Die device
The mold device addresses the challenge of adhesive filling and solidification time by using a guide post and guide bush with tapered parts for easy alignment and fixation, enabling rapid installation without adhesive.
Patent Information
- Application Number
- JP2023102991
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-23
- Publication Date
- 2025-01-09
- Estimated Expiration
- 2043-06-23
AI Technical Summary
The challenge in existing mold devices is the difficulty in filling adhesive into the small gap between the inner wall of the movable mold's mounting hole and the guide bush's outer peripheral surface, which takes time for solidification.
The mold device incorporates a guide post and guide bush with tapered portions and pins that allow for easy alignment and fixation without adhesive, using relative movement and eccentric contact between the tapered parts.
Facilitates quick and easy installation of the guide bush by eliminating the need for adhesive filling and solidification time, enhancing efficiency.
Smart Images

Figure 2025002670000001_ABST
Abstract
Description
[Technical field]
[0001] The present disclosure relates to a mold apparatus. [Background technology]
[0002] The device disclosed in Patent Document 1 includes a fixed mold and a movable mold. A guide pin is fixed to the fixed mold. The movable mold has an attachment hole in which a guide bush is attached. The movable mold moves relative to the fixed mold, guided by the guide pin and guide bush. In the manufacturing method of the device disclosed in Patent Document 1, after the movable mold and the fixed mold are positioned and overlapped, an adhesive is filled in the gap between the inner wall of the attachment hole and the outer peripheral surface of the guide bush and hardened. This fixes the guide bush to the movable mold. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-300435 Summary of the Invention [Problem to be solved by the invention]
[0004] The present inventors have discovered the following technical problems. In such a device, in order to fix the guide bush to the movable die, it is necessary to fill the gap between the inner wall of the mounting hole of the movable die and the outer circumferential surface of the guide bush with adhesive and then harden it. Because this gap is small, it is not easy to fill the adhesive. In addition, it takes time for the adhesive to harden.
[0005] The present disclosure has been made in consideration of the above-mentioned problems, and provides a die apparatus that can easily install a guide bush in a short period of time. [Means for solving the problem]
[0006] The mold apparatus according to the present disclosure is Upper mold and The lower mold and A guide post provided on one of the lower mold and the upper mold; a guide bush provided on the other of the lower mold and the upper mold, the other of the lower die and the upper die has a contact surface that comes into contact with a flange of the guide bush, the upper die and the lower die are guided by the guide post and the guide bush and are relatively movable in a die device, At least three tapered portions provided on the contact surface; At least three tapered pins are provided on the flange of the guide bush and have a shape capable of surface contact with the tapered portion, The upper die and the lower die are moved relative to each other to align the guide bush, and the guide bush is placed on the other of the lower die and the upper die while the tapered portion and the tapered pin remain eccentric. Effect of the Invention
[0007] According to the present disclosure, the guide bush can be easily installed in a short time. [Brief description of the drawings]
[0008] [Figure 1] 1 is a cross-sectional view showing a mold device according to a first embodiment. [Diagram 2] 3 is an enlarged cross-sectional view of a region A of the mold device according to the first embodiment. FIG. [Diagram 3] 3 is a cross-sectional view of a main part of a die device according to embodiment 1 taken along line III-III. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0009] Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In addition, the following description and drawings are appropriately simplified for clarity of explanation.
[0010] <Embodiment 1> A first embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a cross-sectional view showing a die device according to the first embodiment. Fig. 2 is an enlarged cross-sectional view of an area A of the die device shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III of a main part of the die device shown in Fig. 1.
[0011] Naturally, the right-handed XYZ coordinate system shown in Fig. 1 and other drawings is for the convenience of explaining the positional relationship of the components. Usually, the Z axis positive direction is vertically upward, and the XY plane is a horizontal plane, which is common among the drawings. Also, for ease of viewing, hatching has been omitted in Fig. 3.
[0012] As shown in FIGS. 1 and 2, a mold device 10 includes an upper mold 1, a lower mold 2, a guide post 3, a guide bush 4, a taper pin 5, and a taper portion 6. As shown in FIG.
[0013] The lower die 2 is held by a press device (not shown) so as to be fixed at a predetermined position. As shown in Fig. 1, the upper die 1 is disposed above the lower die 2. The upper die 1 and the lower die 2 are held by a press device (not shown) so as to be movable relative to each other.
[0014] The upper die 1 includes a die set 1a, a plate 1b, and a punch 1c. The plate 1b is held by a press device (not shown) via the die set 1a. A knock 1d is inserted between the die set 1a and the plate 1b. The knock 1d fixes the position of the plate 1b relative to the die set 1a. The plate 1b holds a punch 1c. The punch 1c protrudes from the plate 1b toward the lower die 2 (here, in the negative Z-axis direction).
[0015] The lower die 2 includes a die set 2a and a plate 2b. The plate 2b is held by a press device (not shown) via the die set 2a. A knock 2d is inserted between the die set 2a and the plate 2b. The knock 2d fixes the position of the plate 2b relative to the die set 2a. The die set 2a and the plate 2b have a punch hole 2c. The punch hole 2c extends on the axis Z0 and penetrates the die set 2a and the plate 2b. The punch hole 2c has a size capable of accommodating a punch 1c. A workpiece WK can be placed between the punch hole 2c and the punch 1c. The size of the punch hole 2c may be set, for example, so that the punch 1c can punch the workpiece WK with a punching clearance CL.
[0016] The guide post 3 is provided on the die set 2a. The guide post 3 is spaced apart from the plate 2b. The guide post 3 protrudes along the axis Z4 toward the upper die 1 (here, in the positive direction of the Z axis).
[0017] The guide bush 4 is provided in the die set 1a. The guide bush 4 is spaced apart from the plate 1b. The guide bush 4 includes a main body 4a and a flange 4b. The main body 4a is a cylindrical body. The main body 4a protrudes toward the lower die 2 (here, in the negative direction of the Z axis). The flange 4b is a plate-like body protruding from one end of the main body 4a to the outside of the main body 4a. The flange 4b may extend in an annular shape. As shown in FIG. 2, the die set 1a has a contact surface 1e that contacts the flange 4b. The flange 4b and the die set 1a may be bolted together. This bolting prevents the flange 4b of the guide bush 4 from being separated from the die set 1a. In addition, the frictional force between the die set 1a and the flange 4b is increased, and the guide bush 4 is prevented from being displaced from a predetermined position.
[0018] At least three taper pins 5 are provided on the flange 4b of the guide bush 4. The taper pins 5 protrude along the Z5 axis.
[0019] At least three tapered portions 6 are provided on the contact surface 1e of the die set 1a. Specifically, the die set 1a has at least three through holes 1f. Each through hole 1f is arranged on the contact surface 1e. At least three tapered portions 6 and plugs 7 are inserted into each of the at least three through holes 1f. Each plug 7 blocks the upper side (here, the positive direction of the Z axis) of each through hole 1f, suppressing each tapered portion 6 from moving upward in each through hole 1f. Each through hole 1f also extends along the Z6 axis. Similarly, the tapered portion 6 extends along the Z6 axis. Each tapered portion 6 has a concave surface 6a that is concave toward the center of the tapered portion 6.
[0020] The tapered pin 5 has a shape that allows surface contact with the tapered portion 6. Specifically, the tip surface 5a of the tapered pin 5 has a shape that allows contact with the concave surface 6a of the tapered portion 6. The tip surface 5a of the tapered pin 5 is, for example, substantially conical or substantially truncated conical. The concave surface 6a of the tapered portion 6 has a shape that is recessed toward the center of the tapered portion 6, for example, substantially conical or substantially truncated conical.
[0021] The tapered portion 6 and the tapered pin 5 are eccentric. Specifically, the axis Z5 of the tapered pin 5 is disposed at a position spaced a predetermined distance away from the axis Z6 of the tapered portion 6 toward the radial outside of the body 4a of the guide bush 4. An example of the axis Z5 of the tapered pin 5 shown in FIG. 2 is disposed at a position spaced a predetermined distance DS away from the axis Z6 of the tapered portion 6 in the negative direction of the X-axis.
[0022] The tapered portions 6 are preferably arranged at equal intervals on a circle centered on the axis Z4 of the main body 4a of the guide bush 4. In the example shown in Fig. 3, four tapered portions 6 are provided on the contact surface 1e of the die set 1a. The tapered portions 6 are arranged at equal intervals on a circle centered on the axis Z4 of the main body 4a of the guide bush 4.
[0023] As described above, the taper pin 5 is in surface contact with the taper portion 6. The taper portion 6 and the taper pin 5 are eccentric. The taper portions 6 are arranged at equal intervals on a circle centered on the axis Z4 of the main body 4a of the guide bush 4. As a result, the taper portions 6 support the guide bush 4 via the taper pins 5. As a result, it is possible to suppress misalignment of the guide bush 4, specifically, misalignment of the guide bush 4 relative to the die set 1a.
[0024] The upper die 1 and the lower die 2 are guided by the guide post 3 and the guide bush 4 and can move relative to each other. Specifically, when the upper die 1 and the lower die 2 are pressed together, first, the upper die 1 and the lower die 2 approach each other with the guide post 3 remaining inserted in the main body 4a of the guide bush 4. The guide post 3 and the guide bush 4 guide the upper die 1 and the lower die 2, and when the upper die 1 and the lower die 2 are pressed together, the punch hole 2c accommodates the punch 1c.
[0025] <Installation method> Next, a method for installing the guide bush 4 will be described.
[0026] First, the filling plug 7 is loosened (step ST1). This causes the filling plug 7 to move upward in the through hole 1f and separate from the tapered portion 6. The tapered portion 6 is released from the constraint imposed by the filling plug 7 and can move within the through hole 1f.
[0027] Next, the upper die 1 and the lower die 2 move relative to each other to align the guide bush 4 (step ST2). Specifically, the upper die 1 and the lower die 2 are pressed together so that the punch 1c is accommodated in the punch hole 2c. Then, the guide post 3 is inserted into the main body 4a of the guide bush 4, and the guide bush 4 moves to a position corresponding to the guide post 3 as the guide post 3 is inserted. This makes it possible to align the position of the guide bush 4 with respect to the upper die 1 so that the guide post 3 and the guide bush 4 can guide the upper die 1 and the lower die 2.
[0028] Finally, the plug 7 is tightened (step ST3). As a result, the plug 7 moves downward in the through hole 1f and presses against the tapered portion 6. Furthermore, the tapered portion 6 moves downward in the through hole 1f and presses against the tapered pin 5. Each tapered pin 5 is in surface contact with each tapered portion 6. Specifically, the tip surface 5a of the tapered pin 5 is in surface contact with the concave surface 6a of the tapered portion 6. Each tapered portion 6 is in surface contact with each tapered pin 5, so that the guide bush 4 is fixed while the position of the guide bush 4 is aligned with respect to the upper mold 1. The guide bush 4 is installed in the upper mold 1 while the tapered portion 6 and the tapered pin 5 are eccentric. If the plug 7 is marked, it may be possible to easily check the degree of loosening of the plug 7. In addition, it may be possible to again align the position of the guide bush 4 with respect to the upper mold 1 by tightening the plug 7 according to the degree of loosening.
[0029] In this manner, the guide bush 4 can be installed in the upper die 1. In this installation method, the guide bush 4 can be installed in the upper die 1 by relatively moving the upper die 1 and the lower die 2 and loosening and tightening the plug 7 without using adhesive. This eliminates the need to fill and harden the adhesive. Therefore, the guide bush 4 can be easily installed in the upper die 1 in a short time.
[0030] The present invention is not limited to the above-mentioned embodiment, and can be appropriately modified without departing from the spirit of the present invention. The present invention may be implemented by appropriately combining the above-mentioned embodiment and examples thereof. In the die device 10 according to the above-mentioned embodiment 1, the guide bush 4 is provided in the die set 1a of the upper die 1, and the guide post 3 is provided in the die set 2a of the lower die 2. However, the guide post 3 may be provided in the die set 1a of the upper die 1, and the guide bush 4 may be provided in the die set 2a of the lower die 2. [Explanation of symbols]
[0031] 10. Mold Equipment 1 Upper mold 1a Die set 1b Plate 1c Punch 1d Knock 1e Contact surface 1f through hole 2 Lower mold 2a Die set 2b Plate 2d Knock 3. Guidepost 4 Guide bush 4a Main unit 4b flange 5 Taper pin 5a Tip surface 6 Tapered section 6a concave 7 Filler plug CL Clearance DS Interval WK Work
Claims
[Claim 1] Upper mold and The lower mold and A guide post provided on one of the lower mold and the upper mold; a guide bush provided on the other of the lower mold and the upper mold, the other of the lower die and the upper die has a contact surface that comes into contact with a flange of the guide bush, the upper die and the lower die are guided by the guide post and the guide bush and are relatively movable in a die device, At least three tapered portions provided on the contact surface; At least three tapered pins are provided on a flange of the guide bush and have a shape capable of surface-contacting with the tapered portion, the upper die and the lower die are moved relative to each other to align the guide bush, and the guide bush is installed in the other of the lower die and the upper die while the tapered portion and the tapered pin are kept eccentric. Mold equipment.
Citation Information
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