Terminal unit, substrate module, and method for manufacturing substrate module

Abstract

To provide a terminal unit which can improve a yield even if bonding work by wire bonding utilizing ultrasonic waves is performed, a substrate module, and a method for manufacturing a substrate module.SOLUTION: A terminal unit 10 includes a terminal 11 having a wire bonding part 111 having a wire bonding surface 111a, and a resin case 12 for covering and fixing the terminal 11 in a state in which at least a part of the wire bonding surface 111a is exposed. The terminal unit 10 is an integrated molding of the terminal and the resin case 12, and the resin case 12 has an opening 123a for exposing the rear face of the wire bonding surface 111a provided in a rear face covering part 123 for covering the rear face (that is, rear face 111b) of the wire bonding surface 111a of a bottom part 122 thereof.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] An embodiment of the present invention relates to a terminal unit, a board module, and a method for manufacturing the board module. [Background technology]

[0002] Conventionally, there has been known a substrate module capable of mounting electronic components such as semiconductor devices including power semiconductors. The substrate module includes a substrate capable of mounting electronic components and a terminal unit capable of electrically connecting to a wiring pattern on the substrate. The terminal unit is composed of a resin case and a plurality of terminals housed in the resin case. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4242401 Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional technology of pressing a terminal into a resin case as shown in Patent Document 1, when electrically connecting a wire to the terminal by ultrasonic wire bonding, there was a problem that the vibration of the terminal prevented the electrical connection, resulting in a decrease in yield.

[0005] The present invention has been made to solve such problems, and aims to provide a terminal unit, a substrate module, and a method for manufacturing a substrate module that can improve yield even when performing bonding work using ultrasonic wire bonding. [Means for solving the problem]

[0006] The terminal unit according to one embodiment of the present invention comprises: a terminal having a wire bonding portion with a wire bonding surface; a resin case that covers and fixes the terminals with at least a portion of the wire bonding surface exposed; A terminal unit comprising: the terminal unit is an integrally molded product of the terminal and the resin case, The resin case is characterized in that an opening for exposing the back side of the wire bonding surface is provided in a back side covering portion that covers the back side of the wire bonding surface at the bottom of the resin case.

[0007] The terminal unit according to one embodiment of the present invention may have at least one of the following configurations [2] to [5].

[0008] [2] A protrusion is provided on a side surface of the wire bonding portion that is covered by the resin case.

[0009] [3] The surface opposite to the wire bonding surface is roughened.

[0010] [4] In the above configuration [3], The surface opposite to the wire bonding surface is roughened by plating or knurling.

[0011] [5] The resin case is provided with a bonding surface end covering portion that covers an end of the wire bonding surface, and the wire bonding portion is sandwiched between the bonding surface end covering portion and the back surface covering portion.

[0012] The substrate module according to an embodiment of the present invention includes: Any of the above terminal units, a metal base plate to which the terminal unit is attached; A substrate mounted on the metal base plate; Equipped with The resin case is characterized in that the bottom is fixed to the metal base plate via an adhesive, and the terminal is fixed at the back side of the wire bonding surface to the metal base plate via the adhesive in the opening.

[0013] A method for manufacturing a substrate module according to an embodiment of the present invention includes the steps of: a terminal unit manufacturing process for manufacturing the terminal unit according to any one of claims 1 to 7, comprising: pouring a resin into a die while at least a wire bonding surface and a back surface of the terminal are fixed in the die, and solidifying the resin; a fixing step of fixing the terminal unit to a metal base plate via an adhesive; a bonding step of electrically connecting a substrate on the metal base plate and the wire bonding surface by wire bonding using ultrasonic vibration; Equipped with In the terminal unit manufacturing step, an opening is provided in a bottom cover portion of the resin case that covers a side opposite to the wire bonding surface, the opening exposing the side opposite to the wire bonding surface; The fixing step is characterized in that the adhesive is caused to flow into the opening to fix the terminal to the metal base plate. Effect of the Invention

[0014] According to the embodiment of the present invention, even when a bonding operation is performed by wire bonding using ultrasonic waves, the yield can be improved. [Brief description of the drawings]

[0015] [Figure 1] 1 is a top perspective view of a substrate module according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a top view of a substrate module according to an embodiment of the present invention. [Diagram 3] FIG. 2 is a top perspective view of the terminal unit according to the embodiment of the present invention. [Figure 4] FIG. 2 is a bottom perspective view of the terminal unit according to the embodiment of the present invention. [Diagram 5] FIG. [Figure 6] FIG. [Figure 7] 4 is a partially enlarged perspective view of the terminal unit in a region B of FIG. 3. [Figure 8] 3 is a schematic partial cross-sectional view of the substrate module (including the substrate) according to the embodiment of the present invention, taken along the line AA in FIG. 2. FIG. [Figure 9] 5 is a flowchart showing an example of a manufacturing process for a substrate module according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A terminal unit, a board module, and a method for manufacturing a board module according to an embodiment of the present invention will be described with reference to the drawings.

[0017] [1. Embodiment] [1-1. Configuration] Fig. 1 is a top perspective view of a board module according to an embodiment of the present invention. Fig. 2 is a top view of the board module according to an embodiment of the present invention. Fig. 3 is a top perspective view of a terminal unit according to an embodiment of the present invention. Fig. 4 is a bottom perspective view of the terminal unit according to an embodiment of the present invention.

[0018] For ease of explanation, in this specification, the Z-axis direction shown in the drawings is referred to as the "upper" side, and the opposite direction is referred to as the "lower" side. When explaining the configuration of each component, "lower" is also referred to as the "bottom." "Up" and "lower" refer to the positional relationship of each component of the board module and terminal unit, and do not refer to the positional relationship or direction when the board module and terminal unit are mounted on the actual device to be installed. The Z-axis direction may also be referred to as the height direction.

[0019] The substrate module 1 is a module capable of mounting one or more electronic components, such as semiconductor devices such as power semiconductors, transistors, and capacitors.

[0020] As shown in Fig. 1, the board module 1 includes a terminal unit 10, a metal base plate 20, a board 30 (see Fig. 8 described later), and an adhesive 40 (see Fig. 8 described later). The board module 1 is configured by fixing the terminal unit 10 via the adhesive 40 onto the metal base plate 20 on which the board 30 is mounted. The board 30 and the adhesive 40 are not shown in Fig. 1.

[0021] 3 and 4, the terminal unit 10 is a unit including one or more terminals 11 and a resin case 12. The terminal unit 10 is an integrally molded product of the terminals 11 and the resin case 12, and here, the multiple terminals 11 are held or fixed at their respective positions by the resin case 12. In this embodiment, as shown in FIGS. 1 to 4, the multiple terminals 11 are arranged in pairs of two terminals 11, and multiple pairs are arranged in the X-axis and Y-axis directions.

[0022] Fig. 5 is a top perspective view of the terminal, and Fig. 6 is a bottom perspective view of the terminal. The terminal 11 is a conductive member, and is, for example, an electrode electrically connected to a wiring pattern on the substrate 30. The terminal 11 here is roughly L-shaped. As shown in Figs. 5 and 6, the terminal 11 has a wire bonding portion 111, an extension portion 112, and a connection portion 113.

[0023] The wire bonding portion 111 is a portion that is electrically connected to the wiring pattern on the substrate 30 by a wire. Specifically, the wire bonding portion 111 is a roughly rectangular plate-like body, and here, is disposed parallel to the XY plane. The wire bonding portion 111 has a wire bonding surface 111a, a back surface 111b, and a protrusion 111c.

[0024] The wire bonding surface 111a is a surface that is electrically connected to the substrate 30 by wire bonding using ultrasonic vibration. The wire bonding surface 111a is exposed from the resin case 12. The back surface 111b is the surface of the wire bonding portion 111 opposite to the wire bonding surface 111a, and can also be called the bottom surface of the wire bonding portion 111. This back surface 111b may be roughened. The back surface 111b may be roughened by, for example, roughening plating or knurling. In one example, the back surface 111b may be provided with a plating layer by roughening plating. The plating layer may be formed of, for example, nickel plating. In another example, the back surface 111b may be roughened by knurling. The pattern by knurling may be any pattern such as a kanegoshi pattern, a twill pattern, or a flat pattern, as long as a plurality of recesses are provided on the back surface 111b.

[0025] The protrusion 111c is provided at a portion of the terminal 11 that is covered by the resin case 12. Here, the protrusion 111c is provided on the side surface of the wire bonding portion 111 that is covered by the resin case 12, and one is provided on each of the opposing side surfaces of the wire bonding portion 111. The number of the protrusions 111c is arbitrary, and may be one, three, or four. The protrusions 111c may be provided at a portion of the terminal 11 that is covered by the resin case 12, and may be provided on the back surface 111b, for example. The pair of protrusions 111c in this embodiment extend in the Z-axis direction, with one protruding in the positive direction of the X-axis and the other protruding in the negative direction. The shape of the protrusion 111c may be any shape, such as an X-shape, as long as it protrudes from the side surface or back surface 111b of the wire bonding portion 111.

[0026] The extending portion 112 is a plate-like body extending in the Z-axis direction so as to intersect with the wire bonding portion 111, and the width (i.e., the length in the X-axis direction) of the upper side is narrower than the lower side. The extending portion 112 is covered by the resin case 12 at its wider lower part, and is exposed from the resin case 12 at its narrower upper part. This upper part of the extending portion 112 can be electrically connected to a device, an electric circuit, and / or a power source (not shown).

[0027] The connection portion 113 is a portion that connects the wire bonding portion 111 and the extending portion 112, and the terminal 11 is bent by the connection portion 113 so that the entire terminal 11 is generally L-shaped.

[0028] The resin case 12 is an insulating resin member, and as shown in FIG. 3, covers and fixes the terminals 11 with at least a part of the wire bonding surface 111a exposed. The resin case 12 can be formed by insert molding in which the terminals 11 are fixed in a mold (not shown) as an insert item, and resin is injected into the mold and solidified. The resin forming the resin case 12 can be epoxy resin, PPS (Polyphenylene Sulfide), or the like. In addition, by including elastomer, inorganic filler, glass fiber, or the like in the resin, the adhesiveness between the resin case 12 and the adhesive 40 can be improved, and the difference in linear expansion coefficient with the terminals 11 can be reduced even during the cooling and heating cycle after the insert molding, making the resin case 12 less likely to crack.

[0029] 1 and 3, the resin case 12 is generally rectangular and has an opening 120. By fixing the resin case 12 (terminal unit 10) to the metal base plate 20, the metal base plate 20 can be viewed from the area inside the opening 120.

[0030] As shown in FIG. 3, the resin case 12 includes four walls 121 (121a to 121d) and a bottom 122. The walls 121a and 121b form a pair of parallel long sides of a rectangle, extend in the X-axis direction, and have a height in the Z-axis direction. The walls 121c and 121d form a pair of parallel short sides of a rectangle, extend in the Y-axis direction, and have a height in the Z-axis direction. The bottom 122 protrudes inward from the lower part of the wall 121, and forms an opening 120 by its boundary. The bottom 122 covers the periphery of the wire bonding part 111 except for at least the wire bonding surface 111a. Here, as shown in FIGS. 1 to 4, the multiple terminals 11 are arranged so that a part of the multiple terminals 11 is embedded in each wall 121 and the bottom 122, and each terminal 11 is fixed to the resin case 12.

[0031] The bottom 122 has a back surface covering portion 123. The back surface covering portion 123 covers the back surface 111b, which is the surface opposite to the wire bonding surface 111a. The back surface covering portion 123 is provided with an opening 123a that exposes the back surface 111b. The opening 123a is a through hole. In this embodiment, the shape of the opening 123a is round as shown in FIG. 4, but it can be any shape such as a rectangular shape or a polygonal shape. In addition, the number of openings 123a is one for the back surface 111b here, but it can be any number of openings 123a equal to or greater than two. It is preferable that the opening 123a is provided at a location that covers the back surface 111b.

[0032] 4, a groove 122a is provided in the bottom portion 122. The groove 122a has a generally rectangular shape following the shape of the resin case 12, and is provided outside the arrangement of the terminals 11.

[0033] FIG. 7 is a partially enlarged perspective view of the terminal unit 10 in the region B of FIG. 3. As shown in FIG. 3 and FIG. 7, the resin case 12 is provided with a bonding surface end covering portion 124 that covers the end portion 111d of the wire bonding surface 111a. The bonding surface end covering portion 124 can sandwich the wire bonding portion 111 between the bonding surface end covering portion 124 and the back surface covering portion 123. That is, the distance between the back surface covering portion 123 and the bonding surface end covering portion 124 can be the thickness (length in the Z-axis direction) of the wire bonding portion 111. The bonding surface end covering portion 124 has a plate shape and extends, for example, parallel to the XY plane so as to protrude from the inner surface of the wall portion 121. A pair of the bonding surface end covering portions 124 can be provided for one wire bonding surface 111a. The bonding surface end covering portion 124 may be shared between the terminals 11. In the example shown in FIG. 7, three bonding surface end covering portions 124 are provided for a pair of terminals 11.

[0034] The resin case 12 may have screw holes at the four corners so that it can be fixed to an installation object by screw fastening or the like.

[0035] Fig. 8 is a schematic partial cross-sectional view of the board module 1 (including the board 30), and is a schematic cross-sectional view of the AA portion of Fig. 2. As shown in Fig. 1 and Fig. 8, the metal base plate 20 is a member to which the terminal unit 10 is attached, and is made of a conductive material having heat dissipation properties, such as copper or a copper alloy. The metal base plate 20 is a roughly rectangular plate-like body.

[0036] As shown in FIG. 8, the substrate 30 is attached to the metal base plate 20. For example, the substrate 30 is fixed to the metal base plate 20 via an adhesive. The substrate 30 is an insulating substrate having a wiring pattern. Electronic components such as semiconductor devices can be mounted on the substrate 30. Here, a power semiconductor device is mounted on the substrate 30, and the power semiconductor device is electrically connected to the wiring pattern on the substrate 30. The substrate 30 can be electrically connected to the wire bonding surface 111a with a wire 50 by wire bonding using ultrasonic vibration.

[0037] 8, the adhesive 40 is interposed between the terminal unit 10 and the metal base plate 20, and fixes the terminal unit 10 to the metal base plate 20. Specifically, the adhesive 40 is interposed between the bottom 122 of the resin case 12 and the metal base plate 20, and fixes the resin case 12 to the metal base plate 20, and also fixes the terminals 11 to the metal base plate 20 through the openings 123a. The adhesive 40 can fill the space within the openings 123a.

[0038] The adhesive 40 has adhesiveness and insulating properties. Therefore, the terminals 11 are fixed to the metal base plate 20, and the terminals 11 and the metal base plate 20 are insulated from each other. The adhesive 40 may be a silicone resin, an epoxy resin, an acrylic resin, or a urethane resin. The adhesive 40 may be the same type of adhesive as that used to fix the substrate 30 to the metal base plate 20. That is, the substrate 30 is fixed to the metal base plate 20 via the adhesive 40.

[0039] [1-2. Manufacturing process] 9 is a flowchart showing an example of a manufacturing process for a substrate module according to an embodiment of the present invention. As shown in FIG 9, the manufacturing process for a substrate module 1 includes a terminal unit manufacturing process S10, a fixing process S20, and a bonding process S30.

[0040] The terminal unit manufacturing process S10 is an integral molding process using a mold. That is, in a state where at least the wire bonding surface 111a and the back surface 111b of the terminal 11 are fixed in the mold, resin is poured into the mold, and the resin is solidified to form the resin case 12, thereby forming the terminal unit 10. In the terminal unit manufacturing process S10, an opening 123a that exposes the back surface 111b is provided in a back surface covering portion 123 that covers the back surface 111b, which is the surface opposite to the wire bonding surface 111a, of the bottom 122 of the resin case 12. In the terminal unit manufacturing process S10, for example, the wire bonding surface 111a and the back surface 111b are sandwiched between a pair of fixtures to fix the terminal 11 in the mold, so that even if the resin is poured into the mold, the resin does not adhere to the portions of the wire bonding surface 111a and the back surface 111b that are pressed by the fixtures. Therefore, the wire bonding surface 111a is exposed, and an opening 123a is formed and a part of the back surface 111b is exposed from the opening 123a. Here, the fixing tool on the back surface 111b side is a round bar, so the opening 123a is round. The pair of fixing tools may be part of the inside of the mold, or may be separate from the mold.

[0041] In the fixing step S20, the terminal unit 10 is fixed to the metal base plate 20 via the adhesive 40. Specifically, the adhesive is applied to the bottom of the terminal unit 10 (the bottom 122 of the resin case 12) or the metal base plate 20, and the terminal unit 10 is pressed against the metal base plate 20 with the adhesive interposed therebetween to apply pressure. As a result, the adhesive is interposed between the bottom 122 of the resin case 12 and the metal base plate 20, and a part of the adhesive flows into the opening 123a and reaches the back surface 111b. At this time, the adhesive may adhere to the inner wall of the bottom 122 (back surface covering portion 123) that forms the opening 123a, or the inside of the opening 123a may be filled with the adhesive. Thereafter, the adhesive is solidified to form the adhesive 40, and the terminal unit 10 is fixed to the metal base plate 20. In this manner, in the fixing step S20, the adhesive is flowed into the opening 123a to fix the terminal 11 to the metal base plate 20. The substrate 30 may be mounted on the metal base plate 20 in advance before the fixing step S20, or may be mounted after the fixing step S20 and before the bonding step S30.

[0042] In the bonding step S30, the substrate 30 on the metal base plate 20 is electrically connected to the wire bonding surface 111a by wire bonding using ultrasonic vibration. The wire bonding using ultrasonic vibration is, for example, wedge bonding. Since the terminal 11 itself, more specifically, the wire bonding portion 111, is fixed to the metal base plate 20 by the adhesive 40, the vibration of the wire bonding surface 111a can be suppressed even by ultrasonic vibration. By this wire bonding, as shown in FIG. 8, the wire bonding surface 111a can be electrically connected to the wiring pattern on the substrate 30 by the wire 50. Therefore, the electronic component on the substrate 30 is electrically connected to the terminal 11 via the wiring pattern of the substrate 30, the wire 50.

[0043] [1-3. Actions and Effects] (1) The terminal unit 10 of this embodiment includes a terminal 11 having a wire bonding portion 111 having a wire bonding surface 111a, and a resin case 12 that covers and fixes the terminal 11 with at least a portion of the wire bonding surface 111a exposed. The terminal unit 10 is an integrally molded product of the terminal and the resin case 12, and the resin case 12 has a back surface covering portion 123 that covers the back surface (i.e., back surface 111b) of the wire bonding surface 111a at its bottom 122, and an opening 123a that exposes the back surface of the wire bonding surface 111a is provided in the back surface covering portion 123.

[0044] This allows adhesive to flow through opening 123a, which exposes the back surface of wire bonding surface 111a, and allows terminal 11 itself to be fixed to another member (e.g., a metal base plate) via the adhesive. Therefore, even if a bonding operation is performed on wire bonding surface 111a of terminal 11 using ultrasonic wire bonding, wire 50 can be electrically connected to terminal 11, thereby improving yield.

[0045] (2) Protrusions 111c are provided on the side surfaces of wire bonding portion 111 that are covered by resin case 12. This makes it possible to suppress vibration of wire bonding portion 111, thereby improving yield.

[0046] (3) The back surface of the wire bonding surface 111a (i.e., back surface 111b) is roughened. This allows the resin of the resin case 12 and the adhesive inside the opening 123a to be inserted into the roughened recessed portion and adhere closely to it, thereby suppressing vibration of the wire bonding portion 111 and improving the yield. Specifically, the back surface of the wire bonding surface 111a can be roughened by plating or knurling.

[0047] (4) The resin case 12 is provided with the bonding surface end covering portion 124 that covers the end 111 d of the wire bonding surface 111 a, and the wire bonding portion 111 is sandwiched between the bonding surface end covering portion 124 and the back surface covering portion 123.

[0048] This makes it possible to suppress vibration of the wire bonding portion 111, thereby improving the yield.

[0049] (5) The substrate module 1 of this embodiment comprises a terminal unit 10 having a terminal 11 and a resin case 12, a metal base plate 20 to which the terminal unit 10 is attached, and a substrate 30 mounted on the metal base plate 20, wherein the bottom 122 of the resin case 12 is fixed to the metal base plate 20 via an adhesive 40, and the back surface 111a of the wire bonding surface 111a (i.e., back surface 111b) of the terminal 11 is fixed to the metal base plate 20 via the adhesive 40 in the opening 123a.

[0050] This allows adhesive to flow through opening 123a, which exposes the back surface of wire bonding surface 111a, and allows terminal 11 itself to be fixed to metal base plate 20 via adhesive 40. Therefore, even if bonding work is performed on wire bonding surface 111a of terminal 11 using ultrasonic wire bonding, wire 50 can be electrically connected to terminal 11, thereby improving yield.

[0051] (6) The manufacturing method of the substrate module of this embodiment includes a terminal unit manufacturing process S10 in which resin is poured into a mold with at least the wire bonding surface 111a and its back surface of the terminal fixed within the mold and the resin is solidified to manufacture the terminal unit 10, a fixing process S20 in which the terminal unit 10 is fixed to the metal base plate 20 via adhesive 40, and a bonding process S30 in which the substrate 30 on the metal base plate 20 and the wire bonding surface 111a are electrically connected by wire bonding using ultrasonic vibration. In the terminal unit manufacturing process S10, an opening 123a exposing the back surface of the wire bonding surface 111a is provided in a back surface covering portion 123 which is the bottom 122 of the resin case 12 and covers the back surface of the wire bonding surface 111a, and in the fixing process S20, adhesive is flowed into the opening 123a to fix the terminal 11 to the metal base plate 20.

[0052] This makes it possible to electrically connect the wire 50 to the terminal 11 even when a bonding operation is performed on the wire bonding surface 111a of the terminal 11 by ultrasonic wire bonding, thereby improving the yield.

[0053] 2. Other embodiments The present invention is not limited to the above-described embodiments, and includes combinations of any of the above-described embodiments. Furthermore, these embodiments can be omitted, replaced, or modified in various ways without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of symbols]

[0054] 1 PCB Module 10 Terminal Unit 11 Terminal 111 Wire Bonding Section 111a Wire bonding surface 111b back side 111c protrusion 111d End 112 Extension 113 Connection 12 Resin case 120 aperture 121 Wall section 122 Bottom 123 Back surface coating 123a aperture 124 Bonding surface edge coating 20 Metal base plate 30 Substrate 40 Adhesive

Claims

1. a terminal having a wire bonding portion with a wire bonding surface; a resin case that covers and fixes the terminals with at least a portion of the wire bonding surface exposed; A terminal unit comprising: the terminal unit is an integrally molded product of the terminal and the resin case, The resin case has a back surface covering portion that covers a back surface of the wire bonding surface at a bottom thereof, and an opening that exposes the back surface of the wire bonding surface is provided in the back surface covering portion. Terminal unit.

2. a protrusion is provided on a side surface of the wire bonding portion that is covered by the resin case; The terminal unit according to claim 1 .

3. The back surface of the wire bonding surface is roughened. The terminal unit according to claim 1 .

4. The back surface of the wire bonding surface is roughened by plating or knurling. The terminal unit according to claim 3 .

5. The resin case is provided with a bonding surface end covering portion that covers an end of the wire bonding surface, and the wire bonding portion is sandwiched between the bonding surface end covering portion and the back surface covering portion. The terminal unit according to claim 1 .

6. At least one of the following configurations [2] to [5] is included: The terminal unit according to claim 1 . [2] A protrusion is provided on a side surface of the wire bonding portion that is covered by the resin case. [3] The surface opposite to the wire bonding surface is roughened. [4] In the above-mentioned configuration [3], The surface opposite to the wire bonding surface is roughened by plating or knurling. [5] The resin case is provided with a bonding surface end covering portion that covers an end of the wire bonding surface, and the wire bonding portion is sandwiched between the bonding surface end covering portion and the back surface covering portion.

7. A terminal unit according to any one of claims 1 to 6, a metal base plate to which the terminal unit is attached; A substrate mounted on the metal base plate; Equipped with the bottom of the resin case is fixed to the metal base plate via an adhesive, and the terminal is fixed to the metal base plate at a rear surface opposite to the wire bonding surface via the adhesive in the opening; Board module.

8. A power semiconductor device is mounted on the substrate. The substrate module according to claim 7 .

9. a terminal unit manufacturing process for manufacturing the terminal unit according to any one of claims 1 to 6, comprising: pouring a resin into a metal mold while at least a wire bonding surface and a back surface of the terminal are fixed in the metal mold, and solidifying the resin; a fixing step of fixing the terminal unit to a metal base plate via an adhesive; a bonding step of electrically connecting a substrate on the metal base plate and the wire bonding surface by wire bonding using ultrasonic vibration; Equipped with In the terminal unit manufacturing step, an opening is provided in a bottom cover portion of the resin case that covers a side opposite to the wire bonding surface, the opening exposing the side opposite to the wire bonding surface; In the fixing step, the adhesive is caused to flow into the opening to fix the terminal to the metal base plate. A method for manufacturing a substrate module.

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