Multilayer ceramic capacitor

Abstract

To provide a multilayer ceramic capacitor capable of improving the connectivity between a draw-out portion of an internal electrode layer and an external electrode.SOLUTION: A multilayer ceramic capacitor includes: an element assembly portion 110 including a plurality of internal electrode layers 150; a first external electrode 120; and a second external electrode. In the internal electrode layer 150, a width of an opposing portion in a width direction is greater than a width of a draw-out portion in the width direction. Each of the first external electrode 120 and the second external electrode includes a Cu layer provided on the element assembly portion 110. The Cu layer 121 has a first layer portion 125 and a second layer portion 126. The first layer portion 125 has a higher Cu content than the second layer portion 126, and the second layer portion 126 has a higher glass content than the first layer portion 125. The first layer portion 125 is a layer in which Cu is continuous so as to connect adjacent draw-out portions in a thickness direction. In a cross section of the second layer portion 126 that passes through a center portion in the width direction and is parallel to the thickness direction and a length direction, glass occupies 25% or more of an area of the second layer portion 126.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present disclosure relates to a multilayer ceramic capacitor. [Background technology]

[0002] As a conventional multilayer ceramic capacitor, Japanese Patent Laid-Open Publication No. 2006-179873 (Patent Document 1) discloses a configuration including a laminate in which a plurality of dielectric layers and a plurality of internal electrode layers are stacked, chip protection members provided on both side surfaces of the laminate, and a pair of external electrodes provided on both end surfaces of the laminate.

[0003] The internal electrode layers each include an opposing portion that opposes an electrode layer adjacent to the internal electrode layers in the stacking direction and an extended portion that is extended from the opposing portion to an end face of the laminate. The width of the extended portion is narrower than the width of the opposing portion. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2006-179873 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the multilayer ceramic capacitor described in Patent Document 1, the width of the lead-out portions of the internal electrode layers is narrow, and unless some measures are taken, the contact area with the external electrodes may decrease, which may result in reduced connectivity with the external electrodes.

[0006] The present disclosure has been made in consideration of the above-mentioned problems, and an object of the present disclosure is to provide a multilayer ceramic capacitor that can improve the connectivity between an extraction portion and an external electrode in a configuration in which the width of the extraction portion of the internal electrode layer that is extracted to the end face of the body portion is narrower than the opposing portion of the internal electrode layer. [Means for solving the problem]

[0007] The multilayer ceramic capacitor according to the present disclosure has a first main surface and a second main surface facing each other in a thickness direction, a first side surface and a second side surface facing each other in a width direction, and a first end surface and a second end surface facing each other in a length direction, and includes a body portion including a plurality of dielectric layers and a plurality of internal electrode layers stacked in the thickness direction, a first external electrode provided on the first end surface, and a second external electrode provided on the second end surface. The plurality of internal electrode layers include a plurality of first internal electrode layers connected to the first external electrode, and a plurality of second internal electrode layers connected to the second external electrode. Each of the plurality of first internal electrode layers has a first opposing portion facing the second internal electrode layer adjacent to each other in the thickness direction, and a first lead portion connecting the first opposing portion and the first external electrode. Each of the plurality of second internal electrode layers has a second opposing portion facing the first internal electrode layer adjacent to each other in the thickness direction, and a second lead portion connecting the second opposing portion and the second external electrode. The width of the first opposing portion in the width direction is larger than the width of the first lead portion in the width direction. The width of the second opposing portion in the width direction is larger than the width of the second lead portion in the width direction. Each of the first external electrode and the second external electrode includes a Cu layer provided on the element portion, a Ni plating layer provided on the Cu layer, and a Sn plating layer provided on the Ni plating layer. The Cu layer has a first layer portion connected to the first lead portions or the second lead portions and a second layer portion covering the first layer portion. The first layer portion has a higher Cu content than the second layer portion and extends along the thickness direction. The second layer portion has a higher glass content than the first layer portion. The first layer portion of the first external electrode is a layer in which Cu is continuous so as to connect the first lead portions adjacent to each other in the thickness direction. The first layer of the second external electrode is a continuous layer of Cu so as to connect the second lead portions adjacent to each other in the thickness direction. In a cross section of the second layer that passes through the center in the width direction and is parallel to the thickness direction and the length direction, the glass occupies 25% or more of the area of ​​the second layer.

[0008] In the multilayer ceramic capacitor according to the present disclosure, Ni may be diffused into the first layer.

[0009] In the multilayer ceramic capacitor according to the present disclosure, the first layer portion may have an Ni concentration that increases toward the element portion.

[0010] In the multilayer ceramic capacitor according to the present disclosure, the thickness of the second layer along the length direction may be 75% or more of the thickness of the Cu layer along the length direction. Effect of the Invention

[0011] According to the present disclosure, a multilayer ceramic capacitor can be provided that can improve the connectivity between the lead portion and the external electrode in a configuration in which the lead portion of the internal electrode layer that is led to the end face of the body portion is narrower than the opposing portion of the internal electrode layer. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view illustrating a schematic appearance of a multilayer ceramic capacitor according to an embodiment of the present invention. [Diagram 2] 1 is a perspective view showing a schematic diagram of an element portion of a multilayer ceramic capacitor according to an embodiment of the present invention; [Diagram 3] 3 is an exploded perspective view for illustrating a schematic configuration of the element body shown in FIG. 2. FIG. [Figure 4] FIG. 2 is a schematic cross-sectional view taken along line IV-IV shown in FIG. [Diagram 5] 2 is a schematic cross-sectional view taken along line VV shown in FIG. 1. [Figure 6] 6 is a schematic cross-sectional view taken along line VI-VI shown in FIG. [Figure 7] FIG. 5 is a schematic cross-sectional view taken along line VII-VII shown in FIG. [Figure 8] FIG. 2 is a schematic cross-sectional view for explaining details of the multilayer ceramic capacitor according to the embodiment. [Figure 9]4 is a schematic cross-sectional view illustrating the shape of an element portion on an end face side and the state of lead portions of internal electrode layers in a multilayer ceramic capacitor according to an embodiment. FIG. [Figure 10] 4 is a schematic cross-sectional view illustrating the outer shape of a body portion at a center portion in a longitudinal direction and the state of opposing portions of internal electrode layers in a multilayer ceramic capacitor according to an embodiment. FIG. [Figure 11] 5 is a schematic cross-sectional view for illustrating a detailed shape of an element portion of the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 12] 5 is a schematic cross-sectional view for explaining a shift in the width direction of lead portions of internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 13] 5 is a schematic cross-sectional view for explaining a shift in the width direction of opposing portions of internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 14] 3 is a schematic cross-sectional view showing an enlarged view of an end portion in a width direction of a drawn-out portion of the multilayer ceramic capacitor according to the embodiment; FIG. [Figure 15] FIG. 2 is a schematic cross-sectional view for explaining a grain diameter of the multilayer ceramic capacitor according to the embodiment. [Figure 16] 2 is a schematic cross-sectional view showing a detailed configuration of an external electrode of the multilayer ceramic capacitor according to the embodiment; FIG. [Figure 17] 4A to 4C are diagrams showing a step of providing a conductive pattern on an inner layer ceramic green sheet in a manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 18] 5A to 5C are diagrams showing a step of arranging ceramic paste for eliminating steps in a manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 19] FIG. 2 is a diagram showing a step of laminating a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets in a manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 20]4A to 4C are diagrams showing a step of cutting a structure in which a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets are thermocompression-bonded in a manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 21] FIG. 13 is a diagram showing a region in which a ceramic paste for eliminating steps is placed in an individual laminated chip. [Figure 22] 13 is a diagram showing an area where a specific component is segregated in a part of an internal electrode layer in an element part formed by firing a laminated chip coated with a side ceramic paste. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the embodiments described below, the same or common parts are denoted by the same reference numerals in the drawings, and their description will not be repeated. In the drawings, the length direction of the element body portion described later is indicated by L, the width direction of the element body portion by W, and the thickness direction of the element body portion by T.

[0014] FIG. 1 is a perspective view showing a schematic appearance of a multilayer ceramic capacitor according to an embodiment. FIG. 2 is a perspective view showing a schematic element body of the multilayer ceramic capacitor according to an embodiment. FIG. 3 is an exploded perspective view for explaining a schematic configuration of the element body shown in FIG. 2. FIG. 4 is a schematic cross-sectional view taken along line IV-IV shown in FIG. 1. FIG. 5 is a schematic cross-sectional view taken along line VV shown in FIG. A multilayer ceramic capacitor 100 according to an embodiment will be described with reference to FIGS. 1 to 5.

[0015] As shown in FIGS. 1 to 5, a multilayer ceramic capacitor 100 according to an embodiment includes an element body 110, a first external electrode 120, and a second external electrode .

[0016] The body 110 has a substantially rectangular parallelepiped shape. The body 110 includes a first main surface 111 and a second main surface 112 facing in a thickness direction T, a first side surface 113 and a second side surface 114 facing in a width direction W intersecting the thickness direction T, and a first end surface 115 and a second end surface 116 facing in a length direction L intersecting the thickness direction T and the width direction W.

[0017] It is preferable that the corners and ridges of the element part 110 are rounded. Here, a corner is a portion where three faces of the element part 110 intersect, and a ridge is a portion where two faces of the element part 110 intersect.

[0018] The first external electrode 120 is provided on the first end face 115. Specifically, the first external electrode 120 is formed over the entire first end face 115, and is formed so as to extend from the first end face 115 to the first main face 111, the second main face 112, the first side face 113, and the second side face 114.

[0019] The second external electrode 130 is provided on the second end face 116. Specifically, the second external electrode 130 is formed over the entire second end face 116, and is formed so as to extend from the second end face 116 to the first main face 111, the second main face 112, the first side face 113, and the second side face 114.

[0020] The detailed configurations of the first external electrode 120 and the second external electrode 130 will be described later with reference to FIG.

[0021] The element body portion 110 includes a laminate 101, a first side margin portion S1, and a second side margin portion S2.

[0022] The laminate 101 has a pair of main surfaces 101a, 101b facing each other in the thickness direction T, a pair of side surfaces 101c, 101d facing each other in the width direction, and a pair of end surfaces 101e, 101f facing each other in the length direction. The pair of main surfaces 101a, 101b constitute parts of the first main surface 111 and the second main surface 112 of the element body part 110. The side surface 101c is covered by a first side margin portion S1, and the side surface 101d is covered by a second side margin portion S2. The pair of end surfaces 101e, 101f constitute parts of the first end surface 115 and the second end surface 116 of the element body part 110.

[0023] The laminate 101 has a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 alternately laminated along the thickness direction T.

[0024] The multiple internal electrode layers 150 include multiple first internal electrode layers 151 and multiple second internal electrode layers 152. The multiple first internal electrode layers 151 and the multiple second internal electrode layers 152 are laminated alternately in the thickness direction T.

[0025] The multiple first internal electrode layers 151 are extended to the first end surface 115. The multiple first internal electrode layers 151 are connected to the first external electrode 120. The multiple second internal electrode layers 152 are extended to the second end surface 116. The multiple second internal electrode layers 152 are connected to the second external electrode 130. Both end portions in the width direction W of the multiple first internal electrode layers 151 and the multiple second internal electrode layers 152 are exposed to the side surfaces 101c, 101d.

[0026] Although an example in which seven first internal electrode layers 151 and seven second internal electrode layers 152 are provided is shown in Figures 3 to 5, the number of each of the first internal electrode layers 151 and the second internal electrode layers 152 is not limited to seven.

[0027] Each of the dielectric layers 140 is made of a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The dielectric layers 140 may contain Si, Mg, Mn, V, Cr, and rare earth elements as additives.

[0028] Each of the first internal electrode layer 151 and the second internal electrode layer 152 contains Ni. Each of the first internal electrode layer 151 and the second internal electrode layer 152 may further contain dielectric particles having the same composition as the ceramic contained in the dielectric layer 140. In addition, each of the first internal electrode layer 151 and the second internal electrode layer 152 may contain Sn at the interface with the dielectric layer 140.

[0029] The laminate 101 is divided into an inner layer portion C, a first outer layer portion X1, a second outer layer portion X2, and a first end margin portion E1 and a second end margin portion E2. The inner layer portion C has a capacitance due to a first opposing portion 151C (described later) of the first internal electrode layer 151 and a second opposing portion 152C (described later) of the second internal electrode layer 152 being laminated in the thickness direction T.

[0030] The first outer layer portion X1 and the second outer layer portion X2 sandwich the inner layer portion C in the thickness direction T. The first outer layer portion X1 is located outside the inner layer portion C in the thickness direction T, and is located on the first main surface 111 side. The second outer layer portion X2 is located outside the inner layer portion C in the thickness direction T, and is located on the second main surface 112 side.

[0031] The first outer layer portion X1 and the second outer layer portion X2 are made of a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The first outer layer portion X1 and the second outer layer portion X2 may be made of the same dielectric ceramic material as the plurality of dielectric layers 140, or may be made of a dielectric ceramic material different from that of the plurality of dielectric layers 140.

[0032] The first end margin portion E1 and the second end margin portion E2 sandwich the inner layer portion C in the longitudinal direction L. The first end margin portion E1 is located outside the inner layer portion C in the longitudinal direction L, on the side of the first end face 115. The second end margin portion E2 is located outside the inner layer portion C in the longitudinal direction L, on the side of the second end face 116.

[0033] The first side margin portion S1 is provided on a side surface 101c of the laminate. The first side margin portion S1 is provided so as to cover the entire side surface 101c. The first side margin portion S1 exists in the element portion 110 from one end of the internal electrode layer 150 located on one side in the width direction W to the first side surface 113.

[0034] The second side margin portion S2 is provided on a side surface 101d of the laminate. The second side margin portion S2 is provided so as to cover the entire side surface 101d. The second side margin portion S2 exists in the element portion 110 from the other end of the internal electrode layer 150 located on the other side in the width direction W to the second side surface 114.

[0035] The first side margin portion S1 and the second side margin portion S2 are made of a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The first side margin portion S1 and the second side margin portion S2 may be made of the same dielectric ceramic material as the multiple dielectric layers 140, or may be made of a dielectric ceramic material different from that of the multiple dielectric layers 140.

[0036] The first side margin portion S1 and the second side margin portion S2 may be, for example, a dielectric material manufactured by a solid phase method. In this case, no voids exist in the grains (granular matter) included in the first side margin portion S1 and the second side margin portion S2.

[0037] The first side margin portion S1 and the second side margin portion S2 may contain Si and / or Mg. Also, the first side margin portion S1 and the second side margin portion S2 may contain Mn.

[0038] In the first side margin portion S1 and the second side margin portion S2, Si is segregated. The segregation of Si can be confirmed by observing the cross section by, for example, SEM / EDX. Mn can be confirmed by observing the main components Ti or Ba by EPMA or the like.

[0039] The first side margin portion S1 and the second side margin portion S2 may be composed of multiple layers. The multiple layers may not necessarily have an interface between the layers observed, and may include, for example, an embodiment in which the grain size is different between the side surface side and the internal electrode layer 150 side, that is, an embodiment in which the grain size is different in the width direction. The grain size can be measured using an electron microscope such as a TEM. For example, the area of ​​each grain within the field of view is measured in a range of about 10 μm × 10 μm. The circle equivalent diameter is calculated by converting the area of ​​each grain, and the average of the circle equivalent diameters is taken as the grain size.

[0040] As described above, the size of the multilayer ceramic capacitor 100 including the element body 110 and the first and second external electrodes 120 and 130 is not particularly limited, but may be within the following ranges, for example.

[0041] The dimension of the multilayer ceramic capacitor 100 in the length direction L (length dimension L0) is, for example, not less than 0.2 mm and not more than 4.5 mm. The dimension of the multilayer ceramic capacitor 100 in the width direction W (width dimension W0) is, for example, not less than 0.125 mm and not more than 3.2 mm. The dimension of the multilayer ceramic capacitor 100 in the thickness direction T (thickness dimension T0) is, for example, not less than 0.125 mm and not more than 2.5 mm.

[0042] The multilayer ceramic capacitor 100 has, for example, a length dimension L0 of 0.2 mm, a width dimension W0 of 0.125 mm, and a thickness dimension T0 of 0.125 mm, or a length dimension L0 of 0.4 mm, a width dimension W0 of 0.2 mm, and a thickness dimension T0 of 0.2 mm, or a length dimension L0 of 0.6 mm, a width dimension W0 of 0.3 mm, and a thickness dimension T0 of 0.3 mm, or a length dimension L0 of 1.0 mm, a width dimension W0 of 0.5 mm, and a thickness dimension T0 of 0.5 mm, or a length dimension L0 of 3.2 mm, a width dimension W0 of 1.6 mm, and a thickness dimension T0 of 1.6 mm, or a length dimension L0 of 4.5 mm, a width dimension W0 of 3.2 mm, and a thickness dimension T0 of 2.5 mm. Note that tolerances are taken into account in the above sizes.

[0043] Fig. 6 is a schematic cross-sectional view taken along the line VI-VI shown in Fig. 4. The shape of the first internal electrode layer 151 will be described with reference to Fig. 6.

[0044] As shown in FIG. 6, the first internal electrode layer 151 includes a first opposing portion 151C and a first lead portion 151X. The first opposing portion 151C faces the adjacent second internal electrode layer 152 in the thickness direction T. The first lead portion 151X connects the first opposing portion 151C and the first external electrode 120. The first lead portion 151X is led out to the first end surface 115. The width W1 of the first opposing portion 151C in the width direction W is larger than the width W2 of the first lead portion 151X in the width direction. The first opposing portion 151C and the first lead portion 151X are integrally configured.

[0045] Fig. 7 is a schematic cross-sectional view taken along the line VII-VII shown in Fig. 4. The shape of the second internal electrode layer 152 will be described with reference to Fig. 7.

[0046] As shown in FIG. 7, the second internal electrode layer 152 includes a second opposing portion 152C and a second lead portion 152X. The second opposing portion 152C faces the adjacent first internal electrode layer 151 in the thickness direction T. The second lead portion 152X connects the second opposing portion 152C and the second external electrode 130. The second lead portion 152X is led out to the second end surface 116. The width W3 of the second opposing portion 152C in the width direction W is larger than the width W4 of the second lead portion 152X in the width direction. The second opposing portion 152C and the second lead portion 152X are integrally configured.

[0047] When the first lead portion 151X and the second lead portion 152X are not particularly distinguished, they may simply be referred to as lead portions, and when the first opposing portion 151C and the second opposing portion 152C are not particularly distinguished, they may simply be referred to as opposing portions. Similarly, when the first internal electrode layer 151 and the second internal electrode layer 152 are not particularly distinguished, they may simply be referred to as internal electrode layers. When the first external electrode 120 and the second external electrode 130 are not particularly distinguished, they may simply be referred to as external electrodes.

[0048] 8 is a schematic cross-sectional view for explaining details of the internal electrode layers of the multilayer ceramic capacitor according to the embodiment. The details of the multilayer ceramic capacitor 100 will be explained with reference to FIG.

[0049] Within the body portion 110 in a portion sandwiched in the thickness direction T by the first external electrode 120 provided on the first main surface 111 and the second main surface 112, and within the body portion 110 in a portion sandwiched in the thickness direction T by the second external electrode 130 provided on the first main surface 111 and the second main surface 112, some of the multiple internal electrode layers 150 have a shape that bulges toward one of the first main surface 111 and the second main surface 112.

[0050] Specifically, for example, on the first end face 115 side, the lead-out side of the internal electrode layer 150 arranged closest to the first main surface 111 bulges out towards the first main surface 111 side.

[0051] On the second end face 116 side, the lead-out side of the internal electrode layer 150 arranged one layer closer to the second main face 112 than the internal electrode layer 150 arranged closest to the first main face 111 bulges out toward the first main face 111. On the other hand, the internal electrode layer 150 located closest to the second main face 112 has a flat shape.

[0052] The internal electrode layer 150 bulging toward the first main surface 111 side is not limited to the internal electrode layer 150 arranged closest to the first main surface 111 side and the internal electrode layer 150 adjacent thereto. For example, the internal electrode layer 150 from the internal electrode layer 150 located closest to the first main surface 111 side to the third layer may be curved toward the second main surface 112 side. Of the total number of the multiple internal electrode layers 150, 20% or less of the internal electrode layers 150 from the internal electrode layer 150 arranged closest to the first main surface 111 side may bulge toward the first main surface 111 side.

[0053] Within the body portion 110 in the portion sandwiched in the thickness direction T by the first external electrode 120 provided on the first main surface 111 and the second main surface 112, the portion of the internal electrode layer 150 that bulges toward the first main surface 111 is not limited to the pull-out portion, and may also include the opposing portion of the portion located on the pull-out portion side.

[0054] Furthermore, a part of the internal electrode layer 150 that does not have an extraction portion provided on the first end face 115 side may bulge toward the first main face 111. In this case, the end side of the internal electrode layer 150 located opposite to the side where the extraction portion is located bulges.

[0055] The same applies to the portion of the element body 110 sandwiched in the thickness direction T between the second external electrodes 130 provided on the first main surface 111 and the second main surface 112.

[0056] By partially curving the multiple internal electrode layers 150 toward the first main surface 111, the contact area between the inner layer portion C and the first outer layer portion X1 can be increased, thereby making it possible to suppress interlayer peeling between the inner layer portion C and the first outer layer portion X1.

[0057] The first end face 115 and the second end face 116 have a shape that is recessed inward in the length direction L toward the center in the thickness direction T. This makes it possible to increase the contact area between the first end face 115 and the first external electrode 120, and the contact area between the second end face 116 and the second external electrode 130. As a result, the connection efficiency between the internal electrode layer 150 and the first external electrode 120 and the second external electrode 130 can be improved.

[0058] On the first end face 115 side, in the region of the element body 110 where adjacent internal electrode layers 150 do not overlap in the thickness direction T (the region outside the region where adjacent internal electrode layers 150 overlap in the thickness direction T), if the region up to the first end face 115 is defined as Lgap, the length of Lgap along the longitudinal direction L increases from the first main surface 111 toward the second main surface 112.

[0059] Specifically, for example, the length of Lgap from the internal electrode layer 150 located in the fourth layer from the first main surface 111 side to the first end surface 115 is greater than the length of Lgap from the internal electrode layer 150 located in the second layer from the first main surface 111 side to the first end surface 115. At least, the Lgap from the internal electrode 150 located closest to the second main surface 112 side to the first end surface 115 is longer than the Lgap from the internal electrode 150 located closest to the first main surface 111 side to the first end surface 115.

[0060] By increasing the length of Lgap in this manner, even if a crack occurs in Lgap of the element part 110, the multilayer ceramic capacitor 100 can be prevented from short-circuiting.

[0061] 8, a cross section that passes through the center of the width of element body 110 and is parallel to length direction L and thickness direction T is exposed by polishing or the like, and the cross section can be observed using an optical microscope, an electron microscope, etc. When observing with an optical microscope or an electron microscope, a bright field or a dark field is used as necessary.

[0062] 9 is a schematic cross-sectional view for explaining the shape of the element part on the end face side and the state of the lead-out parts of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. Fig. 9 shows a cross section of the element part 110 parallel to the thickness direction T and width direction W on the first end face 115 side.

[0063] 9, the cross section of element body part 110 parallel to thickness direction T and width direction W has a substantially parallelogram shape. In this cross section, the four corners are rounded. By making the cross section substantially parallelogram-shaped, the dimension in thickness direction T can be reduced, and multilayer ceramic capacitor 100 can be made smaller.

[0064] The multiple first drawn portions 151X may have a width in the width direction W that decreases toward one side in the thickness direction T. Specifically, the multiple first drawn portions 151X may have a width that decreases from the second main surface 112 side toward the first main surface 111 side. The same applies to the multiple second drawn portions 152X.

[0065] If the shortest distance in the width direction from an end of each of the first drawer sections 151X to the first side surface 113 or the second side surface 114 is defined as Sgm, then Sgm is, for example, 90 μm or more and 110 μm or less. Note that the numerical value of Sgm is not limited to the above.

[0066] 9 can be confirmed by polishing element body 110 until first end face 115 is exposed from the first external electrode 120 side, and observing a cross section of element body 110 parallel to thickness direction T and width direction W using an optical microscope, an electron microscope, or the like. When observing with an optical microscope or an electron microscope, a bright field or a dark field is used as necessary.

[0067] 10 is a schematic cross-sectional view for explaining the outer shape of the element body at the center in the longitudinal direction and the state of the opposing portions of the internal electrode layers in a multilayer ceramic capacitor according to an embodiment. Fig. 10 shows a cross section of the element body 110 parallel to the thickness direction T and width direction W at the center of the element body 110 in the longitudinal direction L.

[0068] As shown in FIG. 10, at least one of the internal electrode layers 150, which is within 20% of the number of the internal electrode layers 150 from the side closest to the first main surface 111 toward the center in the thickness direction, protrudes outward in the width direction W more than the internal electrode layer 150 located in the center in the thickness direction.

[0069] At least one of the internal electrode layers 150, which is located within 20% of the number of the internal electrode layers 150 from the second main surface 112 side toward the center in the thickness direction, protrudes outward in the width direction W more than the internal electrode layer 150 located in the center in the thickness direction.

[0070] In this way, the internal electrode layer 150 protruding in the width direction is provided on the first main surface 111 side and the second main surface 112 side, so that the side surfaces 101c, 101d of the laminate 101 have an uneven shape. This increases the contact area between the side surfaces 101c, 101d and the first side margin portion S1 and the second side margin portion S2. This makes it possible to prevent the first side margin portion S1 and the second side margin portion S2 from peeling off from the laminate 101.

[0071] In a cross section of the element body 110 parallel to the thickness direction T and the width direction W at the center of the element body 110 in the thickness direction L, the misalignment in the width direction W between internal electrode layers 150 adjacent to each other in the thickness direction T is less than 3 μm.

[0072] If the shortest distance from the end of the multiple internal electrode layers 150 (more specifically, the opposing portion) in the width direction to the first side surface 113 or the second side surface 114 is taken as Sgc, then Sgc is, for example, 10 μm or more and 20 μm or less. Note that the numerical value of Sgc is not limited to the above.

[0073] The above-mentioned Sgm is preferably at least five times the above-mentioned Sgc, which can improve the moisture resistance reliability of the multilayer ceramic capacitor 100.

[0074] In a cross-section of the body portion 110 parallel to the thickness direction T and the width direction W at the central portion of the body portion 110 in the length direction L, the first side surface 113 and the second side surface 114 have a shape that is concave inward in the width direction W as it approaches the central portion in the thickness direction T.

[0075] 10 can be confirmed by polishing element body 110 from the first external electrode 120 side to the center in length direction L, and observing a cross section of element body 110 parallel to thickness direction T and width direction W using an optical microscope, an electron microscope, or the like. When observing with an optical microscope or an electron microscope, a bright field or a dark field is used as necessary.

[0076] Fig. 11 is a schematic cross-sectional view for explaining the detailed shape of the element part of the multilayer ceramic capacitor according to the embodiment. Fig. 11 shows a cross section of the element part 110 passing through the center in the width direction W and parallel to the thickness direction T and the length direction L.

[0077] 11, at both end sides in the longitudinal direction L, the first main surface 111 and the second main surface 112 bulge outward in the thickness direction T. At both end sides in the longitudinal direction L, the element part 110 has thick portions that are thicker than the central part in the longitudinal direction L. More specifically, the region in the element part 110 where the lead portion overlaps in the thickness direction has a thick portion that is thicker than the central part of the element part 110 in the longitudinal direction L. The thickness h2 of the thick portions is thicker than the thickness h1 of the central part of the element part 110 in the longitudinal direction L.

[0078] As will be described later, the thick portion is formed in a region where a ceramic paste for eliminating steps is placed on the conductive paste that will become the internal electrode layer 150 in the manufacturing process.

[0079] The body portion 110 is provided so that its thickness gradually increases from a position about a length W6 inward from the end of the inner layer portion C in the longitudinal direction L, and gradually decreases from the position where the thickness is greatest toward the end face. The length W6 is approximately 5 μm or less.

[0080] By providing the thick portion as described above, as shown by the arrow AR1, the range covered by the first external electrode 120 or the second external electrode 130 from the first main surface 111 side to the end of the drawn-out portion located at the position closest to the first main surface 111 becomes longer than in a configuration in which no thick portion is provided. This makes it difficult for moisture that penetrates from the tip side of the first external electrode 120 or the second external electrode 130 located on the first main surface 111 to reach the end of the drawn-out portion. As a result, the moisture resistance reliability of the multilayer ceramic capacitor 100 can be improved.

[0081] Fig. 12 is a schematic cross-sectional view for explaining the misalignment in the width direction of the lead-out portions of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. Note that Fig. 12 is illustrated for the sake of convenience in explaining the amount of misalignment of the lead-out portions, and the shape of the element body 110, the positions of the lead-out portions, etc. are not limited to the form shown in Fig. 12.

[0082] 12, the misalignment D1 in the width direction W between the first drawer portion 151X located closest to the first side face 113 and the first drawer portion 151X located closest to the second side face 114 among the multiple first drawer portions 151X is 3 μm or more. The misalignment in the width direction between adjacent first drawer portions 151X is 3 μm or more. The misalignment amounts in the multiple second drawer portions 152X are similar to those of the first drawer portion 151X.

[0083] As described above, by setting the offset between adjacent lead portions in the thickness direction to 3 μm or more, when moisture that has infiltrated from the tip sides of the first external electrode 120 and the second external electrode 130 to the interface between the first external electrode 120 and the second external electrode 130 and the first main surface 111 attempts to reach a lead portion other than the lead portion located closest to the first main surface, the path length from the tip to the different lead portion increases. This also makes it more difficult for moisture to reach the lead portions, thereby improving the moisture resistance reliability of the multilayer ceramic capacitor 100.

[0084] At both ends 151t1 and 151t2 in the width direction W of each of the plurality of first drawn-out portions 151X, Si or Mg is segregated.

[0085] The widthwise ends of the first lead portions 151X are not aligned in the thickness direction T, but are offset in the width direction W. In this case, a part of the internal electrode layer 150 adjacent in the thickness direction may be close to one of the widthwise ends 151t1, 151t2 of the first lead portions 151X. The segregation of Si or Mg at the ends 151t1, 151t2 improves the insulation of the ends 151t1, 151t2, and can suppress short-circuiting between the internal electrode layers 150 adjacent in the thickness direction. As a result, the reliability of the multilayer ceramic capacitor 100 can be improved.

[0086] Si or Mg is also segregated at the ends in the width direction of each of the second draw-out portions 152X, and the same effect as described above can be obtained.

[0087] In each of the plurality of first lead portions 151X and the plurality of second lead portions 152X, Si or Mg is segregated on a main surface on one side in the thickness direction. The main surface on one side in the thickness direction is a main surface on which a ceramic paste for eliminating steps is placed in a manufacturing process of the multilayer ceramic capacitor 100 described later. In this way, by having Si or Mg segregated on the main surface on one side in the thickness direction of the lead portion, insulation from the adjacent internal electrode layers 150 can be ensured. This can improve the reliability of the multilayer ceramic capacitor 100.

[0088] The amount of Si or Mg segregated at the end of each of the plurality of lead portions in the width direction is greater than the amount of Si or Mg segregated at one main surface of the lead portion in the thickness direction, thereby further improving the reliability of the multilayer ceramic capacitor 100.

[0089] In addition, each of the multiple internal electrode layers 150 has a non-connected end portion 150U (see Figure 22) that is not connected to an external electrode on the opposite side in the longitudinal direction to the side on which the lead-out portion is located, and Si or Mg is segregated in the non-connected end portion 150U as well.

[0090] Fig. 13 is a schematic cross-sectional view for explaining the misalignment in the width direction of the opposing parts of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. Note that Fig. 12 is illustrated for the sake of convenience in explaining the amount of misalignment of the opposing parts, and the shape of the element part 110, the positions of the opposing parts, etc. are not limited to the form shown in Fig. 13.

[0091] 13, the misalignment D2 in the width direction W between the facing portion located closest to the first side surface 113 and the facing portion located closest to the second side surface 114 among the multiple facing portions (more specifically, the multiple first facing portions 151C and the multiple second facing portions 152C) is smaller than 3 μm. The misalignment D2 is smaller than the above-mentioned misalignment D1 and satisfies the relationship D1>D2. The misalignment in the width direction between adjacent facing portions is also smaller than 3 μm.

[0092] When the thickness of the opposing portion at the end in the width direction W is T1 and the thickness of the drawn-out portion at the end in the width direction is T2 (see FIG. 12), the relationship T1>T2 may be satisfied.

[0093] FIG. 14 is an enlarged schematic cross-sectional view showing an end portion in the width direction of a drawn-out portion of the multilayer ceramic capacitor according to the embodiment.

[0094] As shown in FIG. 14, when the end of the first lead portion 151X in the width direction W is enlarged, the end is scattered at intervals in the width direction and extends intermittently in the width direction. In the end, the gap between adjacent parts spaced apart in the width direction is filled with the dielectric layer 140. Here, when the continuity of the end of the first lead portion 151X in the width direction W is C1 and the continuity of the end of the first opposing portion 151C in the width direction W is C2, the relationship C1>C2 is satisfied. As a result, the ratio of the dielectric layer 140 entering the gap of the end on the first opposing portion 151C side increases, and the adjacent dielectric layers 140 are firmly fixed to each other so as to sandwich the internal electrode layer 150. As a result, it is possible to suppress interlayer peeling between the internal electrode layer 150 and the dielectric layer 140. The above-mentioned continuity relationship is also the same for the second lead portion 152X and the second opposing portion 152C.

[0095] The continuity of the end of the first lead portion 151X and the continuity of the end of the first opposing portion 151C can be measured as follows. First, in a cross section of the multilayer ceramic capacitor 100 parallel to the width direction and thickness direction, the first external electrode 120 is polished so that the first lead portion 151X is exposed. As the first lead portion 151X to be measured, some of the first lead portions 151X located toward the center in the thickness direction T are selected from the multiple first lead portions 151X.

[0096] At the end of the selected first draw-out portion 151X, the area from the outermost position in the width direction W to the area W10 inward is observed using SEM / EDX, and the widths W11, W12 of the area where Ni is not detected are measured. For each of the selected first draw-out portions 151X, the value obtained by (W10-(W11+W12)) / W10 (i.e., the value obtained by subtracting the sum of the widths of the areas where Ni is not detected from the width of the measurement range and dividing the value after subtraction by the width of the measurement range) is calculated, and the average of about 10 of the above values ​​excluding abnormal values ​​is taken as the continuity.

[0097] It should be noted that W10 can be set to, for example, about 20 μm, and can be set appropriately depending on the size of the multilayer ceramic capacitor 100.

[0098] The continuity of the first opposed portion 151C, the continuity of the second drawn-out portion 152X, and the continuity of the second opposed portion 152C can be calculated in the same manner as described above.

[0099] Fig. 15 is a schematic cross-sectional view for explaining the grain diameter of the multilayer ceramic capacitor according to the embodiment. Note that Fig. 15 is illustrated for convenience in order to explain the region of the element body 110 and the grain diameter in that region, and the shape of the element body 110, the position of the lead-out portion, and the like are not limited to the embodiment shown in Fig. 15. Also, Fig. 15 shows a state in which a plurality of dielectric layers 140 are produced by a solid phase method.

[0100] As shown in FIG. 15, the region of the body part 110 between the end of the pull-out part in the width direction and the side surface close to said end can be designated, in order from the inside in the width direction to the outside in the width direction, as a first region R1, a second region R2, and a third region R3.

[0101] Specifically, the first region R1 is a portion between the end in the width direction of the first drawn-out portion 151X located on the second side surface 114 side and the second side margin portion S2. The second region R2 and the third region R3 configure the second side margin portion S2.

[0102] The width of the first region R1 in the width direction W is greater than the width of the second region R2 in the width direction W. The width of the second region R2 in the width direction W2 is greater than the width of the third region R3 in the width direction W.

[0103] Specifically, the width of the first region R1 is 50 μm or more. The width of the second region R2 is 10 μm or less. The width of the third region R3 is 3 μm or less. These widths are values ​​measured at the center in the thickness direction in a cross section of the element part 110 parallel to the width direction W and thickness direction T where the first lead portion 151X is exposed.

[0104] Here, the amount of Mn in the second side margin portion S2 is greater than that in the dielectric layer 140 (more specifically, the dielectric layer 140 of the inner layer portion C) of the laminate 101. As a result, the grain diameter of the second side margin portion S2 is smaller than the grain diameter of the dielectric layer 140.

[0105] Specifically, when the grain diameter of the first region R1 is gr1, the grain diameter of the second region R2 is gr2, and the grain diameter of the third region R3 is gr3, the relationship gr1>gr2>gr3 is satisfied. The grain diameter is the circle equivalent diameter described above.

[0106] As described above, when the dielectric layer 140 and the side margin portion are manufactured using a solid phase method, there are no voids in the grains, and gaps are formed between the grains. Note that the holes formed in the grains are defined as voids, and the gaps formed between the grains are defined as voids. The gaps between the grains refer to a state such as a triple point.

[0107] The amount of voids contained in the second region R2 and the third region R3 is smaller than the amount of voids contained in the first region R1.

[0108] On the other hand, when the multiple dielectric layers 140 are produced using a hydrothermal synthesis method, the grain diameter of the dielectric layers 140 (more specifically, the dielectric layers 140 of the inner layer portion C) of the laminate 101 is smaller than the grain diameter of the second side margin portion S2. In this case, voids may be provided within the grains of the dielectric layers 140.

[0109] The pores or voids mentioned above can be observed using an electron microscope such as SEM or TEM.

[0110] Fig. 16 is a schematic cross-sectional view showing a detailed configuration of the external electrodes of the multilayer ceramic capacitor according to the embodiment. The detailed configuration of the external electrodes will be described with reference to Fig. 16. The first external electrode 120 and the second external electrode 130 have almost the same configuration.

[0111] As shown in FIG. 16, the first external electrode 120 and the second external electrode 130 include a Cu layer 121 provided on the element body 110, a Ni plating layer 122 provided on the Cu layer 121, and a Sn plating layer 123 provided on the Ni plating layer 122.

[0112] The Cu layer 121 has a first layer portion 125 connected to the multiple first lead portions 151X or the multiple second lead portions 152X, and a second layer portion 126 covering the first layer portion 125.

[0113] The first layer 125 is a so-called Cu-rich layer, and has a higher Cu content than the second layer 126. The first layer 125 extends along the thickness direction T on the first end face 115 or the second end face 116. The second layer 126 is a so-called glass-rich layer, and has a higher glass content than the first layer 125.

[0114] The first layer 125 has high continuity in the thickness direction T. In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction and parallel to the thickness direction and length direction, the first layer 125 extends along the thickness direction T so as to bridge between adjacent lead-out portions in the thickness direction T. In addition, in the above description, high continuity means that Cu is in contact with the exposed portions of the end faces of the internal electrode layers, and these are continuously connected in layers in the thickness direction. The first layer 125 plays a role in ensuring the connectivity with the internal electrode layer 150. The Cu contained in the first layer 125 can be made continuous by micronizing the Cu powder of the Cu paste used for the Cu layer and appropriately adjusting the sintering conditions.

[0115] The first layer 125 of the first external electrode 120 is connected to the multiple first lead portions 151X. The first layer 125 of the first external electrode 120 is a layer in which Cu is continuous so as to connect adjacent first lead portions 151X.

[0116] In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction and parallel to the thickness and length directions, the first layer 125 of the first external electrode 120 extends in the thickness direction T so as to connect 80% or more of the multiple first lead portions 151X.

[0117] The first layer 125 of the second external electrode 130 is connected to the multiple second lead portions 152X. The first layer 125 of the second external electrode 130 is a layer in which Cu is continuous so as to connect adjacent second lead portions 152X.

[0118] In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction and parallel to the thickness direction and length direction, the first layer 125 of the second external electrode 130 extends in the thickness direction T so as to connect 80% or more of the multiple second lead portions 152X.

[0119] Ni is diffused in the first layer 125. As described above, the internal electrode layers 150 contain Ni, and Ni is diffused from the first lead portion 151X and the second lead portion 152X into the first layer 125. In the first layer 125, the concentration of Ni increases toward the element body portion 110. By diffusing Ni in this way, even if the widths of the first lead portion 151X and the second lead portion 152X are small, it is possible to improve the connectivity between the first layer 125 and the first lead portion 151X and the second lead portion 152X.

[0120] In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction W and parallel to the thickness direction T and the length direction L, the thickness of the first layer 125 along the length direction L at the center in the thickness direction T is 25% or less of the entire thickness of the Cu layer 121 along the length direction L at the center in the thickness direction T. The thickness of the first layer 125 is preferably 5% or less of the entire thickness of the Cu layer 121.

[0121] The first layer 125 can be observed using SEM / EDX. Furthermore, the degree of Ni diffusion in the first layer 125 can be detected by composition analysis such as WDX or EDX in the cross section.

[0122] The second layer 126 contains Cu and glass. The glass occupies 10% or more of the cross-sectional area of ​​the second layer 126 in a cross section of the multilayer ceramic capacitor 100 that passes through the center in the width direction and is parallel to the thickness direction and length direction. More specifically, the glass may occupy 25% or more of the cross-sectional area of ​​the second layer 126 in the cross section. The second layer 126 contains Cu, which makes it easier to adsorb hydrogen and improves reliability.

[0123] In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction W and parallel to the thickness direction T and the length direction L, the thickness of the second layer 126 along the length direction L at the portion where the first external electrode 120 is thickest in the length direction L is 75% or more of the thickness of the Cu layer 121 along the length direction L. This allows the second layer 126 to sufficiently adsorb hydrogen. The thickness, etc. of the second layer 126 can be measured using an SEM, etc.

[0124] (Manufacturing method) 17 to 19 are diagrams showing predetermined steps for manufacturing the multilayer ceramic capacitor according to the embodiment. The method for manufacturing the multilayer ceramic capacitor 100 will be described with reference to FIGS.

[0125] First, a ceramic slurry containing ceramic powder, a binder, and a solvent is prepared in order to manufacture the multilayer ceramic capacitor 100. The ceramic powder can be synthesized by a known method such as a solid phase method or a hydrothermal synthesis method.

[0126] The ceramic slurry is formed into a sheet on a carrier film using a die coater, a gravure coater, a microgravure coater, or the like, to produce inner layer ceramic green sheets 23 and outer layer ceramic green sheets 26, which will be described later.

[0127] FIG. 17 is a diagram showing a step of providing a conductive pattern on an inner layer ceramic green sheet in a manufacturing process of the multilayer ceramic capacitor according to the embodiment.

[0128] 17, a plurality of strip-shaped conductive patterns 24 extending in a predetermined direction are formed on the inner layer ceramic green sheet 23. The strip-shaped conductive patterns 24 are arranged at intervals in an arrangement direction perpendicular to the extension direction of the conductive patterns 24. The conductive patterns 24 are portions that become the internal electrode layers 150. Each strip-shaped conductive pattern 24 has a plurality of openings 24h spaced apart in the extension direction of the conductive pattern 24. The conductive pattern 24 in a portion located between the openings 24h adjacent to each other in the extension direction is a portion that becomes a lead-out portion. The extension direction of the conductive patterns 24 is parallel to the width direction W. The arrangement direction is parallel to the length direction L.

[0129] The conductive pattern 24 is printed on the inner layer ceramic green sheet 23 by screen printing, inkjet printing, gravure printing or the like.

[0130] FIG. 18 is a diagram showing a step of arranging ceramic paste for eliminating steps in a manufacturing process of the multilayer ceramic capacitor according to the embodiment.

[0131] Next, as shown in Fig. 18, ceramic paste 25 for eliminating steps is applied. Specifically, ceramic paste 25 is applied along the above-mentioned extending direction to areas on inner layer ceramic green sheets 23 where conductive patterns 24 are not formed, and ceramic paste 25 is applied onto each conductive pattern 24 so as to fill multiple openings 24h aligned in the above-mentioned extending direction.

[0132] In order to facilitate alignment, the ceramic paste 25 is applied in a manner that partially overlaps the conductive pattern 24. In the arrangement direction in which the plurality of conductive patterns 24 are arranged, the ceramic paste 25 applied to the outside of each conductive pattern 24 preferably overlaps the conductive pattern 24 within a range of 5 μm from the end of the conductive pattern 24 in the arrangement direction.

[0133] The ceramic paste 25 is printed by, for example, screen printing, inkjet printing, or gravure printing.

[0134] The ceramic paste 25 may be formed of the same material as the inner layer ceramic green sheet 23, or may contain a different component. As described above, when Si or Mg is to be segregated at both ends in the width direction of the drawn-out portion and on one main surface in the thickness direction of the drawn-out portion, Si and / or Mg is added to the ceramic paste 25.

[0135] In the above, the case where the ceramic paste 25 is applied after the conductive pattern 24 is applied has been exemplified, but the conductive pattern 24 may be applied after the ceramic paste 25 is applied.

[0136] Fig. 19 is a diagram showing a step of laminating a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets in a manufacturing process of a multilayer ceramic capacitor according to an embodiment. Note that in Fig. 19, the state in which a plurality of inner layer ceramic green sheets 23 and a plurality of outer layer ceramic green sheets 26 are laminated is seen from the direction of arrow XIX shown in Fig. 18.

[0137] As shown in FIG. 19, a plurality of inner layer ceramic green sheets 23 and a plurality of outer layer ceramic green sheets 26 each having a conductive pattern 24 and a ceramic paste 25 applied thereon are laminated.

[0138] The multiple inner layer ceramic green sheets 23 are laminated such that the strip-shaped conductive patterns 24 are shifted in the arrangement direction between adjacent inner layer ceramic green sheets 23 by half the printing pitch of the conductive patterns 24. Specifically, the multiple inner layer ceramic green sheets 23 are laminated such that the openings 24h of the conductive patterns 24 provided on the inner layer ceramic green sheets 23 adjacent to each other in the stacking direction are alternately aligned in the arrangement direction when viewed from the stacking direction. The stacking method is approximately parallel to the thickness direction T, and the arrangement direction is approximately parallel to the length direction L.

[0139] A plurality of outer layer ceramic green sheets 26 are laminated on both sides of the laminated inner layer ceramic green sheets 23 in the lamination direction.

[0140] Next, the laminated inner layer ceramic green sheets 23 and outer layer ceramic green sheets 26 are thermocompression bonded to form a structure 200 (see FIG. 20).

[0141] Fig. 20 is a diagram showing a step of cutting a structure in which a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets are thermocompression-bonded in a manufacturing process of a multilayer ceramic capacitor according to an embodiment. Note that Fig. 20 shows a schematic plan view of the structure, but for convenience, the outer layer ceramic green sheet 26 is omitted, and only the inner layer ceramic green sheet 23 on which the conductive pattern 24 is formed is shown in plan view.

[0142] 20, the structure 200 is cut along cut lines CL1 and CL2 to cut out the laminated chip 10 (see FIG. 21). The cut line CL1 is parallel to the length direction L. The cut line CL2 is parallel to the width direction W. The structure 200 is cut by push cutting using a push cutting blade, dicing using a cutting blade, laser cutting, or the like. The laminated chip is the portion that becomes the laminate 101.

[0143] FIG. 21 is a diagram showing an area in which ceramic paste for eliminating steps is placed in an individual laminated chip.

[0144] Fig. 21 shows a cross section of the laminated chip 10 parallel to the length direction L and width direction, and in Fig. 21, the range of the conductive pattern 24 is indicated by a dashed line. In the laminated chip 10, the conductive pattern 24 includes an extraction region 24X that serves as a extraction portion, and an opposing region 24C that serves as an opposing portion.

[0145] The ceramic paste 25 for eliminating the step overlaps the conductive pattern 24 in regions R6 and R7. Region R6 is composed of a region in which the lead-out region 24X is formed and a facing region 24C located closer to the lead-out region 24X. Region R7 is a region on the end side of the facing region 24C located on the opposite side to the side where the lead-out region 24X is located.

[0146] In this manner, the conductive pattern 24 that becomes the internal electrode layer 150 and the ceramic paste 25 that forms part of the dielectric layer 140 overlap in regions R6 and R7, causing parts of the laminate 101 to bulge on both sides in the longitudinal direction L, as described above.

[0147] Furthermore, by adding Si and / or Mg to the ceramic paste 25 for eliminating the step, it is possible to cause Si and / or Mg to segregate in the internal electrode layer 150 in the regions R6 and R7.

[0148] Next, ceramic paste for sides is applied to both end faces in the width direction of the laminated chip 10. Specifically, the ceramic paste is filled into a plurality of recesses (grooves) provided on the application surface of the plate, and the end faces in the width direction of the laminated chip 10 are brought into contact with the application surface. This allows the ceramic paste for sides to be applied only to the end faces by capillary action. The applied ceramic paste for sides is fired to become the first side margin portion S1 and the second side margin portion S2.

[0149] The ceramic paste for the sides may be made of the same material as the inner layer ceramic green sheets 23, or may contain different components. The first side margin portion S1 and the second side margin portion S2 can be densified by making the ceramic paste for the sides contain more Mn than the inner layer ceramic green sheets 23. The ceramic powder contained in the ceramic paste for the sides is synthesized by, for example, a solid phase method.

[0150] Next, the laminated chip 10 with the ceramic paste for the sides applied thereto is fired to form the element portion 110.

[0151] Figure 22 is a diagram showing an area in which a specified component segregates in a part of an internal electrode layer in an element part formed by firing a laminated chip to which a ceramic paste for a specified component side has been applied in an element part according to an embodiment.

[0152] As shown in FIG. 22, in the internal electrode layer 150 (more specifically, the first internal electrode layer 151) of the element body 110, in the regions R6 and R7, Si and / or Mg contained in the ceramic paste 25 overlapping the conductive pattern 24 segregates.

[0153] In region R6, Si and / or Mg are segregated in one main surface of the first drawn portion 151X in the thickness direction and in one main surface of the first opposing portion 151C located on the first drawn portion 151X side. In particular, in the regions on both ends in the width direction W of the outer periphery of region R6, the amount of segregation of Si or Mg is larger than that of inner region R8 in region R6.

[0154] In region R7, Si and / or Mg are segregated in one main surface of the first opposing portion 151C on the end side opposite to the side located on the first drawn portion 151X side in the longitudinal direction L. In particular, in the first side margin portion S1, the second side margin portion S2, and the portion along the dielectric layer 140 in the outer periphery of region R7, the amount of segregation of Si or Mg is larger than that in the inner region R9 in region R7. That is, the amount of segregation of Si or Mg is larger in the internal electrode layer at the non-connected end portion 150U located opposite to the side where the drawn portion is located in the longitudinal direction L and which is not connected to the external electrode.

[0155] Incidentally, on the second internal electrode layer 152 side as well, similar to the first internal electrode layer 151, Si and / or Mg are segregated.

[0156] Next, a first external electrode 120 and a second external electrode 130 are formed on both end faces (first end face 115, second end face 116) of the element body 110, respectively. Specifically, a Cu paste containing finely divided Cu particles is applied to both end faces of the element body 110. As an application method, for example, a method of forming a paste layer that will become the first layer on a plate and immersing the end faces in the paste layer can be adopted. The applied paste layer is baked, and plating is performed in the following order: Cu plating, Ni plating, and Sn plating.

[0157] Through the above steps, the multilayer ceramic capacitor 100 according to the embodiment can be manufactured.

[0158] The embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0159] 10 laminated chip, 23 inner layer ceramic green sheet, 24 conductive pattern, 24C opposing region, 24X lead-out region, 24h opening, 25 ceramic paste, 26 outer layer ceramic green sheet, 100 laminated ceramic capacitor, 101 laminate, 101a, 101b main surface, 101c, 101d side surface, 101e, 101f end surface, 110 element portion, 111 first main surface, 112 second main surface, 113 first side surface, 114 second side surface, 115 first end surface, 116 second end surface, 120 first external electrode, 121 Cu layer, 122 Ni plating layer, 123 Sn plating layer, 125 first layer portion, 126 second layer portion, 130 second external electrode, 140 dielectric layer, 150 internal electrode layer, 150U Non-connected end portion, 151 first internal electrode layer, 151C first opposing portion, 151X first lead-out portion, 151t1, 151t2 end portion, 152 second internal electrode layer, 152C second opposing portion, 152X second lead-out portion, 200 structure, C inner layer portion, CL1, CL2 cut line, E1 first end margin portion, E2 second end margin portion, R1 first region, R2 second region, R3 third region, R6, R7 regions, R8, R9 inner regions, S1 first side margin portion, S2 second side margin portion, X1 first outer layer portion, X2 second outer layer portion.

Claims

1. an element portion having a first main surface and a second main surface opposed to each other in a thickness direction, a first side surface and a second side surface opposed to each other in a width direction, and a first end surface and a second end surface opposed to each other in a length direction, the element portion including a plurality of dielectric layers and a plurality of internal electrode layers stacked in the thickness direction; a first external electrode provided on the first end surface; a second external electrode provided on the second end surface, the plurality of internal electrode layers include a plurality of first internal electrode layers connected to the first external electrode and a plurality of second internal electrode layers connected to the second external electrode, each of the plurality of first internal electrode layers has a first opposing portion opposing the second internal electrode layer adjacent to the thickness direction, and a first lead portion connecting the first opposing portion and the first external electrode; each of the plurality of second internal electrode layers has a second opposing portion opposing the first internal electrode layer adjacent in the thickness direction, and a second lead portion connecting the second opposing portion and the second external electrode; a width of the first opposing portion in the width direction is greater than a width of the first drawn-out portion in the width direction, a width of the second opposing portion in the width direction is greater than a width of the second drawn-out portion in the width direction, each of the first external electrode and the second external electrode includes a Cu layer provided on the element body portion, a Ni plating layer provided on the Cu layer, and a Sn plating layer provided on the Ni plating layer; the Cu layer has a first layer portion connected to a plurality of the first lead portions or a plurality of the second lead portions and a second layer portion covering the first layer portion, The first layer has a higher Cu content than the second layer and extends along the thickness direction, the second layer has a higher glass content than the first layer, the first layer portion of the first external electrode is a layer in which Cu is continuous so as to connect the first lead portions adjacent to each other in the thickness direction, the first layer portion of the second external electrode is a layer in which Cu is continuous so as to connect the second lead portions adjacent to each other in the thickness direction, a multilayer ceramic capacitor, wherein in a cross section of the second layer that passes through a center portion in the width direction and is parallel to the thickness direction and the length direction, the glass occupies 25% or more of an area of ​​the second layer.

2. 2. The multilayer ceramic capacitor according to claim 1, wherein Ni is diffused into said first layer.

3. 3. The multilayer ceramic capacitor according to claim 2, wherein the first layer portion has an Ni concentration that increases toward the element portion.

4. 4. The multilayer ceramic capacitor according to claim 1, wherein a thickness of the second layer along the length direction is 75% or more of a thickness of the Cu layer along the length direction.

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