Induction heating cooker

Abstract

To suppress a decrease in the accuracy of measurement results obtained by a temperature measuring device in an induction heating cooker in which a heating coil is formed by winding a conductor around a substrate.SOLUTION: An induction heating cooker includes a top plate on which an object to be heated is placed, an insulating substrate, a heating coil formed by winding a conductor on the substrate and for heating the object to be heated, and a temperature measuring device for measuring the temperature of the object to be heated, with at least a portion of the temperature measuring device being positioned below the substrate.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present technology relates to an induction heating cooker for cooking. [Background technology]

[0002] 2. Description of the Related Art Conventionally, induction heating cookers have been known in which a coil is formed by winding a thin metal film on the surface of an insulating substrate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-043697 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, Patent Document 1 does not disclose a temperature measuring device for measuring the temperature of a heated object. In general, when the temperature measuring device is a non-contact type such as an infrared sensor, it is not assumed that the temperature measuring device and the heated object will come into direct contact with each other, and the internal sensor part is not resistant to heat. In addition, even when the temperature measuring device is a contact type such as a thermistor, the signal line for communicating the measurement result is not resistant to heat. Depending on the installation position of the temperature measuring device, the temperature of the part that should not be affected by the heat of the heated object may rise, and the accuracy of the temperature measurement result by the temperature measuring device may decrease.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to suppress a decrease in the accuracy of measurement results obtained by a temperature measuring device in an induction heating cooker in which a heating coil is formed by winding a conductor around a substrate. [Means for solving the problem]

[0006] The induction heating cooker of the present disclosure comprises a top plate on which an object to be heated is placed, an insulating substrate, a heating coil formed by winding a conductor on the substrate and heating the object to be heated, and a temperature measuring device that measures the temperature of the object to be heated, with at least a portion of the temperature measuring device being positioned below the substrate. Effect of the Invention

[0007] In the induction heating cooker of the present disclosure, a part of the temperature measuring device is provided in a direction away from the heated object relative to the substrate. Therefore, the part of the temperature measuring device that should not be affected by the heat of the heated object can be disposed away from the heated object. Therefore, the temperature measuring device of the induction heating cooker is prevented from decreasing the accuracy of the measurement result. [Brief description of the drawings]

[0008] [Figure 1] 1 is a perspective view showing an induction heating cooker according to a first embodiment. [Diagram 2] FIG. 2 is a diagram for illustrating a configuration inside a main body case of the induction heating cooker according to the first embodiment. [Diagram 3] FIG. 2 is a schematic diagram showing an internal configuration of the induction heating cooker according to the first embodiment. [Figure 4] FIG. 2 is a diagram for explaining the configuration of an induction heating unit in the induction heating cooker according to the first embodiment. [Diagram 5] FIG. 2 is a diagram showing a substrate according to the first embodiment. [Figure 6] FIG. 4 is a rear view of the holding member according to the first embodiment. [Figure 7] FIG. 4 is a rear view of the holding member according to the first embodiment. [Figure 8] 2 is a side view showing a substrate and a holding member according to the first embodiment. FIG. [Figure 9] 2 is a cross-sectional view showing a substrate and a holding member according to the first embodiment. FIG. [Figure 10] FIG. 2 is a schematic diagram showing an internal configuration of the induction heating cooker according to the first embodiment. [Figure 11] FIG. 2 is a schematic diagram showing an internal configuration of the induction heating cooker according to the first embodiment. [Figure 12] FIG. 4 is a schematic diagram showing an internal configuration of an induction heating cooker according to Modification 1. [Figure 13] FIG. 11 is a schematic diagram showing an internal configuration of an induction heating cooker according to Modification 2. [Figure 14] FIG. 11 is a schematic diagram showing an internal configuration of an induction heating cooker according to Modification 3. [Figure 15] FIG. 11 is a schematic diagram showing an internal configuration of an induction heating cooker according to a fourth modified example. [Figure 16] FIG. 13 is a schematic diagram showing an internal configuration of an induction heating cooker according to Modification 5. [Figure 17] FIG. 13 is a schematic diagram showing an internal configuration of an induction heating cooker according to a sixth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an induction heating cooker in an embodiment will be described with reference to the drawings. Here, the present disclosure is not limited to the embodiment described below. In addition, in the following drawings, including FIG. 1, the relationship of the sizes of the components may differ from the actual ones. Furthermore, in the following description, terms that indicate directions are used as appropriate to facilitate understanding, but these terms are for the purpose of explanation and do not limit the present disclosure. Examples of terms that indicate directions include "up", "down", "right", "left", "front" and "rear". Note that the directions are described based on the induction heating cooker installed in a usable state. In addition, in plate-like members such as various boards described below, the surface facing upward may be referred to as the front surface, and the surface opposite the front surface may be referred to as the back surface.

[0010] Embodiment 1 Fig. 1 is a perspective view showing an induction heating cooker 1 according to the first embodiment. As shown in Fig. 1, the induction heating cooker 1 according to the first embodiment is a cooking cooker that uses electromagnetic induction to heat a cooking container and an object to be heated (food to be cooked), which are heating targets. A main body case 2 of the induction heating cooker 1 houses an appliance that performs cooking. The induction heating cooker 1 includes a composite cooking device having multiple types of heating means.

[0011] The top plate 3, which serves as a baking tray, is placed on top of the main body case 2, and a metal cooking container containing an object to be heated is placed on it. The top plate 3 is made of, for example, crystallized glass that transmits infrared rays. The top plate 3 in the first embodiment corresponds to the induction heating unit 10 described below, and has two heating areas 4 that are regions where the cooking container and the object to be heated (hereinafter, these are referred to as the object to be heated) placed on the surface of the top plate 3 can be induction heated. The boundaries of the heating areas 4 that can be heated are indicated to the user by a circular pattern printed on the top plate 3.

[0012] Moreover, the induction heating cooker 1 in the first embodiment has an operation display panel 7 on the upper front. The operation display panel 7 accepts operations for setting various cooking conditions and displays information indicating the setting values ​​of the cooking conditions and abnormalities. Furthermore, the induction heating cooker 1 in the first embodiment has a grill cooker 5 on the lower left side when viewed from the front. The grill cooker 5 is installed on the left side of the front part of the induction heating cooker 1, and has a grill door 6 for opening and closing a grill chamber 5a (see FIG. 3).

[0013] Fig. 2 is a diagram for explaining the configuration inside the main body case 2 of the induction heating cooker 1 of the embodiment 1. Fig. 2 shows the main body case 2 with the top plate 3 removed. The main body case 2 of the induction heating cooker 1 has an air intake port 8 at the rear for taking in air from the outside for cooling the induction heating unit 10, the filter board 14, the inverter board 15, etc. In addition, the main body case 2 has an exhaust port 9 for discharging smoke generated from the heated object in the grill chamber together with the air.

[0014] Moreover, the induction heating cooker 1 in the first embodiment has two induction heating units 10. The induction heating units 10 have heating coils 106 described later, and inductively heat an object to be heated placed on the heating area 4 of the top plate 3. Here, the number of induction heating units 10 included in the induction heating cooker 1 is not limited to two.

[0015] Fig. 3 is a schematic diagram showing the internal configuration of the induction heating cooker 1 according to the first embodiment. Fig. 3 shows the internal configuration when the induction heating cooker 1 is viewed from the front. A control box 20 is installed inside the main body case 2. The control box 20 houses a filter board 14, an inverter board 15, a control device 30, and the like. These boards 102 have components such as semiconductor integrated circuits, resistors, capacitors, and transistors fixed thereto, and have circuits formed by wiring between the components with copper foil.

[0016] The filter board 14 is an insulating board having a filter circuit. The filter circuit converts AC power supplied from a commercial power source (not shown) via a power cord 16 into DC power and rectifies it.

[0017] The inverter board 15 is an insulated power control board having an inverter circuit. The inverter circuit converts the DC power converted in the filter board 14 into AC power of a frequency based on the control of the control device 30, and supplies the AC power to the induction heating unit 10 via the lead wires 12. The lead wires 12 are wires made of twisted wires with an insulating coating.

[0018] A switching element 17, a heat sink 18, and a fan 19 are installed on the upper side of the inverter board 15. The switching element 17 is a part of the inverter circuit, and is a power control element that performs DC-AC conversion by switching operation. Here, the switching element 17 is, for example, an IGBT (Insulated Gate Bipolar Transistor) capable of high-speed switching operation. The heat sink 18 is, for example, made of aluminum, and dissipates heat generated by the switching operation of the switching element 17. The fan 19 sends air to the switching element 17 and the heat sink 18 to promote cooling of the switching element 17. The air taken into the main body case 2 from the intake port 8 when the fan 19 is driven passes through the fan 19 and is discharged from the exhaust port 9. A part of the air taken in from the intake port 8 is also used to cool the induction heating unit 10.

[0019] The control device 30 performs heating control in the induction heating cooker 1 based on instructions set via the operation display panel 7. The control device 30 also controls the display content on the operation display panel 7. Electric signals are input to the control device 30 from a non-contact sensor 501 and a contact sensor 502, which will be described later. The control device 30 is composed of a processing circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array). The control device 30 may also be composed of a CPU consisting of a processor and a memory.

[0020] The induction heating unit 10 is supported from the back side by a spring 13, which is an elastic body, and is pressed against the back side of the top plate 3 by the elastic force of the spring 13 and fixed. The induction heating unit 10 is fixed at a position with a certain distance from the top plate 3 by a spacer 11. The spacer 11 is an elastic member such as rubber. Here, although not particularly limited, for example, the distance between the substrate 102 and the top plate 3 is about 3 mm to about 4 mm. By providing a gap between the substrate 102 and the top plate 3, the influence of heat from the heated object on the heating coil 106 can be suppressed. Furthermore, the air flowing in from the intake port 8 passes over the heating coil 106, so that the heating coil 106 can be cooled. In addition, it is possible to suppress damage to the printing applied to the back side of the top plate 3 by a protrusion such as a screw protruding from the substrate 102. And, the spacer 11 can stabilize the distance between the non-contact sensor 501 and the contact sensor 502 and the top plate 3, and can improve the temperature detection accuracy.

[0021] Fig. 4 is a diagram for explaining the configuration of induction heating unit 10 in induction heating cooker 1 according to embodiment 1. Fig. 4 is an exploded view of induction heating unit 10. Induction heating unit 10 in embodiment 1 has magnetic shielding member 101, substrate 102, ferrite 103, holding member 104, and fixing screw 105.

[0022] The magnetic shielding member 101 is a plate-shaped member made of a non-magnetic metal that prevents the magnetism generated in the heating coil 106 from leaking outside the heating area 4. The magnetic shielding member 101 forms the outer shell of the induction heating unit 10, and has a shape that exposes the heating coil 106. The magnetic shielding member 101 also sandwiches the holding member 104 and the substrate 102, suppressing warping of the substrate 102. Note that the magnetic shielding member 101 is not a member that necessarily needs to be attached.

[0023] The substrate 102 is a printed circuit board provided with a heating coil 106 formed by printing. The substrate 102 is made of an insulating material. The substrate 102 is heat-resistant because it receives radiant heat from the object to be heated. The heating coil 106 is a thin-film conductor such as copper foil, and is spirally wound around the substrate 102. Since the heating coil 106 is formed by printing, no jig for winding copper wire is required during manufacturing, and the coil shape that can be manufactured has a high degree of freedom. The heating coil 106 generates a magnetic field by receiving power from the inverter substrate 15 via the lead wire 12, and forms an eddy current by electromagnetic induction. As a result, the heating coil 106 inductively heats the object to be heated. The heating coil 106 and the like may be protected by applying a solder resist to the substrate 102.

[0024] The configuration of the substrate 102 will be further described with reference to FIG. 5. FIG. 5 is a diagram showing the substrate 102 according to the first embodiment. FIG. 5 is an enlarged view of the main part of the substrate 102, in which the configuration of the front surface is drawn with a solid line and the configuration of the back surface is drawn with a dashed line. As shown in FIG. 5, the substrate 102 has an inner end coil connection part 106a, an outer end coil connection part 106b, and a pattern line 106c. The inner end coil connection part 106a and the outer end coil connection part 106b are pads for wiring connection. The inner end coil connection part 106a and the outer end coil connection part 106b are formed at opposing positions on the front and back surfaces of the substrate 102. The inner end coil connection part 106a and the outer end coil connection part 106b are formed of a thin film conductor.

[0025] An inner end connection terminal 107a (see FIGS. 6 and 7) serving as a connection part for connecting the lead wire 12 is mounted on the back surface of the inner end coil connection portion 106a. The inner end connection terminal 107a is fixed to the inner end coil connection portion 106a by, for example, soldering. The inner end of the heating coil 106 on the front surface of the substrate 102 and the inner end coil connection portion 106a on the back surface are electrically connected through vias (not shown) and pattern lines 106c formed on the back surface of the substrate 102 by a thin film conductor.

[0026] An outer end connection terminal 107b (see FIGS. 6 and 7) is mounted on the back surface of the outer end coil connection portion 106b, and serves as a connection component for connecting the lead wire 12. The outer end of the heating coil 106 on the front surface of the substrate 102 is electrically connected to the outer end coil connection portion 106b on the front surface.

[0027] The inner end coil connection portion 106a and the outer end coil connection portion 106b are located outside the outermost circumference of the heating coil 106, and the outer end coil connection portion 106b and the inner end coil connection portion 106a are arranged side by side along the same side. By arranging the outer end coil connection portion 106b and the inner end coil connection portion 106a side by side, the connection work of the lead wire 12 can be performed efficiently.

[0028] In addition, the substrate 102 is formed with a first non-contact sensor opening 201 and a first contact sensor opening 202 that penetrate in the vertical direction. The first non-contact sensor opening 201 is formed at a position outside the center of the substrate 102, and the first contact sensor opening 202 is formed at approximately the center of the substrate 102. The first non-contact sensor opening 201 functions as a viewing window for the non-contact sensor 501. The contact sensor 502 is inserted through the first contact sensor opening 202. The relationship between the first non-contact sensor opening 201 and the non-contact sensor 501, and the relationship between the first contact sensor opening 202 and the contact sensor 502 will be described later. The heating coil 106 is wound so as to avoid the first non-contact sensor opening 201. In the example of FIG. 5, as shown in the area S surrounded by a dashed line, the heating coil 106 is arranged shifted toward the outer periphery at the portion where the first non-contact sensor opening 201 is located.

[0029] 4, the ferrite 103 is a magnetic material that guides the magnetic flux generated by the magnetism in the heating coil 106 to the object to be heated located above the induction heating unit 10 via the top plate 3, and suppresses magnetic flux leakage downward from the heating coil 106. The suppression of magnetic flux leakage by the ferrite 103 prevents the control device 30 in the control box 20 from malfunctioning due to magnetism.

[0030] The holding member 104 is a member that holds the substrate 102 and the ferrite 103 sandwiched between the substrate 102. The holding member 104 is fixed to the substrate 102 by a fixing screw 105, and suppresses warping of the substrate 102 due to heat.

[0031] Further, the holding member 104 is formed with a second non-contact sensor opening 401 and a second contact sensor opening 402 which penetrate in the vertical direction. The second non-contact sensor opening 401 is formed at a position outside the center of the holding member 104, and the second contact sensor opening 402 is formed at approximately the center of the holding member 104. The second non-contact sensor opening 401 functions as a viewing window for the non-contact sensor 501. The contact sensor 502 is inserted through the second contact sensor opening 402. The relationship between the second non-contact sensor opening 401 and the non-contact sensor 501, and the relationship between the second contact sensor opening 402 and the contact sensor 502 will be described later.

[0032] Furthermore, the holding member 104 is formed with an inner end opening 404a and an outer end opening 404b. The inner end opening 404a is an opening through which the inner end connection terminal 107a passes. The outer end opening 404b is an opening through which the outer end connection terminal 107b passes. The inner end opening 404a and the outer end opening 404b allow the inner end connection terminal 107a and the outer end connection terminal 107b to be exposed to the lower part of the induction heating unit 10.

[0033] Fixing screws 105 fix substrate 102, holding member 104, and magnetic shielding member 101. Fixing substrate 102, holding member 104, and magnetic shielding member 101 together by fastening with fixing screws 105 eliminates the need for adhesive to fix substrate 102 when manufacturing induction heating unit 10, facilitating disassembly, etc. Here, fixing screws 105 are made of a non-magnetic material.

[0034] 6 and 7 are views of the holding member 104 according to the first embodiment as viewed from the back side. FIG. 6 shows a state in which the non-contact sensor 501 and the contact sensor 502 are attached to the holding member 104, and FIG. 7 shows a state in which the non-contact sensor 501 and the contact sensor 502 are removed from the holding member 104. As shown in FIGS. 6 and 7, the inner end connection terminal 107a and the outer end connection terminal 107b penetrate through the inner end opening 404a and the outer end opening 404b of the holding member 104 to the lower surface side of the holding member 104. The inner end connection terminal 107a and the outer end connection terminal 107b are screw terminals. The tab terminals are fixed to the inner end connection terminal 107a and the outer end connection terminal 107b by fastening screws into the inner end connection terminal 107a and the outer end connection terminal 107b and into screw holes (not shown) of the tab terminals connected to the ends of the lead wires 12. This electrically connects the lead wire 12 to the inner end connection terminal 107a and the outer end connection terminal 107b.

[0035] The non-contact sensor 501 is a temperature measuring device that measures the temperature of an object to be heated. The non-contact sensor 501 is, for example, an infrared sensor that detects infrared rays emitted from the object to be heated. The non-contact sensor 501 generates an electric signal indicating the measured temperature and transmits it to the control device 30. The non-contact sensor 501 is fixed to the holding member 104 by fastening a mounting screw 104b between a screw hole (not shown) of the non-contact sensor 501 and a screw hole (not shown) formed in a non-contact sensor mounting portion 104a (see FIG. 7) provided on the back surface of the holding member 104.

[0036] The contact sensor 502 is a temperature measuring device that measures the temperature of the object to be heated through the top plate 3. The contact sensor 502 is, for example, a thermistor. The contact sensor 502 generates an electric signal indicating the measured temperature and transmits it to the control device 30. The contact sensor 502 is fixed to the holding member 104 by fitting into a claw-shaped non-contact sensor attachment portion 403 provided on the back surface of the holding member 104.

[0037] FIG. 8 is a side view showing the substrate 102 and the holding member 104 according to the first embodiment. FIG. 9 is a cross-sectional view showing the substrate 102 and the holding member 104 according to the first embodiment. FIG. 8 shows a state in which the non-contact sensor 501 and the contact sensor 502 are attached to the holding member 104. FIG. 9 shows a cross section of the configuration shown in FIG. 8 cut in the vertical direction from the same direction as FIG. 8. Note that FIG. 9 shows a cross section that does not include the ferrite 103. As shown in FIG. 9, the first non-contact sensor opening 201 of the substrate 102 and the second non-contact sensor opening 401 of the holding member 104 are in communication. The non-contact sensor 501 has a case 501a and a sensor unit 501b that detects infrared rays and is stored in the case 501a. The case 501a is for preventing the sensor unit 501b from being affected by heat and noise. The first non-contact sensor opening 201 and the second non-contact sensor opening 401 are formed at positions facing the sensor portion 501b of the non-contact sensor 501. This allows the non-contact sensor 501 to detect infrared rays emitted from the object to be heated. In this way, the first non-contact sensor opening 201 and the second non-contact sensor opening 401 function as viewing windows for the non-contact sensor 501.

[0038] Furthermore, the first contact sensor opening 202 of the substrate 102 and the second contact sensor opening 402 of the holding member 104 are in communication with each other. A contact sensor 502 is inserted into the first contact sensor opening 202 and the second contact sensor opening 402. This allows the contact sensor 502 to come into contact with the top plate 3.

[0039] Fig. 10 is a schematic diagram showing the internal configuration of the induction heating cooker 1 according to the first embodiment. Fig. 10 shows the internal configuration of the induction heating cooker 1 as viewed from the front. Fig. 10 mainly shows the non-contact sensor 501, and does not show the contact sensor 502. As shown in Fig. 10, the non-contact sensor 501 has a non-contact sensor signal line 501c for receiving a control-related signal from the control device 30 and transmitting a measurement result. Although not shown, the non-contact sensor signal line 501c is wired to extend downward toward the control device 30.

[0040] The non-contact sensor 501 is attached at a position offset from the center of the holding member 104 in the left-right direction. Therefore, the non-contact sensor 501 measures the temperature of a portion of the object to be heated that is located outside the center of the heating area 4 of the top plate 3. The entire non-contact sensor 501 is located below the substrate 102 and the holding member 104. Therefore, the sensor unit 501b and the non-contact sensor signal line 501c of the non-contact sensor 501, which are susceptible to thermal effects from the object to be heated, are arranged away from the object to be heated.

[0041] FIG. 11 is a schematic diagram showing the internal configuration of the induction heating cooker 1 according to the first embodiment. FIG. 11 shows the internal configuration of the induction heating cooker 1 when viewed from the front. In addition, FIG. 11 mainly shows the contact sensor 502, and the non-contact sensor 501 is omitted from the illustration. As shown in FIG. 11, the contact sensor 502 has a contact sensor signal line 502a for receiving a signal related to control from the control device 30 and transmitting a measurement result. Although not shown, the contact sensor signal line 502a is wired so as to extend downward from the connection part 502b of the contact sensor 502 toward the control device 30. The connection part 502b is a part of the outer casing of the contact sensor 502 to which the contact sensor signal line 502a is connected.

[0042] The contact sensor 502 is in contact with the rear surface of the top plate 3. The contact sensor 502 is attached to approximately the center of the holding member 104 in the left-right direction. Therefore, the contact sensor 502 measures the temperature of a portion of the object to be heated that is located approximately in the center of the heating area 4 of the top plate 3. The connection part 502b of the contact sensor 502 is located below the substrate 102 and the holding member 104. Therefore, the contact sensor signal line 502a, which is susceptible to thermal effects from the object to be heated, is arranged away from the object to be heated.

[0043] As described above, in the induction heating cooker 1 of the first embodiment, at least a part of the non-contact sensor 501 and the contact sensor 502 is provided below the substrate 102. Therefore, the parts of the non-contact sensor 501 and the contact sensor 502 that should not be affected by the heat of the object to be heated can be arranged away from the object to be heated. Therefore, the induction heating cooker 1 can suppress a decrease in the accuracy of the measurement result by the temperature measuring device.

[0044] (Variation 1) FIG. 12 is a schematic diagram showing the internal configuration of the induction heating cooker 1A according to the first modification. In addition, FIG. 12 mainly shows the contact sensor 502, and the non-contact sensor 501 is omitted. As shown in FIG. 12, the contact sensor 502 may be provided in the control box 20, not in the holding member 104. The contact sensor 502 is fitted and fixed in a claw-shaped contact sensor attachment portion 20a formed on the upper surface of the control box 20. In this case, the connection portion 502b of the contact sensor 502 is located below the substrate 102 and the holding member 104. Therefore, the induction heating cooker 1A can suppress a decrease in the accuracy of the measurement result by the contact sensor 502.

[0045] (Variation 2) FIG. 13 is a schematic diagram showing the internal configuration of the induction heating cooker 1B according to the second modification. In addition, in FIG. 13, the non-contact sensor 501 is mainly shown, and the contact sensor 502 is omitted. As shown in FIG. 13, the non-contact sensor 501 may be provided in the control box 20 instead of the holding member 104. The non-contact sensor 501 is fixed to the control box 20 by fastening a screw hole (not shown) of the non-contact sensor 501 and a screw hole (not shown) formed in the non-contact sensor mounting portion 20b provided on the upper surface of the control box 20 with a mounting screw 20c. In this case, the entire non-contact sensor 501 is located below the substrate 102 and the holding member 104. Therefore, the induction heating cooker 1B can suppress a decrease in the accuracy of the measurement result by the non-contact sensor 501. Furthermore, when the non-contact sensor 501 is provided on the holding member 104, the spring 13 that presses the induction heating unit 10 against the top plate 3 buckles, which can cause the non-contact sensor 501 to shift together with the holding member 104, resulting in a shift in the portion of the object being measured. By providing the non-contact sensor 501 on the control box 20 as in the second modification, the non-contact sensor 501 is prevented from shifting, making it possible to stably measure the same portion of the object to be heated.

[0046] (Variation 3) FIG. 14 is a schematic diagram showing the internal configuration of the induction heating cooker 1C according to the third modification. In addition, in FIG. 14, the non-contact sensor 501 is mainly shown, and the contact sensor 502 is omitted. As shown in FIG. 14, the non-contact sensor 501 may be mounted on the inverter board 15. In the control box 20, an opening 20d is formed at a position facing the first non-contact sensor opening 201 of the board 102 and the second non-contact sensor opening 401 of the holding member 104. The non-contact sensor 501 measures the temperature of the object to be heated through the first non-contact sensor opening 201 of the board 102, the second non-contact sensor opening 401 of the holding member 104, and the opening 20d of the control box 20. In this case, the entire non-contact sensor 501 is located below the board 102 and the holding member 104. Therefore, the induction heating cooker 1C can suppress a decrease in the accuracy of the measurement result by the non-contact sensor 501. Furthermore, since the non-contact sensor 501 can suppress the effects of heat and noise on the sensor unit 501b by the control box 20, the case 501a can be omitted, and production costs can be reduced.

[0047] (Variation 4) FIG. 15 is a schematic diagram showing the internal configuration of the induction heating cooker 1D according to the fourth modification. In addition, in FIG. 15, the contact sensor 502 is mainly shown, and the non-contact sensor 501 is omitted. As shown in FIG. 15, the contact sensor 502 may be attached to a position that is off the center of the holding member 104 in the left-right direction. In this case, the contact sensor 502 measures the temperature of a portion of the object to be heated that is located outside the center of the heating area 4 of the top plate 3. The positions where the first contact sensor opening 202 of the substrate 102 through which the contact sensor 502 is inserted and the second contact sensor opening 402 of the holding member 104 are formed are also changed according to the position where the contact sensor 502 is attached. In this case, the heating coil 106 is wound so as to avoid the first contact sensor opening 202. The contact sensor 502 and the non-contact sensor 501 are attached so as not to interfere with each other.

[0048] (Variation 5) Fig. 16 is a schematic diagram showing an internal configuration of an induction heating cooker 1E according to Modification 5. Fig. 16 mainly shows the contact sensor 502, and does not show the non-contact sensor 501. As shown in Fig. 16, even when the contact sensor 502 is provided in the control box 20, the contact sensor 502 may be provided in a location other than the portion corresponding to the center of the heating area 4 of the top plate 3.

[0049] (Variation 6) FIG. 17 is a schematic diagram showing the internal configuration of the induction heating cooker 1F according to the sixth modification. In addition, in FIG. 17, the non-contact sensor 501 is mainly shown, and the contact sensor 502 is omitted. As shown in FIG. 17, the induction heating cooker 1F may be provided with a duct 21 below the induction heating unit 10 depending on the model and the like. The duct 21 has an air passage formed therein through which the air sent by the fan 19 passes. In FIG. 17, the air flow generated by the fan 19 is indicated by a dashed arrow. When the induction heating cooker 1F has such a configuration, the non-contact sensor 501 may be provided in the duct 21 instead of the holding member 104. The non-contact sensor 501 is fixed to the duct 21 by fastening a screw hole (not shown) of the non-contact sensor 501 and a screw hole (not shown) formed in the non-contact sensor mounting portion 21a provided on the upper surface of the duct 21 with a mounting screw 21b. In this case as well, the entire non-contact sensor 501 is located below the substrate 102 and the holding member 104. Therefore, the induction heating cooker 1F can suppress a decrease in the accuracy of the measurement results by the non-contact sensor 501. Note that not only the non-contact sensor 501 but also a contact sensor 502 may be provided in the duct 21.

[0050] The above is a description of the embodiment and its modified examples, but the present disclosure is not limited to the above embodiment, and various modifications or combinations are possible within the scope of the gist of the present disclosure. For example, only one of the non-contact sensor 501 and the contact sensor 502 may be provided. Also, a plurality of either or both of the non-contact sensor 501 and the contact sensor 502 may be provided. Furthermore, both the change in the mounting position of the non-contact sensor 501 shown in Modifications 2, 3, and 6 and the change in the mounting position of the contact sensor 502 shown in Modifications 1, 4, and 5 may be performed simultaneously.

[0051] Various aspects of the present disclosure are summarized below as appendices.

[0052] (Appendix 1) A top plate on which an object to be heated is placed; An insulating substrate; A heating coil formed by winding a conductor on the substrate and heating the object to be heated; A temperature measuring device that measures the temperature of the object to be heated, At least a portion of the temperature measuring device is located below the substrate. Induction heating cooker. (Appendix 2) an opening is formed in the substrate at a position facing the temperature measuring device; The temperature measuring device is a non-contact type, The entire temperature measuring device is located below the substrate. 2. An induction heating cooker as described in appendix 1. (Appendix 3) an opening through which the temperature measuring device is inserted is formed in the substrate; The temperature measuring device is a contact type, The temperature measuring device is A connection portion to which a signal line for communicating a measurement result is connected, The connection portion is located below the substrate. 3. An induction heating cooker according to claim 1 or 2. (Appendix 4) The substrate further includes a holding member for holding the substrate, The temperature measuring device is provided on the holding member. An induction heating cooker according to any one of appendix 1 to 3. (Appendix 5) an inverter board that supplies power to the board; A control box that houses the inverter board, The temperature measuring device is provided in the control box. An induction heating cooker according to any one of appendices 1 to 4. (Appendix 6) an inverter board that supplies power to the board; A fan that blows air onto the inverter board; and a duct through which the air blown by the fan flows. The temperature measuring device is provided in the duct. 6. An induction heating cooker according to any one of claims 1 to 5. (Appendix 7) Further comprising an inverter board for supplying power to the board; The temperature measuring device is provided on the inverter board. 5. An induction heating cooker as described in appended claim 2. (Appendix 8) The heating coil is wound around the opening. An induction heating cooker according to any one of appendixes 1 to 7. [Explanation of symbols]

[0053] 1, 1A to 1F induction heating cooker, 2 main body case, 3 top plate, 4 heating area, 5 grill cooker, 5a grill chamber, 6 grill door, 7 operation display panel, 8 air intake, 9 exhaust, 10 induction heating unit, 11 spacer, 12 lead wire, 13 spring, 14 filter board, 15 inverter board, 16 power cord, 17 switching element, 18 heat sink, 19 fan, 20 control box, 20a contact sensor mounting portion, 20b non-contact sensor mounting portion, 20c mounting screw, 20d opening, 21 duct, 21a non-contact sensor mounting portion, 21b mounting screw, 30 control device, 101 magnetic shielding member, 102 board, 103 ferrite, 104 holding member, 104a non-contact sensor mounting portion, 104b mounting screw, 105 Fixing screw, 106 heating coil, 106a inner end coil connection portion, 106b outer end coil connection portion, 106c pattern wire, 107a inner end connection terminal, 107b outer end connection terminal, 201 first non-contact sensor opening, 202 first contact sensor opening, 401 second non-contact sensor opening, 402 second contact sensor opening, 403 non-contact sensor mounting portion, 404a inner end opening, 404b outer end opening, 501 non-contact sensor, 501a case, 501b sensor portion, 501c non-contact sensor signal line, 502 contact sensor, 502a contact sensor signal line, 502b connection portion.

Claims

1. A top plate on which an object to be heated is placed; An insulating substrate; A heating coil formed by winding a conductor on the substrate and heating the object to be heated; A temperature measuring device that measures the temperature of the object to be heated, At least a portion of the temperature measuring device is located below the substrate. Induction heating cooker.

2. an opening is formed in the substrate at a position facing the temperature measuring device; The temperature measuring device is a non-contact type, The entire temperature measuring device is located below the substrate.

2. The induction heating cooker according to claim 1.

3. an opening through which the temperature measuring device is inserted is formed in the substrate; The temperature measuring device is a contact type, The temperature measuring device is A connection portion to which a signal line for communicating a measurement result is connected, The connection portion is located below the substrate.

2. The induction heating cooker according to claim 1.

4. The substrate further includes a holding member for holding the substrate, The temperature measuring device is provided on the holding member. The induction heating cooker according to any one of claims 1 to 3.

5. an inverter board that supplies power to the board; A control box that houses the inverter board, The temperature measuring device is provided in the control box. The induction heating cooker according to any one of claims 1 to 3.

6. an inverter board that supplies power to the board; A fan that blows air onto the inverter board; and a duct through which the air blown by the fan flows. The temperature measuring device is provided in the duct. The induction heating cooker according to any one of claims 1 to 3.

7. Further comprising an inverter board for supplying power to the board; The temperature measuring device is provided on the inverter board.

3. The induction heating cooker according to claim 2.

8. The heating coil is wound around the opening.

4. The induction heating cooker according to claim 2 or 3.

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