Pressure sensor device

Abstract

To provide a pressure sensor device capable of suppressing deterioration of pressure measurement accuracy.SOLUTION: The pressure sensor device is provided with: a substrate; a sensor provided on the substrate for measuring absolute pressure; a cover attached to the substrate to form a housing space for housing the sensor; and a shielding member. The cover has a hole for communicating the housing space with the outside of the housing space, and the shielding member seals the housing space in a state where the hole is closed.SELECTED DRAWING: Figure 3B

Description

[Technical field]

[0001] The present invention relates to a pressure sensor device. [Background technology]

[0002] A typical pressure sensor device includes a pressure sensor that uses a diaphragm formed on a semiconductor substrate, and a package that houses the pressure sensor (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-222175 A Summary of the Invention [Problem to be solved by the invention]

[0004] In some pressure sensor devices, the tube is directly attached to the cap that covers the package. In such pressure sensor devices, when the tube is attached to the cap, force may be applied to the semiconductor substrate or the terminals (so-called lead frames) extending from the package, which may deteriorate the measurement accuracy of the pressure sensor device.

[0005] The present invention has been made in consideration of the above-mentioned problems in the conventional art, and has an object to provide a pressure sensor device capable of suppressing deterioration in pressure measurement accuracy. [Means for solving the problem]

[0006] A first aspect of the present invention that primarily solves the above-mentioned problems is a pressure sensor device comprising: a substrate; a sensor provided on the substrate for measuring absolute pressure; a cover attached to the substrate and forming an accommodating space for accommodating the sensor; and a shielding member, wherein the cover has a hole connecting the accommodating space to the outside of the accommodating space, and the shielding member seals the accommodating space when the hole is blocked.

[0007] A second aspect of the present invention which is primarily intended to solve the above-mentioned problem is a pressure sensor device comprising: a substrate; a first sensor provided on the substrate for measuring absolute pressure; a second sensor provided on the substrate for measuring absolute pressure; a cover attached to the substrate and forming a first accommodating space for accommodating the first sensor and a second accommodating space for accommodating the second sensor; and a shielding member, wherein the cover has a first hole communicating the first accommodating space with the outside of the first accommodating space and a second hole communicating the second accommodating space with the outside of the second accommodating space, the shielding member includes a first portion that seals the first accommodating space when the first hole is blocked, and a second portion that seals the second accommodating space when the second hole is blocked, and is located between the cover and the substrate, and the first portion and the second portion have a common portion. Effect of the Invention

[0008] According to the present invention, it is possible to provide a pressure sensor device capable of suppressing deterioration of the pressure measurement accuracy. [Brief description of the drawings]

[0009] [Figure 1A] FIG. 1 is a perspective view of a typical pressure sensor device 10. [Figure 1B] FIG. 1B is a partial cross-sectional view taken along line AA in FIG. 1A. [Diagram 2] FIG. [Figure 3A] FIG. 2 is a perspective view showing pressure sensor devices 15 and 16. [Figure 3B] 3B is a partial cross-sectional view of the pressure sensor device 15 taken along the line BB in FIG. 3A. [Figure 3C] 3B is a partial cross-sectional view of the pressure sensor device 16 taken along the line BB in FIG. 3A. [Figure 4A] FIG. 2 is a perspective view showing a pressure sensor device 17. [Figure 4B] FIG. 2 is a plan view of the pressure sensor device 17. [Figure 4C] FIG. 4C is a partial cross-sectional view taken along the line CC in FIG. 4B. [Figure 5A] FIG. 2 is an exploded perspective view of the pressure sensor device 18. [Figure 5B] 11 is a diagram illustrating a cover 320 and a shielding member 350. FIG. [Figure 5C] FIG. 2 is a plan view of the pressure sensor device 18. [Figure 5D] 5D is a partial cross-sectional view taken along the line EE in FIG. 5C. [Figure 5E] 5D is a partial cross-sectional view taken along the line FF in FIG. 5C. [Figure 6] 5B is a cross-sectional view of the sensor 310a of FIG. 5A along the line DD. [Figure 7A] FIG. 2 is an exploded perspective view of the pressure sensor device 19. [Figure 7B] 4 is a diagram for explaining a second member 402. FIG. [Figure 7C] FIG. 2 is a plan view of the pressure sensor device 19. [Figure 7D] 7D is a partial cross-sectional view taken along line GG in FIG. 7C. [Figure 7E] 7D is a partial cross-sectional view taken along line HH in FIG. 7C. [Figure 8] FIG. 2 is a diagram illustrating an example of a sensor 22. [Figure 9] 1 is a diagram showing an example of a pressure sensor device 15 using a sensor 22. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] At least the following matters will become apparent from the description of this specification and the accompanying drawings. In addition, the same or equivalent components, members, etc. shown in each drawing are denoted by the same reference numerals, and duplicated descriptions will be omitted as appropriate.

[0011] =====Typical Pressure Sensor Device====== FIG. 1A is a perspective view of a general pressure sensor device 10, and FIG. 1B is a partial cross-sectional view taken along line AA in FIG. 1A.

[0012] <<Definition of direction etc.>> First, with reference to Fig. 1A, directions and the like in the pressure sensor device 10 are defined. In the longitudinal direction of the substrate 20 on a plane, the direction from the left to the right on the paper is defined as the "+X direction", and the opposite direction (i.e., the direction from the right to the left on the paper in the longitudinal direction of the substrate 20) is defined as the "-X direction".

[0013] In the width direction of substrate 20, the direction from the back of the paper to the front is defined as the "+Y direction", and the opposite direction (i.e., in the width direction of substrate 20, the direction from the front of the paper to the back) is defined as the "-Y direction". In addition, the direction perpendicular to substrate 20, pointing upward on the paper, is defined as the "+Z direction", and the opposite direction (i.e., the direction perpendicular to substrate 20, pointing downward) is defined as the "-Z direction".

[0014] Both the +X and -X directions are sometimes simply referred to as the "X direction." Similarly, both the +Y and -Y directions are sometimes simply referred to as the "Y direction." Furthermore, both the +Z and -Z directions are sometimes simply referred to as the "Z direction."

[0015] In Fig. 1A, in order to facilitate understanding of directions in the pressure sensor device 10, the +X direction, +Y direction, and +Z direction are each represented by a line segment with an arrow. In the following description, the +X direction may be referred to as the "right direction", the -X direction may be referred to as the "left direction", and the X direction may be referred to as the "left-right direction". The +Y direction may be referred to as the "front direction (or forward)", the -Y direction may be referred to as the "rear direction (or rear)", and the Y direction may be referred to as the "front-rear direction". The +Z direction may be referred to as the "upper direction (or front surface direction)", the -Z direction may be referred to as the "lower direction (or rear surface direction)", and the Z direction may be referred to as the "upper direction" or "height direction".

[0016] The above definitions of directions and the like are also applicable to this specification unless otherwise specified.

[0017] <<Configuration of the pressure sensor device 10>> The pressure sensor device 10 is a device for measuring the pressure of gas exchanged through a tube 11, and includes a substrate 20 and a sensor 21. The substrate 20 is a member having the sensor 21 attached to its upper surface (hereinafter, may be appropriately referred to as the "front surface"). On the substrate 20, for example, a pattern wiring for applying a power supply voltage to the sensor 21, a pattern wiring for transmitting a signal from the sensor 21, and a ground pattern (not shown) are formed.

[0018] The sensor 21 is a device that measures the pressure of the gas flowing in or out through the tube 11, and includes, for example, a package 30, a measuring portion 31, a terminal 32, a protective member 33, and a cap 34, as shown in FIG.

[0019] The package 30 is a member made of, for example, resin, in which a recess for accommodating the measuring unit 31 (described later) is formed. The terminal 32 is a metal member equivalent to a so-called lead frame, and electrically connects between a semiconductor chip 51 (described later) included in the measuring unit 31 and the substrate 20 via a wire 53 (described later). The package 30 corresponds to a "container" that accommodates the semiconductor chip 51 (i.e., the semiconductor substrate).

[0020] The protective member 33 is a protective gel that protects the semiconductor chip 51 and wires 53 of the measurement unit 31. Note that, for example, a silicone gel is used as the protective member 33, but fluorine gel or the like may also be used. The cap 34 is a member that covers the package 30 and to which the tube 11 is attached, and is made of, for example, a resin. The cap 34 includes a lid portion 40 that has a circular shape in a plan view seen from above (in the +Z direction), and an introduction pipe 41 into which the tube 11 is inserted.

[0021] The introduction pipe 41 is a cylindrical part extending upward at approximately the center of the circular lid part 40. Here, a hole 42 is formed on the inside of the introduction pipe 41, so that gas can flow into or out of the inside of the cap 34 through the hole 42.

[0022] In addition, here, cap 34 is attached to package 30 with an adhesive (not shown) or the like so that when hole 42 is blocked, the space inside sensor 21 formed by package 30 and cap 34 (hereinafter, space S1) is sealed.

[0023] <<Details of measuring unit 31>> The measuring unit 31 is a part that is housed in a recess formed in the package 30 and measures the absolute pressure inside the sensor 21, and is configured to include a semiconductor chip 51 on which a diaphragm 50 is formed, a base 52, and wires 53. Here, the "absolute pressure" is a pressure based on the vacuum pressure. After being housed in the recess of the package 30, the measuring unit 31 is fixed with an adhesive 61.

[0024] The semiconductor chip 51 is a silicon chip having a diaphragm 50 and a bridge circuit (not shown) including a plurality of piezoresistors formed on the diaphragm 50. The base 52 is a member (e.g., a glass member) that supports the semiconductor chip 51, and the semiconductor chip 51 and the base 52 are anodically bonded. Here, the vacuum space between the semiconductor chip 51 and the base 52 serves as a vacuum reference chamber 60. The semiconductor chip 51 corresponds to a "semiconductor substrate."

[0025] The wires 53 are metal members (so-called bonding wires) that connect between pads (not shown) on the front surface of the semiconductor chip 51 and the terminals 32.

[0026] Incidentally, in such a pressure sensor device 10, when the tube 11 is attached to the introduction pipe 41, a downward force (-Z direction) is applied to the cap 34 including the introduction pipe 41. As a result, the force may also be applied to the terminal 32 and the measurement part 31, which may deteriorate the measurement accuracy of the pressure sensor device 10. Hereinafter, a pressure sensor device of this embodiment that can prevent deterioration of the measurement accuracy will be described.

[0027] =====This embodiment===== <<<Pressure sensor device 15>>> Fig. 3A is a perspective view of the pressure sensor device 15, and Fig. 3B is a partial cross-sectional view taken along line BB in Fig. 3A. The pressure sensor device 15 includes a substrate 100, a sensor 21, a cover 110a, and a screw 150. Note that the sensor 21 of the pressure sensor device 15 has been described above, and therefore a detailed description thereof will be omitted here.

[0028] The substrate 100 is a member similar to the substrate 20, and has a sensor 21 attached to its front surface and a plurality of wiring patterns formed thereon. As shown in the enlarged view at the bottom right of FIG. 3B, the substrate 100 has an opening 101 formed therein that corresponds to a screw 150 (described later).

[0029] The cover 110a is attached from above to the front surface of the substrate 100 to form an accommodation space S2 (described in detail later) that accommodates the sensor 21. The cover 110a includes a ceiling portion 111, an introduction pipe 112, a wall portion 113a, an attachment portion 114, and a slit 115.

[0030] The ceiling portion 111 is a plate-like portion corresponding to the ceiling portion of the cover 110a. A cylindrical inlet pipe 112 extending upward is formed in the approximate center of the ceiling portion 111 in a plan view seen from above. A hole 120 is formed on the inside of the inlet pipe 112, and gas is exchanged between the storage space S2 and the external space through the hole 120.

[0031] A wall portion 113a extending downward is formed on the rear surface of the ceiling portion 111. Specifically, on the rear surface of the ceiling portion 111, a cylindrical wall portion 113a is formed so as to surround the sensor 21.

[0032] Furthermore, at each of the left and right ends of the rear surface of the ceiling portion 111, mounting portions 114 for mounting the cover 110a to the substrate 100 extend downward from the rear surface of the ceiling portion 111. As shown in the enlarged view at the bottom right of Fig. 3B, a screw hole 121 corresponding to a screw 150 (described later) is formed in the mounting portion 114. Furthermore, a slit 115 is formed between the wall portion 113a and the mounting portion 114 from the lower side of the cover 110a toward the upper side.

[0033] Here, in the pressure sensor device 15, before the cover 110a is attached to the substrate 100, an adhesive 122, for example, is applied to the lower end of the wall portion 113a as a so-called "seal". In this embodiment, the sensor 21 of the substrate 100 is located inside the cylindrical wall portion 113a, and the cover 110a is arranged so that the center of the opening 101 and the center of the opening of the screw hole 121 coincide with each other.

[0034] Then, the screws 150 are inserted into the screw holes 121 through the openings 101 from the rear surface side of the substrate 100, and the cover 110a and the substrate 100 are fixed by the screws 150. As a result, the cover 110a is attached to the substrate 100. When the cover 110a is attached to the substrate 100 (when fixed by the screws 150), the adhesive 122 fills the gap between the wall portions 113a and the substrate 100.

[0035] Therefore, in this embodiment, when the hole 120 is closed, the adhesive 122 isolates the inside and outside of the storage space S2 so that the storage space S2 is sealed when the hole 120 is closed. Note that the "storage space S2" is a space surrounded by the ceiling portion 111, the wall portion 113a, the adhesive 122, and the substrate 100.

[0036] 1A, a tube (not shown) is attached to the introduction pipe 112 of the cover 110a of the pressure sensor device 15. In this embodiment, the cover 110a is in direct contact with the substrate 100, but is not in direct contact with the sensor 21. Therefore, no force is directly applied to the sensor 21 through the cover 110a, and the pressure sensor device 15 of this embodiment can accurately measure the absolute pressure of the accommodation space S2.

[0037] In addition, in this embodiment, since the slit 115 is provided between the wall portion 113a and the mounting portion 114, it is possible to reduce the force transmitted from the mounting portion 114 toward the wall portion 113a when the screw 150 is inserted into the screw hole 121 of the mounting portion 114. Therefore, when the cover 101a is fixed to the substrate 100, the effect on the sensor 21 can be suppressed.

[0038] The adhesive 122 corresponds to a "shielding member" for sealing the accommodation space S2 when the hole 120 is closed.

[0039] <<<Pressure sensor device 16>>> The pressure sensor device 16 is a device that uses an O-ring 126 as a "seal" instead of the adhesive 122 of the pressure sensor device 15, and is configured to include a substrate 100, a sensor 21, a cover 110b, and a screw 150, as shown in Figures 3A and 3C. Note that when comparing the pressure sensor device 16 with the pressure sensor device 15, the devices are the same except for the cover 110b and the O-ring 126, so only the cover 110b and the O-ring 126 will be described here.

[0040] Cover 110b is a member similar to cover 110a, and is attached from above to the front surface of substrate 100 to form housing space S3 that houses sensor 21. Cover 110b includes a ceiling portion 111, an introduction pipe 112, a wall portion 113b, an attachment portion 114, and a slit 115. Comparing cover 110b and cover 110a, they are the same except for wall portion 113b, so here, wall portion 113b will be described.

[0041] The wall portion 113b is a member extending downward from the back surface of the ceiling portion 111. In this embodiment, the cylindrical wall portion 113b is formed on the back surface of the ceiling portion 111 so as to surround the sensor 21. A groove 125 is formed on the lower end of the wall portion 113b. An O-ring 126 made of resin is fitted into the groove 125.

[0042] When the cover 110b is attached to the substrate 100 (when fixed with the screw 150), the O-ring 126 fills the gap between the wall 113b and the substrate 100. Therefore, in this embodiment, when the hole 120 is closed, the O-ring 126 shields the inside of the storage space S3 from the outside so that the storage space S3 is sealed. Note that the "storage space S3" is a space surrounded by the ceiling 111, the wall 113b, the O-ring 126, and the substrate 100.

[0043] 1A, a tube (not shown) is attached to the introduction pipe 112 of the cover 110b of the pressure sensor device 16. In this embodiment, the cover 110b is in direct contact with the substrate 100, but is not in direct contact with the sensor 21. Therefore, no force is directly applied to the sensor 21 through the cover 110b, and the pressure sensor device 16 of this embodiment can accurately measure the absolute pressure in the accommodation space S3.

[0044] In this embodiment, since the slit 115 is provided between the wall portion 113b and the mounting portion 114, it is possible to reduce the force transmitted from the mounting portion 114 toward the wall portion 113b when the screw 150 is inserted into the screw hole 121 of the mounting portion 114. Therefore, when the cover 110b is fixed to the substrate 100, the effect on the sensor 21 can be suppressed.

[0045] The O-ring 126 corresponds to a "shielding member" for sealing the accommodation space S3 when the hole 120 is closed.

[0046] <<<Pressure sensor device 17>>> Fig. 4A is a perspective view of the pressure sensor device 17, Fig. 4B is a plan view of the pressure sensor device 17, and Fig. 4C is a partial cross-sectional view taken along line CC in Fig. 4B. The pressure sensor device 17 includes a substrate 100, a sensor 21, a cover 140, and a screw 150. Comparing the pressure sensor device 17 with the pressure sensor device 15 in Fig. 3A, the components are the same except for the cover 140, so the following description will focus on the cover 140. Note that, for convenience, the adhesive 205 is omitted from Fig. 4B.

[0047] The cover 140 is attached from above to the front surface of the substrate 100 to form an accommodation space S4 (described in detail later) that accommodates the sensor 21. The cover 140 includes a first member 200, a second member 201, connection portions 202a to 202d, an attachment portion 203, and a slit 204.

[0048] The first member 200 is a member that covers the sensor 21 from above and forms an accommodation space S4 that accommodates the sensor 21, and is configured to include a ceiling portion 210, an introduction pipe 211, and a wall portion 212. The ceiling portion 210 is a plate-shaped portion that corresponds to the ceiling portion of the first member 200. A cylindrical introduction pipe 211 that extends upward is formed in the approximate center of the ceiling portion 210 in a plan view seen from above.

[0049] Furthermore, since a hole 230 is formed on the inside of the introduction pipe 211, gas is exchanged between the accommodation space S4 and the outside space via the hole 230.

[0050] A cylindrical wall portion 212 extending downward is formed from the rear surface of the ceiling portion 210. Specifically, the wall portion 212 is formed on the rear surface of the ceiling portion 210 so as to surround the sensor 21.

[0051] The second member 201 is a cylindrical member that surrounds the first member 200. Therefore, a gap is generated between the first member 200 and the second member 201. The height of the second member 201 from the front surface of the substrate 100 is lower than the height of the first member 200 from the front surface of the substrate 100.

[0052] 4A, the connecting portion 202a is a member that connects the first member 200 and the second member 201 on the right surface of the first member 200. The connecting portion 202b connects the first member 200 and the second member 201 on the front surface of the first member 200, and the connecting portion 202c connects the first member 200 and the second member 201 on the left surface of the first member 200. In addition, the connecting portion 202d connects the first member 200 and the second member 201 on the rear surface of the first member 200.

[0053] The attachment portions 203 are portions for attaching the cover 140 to the substrate 100, and are formed at each end in the left and right direction of the second member 201. The attachment portions 203 are formed with screw holes 231 corresponding to screws 150 (described later). In this embodiment, a slit 204 is formed between the second member 201 and the attachment portions 203 from the lower side of the cover 140 toward the upper side.

[0054] In this embodiment, the sensor 21 of the substrate 100 is located inside the cylindrical wall portion 212, and the cover 140 is arranged so that the center of the opening 101 and the center of the opening of the screw hole 231 coincide with each other.

[0055] Then, the screws 150 are inserted into the screw holes 231 from the rear surface side of the substrate 100 through the openings 101, and the cover 140 and the substrate 100 are fixed together by the screws 150. As a result, the cover 140 is attached to the substrate 100.

[0056] Here, as described above, a gap occurs between the first member 200 and the second member 201. In this embodiment, when the adhesive 205 is filled between the first member 200 and the second member 201 (the gap), the adhesive 205 can fill the gap between the first member 200 and the second member 201. Note that the adhesive 205 in this embodiment is, for example, a potting material made of silicone resin, but is not limited thereto and may be a potting material made of urethane resin or epoxy resin.

[0057] The connection portions 202a to 202d are provided at positions spaced apart from the substrate 100 when the cover 140 is attached to the substrate 100. This allows the adhesive 205 to reliably fill in the gap between the first member 200 and the second member 201.

[0058] In addition, the adhesive 205 of this embodiment isolates the inside and outside of the storage space S4 so that the storage space S4 is sealed when the hole 230 is closed. Note that the "storage space S4" is a space surrounded by the inside of the first member 200, the adhesive 205, and the substrate 100.

[0059] 1A, a tube (not shown) is attached to the introduction pipe 211 of the cover 140 of the pressure sensor device 17. In this embodiment, the cover 140 is in direct contact with the substrate 100, but is not in direct contact with the sensor 21. Therefore, no force is directly applied to the sensor 21 through the cover 140, and the pressure sensor device 17 of this embodiment can accurately measure the absolute pressure in the accommodation space S4.

[0060] In this embodiment, since the slit 204 is provided between the second member 201 and the mounting portion 203, when the screw 150 is inserted into the screw hole 231 of the mounting portion 203, the force transmitted from the mounting portion 203 toward the first member 200 can be reduced. Therefore, when the cover 140 is fixed to the substrate 100, the effect on the sensor 21 can be suppressed.

[0061] The adhesive 205 corresponds to a "shielding member" for sealing the accommodation space S4 when the hole 230 is closed.

[0062] <<<Pressure sensor device 18>>> Fig. 5A is an exploded perspective view of the pressure sensor device 18, and Fig. 5B is a diagram for explaining a cover 320 and a shielding member 350 of the pressure sensor device 18. Fig. 5C is a plan view of the pressure sensor device 18, Fig. 5D is a cross-sectional view taken along line EE in Fig. 5C, and Fig. 5E is a cross-sectional view taken along line FF in Fig. 5C.

[0063] The pressure sensor device 18 is a device capable of measuring absolute pressure in four spaces, and includes a substrate 300, screws 302a-302f, sensors 310a-310d, a cover 320, and a shielding member 350. The substrate 300 is a member having the sensors 310a-310d attached to its front surface. On the substrate 300, for example, pattern wiring for applying a power supply voltage to the sensors 310a-310d, pattern wiring for transmitting signals from the sensors 310a-310d, and a ground pattern (not shown) are formed.

[0064] Furthermore, openings 301a to 301f corresponding to screws 302a to 302f (described later), respectively, are provided in the substrate 300. The screws 302a to 302f are members for fixing the substrate 300 to the cover 320.

[0065] <Sensor 310a> The sensor 310a measures the pressure (here, absolute pressure) of the gas flowing in or out through the introduction pipe 321a (described later). FIG. 6 is a cross-sectional view taken along line D-D in FIG. 5A, and the sensor 310a includes the measuring unit 31, the package 500, the terminal 510, the protective member 520, and the cap 530. The measuring unit 31 used in the sensor 310a in FIG. 6 has the same configuration as that shown in FIG. 2, for example. However, in FIG. 2, the measuring unit 31 is housed in a recessed portion on the lower side of the package 30 so that the pressure of the gas above the measuring unit 31 can be measured. In FIG. 6, the measuring unit 31 is housed in a recessed portion on the upper side of the package 500 so that the pressure of the gas below the measuring unit 31 can be measured.

[0066] The package 500 is, for example, a resin member having a recess formed therein for accommodating the measuring unit 31. The terminal 510 is a metal member (so-called lead frame) similar to the terminal 32 in Fig. 2, and electrically connects the semiconductor chip 51 included in the measuring unit 31 to the substrate 300 together with the wire 53. The package 500 corresponds to a "container" for accommodating the semiconductor chip 51 (i.e., the semiconductor substrate).

[0067] The protective member 520 is a protective gel that covers the measurement unit 31 and protects the semiconductor chip 51 and wires 53 of the measurement unit 31. The cap 530 is a member that covers the lower opening of the package 30, and is made of, for example, resin.

[0068] An opening 531 for measuring pressure is provided approximately near the center of the cap 530. Therefore, the sensor 310a in Fig. 6 can measure the pressure of the gas from below the sensor 310a. Note that, although the sensor 310a includes the cap 530 here, the present invention is not limited to this and may not include the cap 530. Even in such a case, the sensor 310a can appropriately measure the pressure of the gas.

[0069] The sensors 310b to 310d are devices that measure the absolute pressure of gas flowing in or out via inlet pipes 321b to 321d (described later), respectively. The configurations of the sensors 310b to 310d are similar to that of the sensor 310a, and therefore detailed description thereof will be omitted here. <Cover 320> 5A is attached from above to the front surface of the substrate 300 to form storage spaces S10-S13 (described in detail later) that store the sensors 310a-310d, respectively. As shown in FIGS. 5A and 5B, the cover 320 has a substantially rectangular parallelepiped shape and includes introduction pipes 321a-321d, screw holes 322a-322f, a wall portion 323, and partition portions 324a-324c.

[0070] The introduction pipe 321a is a portion where a hole 330a communicating with the storage space S10 (described later) is formed, and is provided on the front side surface of the cover 320. Similarly to the introduction pipe 321a, the introduction pipes 321b to 321d are portions where holes 330b to 330d communicating with the storage spaces S11 to S13 (described later) are formed, respectively, and are provided on the front side surface of the cover 320.

[0071] The screw holes 322a to 322f are holes that correspond to the openings 301a to 301f of the board 300 when the cover 320 is attached to the board 300, and the screws 302a to 302f are inserted into the screw holes 322a to 322f, respectively.

[0072] Wall portion 323 is a portion surrounding a recess formed on the rear surface of cover 320, and a space surrounded by wall portion 323 is partitioned by three partition portions 324a to 324c. As a result, the space surrounded by wall portion 323 is divided into four spaces by the three partition portions 324a to 324c.

[0073] In this embodiment, the "accommodating space S10" is surrounded by the inside of the cover 320, a part 351a (described later) corresponding to an O-ring, and the substrate 300, and is the rightmost space among the four spaces described above. The "accommodating space S11" is surrounded by the inside of the cover 320, a part 351b (described later) corresponding to an O-ring, and the substrate 300, and is the second space from the right among the four spaces described above.

[0074] Moreover, "accommodating space S12" is surrounded by the inside of cover 320, part 351c (described later) corresponding to an O-ring, and substrate 300, and is the third space from the right (i.e., the second space from the left) among the four spaces described above. "Accommodating space S13" is surrounded by the inside of cover 320, part 351d (described later) corresponding to an O-ring, and substrate 300, and is the leftmost space among the four spaces described above.

[0075] In this manner, in this embodiment, the recess formed on the rear surface of the cover 320 is partitioned by the three partition walls 324a to 324c, thereby forming four storage spaces S10 to S13.

[0076] <Shielding member 350> The shielding member 350 is a member (seal) for sealing the storage spaces S10 to S13. As shown in Fig. 5B, the shielding member 350 of this embodiment has four portions 351a to 351d corresponding to O-rings. The portion 351a is a portion for sealing the storage space S10, and the portion 351b is a portion for sealing the storage space S11. The portion 351c is a portion for sealing the storage space S12, and the portion 351d is a portion for sealing the storage space S13.

[0077] In this embodiment, each of the four portions 351a to 351d has a substantially square shape in a plan view seen from above. The portions 351a and 351b share a side between them, thereby forming a portion 352 that is common to both of them. The portions 351b and 351c share a side between them, thereby forming a portion 353 that is common to both of them, and the portions 351c and 351d share a side between them, thereby forming a portion 354 that is common to both of them.

[0078] In this embodiment, for example, the sensor 310a corresponds to a "first sensor", and the sensor 310b corresponds to a "second sensor". The accommodation space S10 corresponds to a "first accommodation space", and the accommodation space S11 corresponds to a "second accommodation space". The hole 330a corresponds to a "first hole", and the hole 330b corresponds to a "second hole". Furthermore, the portion 351a of the shielding member 350 for sealing the accommodation space S10 corresponds to a "first portion", and the portion 351b of the shielding member 350 for sealing the accommodation space S11 corresponds to a "second portion". Furthermore, the portions 351a and 351b have a common portion 352.

[0079] <Installation of cover 320 and storage space> In this embodiment, the cover 320 is attached to the board 300 with the shielding member 350 fitted into a groove (described later) on the back surface of the cover 320. Specifically, with the cover 320 temporarily fixed to the board 300 by the claws of the cover 320, the screws 302a-302f are inserted into the openings 301a-301f and the screw holes 322a-322f.

[0080] 5D, the portion 352 of the shielding member 350 will be described. In the present embodiment, a groove 360 ​​is formed in the partition portion 324a of the cover 320, into which the portion 352 of the shielding member 350 is fitted. When the cover 320 is attached to the substrate 300 with the portion 352 fitted in the groove 360, the portion 352 of the shielding member 350 fills the gap between the partition portion 324a and the substrate 300.

[0081] Here, the gap between the partition 324a and the substrate 300 has been described, but the same is true for other locations (for example, the gap between the partition 324b and the substrate 300, and the gap between the partition 324c and the substrate 300) because grooves 360 are formed and the shielding members 350 are fitted in them. Moreover, since the grooves 360 are also formed in the wall 323, the shielding members 350 also fill the gap between the wall 323 and the substrate 300. Therefore, in this embodiment, when the holes 330a-330d of the introduction pipes 321a-321d are closed, the accommodation spaces S10-S13 are sealed.

[0082] 1A, tubes (not shown) are attached to the introduction pipes 321a-321d of the cover 320 of the pressure sensor device 18. In this embodiment, the cover 320 is in direct contact with the substrate 300, but is not in direct contact with the sensors 310a-310d. Therefore, no force is directly applied to the sensors 310a-310d via the cover 320, and the pressure sensor device 18 of this embodiment can accurately measure the absolute pressures in the accommodation spaces S10-S13.

[0083] Although one shielding member 350 is used here, for example, four O-rings with four separate parts 351a-351d may be used. However, using four O-rings requires a large space in the left-right direction. In this embodiment, because the shielding member 350 has shared parts 352-354, space saving can be achieved even when four sensors 310a-310d are arranged in the left-right direction.

[0084] 5E, in the pressure sensor device 18, the sensor 310a is arranged so that the semiconductor chip 51 is not positioned on an extension of the central axis A0 of the hole 330a (here, the central axis of the opening of the introduction pipe 321a in which the hole 330a is formed). This makes it possible to suppress the influence on the semiconductor chip 51 even if dust or the like gets into the hole 330a. Also, by arranging the sensor 310a in this way, for example, the sensor 310a can be operated stably without providing a cap 530 for the sensor 310a, thereby reducing costs.

[0085] 6, when the semiconductor chip 51 of the sensor 310a is accommodated in the package 500, it is located between the package 500 and the substrate 300. Even if dust or the like gets inside the accommodation space S10, the dust is unlikely to rise from the substrate 300 side (lower side) and affect the semiconductor chip 51. Therefore, the pressure sensor device 18 can measure the absolute pressure in the accommodation space S10 without being affected by dust or the like.

[0086] <<<Pressure sensor device 19>>> Fig. 7A is an exploded perspective view of the pressure sensor device 19, Fig. 7B is a diagram for explaining a first member 401 and a second member 402, and Fig. 7C is a plan view of the pressure sensor device 19. Fig. 7D is a partial cross-sectional view taken along line GG in Fig. 7C, and Fig. 7E is a partial cross-sectional view taken along line HH in Fig. 7C.

[0087] The pressure sensor device 19 is a device capable of measuring the absolute pressure of four spaces, and includes a substrate 300, screws 302a-302f, sensors 310a-310d, a cover 400, and an adhesive 410. Note that the substrate 300, screws 302a-302f, and sensors 310a-310d are the same as those in the pressure sensor device 18, so the following description will focus on the cover 400 and the adhesive 410. Details will be described later, but for example, in FIG. 7A, the adhesive 410 has a predetermined shape, which shows the liquid adhesive 410 in a solidified state.

[0088] <Cover 400> The cover 400 is attached from above to the front surface of the substrate 300 to form accommodation spaces S20-S23 (described in detail later) for accommodating the sensors 310a-310d, respectively. The cover 400 includes first members 401a-401d having a hollow space, a second member 402, connection parts 403a-403d, 404a-404d, and introduction pipes 421a-421d.

[0089] The "accommodating space S20" is a space surrounded by the inside of the first member 401a, the adhesive 410 (described later), and the substrate 300, and the "accommodating space S21" is a space surrounded by the inside of the first member 401b, the adhesive 410, and the substrate 300. The "accommodating space S22" is a space surrounded by the inside of the first member 401c, the adhesive 410, and the substrate 300, and the "accommodating space S23" is a space surrounded by the inside of the first member 401d, the adhesive 410, and the substrate 300.

[0090] The first member 401a is a member that covers the sensor 310a arranged on the substrate 300 and forms an accommodation space S20 in which the sensor 310a is accommodated (i.e., a member having a hollow space inside) (see, for example, FIG. 7B). Similar to the first member 401a, the first members 401b to 401d are members that form accommodation spaces S21 to S23 in which the sensors 310b to 310d are accommodated, respectively.

[0091] The second member 402 has a substantially rectangular parallelepiped shape and is a member having an opening formed in the center in a plan view that surrounds the first members 401a to 401d. On the front side surface of the second member 402, introduction pipes 421a to 421d are provided so that the storage spaces S20 to S23 can communicate with the outside.

[0092] The introduction pipe 421a has a hole 430a formed therein that communicates with the accommodation space S20. Similarly to the introduction pipe 421a, the introduction pipes 421b to 421d have holes 430b to 430d formed therein that communicate with the accommodation spaces S21 to S23. The second member 402 has, on its rear surface, screw holes 322a to 322f formed therein that correspond to the screws 302a to 302f, respectively.

[0093] The connecting portion 403a is a member that connects the first member 401a and the second member 402 on the front surface of the first member 401a. The connecting portion 404a is a member that connects the first member 401a and the second member 402 on the rear surface of the first member 401a. Here, the connecting portion 403a has a cylindrical shape that communicates with the hole 430a of the introduction pipe 421a. Therefore, the connecting portion 403a substantially corresponds to the introduction pipe 421a.

[0094] Although not shown here for convenience, the connection parts 403b to 403d are the same as the connection part 403a, and the connection parts 404b to 404d are the same as the connection part 404a. That is, the connection parts 403b and 404b connect the first member 401b and the second member 402, the connection parts 403c and 404c connect the first member 401c and the second member 402, and the connection parts 403d and 404d connect the first member 401d and the second member 402. In the following, the four connection parts 403a to 403d may be collectively referred to as the connection part 403, and the four connection parts 404a to 404d may be collectively referred to as the connection part 404. Therefore, the connection part 403 in this embodiment corresponds to a "pipe".

[0095] 4A to 4C, the pressure sensor device 19 has gaps between the first members 401a to 401d and the second member 402. In this embodiment, when the adhesive 410 is filled between the first members 401a to 401d and the second member 402 (gaps), the adhesive 410 can fill the gaps between the first members 401a to 401d and the second member 402. The adhesive 410 in this embodiment is, for example, a potting material made of silicone resin, like the adhesive 205 described above.

[0096] Furthermore, in this embodiment, the connection portions 403, 404 are provided at positions away from the substrate 300 when the cover 400 is attached to the substrate 300. This allows the adhesive 410 to reliably fill the gaps between the four first members 401a-401d and the second member 402. In this manner, the adhesive 410 of this embodiment isolates the inside and outside of the storage spaces S20-23 such that the storage spaces S20-23 are sealed when the holes 430a-430d are blocked.

[0097] 1A, tubes (not shown) are attached to the introduction pipes 421a-421d of the cover 400 of the pressure sensor device 19. In this embodiment, the cover 400 is in direct contact with the substrate 300 but is not in direct contact with the sensors 310a-310d. Therefore, no force is directly applied to the sensors 310a-310d via the cover 400, and the pressure sensor device 19 of this embodiment can accurately measure the absolute pressures in the accommodation spaces S20-23.

[0098] 7E, in the pressure sensor device 19, the sensor 310a is arranged so that the semiconductor chip 51 is not positioned on an extension of the central axis A1 of the hole 430a (here, the central axis of the opening of the introduction pipe 421a in which the hole 430a is formed). This makes it possible to suppress the influence on the semiconductor chip 51 even if dust or the like gets into the hole 430a. Also, by arranging the sensor 310a in this way, for example, the sensor 310a can be operated stably without providing a cap 530 for the sensor 310a, thereby reducing costs.

[0099] <<<Other embodiments of the pressure sensor device 15>>> 2 is provided with a cap 34, but when the sensor 21 is used in the pressure sensor devices 15 to 17, the tube is attached to the introduction pipe of the cover, so that it is not necessarily required to provide the cap 34. For example, as shown in FIG. 8, a sensor 22 without the cap 34 may be used.

[0100] Fig. 9 is an example of a partial cross-sectional view of the pressure sensor device 15 when a sensor 22 without a cap 34 is used. In Fig. 9, the position of the inlet pipe 112 is moved to an end (e.g., the left end) of the ceiling portion 111, so that the semiconductor chip 51 is not positioned on an extension line of the central axis A2 of the hole 120 (the central axis of the opening of the inlet pipe 112 in which the hole 120 is formed). Therefore, even if dust or the like enters the accommodation space S2 through the hole 120 of the pressure sensor device 15 shown in Fig. 9, the dust is unlikely to directly hit the measurement unit 31 (particularly the semiconductor chip 51).

[0101] In this way, by moving the position of the inlet pipe 112 to the end of the ceiling portion 111 (for example, the left end), the semiconductor chip 51 is positioned so that it is not positioned on the extension line of the central axis A2 of the hole 120, and deterioration of measurement accuracy can be prevented.

[0102] For convenience, the sensor 22 without the cap 34 has been described as an example here, but the same applies to the sensor 21 in Fig. 3B. By omitting the cap 34, the cost of the sensor 22 can be reduced compared to the sensor 21.

[0103] ===Summary=== The pressure sensor devices 15 to 19 of the present embodiment have been described above. For example, in the pressure sensor device 15 shown in Fig. 3B, a tube is attached to the inlet pipe 112 of the cover 110a. In such an embodiment, when the tube is attached to the cover 110a, no force is directly applied from the cover 110a to the sensor 21 in the accommodation space S2. Therefore, the pressure sensor device 15 can prevent the measurement accuracy of the sensor 21 from deteriorating.

[0104] Also, for example, an adhesive 122 and an O-ring 126 can be used as a "seal" as shown in the pressure sensor devices 15 and 16. By using such a seal, the accommodation spaces S2 and S3 can be sealed.

[0105] For example, the cover 110a of the pressure sensor device 15 has an attachment portion 114 provided on the outer side of the wall portion 113a. By using such an attachment portion 114, the cover 110a can be attached to the substrate 100 easily.

[0106] 3B, an opening 101 is formed in the substrate 100, and a screw hole 121 is formed in the attachment portion 114. Then, the cover 110a and the substrate 100 are fixed together by using a screw 150 corresponding to the opening 101 and the screw hole 121.

[0107] In addition, in the pressure sensor device 15, a slit 115 is formed between the wall portion 113a and the mounting portion 114. Therefore, when the cover 110a is attached to the substrate 100 with the screws 150, it is possible to prevent the force from being transmitted to the sensor 21 side, and therefore it is possible to prevent the measurement accuracy of the sensor 21 from being deteriorated.

[0108] The pressure sensor device 17 includes a first member 200 and a second member 201 surrounding the first member. , and includes connection portions 202a-202d that connect the first member 200 and the second member 201. In such a configuration, an accommodation space S4 that accommodates the sensor 21 can be formed by filling the gap between the first member 200 and the second member 201 with adhesive 205 (here, a potting material). In such a pressure sensor device 17, when the tube is attached to the cover 140, no force is directly applied from the cover 140 to the sensor 21 in the accommodation space S4. Therefore, the pressure sensor device 17 can prevent the measurement accuracy of the sensor 21 from deteriorating.

[0109] Moreover, the pressure sensor device 17 is provided with an attachment portion 203 on the outer side of the second member 201. By using such an attachment portion 203, the cover 140 can be easily attached to the substrate 100.

[0110] Moreover, the cover 140 is attached to the substrate 100 using screws 150 that correspond to the screw holes 231 of the attachment portion 203 .

[0111] In addition, in the pressure sensor device 17, a slit 204 is formed between the second member 201 and the mounting portion 203. Therefore, when the cover 140 is attached to the substrate 100 with the screw 150, the force can be prevented from being transmitted to the sensor 21 side, and therefore the measurement accuracy of the sensor 21 can be prevented from being deteriorated.

[0112] 7D, the connection part 403a is a part of the introduction pipe 421a. By using such a connection part 403a, the first member 401a and the second member 402 can be reliably connected to each other, and the accommodation space S20 can be communicated with the outside.

[0113] 5E, 7E, and 9, in this embodiment, the semiconductor chip 51 is not positioned on an extension line of the axes A0 to A2. This makes it possible to prevent the semiconductor chip 51 from being affected by dust or the like.

[0114] 6, for example, the package 500 that houses the semiconductor chip 51 is located above the semiconductor chip 51, and the substrate 300 to which the sensor 310a is attached is located below the semiconductor chip 51. That is, in this embodiment, the semiconductor chip 51 is located between the package 500 and the substrate 300. Therefore, even if there is no cap, it is possible to reduce the possibility that the semiconductor chip 51 will be affected by dust or the like.

[0115] Furthermore, the pressure sensor device 18 uses the shielding member 350 having the portion 352 common to the portions 351a and 351b. Therefore, even when a plurality of sensors 310 are arranged on the substrate 300, space can be saved.

[0116] The above-mentioned embodiment is for the purpose of facilitating understanding of the present invention, and is not intended to limit the present invention. Furthermore, the present invention can be modified or improved without departing from the spirit of the present invention, and it goes without saying that the present invention includes equivalents thereof. [Explanation of symbols]

[0117] 10,15~19 Pressure sensor device 11 Tube 20,100,300 boards 21, 22, 310a~310d Sensors 30,500 packages 31 Measuring part 32,510 terminals 33,520 Protective materials 34,530 Cap 50 Diaphragm 51 Semiconductor Chip 52 Pedestal 61,122,205 Adhesive 53 Wire 60 Vacuum reference chamber 110a, 110b, 320 Cover 111,210 Ceiling 112, 211, 321a~321d Inlet pipe 113a,113b,212,323 Wall part 114,203 Mounting part 115,204 Slit 120,230,330a~330d,430a~430d hole 121,322a~322f screw holes 125,360 grooves 126 O-ring 150,302a~302f Screw 200 First member 201 Second member 202a~202d Connection 324a~324c Partition part 350 Shielding material 351a~351d,352~354 parts S1~S4, S10~S13 Storage space

Claims

1. A substrate; a sensor provided on the substrate for measuring absolute pressure; a cover attached to the substrate and defining an accommodation space for accommodating the sensor; A shielding member; Equipped with the cover has a hole communicating the accommodation space with the outside of the accommodation space, The shielding member seals the accommodation space when the hole is closed. Pressure sensor device.

2. 2. The pressure sensor device according to claim 1, The cover is The ceiling and a wall portion located between the ceiling portion and the substrate and surrounding the accommodation space, The shielding member is a seal located between the wall portion and the substrate. Pressure sensor device.

3. The pressure sensor device according to claim 2, The cover is a mounting portion provided on the outer side of the wall portion as viewed from the storage space and attached to the board; Pressure sensor device.

4. The pressure sensor device according to claim 3, a screw for fixing the cover and the substrate; The substrate is provided with an opening corresponding to the screw; The mounting portion is provided with a screw hole corresponding to the screw. Pressure sensor device.

5. The pressure sensor device according to claim 4, The cover has a slit between the wall portion and the mounting portion. Pressure sensor device.

6. 2. The pressure sensor device according to claim 1, The cover is A first member that forms the accommodation space; A second member surrounding the first member; A connection portion that connects the first member and the second member; Equipped with the connection portion is provided at a position spaced apart from the board when the cover is attached to the board, The shielding member is a member filled between the first member and the second member. Pressure sensor device.

7. 7. The pressure sensor device according to claim 6, The cover is a mounting portion provided on the outer side of the second member as viewed from the first member and attached to the substrate; Pressure sensor device.

8. The pressure sensor device according to claim 7, a screw for fixing the cover and the substrate; The substrate is provided with an opening corresponding to the screw; The mounting portion is provided with a screw hole corresponding to the screw. Pressure sensor device.

9. The pressure sensor device according to claim 8, The cover has a slit between the second member and the mounting portion. Pressure sensor device.

10. 7. The pressure sensor device according to claim 6, The connection portion is a pipe in which the hole is formed. Pressure sensor device.

11. The pressure sensor device according to any one of claims 1 to 10, the sensor includes a semiconductor substrate; The sensor is disposed on the substrate such that the semiconductor substrate is not positioned on an extension line of a central axis of the hole. Pressure sensor device.

12. The pressure sensor device according to any one of claims 1 to 10, The sensor includes a semiconductor substrate and a housing portion in which the semiconductor substrate is housed, The semiconductor substrate is located between the housing portion and the substrate. Pressure sensor device.

13. A substrate; a first sensor provided on the substrate for measuring absolute pressure; a second sensor provided on the substrate for measuring absolute pressure; a cover attached to the substrate and defining a first accommodation space for accommodating the first sensor and a second accommodation space for accommodating the second sensor; A shielding member; Equipped with The cover is a first hole communicating the first accommodating space with an outside of the first accommodating space, and a second hole communicating the second accommodating space with an outside of the second accommodating space, The shielding member is a first portion that seals the first accommodation space when the first hole is closed, and a second portion that seals the second accommodation space when the second hole is closed, the first portion being located between the cover and the substrate; The first portion and the second portion have a common portion. Pressure sensor device.

Images