Apparatus and method for manufacturing module with coil

Abstract

To provide an apparatus and a method for manufacturing a module with a coil, which can improve the throughput in the production of modules with the coil.SOLUTION: A wireless tag manufacturing apparatus disposes a coil forming tool 211 facing a supply head 112, and then forms a first portion Po1 of a coil Co1 by supplying a wire F1 from the supply head 112 to the coil forming tool 211, and then forms a second portion Po2 of the coil Co1. Thereafter, the wireless tag manufacturing apparatus supplies a chip CP to the inside of the second portion Po2 of the coil Co1, and then supplies the wire F1 from the supply head 112 to the coil forming tool 211, thereby forming a third portion that is continuous with the second portion Po2 on the opposite side to the first portion Po1 side and has a smaller diameter than the second portion Po2.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an apparatus and a method for manufacturing a module with a coil. [Background technology]

[0002] A method for manufacturing a coil tag has been proposed, which includes a winding section formed by winding a conductor, a coil antenna having a winding start section extended inside the winding section and a winding end section extended inside the winding section, and an IC chip connected to the winding start section and the winding end section (see, for example, Patent Document 1). In this coil tag manufacturing method, a conductor is hooked from the inside to the outside on one of a pair of winding jigs, and then the outer conductor is rewound around the winding jig, and the outer conductor is arranged to the other winding jig while extending in an arc shape. Then, the conductor is wound a preset number of times while being hooked on one winding jig and the other winding jig, and then the conductor is rewound from the outside to the inside of the other winding jig, and then the wound conductor is removed from the winding jig. Then, an IC chip is soldered to the winding start section and the winding end section. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-274382 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the coil tag manufacturing method as described in Patent Document 1, there is a demand for improving the throughput in the production of coil tags by shortening the time required to produce each coil tag.

[0005] The present invention has been made in consideration of the above-mentioned circumstances, and has an object to provide an apparatus and method for manufacturing a module with a coil that can improve throughput in the production of modules with a coil. [Means for solving the problem]

[0006] In order to achieve the above object, the coil-equipped module manufacturing apparatus according to the present invention comprises: a wire supplying unit having a supply head for supplying a wire; a coil forming tool having an inclined surface inclined with respect to a supply direction of the wire from the supply head and a guide groove formed therein for guiding the wire in a winding direction of a coil, the coil forming tool being disposed opposite the supply head such that when the wire supplied from the supply head is introduced into the guide groove, the wire is bent along the guide groove to form a coil; a coil forming tool driving unit that changes a distance between a contact position of the wire rod supplied from the supply head of the coil forming tool and the supply head to change a coil diameter of the formed coil; a chip supply unit that supplies chips to the inside of the coil, After the coil forming tool is positioned opposite the supply head, a first portion is formed at one end of the coil by supplying the wire from the supply head to the coil forming tool with the distance between the contact position and the supply head set to a first distance, and then a second portion is formed that is continuous with the first portion and has a larger diameter than the first portion by supplying the wire from the supply head to the coil forming tool with the distance between the contact position and the supply head set to a second distance longer than the first distance. Thereafter, the tip is supplied inside the second portion, and then a third portion is formed that is continuous with the second portion on the opposite side to the first portion side, has a smaller diameter than the second portion, and is located at the other end of the coil by supplying the wire from the supply head to the coil forming tool with the distance between the contact position and the supply head set to the first distance.

[0007] A method for manufacturing a module with a coil according to the present invention from another aspect includes the steps of: a preparation step of disposing, opposite the supply head, a coil forming tool having an inclined surface that is inclined with respect to a supply direction of the wire from a supply head that supplies the wire and has a guide groove formed therein for guiding the wire in a winding direction of the coil, the coil forming tool being disposed opposite the supply head such that when the wire supplied from the supply head is introduced into the guide groove, the wire is bent along the guide groove to form the coil; a first portion forming process for forming a first portion located at one end of the coil by supplying the wire from the supply head to the coil forming tool while setting a distance between the supply head and a contact position of the wire in the guide groove at a first distance; a second portion forming step of, after the first portion forming step, supplying the wire from the supply head to the coil forming tool in a state in which a distance between the contact position and the supply head is set to a second distance longer than the first distance, thereby forming a second portion that is continuous with the first portion and has a larger diameter than the first portion; a chip supplying step of supplying chips to an inside of the second portion after the second portion forming step; and a third portion forming process for forming a third portion at the other end of the coil, the third portion being continuous with the second portion on the opposite side to the first portion and having a smaller diameter than the second portion, by supplying the wire from the supply head to the coil forming tool while setting the distance between the contact position and the supply head to the first distance after the chip supply process. Effect of the Invention

[0008] According to the present invention, a first portion located at one end in the longitudinal direction of the coil is formed by supplying a wire from the supply head to the coil forming tool while the distance between the contact position of the wire in the guide groove of the coil forming tool and the supply head is set to a first distance, and then a second portion having a larger diameter than the first portion is formed by supplying the wire from the supply head to the coil forming tool while the distance between the contact position and the supply head is set to a second distance. Then, a chip is supplied to the inside of the second portion, and then a third portion having a smaller diameter than the second portion and located at the other end in the longitudinal direction of the coil is formed by supplying the wire from the supply head to the coil forming tool while the distance between the contact position and the supply head is set to the first distance. This allows a coil with a chip fixed on the inside to be produced simply by changing the distance between the supply head and the contact position of the wire in the guide groove of the coil forming tool, so that a module with a coil can be produced efficiently. This allows the throughput in the production of modules with a coil to be improved. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic side view of a wireless tag manufacturing apparatus according to an embodiment of the present invention. [Diagram 2] 1 is a schematic side view showing a wireless tag according to an embodiment; [Diagram 3] 1A and 1B show a wire supplying unit according to an embodiment, in which (A) is a schematic front view and (B) is a schematic side view seen from the -Z direction side. [Figure 4] 1A and 1B show a portion of a coil forming tool according to an embodiment, in which (A) is a bottom view and (B) is a side view. [Diagram 5] 1 shows a part of a wireless tag manufacturing apparatus according to an embodiment, where (A) is a diagram showing the state when formation of a first portion begins, (B) is a diagram showing the state of forming the first portion, and (C) is a diagram showing the state of forming the first portion. [Figure 6] 1A and 1B show a part of a wireless tag manufacturing apparatus according to an embodiment, in which (A) is a diagram showing a state at the start of formation of a second portion, and (B) is a diagram showing a state in which the second portion is being formed. [Figure 7] 1 is a schematic side view of a wireless tag manufacturing apparatus according to an embodiment; [Figure 8] 1 is a schematic side view of a wireless tag manufacturing apparatus according to an embodiment; [Figure 9] 1 is a schematic side view of a wireless tag manufacturing apparatus according to an embodiment; [Figure 10] 1 is a schematic side view of a wireless tag manufacturing apparatus according to an embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a coiled module manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings. The coiled module manufacturing apparatus according to this embodiment includes a wire supplying section having a supplying head for supplying a wire, a coil forming tool having an inclined surface inclined with respect to the supplying direction of the wire from the supplying head and aligned in the vertical direction, with a guide groove formed thereon for guiding the wire in the winding direction of the coil, and disposed opposite the supplying head, with the wire supplied from the supplying head being introduced into the guide groove, the wire is bent along the guide groove to form a long coil wound around a central axis aligned in the vertical direction, a coil forming tool driving section for changing the distance between the supplying head and the contact position of the wire supplied from the supplying head in the guide groove to change the coil diameter of the coil to be formed, and a chip supplying section for supplying chips to the inside of the coil. Then, after disposing the coil forming tool opposite the supply head, a first portion is formed at one end of the longitudinal direction of the coil by supplying the wire from the supply head to the coil forming tool while the distance between the contact position and the supply head is set to a first distance, and a second portion is formed that is continuous with the first portion and has a larger diameter than the first portion by supplying the wire from the supply head to the coil forming tool while the distance between the contact position and the supply head is set to a second distance longer than the first distance. Then, a tip is supplied to the inside of the second portion, and a third portion is formed that is continuous with the second portion on the opposite side to the first portion, has a smaller diameter than the second portion, and is located at the other end of the longitudinal direction of the coil by supplying the wire from the supply head to the coil forming tool while the distance between the contact position and the supply head is set to the first distance.

[0011] As shown in FIG. 1, the wireless tag manufacturing apparatus according to the present embodiment is a coil-attached module manufacturing apparatus including a wire supply unit 11, a coil forming tool unit 21, a chip supply unit 30, a coil support unit 23, a cutting unit 24, and a coil recovery unit 31. In the following description, the Z-axis direction corresponds to the vertical direction. And the +Z direction corresponds to the vertical upward direction. The wireless tag according to the present embodiment is a passive tag including a long coil Co1 and a chip CP arranged inside the coil Co1, as shown in FIG. 2, for example. Here, the chip CP is a chip on which a circuit for functioning as a passive tag is formed. The coil Co1 has a first portion Po1 located at one end in the longitudinal direction, a second portion Po2 that is continuous with the first portion Po1 and has a larger diameter than the first portion Po1, and a third portion Po3 that is located at the other end in the longitudinal direction of the coil Co1, is continuous with the second portion Po2 on the opposite side of the first portion Po1 side of the second portion Po2, and has a smaller diameter than the second portion Po2.

[0012] Returning to FIG. 1, the wire supplying unit 11 has a supplying head 112 and a main body 111 that supplies the wire to the supplying head 112. The supplying head 112 has a guide groove 112a that guides the wire F1 and an inclined portion 112b, as shown in FIGS. 3(A) and (B). The main body 111 has a rotation driving portion 1111 that rotates the supplying head 112 around an axis along the extending direction of the guide groove 112a, as shown by an arrow AR1 in FIG. 3(A). The main body 111 also unwinds the wire F1 through the guide groove 112a, as shown by an arrow AR2 in FIG. 3(B). The inclined portion 112b is inclined so that the protrusion amount increases toward the -Y direction side. The wire supplying unit 11 changes the inclination of the supplying head 112 to change the pitch amount of the coil Co1 to be produced.

[0013] Returning to FIG. 1, the coil forming tool unit 21 has a coil forming tool 211 and an arm 212 that supports the coil forming tool 211. The coil forming tool unit 21 also has a coil forming tool driving unit 213 that moves the arm 212 along the X-axis direction to move the coil forming tool 211. As shown in FIGS. 4(A) and 4(B), the coil forming tool 211 has an inclined surface 211a that is inclined with respect to the supply direction of the wire F1 from the supply head 112, i.e., the Y-axis direction and parallel to the Z-axis direction. The inclined surface 211a has a guide groove 211b that extends along the winding direction of the coil Co1 inclined with respect to the Z-axis direction and guides the wire F1 in the winding direction of the coil Co1. The coil forming tool 211 is positioned opposite the supply head 112 in the Y-axis direction, as shown in Figures 5(A) and (B), for example. When the wire F1 supplied from the supply head 112 is introduced into the guide groove 211b, the wire F1 is bent along the guide groove 211b to form a long coil Co1 wound around a central axis C1 along the Z-axis direction.

[0014] The coil forming tool unit 21 supplies the wire F1 from the supply head 112 to the coil forming tool 211 in a state where the distance between the contact position of the wire F1 in the guide groove 211b and the supply head 112 is set to a first distance W1, thereby forming a first portion Po1 of the coil Co1 having a radius R1. At this time, the coil Co1 extends in a spiral shape from the supply head 112 in the -Z direction side as shown by the arrow AR3 in FIG. 5(C). Next, as shown in FIGS. 6(A) and 6(B), the coil forming tool unit 21 moves the coil forming tool 211 in the -X direction as shown by the arrow AR3, thereby setting the distance between the contact position of the wire F1 in the guide groove 211b and the supply head 112 to a second distance W2 longer than the first distance W1. In this state, the coil forming tool unit 21 supplies the wire F1 from the supply head 112 to the coil forming tool 211 to form a second portion Po2 having a radius R2 larger than the first portion Po1 of the coil Co1. Thereafter, the coil forming tool unit 21 moves the coil forming tool 211 again in the +X direction to set the distance between the contact position of the wire F1 in the guide groove 211b and the supply head 112 to the first distance W1, and in this state, the coil forming tool unit 21 supplies the wire F1 from the supply head 112 to the coil forming tool 211, thereby forming the third portion Po3 of the coil Co1.

[0015] Returning to FIG. 1, the chip supply unit 30 is a chip supply unit having a chip storage unit 32 that stores a plurality of chips CP, and a chip transport unit 22 that transports the chips CP to a transfer position Pos2 where the chips CP are transferred to the second part Po2 of the coil Co1. The chip storage unit 32 stores a plurality of chips CP and discharges the chips CP vertically downward one by one. The chip storage unit 32 has a chip storage section 321 that extends vertically and has a holding groove 321a in which a plurality of chips CP are held in an arranged state inside, a shutter 324 that can take a closed state in which the holding groove 321a is blocked at a preset position in the holding groove 321a and an open state in which the holding groove 321a is opened, and a shutter drive section 322 that drives the shutter 324 to supply the chips CP one by one from the chip storage section 321 to the second part Po2 of the coil Co1. The tip storage unit 32 also has a support 323 that collectively supports the tip storage section 321 and the shutter drive section 322 .

[0016] The chip transport unit 22 has a chip holding head 221 that holds the chip CP, a holding tool 222 that supports the chip holding head 221 at its tip, and an arm 223 that supports the holding tool 222. The chip transport unit 22 also has a holding head drive unit 224 that moves the arm 223 along its longitudinal direction to move the chip holding head 221 to either a receiving position Pos1 where one chip CP discharged from the chip storage unit 321 is received, or a transfer position Pos2 that is located vertically above the second portion Po2 of the coil Co1 in a state where the second portion Po2 is formed, and transfers the chip CP held by the chip holding head 221 to the inside of the second portion Po2.

[0017] The coil support unit 23 has a support tool 231 that supports the coil Co1 at its tip, and an arm 232 that supports the support tool. The coil support unit 23 also has a support tool drive unit 233 that moves the arm 232 along the X-axis direction to a support position Pos3 where the tip of the support tool 231 supports the coil Co1, and a detachment position Pos4 where the coil Co1 is detached.

[0018] The cutting unit 24 has a cutting tool 241 that cuts the wire F1 at its tip, and an arm 242 that supports the cutting tool 241. The cutting unit 24 also has a cutting tool driving part 243 that moves the arm 242 along its longitudinal direction to bring a blade provided at the tip of the cutting tool 241 into contact with and press against the wire F1, thereby separating the coil Co1 from the wire F1.

[0019] The coil recovery unit 31 has a cylindrical coil holding head 311 that holds the coil Co1 separated from the wire F1, and a head drive unit 312 that drives the coil holding head 311 in the Z axis direction. The head drive unit 312 has a head support unit 3122 to which the coil holding head 311 is fixed, and a support unit drive unit 3121 that drives the head support unit 3122 in the Z axis direction.

[0020] Next, a method for manufacturing a wireless tag using the wireless tag manufacturing apparatus according to the present embodiment will be described. First, the coil forming tool unit 21 performs a preparation step of disposing the coil forming tool 211 facing the supply head 112 as shown in FIG. 1. Thereafter, in a state where the distance between the contact position between the wire rod F1 and the guide groove 211b in the coil forming tool 211 and the supply head 112 is set to a first distance W1, the wire rod F1 is supplied from the supply head 112 to the coil forming tool 211, thereby performing a first portion forming step of forming a first portion Po1 of the coil Co1. At this time, the first portion Po1 extends in a spiral shape vertically downward from the supply head 112 as the wire rod F1 is supplied from the supply head 112. Next, in a state where the distance between the contact position and the supply head 112 is set to a second distance W2, the wire rod F1 is supplied from the supply head 112 to the coil forming tool 211, thereby performing a second portion forming step of forming a second portion Po2 that is continuous with the first portion Po1 and has a larger diameter than the first portion Po1. At this time, as the wire F1 is supplied from the supply head 112, the second portion Po2 extends vertically downward in a spiral shape from the supply head 112.

[0021] The chip transport unit 22 also places the chip holding head 221 at a receiving position Pos1 for receiving one chip CP discharged from the chip storage unit 321, and the chip storage unit 32 discharges one chip CP to the chip holding head 221 disposed vertically below the chip storage unit 321. As a result, the chip holding head 221 is in a state of holding one chip CP. Next, the coil forming tool unit 21 moves the coil forming tool 211 in the -X direction as shown by the arrow AR11 in FIG. 7 to separate the coil forming tool 211 from the coil Co1, and the coil supporting unit 23 moves the supporting tool 231 in the -X direction as shown by the arrow AR12 to support the coil Co1 at the tip of the supporting tool 231. Then, the chip transport unit 22 moves the chip holding head 221 to a transfer position Pos2 vertically above the coil Co1 as shown by the arrow AR13. Thereafter, the chip transport unit 22 releases the chip CP from the chip holding head 221, thereby performing a chip supplying step of dropping the chip CP inside the second part Po2 of the coil Co1, as shown in FIG.

[0022] Next, the chip transport unit 22 moves the chip holding head 221 to the receiving position Pos1 again, as shown by an arrow AR14 in FIG. 9. Also, the coil support unit 23 moves the support tool 231 in the +X direction as shown by an arrow AR15 to separate the support tool 231 from the coil Co1. Then, the coil forming tool unit 21 moves the coil forming tool 211 in the +X direction as shown by an arrow AR16 to place the coil forming tool 211 facing the supply head 112 again. Thereafter, in a state where the distance between the contact position of the wire material F1 with the guide groove 211b of the coil forming tool 211 and the supply head 112 is set to the first distance W1, the wire material F1 is supplied from the supply head 112 to the coil forming tool 211, thereby performing a third portion forming step of forming a third portion Po3 of the coil Co1. At this time, as the wire F1 is supplied from the supply head 112, the third portion Po3 extends vertically downward in a spiral shape from the supply head 112.

[0023] Next, the coil forming tool unit 21 moves the coil forming tool 211 in the -X direction as shown by the arrow AR17 in FIG. 10 to separate the coil forming tool 211 from the coil Co1. Then, the coil supporting unit 23 moves the supporting tool 231 in the -X direction as shown by the arrow AR18, so that the tip of the supporting tool 231 supports the coil Co1 again. After that, the coil recovery unit 31 moves the coil holding head 311 in the +Z direction as shown by the arrow AR19 so that a part of the lower end side of the coil Co1 is disposed inside the coil holding head 311. After that, the cutting unit 24 moves the cutting tool 241 in a direction approaching the coil Co1 as shown by the arrow AR20, and a blade provided at the tip of the cutting tool 241 abuts against the upper end of the coil Co1 and presses it against the coil Co1, thereby cutting the coil Co1 from the wire F1. Then, the cut coil Co1 is accommodated inside the coil holding head 311.

[0024] As described above, according to the wireless tag manufacturing device of the present embodiment, the wire F1 is supplied from the supply head 112 to the coil forming tool 211 in a state where the distance between the contact position of the wire F1 in the guide groove 211b of the coil forming tool 211 and the supply head 112 is set to the first distance W1, thereby forming a first portion Po1 located at the end of the coil Co1 in the -Z direction. Thereafter, the wire F1 is supplied from the supply head 112 to the coil forming tool 211 in a state where the distance between the contact position and the supply head 112 is set to the second distance W2, thereby forming a second portion Po2 having a larger diameter than the first portion Po1. Thereafter, the chip CP is supplied to the inside of the second portion Po2, and then the wire F1 is supplied from the supply head 112 to the coil forming tool 211 in a state where the distance between the contact position and the supply head 112 is set to the first distance W1, thereby forming a third portion Po3 having a smaller diameter than the second portion Po2 and located at the end of the coil Co1 in the +Z direction. This allows the coil Co1 with the chip CP fixed inside to be produced simply by changing the distance between the contact position of the wire F1 in the guide groove 211b of the coil forming tool 211, thereby enabling the efficient production of wireless tags, thereby improving the throughput in the production of wireless tags.

[0025] Although the embodiments of the present invention have been described above, the present invention is not limited to the configurations of the above-mentioned embodiments. For example, the module with a coil is not limited to a wireless tag, and may be another type of module with a coil.

[0026] Although the embodiments and modifications of the present invention have been described above, the present invention is not limited to these. The present invention includes appropriate combinations of the embodiments and modifications, and appropriate modifications thereto. [Industrial Applicability]

[0027] The present invention is suitable for manufacturing modules with coils, such as wireless tags. [Explanation of symbols]

[0028] 11: wire supply unit, 21: coil forming tool unit, 22: chip transport unit, 23: coil support unit, 24: cutting unit, 30: chip supply unit, 31: coil recovery unit, 32: chip storage unit, 111: main body, 112: supply head, 112a, 211b: guide groove, 112b: inclined portion, 211: coil forming tool, 211a: inclined surface, 212, 223, 232, 242: arm, 213: coil forming tool drive unit, 221: chip holding head, 222: holding tool, 224: holding head drive unit, 231: support tool, 233: Support tool drive unit, 241: Cutting tool, 243: Cutting tool drive unit, 311: Coil holding head, 312: Head drive unit, 321: Chip storage unit, 321a: Holding groove, 322: Shutter drive unit, 323: Support body, 324: Shutter, 3121: Support drive unit, 3122: Head support unit, 1111: Rotation drive unit, C1: Central axis, Co1: Coil, F1: Wire rod, Po1: First part, Po2: Second part, Po3: Third part, Pos1: Receiving position, Pos2: Transfer position, Pos3: Support position, Pos4: Detachment position, W1: First distance, W2: Second distance

Claims

1. a wire supplying unit having a supply head for supplying a wire; a coil forming tool having an inclined surface inclined with respect to a supply direction of the wire from the supply head and a guide groove formed therein for guiding the wire in a winding direction of a coil, the coil forming tool being disposed opposite the supply head such that when the wire supplied from the supply head is introduced into the guide groove, the wire is bent along the guide groove to form a coil; a coil forming tool driving unit that changes a distance between a contact position of the wire rod supplied from the supply head of the coil forming tool and the supply head to change a coil diameter of the formed coil; a chip supply unit that supplies chips to the inside of the coil, a coil forming tool is disposed opposite to the supply head, and a first portion is formed at one end of the coil by supplying the wire from the supply head to the coil forming tool while a distance between the contact position and the supply head is set to a first distance; a second portion is formed that is continuous with the first portion and has a larger diameter than the first portion by supplying the wire from the supply head to the coil forming tool while a distance between the contact position and the supply head is set to a second distance longer than the first distance; a tip is then supplied to the inside of the second portion; and a third portion is formed that is continuous with the second portion on an opposite side to the first portion side, has a smaller diameter than the second portion, and is located at the other end of the coil by supplying the wire from the supply head to the coil forming tool while a distance between the contact position and the supply head is set to the first distance. Coiled module manufacturing equipment.

2. When the wire rod supplied from the supply head is introduced into the guide groove, the wire rod is bent along the guide groove and wound around a central axis extending in a vertical direction.

2. The coiled module manufacturing apparatus according to claim 1.

3. The chip supply unit includes: a chip storage section that stores a plurality of the chips and discharges the chips vertically downward one by one; A chip holding head for holding the chip; a holding head driving unit that moves the tip holding head to either a receiving position that receives one tip discharged from the tip storage unit, or a transfer position that is located vertically above the second portion of the coil when the second portion is formed and transfers the tip held by the tip holding head to the inside of the second portion.

3. The coiled module manufacturing apparatus according to claim 1 or 2.

4. the chip storage section has a holding groove extending in a vertical direction and holding a plurality of the chips in an arranged state therein; The chip supply unit further includes: a shutter that can be in a closed state in which the holding groove is blocked at a preset position in the holding groove and in an open state in which the holding groove is opened; a shutter driving unit that drives the shutter to supply the tips one by one from the tip storage unit to the second portion, 4. The coiled module manufacturing apparatus according to claim 3.

5. a preparation step of disposing, opposite the supply head, a coil forming tool having an inclined surface that is inclined with respect to a supply direction of the wire from a supply head that supplies the wire and has a guide groove formed therein for guiding the wire in a winding direction of the coil, the coil forming tool being disposed opposite the supply head such that when the wire supplied from the supply head is introduced into the guide groove, the wire is bent along the guide groove to form the coil; a first portion forming process for forming a first portion located at one end of the coil by supplying the wire from the supply head to the coil forming tool while setting a distance between the supply head and a contact position of the wire in the guide groove at a first distance; a second portion forming step of, after the first portion forming step, supplying the wire from the supply head to the coil forming tool in a state in which a distance between the contact position and the supply head is set to a second distance longer than the first distance, thereby forming a second portion that is continuous with the first portion and has a larger diameter than the first portion; a chip supplying step of supplying chips to an inside of the second portion after the second portion forming step; and a third portion forming process for forming a third portion at the other end of the coil, the third portion being continuous with the second portion on an opposite side to the first portion side and having a smaller diameter than the second portion, by supplying the wire from the supply head to the coil forming tool while setting the distance between the contact position and the supply head to the first distance after the chip supply process. A method for manufacturing a module with coil.

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