Laminate for packaging container with RFIC element and packaging container with RFIC element

Abstract

To provide a laminate for packaging containers with RFIC elements that suppresses a decrease in sensitivity due to an increase in a value of resistance of a conductor layer provided on a second surface of a base material.SOLUTION: A laminate 10 for a packaging container with an RFIC element according to the present invention comprises: a base material 100 having a first surface 100a facing outward when assembled and a second surface 100b facing inward when assembled, which becomes a box-shaped packaging container when assembled; a conductive layer having a first conductive layer 120 and a second conductive layer 130 provided on the side of the second surface 100b of the base material 100; a smoothing layer 170 provided between at least a region on the second surface 100b of the substrate 100 where the conductive layer is provided and the conductive layer; and an RFIC element 140 provided on the side of the second surface 100b of the substrate 100. The RFIC element 140 is provided so as to be directly or capacitively coupled to the first conductive layer 120 and the second conductive layer 130.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to a laminate for a packaging container with an RFIC element and a packaging container with an RFIC element. [Background technology]

[0002] In recent years, IC tags using RFID (radio frequency identifier) ​​technology (radio frequency identification technology) have been used as non-contact short-range communication using radio waves, etc. IC tags are, for example, attached to various goods or their packaging containers, and are used for distribution of the goods, such as transportation and sales. In this case, by holding the goods over a reader / writer as necessary, the goods information recorded in the RFIC element of the IC tag can be read by non-contact communication, and various information can be written to the RFIC element. This enables efficient logistics management.

[0003] Conventionally, when RFID technology is used in packaging containers, an IC tag is attached to the packaging container as described above. In relation to this RFID technology, Patent Document 1 proposes a form in which an RFIC element and a conductive layer (antenna pattern) are directly provided on packaging paperboard. Patent Document 1 discloses a technique for continuously forming a conductive layer together with an RFIC element between two sheets of base material by gravure printing, screen printing, inkjet printing, or the like. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 216686 Summary of the Invention [Problem to be solved by the invention]

[0005] It has also been proposed to place the RFIC element and conductive layer on the second surface (back surface) of a packaging container to which an IC tag is attached. In that case, depending on the base material that constitutes the packaging container, the resistance value of the conductive layer may increase, resulting in a decrease in sensitivity. The present disclosure provides a laminate for a packaging container with an RFIC device, and a packaging container with an RFIC device, which suppresses a decrease in sensitivity caused by an increase in the resistance value of a conductive layer provided on a second surface of a substrate. [Means for solving the problem]

[0006] The present disclosure solves the above problems by the following solving means. Note that, for ease of understanding, the following description will be given with reference symbols corresponding to the embodiments of the present disclosure, but the present disclosure is not limited thereto.

[0007] The first disclosure is a laminate (10) for a packaging container with an RFIC element, comprising: a substrate (100) having a first surface (100a) facing outward when assembled and a second surface (100b) facing inward when assembled, the substrate (100) becoming a box-shaped packaging container when assembled; a conductive layer having a first conductive layer (120) and a second conductive layer (130) provided on the second surface side of the substrate; a smoothing layer (170) provided between at least the region of the second surface of the substrate where the conductive layer is provided and the conductive layer; and an RFIC element (140) provided on the second surface side of the substrate, the RFIC element being provided so as to be directly or capacitively coupled to the first conductive layer and the second conductive layer.

[0008] A second disclosure is the laminate (10) for a packaging container with an RFIC device according to the first disclosure, wherein the surface roughness Sa of the smoothing layer (170) is 0.5 μm or more and 2 μm or less.

[0009] A third disclosure is the laminate (10) for a packaging container with an RFIC element according to the first or second disclosure, which has a protective layer (180) on the surface side of the conductive layer.

[0010] A fourth disclosure is the laminate (10) for a packaging container with an RFIC element according to the third disclosure, in which the protective layer (180) is not formed in an area where the RFIC element (140) is provided.

[0011] A fifth disclosure is a packaging container (1) with an RFIC device, which is obtained by assembling the laminate (10) for a packaging container with an RFIC device according to any one of the first to fourth disclosures into a box shape. Effect of the Invention

[0012] According to the laminate for a packaging container with an RFIC device and the packaging container with an RFIC device of the present disclosure, it is possible to suppress a decrease in sensitivity caused by an increase in the resistance value of the conductive layer provided on the second surface of the base material. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective view showing a packaging container 1 with an RFIC element according to a first embodiment. [Diagram 2] 1 is a perspective view showing a packaging container 1A with an RFIC element in which a bottle is stored according to a first embodiment. [Figure 3A] 1 is a development view of a laminate 10 for a packaging container with an RFIC element according to a first embodiment. [Figure 3B] 4 is a development view showing another configuration of the RFIC element-equipped packaging container laminate 10 of the first embodiment. FIG. [Figure 4] 13 is a diagram illustrating the relationship between a resin bottle filled with an aqueous solution and the length of a first conductive layer 120. FIG. [Diagram 5] 13 is a diagram illustrating the relationship between the metal bottle and the length of the first conductive layer 120. FIG. [Figure 6] 2 is a partial cross-sectional view showing the layer structure of a laminate 10 for a packaging container with an RFIC element and an IC tag 150. FIG. [Figure 7] 10 is a partial cross-sectional view showing another layer structure of the RFIC element-equipped packaging container laminate 10 and the IC tag 150. FIG. [Figure 8] 1 is a first graph showing the relationship between surface roughness and surface resistance value. [Figure 9]11 is a second graph showing the relationship between surface roughness and surface resistance value. [Figure 10] 11 is a perspective view showing a packaging container 2 with an RFIC element according to a second embodiment. FIG. [Figure 11] 11 is a perspective view showing a packaging container 2A with an RFIC element that stores a bottle according to a second embodiment. FIG. [Figure 12] 13 is a development view of a laminate 20 for a packaging container with an RFIC element according to a second embodiment. FIG. [Figure 13] FIG. 11 is a perspective view showing a packaging container 3 with an RFIC element according to a third embodiment. [Figure 14] FIG. 11 is a perspective view showing an RFIC element-equipped packaging container 3A that houses a bottle according to a third embodiment. [Figure 15] 13 is a development view of a laminate 30 for a packaging container with an RFIC element according to a third embodiment. FIG. [Figure 16] 13 is a diagram illustrating another example of the configuration of the IC tag 150. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present disclosure will be described. Each of the drawings attached to this specification is a schematic diagram, and the shape, scale, aspect ratio, etc. of each part are appropriately changed or exaggerated from the actual one in consideration of ease of understanding. The numerical values, shapes, material names, etc. described in this specification are examples of embodiments, and are not limited thereto, and may be appropriately selected and used. In each drawing, the shape and outline of the members are represented by solid lines or dashed lines, and the illustration of the thickness part is appropriately omitted.

[0015] In each embodiment, an XYZ orthogonal coordinate system is shown in the drawings. In this coordinate system, when the packaging container 1 assembled into a box shape is viewed in the position shown in FIG. 1, the left-right (width / horizontal) direction is the X direction, the front-rear direction is the Y direction, and the up-down (length / height) direction is the Z direction. In the left-right direction (X direction), the right direction in the drawing is the X1 direction, and the left direction is the X2 direction. In the front-rear direction (Y direction), the front direction in the drawing is the Y1 direction, and the rear direction is the Y2 direction. In the up-down direction (Z direction), the upper direction in the drawing is the Z1 direction, and the lower direction is the Z2 direction. In this specification, the "direction" is also referred to as the "side" as appropriate.

[0016] (First embodiment) Fig. 1 is a perspective view showing a packaging container 1 with an RFIC element according to the first embodiment. Fig. 2 is a perspective view showing a packaging container 1A with an RFIC element that stores a bottle according to the first embodiment. Fig. 3A is a development view of a laminate 10 for a packaging container with an RFIC element according to the first embodiment. Fig. 3B is a development view showing another configuration of the laminate 10 for a packaging container with an RFIC element according to the first embodiment. In Fig. 1, flaps folded inward are not shown. In Fig. 2, a bottle to be stored inside is shown by an imaginary line (two-dot chain line). Fig. 3A and Fig. 3B show the unfolded RFIC element-equipped packaging container laminate (hereinafter also referred to as "packaging container laminate") 10 as viewed from the second surface 100b side, which is the inside of the packaging container 1.

[0017] A packaging container 1 with an RFIC element (hereinafter also referred to as "packaging container 1") shown in FIG. 1 is used, for example, as an outer box of a product sold in a state of display at a storefront or the like. The packaging container 1 has a function as an RFID device by mounting an RFIC element 140 (described later). As shown in FIG. 2, the packaging container 1 becomes a packaging container 1A with an RFIC element that contains a bottle 60 as a content. In this specification, the term "bottle" refers to a container with a lid made of resin, metal, glass, etc., and generally refers to a container that contains a liquid, semi-solid material, etc.

[0018] 1, the packaging container 1 is composed of a packaging container laminate 10. The packaging container laminate 10 includes a base material 100, a first conductive layer 120, a second conductive layer 130, and an RFIC element 140. Of these, the first conductive layer 120, the second conductive layer 130, and the RFIC element 140 constitute an IC tag (RFID tag) 150.

[0019] The substrate 100 is a sheet-like member having a first surface 100a that faces outward when assembled and a second surface 100b that faces inward when assembled (see FIG. 3A). The first surface 100a of the substrate 100 is the front surface, and the second surface 100b is the back surface. For example, thick paper such as coated cardboard or cardboard can be used as the substrate 100. Paper materials that can be used as the substrate 100 are not limited to the above, and any paper material may be selected as long as it can maintain its shape even when contents such as goods are stored inside. Furthermore, the substrate 100 is not limited to a paper material, and a resin sheet-like material or the like may be used. The layer thickness of the substrate is, for example, 0.1 mm or more and 1.0 mm or less, or the basis weight (weight per unit area) of the substrate 100 is 100 g / m 2 More than 700g / m 2 In order to maintain the shape of the carton, it is desirable for the carton to be as follows.

[0020] As shown in FIG. 3A, the base material 100 includes a front portion 101, a back portion 102, an upper cover portion 103, a lower cover portion 104, a right side portion 105, a left side portion 106, and a margin portion 107. Of these, the front portion 101, the back portion 102, the right side portion 105, and the left side portion 106 constitute the side portions of the base material 100. By assembling the packaging container laminate 10 shown in FIG. 3A in the procedure described below, a vertically elongated, substantially rectangular parallelepiped (box-shaped) packaging container 1 can be assembled as shown in FIG. 1. The interior of the assembled packaging container 1 becomes a space capable of storing a bottle as a content. By storing a bottle in this space and closing the upper cover portion 103, a packaging container 1A with an RFIC element storing a bottle can be obtained as shown in FIG. 2.

[0021] The front portion 101 is a portion located on the front side Y1 of the packaging container 1. A glue tab 107 is connected to the right side X1 of the front portion 101, which is folded at the fold line a1. That is, the glue tab 107 is provided at one end edge in the left-right direction X of the side portion (the end in the right direction X1 in this example). The glue tab 107 is overlapped with the left side portion 106, which is the other end edge of the side portion (the end in the left direction X2 in this example), thereby joining one end edge and the other end edge in the left-right (width) direction X of the side portion. In the packaging container laminate 10, the fold lines provided in the left-right direction X are folded at the valley and the glue tab 107 is glued to the glued area 106a of the left side portion 106 (described later), so that the packaging container laminate 10 has a substantially rectangular parallelepiped shape that is open in the top and bottom directions.

[0022] In this specification, the term "valley fold" refers to the folding direction when the base material 100 is viewed from the second surface 100b as shown in Fig. 3A. The term "valley fold" of the adhesive portion 107 at the fold line a1 means that the adhesive portion 107 is folded from the back side to the front side in the figure at the fold line a1. In addition, the term "connected" in this specification means that each part is connected seamlessly as shown in Fig. 3A.

[0023] A right side surface portion 105 is connected to the left side X2 of the front surface portion 101 via a valley fold line a3. The right side surface portion 105 is a portion located on the right side X1 of the packaging container 1. An upper flap 109 that is valley-folded at the fold line a4 is connected to the upper side Z1 of the right side surface portion 105. The upper flap 109 is a portion that is closed together with the upper surface portion 103a (described later) and folded inward of the upper lid portion 103 when the upper lid portion 103 is closed. A lower flap 108 that is valley-folded at the fold line a2 is connected to the lower side Z2 of the right side surface portion 105. The lower flap 108 is a portion that is closed together with the lower surface portion 104a (described later) and folded inward of the lower lid portion 104 when the lower lid portion 104 is closed.

[0024] The back portion 102 is connected to the left side X2 of the right side portion 105 via a valley-folded fold line a7. The back portion 102 is a portion located on the rear side Y2 of the packaging container 1. A part of the second conductive layer 130 (described later) is provided on the back portion 102. The top cover portion 103 is connected to the upper side Z1 of the back portion 102, and is valley-folded at the fold line a8. The top cover portion 103 is a portion that closes the opening of the upper side Z1 of the packaging container 1 in an openable and closable manner. The top cover portion 103 includes an upper surface portion 103a and an upper insertion piece 103b. The top surface portion 103a is connected to the back portion 102 via a valley-folded fold line a8. The upper insertion piece 103b is connected to the top surface portion 103a via a valley-folded fold line a9. When the upper insertion piece 103b is inserted into the inside of the packaging container 1, the opening on the upper side Z1 of the packaging container 1 is closed by the upper surface portion 103a.

[0025] A bottom lid portion 104 is connected to the bottom side Z2 of the back surface portion 102, and is valley-folded at the fold line a5. The bottom lid portion 104 is a portion that closes the opening of the bottom side Z2 of the packaging container 1. The bottom lid portion 104 has a bottom surface portion 104a and a bottom insertion piece 104b. The bottom surface portion 104a is connected to the back surface portion 102 via the valley-folded fold line a5. The bottom insertion piece 104b is connected to the bottom surface portion 104a via the valley-folded fold line a6. The bottom insertion piece 104b is inserted into the inside of the packaging container 1, and the bottom opening of the packaging container 1 is closed by the bottom surface portion 104a.

[0026] A left side surface portion 106 that is valley-folded at the fold line a11 is connected to the left side X2 of the back surface portion 102. The left side surface portion 106 is a portion that is located on the left side X2 of the packaging container 1. The left side surface portion 106 is provided with the first conductive layer 120, other portions of the second conductive layer 130, and an RFIC element 140. In addition, a glue tab portion 107 is glued to a region 106a of the left side surface portion 106 that is to be glued. An upper flap 110 that is folded at a fold line a12 is connected to the upper side Z1 of the left side surface portion 106. The upper flap 110 is closed together with the upper surface portion 103a when the top cover portion 103 is closed, and is folded inward of the top cover portion 103. A bottom flap 111 that is folded at a fold line a10 is connected to the lower side Z2 of the left side surface portion 106. The bottom flap 111 is closed together with the bottom surface portion 104a when the bottom cover portion 104 is closed, and is folded inward of the bottom cover portion 104.

[0027] Next, a procedure for assembling the packaging container laminate 10 will be briefly described. First, the folding lines a1, a3, a7, and a11 of the packaging container laminate 10 (base material 100) are folded inward, and the first surface 100a side of the adhesive margin portion 107 is glued to the intended gluing area 106a (second surface 100b) of the left side surface portion 106. As a result, the packaging container laminate 10 becomes a substantially rectangular parallelepiped shape (box shape) with openings in the top and bottom directions. Next, the lower flaps 108 and 111 are folded inward together with the lower lid portion 104 to close the opening of the lower side Z2 of the packaging container 1. In this state, the bottle 60 is stored from the opening of the upper side Z1. Next, the upper flaps 109 and 110 are folded inward together with the upper lid portion 103 to close the opening of the upper side Z1 of the packaging container 1. As a result, the RFIC-equipped packaging container 1A storing the bottle can be obtained.

[0028] Next, the first conductive layer 120, the second conductive layer 130, and the RFIC element 140 provided on the packaging container laminate 10 will be described. The packaging container laminate 10 includes a first conductive layer 120 and a second conductive layer 130 (hereinafter also collectively referred to as "conductive layers") as conductive layers (antenna patterns) for non-contact communication with a reader / writer (not shown). As shown in FIG. 3A, the first conductive layer 120 and the second conductive layer 130 are provided electrically separated from each other on the second surface 100b (rear surface) of the base material 100. The first conductive layer 120 and the second conductive layer 130 are formed in a strip shape. Note that "strip shape" refers to a long, narrow linear shape with a certain width.

[0029] The first conductive layer 120 is provided along the intended glue region 106a on the left side surface portion 106 of the base material 100. The first conductive layer 120 extends along the up-down direction Z, and does not contact or cross the fold line a11 (bending portion). The intended glue region 106a is an area where the glue tab portion 107 is overlapped. That is, the first conductive layer 120 is disposed in an area where the glue tab portion 107 is overlapped on the left side surface portion (side surface portion) 106. By gluing the glue tab portion 107 to the intended glue region 106a, the first conductive layer 120 is covered with the glue tab portion 107.

[0030] The second conductive layer 130 is disposed near the upper cover 103 on the left side surface 106 and the rear surface 102. Specifically, the second conductive layer 130 is provided along the edges of the upper side Z1 of the left side surface 106 and the rear surface 102, and extends along the left-right direction X. The up-down direction Z in which the first conductive layer 120 extends and the left-right direction X in which the second conductive layer 130 extends are orthogonal to each other. Note that the extending directions of the first conductive layer 120 and the second conductive layer 130 only need to intersect with each other, and are not necessarily orthogonal to each other.

[0031] As shown in FIG. 4 (described later), the second conductive layer 130 is disposed on the upper side Z1 of the liquid surface of the aqueous solution filled in the bottle 60. The left side X2 of the second conductive layer 130 is formed so as to be adjacent to the upper side Z1 of the first conductive layer 120. That is, a part of the second conductive layer 130 is disposed in the intended glue region 106a (the region where the adhesive margin portion 107 is overlapped). On the other hand, the end of the right side X1 of the second conductive layer 130 is formed on the back surface portion 102, crossing the fold line a11. By gluing the adhesive margin portion 107 to the intended glue region 106a, a part of the second conductive layer 130 is covered by the adhesive margin portion 107.

[0032] The lower limit of the length L2 of the second conductive layer 130 in the extending direction is preferably 30 mm, more preferably 40 mm. The upper limit of the length L2 of the second conductive layer 130 is preferably 170 mm, more preferably 150 mm. 3A, the lower limit of the total length of the length L1 in the direction in which the first conductive layer 120 extends and the length L2 in the direction in which the second conductive layer 130 extends (hereinafter also referred to as the "conductive layer length L0") is preferably 100 mm, and more preferably 120 mm. The upper limit of the conductive layer length L0 is preferably 200 mm, and more preferably 180 mm. By setting the conductive layer length L0 within this range, contactless communication with a reader / writer (not shown) can be performed satisfactorily.

[0033] As long as the length L0 of the second conductive layer is within the range of the upper and lower limits described above, the second conductive layer 130 may be configured to cross the bent portion (fold line a11 in this example) as shown in Fig. 3A, or may be configured not to cross the bent portion as shown in Fig. 3B. By configuring neither the first conductive layer 120 nor the second conductive layer 130 to cross the bent portion (fold line) as shown in Fig. 3B, it is possible to prevent each conductive layer from bending at the bent portion when assembling the packaging container, and to prevent the resistance value of each conductive layer from increasing due to bending.

[0034] The lower limit of the total length of the first conductive layer 120 and the second conductive layer 130 that do not cross the bent portion (fold line) is preferably 150 mm. The upper limit of the total length of the first conductive layer 120 and the second conductive layer 130 that do not cross the bent portion is preferably 200 mm. The width W of the conductive layer is preferably, for example, about 10 mm, and the thickness of the conductive layer is preferably, for example, about 2 μm.

[0035] Here, the relationship between the length of the first conductive layer 120 and the contents will be described. Fig. 4 is a diagram illustrating the relationship between a resin bottle filled with an aqueous solution and the length of the first conductive layer 120. Fig. 5 is a diagram illustrating the relationship between a metal bottle and the length of the first conductive layer 120.

[0036] 4, in the case of a resin bottle 60 filled with an aqueous solution, the length L3 of the first conductive layer 120 extending from the liquid level 61 of the aqueous solution to the lower side Z2 is preferably 30 mm or more. By making the length of the first conductive layer 120 extend from the liquid level 61 of the aqueous solution to the lower side Z2 by 30 mm or more, good communication performance can be ensured.

[0037] As shown in Fig. 5, in the case of a metal bottle 70, the first conductive layer 120 preferably has a length L4 extending from the upper end (upper end of the metal portion) of the discharge portion 71 of the bottle 70 to the lower side Z2 of 30 mm or more. The metal constituting the bottle 70 reflects or absorbs radio waves transmitted from the IC tag 150, so good communication performance can be ensured by setting the length L4 extending from the upper end of the discharge portion 71 to the lower side Z2 of 30 mm or more in the first conductive layer 120. Note that, although Fig. 5 shows an example in which the cap 72 is made of resin, when the entire bottle including the cap 72 is made of metal, the length L4 extending from the upper end of the cap 72 to the lower side Z2 in the first conductive layer 120 is preferably 30 mm or more.

[0038] The first conductive layer 120 and the second conductive layer 130 can be formed, for example, by printing a conductive ink using a method such as gravure printing, flexographic printing, or silk screen printing. As the conductive ink, for example, a dispersion of metal particles such as copper, silver, or gold, or a mixture thereof, can be used. Note that the first conductive layer 120 and the second conductive layer 130 are not limited to conductive ink, and may be formed of a thin metal film having conductivity such as gold, silver, aluminum, tin, copper, brass, iron, or an alloy thereof, using an adhesive, metal vapor deposition, or other methods.

[0039] Returning to FIG. 2, the RFIC element 140 is an IC chip that transmits and receives information to and from a reader / writer (not shown) by wireless communication. For example, information related to a product is stored in the RFIC element 140. The RFIC element 140 performs wireless communication with the reader / writer using radio waves of a UHF band (for example, 920 MHz). The RFIC element 140 is provided so as to be directly or capacitively coupled to the first conductive layer 120 and the second conductive layer 130 in the intended gluing area 106a (area where the glue margin portion 107 is overlapped) of the left side surface portion 106 (side surface portion). Here, "directly coupled" refers to a state in which a conductive terminal portion (not shown) of the RFIC element 140 is in direct contact with the first conductive layer 120 or the second conductive layer 130. Moreover, being capacitively coupled refers to a state in which the conductive terminal portion of the RFIC element 140 and the first conductive layer 120 or the second conductive layer 130 are coupled via a non-conductive dielectric thin film (not shown). In the state of the packaging container 1, the first conductive layer 120 and the second conductive layer 130 function as antennas for wireless communication with an external reader / writer.

[0040] Here, a description will be given of the layer structure of the laminate 10 for a packaging container with RFIC element and the IC tag 150. Fig. 6 is a partial cross-sectional view showing the layer structure of the laminate 10 for a packaging container with RFIC element and the IC tag 150. Fig. 7 is a partial cross-sectional view showing another layer structure of the laminate 10 for a packaging container with RFIC element and the IC tag 150.

[0041] As shown in FIG. 6, the packaging container laminate 10 includes a base material 100, a design layer 160, a smoothing layer 170, and a protective layer 180 as a basic layer configuration. The design layer 160 is a layer formed on the first surface 100a (surface) of the packaging container laminate 10. The design layer 160 is formed, for example, by printing directly on the surface of the substrate 100 with colored ink. The design layer 160 is a printed layer on which, for example, the product name, model number, product description, etc. of the contents to be stored in the packaging container 1 are affixed together with a design (design).

[0042] The smoothing layer 170 is a layer provided to enhance the smoothness of the second surface 100b (rear surface) of the substrate 100. As described later, by enhancing the smoothness of the second surface 100b of the substrate 100 on which the conductive layer is formed, the resistance value of the conductive layer that becomes the antenna pattern can be reduced. The smoothing layer 170 is provided between the second surface 100b of the substrate 100 and the conductive layer. The smoothing layer 170 may be formed on the entire surface of the second surface 100b of the substrate 100, or may be formed only in the region where the conductive layer is provided. The lower limit of the layer thickness of the smoothing layer 170 is 1 μm. The upper limit of the layer thickness of the smoothing layer 170 is 500 μm. The configuration of the smoothing layer 170 will be described in detail later.

[0043] The protective layer 180 is a layer formed on the surfaces of the first conductive layer 120, the second conductive layer 130, and the smoothing layer 170. The protective layer 180 is provided mainly to protect the conductive layer. The protective layer 180 may be formed on the entire surface of the second surface 100b of the substrate 100, or may be formed only in the area where the conductive layer is provided. The lower limit of the thickness of the protective layer 180 is 0.1 μm. The upper limit of the thickness of the protective layer 180 is 500 μm. The protective layer 180 can be formed, for example, by gravure printing an acrylic resin solution or the like. By forming the protective layer 180, even if the second conductive layer 130 comes into contact with the contents during transportation of the packaging container 1, it is possible to suppress damage to the second conductive layer or adhesion of the second conductive layer 130 to the contents.

[0044] As shown in Fig. 6, the packaging container laminate 10 further includes a first conductive layer 120, a second conductive layer 130, and an RFIC element 140 as a layer configuration of a portion where an IC tag 150 is provided. The first conductive layer 120 and the second conductive layer 130 are provided on the smoothing layer 170 in a form in which they are electrically isolated from each other. The RFIC element 140 is provided so as to be directly or capacitively coupled to the first conductive layer 120 and the second conductive layer 130. The protective layer 180 is formed so as to cover the smoothing layer 170, the first conductive layer 120, and the second conductive layer 130, but is not formed in the region where the RFIC element 140 is provided.

[0045] The layer structure of the packaging container laminate 10 including the smoothing layer 170 is not limited to this. For example, as in another layer structure shown in FIG. 7, the protective layer 180 may be formed so as to cover the entire first conductive layer 120 and the second conductive layer 130. In the layer structure shown in FIG. 7, the RFIC element 140 is provided so as to be capacitively coupled to the first conductive layer 120 and the second conductive layer 130. In this way, if the RFIC element 140 and the conductive layer can be capacitively coupled, the protective layer 180 may be formed so as to cover the entire conductive layer. In this way, the protective layer 180 only needs to be formed on the surface side of the conductive layer, and may be formed in the area where the RFIC element 140 is provided as shown in FIG. 7, or may not be formed in the area where the RFIC element 140 is provided as shown in FIG. 6.

[0046] Next, experimental results showing the relationship between the surface roughness of the smoothing layer 170 and the surface resistance value will be described. FIG. 8 is a first graph showing the correlation between the surface roughness and the surface resistance value in an embodiment. FIG. 9 is a second graph showing the correlation between the surface roughness and the surface resistance value in an embodiment. FIG. 9 is a graph in which the scale interval of the surface resistance value shown in FIG. 8 is widened to a range of 0 to 20 (Ω / sq.). That is, FIG. 9 is a partially enlarged view of FIG. 8. Surface roughness Sa (μm) is a parameter obtained by expanding the linear roughness Ra, which is the two-dimensional roughness of an object, into three dimensions, and is obtained by integrating the absolute value of the difference in height from the drift-corrected average surface in the area A of the reference region within a plane and dividing it by the area A to standardize it. The surface resistance value (Ω / sq.) is the surface resistance value per unit area (1 cm2) of the object. 2 ) is the surface resistivity per unit area.

[0047] Each sample of the embodiment was prepared by the following procedure. First, a resin solution diluted with a solvent was applied to the second surface (back surface) of each of eight mounts of different paper quality to form a smoothing layer. Conductive ink diluted to an appropriate viscosity with an organic solvent was gravure printed on each mount using Kurabo's tabletop color developer GP-2 to form strip patterns of 100 mm in length and 5, 6, 7, 8, 9, 10, 12, and 15 mm in width, to prepare a test piece (sample) that serves as a reference for calculating the sheet resistance. Note that test pieces with the same characteristics can be formed even if gravure printing is performed under the same conditions using Kurabo's tabletop color developer GP-10 instead of Kurabo's tabletop color developer GP-2. Next, the resistance value (Ω) of each sample was measured using a Fluke Handy Tester 233Si. The relationship between the resistance value at each width and the pattern width was fitted to an approximate curve, and the resistance value at a length of 100 mm and a width of 10 mm was calculated for each sample. The relationship between width and length was then converted to a sheet resistance value (Ω / sq.).

[0048] The surface roughness Sa (μm) of the planarized layer of each sample was measured using a Keyence VX-100 series laser microscope. Here, a Nikon OFN25WDBI with 20x magnification was used as the objective lens, and measurements were taken with a field of view of 1024 x 768 and 0.75 μm pitch. Noise processing was performed using a Gaussian filter, a low-pass filter (LPF, S-filter) of 2 μm, and a high-pass filter (HPF, L-filter) of 0.8 mm. For the samples prepared, the minimum surface roughness Sa was 0.7 μm and the maximum was 5.9 μm. The relationship between the surface roughness Sa (μm) and the surface resistance (Ω / sq.) is shown in Figures 8 and 9.

[0049] As shown in FIG. 8, there is a correlation between the surface roughness Sa of the sample (flattened layer) and the surface resistance value, and the smaller the surface roughness Sa, the smaller the surface resistance value. In order to maintain good communication performance of the IC tag 150, it is desirable to set the surface resistance value of the conductive layer to 3 Ω / sq. or less. When a sample with a surface resistance value of the conductive layer of 3 Ω / sq. or less was examined in detail, it was confirmed that the surface resistance value of the conductive layer was 3 Ω / sq. or less in a sample with a surface roughness Sa of the smoothing layer of 2 μm or less, as shown in FIG. 9. From the above results, it was revealed that even if the roughness of the second surface (rear surface) of a substrate is large, the surface resistance value of the conductive layer formed on the second surface can be reduced to 3 Ω / sq. or less by forming a smoothing layer with a surface roughness Sa of 2 μm or less on the second surface.

[0050] On the other hand, as shown in Fig. 9, when the surface roughness Sa of the smoothing layer becomes smaller (smoothness increases), a saturated state is reached where even if the surface roughness Sa is further reduced, the sheet resistance value of the conductive layer changes very little. In the experimental results shown in Fig. 9, the value that is considered to be the lower limit of the surface roughness Sa of the smoothing layer is 0.5 µm. Therefore, it is considered that the desirable range of the surface roughness Sa of the smoothing layer to keep the sheet resistance value of the conductive layer at 3 Ω / sq. or less is a lower limit of 0.5 µm and an upper limit of 2 µm.

[0051] According to the packaging container laminate 10, the packaging container 1, and the RFIC device-equipped packaging container 1A containing a bottle of the first embodiment described above, for example, the following effects are obtained. The packaging container laminate 10 has a smoothing layer 170 between at least the region of the second surface 100b of the substrate 100 where the conductive layer is provided and the conductive layer. According to this configuration, the sheet resistance value of the conductive layer (antenna pattern) formed on the second surface 100b of the substrate 100 can be reduced, so that the decrease in sensitivity can be suppressed. Generally, as the material of the substrate 100, a backing paper with a large roughness on the back surface (second surface) is often used for the cost. When a conductive layer is formed on the second surface of such a backing paper, the resistance value of the conductive layer increases, and a decrease in sensitivity is unavoidable. However, in the packaging container laminate 10 of this embodiment, even if the substrate 100 has a large roughness on the second surface 100b, the decrease in sensitivity can be suppressed by forming the smoothing layer 170 on the second surface 100b. In particular, the decrease in sensitivity can be more effectively suppressed by setting the surface roughness Sa of the smoothing layer 170 to 0.5 μm or more and 2 μm or less. Moreover, by forming the protective layer 180 on the surface of the conductive layer, it is possible to suppress damage to the conductive layer due to contact with the contents of a bottle, etc. Furthermore, if the protective layer 180 is not formed in the region where the RFIC element 140 is provided as shown in Fig. 6, it is possible to improve the sensitivity compared to the configuration in which the protective layer 180 is formed in the region where the RFIC element 140 is provided as shown in Fig. 7.

[0052] In the packaging container laminate 10, the first conductive layer 120 is disposed in the glued area 106a of the left side surface portion 106 (side surface portion). The second conductive layer 130 is disposed near the top cover portion 103 (cover portion) on the left side surface portion 106 and the back surface portion 102 (side surface portion), and a part of the second conductive layer 130 is disposed in the glued area 106a of the left side surface portion 106. According to this configuration, the length of the first conductive layer 120 is ensured, and the length of the entire conductive layer including the first conductive layer 120 and the second conductive layer 130 until it crosses the bent portion (fold line) can be made longer, so that the influence of the increase in resistance value caused by the conductive layer crossing the bent portion can be suppressed. In addition, since the first conductive layer 120 and the second conductive layer 130 are disposed in different areas while being close to each other, the bias in the directivity of the conductive layer (antenna pattern) can be improved. Therefore, according to the first embodiment of the packaging container laminate 10, packaging container 1, and packaging container 1A with RFIC element containing a bottle, it is possible to widen the reading range of the reader / writer while suppressing the decrease in sensitivity due to an increase in resistance value after assembly.

[0053] In addition, the packaging container laminate 10, the packaging container 1, and the RFIC device-equipped packaging container 1A containing a bottle according to the first embodiment have the following common effects, for example. Since the first conductive layer 120 is disposed in the intended glue region 106a of the left side surface portion 106, the first conductive layer 120 can be made less noticeable when used for packaging after assembly. Since the RFIC element 140 is provided so as to be directly or capacitively coupled to the first conductive layer 120 and the second conductive layer 130 in the intended glue region 106a, the RFIC element 140 can be made less noticeable when used for packaging after assembly, and falling off of the RFIC element 140 can be suppressed.

[0054] The extending direction of the first conductive layer 120 and the extending direction of the second conductive layer 130 intersect with each other. With this configuration, the directivity of the conductive layer can be made close to omnidirectional, so that the reading range of the reader / writer can be further widened. By configuring the first conductive layer 120 and the second conductive layer 130 not to cross the bent portion, the influence of the resistance value increase caused by the conductive layer crossing the bent portion can be suppressed compared to a configuration in which either one or both of the first conductive layer 120 and the second conductive layer 130 cross the bent portion. Note that, when the first conductive layer 120 and the second conductive layer 130 are formed in the adhesive margin portion 107 on the first surface 100a facing outward by assembly in order to prevent the RFIC element 140 from falling off, it is difficult to increase the length until the electrode layer crosses the bent portion (fold line), so that the influence of the resistance value increase is strong. However, by configuring the first conductive layer 120 and the second conductive layer 130 to be arranged in the glued region 106a of the left side surface portion 106 and not to cross the bent portion, the influence of the resistance value increase is suppressed, and the deterioration of communication performance can be avoided.

[0055] In the packaging container 1A housing a resin bottle 60 filled with an aqueous solution, the first conductive layer 120 is configured to extend 30 mm or more from the surface of the aqueous solution to the lower side Z2, thereby making it difficult for the aqueous solution to affect the reflection or absorption of radio waves. Therefore, by configuring the length of the first conductive layer 120 to extend 30 mm or more from the surface of the aqueous solution to the lower side Z2, good communication performance can be ensured.

[0056] In a packaging container 1A containing a metal bottle 70, by extending the first conductive layer 120 from the upper end of the metal part of the bottle 70 downward Z2 by 30 mm or more, it is possible to reduce the influence of radio waves being reflected or absorbed by the metal. Therefore, by extending the length of the first conductive layer 120 from the upper end of the metal part downward Z2 by 30 mm or more, good communication performance can be ensured. Note that the "liquid level" refers to the liquid level when the packaging container is displayed, but in containers with lids made of resin, metal, glass, etc., they are usually displayed with the lid facing the top (upper side) in the vertical direction.

[0057] Second embodiment Fig. 10 is a perspective view showing a packaging container 2 with an RFIC element according to a second embodiment. Fig. 11 is a perspective view showing a packaging container 2A with an RFIC element that stores a bottle according to the second embodiment. Fig. 12 is a development view of a laminate 20 for a packaging container with an RFIC element according to the second embodiment. A packaging container 2 with an RFIC element (hereinafter also referred to as "packaging container 2") of the second embodiment is configured similarly to the packaging container 1 of the first embodiment, except that the lengths of each side are different. Therefore, in the following description and drawings, parts that perform the same functions as in the first embodiment are given the same reference numerals, and duplicated descriptions are appropriately omitted.

[0058] As shown in FIG. 10, the packaging container 2 of the second embodiment has a low, approximately rectangular parallelepiped shape. By storing a bottle 80 having a shape as shown in FIG. 11 in this packaging container 2 and closing the top lid portion 103, a packaging container 2A with an RFIC element containing the bottle is obtained. As shown in FIG. 12, in the second embodiment, the length L1 in the direction in which the first conductive layer 120 extends is shorter than the length L2 in the direction in which the second conductive layer 130 extends. Therefore, the right end portion of the second conductive layer 130 is formed to the vicinity of the fold line a7 between the back surface portion 102 and the right side surface portion 105, crossing the fold line a11. In the second embodiment, the total length L0 of the length L1 of the first conductive layer 120 and the length L2 of the second conductive layer 130 is preferably 100 mm or more and 200 mm or less.

[0059] Third embodiment Fig. 13 is a perspective view showing a packaging container 3 with an RFIC element according to a third embodiment. Fig. 14 is a perspective view showing a packaging container 3A with an RFIC element that stores a bottle according to the third embodiment. Fig. 15 is a development view of a laminate 30 for a packaging container with an RFIC element according to the third embodiment. The packaging container 3 with an RFIC element of the third embodiment (hereinafter also referred to as "packaging container 3") is configured similarly to the packaging container 1 of the first embodiment, except for the shape of the second conductive layer 130. Therefore, in the following description and drawings, parts that perform the same functions as in the first embodiment are given the same reference numerals, and duplicated descriptions are appropriately omitted.

[0060] As shown in FIG. 13, the packaging container 3 of the third embodiment has a vertically elongated, approximately rectangular parallelepiped shape (box shape) like the first embodiment. By storing a vertically elongated bottle 60 as shown in FIG. 14 in this packaging container 3 and closing the top lid portion 103, a packaging container 3A with an RFIC element containing the bottle is obtained. As shown in FIG. 15, the second conductive layer 130 of the third embodiment extends in a strip-like shape in the left-right direction X and protrudes to the lower side Z2 at the end of the left side X2 to be formed into a generally approximately L-shape. In the second conductive layer 130, the portion protruding to the lower side Z2 from the end of the left side X2 is formed so as to be adjacent to the upper side Z1 of the first conductive layer 120. In the third embodiment, the entire length of the second conductive layer 130 is the sum of the length of the portion extending in a strip-like shape in the left-right direction X and the length of the portion protruding to the lower side Z2. In the third embodiment, the lower limit of the length (total length) L0 of the conductive layer is preferably 100 mm or more, more preferably 120 mm or more. The upper limit of the length L0 of the conductive layer is preferably 200 mm or less, and more preferably 180 mm or less. In the case where the second conductive layer 130 has a portion extending in two or more directions, if at least one of the extending portions intersects (is perpendicular to) the extending direction of the first conductive layer 120, the extending direction of the first conductive layer 120 and the extending direction of the second conductive layer 130 are in a mutually intersecting relationship. In the third embodiment, the portion of the second conductive layer 130 extending in the left-right direction X intersects (is perpendicular to) the extending direction of the first conductive layer 120 (the up-down direction Z), so that the extending direction of the first conductive layer 120 and the extending direction of the second conductive layer 130 are in a mutually intersecting relationship.

[0061] The second conductive layer 130, including the portion protruding from the end of the left side X2 to the lower side Z2, is disposed on the upper side Z1 of the liquid surface of the aqueous solution filled in the bottle 60. A part of the second conductive layer 130 is disposed in the region 106a to be glued (the region where the glue tab 107 is overlapped). The RFIC element 140 is provided so as to be directly or capacitively coupled to the first conductive layer 120 and the second conductive layer 130 in the region 106a to be glued (the region where the glue tab 107 is overlapped) of the left side surface portion 106 (side surface portion). The shape of the second conductive layer 130 in the third embodiment can also be applied to the second conductive layer 130 in the second embodiment (see FIG. 12).

[0062] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-mentioned embodiments, and various modifications and changes are possible, such as the modified forms described below, which are also included in the technical scope of the present disclosure. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present disclosure, and are not limited to those described in the embodiments. Note that the above-mentioned embodiments and the modified forms described below can be used in appropriate combination, but detailed description will be omitted.

[0063] Fig. 16 is a diagram for explaining another configuration example of the IC tag 150. When the RFIC element 140 includes an impedance matching circuit, the antenna pattern consisting of the first conductive layer 120 and the second conductive layer 130 can efficiently receive radio waves transmitted from a reader / writer (not shown). On the other hand, when the RFIC element 140 does not include an impedance matching circuit, as shown in Fig. 16, by providing a third conductive layer 155 between the first conductive layer 120 and the second conductive layer 130, it becomes possible to more efficiently receive radio waves transmitted from the reader / writer. The configuration of the second conductive layer 130 in this embodiment can also be applied to the first to third embodiments described above.

[0064] In each embodiment, the example of the packaging container being a box-shaped, approximately rectangular parallelepiped shape has been described, but is not limited thereto. The shape of the packaging container may be, for example, a prismatic (box-shaped) packaging container with a base of another polygon, such as a triangular prism shape or a pentagonal prism shape, or may be a cylindrical (box-shaped) packaging container with a cylindrical (elliptical) shape or other columnar (box-shaped) shape. The shape of the packaging container is not limited to the above, and may be a box shape such as a rectangular rod shape or a cone shape, or may be a shape with a corner part at the base of an approximately D-shaped or O-shaped base. That is, the shape of the packaging container may be any shape as long as it can be formed by assembling sheet-like base materials. [Explanation of symbols]

[0065] 1, 2, 3 Packaging container with RFIC element Packaging container with RFIC element containing 1A, 2A, and 3A bottles 10, 20, 30 Laminate for packaging container with RFIC element 60, 70, 80 bottles 100 Base material 100a Page 1 100b 2nd side 103 Top cover 107 Glue section 120 First conductive layer 130 Second conductive layer 140 RFIC elements 150 IC tags 170 Smoothing layer 180 protective layer

Claims

1. A base material having a first surface facing outward when assembled and a second surface facing inward when assembled, the base material being a box-shaped packaging container when assembled; a conductive layer including a first conductive layer and a second conductive layer provided on the second surface side of the base material; a smoothing layer provided between at least the region of the second surface of the base material where the conductive layer is provided and the conductive layer; An RFIC element provided on the second surface side of the base material; Equipped with The RFIC element is arranged so as to be directly or capacitively coupled to the first conductive layer and the second conductive layer, in a laminate for a packaging container with an RFIC element.

2. 2. The laminate for a packaging container with an RFIC element according to claim 1, wherein the smoothing layer has a surface roughness Sa of 0.5 μm or more and 2 μm or less.

3. The laminate for a packaging container with an RFIC element according to claim 1 or 2, further comprising a protective layer on a surface side of the conductive layer.

4. The laminate for a packaging container with an RFIC element according to claim 3 , wherein the protective layer is not formed in an area where the RFIC element is provided.

5. A packaging container with an RFIC element, comprising the laminate for a packaging container with an RFIC element according to any one of claims 1 to 4 assembled into a box shape.

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