Light emitting device

Abstract

To provide a compact light emitting device capable of reducing an adverse effect on a peripheral device due to heat generation of a light emitting body as much as possible while securing quick responsiveness and high synchronization accuracy related to blinking of each light emitting body.SOLUTION: A light emitting device includes: a light emitting device 2 including a plurality of light emitting bodies 22 arranged on a plane; a peripheral device 3 including peripheral elements 32 which are arranged separately in a reverse light direction of the light emitting device 2 and supplies power to the light emitting bodies 22 to control light emitting mode thereof; a coolant flow space 42 formed between the light emitting device 2 and the peripheral device 3; a plurality of heat sinks 44 disposed in the coolant flow space 42; and a plurality of electric lines 6 disposed between the adjacent heat sinks 44 so as to be arranged along a coolant flow direction and electrically connecting the light emitting device 2 and the peripheral device 3.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a light emitting device used for product inspection and the like, in which a large number of light emitting elements such as LEDs are arranged in a planar form. [Background technology]

[0002] Recently, inspection / measurement systems capable of measuring the appearance and surface of products are being developed using light emitting devices such as those shown in Patent Document 1.

[0003] For example, a phase-shift type inspection / measurement system is known in which each LED is individually controlled to turn on and off so that the light-emitting surface of the light-emitting device presents a striped or checkered pattern, or such a pattern is moved while light is irradiated onto the product to be inspected, thereby enabling distortion and external shape of the surface of the object to be inspected to be detected and measured with high accuracy. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2021-103613 A Summary of the Invention [Problem to be solved by the invention]

[0005] In such applications, each LED of the light emitting device is required to have fast response and high synchronization accuracy.

[0006] For this reason, it is preferable to place peripheral devices such as a power supply device and a blinking control device in the vicinity of the LED and to make the cable length between them as short as possible.

[0007] However, since the light-emitting device has many LEDs and dissipates a large amount of heat, placing the LEDs close to the peripheral devices causes the peripheral devices to be thermally affected by the LEDs. More specifically, the peripheral devices have a lower maximum rated temperature than the LEDs, and the temperature rises due to their own heat generation and the heat they receive from the LEDs, which causes problems such as the current flowing through the LEDs being suppressed, making it difficult to obtain the desired brightness, and the need to keep the LEDs far away from the peripheral devices.

[0008] The present invention has been made to solve these problems, and its main objective is to provide a compact light emitting device that can minimize the adverse effects on surrounding devices caused by heat generated by the light emitters, while ensuring fast responsiveness and high synchronization accuracy in the blinking of each light emitter, such as an LED. [Means for solving the problem]

[0009] In order to solve the above problems, the following configuration is adopted.

[0010] [1] A light-emitting device including a plurality of light-emitting bodies arranged in a planar shape; A peripheral device is provided at a distance from the light emitting device in a direction opposite to the light emitting direction, and the peripheral device supplies power to the light emitting body to control the light emitting mode of the light emitting body. a coolant flow space formed between the light emitting device and a peripheral device; A plurality of heat sinks disposed in the refrigerant flow space; a plurality of electrical lines arranged in the coolant flow direction between adjacent heat sinks, electrically connecting the light emitting device and peripheral devices; A light emitting device comprising:

[0011] In such a case, since a heat sink is disposed in the coolant flow space between the light emitting device and the peripheral device, the light emitting device and the peripheral device can be placed close to each other to ensure fast response and high synchronization accuracy of each light emitter, while the heat dissipation from the light emitting device can be performed well and the thermal effect of the light emitting device on the peripheral device can be suppressed as much as possible. In addition, since the light emitting device and the peripheral device can be placed close to each other, compactness (especially thinness) can be ensured.

[0012] Furthermore, since the multiple electrical lines are arranged in line along the direction of refrigerant flow, the flow of the refrigerant is hardly impeded and the heat dissipation function of the heat sink is ensured.

[0013] Furthermore, since the electrical lines are arranged between the heat sinks, their length can be made shorter than when the electrical lines are arranged around the periphery of the heat sink, which contributes to further improving the responsiveness and synchronization accuracy of each light emitter.

[0014] [2] The light emitting device is composed of a plurality of light emitting units each having an equal number of light emitters arranged as an electrical circuit; The light emitting device according to [1], wherein a plurality of electric lines are configured to extend from each of the light emitting units, and a heat sink is provided for each of the light emitting units.

[0015] In this way, each light-emitting unit is provided with its own heat sink, allowing for even heat dissipation. Furthermore, even if a product lineup includes light-emitting devices with different numbers of light-emitting units, areas, and shapes, a common heat sink can be used, allowing for standardization of parts.

[0016] [3] The light emitting device further includes a light emitter supporting substrate having the light emitter mounted on one side thereof, and the peripheral device further includes a peripheral element supporting substrate having the peripheral element mounted on one side thereof, and the other surfaces of the light emitter supporting substrate and the peripheral element supporting substrate are arranged facing each other. The light emitting device described in [1] or [2].

[0017] With this arrangement, the peripheral elements are disposed as far away as possible from the light emitting device across the coolant flow space and the peripheral element support substrate, so that the thermal influence from the light emitting device can be reduced.

[0018] [4] The light emitting device described in any one of [1] to [3] further comprises a housing that houses the light emitting device, peripheral devices, a heat sink and electrical lines, and the housing is formed with a refrigerant inlet for allowing a refrigerant to flow in from one side of the refrigerant flow space and a refrigerant outlet for allowing the refrigerant to flow out from the other side of the refrigerant flow space.

[0019] With such a case, the peripheral devices, heat sinks, and electrical lines can be supported by the housing, while still allowing the circulation of the coolant to dissipate heat reliably.

[0020] [5] The light emitting device according to [4], further comprising a first heat transfer body that is thermally connected to the light emitting device and the housing, and that is disposed so as to be in contact with the coolant flow space.

[0021] With this configuration, the first heat transfer body can dissipate heat from the light emitting device to the outside through the casing as well as through the circulation of the coolant.

[0022] [6] The light emitting device according to [4] or [5], wherein the peripheral device is in contact with the housing directly or via a second heat conductor.

[0023] With this configuration, the second heat transfer body can also dissipate heat from the peripheral devices to the outside through the housing.

[0024] [7] A light-emitting device including a plurality of light-emitting bodies arranged in a planar shape; A peripheral device is provided at a distance from the light emitting device in a direction opposite to the light emitting direction, and the peripheral device supplies power to the light emitting body to control the light emitting mode of the light emitting body. a housing for accommodating the light emitting device and the peripheral devices; a first heat dissipation structure for dissipating heat of the light emitting device to the outside; a second heat dissipation structure that dissipates heat from the peripheral device to the outside; the first heat dissipation structure is disposed between the light emitting device and the peripheral device, and includes a first heat transfer body that is in contact with the light emitting device and the housing and transfers heat of the light emitting device to the housing; The second heat dissipation structure is provided on the opposite side of the peripheral device from the light-emitting device, and is characterized in that it has a second heat transfer body that is in contact with the peripheral device and the housing to transfer heat from the peripheral device to the housing.

[0025] In such a structure, a first heat dissipation structure is disposed between the light-emitting device and the peripheral device, so that the light-emitting device and the peripheral device can be placed close to each other to ensure fast response and high synchronization accuracy of each light-emitting element, while allowing for good heat dissipation from the light-emitting device and minimizing the thermal effects of the light-emitting device on the peripheral devices.

[0026] In addition, heat from the peripheral device is also dissipated from the housing to the outside via the second heat dissipation structure, improving durability against heat from the light-emitting device.

[0027] [8] The light emitting device according to [7], wherein the first heat transfer body has an insertion hole through which an electric line that electrically connects the light emitting device and a peripheral device passes.

[0028] With this arrangement, the length of the electric line can be made shorter than when the electric line is routed around the outer periphery of the first heat conductor, which can contribute to further improvement in the responsiveness and synchronization accuracy of each light-emitting element. Effect of the Invention

[0029] According to the present invention configured in this manner, it is possible to ensure the fast response and high synchronization accuracy of each light-emitting element such as an LED, while minimizing the adverse effects on surrounding devices caused by heat generated by the light-emitting elements, and also to achieve a compact design. [Brief description of the drawings]

[0030] [Figure 1] 1 is an overall view of a light emitting device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is an exploded perspective view of the light emitting device according to the embodiment. [Diagram 3] 2 is a plan view showing the light-emitting device of the embodiment and a light-emitting unit formed therein. FIG. [Figure 4] FIG. 2 is a cross-sectional view of the light emitting device in the embodiment. [Diagram 5] 4 is a partial cross-sectional side view showing the arrangement relationship of the light-emitting unit, the first heat dissipation structure, and the electric cable in the embodiment. FIG. [Figure 6] FIG. 2 is a schematic partial plan view showing an arrangement portion of an electric cable according to the embodiment; [Figure 7] FIG. 5 is a schematic cross-sectional view of a light emitting device according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] A light emitting device according to a first embodiment of the present invention will be described below with reference to the drawings.

[0032] [First embodiment] <Summary> This light emitting device 100 constitutes part of a phase-shift type inspection / measurement system, and as shown in Figures 1 and 2, comprises a rectangular parallelepiped housing 1, and a light emitting device 2, a peripheral device 3, a first heat dissipation structure 4, a second heat dissipation structure 5, and an electrical cable 6 housed within this housing 1. <Each part configuration>

[0033] (1) Case 1 1 and 2, the housing 1 includes a rectangular flat bottom plate 11 and side plates 12 standing up from the four sides of the bottom plate 11, and is opened so that the surface facing the bottom plate 11 becomes the light-emitting surface 1a. Note that, for the sake of convenience, in the following description, the direction from the bottom plate 11 toward the light-emitting surface 1a may be referred to as "up" and the opposite direction as "down," but this does not refer to an absolute direction.

[0034] (2) Light-emitting device 2 As shown in Figures 1 to 4, the light-emitting device 2 includes a single LED wiring board 21 (referred to as a light-emitting body support board in the claims) having a rectangular flat plate shape, and a plurality of LEDs 22 (referred to as light-emitting bodies in the claims) arranged vertically and horizontally in a matrix on one surface (top surface) of the LED wiring board 21, and is disposed within the housing 1 so that one surface of the LED wiring board 21 and each of the LEDs 22 face upward, i.e., toward the opening of the housing 1.

[0035] In this embodiment, a diffusion plate 23 is further provided on the upper side of the light emitting device 2, and the upper surface of the diffusion plate 23 serves as the light emitting surface 1a.

[0036] More specifically, this light emitting device 2 is functionally composed of a plurality of light emitting units 2U, as shown in Fig. 3. Here, twelve light emitting units 2U are arranged vertically and horizontally in a 3x4 matrix.

[0037] Each light-emitting unit 2U has the same rectangular shape (square shape) in a plan view, and each has the same number of LEDs 22 that are equal in terms of electrical circuits. Also, a connector 24 (shown in FIG. 4) for supplying power to the LEDs 22 belonging to each light-emitting unit 2U is provided on the other surface (lower surface) of the wiring board portion belonging to each light-emitting unit 2U.

[0038] (3) Peripheral device 3 As shown in Figures 2 to 4, the peripheral device 3 includes a plurality of peripheral element mounting boards 31 each having a rectangular flat plate shape, and peripheral elements 32 mounted on one surface (the bottom surface) of the peripheral element mounting board 31, such as a DC-DC converter which is a power supply member, a FET which is a switching element which controls the lighting state of each of the LEDs 22, and a communication element which receives a control signal for the FET.

[0039] Here, the peripheral element mounting boards 31 are provided corresponding to the respective light emitting units 2U, and each peripheral element mounting board 31 is disposed directly below each light emitting unit 2U. Each peripheral element mounting board 31 is attached to a support plate 7 disposed above it so as to be spaced apart via a columnar spacer 71. The support plate 7 is a rectangular flat plate having roughly the same shape as the LED wiring board 21 in a plan view.

[0040] As described above, the peripheral elements 32 are mounted on the underside of the peripheral element mounting board 31, i.e., the side opposite to the side facing the light-emitting device 2 (light-emitting unit 2U), so as to face the bottom plate 11 of the housing 1, and the upper side of the peripheral element mounting board 31, i.e., the side facing the light-emitting device 2 (light-emitting unit 2U), is provided with a connector 34 to which an electrical cable 6 that supplies power to the light-emitting device 2 (light-emitting unit 2U) is connected.

[0041] (4) First heat dissipation structure 4 As shown in Figures 2 to 5, the first heat dissipation structure 4 is for dissipating heat from the light-emitting device 2, and includes a first heat transfer body 41 that thermally connects the light-emitting device 2 and the housing 1, a refrigerant circulation space 42 formed between the light-emitting device 2 and the peripheral device 3, a fan 43 that forcibly circulates refrigerant through this refrigerant circulation space 42, and a plurality of heat sinks 44 arranged in this refrigerant circulation space 42.

[0042] (4-1) First heat transfer body 41 The first heat transfer body 41 is composed of a heat transfer plate 411 made of, for example, a metal and having roughly the same shape as the LED wiring board 21 in a planar view, and a heat conduction sheet 412 having electrical insulation and viscoelasticity and sandwiched between the lower surface of the LED wiring board 21 and the upper surface of the heat transfer plate 411 so as to be in close contact with both.

[0043] Any or all of the side surfaces of the heat transfer plate 411 are thermally connected to the inner surface of the side plate 12 of the housing 1 directly or via a heat conductive sheet 412 or the like.

[0044] (4-2) Refrigerant circulation space 42 The coolant flow space 42 is set in the space inside the housing between the first heat transfer plate 411 and the support plate 7. A coolant inlet 42a and a coolant outlet 42b are provided in each of the pair of opposing housing side peripheral plates 12, and air as a coolant flows into the coolant flow space 42 from the coolant inlet 42a and flows out from the coolant inlet 42b. The coolant flow space 42 releases heat from the light-emitting device 2 to the outside by a forced air flow, and at the same time, it also plays a role in blocking the heat from the light-emitting device 2 from reaching the peripheral device 3.

[0045] (4-3) Fan 43 As shown in FIG. 4 etc., the fan 43 is attached to the refrigerant outlet and forcibly flows air into the refrigerant flow space 42 from the refrigerant inlet toward the refrigerant outlet.

[0046] (4-4) Heat sink 44 As shown in Figs. 5 and 6, the heat sink 44 is made of metal and includes a rectangular (square) flat base 441 and a plurality of parallel fins 442 standing up integrally from the flat base 441. The heat sink 44 is attached to the lower surface of the first heat transfer plate 411 so that the base is in close contact with the lower surface of the first heat transfer plate 411. In this embodiment, the plurality of heat sinks 44 are arranged vertically and horizontally so that the directions of the respective heat dissipation fins 442 are the same. Also, one heat sink 44 is configured to be located below one light-emitting unit 2U via the thermal conduction sheet 412 and the heat transfer plate 411. The heat sinks 44 release the heat of the light-emitting device 2 to the refrigerant circulation space 42 and are carried out to the outside together with the refrigerant.

[0047] (5)Second heat dissipation structure 5 4, the second heat dissipation structure 5 dissipates heat from the peripheral device 3 to the outside, and is configured by thermally connecting the top surface of the peripheral device 3 to the bottom plate 11 of the housing 1 directly or via a thermally conductive sheet 51, which is a second heat conductor. With this configuration, the second heat dissipation structure 5 transfers heat from the peripheral device 3 to the bottom plate 11 of the housing 1 and dissipates the heat to the outside.

[0048] (6) Electrical cable 6 Furthermore, in this embodiment, as shown in FIGS. 4 to 6, an electric cable 6, which is an electric line that electrically connects the light-emitting device 2 and the peripheral device 3, is provided.

[0049] More specifically, multiple electrical cables 6 are provided for each light-emitting unit 2U, and the electrical cables 6 are connected to connectors 24 provided on the lower surface of the LED wiring board 21 and corresponding connectors 34 provided on the upper surface of the peripheral element support board 31.

[0050] The heat transfer plate 411 and the heat conduction sheet 412 are formed with an elongated through hole 4a for inserting the connector 24 and the electric cable 6. The support plate 7 is also provided with an elongated through hole 7a for inserting the electric cable 6.

[0051] In the refrigerant flow space 42, the electric cables 6 are arranged in a line along the refrigerant flow direction between adjacent heat sinks 44. In Fig. 6, the lined up electric cables 6 are omitted and depicted as a long and narrow rectangle. <Effects> Such a configuration can provide the following advantages.

[0052] By placing the light emitting device 2 and the peripheral device 3 close to each other, the fast response and high synchronization accuracy of each LED 22 can be ensured, while the heat dissipation of the light emitting device 2 can be performed well and the thermal effect of the light emitting device 2 on the peripheral device 3 can be suppressed as much as possible. This makes it possible to increase the current flowing through the light emitting device 2 and to make the light emitting device 100 brighter.

[0053] Since the light emitting device 2 and the peripheral device 3 can be placed close to each other, compactness (particularly thinness) can be ensured.

[0054] Since the multiple electric cables 6 are arranged side by side in the direction of the flow of the refrigerant, the flow of the refrigerant is hardly impeded and the heat dissipation function of the heat sink 44 can be ensured.

[0055] Since the electric cable 6 is arranged between the heat sinks 44, the length of the electric cable 6 can be made shorter than when the electric cable 6 is arranged around the outer periphery of the heat sink 44, which contributes to further improving the responsiveness and synchronization accuracy of each LED 22.

[0056] Even if a product lineup includes light emitting devices 2 each having a different number of light emitting units 2U and different areas and shapes, a common heat sink 44 can be used, and parts can be standardized.

[0057] The first heat transfer body 41 allows the heat of the light emitting device 2 to be dissipated to the outside through the housing 1 as well as through the circulation of the coolant.

[0058] The second heat transfer body 51 also enables the heat of the peripheral device 3 to be dissipated to the outside through the housing 1.

[0059] [Second embodiment] As shown in FIG. 7, the light emitting device 100 of the second embodiment differs from the light emitting device of the first embodiment in that it does not have a refrigerant flow space 42, and therefore does not have a fan 43 or a heat sink 44.

[0060] The connector 24 of the LED wiring board 21 and the connector 34 of the peripheral element support board 31 are configured to be inserted into the insertion hole 4a penetrating the first heat transfer body 41 in the thickness direction and directly electrically connected to each other. That is, the electrical lines in this embodiment are the connectors 24, 34.

[0061] In the second embodiment, the same reference numerals are used to designate the members corresponding to those in the first embodiment.

[0062] [Other embodiments] The light emitter is not limited to an LED, but may be an LD or the like.

[0063] The number of light emitting units is not limited to the above, and they may be arranged in a single row. The light emitting device 2 may be a single structure instead of being divided into a plurality of light emitting units 2U.

[0064] In the above embodiment, the light emitting surface of the light emitting device is a rectangular flat surface, but it may be a circle, annulus, polygon, or a curved surface such as a cone.

[0065] When peripheral devices 3 are mounted on both sides of the peripheral element support substrate 31, it is preferable to place the one generating more heat on the bottom plate 11 side of the housing 1 and the one generating less heat on the first heat transfer body 41 side, but it is also possible to place the one generating more heat on the first heat transfer body 41 and the one generating less heat on the bottom plate 11 side of the housing 1.

[0066] Furthermore, the present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0067] 100...Light emission device 1. Housing 2. Light-emitting devices 2U Light Emitting Unit 21 LED wiring board (light emitter support board) 22 LED (light emitting device) 3. Peripheral Devices 31... Peripheral element support substrate 32 Peripheral elements 4...1st heat dissipation structure 41...First heat transfer body 42...Refrigerant circulation space 42a Refrigerant inlet 42b...Refrigerant outlet 44 Heat sink 5...Second heat dissipation structure 51...Heat conductive sheet (second heat transfer body) 6. Electrical cables (electrical lines)

Claims

1. A light-emitting device including a plurality of light-emitting bodies arranged in a planar shape; A peripheral device is provided on the opposite side of the light emitting device, and the peripheral device is provided with a peripheral element that supplies power to the light emitting body and controls the light emitting mode of the light emitting body. a coolant flow space formed between the light emitting device and a peripheral device; A plurality of heat sinks disposed in the refrigerant flow space; a plurality of electrical lines arranged in the coolant flow direction between adjacent heat sinks, electrically connecting the light emitting device and peripheral devices; A light emitting device comprising:

2. The light emitting device includes a plurality of light emitting units each having an equal number of light emitters arranged as an electrical circuit; 2. The light emitting device according to claim 1, wherein a plurality of electric lines extend from each of the light emitting units, and a heat sink is provided for each of the light emitting units.

3. The light emitting device further includes a light emitter support substrate having the light emitter mounted on one surface thereof; The peripheral device further includes a peripheral element support substrate having the peripheral element mounted on one surface thereof; 2. The light emitting device according to claim 1, wherein one surface of the light emitter support substrate and one surface of the peripheral element support substrate are arranged so as to face each other.

4. a housing for housing the light emitting device, peripheral devices, a heat sink, and electrical lines; 2. The light emitting device according to claim 1, wherein the housing is formed with a coolant inlet for allowing the coolant to flow in from one side of the coolant flow space, and a coolant outlet for allowing the coolant to flow out from the other side of the coolant flow space.

5. 5. The light emitting device according to claim 4, further comprising a first heat transfer body that thermally connects the light emitting device and the housing and is disposed so as to be in contact with the coolant flow space.

6. The light emitting device according to claim 4 , wherein the peripheral device is in direct contact with the housing or in contact with a second heat conductor therebetween.

7. A light-emitting device including a plurality of light-emitting bodies arranged in a planar shape; A peripheral device is provided at a distance from the light emitting device in a direction opposite to the light emitting direction, and the peripheral device supplies power to the light emitting body to control the light emitting mode of the light emitting body. a housing for accommodating the light emitting device and the peripheral devices; a first heat dissipation structure for dissipating heat of the light emitting device to the outside; a second heat dissipation structure that dissipates heat from the peripheral device to the outside; the first heat dissipation structure is disposed between the light emitting device and the peripheral device, and includes a first heat transfer body that is in contact with the light emitting device and the housing and transfers heat of the light emitting device to the housing; A light emitting device in which the second heat dissipation structure is provided on the opposite side of the peripheral device from the light emitting device, and is equipped with a second heat transfer body that is in contact with the peripheral device and the housing, respectively, and transfers heat from the peripheral device to the housing.

8. 8. The light emitting device according to claim 7, wherein the first heat transfer body has an insertion hole through which an electric line that electrically connects the light emitting device and a peripheral device passes.

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