Manufacturing device of semiconductor device

Abstract

To provide a manufacturing device of a semiconductor device which can further efficiently suppress the unintended vibration of a table.SOLUTION: A manufacturing device 10 comprises: a base 12; a table 14 on which a semiconductor device or its raw material is placed; and a moving mechanism 16 which moves the table 14 to the base 12. The moving mechanism 16 has: a movable unit 30 which moves in a prescribed slide direction together with the table 12; a vibration control unit 20 which is connected to the base 12 so as to be movable in a direction in which a reaction force received from the movable unit 30 is eliminated; a conductor plate 52 which is attached to the base 12, and has non-magnetism and conductivity; and a magnet flux forming mechanism 70 which is attached to the vibration control unit 20, and forms a magnetic flux which penetrating the conductive plate 52. The conductive plate 52 is formed into such a shape that a magnetic flux amount which can penetrate a material of the conductive plate 52 is increased as approaching an end part of a stroke.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present specification discloses an apparatus for manufacturing a semiconductor device, comprising a base, a table, and a moving mechanism for moving the table relative to the base. [Background technology]

[0002] Conventionally, there have been semiconductor device manufacturing devices (hereinafter referred to as "manufacturing devices") such as wire bonding devices and die bonding devices. Such manufacturing devices usually have a table on which a semiconductor device or a substrate is placed, and a moving mechanism that moves the table relative to a base.

[0003] The moving mechanism has, for example, a movable unit and a vibration-damping unit that moves the movable unit by electromagnetic action. The movable unit is connected to a table, and the vibration-damping unit is connected to a base. If the vibration-damping unit is completely fixed to the base, a reaction force generated when the movable unit moves is transmitted to the base via the vibration-damping unit. This may cause unintended vibrations in the base and, ultimately, the table.

[0004] Patent Document 1 discloses an XY table in a semiconductor manufacturing device. This XY table has a driving body (corresponding to a movable unit) that moves together with the table, and a motor body (corresponding to a vibration suppression unit) that moves the movable unit by electromagnetic action. In Patent Document 1, when the driving body is driven, the motor body is made to move in the opposite direction to the driving body. With this configuration, the reaction force generated by the movement of the driving body can be counteracted by the movement of the motor body. As a result, unintended vibrations of the base, and therefore of the table, can be suppressed, and the quality of the manufactured semiconductor device can be further improved. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 4021158 Summary of the Invention [Problem to be solved by the invention]

[0006] In order to suppress vibrations of the table, it is better for the damping unit to have a small damping rate of motion. However, if the damping rate at the end of the stroke of the damping unit is small, the damping unit may collide with other components, causing a large impact. As a result, there is a risk that unintended vibrations of the table may not be sufficiently suppressed.

[0007] Therefore, this specification discloses a manufacturing apparatus that can more effectively suppress unintended vibrations of the table. [Means for solving the problem]

[0008] The manufacturing apparatus disclosed in this specification comprises a base, a table on which a semiconductor device or its material is placed, and a moving mechanism for moving the table relative to the base, the moving mechanism comprising a movable unit connected to the table and moving in a predetermined sliding direction together with the table, a vibration control unit connected to the base so as to be movable in a direction to eliminate the reaction force received from the movable unit, a conductor plate which is nonmagnetic and conductive and attached to either the vibration control unit or the base, and a damper magnet which is attached to the other of the vibration control unit or the base and moves relative to the conductor plate within a predetermined stroke as the vibration control unit moves, and which generates a magnetic flux that penetrates the conductor plate, the conductor plate being characterized in that when the generated magnetic flux density is uniform, the magnetic flux penetrating the material of the conductor plate is greater at its ends than at its central portion.

[0009] In this case, the end of the conductive plate may have a width dimension that continuously increases as it approaches the end point of the stroke.

[0010] The conductive plate may have a plurality of adjustment holes formed therein, and the area of ​​the adjustment holes may be smaller at the end portions of the conductive plate than at the central portion.

[0011] The conductive plate may be fixed to the base, and the damper magnet may be fixed to the vibration control unit.

[0012] Furthermore, a magnetic damper including the conductor plate and the damper magnet may be disposed on both sides of the center of gravity of the vibration control unit.

[0013] In addition, a pair of the damper magnets may be arranged facing each other across the conductor plate, and an adjustment mechanism may be provided for changing the relative positions of the pair of damper magnets in order to change the facing area of ​​the pair of damper magnets. Effect of the Invention

[0014] According to the semiconductor device manufacturing apparatus disclosed in this specification, the damping force of the vibration-damping unit can be made larger at the ends of the stroke than at the center of the stroke. As a result, the damping force of the vibration-damping unit near the center of the stroke can be suppressed, and the vibration-damping unit can be effectively prevented from colliding with the stroke end. This makes it possible to more effectively suppress unintended vibrations of the table. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2 is a schematic plan view of the manufacturing apparatus. [Diagram 2] FIG. 2 is a schematic side view of a moving mechanism. [Diagram 3] 3 is a cross-sectional view taken along line AA in FIG. 2. [Figure 4] 5A and 5B are schematic diagrams illustrating the operation of a magnetic damper. [Diagram 5] FIG. 13 is a diagram illustrating an example of an adjustment mechanism. [Figure 6] 13 is a diagram showing another example of the conductor plate 52. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The configuration of the manufacturing apparatus 10 will be described below with reference to the drawings. FIG. 1 is a schematic plan view of the manufacturing apparatus 10. The manufacturing apparatus 10 has a table 14 on which a semiconductor device or a material thereof (hereinafter, both are collectively referred to as "placed object") is placed, and a tool head that performs a predetermined process on the placed object. The tool head is not shown in FIG. 1. The material of the semiconductor device includes, for example, a substrate or a wafer. The tool head also performs, for example, a transfer process, a wire bonding process, a die bonding process, etc. on the placed object.

[0017] The table 14 is movable in a first axis direction Af and a second axis direction As perpendicular to the first axis direction Af. In order to move the table 14, the manufacturing apparatus 10 further includes a first moving mechanism 16f and a second moving mechanism 16s.

[0018] The second moving mechanism 16s moves the table 14 in the second axial direction As. The first moving mechanism 16f moves the table 14 together with the movable unit 30s of the second moving mechanism 16s in the first axial direction Af.

[0019] The first moving mechanism 16f is broadly divided into a movable unit 30f and a vibration suppression unit 20f. The movable unit 30f is further broadly divided into a sub-table 31f and a mover 32f. The sub-table 31f is disposed below the table 14 and holds the table 14 via a movement guide 40s. The table 14 is movable in the first axis direction Af together with the sub-table 31f, and is also movable in the second axis direction As along the movement guide 40s.

[0020] The mover 32f is fixed to the sub-table 31f. A coil 34f is wound around the mover 32f. When a voltage is supplied to the coil 34f, the movable unit 30f moves in the first axis direction Af according to the direction of the current caused by the voltage.

[0021] The vibration suppression unit 20f has a frame 23f and a permanent magnet 24f. The frame 23f is attached to the base 12 via an absorption guide 42 (not visible in FIG. 1) described later. A plurality of permanent magnets 24f forming magnetic poles are attached to the frame 23f. The movable unit 30f moves in the first axial direction Af due to the electromagnetic action between the permanent magnets 24f and the coils 34f. Here, the weight of the vibration suppression unit 20f is sufficiently greater than the weight of the movable unit 30f. The reason for such a configuration will be described later. In this example, the coils 34f are provided on the movable element 32f, and the permanent magnets 24f are provided on the stator 22f. However, as long as the movable unit 30f can be moved linearly, the configuration of the movable element 32f and the stator 22f may be changed as appropriate. For example, the permanent magnets 24f may be provided on the movable element 32f, and the coils 34f may be provided on the stator 22f. Moreover, instead of the permanent magnet 24f, an electromagnet that generates a magnetic flux by passing a current through a coil may be used.

[0022] The second moving mechanism 16s has a similar configuration to the first moving mechanism 16f. That is, the second moving mechanism 16s is also roughly divided into a vibration suppression unit 20s and a movable unit 30s. The movable element 32s of the movable unit 30s is connected to the table 14 and moves the table 14 in the second axial direction As. As described above, the table 14 is connected to the movable unit 30f of the first moving mechanism 16f via the movement guide 40s, so that both the table 14 and the movable unit 30s move in the first axial direction Af.

[0023] The vibration suppression unit 20s has a frame 23s and a stator 22s, similar to the vibration suppression unit 20f. The frame 23f is attached to the base 12 via an absorption guide 42 (not visible in FIG. 1). The stator 22s has a permanent magnet 24s that generates an electromagnetic effect between the coil 34s and the permanent magnet 24s. When a voltage is supplied to the coil 34s, the movable unit 30s moves in the second axial direction As according to the direction of the current caused by the voltage. Here, in the second moving mechanism 16s, the weight of the vibration suppression unit 20s is sufficiently greater than the weight of the movable unit 30s. The configurations of the movable element 32s and the stator 22s may also be changed as appropriate.

[0024] Here, the reason why the weight of the vibration suppression units 20f, 20s is made greater than the weight of the movable units 30f, 30s will be explained. Note that the basic principle is the same for the first moving mechanism 16f and the second moving mechanism 16s, so in the following, the subscripts f, s will be omitted and they will be explained as "moving mechanism 16". The same applies to other members.

[0025] Fig. 2 is a schematic side view of the moving mechanism 16, and Fig. 3 is a cross-sectional view taken along line AA in Fig. 2. As described above, the frame 23 of the vibration damping unit 20 is attached to the base 12 via the absorption guide 42. The absorption guide 42 is, for example, a slide rail, and holds the vibration damping unit 20 so that it can slide in a predetermined guide direction. This guide direction (and therefore the sliding direction of the vibration damping unit 20) is parallel to the movement direction of the movable unit 30.

[0026] In this way, in this example, the vibration damping unit 20 is movable in a direction parallel to the moving direction of the movable unit 30. The reason for this configuration is to absorb the reaction force generated when the movable unit 30 moves by the sliding movement of the vibration damping unit 20. That is, when the movable unit 30 moves in a predetermined sliding direction to move the table 14, the vibration damping unit 20 receives an equal and opposite force as a reaction to the movement. At this time, if the vibration damping unit 20 is fixed to the base 12, the opposite force is transmitted to the base 12. When the base 12 vibrates due to this force, the vibration is also transmitted to the table 14 indirectly connected to the base 12, resulting in a deterioration in the quality of the semiconductor device.

[0027] In this example, in order to suppress vibration of the base 12, and therefore the table 14, the vibration suppression unit 20 is made slidable relative to the base 12. With this configuration, when the movable unit 30 slides, the vibration suppression unit 20 slides in the opposite direction to the movable unit 30. For example, in Fig. 2, when the movable unit 30 moves to the right on the page, the vibration suppression unit 20 moves to the left on the page. This suppresses the transmission of force to the base 12, and suppresses the vibration of the table 14.

[0028] Here, the acceleration when the vibration damping unit 20 slides is inversely proportional to the weight of the movable unit 30 and the weight of the vibration damping unit 20. Therefore, the greater the weight of the vibration damping unit 20 compared to the weight of the movable unit 30, the smaller the acceleration of the vibration damping unit 20 and, in turn, the moving distance. In this example, in order to keep the moving distance of the vibration damping unit 20 necessary to suppress the recoil small, the weight of the vibration damping unit 20 is made sufficiently greater than the weight of the movable unit 30.

[0029] However, there is a limit to how heavy the vibration-damping unit 20 can be. Therefore, in many cases, the movement distance of the vibration-damping unit 20 required to suppress the recoil cannot be sufficiently reduced. On the other hand, if the stroke of the vibration-damping unit 20 is made excessively large, another problem occurs, that is, the size of the entire device. Therefore, in many cases, the stroke of the vibration-damping unit 20 is limited within a certain range. However, in this case, there is a risk that the vibration-damping unit 20 will collide with the end of the stroke, i.e., the stroke end, causing an unnecessary impact.

[0030] Therefore, some have proposed arranging a mechanical damper at the stroke end to mitigate the impact of the collision of the vibration-damping unit 20. However, it is difficult to absorb the impact with only a mechanical damper. In addition, in many cases, a large mechanical damper is required, which leads to problems such as an increase in size and cost of the device. It has also been proposed to impart sliding resistance to the absorbing guide 42, thereby damping the movement of the vibration-damping unit 20. However, in this case, it is difficult to change the characteristics of the sliding resistance once it has been installed, so it is difficult to adjust the damping force according to the position and speed of the vibration-damping unit 20, the aging deterioration of the absorbing guide 42, etc.

[0031] In this example, the vibration suppression unit 20 is provided with a magnetic damper 50 in order to effectively prevent collision with the stroke end of the vibration suppression unit 20 and effectively suppress unintended vibration of the table 14. The magnetic damper 50 is a damper that utilizes the Lorentz force as a damping force. As shown in FIG. 3, the magnetic dampers 50 are provided on both sides of the vibration suppression unit 20. The magnetic dampers 50 are located at approximately the same height as the center of gravity of the vibration suppression unit 20. In other words, the magnetic dampers 50 are provided symmetrically on both sides of the center of gravity of the vibration suppression unit 20.

[0032] The magnetic damper 50 has a conductor plate 52 and a magnetic flux forming mechanism 70. The conductor plate 52 is a flat plate made of a non-magnetic and conductive metal, such as copper or aluminum. The conductor plate 52 is fixed to the base 12 with its longitudinal direction parallel to the sliding direction. In this example, a plurality of mounting posts 44 stand upright from the upper surface of the base 12. Both longitudinal ends of the conductor plate 52 are fixed to the mounting posts 44.

[0033] The conductor plate 52 in this example has a shape in which the area per unit distance in the sliding direction increases as it approaches the stroke end. Specifically, the conductor plate 52 has a central portion 56 located at the center, a transition portion 58 that gradually becomes wider as it approaches the end from the central portion 56, and an end portion 54 that extends from the transition portion 58 toward the end. Therefore, the width of the end portion 54 is sufficiently larger than the width of the central portion 56. The reason for such a shape will be described later. The width of the conductor plate 52 means the dimension in the direction perpendicular to both the direction of the magnetic flux formed by the pair of damper magnets 74 and the direction of movement of the vibration control unit 20.

[0034] The magnetic flux forming mechanism 70 forms a magnetic flux that penetrates the conductor plate 52. The magnetic flux forming mechanism 70 is fixed to the frame 23 of the vibration damping unit 20, as shown in Figures 2 and 3. Here, since the vibration damping unit 20 is slidable with respect to the base 12, the magnetic flux forming mechanism 70 fixed to the vibration damping unit 20 is movable relative to the conductor plate 52 fixed to the base 12.

[0035] The magnetic flux generating mechanism 70 includes a bracket 72 and a pair of damper magnets 74. The bracket 72 is made of a non-magnetic and insulating material such as resin, and is fixed to the frame 23. The bracket 72 is substantially U-shaped and has a groove portion that opens upward. A part of the conductor plate 52 is inserted into this groove portion. The bracket 72 also holds a pair of damper magnets 74. The damper magnets 74 are disposed on both sides of the groove portion, and therefore the conductor plate 52. The two damper magnets 74 face each other across the conductor plate 52. The two damper magnets 74 are magnetized in the same direction. The vertical range of the damper magnets 74 completely includes the vertical range of the conductor plate 52. Therefore, a magnetic flux penetrating the conductor plate 52 is generated between the two damper magnets 74. In this embodiment, the damper magnet 74 is a permanent magnet, but the damper magnet 74 may be an electromagnet that generates a magnetic flux by passing a current through a coil.

[0036] Next, the operation of the magnetic damper 50 will be described with reference to Fig. 4. Fig. 4 is a schematic diagram for explaining the operation of the magnetic damper 50. As mentioned previously and as shown in Fig. 4, a magnetic flux Fm penetrating the conductor plate 52 is generated between the two damper magnets 74. In Fig. 4, the magnetic flux Fm of the magnet is indicated by a dashed arrow.

[0037] Consider the case where the conductor plate 52 moves in the direction of the arrow B in FIG. 4 with the sliding movement of the vibration damping unit 20. In this case, the conductor plate 52 moves through the magnetic flux Fm of the magnet. As a result, an eddy current is generated in the conductor plate 52, the magnitude of which corresponds to the moving speed of the vibration damping unit 20 and the amount of the magnetic flux Fm penetrating the conductor plate 52. Due to this eddy current, a magnetic flux Fp1 in the opposite direction to the magnetic flux Fm is generated in the part of the conductor plate 52 approaching the damper magnet 74, and a magnetic flux Fp2 in the same direction as the magnetic flux Fm is generated in the part of the conductor plate 52 moving away from the damper magnet 74. Due to these magnetic fluxes Fp1 and Fp2, a repulsive force is generated between the part of the conductor plate 52 approaching the damper magnet 74 and the damper magnet 74, and an attractive force is generated between the part of the conductor plate 52 moving away from the damper magnet 74 and the damper magnet 74. The repulsive and attractive forces act as a damping force that damps the sliding movement of the magnetic flux generating mechanism 70 and, ultimately, the vibration suppression unit 20.

[0038] Here, the damping force generated by the magnetic damper 50 increases as the relative speed of the conductor plate 52 with respect to the magnetic flux generating mechanism 70 increases, and increases as the amount of magnetic flux penetrating the conductor plate 52 increases. In this example, the end portion 54 of the conductor plate 52 is wider than the central portion 56. Therefore, the amount of magnetic flux Fm penetrating the conductor plate 52 increases when the vibration damping unit 20 approaches the stroke end compared to when the vibration damping unit 20 is located at the stroke center. As a result, according to this example, when the vibration damping unit 20 is located at the stroke center, the damping force can be reduced, and the damping force can be increased only when the vibration damping unit 20 approaches the stroke end. Also, according to this example, the greater the moving speed of the vibration damping unit 20, the greater the damping force can be generated. As a result, according to this example, the reaction caused by the movement of the movable unit 30 can be effectively prevented from being transmitted to the base 12, while the vibration damping unit 20 can be effectively prevented from colliding with the stroke end. As a result, according to this example, the occurrence of unintended vibration in the table 14 can be effectively prevented, and the manufacturing quality of the semiconductor device can be improved.

[0039] Moreover, the magnetic damper 50 has as its main components the conductor plate 52 and a pair of damper magnets 74 sandwiching the conductor plate 52. In this case, the magnetic damper 50 can be significantly smaller than a mechanical damper. As a result, the entire device can be made smaller. Furthermore, the conductor plate 52 and the damper magnets 74, which are the main components of the magnetic damper 50, are not in contact with each other. Therefore, deterioration due to wear and tear is less likely to occur compared to a mechanical damper or an absorption guide 42 having sliding resistance. As a result, according to the configuration of this example, the vibration damping performance of the table 14 can be stably maintained for a long period of time.

[0040] In this example, the magnetic dampers 50 are disposed on both sides of the center of gravity of the vibration-damping unit 20. This configuration can effectively prevent the vibration-damping unit 20 from turning due to the damping force. That is, if the magnetic dampers 50 are disposed on only one side, in other words, if the damping force is applied only to one point, the vibration-damping unit 20 may turn around the one point as a fulcrum and tilt. On the other hand, by disposing the magnetic dampers 50 on both sides of the vibration-damping unit 20 as in this example, the vibration-damping unit 20 can effectively be prevented from turning.

[0041] In addition, in preparation for the case where the conductor plate 52 or the damper magnet 74 deteriorates, at least one of the conductor plate 52 and the damper magnet 74 may be made replaceable. For example, the conductor plate 52 may be fixed to the base 12 using a detachable fastening member such as a screw or a clip. In addition, the damper magnet 74 may be made detachable from the bracket 72, and the magnetic flux forming mechanism 70 itself may be made detachable from the vibration control unit 20.

[0042] Also, an adjustment mechanism may be provided to change the position of at least one of the two damper magnets 74 in order to change the opposing area of ​​the two damper magnets 74. That is, the damper magnets 74 are permanent magnets, but the magnetic force of such permanent magnets may decrease due to aging or the like. In this case, the desired damping force may not be obtained. In addition, the required damping force may change depending on the situation. Therefore, there are cases where it is desired to appropriately change the amount of magnetic flux between the two damper magnets 74. In such a case, it is possible to replace the damper magnets 74 themselves, but in that case, not only will the running costs increase, but there is also the problem that it is difficult to prepare a magnet with an appropriate magnetic force to obtain the desired damping force in the first place.

[0043] Therefore, an adjustment mechanism for changing the position of the damper magnet 74 may be provided so as to change the opposing area of ​​the two damper magnets 74. The adjustment mechanism is not particularly limited as long as it can change the relative positional relationship of the two damper magnets 74. FIG. 5 is a diagram showing an example of the adjustment mechanism. As shown in FIG. 5, one of the two damper magnets 74 is accommodated in a guide hole 78. The guide hole 78 is a hole formed in the bracket 72, and holds the damper magnet 74 movably in a predetermined adjustment direction (in the illustrated example, the left-right direction on the paper). The adjustment mechanism has a positioning spring 82 that biases the damper magnet 74 to one side in the adjustment direction, and a positioning screw 80 that presses the damper magnet 74 to the opposite side in the adjustment direction. The adjustment direction position of the damper magnet 74 can be changed by adjusting the amount of tightening of the positioning screw 80.

[0044] Here, as shown in the upper part of FIG. 4, if the center positions of the two damper magnets 74 are misaligned, the amount of magnetic flux Fm generated between them is accordingly reduced, and the damping force of the vibration-damping unit 20 is also reduced. On the other hand, as shown in the lower part of FIG. 4, a case is considered in which the relative positions of the two damper magnets 74 are changed by the adjustment mechanism to increase the facing area. In this case, the amount of magnetic flux Fm generated between them increases by the amount of the increased facing area, and the damping force of the vibration-damping unit 20 also increases. In other words, by providing an adjustment mechanism that changes the relative positions of the two damper magnets 74, fine adjustment of the damping force is possible. As a result, unintended vibration of the table 14 can be more effectively prevented. Of course, the configuration of the adjustment mechanism is not limited to the above, and other configurations may be used.

[0045] Also, the configurations described so far are all examples, and other configurations may be changed as appropriate as long as the configuration described in claim 1 is included. For example, the conductor plate 52 may have another shape as long as the magnetic flux penetrating the material of the conductor plate 52 is greater at its ends than at its center when the generated magnetic flux density is uniform. Therefore, as shown in FIG. 6, a plurality of adjustment holes 60 may be formed in the conductor plate 52, and the density of the adjustment holes 60 may be decreased toward the ends of the stroke. Also, a barrier member (e.g., a plate material made of a non-magnetic material) that prevents the magnetic flux Fm from penetrating may be attached to the center portion 56 of the conductor plate 52.

[0046] The arrangement and number of the magnetic dampers 50 may also be changed as appropriate. For example, only one magnetic damper 50 may be provided, or three or more magnetic dampers 50 may be provided. The magnetic dampers 50 may be attached not only to the side surfaces of the frame 23, but also to the top or bottom surfaces. In the above description, the conductor plate 52 is fixed to the base 12, but the conductor plate 52 may be fixed to the vibration damping unit 20 and the magnetic flux forming mechanism 70 may be fixed to the base 12. [Explanation of symbols]

[0047] 10 manufacturing equipment, 12 base, 14 table, 16 moving mechanism, 16f first moving mechanism, 16s second moving mechanism, 20 vibration control unit, 23 frame, 30 movable unit, 31f sub-table, 32 mover, 34 coil, 40 moving guide, 42 absorbing guide, 44 mounting support, 50 magnetic damper, 52 conductor plate, 54 end portion, 56 central portion, 58 transition portion, 60 adjustment hole, 70 magnetic flux forming mechanism, 72 bracket, 74 damper magnet, 78 guide hole, 80 positioning screw, 82 positioning spring, Fm magnet magnetic flux.

Claims

1. With the base, a table on which a semiconductor device or a material thereof is placed; a moving mechanism that moves the table relative to the base; The moving mechanism includes: a movable unit connected to the table and movable together with the table in a predetermined sliding direction; a vibration control unit connected to the base so as to be movable in a direction to cancel the reaction force received from the movable unit; a conductor plate attached to one of the vibration damping unit or the base, the conductor plate being nonmagnetic and conductive; a damper magnet attached to the other of the vibration damping unit or the base, which moves relative to the conductor plate within a predetermined stroke as the vibration damping unit moves, and which generates a magnetic flux that penetrates the conductor plate; the conductor plate is shaped such that, when the generated magnetic flux density is uniform, the magnetic flux penetrating the material of the conductor plate is greater at its ends than at its center.

2. A semiconductor device manufacturing apparatus comprising:

2. 2. The semiconductor device manufacturing apparatus according to claim 1, 11. An apparatus for manufacturing a semiconductor device, comprising: a conductive plate having an end portion, the end portion having a width dimension which continuously increases as the end portion approaches an end point of the stroke.

3. 2. The semiconductor device manufacturing apparatus according to claim 1, The conductor plate has a plurality of adjustment holes formed therein, the area of ​​the adjustment hole is smaller at the end portion of the conductor plate than at the central portion; 2. A semiconductor device manufacturing apparatus comprising:

4. 2. The semiconductor device manufacturing apparatus according to claim 1, the conductive plate is fixed to the base; The damper magnet is fixed to the vibration control unit.

2. A semiconductor device manufacturing apparatus comprising:

5. 2. The semiconductor device manufacturing apparatus according to claim 1, a magnetic damper including the conductor plate and the damper magnet, the magnetic damper being disposed on either side of the center of gravity of the vibration control unit;

6. 2. The semiconductor device manufacturing apparatus according to claim 1, A pair of the damper magnets are disposed opposite each other with the conductor plate therebetween, Further, an adjustment mechanism is provided for changing the relative position of the pair of damper magnets in order to change the opposing area of ​​the pair of damper magnets.

2. A semiconductor device manufacturing apparatus comprising:

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