Resin composition

Abstract

To provide a novel resin composition capable of giving a cured product which exhibits good dielectric characteristics, has good smear removability, and also has good crack resistance.SOLUTION: The resin composition contains (A) an epoxy resin, (B) an active ester resin, and (C) a (meth)acrylate compound having a C10 or higher aliphatic group.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition, and further to a resin sheet, a cured product, a circuit board, and a semiconductor device. [Background technology]

[0002] Resin compositions containing epoxy resins and their curing agents produce cured products with excellent insulation properties, heat resistance, adhesion, and other properties, and therefore have been widely used as insulating materials for circuit boards such as printed wiring boards and rewiring boards for semiconductor chip packages.

[0003] On the other hand, with the recent increase in communication speed, insulating materials for circuit boards are required to have excellent dielectric properties (low dielectric tangent) in order to reduce transmission loss when they are operated in a high-frequency environment. As insulating materials with excellent dielectric properties, those that use specific curing agents such as active ester resins that can reduce or suppress the generation of polar groups such as secondary hydroxyl groups in the curing reaction of epoxy resins have been reported (for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-157027 A [Patent Document 2] JP 2020-94213 A Summary of the Invention [Problem to be solved by the invention]

[0005] In this regard, if an active ester resin is blended to such an extent that good dielectric properties are achieved, there is a tendency that smear removability during desmear treatment deteriorates and cracks are more likely to occur after desmear treatment.

[0006] An object of the present invention is to provide a novel resin composition which can provide a cured product having good dielectric properties, good smear removability, and good crack resistance. [Means for solving the problem]

[0007] As a result of intensive investigations, the present inventors have found that the above problems can be solved by a resin composition having the following configuration, and have completed the present invention.

[0008] That is, the present invention includes the following. [1] (A) epoxy resin, (B) an active ester resin, and (C) (Meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms A resin composition comprising: [2] The resin composition according to [1], wherein a mass ratio of the component (B) to the component (A) [component (B) / component (A)] is 0.8 or more. [3] The resin composition according to [1] or [2], wherein the content of the component (C) is 0.5% by mass or more when the resin component in the resin composition is 100% by mass. [4] The resin composition according to any one of [1] to [3], wherein the component (C) contains a divalent aliphatic group represented by the following formula (1): [ka] (In formula (1), A C each independently represents a single bond or a divalent aliphatic group, Ring Z C represents an aliphatic ring which may have a substituent, * represents a bond. 2 A's C and Ring Z C The total number of carbon atoms is 10 or more.) [5] The resin composition according to any one of [1] to [4], wherein the component (C) has a structure represented by the following formula (C1): [ka] (In formula (C1), Each X independently represents a (meth)acryloyl group; A 1 each independently represents a divalent aliphatic group, A 2 each independently represents a divalent aliphatic group having 10 or more carbon atoms, L 1 each independently represents a divalent linking group, n1 represents a number equal to or greater than 1.) [6] The resin composition according to any one of [1] to [5], wherein the component (C) has a structure represented by the following formula (C1-1): [ka] (In formula (C1-1), Each X independently represents a (meth)acryloyl group; A 11 each independently represents an alkylene group having 1 to 12 carbon atoms, A 21 each independently represents an alkylene group having 1 to 12 carbon atoms or an alkenylene group having 2 to 12 carbon atoms, Ring Z 1 each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, Ring Z 2 each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent, n11 represents a number from 1 to 10.) [7] In formula (C1-1), Each X independently represents a (meth)acryloyl group; A 11represents an alkylene group having one carbon atom, A 21 represents an alkylene group having 7 carbon atoms, Ring Z 1 represents a tricyclodecane ring, Ring Z 2 represents a cyclohexane ring substituted with two alkyl groups having 5 to 8 carbon atoms, The resin composition according to [6], wherein n11 represents a number from 1 to 5. [8] The resin composition according to any one of [1] to [7], further comprising (E) an inorganic filler. [9] The resin composition according to [8], wherein the content of the component (E) is 40 mass% or more when the nonvolatile components in the resin composition are 100 mass%.

[10] The resin composition according to any one of [1] to [9], further comprising (F) a compound having a radically polymerizable unsaturated group (excluding the component (C)).

[11] The resin composition according to any one of [1] to

[10] , which is for use in an insulating layer of a circuit board.

[12] A resin sheet comprising a support and a layer of the resin composition according to any one of [1] to

[11] provided on the support.

[13] The resin sheet according to

[12] , wherein the support is a thermoplastic resin film or a metal foil.

[14] A cured product of the resin composition according to any one of [1] to

[11] .

[15] A circuit board comprising an insulating layer made of a cured product of the resin composition according to any one of [1] to

[11] .

[16] A semiconductor device comprising the circuit board according to

[15] . Effect of the Invention

[0009] According to the present invention, it is possible to provide a novel resin composition which can give a cured product which exhibits good dielectric properties, good smear removability, and good crack resistance. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] <Terminology explanation> In this specification, the term "aliphatic group" refers to a group obtained by removing one or more hydrogen atoms from an aliphatic compound. In particular, a monovalent aliphatic group refers to a group obtained by removing one hydrogen atom from an aliphatic compound, and a divalent aliphatic group refers to a group obtained by removing two hydrogen atoms from an aliphatic compound. Here, the aliphatic compound may be a heteroatom-free aliphatic compound composed only of carbon atoms and hydrogen atoms, or a heteroatom-containing aliphatic compound composed of carbon atoms and hydrogen atoms as well as heteroatoms. In this specification, the term "heteroatom" refers to an atom other than carbon atoms and hydrogen atoms, and examples thereof include oxygen atoms, nitrogen atoms, sulfur atoms, silicon atoms, halogen atoms, and the like.

[0011] In the present specification, the term "aliphatic hydrocarbon group" refers to a group obtained by removing one or more hydrogen atoms from an aliphatic compound that does not contain a heteroatom and is composed only of carbon atoms and hydrogen atoms. In particular, a monovalent aliphatic hydrocarbon group refers to a group obtained by removing one hydrogen atom from an aliphatic compound that does not contain a heteroatom, and a divalent aliphatic hydrocarbon group refers to a group obtained by removing two hydrogen atoms from an aliphatic compound that does not contain a heteroatom. Examples of monovalent aliphatic hydrocarbon groups include an alkyl group that may have a substituent, a cycloalkyl group that may have a substituent, an alkenyl group that may have a substituent, a cycloalkenyl group that may have a substituent, and an alkapolyenyl group that may have a substituent (the number of double bonds is preferably 2 to 10, more preferably 2 to 6, even more preferably 2 to 4, and even more preferably 2), and may be a combination of two or more of these. Examples of the divalent aliphatic hydrocarbon group include an alkylene group which may have a substituent, a cycloalkylene group which may have a substituent, an alkenylene group which may have a substituent, a cycloalkenylene group which may have a substituent, and an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 10, more preferably 2 to 6, even more preferably 2 to 4, and even more preferably 2), and may be a combination of two or more of these. Here, the alkyl group, the alkenyl group, the alkapolyenyl group, the alkylene group, the alkenylene group, and the alkapolyenylene group may be either linear or branched. In this specification, the number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 or more, more preferably 2 or more or 3 or more, and is preferably 100 or less, more preferably 80 or less, even more preferably 60 or less, 50 or less, or 40 or less, unless otherwise specified. The number of carbon atoms does not include the number of carbon atoms of the substituent.

[0012] In this specification, the term "heteroatom-containing aliphatic group" refers to a group obtained by removing one or more hydrogen atoms from an aliphatic compound containing a heteroatom. In detail, a monovalent heteroatom-containing aliphatic group refers to a group obtained by removing one hydrogen atom from an aliphatic compound containing a heteroatom, and a divalent heteroatom-containing aliphatic group refers to a group obtained by removing two hydrogen atoms from an aliphatic compound containing a heteroatom. In the "heteroatom-containing aliphatic group" in this specification, the heteroatom may be bonded to any of the carbon atoms constituting the group, for example, (i) it may be bonded to a terminal carbon, or (ii) it may be interposed between carbon-carbon bonds. In addition, in the "heteroatom-containing aliphatic group" in this specification, the bond may extend from a carbon atom or from a heteroatom. The heteroatom-containing aliphatic group may be either a saturated or unsaturated heteroatom-containing aliphatic group, and may have a cyclic structure. Examples of the monovalent heteroatom-containing aliphatic group include a heteroalkyl group which may have a substituent, a heteroalkenyl group which may have a substituent, a heteroalkynyl group which may have a substituent, a heteroalkapolyenyl group which may have a substituent, and a monovalent aliphatic heterocyclic group which may have a substituent, and may be a combination of two or more of these. Examples of the monovalent heteroatom-containing aliphatic group also include a monovalent group formed by bonding a divalent group selected from the group consisting of -O-, -S-, -C(=O)-, -S(=O)-, -S(=O)2-, -N(R')-, -Si(R')2-, and combinations thereof to a bond of a monovalent aliphatic carbocyclic group or a monovalent aliphatic heterocyclic group (wherein R' represents a hydrogen atom or a substituent described below. The same applies below). Examples of the divalent heteroatom-containing aliphatic group include a heteroalkylene group which may have a substituent, a heteroalkenylene group which may have a substituent, a heteroalkynylene group which may have a substituent, a heteroalkapolyenylene group which may have a substituent, and a divalent aliphatic heterocyclic group which may have a substituent, and may be composed of a combination of two or more of these.The divalent heteroatom-containing aliphatic group may also be a divalent group formed by bonding at least one bond of a divalent aliphatic carbocyclic group or a divalent aliphatic heterocyclic group to a divalent group selected from the group consisting of -O-, -S-, -C(=O)-, -S(=O)-, -S(=O)2-, -N(R')-, -Si(R')2-, and combinations thereof. In this specification, the number of heteroatoms in the heteroatom-containing aliphatic group is preferably 1 or more, 2 or more, or 3 or more, and preferably 30 or less, 25 or less, or 20 or less, unless otherwise specified, and the number of carbon atoms is preferably 1 or more, more preferably 2 or more, or 3 or more, and preferably 100 or less, more preferably 80 or less, and even more preferably 60 or less, 50 or less, or 40 or less, unless otherwise specified. The number of heteroatoms and the number of carbon atoms do not include the number of heteroatoms and the number of carbon atoms of the substituent.

[0013] In this specification, the term "aliphatic ring" means a ring other than an aromatic ring. The aliphatic ring may have a double bond in a part of the ring. The aliphatic ring may be a monocyclic aliphatic ring or a bridged aliphatic ring such as a bicyclo ring or a tricyclo ring. The aliphatic ring may be an aliphatic carbon ring having only carbon atoms as ring constituent atoms, or an aliphatic heterocycle having heteroatoms in addition to carbon atoms as ring constituent atoms. In this specification, the number of carbon atoms in the aliphatic ring is preferably 3 or more, more preferably 4 or more or 5 or more, and even more preferably 6 or more, unless otherwise specified, and the upper limit is preferably 24 or less, more preferably 18 or less or 14 or less, and even more preferably 10 or less. Examples of monocyclic aliphatic rings include a cyclopropane ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, a cyclononane ring, a cyclodecane ring, a cycloundecane ring, and a cyclododecane ring. Examples of the bridged aliphatic ring include bicycloheptane rings such as bicyclo[4.1.0]heptane, bicyclo[3.2.0]heptane, bicyclo[3.1.1]heptane, and bicyclo[2.2.1]heptane; bicyclooctane rings such as bicyclo[4.2.0]octane, bicyclo[4.1.1]octane, bicyclo[3.2.1]octane, and bicyclo[2.2.2]octane; bicyclononane rings such as bicyclo[4.2.1]nonane and bicyclo[3.3.1]nonane; bicyclodecane rings such as bicyclo[4.4.0]decane, bicyclo[4.2.2]decane, and bicyclo[3.3.2]decane; bicyclodecane rings such as bicyclo[4.3.2]undecane, bicyclo[3 bicyclododecane rings such as bicyclo[4.3.3]dodecane; tricycloheptane rings such as tricyclo[2.2.1.0(2,6)]heptane, [2.2.1.0(3,5)]heptane; tricyclooctane rings such as tricyclo[3.2.1.0(2,4)]octane and tricyclo[3.2.1.0(2,7)]octane; tricyclononane rings such as tricyclo[4.2.1.0(3,7)]nonane and tricyclo[4.2.1.0(4,8)]nonane; and tricyclodecane rings such as tricyclo[5.2.1.0(2,6)]decane and tricyclo[3.3.1.1(3,7)]decane.

[0014] As used herein, the term "optionally substituted" in reference to a compound or group means both the case where none of the hydrogen atoms of the compound or group are substituted with a substituent, and the case where some or all of the hydrogen atoms of the compound or group are substituted with a substituent.

[0015] In this specification, unless otherwise specified, the term "substituent" means a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, a cycloalkyloxy group, an alkylthio group, a cycloalkylthio group, an aryl group, an aryloxy group, an arylthio group, an arylalkyl group, an arylalkoxy group, a monovalent heterocyclic group, an alkylidene group, an acyl group, an acyloxy group, a hydroxy group, an amino group, a silyl group, a carboxy group, a sulfo group, a cyano group, a nitro group, a mercapto group, or an oxo group.

[0016] Examples of halogen atoms used as a substituent include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The alkyl group used as a substituent may be either linear or branched. The number of carbon atoms in the alkyl group is preferably 1 to 12, more preferably 1 to 10, and even more preferably 1 to 8. The alkenyl group used as a substituent may be either linear or branched. The number of carbon atoms in the alkenyl group is preferably 2 to 12, more preferably 2 to 10, and even more preferably 2 to 8. The number of carbon atoms in the cycloalkyl group used as a substituent is preferably 3 to 12, more preferably 3 to 10. The alkoxy group used as a substituent may be either linear or branched. The number of carbon atoms in the alkoxy group is preferably 1 to 12, more preferably 1 to 10, and even more preferably 1 to 8. The number of carbon atoms in the cycloalkyloxy group used as a substituent is preferably 3 to 12, more preferably 3 to 10. The alkylthio group used as a substituent may be either linear or branched. The number of carbon atoms in the alkylthio group is preferably 1 to 12, more preferably 1 to 10, and further preferably 1 to 8. The number of carbon atoms in the cycloalkylthio group used as a substituent is preferably 3 to 12, more preferably 3 to 10. The number of carbon atoms in the aryl group used as a substituent is preferably 6 to 14, more preferably 6 to 10. The number of carbon atoms in the aryloxy group used as a substituent is preferably 6 to 14, more preferably 6 to 10. The number of carbon atoms in the arylthio group used as a substituent is preferably 6 to 14, more preferably 6 to 10. The number of carbon atoms in the arylalkyl group used as a substituent is preferably 7 to 15, more preferably 7 to 11. The number of carbon atoms in the arylalkoxy group used as a substituent is preferably 7 to 15, more preferably 7 to 11. The monovalent heterocyclic group used as a substituent refers to a group obtained by removing one hydrogen atom from the heterocycle of a heterocyclic compound. The number of carbon atoms in the monovalent heterocyclic group is preferably 3 to 15, more preferably 3 to 9. The monovalent heterocyclic group also includes a monovalent aromatic heterocyclic group (heteroaryl group).The alkylidene group used as a substituent refers to a group in which two hydrogen atoms have been removed from the same carbon atom of an alkane. The number of carbon atoms in the alkylidene group is preferably 1 to 12, more preferably 1 to 6, and particularly preferably 1 to 3. The acyl group used as a substituent refers to a group represented by the formula: -C(=O)-R (wherein R is an alkyl group or an aryl group). The alkyl group represented by R may be either linear or branched. The number of carbon atoms in the acyl group is preferably 2 to 13, and more preferably 2 to 7. The acyloxy group used as a substituent refers to a group represented by the formula: -OC(=O)-R (wherein R is the same as above). The number of carbon atoms in the acyloxy group is preferably 2 to 13, and more preferably 2 to 7. The above-mentioned substituents may further have a substituent (sometimes referred to as a "secondary substituent"). Unless otherwise specified, the same secondary substituent as the above-mentioned substituent may be used.

[0017] In this specification, the term "(meth)acrylate compound" includes both acrylate compounds and methacrylate compounds, and refers to a compound containing one or more acryloyloxy groups or methacryloyloxy groups in the molecule. In this specification, the term "(meth)acryloyloxy group" refers to both acryloyloxy group and methacryloyloxy group, and the term "(meth)acryloyl group" refers to both acryloyl group and methacryloyl group.

[0018] Hereinafter, the present invention will be described in detail with reference to embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and may be modified and implemented as desired without departing from the scope of the claims of the present invention and their equivalents.

[0019] [Resin composition] The resin composition of the present invention is characterized by comprising (A) an epoxy resin, (B) an active ester resin, and (C) a (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms.

[0020] As described above, insulating materials for circuit boards are required to exhibit good dielectric properties (low dielectric tangent) in order to reduce transmission loss when they are operated in a high-frequency environment. In this regard, the present inventors have found that when an active ester resin is blended to an extent that good dielectric properties are achieved, the resulting insulating material tends to have poor smear removability during desmear treatment and tends to be prone to cracking after desmear treatment.

[0021] In contrast, the present invention, which uses a (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms in combination with an epoxy resin and an active ester resin, can provide a cured product that exhibits good dielectric properties, good smear removal properties, and good crack resistance. Thus, the present invention can provide a cured product that exhibits good dielectric properties, good smear removal properties, and good crack resistance, and significantly contributes to realizing a circuit board equipped with a circuit that advantageously reduces transmission loss when operating in a high-frequency environment and exhibits desired properties.

[0022] Each component will be described below.

[0023] <(A) Epoxy resin> The resin composition of the present invention contains an epoxy resin as component (A).

[0024] Examples of epoxy resins include bisphenol type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, glycidylamine type epoxy resins, glycidyl ester type epoxy resins, cresol novolac type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, trimethylol type epoxy resins, and tetraphenylethane type epoxy resins. Bisphenol type epoxy resins refer to epoxy resins having a bisphenol structure, and examples thereof include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, and bisphenol AF type epoxy resins. Biphenyl type epoxy resin refers to an epoxy resin having a biphenyl structure, where the biphenyl structure may have a substituent such as an alkyl group, an alkoxy group, or an aryl group. Therefore, bixylenol type epoxy resin and biphenyl aralkyl type epoxy resin are also included in biphenyl type epoxy resin. The epoxy resin may be used alone or in combination of two or more kinds.

[0025] The epoxy resin is preferably an aromatic epoxy resin, where the aromatic epoxy resin means an epoxy resin having an aromatic ring in the molecule.

[0026] The epoxy resin preferably has two or more epoxy groups in one molecule. When the non-volatile component of the epoxy resin is taken as 100 mass%, the ratio of the epoxy resin having two or more epoxy groups in one molecule is preferably 50 mass% or more, more preferably 60 mass% or more, and further preferably 70 mass% or more.

[0027] Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter referred to as "solid epoxy resins").

[0028] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0029] Preferred liquid epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, phenol novolac type epoxy resins, alicyclic epoxy resins such as alicyclic epoxy resins having an ester skeleton, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, and epoxy resins having a butadiene structure.

[0030] Specific examples of liquid epoxy resins include "HP-4032", "HP-4032-D", and "HP-4032-SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "630" and "630LSD" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation. resin); "ZX1059" (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin) manufactured by Nippon Steel Chemical & Material Corporation; "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX Corporation; "Celloxide 2021P" (alicyclic epoxy resin with an ester skeleton) manufactured by Daicel Corporation; "PB-3600" (epoxy resin with a butadiene structure) manufactured by Daicel Corporation; "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel Chemical & Material Corporation.

[0031] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable.

[0032] As the solid epoxy resin, bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, and tetraphenylethane type epoxy resin are preferred.

[0033] Specific examples of solid epoxy resins include "HP-4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200HH", "HP-7200H", and "HP-7200" (dicyclopentadiene epoxy resins) manufactured by DIC Corporation. type epoxy resin); "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin) manufactured by DIC; "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku; "NC-7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku; "NC-3000H", "NC-3000", "NC-3000" manufactured by Nippon Kayaku L, "NC-3100" (biphenyl type epoxy resin); "ESN-475V" (naphthol type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN-485" (naphthol novolac type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX4000HK" (bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. "YX8800" (anthracene type epoxy resin) manufactured by Osaka Gas Chemicals; "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical; "jER1010" (solid bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical; and "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical.

[0034] The resin composition of the present invention may contain only a liquid epoxy resin as an epoxy resin, may contain only a solid epoxy resin, or may contain a combination of a liquid epoxy resin and a solid epoxy resin. When a liquid epoxy resin and a solid epoxy resin are used in combination, the ratio of the amounts (liquid epoxy resin:solid epoxy resin) is preferably 1:0.01 to 1:50, more preferably 1:0.05 to 1:20, and even more preferably 1:0.1 to 1:10, by mass.

[0035] The epoxy equivalent of the epoxy resin is preferably 50 g / eq. to 5000 g / eq., more preferably 50 g / eq. to 3000 g / eq., even more preferably 80 g / eq. to 2000 g / eq., and even more preferably 110 g / eq. to 1000 g / eq. The epoxy equivalent is the mass of an epoxy resin containing one equivalent of an epoxy group. This epoxy equivalent can be measured according to JIS K7236.

[0036] The weight average molecular weight (Mw) of the epoxy resin is preferably from 100 to 5000, more preferably from 250 to 3000, and further preferably from 400 to 1500. The Mw of the epoxy resin can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0037] In combination with the (B) and (C) components described later, a cured product exhibiting good dielectric properties, good desmear removability, and crack resistance can be obtained, and from the viewpoint of obtaining a cured product having excellent mechanical properties, the content of the (A) component in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 12% by mass or more, 14% by mass or more, or 15% by mass or more, when the resin components in the resin composition are taken as 100% by mass. The upper limit of the content is not particularly limited and may be determined depending on the properties required for the resin composition, and may be, for example, 60% by mass or less, 50% by mass or less, or 40% by mass or less.

[0038] In the present invention, the "resin component" of the resin composition refers to the non-volatile components constituting the resin composition excluding the inorganic filler described below.

[0039] <(B) Active ester resin> The resin composition of the present invention contains an active ester resin as the component (B).

[0040] As the active ester curing agent, a compound having one or more active ester groups in one molecule can be used. Among them, as the active ester curing agent, a compound having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, is preferable. The active ester curing agent is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent derived from a carboxylic acid compound is preferable, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is more preferable, and an active ester curing agent obtained from a carboxylic acid compound and an aromatic hydroxy compound is even more preferable.

[0041] The carboxylic acid compound may be either an aromatic carboxylic acid compound or an aliphatic carboxylic acid compound, and examples thereof include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, and halides thereof.

[0042] Examples of aromatic hydroxy compounds include (i) polyaddition products of unsaturated aliphatic cyclic compounds containing two double bonds in one molecule and phenols, (ii) various bisphenol compounds, (iii) aromatic polyols having two or more hydroxyl groups bonded to the carbon atoms on the aromatic ring, and (iv) aromatic monools having one hydroxyl group bonded to the carbon atoms on the aromatic ring. Examples of polyaddition products of unsaturated aliphatic cyclic compounds and phenols include polyaddition products of unsaturated aliphatic cyclic compounds such as dicyclopentadiene, tetrahydroindene, norbornadiene, limonene, and vinylcyclohexene with phenols that may have a substituent (e.g., phenol, cresol, xylenol, ethylphenol, propylphenol, vinylphenol, allylphenol, phenylphenol, benzylphenol, halophenol, etc.), and specifically, for example, dicyclopentadiene-phenols polyaddition products. Examples of bisphenol compounds include bisphenol A, bisphenol F, bisphenol AF, bisphenol AP, bisphenol B, bisphenol BP, bisphenol C, and bisphenol M. Examples of aromatic polyols having two or more hydroxy groups bonded to carbon atoms on an aromatic ring include hydroquinone, resorcinol, catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, benzenetriol, and phenol novolak. Examples of aromatic monools having one hydroxy group bonded to a carbon atom on an aromatic ring include phenol, cresol, xylenol, ethylphenol, propylphenol, vinylphenol, allylphenol, phenylphenol, benzylphenol, halophenol, naphthol, methylnaphthol, dimethylnaphthol, ethylnaphthol, propylnaphthol, vinylnaphthol, allylnaphthol, phenylnaphthol, benzylnaphthol, and halonaphthol.

[0043] Specific examples of the active ester resin that are preferable from the viewpoint of enjoying the effects of the present invention include active ester resins containing a dicyclopentadiene-type diphenol structure, active ester resins containing a naphthalene structure, active ester resins containing an acetylated product of phenol novolac, and active ester resins containing a benzoylated product of phenol novolac. Among them, active ester resins containing a naphthalene structure and active ester resins containing a dicyclopentadiene-type diphenol structure are more preferable from the viewpoint of realizing a cured product that exhibits better dielectric properties, better smear removal properties, and better crack resistance in combination with the component (C) described below. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0044] As the component (B), a commercially available product may be used. Examples of the commercially available product include active ester resins containing a dicyclopentadiene type diphenol structure, such as "EXB-9451", "EXB-9460", "EXB-9460S", "HPC-8000-65T", "HPC-8000H-65MT", and "HPC-8000L-65MT" (manufactured by DIC Corporation); active ester resins containing a naphthalene structure, such as "EXB-8100L-65T", "EXB-8150-60T", "EXB-8150-62T", "EXB-9416-70BK", "HPC-8150-60T", and "HPC-8150-62T". Examples of active ester resins that contain a styryl group and a naphthalene structure include "PC-8150-62T" and "HP-B-8151-62T" (manufactured by DIC Corporation); "EXB9401" (manufactured by DIC Corporation); "DC808" (manufactured by Mitsubishi Chemical Corporation) is an active ester resin that is an acetylated product of phenol novolac; "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) are active ester resins that are benzoylated products of phenol novolac; and "PC1300-02-65MA" (manufactured by Air Water Corporation) is an active ester resin that contains a styryl group and a naphthalene structure.

[0045] The component (B) may use one type alone, or two or more types in combination at any ratio.

[0046] The active ester group equivalent of the component (B) is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The active ester group equivalent is the mass of the active ester resin per equivalent of the active ester group.

[0047] From the viewpoint of easily realizing a resin composition that provides good dielectric properties, the content of the (B) component in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 25% by mass or more or 30% by mass or more, when the resin components in the resin composition are taken as 100% by mass. The upper limit of the content is not particularly limited and may be determined depending on the properties required for the resin composition, but may be, for example, 60% by mass or less, 55% by mass or less, or 50% by mass or less.

[0048] In the resin composition of the present invention, the mass ratio of the (B) component to the (A) component ((B) component / (A) component) is preferably 0.6 or more, more preferably 0.8 or more, and even more preferably 1 or more, from the viewpoint of obtaining a cured product exhibiting good dielectric properties. As described above, according to the resin composition of the present invention using the (C) component, even if the (B) component is contained to an extent that excellent dielectric properties can be realized, a cured product exhibiting good smear removability and good crack resistance can be obtained. For example, in the resin composition of the present invention, the mass ratio of the (B) component to the (A) component may be increased to 1.1 or more, 1.2 or more, or 1.25 or more. The upper limit of the mass ratio ((B) component / (A) component) may be, for example, 2 or less, 1.9 or less, 1.8 or less, etc.

[0049] <(C) (Meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms> The resin composition of the present invention is characterized by containing, as component (C), a (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms.

[0050] From the viewpoint of providing a cured product that exhibits good dielectric properties, as well as good smear removal properties and crack resistance in combination with the (A) and (B) components, the (C) component preferably contains two or more (meth)acryloyl groups in the molecule.

[0051] From the viewpoint of providing a cured product that exhibits good dielectric properties, as well as good smear removal properties and crack resistance in combination with components (A) and (B), it is important that component (C) contains an aliphatic group having 10 or more carbon atoms.

[0052] The aliphatic group having 10 or more carbon atoms contained in component (C) may be either linear or branched, and may contain an aliphatic ring in its structure. The number of carbon atoms in the aliphatic group is as described above, but from the viewpoint of further enjoying the effects of the present invention, it is preferably 12 or more, more preferably 14 or more, 16 or more, 18 or more, or 20 or more, and even more preferably 22 or more, 24 or more, 26 or more, 28 or more, or 30 or more, and the upper limit is preferably 100 or less, more preferably 80 or less, 60 or less, 50 or less, or 40 or less.

[0053] In terms of being able to realize a cured product exhibiting better dielectric properties, better smear removability, and crack resistance in combination with the (A) component and the (B) component, the aliphatic group having 10 or more carbon atoms is preferably an aliphatic group containing an aliphatic ring (preferably an aliphatic carbon ring). From the same viewpoint, the aliphatic group having 10 or more carbon atoms is preferably an aliphatic hydrocarbon group. In a preferred embodiment, the (C) component contains an aliphatic group having 10 or more carbon atoms containing an aliphatic ring, more preferably an aliphatic hydrocarbon group having 10 or more carbon atoms containing an aliphatic carbon ring. The preferred range of the number of carbon atoms of the aliphatic group is as described above.

[0054] Among these, from the viewpoint of being able to further enjoy the effects of the present invention in combination with the components (A) and (B), the aliphatic group having 10 or more carbon atoms contained in the component (C) is preferably an alkylene group which may have a substituent, a cycloalkylene group which may have a substituent, an alkenylene group which may have a substituent, a cycloalkenylene group which may have a substituent, an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and even more preferably 2), or a divalent aliphatic group consisting of a combination of two or more of these.

[0055] The substituents that these aliphatic groups may have are as described above, and among them, from the viewpoint of further enjoying the effects of the present invention, preferred are one or more selected from the group consisting of a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, and a cycloalkyloxy group, and more preferred are one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms.

[0056] In a preferred embodiment in which the effects of the present invention can be more fully enjoyed, the component (C) contains a divalent aliphatic group represented by the following formula (1).

[0057] [ka] (In formula (1), A C each independently represents a single bond or a divalent aliphatic group, Ring Z C represents an aliphatic ring which may have a substituent, * represents a bond. 2 A's C and Ring Z C The total number of carbon atoms is 10 or more.)

[0058] The divalent aliphatic group represented by formula (1) is composed of two A C and Ring ZC The total number of carbon atoms in each of the groups is 10 or more, which corresponds to the aforementioned "aliphatic group having 10 or more carbon atoms."

[0059] In formula (1), A C A each independently represents a single bond or a divalent aliphatic group. C The divalent aliphatic group represented by the formula (I) is as described above, but from the viewpoint of better enjoying the effects of the present invention, an alkylene group which may have a substituent or an alkenylene group which may have a substituent is preferred, and an alkylene group having 1 to 12 carbon atoms which may have a substituent or an alkenylene group having 2 to 12 carbon atoms which may have a substituent is more preferred.

[0060] In formula (1), ring Z C represents an aliphatic ring which may have a substituent. Ring Z C The aliphatic ring in is as described above, but from the viewpoint of obtaining the effects of the present invention, an aliphatic carbon ring is preferable, and a cycloalkane ring or a cycloalkene ring is more preferable. Here, the cycloalkane ring or the cycloalkene ring may be a bridged ring such as a bicyclo ring or a tricyclo ring. The number of carbon atoms in the aliphatic ring is as described above, but from the viewpoint of obtaining the effects of the present invention, it is preferably 4 or more, more preferably 6 or more, and the upper limit is preferably 14 or less, more preferably 10 or less. Therefore, in a preferred embodiment, the ring Z C is a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent.

[0061] In formula (1), A C Divalent aliphatic groups and rings Z CThe substituents that the aliphatic ring in the formula (I) may have are as described above, and from the viewpoint of further enjoying the effects of the present invention, preferred are one or more selected from the group consisting of a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, and a cycloalkyloxy group, and more preferred are one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms.

[0062] As mentioned above, in formula (1), two A C and Ring Z C The total number of carbon atoms is 10 or more, and from the viewpoint of obtaining the effects of the present invention more effectively, is preferably 50 or less, and more preferably 40 or less.

[0063] From the viewpoint of realizing a cured product exhibiting even better dielectric properties, and even better smear removal and crack resistance in combination with the components (A) and (B), particularly preferred examples of the divalent aliphatic group represented by formula (1) are shown below.

[0064] In a preferred embodiment, in formula (1), A C each independently represents an alkylene group having 1 to 12 carbon atoms or an alkenylene group having 2 to 12 carbon atoms, Ring Z C represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent, wherein the substituent is one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; 2 A's C and Ring Z C The total number of carbon atoms is 10 or more and 50 or less.

[0065] In a more preferred embodiment, in formula (1), A C each independently represents an alkylene group having 1 to 8 carbon atoms or an alkenylene group having 2 to 8 carbon atoms, Ring Z C represents a cycloalkane ring having 6 to 10 carbon atoms which may have a substituent, or a cycloalkene ring having 6 to 10 carbon atoms which may have a substituent, wherein the substituent is one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, and an alkenyl group having 2 to 10 carbon atoms; 2 A's C and Ring Z C The total number of carbon atoms is 10 or more and 40 or less.

[0066] From the viewpoint of being able to realize a cured product exhibiting even better dielectric properties and even better smear removability and crack resistance in combination with components (A) and (B), component (C) contains in the molecule preferably one or more, more preferably two or more, and even more preferably three or more divalent aliphatic groups represented by formula (1). The upper limit of the number of divalent aliphatic groups represented by formula (1) in the molecule is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less.

[0067] In a preferred embodiment, the component (C) has a structure represented by the following formula (C1):

[0068] [ka] (In formula (C1), Each X independently represents a (meth)acryloyl group; A 1 each independently represents a divalent aliphatic group, A 2 each independently represents a divalent aliphatic group having 10 or more carbon atoms, L 1 each independently represents a divalent linking group, n1 represents a number equal to or greater than 1.)

[0069] -Divalent aliphatic group A 1 - In formula (C1), A 1 Each of A and B independently represents a divalent aliphatic group. 1 The divalent aliphatic group represented by the formula (I) is as described above, but is preferably an alkylene group which may have a substituent, a cycloalkylene group which may have a substituent, an alkenylene group which may have a substituent, a cycloalkenylene group which may have a substituent, an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and more preferably 2), or a divalent aliphatic group consisting of a combination of two or more of these. The suitable range of the number of carbon atoms of the alkylene group, cycloalkylene group, alkenylene group, cycloalkenylene group, and alkapolyenylene group in these divalent aliphatic groups is as described above for the aliphatic hydrocarbon group.

[0070] A 1 From the viewpoint of better enjoying the effects of the present invention, the number of carbon atoms in the divalent aliphatic group represented by the following formula is preferably 2 or more, more preferably 4 or more, and even more preferably 6 or more, and the upper limit is preferably 40 or less, more preferably 30 or less, 20 or less, or 15 or less.

[0071] Among them, from the viewpoint of being able to enjoy the effects of the present invention more effectively, 1 The divalent aliphatic group represented by the following formula (C2) is preferably a divalent aliphatic group represented by the following formula (C2).

[0072] [ka] (In formula (C2), A 11 each independently represents a single bond or a divalent aliphatic group, Ring Z 1 represents an aliphatic ring which may have a substituent, * represents a bond.)

[0073] In formula (C2), A 11A each independently represents a single bond or a divalent aliphatic group. 11 The divalent aliphatic group represented by the formula (I) is as described above, but from the viewpoint of obtaining the effects of the present invention, a divalent aliphatic hydrocarbon group is preferred, and an alkylene group which may have a substituent, an alkenylene group which may have a substituent, or an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and more preferably 2). 11 The preferred ranges of the number of carbon atoms of the alkylene group, alkenylene group, and alkapolyenylene group in the above are as described above for the aliphatic hydrocarbon group, and the preferred types of the substituents are also as described above. Among them, from the viewpoint of being able to enjoy the effects of the present invention more effectively, they are preferably selected from the group consisting of A C may be similar to that described above.

[0074] In formula (C2), ring Z 1 represents an aliphatic ring which may have a substituent. Ring Z 1 The aliphatic ring in is as described above, but from the viewpoint of obtaining the effects of the present invention, an aliphatic carbon ring is preferable, and a cycloalkane ring which may have a substituent or a cycloalkene ring which may have a substituent is more preferable. Here, the cycloalkane ring or the cycloalkene ring may be a bridged ring such as a bicyclo ring or a tricyclo ring. 1 The preferred ranges of the number of carbon atoms in the cycloalkane ring and the cycloalkene ring in the above formula (1) are as described above for the aliphatic ring, and the preferred types of the substituents are also as described above. C may be similar to that described above.

[0075] 2 A's 11 and Ring Z 1 From the viewpoint of better enjoying the effects of the present invention, the total number of carbon atoms is preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more, and the upper limit is preferably 40 or less, more preferably 30 or less, 20 or less, or 15 or less.

[0076] 2 A's 11 and Ring Z 1 When the total number of carbon atoms of formula (C2) is 10 or more, the divalent aliphatic group represented by formula (C2) may be a divalent aliphatic group having 10 or more carbon atoms represented by formula (1) described above.

[0077] -Divalent aliphatic group A 2 - In formula (C1), A 2 each independently represents a divalent aliphatic group having 10 or more carbon atoms. 2 The divalent aliphatic group having 10 or more carbon atoms represented by the following formula (I) and suitable examples thereof are as described above.

[0078] Among them, from the viewpoint of being able to enjoy the effects of the present invention more effectively, 2 The divalent aliphatic group having 10 or more carbon atoms represented by the following formula (C3) is preferably a divalent aliphatic group represented by the following formula (C3).

[0079] [ka] (In formula (C3), A 21 each independently represents a single bond or a divalent aliphatic group, Ring Z 2 represents an aliphatic ring which may have a substituent, * represents a bond. 2 A's 21 and Ring Z 2 The total number of carbon atoms is 10 or more.)

[0080] In formula (C3), A 21 A each independently represents a single bond or a divalent aliphatic group. 21 The divalent aliphatic group represented by the formula (I) is as described above, but from the viewpoint of obtaining the effects of the present invention, a divalent aliphatic hydrocarbon group is preferred, and an alkylene group which may have a substituent, an alkenylene group which may have a substituent, or an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and more preferably 2). 21The preferred ranges of the number of carbon atoms of the alkylene group, alkenylene group, and alkapolyenylene group in the above are as described above for the aliphatic hydrocarbon group, and the preferred types of the substituents are also as described above. Among them, from the viewpoint of being able to enjoy the effects of the present invention more effectively, they are preferably selected from the group consisting of A C may be similar to that described above.

[0081] In formula (C3), ring Z 2 represents an aliphatic ring which may have a substituent. Ring Z 2 The aliphatic ring in is as described above, but from the viewpoint of obtaining the effects of the present invention, an aliphatic carbon ring is preferable, and a cycloalkane ring which may have a substituent or a cycloalkene ring which may have a substituent is more preferable. Here, the cycloalkane ring or the cycloalkene ring may be a bridged ring such as a bicyclo ring or a tricyclo ring. 2 The preferred ranges of the number of carbon atoms in the cycloalkane ring and the cycloalkene ring in the above formula (1) are as described above for the aliphatic ring, and the preferred types of the substituents are also as described above. C may be similar to that described above.

[0082] 2 A's 21 and Ring Z 2 The total number of carbon atoms is 10 or more, and from the viewpoint of obtaining the effects of the present invention more effectively, is preferably 50 or less, and more preferably 40 or less.

[0083] From the viewpoint of obtaining the effects of the present invention more effectively, the divalent aliphatic group having 10 or more carbon atoms and represented by formula (C3) is preferably a divalent aliphatic group having 10 or more carbon atoms and represented by the above-mentioned formula (1).

[0084] -Divalent Linking Group L 1 - In formula (C1), L 1 each independently represents a divalent linking group.

[0085] L 1The divalent linking group represented by the formula (I) is not particularly limited as long as it is a divalent group consisting of one or more (for example, 1 to 50, 1 to 30, 1 to 20, or 1 to 10) skeletal atoms selected from carbon atoms, oxygen atoms, nitrogen atoms, and sulfur atoms. From the viewpoint of further enjoying the effects of the present invention, however, a divalent linking group selected from the group consisting of a divalent hydrocarbon group having 1 to 10 carbon atoms which may have a substituent, -O-, -CO-, -S-, -SO-, -SO2-, -CONH-, -NHCO-, -COO-, or -OCO-, and a combination thereof is preferred.

[0086] L 1 From the viewpoint of better enjoying the effects of the present invention, the number of carbon atoms in the divalent linking group represented by the following formula is preferably 10 or less, more preferably 6 or less, and even more preferably 4 or less, and the lower limit is 1 or more.

[0087] Among these, from the viewpoint of being able to enjoy the effects of the present invention more effectively, L 1 The divalent linking group represented by the following formula is preferably -CONH-, -NHCO-, -COO-, or -OCO-.

[0088] -n1- In formula (C1), n1 represents a number of 1 or more.

[0089] From the viewpoint of obtaining the effects of the present invention more effectively, n1 is preferably a number of 20 or less, more preferably 15 or less, and further preferably 10 or less, 8 or less, 6 or less, or 5 or less.

[0090] In one embodiment that is preferred from the viewpoint of realizing a cured product exhibiting even better dielectric properties and even better smear removal properties and crack resistance in combination with the components (A) and (B), the component (C) has a structure represented by the following formula (C1-1).

[0091] [ka] (In formula (C1-1), X, A 11 , A 21 , ring Z 1, ring Z 2 has the same meaning as above. Also, n11 indicates a number equal to or greater than 1.)

[0092] X, A 11 , A 21 , ring Z 1 and ring Z 2 is as described above, including preferred examples thereof. In addition, n11 represents a number of 1 or more, and from the viewpoint of further enjoying the effects of the present invention, represents a number of preferably 20 or less, more preferably 15 or less, further preferably 10 or less, 8 or less, 6 or less, or 5 or less.

[0093] In the combination of the (A) component and the (B) component, from the viewpoint of realizing a cured product exhibiting even better dielectric properties, and even better smear removal properties and crack resistance, 11 -Ring Z 1 -A 11 A block consisting of 21 -Ring Z 2 -A 21 and the blocks consisting of the above are preferably both divalent aliphatic groups having 10 or more carbon atoms and represented by the above formula (1).

[0094] From the viewpoint of realizing a cured product exhibiting even better dielectric properties, and even better smear removal properties and crack resistance in combination with the components (A) and (B), particularly preferred examples of the structure represented by formula (C1-1) are shown below.

[0095] In a preferred embodiment, in formula (C1-1), Each X independently represents a (meth)acryloyl group; A 11 and A 21 each independently represents an alkylene group having 1 to 12 carbon atoms or an alkenylene group having 2 to 12 carbon atoms, Ring Z 1 and ring Z 2each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent, wherein the substituent represents one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; n11 represents a number from 1 to 10.

[0096] In a more preferred embodiment, in formula (C1-1), Each X independently represents a (meth)acryloyl group; A 11 each independently represents an alkylene group having 1 to 12 carbon atoms (preferably 1 to 6, more preferably 1 to 4), A 21 each independently represents an alkylene group having 1 to 12 (preferably 1 to 10, more preferably 4 to 10) carbon atoms or an alkenylene group having 2 to 12 (preferably 2 to 10, more preferably 4 to 10) carbon atoms, Ring Z 1 each independently represents a cycloalkane ring having 4 to 14 (preferably 6 to 10) carbon atoms which may have a substituent, wherein the substituent represents one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; Ring Z 2each independently represents a cycloalkane ring having 4 to 14 (preferably 6 to 10) carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 (preferably 6 to 10) carbon atoms which may have a substituent, wherein the substituent represents one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; n11 represents a number from 1 to 10.

[0097] In a particularly preferred embodiment, in formula (C1-1), Each X independently represents a (meth)acryloyl group; A 11 represents an alkylene group having one carbon atom, A 21 represents an alkylene group having 7 carbon atoms, Ring Z 1 represents a tricyclodecane ring, Ring Z 2 represents a cyclohexane ring substituted with two alkyl groups having 5 to 8 carbon atoms, n11 represents a number from 1 to 5.

[0098] In order to realize a cured product exhibiting better dielectric properties and better smear removability and crack resistance in combination with the (A) and (B) components, the (meth)acryloyl group equivalent of the (C) component is preferably 300 g / eq. or more, more preferably 350 g / eq. or more, 400 g / eq. or more, or 450 g / eq. or more, and the upper limit is preferably 4000 g / eq. or less, more preferably 3000 g / eq. or less, 2500 g / eq. or less, 2400 g / eq. or less, 2200 g / eq. or less, or 2000 g / eq. or less. The (meth)acryloyl group equivalent represents the mass of the (C) component per equivalent of the (meth)acryloyl group.

[0099] The component (C) is, for example, an aliphatic dihydroxy compound (HO-A1 -OH, preferably HO-A 11 -Ring Z 1 -A 11 -OH; in the formula, A 1 , A 11 , ring Z 1 has the same meaning as above.) and aliphatic dicarboxylic acid compound (HOOC-A 2 -COOH, preferably HOOC-A 21 -Ring Z 2 -A 21 -COOH; in the formula, A 2 , A 21 , ring Z 2 has the same meaning as above.) and the terminal of the ester compound obtained by reacting with the compound (C1) can be modified with (meth)acrylate. 1 is an ester bond). In this case, n1 in the above (C1) and n11 in the above (C1-1) can be adjusted by adjusting the degree of reaction between the aliphatic dihydroxy compound and the aliphatic dicarboxylic acid compound.

[0100] As the component (C), a commercially available product may be used. Examples of such commercially available products include "PEAM1769" (manufactured by Designer Molecules) which is a (meth)acrylate compound containing a divalent aliphatic group having 10 or more carbon atoms and represented by formula (1).

[0101] From the viewpoint of realizing a cured product exhibiting better dielectric properties, better smear removability, and crack resistance in combination with the (A) and (B) components, the content of the (C) component in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, even more preferably 1.5% by mass or more, 2% by mass or more, 2.5% by mass or more, 3% by mass or more, 3.5% by mass or more, or 4% by mass or more, when the resin components in the resin composition are taken as 100% by mass. The upper limit of the content is not particularly limited and may be determined depending on the properties required for the resin composition, but from the viewpoint of realizing a cured product exhibiting better dielectric properties, better smear removability, and crack resistance in combination with the (A) and (B) components, it is preferably 20% by mass or less, more preferably 15% by mass or less, even more preferably 12% by mass or less, 10% by mass or less, 8% by mass or less, or 6% by mass or less.

[0102] From the viewpoint of obtaining the effects of the present invention more effectively, the mass ratio of the component (C) to the aforementioned component (B) (component (C) / component (B)) is preferably 0.05 or more, more preferably 0.06 or more, 0.08 or more, or 0.1 or more, and the upper limit thereof is preferably 0.5 or less, more preferably 0.4 or less, 0.3 or less, or 0.2 or less.

[0103] <(D) Other hardeners> The resin composition of the present invention may further contain, as component (D), a curing agent other than component (B) (also referred to as "other curing agent").

[0104] Examples of the (D) component include phenol-based curing agents, naphthol-based curing agents, acid anhydride-based curing agents, cyanate ester-based curing agents, carbodiimide-based curing agents, amine-based curing agents, etc. The (D) component may be used alone or in combination of two or more.

[0105] As the phenol-based curing agent and naphthol-based curing agent, those having a novolac structure are preferred from the viewpoint of heat resistance and water resistance. Also, from the viewpoint of adhesion to the conductor layer, nitrogen-containing phenol-based curing agents and nitrogen-containing naphthol-based curing agents are preferred, and triazine skeleton-containing phenol-based curing agents and triazine skeleton-containing naphthol-based curing agents are more preferred.

[0106] Specific examples of phenol-based curing agents and naphthol-based curing agents include, for example, "MEH-7700", "MEH-7810", "MEH-7851", and "MEH-8000H" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd.; and "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-495V", and "SN-37" manufactured by Nippon Steel Chemical & Material Co., Ltd. 5" and "SN-395" manufactured by DIC Corporation; "TD-2090", "TD-2090-60M", "LA-7052", "LA-7054", "LA-1356", "LA-3018", "LA-3018-50P", "EXB-9500", "HPC-9500", "KA-1160", "KA-1163", and "KA-1165" manufactured by Gun-ei Chemical Co., Ltd.; and the like.

[0107] Examples of the acid anhydride curing agent include a curing agent having one or more acid anhydride groups in one molecule. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of acid anhydrides include polymeric acid anhydrides such as anhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and styrene-maleic acid resins, which are copolymers of styrene and maleic acid. Commercially available acid anhydride hardeners include "MH-700" manufactured by New Japan Chemical Co., Ltd.

[0108] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate phenyl-1-(methylethylidene))benzene, bis(4-cyanate phenyl)thioether, and bis(4-cyanate phenyl)ether; polyfunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (phenol novolac type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resin), "BA230", and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been converted to triazine to form a trimer), all of which are manufactured by Lonza Japan.

[0109] Specific examples of carbodiimide-based curing agents include Carbodilite (registered trademark) V-03 (carbodiimide group equivalent: 216 g / eq.), V-05 (carbodiimide group equivalent: 262 g / eq.), V-07 (carbodiimide group equivalent: 200 g / eq.); V-09 (carbodiimide group equivalent: 200 g / eq.), and Stavaxol (registered trademark) P (carbodiimide group equivalent: 302 g / eq.), all manufactured by Nisshinbo Chemical Inc.

[0110] Examples of the amine-based curing agent include curing agents having one or more amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, aromatic amines, etc. Specific examples of the amine-based curing agent include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenylether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)- ... bis(4-aminophenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. The amine-based curing agent may be a commercially available product, for example, "KAYABOND C-200S", "KAYABOND C-100", "KAYAHARD AA", "KAYAHARD AB", "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" manufactured by Mitsubishi Chemical Corporation.

[0111] When the resin composition of the present invention contains the (D) component, the content of the (D) component in the resin composition may be determined according to the properties required for the resin composition, but when the resin components in the resin composition are taken as 100% by mass, it is, for example, 0.1% by mass or more, preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 3% by mass or more. The upper limit of the content of the (D) component is not particularly limited, but may be, for example, 20% by mass or less, 15% by mass or less, 10% by mass or less, etc.

[0112] As described above, from the viewpoint of obtaining a cured product exhibiting good dielectric properties, the resin composition of the present invention contains an active ester resin, i.e., component (B). In the resin composition of the present invention, when the total of the non-volatile components of components (B) and (D) is 100 mass%, the content of component (B) is preferably 50 mass% or more, more preferably 60 mass% or more, and even more preferably 70 mass% or more, 75 mass% or more, or 80 mass% or more. The upper limit of the content of component (B) in the total of components (B) and (D) is not particularly limited, and may be 100 mass%, but may also be, for example, 95 mass% or less, 90 mass% or less, etc.

[0113] <(E) Inorganic filler> The resin composition of the present invention may further contain an inorganic filler as component (E). By including component (E), the thermal expansion coefficient and the dielectric tangent tend to be further reduced.

[0114] Examples of materials for the component (E) include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum silicate, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Moreover, spherical silica is preferred as the silica. The component (E) may be used alone or in combination of two or more.

[0115] Examples of commercially available products of component (E) include "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", "YA010C", "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatechs Co., Ltd.; "UFP-30", "DAW-03", and "FB-105FD" manufactured by Denka Co., Ltd.; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" manufactured by Tokuyama Corporation; "Cellspheres" and "MGH-005" manufactured by Taiheiyo Cement Corporation; and "Sferique" and "BA-1" manufactured by JGC Catalysts and Chemicals Co., Ltd.

[0116] The average particle size of the component (E) is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 3 μm or less, 2 μm or less, 1 μm or less, or 0.7 μm or less. The lower limit of the average particle size is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.07 μm or more, 0.1 μm or more, or 0.2 μm or more. The average particle size of the component (E) can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is prepared on a volume basis using a laser diffraction / scattering type particle size distribution measuring device, and the median diameter is taken as the average particle size. The measurement sample can be prepared by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture by ultrasonic waves for 10 minutes. The measurement sample was measured using a laser diffraction type particle size distribution measuring device with blue and red light source wavelengths, and the particle size distribution of the inorganic filler on a volume basis was measured using a flow cell method, and the average particle size was calculated as the median diameter from the particle size distribution obtained. An example of a laser diffraction type particle size distribution measuring device is the "LA-960" manufactured by Horiba, Ltd.

[0117] The specific surface area of ​​component (E) is not particularly limited, but is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, 3m 2 / g or more or 5m 2 The upper limit of the specific surface area is not particularly limited, but is preferably 100 m 2 / g or less, more preferably 80m 2 / g or less, more preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2 The specific surface area of ​​component (E) is obtained by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) according to the BET method, and calculating the specific surface area using the BET multipoint method.

[0118] The (E) component is preferably surface-treated with a suitable surface treatment agent. By performing the surface treatment, the moisture resistance and dispersibility of the (E) component can be improved. Examples of the surface treatment agent include silane coupling agents such as vinyl-based silane coupling agents, epoxy-based silane coupling agents, styryl-based silane coupling agents, (meth)acrylic-based silane coupling agents, amino-based silane coupling agents, isocyanurate-based silane coupling agents, ureido-based silane coupling agents, mercapto-based silane coupling agents, isocyanate-based silane coupling agents, and acid anhydride-based silane coupling agents; non-silane coupling-alkoxysilane compounds such as methyltrimethoxysilane and phenyltrimethoxysilane; and silazane compounds. The surface treatment agent may be used alone or in combination of two or more.

[0119] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), and Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane).

[0120] The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, it is preferable that 100% by mass of the inorganic filler is surface-treated with 0.2 to 5% by mass of the surface treatment agent.

[0121] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition or the melt viscosity in the form of a sheet, it is more preferable that the melt viscosity is 1.0 mg / m 2 Less than 0.8 mg / m is preferred. 2 Less than 0.5 mg / m is more preferable. 2 The following is more preferable. The carbon amount per unit surface area of ​​component (E) can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the carbon amount per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, an "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used.

[0122] When the resin composition of the present invention contains the (E) component, the content of the (E) component in the resin composition is, for example, 40% by mass or more, preferably 50% by mass or more, more preferably 60% by mass or more, 65% by mass or more, or 70% by mass or more, when the non-volatile components in the resin composition are taken as 100% by mass, from the viewpoint of easily realizing a resin composition that provides a lower dielectric tangent and thermal expansion coefficient. The upper limit of the content of the (E) component is not particularly limited, and may be, for example, 90% by mass or less, 85% by mass or less, etc.

[0123] <(F) Compound containing a radically polymerizable unsaturated group> The resin composition of the present invention may further contain, as component (F), a compound containing a radically polymerizable unsaturated group different from component (C). By including component (F) in combination with component (C), it is easy to realize a resin composition that provides a cured product exhibiting even better dielectric properties, which is preferable.

[0124] The type of the (F) component is not particularly limited as long as it has one or more (preferably two or more) radically polymerizable unsaturated groups in one molecule. For example, the (F) component may be a compound having one or more radically polymerizable unsaturated groups selected from maleimide group, vinyl group, allyl group, styryl group, vinylphenyl group, acryloyl group, methacryloyl group, fumaroyl group, and maleoyl group. Among them, from the viewpoint of easily realizing a resin composition that leads to a cured product exhibiting even better dielectric properties in combination with the (C) component, it is preferable that the (F) component contains one or more selected from maleimide compounds, allyl compounds, styryl compounds, and (meth)acrylic compounds.

[0125] The type of maleimide compound is not particularly limited as long as it has one or more (preferably two or more) maleimide groups (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl groups) in one molecule. Examples of the maleimide compound include (1) "BMI-3000J", "BMI-5000", "BMI-1400", "BMI-1500", "BMI-1700", "BMI-689" (all manufactured by DigiCner Molecular Corp.), "SLK-6895", "SLK-1500" (manufactured by Shin-Etsu Chemical Co., Ltd.), which have an aliphatic skeleton (a divalent aliphatic group having 10 or more carbon atoms as described for the component (C), particularly preferably a dimer acid or dimer). (2) Maleimide compounds containing an indane skeleton, as described in the Technical Journal Disclosure No. 2020-500211 of the Japan Institute of Invention and Innovation; (3) Maleimide compounds containing an aromatic ring skeleton directly bonded to the nitrogen atom of the maleimide group, such as "MIR-3000-70MT" (manufactured by Nippon Kayaku Co., Ltd.), "BMI-4000" (manufactured by Daiwa Kasei Co., Ltd.), and "BMI-80" (manufactured by Keiai Kasei Co., Ltd.).

[0126] The allyl compound is not particularly limited in type, so long as it has one or more (preferably two or more) allyl groups in one molecule, and may be a monomer or an oligomer. Examples of the allyl compound include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenecarboxylate; isocyanuric acid allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; epoxy-containing aromatic allyl compounds such as 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-triallyl ether benzene; allyl silane compounds such as diallyl diphenyl silane; and resins containing a plurality of benzene rings and allyl groups. Commercially available allyl compounds include, for example, "TAIC" (1,3,5-triallyl isocyanurate) manufactured by Nippon Kasei Chemical Industry Co., Ltd., "DAD" (diallyl diphenate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "TRIAM-705" (triallyl trimellitate) manufactured by Wako Pure Chemical Industries, Ltd., "DAND" (diallyl 2,3-naphthalene carboxylate) manufactured by Nippon Distillery Co., Ltd., and "ALP-d" (bis[3-allyl-4- (3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane), Nippon Kayaku's "RE-810NM" (2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane), Shikoku Kasei's "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate), and DIC's "NE-V-1100-70T" (resin containing multiple benzene rings and multiple allyl groups).

[0127] The styryl compound is not particularly limited in type, and may be a monomer or oligomer, as long as it has one or more (preferably two or more) styryl groups or vinylphenyl groups in one molecule. Examples of the styryl compound include low molecular weight (molecular weight less than 1000) styryl compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl)ether; and high molecular weight (molecular weight 1000 or more) styryl compounds such as vinylbenzyl-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Commercially available styryl compounds include, for example, "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymers) manufactured by Nippon Steel Chemical & Material Co., Ltd., and "OPE-2St 1200" and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Co., Inc.

[0128] The (meth)acrylic compound is not particularly limited in type as long as it has one or more (preferably two or more) (meth)acryloyl groups in one molecule, and may be a monomer or oligomer (excluding compounds corresponding to component (C)). Examples of the (meth)acrylic compound include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and the like. (meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, and other low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds; dioxane glycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di(meth)acrylate, acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, and other low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds; tris(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, and other low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylic acid ester compounds; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic modified polyphenylene ether resins.Examples of commercially available (meth)acrylic compounds include "A-DOG" (dioxane glycol diacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA9000" and "SA9000-111" (methacrylic-modified polyphenylene ether) manufactured by SABIC Innovative Plastics.

[0129] The component (F) may be used as a single type, or as a combination of two or more types in any desired ratio.

[0130] The radical polymerizable unsaturated group equivalent of the component (F) is preferably 250 g / eq. to 1200 g / eq., more preferably 300 g / eq. to 1100 g / eq. The radical polymerizable unsaturated group equivalent represents the mass of the component (F) per equivalent of the radical polymerizable unsaturated group. When the radical polymerizable unsaturated group equivalent of the component (F) is within the above range, the effects of the present invention can be significantly obtained.

[0131] The Mw of the component (F) is preferably from 1000 to 40000, and more preferably from 1500 to 35000. The Mw of the component (F) can be measured by the GPC method as a polystyrene-equivalent value.

[0132] When the resin composition contains the component (F), from the viewpoint of being able to realize a resin composition that, in combination with the component (C), provides a cured product exhibiting better dielectric properties and better smear removability and crack resistance, the content of the component (F) in the resin composition is preferably 2% by mass or more, more preferably 3% by mass or more, or 4% by mass or more, and the upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less, based on the resin component in the resin composition being 100% by mass.

[0133] <(G)Organic filler> The resin composition of the present invention may further contain an organic filler as component (G).

[0134] As the organic filler, organic fillers containing a rubber component can be widely used. Examples of the rubber component contained in the organic filler include silicone-based elastomers such as polydimethylsiloxane; olefin-based thermoplastic elastomers such as polybutadiene, polyisoprene, polychlorobutadiene, ethylene-vinyl acetate copolymer, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-isobutylene copolymer, acrylonitrile-butadiene copolymer, isoprene-isobutylene copolymer, isobutylene-butadiene copolymer, ethylene-propylene-diene terpolymer, and ethylene-propylene-butene terpolymer; and thermoplastic elastomers such as acrylic thermoplastic elastomers such as polypropyl(meth)acrylate, polybutyl(meth)acrylate, polycyclohexyl(meth)acrylate, and polyoctyl(meth)acrylate. Furthermore, silicone-based rubbers such as polyorganosiloxane rubber may be mixed into the rubber component. The rubber component contained in the rubber particles has a Tg of, for example, 0° C. or lower, preferably −10° C. or lower, more preferably −20° C. or lower, and even more preferably −30° C. or lower.

[0135] In one embodiment, the organic filler is a core-shell type rubber particle consisting of a core particle containing the above-mentioned rubber component and a shell part obtained by graft copolymerization of a monomer component copolymerizable with the rubber component contained in the core particle. Here, the core-shell type does not necessarily refer only to those in which the core particle and the shell part are clearly distinguishable, but also includes those in which the boundary between the core particle and the shell part is unclear, and the core particle does not necessarily have to be completely covered with the shell part.

[0136] Specific examples of organic fillers containing a rubber component include "CHT" manufactured by Cheil Industries; "B602" manufactured by UMGABS; "Paraloid EXL-2602", "Paraloid EXL-2603", "Paraloid EXL-2655", "Paraloid EXL-2311", "Paraloid-EXL2313", "Paraloid EXL-2315", "Paraloid KM-330", "Paraloid KM-336P", "Paraloid KCZ-201" manufactured by Dow; and "Metabrene C-2" manufactured by Mitsubishi Rayon. 23A", "Metablen E-901", "Metablen S-2001", "Metablen W-450A", "Metablen SRK-200", "Kane Ace M-511", "Kane Ace M-600", "Kane Ace M-400", "Kane Ace M-580", "Kane Ace MR-01" manufactured by Kaneka Corporation, and "Staphyloid AC3355", "Staphyloid AC3816", "Staphyloid AC3832", "Staphyloid AC4030", "Staphyloid AC3364" manufactured by Aica Kogyo Co., Ltd. These are core-shell type rubber particles.

[0137] When the resin composition contains the (G) component, the content of the (G) component in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more, based on 100% by mass of the resin components in the resin composition. The upper limit of the content is preferably 10% by mass or less, more preferably 8% by mass or less, 6% by mass or less, or 5% by mass or less.

[0138] <(H) Curing accelerator> The resin composition of the present invention may contain a curing accelerator as the component (H).

[0139] Examples of the component (H) include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, peroxide-based curing accelerators, etc. The curing accelerators may be used alone or in combination of two or more.

[0140] When the resin composition of the present invention contains the (H) component, the content of the (H) component in the resin composition, relative to 100 mass% of the resin components in the resin composition, is preferably 0.1 mass% or more, more preferably 0.5 mass% or more, and even more preferably 1 mass% or more, and the upper limit is preferably 5 mass% or less, more preferably 4 mass% or less, 3 mass% or less, or 2.5 mass% or less.

[0141] <Optional Additives> The resin composition of the present invention may further contain any additive. Examples of such additives include radical polymerization initiators such as peroxide radical polymerization initiators and azo radical polymerization initiators; thermoplastic resins such as phenoxy resins, polyvinyl acetal resins, polysulfone resins, polyethersulfone resins, polyetheretherketone resins, and polyester resins; organic metal compounds such as organic copper compounds, organic zinc compounds, and organic cobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone leveling agents and acrylic polymer leveling agents; thickeners such as bentone and montmorillonite; defoamers such as silicone defoamers, acrylic defoamers, fluorine defoamers, and vinyl resin defoamers; and purple absorbers such as benzotriazole ultraviolet absorbers. Examples of the suitable additives include ultraviolet ray absorbers; adhesion improvers such as urea silane; adhesion imparting agents such as triazole-based adhesion imparting agents, tetrazole-based adhesion imparting agents, and triazine-based adhesion imparting agents; antioxidants such as hindered phenol-based antioxidants; fluorescent brighteners such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, and red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic acid anhydride-based stabilizers. The content of such additives may be determined depending on the properties required for the resin composition.

[0142] <Organic solvent> The resin composition of the present invention may further contain an organic solvent as a volatile component. Examples of the organic solvent include ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, and diphenyl ether; alcohol-based solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methyl methoxypropionate. Examples of the organic solvent include ether ester solvents such as ethyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. The organic solvent may be used alone or in combination of two or more.

[0143] The resin composition of the present invention can be produced, for example, by adding and mixing the components (A), (B), and (C) in any preparation vessel, and optionally the components (D), (E), (F), (G), and (H), as well as other additives and organic solvents, in any order and / or all at once. In addition, the temperature can be appropriately set during the process of adding and mixing each component, and heating and / or cooling may be performed temporarily or throughout. In addition, during or after the process of adding and mixing, the resin composition may be stirred or shaken using a stirring device or shaking device such as a mixer to disperse the resin composition uniformly. In addition, degassing may be performed under low pressure conditions such as under vacuum at the same time as stirring or shaking.

[0144] As described above, the resin composition of the present invention containing the component (C) in combination with the components (A) and (B) exhibits good dielectric properties and can provide a cured product that exhibits good smear removal properties and crack resistance.

[0145] In one embodiment, the cured product of the resin composition of the present invention is characterized by a low dielectric loss tangent (Df). For example, when measured at 5.8 GHz and 23° C. as described in the <Measurement of Dielectric Loss Tangent> section below, the dielectric loss tangent (Df) of the cured product of the resin composition of the present invention may be preferably 0.0035 or less, 0.0034 or less, 0.0032 or less, 0.003 or less, 0.0028 or less, or 0.0026 or less.

[0146] As described above, the resin composition of the present invention can provide a cured product exhibiting good dielectric properties and good smear removability and crack resistance. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for insulating layer of printed wiring board), and can be more suitably used as a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for interlayer insulating layer of printed wiring board). The resin composition of the present invention can also be suitably used when the printed wiring board is a circuit board with built-in components. The resin composition of the present invention can also be suitably used as a resin composition for forming an insulating layer of a rewiring board of a semiconductor package (resin composition for insulating layer of rewiring board). In the present invention, the printed wiring board and the rewiring board are collectively referred to as "circuit board", and therefore the resin composition of the present invention can be suitably used for the insulating layer of a circuit board.

[0147] The resin composition of the present invention can further be used in a wide range of applications requiring a resin composition, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, hole filling resins, sealing resins, and component embedding resins.

[0148] [Sheet-type laminated materials (resin sheets, prepregs)] The resin composition of the present invention can be used as it is, but it may also be used in the form of a sheet-like laminate material containing the resin composition.

[0149] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0150] In one embodiment, the resin sheet includes a support and a layer of a resin composition (hereinafter simply referred to as a "resin composition layer") provided on the support, and is characterized in that the resin composition layer is formed from the resin composition of the present invention.

[0151] The thickness of the resin composition layer may vary depending on the application, and may be appropriately determined depending on the application. For example, the thickness of the resin composition layer is preferably 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less from the viewpoint of thinning of printed wiring boards and semiconductor packages. The lower limit of the thickness of the resin composition layer is not particularly limited, but may usually be 1 μm or more, 5 μm or more, etc.

[0152] Examples of the support include a thermoplastic resin film, a metal foil, and a release paper, and a thermoplastic resin film and a metal foil are preferred. Thus, in a preferred embodiment, the support is a thermoplastic resin film or a metal foil.

[0153] When a thermoplastic resin film is used as the support, examples of the thermoplastic resin include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0154] When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, etc., and copper foil is preferred. As the copper foil, a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0155] The support may be subjected to a matte treatment, a corona treatment, or an antistatic treatment on the surface to be bonded to the resin composition layer. In addition, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used as the support. The release agent used in the release layer of the support with a release layer may be, for example, one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. The support with a release layer may be a commercially available product, for example, "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Unipeel" manufactured by Unitika Limited, which are PET films having a release layer mainly composed of an alkyd resin-based release agent.

[0156] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the total thickness of the support with a release layer is in the above range.

[0157] When a metal foil is used as the support, a metal foil with a support substrate may be used, which is a thin metal foil with a peelable support substrate attached thereto. In one embodiment, the metal foil with a support substrate includes a support substrate, a release layer provided on the support substrate, and a metal foil provided on the release layer. When a metal foil with a support substrate is used as the support, the resin composition layer is provided on the metal foil.

[0158] In the metal foil with a supporting substrate, the material of the supporting substrate is not particularly limited, and examples thereof include copper foil, aluminum foil, stainless steel foil, titanium foil, copper alloy foil, etc. When copper foil is used as the supporting substrate, it may be electrolytic copper foil or rolled copper foil. In addition, the release layer is not particularly limited as long as it can release the metal foil from the supporting substrate, and examples thereof include an alloy layer of an element selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, and P; an organic coating, etc.

[0159] In the metal foil with a supporting substrate, the material of the metal foil is preferably, for example, copper foil or copper alloy foil.

[0160] In the metal foil with a supporting substrate, the thickness of the supporting substrate is not particularly limited, but is preferably in the range of 10 μm to 150 μm, more preferably in the range of 10 μm to 100 μm, and the thickness of the metal foil may be, for example, in the range of 0.1 μm to 10 μm.

[0161] In one embodiment, the resin sheet may further include an optional layer as necessary. For example, such an optional layer may be a protective film provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to suppress adhesion of dirt and the like to the surface of the resin composition layer and scratches.

[0162] The resin sheet can be produced, for example, by preparing a liquid resin composition as is or a resin varnish by dissolving the resin composition in an organic solvent, applying this onto a support using a die coater or the like, and then drying to form a resin composition layer.

[0163] The organic solvent may be the same as the organic solvent described as a component of the resin composition. The organic solvent may be used alone or in combination of two or more kinds.

[0164] Drying may be performed by a known method such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is performed so that the content of the organic solvent in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although it varies depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when a resin composition or resin varnish containing 30% by mass to 60% by mass of the organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0165] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0166] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.

[0167] The sheet-like fiber substrate used for the prepreg is not particularly limited, and can be a substrate commonly used for prepreg, such as glass cloth, aramid nonwoven fabric, or liquid crystal polymer nonwoven fabric. From the viewpoint of thinning of printed wiring boards and semiconductor chip packages, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber substrate is not particularly limited. It is usually 10 μm or more.

[0168] The prepreg can be produced by a known method such as a hot melt method or a solvent method.

[0169] The thickness of the prepreg may be in the same range as that of the resin composition layer in the above-mentioned resin sheet.

[0170] The sheet-like laminate material of the present invention can be suitably used to form an insulating layer of a printed wiring board (for the insulating layer of a printed wiring board), and can be more suitably used to form an interlayer insulating layer of a printed wiring board (for the insulating layer of a printed wiring board). The sheet-like laminate material of the present invention can also be suitably used to form an insulating layer of a rewiring board of a semiconductor package (for the insulating layer of a rewiring board). That is, the sheet-like laminate material of the present invention can be suitably used as an insulating layer of a circuit board.

[0171] [Circuit board] The resin composition of the present invention can be used to form an insulating layer for a circuit board. The present invention also provides such a circuit board, i.e., a circuit board including an insulating layer made of a cured product of the resin composition of the present invention.

[0172] <Printed wiring board> In one embodiment, the circuit board of the present invention is a printed wiring board.

[0173] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet, by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate such that a resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing (e.g., heat curing) the resin composition layer to form an insulating layer.

[0174] The "inner layer substrate" used in step (I) is a member that becomes the substrate of the printed wiring board, and examples thereof include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. The substrate may have a conductor layer on one or both sides, and the conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be called an "inner layer circuit substrate". In addition, an intermediate product on which an insulating layer and / or a conductor layer is to be formed during the manufacture of a printed wiring board is also included in the "inner layer substrate" of the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0175] The lamination of the inner layer substrate and the resin sheet can be carried out, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of the member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as the "thermocompression bonding member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). The thermocompression bonding member may be pressed directly onto the resin sheet, or may be pressed via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the surface irregularities of the inner layer substrate.

[0176] The lamination of the inner layer substrate and the resin sheet may be performed by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably in the range of 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. The lamination may be performed under reduced pressure conditions, preferably at a pressure of 26.7hPa or less.

[0177] The lamination can be performed by a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch type vacuum pressure laminator.

[0178] After lamination, the laminated resin sheet may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for the lamination. The smoothing treatment may be performed using a commercially available laminator. The lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0179] The support may be removed between step (I) and step (II), or after step (II). When a metal foil is used as the support, the conductor layer may be formed using the metal foil without peeling off the support. When a metal foil with a support substrate is used as the support, the support substrate (and the peel layer) may be peeled off. Then, the conductor layer can be formed using the metal foil.

[0180] In step (II), the resin composition layer is cured (for example, thermally cured) to form an insulating layer made of a cured product of the resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions that are usually adopted when forming an insulating layer for a printed wiring board may be used.

[0181] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, etc., but in one embodiment, the curing temperature is preferably 140° C. to 250° C., more preferably 150° C. to 240° C., and even more preferably 160° C. to 230° C. The curing time is preferably 5 minutes to 240 minutes, more preferably 10 minutes to 150 minutes, and even more preferably 15 minutes to 120 minutes.

[0182] Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50° C. to 140° C., preferably 60° C. to 135° C., more preferably 70° C. to 130° C. for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0183] In manufacturing a printed wiring board, the steps of (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer may be further carried out. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art that are used in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be carried out between step (II) and step (III), between step (III) and step (IV), or between step (IV) and step (V). In addition, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board, as necessary.

[0184] In another embodiment, the printed wiring board of the present invention can be manufactured using the above-mentioned prepreg. The manufacturing method is basically the same as when a resin sheet is used.

[0185] Step (III) is a step of drilling holes in the insulating layer, which allows holes such as via holes and through holes to be formed in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, etc., depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be appropriately determined depending on the design of the printed wiring board.

[0186] Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smear removal (desmear) is also performed. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions that are usually used when forming an insulating layer of a printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0187] The swelling liquid used in the roughening treatment is not particularly limited, but includes an alkaline solution, a surfactant solution, etc., and is preferably an alkaline solution, and more preferably a sodium hydroxide solution or a potassium hydroxide solution. Examples of commercially available swelling liquids include "Swelling Dip Securigans P" and "Swelling Dip Securigans SBU" manufactured by Atotech Japan. The swelling treatment using the swelling liquid is not particularly limited, but can be performed by immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes, for example. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0188] The oxidizing agent used in the roughening treatment is not particularly limited, but examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment using an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 minutes to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP", "Concentrate Compact P", and "Dosing Solution Securigans P" manufactured by Atotech Japan.

[0189] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product such as "Reduction Solution Securigant P" manufactured by Atotech Japan can be mentioned.

[0190] The treatment with the neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30° C. to 80° C. for 5 to 30 minutes. From the viewpoint of workability, etc., a method in which the object that has been roughened with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 to 20 minutes is preferred.

[0191] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. The conductor layer may be a single metal layer or an alloy layer, and examples of the alloy layer include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy and copper-titanium alloy). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, and the like, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0192] The conductor layer may be a single-layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different kinds of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

[0193] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, and preferably 5 μm to 30 μm.

[0194] In one embodiment, the conductor layer may be formed by plating. From the viewpoint of facilitating the formation of fine wiring, it is preferable to form the conductor layer by a semi-additive method. An example of forming the conductor layer by the semi-additive method will be described below.

[0195] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to a desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

[0196] In another embodiment, the conductor layer may be formed using a metal foil. When the conductor layer is formed using a metal foil, it is preferable to carry out the step (V) between the steps (I) and (II). For example, after the step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The lamination of the resin composition layer and the metal foil may be carried out by a vacuum lamination method. The lamination conditions may be the same as those described for the step (I). Then, the step (II) is carried out to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed by a conventionally known technique such as a modified semi-additive method, using the metal foil on the insulating layer.

[0197] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Commercially available metal foils include, for example, HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0198] Alternatively, when a metal foil or a metal foil with a supporting substrate is used as the support for the resin sheet, the conductor layer may be formed using the metal foil, as described above.

[0199] <Rewiring substrate for semiconductor packages> In one embodiment, the circuit board of the present invention is a rewiring board (rewiring layer) of a semiconductor package. Hereinafter, a method for manufacturing a semiconductor package will be described.

[0200] The semiconductor package includes an insulating layer made of the cured product of the resin composition of the present invention as an insulating layer of a rewiring board. The semiconductor package may also include a sealing layer made of the cured product of the resin composition of the present invention.

[0201] A semiconductor package can be manufactured, for example, by a method including the following steps (1) to (6) using the resin composition and resin sheet of the present invention. The resin composition and resin sheet of the present invention may be used to form a rewiring formation layer (insulating layer for forming a rewiring board) in step (5) or a sealing layer in step (3). An example of forming a rewiring formation layer or a sealing layer using a resin composition or a resin sheet is shown below, but the technology for forming a rewiring formation layer or a sealing layer of a semiconductor package is publicly known, and a person skilled in the art can manufacture a semiconductor package using the resin composition and resin sheet of the present invention according to a publicly known technology. (1) A step of laminating a temporary fixing film onto a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A process of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0202] -Process (1)- The material used for the substrate is not particularly limited. Examples of the substrate include semiconductor wafers such as silicon wafers, glass wafers, glass substrates, metal substrates such as copper, titanium, stainless steel, and cold-rolled steel (SPCC), substrates in which glass fibers are impregnated with epoxy resin or the like and subjected to a heat curing treatment (e.g., FR-4 substrates), and substrates made of bismaleimide triazine resin (BT resin).

[0203] The material of the temporary fixing film is not particularly limited as long as it can be peeled off from the semiconductor chip in step (4) and can temporarily fix the semiconductor chip. A commercially available product can be used as the temporary fixing film. An example of the commercially available product is Riva Alpha manufactured by Nitto Denko Corporation.

[0204] -Process (2)- The semiconductor chips can be temporarily fixed using known devices such as a flip chip bonder, a die bonder, etc. The layout and number of semiconductor chips can be appropriately set depending on the shape and size of the temporary fixing film, the number of semiconductor packages to be produced, etc., and for example, the semiconductor chips can be temporarily fixed by arranging them in a matrix shape of multiple rows and multiple columns.

[0205] -Process (3)- A resin composition layer of the resin sheet of the present invention is laminated on a semiconductor chip, or the resin composition of the present invention is applied onto a semiconductor chip and cured (for example, thermally cured) to form an encapsulating layer.

[0206] For example, the semiconductor chip and the resin sheet can be laminated by removing the protective film of the resin sheet and then heat-pressing the resin sheet to the semiconductor chip from the support side. Examples of the member for heat-pressing the resin sheet to the semiconductor chip (hereinafter also referred to as the "heat-pressing member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the heat-pressing member not directly onto the resin sheet but via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the surface irregularities of the semiconductor chip. The semiconductor chip and the resin sheet may be laminated by a vacuum lamination method, and the lamination conditions are the same as those described in relation to the manufacturing method of the printed wiring board, and the preferred ranges are also the same.

[0207] After lamination, the resin composition is thermally cured to form the encapsulating layer under the same conditions as those described in relation to the method for producing a printed wiring board.

[0208] The support of the resin sheet may be peeled off after the resin sheet is laminated on the semiconductor chip and thermally cured, or the support may be peeled off before the resin sheet is laminated on the semiconductor chip.

[0209] When the resin composition of the present invention is applied to form a sealing layer, the application conditions are the same as the application conditions when forming the resin composition layer described in relation to the resin sheet of the present invention, and the preferred ranges are also the same.

[0210] -Process (4)- The method for peeling off the substrate and the temporary fixing film can be appropriately changed depending on the material of the temporary fixing film, and examples of the method include a method in which the temporary fixing film is heated and foamed (or expanded) to peel it off, and a method in which ultraviolet light is irradiated from the substrate side to reduce the adhesive strength of the temporary fixing film and then peeled off.

[0211] In the method of heating and foaming (or expanding) the temporary fixing film to peel it off, the heating conditions are usually 100 to 250° C. for 1 to 90 seconds or 5 to 15 minutes. In the method of irradiating ultraviolet light from the substrate side to reduce the adhesive strength of the temporary fixing film to peel it off, the irradiation dose of ultraviolet light is usually 10 mJ / cm. 2 ~1000mJ / cm 2 It is.

[0212] -Process (5)- The resin composition and resin sheet of the present invention are used to form a rewiring formation layer (insulating layer of a rewiring board).

[0213] After forming the redistribution layer, a via hole may be formed in the redistribution layer to connect the semiconductor chip to a conductor layer described later. The via hole may be formed by a known method depending on the material of the redistribution layer.

[0214] -Process (6)- The formation of the conductor layer on the rewiring formation layer may be carried out in the same manner as in step (V) described in relation to the method for producing a printed wiring board. Note that steps (5) and (6) may be repeated to alternately stack (build up) the conductor layer (rewiring layer) and the rewiring formation layer (insulating layer).

[0215] In manufacturing the semiconductor package, the steps of (7) forming a solder resist layer on the conductor layer (rewiring layer), (8) forming bumps, and (9) dicing a plurality of semiconductor packages into individual semiconductor packages may be further carried out. These steps may be carried out according to various methods used in manufacturing semiconductor packages and known to those skilled in the art.

[0216] By forming a rewiring formation layer (insulating layer) using the resin composition and resin sheet of the present invention, which can provide a cured product exhibiting good dielectric properties, good smear removal properties, and crack resistance, a semiconductor package with extremely low transmission loss can be realized without worrying about cracks, regardless of whether the semiconductor package is a fan-in (Fan-In) type package or a fan-out (Fan-Out) type package. In one embodiment, the semiconductor package of the present invention is a fan-out (Fan-Out) type package. The resin composition and resin sheet of the present invention can be applied to any type of package, whether it is a fan-out type panel level package (FOPLP) or a fan-out type wafer level package (FOWLP). In one embodiment, the semiconductor package of the present invention is a fan-out type panel level package (FOPLP) or a fan-out type wafer level package (FOWLP).

[0217] [Semiconductor Devices] The semiconductor device of the present invention includes a layer made of a cured product of the resin composition layer of the present invention. The semiconductor device of the present invention can be produced by using the circuit board of the present invention.

[0218] Examples of the semiconductor device include various semiconductor devices used in electric appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). EXAMPLES

[0219] The present invention will be specifically described below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified.

[0220] <Synthesis Example 1: Synthesis of Active Ester Resin A> In a flask equipped with a thermometer, a dropping funnel, a cooling tube, a fractionating tube, and a stirrer, 203.0 g of isophthalic acid chloride (molar number of acid chloride groups: 2.0 mol) and 1400 g of toluene were charged, and the inside of the system was reduced pressure and replaced with nitrogen to dissolve. Next, 113.9 g (0.67 mol) of orthophenylphenol and 240 g of dihydroxynaphthalene having a benzyl group (molar number of phenolic hydroxyl groups: 1.33 mol) were charged, and the inside of the system was reduced pressure and replaced with nitrogen to dissolve. Then, 0.70 g of tetrabutylammonium bromide was dissolved, and while applying a nitrogen gas purge, the inside of the system was controlled to 60°C or less, and 400 g of 20% aqueous sodium hydroxide solution was dropped over 3 hours. Then, stirring was continued under these conditions for 1.0 hour. After the reaction was completed, the mixture was left to stand and separated, and the aqueous layer was removed. Furthermore, water was added to the toluene layer in which the reactant was dissolved, and the mixture was stirred and mixed for 15 minutes, and the aqueous layer was left to stand and separated to remove the aqueous layer. This operation was repeated until the pH of the aqueous layer reached 7. Thereafter, water was removed by decanting to obtain active ester resin A (active ester resin containing a naphthalene structure) in the form of a toluene solution with a non-volatile content of 65% by mass. The active ester group equivalent of the obtained active ester resin A was 238 g / eq.

[0221] <Synthesis Example 2: Synthesis of Maleimide Compound A> According to Synthesis Example 1 of the Japan Institute of Invention and Innovation's Technical Journal Publication No. 2020-500211, an MEK solution (non-volatile content 62% by mass) of maleimide compound A represented by the following formula (M) was prepared. The Mw / Mn of this maleimide compound A was 1.81, and t'' in formula (M) was 1.47 (mainly 1, 2, or 3).

[0222] [ka]

[0223] <Synthesis Example 3: Synthesis of vinyl compound A> According to Example 1 of WO 2017 / 115813, 3.0 mol (390.6 g) of divinylbenzene, 1.8 mol (229.4 g) of ethylvinylbenzene, 10.2 mol (1066.3 g) of styrene, and 15.0 mol (1532.0 g) of n-propyl acetate were charged into a 5.0 L reactor, and 600 mmol of a diethyl ether complex of boron trifluoride was added at 70 ° C. and reacted for 4 hours. After the polymerization solution was stopped with an aqueous sodium bicarbonate solution, the oil layer was washed three times with pure water, and the polymer was recovered by degassing at 60 ° C. The obtained product was weighed, and it was confirmed that 896.7 g of vinyl compound A was obtained. The Mw of vinyl compound A was 41300.

[0224] [Examples 1 to 9, Comparative Examples 1 to 3] (1) Preparation of resin composition Each component was weighed according to the composition shown in Table 1, and then 10 parts of MEK and 10 parts of cyclohexanone were added and mixed together. The mixture was uniformly dispersed using a high-speed rotating mixer to obtain a resin composition (resin varnish).

[0225] (2) Manufacturing of resin sheets A polyethylene terephthalate film with a release layer ("AL5" manufactured by Lintec Corporation, thickness 38 μm) was prepared as a support. The obtained resin varnish was uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying would be 40 μm. Thereafter, the resin composition was dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet A having a layer structure of a resin composition layer / support. Moreover, a resin sheet B was obtained in the same manner as above, except that the resin varnish was uniformly applied so that the thickness of the resin composition layer after drying was 25 μm.

[0226] <Measurement of dielectric tangent> The resin sheet A obtained in the examples and comparative examples was heated in an oven at 190°C for 90 minutes to cure the resin composition layer. The support was then peeled off to obtain a cured product of the resin composition layer. The cured product was cut into a length of 80 mm and a width of 2 mm to be used as a cured product for evaluation.

[0227] For each evaluation cured product, the dielectric tangent value (Df value) was measured by the cavity resonance perturbation method using an "HP8362B" manufactured by Agilent Technologies, Inc., at a measurement frequency of 5.8 GHz and a measurement temperature of 23° C. Measurement was performed on two test pieces, and the average was calculated.

[0228] <Evaluation of smear removal> (1) Preparation of inner layer board Both sides of a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed were etched 1 μm with a microetching agent (Mec "CZ8101") to roughen the copper surface.

[0229] (2) Lamination of resin sheet A Using a batch-type vacuum pressure laminator (two-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.), the resin sheet A obtained in the examples and comparative examples was laminated on both sides of the inner layer substrate so that the resin composition layer was in contact with the inner layer substrate. The lamination was performed by reducing the pressure for 30 seconds to adjust the air pressure to 13 hPa or less, and then pressing at 120°C and a pressure of 0.74 MPa for 30 seconds. Next, the laminate was heat-pressed at 100°C and a pressure of 0.5 MPa for 60 seconds to smooth it.

[0230] (3) Thermal curing of the resin composition layer Thereafter, the inner layer substrate on which the resin sheet A was laminated was placed in an oven at 130° C. and heated for 30 minutes, and then transferred to an oven at 170° C. and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. Thereafter, the support was peeled off to obtain a cured substrate having a structure of insulating layer / inner layer substrate / insulating layer.

[0231] (4) Formation of via holes The insulating layer of the obtained cured substrate was drilled using a CO2 laser processing machine (Via Mechanics' "LK-2K212 / 2C") under the conditions of a frequency of 2000 Hz, a pulse width of 3 μs, an output of 0.95 W, and a shot number of 3. In this way, a via hole with a top diameter of 50 μm on the insulating layer surface and a diameter of 50 μm on the insulating layer bottom surface was formed, and Substrate A was obtained.

[0232] (5) Roughening treatment The substrate A was subjected to a desmear treatment as a roughening treatment by the following wet desmear treatment. (Wet desmear treatment) The cured substrate was immersed in a swelling solution (Atotech Japan's "Swelling Dip Securigant P", an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 10 minutes, then in an oxidizing agent solution (Atotech Japan's "Concentrate Compact P", an aqueous solution of potassium permanganate at about 6% and sodium hydroxide at about 4%) at 80°C for 25 minutes, and finally in a neutralizing solution (Atotech Japan's "Reduction Solution Securigant P", an aqueous solution of sulfuric acid) at 40°C for 5 minutes. It was then dried at 80°C for 15 minutes. The obtained substrate is called Evaluation Substrate A.

[0233] (6) Evaluation of smear removal For evaluation substrate A, the periphery of the bottom of the via hole was observed with a scanning electron microscope (SEM), and the maximum smear length from the wall surface of the bottom of the via hole was measured from the obtained image and evaluated according to the following criteria. ○: Maximum smear length is less than 5 μm ×: Maximum smear length is 5 μm or more

[0234] <Evaluation of crack resistance after desmear treatment> (1) Preparation of inner layer board A core material (Hitachi Chemical Co., Ltd. "E705GR", thickness 400 μm) was prepared, in which circular copper pads with a diameter of 350 μm (copper thickness 35 μm) were formed in a lattice pattern at intervals of 400 μm so that the remaining copper ratio was 60%.

[0235] (2) Lamination of resin sheet B Using a batch-type vacuum pressure laminator (two-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.), the resin sheet B obtained in the examples and comparative examples was laminated on both sides of the inner layer substrate so that the resin composition layer was in contact with the inner layer substrate. The lamination was performed by reducing the pressure for 30 seconds to adjust the air pressure to 13 hPa or less, and then pressing at 100°C and a pressure of 0.74 MPa for 30 seconds. Next, the laminate was heat-pressed at 100°C and a pressure of 0.5 MPa for 60 seconds to smooth it.

[0236] (3) Thermal curing of the resin composition layer Thereafter, the inner layer substrate on which the resin sheet B was laminated was placed in an oven at 130° C. and heated for 30 minutes, and then transferred to an oven at 175° C. and heated for 40 minutes to thermally cure the resin composition layer and form an insulating layer. Thereafter, the support was peeled off to obtain a cured substrate having a structure of insulating layer / inner layer substrate / insulating layer.

[0237] (4) Desmearing The obtained cured substrate was immersed in a swelling liquid (Atotech Japan's "Swelling Dip Securigant P", an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 10 minutes, then in an oxidizing agent solution (Atotech Japan's "Concentrate Compact P", an aqueous solution of potassium permanganate at about 6% and sodium hydroxide at about 4%) at 80°C for 30 minutes, and finally in a neutralizing solution (Atotech Japan's "Reduction Solution Securigant P", an aqueous solution of sulfuric acid) at 40°C for 5 minutes. It was then dried at 80°C for 15 minutes. The obtained substrate is called evaluation substrate B.

[0238] (5) Evaluation of crack resistance For evaluation board B, 100 copper pads were observed to check for the presence or absence of cracks in the insulating layer, and evaluated according to the following criteria. ○: 10 or less cracks ×: More than 10 cracks

[0239] The results of Examples 1 to 9 and Comparative Examples 1 to 3 are shown in Table 1.

[0240] [Table 1]

[0241] The details of each component listed in Table 1 are as follows. (A) Epoxy resin ZX1059: Functional group equivalent weight 169g / eq, manufactured by Nippon Steel Chemical & Material Co., Ltd., 1:1 mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin HP-4032-SS: Functional group equivalent weight 144g / eq, manufactured by DIC, naphthalene type epoxy resin NC-3000L: Functional group equivalent weight 269g / eq, manufactured by Nippon Kayaku Co., Ltd., biphenyl type epoxy resin (B) Active ester resin HPC-8150-62T: Functional group equivalent weight 223g / eq, non-volatile content 61.5% by mass in toluene solution, manufactured by DIC Corporation, active ester resin with naphthalene structure HPC-8000L-65MT: Functional group equivalent weight 229g / eq, non-volatile content 65% by mass in toluene / MEK solution, manufactured by DIC Corporation, active ester resin containing dicyclopentadiene-type diphenol structure Active ester resin A: Active ester resin synthesized in Synthesis Example 1 -(C) (Meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms- PEAM1769: manufactured by Designor Molecular Systems, Inc., a (meth)acrylate compound having a structure represented by the following formula (C-1) (wherein R S1 is a C8 alkyl group, R S2 is a C5 or C6 alkyl group, n is 1 to 5) [ka] (D) Other hardeners LA-3018-50P: 1-methoxy-2-propanol solution with functional group equivalent of 151 g / eq and non-volatile content of 50% by mass, manufactured by DIC Corporation (E) Inorganic filler SO-C2: Spherical silica surface-treated with an amino-silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573"), average particle size 0.5 μm, specific surface area 5.8 m 2 / g, manufactured by Admatechs Co., Ltd. (F) Compound containing a radically polymerizable unsaturated group Maleimide compound A: The maleimide compound synthesized in Synthesis Example 2 MIR-3000-70MT: toluene / MEK solution with 70% non-volatile content, manufactured by Nippon Kayaku Co., Ltd., a maleimide compound having an aromatic ring skeleton directly bonded to the nitrogen atom of a maleimide group and having a structure represented by the following formula (wherein n is 1 to 100): [ka] SLK-6895: Shin-Etsu Chemical Co., Ltd., maleimide compound containing an aliphatic skeleton SLK-1500: Shin-Etsu Chemical Co., Ltd., maleimide compound containing an aliphatic skeleton OPE-2St-1200: toluene solution with 65% non-volatile content, manufactured by Mitsubishi Gas Chemical Co., Ltd. Vinyl compound A: The vinyl compound synthesized in Synthesis Example 3 NE-V-1100-70T: toluene solution with 70% non-volatile content, manufactured by DIC ·A-DOG: Manufactured by Shin-Nakamura Chemical Industry Co., Ltd. -(G)Organic filler- EXL-2655: Organic filler containing rubber components, manufactured by Dow -(H) Curing accelerator- 1B2PZ: Shikoku Chemical Industry Co., Ltd., imidazole-based curing accelerator

Claims

1. (A) an epoxy resin, (B) an active ester resin, and (C) (Meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms A resin composition comprising:

2. 2. The resin composition according to claim 1, wherein a mass ratio of the component (B) to the component (A) [component (B) / component (A)] is 0.8 or more.

3. The resin composition according to claim 1 , wherein the content of the component (C) is 0.5% by mass or more when the resin component in the resin composition is 100% by mass.

4. The resin composition according to claim 1 , wherein the component (C) contains a divalent aliphatic group represented by the following formula (1): 【Chemistry 1】 (In formula (1), A Ｃ each independently represents a single bond or a divalent aliphatic group, Ring Z Ｃ represents an aliphatic ring which may have a substituent, * represents a bond, Two Aces Ｃ and Ring Z Ｃ The total number of carbon atoms is 10 or more.

5. The resin composition according to claim 1, wherein the component (C) has a structure represented by the following formula (C1): 【Chemistry 2】 (In formula (C1), Each X independently represents a (meth)acryloyl group; A １ each independently represents a divalent aliphatic group, A ２ each independently represents a divalent aliphatic group having 10 or more carbon atoms, L １ each independently represents a divalent linking group, n1 represents a number of 1 or more.

6. The resin composition according to claim 1, wherein the component (C) has a structure represented by the following formula (C1-1): 【Chemistry 3】 (In formula (C1-1), Each X independently represents a (meth)acryloyl group; A １１ each independently represents an alkylene group having 1 to 12 carbon atoms, A ２１ each independently represents an alkylene group having 1 to 12 carbon atoms or an alkenylene group having 2 to 12 carbon atoms, Ring Z １ each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, Ring Z ２ each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent, n11 represents a number from 1 to 10.

7. In formula (C1-1), Each X independently represents a (meth)acryloyl group; A １１ represents an alkylene group having one carbon atom, A ２１ represents an alkylene group having 7 carbon atoms, Ring Z １ represents a tricyclodecane ring, Ring Z ２ represents a cyclohexane ring substituted with two alkyl groups having 5 to 8 carbon atoms; The resin composition according to claim 6, wherein n11 represents a number from 1 to 5.

8. The resin composition according to claim 1 , further comprising (E) an inorganic filler.

9. The resin composition according to claim 8, wherein the content of the component (E) is 40% by mass or more when the nonvolatile components in the resin composition are taken as 100% by mass.

10. The resin composition according to claim 1 , further comprising (F) a compound having a radically polymerizable unsaturated group (excluding component (C)).

11. The resin composition according to claim 1, which is used for an insulating layer of a circuit board.

12. A resin sheet comprising a support and a layer of the resin composition according to any one of claims 1 to 11 provided on the support.

13. The resin sheet according to claim 12, wherein the support is a thermoplastic resin film or a metal foil.

14. A cured product of the resin composition according to any one of claims 1 to 11.

15. A circuit board comprising an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 11.

16. A semiconductor device comprising the circuit board according to claim 15.

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