Sealing structure, display substrate and its manufacturing method, and display device

Abstract

Among the sealing structure, display substrate and its manufacturing method, and display device provided by the present invention, the sealing structure is configured to seal a component and includes a first sealing layer used to cover the component, and a second sealing layer laminated with the first sealing layer, the second sealing layer being located on a side of the first sealing layer away from the component, the surface of the second sealing layer facing the first sealing layer being in contact with the surface of the first sealing layer facing the second sealing layer, and the surface of the second sealing layer away from the first sealing layer being approximately parallel to a plane in which the sealing structure is located.

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims priority based on a Chinese patent application filed with the China Patent Office on October 27, 2021, bearing application number 202111254074.4, and entitled "Encapsulating structure, display substrate and its manufacturing method, and display device," the entire disclosure of which is incorporated herein by reference.

[0002] The present invention relates to the field of display technology, and in particular to an encapsulation structure, a display substrate and its manufacturing method, and a display device. [Background technology]

[0003] Similar to organic light-emitting diodes (OLEDs), micro light-emitting diodes (including Mini LEDs and Micro LEDs) are self-emitting diodes with a series of advantages such as high brightness, ultra-low latency, ultra-large viewing angles, etc. Micro light-emitting diodes are based on metal semiconductors with more stable characteristics and low luminous resistance, and therefore have lower power consumption, better resistance to high and low temperatures, and longer service life than organic light-emitting diodes based on organic materials.

[0004] Using micro light-emitting diodes as a backlight source can achieve a more accurate dynamic backlight effect, effectively improving the brightness and contrast of the screen, while also solving the glare phenomenon caused by traditional dynamic backlights between the bright and dark areas of the screen, optimizing the visual experience. In addition, using micro light-emitting diodes as a display panel has the advantages of self-luminescence, fast response, low power consumption, high contrast, long life, high color saturation, etc., and will become the next generation of light-emitting diodes, which are displays following liquid crystal displays and organic light-emitting displays. Summary of the Invention [Problem to be solved by the invention]

[0005] In order to solve the problem that the sealing structure of the existing technology does not have both adhesive-free process edge and pressure resistance performance, the embodiments of the present invention provide a sealing structure, a display substrate and its manufacturing method, and a display device. [Means for solving the problem]

[0006] Accordingly, an embodiment of the present invention provides an encapsulation structure for packaging a component, the encapsulation structure including: a first encapsulation layer used to cover the component; and a second encapsulation layer laminated with the first encapsulation layer;

[0007] The second sealing layer is located on a side of the first sealing layer away from the component, the surface of the second sealing layer facing the first sealing layer is in contact with the surface of the first sealing layer facing the second sealing layer, and the surface of the second sealing layer facing away from the first sealing layer is approximately parallel to a plane in which the sealing structure is located.

[0008] Optionally, in the above sealing structure provided by an embodiment of the present invention, the first sealing layer includes at least two sub-sealing layers stacked in a direction away from the component, where the sub-sealing layer closest to the component in a direction away from the component includes a variable viscosity component.

[0009] Optionally, in the above sealing structure provided by an embodiment of the present invention, the sub-encapsulating layer closest to the component in a direction away from the component further comprises a first transparent colloid, and the variable viscosity component comprises an adhesive.

[0010] Optionally, in the above sealing structure provided by an embodiment of the present invention, a mass ratio of the adhesive to the first transparent colloid is greater than or equal to 1:2 and less than or equal to 2:1.

[0011] Optionally, in the above sealing structure provided by an embodiment of the present invention, the sub-encapsulating layer closest to the component in a direction away from the component further comprises a first transparent colloid, and the variable viscosity component comprises expanding particles.

[0012] Optionally, in the above sealing structure provided by the embodiment of the present invention, the mass fraction of the expanding particles in the first transparent colloid is greater than or equal to 0.5% and less than or equal to 3%.

[0013] Meanwhile, in the embodiment of the present invention, the display substrate provided by the embodiment of the present invention is A base substrate; A plurality of components are arranged on one side of a base substrate; a sealing structure; The sealing structure is the above-mentioned sealing structure provided by an embodiment of the present invention, wherein the first sealing layer covers the multiple components, a thickness of the first sealing layer in a direction perpendicular to the base substrate is greater than or equal to the height of the components, the second sealing layer is located on a side of the first sealing layer away from the multiple components, a surface of the second sealing layer facing the first sealing layer is in contact with a surface of the first sealing layer facing the second sealing layer, and a surface of the second sealing layer away from the first sealing layer is approximately parallel to the base substrate.

[0014] Optionally, in the above display substrate provided by an embodiment of the present invention, a hardness of the second encapsulation layer is greater than a hardness of the first encapsulation layer.

[0015] Optionally, in the above display substrate provided by the embodiment of the present invention, the first encapsulating layer includes a first sub-encapsulating layer and a second sub-encapsulating layer stacked together.

[0016] Optionally, in the above display substrate provided by an embodiment of the present invention, at least one of the first sub-encapsulation layer, the second sub-encapsulation layer and the second encapsulation layer includes diffusing particles and / or carbon black particles.

[0017] Optionally, in the above display substrate provided by an embodiment of the present invention, the second sub-encapsulation layer is located on a side of the component away from the first sub-encapsulation layer, and the first sub-encapsulation layer includes diffusing particles.

[0018] Optionally, in the display substrate provided by an embodiment of the present invention, the second sub-encapsulation layer includes carbon black particles. Optionally, in the display substrate provided by an embodiment of the present invention, the first sub-encapsulation layer and the second sub-encapsulation layer protrude in a direction away from the light emitting component, and an orthogonal projection of the protrusion on the base substrate overlaps with an orthogonal projection of the light emitting component on the base substrate.

[0019] Optionally, in the above display substrate provided by an embodiment of the present invention, the protrusion includes a first protrusion located on the first sub-encapsulation layer; The orthogonal projection of the light emitting component on the base substrate is located at the orthogonal projection of the first protrusion on the base substrate.

[0020] Optionally, in the above display substrate provided by an embodiment of the present invention, the protrusion includes a first protrusion located in the first sub-encapsulation layer, the first protrusion surrounding the light-emitting component and perpendicular to the surface of the base substrate.

[0021] Optionally, in the above display substrate provided by an embodiment of the present invention, a portion of the first sub-encapsulation layer located between adjacent first protrusions is substantially parallel to the base substrate.

[0022] Optionally, in the above display substrate provided by an embodiment of the present invention, the protrusion includes a second protrusion located on the second sub-encapsulation layer; The orthogonal projection of the first protrusion on the base substrate is located at the orthogonal projection of the second protrusion on the base substrate, and the orthogonal projection of the light-emitting component on the base substrate is located at the orthogonal projection of the second protrusion on the base substrate.

[0023] Optionally, in the above display substrate provided by an embodiment of the present invention, a portion of the second sub-encapsulation layer located between adjacent second protrusions is substantially parallel to the base substrate.

[0024] Optionally, in the above display substrate provided by an embodiment of the present invention, the first sub-encapsulation layer comprises a first transparent colloid, the second sub-encapsulation layer comprises a second transparent colloid, and the second encapsulation layer comprises a third transparent colloid; The refractive index of the first transparent colloid, the refractive index of the second transparent colloid and the refractive index of the third transparent colloid are approximately the same.

[0025] Optionally, in the above display substrate provided by an embodiment of the present invention, the first sub-encapsulation layer comprises a first transparent colloid, the second sub-encapsulation layer comprises a second transparent colloid, and the second encapsulation layer comprises a third transparent colloid; The refractive index of the second transparent colloid is different from the refractive index of the first transparent colloid, and the refractive index of the second transparent colloid is different from the refractive index of the third transparent colloid.

[0026] Optionally, in the above display substrate provided by the embodiment of the present invention, the color of the first sub-encapsulation layer is black, and the color of the second sub-encapsulation layer is different from the color of the first sub-encapsulation layer.

[0027] Optionally, in the above display substrate provided by the embodiment of the present invention, a color of the second encapsulation layer is different from a color of the first sub-encapsulation layer.

[0028] Optionally, in the above display substrate provided by an embodiment of the present invention, in a direction away from the base substrate of the light emitting component, the sum of the thickness of the first sub-encapsulating layer, the thickness of the second sub-encapsulating layer and the thickness of the second encapsulating layer is greater than the height of the light emitting component.

[0029] Optionally, in the above display substrate provided by an embodiment of the present invention, a positive projection on at least one of the first sub-encapsulation layer, the second sub-encapsulation layer and the second encapsulation layer covers a positive projection of the light-emitting component.

[0030] Optionally, in the above display substrate provided by an embodiment of the present invention, the first sub-encapsulation layer, the second sub-encapsulation layer and the second encapsulation layer are stacked in order in a direction away from the base substrate of the light-emitting diode; an orthogonal projection of the second sub-encapsulation layer on the base substrate completely covers an orthogonal projection of each of the light emitting components on the base substrate and an orthogonal projection of a gap between two adjacent light emitting components on the base substrate; The orthogonal projection onto a vertical plane of the surface of the second sub-encapsulation layer facing the light emitting components on the base substrate partially covers the orthogonal projection onto the vertical plane of each of the light emitting components.

[0031] Optionally, in the above display substrate provided by an embodiment of the present invention, the first sub-encapsulating layer is located between each two adjacent light-emitting components, or the orthogonal projection of the first sub-encapsulating layer on the base substrate completely covers the orthogonal projection of each of the light-emitting components on the base substrate and the orthogonal projection of the gap between two adjacent light-emitting components on the base substrate, and the orthogonal projection of the first sub-encapsulating layer on a vertical plane of the surface facing the light-emitting components on the base substrate completely covers the orthogonal projection of each of the light-emitting components on the vertical plane.

[0032] Optionally, in the above display substrate provided by an embodiment of the present invention, in a direction away from the base substrate of the light emitting component, the second sub-encapsulation layer, the first sub-encapsulation layer and the second encapsulation layer are stacked in order; an orthogonal projection of the first sub-encapsulation layer on the base substrate completely covers an orthogonal projection of each of the light emitting components on the base substrate and an orthogonal projection of a gap between two adjacent light emitting components on the base substrate; an orthogonal projection of a surface of the first sub-encapsulation layer facing the light emitting components on the base substrate on a vertical plane partially covers an orthogonal projection of each of the light emitting components on the vertical plane; an orthogonal projection of the second sub-encapsulation layer on the base substrate completely covers an orthogonal projection of each of the light emitting components on the base substrate and an orthogonal projection of a gap between two adjacent light emitting components on the base substrate; The orthogonal projection on a vertical plane of the surface of the second sub-encapsulation layer facing the light emitting components on the base substrate completely covers the orthogonal projection on the vertical plane of each of the light emitting components.

[0033] Optionally, in the above display substrate provided by an embodiment of the present invention, a surface of the second sub-encapsulation layer away from the base substrate is substantially parallel to the base substrate.

[0034] Optionally, in the above display substrate provided by an embodiment of the present invention, the surface of the second sub-encapsulation layer away from the base substrate is approximately parallel to the base substrate in the gap between two adjacent light-emitting components, and the area in which each of the light-emitting components is located protrudes in a direction away from the base substrate of the light-emitting component.

[0035] Optionally, in the above display substrate provided by an embodiment of the present invention, the refractive index of the first transparent colloid, the refractive index of the second transparent colloid and the refractive index of the third transparent colloid are set to increase, decrease or alternate.

[0036] Optionally, in the above display substrate provided by an embodiment of the present invention, the maximum refractive index of the first transparent colloid, the second transparent colloid and the third transparent colloid is greater than or equal to 1.6, and the minimum refractive index is about 1.41.

[0037] Optionally, in the above display substrate provided by an embodiment of the present invention, a transparent substrate layer is further included, and the transparent substrate layer is provided on a side of the stack including the first transparent colloid, the second transparent colloid, and the third transparent colloid away from the base substrate; The refractive index of a stack including the first transparent colloid, the second transparent colloid, the third transparent colloid and the transparent substrate layer may be increased, decreased or alternated.

[0038] Optionally, in the above display substrate provided by an embodiment of the present invention, at least one auxiliary functional layer is further included, which is located on a side of the transparent substrate layer away from the base substrate, and wherein: The refractive index of the first transparent colloid, the refractive index of the second transparent colloid, the refractive index of the third transparent colloid, and the refractive index of at least one of the auxiliary functional layers are set to increase, decrease, or alternate.

[0039] Optionally, in the above display substrate provided by an embodiment of the present invention, the at least one auxiliary functional layer further includes a laminated hardened layer and an anti-fingerprint layer, wherein the hardened layer is located between the transparent substrate layer and the anti-fingerprint layer.

[0040] Optionally, in the above display substrate provided by an embodiment of the present invention, the anti-fingerprint layer and / or the hardened layer comprises atomized particles.

[0041] Optionally, in the above display substrate provided by an embodiment of the present invention, diffusing particles are dispersed in at least one of the second transparent colloid and the third transparent colloid.

[0042] Optionally, in the above display substrate provided by an embodiment of the present invention, diffusing particles are dispersed in the second transparent colloid.

[0043] Optionally, in the above display substrate provided by the embodiment of the present invention, the particle size of the diffusing particles is in the micron scale, and the mass fraction of the diffusing particles in the second transparent colloid is 10% to 15%.

[0044] Optionally, in the above display substrate provided by the embodiment of the present invention, the particle size of the diffusing particles is nanoscale, and the mass fraction of the diffusing particles in the second transparent colloid is 1.5% to 3.5%.

[0045] Optionally, in the above display substrate provided by an embodiment of the present invention, the diffusing particles are transparent particles or white particles.

[0046] Optionally, in the above display substrate provided by an embodiment of the present invention, the material of the transparent particles includes silicon dioxide or polymethyl methacrylate, and the material of the white particles includes titanium dioxide.

[0047] Optionally, in the above display substrate provided by the embodiment of the present invention, the first sub-encapsulation layer is black, the second sub-encapsulation layer is white, and the second encapsulation layer is transparent.

[0048] Optionally, in the above display substrate provided by an embodiment of the present invention, the first sub-encapsulation layer comprises carbon black particles, and the carbon black particles are dispersed in the first transparent colloid.

[0049] Optionally, in the above display substrate provided by an embodiment of the present invention, said components are light-emitting components.

[0050] Meanwhile, a method for manufacturing the display substrate according to the embodiment of the present invention includes: Providing a base substrate; forming a plurality of components on the base substrate; applying an encapsulation structure to the components; and curing the second encapsulation layer so that a surface of the second encapsulation layer away from the first encapsulation layer is substantially parallel to the base substrate; The sealing structure includes a first sealing layer and a second sealing layer stacked together, where the first sealing layer covers the multiple components and the second sealing layer is located on a side of the first sealing layer away from the multiple components.

[0051] Meanwhile, an embodiment of the present invention provides a display device including the display substrate provided according to an embodiment of the present invention. [Brief description of the drawings]

[0052] [Figure 1] FIG. 2 is a structural schematic diagram of a sealing structure provided by an embodiment of the present invention. [Diagram 2] FIG. 4 is a correlation diagram between peel force and temperature of a first sub-encapsulating layer provided by an embodiment of the present invention. [Diagram 3] FIG. 2 is another structural schematic diagram of a sealing structure provided by an embodiment of the present invention. [Figure 4] FIG. 4 is a schematic diagram showing the sealing structure shown in FIG. 3 being peeled off. [Diagram 5] 1 is a structural schematic diagram of a display substrate provided according to an embodiment of the present invention; [Figure 6] FIG. 2 is another structural schematic diagram of a display substrate provided by an embodiment of the present invention; [Figure 7] FIG. 2 is another structural schematic diagram of a display substrate provided by an embodiment of the present invention; [Figure 8] FIG. 2 is another structural schematic diagram of a display substrate provided by an embodiment of the present invention; [Figure 9] FIG. 2 is another structural schematic diagram of a display substrate provided by an embodiment of the present invention; [Figure 10] FIG. 2 is another structural schematic diagram of a display substrate provided by an embodiment of the present invention; [Figure 11] FIG. 2 is another structural schematic diagram of a display substrate provided by an embodiment of the present invention; [Figure 12] FIG. 2 is another structural schematic diagram of a display substrate provided by an embodiment of the present invention; [Figure 13] 2 is a flowchart illustrating a method for manufacturing a display substrate according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0053] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. Please note that the size and shape of the figures in the drawings do not reflect actual proportions, and are only for the purpose of illustrating the present invention. In addition, the same or similar reference numbers throughout represent the same or similar elements, or elements with the same or similar functions.

[0054] Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning understood by those skilled in the art to which the present invention belongs. The terms "first", "second" and similar terms used in the present invention and claims do not indicate order, quantity, or importance, but are used only to distinguish different components. Words such as "comprise" or "contain" mean that the element or thing appearing before the word includes the elements or things listed after the word and their equivalents, without excluding other elements or things. "Inside", "outside", "upper", "lower", etc. are only used to express relative positional relationships, and if the absolute position of the described object is changed, the relative positional relationship may change accordingly.

[0055] Existing encapsulation methods for micro LEDs include molding, hard film lamination, and soft film lamination, but each of these three solutions has its own process limitations. Among them, the mold encapsulation process requires the application of adhesive on the micro LED substrate, but the adhesive has good fluidity, which causes adhesive overflow during the process. In the laminated hard film solution, the hard film has a two-layer structure of a black hard film and a transparent hard film, and the black hard film is usually heated to a molten state and pressed onto the micro LED substrate. The molten black hard film has fluidity, which causes adhesive overflow at the processing edge. In the soft film lamination solution, the soft film contains multiple layers of soft adhesive, which can be directly bonded to the micro LED substrate. The soft adhesive has low fluidity, so the adhesive overflow process edge does not occur, but the soft film pressure resistance is poor.

[0056] To solve the above problems, an embodiment of the present invention provides a sealing structure for sealing a component E, as shown in FIG.

[0057] The encapsulation structure includes a first encapsulation layer 101 and a second encapsulation layer 102 .

[0058] Said first encapsulation layer 101 is used to cover the component E. In order to better fit the covered component E, the first encapsulation layer 101 may be flexible.

[0059] The second sealing layer 102 is laminated with the first sealing layer 101. The second sealing layer 102 is located on the side of the first sealing layer 101 that is away from the component E. The surface of the second sealing layer 102 that faces the first sealing layer 101 is in contact with the surface of the first sealing layer 101 that faces the second sealing layer 102, and the surface of the second sealing layer 102 that is away from the first sealing layer 101 is approximately parallel to the surface on which the sealing structure is located. In this specification, the relationship of "approximately parallel" may be completely parallel in some cases, or may have a slight error due to the influence of the manufacturing process, measurement, etc. (for example, the included angle is in the range of 0° to 5°). Optionally, before the component E is sealed in the sealing structure, the first sealing layer 101 and the second sealing layer 102 may both be film layers parallel to the plane where the sealing structure is located, and after the component E is sealed in the sealing structure, the first sealing layer 101 may be a protrusion at the position of the component E, so that the surface of the first sealing layer 101 away from the component E is an uneven surface. Correspondingly, the surface of the second sealing layer 102 in contact with the first sealing layer 101 is also an uneven surface. In order to improve the pressure resistance of the sealing structure, the second sealing layer 102 can be hardened after sealing, and the surface of the second sealing layer 102 away from the first sealing layer 101 needs to be better flat and be approximately parallel to the plane where the sealing structure is located. This ensures that when the component E is a light-emitting component, uniform light emission can be obtained. Thereby, the second sealing layer 102 in the present invention can have adjustable hardness, i.e., it can be flexible before sealing and rigid after sealing. If necessary, the hardness of the second sealing layer 102 can be changed through treatment such as illumination or heating so that the second sealing layer 102 has rigidity.

[0060] In the above sealing structure provided by an embodiment of the present invention, in the above sealing structure provided by an embodiment of the present invention, the first sealing layer 101 is used to directly cover the component E, and no adhesive overflow process edge occurs; in addition, the hardness of the second sealing layer 102 is adjustable, so as to ensure that the sealing structure has better voltage resistance performance by increasing the hardness of the second sealing layer 102.

[0061] In some embodiments, in the above sealing structure provided by the embodiment of the present invention, as shown in FIG. 1, the first sealing layer 101 can include at least two sub-sealing layers (e.g., the first sub-sealing layer 101a and the second sub-sealing layer 101b) stacked in the direction Y away from the part E. Here, in the direction Y away from the part E, the sub-sealing layer closest to the part E (e.g., the first sub-sealing layer 101a) includes a variable viscosity component, and the viscosity of the component can change under certain conditions. For example, the component is thermosetting, hot melt, room temperature curing, pressure sensitive, etc. This allows the viscosity of the sub-sealing layer closest to the part E (e.g., the first sub-sealing layer 101a) to be adjustable.

[0062] The sub-encapsulation layer closest to component E (e.g., the first sub-encapsulation layer 101a) directly covers component E. If the viscosity of the sub-encapsulation layer is adjustable, component E can reduce its viscosity by lowering the viscosity of the sub-encapsulation layer when a sealing failure is found. The viscosity of the sub-encapsulation layer allows the entire encapsulation structure to be easily peeled off without damaging component E. This allows rework of component E, improving product yield.

[0063] In some embodiments, in the above sealing structure provided by the embodiment of the present invention, the sub-sealing layer (e.g., the first sub-sealing layer 101a) closest to the part E in the direction Y away from the part E may further include a first transparent colloid, and the variable viscosity component may include an adhesive. Optionally, the viscosity of the adhesive may be related to temperature or other factors. In some embodiments, as shown in FIG. 2, the viscosity of the adhesive is related to temperature. In the temperature range of 0°C to 20°C, the peel force required for tearing increases gradually as the temperature increases (corresponding to a gradually increasing viscosity of the adhesive). In the range of 20°C to 80°C, the peel force required for tearing decreases gradually as the temperature increases (corresponding to a gradually decreasing viscosity of the adhesive), and the rate at which the peel force decreases in the temperature range of 20°C to 60°C is greater than the rate at which the peel force decreases in the temperature range of 60°C to 80°C. Within the range of 80℃~100℃, the peel force required for tearing gradually decreases as the temperature increases (corresponding to the gradual decrease in the viscosity of the adhesive), and the peel force value in this temperature range is small, so the technical effect of peeling off the sealing structure without damaging part E can be achieved. Considering that high temperatures may affect the performance of part E, 80℃~90℃ can be used in the actual production line operation to reduce the viscosity.

[0064] In some embodiments, in the above-mentioned sealing structure provided by the embodiments of the present invention, the mass ratio of the adhesive to the first transparent colloid may be 1:2 or more and 2:1 or less, for example, 1:1. Within this ratio range, under normal use environment (such as room temperature), the sub-sealing layer (such as the first sub-sealing layer 101a) containing the adhesive and the first transparent colloid has better viscosity and can ensure the adhesion effect. Furthermore, when heated to a certain temperature (such as 80°C to 90°C), the viscosity of the sub-sealing layer (such as the first sub-sealing layer 101a) containing the adhesive and the first transparent colloid is greatly reduced. When peeling is required, it can be easily peeled off from the part E when peeling, and there is no glue residue or the part E falling off.

[0065] In some embodiments, in the sealing structure provided by the embodiment of the present invention, as shown in FIG. 3, the sub-sealing layer (e.g., the first sub-sealing layer 101a) closest to the part E in the direction Y away from the part E may include a first transparent colloid, and the variable viscosity component may include expansion particles. The expansion particles are granular, and the material is a polymer material such as a resin, and under certain conditions (such as high temperature), the volume of the expansion particles may increase rapidly, and at least some of the expansion particles may expand outside the first transparent colloid. Since the expansion particles themselves are non-adhesive, after expansion, the sealing structure can be separated from the part E (as shown in FIG. 4), which has the effect of enabling reworking.

[0066] In some embodiments, in the above-mentioned encapsulation structure provided by the embodiments of the present invention, the mass fraction of the expanding particles in the first transparent colloid may be 0.5% or more and 3% or less (e.g., 1.5%). Within this ratio range, under normal use environment (e.g., room temperature), the sub-sealing layer (e.g., first sub-sealing layer 101a) containing the expanding particles and the first transparent colloid can have better viscosity and ensure the bonding effect. Since the volume of the expanding particles increases by heating, when a sealing failure occurs, the sealing structure can be easily peeled off from the part E, and there is no glue residue or the part E falls off.

[0067] Based on the same inventive idea, an embodiment of the present invention provides a display substrate, which includes the above-mentioned sealing structure provided by an embodiment of the present invention. The principle of the display substrate to solve the problem is similar to the principle of the above-mentioned sealing structure to solve the problem, so that the implementation of the display substrate can refer to the above-mentioned embodiment of the sealing structure, and the repeated details will not be repeated.

[0068] Specifically, an embodiment of the present invention provides a display substrate, which includes a base substrate 103, a plurality of components E, and an encapsulation structure, as shown in FIG.

[0069] The base substrate 103 may be a printed circuit board (PCB) or a glass substrate (Glass).

[0070] A plurality of components E are provided on one surface of the base substrate 103.

[0071] The sealing structure is the above-mentioned sealing structure provided by the embodiment of the present invention, where the first sealing layer 101 covers the multiple components E. In a direction perpendicular to the base substrate 103 (corresponding to a direction away from the components), the thickness h1 of the first sealing layer 101 is equal to or greater than the height h2 of the components E. The second sealing layer 102 is located on the side of the first sealing layer 101 away from the multiple components E. The surface of the second sealing layer 102 facing the first sealing layer 101 is in contact with the surface of the first sealing layer 101 facing the second sealing layer 102, and the surface of the second sealing layer 102 away from the first sealing layer 101 is approximately parallel to the base substrate 101. The hardness of the second sealing layer 102 is greater than the hardness of the first sealing layer 101. In some embodiments, the hardness of the second encapsulation layer 102 may be 4H (Rockwell hardness) or greater, and the first encapsulation layer 101 may have a flexible soft adhesive layer.

[0072] The thickness h1 of the soft first sealing layer 101 is greater than or equal to the height h2 of part E, which allows part E to be completely enveloped by the first sealing layer 101, thereby avoiding damage to part E from the harder second sealing layer 102.

[0073] In some embodiments, in the above display substrate provided by the embodiments of the present invention, as shown in FIG. 5, the first encapsulation layer 101 can include a first sub-encapsulation layer 101a and a second sub-encapsulation layer 101b stacked together. Optionally, the second sub-encapsulation layer 101b is located on the side of the component E away from the first sub-encapsulation layer 101a. At least one of the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b and the second encapsulation layer 102 may include diffusing particles and / or carbon black particles. When the component E is a light-emitting component 104, the diffusing particles can scatter the light emitted by the light-emitting component 104 on the diffusing particles, thereby improving the uniformity of the light emission in all directions and effectively improving the color shift difference. When the light-emitting component 104 is not emitting light, the carbon black particles can absorb the ambient light penetrating into the inside of the display substrate, thereby reducing the brightness of the black state and improving the contrast.

[0074] It should be noted that in the present invention, "the first encapsulating layer covers the component" may mean that the first encapsulating layer is in direct contact with each side surface of the component, or that the first encapsulating layer is in direct contact with each side surface and the top surface of the component.

[0075] In some embodiments, in the above display substrate provided by the embodiments of the present invention, the first sub-encapsulation layer 101a includes diffusing particles, as shown in Fig. 5. The first sub-encapsulation layer 101a directly covers the light emitting component 104, so that the emitted light of the light emitting component 104 is directly scattered on the diffusing particles in the first sub-encapsulation layer 101a, which can achieve a better light mixing effect and is conducive to improving the color.

[0076] In some embodiments, the particle size of the diffusion particles may be micron-scale or nano-scale. Considering that the diffusion particles have a certain effect on the light transmittance when diffusing light, the concentration of the diffusion particles should be set appropriately. Optionally, the mass fraction (i.e., concentration) of the micron-scale diffusion particles in the first transparent colloid can be set to 10%-15% in consideration of the light mixing and transmittance. Because the nano-scale diffusion particles have a large effect on the transmittance, the mass fraction of the nano-scale diffusion particles in the first transparent colloid may be smaller than the mass fraction of the micron-scale diffusion particles in the first transparent colloid. For example, the mass fraction of the nano-scale diffusion particles in the first transparent colloid is set to 1.5%-3.5%.

[0077] In some embodiments, the diffusing particles may be transparent particles or white particles, but it should be understood that if the diffusing particles are transparent particles, the first sub-encapsulation layer 101a having the diffusing particles is colorless and transparent. If the diffusing particles are white particles, the first sub-encapsulation layer 101a having the diffusing particles is white, and the first sub-encapsulation layer 101a in the transparent or white state can have better transmittance, which is favorable for improving light efficiency.

[0078] In some embodiments, the material of the transparent particles may include silicon dioxide (SiO2) or polymethyl methacrylate (PMMA), and the material of the white particles includes titanium dioxide (TiO2). Of course, in certain implementations, the materials of the transparent particles and the white particles may be other materials known to those skilled in the art, and are not particularly limited here.

[0079] In some embodiments, in the above display substrate provided by the embodiments of the present invention, as shown in FIG. 5, the second sub-encapsulation layer 101b includes carbon black particles. As shown in FIG. 5, the second sub-encapsulation layer 101b including carbon black particles is located on the first sub-encapsulation layer 101a including diffusing particles. Therefore, when the light-emitting component 104 is not emitting light, the second sub-encapsulation layer 101b can effectively absorb the ambient light and prevent the ambient light from being scattered by the diffusing particles in the lower first sub-encapsulation layer 101a, thereby greatly improving the contrast. Of course, in some embodiments, the second encapsulation layer 102 can also be doped with carbon black particles to improve the contrast, but this is not particularly limited.

[0080] Considering that the carbon black particles will absorb the light emitted by the light emitting component 104 to a certain extent when the light emitting component 104 is in the light emitting state, the brightness of the white state will be slightly lost. Therefore, in order to consider both the brightness of the black state and the light extraction efficiency, in the present invention, the doping mass percentage (also called concentration) of the carbon black particles in the second transparent colloid can be in the range of 2% to 4%, and is preferably 3%.

[0081] In some embodiments, the first sub-encapsulation layer 101a appears white because it is doped with diffusing particles (e.g., white particles) and the second sub-encapsulation layer 101b appears black because it is doped with carbon black particles. The second encapsulation layer 102 is transparent because it is not doped with diffusing or carbon black particles.

[0082] In some embodiments, the light emitting component 104 may be a small light emitting diode, such as a Mini LED or a Micro LED. The size of a Mini LED is in the range of 100 μm to 200 μm, while the size of a Micro LED is less than 100 μm, so the resolution of Mini LED and Micro LED products is higher and the display screen is more delicate. In addition, a major advantage of Mini LED and Micro LED is that they are connectable, and multiple small products can be connected to create a larger product.

[0083] In some embodiments, in the above display substrate provided by the embodiment of the present invention, as shown in FIG. 5, after the encapsulation structure is attached to the display substrate, due to the presence of the light emitting component 104, the soft first sub-encapsulation layer 101a and the soft second sub-encapsulation layer 101b are lifted by the light emitting component 104 at the position of the light emitting component 104, so that at least a part of the first sub-encapsulation layer 101a and at least a part of the second sub-encapsulation layer 101b form a protrusion M in a direction away from the light emitting component 101 (i.e., the Y direction in FIG. 5), and the orthogonal projection of the protrusion M on the base substrate 103 and the orthogonal projection of the light emitting component 104 on the base substrate 103 overlap. It should be understood that when the first sub-encapsulation layer 101a is thin, the first sub-encapsulation layer 101a may be punctured by the light emitting component 104. This forms an opening above the light emitting component 104 as shown in FIG. 6.

[0084] In some embodiments, the protrusion M may include a first protrusion M1 located on the first sub-encapsulation layer 101a, as shown in FIG. 5. The orthogonal projection of the light emitting component 104 on the base substrate 103 may be a projection of the first protrusion M1 on the base substrate 103. 1のLocated in an orthogonal projection. In this case, the first sub-encapsulation layer 101a is not perforated by the light-emitting component 104. Alternatively, as shown in FIG. 6, the first protrusion M1 surrounds the light-emitting component 104 and is disposed perpendicular to the surface (side surface of the light-emitting component 104) of the base substrate 103. The light-emitting component 104 is perforated so that the first sub-encapsulation layer 101a forms an opening at the top of the light-emitting component 104. Optionally, as shown in FIG. 5 and FIG. 6, the portion of the first sub-encapsulation layer 101a located between the adjacent first protrusions M1 is approximately parallel to the base substrate 103. That is, the portion of the first sub-encapsulation layer between the adjacent first protrusions M1 is approximately parallel to the base substrate 103, but there is a possibility that a slight deviation occurs due to the influence of the manufacturing process, measurement, etc. (for example, the included angle is in the range of 0° to 5°).

[0085] In some embodiments, as shown in FIG. 5 and FIG. 6, the protrusion M further includes a second protrusion M2 located on the second sub-encapsulation layer 101b. The orthogonal projection of the first protrusion M1 on the base substrate 103 is located within the orthogonal projection of the second protrusion M2 on the base substrate 103. The orthogonal projection of the light emitting component 104 on the base substrate 103 is located within the orthogonal projection of the second protrusion M2 on the base substrate 103. Optionally, as shown in FIG. 5 and FIG. 6, the portion of the second sub-encapsulation layer 101b located between the adjacent second protrusions M2 is approximately parallel to the base substrate 103, i.e., the portion of the second sub-encapsulation layer. The portion 101b between the adjacent second protrusions M2 is approximately parallel to the base substrate 103, and the portion between the adjacent second protrusions M2 is exactly parallel to the base substrate 103, but may have a slight deviation due to the influence of the manufacturing process, measurement, and other factors. (For example, the included angle is within a range of 0° to 5°) 。

[0086] In this specification, the thickness h1 of the first sealing layer 101 is the thickness before attachment and may be equivalent to the thickness of the first sealing layer 101 with good flatness in the gaps between the light emitting components 104 after attachment, and is not the thickness of the first sealing layer 101 that is raised at the positions of the light emitting components 104.

[0087] In some embodiments, in the above display substrate provided by the embodiment of the present invention, the first sub-sealing layer 101a includes a first transparent colloid. The second sub-sealing layer 101b includes a second transparent colloid. The second sealing layer 102 includes a third transparent colloid. The refractive index of the first transparent colloid, the refractive index of the second transparent colloid and the refractive index of the third transparent colloid may be approximately equal, that is, they may be exactly equal, and the refractive index may be zero, and there may be errors due to measurement or technology. For example, there is an error such as the difference in refractive index is less than 0.1. By using the first transparent colloid, the second transparent colloid and the third transparent colloid with the same refractive index, it is not necessary to prepare different interbody parameters when making different sealing layers, which saves costs.

[0088] In some embodiments, in the above display substrate provided by the embodiments of the present invention, the refractive index of the second transparent colloid may be different from that of the first transparent colloid, and the refractive index of the second transparent colloid may be different from that of the third transparent colloid. In other words, the refractive indexes of two adjacent layers of transparent colloid are different. The stacking of multiple transparent colloids with different refractive indexes can refract the light emitted by the light emitting component 104 at the interface between the two adjacent layers of transparent colloid, thereby changing the propagation direction of the light, and the refracted light becomes divergent, so that the effect of light mixing is obtained, the large visual angle aberration is reduced, and the image quality is greatly improved.

[0089] In some embodiments, in the above display substrate provided by the embodiments of the present invention, under different circumstances, the refractive index of the first transparent colloid contained in the first sub-encapsulation layer 101a and the refractive index of the second transparent colloid contained in the second sub-encapsulation layer 101b, the color of the first sub-encapsulation layer 101a is black, and the color of the second sub-encapsulation layer 101b is different from the color of the first sub-encapsulation layer 101a. By disposing the first sub-encapsulation layer 101a and the second sub-encapsulation layer 101b with different refractive indexes on the light-emitting side of the multiple light-emitting components 104, the light emitted from the light-emitting components 104 is refracted at the interface between the first sub-encapsulation layer 101a and the second sub-encapsulation layer 101b, the propagation direction of the emitted light is changed, the refracted light is more divergent, the mixed light effect is achieved, the large visual angle aberration is reduced, the problem of large visual angle deviation is effectively solved, and the image quality is greatly improved. At the same time, the black first sub-encapsulation layer 101a can effectively absorb the ambient light and reduce the brightness in the black state. In addition, since the black first sub-encapsulation layer 101a absorbs a part of the emitted light of the light-emitting component 104 to a certain extent, the present invention provides a second sub-encapsulation layer 101b with a color different from black, so that the second sub-encapsulation layer 101b and the first sub-encapsulation layer 101a can cooperate to improve the color shift problem, and at the same time, ensure that the absorption of light is reduced. Effectively improve the light extraction efficiency, thereby improving the display brightness. The combination of the above two elements can greatly improve the contrast and appearance quality of the product.

[0090] In some embodiments, the black first sub-encapsulation layer 101a can be obtained by doping melanin, such as carbon black particles, into the first transparent colloid. Optionally, in order to consider the brightness and light extraction efficiency of the black state, in the present invention, the doping mass percentage (also called concentration) of carbon black particles in the first transparent colloid can be in the range of 2%-4%, and is preferably 3%.

[0091] In some embodiments, in the above display substrate provided by the embodiments of the present invention, the refractive index of the 3 transparent colloids contained in the second encapsulation layer 102, the refractive index of the 1 transparent colloids contained in the first sub-encapsulation layer 101a, and the refractive index of the 2 transparent colloids contained in the second sub-encapsulation layer 101b are different. The color of the second encapsulation layer 102 is different from the color of the first sub-encapsulation layer 101a. Due to the arrangement of the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b and the second encapsulation layer 102, the light emitted from the light emitting component 104 can be refracted at the interface of any two adjacent encapsulation layers, so that the refracted light can be more divergent when the propagation direction of the emitted light is further changed, and a better light mixing effect can be obtained, which effectively solves the problem of color shift at large viewing angles and greatly improves the image quality.

[0092] It should be noted that the present invention only takes the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b and the second encapsulation layer 102 as three light modulation layers as an example to illustrate the problem of improving color shift. In a specific implementation, as long as the refractive index of the transparent colloid contained in two adjacent light modulation layers is different, more light modulation layers can be provided to improve the problem of color shift. Furthermore, in a specific implementation, each light modulation layer can be fabricated stepwise above the light emitting component 104, or each light modulation layer can be fabricated as a stacked composite film layer, and then the composite film layer is directly bonded to the side of the display substrate having the light emitting component 104.

[0093] In some embodiments, in the above-mentioned display substrate provided by the embodiments of the present invention, as shown in Figures 5 to 10, the first sub-encapsulating layer 101a, the second sub-encapsulating layer 101b and the second encapsulating layer 102 are located on the side of the multiple light-emitting components 104 away from the base substrate 103, or in the gaps between each light-emitting component 104, so that the light emitted from the top and side surfaces of the light-emitting components 104 is refracted in the light-emitting components 104 at the interface between two adjacent encapsulating layers having different refractive indices, thereby simultaneously increasing the divergence of the light emitted from the top and side surfaces of the light-emitting components 104, and better resolving the color shift problem. In this case, since the light emitting component 104 is completely encapsulated by the first sub-encapsulating layer 101a, the second sub-encapsulating layer 101b and the second encapsulating layer 102, the first sub-encapsulating layer 101a, the second sub-encapsulating layer 101b and the second encapsulating layer 102 can play a role in sealing and protecting the light emitting component 104, which is beneficial to extending the life of the light emitting component 104.

[0094] In some embodiments, in the above display substrate provided by the embodiment of the present invention, as shown in Figures 7 to 10, in the direction Y away from the base substrate 103 of the light emitting component 104, the sum of the thickness h3 of the first sub-encapsulation layer 101a, the thickness h4 of the second sub-encapsulation layer 101b, and the thickness h5 of the second encapsulation layer 102 (i.e., h3+h4+h5) is greater than the height h2 of the light emitting component 104, thereby improving the appearance of the product. Furthermore, as can be seen from Figures 7 to 10, the surface of the stack consisting of the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b, and the second encapsulation layer 102 away from the base substrate 103 is relatively flat, which is conducive to the fabrication of the subsequent film layers.

[0095] It should be noted that in the present invention, the thickness of the encapsulation layer and the thickness of the sub-encapsulation layer both refer to the thickness of the coating. Due to the presence of the light emitting components 104, the thickness of the encapsulation layer or the sub-encapsulation layer in the area where the light emitting components 104 are located and the thickness of the encapsulation layer or the sub-encapsulation layer in the gap between the light emitting components 104 are different. In addition, the thickness of the encapsulation layer or the sub-encapsulation layer in the area where the light emitting components 104 are located is not very uniform. Therefore, the above coating thickness may be approximately equal to the thickness of the encapsulation layer or the sub-encapsulation layer in the gap between the light emitting components 104 in the case of an actual product.

[0096] Optionally, the height h2 of the light emitting component 104 is about 85 μm, and the sum of the thickness h3 of the first sub-encapsulation layer 101a, the thickness h4 of the second sub-encapsulation layer 101b, and the thickness h5 of the second encapsulation layer 102 (i.e., h3+h4+h5) is at least 50 μm to 100 μm greater than the height h2 of the light emitting component 104. In some embodiments, the thickness h3 of the first sub-encapsulation layer 101a is set to 25 μm to 50 μm, thereby effectively improving the contrast by utilizing the first sub-encapsulation layer 101a while maintaining the higher transmittance of the first sub-encapsulation layer 101a. The thickness h4 of the second sub-encapsulation layer 101b and the thickness h5 of the second encapsulation layer 102 can be set to 50 μm to 100 μm, so that the yield of the film layer for producing the second sub-encapsulation layer 101b and the second encapsulation layer 102 by the coating process can be high.

[0097] Of course, during specific implementation, the values ​​of h3, h4, h5 and h4 can be appropriately adjusted according to actual circumstances, and are not particularly limited here.

[0098] In some embodiments, in the above display substrate provided by the embodiments of the present invention, in order to improve color shift and effectively encapsulate the light emitting component 104, as shown in Figures 7 to 10, an orthogonal projection in any direction of at least one of the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b, and the second encapsulation layer 102 covers an orthogonal projection of the light emitting component 104. In other words, at least one of the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b, and the second encapsulation layer 102 can partially or completely surround the light emitting component 104.

[0099] For example, as shown in FIG. 7, one of the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b and the second encapsulation layer 102 is located between each two adjacent light-emitting components 104. In this case, the film layer located between the light-emitting components 104 (for example, the first sub-encapsulation layer 101a shown in FIG. 7) can be fabricated by coating. Still referring to FIG. 7, in the direction Y away from the base substrate 103 of the light-emitting component 104, the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b and the second encapsulation layer 102 are stacked in order. The first sub-encapsulation layer 101a is located between each two adjacent light-emitting components 104. The orthogonal projection of the second sub-encapsulation layer 101b on the base substrate 103 completely covers the orthogonal projection of the multiple light-emitting components 104 on the base substrate 103 and the orthogonal projection of the gap between each two adjacent light-emitting components 10 on the base substrate 103. Moreover, the orthogonal projection of the second sub-encapsulation layer 101b on the surface of the base substrate 103 facing the light emitting component 104 (i.e., the upper surface of the base substrate 103) perpendicular to the surface (i.e., two planes perpendicular to the paper surface and two planes parallel to the paper surface) partially covers the orthogonal projection of each light emitting component 104 on the vertical surface. In this case, the first sub-encapsulation layer 101a partially contacts the side of the light emitting component 104, and the second sub-encapsulation layer 101b completely contacts the upper surface of the light emitting component 104 and contacts the remaining side of the light emitting component 104 that is not in contact with the first sub-encapsulation layer 101a. That is, the second sub-encapsulation layer 101b envelops the upper surface of the light emitting component 104 and some of the side surfaces adjacent to the upper surface. From FIG. 7, it can be seen that the thickness h3 of the first sub-encapsulation layer 101a manufactured by the coating method is smaller than the height h2 of the light emitting component 104. Since the sum of the thickness h3 of the first sub-encapsulating layer 101a and the thickness h4 of the second sub-encapsulating layer 101b (i.e., the thickness h1 of the first encapsulating layer 101) is greater than the height h4 of the light-emitting component 104, the upper surface of the second sub-encapsulating layer 101b is approximately parallel to the base substrate 103.

[0100] As shown in FIG. 8, the first sub-encapsulation layer 101a, the second sub-encapsulation layer 101b, and the second encapsulation layer 102 are stacked in order in the direction Y away from the base substrate 103 of the light emitting component 104. The orthogonal projection of the first sub-encapsulation layer 101a on the base substrate 103 completely covers the orthogonal projection of the multiple light emitting components 104 on the base substrate 103 and the orthogonal projection of the gap between each two adjacent light emitting components 104 on the base substrate 103. The orthogonal projection of the first sub-encapsulation layer 101a on the vertical plane of the surface facing the light emitting components 104 on the base substrate 103 completely covers the orthogonal projection of each light emitting component 104 on the vertical plane. The orthogonal projection of the second sub-encapsulation layer 101b on the base substrate 103 completely covers the orthogonal projection of the multiple light emitting components 104 on the base substrate 103 and the orthogonal projection of the gap between each two adjacent light emitting components 104 on the base substrate 103. The orthogonal projection of the surface of the second sub-encapsulation layer 101b facing the light-emitting components 104 on the base substrate 103 on the vertical plane partially covers the orthogonal projection of each light-emitting component 104 on the vertical plane. In this case, the first sub-encapsulation layer 101a is in full contact with the side of each light-emitting component 104, realizing omnidirectional encapsulation of each light-emitting component 104. The second sub-encapsulation layer 101b and the top and side surfaces of the light-emitting components 104 are both separated by the first sub-encapsulation layer 101a. As shown in FIG. 8, the thickness h3 of the first sub-encapsulation layer 101a is smaller than the height h2 of the light-emitting components 104, and the first sub-encapsulation layer 101a has a protrusion at the upper position of the light-emitting component 104, which is caused by performing film deposition. Of course, in some embodiments, the first sub-encapsulation layer 101a may be pierced by the light emitting component 104 during deposition, so that the first sub-encapsulation layer 101a forms an opening above the light emitting component 104. Also, as shown in FIG. 8, the sum of the thickness h3 of the first sub-encapsulation layer 101a and the thickness h4 of the second sub-encapsulation layer 101b (i.e., the thickness h1 of the first encapsulation layer 101) is greater than the height h2 of the light emitting component 104 so that the top surface of the second sub-encapsulation layer 101b is approximately parallel to the base substrate 103.

[0101] As shown in FIG. 9, in the direction Y away from the base substrate 103 of the light emitting component 104, the second sub-encapsulation layer 101b, the first sub-encapsulation layer 101a, and the second encapsulation layer 102 are stacked in order. The orthogonal projection of the first sub-encapsulation layer 101a on the base substrate 103 completely covers the orthogonal projection of the multiple light emitting components 104 on the base substrate 103 and the orthogonal projection of the gaps between each two adjacent light emitting components 104 on the base substrate 103. The orthogonal projection of the first sub-encapsulation layer 101a on the vertical plane of the surface facing the light emitting components 104 on the base substrate 103 partially covers the orthogonal projection of each light emitting component 104 on the vertical plane. The orthogonal projection of the second sub-encapsulation layer 101b on the base substrate 103 completely covers the orthogonal projection of the multiple light emitting components 104 on the base substrate 103 and the orthogonal projection of the gaps between each two adjacent light emitting components 104 on the base substrate 103. The orthogonal projection of the surface of the second sub-encapsulation layer 101b facing the light-emitting components 104 on the base substrate 103 on the vertical plane completely covers the orthogonal projection of each light-emitting component 104 on the vertical plane. In this case, the second sub-encapsulation layer 101b completely contacts the upper surface and side surface of each light-emitting component 104, realizing the omnidirectional envelopment of each light-emitting component 104. The first sub-encapsulation layer 101a and the upper surface and side surface of the light-emitting component 104 are both separated by the second sub-encapsulation layer 101b. As shown in FIG. 9, the thickness h4 of the second sub-encapsulation layer 101b is smaller than the height h2 of the light-emitting component 104, and the first sub-encapsulation layer 101a has a protrusion at the upper position of the light-emitting component 104 and a recess at the gap between the light-emitting components 104. Correspondingly, the first sub-encapsulation layer 101a has a protrusion at the upper position of the light-emitting component 104 and a recess at the gap between the light-emitting components 104. This is caused by the deposition. Of course, in some embodiments, the second sub-encapsulating layer 101b may be pierced by the light emitting component 104 during deposition, and the second sub-encapsulating layer 101b may have an opening formed above the light emitting component 104. Also, as shown in FIG. 9, the sum of the thickness h3 of the first sub-encapsulating layer 101a and the thickness h4 of the second sub-encapsulating layer 101b (i.e., the thickness h1 of the first encapsulating layer 101) is greater than the height h2 of the light emitting component 104 so that the top surface of the first sub-encapsulating layer 101a is approximately parallel to the base substrate 103.

[0102] Therefore, it can be seen that in the above display substrate provided by the embodiment of the present invention, the second sub-encapsulation layer 101b can directly or indirectly encapsulate each light-emitting component 104. Therefore, when the upper surface of the second sub-encapsulation layer 101b is far away from the upper part of the light-emitting component 104, the surface (i.e., the upper surface) of the second sub-encapsulation layer 101b away from the base substrate 103 can be approximately parallel to the base substrate 103, as shown in Fig. 7 and Fig. 8. When the upper surface of the second sub-encapsulation layer 101b approaches the upper part of the light-emitting component 104, the surface (i.e., the upper surface) of the second sub-encapsulation layer 101b away from the base substrate 103 can be approximately parallel to the base substrate 103 in the gap between each two adjacent light-emitting components 104, and protrudes toward the direction Y away from the light-emitting component 104 at the upper part of each light-emitting component 104. Alternatively, as shown in FIG. 9, the surface (i.e., the upper surface) of the second sub-encapsulating layer 101b facing away from the base substrate 103 protrudes in the direction Y away from the light-emitting components 104 at the upper positions of each light-emitting component 104, and is recessed toward the base substrate 103 in the gaps between each two adjacent light-emitting components 104.

[0103] 7 and 8, the surface (i.e., the upper surface) of the second sub-encapsulation layer 101b away from the base substrate 103 is higher than the upper surface of the light emitting component 104. As can be seen from Fig. 9, in the gap between each two adjacent light emitting components 104, the surface (i.e., the upper surface) of the second sub-encapsulation layer 101b away from the base substrate 103 is lower than the upper surface of the light emitting component 104. As can be seen from Fig. 10, in the gap between each two adjacent light emitting components 104, the surface (i.e., the upper surface) of the second sub-encapsulation layer 101b away from the base substrate 103 may be flush with the upper surface of the light emitting component 104.

[0104] In some embodiments, in the above display substrate provided by the embodiments of the present invention, the refractive index of the first transparent colloid, the refractive index of the second transparent colloid, and the refractive index of the third transparent colloid are set to increase, decrease, or alternate. For example, when the refractive index of the first transparent colloid, the refractive index of the second transparent colloid, and the refractive index of the third transparent colloid gradually increase (i.e., from low to high), the refractive index of the first transparent colloid is 1.41, the refractive index of the second transparent colloid is 1.54, and the refractive index of the third transparent colloid is 1.6. When the refractive index of the first transparent colloid, the refractive index of the second transparent colloid, and the refractive index of the third transparent colloid gradually decrease (i.e., from high to low), the refractive index of the first transparent colloid is 1.6, the refractive index of the second transparent colloid is 1.54, and the refractive index of the third transparent colloid is 1.41. If the refractive indices of the first transparent colloid, the second transparent colloid, and the third transparent colloid alternate (i.e., high and low), the refractive index of the second transparent colloid can be 1.41 and the refractive index of the first transparent colloid and the refractive index of the third transparent colloid can be 1.54. Or, the refractive index of the second transparent colloid can be 1.54 and the refractive index of the first transparent colloid and the refractive index of the third transparent colloid can both be 1.41.

[0105] In some embodiments, the materials of the first transparent colloid, the second transparent colloid and the third transparent colloid can include, but are not limited to, materials with good transparency such as silica gel, acrylic and epoxy resin, and the refractive indexes of the first transparent colloid, the second transparent colloid and the third transparent colloid are the same or different by adjusting the components such as silica gel, acrylic and epoxy resin. Optionally, the light transmittance of the first transparent colloid, the second transparent colloid and the third transparent colloid can be limited to 95% or more to improve the light extraction efficiency.

[0106] In some embodiments, the above display substrate provided by the embodiment of the present invention may further include a transparent substrate layer 105, as shown in Figures 5 and 6. The transparent substrate layer 105 is provided on the side of the stack including the first transparent colloid, the second transparent colloid, and the third transparent colloid away from the base substrate 103, and protects the stack of each transparent colloid through the transparent substrate layer 105. Optionally, the refractive index of the stack including the first transparent colloid, the second transparent colloid, the third transparent colloid, and the transparent substrate layer 105 can be gradually increased, decreased, or alternately set in size, and the combination of the transparent substrate layer 105 with the stack of each transparent colloid can further enhance the light mixing effect and improve color shift defects.

[0107] In some embodiments, the material of the transparent substrate layer 105 may be polyethylene terephthalate (PET) or polycarbonate (PC). Here, the refractive index of PET is 1.61, and the refractive index of PC is 1.51. According to the relevant data, the product of the transparent substrate layer 105 containing PET material has a viewing angle color shift of H0.019, V0.034, and a brightness of black state of 0.048nit. The product of the transparent substrate layer 105 containing PC material has a viewing angle color shift of H0.019, V0.023, and a brightness of black state of 0.044nit. Therefore, the product of the transparent substrate layer 105 containing PC material has a viewing angle color shift and a contrast that are both superior to the product of the transparent substrate layer 105 containing PET material.

[0108] In some embodiments, the above display substrate provided by the embodiments of the present invention may also include at least one auxiliary functional layer (e.g., anti-fingerprint layer 107 and hardening layer 106) located on the side of transparent substrate layer 105 away from base substrate 103, as shown in Figures 5 and 6. Here, the refractive index of the first transparent colloid, the refractive index of the second transparent colloid, the refractive index of the third transparent colloid, the refractive index of transparent substrate layer 105, and the refractive index of one or more auxiliary functional layers are set to increase, decrease, or alternate. For example, when the auxiliary functional layer includes the hardened layer 106 and the anti-fingerprint layer 107, and the hardened layer 106 is located between the transparent substrate layer 105 and the anti-fingerprint layer 107, the refractive index of the laminate including the first transparent colloid, the second transparent colloid, the third transparent colloid, the transparent substrate layer 105, the hardened layer 106 and the anti-fingerprint layer 107 can be gradually increased, decreased or alternately set in size, and the anti-fingerprint layer 107 and the hardened layer 106 can be combined with the transparent substrate layer 105 and each transparent adhesive layer to further enhance the light mixing effect and improve the color shift defect. In addition, the anti-fingerprint layer 107 and the hardened layer 106 can also enhance the fingerprint resistance and scratch resistance of the product.

[0109] In some embodiments, as shown in Figures 1 and 3, the encapsulation structure may include the above-mentioned transparent substrate layer 105, and a release film 100 is provided on the side where the first encapsulation layer 101 is located, and a protective film 108 is provided on the side where the transparent substrate layer 105 is located, in order to protect the encapsulation layer 101 and the transparent substrate layer 105 during transportation and other processes. In a specific implementation, the release film 100 may be peeled off to bond the first encapsulation layer 101 and the display substrate, and the protective film 108 may also be peeled off to form an anti-fingerprint layer 107 and a hardened layer 106 on the transparent substrate layer 105.

[0110] In some embodiments, in the above display substrate provided by the embodiments of the present invention, the hardening layer 106 and / or the anti-fingerprint layer 107 may include atomized particles. The atomized particles may cause the anti-fingerprint layer 107 and the hardening layer 106 to show a fog surface effect. In addition, it should be noted that if the anti-fingerprint layer 107 and the hardening layer 106 are not doped with atomized particles, the anti-fingerprint layer 107 and the hardening layer 106 may exhibit a mirror effect. In some embodiments, the material of the atomized particles may be silicon dioxide (SiO2) or polymethyl methacrylate (PMMA).

[0111] In some embodiments, in the above display substrate provided by the embodiments of the present invention, as shown in Figures 11 and 12, diffusing particles are dispersed in at least one of the two transparent colloids contained in the second sub-encapsulation layer 101b and the three transparent colloids contained in the second encapsulation layer 102, so as to further improve the light mixing effect and improve the color shift defect due to the scattering effect of the diffusing particles on the light.

[0112] 11 and 12, it can be seen that the second sub-encapsulation layer 101b directly encapsulates each light-emitting component 104. Therefore, in order to achieve a better light mixing effect, it is preferable to disperse diffusing particles in the second transparent colloid of the second sub-encapsulation layer 101b in the above display substrate provided by the embodiment of the present invention. In some embodiments, the first sub-encapsulation layer 101a appears black because it is doped with carbon black particles, the second sub-encapsulation layer 101b appears white because it is doped with diffusing particles (such as white particles), and the second encapsulation layer 102 is transparent because it is not doped with diffusing particles.

[0113] It should be noted that, as can be seen from FIG. 11, compared with the second sub-encapsulation layer 101b and the second encapsulation layer 102, the black first sub-encapsulation layer 101a is located in the bottom layer closest to the base substrate 103. As can be seen from FIG. 12, the second sub-encapsulation layer 101b and the second encapsulation layer 102, the black first sub-encapsulation layer 101a are located in the middle layer outside the top layer farthest from the base and the bottom layer closest to the base substrate 103. Therefore, as shown in FIG. 12, when the product is in a dark state, the black first sub-encapsulation layer 101a can effectively absorb the ambient light to prevent the ambient light from being scattered by the diffusing particles in the second sub-encapsulation layer 101b below it. However, in FIG. 11, a part of the ambient light is scattered by irradiating the diffusing particles in the second sub-encapsulation layer 101b, and the remaining ambient light is absorbed by irradiating the black first sub-encapsulation layer 101a through the second sub-encapsulation layer 101b. Compared with FIG. 12, FIG. 11 has a better effect of improving contrast because the black first sub-encapsulation layer 101a absorbs ambient light to enhance contrast, and the diffusing particles scatter ambient light to reduce contrast.

[0114] In some embodiments, in the above display substrate provided by the embodiments of the present invention, the particle size of the diffusion particles may be micron-scale or nano-scale. Considering that the diffusion particles have a certain effect on the light transmittance when diffusing light, the concentration of the diffusion particles needs to be set appropriately. Optionally, considering both the light mixing and the transmittance, the mass fraction (i.e., concentration) of the micron-scale diffusion particles in the second transparent colloid can be set to 10%-15%. Because the nano-scale diffusion particles have a large effect on the transmittance, the mass fraction of the nano-scale diffusion particles in the second transparent colloid may be smaller than the mass fraction of the micron-scale diffusion particles in the second transparent colloid. The mass fraction of the nano-scale diffusion particles in the second transparent colloid is set to 1.5%-3.5%.

[0115] In some embodiments, in the above display substrate provided by the embodiments of the present invention, the diffusion particles may be transparent particles or white particles. When the diffusion particles are transparent particles, the second sub-encapsulation layer 101b having the diffusion particles is colorless and transparent, and when the diffusion particles are white particles, the second sub-encapsulation layer 101b having the diffusion particles is white. The second sub-encapsulation layer 101b in the transparent or white state has excellent transmittance and is helpful in improving light efficiency.

[0116] In some embodiments, in the above display substrate provided by the embodiment of the present invention, the material of the transparent particles includes atomized particles such as silicon dioxide (SiO2) or polymethyl methacrylate (PMMA), and the material of the white particles includes titanium dioxide (TiO2). Of course, in a specific implementation, the materials of the transparent particles and the white particles may be other materials known to those skilled in the art, and are not particularly limited here.

[0117] It should be noted that all other essential components (such as driving circuits) of the above display substrate provided by the embodiment of the present invention are understood by those skilled in the art and will not be described in detail here, and they should not be understood as limitations of the present invention.

[0118] Based on the same inventive idea, the embodiment of the present invention also provides a manufacturing method for the above-mentioned display substrate. The principle of solving the problem by this manufacturing method is similar to that of the above-mentioned display substrate, so for the implementation of this manufacturing method, please refer to the embodiment of the above-mentioned display substrate, and details will not be repeated.

[0119] Specifically, the manufacturing method of the display substrate provided by the embodiment of the present invention can include the following steps, as shown in FIG.

[0120] S1301: Provide a base substrate.

[0121] S1302: Form a plurality of components on a base substrate.

[0122] S1303: Bonding an encapsulation structure to the multiple components, the encapsulation structure including a first encapsulation layer and a second encapsulation layer stacked together, where the first encapsulation layer covers the multiple components and the second encapsulation layer is located on a side of the first encapsulation layer away from the multiple components.

[0123] S1304: The second encapsulation layer is subjected to a hardening process (such as heating or lighting) so that a surface of the second encapsulation layer away from the first encapsulation layer is approximately parallel to the base substrate. Optionally, the hardness of the second encapsulation layer is greater than the hardness of the first encapsulation layer.

[0124] It should be noted that in the above-mentioned manufacturing method provided by the embodiment of the present invention, the patterning process included in the formation of each layer structure may include, but is not limited to, some or all of deposition, photoresist coating, masking, exposure, development, etching, photoresist stripping, etc. It should be noted that other processes may be included, and the details will vary depending on the pattern formation required in the actual manufacturing process, but are not limited here. For example, a post-bake process may be included after development and before etching.

[0125] Here, the deposition process may be, but is not limited to, a chemical vapor deposition method, a plasma enhanced chemical vapor deposition method, or a physical vapor deposition method. The mask used in the mask process may be, but is not limited to, a half tone mask, a single slit mask, or a gray tone mask. The etching may be, but is not limited to, a dry etching method or a wet etching method.

[0126] Based on the same inventive idea, the embodiment of the present invention also provides a display device including the above-mentioned display substrate provided by the embodiment of the present invention. Since the principle of the display device for solving the problem of the display device is similar to the principle of solving the problem of the display substrate, the implementation of the display device can be referred to the embodiment of the display substrate, and the details will not be repeated.

[0127] In some embodiments, the display device may be a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, a smart watch, a fitness wristband, a personal digital assistant, or other products or components with a display function. The display device may include, but is not limited to, components such as a radio frequency unit, a network module, an audio output and input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply, and the like. In addition, a person skilled in the art can understand that the above structure does not limit the display device provided by the embodiment of the present invention. In other words, the display device provided by the embodiment of the present invention may include more or less of the above components, or a combination of certain components, or a different arrangement of components.

[0128] It is apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations in the embodiments of the present invention are within the scope of the claims of the present invention and the technical scope equivalent thereto, the present invention is intended to include these modifications and variations.

Claims

1. A sealing structure for sealing a component, comprising: a first encapsulation layer used to cover the component; a second sealing layer laminated on the first sealing layer, A sealing structure for sealing a component, wherein the second sealing layer is located on a side of the first sealing layer away from the component, the surface of the second sealing layer facing the first sealing layer is in contact with the surface of the first sealing layer facing the second sealing layer, and the surface of the second sealing layer away from the first sealing layer is approximately parallel to a plane in which the sealing structure is located.

2. 2. The encapsulation structure of claim 1, wherein the first encapsulation layer includes at least two sub-encapsulation layers stacked in a direction away from the component, the sub-encapsulation layer closest to the component in a direction away from the component including a variable viscosity component.

3. The encapsulation structure of claim 2 , wherein the sub-encapsulation layer closest to the component in a direction away from the component further comprises a first transparent colloid, and the variable viscosity component comprises an adhesive.

4. The sealing structure according to claim 3 , wherein a mass ratio of the adhesive to the first transparent colloid is equal to or greater than 1:2 and equal to or less than 2:

1.

5. The encapsulation structure of claim 2 , wherein the sub-encapsulation layer closest to the component in a direction away from the component further comprises a first transparent colloid, and the variable viscosity component comprises expanding particles.

6. The sealing structure according to claim 5 , wherein a mass fraction of the expanding particles in the first transparent colloid is 0.5% or more and 3% or less.

7. A base substrate; A plurality of components are arranged on one side of a base substrate; and a sealing structure. The sealing structure is a sealing structure described in any one of claims 1 to 6, wherein the first sealing layer covers the multiple components, a thickness of the first sealing layer in a direction perpendicular to the base substrate is equal to or greater than the height of the components, the second sealing layer is located on a side of the first sealing layer away from the multiple components, a surface of the second sealing layer facing the first sealing layer is in contact with a surface of the first sealing layer facing the second sealing layer, and a surface of the second sealing layer away from the first sealing layer is approximately parallel to the base substrate.

8. The display substrate according to claim 7 , wherein the second sealing layer has a hardness greater than a hardness of the first sealing layer.

9. The display substrate of claim 7 , wherein the first encapsulation layer includes a first sub-encapsulation layer and a second sub-encapsulation layer that are stacked together.

10. The display substrate of claim 9 , wherein at least one of the first sub-encapsulation layer, the second sub-encapsulation layer and the second encapsulation layer comprises diffusing particles and / or carbon black particles.

11. The display substrate of claim 10 , wherein the second sub-encapsulation layer is located on a side of the component remote from the first sub-encapsulation layer, the first sub-encapsulation layer including diffusing particles.

12. The display substrate of claim 11 , wherein the second sub-encapsulation layer comprises carbon black particles.

13. The display substrate of claim 12 , wherein the first sub-encapsulation layer and the second sub-encapsulation layer protrude in a direction away from the light-emitting component, and a positive projection of the protrusion on the base substrate overlaps with a positive projection of the light-emitting component on the base substrate.

14. the protrusion includes a first protrusion located on the first sub-encapsulation layer; The display substrate according to claim 13 , wherein an orthogonal projection of the light emitting component on the base substrate is located at an orthogonal projection of the first protrusion on the base substrate.

15. The display substrate of claim 13 , wherein the protrusion includes a first protrusion located on the first sub-encapsulation layer, the first protrusion surrounding the light-emitting component and perpendicular to a surface of the base substrate.

16. The display substrate according to claim 14 or 15, wherein the portions of the first sub-encapsulation layer located between adjacent first protrusions are substantially parallel to the base substrate.

17. the protrusion includes a second protrusion located on the second sub-encapsulation layer; A display substrate according to any one of claims 14 to 16, wherein an orthogonal projection of the first protrusion on the base substrate is located at an orthogonal projection of the second protrusion on the base substrate, and an orthogonal projection of the light-emitting component on the base substrate is located at an orthogonal projection of the second protrusion on the base substrate.

18. The display substrate of claim 17 , wherein portions of the second sub-encapsulation layer located between adjacent second protrusions are substantially parallel to the base substrate.

19. the first sub-encapsulating layer comprises a first transparent colloid, the second sub-encapsulating layer comprises a second transparent colloid, and the second encapsulating layer comprises a third transparent colloid; 19. The display substrate of claim 9, wherein the refractive index of the first transparent colloid and the refractive index of the second transparent colloid are substantially the same as the refractive index of the third transparent colloid.

20. the first sub-encapsulating layer comprises a first transparent colloid, the second sub-encapsulating layer comprises a second transparent colloid, and the second encapsulating layer comprises a third transparent colloid; The display substrate of claim 9 , wherein the refractive index of the second transparent colloid is different from the refractive index of the first transparent colloid, and the refractive index of the second transparent colloid is different from the refractive index of the third transparent colloid.

21. 21. The display substrate of claim 20, wherein the first sub-encapsulation layer is black in color, and the second sub-encapsulation layer is different in color from the first sub-encapsulation layer.

22. The display substrate of claim 21 , wherein the second encapsulation layer has a different color than the first sub-encapsulation layer.

23. The display substrate of claim 22 , wherein in a direction away from the base substrate of the light-emitting component, the sum of the thickness of the first sub-encapsulation layer, the thickness of the second sub-encapsulation layer and the thickness of the second encapsulation layer is greater than the height of the light-emitting component.

24. 24. The display substrate of claim 23, wherein an orthogonal projection on any one of the first sub-encapsulation layer, the second sub-encapsulation layer, and the second encapsulation layer covers an orthogonal projection of the light emitting component.

25. the first sub-encapsulation layer, the second sub-encapsulation layer, and the second encapsulation layer are stacked in order in a direction away from the base substrate of the light-emitting diode; an orthogonal projection of the second sub-encapsulation layer on the base substrate completely covers an orthogonal projection of each of the light emitting components on the base substrate and an orthogonal projection of a gap between two adjacent light emitting components on the base substrate; The display substrate of claim 24 , wherein an orthogonal projection on a vertical plane of a surface of the second sub-encapsulation layer facing the light-emitting components on the base substrate partially covers an orthogonal projection on the vertical plane of each of the light-emitting components.

26. The display substrate of claim 25, wherein the first sub-encapsulation layer is located between each two adjacent light-emitting components, or the orthogonal projection of the first sub-encapsulation layer on the base substrate completely covers the orthogonal projection of each of the light-emitting components on the base substrate and the orthogonal projection of a gap between two adjacent light-emitting components on the base substrate, and the orthogonal projection of the first sub-encapsulation layer on a vertical plane of a surface facing the light-emitting components on the base substrate completely covers the orthogonal projection of each of the light-emitting components on the vertical plane.

27. In a direction away from the base substrate of the light emitting component, the second sub-encapsulation layer, the first sub-encapsulation layer and the second encapsulation layer are stacked in order; an orthogonal projection of the first sub-encapsulation layer on the base substrate completely covers an orthogonal projection of each of the light emitting components on the base substrate and an orthogonal projection of a gap between two adjacent light emitting components on the base substrate; an orthogonal projection of a surface of the first sub-encapsulation layer facing the light emitting components on the base substrate on a vertical plane partially covers an orthogonal projection of each of the light emitting components on the vertical plane; an orthogonal projection of the second sub-encapsulation layer on the base substrate completely covers an orthogonal projection of each of the light emitting components on the base substrate and an orthogonal projection of a gap between two adjacent light emitting components on the base substrate; The display substrate of claim 24 , wherein an orthogonal projection on a vertical plane of a surface of the second sub-encapsulation layer facing the light-emitting components on the base substrate completely covers an orthogonal projection on the vertical plane of each of the light-emitting components.

28. 28. The display substrate according to claim 25, wherein a surface of the second sub-encapsulation layer away from the base substrate is substantially parallel to the base substrate.

29. A display substrate as described in any one of claims 25 to 27, wherein the surface of the second sub-sealing layer away from the base substrate is approximately parallel to the base substrate in the gap between two adjacent light-emitting components, and the area in which each of the light-emitting components is located protrudes in a direction away from the base substrate of the light-emitting component.

30. 30. The display substrate of claim 18, wherein the refractive index of the first transparent colloid, the refractive index of the second transparent colloid, and the refractive index of the third transparent colloid are set to increase, decrease, or alternate.

31. 31. The display substrate of claim 30, wherein the first transparent colloid, the second transparent colloid and the third transparent colloid have a maximum refractive index of 1.6 or more and a minimum refractive index of about 1.

41.

32. a transparent substrate layer is further included, the transparent substrate layer being provided on a side of the laminate including the first transparent colloid, the second transparent colloid, and the third transparent colloid away from the base substrate; 32. The display substrate of claim 30 or 31, wherein the refractive index of a stack including the first transparent colloid, the second transparent colloid, the third transparent colloid and the transparent base layer increases, decreases or is alternated.

33. At least one auxiliary functional layer is further included, the auxiliary functional layer being located on a side of the transparent substrate layer away from the base substrate, The display substrate of claim 32 , wherein the refractive indexes of the first transparent colloid, the second transparent colloid, the third transparent colloid and at least one of the auxiliary functional layers are set to increase, decrease or alternate.

34. The display substrate according to claim 33 , wherein the at least one auxiliary functional layer includes a laminated hardening layer and an anti-fingerprint layer, the hardening layer being located between the transparent substrate layer and the anti-fingerprint layer.

35. The display substrate of claim 34 , wherein the anti-fingerprint layer and / or the hardened layer comprises atomized particles.

36. 34. The display substrate of claim 21, wherein diffusing particles are dispersed in at least one of the second transparent colloid and the third transparent colloid.

37. 37. The display substrate of claim 36, wherein diffusing particles are dispersed in the second transparent colloid.

38. 38. The display substrate of claim 37, wherein the particle size of the diffusing particles is on the micron scale, and the mass fraction of the diffusing particles in the second transparent colloid is 10% to 15%.

39. 38. The display substrate of claim 37, wherein the diffusion particles have a nanoscale particle size, and the mass fraction of the diffusion particles in the second transparent colloid is 1.5% to 3.5%.

40. 40. The display substrate of claim 37, wherein the diffusing particles are transparent particles or white particles.

41. 41. The display substrate of claim 40, wherein the material of the transparent particles comprises silicon dioxide or polymethylmethacrylate, and the material of the white particles comprises titanium dioxide.

42. 42. The display substrate of claim 21, wherein the first sub-encapsulation layer is black, the second sub-encapsulation layer is white, and the second encapsulation layer is transparent.

43. 43. The display substrate of claim 21, wherein the first sub-encapsulation layer comprises carbon black particles, the carbon black particles being dispersed in the first transparent colloid.

44. 44. The display substrate according to claim 7, wherein the component is a light-emitting component.

45. Providing a base substrate; forming a plurality of components on the base substrate; applying an encapsulation structure to the components; and curing the second encapsulation layer so that a surface of the second encapsulation layer away from the first encapsulation layer is substantially parallel to the base substrate; 45. The method for manufacturing a display substrate described in any one of claims 7 to 44, wherein the sealing structure includes a first sealing layer and a second sealing layer stacked together, the first sealing layer covering the multiple components, and the second sealing layer being located on a side of the first sealing layer away from the multiple components.

46. A display device comprising the display substrate according to any one of claims 7 to 44.

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