Radiation imaging device, radiation imaging system, and manufacturing method for radiation imaging device

Abstract

To provide a technique advantageous for preventing deterioration in image quality.SOLUTION: A radiation imaging device includes: a sensor panel including a first surface on which a pixel array and an electrical connection portion are disposed and a second surface opposite to the first surface; a wiring member connected to the electrical connection portion; and a support base configured to support the second surface via a first support member and a second support member. In an orthogonal projection with respect to the first surface, the electrical connection portion is disposed between a region in which the first support member is disposed so as to overlap the pixel array and an outer edge of the sensor panel, and the second support member is disposed so as to overlap the electrical connection portion. The second support member is fixed to at least one of the second surface, the support base, and the first support member. Between the second surface and the support base, a passage that reaches the outer edge from the first support member is disposed without overlapping the second support member in the orthogonal projection with respect to the first surface.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a radiation imaging apparatus, a radiation imaging system, and a method for manufacturing a radiation imaging apparatus. [Background technology]

[0002] Patent Document 1 shows a radiation detection device including a sensor panel having a pixel array and an electrical connection part to which a wiring member for reading out a signal from the pixel array to the outside is connected. According to Patent Document 1, the electrical connection part is supported by a frame-shaped support member, which prevents the sensor panel from being damaged or deformed when the wiring member is pressure-bonded to the electrical connection part. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-052535 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration shown in Patent Document 1, when the environmental temperature changes, a pressure difference may occur between the space surrounded by the frame-shaped support member, the sensor panel, and the support substrate, and the external space. If the pressure difference causes distortion in the sensor panel, artifacts may occur in the image obtained by the sensor panel.

[0005] An object of the present invention is to provide a technique that is advantageous in suppressing deterioration of image quality. [Means for solving the problem]

[0006] In consideration of the above problem, a radiation imaging device according to an embodiment of the present invention is a radiation imaging device including a sensor panel having a first surface on which a pixel array and an electrical connection portion are arranged and a second surface opposite to the first surface, a wiring member connected to the electrical connection portion, and a support base supporting the second surface via a first support member and a second support member, wherein the electrical connection portion is arranged between an area in which the first support member arranged to overlap the pixel array is arranged and an outer edge of the sensor panel in an orthogonal projection onto the first surface, and the second support member is arranged to overlap the electrical connection portion, the second support member is fixed to at least one of the second surface, the support base, and the first support member, and a passage is arranged between the second surface and the support base, extending from the first support member to the outer edge without overlapping the second support member in the orthogonal projection onto the first surface. Effect of the Invention

[0007] According to the present invention, it is possible to provide a technique that is advantageous in suppressing deterioration of image quality. [Brief description of the drawings]

[0008] [Figure 1] 1 is a diagram showing an example of the arrangement of a radiation imaging system including a radiation imaging apparatus according to an embodiment of the present invention; [Diagram 2] 1 is a diagram showing an example of the arrangement of a radiation imaging apparatus according to an embodiment of the present invention; [Diagram 3] 1 is a diagram showing an example of the arrangement of a radiation imaging apparatus according to an embodiment of the present invention; [Figure 4] 1 is a diagram showing an example of the arrangement of a radiation imaging apparatus according to an embodiment of the present invention; [Diagram 5] 1 is a diagram showing an example of the arrangement of a radiation imaging apparatus according to an embodiment of the present invention; [Figure 6] 1 is a diagram showing an example of the arrangement of a radiation imaging apparatus according to an embodiment of the present invention; [Figure 7] 5A to 5C are diagrams showing an example of a manufacturing method for the radiation imaging apparatus according to the present embodiment. [Figure 8] 5A to 5C are diagrams showing an example of a manufacturing method for the radiation imaging apparatus according to the present embodiment. [Figure 9]5A to 5C are diagrams showing an example of a manufacturing method for the radiation imaging apparatus according to the present embodiment. [Figure 10] 5A to 5C are diagrams showing an example of a manufacturing method for the radiation imaging apparatus according to the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] Furthermore, radiation in this disclosure may include α-rays, β-rays, γ-rays, and the like, which are beams produced by particles (including photons) emitted by radioactive decay, as well as beams having the same or greater energy, such as X-rays, particle beams, and cosmic rays.

[0011] A radiation imaging device according to an embodiment of the present disclosure will be described with reference to FIGS. 1 to 10(a) and 10(b). FIG. 1 is a schematic diagram showing a configuration example of a radiation imaging system SYS using a radiation imaging device 150 of this embodiment. The radiation imaging system SYS may include a radiation imaging device 150, a radiation generating device 152, and a processing device 153. The radiation imaging device 150 and the radiation generating device 152 are connected to the processing device 153. Radiation is irradiated from the radiation generating device 152 under the control of the processing device 153. The radiation imaging device 150 detects radiation irradiated from the radiation generating device 152 and transmitted through a subject 151. The radiation imaging device 150 transmits information on the detected radiation as a signal to the processing device 153, and the processing device 153 performs a desired calculation process. The processing device 153 generates, for example, a radiation image for diagnosis from the information on the radiation detected by the radiation imaging device 150. In FIG. 1, the radiation imaging device 150 and the processing device 153, and the radiation generating device 152 and the processing device 153 are shown as being connected by wire, respectively, but this is not limited to this and may be connected wirelessly.

[0012] 2(a) to 2(c) are schematic diagrams showing an example of the configuration of a radiation imaging device 150 according to this embodiment. Fig. 2(a) is a plan view of the radiation imaging device 150. Fig. 2(b) is a cross-sectional view taken along line A-A' in Fig. 2(a). Fig. 2(c) is a cross-sectional view taken along line B-B' in Fig. 2(a).

[0013] The radiation imaging device 150 includes a sensor panel 100, a wiring member 110, and a support base 300. The sensor panel 100 has a surface 131 on which a pixel array 102 and electrical connection parts 111 are arranged, and a surface 132 opposite to the surface 131. The support base 300 supports the surface 132 of the sensor panel 100 via a support member 301 and a support member 401. The sensor panel 100 has a substrate 101 made of a semiconductor such as silicon, glass, plastic, or the like. The pixel array 102 is arranged on the surface 131 of the sensor panel 100 (substrate 101). In the pixel array 102, pixels each including a conversion element that converts radiation or light into an electrical signal and a switching element such as a TFT are arranged, for example, two-dimensionally.

[0014] The conversion element arranged in the pixel array 102 may be made of amorphous selenium (a-Se) that directly converts radiation into an electrical signal. For example, as shown in Fig. 2(b), the conversion element arranged in the pixel array 102 may be made of a combination of a scintillator 200 and a photosensor (photoelectric conversion element) such as a photodiode or photocapacitor that converts light converted from radiation by the scintillator 200 into an electrical signal. The photoelectric conversion element may be made of a semiconductor such as amorphous silicon, an oxide semiconductor such as IGZO, or the like.

[0015] The electrical connection portion 111 is disposed around the pixel array 102 on the surface 131 of the sensor panel 100. More specifically, the electrical connection portion 111 is disposed between an area in which a support member 301 supporting the pixel array 102 is disposed and an outer edge 133 of the sensor panel 100 in an orthogonal projection onto the surface 131 of the sensor panel 100. A wiring member 110 is connected to the electrical connection portion 111 disposed on the surface 131 of the sensor panel 100. Signals and power for operating the pixel array 102 are supplied via the wiring member 110 and the electrical connection portion 111, and signals generated by the pixel array 102 are output from the sensor panel 100 to the outside.

[0016] The wiring member 110 is located outside the pixel array 102 and is electrically connected to the pixel array 102 as described above. In this embodiment, a plurality of electrical connection parts 111 are arranged on the surface 131 of the sensor panel 100, and a plurality of wiring members 110 are arranged to correspond to the respective electrical connection parts 111. As shown in FIG. 2(a), the electrical connection parts 111 and the wiring members 110 may be arranged on each of the four sides of the rectangular pixel array 102. However, this is not limited thereto, and the electrical connection parts 111 and the wiring members 110 may be arranged on only one side, on two adjacent or opposing sides, or on three sides. In addition, the wiring members 110 may be connected to all of the electrical connection parts 111 arranged on the sensor panel 100. However, depending on the design of the sensor panel 100, there may be electrical connection parts 111 to which the wiring members 110 are not connected.

[0017] In the example shown in Figures 2(a) to 2(c), the sensor panel 100 is composed of one sensor chip. However, the present invention is not limited to this, and the sensor panel 100 may be composed of a plurality of sensor chips. The pixel array 102 may be covered with a protective layer using an inorganic film such as silicon oxide or silicon nitride. Furthermore, a passivation film using an organic film such as polyimide may be disposed on the protective layer, and the surface of the sensor panel 100 may be flattened.

[0018] A flexible substrate or the like may be used for the wiring member 110. The wiring member 110 is connected to a circuit board (not shown) on which an electric circuit for operating the pixel array 102 is arranged, for example, on the surface 132 of the sensor panel 100. The circuit board may be a printed wiring board on which a semiconductor chip having a desired circuit is mounted. The wiring member 110 may also be provided with a circuit 113 for operating the pixel array 102. The circuit 113 may include, for example, a drive circuit for driving the pixel array 102 and a signal processing circuit for performing signal processing such as amplifying an electric signal read out from the pixel array 102. The wiring member 110 is joined to an electrical connection portion 111 arranged on the surface 131 of the sensor panel 100 by a joining member 112 (shown in FIG. 8) such as an anisotropic conductive film, and is electrically connected to the pixel array 102.

[0019] In this embodiment, as described above, the scintillator 200 is disposed as a part of the conversion element. The scintillator 200 can be shared by a plurality of photoelectric conversion elements. The scintillator 200 is disposed on the surface 131 of the sensor panel 100 so as to cover the pixel array 102 disposed on the surface 131 of the sensor panel 100. However, this is not limited thereto, and the scintillator 200 may also be disposed on the surface 132 of the sensor panel 100 as in the configurations shown in FIGS. 3(a) and 3(b), for example, when the substrate 101 is transparent. In an orthogonal projection onto the surface 131 of the sensor panel 100, the scintillator 200 is disposed at a position covering the pixel array 102 on the surface 131 (and surface 132) of the sensor panel 100.

[0020] The scintillator 200 converts radiation incident on the radiation imaging device 150 into light (for example, visible light) of a wavelength detectable by a photoelectric conversion element arranged in the pixel array 102. For example, an alkali halide material such as CsI:Tl in which cesium iodide (CsI) is doped with thallium (Tl) may be used for the scintillator 200. Alternatively, for the scintillator 200, a powder phosphor (which may also be called GOS) in which a metal oxysulfide (for example, Gd2O2S) base is doped with a small amount of a trivalent rare earth such as terbium or europium as a luminescent center may be used. As described above, when the conversion element arranged in the pixel array 102 directly converts radiation into an electrical signal, the scintillator 200 is omitted.

[0021] The surface of the scintillator 200 that is not in contact with the sensor panel 100 may be covered with a scintillator protective layer 201. The scintillator protective layer 201 is arranged to prevent the scintillator 200 from absorbing moisture, which may result in a decrease in the amount of light emitted or the sharpness of the image. The scintillator protective layer 201 may be formed by bonding a resin having low moisture permeability or a sheet having low moisture permeability to the surface of the scintillator 200 via a bonding layer such as an adhesive or a pressure sensitive adhesive. Examples of resin having low moisture permeability include chlorine-based resins such as polyparaxylylene and polyvinylidene chloride, and fluorine-based resins such as polychlorotrifluoroethylene and polyvinylidene fluoride. Examples of sheets having low moisture permeability include metal foils such as aluminum, silver, and copper, in addition to resin sheets. In the configurations shown in FIG. 2(b) and FIG. 3(a), the scintillator protective layer 201 is formed by bonding an aluminum sheet to the scintillator 200 using a pressure sensitive adhesive.

[0022] The support member 301 is disposed so as to overlap the pixel array 102 in an orthogonal projection onto the surface 131 of the sensor panel 100. As shown in FIG. 2(b), the pixel array 102 and the support member 301 may be the same size. The support member 301 is a member for supporting an area of ​​the substrate 101 including at least the pixel array 102 from the surface 132 side of the sensor panel 100. In other words, it can be said that the support base 300 supports the pixel array 102 from the surface 132 side of the sensor panel 100 via the support member 301. The support base 300 may be made of a metal material such as stainless steel, aluminum, or molybdenum, glass, ceramic, or the like. The support member 301 may also be a member for joining the support base 300 and the sensor panel 100.

[0023] The support member 401 is arranged so as to overlap at least one of the electrical connection portions 111 arranged on the sensor panel 100. The support member 401 supports the sensor panel 100 from the surface 132 side in an area where the support member 301 is not arranged. The support member 401 is fixed to at least one of the surface 132 of the sensor panel 100, the support base 300, and the support member 301.

[0024] As shown in FIG. 2(a), a plurality of support members 401 may be arranged. For example, in an orthogonal projection onto the surface 131 of the sensor panel 100, a plurality of support members 401 may be arranged intermittently so as to surround the pixel array 102. In either case, a passage 140 is arranged between the surface 132 of the sensor panel 100 and the support base 300, which does not overlap with the support members 301 in an orthogonal projection onto the surface 131 of the sensor panel 100 and reaches the outer edge 133 of the sensor panel 100. In other words, even if the support members 401 are arranged so as to surround the pixel array 102 as shown in FIG. 2(a), the support members 401 do not continuously surround the pixel array 102.

[0025] When the support member 401 continuously surrounds the pixel array 102, a change in the environmental temperature may cause a difference in air pressure between the space surrounded by the support member 401, the sensor panel 100, and the support base 300 and the external space. When a difference in air pressure occurs, the sensor panel 100 may be distorted, causing artifacts in the obtained image. In addition, for example, when the support member 401 is fixed to the sensor panel 100 and the support base 300, a change in the environmental temperature may cause distortion due to a difference in the expansion coefficient between the sensor panel 100 and the support base 300, which may cause artifacts. Such mechanical distortion may also cause damage or failure of the sensor panel 100.

[0026] On the other hand, in this embodiment, a passage 140 is provided between the surface 132 of the sensor panel 100 and the support base 300, and the passage 140 extends from the support member 301 to the outer edge 133 of the sensor panel 100, without the support member 401. This passage 140 prevents a difference in air pressure between the space surrounded by the support member 401, the sensor panel 100, and the support base 300 and the external space. Even if the support member 401 is fixed to the sensor panel 100 and the support base 300, the passage 140 can reduce distortion caused by the difference in the expansion coefficient between the sensor panel 100 and the support base 300 due to changes in the environmental temperature. As a result, the radiation imaging device 150 of this embodiment can suppress deterioration of image quality due to the occurrence of artifacts, etc. Also, damage and failure of the sensor panel 100 provided in the radiation imaging device 150 can be suppressed.

[0027] The support member 401 may be, for example, a resin that bonds the surface 132 of the sensor panel 100 and the support base 300. Also, for example, the support member 401 may be a sheet-like member having an adhesive surface. Furthermore, for example, the support member 401 may be composed of a plurality of members. For example, the support member 401 may be composed of a plate-like member arranged on the support base 300 so as to overlap the electrical connection portion 111, and a bonding member using a curable resin that bonds the plate-like member and the surface 132 of the sensor panel 100. In this case, the support member 401 is fixed to the surface 132 of the sensor panel 100 by the bonding member. Therefore, the support member 401 may be fixed to at least one of the support member 301 and the support base 300, or may not be fixed to the support member 301 and the support base 300.

[0028] In the configuration shown in FIG. 2(a), the support member 401 is divided and arranged for each side of the rectangular sensor panel 100. However, the present invention is not limited thereto. For example, as shown in FIGS. 4(a) to 4(c), at least two support members 401 may be arranged intermittently along one side of the outer edge 133 of the sensor panel 100. Also, for example, as shown in FIGS. 5(a) to 5(c), the support member 401 may be arranged so as to straddle two sides of the outer edge 133 of the sensor panel 100. Also, one support member 401 may be arranged so as to support one electrical connection portion 111, or may be arranged so as to support two or more electrical connection portions 111. The position where the passage 140 is arranged may be any position. There is no need to provide a support member 401 between the surface 132 of the sensor panel 100 and the support base 300, as long as there is a passage 140 extending from the support member 301 to the outer edge 133 of the sensor panel 100.

[0029] Furthermore, as shown in FIGS. 6(a) to 6(c), the support member 401 does not need to be arranged so as to overlap all the electrical connection parts 111. Although details will be described later, it is sufficient that the support member 401 is arranged so as to overlap at least one of the electrical connection parts 111. In other words, in an orthogonal projection onto the surface 131 of the sensor panel 100, the multiple electrical connection parts 111 may include an electrical connection part 111 arranged at a position that does not overlap the support member 401. Furthermore, the electrical connection parts 111 do not need to be arranged along all sides of the outer edge 133 of the sensor panel 100. The electrical connection parts 111 may be arranged along only two sides as shown in FIG. 6(a), or along one side or three sides, depending on the design of the sensor panel 100.

[0030] The elastic modulus of the support member 401 may be equal to or greater than the elastic modulus of the support member 301. By disposing the support member 401, the impact resistance of the vicinity of the outer edge 133 of the sensor panel 100 where the support member 301 is not disposed is improved, and damage or deformation of the sensor panel 100 can be suppressed. For example, the material of the support member 401 may be selected so that when a pressure of 0.5 MPa is applied to the electrical connection portion 111 supported by the support member 401 in the direction from the surface 131 to the surface 132 of the sensor panel 100, the displacement amount of the outer edge of the sensor panel 100 is equal to or less than the thickness of the sensor panel 100 (substrate 101). Also, for ... 100 μm. This makes it possible to suppress damage to the sensor panel 100 when, for example, the wiring members 110 are connected to the electrical connection portions 111 by crimping.

[0031] Next, an example of a manufacturing method of the radiation imaging device 150 will be described. First, as shown in Figures 7(a) to 7(c), a sensor panel 100 is prepared, which includes a surface 131 on which the pixel array 102 and the electrical connection parts 111 are arranged and a surface 132 opposite to the surface 131. This process can be performed using various known methods.

[0032] For example, the pixel array 102 and the electrical connection portion 111 are formed on a substrate 101 such as glass by using various semiconductor processes. Next, the scintillator 200 is formed so as to cover the pixel array 102. The scintillator 200 is formed, for example, by simultaneously heating and evaporating CsI and TlI in a vacuum chamber. When a powder phosphor is used as the scintillator 200, the scintillator 200 is formed, for example, by applying and drying GOS or the like.

[0033] Next, scintillator protective layer 201 is formed so as to cover scintillator 200. For example, scintillator protective layer 201 is formed by laminating an aluminum sheet to which an adhesive is attached using a roll laminator so as to cover scintillator 200. Polyparaxylylene or the like may be formed as scintillator protective layer 201 by using a CVD method. In that case, for example, sensor panel 100 on which scintillator 200 is formed is placed in a CVD chamber, and after evacuation to about 30 Pa, a polyparaxylylene film is formed while rotating a stage on which sensor panel 100 is placed at 5 rpm.

[0034] After the scintillator 200 and the scintillator protective layer 201 are formed, the wiring member 110 is connected to the electrical connection portion 111. For example, as shown in FIG. 8, the wiring member 110 is connected to the electrical connection portion 111 arranged on the surface 131 of the sensor panel 100 via a bonding member 112 such as an anisotropic conductive film (ACF) or a gold bump. For example, the wiring member 110 is connected to the electrical connection portion 111 by thermocompression bonding using a pressure bonding device 600 under conditions of a temperature of 100° C. to 200° C. and a pressure of 0.5 MPa to 5 MPa for 5 seconds to 5 minutes. The wiring member 110 may be connected to the electrical connection portion 111 by a method that does not involve heating or pressing, instead of using thermocompression bonding. The wiring member 110 may be connected to the electrical connection portion 111 before the scintillator 200 and the scintillator protective layer 201 are formed.

[0035] Next, a step is performed in which the sensor panel 100 is fixed to a support base 300 that supports the surface 132 of the sensor panel 100 via the support members 301 and 401. The support member 301 may be, for example, a silicone-based adhesive having a thickness of 100 μm. The support member 301 is disposed so as to be in contact with at least an area of ​​the surface 132 of the sensor panel 100 that overlaps with a portion on which the pixel array 102 is disposed.

[0036] The supporting member 401 may be disposed between the supporting base 300 and the surface 132 of the sensor panel 100 when the sensor panel 100 is fixed to the supporting base 300 via the supporting member 301. Alternatively, the supporting member 401 may be formed after the sensor panel 100 is fixed to the supporting base 300 via the supporting member 301. As described above, the supporting member 401 is disposed at a position overlapping the electrical connection portion 111. The supporting member 401 may be formed by simply applying a two-liquid epoxy resin in which two liquids are mixed and hardening is accelerated, or a plate material may be placed on the supporting base 300 and epoxy resin may be applied to the plate material.

[0037] The radiation imaging device 150 is manufactured using the above-mentioned process. By disposing the support member 401, the rigidity of the sensor panel 100 near the outer edge 133 is increased. This makes it possible to suppress damage to the sensor panel 100, for example, even if an impact is applied during movement or use of the radiation imaging device 150. As a result, the reliability of the radiation imaging device 150 is improved. In addition, as shown in FIG. 6(a), even in the electrical connection portion 111 where the support member 401 is not disposed directly below, the support member 401 is disposed adjacent thereto. Therefore, it is possible to suppress damage to the sensor panel 100 compared to a case where the support member 401 is not disposed.

[0038] As described above, the passage 140 extending from the support member 301 to the outer edge 133 of the sensor panel 100 is disposed between the surface 132 of the sensor panel 100 and the support base 300, so that the support member 401 does not continuously surround the pixel array 102. This prevents the sensor panel 100 from being distorted due to changes in the environmental temperature, and thus prevents the occurrence of artifacts. In other words, deterioration in the image quality of the image obtained by the radiation imaging device 150 can be prevented.

[0039] In the above-described manufacturing method, the supporting members 301 and 401 are disposed at the same timing when the sensor panel 100 is fixed to the support base 300. However, the manufacturing method is not limited to this. An example of a manufacturing method of the radiation imaging device 150 different from the above will be described below.

[0040] The manufacturing method may be the same as that described above up to the step of fixing the sensor panel 100 to the support base 300, and the sensor panel 100 is prepared with the wiring members 110 connected to the electrical connection parts 111. Next, the sensor panel 100 is fixed to the support base 300 that supports the surface 132 of the sensor panel 100 via the support members 301. At this time, the support members 401 have not yet been placed.

[0041] Thereafter, the radiation imaging device 150 is manufactured using an appropriate process, and a final inspection of the radiation imaging device 150 is performed. In this inspection, for example, a defective connection via the wiring member 110 or a defective circuit 113 disposed on the wiring member 110 may be found. For example, assume that a defect is found in the wiring member 110 connected to the electrical connection portion 111 disposed at the position R shown in FIG. 9. In that case, it is required to replace only the wiring member 110 in which the defect is found from the viewpoint of cost and the like. Therefore, based on the result of this inspection process, the wiring member 110 disposed at the position R is removed from the electrical connection portion 111. Next, the bonding member 112 remaining on the surface 131 of the sensor panel 100 is removed using a solvent such as acetone or methyl ethyl ketone (MEK).

[0042] Next, a wiring member 110 different from the removed wiring member 110 is connected to the electrical connection portion 111 arranged at position R. At this time, a space is generated between the electrical connection portion 111 arranged at position R and the support base 300 due to the support member 301 arranged so as to overlap with the pixel array 102. Therefore, when the wiring member 110 is connected to the electrical connection portion 111 arranged at position R, the pressure applied when the wiring member 110 is crimped may damage the vicinity of position R of the sensor panel 100.

[0043] 10, before connecting the wiring member 110 to the electrical connection portion 111, a support member 401 is placed in an area that overlaps at least the electrical connection portion 111 placed at position R in orthogonal projection onto the surface 131 of the sensor panel 100. The support member 401 may be formed, for example, by applying epoxy resin, or by placing a plate material on the support base 300 and applying epoxy resin onto the plate material.

[0044] After forming the support member 401, a new wiring member 110 is connected to the electrical connection portion 111. The process of connecting the wiring member 110 is the same as the process described with reference to FIG. 8. When connecting the wiring member 110, the support member 401 is disposed between the sensor panel 100 and the support base 300. This ensures the rigidity of the sensor panel 100 (substrate 101) at the position R, and can suppress poor connection between the electrical connection portion 111 and the new wiring member 110 and damage to the sensor panel 100. As a result, it is possible to improve the reliability and yield of the radiation imaging device 150. In addition, as described above, the passage 140 is disposed between the surface 132 of the sensor panel 100 and the support base 300, and the support member 401 does not continuously surround the pixel array 102. Therefore, distortion of the sensor panel 100 due to changes in environmental temperature and the like is suppressed, and the occurrence of artifacts can be suppressed.

[0045] The disclosure of the present specification includes the following radiation imaging device, radiation imaging system, and method for manufacturing a radiation imaging device.

[0046] (Item 1) A radiation imaging device including a sensor panel having a first surface on which a pixel array and an electrical connection portion are arranged and a second surface opposite to the first surface, a wiring member connected to the electrical connection portion, and a support base supporting the second surface via a first support member and a second support member, the electrical connection portion is disposed between an outer edge of the sensor panel and a region in which the first support member is disposed so as to overlap the pixel array in an orthogonal projection onto the first surface, and the second support member is disposed so as to overlap the electrical connection portion; the second support member is fixed to at least one of the second surface, the support base, and the first support member; A radiation imaging device characterized in that a passage is arranged between the second surface and the support base, the passage extending from the first support member to the outer edge without overlapping with the second support member in an orthogonal projection onto the first surface.

[0047] (Item 2) 2. The radiation imaging device described in item 1, characterized in that when a pressure of 0.5 MPa is applied to the electrical connection portion in a direction from the first surface to the second surface, the amount of displacement of the outer edge is less than or equal to the thickness of the sensor panel.

[0048] (Item 3) 3. The radiation imaging device of item 1 or 2, characterized in that when a pressure of 0.5 MPa is applied to the electrical connection portion in a direction from the first surface to the second surface, the amount of displacement of the outer edge is 100 μm or less.

[0049] (Item 4) 4. The radiation imaging apparatus according to any one of items 1 to 3, wherein the second support member has an elastic modulus equal to or greater than the elastic modulus of the first support member.

[0050] (Item 5) 5. The radiation imaging apparatus according to any one of items 1 to 4, further comprising a plurality of second support members including the second support member.

[0051] (Item 6) 6. The radiation imaging device according to item 5, wherein at least two of the plurality of second support members are intermittently arranged along one side of the outer edge.

[0052] (Item 7) 7. The radiation imaging device according to item 5 or 6, wherein, in an orthogonal projection onto the first surface, the plurality of second support members are intermittently arranged so as to surround the pixel array.

[0053] (Item 8) a plurality of electrical connection portions including the electrical connection portion are disposed on the first surface; 8. The radiation imaging device according to any one of items 5 to 7, wherein the plurality of second support members includes one second support member supporting two or more of the electrical connection portions.

[0054] (Item 9) a plurality of electrical connection portions including the electrical connection portion are disposed on the first surface; 5. The radiation imaging apparatus according to any one of items 1 to 4, wherein the second support member supports two or more of the plurality of electrical connection parts.

[0055] (Item 10) 10. The radiation imaging device of claim 8 or 9, wherein, in an orthogonal projection onto the first surface, the plurality of electrical connection portions include an electrical connection portion arranged in a position that does not overlap the second support member.

[0056] (Item 11) 11. The radiation imaging device according to any one of items 1 to 10, wherein a circuit for operating the pixel array is disposed on the wiring member.

[0057] (Item 12) 12. The radiation imaging device according to any one of items 1 to 11, further comprising a scintillator disposed so as to cover the first surface.

[0058] (Item 13) A radiation imaging apparatus according to any one of items 1 to 12, a processing device for processing a signal output from the radiation imaging device; A radiation imaging system comprising:

[0059] (Item 14) A first step of providing a sensor panel having a first surface on which a pixel array and an electrical connection portion are disposed and a second surface opposite to the first surface; a second step of fixing the sensor panel to a support base that supports the second surface via a first support member, the electrical connection portion is disposed between an outer edge of the sensor panel and a region in which the first support member is disposed so as to overlap the pixel array in an orthogonal projection onto the first surface; a third step of disposing a second support member between the second surface and the support base so as to overlap the electrical connection portion in order to support the electrical connection portion; a fourth step of connecting a wiring member to the electrical connection portion; Further comprising: the second support member is fixed to at least one of the second surface, the support base, and the first support member; A manufacturing method characterized in that a passage is arranged between the second surface and the support base, the passage extending from the first support member to the outer edge without overlapping with the second support member in an orthogonal projection onto the first surface.

[0060] (Item 15) The fourth step is carried out after the third step, In the first step, a wiring member different from the wiring member is connected to the electrical connection portion, Item 15. The manufacturing method according to item 14, further comprising a fifth step between the second step and the third step of removing the separate wiring member from the electrical connection portion.

[0061] (Item 16) a sixth step between the second step and the fifth step of inspecting the radiation imaging device; Item 16. The manufacturing method according to item 15, wherein the other wiring member is removed based on the result of the sixth step.

[0062] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0063] 100: sensor panel, 102: pixel array, 110: wiring member, 111: electrical connection portion, 131, 132: surfaces, 133: outer edge, 140: passage, 150: radiation imaging device, 300: support base, 301, 401: support member

Claims

1. A radiation imaging device including: a sensor panel having a first surface on which a pixel array and an electrical connection portion are arranged, and a second surface opposite to the first surface; a wiring member connected to the electrical connection portion; and a support base supporting the second surface via a first support member and a second support member, the electrical connection portion is disposed between an outer edge of the sensor panel and a region in which the first support member is disposed so as to overlap the pixel array in an orthogonal projection onto the first surface, and the second support member is disposed so as to overlap the electrical connection portion; the second support member is fixed to at least one of the second surface, the support base, and the first support member; A radiation imaging device characterized in that a passage is arranged between the second surface and the support base, the passage extending from the first support member to the outer edge without overlapping with the second support member in an orthogonal projection onto the first surface.

2. 2. The radiation imaging device according to claim 1, wherein when a pressure of 0.5 MPa is applied to the electrical connection portion in a direction from the first surface to the second surface, the amount of displacement of the outer edge is equal to or less than a thickness of the sensor panel.

3. 2. The radiation imaging device according to claim 1, wherein when a pressure of 0.5 MPa is applied to the electrical connection portion in a direction from the first surface to the second surface, a displacement of the outer edge is 100 [mu]m or less.

4. 2. The radiation imaging apparatus according to claim 1, wherein the elastic modulus of the second support member is equal to or greater than the elastic modulus of the first support member.

5. 2. The radiation imaging apparatus according to claim 1, further comprising a plurality of second support members including the second support member.

6. 6. The radiation imaging apparatus according to claim 5, wherein at least two of the plurality of second support members are intermittently disposed along one side of the outer edge.

7. 6. The radiation imaging apparatus according to claim 5, wherein the plurality of second support members are intermittently arranged so as to surround the pixel array in an orthogonal projection onto the first surface.

8. a plurality of electrical connection portions including the electrical connection portion are disposed on the first surface; 6. The radiation imaging apparatus according to claim 5, wherein the plurality of second support members include one second support member supporting two or more of the electrical connection portions.

9. a plurality of electrical connection portions including the electrical connection portion are disposed on the first surface; The radiation imaging apparatus according to claim 1 , wherein the second support member supports two or more of the plurality of electrical connection parts.

10. The radiation imaging apparatus according to claim 8 , wherein the plurality of electrical connection portions include an electrical connection portion disposed at a position that does not overlap the second support member in an orthogonal projection onto the first surface.

11. 2. The radiation imaging apparatus according to claim 1, wherein a circuit for operating the pixel array is disposed on the wiring member.

12. 2. The radiation imaging device according to claim 1, further comprising a scintillator disposed so as to cover the first surface.

13. A radiation imaging apparatus according to any one of claims 1 to 12, a processing device for processing a signal output from the radiation imaging device; A radiation imaging system comprising:

14. A first step of providing a sensor panel having a first surface on which a pixel array and electrical connections are disposed and a second surface opposite the first surface; a second step of fixing the sensor panel to a support base that supports the second surface via a first support member, the electrical connection portion is disposed between an area in which the first support member is disposed so as to overlap the pixel array in an orthogonal projection onto the first surface, and an outer edge of the sensor panel; a third step of disposing a second support member between the second surface and the support base so as to overlap the electrical connection portion in order to support the electrical connection portion; a fourth step of connecting a wiring member to the electrical connection portion; Further comprising: the second support member is fixed to at least one of the second surface, the support base, and the first support member; A manufacturing method characterized in that a passage is arranged between the second surface and the support base, the passage extending from the first support member to the outer edge without overlapping with the second support member in an orthogonal projection onto the first surface.

15. The fourth step is carried out after the third step, In the first step, a wiring member different from the wiring member is connected to the electrical connection portion, 15. The manufacturing method according to claim 14, further comprising a fifth step between the second step and the third step of detaching the separate wiring member from the electrical connection portion.

16. a sixth step between the second step and the fifth step of inspecting the radiation imaging device, 16. The manufacturing method according to claim 15, wherein the other wiring member is removed based on the result of the sixth step.

Images