Semiconductor module and semiconductor device

Abstract

To reduce size in a semiconductor device while suppressing increase in manufacturing cost.SOLUTION: A semiconductor device has: a semiconductor package (2) in which terminal contact parts (251 to 253) electrically connected to semiconductor elements (211, 212) appear from a module resin (240) sealing the semiconductor elements (211, 212); a case (4) having a first insertion part (404) to which external terminals are inserted, and including a spring plate (421); and the external terminals (411 to 413). When the external terminals (411 to 413) are inserted into the first insertion part (404) of the case (4), pressing force of the spring plate (421) is added to the external terminals (411 to 413), and the external terminals (411 to 413) and the terminal contact parts (251 to 253) are mechanically connected to each other.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a semiconductor module and a semiconductor device. [Background technology]

[0002] Some semiconductor devices have terminals on a case that houses a wiring board on which a semiconductor element is mounted, and a conductor pattern on the wiring board or a connecting conductor on the conductor pattern are joined by ultrasonic bonding or laser welding (for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2022 / 049660 [Patent Document 2] International Publication No. 2009 / 081723 Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned bonding methods such as ultrasonic bonding and laser welding increase the size of the semiconductor device, resulting in increased manufacturing costs.

[0005] The present invention has been made in view of the above-mentioned points, and has as its object to reduce the size of a semiconductor device while suppressing an increase in manufacturing costs. [Means for solving the problem]

[0006] According to one aspect of the present invention, there is provided a semiconductor module comprising: a semiconductor element; a conductor pattern having a terminal contact portion electrically connected to the semiconductor element; a sealing body that seals the semiconductor element and has the terminal contact portion exposed from an upper surface; a case having an accommodating portion for accommodating the sealing body; and an elastic member that applies a pressing force from a surface opposite to a surface that contacts the terminal contact portion of the inserted external terminal when an external terminal is inserted, wherein the case is provided with a first insertion portion into which the external terminal is inserted.

[0007] Moreover, according to one aspect of the present invention, there is provided a semiconductor device comprising: a semiconductor element; a conductor pattern having a terminal contact portion electrically connected to the semiconductor element; a sealing body that seals the semiconductor element and has the terminal contact portion exposed from an upper surface; a case having an accommodating portion for accommodating the sealing body; an elastic member that applies a pressing force from a surface opposite to a surface that contacts the terminal contact portion of the inserted external terminal when an external terminal is inserted; and the external terminal that is sandwiched between the elastic member and the terminal contact portion and electrically connected to the terminal contact portion, wherein the case is provided with a first insertion portion into which the external terminal is inserted. Effect of the Invention

[0008] According to the present invention, it is possible to reduce the size of a semiconductor device while suppressing an increase in manufacturing costs. [Brief description of the drawings]

[0009] [Figure 1] 1 is a plan view of a semiconductor device according to a first embodiment. [Diagram 2] 1 is a side view (part 1) of a semiconductor device according to a first embodiment; [Diagram 3] FIG. 2 is a side view (part 2) of the semiconductor device according to the first embodiment; [Figure 4] 1 is a plan view showing an internal configuration of a semiconductor package included in the semiconductor device of the first embodiment. [Diagram 5] 2 is a cross-sectional view showing an internal configuration of a semiconductor package included in the semiconductor device of the first embodiment. FIG. [Figure 6] 1 is a cross-sectional view of a semiconductor device according to a first embodiment. [Figure 7] 2 is a diagram showing external terminals included in the semiconductor device of the first embodiment; FIG. [Figure 8] 3A to 3C are diagrams illustrating the state of an external terminal, a spring plate, and a terminal contact portion included in the semiconductor device of the first embodiment. [Figure 9] 4 is a cross-sectional view of a main part illustrating a state in which a tool is inserted into the semiconductor device of the first embodiment; FIG. [Figure 10] 1 is a cross-sectional view of a main part showing a first modified example of the semiconductor device according to the first embodiment. [Figure 11] FIG. 11 is a cross-sectional view of a main part of a semiconductor device according to a second embodiment. [Figure 12] 13 is a cross-sectional view of a main part showing a first modified example of the semiconductor device according to the second embodiment. FIG. [Figure 13] FIG. 13 is a side view of a main part of a first modified example of the semiconductor device according to the second embodiment. [Figure 14] 13 is a cross-sectional view of a main part showing a second modified example of the semiconductor device according to the second embodiment. FIG. [Figure 15] 13 is a cross-sectional view of a main part showing a third modified example of the semiconductor device according to the second embodiment. FIG. [Figure 16] FIG. 11 is a cross-sectional view of a main part showing a fourth modified example of the semiconductor device according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiment of the present invention will be described in detail with reference to the drawings. Note that the X, Y, and Z axes in each of the drawings are shown for the purpose of defining the planes and directions in the semiconductor device and the like to be exemplified, and the X, Y, and Z axes are orthogonal to each other and form a right-handed system. In the following description, the Z direction may be referred to as the up-down direction. In addition, a plane including the X and Y axes may be referred to as the XY plane, a plane including the Y and Z axes may be referred to as the YZ plane, and a plane including the Z and X axes may be referred to as the ZX plane. These directions and planes are terms used for convenience of explanation, and the corresponding relationship with each of the X, Y, and Z directions may change depending on the mounting posture of the semiconductor device. For example, in this specification, the cooler side of the semiconductor device is referred to as the bottom, and the opposite side is referred to as the top, but the cooler side may be referred to as the top, and the opposite side may be referred to as the bottom. In addition, in this specification, a plan view means a case where the top or bottom surface (XY plane) of the semiconductor device or the like is viewed from the Z direction. In addition, the aspect ratios and the size relationships between the components in each drawing are merely schematic and do not necessarily correspond to the relationships in an actually manufactured semiconductor device, etc. For the sake of convenience of explanation, it is assumed that the size relationships between the components may be exaggerated.

[0011] <First embodiment> The internal configuration of the semiconductor device 1 and the semiconductor package 2 according to the first embodiment will be described with reference to Figs. 1 to 5. Fig. 1 is a plan view of the semiconductor device 1 according to the first embodiment. Fig. 2 is a side view of the semiconductor device 1 of Fig. 1 as viewed in the +Y direction. Fig. 3 is a side view of the semiconductor device 1 of Fig. 1 as viewed in the -Y direction. Fig. 4 is a plan view showing the internal configuration of the semiconductor package 2 included in the semiconductor device 1 according to the first embodiment. Fig. 5 is a cross-sectional view of the semiconductor package 2 of Fig. 4 taken along dashed dotted line B-B' as viewed from the Y direction.

[0012] 1, the semiconductor device 1 includes three semiconductor packages 2, a cooler 3, a case 4, a control circuit (not shown), and external terminals 411-413. The semiconductor packages 2 include a wiring board 200, semiconductor elements 211 and 212, leads 221-224, bonding wires 231 and 232, and a sealing body 240, which will be described later. Each semiconductor package 2 has the same configuration. The details of the semiconductor packages 2 will be described later.

[0013] The cooler 3 dissipates heat from the semiconductor package 2 to the outside, and has, for example, a rectangular parallelepiped shape. Although not shown, the cooler 3 is configured by providing a plurality of fins on the lower surface side of a flat base, and these fins are housed in a water jacket. Note that the shape and configuration of the cooler 3 are not limited to this and can be appropriately changed. Also, the semiconductor package 2 may be placed on the upper surface of a member (for example, a base plate) separate from the cooler 3, and the lower surface of the separate member may be connected to the cooler 3.

[0014] The case 4 has a substantially rectangular shape in a plan view, and is a member that covers the semiconductor package 2 arranged on the cooler 3. The case 4 is surrounded by a top surface 4a and side surfaces 4b, 4c, 4d, and 4e. The side surfaces 4b and 4d correspond to the long sides of the case 4, and the side surfaces 4c and 4e correspond to the short sides of the case 4. In a plan view, the corners of the connection points of the side surfaces 4b, 4c, 4d, and 4e do not have to be substantially right angles, and may be, for example, rounded.

[0015] The top surface 4a of the case 4 has through holes 403 through which the leads 223, 224 pass, and fixing holes 406 for fixing the case 4 and the cooler 3 at the corners of the top surface 4a. The fixing holes 406 are through holes that extend from the top surface 4a toward the cooler 3, and screws (not shown) for fixing are inserted into the fixing holes 406. The fixing holes 406 may be formed closer to the cooler 3 (in the -Z direction) than the top surface 4a. The shape and number of the through holes 403 can be appropriately changed in accordance with the leads 223, 224.

[0016] As shown in FIG. 2, the side surface 4d of the case 4 is formed with first insertion parts 404a and 404b into which the external terminals 411 and 412 are inserted, and second insertion parts 405a and 405b into which the tool 5 described later is inserted. Also, as shown in FIG. 3, the side surface 4b is formed with a first insertion part 404c into which the external terminal 413 is inserted, and a second insertion part 405c into which the tool 5 is inserted. In the following description, when it is not necessary to distinguish between the first insertion parts 404a, 404b, and 404c, it is referred to as the first insertion part 404, and when it is not necessary to distinguish between the second insertion parts 405a, 405b, and 405c, it is referred to as the second insertion part 405. Also, the sealing body 240 of the semiconductor module 2 is exposed on the side surfaces 4b and 4d, but this is not limited thereto, and the side surfaces 4b and 4d may be formed to cover the sealing body 240.

[0017] The first insertion portion 404 has a recessed shape that is open toward the cooler 3 in a side view seen from the Y direction. As shown in FIG. 2, the first insertion portions 404a and 404b are formed along the side surface 4d (X direction). As shown in FIG. 3, the first insertion portion 404c is formed along the side surface 4b (X direction). The width (X direction) and height (Z direction) of the first insertion portion may be large enough to allow the external terminals 411, 412, and 413 to be inserted therein. The shape of the first insertion portion 404 can be appropriately changed in accordance with the shapes of the external terminals 411, 412, and 413.

[0018] The second insertion portion 405 has a rectangular shape in a side view seen from the Y direction. The second insertion portions 405a and 405b are formed along the side surface 4d. The second insertion portion 405c is formed along the side surface 4b (X direction). The second insertion portion 405 is arranged side by side with the first insertion portion 404 on the upper surface 4a side (+Z direction side) of the case 4 from the first insertion portion 404. That is, the first insertion portion 404 is provided on the terminal contact portions 251 to 253 side described later from the second insertion portion 405. The dimensions and shape of the second insertion portion 405 can be appropriately changed in accordance with the tool 5 described later.

[0019] Here, a description will be given of the semiconductor package 2. The semiconductor package 2 includes a wiring board 200, semiconductor elements 211 and 212, leads 221 to 224, bonding wires 231 and 232, and a sealing body 240, as shown in FIG.

[0020] 4, wiring board 200 includes insulating substrate 201, conductor patterns 202-204 provided on an upper surface of insulating substrate 201, and conductor pattern 205 provided on a lower surface of insulating substrate 201. Wiring board 200 may be, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazing) substrate. Wiring board 200 may also be called, for example, a laminated substrate, an insulating circuit board, or the like.

[0021] Insulating substrate 201 has a rectangular shape in a plan view. Insulating substrate 201 may have corners that are rounded or C-chamfered. Insulating substrate 201 may be a ceramic substrate made of ceramic materials such as aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), aluminum oxide (Al2O3) and zirconium oxide (ZrO2). Insulating substrate 201 may be a substrate made of insulating resin such as epoxy resin, a substrate made of a base material such as glass fiber impregnated with insulating resin, a substrate made of a flat metal core with its surface coated with insulating resin, or the like.

[0022] The conductor patterns 202-205 are formed of, for example, a metal plate or metal foil such as copper or aluminum. The conductor patterns 202-205 may be called a conductor layer, a conductor plate, a conductive layer, or a wiring pattern. In the following description, when the conductor patterns 202-205 are to be distinguished from one another, they will be referred to as a first conductor pattern 202, a second conductor pattern 203, a third conductor pattern 204, and a fourth conductor pattern 205, respectively.

[0023] A semiconductor element 211 is disposed on the upper surface of the first conductive pattern 202. A semiconductor element 212 is disposed on the upper surface of the second conductive pattern 203. As shown in FIG. 5, the first conductive pattern 202 is bonded to a first main electrode (not shown) provided on the lower surface of the semiconductor element 211 by a bonding material 260. The second conductive pattern 203 is bonded to a first main electrode (not shown) provided on the lower surface of the semiconductor element 212 by a bonding material 260. The bonding material 260 may be a solder or a sintered material. The solder may be a lead-free solder. The lead-free solder is mainly composed of an alloy containing at least two of tin (Sn), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), indium (In), and bismuth (Bi). Furthermore, the solder may contain an additive. The additive is, for example, nickel (Ni), germanium (Ge), cobalt (Co) or silicon (Si). The solder containing the additive has improved wettability, gloss and bonding strength, and can improve reliability. The sintering material is, for example, a metal material including silver, copper or an alloy containing at least one of these.

[0024] Each of the semiconductor elements 211 and 212 is, for example, a switching element such as an IGBT (Insulated Gate Bipolar Transistor) element or a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or a diode element such as an FWD (Free Wheeling Diode). Also, it may be configured as an RC (Reverse Conducting)-IGBT element that integrates the function of a switching element such as an IGBT element and the function of a diode element such as an FWD element. Each of these types of semiconductor elements 211 and 212 has a first main electrode on the lower surface and a second main electrode and a control electrode (gate electrode) on the upper surface. Each of the above elements may be formed on a silicon (Si) substrate. Also, a wide band gap semiconductor formed on a substrate using silicon carbide (SiC) or the like may be used.

[0025] 5, the lead 221 is a wiring member formed by bending a conductive plate such as a copper plate, and is joined to the surface electrode 211a on the upper surface of the semiconductor element 211 and the second conductive pattern 203 by a bonding material 260. That is, the surface electrode 211a of the semiconductor element 211 is electrically connected to the second conductive pattern 203 via the lead 221. The first conductive pattern 202 has a terminal contact portion 251 electrically connected to an external terminal 411.

[0026] The lead 222 is a wiring member formed by bending a conductive plate such as a copper plate, and is joined to the surface electrode 212a on the upper surface of the semiconductor element 212 and the third conductive pattern 204 by a bonding material 260. In other words, the surface electrode 212a of the semiconductor element 212 is electrically connected to the third conductive pattern 204 via the lead 222. The second conductive pattern 203 has a terminal contact portion 253 electrically connected to an external terminal 413.

[0027] The third conductor pattern 204 has a terminal contact portion 252 electrically connected to an external terminal 412. Note that the first conductor pattern 202, the second conductor pattern 203, and the third conductor pattern 204 are merely examples. The numbers, shapes, sizes, and positions of the first conductor pattern 202, the second conductor pattern 203, and the third conductor pattern 204 may be appropriately selected as necessary.

[0028] In FIG. 4, the control electrode 211b provided on the upper surface of the semiconductor element 211 is electrically connected to the lead 223 by a bonding wire 231. The control electrode 212b provided on the upper surface of the semiconductor element 212 is electrically connected to the lead 224 by a bonding wire 232. The leads 223 and 224 are bent, for example, into an L shape, one end of which is joined to the insulating substrate 201, and the other end of which protrudes from an upper surface 240a (described later) of the sealing body 240 and extends upward. The leads 223 and 224 are wiring members formed using a conductive plate such as a copper plate. The other end of the leads 223 and 224 protruding from the upper surface 240a of the sealing body 240 and extending upward passes through a through hole 403 provided in the case 4, and is connected to a control circuit (not shown) arranged on the case 4. The number of leads 223 and leads 224 need only correspond to the control electrodes 211b and 212b of the semiconductor elements 211 and 212, and is not limited to five.

[0029] Conductive patterns 202-204 of wiring board 200, semiconductor elements 211 and 212, leads 221 and 222 as a whole, and parts of leads 223 and 224 are encapsulated by encapsulant 240. Semiconductor package 2 of the first embodiment is manufactured by, for example, transfer molding.

[0030] Next, the fixing of the external terminal and the terminal contact portion will be described with reference to Figs. 6 to 9. Fig. 6 is a cross-sectional view of the semiconductor device 1 in Fig. 1 taken along dashed line A-A' as viewed from the -X direction. Fig. 7 is a diagram showing the configuration of an external terminal included in the semiconductor device 1. Fig. 8 is a diagram explaining the state of the external terminal, the spring plate, and the terminal contact portion included in the semiconductor device 1. Fig. 9 is a cross-sectional view of a main part explaining the state in which a tool 5 is inserted into the semiconductor device 1.

[0031] 6 shows a cross-sectional view of the semiconductor device 1 of FIG. 1 taken along dashed line A-A' as viewed from the -X direction. The terminal contact portion 252 of the semiconductor package 2 is columnar extending from the surface of the third conductor pattern 204 toward the case 4 (+Z direction), and has a surface 252a that contacts the back surface 412b of the external terminal 412 and a protrusion 252b that enters the groove 412d of the external terminal 412. The protrusion 252b extends from the surface 252a toward the upper surface 4a of the case 4. The protrusion 252b may be columnar, for example.

[0032] The sealing body 240 has an upper surface 240a and a step portion 240b in which the end of the upper surface 240a on the side of the side surfaces 4b and 4d of the case 4 is recessed toward the cooler 3. The terminal contact portion 252 is exposed from the upper surface of the step portion 240b to the case 4 side (+Z direction). If the upper surface of the terminal contact portion 252 is exposed from the upper surface 240a of the sealing body 240, the step portion 240b does not need to be provided. The terminal contact portions 251 (not shown) and 253 have the same configuration as the terminal contact portion 252. If the terminal contact portions 251 to 253 are exposed from the upper surface 240a or the step portion 240b of the sealing body 240, there is no particular limitation on their height (Z direction).

[0033] The case 4 has a spring plate accommodating section 401 that accommodates the spring plate 421 and an accommodating section 402 that accommodates the semiconductor package 2. As shown in FIG. 1, the spring plate accommodating section 401 has a rectangular shape in a plan view. The accommodating section 402 has a rectangular shape in a plan view. The spring plate accommodating section 401 is arranged on the side surface 4b and the side surface 4d in the Y direction alongside the first insertion section 404. The accommodating section 402 is arranged in an area sandwiched between the spring plate accommodating section 401 provided on the side surface 4b and the spring plate accommodating section 401 provided on the side surface 4d. As shown in FIG. 6, the spring plate accommodating section 401 and the accommodating section 402 of the case 4 define a concave space that is open on the cooler 3 side (-Z direction). The spring plate accommodating section 401 is provided at a position (+Z direction) facing the terminal contact section 252. That is, the spring plate accommodating portion 401 is provided on the side opposite to the step portion 240b of the sealing body 240 on which the cooler 3 is located. The accommodating portion 402 accommodates the upper surface 240a of the sealing body 240. Each spring plate accommodating portion 401 has the same structure. The spring plate accommodating portion 401 is provided continuous with the first insertion portion 404 and the second insertion portion 405. That is, the first insertion portion 404 and the second insertion portion 405 penetrate from the side surface 4b or 4d of the case 4 toward the spring plate accommodating portion 401 and the spring plate 421.

[0034] A spring plate 421 is accommodated in the spring plate accommodating portion 401 of the case 4. The spring plate 421 is disposed in a position (+Z direction) facing the terminal contact portion 252. The spring plate 421 has a contact portion 421a at an end thereof, which contacts a front surface 412a of the external terminal 412 when the external terminal 412 is inserted into the first insertion portion 404 of the case 4. The spring plate 421 applies a pressing force to pressurize the external terminal 412 into contact with the terminal contact portion 252 as described later, and is desirably formed of an elastic member capable of continuously applying the pressing force. The spring plate 421 may be made of, for example, a metal such as copper or aluminum as an elastic member. The spring plate 421 may also be made of rubber or the like as long as a stable pressing force can be maintained.

[0035] The external terminal 411 is, for example, an input terminal (N terminal). An inner end of the external terminal 411 is inserted into the first insertion portion 404a of the case 4 and is electrically connected to the terminal contact portion 251 of the first conductor pattern 202. An outer end of the external terminal 411 is exposed to the outside from the side surface 4d of the case 4.

[0036] The external terminal 412 is, for example, an input terminal (P terminal). An inner end of the external terminal 412 is inserted into the first insertion portion 404b of the case 4 and is electrically connected to the terminal contact portion 252 of the third conductor pattern 204. An outer end of the external terminal 412 is exposed to the outside from the side surface 4d of the case 4.

[0037] The external terminal 413 is, for example, an output terminal (any of a U-phase output terminal, a V-phase output terminal, and a W-phase output terminal). An inner end of the external terminal 413 is inserted into the first insertion portion 404c of the case 4 and is electrically connected to the terminal contact portion 253 of the second conductor pattern 203. An outer end of the external terminal 413 is exposed to the outside from the side surface 4b of the case 4.

[0038] The external terminals 411 and 412 are, for example, terminals provided on a capacitor (not shown). The external terminal 413 is, for example, a terminal provided on a load that operates on AC, such as an AC motor (not shown).

[0039] FIG. 7 is a diagram for explaining the configuration of an external terminal. FIG. 7 shows the configuration of an external terminal 412 as an example of an external terminal. FIG. 7(a) is a side view of the example of the external terminal, and FIG. 7(b) is a top view of the example of the external terminal. FIG. 7(c) is a side view of another example of the external terminal, and FIG. 7(d) is a top view of the other example of the external terminal. As shown in FIG. 7(a), the external terminal 412 has a front surface 412a on the spring plate 421 side (+Z side) and a back surface 412b on the terminal contact portion 252 side (-Z side) of the third conductor pattern 204. The front surface 412a has a fixing portion 412c recessed from the front surface 412a toward the back surface 412b. The back surface 412b has a groove portion 412d recessed from the back surface 412b toward the front surface 412a. As shown in FIG. 7(b), the fixing portion 412c and the groove portion 412d are rectangular in plan view, but are not particularly limited thereto. The width (X direction) of the fixing portion 412c and the groove portion 412d is equal to the width of the external terminal 412. The fixing portion 412c and the groove portion 412d are provided without overlapping in plan view. As shown in FIG. 7(c), the fixing portion 412c may be a convex portion having a plurality of protrusions. As shown in FIG. 7(d), the fixing portion 412c, which is a convex portion having a plurality of protrusions, is equal to the width of the external terminal 412. The fixing portion 412c and the groove portion 412d are provided without overlapping in plan view.

[0040] 8 is a diagram (exploded perspective view) showing the positional relationship of fitting between the external terminal 412, the spring plate 421, and the terminal contact portion 252 of the first conductor pattern 204. The front surface 252a of the terminal contact portion 252 contacts the rear surface 412b of the external terminal 412. The protrusion portion 252b of the terminal contact portion 252 enters the groove portion 412d of the external terminal 412. The contact portion 421a of the spring plate 421 contacts the fixed portion 412c of the external terminal 412. The width (X direction) of the terminal contact portion 252 is approximately equal to the width (X direction) of the external terminal 412. The width (X direction) of the protrusion portion 252b is approximately equal to the width (X direction) of the groove portion 412d of the external terminal 412. The height (Z direction) of the protrusion 252b is designed to be a height that allows the back surface 412b and the front surface 252a of the terminal contact portion 252 to come into contact with each other when the protrusion 252b enters the groove portion 412d of the external terminal 412. The width (X direction) of the spring plate 421 is approximately equal to the width (X direction) of the fixing portion 412c of the external terminal 412. A plurality of protrusions 252b of the terminal contact portion 252 and a plurality of grooves 412d of the external terminal 412 may be provided.

[0041] Although detailed explanation is omitted, the terminal contact portion 251 and external terminal 411 of the first conductor pattern 202 of the semiconductor package 2, the terminal contact portion 253 and external terminal 413 of the second conductor pattern 203 of the semiconductor package 2, the terminal contact portion 252 and external terminal 412 of the third conductor pattern 204 of the semiconductor package 2, and each spring plate 421 have the same configuration, arrangement, and dimensions.

[0042] 6 and 8, when the external terminals 411-413 are inserted into the first insertion portions 404a-404c of the case 4, the front surfaces 411a-413a of the external terminals 411-413 come into contact with the contact portions 421a of the spring plate 421, and the back surfaces 411b-413b come into contact with the surfaces 251a-253a of the terminal contact portions 251-253 of the conductor patterns 202-204. At this time, the spring plate 421 applies a pressing force to the front surfaces 411a-413a of the external terminals 411-413 toward the contact terminal portions 251-253. The pressing force applied by the spring plate 421 mechanically and electrically connects the external terminals 411-413 to the terminal contact portions 251-253. Therefore, semiconductor device 1 of the first embodiment can ensure electrical connection between external terminals 411-413 and conductor patterns 202-204 of wiring board 200 of semiconductor package 2 without performing laser welding, ultrasonic bonding, or the like. Also, contact portion 421a of spring plate 421 contacts fixed portions 411c-413c of external terminals 411-413. As a result, contact portion 421a of spring plate 421 is caught on fixed portions 411c-413c, thereby making it possible to strengthen the mechanical connection between external terminals 411-413 and terminal contact portions 251-253.

[0043] Furthermore, the protrusions 251b-253b of the terminal contact portions 251-253 enter the grooves 411d-413d of the external terminals 411-413. As a result, the protrusions 251b-253b are caught in the grooves 411d-413d, so that the external terminals 411-413 and the terminal contact portions 251-253 can be aligned and the mechanical connection between the external terminals 411-413 and the terminal contact portions 251-253 can be strengthened.

[0044] The above-mentioned case 4 includes the spring plate 421, and is integrally molded by, for example, injection molding using thermoplastic resin. The thermoplastic resin is, for example, polyphenylene sulfide resin, polybutylene terephthalate resin, polybutylene succinate resin, polyamide resin, or acrylonitrile butadiene styrene resin. The case 4 is molded, for example, from epoxy resin.

[0045] Next, a description will be given of the manufacturing process of semiconductor package 2. The manufacturing process of semiconductor package 2 can be broadly divided into, for example, a step of manufacturing wiring board 200, a step of arranging semiconductor elements 211-212 and leads 221-224 on the upper surface of wiring board 200 to form a circuit, and a step of sealing the circuit on wiring board 200.

[0046] The process (not shown) of sealing the circuit on the wiring board 200 is performed by, for example, transfer molding. The circuit board on which the circuit including the semiconductor elements 211 and 212, the leads 221 and 222, etc. is formed on the upper surface of the wiring board 200 is placed in a space (cavity) defined by the lower and upper dies of a molding die. The lower die is provided with, for example, a concave wiring board accommodating portion having a bottom surface that is in close contact with the lower surface of the fourth conductor pattern 205 in the wiring board 200. The upper die is formed with a wall portion for forming the concave shape of the end portion of the sealing body 240 of the above-mentioned semiconductor package 2. The wall portion defines a recess having a shape that includes the terminal contact portions 251 to 253 of the conductor patterns 202 to 204. By using such a lower and upper die, it is possible to manufacture the semiconductor package 2 in which the terminal contact portions 251 to 253 are exposed from the upper surface of the step portion 240b of the sealing body 240 when the sealing body 240 is poured into the cavity. The method for sealing semiconductor elements 211 and 212 on wiring board 200 with an insulating material is not limited to the above-mentioned transfer molding.

[0047] When manufacturing a conventional semiconductor device, for example, a process of electrically connecting a conductor pattern of a wiring board on which semiconductor elements and the like are arranged to form a circuit to an external terminal provided in a case with an open top surface is performed, followed by a process of sealing the semiconductor elements and the like in the case with an insulating resin. In such a manufacturing process, the conductor pattern of the wiring board and the external terminal are joined by laser welding or ultrasonic bonding.

[0048] However, laser welding can cause damage to the insulating substrate of the wiring board and the flow of the bonding material (e.g., solder) due to heat. Therefore, the terminal contact area needs to have a certain height (dimension in the Z direction). Furthermore, ultrasonic bonding has a limited area where the external terminal and the conductor pattern can be bonded in one process, and the bonding area between the conductor pattern of the wiring board and the conductive material of the case becomes large.

[0049] In contrast, in semiconductor device 1 of the first embodiment, external terminals 411-413 inserted into first insertion portions 404a-404b of case 4 and terminal contact portions 251-253 provided on conductor patterns 202-204 are mechanically connected by a pressing force applied by spring plate 421. That is, terminal contact portions 251-253 do not need a height (dimension in the Z direction) to prevent damage to wiring board 200 due to laser welding, and can be suppressed to a height that is exposed from the upper surface of step portion 240b of sealing body 240. In addition, the process of joining terminal portions 251-253 and external terminals 411-413 can be reduced. Therefore, the semiconductor device can be miniaturized while suppressing an increase in manufacturing cost.

[0050] In the first embodiment, the spring plate 421 has been described as an example of a method for fixing the terminal contact portions 251-253 and the external terminals 411-413, but any fixing method can be used as long as it is an elastic member. By using an elastic member that can apply a pressing force to the contact terminal portions 251-253 in the spring plate accommodating portion 401 of the case 4, the external terminals 411-413 inserted into the first insertion portions 404a-404c of the case 4 can be mechanically connected to the terminal contact portions 251-253.

[0051] 9 is a cross-sectional view of a main part for explaining a method of removing the external terminal. A tool 5 is inserted into the second insertion portion 405b of the case 4. When the tool 5 is inserted into the second insertion portion, the tool 5 presses the spring plate 421 toward the upper surface 4a of the case 4 from a portion where the tool 5 abuts against the spring plate 421. When the spring plate 421 is pressed by the tool 5, the contact portion 421a of the spring plate 421 moves away from the fixed portion 412c of the external terminal 412 toward the upper surface 4a of the case 4. The tool 5 may be any thin plate-shaped object capable of pressing the spring plate 421 away from the external terminal 412, for example, a flat-head screwdriver.

[0052] In this manner, by inserting the tool 5 into the second insertion portion 405 of the case 4, it is possible to release the mechanical connection between the fixing portions 411c-413c of the external terminals 411-413 and the contact portion 421a of the spring plate 421. In other words, it becomes possible to easily remove the external terminals 411-413 from the terminal contact portions 251-253 of the conductive patterns 202-204.

[0053] FIG. 10 is a cross-sectional view of a main part illustrating a first modification of the semiconductor device 1 according to the first embodiment.

[0054] 10, the first insertion portion 404b and the second insertion portion 405b of the case 4 of the semiconductor device 1a of the third modification are provided on the upper surface 4a of the case 4. The first insertion portion 404b is provided closer to the terminal contact portion 252 than the second insertion portion 405b. The first insertion portion 404 and the second insertion portion 405 penetrate from the upper surface 4a of the case 4 toward the spring plate accommodating portion 401 and the spring plate 421.

[0055] Terminal contact portion 252 of third conductor pattern 204 is exposed to the case 4 side (+Z direction) from the upper surface of step portion 240b of sealing body 240. Furthermore, protrusion portion 252 of terminal contact portion 252 has a columnar shape that protrudes from surface 252a of terminal contact portion 252 to the spring plate 421 side (+X direction). Furthermore, the surface of terminal contact portion 252 opposite surface 252a is in contact with the inner wall portion of spring plate accommodating portion 401 of case 4.

[0056] The external terminal 412 has a bent portion 412e that bends at a substantially right angle from a portion protruding from the first insertion portion 404b toward the side surface 4d (−X direction) of the case 4. The external terminal 412 is bent at the bent portion 412e and extends along the upper surface 4a of the case 4.

[0057] When the external terminal 412 is inserted into the first insertion portion 404b of the case 4, the front surface 412a of the external terminal 412 comes into contact with the contact portion 421a of the spring plate 421, and the back surface 412b comes into contact with the front surface 252a of the terminal contact portion 252 of the conductor pattern 204. At this time, the contact portion 421a of the spring plate 421 applies a pressing force to the external terminal 412 toward the contact terminal portion 252. Therefore, the external terminal 412 and the terminal contact portion 252 are mechanically or electrically connected by the pressing force applied via the contact portion 421a. Also, when the external terminal 412 is attached to a capacitor or the like, the weight of the capacitor or the like is applied to the external terminal 412 toward the cooler 3. That is, the external terminal 412 is pressed against the upper surface 4a of the case 4 by the weight of the capacitor or the like. Therefore, the holding force of the external terminal 412 can be strengthened.

[0058] Furthermore, by inserting the tool 5 into the second insertion portion 405 of the case 4, it is possible to release the mechanical connection between the fixing portions 411c-413c of the external terminals 411-413 and the contact portion 421a of the spring plate 421. In other words, it becomes possible to easily remove the external terminals 411-413 from the terminal contact portions 251-253 of the conductive patterns 202-204.

[0059] Although detailed explanation is omitted, the terminal contact portions 251, 253 and external terminals 411, 413 of the first conductor pattern 202 of the semiconductor package 2, and the first insertion portions 404a, 404c of the case 4 have the same configuration, arrangement, and dimensions as the terminal contact portion 252 and external terminal 412 of the third conductor pattern 204 of the semiconductor package 2, and the first insertion portion 404b of the case 4.

[0060] <Second embodiment> A second embodiment will be described. Note that, for elements having the same functions as those in the first embodiment in each of the following exemplary aspects, the same reference numerals as those in the first embodiment will be used and detailed descriptions thereof will be omitted as appropriate.

[0061] FIG. 11 shows a cross-sectional view of a main part of the semiconductor device 1a in the second embodiment. The case 4 has an opening 407 having a rectangular shape in a side view from the Y direction on the side surface 4d. The opening 407 is arranged side by side with the first insertion portion 404b of the case 4 on the upper surface 4a side of the case 4 from the first insertion portion 404b. The opening 407 is also provided in continuity with the spring plate accommodating portion 401. Although not particularly shown, a plurality of openings 407 may be provided on the side surfaces 4b and 4d, and each opening 407 is arranged side by side with the first insertion portions 404a and 404c on the upper surface 4a side from the first insertion portions 404a and 404c. Each opening 407 has a similar configuration.

[0062] Spring plate 421 has bent portion 421b bent toward terminal contact portion 252 of third conductor pattern 204, and tip portion 421c protruding outward from opening 407 of case 4. Peak 421d of bent portion 421b is provided at a position facing third conductor pattern 204. Spring plate 421 is not fixed to spring plate accommodating portion 401 of case 4. In other words, spring plate 421 is not fixed to case 4. The height (dimension in Z direction) and width (dimension in X direction) of tip portion 421c of spring plate 421 are smaller than the height (dimension in Z direction) and width (dimension in X direction) of opening 407.

[0063] When the external terminal 412 is inserted into the first insertion portion 404b of the case 4, the front surface 412a of the external terminal 412 comes into contact with the vertex 421d of the bent portion 421b of the spring plate 421, and the rear surface 412b comes into contact with the front surface 252a of the terminal contact portion 252 of the conductor pattern 204. At this time, the bent portion 421b of the spring plate 421 applies a pressing force to the external terminal 412 toward the contact terminal portion 252 via the vertex 421d. Therefore, the external terminal 412 and the terminal contact portion 252 are mechanically and electrically connected by the pressing force applied via the vertex 421d.

[0064] In the semiconductor device 1a, electrical connection between the external terminal 412 and the conductor pattern 204 of the wiring board 200 of the semiconductor package 2 can be ensured without laser welding, ultrasonic bonding, or the like. That is, the terminal contact portion 252 does not need to have a height (dimension in the Z direction) to prevent damage to the insulating substrate 201 due to laser welding, and can be suppressed to a height that is exposed from the upper surface of the step portion 240b of the sealing body 240. In addition, the process of bonding the terminal portion 252 and the external terminal 412 can be reduced. Therefore, the semiconductor device can be miniaturized while suppressing an increase in manufacturing cost. In addition, the apex 421d of the spring plate 421 is in contact with the fixed portion 412c of the external terminal 412. As a result, the apex 421d of the spring plate 421 is caught by the fixed portion 412c, so that the mechanical connection between the external terminal 412 and the terminal contact portion 252 can be strengthened.

[0065] Further, the tip 421c of the spring plate 421 is not fixed to the case 4 and protrudes from the opening 407. That is, the spring plate 421 is not fixed to the case 4, and the height (dimension in the Z direction) and width (dimension in the X direction) of the tip 421c of the spring plate 421 are smaller than the height (dimension in the Z direction) and width (dimension in the X direction) of the opening 407. This allows the tip 421c of the spring plate 421 to be lifted toward the upper surface 4a of the case 4 using, for example, a tool or fingers, and the mechanical connection between the fixed portion 412c of the external terminal 412 and the spring plate 421d can be released. This allows the external terminal 412 to be easily removed from the terminal contact portion 252 of the conductor pattern 204.

[0066] Although detailed explanation is omitted, the terminal contact portion 251 and external terminal 411 of the first conductor pattern 202 of the semiconductor package 2, the terminal contact portion 253 and external terminal 413 of the second conductor pattern 203 of the semiconductor package 2, the terminal contact portion 252 and external terminal 412 of the third conductor pattern 204 of the semiconductor package 2, and each spring plate 421 have the same configuration, arrangement, and dimensions.

[0067] Fig. 12 and Fig. 13 are cross-sectional views of a main part explaining the modified example 1 of the semiconductor device 1a in the second embodiment. Fig. 12 is a side view of a main part explaining the modified example 1 of the semiconductor device 1a in the second embodiment. Fig. 13 is a side view of a main part of the semiconductor device 1a of the modified example 1 of the second embodiment as viewed in the +Y direction.

[0068] 12, protective member 408 is attached to opening 407 of case 4 of semiconductor device 1a of modification 1 so as to cover tip portion 421c of spring plate 421. Protective member 408 is made of, for example, the same material as case 4. Protective member 408 covers tip portion 421c of spring plate 421, and the tip portion of protective member 408 is inserted into opening 407 and attached. Protective member 408 may be formed integrally with case 4.

[0069] 13, the protective member 408 has a rectangular shape in a side view. The protective member 408 covers the four sides of the tip portion 421c of the spring plate 421 so as to surround it. This makes it possible to protect the insulation of the spring plate 421, for example, when the external terminal 412 is attached to the capacitor. The shape and dimensions of the protective member 408 are appropriately selected so as to cover the tip portions 411c-413c of the external terminals 411-413.

[0070] 14 is a cross-sectional view of a main part for explaining Modification 2 of the semiconductor device 1a in the second embodiment. Note that the terminal contact portion 251 and the external terminal 411 of the first conductor pattern 202 of the semiconductor package 2, the terminal contact portion 253 and the external terminal 413 of the second conductor pattern 203 of the semiconductor package 2, the terminal contact portion 252 and the external terminal 412 of the third conductor pattern 204 of the semiconductor package 2, and each spring plate 421 have the same configuration, arrangement, and dimensions.

[0071] 14, the spring plate 421 of the semiconductor device 1a of the second modification is provided with a first bent portion 421b1 that bends toward the terminal contact portion 252 of the third conductor pattern 204, and a second bent portion 421b2 that bends toward the terminal contact portion 252 of the third conductor pattern 204. The first bent portion 421b1 is provided closer to the side surface 4d of the case 4 than the second bent portion 421b2. The vertices 421d1 and 421d2 of the first bent portion 421b1 and the second bent portion 421b2 are provided to face the terminal contact portion 252 of the third conductor pattern 204.

[0072] The external terminal 412 is provided on the front surface 412a with a first fixing portion 412c1 that contacts the apex 421d of the first bent portion 421b1 and a second fixing portion 412c2 that contacts the apex 421d2 of the second bent portion 421b2. The first fixing portion 412c1 and the second fixing portion 412c2 are recessed from the front surface 412a toward the back surface 412b. The first fixing portion 412c1 and the second fixing portion 412c2 are rectangular in plan view, but are not particularly limited thereto. The width (X direction) of the first fixing portion 412c1 and the second fixing portion 412c2 is equal to the width of the external terminal 412. The first fixing portion 412c1 and the second fixing portion 412c2 are provided without overlapping the groove portion 421d in plan view.

[0073] When the external terminal 412 is inserted into the first insertion portion 404b of the case 4, the fixing portion 421c1 of the front surface 412a of the external terminal 412 comes into contact with the first bent portion 421b1 of the spring plate 421, and the fixing portion 421c2 comes into contact with the second bent portion 421b2 of the spring plate 421. At that time, the first bent portion 421b1 and the second bent portion 421b2 of the spring plate 421 apply a pressing force to the external terminal 412 toward the contact terminal portion 252 via the vertices 421d1 and 421d2. Therefore, the external terminal 412 and the terminal contact portion 252 are mechanically connected by the pressing force applied via the vertices 421d1 and 421d2. In addition, the pressing force is applied to the external terminal 412 from multiple points by multiple bent portions (the first bent portion 421b1 and the second bent portion 421b2) provided on the spring plate 421. This strengthens the mechanical connection between the external terminal 412 and the terminal contact portion 252 of the third conductor pattern 204. The arrangement, dimensions, and shape of the first bent portion 421b1 and the second bent portion 421b2 can be changed as appropriate. Also, the arrangement and shape of the first fixed portions 412c1 and 412c2 of the external terminal 412 can be changed as appropriate as long as they are in contact with the vertices 421d1 and 421d2 of the spring plate 421.

[0074] FIG. 15 is a cross-sectional view of a main part illustrating a third modification of the semiconductor device 1a according to the second embodiment.

[0075] 15, the first insertion portion 404b and the opening 407 of the case 4 of the semiconductor device 1a of the third modification are provided on the top surface 4a of the case 4. The first insertion portion 404b is provided next to the opening 407 on the side surface 4d side of the opening 407. The tip portion 421c of the spring plate 421 protrudes from the top surface 4a of the case 4 (in the +Z direction) through the opening 407.

[0076] Terminal contact portion 252 of third conductor pattern 204 is exposed upward (+Z direction) from the upper surface of step portion 240b of sealing body 240. Moreover, protrusion portion 252 of terminal contact portion 252 has a columnar shape that protrudes from surface 252a of terminal contact portion 252 toward spring plate 421 (+X direction). Moreover, the surface of terminal contact portion 252 opposite surface 252a is in contact with the inner wall of spring plate accommodating portion 401 of case 4.

[0077] The external terminal 412 has a bent portion 412e that bends at a substantially right angle from a portion protruding from the first insertion portion 404b toward the side surface 4d (−X direction) of the case 4. The external terminal 412 is bent at the bent portion 412e and extends along the upper surface 4a of the case 4.

[0078] When the external terminal 412 is inserted into the first insertion portion 404b of the case 4, the front surface 412a of the external terminal 412 comes into contact with the apex 421d of the bent portion 421b of the spring plate 421, and the back surface 412b comes into contact with the surface 252a of the terminal contact portion 252 of the conductor pattern 204. At this time, the bent portion 421b of the spring plate 421 applies a pressing force to the external terminal 412 toward the contact terminal portion 252 through the apex 421d. Therefore, the external terminal 412 and the terminal contact portion 252 are mechanically connected by the pressing force applied through the apex 421d. In addition, when the external terminal 412 is attached to a capacitor or the like, the weight of the capacitor or the like is applied to the external terminal 412 toward the cooler 3. That is, the external terminal 412 is pressed against the upper surface 4a of the case 4 by the weight of the capacitor or the like. Therefore, the holding force of the external terminal 412 can be strengthened.

[0079] Although detailed explanation is omitted, the terminal contact portions 251, 253 and external terminals 411, 413 of the first conductor pattern 202 of the semiconductor package 2, and the first insertion portions 404a, 404c of the case 4 have the same configuration, arrangement, and dimensions as the terminal contact portion 252 and external terminal 412 of the third conductor pattern 204 of the semiconductor package 2, and the first insertion portion 404b of the case 4.

[0080] FIG. 16 is a cross-sectional view of a main part illustrating a fourth modified example of the semiconductor device 1a according to the second embodiment.

[0081] 16, the spring plate 421 has a curved portion 421e that curves toward the terminal contact portion 252 of the third conductor pattern 204. The curved portion 421e is, for example, R-shaped. The curved portion 421e has a portion facing the terminal contact portion 252 of the third conductor pattern 204.

[0082] When the external terminal 412 is inserted into the first insertion portion 404b of the case 4, the front surface 412a of the external terminal 412 comes into contact with a portion of the curved portion 421e of the spring plate 421 that faces the terminal contact portion 252. Also, the back surface 412b comes into contact with the front surface 252a of the terminal contact portion 252 of the conductor pattern 204. At this time, the curved portion 421e of the spring plate 421 applies a pressing force to the external terminal 412 toward the contact terminal portion 252. Therefore, the external terminal 412 and the terminal contact portion 252 are mechanically connected by the pressing force applied via the curved portion 421e.

[0083] Furthermore, since the curved portion 421e is in surface contact with the front surface 412a, the area to which the pressing force is applied is increased, thereby strengthening the mechanical connection between the external terminal 412 and the terminal contact portion 252. Although a plurality of fixing portions 412c are provided for the external terminal 412 in FIG. 16, the number can be changed as appropriate.

[0084] The embodiments of the semiconductor package and the semiconductor device according to the present invention are not limited to the above-mentioned embodiments, and may be variously changed, substituted, or modified within the scope of the spirit of the technical idea. Furthermore, if the technical idea can be realized in a different way due to the progress of technology or another derived technology, it may be implemented using that method. Therefore, the claims cover all embodiments that can be included in the scope of the technical idea. [Explanation of symbols]

[0085] 1, 1a...Semiconductor device 2. Semiconductor package 200...Wiring board 201...Insulating substrate 202...First conductor pattern 203...Second conductor pattern 204…Third conductor pattern 205…4th conductor pattern 211, 212...Semiconductor elements 211a,212a...Surface electrode 211b, 212b...Control electrodes 221~224…Lead 231, 232...Bonding wire 240...Sealing body 240a…Top surface 240b…Step 251~253…Terminal contact part 251a~253a…Surface 251b~253b…Protrusion 3...Cooler 4. Case 4a…Top surface 4b~4e…side 401...Spring plate housing 402… Storage unit 403...Through hole 404, 404a to 404c...First insertion part 405, 405a~405c...Second insertion part 406…Fixing hole 407…Opening 408...Protective material 411~413…External terminals 411a~413a…Front 411b~413b…Back side 411c~413c…Fixed part 412c1…First fixed part 412c2…Second fixed part 411d~413d…Groove 412e…Bend 421...Spring plate 421a...Contact part 421b...Bending part 421b1...First bending part 421b2…Second bending part 421c...Tip 421d, 421d1~421d2...Vertex 421e…Bend 5...Tools

Claims

1. A semiconductor element; a conductor pattern having a terminal contact portion electrically connected to the semiconductor element; a sealing body that seals the semiconductor element and has the terminal contact portion exposed from an upper surface thereof; a case provided with a housing portion that houses the sealing body; an elastic member that applies a pressing force from a surface opposite to a surface that contacts the terminal contact portion of the inserted external terminal when the external terminal is inserted; the case is provided with a first insertion portion into which the external terminal is inserted; Semiconductor Module

2. The first insertion portion is provided on a side surface or a top surface of the case. The semiconductor module according to claim 1 .

3. The elastic member is a spring plate. The semiconductor module according to claim 1 .

4. the spring plate has a bent portion that bends toward the terminal contact portion, The apex of the bent portion is provided opposite to the terminal contact portion. The semiconductor module according to claim 3 .

5. The spring plate has a plurality of bent portions. The semiconductor module according to claim 4 .

6. The case has an opening, the spring plate has a tip portion protruding from the opening of the case, The spring plate is not fixed to the case. The semiconductor module according to claim 4 .

7. a protective member for covering the tip of the spring plate; The protective member is attached to the opening. The semiconductor module according to claim 6 .

8. The first insertion portion and the opening are provided on an upper surface of the case. The semiconductor module according to claim 6 .

9. the spring plate has a curved portion that curves toward the terminal contact portion, The curved portion has a portion facing the terminal contact portion. The semiconductor module according to claim 3 .

10. the case has a second insertion portion into which a tool is inserted to separate the elastic member from the external terminal, the first insertion portion is provided closer to the terminal contact portion than the second insertion hole, The second insertion portion penetrates from the side surface or the top surface of the case toward the elastic member. The semiconductor module according to claim 2 .

11. A semiconductor element; a conductor pattern having a terminal contact portion electrically connected to the semiconductor element; a sealing body that seals the semiconductor element and has the terminal contact portion exposed from an upper surface thereof; a case provided with a housing portion that houses the sealing body; an elastic member that applies a pressing force from a surface opposite to a surface that contacts the terminal contact portion of the external terminal when the external terminal is inserted; the external terminal is sandwiched between the elastic member and the terminal contact portion and is electrically connected to the terminal contact portion, the case is provided with a first insertion portion into which the external terminal is inserted; Semiconductor device.

12. the external terminal has a front surface against which the elastic member abuts and a back surface against which the terminal contact portion contacts, The front surface has a fixing portion for fixing the elastic member at a position where the elastic member abuts. The semiconductor device according to claim 11.

13. The fixing portion is a recess recessed from the front surface toward the back surface. The semiconductor device according to claim 12.

14. The fixing portion is a plurality of protrusions protruding toward the elastic member. The semiconductor device according to claim 12.

15. the terminal contact portion includes a protrusion portion protruding toward the external terminal, The external terminal is provided with a groove into which the protrusion of the terminal contact portion enters. The semiconductor device according to claim 11.

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