resin precursor to ultraviolet light. The thickness of the cover insulating layer 60 is, for example, 8 μm or more and 50 μm or less. In this way, the actuator 100 is completed. According to this manufacturing method, the actuator 100 can be manufactured at low cost.

[0026] (3) Modifications In the present embodiment, the conductor patterns 30 and 50 are connected by the connection conductor portion 70 so that the directions of the currents flowing therethrough are opposite to each other, but the embodiment is not limited to this. The conductor patterns 30 and 50 may be connected by the connection conductor portion 70 so that the directions of the currents flowing therethrough are the same. For example, one end of the conductor pattern 30 and the other end of the conductor pattern 50 may be connected by the connection conductor portion 70, and the other end of the conductor pattern 30 and one end of the conductor pattern 50 may be connected to the drive circuit 110.

[0027] In this connection, when an AC current flows through the conductor patterns 30, 50, a magnetic field is generated by each of the conductor patterns 30, 50 in the same direction. As a result, an attractive force is generated between the conductor patterns 30, 50, causing the intermediate insulating layer 40 between the conductor patterns 30, 50 to elastically deform, displacing the conductor patterns 30, 50 in a direction toward each other. The amount of displacement between the conductor patterns 30, 50 changes so as to follow the time change in the absolute value of the current flowing through the conductor patterns 30, 50. As a result, the displacement of the conductor patterns 30, 50 is perceived by the user as a vibration of the actuator 100.

[0028] (4) Effects In the actuator 100 according to this embodiment, when a current is passed through the conductor patterns 30, 50, the intermediate insulating layer 40 between the conductor patterns 30, 50 is elastically deformed, displacing the conductor patterns 30, 50. This causes the actuator 100 to vibrate. In this configuration, there is no need to provide a magnet in the actuator 100, so the magnet does not limit the thinning of the actuator 100. This allows the actuator 100 to be thinned. Therefore, the actuator 100 can be folded when used.

[0029] The metal support layer 10 includes, for example, any one of magnetic steel, silicon steel, iron, and permalloy. In this case, the magnetic force between the conductor pattern 30 and the conductor pattern 50 is increased. This allows the actuator 100 to vibrate easily.

[0030] The elastic modulus of the intermediate insulating layer 40 is, for example, 3000 MPa or less. In this case, the intermediate insulating layer 40 undergoes sufficient elastic deformation. This allows the actuator 100 to vibrate easily. Furthermore, the elastic modulus of the intermediate insulating layer 40 is, for example, 10 MPa or more. In this case, the durability of the intermediate insulating layer 40 is improved. Furthermore, the ease of processing the intermediate insulating layer 40 is improved. As a result, the actuator 100 can be manufactured easily.

[0031] The intermediate insulating layer 40 is, for example, a porous body. In this case, it becomes easy to elastically deform the intermediate insulating layer 40. In particular, when the average pore size of the porous body is 50 μm or less, or when the porosity of the porous body is 60% or more, it becomes easier to elastically deform the intermediate insulating layer 40. This makes it easy to vibrate the actuator 100.

[0032] Moreover, the conductor patterns 30 and 50 are electrically connected by a connection conductor portion 70 that penetrates the intermediate insulating layer 40. In this case, the actuator 100 can be made smaller in size, and a current can be passed through the conductor patterns 30 and 50 by a simple connection.

[0033] (5) Other embodiments In the above embodiment, the connecting conductor 70 is provided within the opening 41 so as to penetrate through the opening 41 of the intermediate insulating layer 40, but the embodiment is not limited to this. As long as the connecting conductor 70 connects the conductor pattern 30 and the conductor pattern 50, the connecting conductor 70 does not have to be provided within the opening 41 of the intermediate insulating layer 40. Even in this case, a current can be passed through the conductor patterns 30 and 50 by a simple connection.

[0034] Moreover, the actuator 100 may not include the connecting conductor portion 70. Fig. 12 is a schematic perspective view of the actuator 100 according to another embodiment. In Fig. 12, similar to Fig. 4, the metal supporting layer 10, the base insulating layer 20, the intermediate insulating layer 40, and the cover insulating layer 60 are omitted.

[0035] 12, in this embodiment, the conductor patterns 30 and 50 are electrically insulated without being connected by a connecting conductor portion 70. Both ends of the conductor pattern 30 are connected to a drive circuit 110. Similarly, both ends of the conductor pattern 50 are connected to the drive circuit 110. In each of the conductor patterns 30 and 50, the portions where the coil wiring intersects with other wiring may be replaced with jumper wiring or the like as appropriate.

[0036] When the driving circuit 110 detects a change in the capacitance between the electrodes of the touch pad, it passes an AC current through each of the conductor patterns 30, 50 individually. This allows the actuator 100 to vibrate in response to a user's touch operation on the surface of the touch pad. The directions of the currents passed through the conductor patterns 30, 50 may be opposite to each other or may be the same. Furthermore, the frequencies of the currents passed through the conductor patterns 30, 50 may be the same or different.

[0037] (6) Examples In the following Examples 1 to 6, the displacement during vibration of the actuator 100 in Fig. 1 was evaluated by simulation. The insulating materials of the intermediate insulating layer 40 in Examples 1 to 6 were porous polyimide, porous polyimide, PTFE, low-density polyethylene, epoxy resin, and non-porous polyimide, respectively. The elastic moduli of the intermediate insulating layer 40 in Examples 1 to 6 were 950 MPa, 1700 MPa, 500 MPa, 100 MPa, 2400 MPa, and 3500 MPa, respectively.

[0038] For each of the conductor patterns 30, 50 in Examples 1 to 6, the number of coil turns was 5300, the width of the wiring was 2.7 μm, and the spacing between the wiring was 1.0 μm. The magnitude of the AC current flowing through the conductor patterns 30, 50 was 1 A. Table 1 shows the evaluation results for the actuator 100 in Examples 1 to 6. In Table 1, examples in which the displacement was 1 μm or more are evaluated as "◎", examples in which the displacement was 0.5 μm or more and less than 1 μm are evaluated as "◯", and examples in which the displacement was less than 0.5 μm are evaluated as "△".

[0039] [Table 1]

[0040] As shown in Table 1, in Examples 1 to 4, the amount of displacement was 1 μm or more, and it was confirmed that the actuator 100 vibrated sufficiently. In Example 5, the amount of displacement was 0.5 μm or more and less than 1 μm, and it was confirmed that the actuator 100 vibrated appropriately. In Example 6, the amount of displacement was less than 0.5 μm, and it was confirmed that the actuator 100 vibrated slightly.

[0041] In particular, the comparison results between Examples 1 to 5 and Example 6 confirmed that the actuator 100 could be vibrated appropriately by setting the elastic modulus of the intermediate insulating layer 40 to 3000 MPa or less. Also, the comparison results between Examples 1 to 4 and Example 5 confirmed that the actuator 100 could be vibrated sufficiently by setting the elastic modulus of the intermediate insulating layer 40 to 2000 MPa or less.

[0042] (7) Correspondence Below, examples of the correspondence between each component of the claims and each part of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0043] In the above-described embodiment, the metal support layer 10 is an example of a metal support layer, the conductor pattern 30 is an example of a first conductor pattern, and the conductor pattern 50 is an example of a second conductor pattern. The intermediate insulating layer 40 is an example of an insulating layer, the actuator 100 is an example of an actuator, and the connecting conductor 70 is an example of a connecting conductor.

[0044] (8) Summary of the embodiment (1) The actuator according to the first paragraph is A metal support layer; a first conductor pattern having a coil shape and formed on the metal support layer; An insulating layer; The second conductor pattern has a coil shape and is formed opposite the first conductor pattern with the insulating layer interposed therebetween.

[0045] In this actuator, when a current is passed through the first conductor pattern and the second conductor pattern, the insulating layer between the first conductor pattern and the second conductor pattern is elastically deformed, displacing the first conductor pattern and the second conductor pattern. This causes the actuator to vibrate. In this configuration, there is no need to provide a magnet in the actuator, so the magnet does not limit the thinning of the actuator. This allows the actuator to be thin.

[0046] (2) The actuator according to the first aspect, The metallic support layer may include any of electrical steel, silicon steel, iron and permalloy.

[0047] In this case, the magnetic force between the first conductor pattern and the second conductor pattern is increased, which makes it easier to vibrate the actuator.

[0048] (Item 3) In the actuator according to item 1 or 2, The insulating layer may have an elastic modulus of 3000 MPa or less.

[0049] In this case, the insulating layer is sufficiently elastically deformed, which makes it easy to vibrate the actuator.

[0050] (4) The actuator according to any one of the first to third aspects, The insulating layer may have a modulus of elasticity of 10 MPa or more.

[0051] In this case, the durability of the insulating layer is improved, and the insulating layer can be easily processed, which makes it easier to manufacture the actuator.

[0052] (Item 5) In the actuator according to any one of items 1 to 4, The insulating layer may be porous.

[0053] In this case, it becomes easy to elastically deform the insulating layer, which makes it easy to vibrate the actuator.

[0054] (Item 6) The actuator according to item 5, The porous body may have an average pore size of 50 μm or less.

[0055] In this case, it becomes easier to elastically deform the insulating layer, which makes it easier to vibrate the actuator.

[0056] (7) The actuator according to the 5th or 6th aspect, The porous body may have a porosity of 60% or more.

[0057] In this case, it becomes easier to elastically deform the insulating layer, which makes it easier to vibrate the actuator.

[0058] (Item 8) The actuator according to any one of items 1 to 7, The semiconductor device may further include a connection conductor portion that electrically connects the first conductor pattern and the second conductor pattern.

[0059] In this case, a current can be passed through the first conductor pattern and the second conductor pattern by simple connection.

[0060] (Item 9) The actuator according to item 8, The connection conductor may be formed to penetrate the insulating layer.

[0061] In this case, the actuator can be made smaller.

[0062] (Item 10) A method for manufacturing an actuator according to item 10 includes the steps of: forming a first conductor pattern having a coil shape on a metal support layer; forming an insulating layer; and forming a second conductor pattern having a coil shape to face the first conductor pattern with the insulating layer interposed therebetween.

[0063] According to this method for manufacturing an actuator, there is no need to provide a magnet in the actuator, and therefore the magnet does not limit the thinning of the actuator, which allows the actuator to be made thinner.

[0064] (Item 11) A method for manufacturing the actuator according to item 10, The method may further include forming a connection conductor portion that electrically connects the first conductor pattern and the second conductor pattern.

[0065] In this case, a current can be passed through the first conductor pattern and the second conductor pattern by simple connection.

[0066] (Item 12) In the method for manufacturing the actuator according to item 11, Forming the connection conductor may include forming the connection conductor so as to penetrate the insulating layer.

[0067] In this case, the actuator can be made smaller. [Explanation of symbols]

[0068] 10...metal support layer, 20...base insulating layer, 30, 50...conductor pattern, 40...intermediate insulating layer, 41...opening, 60...cover insulating layer, 70...connecting conductor portion, 100...actuator, 110...drive circuit

Claims

1. A metal support layer; a first conductor pattern having a coil shape and formed on the metal support layer; An insulating layer; a second conductor pattern having a coil shape and formed opposite to the first conductor pattern with the insulating layer interposed therebetween.

2. The actuator of claim 1 , wherein the metallic support layer comprises one of magnetic steel, silicon steel, iron, and permalloy.

3. 3. The actuator according to claim 1, wherein the insulating layer has an elastic modulus of 3000 MPa or less.

4. 3. The actuator according to claim 1, wherein the insulating layer has an elastic modulus of 10 MPa or more.

5. 3. The actuator according to claim 1, wherein the insulating layer is a porous material.

6. 6. The actuator according to claim 5, wherein the average pore size of the porous body is 50 [mu]m or less.

7. 6. The actuator according to claim 5, wherein the porosity of the porous body is 60% or more.

8. 3. The actuator according to claim 1, further comprising a connection conductor portion that electrically connects the first conductor pattern and the second conductor pattern.

9. The actuator according to claim 8 , wherein the connection conductor portion is formed so as to penetrate the insulating layer.

10. forming a first conductor pattern having a coil shape on a metal supporting layer; forming an insulating layer; and forming a second conductor pattern having a coil shape opposite the first conductor pattern with the insulating layer interposed therebetween.

11. The method for manufacturing an actuator according to claim 10, further comprising forming a connection conductor portion that electrically connects the first conductor pattern and the second conductor pattern.

12. The method for manufacturing an actuator according to claim 11 , wherein forming the connecting conductor portion includes forming the connecting conductor portion so as to penetrate the insulating layer.

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