Electronic component joint device

Abstract

To provide an electronic component joint device capable of being jointed to a substrate at high speed and high accuracy without breakage of a chip.SOLUTION: An electronic component joint device 1 includes: a first camera 80; a second camera 81; a third camera 82; and a fourth camera 83. The fourth camera recognizes pick-up nozzles 42 and 62 after recognition marks 49 and 69 of a pick-up head 40 and a joint head 60 are recognized. A coordinate difference between the pick-up nozzles 42 and 62 against the recognition marks 49 and 69 is specified. On the basis of this coordinate difference, the positions of the pick-up nozzles 42 and 62 are specified. The pick-up head 40 transports a chip 20 from a wafer chip stage 10 to a pre-alignment stage 30 by picking up them. The joint head 60 picks up the chip 20 from the pre-alignment stage 30, transports it to a substrate stage, and joins it to a substrate 70.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electronic component bonding apparatus. [Background technology]

[0002] An electronic component joining device is a device that picks up chips such as semiconductor chips from a chip supply device with a nozzle and joins them to a predetermined position on a substrate. In recent years, chips to be joined have become smaller and thinner, for example, with a flat side of 1 mm or less and a thickness of several tens of μm. For this reason, electronic component joining devices are required to have higher joining position accuracy. In addition, such thin chips may crack or chip due to misalignment between the pickup nozzle and the chip when the pickup nozzle picks them up. Therefore, in order to suppress the relative misalignment between the pickup nozzle and the chip, an electronic component joining device has been proposed that recognizes the positions of the pickup nozzle and the chip with a camera and corrects the misalignment during the pick-up operation and chip joining operation.

[0003] An example of an electronic component bonding device is the following device. First, a vacuum chuck picks up a chip from a tray for supplying chips and transfers it to an intermediate stage (called a pre-alignment stage). At the pre-alignment stage, a camera placed above recognizes the position of the chip and compares the chip's position information with preset reference position information. Next, the pre-alignment stage is moved and rotated so that the chip's position matches the reference position. Then, the chip positioned on the pre-alignment stage is picked up by a bonding tool and transferred to the bonding stage, and the bonding tool is lowered to bond the chip to a substrate (see, for example, Patent Document 1).

[0004] Another example of an electronic component bonding device is the following device. First, a pickup nozzle picks up a chip attached to a wafer sheet on a chip supply stage and transfers it to a pre-alignment stage. Then, the pre-alignment stage moves in a direction perpendicular to the chip transfer direction, and a bonding tool picks up the chip from the pre-alignment stage after the movement and transfers it to the bonding stage to bond it to a substrate. The wafer stage has a chip placement stage on which a chip is placed and picked up. A first camera is disposed above the chip supply stage, and the first camera recognizes the position of the chip to be picked up. A second camera is disposed on the pre-alignment stage, and the second camera recognizes the chip and corrects the attitude of the chip in the X direction, Y direction, and around the θ axis. A third camera is disposed above the bonding stage, and the third camera recognizes a reference mark on the substrate, aligns the chip with the substrate, and lowers the bonding tool to bond the chip to the substrate (see, for example, Patent Document 2).

[0005] The electronic component bonding apparatus described in Patent Document 2 has a push-up pin on the wafer supply stage that pushes up the chips through the wafer sheet toward the pickup nozzle. The pickup nozzle picks up the chips pushed up by the push-up pins and transfers them to the pre-alignment stage.

[0006] Another example of an electronic component bonding device is the following device. This electronic component bonding device has a top-bottom dual-view recognition means (e.g., a top-bottom dual-view camera) between the bonding head and the bonding stage, and a third recognition means (third camera) below the bonding stage. The top-bottom dual-view recognition means aligns the position of the bonding head with the position of the bonding stage and then retreats. The third recognition means then recognizes the position of the chip adsorbed to the bonding head, corrects the chip position, and lowers the bonding head to bond the chip to the substrate (see, for example, Patent Document 3). [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 18326 / 1983 [Patent Document 2] JP 2007-158102 A [Patent Document 3] International Publication No. 2002-41384 Summary of the Invention [Problem to be solved by the invention]

[0008] In the electronic component bonding device described in Patent Document 1, a camera located above a pre-alignment stage recognizes the position of the chip, and the chip with its position and attitude corrected is transferred to the bonding stage and bonded to a substrate. Since a camera as a position recognition means is not located at the position where the chip is bonded to the substrate, there is a problem that chip bonding position accuracy cannot be obtained.

[0009] In the electronic component bonding apparatus described in the above Patent Document 2, a first camera is disposed above the chip supply stage, a second camera is disposed on the pre-alignment stage, and a third camera is disposed on the bonding stage. The first camera, the second camera, and the third camera are capable of correcting the position of the chip at each operation position. However, since the chip position correction at each operation position is performed for each operation, it is not possible to shorten the tact time. In addition, since the pre-alignment stage moves to switch the chip transfer path between the chip supply stage and the bonding stage, there is a problem that this movement further extends the tact time.

[0010] The electronic component bonding device in Patent Document 2 has push-up pins that push up chips from a wafer sheet, and the pick-up nozzle picks up the chips pushed up by the push-up pins. In this case, since there is no means for recognizing the position of the push-up pins, there is a risk that the chips will crack or chip due to misalignment between the pick-up nozzle and the push-up pins.

[0011] Moreover, the electronic component bonding apparatus described in the above Patent Document 3 inserts an upper and lower dual-field recognition means between the bonding head and the bonding stage to correct the position between the bonding head and the bonding stage. After the position correction, the upper and lower dual-field recognition means retreats from between the bonding head and the bonding stage. Thereafter, the third recognition means recognizes the position of the chip adsorbed to the bonding head, corrects the position of the bonding stage, and then bonds the chip to the substrate. Therefore, the operation of the upper and lower dual-field recognition means and the operation of the third recognition means cannot be performed simultaneously, which causes a problem of a long takt time.

[0012] Therefore, the present invention has been made to solve at least one of these problems, and aims to realize an electronic component joining device that is capable of joining chips to a substrate at high speed and with high precision without damaging the chips. [Means for solving the problem]

[0013] [1] An electronic component bonding apparatus of the present invention includes a pick-up head that picks up a diced chip from a wafer sheet on a wafer chip stage and transfers it to a pre-alignment stage, a bonding head that picks up the chip from the pre-alignment stage, transfers it to a substrate on a substrate stage, and bonds the chip to a predetermined position on the substrate, a push-up pin that is disposed below the wafer chip stage and pushes up the chip toward the pick-up head, a first camera that is disposed above the wafer chip stage and recognizes the diced chip and the push-up pin, a second camera that is disposed above the pre-alignment stage and recognizes the pre-alignment stage and the chip transferred to the pre-alignment stage, a third camera that is disposed above the substrate stage and recognizes the substrate and the chip bonded to the substrate, and a fourth camera that is disposed below the pick-up head and the bonding head, The pick-up head and the joining head each have a pick-up nozzle that adsorbs the chip, and a detection unit having a transparent plate on which a recognition mark is formed, the push-up pin has a push-up pin driving mechanism that aligns its tip position with the position of the central axis of the pick-up nozzle of the pick-up head, the fourth camera is configured to recognize the recognition marks of the pick-up head and the joining head, recognize the position of the pick-up nozzle after the pick-up head and the joining head have been moved, and identify its position relative to the recognition mark, and the first camera, the second camera and the third camera each recognize the recognition mark at their respective placement positions, and have a calibration function that periodically identifies the relative position of the pick-up nozzle at each pick-up position based on position information of the pick-up nozzle relative to the recognition mark before picking up and joining the chip.

[0014] [2] In the electronic component joining apparatus of the present invention, it is preferable that the pickup head and the joining head have a Y-axis drive mechanism that controls movement of the chip in the transport direction, and a Z-axis drive mechanism that controls movement in the vertical direction.

[0015] [3] In the electronic component bonding apparatus of the present invention, it is preferable that the wafer chip stage has a wafer chip stage drive mechanism which aligns the position of the chip to be picked up recognized by the first camera with the optical axis of the first camera based on position information of the central axis of the pick-up nozzle relative to the pre-specified recognition mark.

[0016] [4] In the electronic component joining apparatus of the present invention, it is preferable that the second camera is capable of recognizing an alignment mark on the pre-alignment stage and identifying a horizontal rotation center by image processing, recognizing the position and orientation of the chip on the pre-alignment stage, and the pre-alignment stage has a pre-alignment stage drive mechanism that corrects the position and orientation of the chip based on the information on the position and orientation of the chip.

[0017] [5] In the electronic component bonding apparatus of the present invention, it is preferable that the substrate stage has a substrate stage driving mechanism which moves the chip bonding target position of the substrate recognized by the third camera to the position of the central axis of the pick-up nozzle of the bonding head.

[0018] [6] In the electronic component joining apparatus of the present invention, it is preferable that the joining head is configured to pick up the chip whose position and attitude have been corrected by the pre-alignment stage, transport it to a predetermined position on the board recognized by the third camera, lower the pick-up nozzle, and join the chip to the board.

[0019] [7] In the electronic component bonding apparatus of the present invention, it is preferable that the fourth camera is disposed outside the transfer path of the chip.

[0020] [8] In the electronic component bonding apparatus of the present invention, it is preferable that the third camera has an image processing unit that measures the amount of positional misalignment between the substrate and the chip each time the chip is bonded to the substrate, calculates a bias in the amount of positional misalignment for a predetermined number of bonding operations and a correction value for the bias, and corrects the position of the substrate stage based on the correction value. Effect of the Invention

[0021] The electronic component bonding apparatus of the present invention has a first camera above the wafer chip stage, a second camera above the pre-alignment stage, and a third camera above the substrate stage. The first camera recognizes the chip and push-up pins on the wafer chip stage. The second camera recognizes the pre-alignment stage and the chip on the pre-alignment stage. And the third camera recognizes the substrate on the substrate stage and the chip bonded to the substrate. The first, second, and third cameras enable the electronic component bonding apparatus to perform highly accurate positioning when picking up and bonding the chip.

[0022] The electronic component bonding apparatus also has a fourth camera for calibration. The fourth camera recognizes the recognition marks of the pick-up head and the bonding head. After the pick-up head and the bonding head are moved in the chip transfer direction, the fourth camera recognizes the pick-up nozzles of the pick-up head and the bonding head, and is able to identify the relative positions (coordinate difference) of the pick-up nozzles with respect to the recognition marks.

[0023] Prior to the bonding operation, the first camera, the second camera, and the third camera recognize the recognition marks at their respective positions, and perform a calibration that enables the position of the central axis of the pickup nozzle to be specified based on the relative position information. Note that the calibration does not need to be performed every time a chip bonding operation is performed, and this makes it possible to shorten the takt time.

[0024] The first camera also recognizes the push-up pins, and the push-up pin drive mechanism corrects the misalignment between the pickup nozzle and the central axis of the pickup nozzle, which is determined by calibration. This makes it possible to prevent damage to the chip caused by misalignment between the pickup nozzle and the push-up pins.

[0025] As described above, the electronic component bonding apparatus is capable of bonding chips to substrates at high speed and with high precision without damaging the chips. [Brief description of the drawings]

[0026] [Figure 1] 1 is a configuration explanatory diagram showing a schematic configuration of an electronic component bonding apparatus 1. FIG. [Diagram 2] 2 is a configuration explanatory diagram showing the configurations of a pickup head 40 and a joining head 60. FIG. [Diagram 3] 10A and 10B are diagrams for explaining a situation in which the relative position of the pick-up nozzle 42 with respect to the recognition mark 49 of the pick-up head 40 is specified. [Figure 4] 1 is a diagram showing a situation in which the position of the central axis P1 of the pick-up nozzle 42 is identified when the pick-up head 40 picks up the chip 20 from the wafer chip stage 10. FIG. [Diagram 5] 13A to 13C are diagrams for explaining a situation in which the central position P2 of the pre-alignment stage 30 is identified. [Figure 6] 13 is a diagram showing a situation in which the relative position between the recognition mark 69 of the bonding head 60 and the pick-up nozzle 62 is identified. FIG. [Figure 7]13 is a diagram showing a situation in which the position of a central axis P3 of a pick-up nozzle 62 on a pre-alignment stage 30 is identified. [Figure 8] 13 is a diagram showing a situation in which the position of a central axis P3 of a pickup nozzle 62 on a substrate stage 50 is identified. [Figure 9] FIG. 13 is a diagram showing the state of the pickup head 40 when starting a bonding operation after calibration. [Figure 10] 1 is a diagram showing a situation in which a pick-up head 40 picks up a chip 20 from a wafer chip stage 10. FIG. [Figure 11] 1 is a diagram showing a state in which the pickup head 40 has transferred the chip 20 to the pre-alignment stage 30. FIG. [Figure 12] 13A and 13B are diagrams showing a situation in which the position and attitude of a chip transferred to a pre-alignment stage 30 are corrected. [Figure 13] 13 is a diagram showing a situation in which the bonding head 60 picks up the chip 20 being transferred to the pre-alignment stage 30. FIG. [Figure 14] 1 shows a situation in which the bonding head 60 transfers the chip 20 to the substrate stage 50, and the pick-up head 40 transfers the chip 20 to the pre-alignment stage 30. FIG. [Figure 15] FIG. 13 is a diagram showing a situation in which the third camera 82 recognizes a positional deviation of the chip bonding position. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] An electronic component bonding apparatus 1 according to an embodiment of the present invention will be described below with reference to Fig. 1 to Fig. 15. Note that each of the drawings described below is a schematic diagram for explaining the configuration of the electronic component bonding apparatus 1.

[0028] (Configuration of electronic component bonding device 1) FIG. 1 is a schematic diagram illustrating the configuration of an electronic component bonding apparatus 1. The electronic component bonding apparatus 1 has a pickup head 40 that picks up a solidified chip 20 placed on a wafer chip stage 10 and transfers it to a pre-alignment stage 30. The electronic component bonding apparatus 1 further has a bonding head 60 that picks up the chip 20 from the pre-alignment stage 30 and transfers it to a substrate stage 50. The chip 20 is a solidified chip obtained by dicing a wafer 13 that is attached to a wafer sheet 11 whose outer periphery is attached to a wafer ring 12, and the chip 20 attached to the wafer sheet 11 is called a wafer chip 14. In FIG. 1, the pickup head 40 and the bonding head 60 are shown to be disposed at arbitrary positions in order to explain the configuration.

[0029] The wafer chip stage 10 has a Y-axis drive mechanism 15 and an X-axis drive mechanism 16 as a wafer chip stage drive mechanism, and can move the wafer chip stage 10 in the Y-axis and X-axis directions. The Y-axis drive mechanism 15 and the X-axis drive mechanism 16 move the wafer chip stage 10 to a position where the pickup head 40 can pick up the center of the chip 20 to be picked up. The wafer chip stage 10 also has a θ-axis drive mechanism 21 for adjusting the rotational position of the chip 20 around the Z axis. In each figure described below, the left-right direction of the paper is represented by the Y axis, the depth direction of the paper is represented by the X axis, and the direction perpendicular to the XY plane is represented by the Z axis. The Y axis direction is the movement direction of the pickup head 40 and the bonding head 60, and is the transfer direction of the chip 20. In other words, the pickup head 40 and the bonding head 60 are configured to move only in the Y axis direction.

[0030] The wafer chip stage 10, the Y-axis drive mechanism 15, the X-axis drive mechanism 16, and the θ-axis drive mechanism 21 have a circular ring shape, and a push-up pin 17 is arranged inside the ring and below the wafer chip stage 10. The push-up pin 17 is arranged so that the tip of the cone faces the chip 20 to be picked up. The push-up pin 17 also has a Z-axis drive mechanism 18 and an X-axis drive mechanism 19 as a push-up pin drive mechanism. When the pick-up head 40 picks up the chip 20, the Z-axis drive mechanism 18 pushes up the chip 20 to be picked up toward the pick-up head 40. The X-axis drive mechanism 19 moves the push-up pin 17 in the X-axis direction to prevent misalignment in the planar direction with the pick-up nozzle 42 of the pick-up head 40. Although not shown, a Y-axis drive mechanism for moving the push-up pin 17 in the Y-axis direction may be provided.

[0031] The pre-alignment stage 30 has a θ-axis driving mechanism 31, a Y-axis driving mechanism 32, and an X-axis driving mechanism 33 as pre-alignment stage driving mechanisms. The θ-axis driving mechanism 31 rotates the pre-alignment stage 30 around its center of rotation (called the θ-axis) as the rotation axis. The Y-axis driving mechanism 32 moves the pre-alignment stage 30 in the Y-axis direction, and the X-axis driving mechanism 33 moves the pre-alignment stage 30 in the X-axis direction. Although not shown, the pre-alignment stage 30 has, as a mechanism for fixing the position of the chip 20, for example, a chip suction hole or a clamp mechanism for clamping the chip 20 between two plates.

[0032] The pickup head 40 has a detection unit 41 and a pickup nozzle 42 which protrude in parallel with each other downward in the Z-axis direction. The pickup head 40 is configured to be movable in the Y-axis direction along a horizontally extending Y-axis rail 35. The detailed configuration of the pickup head 40 will be described with reference to FIG. 2.

[0033] The bonding head 60 has the same configuration as the pick-up head 40. The bonding head 60 has a detection unit 61 and a pick-up nozzle 62 which protrude parallel to each other downward along the Z axis. The bonding head 60 is configured to be movable in the Y axis direction along the Y axis rail 35. The pick-up nozzle 62 picks up the chip 20 from the pre-alignment stage 30, transports it to the substrate stage 50, and bonds it to the substrate 70. Therefore, in the bonding head 60, the pick-up nozzle 62 can also be called a bonding nozzle. The detailed configuration of the bonding head 60 will be described with reference to FIG. 2.

[0034] Although not shown in the figure, the substrate stage 50 has a substrate suction hole or a clamp mechanism for clamping the substrate 70 between two plates as a mechanism for fixing the position of the substrate 70 to be bonded to the chip 20. The substrate stage 50 has a Y-axis drive mechanism 51 and an X-axis drive mechanism 52 as a substrate stage drive mechanism, and is capable of moving the substrate stage 50 in the Y-axis direction and the X-axis direction. In other words, the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 move the substrate 70 to a position where the pickup nozzle 62 of the bonding head 60 can bond the chip 20. Although not shown in the figure, the wafer chip stage 10 is connected to a wafer chip supply device that supplies the wafer chip 14, and the substrate stage 50 is connected to a substrate supply device that supplies the substrate 70 and a substrate unloading device that unloads the substrate 70.

[0035] The electronic component bonding apparatus 1 has a first camera 80, a second camera 81, a third camera 82, and a fourth camera 83, whose position coordinates are specified in advance. The first camera 80 is disposed above the wafer chip stage 10 and above the pick-up head 40. The first camera 80 is disposed at a position where its field of view is within a range in which the chip 20 to be picked up and the push-up pins 17 can be recognized.

[0036] The second camera 81 is disposed above the pre-alignment stage 30, above the pickup head 40 and the bonding head 60. The second camera 81 is disposed at a position where its field of view is within a range where two alignment marks (not shown) on the pre-alignment stage 30 and the outer shape of the transferred and placed chip 20 can be visually recognized.

[0037] The third camera 82 is disposed above the substrate stage 50 and above the bonding head 60. The third camera 82 is disposed at a position where its field of view allows the alignment marks and reference patterns (not shown) of the substrate 70 to be visually recognized, and also allows the outer shape of the bonded chip 20 to be visually recognized. In other words, the third camera 82 is disposed at a position where the chip bonding position relative to the substrate 70 can be captured as an image.

[0038] The fourth camera 83 is disposed outside the transfer path of the chip 20, below the pick-up head 40 and the bonding head 60. In other words, the fourth camera 83 is disposed in a position where the field of view capable of recognizing the detection units 41, 61 of the pick-up head 40 and the bonding head 60 and the tips of the pick-up nozzles 42, 62 faces upward. The two-dot chain line L in Fig. 1 represents the lower tip positions of the pick-up nozzles 42, 62 when the pick-up head 40 and the bonding head 60 transfer the chip 20.

[0039] The electronic component bonding apparatus 1 has an image processing unit 85. The image processing unit 85 calculates the position coordinates of the pickup head 40 and the bonding head 60 in each operation from image data captured by the first camera 80, the second camera 81, the third camera 82, and the fourth camera 83. The image processing unit 85 also calculates the position and posture of the chip 20 to be bonded, and the positional deviation between the chip 20 and the substrate 70 after bonding. The various data calculated by the image processing unit 85 is stored in a storage unit (not shown), and the driving of the electronic component bonding apparatus 1 is controlled based on the various data.

[0040] Next, the configurations of the pickup head 40 and the joining head 60 will be described with reference to FIG.

[0041] FIG. 2 is a diagram for explaining the configuration of the pickup head 40 and the joining head 60. FIG. 2(a) is a perspective view, and FIG. 2(b) is a plan view seen from the lower side (thick arrow direction) of FIG. 2(a). The pickup head 40 and the joining head 60 have the same configuration and can be replaced, so the pickup head 40 will be described as a representative. In FIG. 2, each component of the joining head 60 is indicated with a parenthetical symbol to the right of the symbol of the component of the pickup head 40. Therefore, the configuration of the joining head 60 can be explained by replacing it with the parenthetical symbol. The pickup head 40 has a Y-axis driving mechanism 43 that moves along a Y-axis rail 35 that extends in the transfer direction (Y-axis direction) of the chip 20. The pickup head 40 also has a Z-axis driving mechanism 44 that is attached to the Y-axis driving mechanism 43 and can move the detection unit 41 and the pickup nozzle 42 in the vertical direction.

[0042] The detection unit 41 and the pick-up nozzle 42 are fixed to the Z-axis drive mechanism 44, and both the detection unit 41 and the pick-up nozzle 62 extend downward along the Z-axis of the Z-axis drive mechanism 44. A collet 45 is detachably attached to the tip of the pick-up nozzle 42. The pick-up nozzle 42 has a chip suction hole 46 that penetrates in the length direction including the collet 45. The chip suction hole 46 is connected to a vacuum device (not shown) at the end of the pick-up nozzle 42 opposite to the collet 45. At least the pick-up nozzle 62 of the joining head 60 has a heater (not shown) for chip joining disposed above the collet 45.

[0043] The detection unit 41 has a support part 47 that protrudes horizontally from the lower end in the Z-axis direction. A calibration glass plate 48, which is a transparent plate, is fitted into the support part 47. A cross-shaped recognition mark 49 is formed on the calibration glass plate 68. The material of the calibration glass plate 48 is not limited to glass as long as it has a high light transmittance and a low thermal expansion coefficient. As shown in FIG. 2(b), the distance between the recognition mark 49 and the central axis P1 of the pickup nozzle 42 is represented by dy1. For example, if the position coordinates of the recognition mark 49 are (0, 0), the position coordinates of the central axis P1 of the pickup nozzle 42 can be represented by (0, -dy1). The distance between the recognition mark 69 in the bonding head 60 and the central axis P3 of the pickup nozzle 62 (the center of the chip suction hole 66) is represented by dy2. For example, if the position coordinates of the recognition mark 69 are (0, 0), the position coordinates of the central axis P3 of the pickup nozzle 62 can be represented by (0, -dy2).

[0044] There are cases where the position of the central axis P1 of the pick-up nozzle 42 is not on an extension line that passes through the recognition mark 49 and is parallel to the Y-axis rail 35. In such cases, the central axis P1 of the pick-up nozzle 42 relative to the recognition mark 49 can be expressed as (+dx, -dy1) or (-dx, -dy1) as a coordinate difference from the coordinates of the recognition mark 49. In the bonding head 60, the central axis P3 of the pick-up nozzle 62 relative to the recognition mark 69 can be expressed as (+dx, -dy2) or (-dx, -dy2) as a coordinate difference from the coordinates of the recognition mark 69.

[0045] The electronic component bonding apparatus 1 described above requires highly accurate alignment when picking up the chip 20 and when bonding it to the substrate 70. If alignment is performed for each bonding operation, the takt time will be longer accordingly. Therefore, a calibration function is provided that determines the relative positions of the pickup nozzles 42, 62 with respect to the pick-up position and bonding position of the chip 20 with high accuracy beforehand prior to the bonding operation, making it possible to bond the chip 20 to the substrate 70 with high accuracy and at high speed. The calibration method will be described with reference to Figs. 3 to 8.

[0046] (Calibration method) 3A and 3B are diagrams for explaining a situation in which the relative position of the pick-up nozzle 42 with respect to the recognition mark 49 of the pick-up head 40 is identified. First, as shown in Fig. 3A, the pick-up head 40 is moved until the fourth camera 83 recognizes the recognition mark 49, and the position of the recognition mark 49 is identified by image processing in the image processing unit 85 (see Fig. 1). Since the position of the fourth camera 83 has been identified, the position of the recognition mark 49 can be identified.

[0047] 3(b), pick-up head 40 is moved in the Y(+) direction, and fourth camera 83 recognizes the tip of pick-up nozzle 42, i.e., the tip of collet 45. The position of pick-up nozzle 42 can be determined from the amount of movement of pick-up head 40, i.e., the movement distance of central axis P1 of pick-up nozzle 42 in the Y(+) direction, and the captured image, by determining the position (coordinate difference) of central axis P1 of pick-up nozzle 42 relative to recognition mark 49.

[0048] 4 is a diagram showing a situation in which the position of the central axis P1 of the pick-up nozzle 42 is identified when the pick-up head 40 picks up the chip 20 from the wafer chip stage 10. First, the pick-up head 40 moves along the Y-axis rail 35 from the position where the fourth camera 83 recognizes the pick-up nozzle 42 (see FIG. 3(b)) to below the first camera 80, and stops at the position where the first camera 80 recognizes the recognition mark 49. Since the position of the first camera 80 and the coordinate difference of the central axis P1 of the pick-up nozzle 42 relative to the recognition mark 49 are known, the position coordinates of the pick-up nozzle 42 relative to the first camera 80 can be identified. In other words, the position of the pick-up nozzle 42 is identified as the position coordinates when picking up the chip 20 from the wafer chip stage 10.

[0049] Next, the central position P2 of the pre-alignment stage 30 is identified.

[0050] FIG. 5 is a diagram showing a situation where the center position P2 of the pre-alignment stage 30 is specified. FIG. 5(a) shows a situation where the center position P2 of the pre-alignment stage 30 in the image processing is obtained, and FIG. 5(b) shows a situation where the position coordinates of the center axis P1 of the pickup nozzle 42 on the pre-alignment stage 30 are specified. First, as shown in FIG. 5(a), the second camera 81 captures images of two alignment marks or chip suction holes (both not shown) provided on the pre-alignment stage 30. Then, the second camera 81 calculates the center position P2 of the pre-alignment stage 30 by image processing, and specifies the center position P2 in the image processing. It is assumed that the pickup head 40 is stopped below the first camera 80 (see FIG. 4).

[0051] 5(b), the pick-up head 40 moves in the Y(-) direction along the Y-axis rail 35 from below the first camera 80 to a position where the second camera 81 recognizes the recognition mark 49. The position coordinates of the second camera 81 are specified in advance, and the coordinate difference between the central axis P1 of the pick-up nozzle 42 and the recognition mark 49 is known, so that the position of the central axis P1 can be specified as the position coordinate.

[0052] 3 to 5, the calibration related to the operation of the pickup head 40 picking up the chip 20 from the wafer chip stage 10 and transferring it to the pre-alignment stage 30 has been described. Next, the calibration related to the bonding head 60 will be described.

[0053] FIG. 6 is a diagram for explaining a situation in which the relative position between the recognition mark 69 of the bonding head 60 and the pick-up nozzle 62 is specified. The pick-up head 40 is moved to an arbitrary position between the first camera 80 and the second camera 81. First, as shown in FIG. 6(a), the bonding head 60 is moved in the Y(+) direction until the fourth camera 83 recognizes the recognition mark 69 of the bonding head 60, and the position of the recognition mark 69 is specified by image processing of the image processing unit 85 (see FIG. 1). Since the position of the fourth camera 83 is specified in advance, the position of the recognition mark 69 can be specified. The position where the fourth camera 83 recognizes the recognition mark 69 of the bonding head 60 coincides with the position where the fourth camera 83 recognizes the recognition mark 49 of the pick-up head 40.

[0054] 6(b), the bonding head 60 is moved in the Y(+) direction, and the fourth camera 83 recognizes the tip of the pick-up nozzle 62, i.e., the tip of the collet 65. The position of the pick-up nozzle 62 can be determined by determining the position (coordinate difference) of the central axis P3 of the pick-up nozzle 62 relative to the recognition mark 69 from the amount of movement of the bonding head 60, i.e., the movement distance in the Y(+) direction of the central axis P3 of the pick-up nozzle 62, and the captured image.

[0055] 7 is a diagram showing a situation in which the position of the central axis P3 of the pick-up nozzle 62 on the pre-alignment stage 30 is identified. The bonding head 60 moves in the Y(+) direction from the position of the fourth camera 83 (see FIG. 6(b)) to the position where the second camera 81 recognizes the recognition mark 69. The position coordinates of the second camera 81 are specified in advance, and the coordinate difference with respect to the recognition mark 69 is also known, so that the position of the central axis P3 of the pick-up nozzle 62 can be identified as the position coordinates.

[0056] 8 is a diagram showing a situation in which the position of the central axis P3 of the pick-up nozzle 62 on the substrate stage 50 is identified. The bonding head 60 moves in the Y(-) direction from the position of the second camera 81 (see FIG. 7) to the position where the third camera 82 recognizes the recognition mark 69. Since the position coordinates of the third camera 82 are specified in advance, the position coordinates of the recognition mark 69 can be identified by recognizing the recognition mark 69 of the bonding head 60. In addition, since the coordinate difference between the recognition mark 69 and the central axis P3 of the pick-up nozzle 62 is known, the position coordinates of the central axis P3 of the pick-up nozzle 62 at the position where the third camera 82 recognizes the recognition mark 69 can be calculated and identified.

[0057] 3 to 8, the chip 20 is bonded to the substrate 70. Note that the calibration is not performed during the operation related to bonding.

[0058] (Method of bonding chip 20 to substrate 70) FIG. 9 is a diagram showing the state of the pickup head 40 when starting the bonding operation after the above-mentioned calibration. First, prior to the bonding operation, the wafer chip supply device (not shown) supplies the wafer chip 14 to the wafer chip stage 10 in a predetermined attitude. Then, the first camera 80 recognizes the chip 20 to be picked up, and moves the wafer chip stage 10 to a position facing the central axis P1 of the pickup nozzle 42 by the Y-axis drive mechanism 15, the X-axis drive mechanism 16, and the θ-axis drive mechanism 21. At this time, the pickup head 40 waits at a position that does not block the field of view of the first camera 80. The push-up pin 17 is located at a position away from the wafer chip 14 downward. Before the wafer chip 14 is supplied, the first camera 80 recognizes the push-up pin 17 and identifies the tip position by image processing. Then, the push-up pin 17 is moved by the X-axis drive mechanism 19 to the position of the central axis P1 when the pickup nozzle 42 picks up the chip 20 obtained by the calibration.

[0059] On the other hand, the substrate 70 is supplied to the substrate stage 50 from a substrate supply device (not shown). Then, the third camera 82 recognizes the substrate 70 and captures the bonding target position of the chip 20 as an image from the arrangement of the substrate pattern (not shown) or the alignment mark (both not shown). The third camera 82 has already recognized the position of the pickup nozzle 62 of the bonding head 60 by calibration. Therefore, the position of the substrate stage 50 is adjusted by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 so that the chip bonding target position of the substrate 70 faces the pickup nozzle 62. At this time, the bonding head 60 waits at an arbitrary position between the second camera 81 and the third camera 82 that does not block the field of view of the third camera 82. The pickup head 40 moves to directly above the chip 20 to be picked up and the push-up pin 17.

[0060] FIG. 10 is a diagram showing a situation where the pickup head 40 picks up the chip 20 from the wafer chip stage 10. The pickup nozzle 42 moves onto the chip 20 to be picked up, and is gently lowered by the Z-axis drive mechanism 44 to come into contact with the chip 20 to be picked up. At the same time, the push-up pin 17 is raised by the Z-axis drive mechanism 18 to push up the chip 20 to be picked up. Then, the pickup nozzle 42 picks up the chip 20 by adsorbing it. The pickup nozzle 42 picks up only the chip 20 to be picked up. The push-up pin 17 is lowered to its original position when the pickup nozzle 42 picks up the chip 20. Since the pickup nozzle 42 and the push-up pin 17 are aligned with high accuracy, there is no risk of the chip 20 being damaged due to misalignment between the pickup nozzle 42 and the push-up pin 17 when the chip 20 is sandwiched between them. Next, as shown in FIG. 11, the pickup head 40 transfers the chip 20 to the pre-alignment stage 30.

[0061] FIG. 11 is a diagram showing a situation in which the pick-up head 40 transfers the chip 20 to the pre-alignment stage 30. The pick-up head 40 stops when the central axis P1 of the pick-up nozzle 42 is above the central position P2 of the pre-alignment stage 30, and is lowered by the Z-axis drive mechanism 44 to place the chip 20 on the pre-alignment stage 30. The chip 20 is sucked and held in a chip suction hole (not shown) provided in the pre-alignment stage 30. After the chip 20 is sucked and held on the pre-alignment stage 30, the pick-up head 40 moves to a position below the first camera 80, that is, to a position where the chip 20 can be picked up from the wafer chip 14. Next, as shown in FIG. 12, the second camera 81 recognizes the outer shape of the chip 20.

[0062] FIG. 12 is a diagram showing a situation in which the position and attitude of the chip 20 transferred to the pre-alignment stage 30 are corrected. The second camera 81 recognizes the outer shape of the chip 20, calculates the center position P4 of the chip 20 by image processing, and corrects the X-axis direction deviation of the chip 20 by the X-axis driving mechanism 33, the Y-axis direction deviation by the Y-axis driving mechanism 32, and the inclination θ in the planar direction by the θ-axis driving mechanism 31. This allows the bonding head 60 to match the center axis P3 of the pick-up nozzle 62 with the center position P4 of the chip 20, pick up the chip 20 in an attitude that allows bonding to the substrate 70, and transfer it to the substrate 70. As described above, the position of the chip 20 around the Z axis (θ-axis) is adjusted on the wafer chip stage 10. This makes it possible to improve the positional accuracy of the chip 20 on the pre-alignment stage 30.

[0063] 13 is a diagram showing a situation in which the bonding head 60 picks up the chip 20 being transferred to the pre-alignment stage 30. The bonding head 60 moves from a standby position (see FIG. 12) to above the pre-alignment stage 30 and stops there. The stopping position of the pickup nozzle 62 is previously specified by calibration. Then, the Z-axis drive mechanism 64 lowers the pickup nozzle 62, which then sucks and picks up the chip 20. In synchronization with the operation of the bonding head 60 picking up the chip 20, the pickup head 40 picks up the chip 20 from the wafer chip stage 10 (see FIG. 10).

[0064] FIG. 14 is a diagram showing a state where the bonding head 60 transfers the chip 20 to the substrate stage 50, and the pick-up head 40 transfers the chip 20 to the pre-alignment stage 30. The bonding head 60 picks up the chip 20 from the pre-alignment stage 30, transfers it to the substrate stage 50, and bonds the chip 20 to a predetermined position on the substrate 70. Specifically, the chip 20 is bonded to the substrate 70 by pressing the chip 20 while heating a collet 65 attached to the tip of the pick-up nozzle 62 with a heater (not shown). Alternatively, the chip 20 can be fixed to the substrate 70 by pressing the chip 20 against a bonding material that has been applied to the substrate 70 in advance. In synchronization with the operation of the bonding head 60, the pick-up head 40 transfers the chip 20 from the wafer chip stage 10 to the pre-alignment stage 30. The positions where the pick-up head 40 and the bonding head 60 pick up the chip 20 and the positions where the chip 20 is transferred are specified by calibration.

[0065] When the bonding head 60 finishes bonding the chip 20, the bonding head 60 moves onto the pre-alignment stage 30 and starts the operation of picking up the chip 20. The pick-up head 40 transfers the chip 20 to the pre-alignment stage 30, and then moves onto the wafer chip stage 10. The operations of the bonding head 60 and the pick-up head 40 are synchronized. The pick-up head 40 picks up the chip 20 from the wafer chip stage 10 and transfers it to the pre-alignment stage 30, and the bonding head 60 picks up the chip 20 from the pre-alignment stage 30 and transfers it to the substrate stage 50, and bonds it to the substrate 70. These operations are repeated. Note that the above-mentioned synchronization does not have to be perfect synchronization.

[0066] FIG. 15 is a diagram showing a situation where the third camera 82 recognizes the positional deviation of the chip bonding position. After the chip bonding, while the bonding head 60 is moving above the pre-alignment stage 30, the third camera 82 recognizes the substrate 70 to which the chip 20 is bonded. Then, the third camera 82 obtains measurement data of the positional deviation between the chip 20 and the pattern or alignment mark (both not shown) of the substrate 70 by image processing. The measurement data of the positional deviation amount and direction is stored in a storage unit (not shown), and a distribution diagram of this positional deviation is created. Even if the positional deviation amount is within the standard, if a deviation is observed in the distribution of the positional deviation, the position of the substrate stage 50 is fine-adjusted by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 in a direction to reduce the deviation. This makes it possible to improve the bonding position accuracy of the chip 20 and suppress the variation.

[0067] 3 to 8 is preferably performed at least periodically. Periodically may be defined as, for example, after a predetermined operation time of the electronic component bonding apparatus 1, a predetermined number of bonded chips, bonded substrates, or wafer chips 14. Calibration is also performed when the amount of positional deviation of the chips 20 falls outside the standard.

[0068] As described above, the electronic component bonding apparatus 1 has the first camera 80 above the wafer chip stage 10, the second camera 81 above the pre-alignment stage 30, and the third camera 82 above the substrate stage 50. The first camera 80 recognizes the chip 20 and the push-up pins 17 on the wafer chip stage 10. The second camera 81 recognizes the pre-alignment stage 30 and the chip 20 on the pre-alignment stage 30. The third camera 82 recognizes the substrate 70 on the substrate stage 50 and the chip 20 bonded to the substrate 70. In this way, the electronic component bonding apparatus 1 is provided with the first camera 80, the second camera 81, and the third camera 82, thereby enabling highly accurate positioning during picking up and bonding of the chip 20.

[0069] The electronic component bonding apparatus 1 also has a fourth camera 83 for calibration. The fourth camera 83 recognizes the recognition marks 49, 69 of the pick-up head 40 and the bonding head 60, respectively. After the fourth camera 83 moves the pick-up head 40 and the bonding head 60 in the transfer direction of the chip 20, it recognizes the pick-up nozzles 42, 62 of the pick-up head 40 and the bonding head 60, respectively, and specifies the relative positions of the pick-up nozzles 42, 62 with respect to the recognition marks 49, 69.

[0070] Prior to the bonding operation, the first camera 80, the second camera 81, and the third camera 82 recognize the recognition marks 49, 69 at their respective positions, and perform a calibration that enables them to identify the positions of the central axes P1, P3 of the pick-up nozzles 42, 62 based on the relative position information. Note that the calibration does not need to be performed every time a chip bonding operation is performed, and this makes it possible to shorten the tact time.

[0071] In addition, first camera 80 recognizes push-up pin 17, and corrects the positional deviation from central axis P1 of pickup nozzle 42 specified by calibration by X-axis drive mechanism 19, which is a push-up pin drive mechanism. This makes it possible to prevent damage to chip 20 caused by the positional deviation between pickup nozzle 42 and push-up pin 17.

[0072] As described above, the electronic component bonding apparatus 1 is capable of bonding the chip 20 to the substrate 70 at high speed and with high accuracy without damaging the chip 20.

[0073] Furthermore, the pickup head 40 and the bonding head 60 each have a Y-axis drive mechanism 43, 63 that controls the movement of the chip 20 in the transport direction (Y-axis direction), and a Z-axis drive mechanism 44, 64 that is attached to the Y-axis drive mechanism 43, 63 and moves vertically. This configuration makes it possible to simplify and reduce the weight of each drive mechanism, thereby enabling high-speed transport of the chip 20 in the Y-axis direction.

[0074] The wafer chip stage 10 has a Y-axis drive mechanism 15, an X-axis drive mechanism 16, and a θ-axis drive mechanism 21 as wafer chip stage drive mechanisms that align the position of the chip 20 to be picked up recognized by the first camera 80 based on the position information of the central axis P1 of the pick-up nozzle 42 specified by calibration. With this configuration, the pick-up head 40 can pick up the chip 20 with high accuracy and high speed.

[0075] In addition, the second camera 81 can identify the horizontal rotation center of the pre-alignment stage 30 by image processing. The pre-alignment stage 30 has, as pre-alignment stage drive mechanisms, a Y-axis drive mechanism 32 that controls the movement of the chip 20 in the Y-axis direction, an X-axis drive mechanism 33 that controls the movement in the X-axis direction, and a θ-axis drive mechanism 31 that controls the rotation around the Z-axis (θ-axis). With this configuration, the bonding head 60 can pick up the chip 20 in a position that allows it to be bonded to the substrate 70, and transport it to the substrate 70. Therefore, the chip 20 does not need to be aligned during the bonding operation, and high-speed operation is possible.

[0076] The substrate stage 50 has a Y-axis drive mechanism 51 and an X-axis drive mechanism 52 as a substrate stage drive mechanism for moving the chip bonding target position of the substrate 70 recognized by the third camera 82 to the position of the central axis P3 of the pick-up nozzle 62 of the bonding head 60. The third camera 82 has already specified the position of the pick-up nozzle 62 of the bonding head 60 by calibration. Then, the position of the substrate stage 50 is adjusted by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 so that the chip bonding target position of the substrate 70 faces the pick-up nozzle 62. This can be performed during the operation of the bonding head 60 picking up the chip 20 on the pre-alignment stage 30, and since no extra time is required, it is possible to bond the chip 20 to the substrate 70 with high accuracy without affecting the takt time.

[0077] Furthermore, the bonding head 60 picks up the chip 20 whose position and orientation have been corrected by the pre-alignment stage 30, transports it to a predetermined position on the substrate 70 recognized by the third camera 82, and lowers the pickup nozzle 62 to bond the chip 20 to the substrate 70. In this configuration, the bonding head 60 only needs to pick up the chip 20, transport it, and bond it to the substrate 70. The time required for correcting the position of the chip 20 and the position of the substrate 70 does not affect the operation of the bonding head 60 itself. Therefore, the bonding head 60 can bond the chip 20 to the substrate 70 with high accuracy without affecting the takt time.

[0078] Further, the fourth camera 83 is provided for calibration. Therefore, the fourth camera 83 is disposed outside the transfer path of the chip 20. Therefore, the fourth camera 83 does not interfere with the movement of the pick-up head 40 and the bonding head 60 during the bonding operation, and no extra space for the movement of the pick-up head 40 and the bonding head 60 is required.

[0079] Moreover, the third camera 82 measures the amount of misalignment between the substrate 70 and the chip 20 by image processing every time the chip 20 is bonded to the substrate 70, calculates the bias of the amount of misalignment in a predetermined number of bonding operations and a correction value for the bias, and corrects the position of the substrate stage 50 based on this correction value. The measurement data of the amount of misalignment and the direction of misalignment are, for example, plotted on a normal distribution diagram. Then, even if the amount of misalignment and the direction of misalignment are within the standard, if a bias is observed in the distribution of the misalignment, the position of the substrate stage 50 is fine-tuned by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 in a direction that reduces the bias. This makes it possible to increase the bonding position accuracy of the chip 20 and suppress the variation. [Explanation of symbols]

[0080] 1...Electronic component bonding device, 10...Wafer chip stage, 11...Wafer sheet, 13...Wafer, 14...Wafer chip, 15,32,43,51,63...Y-axis drive mechanism, 16,19,33,52...X-axis drive mechanism, 17...Push-up pin, 18,44,64...Z-axis drive mechanism, 20...Chip, 21,31...θ-axis drive mechanism, 30...Pre-alignment stage, 40...Pickup head, 41,61...Detection unit, 42,62...Pickup nozzle, 48,68...Calibration glass plate (transparent plate), 49,69...Recognition mark, 50...Substrate stage, 60...Bonding head, 70...Substrate, 80...First camera, 81...Second camera, 82...Third camera, 83...Fourth camera, 85...Image processing unit, P1,P3...Central axis, P2,P4...Central position, θ...Inclination in the planar direction

Claims

1. a pick-up head that picks up a diced chip from the wafer sheet on the wafer chip stage and transfers it to a pre-alignment stage; a bonding head that picks up the chip from the pre-alignment stage, transfers it to a substrate on a substrate stage, and bonds the chip to a predetermined position on the substrate; a push-up pin disposed below the wafer chip stage and pushing up the chip toward the pickup head; a first camera disposed above the wafer chip stage for recognizing the chips that have been diced; a second camera disposed above the pre-alignment stage for recognizing the pre-alignment stage and the chip transferred to the pre-alignment stage; a third camera disposed above the substrate stage and configured to recognize the substrate and the chip bonded to the substrate; a fourth camera disposed below the pick-up head and the splice head; having the pick-up head and the bonding head each have a pick-up nozzle for suctioning the chip, and a detection unit having a transparent plate on which a recognition mark is formed, the push-up pin has a push-up pin drive mechanism that aligns a tip position with a position of a central axis of the pick-up nozzle of the pick-up head, the fourth camera is configured to recognize the recognition marks of the pick-up head and the joining head, recognize a position of the pick-up nozzle after each of the pick-up head and the joining head is moved, and identify a position of the pick-up nozzle relative to the recognition marks; the first camera, the second camera and the third camera each recognize the recognition mark at its respective arrangement position, and have a calibration function for periodically specifying a relative position of the pick-up nozzle at each pick-up position from picking up the chip to joining the chip based on position information of the pick-up nozzle relative to the recognition mark. An electronic component bonding apparatus comprising:

2. The electronic component bonding apparatus according to claim 1, The pickup head and the bonding head each have a Y-axis drive mechanism for controlling the movement of the chip in a transfer direction and a Z-axis drive mechanism for controlling the movement of the chip in a vertical direction. An electronic component bonding apparatus comprising:

3. The electronic component bonding apparatus according to claim 1, the wafer chip stage has a wafer chip stage drive mechanism that aligns the position of the chip to be picked up, which is recognized by the first camera, with an optical axis of the first camera based on the position information of the pick-up nozzle with respect to the recognition mark that is specified in advance; An electronic component bonding apparatus comprising:

4. The electronic component bonding apparatus according to claim 1, the second camera is capable of recognizing an alignment mark of the pre-alignment stage and identifying a horizontal rotation center by image processing, and recognizing a position and an orientation of the chip on the pre-alignment stage; the pre-alignment stage has a pre-alignment stage driving mechanism that corrects the position and attitude of the chip based on information on the position and attitude of the chip; An electronic component bonding apparatus comprising:

5. The electronic component bonding apparatus according to claim 1, the substrate stage has a substrate stage driving mechanism which moves a bonding target position of the chip of the substrate recognized by the third camera to a position of the central axis of the pick-up nozzle of the bonding head. An electronic component bonding apparatus comprising:

6. The electronic component bonding apparatus according to claim 1, the bonding head is configured to pick up the chip whose position and attitude have been corrected by the pre-alignment stage, transport the chip to the predetermined position on the substrate recognized by the third camera, lower the pickup nozzle, and bond the chip to the substrate. An electronic component bonding apparatus comprising:

7. The electronic component bonding apparatus according to claim 1, The fourth camera is disposed outside the transfer path of the chip. An electronic component bonding apparatus comprising:

8. The electronic component bonding apparatus according to claim 1, the third camera has an image processing unit that measures an amount of misalignment between the substrate and the chip every time the chip is bonded to the substrate, calculates a bias in the amount of misalignment in a predetermined number of bonding operations and a correction value for the bias, and corrects a position of the substrate stage based on the correction value. An electronic component bonding apparatus comprising:

Images