Vehicle lighting device and vehicle lamp fitting

Abstract

To provide a vehicle lighting device which can inhibit change of a relative position between a frame part and a light emitting element when the frame part is joined onto a substrate, and to provide a vehicle lamp fitting.SOLUTION: A vehicle lighting device according to an embodiment includes: a socket; a substrate provided at one end side of the socket; a light emitting element provided on the substrate; a frame part provided on the substrate and enclosing the light emitting element; a joint part provided between the substrate and the frame part and containing a first metal; a first joint layer provided between the substrate and the joint part, joined to the substrate and the joint part, and containing a second metal; and a second joint layer provided between the frame part and the joint part, joined to the frame part and the joint part, and containing a third metal. A melting point of the first metal is lower than a melting point of the second metal and a melting point of the third metal.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] An embodiment of the present invention relates to a vehicle lighting device and a vehicle lamp. [Background technology]

[0002] From the viewpoint of energy saving and long life, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming more and more popular instead of vehicle lighting devices equipped with lamps having filaments. Such vehicle lighting devices include a socket and a light emitting module provided on one end side of the socket. The light emitting module includes, for example, a substrate, a chip-shaped light emitting element provided on the substrate, and a frame portion that surrounds the chip-shaped light emitting element and is bonded to the substrate.

[0003] Here, the adhesive that bonds the frame requires a certain time to completely harden. Therefore, if an external force such as vibration is applied to the substrate or frame before the adhesive hardens, the relative position between the frame and the light-emitting element may change. In this case, since the frame has a function of a reflector that reflects the light irradiated from the light-emitting element, if the relative position between the frame and the light-emitting element changes, there is a risk that a predetermined light distribution characteristic or light distribution pattern may not be obtained.

[0004] Therefore, there has been a demand for the development of a technique that can prevent the relative position between the frame and the light-emitting element from changing when the frame is bonded onto the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2013-247061 A Summary of the Invention [Problem to be solved by the invention]

[0006] The problem that the present invention aims to solve is to provide a vehicle lighting device and a vehicle lamp that can suppress change in the relative position between a frame portion and a light-emitting element when the frame portion is joined onto a substrate. [Means for solving the problem]

[0007] A vehicle lighting device according to an embodiment includes a socket, a substrate provided on one end of the socket, a light-emitting element provided on the substrate, a frame portion provided on the substrate and surrounding the light-emitting element, a joint portion provided between the substrate and the frame portion and including a first metal, a first joint layer provided between the substrate and the joint portion and joined to the substrate and the joint portion and including a second metal, and a second joint layer provided between the frame portion and the joint portion and joined to the frame portion and including a third metal. The melting point of the first metal is lower than the melting point of the second metal and the melting point of the third metal. Effect of the Invention

[0008] According to an embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can suppress change in the relative position between a frame portion and a light-emitting element when the frame portion is joined onto a substrate. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic exploded view illustrating a vehicle lighting device according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the vehicle lighting device taken along line AA in FIG. 1. [Diagram 3] 2 is a schematic cross-sectional view illustrating a joint portion between a frame portion 23 and a substrate 21. FIG. [Figure 4] 10A and 10B are schematic cross-sectional views illustrating a joint portion between a frame portion and a substrate according to another embodiment. [Diagram 5] 13 is a schematic partial side view illustrating a frame portion according to another embodiment. FIG. [Figure 6]1 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

[0011] (Vehicle lighting device) The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railcar. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0012] FIG. 1 is a schematic exploded view illustrating a vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG. As shown in FIGS. 1 and 2, a vehicle lighting device 1 includes a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40, for example.

[0013] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 may be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

[0014] The bayonet 12 is provided, for example, on a side surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1, for example, to a housing 101 of a vehicle lamp 100 described later. The bayonet 12 may be used for a twist lock.

[0015] The flange 13 has a plate shape. The flange 13 has, for example, a substantially circular plate shape. A side surface of the flange 13 is located outward of the vehicle lighting device 1 from a side surface of the bayonet 12.

[0016] The heat dissipating fin 14 is provided on the side of the flange 13 opposite to the mounting portion 11. At least one heat dissipating fin 14 may be provided. For example, as shown in Figs. 1 and 2, a plurality of heat dissipating fins 14 may be provided on the socket 10. The plurality of heat dissipating fins 14 may be arranged side by side in a predetermined direction. The heat dissipating fin 14 has, for example, a plate or cylinder shape.

[0017] The connector holder 15 is provided on the opposite side of the flange 13 to the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a therein is inserted into the connector holder 15.

[0018] The socket 10 has a function of holding the light-emitting module 20 and the power supply unit 30, and a function of transferring heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably made of a material with high thermal conductivity. The socket 10 can be made of a metal such as an aluminum alloy, for example.

[0019] The socket 10 can also be made of, for example, a highly thermally conductive resin. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or Nylon mixed with a filler using carbon or aluminum oxide. If the socket 10 contains a highly thermally conductive resin, the heat generated in the light-emitting module 20 can be efficiently dissipated. Also, the weight of the socket 10 can be reduced.

[0020] The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 . The power supply terminals 31 may be rod-shaped. One end of each of the power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of each of the power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted to the power supply terminals 31 exposed inside the hole of the connector holder 15. The power supply terminals 31 are formed of a metal such as a copper alloy. The shape, arrangement, material, and the like of the power supply terminals 31 are not limited to those exemplified, and may be changed as appropriate.

[0021] When the socket 10 is formed using, for example, a highly thermally conductive resin containing a filler using carbon, or a metal, the socket 10 becomes conductive. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the conductive socket 10. Note that when the socket 10 is formed using an insulating highly thermally conductive resin (for example, a highly thermally conductive resin containing a filler using aluminum oxide), the holding portion 32 can be omitted. For example, the holding portion 32 can be pressed into a hole provided in the socket 10 or adhered to the inner wall of the hole.

[0022] The heat transfer section 40 has a plate shape and is provided between the socket 10 and the light emitting module 20 (substrate 21). As shown in Fig. 1 and Fig. 2, the heat transfer section 40 can be adhered to, for example, the bottom surface 11a1 of the recess 11a. The heat transfer section 40 can be adhered to the inside of a recess provided in the bottom surface 11a1 of the recess 11a, attached to the inside of the recess via thermally conductive grease (heat dissipating grease), or embedded in the inside of the recess by insert molding.

[0023] The heat transfer unit 40 is made of a material with high thermal conductivity. For example, the heat transfer unit 40 is made of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. Note that if the socket 10 is made of a metal or if the amount of heat generated in the light-emitting module 20 is small, the heat transfer unit 40 can be omitted.

[0024] The light emitting module 20 (substrate 21) is provided on one end side of the socket 10. For example, the light emitting module 20 is provided on a heat transfer section 40. As shown in FIGS. 1 and 2, a light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, a circuit element 25, and a joint portion 26.

[0025] The substrate 21 is adhered, for example, onto the heat transfer section 40. In the case where the heat transfer section 40 is omitted, the substrate 21 is adhered, for example, to the bottom surface 11a1 of the recess 11a. The adhesive for adhering the substrate 21 is preferably an adhesive with high thermal conductivity. For example, the adhesive may be an adhesive mixed with a filler using a conductive material or an inorganic material.

[0026] The substrate 21 has a plate shape. The planar shape of the substrate 21 (the shape when viewed from a direction along the central axis 1a of the vehicle lighting device 1) is, for example, substantially rectangular. The substrate 21 can be formed from, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is covered with an insulating material. The substrate 21 may also have a single-layer structure or a multi-layer structure.

[0027] Moreover, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is formed from, for example, a material containing silver as a main component or a material containing copper as a main component. In addition, a covering portion may be provided to cover the wiring pattern 21a, a film resistor described later, etc. The covering portion may include, for example, a glass material.

[0028] The light-emitting element 22 is provided on the substrate 21 (the surface of the substrate 21 opposite to the socket 10 side). The light-emitting element 22 is electrically connected to the wiring pattern 21a. At least one light-emitting element 22 can be provided. The vehicle lighting device 1 (light-emitting module 20) illustrated in Figs. 1 and 2 is provided with a plurality of light-emitting elements 22. When a plurality of light-emitting elements 22 are provided, the plurality of light-emitting elements 22 can be connected in series.

[0029] The light emitting elements 22 may be, for example, light emitting diodes, organic light emitting diodes, laser diodes, or the like.

[0030] The light emitting element 22 may be a chip-shaped light emitting element. If the light emitting element is a chip-shaped light emitting element, the light emitting module 20 can be made smaller, and the vehicle lighting device 1 can be made smaller.

[0031] The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-shaped light-emitting element 22 may be any of an upper electrode type light-emitting element, a top and bottom electrode type light-emitting element, and a flip chip type light-emitting element.

[0032] Frame portion 23 is provided on substrate 21. Frame portion 23 is joined to substrate 21 via joint portion 26. The joining of frame portion 23 and substrate 21 by joint portion 26 will be described later. The frame portion 23 has a frame shape and surrounds the light emitting element 22. The outline of the planar shape of the frame portion 23 (the shape when viewed from a direction along the central axis 1a of the vehicle lighting device 1) can be appropriately changed according to the required light distribution characteristics, luminance distribution, etc. For example, the outline of the planar shape of the frame portion 23 can be a circle, a rectangle, an ellipse, etc.

[0033] The frame 23 is formed of, for example, a resin. The resin may be, for example, a thermoplastic resin such as polybutylene terephthalate (PBT), polycarbonate (PC), PET, nylon, polypropylene (PP), polyethylene (PE), or polystyrene (PS).

[0034] The frame 23 has a function of defining the formation range of the sealing portion 24 and a function of a reflector. Therefore, the frame 23 may contain titanium oxide particles or a white resin in order to improve the reflectance. If the frame 23 is provided, the utilization efficiency of the light irradiated from the light emitting element 22 can be improved. In addition, since the formation range of the sealing portion 24 can be reduced, the light emitting module 20 can be made smaller, and the vehicle lighting device 1 can be made smaller.

[0035] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having light-transmitting properties. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, silicone resin. The sealing portion 24 may also contain a phosphor.

[0036] In addition, optical elements and the like can be provided as necessary. Examples of the optical elements include a convex lens, a concave lens, a light guide, etc. The optical elements can be provided on the sealing portion 24, for example.

[0037] The circuit element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The circuit element 25 is provided on the substrate 21. The circuit element 25 is provided, for example, on the periphery of the frame portion 23, and is electrically connected to the wiring pattern 21a. The circuit element 25 is electrically connected to the light-emitting element 22 via the wiring pattern 21a.

[0038] The circuit elements 25 illustrated in FIG. 1 include a protection element 25a, a resistor 25b, and a control element 25c. However, the type of the circuit element 25 is not limited to the exemplified ones, and can be changed appropriately depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, the circuit element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor, an integrated circuit, a computing element, etc., in addition to those mentioned above.

[0039] The protective element 25a is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The protective element 25a may be, for example, a diode. The protective element 25a illustrated in FIG. 1 is a surface-mounted diode.

[0040] The resistor 25b may be, for example, a surface mount resistor, a resistor having leads (metal oxide film resistor), a film resistor formed by using a screen printing method, etc. The resistor 25b illustrated in FIG. 1 is a film resistor.

[0041] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the voltage applied between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is controlled to be within a predetermined range by the resistor 25b connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25b is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

[0042] When the resistor 25b is a surface mount resistor or a resistor with leads, the resistor 25b having an appropriate resistance value is selected according to the forward voltage characteristics of the light emitting element 22. When the resistor 25b is a film resistor, the resistance value can be increased by removing a part of the resistor 25b. For example, by irradiating a laser beam onto a film resistor, a part of the film resistor can be easily removed. Note that the number, arrangement, size, etc. of the resistors 25b are not limited to those exemplified, and can be appropriately changed according to the number and specifications of the light emitting elements 22.

[0043] The control element 25c is provided, for example, to switch the voltage applied to the light-emitting element 22 or to perform temperature derating. However, the functions and uses of the control element 25c are not limited to those exemplified. The control element 25c can be, for example, a transistor or an integrated circuit. The control element 25c exemplified in FIG. 1 is a surface-mounted integrated circuit.

[0044] Next, the joining of frame 23 and substrate 21 by joint 26 will be described. Generally, the frame 23 is adhered onto the substrate 21. In this case, the adhesive requires a certain time to harden. Therefore, the position of the frame 23 relative to the substrate 21, and therefore the position of the frame 23 relative to the light-emitting element 22, may change before the adhesive hardens. For example, since the adhesive has a certain degree of fluidity before hardening, if an external force due to vibration or air flow during heat hardening is applied to the substrate 21 or the frame 23 before the adhesive hardens, the relative positions between the frame 23 and the light-emitting element 22 may change.

[0045] As described above, the frame 23 functions as a reflector that reflects the light emitted from the light emitting element 22. Therefore, if the relative position between the frame 23 and the light emitting element 22 changes, there is a risk that a predetermined light distribution characteristic, light distribution pattern, etc. cannot be obtained. In addition, there is a risk that the light distribution characteristic, light distribution pattern, etc. vary among a plurality of vehicle lighting devices.

[0046] Therefore, in the vehicle lighting device 1 according to the present embodiment, the frame portion 23 and the substrate 21 are joined by a joint 26 provided between the substrate 21 and the frame portion 23 and containing a metal (corresponding to an example of a first metal). In this case, the melting point of the metal contained in the joint 26 is lower than, for example, the melting point of the metal (corresponding to an example of a second metal) contained in the joint layer 21b (corresponding to an example of a first joint layer) described later and the melting point of the metal (corresponding to an example of a third metal) contained in the joint layer 23a (corresponding to an example of a second joint layer). The melting point of the metal contained in the joint 26 can also be lower than the melting point of the metal contained in the wiring pattern 21a.

[0047] The metal contained in the joint 26 is, for example, lead-free solder (lead-free solder) with a melting point of approximately 217°C, eutectic solder (lead-containing solder) with a melting point of approximately 183°C, a tin-lead-antimony alloy with a melting point of approximately 240°C to 300°C, or a bismuth-tin alloy with a melting point of approximately 130°C to 170°C.

[0048] The time required for the molten metal to solidify when forming joint 26 can be made much shorter than the time required for a thermosetting adhesive to harden, for example. Therefore, by joining frame 23 and substrate 21 with joint 26, it is possible to prevent the relative positions of frame 23 and light-emitting element 22 from changing.

[0049] However, as described above, the material of the substrate 21 is an inorganic material such as ceramics, an organic material such as glass epoxy, a metal core substrate, etc. The material of the frame 23 is a resin such as a thermoplastic resin, etc. Therefore, the frame 23 and the substrate 21 cannot be directly joined by using the joint 26 containing a metal. Therefore, the bonding layer 21b is provided between the substrate 21 and the bonding portion 26. The bonding layer 21b is bonded to the substrate 21 and the bonding portion 26. In addition, a bonding layer 23a is provided between the frame portion 23 and the bonding portion 26. The bonding layer 23a is bonded to the frame portion 23 and the bonding portion 26.

[0050] FIG. 3 is a schematic cross-sectional view illustrating a joint portion between frame portion 23 and substrate 21. As shown in FIG. FIG. 3 is a schematic enlarged view of part B in FIG. 3, a bonding layer 21b may be provided on the surface of the substrate 21 in an area where the frame portion 23 is provided. The bonding layer 21b is in the form of a film and contains a metal. The bonding layer 21b may contain, for example, copper, nickel, tin, etc.

[0051] Here, as described above, the wiring pattern 21a containing a metal is provided on the surface of the substrate 21. Therefore, if the bonding layer 21b and the wiring pattern 21a contain the same metal, the bonding layer 21b and the wiring pattern 21a can be formed in the same manufacturing process. In addition, the material of the wiring pattern 21a has high affinity (wettability) with lead-free solder or eutectic solder. Therefore, in the case where the bonding portion 26 contains lead-free solder or eutectic solder, if the bonding layer 21b contains the same metal as the wiring pattern 21a, the affinity of the bonding portion 26 before solidification with the bonding layer 21b can be improved. Therefore, it is possible to reduce manufacturing costs and shorten manufacturing time.

[0052] As shown in FIG. 3, a bonding layer 23a can be provided on the end of the frame 23 on the substrate 21 side. The bonding layer 23a is in the form of a film and contains a metal. The bonding layer 23a can contain, for example, copper, nickel, tin, etc. In this case, it is preferable that the material of the bonding layer 23a has a high affinity with the bonding portion 26 before solidification. For example, the bonding layer 23a, the bonding layer 21b, and the wiring pattern 21a can contain the same metal. If these materials are the same, it is possible to reduce manufacturing costs and management costs.

[0053] Here, when forming the joint 26, the molten material of the joint 26 comes into contact with the bonding layer 21b and the bonding layer 23a. Therefore, the material on the surface of the bonding layer 21b may melt and diffuse into the molten material of the joint 26. Similarly, the material on the surface of the bonding layer 23a may melt and diffuse into the molten material of the joint 26. That is, when forming the joint 26, the thickness T1 of the bonding layer 21b and the thickness T2 of the bonding layer 23a may decrease.

[0054] In this case, if the thickness T1 is too thin, the bonding strength between the bonding layer 21b and the substrate 21 becomes too small, and the bonding layer 21b may peel off from the substrate 21. If the thickness T2 is too thin, the bonding strength between the bonding layer 23a and the frame 23 becomes too small, and the bonding layer 23a may peel off from the frame 23. In other words, the frame 23 may detach from the substrate 21.

[0055] According to the knowledge of the present inventors, it is preferable that the thickness T1 of the bonding layer 21b and the thickness T2 of the bonding layer 23a are 10 μm or more. In this way, even if the thicknesses T1 and T2 are reduced when forming the bonding portion 26, the bonding strength between the bonding layer 21b and the substrate 21 and the bonding strength between the bonding layer 23a and the frame portion 23 can be kept within an appropriate range. Therefore, it is possible to prevent the frame portion 23 from being detached from the substrate 21. In this case, the thickness T3 of the joint 26 can be set to, for example, not less than 10 μm and not more than 25 μm.

[0056] FIG. 4 is a schematic cross-sectional view illustrating a joint portion between a frame portion 23b and a substrate 21 according to another embodiment. The frame portion 23b is obtained by further providing a recess 23b1 at the end of the frame portion 23 on the substrate 21 side.

[0057] 4, the recess 23b1 is open to the end of the frame portion 23b on the substrate 21 side and to the outer surface 23b2 of the frame portion 23b. In this case, the recess 23b1 does not have to be open to the inner surface 23b3 of the frame portion 23b. The end of the frame portion 23b on the substrate 21 side near the inner surface 23b3 is in contact with the bonding layer 21b. Moreover, the bonding layer 23a is provided on the surface of the recess 23b1 facing the substrate 21. The bonding layer 23a does not have to be provided on the surface facing the substrate 21 near the inner side surface 23b3 of the frame portion 23b. The bonding portion 26 is provided inside the recess 23b1, in the space between the bonding layer 23a and the bonding layer 21b.

[0058] 1 and 2, the light emitting element 22 and the wiring pattern 21a on which the light emitting element 22 is mounted are provided inside the frame portion 23b. Therefore, if the joint portion 26 protrudes significantly toward the inside of the frame portion 23b, there is a risk of a short circuit between the joint portion 26 and the wiring pattern 21a, etc.

[0059] In this case, as shown in Fig. 4, if the recess 23b1 is provided, it is possible to prevent the melted material of the joint 26 from leaking out to the inside of the frame 23b when the joint 26 is formed. This makes it possible to prevent the joint 26 from being short-circuited with the wiring pattern 21a, etc. Also, the work of forming the joint 26 becomes easier.

[0060] FIG. 5 is a schematic partial side view illustrating a frame portion 23c according to another embodiment. FIG. 5 is a schematic partial side view of the frame portion 23c when viewed from a direction perpendicular to the central axis 1a of the vehicle lighting device 1. As shown in FIG.

[0061] 1, the light emitting element 22 is provided inside the frame portion 23c, and the circuit element 25 is provided outside the frame portion 23c. Therefore, a part of the wiring pattern 21a may be provided below the frame portion 23c. In this case, if the formed joint portion 26 comes into contact with the wiring pattern 21a below the frame portion 23c, a short circuit may occur in the light emitting circuit.

[0062] As described above, since the wiring pattern 21a is covered with the covering portion including the glass material, there is little risk of a short circuit occurring in the light-emitting circuit. However, there are cases where a short circuit is likely to occur due to the application, usage environment, aging, etc. of the vehicle lighting device 1.

[0063] 5, frame 23c has protrusion 23c1 provided at the end on the substrate 21 side. Protrusion 23c1 extends between outer surface 23c2 and inner surface 23c3 of frame 23c. The tip of protrusion 23c1 contacts wiring pattern 21a (or the covering portion if a covering portion containing a glass material is provided). When viewed from the direction along the central axis 1a of the vehicle lighting device 1, the protrusion 23c1 can be provided in a region of the frame 23c that overlaps with the wiring pattern 21a. In this case, it is preferable that the protrusion 23c1 overlaps with the entire wiring pattern 21a that overlaps with the frame 23c. In addition, the bonding layer 23a does not need to be provided on the end of the protrusion 23c1 on the substrate 21 side. If a gap occurs between the tip of the protruding portion 23c1 and the substrate 21, the gap is filled with resin when the sealing portion 24 is formed.

[0064] If the protruding portion 23c1 is provided, the formed joint portion 26 can be prevented from contacting the wiring pattern 21a between the frame portion 23c and the substrate 21 more effectively. The protrusion 23c1 may be provided on either the frame 23 or the frame 23b.

[0065] (Vehicle lighting fixtures) In one embodiment of the present invention, a vehicle lamp 100 can be provided that includes the vehicle lighting device 1. The above-mentioned description of the vehicle lighting device 1 and modified examples of the vehicle lighting device 1 (for example, frame portion 23b, frame portion 23c, and a device in which a person skilled in the art appropriately adds, deletes, or modifies components and has the features of the present invention) can all be applied to the vehicle lamp 100.

[0066] In the following, as an example, a case where the vehicular lamp 100 is a rear combination light installed in an automobile will be described. However, the vehicular lamp 100 is not limited to a rear combination light installed in an automobile. The vehicular lamp 100 may be any vehicular lamp that is installed in an automobile, a railroad car, or the like.

[0067] FIG. 6 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 6, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0068] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end side open. The housing 101 is formed of, for example, a resin that does not transmit light. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that, although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided on the housing 101.

[0069] When mounting the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in a fitting portion provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.

[0070] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have a function such as a lens.

[0071] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in Fig. 6 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0072] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is made of an elastic material such as rubber or silicone resin.

[0073] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. In addition, the bayonet 12 is pressed against the housing 101 by the elastic force of the seal member 104. Therefore, it is possible to prevent the vehicle lighting device 1 from coming off the housing 101.

[0074] The connector 105 is fitted to ends of the multiple power supply terminals 31 exposed inside the connector holder 15. A lighting circuit or the like provided outside the vehicle lamp 100 is electrically connected to the connector 105. Therefore, by fitting the connector 105 to ends of the multiple power supply terminals 31, the lighting circuit or the like can be electrically connected to the light-emitting element 22.

[0075] Furthermore, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the inside of the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0076] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other.

[0077] Below, additional notes regarding the above-described embodiment are given.

[0078] (Appendix 1) Socket and; A substrate provided on one end side of the socket; A light emitting element provided on the substrate; a frame portion provided on the substrate and surrounding the light emitting element; a bonding portion provided between the substrate and the frame, the bonding portion including a first metal; a first bonding layer provided between the substrate and the bonding portion, bonded to the substrate and the bonding portion, and including a second metal; a second bonding layer provided between the frame and the bonding portion, bonded to the frame and the bonding portion, and including a third metal; Equipped with A vehicle lighting device, wherein the melting point of the first metal is lower than the melting point of the second metal and the melting point of the third metal.

[0079] (Appendix 2) the frame portion has an end portion on the substrate side and an outer surface, and a recess portion that opens to the outer surface, the second bonding layer is provided on a surface of the recess facing the substrate, 2. The vehicle lighting device according to claim 1, wherein the frame portion has an end portion on the substrate side, the end portion being in contact with the first bonding layer near the inner surface.

[0080] (Appendix 3) the substrate has a wiring pattern electrically connected to the light emitting element, the frame portion has a protrusion provided at an end portion on the substrate side, 3. The vehicle lighting device according to claim 1, wherein the convex portion is provided in an area of ​​the frame portion that overlaps with the wiring pattern when viewed from a direction along a central axis of the vehicle lighting device.

[0081] (Appendix 4) 4. The vehicle lighting device according to claim 1, wherein the first metal is solder.

[0082] (Appendix 5) A vehicle lighting device according to any one of appendix 1 to 4; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with: [Explanation of symbols]

[0083] REFERENCE SIGNS LIST 1 vehicle lighting device, 1a central axis, 10 socket, 11 mounting portion, 20 light emitting module, 21 substrate, 21a wiring pattern, 21b bonding layer, 22 light emitting element, 23 frame portion, 23a bonding layer, 23b frame portion, 23b1 recessed portion, 23b2 outer surface, 23b3 inner surface, 23c frame portion, 23c1 protruding portion, 23c2 outer surface, 23c3 inner surface, 25 circuit element, 26 bonding portion, 100 vehicle lamp, 101 housing

Claims

1. A socket; A substrate provided on one end side of the socket; A light emitting element provided on the substrate; a frame portion provided on the substrate and surrounding the light emitting element; a bonding portion provided between the substrate and the frame portion, the bonding portion including a first metal; a first bonding layer provided between the substrate and the bonding portion, bonded to the substrate and the bonding portion, and including a second metal; a second bonding layer provided between the frame portion and the bonding portion, bonded to the frame portion and the bonding portion, and including a third metal; Equipped with A vehicle lighting device, wherein the melting point of the first metal is lower than the melting point of the second metal and the melting point of the third metal.

2. the frame portion has an end portion on the substrate side and an outer surface, and a recess portion that opens to the outer surface, the second bonding layer is provided on a surface of the recess facing the substrate, The vehicle lighting device according to claim 1 , wherein a portion of the end of the frame portion on the substrate side near the inner surface is in contact with the first bonding layer.

3. the substrate has a wiring pattern electrically connected to the light emitting element, the frame portion has a protrusion provided at an end portion on the substrate side, 3. The vehicle lighting device according to claim 1, wherein the protrusion is provided in a region of the frame that overlaps with the wiring pattern when viewed from a direction along a central axis of the vehicle lighting device.

4. The vehicle lighting device according to claim 1 , wherein the first metal is solder.

5. The vehicle lighting device according to claim 1; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with:

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