Method for processing workpiece

Abstract

To provide a method for processing a workpiece with which hairline alignment can be easily executed at an arbitrary position.SOLUTION: A method for processing a workpiece comprises: an imaging step 1001 of picking up an image of a workpiece by using an imaging unit; a display step 1002 of displaying the image picked up in the imaging step 1001 on a monitor; a designation step 1003 of designating a processing position in the image displayed on the monitor; a groove forming step 1004 of performing processing at the processing position by using a processing unit to form a positioning groove; a distance registration step 1005 of aligning a reference line of the imaging unit with the positioning groove to register a distance between the positioning groove and the reference line; a processing position setting step 1006 of aligning the reference line with scheduled division lines set on the workpiece to set a position at which processing is to be performed; and a processing step 1007 of locating the processing unit at a position corrected on the basis of the setting in the processing position setting step 1006, and processing the workpiece.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for machining a workpiece. [Background technology]

[0002] When processing to form a machining groove in a workpiece, it is known to perform a so-called hairline alignment, which is a process of aligning a reference line of an imaging unit such as a camera mounted on the processing device with the machining position of a processing unit that processes the workpiece (see, for example, Patent Documents 1 and 2).

[0003] Specifically, this hairline alignment work is performed by first processing the workpiece in a processing unit to form a processing groove, then imaging this processing groove and performing image processing to detect the center of the width of the processing groove, calculating the amount of deviation between the center of the width of the processing groove and the reference line position of the camera, and adding or subtracting this deviation from the coordinate position, thereby storing in the device a corrected position that matches the center of the width of the processing groove with the reference line position of the camera. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6600267 [Patent Document 2] Patent No. 6037705 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when performing hairline alignment by forming a processing groove in the peripheral excess area of ​​the workpiece or in the support tape that supports the workpiece so as not to affect the processing of the workpiece, there was a problem in that setting the processing position was troublesome.

[0006] The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a method for processing a workpiece that allows hairline alignment to be easily performed at any position. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the present invention provides a method for processing a workpiece using a processing device including a holding table for holding a workpiece, a processing unit for processing the workpiece held by the holding table, a moving unit for relatively moving the holding table and the processing unit in a Y direction and an X direction perpendicular to the Y direction, an imaging unit for imaging the workpiece having an optical system in which a reference line for aligning the processing unit is formed in the X direction, a control unit for controlling each component, and a monitor, the method including the steps of: imaging the workpiece with the imaging unit; and displaying the image captured in the imaging step on the monitor. a display step of displaying the image on the monitor; a designation step of designating a processing position in the image displayed on the monitor; a groove forming step of processing the processing position with the processing unit to form an alignment groove; a distance registration step of aligning the reference line of the imaging unit with the alignment groove and registering the distance between the alignment groove and the reference line; a processing position setting step of aligning the reference line with a planned division line set on the workpiece and setting the position to be processed; and a processing step of positioning the processing unit at a position corrected by the distance from the position set in the processing position setting step, and processing the workpiece along the planned division line.

[0008] The designating step may designate the formation position and length of the alignment groove by tracing a line on the image.

[0009] The designation step may include a position selection step of designating the machining position in the image, and a length setting step of numerically setting the length of the alignment groove. Effect of the Invention

[0010] The present invention allows the machining position of an alignment groove for hairline alignment to be easily specified intuitively in an image captured by an imaging unit, making it easy to perform hairline alignment at any position, including the outer peripheral excess area. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a flowchart showing a processing procedure of a method for processing a workpiece according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing an example of a workpiece to be processed by the workpiece processing method according to the first embodiment. [Diagram 3] FIG. 3 is a perspective view showing a configuration example of a processing device for carrying out the method for processing a workpiece according to the first embodiment. [Figure 4] FIG. 4 is a diagram for explaining the imaging steps of FIG. [Diagram 5] FIG. 5 is a diagram for explaining the display steps of FIG. [Figure 6] FIG. 6 is a diagram for explaining the designation step in FIG. [Figure 7] FIG. 7 is a diagram for explaining the designation step of FIG. [Figure 8] FIG. 8 is a diagram for explaining the distance registration step of FIG. [Figure 9] FIG. 9 is a diagram for explaining the distance registration step of FIG. [Figure 10] FIG. 10 is a flowchart showing a processing procedure of a designation step of the method for machining a workpiece according to the second embodiment. [Figure 11] FIG. 11 is a diagram for explaining the designation step of FIG. [Figure 12] FIG. 12 is a perspective view showing a configuration example of a processing device for carrying out the method for processing a workpiece according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0013] [Embodiment 1] A method for processing a workpiece according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a flow chart showing the procedure of the method for processing a workpiece according to the first embodiment. As shown in Fig. 1, the method for processing a workpiece according to the first embodiment includes an imaging step 1001, a display step 1002, a designation step 1003, a groove forming step 1004, a distance registration step 1005, a processing position setting step 1006, and a processing step 1007.

[0014] FIG. 2 is a perspective view showing an example of a workpiece 100 to be processed by the method for processing a workpiece according to the first embodiment. As shown in FIG. 2, the workpiece 100 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose base material is silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like. The workpiece 100 has a flat surface 101, a device region 107 in which chip-shaped devices 103 are formed in each region partitioned by a plurality of dividing lines 102 intersecting each other, and a peripheral surplus region 108 in which no device 103 is formed and which surrounds the periphery of the device region 107. The method for processing a workpiece according to the first embodiment is performed on the workpiece 100 to divide the workpiece 100 along the dividing lines 102, thereby manufacturing chips of a plurality of devices 103.

[0015] The workpiece 100 may have a support tape 105 attached to a back surface 104 behind the front surface 101, and an annular frame 106 may be attached to the outer edge of the support tape 105. That is, the workpiece 100 may be supported and fixed to the opening of the annular frame 106 via the support tape 105. In the present invention, the workpiece 100 may be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic plate, a glass plate, or the like.

[0016] Fig. 3 is a perspective view showing a configuration example of a processing device 1 that performs the workpiece processing method according to embodiment 1. As shown in Fig. 3, the processing device 1 includes a holding table 10, a processing unit 20, an imaging unit 30, a moving unit 40, a monitor 50, and a control unit 60. The processing device 1 performs an imaging step 1001, a display step 1002, a designation step 1003, a groove forming step 1004, a distance registration step 1005, a processing position setting step 1006, and a processing step 1007 of the workpiece processing method according to embodiment 1.

[0017] The holding table 10 is a so-called chuck table that includes a disk-shaped frame body with a recess formed therein and a disk-shaped suction part fitted into the recess. The suction part of the holding table 10 is made of porous ceramics or the like with a large number of porous holes, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction part of the holding table 10 is a holding surface 11 on which the workpiece 100 is placed and which suction-holds the placed workpiece 100 by negative pressure introduced from the vacuum suction source. The holding surface 11 and the upper surface of the frame body of the holding table 10 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The holding table 10 is provided so as to be movable in the X-axis direction (X direction) parallel to the horizontal direction by the X-axis direction moving unit 41 of the moving unit 40. The holding table 10 is provided so as to be rotatable around the Z axis, which is parallel to the vertical direction and perpendicular to the XY plane, by a rotary drive source (not shown).

[0018] In the first embodiment, the processing unit 20 is a cutting unit including a cutting blade 21 and a spindle 22, as shown in FIG. 3. The cutting blade 21 is attached to the tip of the spindle 22, and is rotated by the spindle 22, which serves as a rotation axis, to cut the workpiece 100 held on the holding table 10. The spindle 22 is provided rotatably around an axis parallel to the horizontal direction and parallel to a Y-axis direction (Y direction) perpendicular to the X-axis direction, and rotates around the axis by a motor (not shown) connected to the spindle 22. The spindle 22 supports the cutting blade 21 attached to the tip of the spindle 22 rotatably around an axis parallel to the Y-axis direction. The processing unit 20 is provided to be movable in the Y-axis direction and the Z-axis direction (Z direction) by the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43 of the moving unit 40, respectively. In the first embodiment, as shown in FIG. 3, the processing device 1 is a so-called facing dual type processing device that includes two processing units 20 that are cutting units, that is, a two-spindle dicer.

[0019] The processing unit 20 rotates the cutting blade 21 attached to the tip of the spindle 22 around an axis parallel to the Y-axis direction by the rotational movement of the spindle 22, while moving (processing feed) the cutting blade 21 along the X-axis direction, which is the processing feed direction, relative to the workpiece 100 on the holding table 10 by the X-axis direction moving unit 41, thereby cutting the workpiece 100 with the cutting blade 21 to form a cut groove (machined groove). Similarly, the processing unit 20 also cuts the workpiece 100 along the planned division lines 102 with the cutting blade 21, thereby dividing the workpiece 100 along the planned division lines 102.

[0020] The imaging unit 30 includes an imaging element for imaging the workpiece 100 held on the holding table 10. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 images the surface 101 of the workpiece 100 held on the holding table 10 to obtain an image for performing alignment for positioning the workpiece 100 and the processing unit 20. The imaging unit 30 also images the surface 101 of the workpiece 100 held on the holding table 10 to obtain an image for performing a check for automatically confirming whether or not the processing of the workpiece 100 has been performed within a normal range. In the first embodiment, the imaging unit 30 is fixed adjacent to the processing unit 20 and moves integrally with the processing unit 20.

[0021] The imaging unit 30 has an optical system in which a reference line 31 (see Figs. 8 and 9) for aligning the processing unit 20 is formed along the X-axis direction. The reference line 31 is set inside the imaging unit 30, and can be acquired and displayed superimposed on an image captured by the imaging unit 30. In the first embodiment, the reference line 31 is set as a straight line extending along the X-axis direction, which is the horizontal direction of the image, through the center in the Y-axis direction, which is the vertical direction of the image, in the image captured by the imaging unit 30.

[0022] The moving unit 40 moves the holding table 10 and the processing unit 20 relatively along the X-axis direction, the Y-axis direction, and the Z-axis direction. In the first embodiment, the moving unit 40 has an X-axis direction moving unit 41, a Y-axis direction moving unit 42, and a Z-axis direction moving unit 43, as shown in FIG. 3. The X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 move the holding table 10, the processing unit 20, and the imaging unit 30 relatively in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. In the first embodiment, the X-axis direction moving unit 41 moves the holding table 10 relative to the processing unit 20 and the imaging unit 30 along the X-axis direction. In the first embodiment, the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43 move the processing unit 20 and the imaging unit 30 relative to the holding table 10 along the Y-axis direction and the Z-axis direction, respectively.

[0023] The X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 are all known ball screw mechanisms having a motor, a ball screw, and a guide. The X-axis direction moving unit 41, the Y-axis direction moving unit 42, and the Z-axis direction moving unit 43 each include an encoder that reads the rotational position of the motor, and detects the relative positions of the holding table 10, the processing unit 20, and the imaging unit 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction based on the rotational position of the motor read by the encoder, and outputs the detected relative positions to the control unit 60. Here, the relative positions in the X-axis direction, the Y-axis direction, and the Z-axis direction are provided in the processing device 1, and for example, an apparatus coordinate system (such as an XYZ coordinate system, which is an orthogonal coordinate system, or an RθZ coordinate system, which is a cylindrical coordinate system) with the center of the holding surface 11 of the holding table 10 as the origin is used.

[0024] In addition, the X-axis direction moving unit 41, the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43 are not limited to a configuration in which the relative positions of the holding table 10, the processing unit 20 and the imaging unit 30 are detected by an encoder, and may be configured with linear scales parallel to the X-axis direction, the Y-axis direction and the Z-axis direction, respectively, and a reading head that is freely movable in the X-axis direction, the Y-axis direction and the Z-axis direction by the X-axis direction moving unit 41, the Y-axis direction moving unit 42 and the Z-axis direction moving unit 43, respectively, and that reads the graduations of the linear scale.

[0025] In the first embodiment, as shown in FIG. 3, the monitor 50 is provided on a cover (not shown) of the processing device 1 with the display surface facing outward. The monitor 50 displays a screen for setting various conditions related to various processes of the processing device 1, such as processing by the processing unit 20 and imaging by the imaging unit 30, acquired images and data, various processing results by the control unit 60, etc., so that the operator can visually confirm them. The monitor 50 is configured with a liquid crystal display device or the like. The monitor 50 is provided with an input unit 51 that the operator uses when inputting information related to the above-mentioned various conditions of the processing device 1 and information related to the display of images, etc. The input unit 51 provided on the monitor 50 is configured with at least one of a touch panel provided on the monitor 50, a mouse, a touch pad, a keyboard, etc. Note that the monitor 50 is not fixed to the processing device 1, but is provided on an arbitrary communication device, and the arbitrary communication device may be connected to the processing device 1 wirelessly or by wire.

[0026] The control unit 60 controls the operation of each component of the processing device 1 to cause the processing device 1 to perform various processes including various processes in the processing method for a workpiece according to the first embodiment. In the first embodiment, the control unit 60 includes a computer system. The computer system included in the control unit 60 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device of the control unit 60, and outputs a control signal for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device of the control unit 60.

[0027] Next, this specification will explain the processing method of the workpiece according to the first embodiment based on the drawings. In the processing method of the workpiece according to the first embodiment, before performing the imaging step 1001, a holding step is performed in which the workpiece 100 is held on the holding surface 11 of the holding table 10. In this holding step, specifically, first, the control unit 60 uses a transport unit (not shown) to carry out one workpiece 100 before performing the processing method of the workpiece according to the first embodiment, exposes the front surface 101 upward, and transports the back surface 104 side toward the holding surface 11 of the holding table 10 onto the holding surface 11 of the holding table 10. In this holding step, next, the control unit 60 suction-holds the workpiece 100 transported onto the holding surface 11 by the holding table 10 from the back surface 104 side with the front surface 101 exposed upward.

[0028] Fig. 4 is a diagram for explaining the imaging step 1001 in Fig. 1. The imaging step 1001 is a step of imaging the workpiece 100 by the imaging unit 30. In the imaging step 1001, in the first embodiment, the control unit 60 images an area 111 including a part of the outer peripheral excess area 108 of the surface 101 of the workpiece 100 shown in Fig. 2 by the imaging unit 30, thereby capturing and acquiring an image 121 shown in Fig. 4.

[0029] In embodiment 1, as shown in FIG. 4, image 121 captured in imaging step 1001 captures an area including a portion of the peripheral excess area 108 of workpiece 100 shown in the center of image 121, an area outside the outer edge of workpiece 100 shown on the left side of image 121 (in embodiment 1, the adhesive surface of support tape 105 is shown), and a portion of device area 107 and device 103 of workpiece 100 shown on the right side of image 121.

[0030] Fig. 5 is a diagram for explaining the display step 1002 in Fig. 1. The display step 1002 is a step for displaying the image 121 captured in the imaging step 1001 on the monitor 50. In the display step 1002, in the first embodiment, the control unit 60 generates a screen 131 shown in Fig. 5 based on the image 121 captured in the imaging step 1001 and screen generation data previously stored in the storage device of the control unit 60, transmits it to the monitor 50, and causes the monitor 50 to display it.

[0031] In embodiment 1, as shown in FIG. 5, the screen 131 generated in the display step 1002 and displayed on the monitor 50 displays the image 121 in the upper left corner of the screen 131, displays a button 132 in the lower left corner of the screen 131 for accepting input to move the imaging area of ​​the image 121, and displays a processing position setting input receiving section 133 in the upper right corner of the screen 131 for accepting input for setting the processing position 151 on the surface 101 of the workpiece 100 when forming an alignment groove 141 (see FIG. 8 and FIG. 9) for aligning with the reference line 31.

[0032] In the method for processing a workpiece according to the first embodiment, each time the control unit 60 receives a selection of the button 132 from the operator on the screen 131 displayed on the monitor 50 in the display step 1002, it moves the imaging area of ​​the image 121 in accordance with the selection of the button 132, and for the moved imaging area, it performs the imaging step 1001 again to re-image the image 121, and performs the display step 1002 again to re-generate the screen 131 and re-display it on the monitor 50, thereby re-displaying the image 121 on the monitor 50.

[0033] The designation step 1003 is a step of designating the processing position 151 in the image 121 displayed on the monitor 50. In the designation step 1003, in the first embodiment, when the control unit 60 receives an input from the operator to designate the processing position 151 when forming the alignment groove 141 in the image 121 in the screen 131 displayed on the monitor 50 in the display step 1002, the control unit 60 displays the processing position 151 for which the input has been received in the processing position setting input receiving section 133 in the screen 131. In the designation step 1003, when the ENTER button shown in FIG. 5 is selected in the processing position setting input receiving section 133 in the screen 131 displaying the processing position 151 for which the input has been received, the control unit 60 determines the processing position 151.

[0034] 6 and 7 are diagrams for explaining the designation step 1003 in FIG. 1. In the designation step 1003, in the first embodiment, the operator traces the image 121 in the screen 131 displayed on the monitor 50 in the display step 1002 in a line shape, and the designated input of the processing position 151 is performed based on the traced trajectory 161, and the inputted trajectory 161 is displayed superimposed on the image 121 in the screen 131. For example, when the input unit 51 provided on the monitor 50 is a touch panel, as shown in FIG. 6, the operator traces the area where the image 121 is displayed on the touch panel with his / her finger 200, thereby performing the designated input of the processing position 151. Also, when the input unit 51 provided on the monitor 50 is a mouse or a touch pad, the operator drags the cursor of the mouse or touch pad instead of the finger 200 on the area where the image 121 is displayed, thereby performing the designated input of the processing position 151.

[0035] In the designation step 1003, when the designation input of the machining position 151 is performed based on the traced trajectory 161 as described above, the control unit 60 performs an approximation process to approximate the trajectory 161 to a straight line extending along the X-axis direction based on the information of the trajectory 161 that has been received as input, as shown in Fig. 7, thereby obtaining information on an approximation line 162 that approximates the trajectory 161, and displays the approximation line 162 superimposed on the image 121 in the screen 131. In the designation step 1003, the control unit 60 may, for example, calculate the approximation line 162 that approximates the trajectory 161 using the least squares method in this approximation process, or may calculate the approximation line 162 by detecting the start point and the end point of the trajectory 161 and correcting the start point and the end point to be parallel along the X-axis direction, or may calculate the approximation line 162 that approximates the trajectory 161 by other calculation processes. Here, the control unit 60 may handle information about the approximation line 162 using the start point and end point of the approximation line 162, or may handle information using a function or the like that represents the approximation line 162.

[0036] In the designation step 1003, when the approximation line 162 approximating the traced trajectory 161 is calculated as described above, the control unit 60 performs a groove formation position length calculation process to calculate the formation position 152 and length 153 of the alignment groove 141 based on the approximation line 162, thereby acquiring information on the formation position 152 and length 153 of the alignment groove 141 as information on the processing position 151. In the designation step 1003, for example, in the groove formation position length calculation process, the control unit 60 calculates the center position (coordinates) of the approximation line 162 as the formation position 152 of the alignment groove 141, and calculates the length of the approximation line 162 as the length 153 of the alignment groove 141. In the designation step 1003, the control unit 60 displays the formation position 152 and length 153 of the alignment groove 141 thus calculated on the processing position setting input receiving unit 133 in the screen 131, as shown in FIG. 5.

[0037] In the specification step 1003, in the first embodiment, the worker traces the image 121 in a line as described above to specify the formation position 152 and length 153 of the alignment groove 141 as information on the processing position 151 when forming the alignment groove 141.

[0038] The groove forming step 1004 is a step of processing the processing position 151 by the processing unit 20 to form the alignment groove 141. In the groove forming step 1004, first, the control unit 60 rotates the holding table 10 by a rotation drive source (not shown) of the holding table 10, so that the direction in which the processing position 151 on the surface 101 of the workpiece 100 on the holding table 10 specified in the specification step 1003 extends is parallel to the processing feed direction (X-axis direction), and the moving unit 40 relatively moves the holding table 10 holding the workpiece 100 and the processing unit 20, so that the processing position by the processing unit 20 (cutting position by the cutting blade 21) is positioned at the processing position 151 on the surface 101 of the workpiece 100 on the holding table 10 specified in the specification step 1003, specifically, at a position in the -X direction (opposite to the processing feed direction) by half the length 153 from the forming position 152 by.

[0039] In the groove forming step 1004, next, the control unit 60 rotates the spindle 22 to rotate the cutting blade 21 around an axis parallel to the Y-axis direction, while moving (processing feed) the cutting blade 21 by a length 153 along the X-axis direction, which is the processing feed direction, relative to the workpiece 100 on the holding table 10 using the X-axis moving unit 41, so that the cutting blade 21 cuts a linear area extending by the length 153 in the X-axis direction centered on the processing position 151 of the workpiece 100, more specifically, the formation position 152, to form an alignment groove 141 extending by the length 153 in the X-axis direction.

[0040] Fig. 8 and Fig. 9 are both diagrams for explaining the distance registration step 1005 in Fig. 1. The distance registration step 1005 is a step for aligning the reference line 31 of the imaging unit 30 with the alignment groove 141, and registering the distance 143 (see Fig. 8) between the alignment groove 141 and the reference line 31.

[0041] In distance registration step 1005, after forming alignment groove 141 in groove forming step 1004, first, control unit 60 causes moving unit 40 to relatively move holding table 10 holding workpiece 100 and imaging unit 30, thereby aligning the center of the imaging area of ​​imaging unit 30 with processing position 151 designated in designation step 1003. Specifically, in this process, control unit 60 aligns the center of the imaging area of ​​imaging unit 30 with forming position 152 designated in designation step 1003.

[0042] In the distance registration step 1005, after aligning the center of the imaging area of ​​the imaging unit 30 with the processing position 151 (forming position 152) specified in the specification step 1003, the control unit 60 performs imaging processing using the imaging unit 30 while aligning the center of the imaging area of ​​the imaging unit 30 with the processing position 151 (forming position 152) specified in the specification step 1003, thereby capturing and acquiring an image 122 as shown in FIG. 8.

[0043] In distance registration step 1005, after acquiring image 122, control unit 60 calculates center line 142 (see FIG. 8) that represents the center position of alignment groove 141 in the width direction and is parallel to the X-axis direction based on image 122. In distance registration step 1005, control unit 60 performs binarization processing on image 122, for example, to form a binarized image in which an area where alignment groove 141 is not formed is represented by bright luminance and an area where alignment groove 141 is formed is represented by dark luminance, detects the boundary line between the bright luminance area and the dark luminance area in this binarized image as a line indicating both ends of alignment groove 141 in the width direction, calculates a center line between the lines indicating both ends of alignment groove 141 in the width direction, and calculates center line 142 that is approximate to center line 124 and is parallel to the X-axis direction based on this center line. In the distance registration step 1005, the control unit 60 may use, for example, the least squares method in the approximation process for calculating the center line 142 based on this center line, or may perform the approximation process using other calculation processes.

[0044] In the distance registration step 1005, the control unit 60 calculates a center line 142 that indicates the center position of the alignment groove 141 in the width direction, and then calculates a distance 143 along the Y-axis direction between the calculated center line 142 and the reference line 31 of the imaging unit 30. This distance 143 corresponds to a hairline deviation that is a deviation between the reference line 31 of the imaging unit 30 and a processing position 151 by the processing unit 20 that processes the workpiece 100. Note that the distance 143 includes information on the positional relationship of whether the center line 142 is in the +Y direction or the -Y direction with respect to the reference line 31, and is expressed as a positive value when the center line 142 is in the +Y direction with respect to the reference line 31, and is expressed as a negative value when the center line 142 is in the -Y direction with respect to the reference line 31, for example.

[0045] In the distance registration step 1005, the control unit 60 adds a correction process for setting a position corrected to cancel the distance 143 from the position calculated in the image captured by the imaging unit 30 as the position of the machining unit 20 when positioning the machining unit 20 on the planned division line 102 based on the information of the relative position of the imaging unit 30 with respect to the holding table 10 acquired by the moving unit 40 and the information of the position in the image captured by the imaging unit 30, and registers the execution of the correction process in the storage device of the control unit 60. In the distance registration step 1005, the operator may relatively move the imaging unit 30 and the holding table 10 in the Y direction from the state of FIG. 8 to the state of FIG. 9, and calculate the distance 143 from the amount of movement.

[0046] In the method for processing the workpiece according to embodiment 1, the imaging step 1001, the display step 1002, the specification step 1003, the groove forming step 1004 and the distance registration step 1005 are carried out to perform the so-called hairline alignment, which is the task of aligning the reference line 31 of the imaging unit 30 with the processing position 151 of the processing unit 20 that processes the workpiece 100.

[0047] The processing position setting step 1006 is a step of aligning the reference line 31 with the planned dividing line 102 set on the workpiece 100 and setting the position to be processed. Specifically, in the processing position setting step 1006, the control unit 60 relatively moves the holding table 10 holding the workpiece 100 and the imaging unit 30 by the moving unit 40, thereby aligning the reference line 31 of the imaging unit 30 with one planned dividing line 102 set on the workpiece 100, and registers in the storage device of the control unit 60 that the position on the reference line 31 at the time of alignment should be processed. In the processing position setting step 1006, this registration process is performed on one planned dividing line 102 to be processed, and the positions of the other planned dividing lines 102 are detected along the intervals of the planned dividing lines 102 registered in advance based on the planned dividing line 102 for which the registration process has been performed. In the machining position setting step 1006, the position on the reference line 31 where machining is to be registered is corrected by the distance 143 registered in the distance registration step 1005, and the corrected position is registered as the positioning position of the machining unit 20.

[0048] In the processing position setting step 1006, a registration process is performed in which the position on the reference line 31 where processing is to be registered is corrected by the distance 143 registered in the distance registration step 1005, and the corrected position is registered as the positioning position of the processing unit 20, so that the position to be processed can be registered more accurately.

[0049] The processing step 1007 is a step of positioning the processing unit 20 at a position corrected by a distance 143 from the position set in the processing position setting step 1006, and processing the workpiece 100 along the planned division line 102. In the processing step 1007, first, the control unit 60 rotates the holding table 10 by a rotation drive source (not shown) of the holding table 10, thereby making the planned division line 102 on the surface 101 of the workpiece 100 on the holding table 10 set in the processing position setting step 1006 parallel to the processing feed direction (X-axis direction), and by relatively moving the holding table 10 holding the workpiece 100 and the processing unit 20 by the moving unit 40, the processing position by the processing unit 20 (cutting position by the cutting blade 21) is positioned at the planned division line 102 on the surface 101 of the workpiece 100 on the holding table 10 set in the processing position setting step 1006.

[0050] In processing step 1007, next, the control unit 60 rotates the spindle 22 to rotate the cutting blade 21 around an axis parallel to the Y-axis direction, while moving (processing feed) the cutting blade 21 along the processing feed direction (X-axis direction) relative to the workpiece 100 on the holding table 10 using the X-axis movement unit 41, thereby cutting the workpiece 100 along the planned division lines 102 with the cutting blade 21 to form cut grooves (machined grooves). In processing step 1007, this cutting process is performed one by one on all planned division lines 102 to be processed.

[0051] In the processing step 1007, the position to be processed is corrected to the position corrected to cancel the distance 143 in the processing position setting step 1006 as the positioning position of the processing unit 20, and then the registered position to be processed is processed, so that the cutting groove (machined groove) can be formed at a more accurate position.

[0052] The method for processing the workpiece of embodiment 1 having the above-mentioned configuration has the effect of making it possible to easily and intuitively specify the processing position 151 of the alignment groove 141 for hairline alignment in the image 121 captured by the imaging unit 30, and therefore to easily perform hairline alignment at any position including the outer peripheral excess region 108.

[0053] Conventionally, alignment groove 141 for hairline alignment was set longer than necessary because it was assumed that cutting processing would be completed from one end of workpiece 100 to the other end according to the size (size, diameter, wafer size) of workpiece 100. Therefore, in the method for processing a workpiece according to embodiment 1, processing position 151 of alignment groove 141 for hairline alignment can be easily specified intuitively, so alignment groove 141 can be set to the required length that is shorter than in the past.

[0054] Furthermore, in the method for processing the workpiece according to the first embodiment, in the specification step 1003, the formation position 152 and length 153 of the alignment groove 141 are specified by tracing a line on the image 121, so that the processing position 151 of the alignment groove 141 for hairline alignment can be specified more intuitively and easily.

[0055] In the method for processing the workpiece according to embodiment 1, the alignment groove 141 is formed in either the peripheral excess region 108 of the workpiece 100 where the device 103 is not formed, or in the support tape 105 which supports the workpiece 100 and the annular frame 106 together while positioning the workpiece 100 in the central opening of the annular frame 106. However, the present invention is not limited to this, and the alignment groove 141 may also be formed on the planned division line 102 of the device region 107.

[0056] [Embodiment 2] A method for processing a workpiece according to a second embodiment of the present invention will be described. Fig. 10 is a flowchart showing the processing procedure of step 1003 for designating a method for processing a workpiece according to the second embodiment. Fig. 11 is a diagram for explaining step 1003 for designating in Fig. 10. In Figs. 10 and 11, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0057] The method for processing a workpiece according to the second embodiment is obtained by changing the designation step 1003 in the method for processing a workpiece according to the first embodiment, and other configurations are the same as those of the method for processing a workpiece according to the first embodiment. The designation step 1003 of the second embodiment includes a position selection step 1011 and a length setting step 1012, as shown in FIG.

[0058] The position selection step 1011 is a step of designating the processing position 151 in the image 121. In the position selection step 1011, in the second embodiment, the operator selects a desired position on the image 121 in the screen 131 displayed on the monitor 50 in the display step 1002, and based on the selected position, a designation input of a forming position 152 included in the processing position 151 is performed, and the processing position setting input receiving unit 133 in the screen 131 displays the input-accepted forming position 152, and displays a mark 163 indicating the input-accepted forming position 152 superimposed on the image 121 in the screen 131.

[0059] In the position selection step 1011, for example, when the input unit 51 provided on the monitor 50 is a touch panel, the operator touches a desired position in the area where the image 121 is displayed on the touch panel with a finger 200, as shown in Fig. 11, to specify the formation position 152. When the input unit 51 provided on the monitor 50 is a mouse or a touchpad, the operator clicks a desired position in the area where the image 121 is displayed with a cursor of the mouse or touchpad instead of the finger 200, to specify the formation position 152. Note that, in the example of the second embodiment shown in Fig. 11, the formation position 152 is the center position of the processing position 151, but is not limited to this in the present invention, and may be any position that serves as a reference for the processing position 151, such as the start point position or end point position of the processing position 151.

[0060] The length setting step 1012 is a step for numerically setting the length 153 of the alignment groove 141. In the length setting step 1012, the operator inputs the length 153 of the alignment groove 141 as a numerical value in the processing position setting input receiving section 133 on the screen 131, whereby the length 153 is set based on the input numerical value, and a virtual line 164 of the length 153 whose center is the formation position 152 and whose input has been received is displayed superimposed on the image 121 on the screen 131.

[0061] In the specification step 1003, and after performing the position selection step 1011 and the length setting step 1012, the control unit 60 further determines the formation position 152 and length 153 (processing position 151) when the ENTER button shown in FIG. 5 is selected in the processing position setting input receiving section 133 in the screen 131 displaying the formation position 152 and length 153 for which input has been received, and receives an input to determine the displayed formation position 152 and length 153.

[0062] The method of processing a workpiece according to the second embodiment having the above-mentioned configuration is the same as the method of processing a workpiece according to the first embodiment, except that in the designation step 1003, the form in which the processing position 151 is selected is changed from tracing a line to selecting a formation position 152 (any position that can be a reference position for the formation position 152, such as the center position, the start position, the end position, etc.) and inputting the length 153 numerically. As in the first embodiment, the processing position 151 of the alignment groove 141 for hairline alignment can be easily and intuitively designated in the image 121 captured by the imaging unit 30, thereby achieving the same effect as the first embodiment.

[0063] Furthermore, the method for processing a workpiece according to the second embodiment is the same as the method for processing a workpiece according to the first embodiment, except that, instead of inputting the length 153 by tracing a line, the length 153 is input as a numerical value. This reduces the risk that the length 153 of the alignment groove 141 will be erroneously set longer than necessary due to an error in the input unit 51, etc.

[0064] [Embodiment 3] A method for processing a workpiece according to embodiment 3 of the present invention will be described. Fig. 12 is a perspective view showing a configuration example of a processing device 1-2 for carrying out the method for processing a workpiece according to embodiment 3. In Fig. 12, the same parts as those in embodiments 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0065] The method for processing a workpiece according to embodiment 3 is a modification of the method for processing a workpiece according to embodiments 1 and 2, in which instead of using the processing device 1, a processing device 1-2 shown in FIG. 12 is used.

[0066] 12, the processing device 1-2 includes a holding table 10, a processing unit 20-2, an imaging unit 30, a moving unit 40, a monitor 50, and a control unit 60. The processing device 1-2 is obtained by changing the processing unit 20 in the processing device 1 used in the first and second embodiments to a processing unit 20-2, and by changing the specifications of the moving unit 40 in accordance with this change. In the processing device 1-2, the holding table 10 is provided so as to be freely movable in the X-axis direction and the Y-axis direction by an X-axis direction moving unit 41 and a Y-axis direction moving unit 42, respectively.

[0067] 12, the processing unit 20-2 is a laser processing unit equipped with a laser beam applicator that applies a laser beam to the workpiece 100. In the processing unit 20-2, a collector that collects the laser beam applied from the laser beam applicator toward the workpiece 100 is provided so as to be movable in the Z-axis direction by the Z-axis direction moving unit 43 of the moving unit 40.

[0068] The machining unit 20-2 uses a laser beam emitter to irradiate the workpiece 100 held on the holding table 10 with a laser beam of a wavelength that is absorbed by the workpiece 100, while using the X-axis movement unit 41 to move (machine feed) the workpiece 100 on the holding table 10 along the machining feed direction relative to the collector of the laser beam emitter, thereby ablating (sublimating or evaporating) the workpiece 100 with the laser beam, and ablating the workpiece 100 held on the holding table 10 to form a machined groove.

[0069] In addition, the machining unit 20-2 uses a laser beam irradiator to irradiate the workpiece 100 held on the holding table 10 with a laser beam having a wavelength that is transparent to the workpiece 100, while moving the workpiece 100 on the holding table 10 along the machining feed direction relative to the condenser of the laser beam irradiator (machining feed) with the X-axis movement unit 41, thereby forming a machining groove consisting of a modified layer and cracks extending from the modified layer toward the front and back surfaces of the workpiece 100 along the planned division line 102 inside the workpiece 100 with the laser beam. Here, the modified layer means a region in which the density, refractive index, mechanical strength, and other physical properties are different from those of the surroundings, and examples thereof include a melting treatment region, a crack region, an insulation breakdown region, a refractive index change region, and a region in which these regions are mixed. This machining groove becomes a division starting point for dividing the workpiece 100 along the planned division line 102 by performing a grinding process or other division processes such as expanding.

[0070] In the third embodiment, the X-axis direction moving unit 41 and the Y-axis direction moving unit 42 move the holding table 10 relative to the processing unit 20-2 and the imaging unit 30 along the X-axis direction and the Y-axis direction, respectively. In the third embodiment, the Z-axis direction moving unit 43 moves the collector of the processing unit 20-2 and the imaging unit 30 relative to the holding table 10 along the Z-axis direction.

[0071] The workpiece processing method of embodiment 3 is the same as that of embodiment 1 and embodiment 2, except that groove forming step 1004 and processing step 1007 are both modified so that alignment groove 141 and processing groove similar to those of embodiment 1 and embodiment 2 are formed by irradiating workpiece 100 with a laser beam having a wavelength absorbed by the workpiece by processing unit 20-2, and the other configurations are similar to those of embodiment 1 and embodiment 2.

[0072] The method for processing a workpiece according to the third embodiment having the above-mentioned configuration is a modification of the method for processing a workpiece according to the first and second embodiments, in which, instead of forming the alignment groove 141 and the processing groove with the cutting blade 21 of the processing unit 20, the alignment groove 141 and the processing groove are formed by irradiating the workpiece 100 with a laser beam having a wavelength that is absorbed by the workpiece 100 by the processing unit 20-2. As in the first and second embodiments, the processing position 151 of the alignment groove 141 for hairline alignment can be easily and intuitively specified in the image 121 captured by the imaging unit 30, and therefore the same effect as in the first and second embodiments is achieved.

[0073] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0074] 1,1-2 Processing equipment 10 Holding table 20,20-2 Processing unit 30 Imaging unit 31 Reference Line 40 Mobile Units 50 Monitors 60 Control Unit 100 Workpiece 102 Division line 121,122 images 141 Alignment groove 143 distance 151 Processing position 152 Formation position 153 Length 1001 Imaging Steps 1002 display steps 1003 Designated Step 1004 Groove formation step 1005 Distance registration step 1006 Processing position setting step 1007 Processing Steps 1011 Position selection step 1012 Length setting step

Claims

1. A holding table for holding the workpiece; a processing unit that processes the workpiece held by the holding table; a moving unit that moves the holding table and the processing unit relatively in a Y direction and an X direction perpendicular to the Y direction; an imaging unit having an optical system in which a reference line for aligning the processing unit is formed in the X direction and imaging the workpiece; A control unit for controlling each of the components; A monitor and A method for processing a workpiece using a processing apparatus comprising: an imaging step of imaging a workpiece by the imaging unit; a display step of displaying the image captured in the imaging step on the monitor; A designation step of designating a processing position on the image displayed on the monitor; a groove forming step of forming an alignment groove by processing the processing position with the processing unit; a distance registration step of aligning the reference line of the imaging unit with the alignment groove and registering a distance between the alignment groove and the reference line; a processing position setting step of aligning the reference line with a planned dividing line set on the workpiece and setting a position to be processed; a processing step of positioning the processing unit at a position corrected by the distance from the position set in the processing position setting step, and processing the workpiece along the planned dividing line; A method for processing a workpiece comprising the steps of:

2. 2. The method for machining a workpiece according to claim 1, wherein the designating step designates the formation position and length of the alignment groove by tracing a line on the image.

3. The designation step includes: a position selection step of designating the processing position in the image; a length setting step of setting a length of the alignment groove by a numerical value; The method for processing a workpiece according to claim 1 , comprising:

Images