Wafer test system and prober

Abstract

To provide a wafer test system capable of automating an exchange of probe cards at low cost while suppressing an increase of an installation space, and a prober.SOLUTION: A wafer test system 2 comprises: a prober 10; an unmanned carrier (ceiling travel type unmanned carrier 54); a card conveyance mechanism 32 which conveys a probe card 30 between a hold position and an exchange position; a conveyance control section (a collection control section 84 and a carrying-in control section 86) which conveys the probe card 30 between the exchange position and a storage place; a separation control section 64 which controls the card conveyance mechanism 32 and conveys the probe card 30 before an exchange from the hold position to the exchange position; and a mount control section 66 which controls the card conveyance mechanism 32 and conveys a new probe card 30 from the exchange position to the hold position. The prober 10 includes an opening 34a which is formed in a housing 34, a door 35, a door opening / closing mechanism 49, and a door opening / closing control section 70.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wafer test system that uses a prober to inspect semiconductor wafers, a probe card replacement method for replacing a probe card of the prober, and a prober used in the wafer test system. [Background technology]

[0002] A plurality of semiconductor chips each having the same electric element circuit are formed on the surface of a semiconductor wafer. Before each semiconductor chip is individually cut by a dicer in the semiconductor manufacturing process, the electrical characteristics of each semiconductor chip are inspected by a wafer test system. This wafer test system includes a prober and a tester (see Patent Document 1).

[0003] The prober holds a semiconductor wafer on a wafer chuck and moves a probe card having probe needles relative to the wafer chuck to electrically contact the probe needles with the electrode pads of the semiconductor chip. The tester supplies various test signals to the semiconductor chip via terminals connected to the probe needles, and receives and analyzes signals output from the semiconductor chip to test whether the semiconductor chip operates normally.

[0004] In recent years, automation of semiconductor manufacturing processes has progressed, and so has automation of wafer test systems. For example, in the wafer test system described in Patent Document 1, a cassette containing multiple semiconductor wafers to be inspected is placed on a load port of a prober using an overhead hoist transport (OHT). Next, in the wafer test system, the semiconductor wafer is set on a wafer chuck, probe needles are contacted with each semiconductor chip on the semiconductor wafer, and each semiconductor chip is tested by a tester. Then, the cassette containing the inspected semiconductor wafer is retrieved from the prober by the OHT. This allows the semiconductor wafer to be inspected without the intervention of an operator. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2007-329458 A Summary of the Invention [Problem to be solved by the invention]

[0006] Incidentally, the types of semiconductor chips formed on a semiconductor wafer are diverse, and the types of probe cards used to inspect the semiconductor chips are also diverse. For this reason, in a wafer test system, the type of probe card set in a prober may need to be changed in response to switching of the type of semiconductor chip to be inspected. Conventionally, an operator was always involved in the replacement of a probe card in a prober, and this replacement was performed manually or semi-automatically. For this reason, devices delivered to the United States and Europe must meet certain safety standards (SEMI standard S2CE, etc.), and for example, when opening and closing the door of the prober to replace the probe card, the power supply of the driving unit of the prober must be turned off. Furthermore, since manual replacement of the probe card by an operator may cause the probe card to be dropped by mistake, there is a strong demand for automating the replacement of the probe card in a prober in the semiconductor manufacturing process.

[0007] In order to automate the replacement of the probe card of the prober, it is necessary to automate the removal of the probe card from the prober and the loading of a new probe card into the prober. However, when a new facility for removing and loading the probe card is installed in the semiconductor manufacturing process, there are problems in terms of cost and installation space.

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a wafer test system, a probe card replacement method, and a prober that can automate probe card replacement at low cost while minimizing increases in installation space. [Means for solving the problem]

[0009] A wafer test system for achieving the object of the present invention includes a prober having a chuck for holding a semiconductor wafer and a probe card having probe needles, and for inspecting a semiconductor chip by bringing the probe needles into contact with a plurality of semiconductor chips formed on the semiconductor wafer; an overhead traveling type unmanned guided vehicle that moves along a transport rail while holding a cassette for storing a plurality of semiconductor wafers, and that carries in the cassette for storing a plurality of semiconductor wafers before inspection into the prober and retrieves from the prober the cassette for storing a plurality of semiconductor wafers after inspection; a transport control unit that controls the overhead traveling type unmanned guided vehicle to transport the probe card between a probe card exchange position predetermined in the prober and a probe card storage location located separately from the prober; a card transport mechanism provided in the prober that transports the probe card between a holding position where the probe card is held in the prober and an exchange position; a separation control unit that controls the card transport mechanism to perform a separation process for transporting the probe card before replacement from the holding position to the exchange position; and a mounting control unit that controls the card transport mechanism to perform a mounting process for transporting a new probe card from the exchange position to the holding position.

[0010] According to this wafer test system, the probe card of the prober can be automatically replaced by using an overhead traveling automatic guided vehicle for transporting cassettes.

[0011] In a wafer test system according to another aspect of the present invention, the prober includes a housing for storing a chuck, a probe card, and a card transport mechanism, an opening formed in the housing for exposing an exchange position to the outside of the housing, a door switchable between an open state for opening the opening and a closed state for covering the opening, a door opening / closing mechanism for switching the door between the open state and the closed state, and a door opening / closing control unit for driving the door opening / closing mechanism to switch the door from the closed state to the open state in a separation process and driving the door opening / closing mechanism to switch the door from the open state to the closed state in a mounting process. This makes it possible to automate the opening and closing of the door during the separation process and the mounting process.

[0012] In another aspect of the present invention, a wafer test system includes a human detection sensor that detects whether a person has entered a preset protected area based on the position of the door, and a door opening / closing control unit stops the operation of the door opening / closing mechanism while a person is entering the protected area based on the detection result of the human detection sensor, thereby preventing the door from colliding with the person or having a hand or finger caught in the door.

[0013] In a wafer test system according to another aspect of the present invention, when the door opening / closing control unit stops the operation of the door opening / closing mechanism midway, the door opening / closing control unit restarts the operation of the door opening / closing mechanism in response to the detection result of the human detection sensor switching from the presence of a human intrusion into the protected area to the absence of a human intrusion, thereby reducing the effort required for the operator to perform the restart operation.

[0014] In a wafer test system according to another aspect of the present invention, the system includes a card holding section that holds a probe card detachably at a holding position, a card transport mechanism has a tray capable of holding the probe card and transports the tray between the holding position and the replacement position, and a separation control section sequentially executes, as a separation process, a process of driving the card transport mechanism to transport the tray to the holding position, a process of releasing the probe card held by the card holding section and having the tray hold the probe card, and a process of driving the card transport mechanism to transport the tray from the holding position to the replacement position, and a mounting control section, when a new probe card is held on the tray at the replacement position, sequentially executes, as a mounting process, a process of driving the card transport mechanism to transport the tray from the replacement position to the holding position, and a process of having the card holding section hold the probe card. This allows the separation process and the mounting process to be automated, so that the replacement of the probe card in the prober can be fully automated.

[0015] In a wafer test system according to another aspect of the present invention, the prober includes a card holder that holds a probe card, and a card transport mechanism transports the probe card and the card holder together between a holding position and an exchange position.

[0016] In a wafer test system according to another aspect of the present invention, the card holder has a card holding hole for holding a probe card, the ceiling-traveling automated guided vehicle places the probe card in the card holding hole of the card holder at the exchange position, and the card holder has a plurality of positioning parts provided on an opening edge part that forms the card holding hole of the card holder, and the plurality of positioning parts have guide surfaces that guide the probe card into the card holding hole when the probe card is placed in the card holding hole by the ceiling-traveling automated guided vehicle, thereby making it possible to reliably guide the probe card into the card holding hole.

[0017] In a wafer test system according to another aspect of the present invention, a transport control unit controls an overhead traveling automated guided vehicle to execute a recovery process of transporting a probe card before replacement of a prober from a replacement position to a storage location and a carry-in process of transporting a new probe card from the storage location to the replacement position, the transport control unit includes a human detection sensor that detects whether or not a person has entered a protected area that is set in advance based on the replacement position, the transport control unit stops the recovery process while a person has entered the protected area based on the detection result of the human detection sensor, and the transport control unit stops the carry-in process while a person has entered the protected area based on the detection result of the human detection sensor. This prevents the overhead traveling automated guided vehicle from colliding with a person.

[0018] In a wafer test system according to another aspect of the present invention, a transport control unit controls an overhead traveling type automated guided vehicle to perform a recovery process of transporting a probe card before replacement of a prober from a replacement position to a storage location and a carry-in process of transporting a new probe card from the storage location to the replacement position, the overhead traveling type automated guided vehicle has a lifting and lowering holding unit that can be raised and lowered and that detachably holds a cassette or a probe card, and the transport control unit controls the recovery process to move the overhead traveling type automated guided vehicle to a position directly above the replacement position and to lower the lifting and lowering holding unit to the replacement position. a process of holding the probe card at the exchange position by the lifting holding unit, a process of having the lifting holding unit hold the probe card at the exchange position, a process of lifting the lifting holding unit, and a process of moving the ceiling traveling type automated guided vehicle from the directly above position to the storage location, and a transport control unit executes, as a carry-in process, a process of having the lifting holding unit hold the probe card at the storage location, a process of moving the ceiling traveling type automated guided vehicle from the storage location to the directly above position, a process of lowering the lifting holding unit, a process of having the lifting holding unit release the hold of the probe card at the exchange position by the lifting holding unit, and a process of lifting the lifting holding unit. This makes it possible to automatically replace the probe card of the prober by using the ceiling traveling type automated guided vehicle for transporting cassettes.

[0019] In a wafer test system according to another aspect of the present invention, a card transport mechanism is provided in a prober and transports a probe card between a holding position in the prober and an exchange position, the card transport mechanism has a tray capable of holding the probe card and transports the tray between the holding position and the exchange position, the card transport mechanism is provided in the tray and has a card sensor that detects the presence or absence of the probe card on the tray, and a transport control unit executes a process of lowering the lifting and lowering holding unit while the card sensor detects that there is no probe card on the tray, and further executes a process of releasing the holding of the probe card by the lifting and lowering holding unit and raising the lifting and lowering holding unit in response to the detection result of the card sensor switching from the absence of the probe card on the tray to the presence of the probe card. This makes it possible to automate the loading process.

[0020] In a wafer test system according to another aspect of the present invention, the transport rail extends in the X direction among mutually orthogonal XYZ directions, the overhead traveling automated guided vehicle has a lifting and lowering holding part that can be raised and lowered in the Z direction and whose position can be adjusted within a predetermined movable range in the Y direction, and the lifting and lowering holding part can detachably hold a cassette or a probe card, the prober has a load port that is provided at a position different from the exchange position in the X direction and on which the cassette is placed by the overhead traveling automated guided vehicle, and the lifting and lowering holding part can place the cassette on the load port within the movable range of the lifting and lowering holding part in the Y direction, and can place the probe card on the exchange position. This makes it possible to retrieve the probe card from the exchange position and carry the probe card into the exchange position by using the overhead traveling automated guided vehicle for transporting the cassette.

[0021] A probe card exchange method for achieving the object of the present invention is a probe card exchange method for exchanging a probe card of a prober which is equipped with a chuck for holding a semiconductor wafer and a probe card having probe needles, and which performs an inspection by bringing the probe needles into contact with a plurality of semiconductor chips formed on the semiconductor wafer, the method comprising the steps of: a separation step in which a card transport mechanism of the prober performs a separation process for transporting the probe card before replacement from a holding position in the prober where the probe card is held to a probe card exchange position predetermined in the prober; and a transfer step in which the card transport mechanism of the prober moves along a transport rail while holding a cassette which stores a plurality of semiconductor wafers; The method also includes a recovery step in which an overhead traveling type unmanned guided vehicle carries out a recovery process of transporting the unreplaced probe card transported to the replacement position from the replacement position to a probe card storage location located away from the prober, the unreplaced probe card having been transported to the replacement position being transported therefrom by the overhead traveling type unmanned guided vehicle; a carrying-in step in which the overhead traveling type unmanned guided vehicle carries out a carrying-in process of transporting a new probe card from the storage location to the replacement position; and an attachment step in which a card transport mechanism carries out an attachment process of transporting the new probe card from the replacement position to the holding position.

[0022] A prober for achieving the object of the present invention includes a chuck for holding a semiconductor wafer and a probe card having probe needles, and the probe needles are brought into contact with multiple semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips, the prober including a card transport mechanism for transporting the probe card between a holding position in the prober and an exchange position for exchanging the probe card, and a load port on which a cassette for storing multiple semiconductor wafers is placed by an overhead traveling type automated guided vehicle that is movable along a transport rail extending in the X direction among mutually perpendicular XYZ directions and has a lifting holding part that is liftable in the Z direction and whose position can be adjusted within a predetermined movable range in the Y direction, the cassette can be placed on the load port by the lifting holding part within the movable range of the lifting holding part in the Y direction, and the probe card can be placed on the exchange position by the lifting holding part, the probe card has a held part held by the lifting holding part, and the exchange position is a position where the probe card can be exchanged by the overhead traveling type automated guided vehicle. Effect of the Invention

[0023] The present invention can automate probe card replacement at low cost while minimizing an increase in installation space. [Brief description of the drawings]

[0024] [Figure 1] FIG. 1 is a schematic diagram of a wafer test system. [Diagram 2] FIG. 2 is a schematic diagram of a prober and a tester. [Diagram 3] FIG. [Figure 4] 13 is an enlarged view of a plurality of positioning portions provided on the card holder. FIG. [Diagram 5] FIG. 2 is a perspective view of a tray that holds a probe card and a card holder. [Figure 6] FIG. [Figure 7] FIG. 13 is an explanatory diagram for explaining a separation process when replacing a probe card. [Figure 8]FIG. 13 is an explanatory diagram for explaining a separation process when replacing a probe card. [Figure 9] 11 is an explanatory diagram for explaining a mounting process when replacing a probe card. FIG. [Figure 10] 11 is an explanatory diagram for explaining a mounting process when replacing a probe card. FIG. [Figure 11] 1 is a perspective view of a door of a housing switched to an open state; FIG. [Figure 12] 1 is a perspective view of a door of a housing switched to a closed state; FIG. [Figure 13] FIG. 2 is an explanatory diagram of a laser scanner. [Figure 14] FIG. 1 is a schematic diagram of an OHT of a wafer transport mechanism. [Figure 15] 11 is an explanatory diagram for explaining conditions that enable the retrieval and loading processes of a probe card by a wafer transport mechanism. FIG. [Figure 16] 2 is a functional block diagram of a prober control unit of a prober and a GEM host. [Figure 17] 11 is a flowchart showing a flow of a probe card replacement process of a prober performed in a wafer test system. [Figure 18] FIG. 18 is an explanatory diagram for explaining the separation process (exchange instruction) in step S1 shown in FIG. [Figure 19] 18 is an explanatory diagram for explaining the separation process (tray transport) in step S1 shown in FIG. 17. FIG. [Figure 20] FIG. 18 is an explanatory diagram for explaining the separation process (start of switching to the open state of the door) in step S1 shown in FIG. 17. [Figure 21] FIG. 18 is an explanatory diagram for explaining the separation process (emergency stop of the door opening and closing mechanism) in step S1 shown in FIG. 17. [Figure 22] 18 is an explanatory diagram for explaining the separation process (restarting the driving of the door opening and closing mechanism) in step S1 shown in FIG. 17. FIG. [Diagram 23] 18 is an explanatory diagram for explaining the separation process (notification of completion of exchange preparation) in step S1 shown in FIG. 17. FIG. [Figure 24]18 is an explanatory diagram for explaining the recovery process (lowering of the lifting / lowering holding part) in step S2 of FIG. 17. FIG. [Diagram 25] 18 is an explanatory diagram for explaining the recovery process (raising of the lifting / lowering holding part) in step S2 of FIG. 17. FIG. [Figure 26] 18 is an explanatory diagram for explaining the loading process (transportation of a probe card) in step S3 shown in FIG. 17. FIG. [Figure 27] 18 is an explanatory diagram for explaining the carry-in process (lowering of the lifting / lowering holding part) in step S3 shown in FIG. 17. FIG. [Figure 28] 18 is an explanatory diagram for explaining the carry-in process (raising of the lifting support part) in step S3 shown in FIG. 17. FIG. [Figure 29] FIG. 18 is an explanatory diagram for explaining the mounting process (mounting instruction) in step S4 shown in FIG. 17. [Diagram 30] 18 is an explanatory diagram for explaining the mounting process (start of switching to the closed state of the door) in step S4 shown in FIG. 17. FIG. [Diagram 31] 18 is an explanatory diagram for explaining the mounting process (read information, authentication result) in step S4 shown in FIG. 17. FIG. [Diagram 32] 18 is an explanatory diagram for explaining the mounting process (mounting of a probe card) in step S4 shown in FIG. 17. FIG. [Diagram 33] 18 is an explanatory diagram for explaining the mounting process (movement of the chuck) in step S4 shown in FIG. 17. FIG. [Diagram 34] FIG. 18 is an explanatory diagram for explaining the mounting process (replacement completion notification) in step S4 shown in FIG. 17. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] [Overall configuration of wafer test system] Fig. 1 is a schematic diagram of a wafer test system 2. As shown in Fig. 1, the wafer test system 2 automatically inspects the electrical characteristics of each semiconductor chip (not shown) of a semiconductor wafer W using a prober 10 described below. The wafer test system 2 also automatically replaces a probe card 30 of the prober 10.

[0026] The wafer test system 2 mainly includes a prober 10, a tester 11 (see FIG. 2), a laser scanner 12, a wafer transport mechanism 14, and a GEM host 16, which is a GEM (Generic Model For Communications and Control Of Manufacturing Equipment) computer. The wafer test system 2 is provided with a plurality of probers 10 (see FIG. 14).

[0027] Each prober 10, the wafer transport mechanism 14, and the GEM host 16 are connected to each other via a known network 18. Note that in reality, the network 18 connecting each prober 10 and the GEM host 16 is different from the network 18 connecting the wafer transport mechanism 14 and the GEM host 16 (see FIG. 16). Also, each prober 10 and the wafer transport mechanism 14 (OHT 54) are connected by an I / O interface 19 (SEMI-E48 compliant) (see FIG. 16). Also, the laser scanner 12 is connected to the prober 10, and is connected to the GEM host 16 via the prober 10 and the network 18.

[0028] [Prober] FIG. 2 is a schematic diagram of the prober 10 and the tester 11. In the figure, the XYZ directions are orthogonal to each other, and the XY direction is the horizontal direction, and the Z direction is the vertical direction. As shown in FIG. 2, the prober 10 is roughly divided into a base 20, a load port 21 (see FIG. 13), a chuck 22, a chuck moving mechanism 24, a card holding unit 26, a card holder 28, a probe card 30, a card transport mechanism 32, and a housing 34 that houses them. Note that the detailed configuration of the prober 10 is a publicly known technology (see, for example, JP 2018-117096 A), so only a partial configuration of the prober 10 will be described here.

[0029] A chuck 22 is held on the base 20 so as to be movable in each of the X, Y and Z directions, and is also held so as to be rotatable in the θ direction, which is a direction around an axis parallel to the Z direction. In addition, a card transport mechanism 32 is held on the base 20 so as to be movable in the Y direction.

[0030] A cassette CS storing a plurality of semiconductor wafers W to be inspected is placed on the load port 21 (see FIG. 13) by an OHT 54 of a wafer transport mechanism 14 described later. Although not shown, the prober 10 is provided with a transport mechanism for transporting the semiconductor wafers W between the load port 21 and the chuck 22.

[0031] The semiconductor wafer W is held on the upper surface of the chuck 22 by various holding methods such as vacuum suction. Inside the chuck 22, a temperature adjustment unit (not shown) that adjusts the temperature of the semiconductor wafer W is provided.

[0032] Further, the chuck 22 is provided with a connecting portion 36 at a position facing a card transport mechanism 32 described later. The connecting portion 36 is used to connect the chuck 22 and the card transport mechanism 32. The connecting portion 36 is stored inside the chuck 22 except when the probe card 30 described later is replaced, and when the probe card 30 is replaced, the connecting portion 36 protrudes from the side surface of the chuck 22 in the Y direction to connect to the card transport mechanism 32. This allows the chuck 22 and the card transport mechanism 32 to move together when the probe card 30 is replaced. Note that the connecting portion 36 may not be provided and the chuck 22 and the card transport mechanism 32 may always move together.

[0033] The chuck moving mechanism 24 is a known actuator composed of a motor or the like. The chuck moving mechanism 24 can move the chuck 22 in the X, Y, Z, and θ directions. This allows the semiconductor wafer W held by the chuck 22 and a probe needle 30a (described later) to be moved relatively in the X, Y, Z, and θ directions. Furthermore, the chuck moving mechanism 24 moves the chuck 22 and the card transport mechanism 32 together in the Y direction when replacing the probe card 30. Note that a mechanism for moving the card transport mechanism 32 may be provided separately from the chuck moving mechanism 24.

[0034] Card holding section 26 (also referred to as head stage) is provided at a position above chuck 22 in the Z direction, and detachably holds card holder 28. Card holder 28 holds the outer periphery of probe card 30. Thus, card holding section 26 detachably holds probe card 30 via card holder 28.

[0035] Fig. 3 is a top view of the card holder 28. Fig. 4 is an enlarged view of a plurality of positioning portions 40 provided on the card holder 28.

[0036] 3 and 4, card holder 28 has a card holding hole 38 that holds the outer periphery of probe card 30. Card holder 28 also has a plurality of positioning portions 40 provided at intervals along the opening edge that forms card holding hole 38.

[0037] Each positioning portion 40 has a guide surface 40a that guides the probe card 30 into the card holding hole 38 when the probe card 30 is placed in the card holding hole 38 by an OHT 54 described later (see FIG. 27). The guide surface 40a is an inclined surface whose Z-direction lower end is located on the opening edge of the card holding hole 38 and which is gradually inclined so as to move away from the card holding hole 38 in the horizontal direction as it moves upward in the Z direction. This allows the probe card 30 to be guided into the card holding hole 38 along the guide surface 40a of each positioning portion 40.

[0038] 2, the probe card 30 has probe needles 30a arranged according to the arrangement of electrode pads of a semiconductor chip (not shown) formed in large numbers on the semiconductor wafer W. In addition, the upper surface of the probe card 30 is provided with a held portion 30b that is held by a lifting and lowering holding portion 54a (see FIG. 1) of an OHT 54 constituting a wafer transport mechanism 14 described below. Furthermore, the probe card 30 is provided with a connection terminal (not shown) electrically connected to the probe needles 30a, and the tester 11 is connected to this connection terminal.

[0039] The tester 11 supplies various test signals to the electrode pads of each semiconductor chip on the semiconductor wafer W via the connection terminals of the probe card 30 and the probe needles 30a, and receives and analyzes signals output from the electrode pads to inspect (test) whether the semiconductor chips operate normally. Note that the configuration and test method of the tester 11 are well known technologies, so detailed explanations will be omitted.

[0040] The probe card 30 used for such semiconductor chip inspection is replaced, for example, according to the type of semiconductor chip, or is replaced after a predetermined number of inspections. In the wafer test system 2 of this embodiment, the probe card 30 is automatically replaced using the chuck moving mechanism 24 described above, the card transport mechanism 32 described below, and the wafer transport mechanism 14 described below. The "replacement of the probe card 30" here includes a case where a new probe card 30 is mounted on the prober 10 when the probe card 30 is not mounted on the prober 10, but in this embodiment, an example will be described in which the probe card 30 before replacement, which is already held in the card holding unit 26, is replaced with the new probe card 30.

[0041] When exchanging the probe card 30, the card transport mechanism 32, together with the chuck moving mechanism 24, performs a separation process of transporting the card holder 28 and the probe card 30 before the exchange from the "holding position" to the "exchange position" as a whole, and a mounting process of transporting the card holder 28 and the new probe card 30 from the "exchange position" to the "holding position" as a whole. Here, the holding position is a position where the probe card 30 and the card holder 28 are held by the card holding unit 26. The exchange position is a position where the probe card 30 is exchanged in the prober 10, more specifically, a position where the probe card 30 can be retrieved and carried in by an OHT 54 (see FIG. 1) described later (see FIG. 8).

[0042] When exchanging the probe card 30, the card transport mechanism 32 is connected to the chuck 22 via the above-mentioned connecting portion 36 (see FIG. 7), thereby transporting the card holder 28 and the probe card 30 together between the holding position and the exchange position.

[0043] The card transport mechanism 32 holds a substantially flat tray 42 capable of holding (supporting) the probe card 30 and the card holder 28, so that the tray 42 can be displaced between a lying state parallel to the XZ plane (see FIG. 2) and an upright state parallel to the XY plane (see FIG. 7). The card transport mechanism 32 also holds the upright tray 42 so that it can be raised and lowered in the Z direction (see FIG. 7).

[0044] Fig. 5 is a perspective view of the tray 42 that holds (supports) the probe card 30 and the card holder 28. Fig. 6 is a top view of the tray 42. As shown in Figs. 5 and 6, the tray 42 has holder holding holes 44 that hold the outer periphery of the card holder 28, and holds the card holder 28 by the holder holding holes 44 in the above-mentioned upright state. In this way, the tray 42 holds the probe card 30 and the card holder 28 together.

[0045] The tray 42 is provided with a plurality of holder sensors 46 for detecting the presence or absence of the card holder 28, and a plurality of card sensors 48 for detecting the presence or absence of the probe card 30. Each holder sensor 46 is, for example, a pressure-type (or pressure-sensitive) sensor provided on the bottom surface of the holder holding hole 44. When the card holder 28 is held in the holder holding hole 44, each holder sensor 46 is pressed by the card holder 28 to change its sensor output value. This makes it possible to detect the presence or absence of the card holder 28 on the tray 42 based on the sensor output value of each holder sensor 46.

[0046] Each card sensor 48 is, for example, a pressure-type sensor provided inside the holder holding hole 44. A sensor head of each card sensor 48 protrudes upward in the Z direction from the inside of the card holding hole 38 when the card holder 28 is held in the holder holding hole 44. Therefore, when the probe card 30 is held in the card holding hole 38, each card sensor 48 changes its sensor output value by being pressed by the card holder 28. This makes it possible to detect the presence or absence of the probe card 30 on the tray 42 based on the sensor output value of each card sensor 48.

[0047] 7 and 8 are explanatory diagrams for explaining a separation process when replacing the probe card 30. In order to prevent the drawings from becoming complicated, the internal structure of the prober 10, the probe card 30, etc. are simply shown in Fig. 7 and Fig. 8 (Fig. 9 and Fig. 10 described later), and further, the sizes of the probe card 30 and the card holder 28 are emphasized more than the tray 42 so that it is clear that the probe card 30 and the card holder 28 are transported by the tray 42.

[0048] 7, before the start of the separation process, the chuck 22 is positioned at the inspection position Y1, which is a position vertically below the card holding portion 26. The card transport mechanism 32 is positioned at the exchange position. Furthermore, the tray 42 of the card transport mechanism 32 is switched to a laid-down state.

[0049] 7, when the separation process is started, the chuck moving mechanism 24 moves the chuck 22 to a connecting position Y3. The connecting position Y3 is a position adjacent to the exchange position and is a position where the chuck 22 can be connected to the card transport mechanism 32. Then, a connecting portion 36 protrudes from a side surface of the chuck 22 in the Y direction and is connected to the card transport mechanism 32. This allows the chuck 22 and the card transport mechanism 32 to move together in the Y direction.

[0050] 7, after the chuck 22 and the card transport mechanism 32 are connected, the chuck moving mechanism 24 moves the chuck 22 to the tray switching position Y2 between the inspection position Y1 and the connection position Y3. After this movement is completed, the card transport mechanism 32 switches the tray 42 from the laid-down state to the upright state.

[0051] As shown by reference symbol 7D in Fig. 7, after the tray 42 is switched to the upright state, the chuck moving mechanism 24 moves the chuck 22 to the separation / attachment position Y0. This separation / attachment position Y0 is a position where the tray 42 is adjusted to a position vertically below the card holding section 26, and more specifically, is a position where the holder holding hole 44 of the tray 42 coincides with the card holder 28 held by the card holding section 26. After this movement is completed, the card transport mechanism 32 lifts the tray 42 and transports it to a position where it contacts the card holder 28 held by the card holding section 26. As a result, the card holder 28 is held in the holder holding hole 44 of the tray 42, and the probe card 30 is held via the card holder 28.

[0052] 8, when the probe card 30 and the card holder 28 are held by the tray 42 and the card holder 28 is released from the card holding portion 26, the sensor output value of each holder sensor 46 and the output value of each card sensor 48 change. As a result, the probe card 30 and the card holder 28 are held by the tray 42.

[0053] As shown by reference symbol 8B in FIG. 8, when the card holder 28 is released from the card holding portion 26, the card transport mechanism 32 lowers the tray 42.

[0054] As shown by reference symbol 8C in FIG. 8, when the descent of the tray 42 is completed, the chuck moving mechanism 24 moves the chuck 22 to the connection position Y3. As a result, the tray 42 of the card transport mechanism 32 is transported to the replacement position, and the probe card 30 and the card holder 28 are also transported to the replacement position. Since a door 35, which will be described later in detail, is provided in front of the replacement position, the chuck moving mechanism 24 temporarily stops the transport of the tray 42 in front of the door 35 when transporting the tray 42 toward the replacement position, and resumes the transport of the tray 42 after the door 35 is opened (see FIG. 22, which will be described later). By transporting the tray 42 to the replacement position, the OHT 54, which will be described later, can retrieve the probe card 30 before replacement from the tray 42 (see FIG. 25), and the OHT 54 can carry a new probe card 30 into the tray 42 (see FIG. 27).

[0055] 9 and 10 are explanatory diagrams for explaining the mounting process when replacing the probe card 30. FIG.

[0056] As shown by reference symbol 9A in Fig. 9, when a new probe card 30 is held by the card holder 28 on the tray 42 set at the replacement position, the chuck moving mechanism 24 moves the chuck 22 to the separation / attachment position Y0 as shown by reference symbol 9B in Fig. 9. As a result, the tray 42, the probe card 30, and the card holder 28 are positioned vertically below the card holding section 26. Then, the card transport mechanism 32 lifts the tray 42. As a result, the card holder 28 and the probe card 30 held by the tray 42 are also lifted together.

[0057] 9, the card transport mechanism 32 continues to raise the tray 42 until the card holder 28 reaches the card holding section 26 (holding position). As a result, the tray 42, the probe card 30, and the card holder 28 are transported from the replacement position to the holding position, and when this transport is completed, the card holding section 26 holds the card holder 28. As a result, a new probe card 30 is attached to the card holding section 26 via the card holder 28.

[0058] 10, when the card holding section 26 holds the card holder 28, the card transport mechanism 32 lowers the tray 42. This causes the tray 42 to release the card holder 28 from its hold.

[0059] 10, when the lowering of the tray 42 is completed, the chuck moving mechanism 24 moves the chuck 22 to the tray switching position Y2. After this movement is completed, the card transport mechanism 32 switches the tray 42 from the upright state to the laid state.

[0060] 10, after the tray 42 is switched to the laid-down state, the chuck moving mechanism 24 moves the chuck 22 to the connecting position Y3. Then, the connecting portion 36 is stored inside the chuck 22, whereby the connection between the chuck 22 and the card transport mechanism 32 is released. As a result, the card transport mechanism 32 is located at the exchange position before the start of the separation process.

[0061] 10, when the chuck 22 is released from the card transport mechanism 32, the chuck moving mechanism 24 moves the chuck 22 to the inspection position Y1, thereby completing the mounting process.

[0062] Fig. 11 is a perspective view of the door 35 of the housing 34 switched to the open state. Fig. 12 is a perspective view of the door 35 of the housing 34 switched to the closed state. As shown in Figs. 11 and 12, the housing 34 has an opening 34a that exposes the replacement position, more specifically, the tray 42 and the like that have been moved to the replacement position, to the outside. In this embodiment, a part of the tray 42 and the like that have been moved to the replacement position protrudes from the opening 34a to the outside of the housing 34.

[0063] The housing 34 is provided with a rotatable door 35 that can be switched between an open state (see FIG. 11) that exposes the opening 34a and a closed state (see FIG. 12) that covers the opening 34a. The door 35 is opened and closed by a door opening / closing mechanism 49 (see FIG. 16) that is configured with a known actuator such as a motor. The door opening / closing mechanism 49 switches the door 35 to the open state before the tray 42 is moved to the replacement position during the separation process. In addition, the door opening / closing mechanism 49 switches the door 35 to the closed state after the tray 42 is stored in the housing 34 during the mounting process.

[0064] [Laser scanner] Fig. 13 is an explanatory diagram of the laser scanner 12. As shown in Fig. 13 and the above-described Fig. 1, the laser scanner 12 corresponds to the human detection sensor of the present invention, and is disposed near the door 35 (opening 34a) of the prober 10. For example, the laser scanner 12 emits and scans infrared laser light, and detects the infrared laser light reflected by the person H, which is a detected object, thereby detecting the distance to the person H. By adjusting the installation position of the laser scanner 12 and the scanning range of the infrared laser light, it is possible to detect whether or not the person H has entered the protected area PA and the warning area WA that are preset based on the replacement position and the position of the door 35.

[0065] The protected area PA is an area in which there is a risk of a person H colliding with the opening or closing door 35 or having his or her hand caught, that is, an area that defines a dangerous area if the person H enters while the door 35 is being opened or closed.

[0066] The warning area WA is set outside the protected area PA, and is an area for issuing a warning to a person H who may enter the protected area PA. Note that the setting of the warning area WA may be omitted.

[0067] A detection signal output from the laser scanner 12 is input to the prober 10, and further input to a GEM host 16 (to be described later) via the prober 10 and a network 18.

[0068] [Wafer transport mechanism] Fig. 14 is a schematic diagram of the OHT 54 of the wafer transport mechanism 14. As shown in Fig. 14 and Fig. 1 described above, the wafer transport mechanism 14 transports a cassette CS storing a plurality of semiconductor wafers W between a plurality of probers 10 arranged two-dimensionally in the XY directions and a predetermined storage 50 (see Fig. 1). Specifically, the wafer transport mechanism 14 carries (also referred to as carrying-in) the cassette CS storing a plurality of uninspected semiconductor wafers W to the prober 10 and collects (also referred to as carrying-out) the cassette CS storing a plurality of inspected semiconductor wafers W from the prober 10 for each of the plurality of probers 10.

[0069] The wafer transport mechanism 14 includes a plurality of transport rails 52 and a plurality of OHTs 54, which are ceiling-traveling unmanned transport vehicles. Each transport rail 52 extends in the X direction, and is arranged in a row in the Y direction on the ceiling of a semiconductor manufacturing process (not shown). That is, a transport rail 52 is provided for each row of probers 10 arranged in the X direction. More specifically, when viewed from above in the Z direction, the transport rails 52 are provided on the ceiling for each row of probers 10 so as to intersect with the load ports 21 of each prober 10 in the row.

[0070] One end of each transport rail 52 is connected to a storage facility 50. This storage facility 50 stores a plurality of cassettes CS each containing a plurality of semiconductor wafers W before inspection, as well as a plurality of types of probe cards 30 corresponding to the types of semiconductor chips of the semiconductor wafers W. The storage facility 50 in which the cassettes CS are stored and the storage facility 50 in which the probe cards 30 are stored may be provided in different locations.

[0071] An OHT 54 is provided for each transport rail 52 and travels along the transport rail 52. Therefore, each OHT 54 is freely movable in the X direction. This allows the OHT 54 to move for each row of probers 10 to a position directly above (including a position substantially directly above) the load port 21 of each prober 10 in the row. Each OHT 54 also includes an elevation support part 54a that can be raised and lowered in the Z direction (up and down direction) and whose position can be adjusted in the Y direction.

[0072] When the cassette CS is placed on or removed from the load port 21, the lifting and lowering holding portion 54a releasably holds the cassette CS storing a plurality of semiconductor wafers W therein.

[0073] When placing the cassette CS on the load port 21, the OHT 54 moves to the storage location 50, and then lowers the lifting holder 54a to hold the cassette CS. Next, the OHT 54 raises the lifting holder 54a holding the cassette CS, and then moves to a position directly above the load port 21 of the prober 10 designated by the GEM host 16, which will be described later. Then, the OHT 54 lowers the lifting holder 54a to place the cassette CS on the load port 21, and then releases the lifting holder 54a from holding the cassette CS. This makes it possible to transport the cassette CS, i.e., a plurality of uninspected semiconductor wafers W, from the storage location 50 to the load port 21.

[0074] When retrieving the cassette CS from the load port 21, the OHT 54 moves to a position directly above the load port 21 of the prober 10 to be retrieved, and then lowers the lifting holder 54a to hold the cassette CS placed on the load port 21 with the lifting holder 54a. Next, the OHT 54 raises the lifting holder 54a holding the cassette CS, and transports it to the storage 50. Then, the OHT 54 lowers the lifting holder 54a to the storage 50, and then releases the lifting holder 54a from holding the cassette CS. This makes it possible to transport the cassette CS, i.e., multiple inspected semiconductor wafers W, from the load port 21 to the storage 50.

[0075] Such a wafer transport mechanism 14 is used not only for placing and retrieving the cassette CS, but also for replacing the probe card 30. Specifically, the wafer transport mechanism 14 performs a retrieval process for retrieving the probe card 30 before replacement from the tray 42 transported to the replacement position in the separation process and transporting it to the storage 50 for each of the multiple probers 10, and a carry-in process for transporting a new probe card 30 from the storage 50 to the tray 42 at the replacement position before the mounting process. At this time, the center position of the load port 21 and the replacement position of the tray 42 are adjusted for each prober 10 to enable the retrieval process and the carry-in process of the probe card 30 by the wafer transport mechanism 14.

[0076] 15 is an explanatory diagram for explaining the conditions that enable the retrieval process and the loading process of the probe card 30 by the wafer transport mechanism 14. Note that the following description will be given taking one prober 10 as an example.

[0077] As described above, the OHT 54 moves along the transport rail 52, and is therefore freely movable in the X direction. On the other hand, the lifting and lowering holding part 54a of the OHT 54 can be adjusted in the Y direction, but the movable range ΔY is limited (for example, about 10 mm). Also, when each prober 10 is installed in the semiconductor manufacturing process, installation errors in the X and Y directions may occur. For this reason, as shown in FIG. 15, in order to enable the wafer transport mechanism 14 to perform the retrieval and loading process of the probe card 30, the center position C1 of the load port 21 for each prober 10 in the row and the center position C2 of the tray 42 (holder holding hole 44) set at the exchange position must be arranged in a substantially straight line along the X direction.

[0078] Therefore, in this embodiment, the center position C1 and center position C2 in each prober 10 are adjusted so that the center position C1 of each prober 10 falls within the movable range ΔY in the Y direction of the cassette CS held by the lifting and lowering holding unit 54a, and the center position C2 of each prober 10 falls within the movable range ΔY in the Y direction of the probe card 30 held by the lifting and lowering holding unit 54a, and the installation position of each prober 10 is adjusted. As a result, the lifting and lowering holding unit 54a can place the cassette CS on the load port 21 within its movable range in the Y direction, and the probe card 30 can be placed at the exchange position. Note that the higher the installation position accuracy of each prober 10, i.e., the higher the position accuracy of the center position C1, the larger the difference A between the center position C1 and the center position C2 can be, and conversely, the lower the position accuracy of the center position C1, the smaller the difference A needs to be.

[0079] In this way, by arranging the center position C1 and center position C2 of each prober 10 in each row on substantially the same straight line in the X direction, the lifting and lowering holding part 54a of the OHT 54 can be adjusted to a position directly above the center position C2. Therefore, the lifting and lowering holding part 54a can be lowered to hold the held part 30b of the probe card 30. This allows the OHT 54 to collect the probe card 30 before replacement from the card holder 28 on the tray 42, or to place a new probe card 30 in the card holding hole 38 of the card holder 28 on the tray 42. As a result, the wafer transport mechanism 14 can perform the collection and loading process of the probe card 30.

[0080] In this embodiment, the probe card 30 is held by the lifting and lowering holding part 54a of the OHT 54 used for replacing (collecting, placing) the cassette CS, so that the held part 30b of the probe card 30 is adjusted in shape and arrangement so as to be held by the lifting and lowering holding part 54a. For example, the held part 30b of the probe card 30 may be made common to the held part of the cassette CS (not shown).

[0081] [Prober control section] Fig. 16 is a functional block diagram of the prober control unit 58 of the prober 10 and the GEM host 16. As shown in Fig. 16, the prober 10 is provided with a prober control unit 58 in addition to the units already described.

[0082] The prober control unit 58 comprehensively controls the operation of the prober 10 under the control of the GEM host 16 described later, and includes an arithmetic circuit configured with various processors, memories, etc. The various processors include a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), and programmable logic devices (e.g., simple programmable logic devices (SPLD), complex programmable logic devices (CPLD), and field programmable gate arrays (FPGA)). The various functions of the prober control unit 58 may be realized by one processor, or may be realized by multiple processors of the same or different types.

[0083] The prober control unit 58 is connected to the tester 11, the chuck moving mechanism 24, the card transport mechanism 32, the holder sensor 46, the card sensor 48, and the door opening / closing mechanism 49, and is also connected to the laser scanner 12 via a connection interface (not shown). The prober control unit 58 is also connected to the GEM host 16 via a communication interface and the network 18 (not shown).

[0084] The prober control unit 58 functions as a transmission / reception control unit 60, an inspection control unit 62, a separation control unit 64, a mounting control unit 66, a scanner control unit 68, and a door opening / closing control unit 70 by executing a control program read out from a memory unit not shown.

[0085] When replacing the probe card 30, the transmission / reception control unit 60 exchanges various information with the GEM host 16 via the network 18. For example, the transmission / reception control unit 60 receives a "replacement instruction" for the probe card 30 from the GEM host 16 before starting the separation process. In addition, the transmission / reception control unit 60 transmits a "replacement preparation completion notification" to the GEM host 16 after the separation process is completed. In addition, the transmission / reception control unit 60 receives a "mounting process start instruction" from the GEM host 16 after the carry-in process by the OHT 54 is completed.

[0086] Furthermore, after the door 35 is switched to the closed state during the mounting process, the transmission / reception control unit 60 transmits to the GEM host 16 the "read information" of the probe card 30 that has been read (see FIG. 31). The transmission / reception control unit 60 also receives the "authentication result" of the probe card 30 transmitted from the GEM host 16 in response to the transmission of the "read information". Furthermore, the transmission / reception control unit 60 transmits to the GEM host 16 a "replacement completion notification" of the probe card 30 after the mounting process is completed.

[0087] Furthermore, during the loading process of the probe card 30 (particularly while the lifting / lowering holding unit 54a is being lifted / lowered), the transmission / reception control unit 60 outputs the sensor output values ​​of both the holder sensor 46 and the card sensor 48 to the GEM host 16. Note that the output of each sensor output value to the GEM host 16 may be performed at all times.

[0088] Furthermore, while the laser scanner 12 is operating, the transmission / reception control unit 60 transmits a detection signal output from the laser scanner 12 to the GEM host 16 via the network 18. Note that the transmission / reception control unit 60 also exchanges various information (e.g., instructions to inspect the semiconductor wafer W) with the GEM host 16 at times other than when the probe card 30 is replaced, but as these are well-known techniques, detailed explanations thereof will be omitted here.

[0089] Under the control of the GEM host 16, the inspection control unit 62 controls the tester 11 and the chuck moving mechanism 24 to align the semiconductor wafer W held on the chuck 22 with the probe needles 30a, to bring the probe needles 30a into contact with the semiconductor chips of the semiconductor wafer W, and to perform testing using the tester 11.

[0090] Under the control of the GEM host 16, the separation control unit 64 controls the chuck moving mechanism 24, the connecting unit 36, the card transport mechanism 32, and the card holding unit 26 to execute the separation process shown in Figures 7 and 8. After the separation process is completed, the separation control unit 64 also controls the transmission / reception control unit 60 to transmit an "exchange preparation completion notification" to the GEM host 16 via the network 18.

[0091] The mounting control unit 66, under the control of the GEM host 16, controls the chuck moving mechanism 24, the connecting unit 36, the card transport mechanism 32, and the card holding unit 26 to execute the mounting process shown in Figures 9 and 10. The mounting control unit 66 also reads information on the probe card 30 during the mounting process by a known method, and causes the transmission / reception control unit 60 to transmit this "read information" to the GEM host 16 via the network 18. Furthermore, after the mounting process is completed, the mounting control unit 66 causes the transmission / reception control unit 60 to transmit an "exchange completion notice" to the GEM host 16 via the network 18.

[0092] The scanner control unit 68 continuously controls the laser scanner 12 to detect whether or not a person H has entered the protected area PA and the warning area WA from the time when the door opening / closing mechanism 49 starts switching the door 35 to the open state during the separation process to the time when the door opening / closing mechanism 49 finishes switching the door 35 to the closed state during the attachment process. Note that the detection by the laser scanner 12 may be performed continuously.

[0093] When the tray 42 is transported to the front of the door 35 during the separation process, the door opening / closing control unit 70 drives the door opening / closing mechanism 49 to switch the door 35 from the closed state to the open state. Also, when the tray 42 is stored in the housing 34 during the mounting process, the door opening / closing control unit 70 drives the door opening / closing mechanism 49 to switch the door 35 from the open state to the closed state.

[0094] While the door 35 is being opened and closed by the door opening / closing mechanism 49, the door opening / closing control unit 70 acquires a detection signal input from the laser scanner 12. Then, when a person H has entered the protected area PA based on the detection result of the laser scanner 12, the door opening / closing control unit 70 stops the operation of the door opening / closing mechanism 49. This makes it possible to stop the opening / closing operation of the door 35 before the door 35 collides with the person or before a hand (fingers) is pinched.

[0095] Furthermore, the door opening / closing control unit 70 continues to stop driving the door opening / closing mechanism 49 while the person H is intruding into the protected area PA. Then, the door opening / closing control unit 70 resumes driving the door opening / closing mechanism 49 in response to the detection result of the laser scanner 12 switching from "the presence of intrusion of the person H into the protected area PA" to "the absence of intrusion."

[0096] [GEM Host] The GEM host 16 comprehensively controls the operations of the multiple probers 10 and multiple OHTs 54, and includes an arithmetic circuit configured with various processors and memories. The various functions of the GEM host 16 may be realized by one processor, or may be realized by multiple processors of the same or different types. Also, a control device other than the GEM host 16 may be used as long as it is capable of comprehensively controlling the operations of the multiple probers 10 and multiple OHTs 54.

[0097] The GEM host 16 functions as an inspection start control unit 80, a separation processing start control unit 82, a collection control unit 84, a loading control unit 86, a mounting processing start control unit 88, and an authentication control unit 90 by executing a control program read from a memory unit not shown.

[0098] After the cassette CS is transported by the OHT 54 from the storage 50 to the load port 21 of the prober 10, the inspection start control unit 80 outputs an instruction to inspect the semiconductor wafer W to the prober 10 via the network 18. This inspection instruction is input to the inspection control unit 62 via the transmission / reception control unit 60. As a result, the inspection control unit 62 controls the tester 11 and the chuck moving mechanism 24 to test the semiconductor chips of the semiconductor wafer W.

[0099] The separation process start control unit 82 outputs an instruction to replace the probe card 30 to the transmission / reception control unit 60 of the prober 10 via the network 18 at a predetermined timing for replacing the probe card 30. This instruction is input to the separation control unit 64 and the door opening / closing control unit 70 via the transmission / reception control unit 60. As a result, the separation control unit 64 controls the chuck moving mechanism 24, the connecting unit 36, the card transport mechanism 32, and the card holding unit 26 to execute the separation process, and after the separation process is completed, causes the transmission / reception control unit 60 to transmit a "notification of completion of preparation for replacement" to the GEM host 16. In addition, the door opening / closing control unit 70 drives the door opening / closing mechanism 49 during the separation process to switch the door 35 to the open state.

[0100] Examples of timing for replacing the probe card 30 include when switching the type of semiconductor chip on the semiconductor wafer W to be inspected, when the probe card 30 has been used a predetermined number of times or more, and when an operator manually inputs an instruction to replace the probe card 30 to the GEM host 16.

[0101] The recovery control unit 84 and the loading control unit 86 constitute the transport control unit of the present invention, and control the OHT 54 of the wafer transport mechanism 14 to transport the probe card 30 between the exchange position and the storage location 50.

[0102] When the "exchange preparation completion notice" is input from the transmission / reception control unit 60 via the network 18, the collection control unit 84 controls the OHT 54 to start the collection process. Specifically, the collection control unit 84 sequentially executes the process of moving the OHT 54 to a position directly above the exchange position, the process of lowering the lifting and lowering holding unit 54a to the exchange position, the process of holding the probe card 30 by the lifting and lowering holding unit 54a, the process of raising the lifting and lowering holding unit 54a, and the process of transporting the probe card 30 to the storage location 50 by the OHT 54.

[0103] After the recovery process is completed, the carry-in control unit 86 controls the OHT 54 to start the carry-in process. Specifically, the carry-in control unit 86 first executes a process of transporting the probe card 30 corresponding to the semiconductor wafer W to be inspected from the storage 50 to a position immediately above the exchange position by the OHT 54.

[0104] Next, the carry-in control unit 86 performs a process of lowering the lifting / lowering holder 54a to the exchange position (tray 42) and a process of releasing the hold of the probe card 30 by the lifting / lowering holder 54a based on the sensor output value of the card sensor 48 input from the transmission / reception control unit 60 via the network 18. In this case, the carry-in control unit 86 continues the lowering process until the sensor output value of the card sensor 48 changes, that is, until the card sensor 48 is pressed by the probe card 30, and performs a hold release process according to the change in the sensor output value. Next, the carry-in control unit 86 causes the lifting / lowering holder 54a to perform a process of raising.

[0105] When a state of intrusion of a person H into the protected area PA occurs based on a detection signal of the laser scanner 12 input from the transmission / reception control unit 60 via the network 18, the collection control unit 84 and the carry-in control unit 86 stop the operation of the OHT 54, in particular the raising and lowering of the lifting and lowering holding unit 54a. The collection control unit 84 and the carry-in control unit 86 then stop the operation of the OHT 54 while the state of intrusion of a person H into the protected area PA continues, and resume the operation of the OHT 54 when the state of intrusion of a person H into the protected area PA switches to a state of no intrusion.

[0106] After the loading process is completed, the mounting process start control unit 88 outputs an instruction to the prober 10 to start the mounting process of the probe card 30. This start instruction is input to the mounting control unit 66 and the door opening / closing control unit 70 via the transmission / reception control unit 60. As a result, the mounting control unit 66 controls the chuck moving mechanism 24, the connecting unit 36, the card transport mechanism 32, and the card holding unit 26 to execute the mounting process, and also causes the transmission / reception control unit 60 to transmit "read information" and "exchange completion notice" to the GEM host 16. In addition, the door opening / closing control unit 70 drives the door opening / closing mechanism 49 during the mounting process to switch the door 35 to the closed state.

[0107] When the "read information" of the probe card 30 is input from the transmission / reception control unit 60 via the network 18 during the mounting process, the authentication control unit 90 authenticates the probe card 30 by a known method and transmits the authentication result to the transmission / reception control unit 60 via the network 18. This authentication result is input to the mounting control unit 66 via the transmission / reception control unit 60. As a result, the mounting control unit 66 continues the mounting process if the authentication result is proper, and stops the mounting process if the authentication result is improper.

[0108] [Wafer test system function] 17 is a flow chart showing the flow of the replacement process of the probe card 30 of the prober 10 performed in the wafer test system 2 configured as above (corresponding to the probe card replacement method of the present invention). As shown in Fig. 17, when the probe card 30 of the prober 10 is replaced, under the control of the GEM host 16, a separation process (step S1, corresponding to the separation step), a recovery process (step S2, corresponding to the recovery step), a carry-in process (step S3, corresponding to the carry-in step), and a mounting process (step S4, corresponding to the mounting step) are executed in order for each prober 10.

[0109] <Separation process> Fig. 18 to Fig. 23 are explanatory diagrams for explaining the separation process of step S1 shown in Fig. 17. As shown in Fig. 18, the separation process start control unit 82 outputs a probe card 30 replacement instruction T1 to the prober 10 via the network 18 at a predetermined replacement timing of the probe card 30. This replacement instruction T1 is input to the separation control unit 64 and the door opening / closing control unit 70 via the transmission / reception control unit 60 of the prober 10.

[0110] 19, the separation control unit 64 that has received the exchange command T1 controls the chuck moving mechanism 24, the connecting unit 36, the card transport mechanism 32, and the card holding unit 26 to start the separation process. As a result, as shown in FIGS. 7 and 8, after the probe card 30 and the card holder 28 at the holding position are held by the tray 42, the tray 42 is transported to the front of the door 35 by the chuck moving mechanism 24.

[0111] 20, when the tray 42 is transported to the front of the door 35 by the chuck moving mechanism 24, the door opening / closing control unit 70 that has received the exchange command T1 drives the door opening / closing mechanism 49 to start switching the door 35 from the closed state to the open state. In response to the start of this switching, the scanner control unit 68 starts detection by the laser scanner 12, that is, detection of the presence or absence of intrusion of a person H into the protected area PA. The detection results of the laser scanner 12 are continuously input to the door opening / closing control unit 70, and are also continuously input from the transmission / reception control unit 60 to the GEM host 16 via the network 18.

[0112] As shown in Fig. 21, the door opening / closing control unit 70 stops the operation of the door opening / closing mechanism 49 while person H is intruding into the protected area PA based on the detection result of the laser scanner 12. This prevents the door 35 from colliding with the person H. Then, as shown in Fig. 22, the door opening / closing control unit 70 resumes the operation of the door opening / closing mechanism 49 when the detection result of the laser scanner 12 changes from "the presence of person H intrusion into the protected area PA" to "the absence of intrusion." This reduces the effort required for the operator to perform the restart operation.

[0113] As shown in Fig. 23, when the door 35 is switched to the open state, the transportation of the tray 42 by the chuck moving mechanism 24 is resumed, and the chuck moving mechanism 24 transports the tray 42 to the replacement position. As a result, the probe card 30 held in the card holder 28 on the tray 42 is also transported to the replacement position. After this transportation is completed, the separation control unit 64 transmits a replacement preparation completion notification T2 from the transmission / reception control unit 60 to the GEM host 16 via the network 18. This completes the separation process of step S1. After this separation process is completed, the transmission / reception control unit 60 continuously outputs sensor output values ​​of the card sensor 48, etc. to the GEM host 16 via the network 18.

[0114] <Collection processing> 24 and 25 are explanatory diagrams for explaining the collection process of step S2 in FIG. 17. As shown in FIG. 24, when the collection control unit 84 of the GEM host 16 receives the exchange preparation completion notification T2 via the network 18, the collection control unit 84 controls the OHT 54 of the wafer transport mechanism 14 to sequentially execute the process of moving the OHT 54 to a position directly above the exchange position of the prober 10, the process of lowering the lifting and lowering holding unit 54a to the exchange position, and the process of holding the held portion 30b of the probe card 30 by the lifting and lowering holding unit 54a. Next, as shown in FIG. 25, the collection control unit 84 controls the OHT 54 to sequentially execute the process of lifting the lifting and lowering holding unit 54a holding the probe card 30, and the process of transporting the probe card 30 to the storage 50 by the OHT 54.

[0115] The collection control unit 84 stops the driving of the OHT 54, particularly the raising and lowering of the lifting and lowering holding unit 54a, if a person H has entered the protected area PA based on the detection result of the laser scanner 12 input from the transmission / reception control unit 60 via the network 18 during the execution of each of the above-mentioned processes. This prevents the lifting and lowering holding unit 54a from colliding with the person H. Then, the collection control unit 84 resumes the driving of the OHT 54 when the detection result of the laser scanner 12 changes from "there is an intrusion of person H into the protected area PA" to "there is no intrusion." This reduces the effort required for the operator to perform the restart operation. This completes the collection process of step S2.

[0116] <Delivery Processing> Figures 26 to 28 are explanatory diagrams for explaining the carry-in process of step S3 shown in Figure 17. As shown in Figure 26, when the collection process is completed, the carry-in control unit 86 of the GEM host 16 controls the OHT 54 to move the OHT 54 to the storage 50, and further causes the lifting and lowering holding unit 54a to hold a new probe card 30 corresponding to the semiconductor wafer W to be inspected, and then moves the OHT 54 to a position directly above the exchange position.

[0117] 27, the carry-in control unit 86 lowers the lifting and lowering holding unit 54a holding the probe card 30. At this time, the carry-in control unit 86 continues the lowering process of the lifting and lowering holding unit 54a based on the sensor output value of each card sensor 48 input via the network 18 until the sensor output value changes, that is, until each card sensor 48 is pressed by the probe card 30. As described above, the card holder 28 on the tray 42 is provided with a plurality of positioning units 40 (see FIGS. 3 and 4) around the card holding hole 38. Therefore, even if there is a positional deviation (for example, about ±2 mm) in the XY position of the lifting and lowering holding unit 54a, the probe card 30 is guided into the card holding hole 38 by the guide surface 40a of each positioning unit 40, and the probe card 30 is held by the card holder 28.

[0118] When the probe card 30 is held by the card holder 28, as described above, the sensor output value of each card sensor 48 changes, and the carry-in control unit 86 determines that the probe card 30 on the card holder 28 (tray 42) has been switched from not being held to being held. Then, the carry-in control unit 86 stops the lowering process of the lift-and-lower holding unit 54a and releases the hold of the probe card 30 (held portion 30b) by the lift-and-lower holding unit 54a. This allows a new probe card 30 to be transported from the storage 50 to the replacement position. Next, as shown in FIG. 28, the carry-in control unit 86 raises the lift-and-lower holding unit 54a.

[0119] Based on the detection result of the laser scanner 12 input from the transmission / reception control unit 60 via the network 18 during the carrying-in process, the carrying-in control unit 86 stops the operation of the OHT 54 while the person H is entering the protected area PA, similar to the above-described recovery process, and resumes the operation of the OHT 54 when the person H leaves the protected area PA. This prevents the lifting and lowering holding unit 54a from colliding with the person H. This completes the carrying-in process of step S3.

[0120] <Installation process> Fig. 29 to Fig. 34 are explanatory diagrams for explaining the mounting process of step S4 shown in Fig. 17. As shown in Fig. 29, when the loading process is completed, the mounting process start control unit 88 outputs a mounting instruction T3 for the probe card 30 to the prober 10 via the network 18. This mounting instruction T3 is input to the mounting control unit 66 and the door opening / closing control unit 70 via the transmission / reception control unit 60 of the prober 10.

[0121] Then, the mounting control unit 66 that has received the mounting instruction T3 starts the mounting process by controlling the chuck moving mechanism 24, the connecting unit 36, the card transport mechanism 32, and the card holding unit 26. As a result, as shown in FIG. 9, the tray 42 is transported by the chuck moving mechanism 24 and the card transport mechanism 32 toward the holding position.

[0122] 30, when the tray 42 transported toward the holding position is stored in the housing 34, the door opening / closing control unit 70 that has received the mounting instruction T3 drives the door opening / closing mechanism 49 to switch the door 35 from the open state to the closed state. At this time, the door opening / closing control unit 70 also stops driving the door opening / closing mechanism 49 while the person H is in the protected area PA based on the detection result of the laser scanner 12. This prevents the door 35 from colliding with the person H or having the person's hand or fingers pinched.

[0123] As shown in Fig. 31, after the door 35 is switched to the closed state (or before the door 35 is switched), the mounting control unit 66 reads information on the probe card 30 held in the card holder 28 on the tray 42, and transmits this read information T4 from the transmission / reception control unit 60 to the authentication control unit 90 of the GEM host 16 via the network 18. Then, the authentication control unit 90 authenticates the probe card 30 based on the read information T4 input via the network 18, and transmits the authentication result T5 to the mounting control unit 66 via the network 18 and the transmission / reception control unit 60. The mounting control unit 66 that has received the authentication result T5 continues the mounting process if the authentication result T5 is appropriate, and stops the mounting process if the authentication result T5 is inappropriate.

[0124] Furthermore, when the authentication of the probe card 30 is completed, the scanner control unit 68 causes the laser scanner 12 to end detection.

[0125] 32, as the mounting process continues, the tray 42 is transported to the holding position by the chuck moving mechanism 24 and the card transport mechanism 32 as already shown in FIG 9, and then the card holder 28 is held by the card holding section 26. This completes the transport of the probe card 30 to the holding position, and a new probe card 30 is mounted on the card holding section 26.

[0126] As shown in Figure 33, when the installation of a new probe card 30 into the card holding portion 26 is completed, as shown in Figure 10 described above, the tray 42 is lowered by the card transport mechanism 32, the chuck 22 is moved by the chuck moving mechanism 24, the tray 42 is switched to a laid-down state by the card transport mechanism 32, and the connection between the chuck 22 and the card transport mechanism 32 is released, and then the chuck 22 is moved to the inspection position Y1 by the chuck moving mechanism 24.

[0127] 34, when the movement of the chuck 22 to the inspection position Y1 is completed, the mounting control unit 66 causes the transmission / reception control unit 60 to transmit a replacement completion notification to the GEM host 16 via the network 18. This completes the mounting process of step S4.

[0128] As described above, in this embodiment, the probe card 30 of the prober 10 is loaded and retrieved using the OHT 54 of the wafer transport mechanism 14 that places and retrieves the cassette CS (semiconductor wafer W) of the prober 10 in the semiconductor manufacturing process, eliminating the need to install new equipment in the semiconductor manufacturing process for loading and retrieving the probe card 30. As a result, the replacement of the probe card 30 can be automated at low cost while suppressing an increase in installation space in the semiconductor manufacturing process.

[0129] [others] In the above embodiment, the separation process is started in a state where the card holder 28 and the probe card 30 are held in the card holding section 26, but the separation process may be started in a state where the card holder 28 and the probe card 30 are not held in the card holding section 26. In this case, the separation process (step S1) transitions from the state shown in reference symbol 7C in Fig. 7 to the state shown in reference symbol 8C in Fig. 8. Then, the recovery process (step S2) is omitted, and the carry-in process (step S3) and the mounting process (step S4) are executed in order.

[0130] In the above embodiment, the wafer test system 2 is provided with a plurality of probers 10, but the number of probers 10 may be one.

[0131] In the above embodiment, when a person H enters the protected area PA, the opening and closing of the door 35 and the operation of the OHT 54 are stopped. However, for example, a warning (warning sound, warning display, etc.) may be issued to the person H when the person H enters the warning area WA based on the detection results of the laser scanner 12.

[0132] In the above embodiment, a laser scanner 12 is used to detect whether or not a person H has intruded into the protected area PA and the warning area WA, but the presence or absence of a person H intrusion into the protected area PA, etc. may also be detected by image analysis of images captured by a surveillance camera, for example, or various known person detection sensors may be used.

[0133] In the above embodiment, the OHT 54 has been described as an example of the wafer transport mechanism 14. However, it is possible to use any of the well-known mechanisms such as an Automated Guided Vehicle (AGV) capable of transporting a cassette CS (or only a semiconductor wafer W), an Over Head Shuttle (OHS), etc. A seed wafer transport mechanism may be used.

[0134] In the above embodiment, the probe card 30 is transported between the storage location 50 and the exchange position using a wafer transport mechanism 14 that places and retrieves the cassette CS (semiconductor wafer W). However, the probe card 30 may also be transported between the storage location 50 and the exchange position using a transport mechanism installed separately from the wafer transport mechanism 14. [Explanation of symbols]

[0135] 2 Wafer Test System 10 Prober 11 Tester 12 Laser scanner 14 Wafer transport mechanism 16 GEM Host 18 Network 20 Base 21 Loading Port 22 Chuck 24 Chuck movement mechanism 26 Card holder 28 Card Holder 30 Probe Card 30a probe needle 30b Holding part 32 Card transport mechanism 34 Case 34a opening 35 Door 36 Connecting part 38 Card holder hole 40 Positioning part 40a Guide surface 42 Tray 44 Holder retaining hole 46 Holder Sensor 48 Card Sensor 49 Door opening and closing mechanism 50 Storage 52 Transport rail 54a Lifting support part 58 Prober control section 60 Transmission and reception control section 62 Inspection control section 64 Separate control section 66 Wearing control unit 68 Scanner control unit 70 Door opening / closing control section 80 Inspection start control unit 82 Separation process start control unit 84 Recovery control section 86 Carry-in Control Section 88 Mounting process start control unit 90 Authentication control section A Difference C1 center position C2 center position CS Cassette H people PA Protected Area T1 replacement instructions T2 replacement preparation completion notification T3 Wearing Instructions T4 Reading Information T5 Authentication Result W Semiconductor wafer WA Warning Area Y0 Installation position Y1 inspection position Y2 Tray switching position Y3 connection position ΔY Movable Range

Claims

1. a prober including a chuck for holding a semiconductor wafer and a probe card having probe needles, the probe needles being brought into contact with a plurality of semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips; An automated guided vehicle, a transport control unit that controls the automatic guided vehicle to transport the probe card between a predetermined exchange position of the probe card in the prober and a storage location of the probe card that is located at a different location from the prober; a card transport mechanism provided in the prober for transporting the probe card between a holding position in the prober and the exchange position; a separation control unit that controls the card transport mechanism to execute a separation process for transporting the probe card before replacement from the holding position to the replacement position; a mounting control unit that controls the card transport mechanism to perform a mounting process for transporting a new probe card from the exchange position to the holding position; Equipped with The prober includes: a housing that houses the chuck, the probe card, and the card transport mechanism; an opening formed in the housing for exposing the replacement position to the outside of the housing; a door that can be switched between an open state that opens the opening and a closed state that covers the opening; a door opening / closing mechanism that switches the door between the open state and the closed state; a door opening / closing control unit that drives the door opening / closing mechanism to switch the door from the closed state to the open state in the separation process, and drives the door opening / closing mechanism to switch the door from the open state to the closed state in the installation process; A wafer test system comprising:

2. A prober comprising a chuck for holding a semiconductor wafer and a probe card having probe needles, the probe needles being brought into contact with a plurality of semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips, a card transport mechanism for transporting the probe card between a holding position in the prober and an exchange position where the probe card is exchanged by an automatic guided vehicle; a housing that houses the chuck, the probe card, and the card transport mechanism; an opening formed in the housing for exposing the replacement position to the outside of the housing; a door that can be switched between an open state that opens the opening and a closed state that covers the opening; a door opening / closing mechanism that switches the door between the open state and the closed state; a door opening / closing control unit that drives the door opening / closing mechanism to switch the door from the closed state to the open state in a separation process in which the card transport mechanism transports the probe card before replacement from the holding position to the replacement position, and drives the door opening / closing mechanism to switch the door from the open state to the closed state in a mounting process in which the card transport mechanism transports a new probe card from the replacement position to the holding position; A prober comprising:

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