Method for processing workpiece

Abstract

To provide a method for processing a workpiece, capable of performing plural times of hairline arrangement and also capable of checking a meandering of processing, in an actually processed workpiece.SOLUTION: A method for processing a workpiece includes: a groove formation step 1001 of forming an alignment groove in an outer peripheral excessive region; a distance registration step 1002 of aligning a reference line of an imaging unit with the alignment groove and registering a distance between the alignment groove and the reference line; a meandering detection step 1003 of detecting an amount of deflection of the alignment groove in a Y direction; a distance meandering checking step 1004 of rotating a holding table, and checking a distance registered in the distance registration step 1002 and the amount of deflection detected in the meandering detection step 1003, in a different outer peripheral excessive region; a processing position setting step 1005 of setting a scheduled division line of a workpiece to a position to be processed; and a processing step 1006 of, after the processing position setting step 1005, processing the workpiece along the scheduled division line.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for machining a workpiece. [Background technology]

[0002] When processing to form a machining groove in a workpiece, it is known to perform a so-called hairline alignment, which is a process of aligning a reference line of an imaging unit such as a camera mounted on the processing device with the machining position of a processing unit that processes the workpiece (see, for example, Patent Documents 1 and 2).

[0003] Specifically, this hairline alignment work is performed by first processing the workpiece in a processing unit to form a processing groove, then imaging this processing groove and performing image processing to detect the center of the width of the processing groove, calculating the amount of deviation between the center of the width of the processing groove and the reference line position of the camera, and adding or subtracting this deviation from the coordinate position, thereby storing in the device a corrected position that matches the center of the width of the processing groove with the reference line position of the camera. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6600267 [Patent Document 2] Patent No. 6037705 Summary of the Invention [Problem to be solved by the invention]

[0005] In some cases, it may be necessary to perform this hairline alignment twice for confirmation, but there is a problem that there is not enough space to perform hairline alignment on the outer periphery of the workpiece. In particular, when detecting meandering during machining while aligning the hairline, it is preferable that the machined groove is long, so there is a problem that it is more difficult to secure the space.

[0006] The present invention has been made in consideration of the above problems, and its object is to provide a method for processing a workpiece that enables hairline alignment and checking for meandering during processing to be performed multiple times on the workpiece that is actually processed. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, a processing method of a workpiece of the present invention is a processing method of a workpiece using a processing device including a holding table for holding a workpiece, a processing unit for processing the workpiece held by the holding table, a moving unit for relatively moving the holding table and the processing unit in a Y direction and an X direction perpendicular to the Y direction, an imaging unit for imaging the workpiece having an optical system in which a reference line for aligning the processing unit is formed in the X direction, and a control unit for controlling each component, the processing method including a groove forming step of forming an alignment groove in a peripheral excess area of ​​the workpiece held on the holding table, a distance registration step of aligning the reference line of the imaging unit with the alignment groove and registering the distance between the alignment groove and the reference line, and a distance registration step of detecting a runout amount of the alignment groove in the Y direction. the distance meandering confirmation step of rotating the holding table to form alignment grooves in different outer circumferential excess areas, aligning the reference line of the imaging unit with the alignment groove to calculate the distance between the alignment groove and the reference line to confirm the distance registered in the distance registration step and detecting the amount of runout of the alignment groove in the Y direction, thereby confirming the amount of runout detected in the meandering detection step; a processing position setting step of aligning the reference line with a planned division line set on the workpiece and setting a position to be processed; and a processing step of positioning the processing unit at a position corrected by the distance from the position set in the processing position setting step, and processing the workpiece along the planned division line, wherein the distance meandering confirmation step is performed once or a plurality of times.

[0008] The groove forming step may form the alignment groove to a depth that does not completely divide the workpiece.

[0009] The processing unit may be a cutting blade fixed to the tip of a spindle.

[0010] The processing unit may have a first cutting blade fixed to the tip of a first spindle and a second cutting blade fixed to the tip of a second spindle, and the groove forming step, the distance registration step, the meandering detection step, and the distance / wandering confirmation step may be performed for each of the first cutting blade and the second cutting blade.

[0011] The processing unit may be a laser beam application unit including a laser beam oscillator that oscillates a laser beam, and an optical system including a condenser lens that condenses the laser beam. Effect of the Invention

[0012] In the present invention, the area in which alignment grooves are formed in the prior (immediately prior) groove forming step, distance registration step, and meandering detection step is changed to the area in which alignment grooves are to be formed in the subsequent distance meandering confirmation step by rotating the workpiece. Therefore, even if the area of ​​the peripheral excess area of ​​the workpiece is small, alignment grooves of a specified length or more can be formed multiple times, so that hairline alignment and processing meandering checks can be performed multiple times on the workpiece to be actually processed. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a flowchart showing a processing procedure of a method for processing a workpiece according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing an example of a workpiece to be processed by the workpiece processing method according to the first embodiment. [Diagram 3] FIG. 3 is a perspective view showing a configuration example of a processing device for carrying out the method for processing a workpiece according to the first embodiment. [Figure 4] FIG. 4 is a diagram for explaining the distance registration step of FIG. [Diagram 5] FIG. 5 is a diagram for explaining the distance registration step of FIG. [Figure 6] FIG. 6 is a diagram for explaining the meandering detection step in FIG. [Figure 7] FIG. 7 is a perspective view showing a configuration example of a processing device for carrying out the method for processing a workpiece according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0015] [Embodiment 1] A method for processing a workpiece according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a flow chart showing the procedure of the method for processing a workpiece according to the first embodiment. As shown in Fig. 1, the method for processing a workpiece according to the first embodiment includes a groove forming step 1001, a distance registering step 1002, a meandering detection step 1003, a distance and meandering confirmation step 1004, a processing position setting step 1005, and a processing step 1006.

[0016] FIG. 2 is a perspective view showing an example of a workpiece 100 to be processed by the method for processing a workpiece according to the first embodiment. As shown in FIG. 2, the workpiece 100 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose base material is silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like. The workpiece 100 has a flat surface 101, a device region 107 in which chip-shaped devices 103 are formed in each region partitioned by a plurality of dividing lines 102 intersecting each other, and a peripheral surplus region 108 in which no device 103 is formed and which surrounds the periphery of the device region 107. The method for processing a workpiece according to the first embodiment is performed on the workpiece 100 to divide the workpiece 100 along the dividing lines 102, thereby manufacturing chips of a plurality of devices 103.

[0017] The workpiece 100 may have a support tape 105 attached to a back surface 104 behind the front surface 101, and an annular frame 106 may be attached to the outer edge of the support tape 105. That is, the workpiece 100 may be fixed to an opening of the annular frame 106 via the support tape 105. In the present invention, the workpiece 100 may be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic plate, a glass plate, or the like.

[0018] Fig. 3 is a perspective view showing a configuration example of a processing device 1 that performs the workpiece processing method according to embodiment 1. As shown in Fig. 3, the processing device 1 includes a holding table 10, a processing unit 20, an imaging unit 30, a moving unit 40, a monitor 50, and a control unit 60. The processing device 1 performs a groove forming step 1001, a distance registration step 1002, a meandering detection step 1003, a distance and meandering confirmation step 1004, a processing position setting step 1005, and a processing step 1006 of the workpiece processing method according to embodiment 1.

[0019] The holding table 10 is a so-called chuck table that includes a disk-shaped frame body with a recess formed therein and a disk-shaped suction part fitted into the recess. The suction part of the holding table 10 is made of porous ceramics or the like with a large number of porous holes, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction part of the holding table 10 is a holding surface 11 on which the workpiece 100 is placed and which suction-holds the placed workpiece 100 by negative pressure introduced from the vacuum suction source. The holding surface 11 and the upper surface of the frame body of the holding table 10 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The holding table 10 is provided so as to be movable in the X-axis direction (X direction) parallel to the horizontal direction by the X-axis direction moving unit 41 of the moving unit 40. The holding table 10 is provided so as to be rotatable around the Z axis, which is parallel to the vertical direction and perpendicular to the XY plane, by a rotary drive source (not shown).

[0020] In the first embodiment, the machining unit 20 has a first machining unit 20-1 and a second machining unit 20-2, as shown in FIG. 3. The first machining unit 20-1 and the second machining unit 20-2 have roughly the same configuration. Hereinafter, when each part related to the first machining unit 20-1 is to be distinguished from each part related to the second machining unit 20-2, "-1" is added after the reference numeral, and when each part related to the second machining unit 20-2 is to be distinguished from each part related to the first machining unit 20-1, "-2" is added after the reference numeral. When it is not necessary to distinguish between the first machining unit 20-1 and the second machining unit 20-2, the corresponding parts are regarded as being common to both, and are appropriately omitted without adding "-1" or "-2" after the reference numeral. In addition, when describing parts having the same configuration, or when there is no particular distinction between the first machining unit 20-1 and the second machining unit 20-2, they are abbreviated to machining unit 20.

[0021] The processing unit 20 is a cutting unit including a cutting blade 21 and a spindle 22. The cutting blade 21 is attached to the tip of the spindle 22, and is rotated by the spindle 22, which serves as a rotation axis, to cut the workpiece 100 held on the holding table 10. The spindle 22 is provided rotatably about an axis parallel to the horizontal direction and parallel to a Y-axis direction (Y direction) perpendicular to the X-axis direction, and is rotated about the axis by a motor (not shown) connected to the spindle 22. The spindle 22 supports the cutting blade 21 attached to the tip of the spindle 22 rotatably about an axis parallel to the Y-axis direction.

[0022] That is, the first machining unit 20-1 of the machining unit 20 has a first spindle 22-1 and a first cutting blade 21-1 fixed to the tip of the first spindle 22-1 so as to be rotatable together with the first spindle 22-1, and the second machining unit 20-2 of the machining unit 20 has a second spindle 22-2 and a second cutting blade 21-2 fixed to the tip of the second spindle 22-2 so as to be rotatable together with the second spindle 22-2.

[0023] The first machining unit 20-1 is provided independently of the second machining unit 20-2 so as to be movable in the Y-axis direction and the Z-axis direction (Z direction) by the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43 of the moving unit 40, respectively. The second machining unit 20-2 is provided independently of the first machining unit 20-1 so as to be movable in the Y-axis direction and the Z-axis direction by the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43 of the moving unit 40, respectively. The machining apparatus 1 thus includes two sets of machining units 20-1 and 20-2, which are cutting units, that is, a two-spindle dicer, a so-called facing dual type machining apparatus.

[0024] The processing unit 20 rotates the cutting blade 21 attached to the tip of the spindle 22 around an axis parallel to the Y-axis direction by the rotational movement of the spindle 22, while moving (processing feed) the cutting blade 21 along the X-axis direction, which is the processing feed direction, relative to the workpiece 100 on the holding table 10 by the X-axis direction moving unit 41, thereby cutting the workpiece 100 with the cutting blade 21 to form a cut groove (machined groove). Similarly, the processing unit 20 also cuts the workpiece 100 along the planned division lines 102 with the cutting blade 21, thereby dividing the workpiece 100 along the planned division lines 102.

[0025] In the first embodiment, the imaging unit 30 has a first imaging unit 30-1 and a second imaging unit 30-2, as shown in FIG. 3. The first imaging unit 30-1 and the second imaging unit 30-2 have roughly the same configuration. Hereinafter, when each part related to the first imaging unit 30-1 is to be distinguished from each part related to the second imaging unit 30-2, "-1" is added after the reference numeral, and when each part related to the second imaging unit 30-2 is to be distinguished from each part related to the first imaging unit 30-1, "-2" is added after the reference numeral. When it is not necessary to distinguish between the first imaging unit 30-1 and the second imaging unit 30-2, the corresponding parts are regarded as being common to both, and are appropriately omitted without adding "-1" or "-2" after the reference numeral. In addition, when describing parts having the same configuration, or when there is no particular distinction between the first imaging unit 30-1 and the second imaging unit 30-2, the first imaging unit 30-1 and the second imaging unit 30-2 are abbreviated to imaging unit 30.

[0026] The imaging unit 30 includes an imaging element that images the workpiece 100 held on the holding table 10. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 images the surface 101 of the workpiece 100 held on the holding table 10 to obtain an image for performing alignment for positioning the workpiece 100 and the processing unit 20. The imaging unit 30 also images the surface 101 of the workpiece 100 held on the holding table 10 to obtain an image for performing a check to automatically confirm whether processing of the workpiece 100 has been performed within a normal range.

[0027] In the first embodiment, the first imaging unit 30-1 is fixed adjacent to the first processing unit 20-1 and moves integrally with the first processing unit 20-1, and the second imaging unit 30-2 is fixed adjacent to the second processing unit 20-2 and moves integrally with the second processing unit 20-2.

[0028] The imaging unit 30 has an optical system in which a reference line 31 (see Figs. 8 and 9) for aligning the processing unit 20 is formed along the X-axis direction. The reference line 31 is set inside the imaging unit 30, and can be acquired and displayed superimposed on an image captured by the imaging unit 30. In the first embodiment, the reference line 31 is set as a straight line extending along the X-axis direction, which is the horizontal direction of the image, through the center in the Y-axis direction, which is the vertical direction of the image, in the image captured by the imaging unit 30.

[0029] In the first embodiment, the first imaging unit 30-1 has an optical system in which a first reference line 31-1 for aligning the first processing unit 20-1 is formed, and the second imaging unit 30-2 has an optical system in which a second reference line 31-2 for aligning the second processing unit 20-2 is formed.

[0030] The moving unit 40 moves the holding table 10 and the processing unit 20 relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction. In the first embodiment, the moving unit 40 has an X-axis direction moving unit 41, a Y-axis direction moving unit 42, and a Z-axis direction moving unit 43, as shown in FIG. 3. The X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 move the holding table 10, the processing unit 20, and the imaging unit 30 relatively in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. In the first embodiment, the X-axis direction moving unit 41 moves the holding table 10 relative to the processing unit 20 and the imaging unit 30 along the X-axis direction. In the first embodiment, the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43 move the processing unit 20 and the imaging unit 30 relative to the holding table 10 along the Y-axis direction and the Z-axis direction, respectively.

[0031] The X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 are all known ball screw mechanisms having a motor, a ball screw, and a guide. The X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 each include an encoder that reads the rotational position of the motor, and detects the relative positions of the holding table 10, the processing unit 20, and the imaging unit 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction based on the rotational position of the motor read by the encoder, and outputs the detected relative positions to the control unit 60. Here, the relative positions in the X-axis direction, the Y-axis direction, and the Z-axis direction are provided in the processing device 1, and for example, an apparatus coordinate system (such as an XYZ coordinate system, which is an orthogonal coordinate system, or an RθZ coordinate system, which is a cylindrical coordinate system) with the center of the holding surface 11 of the holding table 10 as the origin is used.

[0032] In addition, the X-axis direction moving unit 41, the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43 are not limited to a configuration in which the relative positions of the holding table 10, the processing unit 20 and the imaging unit 30 are detected by an encoder, and may be configured with linear scales parallel to the X-axis direction, the Y-axis direction and the Z-axis direction, respectively, and a reading head that is freely movable in the X-axis direction, the Y-axis direction and the Z-axis direction by the X-axis direction moving unit 41, the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43, respectively, and that reads the graduations of the linear scale.

[0033] In the first embodiment, as shown in FIG. 3, the monitor 50 is provided on a cover (not shown) of the processing device 1 with the display surface facing outward. The monitor 50 displays a screen for setting various conditions related to various processes of the processing device 1, such as processing by the processing unit 20 and imaging by the imaging unit 30, acquired images and data, various processing results by the control unit 60, etc., so that the operator can visually confirm them. The monitor 50 is configured with a liquid crystal display device or the like. The monitor 50 is provided with an input unit 51 that the operator uses when inputting information related to the above-mentioned various conditions of the processing device 1 and information related to the display of images, etc. The input unit 51 provided on the monitor 50 is configured with at least one of a touch panel provided on the monitor 50, a mouse, a touch pad, a keyboard, etc. Note that the monitor 50 is not fixed to the processing device 1, but is provided on an arbitrary communication device, and the arbitrary communication device may be connected to the processing device 1 wirelessly or by wire.

[0034] The control unit 60 controls the operation of each component of the processing device 1 to cause the processing device 1 to perform various processes including various processes in the processing method for a workpiece according to the first embodiment. In the first embodiment, the control unit 60 includes a computer system. The computer system included in the control unit 60 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device of the control unit 60, and outputs a control signal for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device of the control unit 60.

[0035] Next, this specification will explain the method for processing a workpiece according to the first embodiment with reference to the drawings. In the method for processing a workpiece according to the first embodiment, a holding step is performed in which the workpiece 100 is held on the holding surface 11 of the holding table 10 before performing the groove forming step 1001. In this holding step, specifically, first, the control unit 60 uses a transport unit (not shown) to carry out one workpiece 100 before performing the method for processing a workpiece according to the first embodiment, exposes the front surface 101 upward, and transports the back surface 104 side toward the holding surface 11 of the holding table 10 onto the holding surface 11 of the holding table 10. In this holding step, next, the control unit 60 suction-holds the workpiece 100 transported onto the holding surface 11 by the holding table 10 from the back surface 104 side with the front surface 101 exposed upward.

[0036] The groove forming step 1001 is a step of forming an alignment groove 121 in the outer peripheral excess area 108 of the workpiece 100 held on the holding table 10. In the groove forming step 1001, first, the control unit 60 rotates the holding table 10 by a rotation drive source (not shown) of the holding table 10, thereby making a desired groove forming line 111 (see FIG. 2) that crosses the outer peripheral excess area 108 of the workpiece 100 held on the holding table 10 along the in-plane direction parallel to the processing feed direction (X-axis direction), and by relatively moving the holding table 10 that holds the workpiece 100 and the processing unit 20 by the moving unit 40, the processing position by the processing unit 20 (cutting position by the cutting blade 21) is positioned on the desired groove forming line 111 in the outer peripheral excess area 108 of the workpiece 100 held on the holding table 10.

[0037] Here, the desired groove formation line 111 is a linear region extending along the in-plane direction, which crosses only the peripheral excess region 108 of the workpiece 100 held on the holding table 10 along the in-plane direction and is set to be as long as possible so as not to cross the device region 107 including the device 103 of the workpiece 100 held on the holding table 10 at all. A plurality of desired groove formation lines 111 can be set in the peripheral excess region 108 of the workpiece 100 held on the holding table 10, and a desired one is appropriately selected. In the example of the first embodiment shown in FIG. 2, five groove formation lines 111, 111-1, 111-2, 111-3, 111-4, and 111-5, are set as the groove formation lines 111, but the present invention is not limited to this and any number of lines may be set. In addition, the groove formation line 111 may be set under appropriate conditions such as a predetermined length or more. The control unit 60 handles information on a plurality of desired groove formation lines 111 that can be set, for example, by a function using the device coordinate system, and the information is stored in advance in a storage device of the control unit 60 .

[0038] In the groove forming step 1001, the control unit 60 then rotates the spindle 22 to rotate the cutting blade 21 around an axis parallel to the Y-axis direction, while moving (processing feed) the cutting blade 21 along the X-axis direction, which is the processing feed direction, relative to the workpiece 100 on the holding table 10 using the X-axis direction moving unit 41, so that the cutting blade 21 cuts along the groove formation line 111 of the workpiece 100, and forms an alignment groove 121 along the groove formation line 111.

[0039] Here, in the groove forming step 1001, it is preferable to form the alignment groove 121 to a depth that does not completely divide the workpiece 100. In this case, it is possible to reduce the risk that the formation of the alignment groove 121 will cause a part of the workpiece 100 to be cut off as scrap material, or the risk that the scrap material will fly off when it is cut off, which is known as chipping.

[0040] 4 and 5 are diagrams for explaining the distance registration step 1002 in Fig. 1. The distance registration step 1002 is a step for aligning the reference line 31 of the imaging unit 30 with the alignment groove 121 and registering the distance 125 (see Fig. 4) between the alignment groove 121 and the reference line 31.

[0041] In the distance registration step 1002, after the alignment groove 121 is formed in the groove forming step 1001, the control unit 60 first uses the moving unit 40 to relatively move the holding table 10 holding the workpiece 100 and the imaging unit 30, thereby aligning the reference line 31 of the imaging unit 30 to a line that the control unit 60 recognizes as the desired groove formation line 111 along which the alignment groove 121 was formed in the groove forming step 1001.

[0042] In the distance registration step 1002, the reference line 31 of the imaging unit 30 is aligned with the line that the control unit 60 recognizes as the desired groove formation line 111, and then the control unit 60 performs an imaging process using the imaging unit 30 while aligning the reference line 31 of the imaging unit 30 with the line that the control unit 60 recognizes as the desired groove formation line 111, thereby capturing and acquiring an image 131 of the alignment groove 121 as shown in FIG. 4.

[0043] In the distance registration step 1002, the control unit 60 moves the imaging unit 30 relative to the holding table 10 that holds the workpiece 100 using the moving unit 40, while acquiring and capturing images 131 of the alignment groove 121 in all areas in which the alignment groove 121 is formed, and may then combine these images 131 so that the alignment groove 121 is smoothly connected to create an image 131 of the entire alignment groove 121.

[0044] In distance registration step 1002, after acquiring image 131, control unit 60 calculates center line 122 (see FIG. 4) that represents the center position of alignment groove 121 in the width direction and is parallel to the X-axis direction based on image 131. In distance registration step 1002, control unit 60 performs, for example, binarization processing on image 131 to form a binarized image in which an area where alignment groove 121 is not formed is represented by bright luminance and an area where alignment groove 121 is formed is represented by dark luminance, detects boundary lines between bright luminance areas and dark luminance areas in this binarized image as both end lines 123 (curved line, see FIG. 6) that indicate both ends (both edges) of alignment groove 121 in the width direction, calculates center line 124 (curved line, see FIG. 6) between both end lines 123, and calculates center line 122 that is approximate to center line 124 and is parallel to the X-axis direction based on center line 124. In the distance registration step 1002, the control unit 60 may use, for example, the least squares method in the approximation process for calculating the center line 122 based on this center line 124, or may perform the approximation process using other calculation processes.

[0045] In the distance registration step 1002, the control unit 60 calculates a center line 122 that indicates the center position of the alignment groove 121 in the width direction, and then calculates a distance 125 along the Y-axis direction between the calculated center line 122 and the reference line 31 of the imaging unit 30. This distance 125 corresponds to a so-called hairline deviation, which is a deviation between the reference line 31 of the imaging unit 30 and the processing position by the processing unit 20 that processes the workpiece 100. Note that the distance 125 includes information on the positional relationship of whether the center line 122 is in the +Y direction or the -Y direction with respect to the reference line 31, and is expressed as a positive value when the center line 122 is in the +Y direction with respect to the reference line 31, and as a negative value when the center line 122 is in the -Y direction with respect to the reference line 31, for example.

[0046] In the distance registration step 1002, the control unit 60 adds a correction process for setting the position of the machining unit 20 to the planned division line 102 based on the position information calculated and acquired based on the information on the relative position of the imaging unit 30 with respect to the holding table 10 acquired by the moving unit 40 and the information on the position in the image captured by the imaging unit 30 to cancel the distance 125 from the position calculated in the image captured by the imaging unit 30 as the position of the machining unit 20, and registers the execution of the correction process in the storage device of the control unit 60. Note that in the distance registration step 1002, instead of the calculation of the distance 125 by the control unit 60, the operator may relatively move the imaging unit 30 and the holding table 10 in the Y direction from the state of FIG. 4 to the state of FIG. 5, and calculate the distance 125 from the amount of movement.

[0047] In the workpiece processing method of embodiment 1, by carrying out such groove formation step 1001 and distance registration step 1002, so-called hairline alignment is performed, which is the process of aligning the reference line 31 of the imaging unit 30 with the processing position by the processing unit 20 that processes the workpiece 100.

[0048] Fig. 6 is a diagram for explaining the meandering detection step 1003 in Fig. 1. The meandering detection step 1003 is a step for detecting the amount of runout 126 (see Fig. 6) of the alignment groove 121 in the Y direction. In the meandering detection step 1003, first, the control unit 60 acquires an image 131 of the entire alignment groove 121 and calculates both end lines 123, similar to the distance registration step 1002. The image 131 of the entire alignment groove 121 and both end lines 123 may be acquired and calculated in the distance registration step 1002, or may be acquired and calculated again after the distance registration step 1002 is performed.

[0049] In the meandering detection step 1003, after calculating the end lines 123, the control unit 60 calculates the distance between these end lines 123 as the groove width 127 of the alignment groove 121 (see Figure 6), and also calculates the distance between the points farthest from the other end line 123 for each of the end lines 123 as the maximum separation distance 128 (see Figure 6), and calculates the difference between the calculated groove width 127 and maximum separation distance 128 (the sum of the deflection amount portions 126-1 and 126-2 in Figure 6) as the deflection amount 126 in the Y-axis direction of the alignment groove 121.

[0050] In the meandering detection step 1003, after calculating the amount of deflection 126, the control unit 60 judges whether the amount of deflection 126 is equal to or less than a predetermined threshold (tolerance value). In the meandering detection step 1003, if it is judged that the amount of deflection 126 is equal to or less than the predetermined threshold, the control unit 60 judges that no meandering has been detected in the alignment groove 121, and causes the monitor 50 to display the judgment result so as to be recognizable by the operator. In the meandering detection step 1003, if it is judged that the amount of deflection 126 is not equal to or less than the predetermined threshold, that is, if it is judged that the amount of deflection 126 is greater than the predetermined threshold, the control unit 60 judges that meandering has been detected in the alignment groove 121, and causes the monitor 50 to display the judgment result together with a message urging the operator to take measures to eliminate the meandering, that is, measures to make the amount of deflection 126 greater than the predetermined threshold equal to or less than the predetermined threshold, so as to be recognizable by the operator.

[0051] A large deflection amount 126 of the alignment groove 121, i.e., meandering of the alignment groove 121, may be caused, for example, by loosening or distortion of the cutting blade 21 at the tip of the spindle 22 when the processing unit 20 is a cutting unit as in the first embodiment. For this reason, in the meandering detection step 1003, when the control unit 60 determines that meandering has been detected in the alignment groove 121, as a countermeasure, for example, by reattaching the cutting blade 21 at the tip of the spindle 22 to eliminate the loosening or distortion of the cutting blade 21, thereby prompting a measure to eliminate the meandering.

[0052] In addition, in the meandering detection step 1003, the present invention is not limited to the above form. For example, an operator may operate the moving unit 40 to move the holding table 10 holding the workpiece 100 in the X-axis direction, while visually checking the vibration amount 126 of the alignment groove 121 in the Y-axis direction through the imaging unit 30, and determine whether the vibration amount 126 is equal to or less than a predetermined threshold value (tolerance value), thereby determining whether or not there is any meandering.

[0053] The distance meandering confirmation step 1004 is a step in which the holding table 10 is rotated to form an alignment groove 121 in a different outer peripheral excess area 108, the alignment groove 121 is aligned with the reference line 31 of the imaging unit 30 to calculate the distance 125 between the alignment groove 121 and the reference line 31, and the distance 125 registered in the distance registration step 1002 is confirmed, and the shake amount 126 detected in the meandering detection step 1003 is confirmed by detecting the shake amount 126 of the alignment groove 121 in the Y direction.

[0054] The distance meandering confirmation step 1004 is to confirm whether the distance 125 registered in the previously (immediately) performed distance registration step 1002 is accurate and whether the runout amount 126 detected in the previously (immediately) performed meandering detection step 1003 is below a predetermined threshold by again performing the same processes as the groove formation step 1001, the distance registration step 1002 and the meandering detection step 1003 on a groove formation line 111 in the outer peripheral excess area 108 of the same workpiece 100, which is different from the groove formation line 111 in which the groove formation step 1001, the distance registration step 1002 and the meandering detection step 1003 were previously (immediately) performed.

[0055] Therefore, in the distance meandering confirmation step 1004, the control unit 60 first rotates the holding table 10 holding the workpiece 100 using a rotation drive source (not shown) of the holding table 10, thereby setting the groove formation line 111 on which the subsequent groove formation step 1001, distance registration step 1002 and meandering detection step 1003 will be performed to a groove formation line 111 different from the groove formation line 111 on which the previous groove formation step 1001, distance registration step 1002 and meandering detection step 1003 were performed. In the distance meandering confirmation step 1004, for example, if the groove formation step 1001, the distance registration step 1002 and the meandering detection step 1003 are performed first on the groove formation line 111-1, the groove formation line 111 on which the subsequent groove formation step 1001, the distance registration step 1002 and the meandering detection step 1003 will be performed is set to any one of the groove formation lines 111-2, 111-3, 111-4, 111-5 other than the groove formation line 111-1.

[0056] In the method for processing a workpiece according to the first embodiment, the distance meandering confirmation step 1004 is performed at least once. In the method for processing a workpiece according to the first embodiment, it is preferable to repeatedly perform the distance meandering confirmation step 1004 until it is confirmed that the distance 125 registered in the distance registration step 1002 previously performed (immediately before) is accurate and that the runout amount 126 detected in the meandering detection step 1003 previously performed (immediately before) is equal to or less than a predetermined threshold. In the method for processing a workpiece according to the first embodiment, when it is confirmed that the distance 125 registered in the distance registration step 1002 previously performed (immediately before) is accurate and that the runout amount 126 detected in the meandering detection step 1003 previously performed (immediately before) is equal to or less than a predetermined threshold, the distance meandering confirmation step 1004 is terminated and the process proceeds to the next processing position setting step 1005.

[0057] In the method for processing the workpiece according to the first embodiment, a groove forming step 1001 and a distance registration step 1002 are performed to perform hairline alignment for aligning the first reference line 31-1 of the first imaging unit 30-1 with the processing position of the first cutting blade 21-1 attached to the tip of the first spindle 22-1 of the first processing unit 20-1, and a meandering detection step 1003 is performed to detect the Y-direction runout amount 126 of the alignment groove 121, and a distance meandering confirmation step is further performed. In addition to performing step 1004, a groove forming step 1001 and a distance registration step 1002 are performed to perform hairline alignment to align the second reference line 31-2 of the second imaging unit 30-2 with the processing position by the second cutting blade 21-2 attached to the tip of the second spindle 22-2 of the second processing unit 20-2, a meandering detection step 1003 is performed to detect the Y-direction runout amount 126 of the alignment groove 121, and further a distance meandering confirmation step 1004 is performed.

[0058] In this case, for example, in the first cutting blade 21-1, groove formation line 111-1 is used when performing groove formation step 1001, distance registration step 1002 and meandering detection step 1003, groove formation line 111-2 is used when performing distance meandering confirmation step 1004 in the first cutting blade 21-1, groove formation line 111-3 is used when performing groove formation step 1001, distance registration step 1002 and meandering detection step 1003 in the second cutting blade 21-2, and groove formation line 111-4 is used when performing distance meandering confirmation step 1004 in the second cutting blade 21-2, and different groove formation lines 111 are used in all cases.

[0059] In addition, the processing method of the workpiece in embodiment 1 is not limited to a form in which the groove forming step 1001, the distance registration step 1002, the meandering detection step 1003 and the distance meandering confirmation step 1004 are performed by the first cutting blade 21-1 and the second cutting blade 21-2 in the present invention, and for example, the groove forming step 1001, the distance registration step 1002, the meandering detection step 1003 and the distance meandering confirmation step 1004 may be performed only by the first cutting blade 21-1 or the second cutting blade 21-2 used when processing the workpiece 100 in the processing step 1006 performed later.

[0060] The processing position setting step 1005 is a step of aligning the reference line 31 with the planned dividing line 102 set on the workpiece 100 and setting the position to be processed. Specifically, in the processing position setting step 1005, the control unit 60 relatively moves the holding table 10 that holds the workpiece 100 and the imaging unit 30 by the moving unit 40, thereby aligning the reference line 31 of the imaging unit 30 with one planned dividing line 102 set on the workpiece 100, and registers in the storage device of the control unit 60 that the position on the reference line 31 at the time of alignment should be processed. In the processing position setting step 1005, this registration process is performed on one planned dividing line 102 to be processed, and the positions of the other planned dividing lines 102 are specified along the intervals between the planned dividing lines 102 registered in advance based on the planned dividing line 102 for which the registration process has been performed. In the machining position setting step 1005, a registration process is performed to set a position corrected by the distance 125 registered in the distance registration step 1002 from the position on the reference line 31 where machining is to be registered as the positioning position of the machining unit 20.

[0061] In the processing position setting step 1005, a position corrected by the distance 125 registered in the distance registration step 1002 from the position on the reference line 31 where the processing is registered is registered as the positioning position of the processing unit 20. Furthermore, the registration process is performed only after it has been confirmed that the distance 125 registered in the previous (immediately prior) distance registration step 1002 is accurate and that the amount of vibration 126 detected in the previous (immediately prior) meandering detection step 1003 is below a predetermined threshold value, so that the position to be processed can be registered more accurately.

[0062] The processing step 1006 is a step in which the processing unit 20 is positioned at a position corrected by a distance 125 from the position set in the processing position setting step 1005, i.e., the positioning position of the processing unit 20 registered in the processing position setting step 1005, and the workpiece 100 is processed along the planned division line 102. In the processing step 1006, first, the control unit 60 rotates the holding table 10 using a rotational drive source (not shown) of the holding table 10, thereby aligning the planned division line 102 on the surface 101 of the workpiece 100 on the holding table 10 registered in the processing position setting step 1005 parallel to the processing feed direction (X-axis direction), and then, by moving the holding table 10 holding the workpiece 100 and the processing unit 20 relatively using the moving unit 40, positions the processing position by the processing unit 20 (cutting position by the cutting blade 21) at the planned division line 102 on the surface 101 of the workpiece 100 on the holding table 10 registered in the processing position setting step 1005.

[0063] In processing step 1006, next, the control unit 60 rotates the spindle 22 to rotate the cutting blade 21 around an axis parallel to the Y-axis direction, while moving (processing feed) the cutting blade 21 along the processing feed direction (X-axis direction) relative to the workpiece 100 on the holding table 10 using the X-axis movement unit 41, thereby cutting the workpiece 100 along the planned division lines 102 with the cutting blade 21 to form cut grooves (machined grooves). In processing step 1006, this cutting process is performed one by one on all planned division lines 102 to be processed.

[0064] In the processing step 1006, the position corrected to cancel out the distance 125 in the processing position setting step 1005 is registered as the positioning position of the processing unit 20, and after it is confirmed that the distance 125 registered in the previous (immediately prior) distance registration step 1002 is accurate and that the runout amount 126 detected in the previous (immediately prior) meandering detection step 1003 is below a predetermined threshold, the registered position to be processed is processed, so that a cutting groove (machined groove) can be formed at a more accurate position.

[0065] The method for processing a workpiece according to the first embodiment having the above-mentioned configuration changes the groove formation line 111, which is the area where the alignment groove 121 is formed in the groove formation step 1001, distance registration step 1002, and meandering detection step 1003 performed previously (immediately before), to the groove formation line 111, which is the area where the alignment groove 121 is formed in the same processing as the groove formation step 1001, distance registration step 1002, and meandering detection step 1003 performed later in the distance meandering confirmation step 1004, by rotating the workpiece 100, so that even if the area of ​​the peripheral excess area 108 of the workpiece 100 is small, multiple groove formation lines 111 having a predetermined length or more can be set, and the alignment groove 121 having a predetermined length or more can be formed multiple times. Therefore, the method for processing a workpiece according to the first embodiment has an effect of being able to perform multiple hairline alignments and meandering checks in the workpiece 100 to be actually processed.

[0066] Furthermore, in the method for processing a workpiece according to the first embodiment, in the groove forming step 1001, the alignment groove 121 is formed to a depth that does not completely divide the workpiece 100. Therefore, the method for processing a workpiece according to the first embodiment can suppress the risk that a part of the workpiece 100 becomes scrap material and is cut off due to the formation of the alignment groove 121, and the risk that the cut-off scrap material flies away due to the cutting off of the scrap material, that is, so-called chipping occurs.

[0067] In addition, in the method for processing a workpiece according to the first embodiment, it is particularly preferable that the processing unit 20 is a cutting blade 21 attached to a mount fixed to the tip of the spindle 22. This is because, compared to other types of processing units, hairline misalignment occurs when the cutting blade 21 is replaced, and further, meandering is likely to occur due to foreign matter being pinched between the cutting blade 21 and the mount fixed to the tip of the spindle 22, or due to being attached at an angle. For this reason, the method for processing a workpiece according to the first embodiment has a particularly notable effect of being able to check hairline alignment and meandering in processing multiple times on the workpiece 100 that is actually processed, which leads to a significant reduction in the time and cost required for checking hairline alignment and meandering in processing multiple times.

[0068] In addition, the method for processing the workpiece according to the first embodiment further includes a first processing unit 20-1 having a first cutting blade 21-1 fixed to the tip of the first spindle 22-1, and a second processing unit 20-2 having a second cutting blade 21-2 fixed to the tip of the second spindle 22-2, and the groove forming step 1001, the distance registration step 1002, the meandering detection step 1003, and the distance meandering confirmation step 1004 are performed in each of the first cutting blade 21-1 and the second cutting blade 21-2. Therefore, the method for processing the workpiece according to the first embodiment has a particularly remarkable effect of being able to check the hairline alignment and meandering of processing multiple times on the workpiece 100 to be actually processed, which leads to a significant reduction in the time and cost required for checking the hairline alignment and meandering of processing multiple times in each of the multiple processing units 20-1 and 20-2.

[0069] [Embodiment 2] A method for processing a workpiece according to embodiment 2 of the present invention will be described. Fig. 7 is a perspective view showing a configuration example of a processing device 1-3 for carrying out the method for processing a workpiece according to embodiment 2. In Fig. 7, the same parts as those in embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted.

[0070] The method for processing a workpiece according to the second embodiment is the same as the method for processing a workpiece according to the first embodiment, except that instead of using the processing device 1, a processing device 1-3 shown in FIG. 7 is used.

[0071] 7, the processing device 1-3 includes a holding table 10, a processing unit 20-3, an imaging unit 30, a moving unit 40, a monitor 50, and a control unit 60. The processing device 1-3 is obtained by changing the processing unit 20 in the processing device 1 used in the first embodiment to a processing unit 20-3, and by changing the specifications of the moving unit 40 accordingly. In the processing device 1-3, the holding table 10 is provided so as to be freely movable in the X-axis direction and the Y-axis direction by an X-axis direction moving unit 41 and a Y-axis direction moving unit 42, respectively.

[0072] 7, the machining unit 20-3 is a laser beam projection unit (laser machining unit) that includes a laser beam oscillator 25 that oscillates a laser beam and an optical system 26 including a condenser lens that condenses the laser beam and radiates it toward the workpiece 100. In the machining unit 20-3, the optical system 26 is provided so as to be freely movable in the Z-axis direction by the Z-axis direction moving unit 43 of the moving unit 40.

[0073] The machining unit 20-3 irradiates the workpiece 100 held on the holding table 10 with a laser beam of a wavelength that is absorbed by the workpiece 100, while using the X-axis movement unit 41 to move (machine feed) the workpiece 100 on the holding table 10 along the machining feed direction relative to the optical system 26 of the machining unit 20-3, thereby ablating (sublimating or evaporating) the workpiece 100 with the laser beam, thereby ablating the workpiece 100 held on the holding table 10 and forming a machined groove.

[0074] In addition, the machining unit 20-3 irradiates the workpiece 100 held on the holding table 10 with a laser beam having a wavelength that is transparent to the workpiece 100, while moving (machining-feeding) the workpiece 100 on the holding table 10 relative to the optical system 26 of the machining unit 20-3 along the machining feed direction by the X-axis moving unit 41, thereby forming a machining groove consisting of a modified layer and cracks extending from the modified layer toward the front and back surfaces of the workpiece 100 along the planned division line 102 inside the workpiece 100 with the laser beam. Here, the modified layer means a region in which the density, refractive index, mechanical strength, and other physical properties are different from those of the surroundings, and examples thereof include a melting treatment region, a crack region, an insulation breakdown region, a refractive index change region, and a region in which these regions are mixed. This machining groove becomes a division starting point for dividing the workpiece 100 along the planned division line 102 by performing a grinding process or other division processes such as expanding.

[0075] In the second embodiment, the X-axis direction moving unit 41 and the Y-axis direction moving unit 42 move the holding table 10 relative to the processing unit 20-3 and the imaging unit 30 along the X-axis direction and the Y-axis direction, respectively. In the second embodiment, the Z-axis direction moving unit 43 moves the optical system 26 and the imaging unit 30 of the processing unit 20-3 relative to the holding table 10 along the Z-axis direction.

[0076] The method of processing a workpiece according to the second embodiment is the method of processing a workpiece according to the first embodiment, except that groove forming step 1001, the distance meandering confirmation step 1004 for forming an alignment groove 121, and processing step 1006 are all modified so that an alignment groove 121 and a processed groove similar to those of the first embodiment are formed by irradiating the workpiece 100 with a laser beam having a wavelength absorbed by the workpiece 100 by the processing unit 20-3, and the other configurations are the same as those of the first embodiment.

[0077] The method for processing a workpiece of embodiment 2 having the above-mentioned configuration is a modification of the method for processing a workpiece of embodiment 1, in which instead of forming the alignment groove 121 and the processed groove by the cutting blade 21 of the processing unit 20, the alignment groove 121 and the processed groove are formed by irradiating the workpiece 100 with a laser beam of a wavelength that is absorbent by the workpiece 100 by the processing unit 20-3. As in embodiment 1, the groove formation line 111, which is the area in which the alignment groove 121 was formed in the groove formation step 1001, distance registration step 1002 and meandering detection step 1003 performed earlier (immediately before), is changed to the groove formation line 111, which is the area in which the alignment groove 121 is formed in the same processing as the groove formation step 1001, distance registration step 1002 and meandering detection step 1003 performed later in the distance meandering confirmation step 1004, by rotating the workpiece 100, so that the same effect as embodiment 1 is achieved.

[0078] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0079] 1,1-3 Processing equipment 10 Holding table 20,20-3 Processing unit 20-1 First processing unit 20-2 Second processing unit 21 Cutting blade 21-1 First cutting blade 21-2 Second cutting blade 22 Spindle 22-1 First spindle 22-2 Second spindle 25 Laser beam oscillator 26 Optical system 30 Imaging unit 31 Reference Line 40 Mobile Units 60 Control Unit 100 Workpiece 102 Division line 108 Surplus outer area 121 Alignment groove 125 distance 126 Deflection 1001 Groove formation step 1002 Distance registration step 1003 Meandering detection step 1004 Distance meandering confirmation step 1005 Processing position setting step 1006 Processing Steps

Claims

1. A holding table for holding the workpiece; a processing unit that processes the workpiece held by the holding table; a moving unit that moves the holding table and the processing unit relatively in a Y direction and an X direction perpendicular to the Y direction; an imaging unit having an optical system in which a reference line for aligning the processing unit is formed in the X direction and imaging the workpiece; A control unit for controlling each of the components; A method for processing a workpiece using a processing apparatus comprising: a groove forming step of forming an alignment groove in a peripheral excess area of ​​the workpiece held on the holding table; a distance registration step of aligning the reference line of the imaging unit with the alignment groove and registering a distance between the alignment groove and the reference line; a meandering detection step of detecting a deflection amount of the alignment groove in the Y direction; a distance meandering confirmation step of rotating the holding table to form alignment grooves in different peripheral excess areas, aligning the reference line of the imaging unit with the alignment groove to calculate a distance between the alignment groove and the reference line, confirming the distance registered in the distance registration step, and detecting a runout amount of the alignment groove in the Y direction, thereby confirming the runout amount detected in the meandering detection step; a processing position setting step of aligning the reference line with a planned dividing line set on the workpiece and setting a position to be processed; a processing step of positioning the processing unit at a position corrected by the distance from the position set in the processing position setting step, and processing the workpiece along the planned dividing line, The method for machining a workpiece, wherein the distance meandering confirmation step is performed once or a plurality of times.

2. 2. The method for machining a workpiece according to claim 1, wherein said groove forming step forms said alignment groove to a depth that does not completely divide the workpiece.

3. 3. The method for machining a workpiece according to claim 1, wherein the machining unit is a cutting blade fixed to the tip of a spindle.

4. The processing unit has a first cutting blade fixed to a tip of a first spindle and a second cutting blade fixed to a tip of a second spindle, A method for processing a workpiece as described in claim 1 or 2, characterized in that the groove forming step, the distance registration step, the meandering detection step, and the distance / wandering confirmation step are performed for each of the first cutting blade and the second cutting blade.

5. 2. The method for processing a workpiece according to claim 1, wherein the processing unit is a laser beam application unit including a laser beam oscillator that oscillates a laser beam, and an optical system including a focusing lens that focuses the laser beam.

Images