Support base separation method and method for manufacturing electronic component

Abstract

To provide a method for separating a support base in which a laminate obtained by sticking a support base to a substrate is used, the support base can be separated from the laminate by light irradiation, and the adhesion between the support base and the substrate is enhanced.SOLUTION: A method for separating a support base 11 from a laminate 10 in which a light-transmitting support base 11, a separation layer 12, an adhesive layer 14, and a substrate 16 are laminated in this order includes a step of irradiating a layer peripheral edge portion 12B with light from the support base 11 side to alter the layer peripheral edge portion 12B, thereby separating the support base 11 from the laminate 10. At least one surface of the separation layer 12 consists of a layer center portion 12A and the layer peripheral edge portion 12B having different adhesive strengths in a plan view. The layer peripheral edge portion 12B is a region that has a higher adhesive strength than the layer center portion 12A and is altered by light irradiation. The support base 11 and the adhesive layer 14 are stuck together via the layer peripheral edge portion 12B.SELECTED DRAWING: Figure 1D

Description

[Technical field]

[0001] The present invention relates to a method for separating a support base and a method for manufacturing an electronic component. [Background technology]

[0002] 2. Description of the Related Art In recent years, there has been a demand for higher integration, thinner size, and smaller size of semiconductor packages (electronic components) that include semiconductor elements. In order to miniaturize semiconductor packages, it is important to reduce the thickness of the substrate in which the elements are built in. However, when the substrate is made thinner, its strength decreases, and the substrate becomes more susceptible to breakage during the manufacture of the semiconductor package.

[0003] In response to this, a laminate in which a supporting base is bonded to a substrate is used. Finally, the supporting base is separated from this laminate to manufacture an electronic component. For example, a method has been proposed in the past in which a substrate and a light-transmitting supporting base are laminated together via at least a separation layer that is altered by irradiation with light, and the supporting base is separated from the laminate.

[0004] 5A to 5C are diagrams showing an example of a method for producing a laminate, and Fig. 5D is a diagram illustrating an operation for separating the support base from the laminate. First, a separation layer 52, which has a property of being altered by irradiation with light, is uniformly formed on a light-transmitting support base 51 (FIG. 5A). Next, an adhesive layer 54 and a substrate 56 are laminated in this order on the separation layer 52, and the support base 51 and the substrate 56 are bonded together via the separation layer 52 and the adhesive layer 54 (FIG. 5B). Next, the substrate 56 is processed to obtain the laminate 50. Here, an encapsulant layer 58 is provided so as to cover the entire substrate 56 (FIG. 5C). 5C is then turned upside down, and the entire surface of separation layer 52 is irradiated with synchrotron radiation (arrow) from the supporting base 51 side (FIG. 5D). This causes separation layer 52 to change in quality and decompose, so that processed substrate 56 and supporting base 51 are separated.

[0005] For example, Patent Document 1 discloses a method for successfully separating a supporting base from a laminate in a short time without damaging the substrate and supporting base. The method described in Patent Document 1 is characterized by including a light irradiation step in which at least a portion of the peripheral portion of the uniformly formed separation layer is irradiated with light through the support, thereby altering the separation layer in the irradiated area, and a separation step in which the support is held and lifted from the back side of the surface of the support facing the area where the separation layer has been altered, thereby forming a gap between the substrate and the support, which are stacked via the altered separation layer, and a fluid is sprayed from the gap toward the inside of the stack, thereby separating the support from the stack. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 6470414 Summary of the Invention [Problem to be solved by the invention]

[0007] However, the method described in Patent Document 1 and the like has a problem in that the adhesion between the substrate and the support is poor, and the support is likely to peel off from the substrate during processing. On the other hand, if an attempt is made to address the above problem by selecting a material for forming the separation layer to increase the adhesion between the substrate and the support, the support becomes difficult to separate from the laminate in the separation step.

[0008] The present invention has been made in consideration of the above circumstances, and has an object to provide a supporting base separation method that uses a laminate in which a supporting base is bonded to a substrate, is capable of separating the supporting base from the laminate by irradiating light, and is capable of increasing adhesion between the supporting base and the substrate, and a manufacturing method for electronic components using this method. [Means for solving the problem]

[0009] In order to solve the above problems, the present invention employs the following configuration.

[0010] A first aspect of the present invention is a method for separating a supporting base from a laminate in which a light-transmitting supporting base, a separation layer, an adhesive layer, and a substrate are stacked in this order, wherein at least one surface of the separation layer comprises, in a planar view, a layer central portion and a layer peripheral portion which have different adhesive strengths to the supporting base or the adhesive layer, the layer peripheral portion having a higher adhesive strength than the layer central portion and being an area which is altered by irradiation with light, the supporting base and the adhesive layer being bonded together via the layer peripheral portion, and the method for separating a supporting base from the laminate includes a step of irradiating the layer peripheral portion with light from the supporting base side to alter the layer peripheral portion, thereby separating the supporting base from the laminate.

[0011] A second aspect of the present invention is a method for producing an electronic component, comprising: a separation step of separating the supporting base from the laminate by using the supporting base separation method according to the first aspect; and a removal step of removing the adhesive layer adhering to the substrate after the separation step. Effect of the Invention

[0012] According to the present invention, it is possible to provide a supporting base separation method that uses a laminate in which a supporting base is bonded to a substrate, and that is capable of separating the supporting base from the laminate by irradiating light and that can increase adhesion between the supporting base and the substrate, and a manufacturing method for electronic components using this method. [Brief description of the drawings]

[0013] [Figure 1A] 1A to 1C are diagrams illustrating a method for forming a separation layer. [Figure 1B] FIG. [Figure 1C] FIG. 2 is a diagram showing an example of a laminate prepared in the first embodiment. [Figure 1D]FIG. 2 is a diagram illustrating an operation of separating the support base from the laminate. [Figure 2A] 1A to 1C are diagrams illustrating a method for forming a separation layer. [Figure 2B] 1A to 1C are diagrams illustrating a method for forming a separation layer. [Figure 2C] FIG. 2 is a plan view of the separation layer as viewed from the supporting base side. [Figure 2D] FIG. 11 is a diagram showing an example of a laminate prepared in a second embodiment. [Figure 2E] FIG. 2 is a diagram illustrating an operation of separating the support base from the laminate. [Figure 3A] 1A to 1C are diagrams illustrating a method for forming a separation layer. [Figure 3B] FIG. 2 is a plan view of the separation layer as viewed from above the support base on the separation layer side. [Figure 3C] FIG. 13 is a diagram showing an example of a laminate prepared in a third embodiment. [Figure 3D] FIG. 2 is a diagram illustrating an operation of separating the support base from the laminate. [Figure 4A] 1A to 1C are diagrams illustrating an example of a method for manufacturing a semiconductor package (electronic component), illustrating a separation step. [Figure 4B] 1A to 1C are diagrams illustrating an example of a method for manufacturing a semiconductor package (electronic component), illustrating a removing step. [Figure 5A] 1A to 1C are diagrams illustrating a method for forming a separation layer. [Figure 5B] 1A to 1C are diagrams illustrating an example of a method for manufacturing a laminate. [Figure 5C] FIG. 2 is a diagram showing an example of a laminate; [Figure 5D] FIG. 2 is a diagram illustrating an operation of separating the support base from the laminate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The present invention is characterized by the separation layer disposed between the supporting substrate and the adhesive layer in the laminate, and known techniques can be applied to the configurations other than the separation layer.

[0015] (First aspect: Support substrate separation method) A support base separation method according to a first aspect of the present invention is a method for separating the support base from a laminate in which a light-transmitting support base, a separation layer, an adhesive layer, and a substrate are stacked in this order. At least one surface of the separation layer is composed of a central portion and a peripheral portion which have different adhesive strengths to the supporting base or the adhesive layer in a plan view, The peripheral portion is a region which has a higher adhesive strength than the central portion and is altered by irradiation with light. The supporting base and the adhesive layer are bonded together via the peripheral edge portion of the layer. The support base separation method according to this aspect includes a step of separating the support base from the laminate by irradiating the peripheral portion of the layer with light from the support base side to alter the peripheral portion of the layer.

[0016] About laminates In the support base separation method according to this embodiment, the laminate is formed by stacking a support base, a separation layer, an adhesive layer, and a substrate in this order. The supporting base and the adhesive layer are bonded together via the peripheral portion of the separation layer.

[0017] ·Support base The supporting base has a property of transmitting light. The supporting base is a member that supports the substrate, and is bonded to the substrate via a separation layer. Therefore, the supporting base preferably has a strength required to prevent damage or deformation of the substrate during thinning of the encapsulant, transportation of the substrate, mounting on the substrate, etc. In addition, the supporting base preferably transmits light of a wavelength that can alter the separation layer. The material of the support base may be, for example, glass, silicon, acrylic resin, etc. The shape of the support base may be, for example, rectangular, circular, etc., but is not limited thereto. Furthermore, as the supporting base, in order to achieve higher density integration and improve production efficiency, a supporting base having a larger circular shape, or a large panel having a rectangular shape when viewed from above, can also be used.

[0018] ·Separation layer At least one surface of the separation layer is composed of a layer central portion and a layer peripheral portion in a plan view. The central portion and the peripheral portion of the layer have different adhesive strengths to the supporting base or the adhesive layer. The peripheral portion of the layer is a region in which the adhesive strength is higher than that of the central portion of the layer and which is altered by irradiation with light.

[0019] The term "layer peripheral portion" as used herein refers to a region ranging from 0.5 mm to 8 mm, preferably from 1 mm to 5 mm, from the outer peripheral edge of the separation layer toward the center of the separation layer.

[0020] The separation layer is suitably altered by absorbing the light irradiated through the support substrate. The separation layer may be a layer containing a material that does not have a light-absorbing structure, as long as the essential properties are not impaired. However, from the viewpoints of photoreactivity and separability, it is preferable that the separation layer is formed only from a light-absorbing material. The term "alteration" of the separation layer refers to a phenomenon in which the separation layer is in a state where it can be destroyed by an external force, or where the adhesive strength between the separation layer and a layer in contact with it is reduced. The separation layer becomes brittle by absorbing light, and loses the strength or adhesiveness it had before it was irradiated with light. The alteration of the separation layer occurs when the energy of the absorbed light causes decomposition, a change in configuration, or dissociation of functional groups, etc.

[0021] The thickness of the separation layer is, for example, preferably in the range of 0.05 μm to 50 μm, and more preferably in the range of 0.3 μm to 10 μm. If the thickness of the separation layer is within the range of 0.05 μm or more and 50 μm or less, the desired alteration can be caused in the separation layer by short-time light irradiation and low-energy light irradiation. Moreover, from the viewpoint of productivity, it is particularly preferable that the thickness of the separation layer is within the range of 1 μm or less.

[0022] The specific form of the separation layer will be described later.

[0023] ·Adhesive layer The adhesive layer is a layer for bonding the supporting base and the substrate, and can be formed using a composition for forming an adhesive layer. The adhesive layer-forming composition may contain, for example, a thermoplastic resin, a diluent, and other components such as additives. The thermoplastic resin may be any resin that exhibits adhesive strength, and may be one or more of hydrocarbon resins (preferably cycloolefin polymers, etc.), acrylic-styrene resins, maleimide resins, elastomer resins, polysulfone resins, etc. The diluent may be an organic solvent component. Other components may include additional resins for improving the performance of the adhesive layer, curable monomers, photopolymerization initiators, plasticizers, adhesive assistants, stabilizers, colorants, thermal polymerization inhibitors, surfactants, etc.

[0024] The thickness of the adhesive layer is, for example, preferably in the range of 0.1 μm or more and 100 μm or less, and more preferably in the range of 1 μm or more and 50 μm or less. If the thickness of the adhesive layer is within the range of 0.1 μm or more and 100 μm or less, the support base and the substrate can be bonded together more satisfactorily. In addition, if the thickness of the adhesive layer is 1 μm or more, the substrate can be sufficiently fixed onto the support base, and if the thickness of the adhesive layer is 50 μm or less, the adhesive layer can be easily removed in a later process.

[0025] ··substrate The substrate, while supported by a supporting base, is subjected to processes such as thinning, mounting, etc. Structures such as integrated circuits and metal bumps are mounted on the substrate. The substrate is typically a silicon wafer substrate, but is not limited thereto, and may be a ceramic substrate, a thin film substrate, a flexible substrate, or the like.

[0026] Other layers In the support base separation method according to this embodiment, the laminate may further include layers other than the support base, separation layer, adhesive layer and substrate (other layers).

[0027] The laminate may further include another layer between the support base and the separation layer. In this case, the other layer may be made of a material that transmits light. This allows a layer that imparts desirable properties to the laminate to be added as appropriate without preventing the light from entering the separation layer. The wavelength of light that can be used varies depending on the type of material that constitutes the separation layer. Therefore, the material that constitutes the other layer does not need to transmit light of all wavelengths, and can be appropriately selected from materials that transmit light of a wavelength (e.g., 532 nm) that can alter the material that constitutes the separation layer.

[0028] The laminate may also be a sealed body in which a substrate bonded to a support base via a separation layer and an adhesive layer is sealed with a sealing material layer. The sealing material layer can be formed, for example, using a composition containing an epoxy resin or a silicone resin. The sealed body here is preferably one in which the substrates on the adhesive layer are entirely covered, rather than one in which each substrate is sealed.

[0029] The laminate may also be one in which, after sealing with the sealing material layer, the sealing material layer is ground so as to expose a part of the substrate, and a rewiring layer is formed on the exposed substrate. The rewiring layer may be, for example, a dielectric (silicon oxide (SiOx), photosensitive resin such as photosensitive epoxy, etc.) on which wiring is formed using a conductor (metal such as aluminum, copper, titanium, nickel, gold, silver, etc., and alloy such as silver-tin alloy, etc.), but is not limited thereto. Such a laminate formed by stacking a supporting base, a separation layer, an adhesive layer, a substrate, a sealing material layer covering the substrate, and a redistribution layer in this order is a laminate produced in a process based on fan-out technology in which terminals provided on the substrate are mounted on the redistribution layer that extends outside the chip area.

[0030] The support base separation method according to the first aspect includes the following first to third embodiments, each of which will be described with reference to the drawings. In the drawings, components may be shown diagrammatically to make them easier to see, and some components may be shown on different scales.

[0031] First Embodiment The support base separation method of the first embodiment is a method including a step (1-1) of preparing a laminate, and a step (1-2) of separating the support base from the laminate. FIG. 1A is a diagram illustrating a method for forming a separation layer. FIG. 1B is a plan view of the separation layer. FIG. 1C is a diagram showing an example of a laminate prepared in the first embodiment. FIG. 1D is a diagram illustrating an operation of separating the support base from the laminate. In the first embodiment, the separation layer constituting the laminate is configured such that the peripheral edge of the layer is flush with the outer periphery of the central part of the layer.

[0032] [Step (1-1) of preparing a laminate] As an example, the laminate can be obtained by laminating a supporting base on which a separation layer is formed, and a substrate, with the separation layer and an adhesive layer interposed therebetween.

[0033] 1A and 1B, a separation layer 12 consisting of a layer central portion 12A and a layer peripheral portion 12B is formed on a support base 11. The layer peripheral portion 12B is disposed on the outer periphery of the layer central portion 12A, and the layer central portion 12A and the layer peripheral portion 12B are formed to be flush with each other. The layer peripheral portion 12B is a region ranging from the outer peripheral edge of the separation layer 12 toward the center of the separation layer 12 up to a length (L1). This length (L1) is 0.5 mm or more and 8 mm or less, and preferably 1 mm or more and 5 mm or less.

[0034] The central portion 12A and the peripheral portion 12B of the layer have different adhesive strength to the support base 11 or the adhesive layer 14. The peripheral portion 12B of the layer has a higher adhesive strength than the central portion 12A of the layer, and is an area that is altered by irradiation with light. The separation layer 12 can be formed by using a method of using materials with different adhesive strength, a method of changing the curing conditions, or the like. For example, the separation layer 12 can be formed by applying a composition for forming a layer center portion to form the layer center portion 12A, and then applying a composition for forming a layer peripheral portion to the outer periphery of the layer center portion 12A and curing the composition. The material (composition) constituting the separation layer will be described later. Alternatively, the separation layer 12 can be formed by using the same composition and setting the curing temperature to a relatively high value when forming the central portion 12A of the layer and a relatively low value when forming the peripheral portion 12B of the layer.

[0035] Next, an adhesive layer-forming composition is applied onto the separation layer 12 formed on the supporting base 11 and heated to form an adhesive layer 14, and then the supporting base 11 and the substrate 16 are bonded together. The method for bonding the supporting base 11 and the substrate 16 is, for example, to place the substrate 16 at a predetermined position on the adhesive layer 14, and pressure-bond the substrate 11 and the substrate 16 using a die bonder or the like while heating the substrate in a vacuum. 1C, the supporting base 11 on which the separation layer 12 is formed and the substrate 16 are laminated via the separation layer 12 and the adhesive layer 14 to obtain a laminate 10 in which the supporting base 11, the separation layer 12, the adhesive layer 14, and the substrate 16 are stacked in this order. The supporting base 11 and the adhesive layer 14 are bonded together via the layer peripheral portion 12B. Furthermore, in the laminate 10, a sealing material layer 18 is provided so as to cover the substrate 16 on the adhesive layer 14.

[0036] [Step (1-2) of separating the support base from the laminate] In the step (1-2), the peripheral portion of the layer is irradiated with light from the supporting base side to alter the peripheral portion of the layer, thereby separating the supporting base from the laminate.

[0037] As shown in FIG. 1D, in this step (1-2), a peripheral portion 12B of separation layer 12 is irradiated with light (arrow) through support base 11 to alter only peripheral portion 12B.

[0038] The wavelength that can alter the layer peripheral portion 12B is, for example, in the range of 600 nm or less (for example, 532 nm). The type and wavelength of the light to be irradiated may be appropriately selected depending on the transparency of the supporting base 11 and the material of the layer peripheral portion 12B. For example, laser light such as a solid laser such as a YAG laser, a ruby ​​laser, a glass laser, a YVO4 laser, an LD laser, or a fiber laser, a liquid laser such as a dye laser, a gas laser such as a CO2 laser, an excimer laser, an Ar laser, or a He-Ne laser, a semiconductor laser, or a free electron laser, or a non-laser light may be used.

[0039] When irradiating with laser light, the following conditions can be given as examples of the laser light irradiation conditions. The average output value of the laser beam is preferably 1.0 W or more and 5.0 W or less, and more preferably 3.0 W or more and 4.0 W or less. The repetition frequency of the laser beam is preferably 20 kHz or more and 60 kHz or less, and more preferably 30 kHz or more and 50 kHz or less. The scanning speed of the laser beam is preferably 100 mm / s or more and 10,000 mm / s or less.

[0040] Next, layer peripheral portion 12B is irradiated with light (arrow) to alter layer peripheral portion 12B, and then supporting base 11 is separated from laminate 10. The operation of separating the supporting base 11 from the laminate 10 can be performed by applying a force in a direction in which the supporting base 11 and the substrate 16 move away from each other. For example, the supporting base 11 and the substrate 16 can be separated by fixing one of the supporting base 11 side and the substrate 16 side to a stage and lifting the other side while vacuum-adsorbing it with a separation plate equipped with an adsorption pad such as a bellows pad. At that time, a fluid may be injected into a gap formed between the supporting base 11 and the substrate 16, and the supporting base 11 and the substrate 16 may be separated by the pressure of the injected fluid.

[0041] Examples of the fluid to be sprayed include gas, liquid, and a mixed fluid containing gas and liquid, and it is preferable to use a gas, which may be at least one selected from the group consisting of air, dry air, nitrogen, and argon.

[0042] According to the support base separation method of the first embodiment described above, the layer peripheral portion 12B of the separation layer 12 has a higher adhesive strength than the layer central portion 12A, so that the adhesion between the support base 11 and the substrate 16 is improved compared to the case where a separation layer consisting of only the layer central portion 12A is provided.

[0043] In the laminate 10 used in the first embodiment, the peel strength of the interface between the layer central portion 12A and the adhesive layer 14 is preferably 3.0 N or less, and more preferably 2.5 N or less. When the peel strength of the interface is within the above-mentioned preferred range, the separation property of the support base 11 from the laminate 10 by light irradiation becomes better.

[0044] The peel strength of the interface between the layer central portion 12A and the adhesive layer 14 is measured by the following [Method (i) for measuring adhesive strength].

[0045] [Method of measuring adhesive strength (i)] (1) A film is formed on a glass substrate measuring 10 cm×10 cm using a composition for forming the central portion 12A of the layer. (2) A composition for forming an adhesive layer (*) is applied onto the formed film to a thickness of 50 μm, and an adhesive layer is formed by heating at temperatures of 90°C, 160°C, and 220°C for 4 minutes each. (*) The adhesive layer-forming composition used here is an elastomer adhesive containing a hydrogenated block copolymer of styrene and a conjugated diene. (3) The adhesive layer is cut into strips having a width of 10 mm. (4) While always maintaining the angle (peel angle) between the glass substrate and the strip-shaped adhesive layer at 90 degrees, the strip-shaped adhesive layer is pulled in the vertical direction to the glass substrate at a speed of 200 mm / sec to peel the strip-shaped adhesive layer from the glass substrate. The adhesive strength (N) at this time is measured and regarded as the peel strength of the interface between the layer center portion 12A and the adhesive layer 14.

[0046] Furthermore, according to the support base separation method of the first embodiment, in the separation layer 12, the layer peripheral portion 12B is an area that changes in quality when irradiated with light, so that the support base 11 can be easily separated from the laminate 10 by irradiating it with light. Furthermore, in the support base separation method of the first embodiment, the area to which light is irradiated is only the outer peripheral area of ​​the separation layer 12 (layer peripheral portion 12B), so that the support base 11 can be successfully separated from the laminate 10 in a short time without damaging the substrate 16 and support base 11, compared to when the area to which light is irradiated is the entire surface of the separation layer 12.

[0047] <Second embodiment> The support base separation method of the second embodiment is a method including a step (2-1) of preparing a laminate, and a step (2-2) of separating the support base from the laminate. FIG. 2A is a diagram illustrating a method for forming a separation layer. FIG. 2B is a diagram illustrating a method for forming a separation layer. FIG. 2C is a plan view of the separation layer as viewed from the supporting base side. FIG. 2D is a diagram showing an example of a laminate prepared in the second embodiment. FIG. 2E is a diagram illustrating an operation for separating the support base from the laminate. In the second embodiment, the separation layer constituting the laminate is in the form of a first separation layer and a second separation layer stacked together, with the second separation layer being a layer covering the side surface of the first separation layer.

[0048] [Step (2-1) of preparing a laminate] As an example, the laminate can be obtained by laminating a supporting base on which a separation layer is formed, and a substrate, with the separation layer and an adhesive layer interposed therebetween.

[0049] In FIG. 2A, a first separation layer 22a constituting a layer central portion 22A is formed on a support base . 2B, a separation layer 22 in which a first separation layer 22a and a second separation layer 22b are laminated is formed on a support base 21. The first separation layer 22a is disposed between the second separation layer 22b and the support base 21. The second separating layer 22b is formed so as to cover the entirety of the first separating layer 22a, and the top surface and side surfaces of the first separating layer 22a are covered with the second separating layer 22b. In plan view from the support base 21 side, the first separation layer 22a constitutes a layer central portion 22A, and the second separation layer portion 22b1 covering the side surface of the first separation layer 22a constitutes a layer peripheral portion 22B. The layer peripheral portion 22B (second separation layer portion 22b1) is a region ranging from the outer peripheral end of the separation layer 22 toward the center of the separation layer 22 up to a length (L2). This length (L2) is 0.5 mm or more and 8 mm or less, and preferably 1 mm or more and 5 mm or less.

[0050] The layer central portion 22A and the layer peripheral portion 22B have different adhesive strength to the support base 21 or the adhesive layer 24. The layer peripheral portion 22B is a region in which the adhesive strength is higher than that of the layer central portion 22A and which is altered by irradiation with light. The first separation layer 22a and the second separation layer 22b can be formed by using a method of using materials having different adhesive strengths, a method of changing the curing conditions, or the like. For example, the separation layer 22 can be formed by applying a first separation layer forming composition to form the first separation layer 22a (layer central portion 22A), and then applying a second separation layer forming composition so as to cover the entire first separation layer 22a, and curing the composition. The materials (compositions) constituting each separation layer will be described later. Alternatively, the separation layer 22 can be formed by using the same composition and setting the curing temperature when forming the first separation layer 22a (layer central portion 22A) to a relatively low temperature and setting the curing temperature when forming the second separation layer 22b to a relatively high temperature.

[0051] Next, an adhesive layer-forming composition is applied onto the separation layer 22 formed on the supporting base 21 and heated to form an adhesive layer 24, and then the supporting base 21 and the substrate 26 are bonded together. The method for bonding the supporting base 21 and the substrate 26 is, for example, to place the substrate 26 at a predetermined position on the adhesive layer 24, and pressure-bond the substrate 26 with a die bonder or the like while heating the substrate 26 under vacuum. 2D, the supporting base 21 on which the separation layer 22 is formed and the substrate 26 are laminated via the separation layer 22 and the adhesive layer 24 to obtain a laminate 20 in which the supporting base 21, the separation layer 22, the adhesive layer 24, and the substrate 26 are stacked in this order. The supporting base 21 and the adhesive layer 24 are bonded together via the layer peripheral portion 22B (second separation layer portion 22b1). Furthermore, in the laminate 20, a sealing material layer 28 is provided so as to cover the substrate 26 on the adhesive layer 24.

[0052] [Step (2-2) of separating the support base from the laminate] In the step (2-2), the peripheral portion of the layer is irradiated with light from the supporting base side to alter the peripheral portion of the layer, thereby separating the supporting base from the laminate.

[0053] As shown in FIG. 2E, in this step (2-2), layer peripheral portion 22B (second separation layer portion 22b1) of separation layer 22 is irradiated with light (arrow) through support base 21, thereby altering only layer peripheral portion 22B.

[0054] The wavelength that can alter the layer peripheral portion 22B is, for example, in the range of 600 nm or less (for example, 532 nm). The type and wavelength of the irradiated light and the laser light irradiation conditions are the same as those described in the support base separation method of the first embodiment.

[0055] Next, layer peripheral portion 22B is irradiated with light (arrow) to alter layer peripheral portion 22B, and then supporting base 21 is separated from laminate 20. The operation for separating the support base 21 from the laminate 20 is similar to the explanation in the support base separation method of the first embodiment (the operation for separating the support base 11 from the laminate 10).

[0056] According to the support base separation method of the second embodiment described above, in the separation layer 22, the layer peripheral portion 22B (second separation layer portion 22b1) has a higher adhesive strength than the layer central portion 22A (first separation layer 22a), so that the adhesion between the support base 21 and the substrate 26 is improved compared to the case where a separation layer consisting of only the layer central portion 22A is provided.

[0057] In the laminate 20 used in the second embodiment, the peel strength of the interface between the first separation layer 22a and the supporting base 21 is preferably 2.5 N or less, and more preferably 1.0 N or less. When the peel strength of the interface is within the above-mentioned preferred range, the separation property of the supporting base 21 from the laminate 20 by light irradiation becomes better.

[0058] The peel strength of the interface between the first separation layer 22a and the supporting substrate 21 is measured by the following [Method (ii) for measuring adhesive strength].

[0059] [Method of measuring adhesive strength (ii)] (1) A film is formed on a support substrate 21 having a size of 10 cm×10 cm using a composition for forming a first separating layer 22a. (2) A composition for forming an adhesive layer (*) is applied onto the formed film to a thickness of 50 μm, and an adhesive layer is formed by heating at temperatures of 90°C, 160°C, and 220°C for 4 minutes each. (*) The adhesive layer-forming composition used here is an elastomer adhesive containing a hydrogenated block copolymer of styrene and a conjugated diene. (3) The adhesive layer is cut into strips having a width of 10 mm. (4) While always maintaining the angle (peel angle) between the support base 21 and the strip-shaped adhesive layer at 90 degrees, the strip-shaped adhesive layer is pulled in the vertical direction relative to the support base 21 at a speed of 200 mm / sec, whereby the first separation layer 22a is peeled off from the support base 21. The adhesive strength (N) at this time is measured and regarded as the peel strength of the interface between the support base 21 and the first separation layer 22a.

[0060] Furthermore, according to the support base separation method of the second embodiment, in the separation layer 22, the layer peripheral portion 22B (second separation layer portion 22b1) is an area that is altered by irradiation with light, and therefore the support base 21 can be easily separated from the laminate 20 by irradiation with light. Furthermore, in the support base separation method of the second embodiment, the area to which light is irradiated is only the outer peripheral region of the separation layer 22 (layer peripheral portion 22B). Therefore, compared to when the area to which light is irradiated is the entire surface of the separation layer 22, the support base 21 can be successfully separated from the laminate 20 in a short time without damaging the substrate 26 and the support base 21.

[0061] In the support base separation method of the second embodiment, the separation layer 22 is formed by laminating the first separation layer 22a and the second separation layer 22b so as to cover the entire first separation layer 22a. When forming such a separation layer 22, the first separation layer forming composition and the second separation layer forming composition may be applied in layers, and according to the second embodiment, the separation layer 22 consisting of the layer central portion 22A and the layer peripheral portion 22B having different adhesive strengths can be easily formed.

[0062] <Third embodiment> The support base separation method of the third embodiment is a method including a step (3-1) of preparing a laminate, and a step (3-2) of separating the support base from the laminate. FIG. 3A is a diagram illustrating a method for forming a separation layer. FIG. 3B is a plan view of the separation layer as viewed from above the support base on the separation layer side. FIG. 3C is a diagram showing an example of a laminate prepared in the third embodiment. FIG. 3D is a diagram illustrating an operation for separating the support base from the laminate. In the third embodiment, the separation layer constituting the laminate is in the form of a layer in which a third separation layer and a fourth separation layer are laminated so that the third separation layer is exposed on the outer periphery of the fourth separation layer in a planar view.

[0063] [Step (3-1) of preparing a laminate] As an example, the laminate can be obtained by laminating a supporting base on which a separation layer is formed, and a substrate, with the separation layer and an adhesive layer interposed therebetween.

[0064] 3A and 3B, a separation layer 32 is formed on a support base 31, in which a third separation layer 32a and a fourth separation layer 32b are laminated in this order. The third separation layer 32a and the fourth separation layer 32b are laminated such that, in a plan view seen from above the support base 31, the third separation layer 32a is exposed on the outer periphery of the fourth separation layer 32b. In the separation layer 32, the fourth separation layer 32b constitutes a layer central portion 32A, and the third separation layer portion 32a1 exposed on the outer periphery of the fourth separation layer 32b constitutes a layer peripheral portion 32B. The layer peripheral portion 32B (third separation layer portion 32a1) is a region ranging from the outer peripheral end of the separation layer 32 toward the center of the separation layer 32 up to a length (L3). This length (L3) is 0.5 mm or more and 8 mm or less, and preferably 1 mm or more and 5 mm or less.

[0065] The layer central portion 32A and the layer peripheral portion 32B have different adhesive strength to the support base 31 or the adhesive layer 34. The layer peripheral portion 32B (third separation layer portion 32a1) has a higher adhesive strength than the layer central portion 32A (fourth separation layer 32b), and is an area that is altered by irradiation with light. The third separation layer 32a and the fourth separation layer 32b can be formed by using a method of using materials having different adhesive strengths, a method of changing the curing conditions, or the like. For example, the separation layer 32 can be formed by applying a composition for forming a third separation layer to form a third separation layer 32a, applying a composition for forming a fourth separation layer on the third separation layer 32a to form a fourth separation layer 32b, and laminating the third separation layer 32a so that the third separation layer 32a is exposed on the outer periphery of the fourth separation layer 32b. The materials (compositions) constituting each separation layer will be described later. Alternatively, the separation layers 32 can be formed by using the same composition and setting the curing temperature to a relatively low value when forming the third separation layer 32a and to a relatively high value when forming the fourth separation layer 32b.

[0066] Next, an adhesive layer-forming composition is applied onto the separation layer 32 formed on the supporting base 31 and heated to form an adhesive layer 34, and then the supporting base 31 and the substrate 36 are bonded together. The method for bonding the supporting base 31 and the substrate 36 is, for example, to place the substrate 36 at a predetermined position on the adhesive layer 34, and pressure-bond the substrate 36 with a die bonder or the like while heating the substrate 36 under vacuum. 3C, the support base 31 on which the separation layer 32 is formed and the substrate 36 are laminated via the separation layer 32 and the adhesive layer 34 to obtain a laminate 30 in which the support base 31, the separation layer 32, the adhesive layer 34, and the substrate 36 are stacked in this order. The fourth separation layer 32b (layer central portion 32A) is disposed between the third separation layer 32a and the adhesive layer 34. The support base 31 and the adhesive layer 34 are bonded together via the layer peripheral portion 32B (third separation layer portion 32a1). Furthermore, in the laminate 30, a sealing material layer 38 is provided so as to cover the substrate 36 on the adhesive layer 34.

[0067] [Step (3-2) of separating the support base from the laminate] In the step (3-2), the peripheral portion of the layer is irradiated with light from the supporting base side to alter the peripheral portion of the layer, thereby separating the supporting base from the laminate.

[0068] As shown in FIG. 3D, in this step (3-2), light (arrow) is irradiated onto layer peripheral portion 32B (third separation layer portion 32a1) of separation layer 32 through support base 31, thereby altering only layer peripheral portion 32B.

[0069] The wavelength that can alter the layer peripheral portion 32B is, for example, in the range of 600 nm or less (for example, 532 nm). The type and wavelength of the irradiated light and the laser light irradiation conditions are the same as those described in the support base separation method of the first embodiment.

[0070] Next, layer peripheral portion 32B is irradiated with light (arrow) to alter layer peripheral portion 32B, and then supporting base 31 is separated from laminate 30. The operation for separating the support base 31 from the laminate 30 is similar to the explanation in the support base separation method of the first embodiment (the operation for separating the support base 11 from the laminate 10).

[0071] According to the support base separation method of the third embodiment described above, the layer peripheral portion 32B (third separation layer portion 32a1) of the separation layer 32 has a higher adhesive strength than the layer central portion 32A (fourth separation layer 32b), so that the adhesion between the support base 31 and the substrate 36 is improved compared to the case where a separation layer consisting of only the layer central portion 32A is provided.

[0072] In the laminate 30 used in the third embodiment, the peel strength of the interface between the fourth separation layer 32b and the adhesive layer 34 is preferably 2.5 N or less, and more preferably 1.0 N or less. When the peel strength of the interface is within the above-mentioned preferred range, the separation property of the support base 31 from the laminate 30 by light irradiation becomes better.

[0073] The peel strength of the interface between the fourth separation layer 32b and the adhesive layer 34 is measured by the following [Method of measuring adhesive strength (iii)].

[0074] [Method of measuring adhesive strength (iii)] (1) A film is formed on a glass substrate measuring 10 cm×10 cm using a composition for forming the fourth separation layer 32b. (2) A composition for forming an adhesive layer (*) is applied onto the formed film to a thickness of 50 μm, and an adhesive layer is formed by heating at temperatures of 90°C, 160°C, and 220°C for 4 minutes each. (*) The adhesive layer-forming composition used here is an elastomer adhesive containing a hydrogenated block copolymer of styrene and a conjugated diene. (3) The adhesive layer is cut into strips having a width of 10 mm. (4) While always maintaining the angle (peel angle) between the glass substrate and the strip-shaped adhesive layer at 90 degrees, the strip-shaped adhesive layer is pulled perpendicularly to the glass substrate at a speed of 200 mm / sec to peel the strip-shaped adhesive layer from the glass substrate. The adhesive strength (N) at this time is measured and regarded as the peel strength of the interface between the fourth separation layer 32b and the adhesive layer 34.

[0075] Furthermore, according to the support base separation method of the third embodiment, in the separation layer 32, the layer peripheral portion 32B (third separation layer portion 32a1) is an area that is altered by irradiation with light, and therefore the support base 31 can be easily separated from the laminate 30 by irradiation with light. Furthermore, in the support base separation method of the third embodiment, the area to which light is irradiated is only the outer peripheral region of the separation layer 32 (layer peripheral portion 32B), so that the support base 31 can be successfully separated from the laminate 30 in a short time without damaging the substrate 36 and support base 31, compared to when the area to which light is irradiated is the entire surface of the separation layer 32.

[0076] In the support base separation method of the third embodiment, the separation layer 32 has a fourth separation layer 32b laminated on a third separation layer 32a. When forming such a separation layer 32, the third separation layer 32a and the fourth separation layer 32b may be laminated so that the third separation layer is exposed on the outer periphery of the fourth separation layer 32b, and according to the third embodiment, the separation layer 32 consisting of a layer central portion 32A and a layer peripheral portion 32B having different adhesive strengths can be easily formed.

[0077] <Other embodiments> The support base separation method according to this aspect is not limited to the above-mentioned first to third embodiments, and may be other embodiments. For example, it may be an embodiment in which a laminate in which the fourth separation layer 32b in the third embodiment is replaced with a release layer is used. In the third embodiment, when the fourth separation layer 32b is replaced with a release layer, this release layer constitutes the layer center portion 32A of the separation layer 32.

[0078] Materials for forming the release layer include release agents using silicone-based resins, release agents using fluorine-based resins, release agents using acrylic resins, and release agents using higher fatty acids, and other components include thermosetting resins, crosslinking agents, and curing agents. As the thermosetting resin, a conventionally known film-forming resin that can be cured and crosslinked can be used, and examples of such a thermosetting resin include acrylic resin, polyester resin, alkyd resin, and polyurethane resin, which have a crosslinkable functional group such as a hydroxyl group, a carboxyl group, or an alkoxysilyl group. The crosslinking agent can be used without any particular limitation as long as it reacts with the crosslinkable functional group of the thermosetting resin by heating to cause crosslinking and curing. Examples of such crosslinking agents include amino resins such as melamine resins, benzoguanamine resins, and urea resins, polyisocyanate compounds, metal chelate compounds, and epoxy resins, and among these, melamine resins, polyisocyanate compounds, metal chelate compounds, and benzoguanamine resins are preferably used. As the curing agent, for example, when the crosslinking agent is a polyisocyanate compound, known urethane curing catalysts (organotin compounds, amine compounds, organic acids, etc.) can be used.

[0079] According to the support base separation method of the other embodiment described above, the peripheral portion of the separation layer has a higher adhesive strength than the central portion of the layer (release layer), so that the adhesion between the support base and the substrate is improved compared to when a separation layer consisting of only the central portion of the layer (release layer) is provided. In addition, by replacing the fourth separation layer 32b in the third embodiment with a release layer, the amount of release agent added can be adjusted, making it easy to control the adhesion between the support base and the substrate.

[0080] In a laminate in which the fourth separation layer 32b in the third embodiment is replaced with a release layer, the peel strength of the interface between the release layer and the adhesive layer 34 is preferably 2.5 N or less, and more preferably 1.0 N or less. When the peel strength of the interface is within the above-mentioned preferred range, the separation property of the support base 31 from the laminate by light irradiation becomes better.

[0081] The peel strength of the interface between the release layer and the adhesive layer 34 is measured by the following [Method of measuring adhesive strength (iv)].

[0082] [Method of measuring adhesive strength (iv)] (1) A composition for forming a third separation layer 32a is used to form a film on a 12-inch glass substrate. Next, a composition for forming a release layer is used to form a film having a thickness of 2 μm on the third separation layer 32a. (2) A composition for forming an adhesive layer (*) is applied onto the formed film to a thickness of 50 μm, and an adhesive layer is formed by heating at temperatures of 90°C, 160°C, and 220°C for 4 minutes each. (*) The adhesive layer-forming composition used here is an elastomer adhesive containing a hydrogenated block copolymer of styrene and a conjugated diene. (3) The adhesive layer is cut into strips having a width of 10 mm. (4) While always maintaining the angle (peel angle) between the glass substrate and the strip-shaped adhesive layer at 90 degrees, the strip-shaped adhesive layer is pulled in the vertical direction to the glass substrate at a speed of 200 mm / sec to peel the strip-shaped adhesive layer from the glass substrate. The adhesive strength (N) at this time is measured and regarded as the peel strength of the interface between the release layer and the adhesive layer 34.

[0083] <Materials (compositions) constituting the separation layer> The material (composition) constituting the separation layer is intended to form a separation layer in a laminate having a separation layer between a light-transmitting supporting base and a substrate, the separation layer being altered by irradiation of light from the supporting base side, thereby enabling the supporting base to be separated from the laminate. One embodiment of the material (composition) constituting the separation layer contains a resin component (P). Hereinafter, the material (composition) constituting the separation layer may also be referred to as a "separation layer-forming composition."

[0084] ·Resin component (P) Resin component (P) (hereinafter also referred to as "component (P)") may be any resin component known in the art that can be used as a resin component for a composition for forming a separation layer, without any particular limitations. Component (P) is preferably one that changes to a structure having light absorption properties upon firing. Component (P) is preferably one that changes to a structure having light absorption properties for a wavelength of 532 nm, for example, when the composition for forming a separation layer of this embodiment is fired (e.g., at 200 to 300°C).

[0085] (P1) component The component (P) may be a resin component having a repeating unit represented by the following general formula (p1) (hereinafter also referred to as "component (P1)").

[0086] [ka] [In the formula, L P1 R represents a divalent linking group. P1 represents an organic group.

[0087] In the formula (p1), L P1 The divalent linking group in the formula (I) may contain an aromatic ring, may contain a plurality of kinds of aromatic rings, or may contain a ring structure in which an aromatic ring and an aliphatic ring are condensed. L P1 When the divalent linking group in the formula (I) contains an aromatic ring, the aromatic ring is not particularly limited as long as it is a cyclic conjugated system having 4n+2 π electrons, and may be monocyclic or polycyclic. The aromatic ring preferably has 5 to 30 carbon atoms, more preferably 5 to 20 carbon atoms, further preferably 6 to 15 carbon atoms, and particularly preferably 6 to 12 carbon atoms. Specific examples of the aromatic ring include aromatic hydrocarbon rings such as benzene, naphthalene, anthracene, and phenanthrene; and aromatic heterocycles in which a part of the carbon atoms constituting the aromatic hydrocarbon ring is replaced with a heteroatom. Examples of the heteroatom in the aromatic heterocycle include an oxygen atom, a sulfur atom, and a nitrogen atom. Specific examples of the aromatic heterocycle include a pyridine ring and a thiophene ring. The divalent linking group may contain one aromatic ring or two or more aromatic rings, and preferably contains two or more aromatic rings because this provides better photoreactivity.

[0088] Alternatively, in the formula (p1), L P1 The divalent linking group in L is preferably a divalent linking group containing a hetero atom. p1 Examples of the linking group include linking groups having various skeletons introduced therein in order to impart desired properties. Examples of the skeleton in the "linking group having various skeletons introduced therein" include a naphthalene skeleton, anthracene skeleton, xanthene skeleton, fluorene skeleton, and bisphenol A skeleton.

[0089] L p1 Examples of such bond groups include ether bond groups of bisphenols, ether bond groups of diols, ester bond groups of dicarboxylic acids, Si-O bond groups, and repeating structures of these bond groups.

[0090] Examples of the bisphenols include bisphenol F, bisphenol A, bisphenol Z, biphenol, and polymers thereof. Examples of the diols include ethylene glycol, propylene glycol, 1,6-hexanediol, neopentyl glycol, naphthalenediol (dihydroxynaphthalene), anthracenediol (dihydroxyanthracene), 2,2-bis(4-hydroxyphenyl)propane, and polymers thereof. Examples of the dicarboxylic acids include maleic acid, phthalic acid, hydrogenated phthalic acid, and terephthalic acid.

[0091] L p1 When an ether bond group of a bisphenol is selected as the copolymer, the flexibility of the film made from the component (P) can be easily improved. L p1When an ether bond group of a diol is selected as the linking group, the alkali solubility of the component (P) can be easily adjusted. As the ether bond group of a diol, a linking group having a glycol skeleton is preferable. As the glycol skeleton, for example, a propylene glycol skeleton can be mentioned. L p1 When a Si-O bond group is selected as the bond, it becomes easier to achieve a low dielectric constant for the molded article of the component (P).

[0092] Hereinafter, L in the formula (p1) will be described. P1 Preferred specific examples of (divalent linking group) are shown below. In the following formula, * indicates a bond that bonds to a methylene group (CH2). P1 -9) n represents the number of repetitions of the oxypropylene group.

[0093] [ka]

[0094] In the formula (p1), R P1 The organic group in is not particularly limited, and examples thereof include hydrocarbon groups which may have a substituent. R P1 Examples of the hydrocarbon group in include linear or branched alkyl groups, linear or cyclic alkenyl groups, and cyclic hydrocarbon groups.

[0095] R P1 The linear alkyl group in R preferably has 1 to 5 carbon atoms. P1 Specific examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, and an n-pentyl group. R P1 The branched alkyl group in R preferably has 3 to 10 carbon atoms, and more preferably has 3 to 5 carbon atoms. P1 Specific examples of the alkyl group include an isopropyl group, an isobutyl group, a tert-butyl group, an isopentyl group, a neopentyl group, a 1,1-diethylpropyl group, and a 2,2-dimethylbutyl group.

[0096] R P1 The chain or cyclic alkenyl group in is preferably an alkenyl group having 2 to 10 carbon atoms.

[0097] R P1 The cyclic hydrocarbon group in may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group, and may be a polycyclic group or a monocyclic group. The monocyclic aliphatic hydrocarbon group is preferably a group in which one hydrogen atom has been removed from a monocycloalkane. The monocycloalkane preferably has 3 to 6 carbon atoms, and specific examples thereof include cyclopentane and cyclohexane. The aliphatic hydrocarbon group that is a polycyclic group is preferably a group in which one hydrogen atom has been removed from a polycycloalkane, and the polycycloalkane preferably has 7 to 12 carbon atoms, specific examples of which include adamantane, norbornane, isobornane, tricyclodecane, and tetracyclododecane.

[0098] R P1The aromatic hydrocarbon group in the above is a hydrocarbon group having at least one aromatic ring. The aromatic ring is not particularly limited as long as it is a cyclic conjugated system having 4n+2 π electrons, and may be monocyclic or polycyclic. The aromatic ring preferably has 5 to 30 carbon atoms, more preferably 5 to 20 carbon atoms, further preferably 6 to 15 carbon atoms, and particularly preferably 6 to 12 carbon atoms. Specific examples of the aromatic ring include aromatic hydrocarbon rings such as benzene, naphthalene, anthracene, and phenanthrene; and aromatic heterocycles in which a part of the carbon atoms constituting the aromatic hydrocarbon ring is substituted with a heteroatom. Examples of the heteroatom in the aromatic heterocycle include an oxygen atom, a sulfur atom, and a nitrogen atom. Specific examples of the aromatic heterocycle include a pyridine ring and a thiophene ring. Specific examples of the aromatic hydrocarbon group include a group in which one hydrogen atom has been removed from the aromatic hydrocarbon ring or aromatic heterocycle (aryl group or heteroaryl group); a group in which one hydrogen atom has been removed from an aromatic compound containing two or more aromatic rings (such as biphenyl, fluorene, etc.); and a group in which one hydrogen atom of the aromatic hydrocarbon ring or aromatic heterocycle has been substituted with an alkylene group (such as arylalkyl groups such as benzyl group, phenethyl group, 1-naphthylmethyl group, 2-naphthylmethyl group, 1-naphthylethyl group, and 2-naphthylethyl group). The number of carbon atoms of the alkylene group bonded to the aromatic hydrocarbon ring or aromatic heterocycle is preferably 1 to 4, more preferably 1 to 2, and particularly preferably 1.

[0099] R P1 The aromatic hydrocarbon group in may be a condensed polycyclic aromatic group. The condensed polycyclic aromatic group is a group in which one hydrogen atom is removed from a condensed polycyclic aromatic ring. This condensed polycyclic aromatic ring may be a ring structure in which a plurality of aromatic rings are condensed, or a ring structure in which an aromatic ring and an aliphatic ring are condensed. In the ring structure in which an aromatic ring and an aliphatic ring are condensed, the number of aromatic rings may be multiple, the number of aliphatic rings may be multiple, or there may be one aromatic ring and one aliphatic ring. The number of rings constituting this condensed polycyclic aromatic ring is preferably 2 to 5, more preferably 2 to 3, and even more preferably 3.

[0100] R P1 Examples of the fused polycyclic aromatic group in the above formula include groups in which one hydrogen atom has been removed from a naphthalene ring, an azulene ring, an anthracene ring, a phenanthrene ring, a pyrene ring, a chrysene ring, a triphenylene ring, a perylene ring, an anthraquinone ring, or a naphthoquinone ring. Among these, groups in which one hydrogen atom has been removed from an anthraquinone ring or a naphthoquinone ring are preferred, and groups in which one hydrogen atom has been removed from an anthraquinone ring are more preferred.

[0101] The above R P1 When the hydrocarbon group represented by the formula (I) is substituted, examples of the substituent include a hydroxy group, a carboxy group, a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, etc.), an alkoxy group (a methoxy group, an ethoxy group, a propoxy group, a butoxy group, etc.), an alkyloxycarbonyl group, etc. R P1 The hydrocarbon group represented by the following formula may have an ether bond in the middle of the hydrocarbon chain.

[0102] Specific examples of the repeating unit represented by formula (p1) are shown below, but the repeating unit is not limited to these.

[0103] [ka]

[0104] [ka]

[0105] [ka]

[0106] [ka]

[0107] The component (P1) has a film-forming ability and preferably has a molecular weight of at least 1000. The film-forming ability is improved by the molecular weight of the component (P1) being at least 1000. The molecular weight of the component (P1) is more preferably 1000 to 30000, further preferably 1500 to 25000, particularly preferably 1500 to 20000, and most preferably 2000 to 15000. When the molecular weight of the component (P1) is equal to or less than the upper limit of the above-mentioned preferred range, the solubility of the separation layer forming composition in a solvent is increased. The molecular weight of the resin component is determined by polystyrene-equivalent weight average molecular weight (Mw) measured by gel permeation chromatography (GPC).

[0108] As the component (P1), for example, the GSP series (manufactured by Gun-ei Chemical Industry Co., Ltd.) with the trade names GSP-01, GSP-02, GSP-03, GSP-106, GSP-112, GSP-113, GSP-117, and GSP-119 can be used.

[0109] Furthermore, as the component (P1), a resin produced by reacting an aminophenol, an aminonaphthol, or an aniline with a compound having two epoxy groups in one molecule can also be used. Examples of aminophenols include 2-aminophenol, 3-aminophenol, 4-aminophenol, 4-amino-3-methylphenol, 2-amino-4-methylphenol, 3-amino-2-methylphenol, 5-amino-2-methylphenol, etc. Examples of aminonaphthols include 1-amino-2-naphthol, 3-amino-2-naphthol, 5-amino-1-naphthol, etc. Examples of compounds having two epoxy groups in one molecule include bisphenol-type epoxy resins with trade names of EPICLON850, EPICLON830 (manufactured by DIC Corporation), jERYX-4000 (manufactured by Mitsubishi Chemical Corporation), and the like; diol-type epoxy resins such as DENACOL EX-211, DENACOL EX-212, DENACOL EX-810, DENACOL EX-830, DENACOL EX-911, DENACOL EX-920, DENACOL EX-930 (manufactured by Nagase ChemteX Corporation); dicarboxylate-type epoxy resins such as DENACOL EX-711, DENACOL EX-721 (manufactured by Nagase ChemteX Corporation), jER191P (manufactured by Mitsubishi Chemical Corporation); and silicone-type epoxy resins such as X-22-163, KF-105 (manufactured by Shin-Etsu Chemical Co., Ltd.). The heat treatment temperature during this reaction is preferably 60°C or higher and 250°C or lower, and more preferably 80°C or higher and 180°C or lower.

[0110] The component (P1) may be used alone or in combination of two or more types.

[0111] ·(P2) component The component (P) may be a resin component other than the component (P1) (hereinafter also referred to as "component (P2)"). Examples of the component (P2) include benzoxazine resins, phenol derivatives, novolac-type phenolic resins, resol-type phenolic resins, hydroxystyrene resins, hydroxyphenylsilsesquioxane resins, hydroxybenzylsilsesquioxane resins, and acrylic resins containing a phenol skeleton.

[0112] Benzoxazine resin: The benzoxazine resin is a resin containing a benzoxazine skeleton. Examples of the benzoxazine resin include resins represented by the following general formula (p2-1).

[0113] [ka] [In the formula, Lb1 represents an aliphatic hydrocarbon group having 1 to 10 carbon atoms; Rb 1 and Rb 2 each independently represents a hydrocarbon group having 12 to 24 carbon atoms; Rb 3 ~Rb 6 each independently represents a hydrogen atom or a substituent.

[0114] In the general formula (p2-1), Lb 1 represents an aliphatic hydrocarbon group having 1 to 10 carbon atoms. 1 The aliphatic hydrocarbon group in Lb may be linear, branched, or have a cyclic structure. 1 The aliphatic hydrocarbon group in may be a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group, but is preferably a saturated aliphatic hydrocarbon group.

[0115] The linear aliphatic hydrocarbon group preferably has 1 to 8 carbon atoms, more preferably 1 to 6 carbon atoms, further preferably 1 to 4 carbon atoms, and particularly preferably 1, 2 or 3 carbon atoms. The linear aliphatic hydrocarbon group is preferably a linear alkylene group. The branched aliphatic hydrocarbon group preferably has 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, further preferably 2 to 4 carbon atoms, and particularly preferably 2 or 3. The branched aliphatic hydrocarbon group is preferably a branched alkylene group.

[0116] Examples of the aliphatic hydrocarbon group containing a ring in the structure include an alicyclic hydrocarbon group (a group in which two hydrogen atoms have been removed from an aliphatic hydrocarbon ring), a group in which an alicyclic hydrocarbon group is bonded to the end of a linear or branched aliphatic hydrocarbon group, a group in which an alicyclic hydrocarbon group is interposed in the middle of a linear or branched aliphatic hydrocarbon group, etc. Examples of the linear or branched aliphatic hydrocarbon group in the aliphatic hydrocarbon group containing a ring in the structure include the same as the linear aliphatic hydrocarbon group or the branched aliphatic hydrocarbon group described above. The alicyclic hydrocarbon group preferably has 3 to 10 carbon atoms, more preferably has 3 to 8 carbon atoms, and further preferably has 3 to 6 carbon atoms. The alicyclic hydrocarbon group may be polycyclic or monocyclic. The monocyclic alicyclic hydrocarbon group is preferably a group obtained by removing two hydrogen atoms from a monocycloalkane. The monocycloalkane preferably has 3 to 6 carbon atoms, specifically cyclopentane, cyclohexane, etc. The polycyclic alicyclic hydrocarbon group is preferably a group obtained by removing two hydrogen atoms from a polycycloalkane, preferably has 7 to 10 carbon atoms, specifically adamantane, norbornane, isobornane, tricyclodecane, etc.

[0117] Lb 1 is preferably a linear or branched alkylene group having 1 to 8 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 4 carbon atoms, and particularly preferably 1, 2 or 3 carbon atoms.

[0118] In general formula (p2-1), Rb 1 and Rb 2 Rb each independently represents a hydrocarbon group having 12 to 24 carbon atoms. 1 and Rb 2 The hydrocarbon group in may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group.

[0119] Rb 1 and Rb 2 The aliphatic hydrocarbon group in Rb may be linear, branched, or have a cyclic structure. 1 and Rb 2 The aliphatic hydrocarbon group in Rb may be a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group. 1 and Rb 2 The aliphatic hydrocarbon group in preferably has 12 to 20 carbon atoms, more preferably has 12 to 18 carbon atoms, and further preferably has 14 to 16 carbon atoms.

[0120] Rb 1 and Rb 2Examples of the aliphatic hydrocarbon group having a ring in the structure include an alicyclic hydrocarbon group (a group in which one hydrogen atom has been removed from an aliphatic hydrocarbon ring), a group in which an alicyclic hydrocarbon group is bonded to the end of a straight-chain or branched-chain aliphatic hydrocarbon group, and a group in which an alicyclic hydrocarbon group is present in the middle of a straight-chain or branched-chain aliphatic hydrocarbon group.

[0121] Rb 1 and Rb 2 The aromatic hydrocarbon group in may be monocyclic or polycyclic. The aromatic ring contained in the aromatic hydrocarbon group preferably has 5 to 20 carbon atoms, more preferably 6 to 15 carbon atoms, and even more preferably 6 to 12 carbon atoms. Examples of the aromatic ring include aromatic hydrocarbon rings such as benzene, naphthalene, anthracene, and phenanthrene. Specific examples of the aromatic hydrocarbon group include a group (aryl group or heteroaryl group) obtained by removing one hydrogen atom from the aromatic hydrocarbon ring; a group obtained by removing one hydrogen atom from an aromatic compound containing two or more aromatic rings (such as biphenyl and fluorene); and a group in which one hydrogen atom of the aromatic hydrocarbon ring is substituted with an alkylene group (such as arylalkyl groups such as benzyl group, phenethyl group, 1-naphthylmethyl group, 2-naphthylmethyl group, 1-naphthylethyl group, and 2-naphthylethyl group). The alkylene group bonded to the aromatic hydrocarbon ring preferably has 1 to 12 carbon atoms, more preferably 1 to 10 carbon atoms.

[0122] Rb 1 and Rb 2 Rb is preferably a linear or branched, saturated or unsaturated aliphatic hydrocarbon group, more preferably a linear, saturated or unsaturated aliphatic hydrocarbon group. 1 and Rb 2 When Rb is an unsaturated aliphatic hydrocarbon group, the number of unsaturated bonds is not particularly limited, and examples thereof include 1 to 5, 1 to 4, 1 to 3, or 1 or 2. 1 and Rb 2 is preferably a linear alkyl group, a linear alkenyl group, a linear alkadiene group, or a linear alkatriene group.

[0123] Rb 1 and Rb 2 Specific examples are shown below, but are not limited to these.

[0124] [ka]

[0125] In the above formula (p2-1), Rb 3 ~Rb 6 Rb each independently represents a hydrogen atom or a substituent. 3 ~Rb 6 The substituents in Rb are not particularly limited. 3 ~Rb 6 Examples of the substituent in include a hydroxy group, a carboxy group, a halogen atom (such as a fluorine atom, a chlorine atom, or a bromine atom), an alkoxy group, an alkyloxycarbonyl group, a nitro group, and an amino group, as well as alkyl groups which may have these groups as substituents. Rb 3 ~Rb 6 The alkyl group in the formula (I) preferably has 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms, further preferably 1 to 3 carbon atoms, and particularly preferably 1 or 2 carbon atoms. The alkyl group may or may not have a substituent, but preferably does not have a substituent. Rb 3 ~Rb 6 The alkoxy group in the above formula (I) preferably has 1 to 6 carbon atoms, more preferably has 1 to 4 carbon atoms, further preferably has 1 to 3 carbon atoms, and particularly preferably has 1 or 2 carbon atoms. Rb 3 ~Rb 6 The alkyl group or alkoxy group in may be linear or branched, but is preferably linear.

[0126] Rb 3 ~Rb 6 is preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and particularly preferably a hydrogen atom, a methyl group, or an ethyl group.

[0127] Specific examples of benzoxazine resins are shown below, but are not limited thereto.

[0128] [ka] [In the formula, R represents a group represented by any one of the formulae (Rb1-1) to (Rb1-4). A plurality of R may be the same or different from each other.]

[0129] The benzoxazine resin may be used alone or in combination of two or more kinds. The benzoxazine resin may be a mixture of compounds in which R in the formula (p2-1-1) is different from one another.

[0130] Specific examples of the component (P2) other than the benzoxazine resin are shown below, but the present invention is not limited to these.

[0131] [ka]

[0132] The component (P) is preferably a resin containing an aromatic ring. The aromatic ring may be an aromatic hydrocarbon ring or an aromatic heterocycle. The aromatic ring may be a monocycle or a polycycle. The aromatic ring may be a condensed ring of an aromatic ring and an aliphatic ring. The aliphatic ring forming a condensed ring with the aromatic ring may be an aliphatic hydrocarbon ring or an aliphatic heterocycle. The component (P) is preferably a component (P1), a benzoxazine resin, or a resin represented by the formula (p2-2).

[0133] The component (P) contained in the separation layer-forming composition of the present embodiment may be one type or two or more types. The content of the (P) component in the separation layer forming composition of this embodiment may be adjusted according to the thickness of the separation layer to be formed, etc. The content of the (P) component in the separation layer forming composition may be, for example, 1 to 100 mass% relative to the composition (100 mass%). The content of the (P) component is preferably 1 to 70 mass%, more preferably 5 to 50 mass%, even more preferably 10 to 50 mass%, and particularly preferably 10 to 30 mass%. When the content of the (P) component is equal to or greater than the lower limit of the preferred range, the photoreactivity of the separation layer is more likely to be increased. In addition, the adhesion is also more likely to be increased. On the other hand, when the content of the (P) component is equal to or less than the upper limit of the preferred range, it is easier to achieve a balance with other components.

[0134] Other ingredients The separation layer-forming composition of the present embodiment may contain other components (optional components) in addition to the above-mentioned component (P). Such optional components include fluorocarbons, thermal acid generator components, photoacid generator components, photosensitizer components, organic solvent components, surfactants, sensitizers, and the like.

[0135] In this embodiment, the material (composition) constituting the separation layer may contain a fluorocarbon. Fluorocarbons absorb light having a wavelength in a specific range depending on the type of fluorocarbon. By irradiating the separation layer with light having a wavelength in the range absorbed by the fluorocarbon, the fluorocarbon can be suitably altered. The fluorocarbon constituting the separation layer can be suitably formed into a film by plasma CVD (chemical vapor deposition).

[0136] Thermal acid generator The separation layer-forming composition of the present embodiment may contain a thermal acid generator (hereinafter also referred to as "component (T)").

[0137] The component (T) can be appropriately selected from known ones and used. The component (T) is preferably one that generates an acid at a temperature equal to or higher than the temperature at which the support substrate coated with the separation layer-forming composition is prebaked, more preferably 110°C or higher, and even more preferably 130°C or higher. Examples of such component (T) include trifluoromethanesulfonate, hexafluorophosphate, perfluorobutanesulfonate, boron trifluoride salt, boron trifluoride ether complex, etc. Preferred examples of the component (T) include compounds consisting of a cation moiety and an anion moiety shown below.

[0138] [ka] [In formula (T-ca-1), R h01 ~R h04 are each independently a group selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and an aryl group; R h01 ~R h04 At least one of R is an aryl group. The alkyl group or aryl group may have a substituent. h05 ~R h07 are each independently a group selected from the group consisting of alkyl groups and aryl groups having 1 to 20 carbon atoms, R h05 ~R h07 At least one of the alkyl groups is an aryl group. The alkyl group or the aryl group may have a substituent.]

[0139] Regarding the cationic portion of the (T) component In the above formula (T-ca-1), R h01 ~R h04The alkyl group in the formula (I) has 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and further preferably a linear or branched alkyl group having 1 to 5 carbon atoms. Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, a pentyl group, an isopentyl group, and a neopentyl group. Of these, a methyl group and an ethyl group are preferred.

[0140] R h01 ~R h04 The alkyl group in may have a substituent, for example, an alkoxy group, a halogen atom, a halogenated alkyl group, a hydroxyl group, a carbonyl group, a nitro group, an amino group, a cyclic group, etc.

[0141] The alkoxy group as a substituent of the alkyl group is preferably an alkoxy group having 1 to 5 carbon atoms, more preferably a methoxy group, an ethoxy group, an n-propoxy group, an iso-propoxy group, an n-butoxy group, or a tert-butoxy group, and further preferably a methoxy group or an ethoxy group. Examples of the halogen atom as a substituent of the alkyl group include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, with a fluorine atom being preferred. Examples of the halogenated alkyl group as the substituent of the alkyl group include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, propyl, n-butyl, and tert-butyl groups, in which some or all of the hydrogen atoms have been substituted with the above-mentioned halogen atoms. A carbonyl group as a substituent of an alkyl group is a group (>C=O) that replaces a methylene group (-CH2-) that constitutes the alkyl group. Examples of the cyclic group as a substituent of the alkyl group include an aromatic hydrocarbon group and an alicyclic hydrocarbon group (which may be polycyclic or monocyclic). The aromatic hydrocarbon group here is the same as R h01 ~R h04Examples of the aryl group in the above are the same as those in the above. In the alicyclic hydrocarbon group, the monocyclic alicyclic hydrocarbon group is preferably a group obtained by removing one or more hydrogen atoms from a monocycloalkane. The monocycloalkane is preferably one having 3 to 6 carbon atoms, specifically cyclopentane, cyclohexane, etc. In addition, the polycyclic alicyclic hydrocarbon group is preferably a group obtained by removing one or more hydrogen atoms from a polycycloalkane, and the polycycloalkane is preferably one having 7 to 30 carbon atoms. Among them, the polycycloalkane is more preferably a polycycloalkane having a polycyclic skeleton of a bridged ring system such as adamantane, norbornane, isobornane, tricyclodecane, tetracyclododecane, etc.; or a polycycloalkane having a polycyclic skeleton of a condensed ring system such as a cyclic group having a steroid skeleton.

[0142] In the above formula (T-ca-1), R h01 ~R h04 The aryl group in the formula (I) is a hydrocarbon group having at least one aromatic ring. The aromatic ring is not particularly limited as long as it is a cyclic conjugated system having 4n+2 π electrons, and may be monocyclic or polycyclic. The aromatic ring preferably has 5 to 30 carbon atoms, more preferably 5 to 20 carbon atoms, further preferably 6 to 15 carbon atoms, and particularly preferably 6 to 12 carbon atoms. Specific examples of the aromatic ring include aromatic hydrocarbon rings such as benzene, naphthalene, anthracene, and phenanthrene; and aromatic heterocycles in which a part of the carbon atoms constituting the aromatic hydrocarbon ring is replaced with a heteroatom. Examples of the heteroatom in the aromatic heterocycle include an oxygen atom, a sulfur atom, and a nitrogen atom. Specific examples of the aromatic heterocycle include a pyridine ring and a thiophene ring. R h01 ~R h04Specific examples of the aryl group in the above include a group in which one hydrogen atom has been removed from the aromatic hydrocarbon ring or aromatic heterocycle; a group in which one hydrogen atom has been removed from an aromatic compound containing two or more aromatic rings (such as biphenyl, fluorene, etc.); and a group in which one hydrogen atom of the aromatic hydrocarbon ring or aromatic heterocycle has been substituted with an alkylene group (such as arylalkyl groups such as benzyl, phenethyl, 1-naphthylmethyl, 2-naphthylmethyl, 1-naphthylethyl, and 2-naphthylethyl). The number of carbon atoms of the alkylene group bonded to the aromatic hydrocarbon ring or aromatic heterocycle is preferably 1 to 4, more preferably 1 to 2, and particularly preferably 1. Among these, a group in which one hydrogen atom has been removed from the above-mentioned aromatic hydrocarbon ring or aromatic heterocycle, or a group in which one hydrogen atom of the above-mentioned aromatic hydrocarbon ring or aromatic heterocycle has been substituted with an alkylene group, is more preferred, and a group in which one hydrogen atom has been removed from the above-mentioned aromatic hydrocarbon ring, or a group in which one hydrogen atom of the above-mentioned aromatic hydrocarbon ring has been substituted with an alkylene group is even more preferred.

[0143] R h01 ~R h04 The aryl group in may have a substituent, for example, an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, a hydroxyl group, a carbonyl group, a nitro group, an amino group, a cyclic group, an alkylcarbonyloxy group, and the like.

[0144] The alkyl group as a substituent of the aryl group is preferably an alkyl group having 1 to 5 carbon atoms, and is preferably a methyl group, an ethyl group, a propyl group, an n-butyl group or a tert-butyl group. The explanations about the alkoxy group, halogen atom, halogenated alkyl group, carbonyl group and cyclic group as the substituent of the aryl group are the same as the explanations about the alkoxy group, halogen atom, halogenated alkyl group, carbonyl group and cyclic group as the substituent of the alkyl group described above. In the alkylcarbonyloxy group as a substituent of an aryl group, the alkyl portion preferably has 1 to 5 carbon atoms, and examples of the alkyl portion include a methyl group, an ethyl group, a propyl group, and an isopropyl group. Among these, a methyl group and an ethyl group are preferable, and a methyl group is more preferable.

[0145] However, in the above formula (T-ca-1), R h01 ~R h04 At least one of the groups is an aryl group which may have a substituent. Specific examples of the cation represented by the formula (T-ca-1) are shown below.

[0146] [ka]

[0147] In the above formula (T-ca-2), R h05 ~R h07 The alkyl group and aryl group in R h01 ~R h04 This is the same as the explanation for the alkyl group and aryl group in the above.

[0148] However, in the above formula (T-ca-2), R h05 ~R h07 At least one of the groups is an aryl group which may have a substituent. Specific examples of the cation represented by the formula (T-ca-2) are shown below.

[0149] [ka]

[0150] Regarding the anion part of the (T) component Examples of the anion moiety of the component (T) include a hexafluorophosphate anion, a trifluoromethanesulfonate anion, a perfluorobutanesulfonate anion, and a tetrakis(pentafluorophenyl)borate anion. Among these, hexafluorophosphate anion, trifluoromethanesulfonate anion, and perfluorobutanesulfonate anion are preferred, and hexafluorophosphate anion and trifluoromethanesulfonate anion are more preferred.

[0151] In the separation layer forming composition of the present embodiment, examples of the component (T) include trade names such as San-Aid SI-45, SI-47, SI-60, SI-60L, SI-80, SI-80L, SI-100, SI-100L, SI-110, SI-110L, SI-145, I-150, SI-160, SI-180L, SI-B3, SI-B2A, SI-B3A, SI-B4, and SI-300 (all manufactured by Sanshin Chemical Industry Co., Ltd.); CI-2921, CI-2920, CI-2946, CI-3128, CI-2624, CI-2639, and CI-2064 (manufactured by Nippon Soda Co., Ltd.); CP-66 and CP-77 (manufactured by ADEKA Corporation); FC-520 (manufactured by 3M); and K-PURE TAG-2396, TAG-2713S, TAG-2713, TAG-2172, TAG-2179, TAG-2168E, TAG-2722, TAG-2507, TAG-2678, TAG-2681, TAG-2679, TAG-2689, TAG-2690, TAG-2700, TAG-2710, TAG-2100, CDX -3027, CXC-1615, CXC-1616, CXC-1750, CXC-1738, CXC-1614, CXC-1742, CXC-1743, CXC-16 13, CXC-1739, CXC-1751, CXC-1766, CXC-1763, CXC-1736, CXC-1756, CXC-1821, CXC-1802- Commercially available products such as No. 60 and CXC-2689 (all manufactured by KING INDUSTRY) can be used.

[0152] The component (T) contained in the separation layer-forming composition of the present embodiment may be one type or two or more types. In the composition for forming a separation layer of this embodiment, among the above, hexafluorophosphate, trifluoromethanesulfonate, and perfluorobutanesulfonate are preferred as the component (T), trifluoromethanesulfonate is more preferred, and a quaternary ammonium salt of trifluoromethanesulfonic acid is even more preferred. When the separation layer forming composition of this embodiment contains the (T) component, the content of the (T) component is preferably 0.01 to 20 parts by mass, more preferably 1 to 15 parts by mass, and even more preferably 2 to 10 parts by mass, relative to 100 parts by mass of the (P) component. The separation layer forming composition of the present embodiment preferably does not contain the component (T).

[0153] Photoacid generator The separation layer forming composition of the present embodiment may contain a photoacid generator. Suitable examples of photoacid generators include onium salt-based acid generators such as sulfonium salts.

[0154] In the onium salt acid generator, preferred cationic moieties include a sulfonium cation and an iodonium cation.

[0155] A preferred anion moiety in the onium salt acid generator is tetrakis(pentafluorophenyl)borate ([B(C6F5)4] - );Tetrakis[(trifluoromethyl)phenyl]borate ([B(C6H4CF3)4] - );Difluorobis(pentafluorophenyl)borate ([(C6F5)2BF2] - );Trifluoro(pentafluorophenyl)borate ([(C6F5)BF3] - );Tetrakis(difluorophenyl)borate ([B(C6H3F2)4] - In addition, anions represented by the following general formula (b0-2a) are also preferred.

[0156] [ka] [In the formula, R bf05 is a fluorinated alkyl group which may have a substituent. 1 is an integer from 1 to 5.

[0157] In the above formula (b0-2a), R bf05 The fluorinated alkyl group in R preferably has 1 to 10 carbon atoms, more preferably has 1 to 8 carbon atoms, and even more preferably has 1 to 5 carbon atoms. bf05 As the alkyl group, a fluorinated alkyl group having 1 to 5 carbon atoms is preferable, a perfluoroalkyl group having 1 to 5 carbon atoms is more preferable, and a trifluoromethyl group or a pentafluoroethyl group is even more preferable. In the above formula (b0-2a), nb 1 is preferably an integer of 1 to 4, more preferably an integer of 2 to 4, and most preferably 3. nb 1 If is 2 or more, multiple R bf05 may be the same or different from each other.

[0158] The separation layer-forming composition of the present embodiment may contain one type of photoacid generator or two or more types of photoacid generators. When the composition for forming a separation layer of this embodiment contains a photoacid generator, the content of the photoacid generator is preferably 0.01 to 20 parts by mass, more preferably 1 to 15 parts by mass, and even more preferably 2 to 10 parts by mass, per 100 parts by mass of the (P) component. The separation layer forming composition of the present embodiment preferably does not contain a photoacid generator.

[0159] Photosensitizer component The separation layer forming composition of the present embodiment may contain a photosensitizer component. A suitable example of the photosensitizer component (hereinafter also referred to as “component (C)”) is an esterification reaction product (hereinafter also referred to as “component (C1)”) between a phenolic hydroxyl group-containing compound represented by the following chemical formula (c1) and a 1,2-naphthoquinone diazide sulfonic acid compound.

[0160] [ka]

[0161] Examples of the 1,2-naphthoquinone diazide sulfonic acid compound include a 1,2-naphthoquinone diazide-5-sulfonyl compound and a 1,2-naphthoquinone diazide-4-sulfonyl compound, and the like, with the 1,2-naphthoquinone diazide-5-sulfonyl compound being preferred.

[0162] Specific examples of suitable components (C1) are given below.

[0163] [ka] [In formula (c1-1), D 1 ~D 4 each independently represents a hydrogen atom or a 1,2-naphthoquinonediazide-5-sulfonyl group. D 1 ~D 4 At least one of the groups represents a 1,2-naphthoquinonediazide-5-sulfonyl group.

[0164] The esterification rate of the (C1) component is preferably 50 to 70%, and more preferably 55 to 65%. When the esterification rate is 50% or more, the film loss after alkali development is further suppressed, and the residual film rate is increased. When the esterification rate is 70% or less, the storage stability is further improved. The "esterification rate" here means, for the compound represented by formula (c1-1), D 1 ~D 4 is substituted with 1,2-naphthoquinonediazide-5-sulfonyl groups. The component (C1) is also preferred because it is very inexpensive and yet can achieve high sensitivity.

[0165] As the component (C), a photosensitizer component other than the component (C1) (hereinafter also referred to as "component (C2)") can be used. A suitable example of the (C2) component is an esterification reaction product of a phenolic hydroxyl group-containing compound ((C2-Phe) component) shown below with a 1,2-naphthoquinone diazide sulfonic acid compound (preferably a 1,2-naphthoquinone diazide-5-sulfonyl compound or a 1,2-naphthoquinone diazide-4-sulfonyl compound).

[0166] Examples of the (c2-phe) component include tris(4-hydroxyphenyl)methane, bis(4-hydroxy-3-methylphenyl)-2-hydroxyphenylmethane, bis(4-hydroxy-2,3,5-trimethylphenyl)-2-hydroxyphenylmethane, bis(4-hydroxy-3,5-dimethylphenyl)-4-hydroxyphenylmethane, bis(4-hydroxy-3,5-dimethylphenyl)-3-hydroxyphenylmethane, bis(4-hydroxy-3,5-dimethylphenyl)-2-hydroxyphenylmethane, Bis(4-hydroxy-2,5-dimethylphenyl)-4-hydroxyphenylmethane, Bis(4-hydroxy-2,5-dimethylphenyl)-3-hydroxyphenylmethane, Bis(4-hydroxy-2,5-dimethylphenyl)-2-hydroxyphenylmethane, Bis(4-hydroxy-3,5-dimethylphenyl)-3,4-dihydroxyphenylmethane, Bis(4-hydroxy-2,5-dimethylphenyl)-3,4-dihydroxyphenylmethane, Bis(4-hydroxy-2,5-dimethylphenyl)-2,4-dihydroxy Phenylmethane, bis(4-hydroxyphenyl)-3-methoxy-4-hydroxyphenylmethane, bis(5-cyclohexyl-4-hydroxy-2-methylphenyl)-4-hydroxyphenylmethane, bis(5-cyclohexyl-4-hydroxy-2-methylphenyl)-3-hydroxyphenylmethane, bis(5-cyclohexyl-4-hydroxy-2-methylphenyl)-2-hydroxyphenylmethane, bis(5-cyclohexyl-4-hydroxy-2-methylphenyl)-3,4-dihydroxyphenylmethane, bis(2 ,3,5-trimethyl-4-hydroxyphenyl)-2-hydroxyphenylmethane, 1-[1-(4-hydroxyphenyl)isopropyl]-4-[1,1-bis(4-hydroxyphenyl)ethyl]benzene, 1-[1-(3-methyl-4-hydroxyphenyl)isopropyl]-4-[1,1-bis(3-methyl-4-hydroxyphenyl)ethyl]benzene, 2-(2,3,4-trihydroxyphenyl)-2-(2',3',4'-trihydroxyphenyl)propane, 2-(2,4-dihydroxyphenyl)-2-(2',4'-dihydroxyphenyl)propane, 2-(4-hydroxyphenyl)-2-(4'-hydroxyphenyl)propane, 2-(3-fluoro-4-hydroxyphenyl)-2-(3'-fluoro-4'-hydroxyphenyl)propane, 2-(2,4-dihydroxyphenyl)-2-(4'-hydroxyphenyl)propane, 2-(2,3,4-trihydroxyphenyl)-2-(4'-hydroxyphenyl)propane, 2-(2,3,4-trihydroxyphenyl)-2-(4'-hydroxy-3',5'-dimethylphenyl)propane, bis(2,3,4-trihydroxyphenyl)methane, bis(2,4-dihydroxyphenyl)methane, 2,3,4-trihydroxyphenyl-4'-hydroxyphenylmethane, 1,1-di(4-hydroxyphenyl)cyclohexane, 2,4-bis[1-(4-hydroxyphenyl)isopropyl]-5-hydroxyphenol, and the like.

[0167] The component (C) contained in the composition for forming a separation layer of the present embodiment may be used alone or in combination of two or more. In the composition for forming a separation layer of the present embodiment, it is preferable to use the component (C1) as the component (C) among the above. When the composition for forming a separation layer of this embodiment contains the (C) component, the content of the (C) component is preferably 95 parts by mass or less, more preferably 50 to 95 parts by mass, and even more preferably 60 to 90 parts by mass, per 100 parts by mass of the (P) component. The separation layer forming composition of the present embodiment preferably does not contain the component (C).

[0168] Organic solvent components The separation layer-forming composition of the present embodiment may contain an organic solvent component (hereinafter also referred to as "component (S)") in order to adjust the coating workability and the like. Examples of the (S) component include linear hydrocarbons such as hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, and tridecane; branched hydrocarbons having 4 to 15 carbon atoms; cyclic hydrocarbons such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, and tetrahydronaphthalene; p-menthane, o-menthane, m-menthane, diphenylmenthane, 1,4-terpine, 1,8-terpine, bornane, norbornane, pinane, thujane, carane, longifolene, geraniol, nerol, Terpene solvents such as linalool, citral, citronellol, menthol, isomenthol, neomenthol, α-terpineol, β-terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydroterpinyl acetate, 1,4-cineole, 1,8-cineole, borneol, carvone, ionone, thujone, camphor, d-limonene, l-limonene, and dipentene; lactones such as γ-butyrolactone; acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl ketones such as isopentyl ketone and 2-heptanone; polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol and dipropylene glycol; compounds having an ester bond such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate and dipropylene glycol monoacetate, derivatives of polyhydric alcohols such as monoalkyl ethers of the polyhydric alcohols or compounds having an ester bond such as monomethyl ether, monoethyl ether, monopropyl ether and monobutyl ether, or compounds having an ether bond such as monophenyl ether (among these, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferred); cyclic ethers such as dioxane, and esters such as methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methoxypropyl acetate, methoxybutyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate and ethyl ethoxypropionate;Examples of aromatic organic solvents include anisole, ethyl benzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, phenetole, and butyl phenyl ether. The component (S) contained in the separation layer-forming composition of the present embodiment may be one type or two or more types.

[0169] In the separation layer forming composition of the present embodiment, the amount of the (S) component used is not particularly limited, and is appropriately set according to the coating film thickness and coatability at a concentration that can be applied to a support substrate, etc. Preferably, the (S) component is used so that the total amount of the (P) component in the separation layer forming composition is 70 mass % or less, preferably in the range of 5 to 50 mass %, more preferably in the range of 10 to 50 mass %, based on the total mass (100 mass %) of the composition.

[0170] Surfactants The separation layer forming composition of the present embodiment may contain a surfactant in order to adjust the coating workability and the like. Examples of the surfactant include silicone-based surfactants and fluorine-based surfactants. Examples of silicone surfactants that can be used include BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK-341, BYK-344, BYK-345, BYK-346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380, and BYK-390 (all manufactured by BYK Chemie). Examples of fluorine-based surfactants include F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-446, F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487, F-172D, MCF-350SF, and TF-10. 25SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF-1132, TF-1027SF, TF-1441, TF-1442 (all manufactured by DIC Corporation); Polyfox series PF-636, PF-6320, PF-656, PF-6520 (all manufactured by Omnova), etc. can be used.

[0171] The separation layer-forming composition of the present embodiment may contain one type of surfactant or two or more types of surfactants. When the separation layer forming composition of this embodiment contains a surfactant, the content of the surfactant is preferably 0.01 to 10 parts by mass, more preferably 0.02 to 2 parts by mass, and even more preferably 0.03 to 1 part by mass, per 100 parts by mass of the (P) component. If the content of the surfactant is within the above-mentioned preferred range, a separation layer having high flatness can be easily formed when the separation layer forming composition is applied onto a supporting substrate.

[0172] In the separation layer forming composition of this embodiment, the material constituting the layer peripheral portion is preferably a light absorbing resin, and a resin containing an aromatic ring or a condensed polycyclic skeleton in the main chain or side chain is preferably mentioned. As the condensed polycyclic skeleton, a condensed ring structure of an aromatic ring and an aromatic ring, or a condensed ring structure of an aromatic ring and an aliphatic ring is preferable. Among the materials constituting the layer peripheral portion, for example, a resin component (component (P1)) having a repeating unit represented by the above-mentioned general formula (p1) is more preferable. The material constituting the central portion of the layer is preferably a material containing fluorocarbon. In this specification, the term "light absorbing resin" refers to a resin that has the property of absorbing light with a wavelength in the range of 190 to 1300 nm.

[0173] (Second aspect: Manufacturing method of electronic components) A method for manufacturing an electronic component according to a second aspect of the present invention is a manufacturing method having a separation step of separating the supporting base from the laminate by using the supporting base separation method according to the first aspect described above, and a removal step of removing the adhesive layer adhering to the substrate after the separation step. 4A and 4B are schematic diagrams illustrating an example of a method for manufacturing a semiconductor package (electronic component), in which Fig. 4A is a diagram illustrating a separation step, and Fig. 4B is a diagram illustrating a removal step.

[0174] [Separation process] In the separation step, the support base is separated from the laminate by using, for example, the support base separation method according to the above-mentioned first to third embodiments. FIG. 4A shows the state after the support base 11 has been separated from the laminate 10 using the support base separation method of the first embodiment.

[0175] [Removal process] In the removing step, after the separating step, the adhesive layer and the separating layer attached to the substrate are removed. In FIG. 4A, after the separation step, a substrate 16 has an adhesion layer 14 and a release layer 12 attached thereto. In this embodiment, the adhesive layer 14 and the separation layer 12 attached to the substrate 16 are removed in the removal step, thereby obtaining the electronic component 40 shown in FIG. 4B.

[0176] Examples of methods for removing the adhesive layer 14 and the like attached to the substrate 16 include a method of removing the residue of the adhesive layer 14 and the separation layer 12 using a cleaning liquid, or a method of irradiating with plasma. As the cleaning liquid, a cleaning liquid containing an organic solvent is preferably used. As the organic solvent, it is preferable to use an organic solvent blended in the composition for forming the separation layer or an organic solvent blended in the composition for forming the adhesive layer.

[0177] The method for manufacturing an electronic component according to the present embodiment may further include, after the above-mentioned removing step, a step of performing a process such as forming solder balls, dicing, or forming an oxide film on the electronic component. EXAMPLES

[0178] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0179] <Evaluation of separation of the support base from the laminate (1)> Using a laminate in which a supporting base was bonded to a substrate, the separability of the supporting base from the laminate by light irradiation was evaluated. A glass substrate was used as the supporting base. As compositions for forming a separation layer, a material containing fluorocarbon (product name: US244, manufactured by Tokyo Ohka Kogyo Co., Ltd.) and a material containing resins GSP-01 and GSP-02 having repeating units represented by general formula (p1) (product name: CTRL9, manufactured by Gun-ei Chemical Industry Co., Ltd.) were used. As the adhesive layer forming composition, an elastomer adhesive containing H1051 (manufactured by Asahi Kasei Corporation) and Septon2002 (manufactured by Kuraray Co., Ltd.) [product name: TZNR (registered trademark)-A4017 (manufactured by Tokyo Ohka Kogyo Co., Ltd.)] was used. H1051 is a triblock copolymer of styrene-ethylene / butylene-styrene. Septon2002 is a polystyrene-poly(ethylene / propylene) block copolymer. The support separation device used was the same in configuration as the support separation device 100 shown in FIG. 1(a) and disclosed in Japanese Patent No. 6470414.

[0180] Example 1 -Laminate fabrication A laminate having a separation layer having the same configuration as the separation layer in the first embodiment described above, i.e., a configuration in which the peripheral portion of the layer is flush with the outer periphery of the central portion of the layer, was produced as follows. US244 was applied onto a glass substrate to form a film, forming a central layer. Next, CTRL9 was applied to an area within a range of 5 mm in length (L1) of the outer periphery of the central part of the layer. Then, curing was performed at 300°C / 10 min to form a layer peripheral part flush with the outer periphery of the central part of the layer. Next, an adhesive layer forming composition (TZNR (registered trademark)-A4017) was applied to the entire surface of the separation layer consisting of the central part of the layer and the layer peripheral part to form an adhesive layer, and then the layer was attached to a substrate to be processed to obtain a laminate.

[0181] A process for separating the support substrate from the laminate Using the support separating device, the layer periphery of the obtained laminate was irradiated with laser light from the glass substrate side The conditions for the laser light irradiation were set to a wavelength of 532 nm and a repetition rate of 40 kHz. After that, the glass substrate was lifted by a clamp, and dry air was blown into the gap formed between the substrate and the glass substrate. This caused the glass substrate to be separated from the laminate. The peeled interface at that time was the US244 / adhesive layer.

[0182] Example 2 -Laminate fabrication A laminate having a separation layer in the same form as the separation layer in the second embodiment described above, i.e., a first separation layer and a second separation layer stacked together, with the second separation layer serving as a layer covering the side surface of the first separation layer, was produced as follows. CTRL9 was applied to the glass substrate except for the area that would become the layer periphery (area up to a length (L2) of 5 mm), and cured at 350°C / 1 hr to form a first separation layer that would make up the layer center. CTRL9 was then applied up to the area that would become the layer periphery so as to cover the entire first separation layer. After that, curing was performed at 300°C / 10 min to form a second separation layer that covers the top and side surfaces of the first separation layer (in a plan view seen from the glass substrate side, the first separation layer constitutes the layer center, and the second separation layer portion covering the side surfaces of the first separation layer constitutes the layer periphery). Next, an adhesive layer-forming composition (TZNR (registered trademark)-A4017) was applied to the entire surface of the separation layer opposite the glass substrate, i.e., the entire surface of the second separation layer, to form an adhesive layer, which was then attached to the substrate to be processed to obtain a laminate.

[0183] A process for separating the support substrate from the laminate Using the support separating device, the layer periphery of the obtained laminate was irradiated with laser light from the glass substrate side The conditions for the laser light irradiation were set to a wavelength of 532 nm and a repetition rate of 40 kHz. After that, the glass substrate was lifted by a clamp, and dry air was blown into the gap formed between the substrate and the glass substrate. This caused the glass substrate to be separated from the laminate. The peeled interface at that time was the glass substrate / first separation layer (CTRL9 (cured at 350°C / 1hr)).

[0184] Example 3 -Laminate fabrication A laminate having a separation layer of the same form as the separation layer in the third embodiment described above, i.e., a form in which the third separation layer and the fourth separation layer are laminated such that the third separation layer is exposed on the outer periphery of the fourth separation layer in a planar view, was produced as follows. CTRL9 was applied to the entire surface of the glass substrate and cured at 300°C / 10 min to form a third separation layer. Next, US244 was applied onto the third separation layer to form a film, and the region that would become the layer periphery (region up to a length (L3) of 5 mm) was edge-cut with SL-Remover to form a fourth separation layer (in a plan view seen from above the glass substrate on the separation layer side, the fourth separation layer constitutes the layer center, and the third separation layer portion exposed on the periphery of the fourth separation layer constitutes the layer periphery). Next, an adhesive layer-forming composition (TZNR (registered trademark)-A4017) was applied to the entire surface of the separation layer opposite the glass substrate, i.e., the fourth separation layer and the third separation layer portion, to form an adhesive layer, which was then attached to the substrate to be processed to obtain a laminate.

[0185] A process for separating the support substrate from the laminate Using the support separation device, the layer periphery (third separation layer portion) of the obtained laminate was irradiated with laser light from the glass substrate side The conditions for the laser light irradiation were set to a wavelength of 532 nm and a repetition frequency of 40 kHz. After that, the glass substrate was lifted by a clamp, and dry air was blown into the gap formed between the substrate and the glass substrate. This caused the glass substrate to be separated from the laminate. The peeling interface at that time was the fourth separation layer (US244) / adhesive layer.

[0186] Comparative Example 1 CTRL9 was applied to the entire surface of the glass substrate and cured at 300°C for 10 minutes to form a CTRL9 layer. Next, an adhesive layer-forming composition (TZNR (registered trademark)-A4017) was applied onto the CTRL9 layer to form an adhesive layer, which was then attached to a substrate to be processed to obtain a laminate. Using the support separation device, the CTRL9 layer of the obtained laminate was irradiated with laser light from the glass substrate side. The conditions for the laser light irradiation were set to a wavelength of 532 nm and a repetition rate of 40 kHz. After that, an attempt was made to lift the glass substrate using a clamp, but this failed.

[0187] <Evaluation of adhesion between supporting base and substrate (1): Test Examples 1 to 6> Each separation layer was formed on an EXG glass substrate measuring 10 cm x 10 cm by changing the curing conditions as shown in Table 1. Next, a composition for forming an adhesive layer (TZNR (registered trademark)-A4017) was spin-coated onto the formed film to a thickness of 50 μm, and an adhesive layer was formed by heating at temperatures of 90°C, 160°C, and 220°C for 4 minutes each. Next, the adhesive layer was cut into strips having a width of 10 mm using a cutter. Next, the strip-shaped adhesive layer was pulled perpendicularly to the glass substrate at a speed of 200 mm / sec while the angle (peel angle) between the glass substrate and the strip-shaped adhesive layer was always kept at 90 degrees, thereby peeling the strip-shaped adhesive layer from the glass substrate. The adhesive strength (N) at this time was measured to determine the peel strength of the peel interface at this time. The results are shown in Table 1.

[0188] [Table 1]

[0189] In the separation layers in the above-mentioned Examples 1 to 3, the layer peripheral portions were all formed using CTRL9 as the material and under the curing conditions of 300° C. / 10 min (corresponding to Test Example 2). The central part of the layer in Example 1 is made of US244 (corresponding to Test Example 1). The central part of the layer in Example 2 is made of CTRL9 and is formed under the curing conditions of 350°C / 1hr (corresponding to Test Example 3). The central part of the layer in Example 3 is made of US244 (corresponding to Test Example 1). From the results shown in Table 1, it can be confirmed that the separation layer in Examples 1 to 3 is composed of a central portion and a peripheral portion of the layer, which have different adhesive strengths to the supporting base or adhesive layer; the peripheral portion of the layer has a higher adhesive strength than the central portion of the layer.

[0190] <Evaluation of separation of the support base from the laminate (2)> Using a laminate in which a supporting base was bonded to a substrate, the separability of the supporting base from the laminate by light irradiation was evaluated. A glass substrate was used as the supporting base. CTRL9 was used as the separation layer forming composition. As the release layer forming composition, a mixture (mass ratio 100 / 4) of a release layer coating agent TOMAX FS9309L (manufactured by Nippon Kako Toryo Co., Ltd.) using a silicone resin and a curing agent was used. As the adhesive layer-forming composition, TZNR (registered trademark)-A4017 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was used. The support separation device used was the same in configuration as the support separation device 100 shown in FIG. 1(a) and disclosed in Japanese Patent No. 6470414.

[0191] Example 4 -Laminate fabrication A laminate having a separation layer having the same configuration as the separation layer in the other embodiments described above, i.e., a configuration in which the third separation layer and the release layer are laminated so that the third separation layer is exposed on the outer periphery of the release layer when viewed in a plane, was prepared as follows. CTRL9 was applied to the entire surface of the glass substrate, and then dried at 90°C / 2 min, followed by curing at 300°C / 10 min to form a third separation layer. Next, the release layer forming composition was applied to the third separation layer to form a film, and the region that would become the layer periphery (region up to 5 mm in length (L3)) was edge-cut with propylene glycol monomethyl ether acetate (PGMEA), and curing was performed at 150°C / 5 min to form a release layer (in a plan view seen from above the glass substrate on the separation layer side, the release layer constitutes the layer center, and the third separation layer portion exposed to the outer periphery of the release layer constitutes the layer periphery). Next, an adhesive layer-forming composition (TZNR (registered trademark)-A4017) was applied to the entire surface of the separation layer opposite the glass substrate, i.e., the release layer and third separation layer portion, to form an adhesive layer, which was then attached to the substrate to be processed to obtain a laminate.

[0192] A process for separating the support substrate from the laminate Using the support separation device, the layer periphery (third separation layer portion) of the obtained laminate was irradiated with laser light from the glass substrate side The conditions for the laser light irradiation were set to a wavelength of 532 nm and a repetition frequency of 40 kHz. After that, the glass substrate was lifted by a clamp, and dry air was blown into the gap formed between the substrate and the glass substrate. This caused the glass substrate to be separated from the laminate. The peeling interface at that time was the release layer / adhesive layer.

[0193] <Evaluation of adhesion between supporting base and substrate (2): Test Example 7> CTRL9 was applied onto a 12-inch glass substrate, dried at 90°C / 2 min, and then cured at 300°C / 10 min to form a CTRL9 layer as the third separation layer. The release layer-forming composition was spin-coated onto the CTRL9 layer to a film thickness of 2 μm, and the edges were rinsed with propylene glycol monomethyl ether acetate (PGMEA) so that a 5 mm edge could be cut. The release layer was then formed by curing at 150°C for 5 minutes. Next, a composition for forming an adhesive layer (TZNR (registered trademark)-A4017) was spin-coated onto the formed separation layer to a film thickness of 50 μm, and an adhesive layer was formed by heating at temperatures of 90°C, 160°C, and 220°C for 4 minutes each. Next, the adhesive layer was cut into strips having a width of 10 mm using a cutter. Next, the strip-shaped adhesive layer was pulled perpendicularly to the glass substrate at a speed of 200 mm / sec while the angle (peel angle) between the glass substrate and the strip-shaped adhesive layer was always kept at 90 degrees, thereby peeling the strip-shaped adhesive layer from the glass substrate. The adhesive strength (N) at this time was measured to determine the peel strength of the peel interface at this time. The results are shown in Table 2.

[0194] [Table 2]

[0195] In the laminate in Example 4 described above, the peripheral portion of the layer is formed using CTRL9 as the material and cured under the conditions of 300°C / 10 min (corresponding to Test Example 2), while the central portion of the layer is formed using a release agent as the material (corresponding to Test Example 7). From the results shown in Table 2, it can be confirmed that the separation layer in Example 4 consists of a central portion and a peripheral portion which have different adhesive strength to the adhesive layer; the peripheral portion has a higher adhesive strength than the central portion.

[0196] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments. Addition, omission, substitution, and other modifications of the configuration are possible without departing from the spirit of the present invention. The present invention is not limited by the above description, but is limited only by the scope of the attached claims. [Explanation of symbols]

[0197] 10,20,30,50 laminate 11,21,31,51 Supporting base 12,22,32,52 separation layer 12A, 22A, 32A layer center part 12B, 22B, 32B Layer Edges 14,24,34,54 Adhesive layer 16,26,36,56 board 18,28,38,58 Encapsulant layer 40 Electronic Components

Claims

1. A method for separating a support base from a laminate in which a light-transmitting support base, a separation layer, an adhesive layer, and a substrate are stacked in this order, comprising the steps of: At least one surface of the separation layer includes a layer central portion and a layer peripheral portion, which have different adhesive strengths to the supporting base or the adhesive layer in a plan view, the peripheral portion of the layer is a region in which the adhesive strength is higher than that of the central portion of the layer and which is altered by irradiation with light, the supporting base and the adhesive layer are bonded together via the layer peripheral portion, A method for separating a supporting base, comprising: a step of irradiating a peripheral portion of the layer with light from the supporting base side to alter the peripheral portion of the layer, thereby separating the supporting base from the laminate.

2. 2. The method for separating a support base according to claim 1, wherein in the separation layer, the layer peripheral portion is disposed flush with an outer periphery of the layer central portion.

3. 3. The method for separating a supporting base according to claim 2, wherein a peel strength of an interface between the central part of the layer and the adhesive layer, measured by the following [Method (i) for measuring adhesive strength], is 2.5 N or less. [Method for measuring adhesive strength (i)] (1) A film is formed on a glass substrate measuring 10 cm x 10 cm using the composition for forming the central portion of the layer. (2) A composition for forming an adhesive layer is applied onto the formed film to a thickness of 50 μm, and the composition is heated at temperatures of 90° C., 160° C., and 220° C. for 4 minutes each to form an adhesive layer. (3) The adhesive layer is cut into strips having a width of 10 mm. (4) While always maintaining the angle (peel angle) between the glass substrate and the strip-shaped adhesive layer at 90 degrees, the strip-shaped adhesive layer is pulled perpendicularly to the glass substrate at a speed of 200 mm / sec to peel the strip-shaped adhesive layer from the glass substrate. The adhesive strength (N) at this time is measured and is regarded as the peel strength of the interface between the center of the layer and the adhesive layer.

4. the separation layer is a layer in which a first separation layer and a second separation layer are laminated, and the second separation layer covers a side surface of the first separation layer; The first separation layer constitutes the layer central portion, a portion of the second separation layer covering a side surface of the first separation layer constitutes the layer peripheral portion, the second separation layer has a higher adhesive strength than the first separation layer and is altered by irradiation with light; the first separation layer is disposed between the second separation layer and the supporting substrate; 2 . The support base separation method according to claim 1 , wherein the support base and the adhesive layer are bonded together via a portion of the second separation layer covering a side surface of the first separation layer.

5. 5. The method for separating a supporting base according to claim 4, wherein a peel strength of an interface between the first separation layer and the supporting base, measured by the following [Method (ii) for measuring adhesive strength], is 2.5 N or less. [Method for measuring adhesive strength (ii)] (1) On the supporting substrate having a size of 10 cm×10 cm, a composition for forming the first separation layer is used to form the first separation layer. (2) On the first separation layer, a composition for forming an adhesive layer is applied to a film thickness of 50 μm, and heated at temperatures of 90° C., 160° C., and 220° C. for 4 minutes each to form an adhesive layer. (3) The adhesive layer is cut into strips having a width of 10 mm. (4) While always maintaining the angle (peel angle) between the support base and the strip-shaped adhesive layer at 90 degrees, the strip-shaped adhesive layer is pulled perpendicularly to the glass substrate at a speed of 200 mm / sec, whereby the first separation layer is peeled off from the support base. The adhesive strength (N) at this time is measured and regarded as the peel strength at the interface between the support base and the first separation layer.

6. the separation layer is a layer in which a third separation layer and a fourth separation layer are laminated such that the third separation layer is exposed on an outer periphery of the fourth separation layer in a plan view; The fourth separation layer constitutes the layer central portion, a portion of the third separation layer exposed at an outer periphery of the fourth separation layer in a plan view constitutes the layer peripheral portion, the third separation layer has a higher adhesive strength than the fourth separation layer and is a layer that changes in quality when irradiated with light, the fourth separation layer is disposed between the third separation layer and the adhesive layer; 2 . The support base separation method according to claim 1 , wherein the support base and the adhesive layer are bonded together via a portion of the third separation layer exposed on an outer periphery of the fourth separation layer in a plan view.

7. 7. The method for separating a supporting base according to claim 6, wherein a peel strength of an interface between the fourth separation layer and the adhesive layer, measured by the following [Method (iii) for measuring adhesive strength], is 2.5 N or less. [Method for measuring adhesive strength (iii)] (1) On a glass substrate having a size of 10 cm×10 cm, a film is formed using the composition for forming the fourth separation layer. (2) A composition for forming an adhesive layer is applied onto the formed film to a thickness of 50 μm, and the composition is heated at temperatures of 90° C., 160° C., and 220° C. for 4 minutes each to form an adhesive layer. (3) The adhesive layer is cut into strips having a width of 10 mm. (4) While always maintaining the angle (peel angle) between the glass substrate and the strip-shaped adhesive layer at 90 degrees, the strip-shaped adhesive layer is pulled perpendicularly to the glass substrate at a speed of 200 mm / sec to peel the strip-shaped adhesive layer from the glass substrate. The adhesive strength (N) at this time is measured and is regarded as the peel strength of the interface between the center of the layer and the adhesive layer.

8. A separation step of separating the support base from the laminate by using the support base separation method according to any one of claims 1 to 7; a removing step of removing the adhesive layer attached to the substrate after the separating step; The method for manufacturing an electronic component includes the steps of:

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