Resin molding machine and method for manufacturing resin molded products

Abstract

To improve resin molding throughput by efficiently transporting molding objects.SOLUTION: It has a transfer mechanism 2 that carries the pre-molded substrate W into the molding dies 7A, 7B and carries the resin molded product P out of the molding dies 7A, 7B, a first transfer stage 3 onto which the pre-molded substrate W is transferred, a second transfer stage 4 onto which the resin molded product P is transferred, a supply mechanism 5 that supplies the pre-molded substrate W to the first transfer stage 3 and a collection mechanism 6 that collects the resin molded product P from the second transfer stage 4. The transfer mechanism 2 has a pre-molding transfer section 21 that carries the pre-molded substrate W from the first transfer stage 3 to the molding dies 7A and 7B, and a post-molding transfer section 22 that carries the resin molded product P from the molding dies 7A and 7B to the second transfer stage 4. The first transfer stage 3 and the second transfer stage 4 are arranged side by side, and the pre-molding transfer section 21 and the post-molding transfer section 22 are arranged side by side corresponding to the first transfer stage 3 and the second transfer stage 4.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Conventionally, as shown in Patent Document 1, a resin molding device for compression molding a plurality of workpieces has been considered. This resin molding device is configured such that a workpiece transport mechanism moves back and forth between a workpiece supply and storage section and a press section. Specifically, the workpiece transport mechanism removes the molded workpiece and supplies the unmolded workpiece when moving toward and away from an open compression molding die. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-136943 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned resin molding device performs a series of operations in which the work transport mechanism receives the work from the work supply and storage section, then moves to the press section, removes the molded work from the press section, supplies the work before molding, and stores the received molded work in the work supply and storage section.

[0005] Incidentally, in order to improve the throughput of resin molding, it is possible to increase the movement speed of the work transport mechanism to speed up the transport of workpieces before and after molding between the work supply and storage section and the press section.

[0006] However, there is a limit to how fast the work transport mechanism can move, and the more workpieces the work transport mechanism transports at one time, the longer it takes to supply the workpieces from the work supply and storage unit to the work transport mechanism, which hinders the improvement of throughput.

[0007] SUMMARY OF THE PRESENT DISCLOSURE OF THE PRESENT DISCLOSURE The present invention has been made to solve the above problems, and has as its main object to improve the throughput of resin molding by efficiently transporting molding objects. [Means for solving the problem]

[0008] That is, the resin molding apparatus of the present invention is a resin molding apparatus that performs resin molding on a molding object, and is equipped with a molding mold, a transport mechanism that transports the molding object before molding into the molding mold and transports the molding object after molding out of the molding mold, a first transfer stage to which the molding object before molding handed over to the transport mechanism is transferred, a second transfer stage to which the molding object after molding transported by the transport mechanism is transferred, a supply mechanism that supplies the molding object before molding to the first transfer stage, and a recovery mechanism that recovers the molding object after molding from the second transfer stage, wherein the transport mechanism has a pre-molding transport section that transports the molding object before molding from the first transfer stage to the molding mold, and a post-molding transport section that transports the molding object after molding from the molding mold to the second transfer stage, wherein the first transfer stage and the second transfer stage are arranged side by side, and the pre-molding transport section and the post-molding transport section are arranged side by side corresponding to the first transfer stage and the second transfer stage. Effect of the Invention

[0009] According to the present invention thus configured, the throughput of resin molding can be improved by efficiently transporting molding objects. [Brief description of the drawings]

[0010] [Figure 1]1 is a schematic diagram showing a configuration of a resin molding apparatus according to an embodiment of the present invention; [Diagram 2] 2A and 2B are a front view and a side view, respectively, illustrating a configuration of the resin molding module according to the embodiment. [Diagram 3] 10A is a schematic diagram showing a lever mechanism and FIG. 10B is a schematic diagram showing a rack-and-pinion mechanism, which are modifications of the interlocking mechanism. [Figure 4] FIG. 2 is a cross-sectional view showing a schematic configuration of a molding die according to the embodiment. [Diagram 5] 2 is a schematic diagram showing the configurations of a first transfer stage, a second transfer stage, and a transport mechanism in the embodiment. FIG. [Figure 6] 1A to 1C are diagrams showing schematic configurations of a substrate supply section and a molded product storage section in the embodiment, and also showing operations of supplying pre-molded substrates and recovering resin molded products between the substrate supply section and each transfer stage. [Figure 7] 5A to 5C are schematic diagrams showing specific operational states of a supply mechanism, a recovery mechanism, and a transport mechanism in the embodiment; [Figure 8] 5A to 5C are schematic diagrams showing specific operational states of a supply mechanism, a recovery mechanism, and a transport mechanism in the embodiment; [Figure 9] 5A to 5C are schematic diagrams showing specific operational states of a supply mechanism, a recovery mechanism, and a transport mechanism in the embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0012] A resin molding apparatus according to a first aspect of the present invention is a resin molding apparatus for resin molding an object to be molded, comprising: a mold; a transport mechanism for transporting the object to be molded before molding into the mold and transporting the object to be molded after molding out of the mold; a first transfer stage to which the object to be molded before being handed over to the transport mechanism is transferred; a second transfer stage to which the object to be molded after molding transported by the transport mechanism is transferred; a supply mechanism for supplying the object to be molded before molding to the first transfer stage; and a recovery mechanism for recovering the object to be molded after molding from the second transfer stage, wherein the transport mechanism has a pre-molding transport section for transporting the object to be molded from the first transfer stage to the mold and a post-molding transport section for transporting the object to be molded after molding from the mold to the second transfer stage, wherein the first transfer stage and the second transfer stage are arranged side by side, and the pre-molding transport section and the post-molding transport section are arranged side by side corresponding to the first transfer stage and the second transfer stage.

[0013] With this resin molding device, the loading / unloading operation including the loading operation from the first transfer stage to the mold and the unloading operation from the mold to the second transfer stage, and the supply / recovery operation including the supply operation of the molding object before molding to the first transfer stage and the recovery operation of the molding object after molding from the second transfer stage can be performed separately. This allows the molding object to be transported efficiently by performing the above-mentioned supply operation and recovery operation while performing the above-mentioned loading operation and unloading operation. As a result, the throughput of resin molding can be improved. In addition, when the first transfer stage and the second transfer stage are not provided, the molding object before molding is supplied to the transport mechanism, and the transport mechanism transports the molding object before molding to the molding mold. Furthermore, the transport mechanism transports the molding object after molding from the mold and recovers the molding object after molding that the transport mechanism transports. In this configuration, the molding object cannot be supplied or recovered while the transport mechanism is carrying it in or out. Furthermore, with the resin molding device of the present technology 1, the pre-molding conveying section can be configured to properly hold the molded object before molding, and the post-molding conveying section can be configured to properly hold the molded object after molding, allowing them to be transported stably. Furthermore, in the resin molding apparatus of the present technology 1, the pre-molding conveying section and the post-molding conveying section are arranged side by side corresponding to the first transfer stage and the second transfer stage, so that with the conveying mechanism stopped at a predetermined position, the operation of supplying the molded object before molding from the first transfer stage to the pre-molding conveying section and the operation of transferring the molded object after molding from the post-molding conveying section to the second transfer stage can be performed simultaneously, thereby efficiently transporting the molded object.

[0014] In the resin molding apparatus of Technology 2 according to the present invention, in addition to the configuration of Technology 1 described above, it is desirable that the transport mechanism performs loading by the pre-molding transport section and unloading by the post-molding transport section during one round trip between a transfer module including the first transfer stage and the second transfer stage, and a molding module including the molding mold. With this configuration, the objects to be molded can be transported efficiently, and the throughput of resin molding can be improved.

[0015] As a specific arrangement of the first and second transfer stages, in the resin molding apparatus of Technology 3 according to the present invention, in addition to the configuration of Technology 1 or 2 described above, it is desirable that the first and second transfer stages are arranged side-by-side along the transport direction of the transport mechanism.

[0016] As a specific embodiment for improving the throughput of resin molding, in addition to the configuration of any one of the above-mentioned technologies 1 to 3, the resin molding apparatus of Technology 4 according to the present invention desirably has the following features: while the conveying mechanism is away from the first transfer stage and the second transfer stage, the supply mechanism supplies the molding object before molding to the first transfer stage, and the recovery mechanism recovers the molding object after molding from the second transfer stage.

[0017] The resin molding apparatus of Technology 5 according to the present invention, in addition to the configuration of Technology 3 or 4 described above, is provided with a plurality of the molding dies arranged along the vertical direction, and the transport mechanism has a plurality of the pre-molding transport sections and a plurality of the post-molding transport sections in the vertical direction corresponding to the plurality of the molding dies, and it is desirable that the first transfer stage is provided in a plurality of positions in the vertical direction corresponding to the plurality of the pre-molding transport sections, and the second transfer stage is provided in a plurality of positions in the vertical direction corresponding to the plurality of the post-molding transport sections. With this configuration, a plurality of pre-molding objects can be simultaneously transferred to a plurality of molding dies arranged vertically, and a plurality of molded objects can simultaneously be simultaneously removed from the plurality of molding dies. Also, the effects of providing the first transfer stage and the second transfer stage can be made even more pronounced.

[0018] In the resin molding apparatus of Technology 6 according to the present invention, in addition to the configuration of any one of Technologies 1 to 5 described above, it is desirable that at least one of the first transfer stage or the second transfer stage is configured to be movable in the vertical direction. With this configuration, if the first transfer stage is movable in the vertical direction, the pre-molding object can be reliably supplied to the transport mechanism. Also, even if the transport mechanism (the pre-molding transport section) is located on the first transfer stage, the vertical distance between the first transfer stage and the transport mechanism can be expanded, and the pre-molding object can be supplied to the first transfer stage. On the other hand, if the second transfer stage is movable in the vertical direction, the molded object can be reliably received from the transport mechanism. Also, even if the transport mechanism (the post-molding transport section) is located on the second transfer stage, the vertical distance between the second transfer stage and the transport mechanism can be expanded, and the molded object can be collected from the second transfer stage.

[0019] As a specific embodiment of the supply mechanism, in addition to the configuration of any one of the above-mentioned techniques 1 to 6, the resin molding apparatus of technique 7 according to the present invention desirably has a molding object supply section that supplies the molding object before molding, and a molding object transfer section that transfers the molding object before molding from the molding object supply section to the first transfer stage.

[0020] As a specific embodiment of the recovery mechanism, in addition to the configuration of any one of the above-mentioned techniques 1 to 7, the resin molding apparatus of technique 8 according to the present invention desirably has a molding object storage section that stores the molding object after molding, and a molding object recovery section that recovers the molding object after molding from the second transfer stage to the molding object storage section.

[0021] In the resin molding apparatus of Technology 9 according to the present invention, in addition to the configuration of Technology 8 which is based on Technology 7 described above, it is desirable that the molding object transfer section and the molding object recovery section have a common transport robot which includes a holding unit which holds the molding object and a multi-joint arm section which moves the holding unit. With this configuration, the molding object transfer section and the molding object recovery section are formed from a common transport robot, so that the configuration of the resin molding apparatus can be simplified and the installation space required for the resin molding apparatus can be reduced.

[0022] A resin molding apparatus according to Technology 10 of the present invention, in addition to the configuration of Technology 7 or 9 described above, desirably has the object to be molded having an electronic component fixed to one surface, the object to be molded supplying unit supplies the object to be molded before molding in a first state in which the electronic component is on the upper side, the first transfer stage transfers the object to be molded before molding in a second state in which the electronic component is on the lower side, and the object to be molded transfer unit holds the object to be molded supplied in the first state and passes it to the first transfer stage in the second state. With this configuration, the molding object before molding can be stored in the first state, and dust can be prevented from adhering to the back surface (the surface held by the mold) of the molding object before molding, opposite the electronic components. As a result, defects in the appearance of the resin molded product can be prevented. In addition, since the molding object is in the second state on the first transfer stage, the molding object before molding in the second state can be supplied to the upper die of the mold by transporting it to the mold by the transport mechanism while still in the second state.

[0023] The manufacturing method of a resin molded product according to Technology 11 of the present invention is a manufacturing method of a resin molded product using a resin molding apparatus according to any one of Technologies 1 to 10 above, and is characterized in that it includes a loading step of loading the molded object before molding into the molding die by the conveying mechanism, a molding step of clamping the molding die to perform resin molding on the molded object before molding, and an unloading step of unloading the molded object after molding from the molding die by the conveying mechanism.

[0024] In addition to the configuration of the above-mentioned Technology 11, the manufacturing method for a resin molded product of Technology 12 according to the present invention is preferably such that the loading step and the unloading step are performed by the conveying mechanism during one round trip between the first transfer stage and the second transfer stage and the molding die.

[0025] In addition to the configuration of Technique 11 or 12 above, the manufacturing method for a resin molded product of Technology 13 according to the present invention is preferably configured such that, while the conveying mechanism is away from the first transfer stage and the second transfer stage, the supply mechanism supplies the molded object before molding to the first transfer stage, and the recovery mechanism recovers the molded object after molding from the second transfer stage.

[0026] <One embodiment of the present invention> DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. In addition, in any of the drawings shown below, for the purpose of easy understanding, some parts are omitted or exaggerated in schematic form as appropriate. The same components are denoted by the same reference numerals and the description thereof is omitted as appropriate.

[0027] <Overall configuration of resin molding equipment> The resin molding apparatus 100 of the first embodiment manufactures a resin molded product P by resin-sealing a substrate W, which is a molding object having electronic components Wx fixed to one surface, through resin molding using a resin material J. In the following, the molding object (substrate W) before resin molding is referred to as a "pre-molded substrate W", and the molding object (substrate W) after resin molding is referred to as a "molded substrate W" or a "resin molded product P".

[0028] Here, the substrate W is, for example, rectangular in plan view, and examples thereof include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. Alternatively, the substrate W may be a carrier without wiring. The substrate W may be of other shapes, such as a circular shape, in plan view.

[0029] Examples of the resin material J include powdered resin (including granular resin), liquid resin, etc. Examples of the electronic component Wx include electronic elements such as semiconductor chips, resistor elements, and capacitor elements, or electronic components in which at least one of these electronic elements is sealed with resin.

[0030] 1, this resin molding apparatus 100 includes, as its components, a substrate supply / storage module A, two resin molding modules B, and a resin material supply module C. Each component (each of modules A to C) is detachable and replaceable with respect to the other components.

[0031] As shown in Fig. 1, the substrate supply / storage module A includes a transport mechanism 2 that transports a pre-molded substrate W into the molding dies 7A and 7B of the resin molding module B and transports a molded substrate W (resin molded product P) out of the molding dies 7A and 7B, a first transfer stage 3 onto which the pre-molded substrate W handed over to the transport mechanism 2 is transferred, a second transfer stage 4 onto which the resin molded product P transported by the transport mechanism 2 is transferred, a supply mechanism 5 that supplies the pre-molded substrate W to the first transfer stage 3, and a recovery mechanism 6 that recovers the resin molded product P from the second transfer stage 4. The specific configuration of each part of the substrate supply / storage module A will be described later. The substrate supply / storage module A corresponds to a transfer module including the first transfer stage 3 and the second transfer stage 4.

[0032] As shown in Fig. 2, each resin molding module B has a plurality of molding dies 7A, 7B (two in Fig. 2) arranged along the vertical direction, a clamping mechanism 8 that clamps the plurality of molding dies 7A, 7B, and an interlocking mechanism 9 that interlocks the clamping and opening of the plurality of molding dies 7A, 7B. Here, the upper molding die is also referred to as the first molding die 7A, and the lower molding die is also referred to as the second molding die 7B.

[0033] Resin molding module B has a fixed platen 10, a movable platen 11 that can be raised and lowered by a mold clamping mechanism 8, and an intermediate plate 12 that is disposed between the fixed platen 10 and the movable platen 11. A first molding die 7A is provided between the fixed platen 10 and the intermediate plate 12, and a second molding die 7B is provided between the intermediate plate 12 and the movable platen 11. The intermediate plate 12 is supported by a pair of side wall members 131, 132 to whose upper ends the fixed platen 10 is fixed so as to be slidable in the vertical direction. The pair of side wall members 131, 132 are provided on a base 14, and fix the fixed platen 10 at a predetermined height relative to the base 14.

[0034] The first mold 7A has an upper mold 71 and a lower mold 72 that are paired with each other. The second mold 7B also has an upper mold 71 and a lower mold 72 that are paired with each other. The upper mold 71 of the first mold 7A is provided on the lower surface of the fixed platen 10 directly or via another member. The lower mold 72 of the first mold 7A is provided on the upper surface of the intermediate plate 12 directly or via another member. Meanwhile, the upper mold 71 of the second mold 7B is provided on the lower surface of the intermediate plate 12 directly or via another member. The lower mold 72 of the second mold 7B is provided on the upper surface of the movable platen 11 directly or via another member. The movable platen 11 is moved up and down by a mold clamping mechanism 8 provided below the movable platen 11.

[0035] Here, first molding die 7A and second molding die 7B will be described with reference to FIG. The upper die 71 of each of the molding dies 7A and 7B sucks and holds the back surface (the surface on which the electronic components Wx are not fixed) of the substrate W. A suction port (not shown) is formed in the lower surface of the upper die 71, and a suction flow path (not shown) connected to the suction port is formed inside the upper die 71. This suction flow path is connected to an external suction device (not shown).

[0036] Further, the lower die 72 of each of the molding dies 7A and 7B has a cavity 72C that accommodates the electronic component Wx fixed to the substrate W and the resin material J. Specifically, the lower die 72 has a bottom member 721 that forms the bottom surface of the cavity 72C, and a frame-shaped side member 722 that surrounds the bottom member 721. The upper surface of the bottom member 721 and the inner peripheral surface of the side member 722 form the cavity 72C. Furthermore, the side member 722 is provided so as to be movable up and down relative to the bottom member 721. Specifically, the side member 722 is supported by a plurality of elastic members 724 such as coil springs on a base plate 723 of the lower die 72. Furthermore, the lower die 72 is covered with a release film F to improve the releasability of the resin molded product P. Also, an air vent (not shown) for discharging air or gas may be provided on the upper surface of the side member 722. Additionally, around the upper die 71 and the lower die 72 in each molding die, there is provided a sealing structure 15 consisting of side walls and sealing members such as O-rings for drawing a vacuum around the upper die 71 and the lower die 72 during resin molding.

[0037] The mold clamping mechanism 8 of this embodiment is of a linear motion type that uses a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement to raise and lower the movable platen. Note that the mold clamping mechanism 8 may also be of a link type that transmits a power source such as a servo motor to the movable platen using a link mechanism such as a toggle link.

[0038] The interlocking mechanism 9 synchronizes the clamping and opening of the first molding die 7A and the second molding die 7B by interlocking the lifting and lowering of the intermediate plate 12 with the lifting and lowering of the movable platen 11. In other words, the interlocking mechanism 9 makes it possible to clamp the first molding die 7A and the second molding die 7B at the same clamping speed, while simultaneously clamping them.

[0039] The interlocking mechanism 9 shown in FIG. 2 is configured using a pantograph mechanism 91 that expands and contracts as the movable platen 11 rises and falls. The pantograph mechanism 91 is configured from one cross link portion 911, an upper end link portion 912, and a lower end link portion 913. The upper end link portion 912 is fixed to the upper ends of a pair of side wall members 131 and 132, and the lower end link portion 913 is fixed to the movable platen 11 or a fixing member 110 that moves together with the movable platen 11. A rotation shaft 911a of the cross link portion 911 is fixed to the intermediate plate 12 or a fixing member 120 that moves together with the intermediate plate 12. When the movable platen 11 is driven by the mold clamping mechanism 8, the pantograph mechanism 91 expands and contracts accordingly, and the intermediate plate 12 connected to the cross link portion 911 moves up and down in conjunction with the movable platen 11.

[0040] As a modified example of the interlocking mechanism 9, as shown in FIG. 3(a), it may be one using a lever mechanism or one using a rack and pinion mechanism.

[0041] 3(a), the interlocking mechanism 9 using a lever mechanism has an arm 92 that rotates around one end of a fulcrum 92a, and the movable platen 11 and the intermediate plate 12 are connected to different positions of the arm 92 via connecting members 93a and 93b. When the movable platen 11 is driven by the mold clamping mechanism 8, the arm 92 rotates around the fulcrum 92a accordingly, and the intermediate plate 12 connected to the arm 92 moves up and down in conjunction with the movable platen 11.

[0042] 3(b), the interlocking mechanism 9 using a rack and pinion mechanism has a pair of rack gears 94a, 94b and a pinion gear 94c that meshes with the rack gears 94a, 94b, with one rack gear 94a provided on the side wall members 131, 132 and the other rack gear 94b provided on the movable platen 11 side. The pinion gear 94c that meshes with the pair of rack gears 94a, 94b is provided on the intermediate plate 12 side. By rotating the pinion gear 94c forward or backward by a motor (not shown), the movable platen 11 and the intermediate plate 12 move up and down in an interlocking manner.

[0043] 1, the resin material supply module C has a moving table 16, a resin material accommodation section 17 placed on the moving table 16, a resin material supply mechanism 18 that measures and supplies resin material J to the resin material accommodation section 17, and a resin material transport mechanism 19 that transports the resin material accommodation section 17 and supplies resin material J to the cavity 72C of the lower mold 72. Here, the resin material accommodation section 17 is configured using a holding frame that holds a release film F, and the resin material J is supplied by the resin material supply mechanism 18 onto the release film F held by the holding frame.

[0044] The moving table 16 moves within the resin material supplying module C between a resin supplying position by a resin material supplying mechanism 18 and a transport position for delivering the resin material accommodation portion 17 to a resin material transport mechanism 19.

[0045] Furthermore, the resin material transport mechanism 19 transports the resin material accommodation section 17, which accommodates the resin material J, from the resin material supply module C to the resin molding module B, and supplies the release film F and the resin material J to the lower die 72 of the molding dies 7A and 7B in the resin molding module B. Thereafter, the resin material transport mechanism 19 transports the resin material accommodation section 17 after the resin material J has been supplied from the resin molding module B to the resin material supply module C.

[0046] The resin material transport mechanism 19 of this embodiment has a resin material transport section 191 that transports the resin material accommodation section 17 that accommodates the resin material J, and a film recovery section 192 that recovers used release film F from the cavity 72C of the lower mold 72. Furthermore, the resin material transport mechanism 19 has a plurality of resin material transport sections 191 and a plurality of film recovery sections 192 in the vertical direction corresponding to the plurality of molding dies 7A, 7B.

[0047] <Specific configuration of each part of the substrate supply / storage module A> The substrate supply and storage module A includes a transport mechanism 2, a first transfer stage 3, a second transfer stage 4, a supply mechanism 5, and a recovery mechanism 6, as shown in FIGS.

[0048] 1, the transport mechanism 2 travels between the substrate supply / storage module A and the resin molding module B, and moves along rails (not shown) provided between the substrate supply / storage module A and the resin molding module B. The transport mechanism 2 receives the pre-molding substrate W temporarily placed (transferred) on the first transfer stage 3, and transports (carries) it to the upper mold 71 of the resin molding module B. After the pre-molding substrate W has been resin molded, the transport mechanism 2 receives the resin molded product P from the upper mold 71 of the resin molding module B, and transports (carries) it out to the second transfer stage 4.

[0049] Specifically, as shown in Figs. 1, 5 and 6, the transport mechanism 2 has a substrate transport section 21, which is a pre-molding transport section that transports a pre-molding substrate W, and a molded product transport section 22, which is a post-molding transport section that transports a resin molded product P. The substrate transport section 21 may be provided with a positioning pin (not shown) that is inserted into a positioning hole formed in the pre-molding substrate W. The transport mechanism 2 is configured so that the substrate transport section 21 and the molded product transport section 22 move simultaneously. In this embodiment, the substrate transport section 21 and the molded product transport section 22 are arranged side by side along the transport direction (here, the left-right direction). Here, the transport direction is also the movement direction of the transport mechanism 2.

[0050] 5 and 6, the transport mechanism 2 has a plurality of substrate transport sections 21 and a plurality of molded product transport sections 22 corresponding to the plurality of molding dies 7A, 7B arranged in the vertical direction. The plurality of substrate transport sections 21 are arranged in the vertical direction so as to supply pre-molded substrates W to each upper die 71 in the plurality of molding dies 7A, 7B that have been opened. The plurality of molded product transport sections 22 are arranged in the vertical direction so as to receive resin molded products P from each upper die 71 in the plurality of molding dies 7A, 7B that have been opened. The height positions of the substrate transport sections 21 and molded product transport sections 22 corresponding to each upper die 71 are the same.

[0051] As shown in Figs. 1, 5 and 6, the first transfer stage 3 is where the pre-molded substrate W supplied by the supply mechanism 5 is temporarily placed (transferred) and passes the pre-molded substrate W to the transport mechanism 2. Here, the pre-molded substrate W is transferred to the first transfer stage 3 in a second state (so-called chip-down state) in which the electronic components Wx are on the lower side. The first transfer stage 3 has holding claws (not shown) that hook and hold the end of the pre-molded substrate W in the second state, and holds the pre-molded substrate W in the second state by opening and closing the holding claws. The first transfer stage 3 may be provided with positioning pins (not shown) that are inserted into positioning holes formed in the pre-molded substrate W.

[0052] 5 and 6, a plurality of first transfer stages 3 are provided in the vertical direction corresponding to a plurality of substrate transport parts 21 in the transport mechanism 2. Furthermore, the plurality of first transfer stages 3 are configured to be movable in the vertical direction. Here, the plurality of first transfer stages 3 are configured to be movable in the vertical direction in synchronization with each other.

[0053] Specifically, as shown in Fig. 5 and Fig. 6, the substrate supply / storage module A has a first support member 31 that supports a plurality of first transfer stages 3 movably in the vertical direction, and a first guide mechanism 32 that guides the plurality of first transfer stages 3 in the vertical direction relative to the first support member 31. The first guide mechanism 32 has, for example, a first guide rail 321 provided on the first support member 31, and a first slide body 322 that supports the plurality of first transfer stages 3, for example, at equal intervals in the vertical direction and moves along the first guide rail 321. The first slide body 322 moves on the first guide rail 321 by an actuator (not shown) using, for example, a ball screw mechanism or an air cylinder.

[0054] 1, 5 and 6, the second transfer stage 4 is where the resin molded product P is temporarily placed (transferred) and receives the resin molded product P from the transport mechanism 2. Here, the resin-sealed electronic component Wx is transferred to the second transfer stage 4 in a second state (so-called tip-up state) on the lower side. The second transfer stage 4 has holding claws (not shown) that hook and hold the edges of the resin molded product P in the second state, and holds the resin molded product P in the second state by opening and closing the holding claws.

[0055] 5 and 6, a plurality of second transfer stages 4 are provided in the vertical direction corresponding to a plurality of molded product transport sections 22 in the transport mechanism 2. Furthermore, the plurality of second transfer stages 4 are configured to be movable in the vertical direction. Here, the plurality of second transfer stages 4 are configured to be movable in the vertical direction in synchronization with each other.

[0056] Specifically, as shown in Fig. 5 and Fig. 6, the substrate supply / storage module A has a second support member 41 that supports a plurality of second transfer stages 4 so as to be movable in the vertical direction, and a second guide mechanism 42 that guides the plurality of second transfer stages 4 in the vertical direction relative to the second support member 41. The second guide mechanism 42 has a second guide rail 421 provided on the second support member 41, and a second slide body 422 that supports the plurality of second transfer stages 4, for example, at equal intervals in the vertical direction and moves along the second guide rail 421. The second slide body 422 moves on the second guide rail 421 by an actuator (not shown) using, for example, a ball screw mechanism or an air cylinder.

[0057] 1, 5 and 6, the first transfer stages 3 and the second transfer stages 4 are arranged side by side in the left-right direction, and are at the same height. That is, the first transfer stages 3 and the second transfer stages 4 are provided in accordance with the positional relationship of the substrate transport sections 21 and the molded product transport sections 22 of the transport mechanism 2. In this embodiment, since the substrate transport sections 21 and the molded product transport sections 22 are arranged side by side in the left-right direction, the first transfer stages 3 and the second transfer stages 4 are also arranged side by side in the left-right direction.

[0058] With this configuration, while the transport mechanism 2 makes one round trip between the substrate supply / storage module A and the resin molding module B, it can perform a loading operation to transport multiple pre-molded substrates W from the first transfer stage 3 to the upper mold 71, and an unloading operation to transport multiple resin molded products P from the upper mold 71 to the second transfer stage 4.

[0059] As shown in Figures 1 and 6, the supply mechanism 5 has a substrate supply section 51, which is a molding object supply section that supplies a pre-molded substrate W, and a molding object transfer section 52 that transfers the pre-molded substrate W from the substrate supply section 51 to the first transfer stage 3.

[0060] The substrate supply section 51 includes a storage box 511 in which the pre-molded substrates W are stored, and a take-out mechanism 512 that takes out the pre-molded substrates W from the storage box 511. The storage box 511 stores a plurality of pre-molded substrates W in multiple vertical stages. The storage box 511 stores the pre-molded substrates W in a first state (so-called tip-up state) in which the electronic components Wx are on the upper side. The storage box 511 is configured so as to be removable from the resin molding apparatus 100. The take-out mechanism 512 takes out one pre-molded substrate W from the storage box 511, for example, by pinching it, and positions the pre-molded substrate W in the first state on a pre-molded substrate stage 513 of the substrate supply section 51. A guide rail 514 is provided between the storage box 511 and the pre-molded substrate stage 513.

[0061] The pre-molding substrate stage 513 may be configured to slide on the guide rail 514. In this case, when the pre-molding substrate stage 513 is located near the storage box 511, the take-out mechanism 512 takes out the pre-molding substrate W from the storage box 511 and places the taken-out pre-molding substrate W on the pre-molding substrate stage 513. The pre-molding substrate stage 513, for example, adsorbs and holds the pre-molding substrate W. Thereafter, the pre-molding substrate stage 513 moves in a direction away from the storage box 511 along the guide rail 514. In addition, the substrate supply unit 51 is provided with a confirmation mechanism (not shown) that, for example, checks whether the electronic components Wx are appropriately arranged on the pre-molding substrate W. In this configuration, for example, while the pre-molding substrate stage 513 is moving on the guide rail 514, the confirmation mechanism checks whether the electronic components Wx are appropriately arranged on the pre-molding substrate W from above. The confirmation mechanism is a laser displacement meter, a camera, or the like.

[0062] As shown in Figures 1 and 6, the recovery mechanism 6 has a molded product storage section 61, which is a molding object storage section that stores the resin molded product P, and a molding object recovery section 62 that recovers the resin molded product P from the second transfer stage 4 to the molded product storage section 61.

[0063] The molded product storage section 61 includes a storage box 611 in which the resin molded product P is stored, and a storage mechanism 612 that stores the resin molded product P in the storage box 611. The storage box 611 stores a plurality of resin molded products P in multiple vertical stages. The storage box 611 stores the resin molded products P in a first state (so-called tip-up state) in which the resin-sealed electronic components Wx are on the upper side. The storage box 611 is configured so as to be removable from the resin molding apparatus 100. The storage mechanism 612 stores the resin molded product P in the first state in the storage box 611 by pushing the resin molded product P on the resin molded product stage 613 of the molded product storage section 61. A guide rail 614 is provided between the storage box 611 and the resin molded product stage 613.

[0064] Furthermore, the storage mechanism 612 may sandwich the resin molded product P and move it to the vicinity of the storage box 611. In this case, after the resin molded product P moves to the vicinity of the storage box 611, the resin molded product P is pushed by the storage mechanism 612 or the like to be stored in the storage box 611.

[0065] Here, for convenience, the substrate supply section 51 and the molded product storage section 61 are shown arranged side by side in the front-to-rear direction in Fig. 1, but in order to reduce the installation space of the resin molding apparatus 100 (substrate supply / storage module A), the substrate supply section 51 and the molded product storage section 61 in this embodiment are arranged one above the other as shown in Fig. 6. It is noted that either the substrate supply section 51 or the molded product storage section 61 may be arranged on top. Also, the substrate supply section 51 and the molded product storage section 61 may be arranged side by side.

[0066] 1, the molding object transfer section 52 and the molding object recovery section 62 in this embodiment are configured from a common transport robot 20. This common transport robot 20 delivers pre-molding substrates W between the substrate supply section 51 and the first transfer stage 3, and delivers resin molded products P between the second transfer stage 4 and the molded product storage section 61. This transport robot 20 is provided between the substrate supply section 51 and the molded product storage section 61 and each of the transfer stages 3, 4 in a plan view.

[0067] Specifically, the transfer robot 20 has a holding unit 20a that holds the pre-molding substrate W and the resin molded product P, respectively, and an articulated arm section 20b that moves the holding unit 20a.

[0068] The holding unit 20a has holding claws (not shown) that hook and hold the edges of the pre-molded substrate W and the resin molded product P, and holds the pre-molded substrate W and the resin molded product P by opening and closing the holding claws.

[0069] The articulated arm section 20b is, for example, a vertical articulated robot (for example, an articulated robot having six joints). The articulated arm section 20b can control the position and posture of the holding unit 20a. Specifically, the articulated arm section 20b can turn the holding unit 20a holding the pre-molding substrate W or the resin molded product P upside down. The articulated arm section 20b also moves the holding unit 20a between the substrate supply section 51 and the first transfer stage 3, and between the molded product storage section 61 and the second transfer stage 4.

[0070] The transport robot 20 then holds the pre-molded substrate W supplied to the pre-molded substrate stage 513 in the first state, changes it to the second state and delivers it to the first transfer stage 3. The transport robot 20 also holds the resin molded product P transferred to the second transfer stage 4 in the second state, changes it to the first state and delivers it to the resin molded product stage 613 of the molded product storage section 61.

[0071] <An example of the operation of the resin molding apparatus 100> Next, an example of the operation of the resin molding apparatus 100 will be described with reference to Figures 1, 2 and 4. The operation described below is performed by a control unit COM provided in the substrate supply / storage module A, for example, by controlling each part of the resin molding apparatus 100. The control unit COM is a dedicated or general-purpose computer having a CPU, internal memory, an input / output interface, an AD converter, etc.

[0072] <Overall operation> First, in a state where each of the molds 7A, 7B is opened by the mold clamping mechanism 8, the conveying mechanism 2 conveys and holds the pre-molded substrate W to the upper mold 71 of each of the molds 7A, 7B (see Figs. 1 and 2). In addition, the resin material conveying mechanism 19 accommodates the release film F and the resin material J in the cavity 72C of the lower mold 72 of each of the molds 7A, 7B (see Fig. 1). In this way, the pre-molded substrate W, the release film F, and the resin material J are supplied to each of the molds 7A, 7B (see Fig. 4). The resin material J has thermosetting properties. The resin material J is heated by a heating mechanism (not shown) while being accommodated in the cavity 72C. This temporarily reduces the viscosity of the resin material J.

[0073] Next, the movable platen 11 is raised by the mold clamping mechanism 8. As the movable platen 11 rises, the pantograph mechanism 91 contracts, and the intermediate plate 12 connected to the rotation shaft 911a of the cross link portion 911 of the pantograph mechanism 91 rises. As the movable platen 11 rises, the periphery of the upper mold 71 and the lower mold 72 is sealed by the sealing structure 15 shown in FIG. 4, and the periphery of the upper mold 71 and the lower mold 72 is evacuated by a vacuum pump (not shown).

[0074] Thereafter, the clamping mechanism 8 further raises the movable platen 11, completing clamping of the first molding die 7A and the second molding die 7B, and by maintaining this state for a preset time, the temperature of the resin material J increases and the resin material J hardens. After the preset time has elapsed, the resin molding is completed.

[0075] After this resin molding, the mold clamping mechanism 8 lowers the movable platen 11, thereby opening the molding dies 7A, 7B. Then, the resin molded product P is stored in the molded product storage section 61 by the substrate supply / storage module A (see FIG. 1). A material having thermoplastic properties may be used as the resin material J. In this case, the resin material J is hardened by cooling.

[0076] <Specific Operations of the Supply Mechanism 5, the Recovery Mechanism 6, and the Transport Mechanism 2> Next, the transport operations of the supply mechanism 5, the recovery mechanism 6 and the transport mechanism 2 will be described with reference to FIGS.

[0077] First, the pre-molding substrate W is placed on the pre-molding substrate stage 513 from the storage box 511 of the substrate supply unit 51 by the take-out mechanism 512 (see FIG. 6). Here, on the pre-molding substrate stage 513, the pre-molding substrate W is in a first state (a so-called tip-up state).

[0078] The articulated arm section 20b of the transfer robot 20 moves the holding unit 20a to the pre-molded substrate stage 513. Then, the holding unit 20a holds the pre-molded substrate W on the pre-molded substrate stage 23. Thereafter, the articulated arm section 20b moves the holding unit 20a to the first transfer stage 3 while turning it over. Then, the holding unit 20a delivers the pre-molded substrate W in the second state to the first transfer stage 3 (see FIG. 6).

[0079] The supply mechanism 5 performs the above-mentioned supply operation on each of the plurality of first transfer stages 3 , whereby the pre-molding substrate W is supplied to each of the plurality of first transfer stages 3 .

[0080] Next, the transport mechanism 2 moves the multiple substrate transport parts 21 to the multiple first transfer stages 3 (see FIG. 7(a)). At this time, the multiple first transfer stages 3 are in a position raised by the first guide mechanism 32 (see FIG. 7(b)). Then, the multiple first transfer stages 3 are lowered by the first guide mechanism 32 to a predetermined substrate transfer position (see FIG. 8(a)). Thereafter, the multiple substrate transport parts 21 receive the multiple pre-molding substrates W in the second state all at once from the multiple first transfer stages 3 (see FIG. 8(b)).

[0081] Here, as the multiple substrate transport parts 21 move to the multiple first transfer stages 3, the multiple molded product transport parts 22 move to the multiple second transfer stages 4 (see FIG. 7(a)). At this time, the multiple second transfer stages 4 are in a position raised by the second guide mechanism 42 (see FIG. 7(b)). Then, the multiple second transfer stages 4 are lowered by the second guide mechanism 42 to a predetermined molded product receiving position (see FIG. 8(a)). Thereafter, if the multiple molded product transport parts 22 are holding multiple resin molded products P, the multiple molded product transport parts 22 deliver the multiple resin molded products P in the second state to the multiple second transfer stages 4 all at once (see FIG. 8(b)).

[0082] Then, when the above-mentioned operation of supplying the pre-molding substrate W to the transport mechanism 2 is completed, the first transfer stages 3 are raised by the first guide mechanism 32 (see FIG. 9(a)). Moreover, when the operation of transferring the resin molded product P to the second transfer stage 4 is completed, the second transfer stages 4 are raised by the second guide mechanism 42 (see FIG. 9(a)).

[0083] Thereafter, the transport mechanism 2 moves the multiple substrate transport sections 21, with the multiple substrate transport sections 21 holding the multiple pre-molded substrates W, to the multiple opened molding dies 7A, 7B (see Figure 9 (b)), and delivers the pre-molded substrates W to each of the multiple upper dies 71.

[0084] Here, before delivering the pre-molded substrates W from the plurality of substrate transport sections 21 to the plurality of upper dies 71, if the plurality of upper dies 71 hold a plurality of resin molded products P, the transport mechanism 2 receives the plurality of resin molded products P by the plurality of molded product transport sections 22. Then, after the plurality of molded product transport sections 22 receive the plurality of resin molded products P, the transport mechanism 2 delivers the pre-molded substrates W from the plurality of substrate transport sections 21 to the plurality of upper dies 71. In addition to the delivery of the pre-molded substrates W, a release film F and a resin material J are supplied to the plurality of lower dies 72 by the resin material transport mechanism 19. Thereafter, the molding dies 7A, 7B are clamped to perform resin molding on the pre-molded substrates W.

[0085] When a plurality of resin molded products P are transferred to a plurality of second transfer stages 4, the articulated arm section 20b of the transport robot 20 moves the holding unit 20a to the second transfer stage 4. Then, the holding unit 20a holds the resin molded product P on the second transfer stage 4. Thereafter, the articulated arm section 20b moves the holding unit 20a to the resin molded product stage 613 of the molded product storage section 61 while turning it over, and the holding unit 20a delivers the resin molded product P in the first state to the resin molded product stage 613 (see FIG. 6). After the resin molded product P in the first state is placed on the resin molded product stage 613, the storage mechanism 612 of the molded product storage section 61 pushes the resin molded product P on the resin molded product stage 613 to store it in the storage box 611. The storage mechanism 612 may hold an end of the resin molded product P and slide the resin molded product P along the guide rail 614 to the vicinity of the storage box 611. In this case, the storage mechanism 612 pushes the slid resin molded product P to store it in the storage box 611 .

[0086] The recovery mechanism 6 performs the recovery operation on each of the second transfer stages 4, whereby the resin molded products P are recovered from each of the second transfer stages 4.

[0087] When the transport mechanism 2 moves from the molding dies 7A, 7B to the first transfer stage 3 after delivering the pre-molding substrate W to the upper die 71, the molded product transport part 22 holds the resin molded product P. Then, the molded product transport part 22 of the transport mechanism 2 moves to the second transfer stage 4, whereby the resin molded product P is carried out.

[0088] In this way, on the outward path in which the transport mechanism 2 moves from the first transfer stage 3 and the second transfer stage 4 to the molding molds 7A, 7B, it transports the pre-molded substrate W from the first transfer stage 3 into the molding molds 7A, 7B. Also, on the return path in which the transport mechanism 2 moves from the molding molds 7A, 7B to the first transfer stage 3 and the second transfer stage 4, it transports the resin molded product P from the molding molds 7A, 7B to the second transfer stage 4.

[0089] In this embodiment, while the transport mechanism 2 is away from the first transfer stage 3 and the second transfer stage 4, the supply mechanism 5 supplies pre-molded substrates W to the multiple first transfer stages 3, and the recovery mechanism 6 recovers the resin molded products P from the multiple second transfer stages 4.

[0090] Here, the period when the transport mechanism 2 is away from the first transfer stage 3 and the second transfer stage 4 refers to (a) the period when the transport mechanism 2 is moving from each transfer stage 3, 4 toward the molding molds 7A, 7B, (b) the period when the transport mechanism 2 is receiving the resin molded product P from the molding molds 7A, 7B after moving to the molding molds 7A, 7B, (c) the period when the transport mechanism 2 is supplying the pre-molded substrate W to the molding molds 7A, 7B after moving to the molding molds 7A, 7B, or (d) the period when the transport mechanism 2 is moving from the molding molds 7A, 7B toward the first transfer stage 3 and the second transfer stage 4.

[0091] Furthermore, while the transport mechanism 2 is away from the first transfer stage 3 and the second transfer stage 4, either the supply operation of the pre-molding substrate W by the supply mechanism 5 (transport robot 20) or the recovery operation of the resin molded product P by the recovery mechanism 6 (transport robot 20) may be performed first.

[0092] Moreover, the operation of supplying the pre-molded substrate W and the operation of recovering the resin molded product P may be performed alternately. For example, the transport robot 20 may repeat an operation of transporting the resin molded product P from one of the second transfer stages 4 to the resin molded product stage 613, and subsequently transporting the pre-molded substrate W from the pre-molded substrate stage 513 to one of the first transfer stages 3. Also, the transport robot 20 may repeat an operation of transporting the pre-molded substrate W from the pre-molded substrate stage 513 to one of the first transfer stages 3, and subsequently transporting the resin molded product P from one of the second transfer stages 4 to the resin molded product stage 613.

[0093] In addition, in this embodiment, since the first transfer stage 3 and the second transfer stage 4 are configured to be movable in the vertical direction, when the transport mechanism 2 is located at the first transfer stage 3 and the second transfer stage 4, it is possible to increase the vertical distance between the first transfer stage 3 and the second transfer stage 4 and the transport mechanism 2. Then, with the vertical distance increased, the supply mechanism 5 can supply the pre-molded substrate W, and the recovery mechanism 6 can recover the resin molded product P.

[0094] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, the operation of carrying in the pre-molded substrate W from the first transfer stage 3 to the molds 7A and 7B and the operation of carrying out the resin molded product P from the molds 7A and 7B to the second transfer stage 4 can be performed separately from the operation of supplying the pre-molded substrate W to the first transfer stage 3 and the operation of recovering the resin molded product P from the second transfer stage 4. As a result, the pre-molded substrate W and the resin molded product P can be transported efficiently by performing the above-mentioned supplying operation and recovery operation while performing the above-mentioned carrying-in operation and carrying-out operation. As a result, the throughput of the resin molding can be improved. In addition, when the first transfer stage 3 and the second transfer stage 4 are not present, the pre-molded substrate W is supplied to the transport mechanism 2, and the transport mechanism 2 carries the pre-molded substrate W into the molds 7A and 7B. Furthermore, the transport mechanism 2 carries out the resin molded product P from the molds 7A and 7B, and recovers the resin molded product P carried out by the transport mechanism 2. In this configuration, while the transport mechanism 2 is carrying in or out, the supply of the pre-molding substrate W and the collection of the resin molded product P cannot be performed.

[0095] Furthermore, in this embodiment, since the transport mechanism 2 has a substrate transport section 21 and a molded product transport section 22, the substrate transport section 21 can be configured to properly hold the pre-molded substrate W, and the molded product transport section 22 can be configured to properly hold the resin molded product P, allowing them to be transported stably.

[0096] Furthermore, in this embodiment, the substrate transport section 21 and the molded product transport section 22 are arranged side by side in correspondence with the first transfer stage 3 and the second transfer stage 4 which are arranged side by side, so that with the transport mechanism 2 stopped at a predetermined position, the supply operation of the pre-molded substrate W from the first transfer stage 3 to the substrate transport section 21 and the transfer operation of the resin molded product P from the molded product transport section 22 to the second transfer stage 4 can be performed simultaneously, thereby enabling the transport of the pre-molded substrate W and the resin molded product P to be performed efficiently.

[0097] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0098] For example, the substrate supply unit 51 is configured to store the pre-molded substrate W in the first state (so-called tip-up state), but may be configured to store the pre-molded substrate W in the second state (so-called tip-down state). In this case, the molding target transfer unit 52 is configured not to turn the pre-molded substrate W upside down when transporting the pre-molded substrate W from the first transfer stage 3 to the pre-molded substrate stage 513.

[0099] Furthermore, although the molded product storage section 61 is configured to store the resin molded product P in the first state (so-called tip-up state), it may be configured to store the resin molded product P in the second state (so-called tip-down state). In this case, the molding target object recovery section 62 is configured not to turn the resin molded product P upside down when transporting the resin molded product P from the second transfer stage 4 to the resin molded product stage 613.

[0100] Furthermore, in the above embodiment, the supply mechanism 5 and the recovery mechanism 6 are configured using a common transport robot 20, but the supply mechanism 5 and the recovery mechanism 6 may be configured using separate transport robots. The transport mechanism 2 is also a common mechanism for transporting both the pre-molding substrate W and the resin molded product P, but the transport mechanism may be configured to include separate transport mechanisms for transporting the pre-molding substrate W and the resin molded product P.

[0101] Furthermore, the resin molding module B may have one molding die or three or more molding dies in addition to the two molding dies 7A and 7B. In these cases, the pre-molding conveying section and the post-molding conveying section of the conveying mechanism 2 are provided according to the number of molding dies, and the transfer stages 3 and 4 are provided according to the number of molding dies.

[0102] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0103] 100...Resin molding equipment W: Pre-molded substrate (molding target) Wx...Electronic components P... Resin molded products (molded objects) 2. Transport mechanism 21... Substrate transport section (pre-molding transport section) 22 Molded product transport section (post-molding transport section) 3. First transfer stage 4. Second transfer stage 5...Feeding mechanism 51: Substrate supply section (molding object supply section) 52 Molding object transfer section 6. Recovery mechanism 61 Molded product storage section (molded object storage section) 62... Molding object recovery section 7A, 7B...molding mold 20. Transport robot 20a···Holding unit 20b... Articulated arm section

Claims

1. A resin molding apparatus for molding a resin into a molding object, A molding die; a conveying mechanism that conveys the molding object before molding into the mold and conveys the molding object after molding out of the mold; a first transfer stage onto which the molding object before being handed over to the conveying mechanism is transferred; a second transfer stage onto which the molded object carried out by the conveying mechanism is transferred; a supply mechanism for supplying the molding object before molding to the first transfer stage; a recovery mechanism for recovering the molding object after molding from the second transfer stage, The transport mechanism includes: a pre-molding conveying section that conveys the molding object before molding from the first transfer stage to the molding die; a post-molding conveying section that conveys the molded object from the mold to the second transfer stage, The first transfer stage and the second transfer stage are arranged side by side, The pre-molding transport section and the post-molding transport section are arranged side by side corresponding to the first transfer stage and the second transfer stage.

2. The resin molding apparatus of claim 1, wherein the transport mechanism performs loading by the pre-molding transport section and unloading by the post-molding transport section during one round trip between a transfer module including the first transfer stage and the second transfer stage and a molding module including the molding mold.

3. The resin molding apparatus according to claim 1 , wherein the first transfer stage and the second transfer stage are arranged side by side along a transfer direction of the transfer mechanism.

4. A resin molding apparatus as described in any one of claims 1 to 3, wherein while the transport mechanism is away from the first transfer stage and the second transfer stage, the supply mechanism supplies the molding object before molding to the first transfer stage, and the recovery mechanism recovers the molding object after molding from the second transfer stage.

5. The molding machine includes a plurality of the molding dies arranged along a vertical direction, the conveying mechanism has a plurality of the pre-molding conveying sections and a plurality of the post-molding conveying sections in a vertical direction corresponding to the plurality of molding dies, The first transfer stage is provided in a plurality of positions in the vertical direction corresponding to the plurality of pre-molding transport sections, The resin molding apparatus according to claim 1 , wherein the second transfer stage is provided in a plurality of positions in the vertical direction corresponding to the plurality of post-molding transport sections.

6. The resin molding apparatus according to claim 1 , wherein at least one of the first transfer stage and the second transfer stage is configured to be movable in a vertical direction.

7. The supply mechanism includes: a molding object supplying section for supplying the molding object before molding; The resin molding apparatus according to claim 1 , further comprising: a molding object transfer section that transfers the unmolded molding object from the molding object supply section to the first transfer stage.

8. The recovery mechanism includes: a molding object storage section for storing the molding object after molding; The resin molding apparatus according to claim 1 , further comprising: a molding object recovery section that recovers the molding object after molding from the second transfer stage to the molding object storage section.

9. The resin molding apparatus according to claim 8, which recites claim 7, wherein the molding object transfer section and the molding object recovery section have a common transport robot equipped with a holding unit that holds the molding object and a multi-joint arm section that moves the holding unit.

10. the molding object has an electronic component fixed to one surface thereof, the molding object supply unit supplies the molding object before molding in a first state in which the electronic component is on an upper side, the first transfer stage is a stage on which the molding object before molding is transferred in a second state with the electronic component on a lower side, 10. The resin molding apparatus according to claim 7, wherein the molding object transfer section holds the molding object supplied in the first state and transfers it to the first transfer stage in the second state.

11. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 10, a carrying-in step of carrying the molding object before molding into the molding die by the conveying mechanism; a molding step of clamping the mold to perform resin molding on the molding object before molding; and a carrying-out step of carrying out the molded object after molding from the mold by the conveying mechanism.

12. The method for producing a resin molded product according to claim 11 , wherein the carrying-in step and the carrying-out step are performed by the conveying mechanism during one round trip between the first transfer stage and the molding die and between the second transfer stage and the molding die.

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