Plasma processing apparatus and plasma processing method

Abstract

To suppress damages of a substrate while avoiding an increase of a tact time.SOLUTION: A plasma processing apparatus 10 comprises: a plasma processing part 20 that performs a plasma processing of a substrate 90 in a chamber 21 in a reduced pressure state, and in which a transport and export are performed of a substrate 90 to a chamber 21 in an atmosphere open state; a substrate collection part 30 that includes a plurality of slots 32 that houses the substrate 90 after the plasma processing by the plasma processing part 20 is performed; an export mechanism 40 that exports the substrate 90 to the substrate collection part 30 from the chamber 21 in the atmosphere open state; a detection part 70 that detects a blank slot 32A that does not house the substrate 90 in the substrate collection part 30; and a control part 80 that controls the detection part 70. The control part 80 causes the detection part 70 to execute a confirmation operation for confirming the presence / absence of the blank slot 32A for housing a first substrate 90A during the plasma processing to the first substrate 90A being performed in the plasma processing part 20.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a plasma processing apparatus and a plasma processing method. [Background technology]

[0002] Conventionally, plasma processing apparatuses for performing plasma processing on substrates are known (for example, Patent Document 1). The plasma processing apparatus of Patent Document 1 includes a plasma processing section having a chamber for performing plasma processing on substrates and in which substrates are loaded and unloaded from the chamber, a substrate recovery section having a plurality of slots for accommodating substrates after plasma processing, and an unloading mechanism for unloading the substrates from the chamber to the substrate recovery section. The substrate recovery section moves up and down in accordance with the operation of the unloading mechanism so that the substrate is unloaded to an empty slot that does not accommodate a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-50366 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, for example, when a plasma processing apparatus is stopped during production, the substrate recovery unit may be set to an initial position with some of the slots filled with substrates. To resume production from such a state, it is necessary to reset the position of the substrate recovery unit so that the vacant slots are in appropriate positions (i.e., positions corresponding to the substrates to be removed). However, if the position is not reset appropriately, the substrate may be removed to a slot that already contains a substrate, resulting in damage to the substrate. In addition, such a resetting of the position takes a certain amount of time, which may lead to an increase in takt time. In such a situation, one of the objectives of the present disclosure is to suppress damage to the substrates while avoiding an increase in takt time. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to a plasma processing apparatus, comprising: a plasma processing section having a chamber switchable between a reduced pressure state and an open-to-atmosphere state, where a plasma processing of a substrate is performed in the chamber in the reduced pressure state and the substrate is transferred to and from the chamber in the open-to-atmosphere state; a substrate recovery section having a plurality of slots for receiving the substrate after the plasma processing by the plasma processing section; a transfer mechanism for transferring the substrate from the chamber in the open-to-atmosphere state to the substrate recovery section; a detection section for detecting an empty slot not receiving the substrate in the substrate recovery section; and a control section for controlling the detection section, wherein the control section causes the detection section to perform a confirmation operation for confirming the presence or absence of the empty slot for receiving the first substrate while the plasma processing of a first substrate is being performed in the plasma processing section.

[0006] Another aspect of the present disclosure relates to a plasma processing method, the plasma processing method being performed in a plasma processing apparatus including a plasma processing unit having a chamber switchable between a reduced pressure state and an open-to-atmosphere state, where a plasma processing of a substrate is performed in the chamber in the reduced pressure state and the substrate is transported into and out of the chamber in the open-to-atmosphere state, a substrate recovery unit having a plurality of slots for accommodating the substrate after the plasma processing by the plasma processing unit, and a transport mechanism for transporting the substrate from the chamber in the open-to-atmosphere state to the substrate recovery unit, the plasma processing method including a confirmation step of performing a confirmation operation for confirming whether or not there is an empty slot in the substrate recovery unit for accommodating the first substrate while the plasma processing of a first substrate is being performed in the plasma processing unit. Effect of the Invention

[0007] According to the present disclosure, damage to a substrate can be suppressed while avoiding an increase in tact time. [Brief description of the drawings]

[0008] [Figure 1] 1 is a front view showing a schematic diagram of an example of a plasma processing apparatus according to the present disclosure, illustrating a state before plasma processing. [Diagram 2] FIG. 2 is a front view showing the plasma processing apparatus in a schematic manner during plasma processing. [Diagram 3] FIG. 2 is a front view showing the plasma processing apparatus in a schematic manner, illustrating a state after plasma processing. [Figure 4] 1 is a flowchart illustrating an example of a plasma processing method according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The following describes an embodiment of a plasma processing apparatus and a plasma processing method according to the present disclosure. However, the present disclosure is not limited to the examples described below. In the following description, specific numerical values ​​and materials may be exemplified, but other numerical values ​​and materials may be applied as long as the effects of the present disclosure are obtained. In this specification, the terms "first substrate" and "second substrate" are used for convenience to clarify the two substrates in question. In addition, the "first substrate" and "second substrate" are each included in the category of "substrate".

[0010] (Plasma processing equipment) The plasma processing apparatus according to the present disclosure may be an apparatus for performing a plasma cleaning process on a substrate, but is not limited thereto. For example, the plasma processing apparatus may be a plasma etching apparatus, a plasma dicer, a plasma ashing apparatus, or a plasma CVD apparatus. The plasma processing apparatus according to the present disclosure includes a plasma processing section, a substrate recovery section, a carrying-out mechanism, a detection section, and a control section.

[0011] The plasma processing unit has a chamber that can be switched between a reduced pressure state (a state in which the pressure is lower than atmospheric pressure) and an open-to-atmosphere state (a state in which the chamber interior space is in communication with the chamber exterior space). The chamber may have a base and a lid that can be opened and closed relative to the base. The chamber may be in a reduced pressure state by a reduced pressure mechanism (e.g., a vacuum pump) with the lid closed. The plasma processing unit may further have a plasma generating unit that generates plasma in the chamber. The plasma generating unit may include at least one coil for generating a high-frequency electromagnetic field in the chamber. The plasma processing unit performs plasma processing on a substrate in the chamber in a reduced pressure state, and also transfers the substrate into and out of the chamber in an open-to-atmosphere state.

[0012] The substrate recovery unit has a plurality of slots for accommodating the substrates after the plasma processing by the plasma processing unit. The substrate recovery unit may include a magazine having a plurality of slots aligned vertically and movable vertically.

[0013] The unloading mechanism unloads the substrate from the chamber open to the atmosphere to the substrate recovery unit. The unloading mechanism may have an unloading arm for pushing and moving the substrate in a predetermined direction. The unloading arm may have a pushing member for pushing the substrate. The number of pushing members that the unloading arm has may be the same as the number of substrates processed in the plasma processing unit.

[0014] The detection unit detects an empty slot not housing a substrate in the substrate recovery unit. An empty slot refers to a slot not housing a substrate among a plurality of slots in the substrate recovery unit. The detection unit may detect an empty slot by a contact method or a non-contact method. The detection unit may include, for example, an optical sensor capable of detecting an empty slot by a non-contact method. The detection unit may be a fixed-position type or a movable type.

[0015] The control unit controls the detection unit. The control unit may include a calculation device and a storage device storing a program executable by the calculation device. The control unit may control at least some of the other components of the plasma processing apparatus in addition to the detection unit.

[0016] The control unit causes the detection unit to perform a confirmation operation to confirm whether or not there is an empty slot for accommodating the first substrate while the plasma processing is being performed on the first substrate in the plasma processing unit. If there is an empty slot, the first substrate is conveyed to the empty slot, thereby preventing the first substrate from interfering with other substrates (i.e., substrates already accommodated in the slot of the substrate recovery unit) and damaging one or both of them. In addition, since the confirmation operation is performed while the plasma processing is being performed, no additional time is required for the confirmation operation, and therefore it is possible to avoid an increase in takt time. Note that the time required for the confirmation operation is typically shorter than the time required for the plasma processing, but may be longer than the time required for the plasma processing. In this specification, even in the latter case, if the confirmation operation is started during the plasma processing, it is considered that "the confirmation operation is performed while the plasma processing is being performed."

[0017] The above-mentioned confirmation operation may be performed at least for some of the plasma processes when multiple plasma processes are performed consecutively. However, when the plasma process is performed when the plasma processing apparatus is stopped during production and then the production is restarted, it is desirable to perform the confirmation operation during the plasma process.

[0018] After the confirmation operation detects an empty slot, the control unit may open the chamber to the atmosphere and then cause the unloading mechanism to unload the first substrate from the chamber to the substrate recovery unit (more specifically, the empty slot of the substrate recovery unit). With this configuration, the first substrate is unloaded from the chamber to the substrate recovery unit after the empty slot is detected, so that damage to the first substrate due to interference with other substrates can be suppressed. In addition, since the chamber is not opened to the atmosphere before the detection of the empty slot, changes in the state within the chamber can be suppressed, and the subsequent plasma processing can be performed stably.

[0019] If no empty slot is detected by the checking operation, the control unit may notify the user that there is no empty slot without opening the chamber to the atmosphere. The notification may be made by displaying a predetermined message on a monitor provided in the plasma processing apparatus, or by other means (e.g., acoustic means). With this configuration, the chamber is not opened to the atmosphere when there is no suitable destination for the first substrate (i.e., an empty slot), so that changes in the state inside the chamber can be suppressed and adverse effects on the subsequent plasma processing can be suppressed.

[0020] The plasma processing apparatus may further include a substrate supply unit that supplies a substrate to the plasma processing unit, and a loading mechanism that loads the substrate supplied from the substrate supply unit into the chamber. When the chamber is in an atmospheric open state, the control unit may cause the unloading mechanism to load the first substrate from the chamber and the loading mechanism to load the second substrate supplied from the substrate supply unit into the chamber. The loading mechanism may have at least one loading arm for pushing and moving the substrate in a predetermined direction. In this configuration, the unloading of the processed substrate (first substrate) and the loading of the unprocessed substrate (second substrate) are performed at the same time. Therefore, the time that the chamber is kept in an atmospheric open state can be shortened, and thus changes in the state inside the chamber can be suppressed.

[0021] (Plasma treatment method) The plasma processing method according to the present disclosure can be performed using, for example, the above-mentioned plasma processing apparatus, but may also be performed using other plasma processing apparatuses. In the following, an example in which the plasma processing method is performed using the above-mentioned plasma processing apparatus will be described. The plasma processing method according to the present disclosure includes a confirmation step.

[0022] In the confirmation step, while the plasma processing is being performed on the first substrate in the plasma processing section, a confirmation operation is performed to confirm whether or not there is an empty slot in the substrate recovery section for accommodating the first substrate. The confirmation operation may be performed by the above-mentioned detection section. If there is such an empty slot, the first substrate is conveyed to the empty slot, thereby preventing the first substrate from interfering with other substrates (i.e., substrates already accommodated in the slots of the substrate recovery section) and damaging one or both of them. In addition, since the confirmation operation is performed while the plasma processing is being performed, no additional time is required for the confirmation operation, and therefore it is possible to avoid an increase in takt time.

[0023] The plasma processing method may further include a carrying-out step of, after the empty slot is detected by the confirmation operation, opening the chamber to the atmosphere and then causing the carrying-out mechanism to carry out the first substrate from the chamber to the substrate recovery section (more specifically, the empty slot of the substrate recovery section). According to this configuration, since the first substrate is carried out from the chamber to the substrate recovery section after the empty slot is detected, it is possible to prevent the first substrate from being damaged due to interference with other substrates. Furthermore, since the chamber is not opened to the atmosphere before the empty slot is detected, it is possible to suppress changes in the state within the chamber and stably perform the subsequent plasma processing.

[0024] The plasma processing method may further include a notification step of notifying the user that there is no empty slot without opening the chamber to the atmosphere if the checking operation does not detect an empty slot. The notification may be performed by displaying a predetermined message on a monitor provided in the plasma processing apparatus, or by other means (e.g., acoustic means). With this configuration, the chamber is not opened to the atmosphere if there is no suitable destination for the first substrate (i.e., an empty slot), so that changes in the state inside the chamber can be suppressed and adverse effects on the subsequent plasma processing can be suppressed.

[0025] The plasma processing apparatus may further include a substrate supply unit that supplies a substrate to the plasma processing unit, and a loading mechanism that loads the substrate supplied from the substrate supply unit into the chamber. The plasma processing method may further include a loading / unloading step of causing the unloading mechanism to unload a first substrate from the chamber and the loading mechanism to load a second substrate supplied from the substrate supply unit into the chamber when the chamber is open to the atmosphere. In this configuration, the unloading of the processed substrate (first substrate) and the loading of the unprocessed substrate (second substrate) are performed at the same time. This makes it possible to shorten the time that the chamber is open to the atmosphere, thereby suppressing changes in the state inside the chamber.

[0026] As described above, according to the present disclosure, by performing a predetermined checking operation during plasma processing, it is possible to suppress damage to the substrate while avoiding an increase in takt time.

[0027] In the following, an example of a plasma processing apparatus and a plasma processing method according to the present disclosure will be specifically described with reference to the drawings. The above-mentioned components and steps can be applied to the components and steps of the plasma processing apparatus and the plasma processing method of the example described below. The components and steps of the plasma processing apparatus and the plasma processing method of the example described below can be modified based on the above description. In addition, the matters described below may be applied to the above embodiment. Among the components and steps of the plasma processing apparatus and the plasma processing method of the example described below, the components and steps that are not essential to the plasma processing apparatus and the plasma processing method according to the present disclosure may be omitted. Note that the figures shown below are schematic and do not accurately reflect the shapes and numbers of actual members.

[0028] The plasma processing apparatus 10 of this embodiment is a plasma cleaner, but is not limited thereto. As shown in Fig. 1 to Fig. 3, the plasma processing apparatus 10 includes a plasma processing unit 20, a substrate recovery unit 30, an unloading mechanism 40, a substrate supply unit 50, a carry-in mechanism 60, a detection unit 70, and a control unit 80. Fig. 1 shows simplified movable ranges MR1 ​​to MR3 of a push-out unit 54, a carry-in arm 61, and an unloading arm 41, which will be described later.

[0029] The plasma processing unit 20 has a chamber 21 that can be switched between a reduced pressure state and an open-to-atmosphere state. The chamber 21 has a base portion 21a and a lid portion 21b that can be opened and closed relative to the base portion 21a. The plasma processing unit 20 performs plasma processing on a substrate 90 in the chamber 21 in a reduced pressure state, and also transfers the substrate 90 into and out of the chamber 21 in an open-to-atmosphere state.

[0030] The substrate recovery unit 30 has a plurality of recovery slots 32 that accommodate the substrates 90 after the plasma processing by the plasma processing unit 20. The substrate recovery unit 30 has a recovery magazine 31 having a plurality of recovery slots 32 aligned vertically, and a recovery support unit 33 that supports the recovery magazine 31 so that it can be raised and lowered. The recovery slots 32 are an example of a slot.

[0031] The unloading mechanism 40 unloads the substrate 90 from the chamber 21, which is open to the atmosphere, to the substrate recovery part 30. The unloading mechanism 40 has an unloading arm 41 for pushing and moving the substrate 90 in a predetermined direction (from left to right in FIG. 1 ), and an unloading rail 42 for guiding the substrate 90 between the chamber 21 and the substrate recovery part 30.

[0032] The substrate supply unit 50 supplies substrates 90 to the plasma processing unit 20. The substrate supply unit 50 includes a supply magazine 51 having a plurality of supply slots 52 arranged vertically, a supply support unit 53 that supports the supply magazine 51 so that it can be raised and lowered, and a push-out unit 54 that pushes out the substrates 90 from the supply slots 52.

[0033] The carry-in mechanism 60 carries the substrate 90 supplied from the substrate supply unit 50 into the chamber 21. The carry-in mechanism 60 has a carry-in arm 61 for pushing and moving the substrate 90 in a predetermined direction, and a carry-in rail 62 for guiding the substrate 90 between the substrate supply unit 50 and the chamber 21.

[0034] The detection unit 70 detects empty slots 32A that do not accommodate a substrate 90 in the substrate recovery unit 30. The detection unit 70 of this embodiment includes an optical sensor that can detect empty slots 32A in a non-contact manner, but is not limited to this.

[0035] The control unit 80 controls the detection unit 70. While the plasma processing is being performed on the first substrate 90A in the plasma processing unit 20, the control unit 80 causes the detection unit 70 to perform a confirmation operation to confirm the presence or absence of an empty slot 32A for accommodating the first substrate 90A. After the empty slot 32A is detected by the confirmation operation, the control unit 80 makes the chamber 21 open to the atmosphere and then causes the unloading mechanism 40 to unload the first substrate 90A from the chamber 21 to the substrate recovery unit 30. If the empty slot 32A is not detected by the confirmation operation, the control unit 80 notifies the fact that there is no empty slot 32A without making the chamber 21 open to the atmosphere. When the chamber 21 is in an atmosphere-open state, the control unit 80 causes the unloading mechanism 40 to unload the first substrate 90A from the chamber 21 and causes the loading mechanism 60 to load the second substrate 90B supplied from the substrate supply unit 50 into the chamber.

[0036] (Plasma treatment method) Next, a plasma processing method of the present embodiment will be described with reference to Figures 1 to 4. The plasma processing method of the present embodiment can be performed using the plasma processing apparatus 10 of the present embodiment, but may also be performed using other plasma processing apparatuses. As shown in Figure 4, the plasma processing method of the present embodiment includes steps ST1 to ST11.

[0037] In step ST1, the control unit 80 opens the chamber 21 and places it in an atmosphere-open state (FIG. 1). Then, the process proceeds to step ST2.

[0038] In step ST2, the control unit 80 drives the push-out unit 54 and the carry-in arm 61, and the first substrate 90A is carried in from the substrate supply unit 50 to the chamber 21 via the carry-in rail 62 (FIG. 1). Step ST2 is an example of a carry-in process. Then, the process proceeds to step ST3.

[0039] In step ST3, the control unit 80 closes the chamber 21 (FIG. 2). Then, the process proceeds to step ST4.

[0040] In step ST4, the control unit 80 starts plasma processing in the plasma processing unit 20 (FIG. 2). Specifically, in a state where a process gas is supplied into the chamber 21, which is depressurized by a depressurization mechanism (not shown), a high-frequency electromagnetic field is applied to the internal space of the chamber 21, thereby starting plasma processing on the first substrate 90A. Then, the process proceeds to step ST5.

[0041] In step ST5, while the plasma processing is being performed on the first substrate 90A in the plasma processing unit 20, the control unit 80 causes the detection unit 70 to perform a confirmation operation to confirm the presence or absence of an empty slot 32A for accommodating the first substrate 90A in the substrate recovery unit 30 (FIG. 2). At this time, as shown by the arrow in FIG. 2, it is preferable that the recovery magazine 31 moves up and down so that the detection unit 70 can confirm the presence or absence of the substrate 90 in each recovery slot 32. Step ST5 is an example of a confirmation step. Next, proceed to step ST6.

[0042] In step ST6, the control unit 80 determines whether the plasma processing has been completed. For example, this determination may be made using information on the processing time included in the process recipe. If the plasma processing has not been completed (if "No"), step ST6 is repeated. If the plasma processing has been completed (if "Yes"), the process proceeds to step ST7.

[0043] In step ST7, the control unit 80 determines whether or not there is an empty slot 32A in the substrate recovery unit 30 (more specifically, the recovery magazine 31). If there is an empty slot 32A (if "Yes"), the process proceeds to step ST8. If there is no empty slot 32A (if "No"), the process proceeds to step ST12. The determination in step ST7 may be performed before step ST6 or in parallel with step ST6.

[0044] In step ST8, the control unit 80 opens the chamber 21 and places it in an atmosphere-open state (FIG. 3). Then, the process proceeds to step ST9.

[0045] In step ST9, the control unit 80 determines whether or not the second substrate 90B is present in the substrate supply unit 50 (more specifically, the supply magazine 51). If the second substrate 90B is present (if "Yes"), the process proceeds to step ST10. If the second substrate 90B is not present (if "No"), the process proceeds to step ST11. Note that the determination in step ST9 may be performed prior to step ST8, or may be performed in parallel with step ST7, for example.

[0046] In step ST10, the control unit 80 drives the unloading arm 41 to unload the first substrate 90A from the chamber 21 to the empty slot 32A of the substrate recovery unit 30 via the unloading rail 42, and drives the pushing unit 54 and the loading arm 61 to load the second substrate 90B from the substrate supply unit 50 into the chamber 21 via the loading rail 62 (FIG. 3). Steps ST8 and ST10 are an example of a loading / unloading process. Then, the process returns to step ST3.

[0047] In step ST11, the control unit 80 drives the unloading arm 41, and the first substrate 90A is unloaded from the chamber 21 to the empty slot 32A of the substrate recovery unit 30 via the unloading rail 42. Steps ST8 and ST11 are an example of an unloading process. Then, a series of processes is completed.

[0048] In step ST12, the control unit 80 notifies the user that there is no free slot 32A without opening the chamber 21 to the atmosphere. As a means for notifying the user, for example, a predetermined error message may be displayed on a monitor (not shown) provided in the plasma processing apparatus 10. Step ST12 is an example of a notifying process. Then, the series of processes ends.

[0049] Additional Notes The above description of the embodiments discloses the following techniques. (Technology 1) a plasma processing section including a chamber switchable between a reduced pressure state and an open-to-atmosphere state, in which a plasma processing of a substrate is performed in the chamber in the reduced pressure state, and the substrate is transferred into and out of the chamber in the open-to-atmosphere state; a substrate recovery unit having a plurality of slots for accommodating the substrate after the plasma processing by the plasma processing unit; a carry-out mechanism that carries out the substrate from the chamber in the atmospheric open state to the substrate recovery unit; a detection unit that detects an empty slot not accommodating the substrate in the substrate recovery unit; A control unit that controls the detection unit; Equipped with The control unit causes the detection unit to perform a confirmation operation to confirm whether or not there is an empty slot for accommodating the first substrate while plasma processing is being performed on the first substrate in the plasma processing unit. (Technology 2) The plasma processing apparatus according to technology 1, wherein after the empty slot is detected by the confirmation operation, the control unit puts the chamber into the atmospheric open state and then causes the unloading mechanism to unload the first substrate from the chamber to the substrate recovery unit. (Technology 3) The plasma processing apparatus according to technique 1 or 2, wherein, when the empty slot is not detected by the confirmation operation, the control unit notifies the fact that the empty slot is not present without opening the chamber to the atmosphere. (Technology 4) a substrate supply unit that supplies the substrate to the plasma processing unit; a loading mechanism that loads the substrate supplied from the substrate supply unit into the chamber; Further equipped with The plasma processing apparatus according to any one of techniques 1 to 3, wherein the control unit, when the chamber is in the atmospheric open state, causes the unloading mechanism to unload the first substrate from the chamber and causes the loading mechanism to load the second substrate supplied from the substrate supply unit into the chamber. (Technology 5) a plasma processing section including a chamber switchable between a reduced pressure state and an open-to-atmosphere state, in which a plasma processing of a substrate is performed in the chamber in the reduced pressure state, and the substrate is transferred into and out of the chamber in the open-to-atmosphere state; a substrate recovery unit having a plurality of slots for accommodating the substrate after the plasma processing by the plasma processing unit; a carry-out mechanism that carries out the substrate from the chamber in the atmospheric open state to the substrate recovery unit; A plasma processing method performed in a plasma processing apparatus, comprising: A plasma processing method comprising a confirmation step of performing a confirmation operation to confirm whether or not there is an empty slot in the substrate recovery section for accommodating the first substrate while plasma processing is being performed on the first substrate in the plasma processing section. (Technology 6) The plasma processing method according to technique 5, further comprising a conveying step of causing the conveying mechanism to convey the first substrate from the chamber to the substrate recovery section after the empty slot is detected by the confirmation operation and then opening the chamber to the atmospheric state. (Technology 7) The plasma processing method according to technique 5 or 6, further comprising a notification step of, if the empty slot is not detected by the confirmation operation, notifying that the empty slot does not exist without opening the chamber to the atmosphere. (Technology 8) The plasma processing apparatus includes: a substrate supply unit that supplies the substrate to the plasma processing unit; a loading mechanism that loads the substrate supplied from the substrate supply unit into the chamber; Further equipped with The plasma processing method according to any one of Techniques 5 to 7, further comprising a loading / unloading step of causing the unloading mechanism to unload the first substrate from the chamber when the chamber is in the atmospheric open state, and causing the loading mechanism to load a second substrate supplied from the substrate supply unit into the chamber. [Industrial Applicability]

[0050] The present disclosure can be used in a plasma processing apparatus and a plasma processing method. [Explanation of symbols]

[0051] 10: Plasma processing equipment 20: Plasma processing section 21: Chamber 21a: Base section 21b: Lid part 30: Substrate recovery section 31: Recovered magazine 32: Recovery slot (slot) 32A: Free slot 33: Recovery Support Department 40: Unloading mechanism 41: Eject arm 42:Exit rail 50: Substrate supply section 51: Supply magazine 52: Supply Slot 53: Supply support part 54: Extrusion section 60: Loading mechanism 61: Loading arm 62: Carry-in rail 70: Detection unit 80: Control unit 90: Circuit board 90A: First board 90B: 2nd board MR1: Movable range of extrusion part MR2: Loading arm movement range MR3: Range of movement of ejection arm

Claims

1. a plasma processing section including a chamber switchable between a reduced pressure state and an open-to-atmosphere state, in which a plasma processing of a substrate is performed in the chamber in the reduced pressure state, and the substrate is transferred into and out of the chamber in the open-to-atmosphere state; a substrate recovery unit having a plurality of slots for accommodating the substrate after the plasma processing by the plasma processing unit; a carry-out mechanism that carries out the substrate from the chamber in the atmospheric open state to the substrate recovery unit; a detection unit that detects an empty slot not accommodating the substrate in the substrate recovery unit; A control unit that controls the detection unit; Equipped with A plasma processing apparatus, wherein the control unit causes the detection unit to perform a confirmation operation to confirm whether or not there is an empty slot for accommodating the first substrate while plasma processing is being performed on the first substrate in the plasma processing unit.

2. 2. The plasma processing apparatus of claim 1, wherein after the empty slot is detected by the confirmation operation, the control unit causes the chamber to be in the atmospheric open state and then causes the unloading mechanism to unload the first substrate from the chamber to the substrate recovery unit.

3. 3 . The plasma processing apparatus according to claim 1 , wherein, when the empty slot is not detected by the checking operation, the control unit notifies the user that there is no empty slot without opening the chamber to the atmosphere.

4. a substrate supply unit that supplies the substrate to the plasma processing unit; a loading mechanism that loads the substrate supplied from the substrate supply unit into the chamber; Further equipped with 3. The plasma processing apparatus of claim 1, wherein the control unit causes the unloading mechanism to unload the first substrate from the chamber when the chamber is in the atmospheric open state, and causes the loading mechanism to load the second substrate supplied from the substrate supply unit into the chamber.

5. a plasma processing section including a chamber switchable between a reduced pressure state and an open-to-atmosphere state, in which a plasma processing of a substrate is performed in the chamber in the reduced pressure state, and the substrate is transferred into and out of the chamber in the open-to-atmosphere state; a substrate recovery unit having a plurality of slots for accommodating the substrate after the plasma processing by the plasma processing unit; a carry-out mechanism that carries out the substrate from the chamber in the atmospheric open state to the substrate recovery unit; A plasma processing method performed in a plasma processing apparatus, comprising: A plasma processing method comprising a confirmation step of performing a confirmation operation to confirm whether or not there is an empty slot in the substrate recovery section for accommodating the first substrate while plasma processing is being performed on the first substrate in the plasma processing section.

6. 6. The plasma processing method according to claim 5, further comprising a transport step of causing the chamber to be in the atmospheric open state after the empty slot is detected by the confirmation operation, and then causing the transport mechanism to transport the first substrate from the chamber to the substrate recovery section.

7. 7. The plasma processing method according to claim 5, further comprising a notifying step of, when the empty slot is not detected by the checking operation, notifying that the empty slot does not exist without placing the chamber in the atmospheric open state.

8. The plasma processing apparatus includes: a substrate supply unit that supplies the substrate to the plasma processing unit; a loading mechanism that loads the substrate supplied from the substrate supply unit into the chamber; Further equipped with 7. The plasma processing method according to claim 5, further comprising a loading / unloading step of causing the unloading mechanism to unload the first substrate from the chamber when the chamber is in the atmospheric open state, and causing the loading mechanism to load a second substrate supplied from the substrate supply unit into the chamber.

Images