Electronic apparatus

Abstract

To provide an electronic apparatus that can prevent damage to an electrode, a signal line, or an insulating layer on a thin-film transistor layer even when a substrate is bent.SOLUTION: An electronic apparatus 10 comprises: a first constitutional substrate 102 that includes a first polymer substrate 104 and a component layer 106, wherein the component layer 106 is arranged on the first polymer substrate 104; and a neutral surface 114 that is arranged in the first constitutional substrate 102.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] This application claims the benefit of Chinese Patent Application No. 201910105115.X, filed on February 1, 2019, the entire contents of which are incorporated herein by reference.

[0002] The present disclosure relates to electronic devices, and more particularly to electronic devices that use flexible materials as substrates. [Background technology]

[0003] With the advancement of technology, display devices are gradually developed toward the trend of brightness and thinness. In liquid crystal display devices, in order to reduce the overall weight and overall thickness, a flexible substrate made of plastic material can replace the glass substrate, and the liquid crystal display device may be called a plastic liquid crystal display (PLCD). However, the PLCD still has some drawbacks that need to be improved. One of these drawbacks is that there may be foreign matter when forming the plastic substrate, or the solute of the plastic material is easily precipitated due to the low cleanliness of the manufacturing process, resulting in the surface of the plastic substrate used to form components being raised. For this reason, the metal traces formed on the plastic substrate are not easily formed on the protruding surface, and the metal lines on the protruding surface are easily broken or have excessive resistance, resulting in display defects of the display device, such as bright lines and bright spots. Another drawback is that the thickness of the two plastic substrates of the liquid crystal display device is reduced, and a large amount of asymmetric stress is generated in the thin film transistor layer of the liquid crystal display device, so that the electrodes, signal lines or insulating layers in the thin film transistor layer are easily damaged due to bending, which causes display defects of the liquid crystal display device. Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure includes a component substrate comprising a polymer substrate and a component layer, the component layer disposed on the polymer substrate, and a neutral surface disposed within the component substrate.

[0005] These and other objects of the present disclosure will no doubt become apparent to those skilled in the art after reading the following detailed description of the embodiments that are illustrated in the various figures and drawings. [Brief description of the drawings]

[0006] [Figure 1] 1 is a schematic diagram showing a cross-sectional view of an electronic device according to a first embodiment of the present disclosure. [Figure 2A] FIG. 2 is a schematic diagram showing a cross-sectional view of an electronic device according to a first embodiment before bending. [Figure 2B] FIG. 2 is a schematic diagram showing a cross-sectional view of an electronic device according to a first embodiment after bending. [Diagram 3] FIG. 1 is a schematic diagram showing a perspective view of an electronic device and a neutral plane according to a first embodiment. [Figure 4] FIG. 2 is a schematic diagram showing a cross-sectional view of an electronic device according to a modified embodiment of the first embodiment of the present disclosure. [Diagram 5] FIG. 2 is a schematic diagram showing a cross-sectional view of an electronic device according to a second embodiment of the present disclosure. [Figure 6] 1 is a schematic diagram showing a cross-sectional view of an electronic device during bending according to a second embodiment of the present disclosure. [Figure 7] FIG. 11 is a schematic diagram showing a cross-sectional view of an electronic device according to a third embodiment of the present disclosure. [Figure 8] 11 is a schematic diagram showing a cross-sectional view of an electronic device during bending according to a third embodiment of the present disclosure. FIG. [Figure 9] FIG. 11 is a schematic diagram showing a cross-sectional view of an electronic device according to a fourth embodiment of the present disclosure. [Figure 10] FIG. 11 is a schematic diagram showing a cross-sectional view of an electronic device according to a fifth embodiment of the present disclosure. [Figure 11]FIG. 10 is a schematic diagram showing a top view of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] The present disclosure can be understood by referring to the following detailed description in conjunction with the drawings, as described below. It should be noted that for clarity of explanation and to facilitate understanding by the reader, the various drawings in the present disclosure show parts of an electronic device, and specific components in the various drawings may not be drawn to scale. In addition, the number and dimensions of each component shown in these drawings are merely examples, and are not intended to limit the scope of the present disclosure.

[0008] Certain terms are used throughout the specification and claims to refer to particular components. As one skilled in the art will appreciate, electronics manufacturers may refer to components by different names. This application does not intend to distinguish between components that differ in name but not function. In the following detailed description and claims, the terms "include," "comprise," and "have" are open-ended and thus should be interpreted to mean "including, but not limited to."

[0009] Spatially relative terms used in the following embodiments, such as "above," "on," "beneath," "below," "under," "left," "right," "before," "front," "after," "behind," and the like, refer only to orientation in the drawings and are not intended to limit the present disclosure. It should be understood that components in the drawings may be arranged in any type of configuration known to those skilled in the relevant art, and are described in a specific manner. Furthermore, when a layer is "on" another layer or substrate, the layer may be "directly on" the other layer or substrate, or the layer may be on the other layer or substrate, or the other layer may be sandwiched between the layer and the other layer or substrate.

[0010] It should be noted that relative terms such as, for example, "lower," "bottom," "upper," or "top" may be used herein to describe the location of one component relative to another. It is understood that if the device in the figures were turned over, the resulting component described as "lower" would be oriented toward the "upper" component.

[0011] As used herein, the terms "about," "approximately," and "substantially" generally mean within 20% of a given value or range, preferably within 10% of a given value or range, and more preferably within 5% of a given value or range. Generally constant numbers that are not specified still include the meaning of "about," "approximately," and "substantially."

[0012] For example, terms such as "first," "second," and the like may be used in the detailed description and the claims that follow to describe various elements of the claims. The terms do not imply or imply any ordering of the claimed components, nor do they imply an order of one claimed component and another claimed component, or an order in a method of manufacture. These terms are used to distinguish a claimed component of a type from another claimed component of the same type.

[0013] It should be noted that the technical features of the different embodiments described in the following description can be exchanged, recombined or mixed with each other to construct other embodiments without departing from the spirit of the present disclosure.

[0014] FIG. 1 is a schematic diagram showing a cross-sectional view of an electronic device according to a first embodiment of the present disclosure. The electronic device 10 includes a first component substrate 102, which includes a first polymer substrate 104 and a component layer 106. The first polymer substrate 104 is used to support the component layer 106 and has a bendable property, for example, the first polymer substrate 104 includes a polymer substrate or other suitable substrate. As an example, the material of the first polymer substrate 104 may include, but is not limited to, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethersulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyarylate (PAR), other suitable materials, or any combination thereof. The component layer 106 is disposed on the first polymer substrate 104. The component layer 106 may include necessary driving components, display components, or components without display functions according to the type of the electronic device 10. In some embodiments, the electronic device 10 may be a liquid crystal display device, the first component substrate 102 may be a thin film transistor substrate, and the component layer 106 may include a plurality of thin film transistors 108 for controlling the gray scale of a pixel. For example, the thin film transistor 108 may include a gate electrode G, a gate insulating layer GI, a semiconductor layer SEM, a source electrode S, and a drain electrode D, in which the gate electrode G may be formed by a first metal pattern layer M1, and the source electrode S and the drain electrode D may be formed by a second metal pattern layer M2. In some embodiments, the display device may be a self-luminous display device, and thus the component layer 106 may include a plurality of thin film transistors 108 for displaying an image, control lines, and light-emitting components. The light-emitting components may be, for example, organic light-emitting diodes (OLEDs) or inorganic light-emitting diodes, such as quantum dot light-emitting diodes (Q-LEDs), micro light-emitting diodes (micro LEDs), or mini light-emitting diodes (mini LEDs), etc.In other embodiments, multiple liquid crystal displays or multiple self-emissive displays may be used to form a large tiling display. In some embodiments, the component layer 106 may further include an insulating or protective layer to electrically insulate different lines or electrodes from each other. In some embodiments, the display device may further include an encapsulation layer, barrier layer, or cover film disposed on the component layer 106 to protect the thin film transistors 108 and the light-emitting components. In some embodiments, the component layer 106 may not have a display function, for example, the component layer 106 may include a liquid crystal antenna. In such a situation, the component layer 106 may include a dielectric layer and a circuit layer, where the dielectric layer may be a liquid crystal layer or other suitable dielectric material. The circuit layer may be formed by thin film processing and may optionally include a switch component, for example, but not limited to, amorphous thin film transistors, low temperature polysilicon thin film transistors, metal oxide thin film transistors, etc. In one embodiment, when the component layer 106 is a liquid crystal antenna, the operating range of the liquid crystal antenna refers to a range corresponding to an actual effective operating area, such as an area capable of transmitting or receiving electromagnetic signals, optical signals, etc. Other areas that are not the actual effective operating area correspond to non-operating areas. The above description is merely an example and is not limiting. In some embodiments, the first component substrate 102 may be a color filter substrate, in which the component layer 106 may include a black matrix layer and / or a color filter layer. The component layer 106 disclosed in the present application is not limited to those described above.

[0015] It should be noted that due to the bendable nature of the first polymer substrate 104, the first polymer substrate 104 may be formed on a carrier plate (not shown), e.g., formed on a glass substrate, before forming the component layer 106 on the first polymer substrate 104. In some embodiments, the first polymer substrate 104 may be formed by coating a solution on the carrier plate, then shaping the solution by a first bake, and then fully curing the solution by a second bake. In other embodiments, the first polymer substrate 104 may be formed by coating a solution on the carrier plate, and then fully curing the solution by irradiation (e.g., ultraviolet or infrared). The above is only an example and is not limiting. Due to insufficient cleanliness of the processing environment, some protruding elements 110, e.g., foreign objects or floating particles, may be present on the carrier plate. Or during baking, the solutes in the solution may not dissolve in the solvent, which may cause some of the solutes in the solution close to the carrier plate to separate. As a result, the formed first polymer substrate 104 includes a number of protruding elements 110 arranged under the upper surface 104s of the first polymer substrate 104. Since the protruding elements 110 have a certain thickness, if the thickness of the first polymer substrate 104 formed on the carrier plate is too thin, the upper surface 104s of the first polymer substrate 104 corresponding to the protruding elements 110 may protrude, which means that the first polymer substrate 104 includes a number of protruding parts 104a protruding from the upper surface 104s. The cross-sectional shape of one of the upper surfaces 104s among the protruding parts 104a is not limited to a curved surface, and may be uneven. The above description is merely an example and is not limiting. The height of the protruding part 104a may be defined as the absolute value of the difference between the average height of a part of the upper surface 104s without the protruding part 104a and the height of the top of the protruding part 104a in the plan view direction VD of the electronic device 10. The absolute value of this difference may be in the range of substantially 3 μm or less. The above description is merely an example and is not limiting.For the height of the top of the protrusion 104a, the following related description of FIG. 11 may be referred to. In one embodiment, the top surface 104s without the protrusion 104a may not be a completely flat surface, so the average height of the top surface 104s may be obtained by averaging the top height and the bottom height of the top surface 104s in a unit area (for example, an area of ​​10 μm×10 μm), but this description is only an example and is not limited. For example, the top height and the bottom height of the top surface 104s may be obtained by calculating the absolute value of the difference between the top height and the reference height, and the absolute value of the difference between the bottom height and the reference height, respectively, based on a reference height, and in the cross-sectional view of the electronic device 10, the bottom height may be located between the top height and the reference height, and the reference height may be, for example, the bottom surface of the first polymer substrate 104 opposite to the top surface 104s. In the present disclosure, since the first polymer substrate 104 is formed by baking the solution, the increased thickness of the coated first polymer substrate 104 can reduce the protruding height of the protrusion 104a, improving the flatness of the top surface 104s of the first polymer substrate 104. Thus, damage to the component layer 106 formed on the first polymer substrate 104 can be reduced. In some embodiments, the height of the protrusion 104a can be reduced by gradually changing the temperature during the second baking. The thin film transistor 108 in the component layer 106 shown in FIG. 1 is, for example, a bottom gate type, and the first metal pattern layer M1 of the component layer 106 (the first metal pattern layer M1 may include a scan line (not shown) and a gate electrode G of the thin film transistor 108) is formed on the first polymer substrate 104. The height of the protrusion 104a is reduced and the thickness of the first metal pattern layer M1 is made larger than the height of the protrusion 104a, so that when the first metal pattern layer M1 crosses the protrusion 104a, the first metal pattern layer M1 is not destroyed or the resistance of the first metal pattern layer M1 is not significantly reduced. For example, but not limited to, the first polymer substrate 104 may have a first thickness x1 of 5 μm or more and 45 μm or less.The height of the protrusion 104a may be, for example, less than 2 μm, but is not limited to this.

[0016] In some embodiments, the first component substrate 102 may optionally include a stress buffer layer disposed between the component layer 106 and the first polymer substrate 104. Due to the stress between the first polymer substrate 104 formed on the carrier plate and the carrier plate, a portion of the first polymer substrate 104 adjacent to the edge of the first polymer substrate 104 is bent toward the side of the carrier plate opposite the first polymer substrate 104, forming a curved first polymer substrate 104. By forming a stress buffer layer 112 on the side of the first polymer substrate 104 opposite the carrier plate, the bending phenomenon of the first polymer substrate 104 can be alleviated, thereby facilitating the formation of the component layer 106 on the first polymer substrate 104. For example, the stress buffer layer 112 may include silicon oxide, silicon nitride, or a combination thereof, to balance the stress of the carrier plate on the first polymer substrate 104. The thickness of the stress buffer layer 112 may be, for example, but not limited to, about 2,500 angstroms or more and about 7,500 angstroms or less. In some embodiments, the stress buffer layer 112 may be conformally formed on the top surface 104s of the first polymer substrate 104, such that the part of the stress buffer layer 112 corresponding to the protrusion 104a of the first polymer substrate 104 may also have the protrusion 112a. In such a situation, the thickness of the first metal pattern layer M1 may still be greater than the height of the protrusion 112a, and the resistance of the part of the first metal pattern layer M1 crossing the protrusion 104a is not affected by the protrusion 112a. The height of the protrusion 112a may be, for example, but not limited to, less than 2 μm.

[0017] Furthermore, the electronic device 10 has a neutral plane 114 during bending, and when the electronic device 10 is bent, the stress on the components of the electronic device 10 at the neutral plane 114 is close to or equal to zero. In the present disclosure, the neutral plane 114 of the electronic device 10 may be adjusted to be adjacent to or within the first component substrate 102 by increasing the thickness x1 of the first polymer substrate 104, so that the component layer 106 is close to the neutral plane 114. Thus, the stress on the component layer 106 during bending can be reduced, thereby reducing damage to the component layer 106 due to bending.

[0018] The definition of the neutral plane 114 of the electronic device 10 will be further detailed in the following description. Figures 2A and 2B are schematic diagrams showing cross-sectional views of the electronic device 10 before and after bending, respectively, and Figure 3 is a schematic diagram showing a perspective view of the electronic device 10 and the neutral plane 114. When the electronic device 10 is not bent, the portion A from point a1 to point a2, the portion B from point b1 to point b2, and the portion C from point c1 to point c2 have substantially the same length. When the electronic device 10 is bent, the portion A' from point a1 to point a2, the portion B' from point b1 to point b2, and the portion C' from point c1 to point c2 have different lengths, and when the above-mentioned parts C and C' have substantially the same length, the parts C and C' can function as being located on the neutral plane 114.

[0019] In the following description, it is further mentioned that the part C and the part C', which have substantially no change in length before and after bending, should be located on the neutral plane 114 where the stress is zero. As shown in FIG. 2A, the part M from the point m1 to the point m2 and the above-mentioned part C have a distance, for example, a shortest distance. When the electronic device 10 is not bent, the part M from the point m1 to the point m2 can have substantially the same length as the part C. As shown in FIG. 2B, when the electronic device 10 is bent, the length of the part M' from the point m1 to the point m2 can be (r+y1)×θ, where r is the radius of curvature of the part C' when the electronic device 10 is bent, θ is the bending angle of the part C', and y1 is the difference between the radius of curvature of the part M' and the radius of curvature of the part C', for example, the shortest distance between the part M' and the part C'. As a result, the strain value ε of the part M' caused by bending is obtained as [(r+y1)×θ-r×θ] / r×θ, and thus the strain value ε is obtained as y1 / r. According to Hooke's law, the stress σ of the part M' is E×y1 / r, where E is the elastic constant. As shown in FIG. 3, the total force F in the whole electronic device 10 is the sum of the stresses σ in all unit areas dA, as follows:

[0020]

number

[0021] When the sum of the forces F is 0, the above stress σ can be introduced into the above equation to obtain the following equation:

number

number

[0022] As shown in FIG. 1 , in this embodiment, by increasing the thickness of the first polymer substrate 104, the neutral plane 114 of the electronic device 10 may be adjusted to be located on the first component substrate 102, for example, the neutral plane 114 may be located on the component layer 106, which can reduce stress on the thin film transistors 108 and lines in the component layer 106 when the electronic device 10 is bent, thereby reducing damage to the thin film transistors 108 and lines due to bending.

[0023] The electronic device disclosed in the present application is not limited to the above-mentioned embodiment, and may have different modified embodiments or other embodiments. For the sake of simplicity, the same components in the other embodiments are marked with the same symbols as in the first embodiment. In order to conveniently compare the differences between the first embodiment and the other embodiments, the following description will describe the differences between the first embodiment and the other embodiments in detail, and the same features will not be described repeatedly.

[0024] 4 is a schematic diagram showing a cross-sectional view of an electronic device according to a modified embodiment of the first embodiment of the present disclosure. In this modified embodiment, the electronic device 12 may not include a stress buffer layer, and the electronic device 12 may be disposed between the component layer 106 and the first polymer substrate 104. The electronic device 12 may include a transparent photoresist layer 116 disposed on the top surface 104s of the first polymer substrate 104. Specifically, the transparent photoresist layer 116 is formed on the top surface 104s of the first polymer substrate 104 prior to forming the component layer 106. Because the transparent photoresist layer 116 has fluid properties, the top surface 116s of the formed transparent photoresist layer 116 has better planarity compared to the top surface 104s of the first polymer substrate 104, thereby facilitating the manufacture of the component layer 106. In some embodiments, the electronic device 12 may also include a stress buffer layer 112 formed between the transparent photoresist layer 116 and the first polymer substrate 104.

[0025] FIG. 5 is a schematic diagram showing a cross-section of an electronic device according to a second embodiment of the present disclosure, and FIG. 6 is a schematic diagram showing a cross-section of an electronic device according to a second embodiment of the present disclosure during bending. In order to clearly show the bending of each film layer and because the view of the protruding elements and protrusions may become unclear during bending, the protruding elements and protrusions are omitted in FIG. 6, but not limited thereto. The difference between the electronic device 20 of this embodiment and the electronic device 10 shown in FIG. 1 is that the electronic device 20 may be a liquid crystal display device, for example, and may further include a second component substrate 202 and a liquid crystal layer 204, and the liquid crystal layer 204 is disposed between the first component substrate 102 and the second component substrate 202. The second component substrate 202 may include a second polymer substrate 206 disposed on the opposite side of the first polymer substrate 104. The second polymer substrate 206 may include, for example, a polymer substrate, or other suitable substrate. For example, the material of the second polymer substrate 206 may include, but is not limited to, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethersulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN) or polyarylate (PAR), other suitable materials, or any combination thereof. The second polymer substrate 206 has a second thickness x2. In order to reduce stress in the component layer 106, the first thickness x1 of the first polymer substrate 104 may be adjusted to be thicker than the second thickness x2 of the second polymer substrate 206 in the plan view direction VD of the electronic device 20, so that the distance between the neutral plane 114 and the first polymer substrate 104 is less than the distance between the neutral plane 114 and the second polymer substrate 206. For example, the neutral plane 114 of this embodiment may be located in the liquid crystal layer 204 near the component layer 106. Also, in some embodiments, the neutral surface 114 may be located between the liquid crystal layer 204 and the first polymer substrate 104 (as shown in FIG. 1 ), or may be located within the first polymer substrate 104 (as shown in FIG. 4 ). For example, the first thickness x1 and the second thickness x2 may follow the formula:

number

[0026] In this embodiment, the second component substrate 202 may further include a black matrix 208 and a color filter layer 210 disposed between the liquid crystal layer 204 and the second polymer substrate 206. The color filter layer 210 may include color filters (not shown) of different colors, such as a red color filter, a green color filter, and a blue color filter, and the different color filters are disposed corresponding to different openings of the black matrix 208, respectively. In some embodiments, the second component substrate 202 may further include another stress buffer layer 212 disposed between the color filter layer 210 and the second polymer substrate 206 and between the black matrix 208 and the second polymer substrate 206. The stress buffer layer 212 may have the same function and structure as the stress buffer layer 112, and will not be described in detail.

[0027] In some embodiments, the display device 20 may further include a first retardation film 214 and a second retardation film 216 to reduce light leakage in the dark state. The first retardation film 214 is disposed on the side of the first polymer substrate 104 opposite the thin film transistor 108, and the second retardation film 216 is disposed on the side of the second polymer substrate 206 opposite the color filter layer 210. It should be noted that the first polymer substrate 104 has retardation properties, so the first retardation film 214 can be used to compensate for the retardation of the first polymer substrate 104. For example, the first polymer substrate 104 has the retardation properties of a -C plate. That is, the refractive index nx1 of the first polymer substrate 104 in the first direction D1 and the refractive index ny1 of the first polymer substrate 104 in the second direction D2 may be substantially equal to each other, the refractive index nz1 of the first polymer substrate 104 in the thickness direction TD may be smaller than the refractive index nx1 of the first polymer substrate 104 in the first direction D1, and the first direction D1 and the second direction D2 are in a plane perpendicular to the thickness direction TD, which may be, for example, the planar viewing direction VD of the electronic device 20. Therefore, the retardation value R0 of the first polymer substrate 104 in the in-plane direction (i.e., (nx1-ny1)×d) is approximately 0, and the retardation value Rth of the first polymer substrate 104 in the thickness direction TD (i.e., [(nx1+ny1) / 2-nz1]×d) is not 0, where d is the thickness of the corresponding film. In order to compensate for the retardation of the first polymer substrate 104, the first retardation film 214 may have, for example, retardation characteristics of a +C plate. That is, the refractive index of the first retardation film 214 in the first direction D1 and the refractive index in the second direction D2 may be substantially equal, and the refractive index of the first retardation film 214 in the thickness direction TD is greater than the refractive index nx1 of the first retardation film 214 in the first direction D1 and the refractive index ny1 of the first retardation film 214 in the second direction D2. Therefore, the retardation value of the first retardation film 214 in the thickness direction TD is also not 0.In order not to exceed the retardation value that the first retardation film 214 can compensate, it is necessary to increase the retardation value of the first retardation film 214 in the film thickness direction TD due to the increase in the first thickness x1 of the first polymer substrate 104, so the first thickness x1 of the first polymer substrate 104 may be 45 μm or less. For example, the retardation value of the first retardation film 214 in the film thickness direction TD may be greater than 0 and less than 300 nm. Similarly, for example, the second polymer substrate 206 may have the retardation characteristics of a -C plate. That is, the refractive index nx2 of the second polymer substrate 206 in the first direction D1 and the refractive index ny2 of the second polymer substrate 206 in the second direction D2 may be substantially equal to each other, and the refractive index nz2 of the second polymer substrate 206 in the film thickness direction TD is smaller than the refractive index nx2 of the second polymer substrate 206 in the first direction D1. Therefore, the retardation value R0 (i.e., (nx2-ny2)×d) of the second polymer substrate 104 in the in-plane direction is approximately 0, and the retardation value Rth (i.e., [(nx2+ny2) / 2-nz2]×d) of the second polymer substrate 104 in the thickness direction TD is not 0. In order to avoid exceeding the retardation value that the second retardation film 216 can compensate for, the second thickness x2 of the second polymer substrate 206 may be 45 μm or less. The retardation value that the second retardation film can compensate for in the thickness direction TD may be, for example, greater than 0 and 300 nm or less. In some embodiments, the display device 20 may further include a first polarizer 218 and a second polarizer 220, and the first retardation film 214 is located between the first polarizer 218 and the first polymer substrate 104, and the second retardation film 216 is located between the second polarizer 220 and the second polymer substrate 206.

[0028] In some embodiments, the first polymer substrate 104 has a color variation of 0.002 in the x coordinate of the CIE 1931 color space and a color variation of 0.003 in the y coordinate of the CIE 1931 color space per 10 μm of thickness. In other words, when light passes through the first polymer substrate 104 with a thickness of 10 μm, the value of the x coordinate of the light in the CIE 1931 color space increases by 0.002, and the value of the y coordinate of the light in the CIE 1931 color space increases by 0.003. Therefore, in order to reduce the color shift caused by the increase in the first thickness x1 of the first polymer substrate 104, the first thickness x1 has an upper limit, for example, the first thickness x1 is 45 μm or less. Similarly, in order to reduce the color shift caused by the second polymer substrate 206, the second thickness x2 also has an upper limit, for example, the second thickness x2 is 45 μm or less.

[0029] 7 is a schematic diagram showing a cross-section of an electronic device according to a third embodiment of the present disclosure, and FIG. 8 is a schematic diagram showing a cross-section of an electronic device according to a third embodiment of the present disclosure during bending. In order to clearly show the bending of each film layer and because the view of the protruding elements and protrusions may become unclear during bending, the protruding elements and protrusions are omitted in FIG. 8, but not limited thereto. The difference between the electronic device 30 of this embodiment and the electronic device 20 shown in FIG. 5 is that the component layer of the electronic device 30 includes a black matrix 208 and a color filter layer 210, and the second thickness x2 of the second polymer substrate 306 for disposing the component layer is larger than the first thickness x1 of the first polymer substrate 304 in the plan view VD of the electronic device 20, so that the neutral surface 114 can be located adjacent to the second component substrate 302 or can be located within the second component substrate 302. For example, the neutral plane 114 may be in the black matrix 208, which may reduce the change in size of the openings in the black matrix 208 when the electronic device 30 is bent or not bent, thereby reducing light leakage or light mixing of adjacent subpixels. For example, the first thickness x1 and the second thickness x2 may follow the formula:

number

[0030] In some embodiments, the second polymer substrate 306 may also include a plurality of protruding elements 310, such as foreign matter or suspended particles, disposed on the surface of the second polymer substrate 306 opposite to the black matrix 208. Since these protruding elements 310 have a certain thickness, the second polymer substrate 306 may also include a plurality of protruding portions 306a protruding from the bottom surface 306s of the second polymer substrate 306. The height of the protruding portion 306a may be defined as the absolute value of the difference between the average height of the bottom surface 306s without the protruding portion 306a and the height of the bottom of the protruding portion 306a in the plan view direction VD of the electronic device 30. The related calculation method is described in the relevant and corresponding paragraph of FIG. 1 and will not be described again. By increasing the thickness of the second polymer substrate 306, the protruding height of the protruding portion 306a can be reduced, and the flatness of the bottom surface 306s of the second polymer substrate 306 is improved. In some embodiments, the thickness of the color filter layer 210 may be greater than the height of the protrusion 306a, such that the color filter layer 210 crosses the protrusion 306a. By way of example and without limitation, the height of the protrusion 306a may be, for example, less than 2 μm.

[0031] 9 and 10 are schematic diagrams showing cross-sectional views of electronic devices according to the fourth and fifth embodiments of the present disclosure. In order to clearly show the protruding elements and corresponding protrusions, Fig. 9 and 10 show a single component board, and component layers in the component board are omitted, and the component board in Fig. 9 and 10 takes the above-mentioned first component board as an example but not limited thereto. As shown in Fig. 9, the electronic device 40 of the fourth embodiment includes a protruding element 110, a first polymer substrate 104, and an inorganic layer 422, where the first polymer substrate 104 covers the protruding element 110, and the inorganic layer 422 covers the first polymer substrate 104. Due to the protruding element 110, the first polymer substrate 104 includes a protrusion 104a protruding from the upper surface 104s corresponding to the protruding element 110, and the inorganic layer 422 includes a protrusion 422a protruding from the upper surface 422s of the inorganic layer 422 at the corresponding protruding element 110 and the protrusion 104a. The inorganic layer 422 includes an inorganic material such as silicon oxide, silicon nitride, or a combination thereof. The maximum width W1 of the protrusion 422a of the inorganic layer 422 may be smaller than the maximum width W2 of the protruding element 110, or the maximum height H1 of the protrusion 422a may be smaller than the maximum height H2 of the protruding element 110. In some embodiments, the maximum width W3 of the protrusion 104a of the first polymer substrate 104 may be between the maximum width W2 of the protrusion element 110 and the maximum width W1 of the protrusion 422a of the inorganic layer 422, or may be substantially equal to the maximum width W1 of the protrusion 422a of the inorganic layer 422. Also, the maximum height H3 of the protrusion 104a of the first polymer substrate 104 may be between the maximum height H2 of the protrusion element 110 and the maximum width H1 of the protrusion 422a of the inorganic layer 422, or may be substantially equal to the maximum height H1 of the protrusion 422a of the inorganic layer 422.

[0032] 10, the electronic device 50 of the fifth embodiment is different from the electronic device 40 of the fourth embodiment in that the inorganic layer 422 is replaced with an organic layer 522. The organic layer 522 includes an organic material, such as a photoresist material, PFA, or other suitable organic material, and has fluid properties, so that the upper surface 522s of the formed organic layer 522 has better flatness than the inorganic layer described above, and the maximum width W4 of the protrusion 522a of the organic layer 522 may be smaller than the maximum width W1 of the protrusion 422a of the inorganic layer 422 of the fourth embodiment, or the maximum height H4 of the protrusion 522a may be smaller than the maximum height H1 of the protrusion 422a of the inorganic layer 422 of the fourth embodiment. The maximum width W4 and maximum height H4 of the protrusion 522a of the organic layer 522 may be smaller than the maximum width W2 and maximum height H2 of the protrusion element 110, respectively.

[0033] The method of measuring the height of the top of the protruding element and the height of the top of the protrusion according to the present disclosure will be described in more detail below. Please refer to FIG. 11, which is a schematic diagram showing a plan view of FIG. 9. FIG. 11 takes the inorganic layer 422 of the fourth embodiment as an example, and omits the component layer in the component substrate, but is not limited thereto. For example, based on the same reference height, the absolute value of the difference between the location and the reference height can be calculated to obtain the height of the protrusion 422a described below. The method of measuring the height of the top of the protrusion 422a of the inorganic layer 422 may include determining at least three imaginary line segments passing through the protrusion 422a in the plan view direction VD, and all three imaginary line segments pass through a position close to the center of the protrusion 422a (for example, within a range from a position disposed on the left side of this center away from the center by one-sixth of the width of the protrusion 422a to another position disposed on the right side of this center away from the center by one-sixth of the width of the protrusion 422a, i.e., within a middle portion of one-third of the width of the protrusion 422a). These three virtual line segments may be, for example, a first virtual line segment L1, a second virtual line segment L2, and a third virtual line segment L3, respectively. Then, the absolute value of the difference between the height of the top of the protruding element 110 on each virtual line segment and the reference height is measured, followed by adding and averaging the absolute values ​​(e.g., (PH1+PH2+PH3) / 3), for example, by adding and averaging the first top height PH1 corresponding to the first virtual line segment L1, the second top height PH2 corresponding to the second virtual line segment L2, and the third top height PH3 corresponding to the third virtual line segment L3, to obtain the top height of the protrusion 422a. In some embodiments, the method for measuring the height of the top of the protrusion 422a can also measure the absolute value of the difference between the height of the top of the protrusion 422a on each virtual line segment and a reference height, and the absolute value of the difference between the height of the bottom of the protrusion 422a on each virtual line segment and the reference height, and the absolute value of the difference between the bottom height and the reference height is the bottom height, such as, for example, a first bottom height PL1, a second bottom height PL2 and a third bottom height PL3.Next, the average value of the top height and bottom height of each virtual line segment is calculated, respectively, and then the average values ​​of these virtual line segments are summed and averaged to obtain the average value (e.g., ((PH1+PL1) / 2+(PH2+PL2) / 2+(PH3+PL3) / 2) / 3), thereby obtaining the top height of the protrusion 422a. In one embodiment, the bottom height of the protrusion 422a excludes the edge height of the protrusion 422a. The instrument for measuring the top height and bottom height may be, for example, a confocal microscope. In some embodiments, the above-mentioned method can also measure the top height of the protrusion of the organic layer. In combination with the above method, the top height of the protrusion of the first polymer substrate can also be measured by removing the inorganic or organic layer. In combination with the above method, the top height of the protrusion element can be measured by removing the inorganic or organic layer and the first polymer substrate.

[0034] In summary, in the electronic device disclosed herein, by increasing the first thickness of the first polymer substrate or the second thickness of the second polymer substrate, the protruding height of the protrusion can be reduced, improving the surface flatness of the first polymer substrate or the second polymer substrate, thereby reducing damage to the component layer formed on the first polymer substrate or the second polymer substrate, or by increasing the first thickness of the first polymer substrate or the second thickness of the second polymer substrate, the neutral plane can be adjusted to be adjacent to the first component substrate or the second component substrate, or to be within the first component substrate or the second component substrate, thereby reducing damage to the component during bending or reducing display defects of the display device.

[0035] Those skilled in the art will readily appreciate that numerous modifications and variations of the apparatus and methods may be made while retaining the teachings of this disclosure. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims

1. a component substrate comprising a polymer substrate and a component layer, the component layer being disposed on the polymer substrate; and a neutral surface disposed within the component substrate.

2. 2. The display device of claim 1, wherein the component layer comprises a plurality of thin film transistors.

3. 2. The display device according to claim 1, wherein the polymer substrate has a thickness of 5 μm or more and 45 μm or less.

4. the component layer comprises a black matrix and a color filter layer; The display device, a second component substrate disposed on an opposite side of the first component substrate, the second component substrate comprising a second polymer substrate and a plurality of thin film transistors, the thin film transistors being disposed on the second polymer substrate; a liquid crystal layer disposed between the component substrate and the other component substrate; 2. The display device of claim 1, wherein the another polymer substrate has a first thickness and the polymer substrate has a second thickness, the second thickness being greater than the first thickness.

5. The first thickness and the second thickness are defined by the following formula: [0070] in accordance with 5. The display device according to claim 4, wherein x1 is the first thickness and x2 is the second thickness.

6. 5. The display device according to claim 4, wherein the distance between the neutral plane and the polymer substrate is shorter than the distance between the neutral plane and the other polymer substrate.

7. the polymer substrate has a plurality of protrusions each corresponding to one of the plurality of protrusion elements when the plurality of protrusion elements are disposed on a surface of the polymer substrate; The display device according to claim 4 , wherein the plurality of protrusions protrude from a bottom surface of the polymer substrate.

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