Substrate processing system

Abstract

To provide a substrate processing system that prevents a decrease in throughput.SOLUTION: A substrate processing system 1 includes a transfer device 3 provided with shelves 19, a batch processing device 7, and a single wafer processing device 5. The transfer device 3, the single wafer processing device 5, and the batch processing device 7 are arranged in a line in this order. The batch processing device 7 includes a first batch transport mechanism WTR1 that transports multiple substrates W all at once to, for example, a batch processing tank BT1. The first batch transport mechanism WTR1 receives the multiple substrates W that have been converted to a vertical position on the side of the transfer device 3, and transports them directly to, for example, the batch processing tank BT1 without using a substrate transport robot CR2 of the single wafer processing device 5.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a substrate processing system for processing substrates. Examples of the substrate include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices.

[0002] In a conventional substrate processing system, a load / unload device, a single wafer processing device, an interface device, and a batch processing device are arranged in this order (see, for example, Patent Document 1).

[0003] The loading / unloading device includes a stage for placing a cassette thereon, a first transfer device, and a first transition device for temporarily storing the substrate. The single wafer processing device includes a second transfer device and a second transition device for temporarily storing the substrate. The interface device includes a transfer robot and a lot forming unit.

[0004] The first transport device removes the five substrates from the cassette and transports the five substrates to the first transition device. The five substrates are held horizontally inside the cassette. The second transport device then receives the five substrates from the first transition device and transports the five substrates to the second transition device. The transport robot then receives the five substrates from the second transition device and transports the five substrates to the lot formation section. In the lot formation section, the five substrates are held vertically. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-064652 Summary of the Invention [Problem to be solved by the invention]

[0006] However, conventional substrate processing systems may have the following problems. For example, in the substrate processing system of Patent Document 1, in order to process a plurality of substrates collectively in a processing tank of a batch processing device, a transport robot of an interface device arranges a plurality of substrates in a vertical position in a lot formation section. Therefore, the substrates must pass through the single-wafer processing device and be transported from the load / unload device to the interface device. Here, a second transport device is used to pass the substrates through the single-wafer processing device. The second transport device is also used to transport the substrates from the liquid processing device to the drying device in the single-wafer processing device. The increased substrate transport load on the second transport device may result in a decrease in the throughput of the substrate processing system.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing system that prevents a decrease in throughput. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration: That is, the substrate processing system according to the present invention is a substrate processing system that performs batch processing for processing a plurality of substrates collectively and single wafer processing for processing the plurality of substrates one by one, and includes a transfer device provided with a carrier mounting shelf on which carriers for storing the plurality of substrates in a horizontal position with a predetermined interval therebetween are mounted, a batch processing device that processes the plurality of substrates collectively, and a single wafer processing device that processes the plurality of substrates one by one, the transfer device, the single wafer processing device, and the batch processing device being arranged in this order in a line and linearly, and the transfer device transfers the plurality of substrates taken out of the carriers mounted on the carrier mounting shelf. The single wafer processing apparatus comprises a first attitude conversion unit that converts the substrates from a horizontal attitude to a vertical attitude, the single wafer processing apparatus comprises a plurality of single wafer processing units that process substrates one by one, and a first substrate transport mechanism that transports substrates to the plurality of single wafer processing units, the batch processing apparatus comprises a batch processing unit that processes the plurality of substrates in a batch, and a first batch transport mechanism that transports the plurality of substrates in a batch to the batch processing unit, and the first batch transport mechanism receives the plurality of substrates converted to a vertical attitude by the first attitude conversion unit on the side of the transfer device, and transports them directly to the batch processing unit without using the first substrate transport mechanism of the single wafer processing apparatus.

[0009] According to the substrate processing system of the present invention, since the substrate transport mechanism of the single wafer processing device is not used when transporting substrates from the transfer device to the batch processing device, the load on the substrate transport mechanism is reduced and substrates can be transported quickly to the batch processing device, thereby improving the throughput of the substrate processing device.

[0010] In addition, in the above-mentioned substrate processing system, it is preferable that the batch processing device has a batch substrate transport area which is an area in which the first batch transport mechanism moves, the batch substrate transport area being arranged at one end side of the transfer device in a second horizontal direction perpendicular to a first horizontal direction in which the transfer device and the batch processing device are aligned, the batch substrate transport area extending from the transfer device to the batch processing unit of the batch processing device, the batch processing unit performing the batch processing on the plurality of substrates transported by the first batch transport mechanism, the first batch transport mechanism receiving the plurality of substrates that have been batch processed and transporting the plurality of substrates in a vertical position to the single-substrate processing device, the single-substrate processing device performing the single-substrate processing one by one of the plurality of single-substrate processing units that have been batch processed, and the transfer device transporting the plurality of substrates transported from the single-substrate processing device and that have been single-substrate processed to the carrier placed on the carrier mounting shelf.

[0011] The batch substrate transport area extends from the transfer device to a batch processing unit of the batch processing device, and is disposed on one end side of the transfer device in a second horizontal direction perpendicular to the first horizontal direction.

[0012] Furthermore, in the above-mentioned substrate processing system, it is preferable that the transfer device comprises a substrate handling mechanism having a hand that removes the multiple substrates in a horizontal position from the carrier placed on the carrier mounting shelf, a first position conversion unit that converts the multiple substrates transported by the substrate handling mechanism from a horizontal position to a vertical position, and a first vertical holding unit that holds the multiple substrates received from the first position conversion unit in a vertical position, and that the first batch transport mechanism receives the multiple substrates in the vertical position from the first vertical holding unit.

[0013] The first batch transfer mechanism can receive a plurality of substrates from a first vertical holding unit of the transfer device, and transfer the plurality of substrates in a vertical position from the transfer device to the batch processing device via the single substrate processing device.

[0014] Furthermore, in the above-mentioned substrate processing system, it is preferable that the single-wafer processing device has an interface area extending in the first horizontal direction, the multiple single-wafer processing units are provided on the opposite side of the batch substrate transport area via the interface area, the interface area has a horizontal position conversion mechanism for converting the multiple substrates transported by the first batch transport mechanism from a vertical position to a horizontal position, and the first substrate transport mechanism transports a single substrate in a horizontal position from the horizontal position conversion mechanism to the multiple single-wafer processing units.

[0015] For example, suppose there is an interface area between the single wafer processing apparatus and the batch processing apparatus. In this case, the presence of the interface area makes the substrate processing system longer in the first horizontal direction in which the transfer apparatus and the batch processing apparatus are aligned. In contrast, according to the present invention, the single wafer processing apparatus includes an interface area extending in the first horizontal direction and a single wafer processing unit. In addition, the single wafer processing unit is provided on the opposite side of the interface area from the batch substrate transport area. This configuration makes it possible to prevent the substrate processing system from becoming longer in the first horizontal direction.

[0016] In the above-mentioned substrate processing system, the single substrate processing apparatus includes a passing area and a single substrate transport area each extending in the first horizontal direction, the batch substrate transport area, the passing area and the single substrate transport area are arranged in this order in the second horizontal direction, the plurality of single substrate processing units are disposed on the opposite side of the passing area across the single substrate transport area, the first substrate transport mechanism is provided in the single substrate transport area, the passing area includes a transfer device side area adjacent to the transfer device, and a batch substrate processing apparatus side area adjacent to the transfer device side area and the batch substrate processing apparatus, and the batch substrate processing apparatus side area includes It is preferable that the system is provided with a horizontal position conversion mechanism that converts the multiple substrates transported by a first batch transport mechanism from a vertical position to a horizontal position, the horizontal position conversion mechanism comprising a second position conversion unit that converts the multiple substrates from a vertical position to a horizontal position, and a second substrate transport mechanism that is arranged on the opposite side of the batch processing device via the second position conversion unit, and that the second substrate transport mechanism transports one of the multiple substrates that has been converted to a horizontal position, and that the first substrate transport mechanism in the single substrate transport area receives the one substrate from the second substrate transport mechanism and transports the one substrate to the multiple single substrate processing devices.

[0017] According to the present invention, it is possible to prevent the substrate processing system from becoming long in the first horizontal direction. Also, a horizontal position changing mechanism is provided in the batch processing device side area of ​​the passing area. The horizontal position changing mechanism includes a second position changing unit and a second substrate transport mechanism. The second substrate transport mechanism is disposed on the opposite side of the batch processing device via the second position changing unit. That is, the second position changing unit and the second substrate transport mechanism are disposed in this order in the direction from the batch processing device toward the transfer device. Therefore, the first substrate transport mechanism can receive a substrate in a horizontal position at a position away from the batch processing device.

[0018] Furthermore, in the above-mentioned substrate processing system, it is preferable that the single-substrate transport area includes a third position change unit disposed between the transfer device and the first substrate transport mechanism, the third position change unit converting the multiple substrates transported by the first substrate transport mechanism from a horizontal position to a vertical position, and a second vertical holding unit holding the multiple substrates converted to the vertical position by the third position change unit in a vertical position, the first batch transport mechanism receiving the multiple substrates from the second vertical holding unit and transporting the multiple substrates in a vertical position to the transfer device, and the transfer device converting the multiple substrates transported from the single-substrate processing device and having undergone the single-substrate processing from a vertical position to a horizontal position, and transporting the multiple substrates converted to the horizontal position to the carrier placed on the carrier mounting shelf.

[0019] The third position conversion unit converts the multiple substrates transported by the first substrate transport mechanism from a horizontal position to a vertical position. The first batch transport mechanism receives the multiple substrates in a vertical position from the third position conversion unit via the second vertical holding unit, and transports the multiple substrates from the single substrate processing device to the transfer device. Also, by configuring in this manner, an existing transfer device can be used as the transfer device.

[0020] Furthermore, in the above-mentioned substrate processing system, it is preferable that the horizontal posture change mechanism is a waiting tank arranged between the second posture change unit and the batch processing device, and the waiting tank stores an immersion liquid in which the multiple substrates are immersed in a vertical posture.

[0021] The horizontal position changing mechanism can hold a plurality of substrates in a vertical position while immersing the plurality of substrates in the immersion liquid stored in the standby tank.

[0022] Furthermore, in the above-mentioned substrate processing system, it is preferable that the horizontal posture change mechanism includes a second batch transport mechanism having a pair of chucks in which multiple pairs of holding grooves and multiple pairs of passing grooves are arranged alternately, and when a group of substrates to be processed in which the multiple substrates and other multiple substrates are arranged alternately is immersed in the immersion liquid in the waiting tank, the second batch transport mechanism uses the pair of chucks to remove the multiple substrates from the group of substrates to be processed and transport the removed multiple substrates to the second posture change section.

[0023] The second batch transport mechanism can remove multiple substrates (first substrate group) from a processing substrate group in which multiple substrates (first substrate group) and other multiple substrates (second substrate group) are alternately arranged. The removed multiple substrates (first substrate group) are converted to a horizontal position by the second position conversion unit. Meanwhile, the other multiple substrates (second substrate group) can be made to wait while being immersed in the immersion liquid in the waiting tank. This can prevent the other multiple substrates (second substrate group) from drying out while waiting.

[0024] In addition, in the above-mentioned substrate processing system, the first batch transfer mechanism is provided with a pair of chucks that hold the multiple substrates in a vertical position, and the first batch transfer mechanism transports the multiple substrates held in a vertical position by the pair of chucks.

[0025] In the above-described substrate processing system, the batch processing unit is a batch processing tank that stores a processing liquid for immersing the plurality of substrates, and the plurality of single wafer processing units are a plurality of single wafer processing chambers. Effect of the Invention

[0026] According to the substrate processing system of the present invention, a decrease in throughput can be prevented. [Brief description of the drawings]

[0027] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing system according to an embodiment; [Diagram 2] FIG. 2 is a side view showing the substrate handling mechanism. [Diagram 3] 13(a) to 13(f) are side views illustrating the first attitude changing mechanism. [Figure 4] FIG. 2 is a left side view showing the substrate processing system. [Diagram 5] 13 is a plan view showing the standby tank, a second pusher mechanism, and a second batch transfer mechanism. FIG. [Figure 6] FIG. 4 is a plan view showing a second attitude change unit. [Figure 7] 1A is a side view showing the second pusher receiving multiple substrates from the first batch transport mechanism, and FIG. 1B is a side view showing the multiple substrates held by the second pusher being immersed in pure water in a waiting tank. [Figure 8] 6(a) to 6(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 9] 6(a) to 6(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 10] 13(a) to 13(c) are side views illustrating the configuration and operation of a third attitude change mechanism. [Figure 11] 4 is a flowchart for explaining an operation of the substrate processing system according to the embodiment. [Figure 12] 13(a) and (b) are plan views illustrating a second attitude changer unit according to a modified example. [Figure 13] FIG. 13 is a plan view showing a schematic configuration of a substrate processing system according to a modified example. [Figure 14] FIG. 13 is a plan view showing a schematic configuration of a substrate processing system according to a modified example. [Figure 15] FIG. 13 is a plan view showing a schematic configuration of a substrate processing system according to a modified example. [Figure 16] FIG. 13 is a plan view showing a schematic configuration of a substrate processing system according to a modified example. EXAMPLES

[0028] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing system 1 according to a first embodiment.

[0029] <1. Overall composition> Please refer to Fig. 1. The substrate processing system 1 includes a stocker apparatus 2, a transfer apparatus 3, a single wafer processing apparatus 5, a batch processing apparatus 7, and a batch substrate transport area R1. The stocker apparatus 2, the transfer apparatus 3, the single wafer processing apparatus 5, and the batch processing apparatus 7 are arranged in a line in this order. The batch processing apparatus 7 may also include a batch substrate transport area R1.

[0030] The substrate processing system 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing system 1 performs batch processing and single-wafer processing successively on a plurality of substrates W (for example, 50 or 25 substrates W). Specifically, the substrate processing system 1 employs a processing method that combines the batch and single-wafer processing methods (a so-called hybrid method). The batch method is a method in which a plurality of substrates W are processed collectively in a vertical position. The single-wafer method is a method in which a plurality of substrates W are processed one by one in a horizontal position.

[0031] For convenience, in this specification, the direction in which the transfer device 3 and the batch processing device 7 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. In the front-rear direction X, for example, the direction from the batch processing device 7 toward the transfer device 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right side" as appropriate. The direction opposite to the right side is referred to as the "left side." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0032] <2. Stocker equipment> The stocker device 2 contains at least one carrier C. The carrier C stores a plurality of (e.g., 25) substrates W in a horizontal position at a predetermined interval (e.g., 10 mm). In the carrier C, the plurality of substrates W in a horizontal position are aligned in the vertical direction Z. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited thereto.

[0033] The stocker apparatus 2 comprises a plurality of (e.g., two) load ports 9 and a stocker body 11. The two load ports 9 are adjacent to the front X of the stocker body 11. The two load ports 9 are arranged in the width direction Y. Each of the two load ports 9 is for loading and unloading a carrier C. The stocker apparatus 2 comprises a storage shelf 15 and a carrier transport robot 17. The storage shelf 15 is a shelf for storing the carrier C. The carrier C is placed on the storage shelf 15.

[0034] The carrier transport robot 17 transports the carrier C between the two load ports 9, the storage shelf 15, and a shelf 19 described below. The carrier transport robot 17 is equipped with a gripping unit 18 that grips a protrusion provided on the upper surface of the carrier C, for example. The gripping unit 18 is movable in the horizontal direction (front-rear direction X and width direction Y) and the vertical direction Z by the carrier transport robot 17. The carrier transport robot 17 is driven by one or more electric motors. Note that the carrier transport robot 17 may be a movable support unit that supports the lower surface of the carrier C.

[0035] <3.Transfer device> The transfer device 3 is provided with a shelf 19 on which the carrier C is placed. The transfer device 3 takes out a plurality of substrates W (e.g., 25 substrates) from the carrier C placed on the shelf 19. The transfer device 3 converts the plurality of substrates W taken out (e.g., 25 or 50 substrates) from a horizontal position to a vertical position. The transfer device 3 then delivers the plurality of substrates W converted to a vertical position to a first batch transport mechanism WTR1 (described later). The transfer device 3 (substrate handling mechanism HTR) then converts the plurality of substrates W that have been transported from the single-wafer processing device 5 and have been subjected to single-wafer processing from a vertical position to a horizontal position, and transports the plurality of substrates W converted to a horizontal position to the carrier C placed on the shelf 19.

[0036] The transfer device 3 will be described in detail. The transfer device 3 includes a shelf 19, a substrate handling mechanism (robot) HTR, and a first attitude conversion mechanism 21. The shelf 19 is a shelf for taking out and storing the substrate W. The carrier C is placed on the shelf 19. The shelf 19 corresponds to a carrier placement shelf of the present invention.

[0037] The substrate handling mechanism HTR is provided behind X of the shelf 19. The substrate handling mechanism HTR takes out a plurality of (e.g., 25) substrates W in a horizontal position from a carrier C placed on the shelf 19, and transports the taken-out substrates W to a first position changing mechanism 21.

[0038] Please refer to Fig. 2. The substrate handling mechanism HTR has a plurality of hands 23 (e.g., 25 hands). Each hand 23 holds one substrate W. For convenience of illustration, in Fig. 2, the substrate handling mechanism HTR is shown to have three hands 23. Also, in Figs. 3(a) to 3(f), a pair of horizontal holding parts 31B and a pair of vertical holding parts 31C, which will be described later, hold three substrates W. Also, a first pusher 33A, which will be described later, supports six substrates W.

[0039] The substrate handling mechanism HTR further includes a hand support section 25, an advancing / retreating section 27, and a lifting / rotating section 29. The hand support section 25 supports the multiple hands 23. This allows the multiple hands 23 to move as a unit. The advancing / retreating section 27 moves the multiple hands 23 forward and backward via the hand support section 25. The lifting / rotating section 29 rotates the advancing / retreating section 27 around a vertical axis AX1 to change the orientation of the hands 23. The advancing / retreating section 27 and the lifting / rotating section 29 each include an electric motor. The substrate handling mechanism HTR may also include a movable hand (not shown) for transporting only one substrate W, in addition to the hand 23.

[0040] 1 and 3(a) to 3(f). The first position change mechanism 21 includes a position change unit 31 and a first pusher mechanism 33. The substrate handling mechanism HTR, the position change unit 31, and the first pusher mechanism 33 (including the first pusher 33A) are arranged in this order in a width direction Y perpendicular to the front-rear direction X in which the transfer device 3 and the batch processing device 7 are arranged. That is, the position change unit 31 is arranged on the left side Y of the substrate handling mechanism HTR, and the first pusher mechanism 33 is arranged on the left side Y of the position change unit 31.

[0041] Please refer to FIG. 3(a). The attitude conversion unit 31 converts a plurality of substrates W (e.g., 25 substrates) transported by the substrate handling mechanism HTR from a horizontal attitude to a vertical attitude. The attitude conversion unit 31 includes a support table 31A, a pair of horizontal holding units 31B, a pair of vertical holding units 31C, and a rotation drive unit 31D. The pair of horizontal holding units 31B and the pair of vertical holding units 31C are provided on the support table 31A. When the substrates W are in a horizontal attitude, the pair of horizontal holding units 31B support the substrates W from below while contacting the lower surface of each substrate W. When the substrates W are in a vertical attitude, the pair of vertical holding units 31C hold the substrates W. The rotation drive unit 31D rotates the support table 31A around the horizontal axis AX2.

[0042] Please refer to FIG. 3(f). The first pusher mechanism 33 includes a first pusher 33A, a lifting and rotating unit 33B, a horizontal moving unit 33C, and a rail 33D. The first pusher 33A holds the lower portion of each of a plurality of substrates W (e.g., 25 or 50 substrates) in a vertical position. The first pusher 33A also holds the plurality of substrates W received from the position changing unit 31 in a vertical position. The lifting and rotating unit 33B lifts and lowers the first pusher 33A in the vertical direction Z. The lifting and rotating unit 33B also rotates the first pusher 33A around a vertical axis AX3. This allows the orientation of the device surface of the substrate W, indicated by the arrow AR1, to be in any direction.

[0043] The horizontal moving unit 33C horizontally moves the first pusher 33A and the lifting and rotating unit 33B along the rail 33D. The rail 33D extends in the width direction Y. Each of the rotary drive unit 31D, the lifting and rotating unit 33B, and the horizontal moving unit 33C includes an electric motor.

[0044] The position changer 31 corresponds to the first position changer of the present invention. The first pusher 33A corresponds to the first vertical holder of the present invention. The front-rear direction X corresponds to the first horizontal direction of the present invention. The width direction Y corresponds to the second horizontal direction of the present invention.

[0045] Here, the operation of the first position changing mechanism 21 will be described. For example, each of the four batch processing tanks BT1 to BT4 of the batch processing device 7, which will be described later, processes 50 substrates W corresponding to two carriers C at a time. For this reason, the first pusher 33A holds the 50 substrates W while changing the position of 25 of the 50 substrates W (W1, W2). The 25 substrates W1 are called the first substrate group. The 25 substrates W2 are called the second substrate group. The 50 substrates W (W1, W2) are called the processing substrate group. When the substrates W1 and W2 are not particularly distinguished from each other, the substrates W1 and W2 are described as substrates W.

[0046] See Fig. 3(a). The attitude conversion unit 31 receives 25 substrates W1 from the substrate handling mechanism HTR. At this time, the 25 substrates W1 are in a horizontal attitude and aligned at full pitch (e.g., 10 mm intervals). The full pitch is also called normal pitch. The device surface of each substrate W1 faces upward. The device surface of the substrate W is the surface on which electronic circuits are formed and is called the "front surface." The back surface of the substrate W refers to the surface on which electronic circuits are not formed. The surface opposite to the device surface is the back surface.

[0047] See Fig. 3(b). The rotary drive unit 31D of the attitude changing unit 31 rotates the pair of horizontal holding units 31B, etc. by 90 degrees around the horizontal axis AX2 to change the attitude of the 25 substrates W1 from a horizontal attitude to a vertical attitude. See Fig. 3(c). Thereafter, the first pusher mechanism 33 raises the first pusher 33A to receive the 25 substrates W1 from the attitude changing unit 31.

[0048] Refer to FIG. 3(d). After that, the first pusher mechanism 33 rotates the first pusher 33A 180 degrees around the vertical axis AX3. This changes the orientation of the 25 substrates W1 from the left Y to the right Y. Also, the attitude conversion unit 31 receives the 25 substrates W2 from the substrate handling mechanism HTR. Refer to FIG. 3(e). The first pusher mechanism 33 lowers the first pusher 33A holding the 25 substrates W1 to the retracted position. After that, the attitude conversion unit 31 converts the 25 substrates W2 from a horizontal attitude to a vertical attitude. Note that the attitude conversion unit 31 and the first pusher mechanism 33 are operated so as not to interfere with each other.

[0049] See Fig. 3(f). After that, the first pusher mechanism 33 raises the first pusher 33A holding the 25 substrates W1. As a result, the first pusher 33A receives an additional 25 substrates W2. The first pusher 33A holds 50 substrates W (W1, W2). The 25 substrates W1 and the 25 substrates W2 are arranged alternately. The 50 substrates W are aligned at a half pitch (e.g., 5 mm intervals). The half pitch is half the full pitch.

[0050] Thereafter, the first pusher mechanism 33 moves the first pusher 33A holding the 50 substrates W along the rails 33D to a first substrate transfer position PP1 below a pair of chucks 37, 38 (described later) of a first batch transport mechanism WTR1 (described later).

[0051] <4. Batch substrate transport area> Please refer to FIG. 1. The batch substrate transport region R1 is disposed, for example, at one end side of the transfer device 3 in the width direction Y perpendicular to the front-rear direction X in which the transfer device 3 and the batch processing device 7 are aligned. That is, the batch substrate transport region R1 is adjacent to the left side Y of the transfer device 3, the single wafer processing device 5, and the batch processing device 7. The batch substrate transport region R1 also extends from the transfer device 3 to the batch processing device 7 (four batch processing tanks BT1 to BT4 described below). That is, in the front-rear direction X, one end of the batch substrate transport region R1 extends to the transfer device 3. The other end of the batch substrate transport region R1 extends to the batch processing device 7 (four batch processing tanks BT1 to BT4).

[0052] The batch substrate transfer region R1 includes a batch transfer mechanism (robot) WTR1. The first batch transfer mechanism WTR1 transfers a plurality of substrates W in a vertical position between a first substrate transfer position PP1, a second substrate transfer position PP2, a standby tank 57, and four batch processing tanks BT1 to BT4.

[0053] The first substrate transfer position PP1, the second substrate transfer position PP2, the standby tank 57, and the four batch processing tanks BT1 to BT4 are aligned in a row in the front-rear direction X. Therefore, the first batch transport mechanism WTR1 transports a plurality of substrates W in the front-rear direction X.

[0054] The first batch transport mechanism WTR1 includes a pair of chucks 37, 38 and a guide rail 39. The pair of chucks 37, 38 includes 50 pairs of holding grooves for holding, for example, 50 substrates W in a vertical position. That is, each of the two chucks 37, 38 includes 50 holding grooves. The two chucks 37, 38 each extend in the width direction Y. The first batch transport mechanism WTR1 opens and closes the two chucks 37, 38. The guide rail 39 extends in the front-rear direction X. The first batch transport mechanism WTR1 moves the pair of chucks 37, 38 along the guide rail 39. The first batch transport mechanism WTR1 is driven by an electric motor.

[0055] <5. Batch processing equipment> The batch processing device 7 is adjacent to the rear X of the single wafer processing device 5. The batch processing device 7 processes a plurality of substrates W collectively. The batch processing device 7 performs a predetermined batch processing on the plurality of substrates W transported by the first batch transport mechanism WTR1. The batch processing device 7 includes, for example, four batch processing tanks BT1 to BT4. The four batch processing tanks BT1 to BT4 are aligned in a row in the front-rear direction X.

[0056] Each of the four batch processing tanks BT1 to BT4 collectively immerses and processes a plurality of (e.g., 25 or 50) substrates W. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (e.g., a chemical liquid or pure water) in which the plurality of substrates W are immersed.

[0057] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical processing tanks BT1, BT3 and two water rinsing processing tanks BT2, BT4. The chemical processing tank BT1 and the water rinsing processing tank BT2 form one set, and the chemical processing tank BT3 and the water rinsing processing tank BT4 form another set. The combination of the chemical processing tanks and the water rinsing processing tanks is not limited to this example. The number of batch processing tanks is not limited to four, and may be one or more than two.

[0058] The two chemical processing tanks BT1, BT3 each perform an etching process using a chemical liquid. For example, phosphoric acid is used as the chemical liquid. The chemical processing tanks BT1, BT3 each store a chemical liquid supplied from a chemical liquid jetting pipe (not shown). The two water rinsing processing tanks BT2, BT4 each perform a pure water cleaning process in which the chemical liquid adhering to multiple substrates W is washed away with pure water. For example, deionized water (DIW) is used as the pure water. The water rinsing processing tanks BT2, BT4 each store pure water supplied from a pure water jetting pipe (not shown).

[0059] Four lifters LF1 to LF4 are provided in each of the four batch processing tanks BT1 to BT4. For example, the lifter LF1 holds substrates W in a vertical position aligned at a predetermined half pitch (for example, 5 mm intervals). The lifter LF1 raises and lowers a plurality of substrates W between a processing position inside the batch processing tank BT1 and a transfer position above the batch processing tank BT1. The other three lifters LF2 to LF4 are configured in the same manner as the lifter LF1. Each of the four batch processing tanks BT1 to BT4 corresponds to a batch processing section of the present invention.

[0060] <6. Single wafer processing equipment> The single-wafer processing apparatus 5 processes, one by one, a plurality of (for example, 50 or 25) substrates W. That is, the single-wafer processing apparatus 5 performs a predetermined single-wafer processing on the plurality of substrates W that have been subjected to a predetermined batch processing, one by one.

[0061] The single substrate processing apparatus 5 is adjacent to the rear X of the transfer apparatus 3 and adjacent to the front X of the batch processing apparatus 7. The single substrate processing apparatus 5 includes a single substrate processing area R2 and an interface area R3 each extending in the front-rear direction X. The interface area R3 also includes a single substrate transport area R4 and a passing area R5 each extending in the front-rear direction X.

[0062] The single substrate processing area R2 and the interface area R3 (single substrate transport area R4 and passing area R5) each extend from the transfer device 3 to the batch processing device 7. The single substrate processing area R2 and the interface area R3 are arranged side by side in the width direction Y. The single substrate transport area R4 and the passing area R5 are arranged side by side in the width direction Y. The batch substrate transport area R1, the passing area R5, the single substrate transport area R4 and the single substrate processing area R2 are arranged in this order in the width direction Y (right side Y in FIG. 1). That is, the single substrate processing area R2 is adjacent to the right side Y of the single substrate transport area R4. The passing area R5 is adjacent to the left side Y of the single substrate transport area R4. The batch substrate transport area R1 is adjacent to the left side Y of the passing area R5.

[0063] <6-1. Single-substrate processing area> The single substrate processing region R2 is provided on the opposite side of the batch substrate transport region R1 across the interface region R3, and the single substrate processing region R2 is provided on the opposite side of the passing region R5 across the single substrate transport region R4.

[0064] The single substrate processing area R2 includes a rear tower TW1, a front tower TW2, and a substrate transport robot CR1. The rear tower TW1, the substrate transport robot CR1, and the front tower TW2 are provided along the single substrate transport area R4.

[0065] The rear tower TW1 is provided at the rear X of the substrate transport robot CR1. The front tower TW2 is provided at the front X of the substrate transport robot CR1. The rear tower TW1 includes one first single wafer processing chamber SW1 and two second single wafer processing chambers SW2 stacked in the vertical direction Z as shown in FIG. 4. The front tower TW2 includes three second single wafer processing chambers SW2 stacked in the vertical direction Z. That is, the single substrate processing region R2 includes six single wafer processing chambers SW1, SW2. Each single wafer processing chamber SW1, SW2 performs a predetermined single wafer processing on one substrate W. Each single wafer processing chamber SW1, SW2 corresponds to a single wafer processing section of the present invention.

[0066] The substrate transport robot CR1 includes a hand 41, an advancing / retreating unit 42, and a lifting / rotating unit 43. The hand 41 holds one substrate W in a horizontal position and is movable. The advancing / retreating unit 42 moves the hand 41 forward and backward. The lifting / rotating unit 43 raises and lowers the hand 41 and the advancing / retreating unit 42. In addition, the lifting / rotating unit 43 rotates the hand 41 and the advancing / retreating unit 42 around a vertical axis AX4 to change the orientation of the hand 41.

[0067] The substrate transport robot CR1 transports one substrate W in a horizontal position between the three single wafer processing chambers SW1, SW2 of the rear tower TW1 and the three second single wafer processing chambers SW2 of the front tower TW2. The types and numbers of the single wafer processing chambers provided in the rear tower TW1 and the front tower TW2 are set appropriately.

[0068] The first single wafer processing chamber SW1 includes, for example, a holding and rotating unit 45 and a nozzle 46. The holding and rotating unit 45 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 46 supplies a processing liquid onto the substrate W held by the holding and rotating unit 45. For example, pure water (e.g., DIW) and IPA (isopropyl alcohol) are used as the processing liquid. The first single wafer processing chamber SW1 performs a cleaning process on the substrate W with pure water, and then forms a liquid film of IPA on the upper surface of the substrate W.

[0069] Each of the second single wafer processing chambers SW2 performs drying processing using, for example, a supercritical fluid. For example, carbon dioxide is used as the fluid. When the fluid is carbon dioxide, the supercritical state is obtained when the critical temperature is 31° C. and the critical pressure is 7.38 MPa. By performing drying processing using a supercritical fluid, it is possible to make it difficult for pattern collapse to occur on the substrate W.

[0070] The second single wafer processing chamber SW2 includes a chamber body (container) 47, a support tray 48, and a lid. The chamber body 47 includes a processing space provided therein, an opening for inserting the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray 48. The lid closes the opening of the chamber body 47. For example, each second single wafer processing chamber SW2 brings a fluid into a supercritical state and supplies the supercritical fluid to the processing space in the chamber body 47 from the supply port. A drying process is performed on one substrate W by the supercritical fluid supplied to the processing space.

[0071] <6-2. Passage area> The passing area R5 includes a transfer device side area R7 and a batch processing device side area R8. The transfer device side area R7 is adjacent to the rear X of the transfer device 3. The batch processing device side area R8 is adjacent to the rear X of the transfer device side area R7 and adjacent to the front X of the batch processing device 7.

[0072] Fig. 5 is a plan view showing the standby tank 57, the second pusher 63A, and the second batch transport mechanism WTR2. Fig. 6 is a plan view showing the second attitude changing unit 59. Fig. 7(a) is a view showing how the second pusher 63A receives a plurality of substrates W from the first batch transport mechanism WTR1. Fig. 7(b) is a view showing how the plurality of substrates W held by the second pusher 63A are immersed in pure water in the standby tank 57.

[0073] <6-2-1. Batch processing device side area> As shown in FIG. 1, the batch processing device side area R8 includes a second position changing mechanism 55. The second position changing mechanism 55 changes the position of the substrates W transferred by the first batch transfer mechanism WTR1 from a vertical position to a horizontal position. The second position changing mechanism 55 includes a waiting tank 57, a second batch transfer mechanism (robot) WTR2, a second position changing unit 59, and a belt conveyor 61. The second position changing mechanism 55 corresponds to the horizontal position changing mechanism of the present invention. The second position changing unit 59 corresponds to the second position changing unit of the present invention. The belt conveyor 61 corresponds to the second substrate transfer mechanism of the present invention.

[0074] The standby tank 57 is disposed between the second position change unit 59 and the batch processing device 7. That is, the standby tank 57 is disposed in front of the four batch processing tanks BT1 to BT4, and is disposed behind the second position change unit 59. The standby tank 57 stores an immersion liquid in which a plurality of substrates W are immersed in a vertical position. Pure water (e.g., DIW) is used as the immersion liquid. The pure water is supplied from a pure water jetting pipe (not shown).

[0075] As shown in Fig. 5 and Fig. 7(a), a second pusher mechanism 63 is provided in the standby tank 57. The second pusher mechanism 63 includes a second pusher 63A that holds the lower portions of a plurality of substrates W (e.g., 50 or 25 substrates W) in a vertical position. The second pusher mechanism 63 can raise and lower the second pusher 63A and rotate the second pusher 63A about a vertical axis AX5. The second pusher mechanism 63 and a horizontal push-out mechanism 81 (described later) are driven by at least one of an electric motor and an air cylinder.

[0076] The second batch transport mechanism WTR2 transports a plurality of substrates W (for example, 25 substrates) in a vertical position from the standby tank 57 to the second position changing part 59 along a guide rail (not shown) extending in the front-rear direction X.

[0077] The second batch transfer mechanism WTR2 includes a pair of chucks 65, 66 and a drive unit 67. The pair of chucks 65, 66 includes multiple pairs (e.g., 25 pairs) of holding grooves 69, 70 and multiple pairs (e.g., 25 pairs) of passing grooves 73, 74. The 25 pairs of holding grooves 69, 70 and the 25 pairs of passing grooves 73, 74 are arranged alternately. The chuck 65 is provided with 25 holding grooves 69 and 25 passing grooves 73. The chuck 66 is provided with 25 holding grooves 70 and 25 passing grooves 74. The pair of chucks 65, 66 may include multiple pairs of passing grooves 73, 74 instead of the multiple pairs of passing grooves 73, 74.

[0078] For example, suppose that 50 substrates W1, W2 of a processing substrate group in which 25 substrates W1 (first substrate group) and another 25 substrates W2 (second substrate group) are alternately arranged are immersed in the immersion liquid in the standby tank 57. In this case, the second batch transport mechanism WTR2 uses a pair of chucks 65, 66 to remove 25 substrates W1 (W2) from the 50 substrates W1, W2 of the processing substrate group, and transports the removed 25 substrates W1 (W2) to the second attitude changing unit 59.

[0079] The drive unit 67 of the second batch transport mechanism WTR2 opens and closes the two chucks 65, 66. That is, the drive unit 67 moves the chucks 65, 66 in the width direction Y, for example, so as to move the chucks 65, 66 closer to or farther from each other. In FIG. 5, the chucks 65, 66 shown by solid lines are in a closed state. At this time, the chucks 65, 66 hold, for example, 25 substrates W1 out of the 50 substrates W1, W2 held by the second pusher 63A. In addition, a pair of chucks 65, 66 shown by dashed lines are in an open state. The chucks 65, 66 do not hold any of the 50 substrates W1, W2 held by the second pusher 63A.

[0080] Further, the driving unit 67 moves the pair of chucks 65, 66 along a guide rail (not shown) extending in the front-rear direction X. Each of the driving unit 67, a driving unit 79 (described later), and a horizontal push-out mechanism 81 (described later) includes at least one of an electric motor and an air cylinder.

[0081] For convenience of illustration, in Fig. 5 and Fig. 8(a), the second pusher 63A holds six substrates W (W1, W2). In Fig. 5, the pair of chucks 65, 66 includes three pairs of holding grooves 69, 70 and three pairs of passing grooves 73, 74. In Fig. 5, Fig. 8(b), and Fig. 9(a), the chucks 65, 66 and the chucks 77, 78 each hold three substrates W.

[0082] Please refer to FIG. 1 and FIG. 6. The second position conversion unit 59 converts a plurality of (e.g., 25) substrates W from a vertical position to a horizontal position. The second position conversion unit 59 is disposed between the belt conveyor 61 and the batch processing device 7. The second position conversion unit 59 includes a pair of chucks 77, 78, a drive unit 79, a horizontal push-out mechanism 81, and a position conversion tank 82. The second position conversion unit 59 holds, for example, 25 substrates W by sandwiching the substrates W between the chucks 77, 78. The pair of chucks 65, 66 includes a plurality of pairs (e.g., 25 pairs) of holding grooves 83, 84. In FIG. 6, the chucks 77, 78 are shown in cross section at the pair of holding grooves 83, 84.

[0083] The driving unit 79 opens and closes the two chucks 77, 78. That is, the driving unit 79 moves the chucks 77, 78 in the width direction Y so as to move the chucks 77, 78 closer to or farther away from each other. Note that the chucks 77, 78 shown in Fig. 6 are in an open state. In addition, in the open state, the 25 substrates W converted to a horizontal position are placed on the 25 pairs of holding grooves 83, 84.

[0084] Further, two rotating shafts 87, 88 are connected to the two chucks 77, 78, respectively. The rotating shafts 87, 88 each extend in the width direction Y. Further, the driving unit 79 rotates the chucks 77, 78 around the rotating shafts 87, 88 (horizontal axis AX6). The horizontal axis AX6 extends in the width direction Y.

[0085] The horizontal push-out mechanism 81 is disposed behind X of the substrate W held by the chucks 77, 78. As shown in Fig. 6, the horizontal push-out mechanism 81 includes a push-out member 81A that pushes out one substrate W in a horizontal position. The horizontal push-out mechanism 81 moves the push-out member 81A in the front-rear direction X.

[0086] The posture changing tank 82 stores pure water (for example, DIW) supplied from a pure water jet pipe (not shown). This allows the 25 substrates W held by the chucks 77 and 78 to be immersed in the pure water in the posture changing tank 82.

[0087] Refer to FIG. 1. The belt conveyor 61 is disposed on the opposite side of the batch processing device 7 across the second position changing unit 59. That is, the belt conveyor 61 is disposed in front X of the second position changing unit 59. The belt conveyor 61 transports the substrates W, which have been changed to a horizontal position, one by one in a direction from the batch processing device 7 toward the transfer device 3 (that is, the front X). The belt conveyor 61 includes two pulleys 61A, two belts 61B, and a pin lifting unit 61C. The two belts 61B are stretched around the two pulleys 61A. The pin lifting unit 61C is provided at the tip of the belt conveyor 61. The pin lifting unit 61C has three lift pins (not shown). The pin lifting unit 61C lifts one substrate W on the two belts 61B by the three lift pins. At least one of the two pulleys 61A and the pin lifting section 61C are each driven by an electric motor.

[0088] <6-2-2. Operation of the second attitude transformation mechanism> Here, the operation of the second position change mechanism 55 will be described. Figures 7(a) to 9(c) are diagrams for explaining the operation of the second position change mechanism 55. Note that in Figures 7(a) and 7(b), the lateral direction is the width direction Y. In contrast, in Figures 8(a) to 9(c), the lateral direction is the front-rear direction X.

[0089] First, the first batch transport mechanism WTR1 transports, for example, 50 substrates W that have been processed in one of the two water-rinsing processing tanks BT2, BT4 to above the standby tank 57 of the single-wafer processing device 5. At this time, the 50 substrates W are aligned in the width direction Y. Thereafter, the second pusher mechanism 63 raises the second pusher 63A. Also, the second pusher mechanism 63 rotates the second pusher 63A 90 degrees around the vertical axis AX5 so that the second pusher mechanism 63 can receive the 50 substrates W from the first batch transport mechanism WTR1. As a result, the holding grooves (not shown) of the second pusher 63A are aligned in the width direction Y. Thereafter, as shown in FIG. 7(a), the second pusher 63A holds the lower portions of the 50 substrates W held by the pair of chucks 37, 38 of the first batch transport mechanism WTR1.

[0090] Thereafter, the pair of chucks 37, 38 are opened, and the second pusher 63A receives the 50 substrates W from the first batch transport mechanism WTR1. The second pusher mechanism 63 lowers the second pusher 63A to a height position where the chucks 37, 38 do not interfere with the 50 substrates W held by the second pusher 63A. Thereafter, as shown by the dashed line in Fig. 7(b), the second pusher mechanism 63 rotates the 50 substrates W by 90 degrees around the vertical axis AX5 so that the 50 substrates W are aligned in the front-rear direction X. The direction of rotation is arbitrary.

[0091] Thereafter, the second pusher mechanism 63 immerses the 50 substrates W aligned in the front-rear direction X into the pure water in the standby tank 57 while passing the 50 substrates W between the two chucks 65, 66 of the second batch transport mechanism WTR2. At this time, the two chucks 65, 66 are in an open state.

[0092] Refer to Fig. 8(a). The two chucks 65, 66 remain in an open state. The second pusher mechanism 63 raises the 50 substrates W aligned in the front-rear direction X while passing the 50 substrates W through the two chucks 65, 66. In addition, the drive unit 79 (see Fig. 6) of the second position change unit 59 raises the pair of chucks 77, 78.

[0093] Refer to FIG. 8(b). The chucks 65, 66 of the second batch transport mechanism WTR2 are closed. After that, the second pusher mechanism 63 lowers the second pusher 63A. As a result, the second batch transport mechanism WTR2 holds 25 substrates W1 from the 50 substrates W1, W2 held by the second pusher 63A using the 25 pairs of holding grooves 83, 84 (see FIG. 5) of the chucks 65, 66 (see the broken lines in FIG. 8(b)). In addition, the 25 substrates W2 pass through the 25 pairs of passing grooves 73, 74 (see FIG. 5) of the chucks 65, 66, respectively. Therefore, the 25 substrates W2 remain on the second pusher 63A. The 25 substrates W2 are immersed in pure water in the standby tank 57 to prevent drying.

[0094] 8(b), the second batch transfer mechanism WTR2 moves the 25 substrates W1 held by the chucks 65, 66 to above the posture changing tank 82. That is, the 25 substrates W1 are moved between the chucks 77, 78 and the posture changing tank 82.

[0095] Please refer to Fig. 8(c). The chucks 77, 78 are in an open state. The second position changer 59 (driver 79) lowers the chucks 77, 78 to a predetermined height position. Thereafter, the second position changer 59 clamps the 25 substrates W1 between the chucks 77, 78. That is, the second position changer 59 closes the chucks 77, 78. As a result, the second position changer 59 holds the 25 substrates W1.

[0096] See Fig. 9(a). Thereafter, the second batch transport mechanism WTR2 opens the chucks 65, 66. As a result, the 25 substrates W1 are transferred to the chucks 77, 78 of the second position changer 59. Thereafter, the second batch transport mechanism WTR2 moves the open chucks 65, 66 to above the standby tank 57. Thereafter, the second position changer 59 lowers the chucks 77, 78 holding the 25 substrates W1. As a result, the 25 substrates W1 are immersed in the pure water in the position changer tank 82.

[0097] See Fig. 9(b). The second position changer 59 rotates the 25 substrates W1 by 90 degrees clockwise, for example, around the two rotating shafts 87 and 88 (horizontal axis AX6). As a result, the 25 substrates W1 are changed from a vertical position to a horizontal position in the pure water in the position change tank 82. In addition, the device surface of each substrate W1 faces upward.

[0098] 9(c). The second position changing unit 59, for example, raises the chucks 77, 78 to take out the single substrate W in the horizontal position from the pure water. When the chucks 77, 78 are in the open state, the horizontal push-out mechanism 81 pushes out the single substrate W1 taken out of the pure water in the forward direction X by the push-out member 81A. As a result, the single substrate W1 pushed out is transported to the belt conveyor 61.

[0099] After the 25 substrates W1 have been transported from the chucks 77, 78, the remaining 25 substrates W2 immersed in the pure water in the standby tank 57 are converted to a horizontal position. The second batch transport mechanism WTR2 holds the 25 substrates W2 in the 25 pairs of holding grooves 83, 84 of the chucks 65, 66. When converting to the horizontal position, the 25 substrates W2 may be rotated 90 degrees counterclockwise. Other operations are performed in the same manner as for converting the position of the 25 substrates W1 (see FIGS. 8(a) to 9(c)).

[0100] <6-3. Single-substrate transport area> Returning to FIG. 1, the single substrate transport region R4 includes a substrate transport robot CR2. The substrate transport robot CR2 transports, for example, one substrate W in a horizontal position from the second position change mechanism 55 to one first single substrate processing chamber SW1. That is, the substrate transport robot CR2 receives one substrate W from the belt conveyor 61 and transports the one substrate W to one first single substrate processing chamber SW1. The substrate transport robot CR2 also transports one substrate W between the six single substrate processing chambers SW1, SW2, the second position change mechanism 55, and a third position change mechanism 91 (described later).

[0101] The substrate transport robot CR2, like the substrate transport robot CR1, includes a hand 41, a forward / backward movement unit 42, and a lifting / rotating unit 43. The substrate transport robot CR2 further includes a guide rail 89 extending in the front-rear direction X. The substrate transport robot CR2 (lifting / rotating unit 43) can move along the guide rail 89. The substrate transport robot CR2 preferably includes two hands 41. In this case, the first hand 41 is used to transport a wet substrate W, and the second hand 41 is used to transport a substrate W that has been dried in the second single-wafer processing chamber SW2.

[0102] Furthermore, the single substrate transport region R4 is equipped with a third position conversion mechanism 91. The third position conversion mechanism 91 is equipped with a third position conversion unit 93 and a third pusher mechanism 95. The third position conversion unit 93 converts a plurality of (e.g., 25) substrates W transported by the substrate transport robot CR2 from a horizontal position to a vertical position. The third position conversion unit 93 is disposed between the transfer device 3 and the substrate transport robot CR2. That is, the third position conversion unit 93 is disposed behind the transfer device 3, and in front of the substrate transport robot CR2.

[0103] 10(a) to 10(c) are side views for explaining the third position change mechanism 91. The third position change unit 93 includes a support base 93A, a pair of horizontal holding units 93B, a pair of vertical holding units 93C, and a rotation drive unit 93D. The support base 93A, the pair of horizontal holding units 93B, and the pair of vertical holding units 93C are configured similarly to the support base 31A, the pair of horizontal holding units 31B, and the pair of vertical holding units 31C of the first position change unit 31, respectively. The rotation drive unit 93D of the third position change unit 93 rotates the support base 93A around a horizontal axis AX7 extending in the width direction Y.

[0104] 10(c), the third pusher mechanism 95 includes a third pusher 95A, an elevation rotation unit 95B, a horizontal movement unit 95C, and a rail 95D. The third pusher 95A is disposed between the transfer device 3 and the third position conversion unit 93 (see FIG. 1).

[0105] The third pusher 95A holds the lower portions of a plurality of (e.g., 25) substrates W that have been converted to a vertical position by the third position conversion unit 93. The lifting and rotating unit 95B lifts and lowers the third pusher 95A, and rotates the third pusher 95A about a vertical axis AX8. The horizontal moving unit 95C horizontally moves the third pusher 95A and the lifting and rotating unit 95B along the rail 95D. The rotation drive unit 93D, the lifting and rotating unit 95B, and the horizontal moving unit 95C are driven by electric motors.

[0106] The rails 95D extend in the width direction Y. Specifically, the rails 95D extend from the single substrate transport region R4 to the transfer device side region R7. A second substrate transfer position PP2 is set in the transfer device side region R7. The third pusher 95A can move the multiple substrates W that have been converted to a vertical position by the third position conversion unit 93 to the second substrate transfer position PP2 in the transfer device side region R7.

[0107] Each of the substrate transport robots CR1 and CR2 corresponds to a first substrate transport mechanism of the present invention. The third pusher 95A corresponds to a second vertical holding unit of the present invention. In addition, in Fig. 10(a) to Fig. 10(c), for convenience of illustration, the pair of horizontal holding units 93B, the pair of vertical holding units 93C, and the third pusher 95A are assumed to hold three substrates W.

[0108] Here, the operation of the third position conversion mechanism 91 will be described. See Fig. 10(a). The substrate transport robot CR2 transports the substrate W, which has been processed in, for example, the second single-wafer processing chamber SW2, to the third position conversion unit 93. The third position conversion unit 93 holds the substrate W with a pair of horizontal holding units 93B and a pair of vertical holding units 93C.

[0109] See Fig. 10(b). When, for example, 25 substrates W are transported to the third position conversion unit 93, the third position conversion unit 93 rotates the 25 substrates W 90 degrees around the horizontal axis AX7 while tilting the pair of horizontal holding units 93B, etc. As a result, the third position conversion unit 93 converts the 25 substrates W from a horizontal position to a vertical position. The 25 substrates W converted to the vertical position are aligned in the front-rear direction X.

[0110] Thereafter, the third pusher mechanism 95 raises the third pusher 95A to receive the 25 substrates W in the vertical position from the third position conversion unit 93. The third pusher 95A holds the 25 substrates W aligned in the front-rear direction X.

[0111] Refer to Fig. 10(c). Thereafter, the third position changing unit 93 rotates the support base 93A by -90 degrees around the horizontal axis AX7 in order to raise the pair of horizontal holding units 93B and the like. Thereafter, the third pusher mechanism 95 moves the third pusher 95A, which holds the 25 substrates W in a vertical position, from the single substrate transport region R4 to the transfer device side region R7. That is, the third pusher mechanism 95 moves the third pusher 95A from the substrate transfer position for the third position changing unit 93 to the second substrate transfer position PP2 for the first batch transport mechanism WTR1.

[0112] Further, the third pusher mechanism 95 rotates the third pusher 95A 90 degrees around the vertical axis AX8 so that the 25 substrates W held by the third pusher 95A are aligned in the width direction Y. The direction of the 90-degree rotation is such that the device surface faces upward when the substrates W are converted to a horizontal position by the first position conversion unit 31. By this operation, the first batch transport mechanism WTR1 can transport the 25 substrates W aligned in the width direction Y from the third position conversion mechanism 91 (second substrate transfer position PP2) to the first position conversion mechanism 21 (first substrate transfer position PP1).

[0113] <7. Control unit> The substrate processing system 1 includes a control unit 110 (see FIG. 1) and a storage unit (not shown). The control unit 110 controls each component of the substrate processing system 1. The control unit 110 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk, for example. The storage unit stores computer programs required to control each component of the substrate processing system 1.

[0114] <8. Operation of the Substrate Processing System> Next, the operation of the substrate processing system 1 will be described with reference to the flow chart of Fig. 11. With reference to Fig. 1, an external transfer robot (not shown) transfers two carriers C to the load port 9.

[0115] [Step S01] Removing the substrate from the carrier An external transfer robot (not shown) transfers two carriers C to the load port 9. Each of the two carriers C stores, for example, 25 substrates W in a horizontal position. The carrier transfer robot 17 of the storage device 2 transfers the first carrier C from the load port 9 to the shelf 19 while holding the first carrier C with a holding portion 18.

[0116] The substrate handling mechanism HTR takes out 25 substrates W1 (first substrate group) from the first carrier C placed on the shelf 19, and transports the 25 substrates W1 in a horizontal position to the first position conversion part 31. Thereafter, the carrier transport robot 17 transports the first carrier C (empty carrier) from which the 25 substrates W1 have been taken out, from the shelf 19 to the first storage shelf 15.

[0117] Thereafter, the carrier transport robot 17 transports the second carrier C from the load port 9 to the shelf 19. The substrate handling mechanism HTR takes out 25 substrates W2 (second substrate group) from the second carrier C placed on the shelf 19, and transports the 25 substrates W2 in a horizontal position to the first position conversion part 31. Thereafter, the carrier transport robot 17 transports the second carrier C (empty carrier) from which the 25 substrates W2 have been taken out, from the shelf 19 to the second storage shelf 15.

[0118] [Step S02] First vertical attitude transformation As shown in Figures 3(a) to 3(c), the first position conversion unit 31 converts the 25 substrates W1 and the 25 substrates W2 individually from a horizontal position to a vertical position. The first pusher 33A of the first pusher mechanism 33 holds the 50 substrates W (W1, W2) in which the 25 substrates W1 and the 25 substrates W2 are alternately arranged, in a vertical position. The first pusher mechanism 33 then transports the 50 substrates W to the first substrate transfer position PP1.

[0119] [Step S03] Chemical treatment (batch treatment) The first batch transport mechanism WTR1 receives 50 substrates W in a vertical position from the first pusher 33A of the first pusher mechanism 33 at the first substrate transfer position PP1. Then, the first batch transport mechanism WTR1 transports the 50 substrates W in a vertical position from the transfer device 3 to the batch processing device 7 via the single wafer processing device 5. The first batch transport mechanism WTR1 also transports the 50 substrates W to one of the two lifters LF1, LF3 of the two chemical liquid processing tanks BT1, BT3.

[0120] In the transfer device 3, the 50 substrates W in a vertical position held by the first pusher 33A are in a state where they can be batch-processed in each of the batch processing tanks BT1 to BT4. Therefore, after the 50 substrates W are transported to the batch processing device 7, they can immediately be transferred to the batch processing device.

[0121] For example, the first batch transport mechanism WTR1 transports 50 substrates W in a vertical position to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 50 substrates W in the chemical liquid (e.g., phosphoric acid) in the chemical liquid treatment tank BT1. This performs an etching process (batch process). After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the chemical liquid treatment tank BT1. Note that when the 50 substrates W are transported to the lifter LF3 of another chemical liquid treatment tank BT3, the same process as in the chemical liquid treatment tank BT1 is performed.

[0122] [Step S04] Pure water cleaning process (batch process) The first batch transport mechanism WTR1 receives, for example, 50 substrates W in a vertical position from the lifter LF1, and transports the 50 substrates W to the lifter LF2 in the water-rinsing processing tank BT2. The lifter LF2 receives the 50 substrates W at a position above the water-rinsing processing tank BT2. The lifter LF2 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT2. This performs the cleaning process (batch process).

[0123] When the first batch transport mechanism WTR1 receives 50 vertically oriented substrates W from the lifter LF3, the first batch transport mechanism WTR1 transports the 50 substrates W to the lifter LF4 of the water-rinsing processing tank BT4. The lifter LF4 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT4.

[0124] [Step S05] First horizontal attitude transformation The first batch transport mechanism WTR1 receives 50 substrates W that have been subjected to a predetermined batch process in one of the two batch processing tanks BT2, BT4. That is, the first batch transport mechanism WTR1 receives 50 substrates W that have been subjected to a pure water cleaning process from one of the two lifters LF2, LF4. When transporting the 50 substrates W, for example, the lifter LF2 lifts the 50 substrates W from the pure water in the pure water processing tank BT2. Thereafter, the first batch transport mechanism WTR1 transports the 50 substrates W from the batch processing device 7 to the second position changing mechanism 55 of the single wafer processing device 5. Specifically, the first batch transport mechanism WTR1 transports the 50 substrates W above the standby tank 57 of the second position changing mechanism 55 that is disposed in front X of the four batch processing tanks BT1 to BT4.

[0125] The second pusher mechanism 63 provided in the standby tank 57 uses the second pusher 63A to receive the 50 substrates W. At this time, as shown in Figures 7(a) and 7(b), the 50 substrates W aligned in the width direction Y are rotated 90 degrees around the vertical axis AX5 to align them in the front-rear direction X.

[0126] As shown in Figs. 8(a) to 9(c), the second position conversion unit 59 converts the 25 substrates W1 and the 25 substrates W2 individually from a vertical position to a horizontal position. The second position conversion unit 59 transports the 25 substrates W1 (25 substrates W2) converted to the horizontal position one by one to the belt conveyor 61. The belt conveyor 61 transports one substrate W in the horizontal position forward X to a position above the pin lifting unit 61C. Thereafter, the pin lifting unit 61C uses three pins (not shown) to lift one substrate W on the two belts 61B.

[0127] [Step S06] First single wafer processing The substrate transport robot CR2 receives the wet substrate W lifted by the three pins of the pin lifting section 61C using the first hand 41 of the two hands 41. The substrate transport robot CR2 then transports the substrate W received by the first hand 41 to the first single-wafer processing chamber SW1 of the rear tower TW1.

[0128] The first single-wafer processing chamber SW1 holds and rotates the substrate W with its device surface facing upward in a horizontal position by the holding and rotating part 45, and also supplies pure water to the device surface from the nozzle 46. Thereafter, the first single-wafer processing chamber SW1 supplies IPA from the nozzle 46 to the device surface (upper surface) of the substrate W to replace the pure water on the substrate W with IPA.

[0129] [Step S07] Second single wafer processing The substrate transport robot CR1 in the single substrate processing region R2 transports the substrate W, whose atmosphere has been replaced with IPA, from the first single substrate processing chamber SW1 to one of the five second single substrate processing chambers SW2. Each second single substrate processing chamber SW2 performs a drying process on one substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid prevents the pattern on the pattern surface (device surface) of the substrate W from collapsing.

[0130] [Step S08] Second vertical attitude transformation The substrate transport robot CR2 receives one substrate W1 from the second single-wafer processing chamber SW2 in which the drying process has been performed, using the second hand 41 of the two hands 41. Then, the substrate transport robot CR2 transports the substrate W1 received by the second hand 41 to the third attitude conversion unit 93.

[0131] When the 25 substrates W1 are transported to the third posture conversion section 93, as shown in Figures 10(a) to 10(c), the 25 substrates W are converted back to a vertical posture, and the 25 substrates W1 in the vertical posture are moved to the second substrate transfer position PP2.

[0132] A more detailed description will be given. The third position conversion unit 93 converts the 25 substrates W1 from a horizontal position to a vertical position. The third pusher mechanism 95 receives the 25 substrates W1 with the third pusher 95A. The third pusher mechanism 95 then rotates the 25 substrates W1 by 90 degrees around the vertical axis AX8 so that the 25 substrates W1 aligned in the front-rear direction X are aligned in the width direction Y. The third pusher mechanism 95 also transports the 25 substrates W1 to the second substrate transfer position PP2.

[0133] In addition, when 25 substrates W2 (second substrate group) are transported to the third posture conversion section 93, the 25 substrates W2 are transported to the second substrate transfer position PP2, etc., in the same manner as the 25 substrates W1 (first substrate group).

[0134] [Step S09] Second horizontal attitude transformation The first batch transport mechanism WTR1 transports 25 substrates W1 (W2) in a vertical position from the single substrate processing device 5 to the transfer device 3. That is, the first batch transport mechanism WTR1 receives the 25 substrates W1 (W2) from the third pusher 95A moved to the second substrate transfer position PP2. Then, the first batch transport mechanism WTR1 transports the 25 substrates W1 (W2) in a vertical position to the first pusher 33A moved to the first substrate transfer position PP1.

[0135] The first position conversion unit 31 of the transfer device 3 receives the 25 substrates W1 (W2) from the first pusher 33A. The first position conversion unit 31 also converts the 25 substrates W1 (W2) received from the first pusher 33A from a vertical position to a horizontal position. The method of conversion to the horizontal position is performed in the order of Figure 3(c), Figure 3(b), and Figure 3(a).

[0136] [Step S10] Storing substrates in carriers A first carrier (empty carrier) is transported from the first storage shelf 15 to the shelf 19 by the carrier transport robot 17 of the stocker device 2. The substrate handling mechanism HTR of the transfer device 3 receives, from the first position conversion unit 31, the 25 substrates W1 that have been converted to a horizontal position by the first position conversion unit 31 and have undergone the single-wafer processing. The substrate handling mechanism HTR then transports the 25 substrates W1 to the first carrier C placed on the shelf 19 and stores them therein.

[0137] Thereafter, the carrier transport robot 17 transports the first carrier C storing the 25 substrates W1 from the shelf 19 to one of the two load ports 9. Thereafter, the carrier transport robot 17 transports the second carrier C (empty carrier) from the second storage shelf 15 to the shelf 19. Similarly, the substrate handling mechanism HTR receives the 25 substrates W2 converted to a horizontal posture from the first posture conversion unit 31, and stores the received 25 substrates W2 in the second carrier C placed on the shelf 19.

[0138] Thereafter, the carrier transport robot 17 transports the second carrier C storing the 25 substrates W2 from the shelf 19 to one of the two load ports 9. An external transport mechanism (not shown) transports the two carriers C in turn from the load port 9 to their next destinations.

[0139] According to this embodiment, the transfer device 3, the single wafer processing device 5 and the batch processing device 7 are arranged in a line in this order. When the substrate W is transported from the transfer device 3 to the batch processing device 7, the substrate transport robot CR2 of the single wafer processing device 5 is not used, so that the load on the substrate transport robot CR1 is reduced and the substrate can be transported quickly to the batch processing device 7. This improves the throughput of the substrate processing system 1.

[0140] Furthermore, the batch substrate transport region R1 having the first batch transport mechanism WTR1 extends from the transfer device 3 to the batch processing device 7 (four batch processing tanks BT1 to BT4). Therefore, the first batch transport mechanism WTR1 receives a plurality of substrates W from the transfer device 3, and transports the plurality of substrates W in a vertical position from the transfer device 3 to the batch processing device 7 via the single wafer processing device 5. Furthermore, after passing through the single wafer processing device 5, the plurality of substrates W are in a state where they can be immediately processed, for example, in the batch processing tank BT1.

[0141] Also, for example, suppose that a first transfer device is provided in the batch processing device 7 and a second transfer device is provided in the single wafer processing device 5. In this case, if the first transfer device removes the unprocessed substrate W from the carrier C and the second transfer device stores the processed substrate W in the carrier C, the operation program of the substrate processing system 1 may become relatively complicated. According to this embodiment, the transfer device 3 is common to the batch processing device 7 and the single wafer processing device 5. Therefore, the operation program can be configured simply.

[0142] Also, for example, suppose there is an interface area between the single wafer processing device 5 and the batch processing device 7. In this case, the interface area makes the substrate processing system 1 longer in the front-rear direction X in which the transfer device 3 and the batch processing device 7 are aligned. In contrast, according to this embodiment, the single wafer processing device 5 has an interface area R3. Specifically, the single wafer processing device 5 includes an interface area R3 extending in the front-rear direction X, and, for example, a first single wafer processing chamber SW1. The first single wafer processing chamber SW1 is provided on the opposite side of the batch substrate transport area R1 via the interface area R3. With this configuration, it is possible to prevent the substrate processing system 1 from becoming longer in the front-rear direction X.

[0143] Further, a second position change mechanism 55 is provided in the batch processing device side region R8 of the passing region R5. The second position change mechanism 55 includes a second position change unit 59 and a belt conveyor 61. The belt conveyor 61 is disposed on the opposite side of the batch processing device 7 with the second position change unit 59 in between. That is, the second position change unit 59 and the belt conveyor 61 are disposed in this order in the direction (forward X) from the batch processing device 7 toward the transfer device 3. Therefore, the substrate transport robot CR2 can receive the substrate W in a horizontal position at a position away from the batch processing device 7. Therefore, the transport distance of the substrate W by the substrate transport robot CR2 is shortened, and the substrate W can be transported efficiently.

[0144] Furthermore, the third position conversion unit 93 converts the multiple substrates W transported by the substrate transport robot CR2 from a horizontal position to a vertical position. The first batch transport mechanism WTR1 can receive the multiple substrates W in the vertical position from the third position conversion unit 93 via the third pusher 95A, and transport the multiple substrates W from the single wafer processing device 5 to the transfer device 3. Furthermore, by configuring in this manner, an existing transfer device can be used as the transfer device 3.

[0145] Furthermore, the second position changing mechanism 55 can make the multiple substrates W in the vertical position wait while immersing the multiple substrates W in the immersion liquid stored in the standby tank 57 .

[0146] Furthermore, the second batch transport mechanism WTR2 can remove a plurality of substrates W1 (first substrate group) from a processing substrate group in which a plurality of substrates W1 (first substrate group) and another plurality of substrates W2 (second substrate group) are alternately arranged. The removed plurality of substrates W1 (first substrate group) are converted to a horizontal position by the second position conversion unit 59. Meanwhile, the other plurality of substrates W2 (second substrate group) can be made to wait while being immersed in the immersion liquid in the waiting tank 57. This can prevent the other plurality of substrates W2 (second substrate group) from drying out while waiting.

[0147] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0148] (1) In the embodiment described above, the second position change mechanism 55 includes the standby tank 57 and the second pusher mechanism 63. However, the second position change mechanism 55 may include the second pusher mechanism 63 without including the standby tank 57.

[0149] (2) In the embodiment described above, the second position change mechanism 55 includes the standby tank 57, the second pusher mechanism 63, and the second batch transfer mechanism WTR2. In this regard, the second position change mechanism 55 does not necessarily have to include the standby tank 57, the second pusher mechanism 63, and the second batch transfer mechanism WTR2. In this case, as shown in Figures 12(a) and 12(b), the second position change unit 59 may include a fourth pusher mechanism 101.

[0150] The fourth pusher mechanism 101 includes a fourth pusher 101A that holds the lower portions of a plurality of (e.g., 25) vertically oriented substrates W. The fourth pusher mechanism 101 uses one or more electric motors (not shown) to raise and lower the fourth pusher 101A and rotate the fourth pusher 101A around a vertical axis AX9.

[0151] The fourth pusher 101A is disposed at the bottom of the posture changing tank 82. As shown in FIG. 12(a), the first batch transfer mechanism WTR1 moves the pair of chucks 37, 38 holding 25 substrates W to above the posture changing tank 82.

[0152] The fourth pusher mechanism 101 raises the fourth pusher 101A while passing the fourth pusher 101A between the pair of chucks 77, 78 of the second position changing unit 59. The fourth pusher mechanism 101 also rotates the fourth pusher 101A 90 degrees around the vertical axis AX9. This allows the alignment direction of the multiple holding grooves MZ provided in the fourth pusher 101A to be changed from the front-rear direction X to the width direction Y. The multiple holding grooves MZ are grooves for holding multiple substrates W. Therefore, the fourth pusher 101A can receive 25 substrates W aligned in the width direction Y from the pair of chucks 37, 38 of the first batch transport mechanism WTR1.

[0153] Thereafter, the first batch transport mechanism WTR1 moves the pair of chucks 37, 38 from above the posture changing tank 82. The fourth pusher mechanism 101 rotates the fourth pusher 101A 90 degrees in any direction about the vertical axis AX9. This causes the 25 substrates W (or the multiple holding grooves MZ) aligned in the width direction Y to be aligned in the front-rear direction X.

[0154] 12(b), the fourth pusher mechanism 101 lowers the fourth pusher 101A holding the 25 substrates W so that the 25 substrates W are moved between the pair of chucks 77, 78 in the open state. Then, the pair of chucks 77, 78 sandwich the 25 substrates W held by the fourth pusher 101A. That is, the pair of chucks 77, 78 are closed. As a result, the pair of chucks 77, 78 hold the 25 substrates W. Then, the fourth pusher 101A is lowered to the bottom of the attitude changing tank 82 where it does not interfere with the 25 substrates W held by the pair of chucks 77, 78. The second attitude changing unit 59 rotates the pair of chucks 77, 78 by 90 degrees in any direction around the horizontal axis AX6. As a result, the second position changing section 59 changes the 25 substrates W from a vertical position to a horizontal position while keeping the device surfaces facing upward.

[0155] (3) In the above-described embodiment and each modified example, the belt conveyor 61, the second position change unit 59, and the standby tank 57 are arranged in this order at the rear X. In this regard, the standby tank 57, the second position change unit 59, and the belt conveyor 61 may be arranged in this order at the rear X. In other words, the arrangement of the belt conveyor 61, the second position change unit 59, and the standby tank 57 shown in FIG. 1 may be reversed.

[0156] (4) In the above-described embodiment and each modified example, the second attitude changing mechanism 55 may include a substrate transport robot CR3 instead of the belt conveyor 61, as shown in Fig. 13. In this case, the substrate transport robot CR3 is configured similarly to the substrate transport robot CR1. That is, the substrate transport robot CR3 includes a movable hand 41 that holds one substrate W.

[0157] After the second position conversion unit 59 converts the 25 substrates W from a vertical position to a horizontal position, the substrate transport robot CR3 inserts the hand 41 between the pair of open chucks 77, 78 and removes one substrate W from the pair of chucks 77, 78. The substrate transport robot CR3 then transports the one substrate W to the substrate placement part PS1 in the front X. The substrate transport robot CR2 in the single substrate transport region R4 removes the one substrate W from the substrate placement part PS1. The substrate transport robot CR3 may deliver the one substrate W directly to the substrate transport robot CR2 in the single substrate transport region R4 without going through the substrate placement part PS1.

[0158] (5) In the above-described embodiment and each modified example, the single substrate processing region R2 shown in Fig. 1 includes a substrate transport robot CR1, a first single substrate processing chamber SW1, and a second single substrate processing chamber SW2. In this regard, the single substrate processing region R2 may include a first single substrate processing chamber SW1 without including a substrate transport robot CR1 and a second single substrate processing chamber SW2, as shown in Fig. 13.

[0159] In this case, the rear tower TW1 and the front tower TW2 of the single substrate processing region R2 each include three first single substrate processing chambers SW1. Each first single substrate processing chamber SW1 processes one horizontally oriented substrate W with pure water and IPA, and then dries the substrate W by spin drying. Note that the single substrate processing region R2 may include one or more first single substrate processing chambers SW1.

[0160] (6) In the above-described embodiment and each modified example, as shown in Fig. 1, the second position changing unit 59 rotates the multiple substrates W around a horizontal axis AX6 extending in the width direction Y in order to change the substrates W to a horizontal position. In this regard, as shown in Fig. 14, the second position changing unit 59 may rotate the multiple substrates W around a horizontal axis AX6 extending in the front-rear direction X.

[0161] In this case, the first batch transport mechanism WTR1 may transport a plurality of substrates W (e.g., 25 substrates) among the first pusher 33A at the first substrate transfer position PP1, the second pusher 63A, the third pusher 95A at the second substrate transfer position PP2, the four batch processing tanks BT1 to BT4, and the second position changing unit 59. In addition, the second position changing unit 59 may receive a plurality of substrates W from the first batch transport mechanism WTR1 via a fourth pusher 101A of a fourth pusher mechanism 101 as shown in FIG. 12(b).

[0162] After the second posture conversion unit 59 converts the multiple substrates W from a vertical posture to a horizontal posture, the substrate transport robot CR2 may insert the first hand 41 between the two chucks 77, 78 in the open state and use the first hand 41 to remove one substrate W.

[0163] In this modified example, the first batch transport mechanism WTR1 may be configured to be able to select, for example, either a function of holding 50 substrates W (W1, W2), a function of holding 25 substrates W1 of the first substrate group, or a function of holding 25 substrates W2 of the second substrate group.

[0164] (7) In the above-mentioned embodiment and each modified example, the second position changer 59 is provided in the batch processing device side region R8, and the standby tank 57 and the second position changer 59 are arranged in the front-rear direction X. In this regard, as shown in FIG. 15, the second position changer 59 may be provided in the single substrate transport region R4. That is, in the single substrate transport region R4, the second position changer 59 may be provided between the substrate transport robot CR2 and the batch processing device 7. The standby tank 57 is provided in the batch processing device side region R8. In FIG. 15, the standby tank 57 and the second position changer 59 are arranged in the width direction Y. The second batch transport mechanism WTR2 transports the substrates W in the width direction Y to transport the substrates W from the standby tank 57 to the second position changer 59. The second position changer 59 rotates the substrates W by 90 degrees in any direction around a horizontal axis AX6 extending in the width direction Y.

[0165] (8) In the above-described embodiment and each modified example, the single wafer processing apparatus 5 includes the third position change mechanism 91. In this regard, as shown in FIG. 16, the single wafer processing apparatus 5 does not need to include the third position change mechanism 91. In this case, the single wafer processing apparatus 5 may include a substrate platform PS2 on which, for example, 25 or more substrates W are placed, within an access range of the substrate handling mechanism HTR. The substrate platform PS2 is disposed between the transfer apparatus 3 and the front tower TW2 in the single wafer processing area R2.

[0166] The substrate transport robot CR2 receives one substrate W from the second single-wafer processing chamber SW2 where the drying process has been performed, and transports the substrate W to the substrate platform PS2. When, for example, 25 substrates W have been transported to the substrate platform PS2, the substrate handling mechanism HTR transports the 25 substrates W from the substrate platform PS2 to the carrier C placed on the shelf 19.

[0167] In this modified example, the third position change mechanism 91 is not provided, and the operation of returning the substrate W to the carrier C is simplified. However, there is a possibility that the single-wafer processing apparatus 5 may become longer in the front-rear direction X. Also, the substrate handling mechanism HTR accesses the substrate placement part PS2 in addition to the carrier C placed on the shelf 19 and the first position change part 31. Therefore, the transfer device 3 has an operation program that has been modified from that of the existing transfer device.

[0168] (9) In the above-described embodiment and each modified example, the transfer device 3 includes the substrate handling mechanism HTR, the attitude changing unit 31, and the pusher 33A. In this regard, the transfer device 3 may include the substrate handling mechanism HTR and the pusher 33A without including the attitude changing unit 31. In other words, the substrate handling mechanism HTR may include the attitude changing unit 31 (the function of the attitude changing unit 31). Alternatively, the attitude changing unit 31 may include the substrate handling mechanism HTR (the function of the substrate handling mechanism HTR).

[0169] In this case, the substrate handling mechanism HTR (or posture conversion unit 31) is composed of an articulated robot. The articulated robot takes out a plurality of substrates W (e.g., five substrates W) from a carrier and converts the plurality of substrates W from a horizontal posture to a vertical posture. Then, the articulated robot causes the plurality of substrates W in the vertical posture to be held by pusher 33A.

[0170] (10) In the above-described embodiment and each modified example, the second position change mechanism 55 includes the second batch transport mechanism WTR2, the second position change unit 59, and the belt conveyor 61. In this regard, the second position change mechanism 55 may include an articulated robot and a substrate placement unit. In the batch processing device side region R8, for example, the standby tank 57, the articulated robot, and the substrate placement unit are arranged in this order at the front X.

[0171] The articulated robot receives one substrate W from the second pusher 63A provided in the standby tank 57, and converts the substrate W from a vertical position to a horizontal position. The articulated robot then transports the substrate W in the horizontal position to the substrate mounting portion. The substrate transport robot CR2 in the single substrate transport region R4 then takes out the substrate W from the substrate mounting portion.

[0172] (11) In the above-described embodiment and each modified example, the third posture conversion unit 93 may be, for example, a substrate placement unit and an articulated robot. In the single substrate transport region R4, the substrate placement unit is disposed between the substrate transport robot CR2 and the articulated robot. The substrate transport robot CR2 transports one substrate W that has been dried to the substrate placement unit. The articulated robot takes out the one substrate W from the substrate placement unit and converts the one substrate W from a horizontal posture to a vertical posture. The articulated robot then causes the one substrate W in the vertical posture to be held by the third pusher 95A.

[0173] (12) In the above-described first embodiment and each of the modified examples, the substrate transport robot CR2 transports one substrate W in a horizontal position between the belt conveyor 61, the six single-wafer processing chambers SW1, SW2, and the third position change unit 93. This substrate transport may be shared by a plurality of substrate transport robots. Furthermore, one substrate W may be transferred directly between two substrate transport robots. Furthermore, one substrate W may be transferred via a substrate placement unit.

[0174] (13) In each of the above-described embodiments and modifications, at least one of the three substrate transport robots CR1 to CR3 may have a hand 41 that is moved by an articulated arm.

[0175] (14) In each of the above-described embodiments and modifications, for example, the batch processing tank BT1 collectively immerses and processes 50 substrates W, which are arranged alternately with 25 substrates W1 and 25 substrates W2. The 50 substrates W (W1, W2) are arranged at a half pitch (e.g., 5 mm). However, the batch processing tank BT1 may collectively immerse and process 25 substrates W arranged at a full pitch (e.g., 10 mm).

[0176] (15) In each of the above-described embodiments and modified examples, for example, the batch processing tank BT1 immerses 50 substrates W, which are a processing substrate group, in a batch process. In these 50 substrates W (W1, W2), when the device surfaces of the 25 substrates W1 in the first substrate group face to the right Y, the device surfaces of the 25 substrates W2 in the second substrate group may face to the left Y. In addition, when the device surfaces of the 25 substrates W1 in the first substrate group face to the right Y, the device surfaces of the 25 substrates W2 in the second substrate group may face to the right Y.

[0177] (16) In each of the above-described embodiments and modified examples, the batch substrate transport area R1 is not limited to being disposed to the side (left side Y) of the single substrate processing apparatus 5, and may pass above the single substrate processing apparatus 5. [Explanation of symbols]

[0178] 1 ... Substrate processing system 3 … Transfer device 5 … Single wafer processing equipment 7 … Batch processing equipment 19 … Shelf HTR: Substrate handling mechanism 21 ... First attitude transformation mechanism 31 ... Posture conversion section 33 ... Pusher mechanism 33A … 1st pusher CR1, CR2 ... Substrate transport robot SW1: First single wafer processing chamber SW2: Second single wafer processing chamber 55 ... Second attitude transformation mechanism 57 … Standby tank 59 … Second attitude transformation section 61 ... Conveyor belt WTR1: First batch transfer mechanism WTR2: Second batch transfer mechanism 63 ... Second pusher mechanism 63A … 2nd pusher 65,66 … Chuck 69,70 … Retaining groove 73,74 … Passing groove 91 ... Third attitude transformation mechanism 93 … Third attitude transformation section 95 ... 3rd pusher mechanism 95A ... 3rd pusher R1 … Batch substrate transport area R3: Interface area R4: Single substrate transport area R5 … Passage area R7…Transfer device side area R8 … Batch processor side area

Claims

1. A substrate processing system that performs batch processing for processing a plurality of substrates collectively and single substrate processing for processing the plurality of substrates one by one, a transfer device provided with a carrier placement shelf on which a carrier for storing the plurality of substrates in a horizontal position at a predetermined interval is placed; a batch processing device for processing the plurality of substrates at once; a single-substrate processing apparatus for processing the plurality of substrates one by one; the transfer device, the single wafer processing device, and the batch processing device are arranged in this order in a line and in a straight line; the transfer device includes a first position changing unit that changes the position of the plurality of substrates taken out of the carrier placed on the carrier mounting shelf from a horizontal position to a vertical position, the single wafer processing apparatus includes a plurality of single wafer processing units that process substrates one by one, and a first substrate transport mechanism that transports substrates to the plurality of single wafer processing units; the batch processing device includes a batch processing section that processes the plurality of substrates collectively, and a first batch transfer mechanism that transfers the plurality of substrates collectively to the batch processing section; A substrate processing system characterized in that the first batch transport mechanism receives the multiple substrates that have been converted to a vertical position by the first position conversion unit on the side of the transfer device, and transports them directly to the batch processing unit without using the first substrate transport mechanism of the single substrate processing device.

2. 2. The substrate processing system of claim 1, the batch processing device includes a batch substrate transfer area in which the first batch transfer mechanism moves; the batch substrate transport area is disposed on one end side of the transfer device in a second horizontal direction perpendicular to a first horizontal direction in which the transfer device and the batch processing device are aligned, the batch substrate transport area extends from the transfer device to the batch processing unit of the batch processing device; the batch processing unit performs the batch processing on the plurality of substrates transported by the first batch transport mechanism; the first batch transfer mechanism receives the plurality of substrates that have been subjected to the batch processing, and transfers the plurality of substrates in a vertical position to the single substrate processing apparatus; the single wafer processing apparatus performs the single wafer processing one by one on the plurality of substrates that have been subjected to the batch processing using the plurality of single wafer processing units; The transfer device transfers the plurality of substrates that have been transferred from the single-wafer processing device and have been subjected to the single-wafer processing to the carrier placed on the carrier placement shelf. A substrate processing system comprising:

3. 2. The substrate processing system according to claim 1, the transfer device includes a substrate handling mechanism including a hand that removes the substrates from the carrier placed on the carrier placement shelf in a horizontal position; the first position changing unit that changes the position of the substrates transferred by the substrate handling mechanism from a horizontal position to a vertical position; a first vertical holding unit that holds the plurality of substrates received from the first position changing unit in a vertical position, The substrate processing system according to claim 1, wherein the first batch transfer mechanism receives the plurality of substrates in a vertical position from a first vertical holder.

4. 3. The substrate processing system according to claim 2, The single wafer processing apparatus includes an interface area extending in the first horizontal direction, the plurality of single substrate processing units are provided on the opposite side of the batch substrate transport area across the interface area, the interface region includes a horizontal position conversion mechanism that converts the substrates transferred by the first batch transfer mechanism from a vertical position to a horizontal position, a first substrate transport mechanism for transporting a single substrate in a horizontal position from the horizontal position changing mechanism to the plurality of single substrate processing units;

5. 3. The substrate processing system according to claim 2, the single substrate processing apparatus includes a passing area and a single substrate transport area each extending in the first horizontal direction, the batch substrate transport area, the passing area, and the single substrate transport area are aligned in this order in the second horizontal direction; the plurality of single substrate processing units are disposed on the opposite side of the passing area across the single substrate transport area, the first substrate transport mechanism is provided in the single substrate transport area, The passing area is A transfer device side area adjacent to the transfer device; a batch processing device side area adjacent to the transfer device side area and the batch processing device, the batch processing device side region includes a horizontal position conversion mechanism that converts the substrates transferred by the first batch transfer mechanism from a vertical position to a horizontal position, The horizontal attitude conversion mechanism includes: a second position change unit that changes the position of the plurality of substrates from a vertical position to a horizontal position; a second substrate transport mechanism disposed on the opposite side of the batch processing device via the second attitude conversion unit, the second substrate transport mechanism transporting one of the plurality of substrates that has been converted to a horizontal attitude; A substrate processing system characterized in that the first substrate transport mechanism in the single substrate transport area receives the single substrate from the second substrate transport mechanism and transports the single substrate to the plurality of single substrate processing units.

6. 6. The substrate processing system according to claim 5, The single substrate transport area includes: a third position change unit disposed between the transfer device and the first substrate transport mechanism, the third position change unit changing the position of the substrates transported by the first substrate transport mechanism from a horizontal position to a vertical position; a second vertical holding unit that holds, in a vertical position, the plurality of substrates that have been converted to a vertical position by the third position conversion unit, the first batch transfer mechanism receives the plurality of substrates from the second vertical holder and transfers the plurality of substrates to the transfer device in a vertical position; The transfer device converts the multiple substrates transported from the single-substrate processing device and subjected to the single-substrate processing from a vertical position to a horizontal position, and transports the multiple substrates converted to the horizontal position to the carrier placed on the carrier mounting shelf.

7. 6. The substrate processing system according to claim 5, The substrate processing system is characterized in that the horizontal posture change mechanism is a waiting tank arranged between the second posture change unit and the batch processing device, and the waiting tank stores an immersion liquid in which the multiple substrates are immersed in a vertical posture.

8. 8. The substrate processing system according to claim 7, the horizontal position changing mechanism includes a second batch transfer mechanism having a pair of chucks in which a plurality of pairs of holding grooves and a plurality of pairs of passing grooves are alternately arranged; a second batch transport mechanism that uses the pair of chucks to remove the substrates from the group of substrates to be processed and transports the removed substrates to the second attitude change unit when a group of substrates to be processed, in which the substrates are alternately arranged with other substrates, is immersed in the immersion liquid in the waiting tank.

9. 2. The substrate processing system according to claim 1, the first batch transfer mechanism includes a pair of chucks that hold the plurality of substrates in a vertical position; The first batch transfer mechanism transfers the plurality of substrates held in a vertical position by the pair of chucks.

10. 2. The substrate processing system according to claim 1, the batch processing unit is a batch processing tank that stores a processing liquid into which the plurality of substrates are immersed, The substrate processing system according to claim 1, wherein the plurality of single wafer processing units are a plurality of single wafer processing chambers.

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