Power conversion device

Abstract

To provide a power conversion device capable of reducing an area required to accommodate electrical components when the inside of a housing is viewed from above.SOLUTION: A power conversion device 4 includes a partition wall 12c that divides a housing 12 into a first housing chamber 121 and a second housing chamber 122, and a communication bus bar 15. The communication bus bar 15 is provided across the first housing chamber 121 and the second housing chamber 122, and is included in a power path that connects a terminal portion of a noise filter 7 and a terminal portion 90a of a semiconductor device. The communication bus bar 15 has a through bus bar portion 152. The through bus bar portion 152 extends across the first housing chamber 121 and the second housing chamber 122 at one location inside the housing 12 and penetrates the partition wall 12c. The power conversion device 4 has a configuration with one through bus bar portion, so that a space for arranging the electric components can be made compact.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The disclosure herein relates to power conversion devices. [Background technology]

[0002] Patent Document 1 discloses a power converter that houses a capacitor and a semiconductor module in an upper chamber of a housing and a noise filter in a lower chamber. The upper chamber and the lower chamber are partitioned by a bottom wall provided in the housing. At least a first internal bus bar, a second internal bus bar, and an output bus bar penetrate the bottom wall. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-107381 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the power converter of Patent Document 1, the bus bars penetrate the bottom wall at least three places. This requires securing space for the bus bars to penetrate the bottom wall. This poses a problem that when the inside of the housing is viewed from the bottom in a plan view, the area required for installing electrical components becomes large.

[0005] An object of the disclosure in this specification is to provide a power conversion device that can reduce the area required to accommodate electrical components when the inside of the housing is viewed in plan. [Means for solving the problem]

[0006] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference symbols in parentheses in the claims and in this section are merely examples showing the corresponding relationship with the specific means described in the embodiments described below as one aspect, and do not limit the technical scope.

[0007] One of the disclosed power conversion devices includes a housing (12) having a first accommodating chamber (121) and a second accommodating chamber (122) therein, a partition wall (12c) dividing the housing into the first accommodating chamber and the second accommodating chamber, a plurality of semiconductor devices (90) accommodated in the first accommodating chamber and forming a power conversion circuit, a smoothing capacitor (5) accommodated in the first accommodating chamber and connected to the semiconductor devices, a noise filter (7) accommodated in the second accommodating chamber and connected to the smoothing capacitor, a cooling passage (124) formed in the partition wall and through which cooling water flows, and a communication bus bar (15) provided across the first accommodating chamber and the second accommodating chamber and included in a power path connecting a terminal portion of the noise filter and a terminal portion (90a) of the semiconductor device, The communication bus bar has a through bus bar portion (152) that extends across the first storage chamber and the second storage chamber at one location inside the housing and passes through the partition wall.

[0008] According to the power conversion device, since the bus bar penetrates the partition wall at one location in the housing, the space for arranging electrical components such as a noise filter and a smoothing capacitor can be made compact. This makes it possible to reduce the size of the interior of the housing when the partition wall is viewed in a plan view. Therefore, when the interior of the housing of the power conversion device is viewed in a plan view with respect to the partition wall, the area for accommodating electrical components can be reduced. Furthermore, since the bus bar does not penetrate the partition wall except for the through bus bar portion, a configuration can be realized in which the bus bar is close to or along the cooling passage over a wide range. This makes it possible to reduce the portion of the bus bar that is difficult to cool with cooling water, thereby improving the ability to cool the bus bar. [Brief description of the drawings]

[0009] [Figure 1] 1 is a circuit diagram of a power conversion device according to a first embodiment. [Diagram 2] 1 is a cross-sectional view showing a configuration of a power conversion device. [Diagram 3] 11 is a plan view showing the position of a through bus bar portion in a partition wall. FIG. [Figure 4] FIG. 11 is a plan view showing the position of the through bus bar portion according to the first alternative example. [Diagram 5] FIG. 11 is a plan view showing the position of the through bus bar portion according to the second alternative example. [Figure 6] FIG. 11 is a plan view showing the position of the through bus bar portion according to the third alternative example. [Figure 7] 4 is a perspective view showing a configuration of a terminal coupling portion in the terminal block unit; FIG. [Figure 8] FIG. 2 is a perspective view showing a terminal block unit. [Figure 9] FIG. 2 is a perspective view showing a bus bar built into the terminal block unit. [Figure 10] FIG. 2 is a perspective view showing a bus bar of the terminal block unit. [Figure 11] 4 is a partial cross-sectional view showing a state in which a plurality of terminals are joined at a terminal joining portion. FIG. [Figure 12] 4 is a partial cross-sectional view showing a state in which a plurality of terminals are joined at a terminal joining portion. FIG. [Figure 13] FIG. 11 is a partial cross-sectional view showing a coupled state of a plurality of terminals in a second embodiment. [Figure 14] FIG. 11 is a cross-sectional view showing a configuration of a power conversion device according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a number of embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, the same reference numerals may be used to designate parts corresponding to matters described in the preceding embodiment, and duplicated descriptions may be omitted. In each embodiment, when only a part of the configuration is described, other embodiments described previously may be applied to other parts of the configuration. In addition to combinations of parts that are specifically indicated as being possible in each embodiment, it is also possible to partially combine embodiments even if not indicated, as long as there is no particular problem with the combination.

[0011] First embodiment A first embodiment disclosing an example of a power conversion device will be described with reference to Figs. 1 to 12. Application examples of the power conversion device are as follows. The power conversion device can be applied to an on-board power conversion device mounted on vehicles such as electric cars, hybrid cars, and plug-in hybrid cars. The power conversion device can also be mounted on flying objects such as electric vertical take-off and landing aircraft and drones, ships, construction machinery, agricultural machinery, and the like. An example in which the power conversion device is applied to a vehicle will be described below.

[0012] As shown in FIG. 1, a vehicle drive system 1 includes a DC power supply 2, a motor generator 3, and a power conversion device 4. The DC power supply 2 is a DC voltage source constituted by a chargeable and dischargeable secondary battery. The secondary battery is, for example, a lithium ion battery, a nickel-metal hydride battery, or the like. The motor generator 3 is, for example, a three-phase AC rotating electric machine. The motor generator 3 functions as a drive source for the vehicle, that is, an electric motor. The motor generator 3 functions as a generator during regeneration. The power conversion device 4 performs power conversion between the DC power supply 2 and the motor generator 3.

[0013] The power conversion device 4 includes a power conversion circuit. As shown in Fig. 1, the power conversion device 4 includes a smoothing capacitor 5, an inverter 6 which is a power conversion circuit, and a noise filter 7. The smoothing capacitor 5 mainly has a function of smoothing the DC voltage supplied from the DC power supply 2. The smoothing capacitor 5 is connected to a P line 10 which is a power supply line on the high potential side and an N line 11 which is a power supply line on the low potential side.

[0014] The smoothing capacitor 5 is connected in parallel to the DC power supply 2. The P line 10 is connected to the positive terminal of the DC power supply 2. The N line 11 is connected to the negative terminal of the DC power supply 2. The positive terminal of the smoothing capacitor 5 is connected to the P line 10 between the DC power supply 2 and the inverter 6. The negative terminal of the smoothing capacitor 5 is connected to the N line 11 between the DC power supply 2 and the inverter 6. The P line 10 includes a plurality of P bus bars that connect electric components to each other. The N line 11 includes a plurality of N bus bars that connect electric components to each other.

[0015] The inverter 6 is a DC-AC conversion circuit. In accordance with switching control by a control circuit provided on the control circuit board 93, the inverter 6 converts a DC voltage into a three-phase AC voltage and outputs it to the motor generator 3. This operation drives the motor generator 3 to generate a predetermined torque. During regenerative braking of the vehicle, the inverter 6 converts the three-phase AC voltage generated by the motor generator 3 upon receiving rotational force from the wheels into a DC voltage in accordance with switching control of the control circuit. The converted DC power is output to the P line 10. In this way, the inverter 6 performs bidirectional power conversion between the DC power source 2 and the motor generator 3.

[0016] The noise filter 7 is connected to each of the P line 10 and the N line 11. The noise filter 7 is connected in parallel to the DC power supply 2. The positive terminal of the noise filter 7 is connected to the P line 10 between the DC power supply 2 and the smoothing capacitor 5. The negative terminal of the noise filter 7 is connected to the N line 11 between the DC power supply 2 and the smoothing capacitor 5. The noise filter 7 removes noise input to and output from the P line 10 and the N line 11. The noise filter 7 may include a capacitor. The capacitor included in the noise filter 7 has a smaller capacitance than the smoothing capacitor 5.

[0017] The inverter 6 includes upper and lower arm circuits 9 corresponding to each of the three phases. The upper and lower arm circuits 9 are sometimes referred to as legs. The upper and lower arm circuits 9 include an upper arm 9H and a lower arm 9L. The upper arm 9H and the lower arm 9L are connected in series between the P line 10 and the N line 11, with the upper arm 9H on the P line 10 side and the lower arm 9L on the N line 11 side.

[0018] A connection point between the upper arm 9H and the lower arm 9L is connected to the winding 3a of the corresponding phase in the motor generator 3 via an output line 8. Of the upper and lower arm circuits 9, the U-phase upper and lower arm circuit 9U is connected to the U-phase winding 3a via a corresponding output line 8. The V-phase upper and lower arm circuit 9V is connected to the V-phase winding 3a via a corresponding output line 8. The W-phase upper and lower arm circuit 9W is connected to the W-phase winding 3a via a corresponding output line 8. At least a portion of the output line 8 is formed of a conductive member such as a bus bar.

[0019] The inverter 6 has six arms. Each arm is equipped with a switching element. The number of switching elements constituting each arm is not particularly limited. There may be one or more. When there are more than one switching elements, the multiple switching elements connected in parallel to each other are turned on and off at the same timing by a common gate drive signal.

[0020] In this specification, an n-channel MOSFET 91 is used as a switching element constituting each arm. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. In the upper arm 9H, the drain of the MOSFET 91 is connected to a P line 10. In the lower arm 9L, the source of the MOSFET 91 is connected to an N line 11. The source of the MOSFET 91 in the upper arm 9H and the drain of the MOSFET 91 in the lower arm 9L are connected to each other.

[0021] A freewheeling diode 92 is connected in anti-parallel to each of the MOSFETs 91. The diode 92 may be a parasitic diode of the MOSFET 91 or may be provided separately from the parasitic diode. The anode of the diode 92 is connected to the source of the corresponding MOSFET 91. The cathode of the diode 92 is connected to the drain.

[0022] The switching element is not limited to the MOSFET 91. An IGBT may be used as the switching element. IGBT is an abbreviation for Insulated Gate Bipolar Transistor. In the case of an IGBT, a freewheeling diode is also connected in inverse parallel.

[0023] As shown in FIG. 2, the power conversion device 4 has a plurality of semiconductor devices 90, a control circuit board 93, a smoothing capacitor 5, a noise filter 7, and the like, which are provided inside a housing 12. The semiconductor device 90 provides at least one arm of the power conversion circuit. The semiconductor device 90 provides upper and lower arm circuits 9 for one phase. The plurality of semiconductor devices 90 are connected in parallel to provide the power conversion circuit. The plurality of semiconductor devices 90 may be referred to as a semiconductor module. In the following, the three directions that are mutually orthogonal are defined as the X direction, the Y direction, and the Z direction. The X direction and the Y direction indicate directions along a horizontal plane. The Z direction corresponds to the vertical direction.

[0024] The housing 12 is a container that houses electrical components such as the smoothing capacitor 5, the semiconductor device 90, the control circuit board 93, and the noise filter 7. The housing 12 is formed by combining a plurality of case members. The housing 12 is made of aluminum or an alloy. Each member is formed, for example, by aluminum die casting. The inside of the housing 12 is largely divided into a first housing chamber 121 and a second housing chamber 122 by a partition wall 12c. The first housing chamber 121 is a space divided above the partition wall 12c. The second housing chamber 122 is a space divided below the partition wall 12c. The partition wall 12c is made of a material that allows good heat transfer to members in contact with the partition wall 12c.

[0025] The first housing chamber 121 is provided with a smoothing capacitor 5, a control circuit board 93, a semiconductor device 90, etc. The second housing chamber 122 is provided with a noise filter 7, etc. An input line connecting the DC power supply 2 and the noise filter 7 is inserted into the side wall 12a of the housing 12. The side wall 12a is a wall portion adjacent to the ceiling wall and bottom wall of the housing 12 and connecting the ceiling wall and the bottom wall. The side wall 12a forms a side surface extending in the vertical direction and forms a side surface parallel to the Y direction and the Z direction. A side wall 12b of the housing is provided at a position opposite to the side wall 12a.

[0026] The input line is configured to include a part of the P line 10 and a part of the N line 11. The input line includes two input bus bars 14. The input line is provided in the second accommodation chamber 122. The input line and the side wall 12a are insulated by an insulating part. The insulating part is, for example, an input connector. A terminal connected to the tip of the input bus bar 14 is provided inside the input connector. A terminal of a wire harness extending from the DC power source 2 is connected to the terminal in the input connector. As a result, each of the P line 10 and the N line 11 is electrically connected to the DC power source 2.

[0027] An output line 8 that connects the motor generator 3 and the semiconductor device 90 is inserted through the side wall 12a of the housing 12. The output line 8 includes three output bus bars 16. The output bus bars 16 are provided in the first housing chamber 121. The output line 8 and the side wall 12a are insulated by an insulating component. The insulating component is, for example, an output connector. A terminal connected to the tip of the output bus bar 16 is provided inside the output connector. A terminal of a wire harness extending from the motor generator 3 is connected to the terminal inside the output connector. As a result, each phase of the upper and lower arm circuits 9 is electrically connected to the windings 3a of the motor generator 3.

[0028] The smoothing capacitor 5 includes a capacitor element, a sealing member, an electrode 5a connected to the capacitor element, a terminal portion 5b, and the like. The smoothing capacitor 5 includes a capacitor element and a sealing member filled in the housing of the capacitor element to seal the capacitor element. The sealing member seals the capacitor element in the housing space. The sealing member forms the outer shell of the smoothing capacitor 5. The outer shell of the smoothing capacitor 5 forms a rectangular parallelepiped outer shape except for the terminal portion 5b and the like. The sealing member is made of a thermosetting resin such as an epoxy resin. The sealing member is an insulating material that fills the gap between the capacitor element and the electrode 5a and the housing of the capacitor element. With this configuration, the sealing member seals the capacitor element and the electrode 5a and the like. One end of the terminal portion 5b is connected to the electrode 5a inside the smoothing capacitor 5, and the other end protrudes from the sealing member into the first housing chamber 121. In the first housing chamber 121, the terminal portion 5b is connected to the P line 10 and the N line 11 via the terminal coupling portion of the terminal block unit 13.

[0029] Smoothing capacitor 5 is installed in first housing chamber 121 in a position where the height direction, in which the external length is shortest, is in the vertical direction. This configuration makes it possible to reduce the vertical length of first housing chamber 121 that smoothing capacitor 5 occupies. Moreover, smoothing capacitor 5 is installed in first housing chamber 121 in a position where the largest surface of its external shape is aligned along partition wall 12c.

[0030] The semiconductor device 90 has a flattened outer shape due to the sealing member, except for the terminal portion 90a protruding from the sealing member. The semiconductor device 90 is installed in the first housing chamber 121 such that the thickness direction, which is the smallest side dimension, is aligned along the vertical direction. The control circuit board 93 is installed above the semiconductor device 90 such that the thickness direction of the board is aligned along the vertical direction. This configuration makes it possible to reduce the vertical length of the first housing chamber 121 occupied by the semiconductor device 90 and the control circuit board 93. The semiconductor device 90 is also installed in the first housing chamber 121 such that the largest surface of the flattened outer shape is aligned along the partition wall 12c.

[0031] A terminal portion 90a forming a collector terminal and an emitter terminal protrudes from one side of the flat body. The terminal portion 90a protrudes toward the smoothing capacitor 5 and is connected to the P line 10 and the N line 11 via a terminal coupling portion of the terminal base unit 13. A relay terminal protrudes from the other side of the flat body. The relay terminal is connected to the output line 8. The gate terminal of the semiconductor device 90 is connected to a control circuit board 93. The control circuit board 93 forms a control circuit on which electronic components such as a computing element that controls the operation of the MOSFET 91 are mounted.

[0032] As shown in FIG. 2, the power converter 4 includes a power path that connects the terminal portion of the noise filter 7 and the terminal portion 90a of the semiconductor device. This power path is formed by including a communication bus bar 15. The communication bus bar 15 extends between the first accommodation chamber 121 and the second accommodation chamber 122, and is provided along the partition wall 12c. The communication bus bar 15 includes a first bus bar portion 151 that is mainly located in the second accommodation chamber 122, a second bus bar portion that is mainly located in the first accommodation chamber 121, and a through bus bar portion 152. The relay bus bar 153 shown in FIG. 2 corresponds to the second bus bar portion. The relay bus bar 153 is formed by including a P-side bus bar included in the P line 10 on the high potential side and an N-side bus bar included in the N line 11 on the low potential side.

[0033] The first busbar portion 151 extends toward the through busbar portion 152 along the cooling passage 124 in the second accommodation chamber 122. The first busbar portion 151 includes a busbar that is a part of the P line 10 and a busbar that is a part of the N line 11. The first busbar portion 151 is in contact with the partition wall 12c via the insulating member 125 so as to be capable of thermal transfer. The insulating member 125 is a sheet-like member, grease, a gel-like substance, a gap filler, a resin molded portion that covers the busbar, or the like, formed of an insulating material. The first busbar portion 151 is provided so as to be along the cooling passage 124. The first busbar portion 151 is provided so as to overlap the cooling passage 124 in a plan view.

[0034] In the first housing chamber 121, the relay bus bar 153 extends from the side of the through bus bar portion 152 toward the semiconductor device 90 along the cooling passage 124. The relay bus bar 153 is provided so as to be along the cooling passage 124. The relay bus bar 153 is provided so as to overlap the cooling passage 124 in a plan view. The relay bus bar 153 includes a portion that is arranged below the smoothing capacitor 5 and a portion that is not arranged therebelow. The portion that is arranged below the smoothing capacitor 5 utilizes the space below the smoothing capacitor 5 to perform bus bar cooling, while providing a bus bar arrangement that does not spread outwardly.

[0035] The relay bus bar 153 includes a bus bar that is a part of the P line 10 and a bus bar that is a part of the N line 11. The relay bus bar 153 is covered with a sealing member having insulating properties. The part of the relay bus bar 153 that is covered with the sealing member is in contact with the partition wall 12c via the thermally conductive member 126. The thermally conductive member 126 is a sheet-like member, grease, a gel-like substance, a gap filler, or the like, formed of a material having high thermal conductivity.

[0036] The partition wall 12c has a through hole 123 that communicates the first storage chamber 121 and the second storage chamber 122. The through bus bar portion 152 is a portion of the communication bus bar 15 that is located between the first bus bar portion 151 and the relay bus bar 153 and passes through the through hole 123 of the partition wall 12c in the vertical direction. Therefore, the communication bus bar 15 may be configured to have three bus bars, namely, the first bus bar portion 151, the through bus bar portion 152, and the relay bus bar 153, which are coupled together, or may be configured to have two bus bars coupled together. In the case of a configuration in which two bus bars are coupled together, the portion corresponding to the through bus bar portion 152 is, for example, a part of the first bus bar portion 151 or a part of the relay bus bar 153. The through bus bar portion 152 includes a bus bar that is a part of the P line 10 and a bus bar that is a part of the N line 11. The through bus bar portion 152 penetrates the partition wall 12c at a location adjacent to the cooling passage 124.

[0037] 3 shows the position of the through bus bar portion 152 inside the housing 12 in a plan view. As shown in FIGS. 3 to 6, the through bus bar portion 152 may be located in an area on the opposite side away from the semiconductor device 90 than the side surface portion 51 in the outline of the smoothing capacitor 5. The side surface portion 51 is the portion of the side surface of the smoothing capacitor 5 that is located closest to the semiconductor device 90.

[0038] The through busbar portion 152 is provided in a range located closer to the side wall 12b than the extension line of the side surface portion 51 shown by the two-dot chain line in FIG. 3 in a plan view. This range is an area between the extension line of the side surface portion 51 and the inner surface of the side wall 12b in a plan view in FIG. 3. The through busbar portion 152 shown in FIG. 3 is provided outside the outer surface portion of the smoothing capacitor 5 located on the opposite side to the semiconductor device 90. This outer surface portion is located so as to face the side wall 12b of the housing located on the opposite side to the semiconductor device 90 in a plan view. The through busbar portion 152 is located between this outer surface portion and the side wall 12b in a plan view. The noise filter 7 and the smoothing capacitor 5 are installed so as to overlap in a direction perpendicular to the partition wall 12c in a plan view. The smoothing capacitor 5 and the semiconductor device 90 are installed so as not to overlap in a direction perpendicular to the partition wall 12c in a plan view.

[0039] Further, other examples regarding the position of the through busbar portion 152 will be described with reference to Figs. 4 to 6. Fig. 4 shows another first example. The through busbar portion 152 shown in Fig. 4 is located in an area on the opposite side farther from the semiconductor device 90 than the side surface portion 51 in the outer periphery of the smoothing capacitor 5. The through busbar portion 152 shown in Fig. 4 is provided outside the smoothing capacitor in a direction perpendicular to the direction in which the semiconductor device and the smoothing capacitor are arranged in a plan view. This makes it possible to reduce the size of the power conversion device 4 in the direction in which the semiconductor device and the smoothing capacitor are arranged in a plan view, as shown in Fig. 4.

[0040] Fig. 5 shows another second example. The through busbar portion 152 shown in Fig. 5 is located in an area on the opposite side farther from the semiconductor device 90 than the side surface portion 51 in the outer periphery of the smoothing capacitor 5. The through busbar portion 152 shown in Fig. 5 is provided outside the smoothing capacitor in a direction perpendicular to the direction in which the semiconductor device and the smoothing capacitor are arranged in a plan view. The through busbar portion 152 shown in Fig. 5 is provided outside the smoothing capacitor on the opposite side to the through busbar portion 152 shown in Fig. 4. This makes it possible to reduce the size of the power conversion device 4 in the direction in which the semiconductor device and the smoothing capacitor are arranged in a plan view, as shown in Fig. 5.

[0041] Fig. 6 shows another third example. The through bus bar portion 152 shown in Fig. 6 is located in an area on the opposite side farther from the semiconductor device 90 than the side surface portion 51 in the outer periphery of the smoothing capacitor 5. The through bus bar portion 152 shown in Fig. 6 is provided in an area overlapping the smoothing capacitor in a plan view. This makes it possible to reduce the size of the power conversion device 4 in both the direction in which the semiconductor device and the smoothing capacitor are arranged in a plan view and in the direction perpendicular to this direction, as shown in Fig. 6.

[0042] A cooling passage 124 through which cooling water flows is provided inside the partition wall 12c. The cooling passage 124 is formed along the partition wall 12c. The cooling passage 124 is a passage arranged in the entire partition wall 12c. The cooling passage 124 is a passage arranged to meander over a wide area along the partition wall 12c. The cooling water flowing through the cooling passage 124 has a function of cooling the electric components and bus bars arranged above or below the partition wall 12c. A phase-changing refrigerant such as water or ammonia, or a phase-non-changing refrigerant such as an ethylene glycol-based refrigerant may be used as the cooling water. The cooling passage 124 is provided so as to overlap at least a part of the smoothing capacitor 5, the semiconductor device 90, and the noise filter 7 in a plan view. It is preferable that the cooling passage 124 is provided so as to overlap the entire smoothing capacitor 5, the semiconductor device 90, and the noise filter 7 in a plan view. The line of sight in a plan view described in this specification is perpendicular to the partition wall 12c.

[0043] The input bus bar 14 is in contact with the partition wall 12c via an insulating member 128 so as to be capable of thermal transfer. The insulating member 128 is a sheet-like member, grease, a gel-like substance, a gap filler, a resin molded part covering the bus bar, or the like, formed of an insulating material. It is preferable that the insulating member 128 is made of a material having insulating properties and high thermal conductivity. The input bus bar 14 is provided so as to be aligned with the cooling passage 124. The input bus bar 14 is provided so as to overlap the cooling passage 124 in a plan view. The input bus bar 14 extends from the side wall 12a to the outside of the housing 12 at a position lower than the output bus bar 16.

[0044] The output bus bar 16 is in contact with the partition wall 12c via an insulating member 127 so as to be capable of transferring heat. The insulating member 127 is a sheet-like member, grease, a gel-like substance, a gap filler, a resin molded part covering the bus bar, or the like, formed of an insulating material. The output bus bar 16 is provided so as to follow the cooling passage 124. At least a part of the output bus bar 16 is provided so as to overlap the cooling passage 124 in a plan view. For example, a ceramic plate or a resin sheet can be used as the insulating member. Furthermore, a silicone gel or the like may be used as the insulating member in order to increase thermal conductivity.

[0045] The configuration of the terminal base unit 13 will be described with reference to Figs. 7 to 12. The power converter 4 includes the terminal base unit 13 having a relay bus bar 153 and resin molded parts 131 and 132 in which the relay bus bar 153 is built. As shown in Fig. 8, the resin molded parts 131 and 132 are resin parts that cover the relay bus bar 153 except for the first terminal part 153a and the second terminal part 153b. The resin molded parts 131 and 132 are formed of an insulator that insulates the relay bus bar 153 from the surrounding conductive members. The set of relay bus bars 153 can be provided integrally with the resin parts of the terminal base unit 13 by insert molding when the terminal base unit 13 is molded.

[0046] The first terminal portion 153a is a bus bar terminal portion provided at one end of the relay bus bar 153. The second terminal portion 153b is provided at the other end of the relay bus bar 153. The second terminal portion 153b is connected to one end of the bus bar corresponding to the through bus bar portion 152. The other end of the bus bar corresponding to the through bus bar portion 152 is connected to an end of the first bus bar portion 151. Note that in addition to the terminal base unit 13, FIG. 8 also illustrates the terminal portion 90a of the semiconductor device connected to the first terminal portion 153a.

[0047] As shown in FIG. 9, the terminal block unit 13 has two relay bus bars 153. The two relay bus bars 153 are insulated from each other by the resin molded parts 131 and 132. The pair of relay bus bars 153 includes a P-side bus bar included in the P line 10 on the high potential side and an N-side bus bar included in the N line 11 on the low potential side. Each relay bus bar 153 includes a main body part 1531 extending in the X direction and a plurality of branch parts 1532 branching from the main body part 1531. The plurality of branch parts 1532 are arranged side by side in the Y direction. An end of the main body part 1531 corresponds to the second terminal part 153b. The relay bus bar 153 of this embodiment has three branch parts 1532 connected to each of the three-phase upper and lower arm circuits 9. An end of the branch part 1532 corresponds to the first terminal part 153a. As shown in FIG. 7, the six branch parts 1532 are arranged side by side in the Y direction.

[0048] The resin molded portion 131 covers the two main body portions 1531, insulating the pair of main body portions 1531 from each other and from the surrounding conductive members. The resin molded portion 132 covers the three branch portions 1532, insulating the three branch portions 1532 from each other and from the surrounding conductive members. The resin molded portions 131 and 132 are formed to be in contact with the partition wall 12c via the heat conductive member 126 when the terminal block unit 13 is installed.

[0049] As shown in Fig. 7, each of the terminal portion 90a of the semiconductor device and the terminal portion 5b of the smoothing capacitor is fixed to the relay bus bar 153 in a state of surface contact with the first terminal portion 153a. As shown in Figs. 11 and 12, the terminal portion 90a of the semiconductor device is fastened and fixed by a bolt member 171 in a state of surface contact with the first terminal portion 153a. As shown in Fig. 7, the terminal portion 5b of the smoothing capacitor is similarly fastened and fixed by a bolt member 171 and a nut member 172 in a state of surface contact with the first terminal portion 153a. That is, the terminal portion 90a shown in Figs. 11 and 12 can be shown as being replaced with the terminal portion 5b of the smoothing capacitor.

[0050] A female thread formed on the inner circumferential surface of nut member 172 is screwed into a male thread of bolt member 171, whereby terminal portion 90a is sandwiched between the head of bolt member 171 and first terminal portion 153a. Nut member 172 is fixed to resin molded portion 132 while being covered with a resin material. Nut member 172 is provided on terminal base unit 13 while being in contact with heat conductive member 126.

[0051] This configuration can form a heat transfer path in which heat transfers from the terminal portion 90a to the bolt member 171, the nut member 172, the heat conductive member 126, the partition wall 12c, and the cooling water in this order. The nut member 172 is preferably in contact with the first terminal portion 153a at an end opposite to the portion in contact with the heat conductive member 126. This configuration can form a heat transfer path in which heat transfers from the terminal portion 90a to the nut member 172, the heat conductive member 126, the partition wall 12c, and the cooling water in this order, in addition to the above-mentioned heat transfer paths. The formation of these heat transfer paths can improve the heat dissipation capabilities of the terminal portion 5b of the smoothing capacitor, the terminal portion 90a of the semiconductor device, the bus bar, and the like. The nut member 172 can be integrally installed with the resin molded portion 132 by insert molding during molding of the terminal block unit 13.

[0052] Each of the P-side bus bar and the N-side bus bar of the relay bus bar 153 is provided with an extension portion 1533 that is bent from the first terminal portion 153a and built into the resin molded portion 132. As shown in Figs. 10 to 12, the extension portion 1533 of the P-side bus bar and the extension portion 1533 of the N-side bus bar extend toward the partition wall while facing each other. The pair of extension portions 1533 may be configured so that the tip of the extension portion 1533 contacts the heat conductive member 126, or may be configured so as to be slightly separated from the heat conductive member 126. The extension portion 1533 can form a heat transfer path that dissipates heat from the first terminal portion 153a of the relay bus bar to the heat conductive member 126 via the extension portion. In this way, the heat transfer path including the heat transfer path via the nut member 172 can improve the heat dissipation performance from the first terminal portion 153a. Furthermore, according to the configuration of the extension 1533, the extension can be formed so that currents flow in opposite directions between the extension of the P-side bus bar and the extension of the N-side bus bar, thereby reducing inductance between the P-side bus bar and the N-side bus bar.

[0053] The effects of the power converter 4 disclosed in the specification will be described. The power converter 4 includes a partition wall 12c that divides the inside of the housing 12 into a first housing chamber 121 and a second housing chamber 122. The semiconductor devices 90 and the smoothing capacitor 5 are housed in the first housing chamber 121. The noise filter 7 is housed in the second housing chamber 122. The partition wall 12c is formed with a cooling passage 124 through which cooling water flows. The power converter 4 includes a communication bus bar 15 included in a power path that connects a terminal portion of the noise filter and a terminal portion 90a of the semiconductor device. The communication bus bar 15 has a through bus bar portion 152 that extends between the first housing chamber 121 and the second housing chamber 122 at one location inside the housing 12 and penetrates the partition wall 12c. The through bus bar portion 152 is in contact with the partition wall 12c via an insulating member so as to be capable of thermal transfer. The insulating member is a sheet-like member, grease, a gel-like substance, a gap filler, a resin molded portion that covers the bus bar, or the like, formed from an insulating material.

[0054] In the power converter 4, the bus bar penetrates the partition wall 12c at only one location inside the housing 12. Therefore, the area required for arranging electrical components such as the noise filter 7 and the smoothing capacitor 5 can be compactly formed. In other words, the projected area of ​​the electrical components projected onto the partition wall can be compact. This makes it possible to reduce the size of the interior of the housing 12 when the partition wall 12c is viewed in a plan view. Therefore, when the power converter 4 is viewed in a plan view inside the housing, the area for accommodating the electrical components can be reduced. In addition, since the configuration is such that the bus bar does not penetrate the partition wall 12c except for the through bus bar portion, a configuration can be realized in which the bus bar is close to or along the cooling passage over a wide range. Therefore, the portion of the bus bar that is difficult to cool by the cooling water can be reduced, and the ability to cool the bus bar can be improved.

[0055] When the partition wall is viewed in plan, the through bus bar portion 152 penetrates the partition wall in an area farther from the semiconductor device than the side surface portion 51 of the smoothing capacitor that is located closest to the semiconductor device. This configuration allows the smoothing capacitor and the semiconductor device to be installed close to each other in a plan view. This allows the bus bar connecting the smoothing capacitor and the semiconductor device to be set short, thereby reducing inductance.

[0056] When the partition wall is viewed in plan, the through busbar portion 152 penetrates the partition wall outside the outer surface portion of the smoothing capacitor located on the opposite side to the semiconductor device. This makes it possible to reduce the size of the power conversion device 4 in the direction perpendicular to the direction in which the semiconductor device and the smoothing capacitor are arranged in plan, as shown in Fig. 3 .

[0057] 2, the smoothing capacitor 5 is located closer to the semiconductor device 90 than the through bus bar portion 152. According to this configuration, the cooling passage 124 can be made compact in configuration and size.

[0058] 2, the noise filter 7 is located closer to the semiconductor device 90 than the smoothing capacitor 5 is to the through bus bar portion 152. According to this configuration, a configuration in which the relay bus bar 153 is arranged long along the cooling passage 124 can be adopted, so that the ability to cool the relay bus bar 153 can be improved.

[0059] The communication busbar 15 further includes a first busbar portion 151 extending toward the through busbar portion along the cooling passage in the second housing chamber, and a second busbar portion extending toward the semiconductor device from the through busbar portion side in the first housing chamber along the cooling passage. The through busbar portion 152 penetrates the partition wall 12c at a position adjacent to the cooling passage 124. According to this configuration, the first busbar portion and the second busbar portion are installed so as to extend along the flow of the cooling water. Therefore, the amount of heat dissipation can be increased over a wide range in the length direction for the first busbar portion and the second busbar portion. Furthermore, since the cooling water can be brought close to the through busbar portion 152, the heat dissipation effect of the busbar can be increased at the portion penetrating the partition wall 12c. Therefore, the busbar extending from the noise filter 7 to the semiconductor device 90 side through the partition wall 12c can be set to a wide range of coolable portions.

[0060] The first busbar portion 151 is provided between the smoothing capacitor 5 and the cooling passage 124 in contact with the partition wall 12c via an insulator. This configuration provides an effective heat transfer path in which heat generated in the first busbar portion 151 moves to the partition wall 12c and is absorbed by the cooling water. Therefore, it is possible to provide the power conversion device 4 in which the cooling effect of the first busbar portion 151 is improved.

[0061] First accommodation chamber 121 is located above second accommodation chamber 122. Penetrating busbar portion 152 extends in the vertical direction across first accommodation chamber and second accommodation chamber at one location inside housing 12 and penetrates partition wall 12c. With this, a power conversion device can be provided that realizes reducing the lateral length of the housing by configuring the accommodation chamber in the housing to have a two-layer structure.

[0062] The power conversion device 4 includes an input bus bar 14 of an input line that connects the DC power supply 2 and the noise filter 7, and an output bus bar 16 of an output line that is connected to the semiconductor device. The input bus bar and the output bus bar extend from the same side wall 12a of the housing 12 to the outside of the housing. With this configuration, the power input section and the power output section of the power conversion device can be taken out from the same side of the housing. Therefore, the installation space occupied by the power conversion device 4, the DC power supply 2, and the output device can be made compact.

[0063] Second embodiment The second embodiment will be described with reference to Fig. 13. The power conversion device of the second embodiment differs from the first embodiment in that it has a heat transfer path from the first terminal portion 153a to the contact heat dissipation portion 153a1. The configurations, actions, and effects of the second embodiment that are not specifically described are the same as those of the first embodiment, and the following describes the differences from the first embodiment.

[0064] Each of the P-side bus bar and the N-side bus bar of the relay bus bar 153 is provided with a contact heat dissipation portion 153a1 extending from the first terminal portion 153a toward the bent partition wall 12c. The contact heat dissipation portion 153a1 is disposed so as to be in contact with the heat conductive member 126. The heat conductive member 126 of the second embodiment is a sheet-like member, grease, a gel-like substance, a gap filler, or the like, formed of a material having high thermal conductivity and insulating properties. The portion extending from the first terminal portion 153a toward the bent partition wall 12c is covered with a resin molded portion 132. The portion in contact with the heat conductive member 126 is a portion protruding from the resin molded portion 132.

[0065] The P-side bus bar and the N-side bus bar in the second embodiment have contact heat dissipation parts 153a1 that contact the partition wall via an insulator. With this configuration, a heat transfer path can be formed that dissipates heat from the first terminal part 153a to the thermal conductive member 126 via the contact heat dissipation parts 153a1. In the second embodiment, by forming a plurality of heat transfer paths including the heat transfer path via the extension part 1533, the heat dissipation performance from the first terminal part 153a can be improved.

[0066] Third embodiment The third embodiment will be described with reference to Fig. 14. The power conversion device of the third embodiment differs from the first embodiment in that the first housing chamber 121 is provided below the second housing chamber 122. Configurations, actions, and effects of the third embodiment that are not specifically described are similar to those of the previously described embodiments, and only the differences from the previously described embodiments will be described below.

[0067] The input bus bar 14 extends from the side wall 12a to the outside of the housing 12 at a position higher than the output bus bar 16. The semiconductor devices 90 and the smoothing capacitor 5 are accommodated in an accommodation chamber located below the noise filter 7 inside the housing 12. The first bus bar portion 151 is accommodated in an accommodation chamber located above the relay bus bar 153 inside the housing 12.

[0068] In the power conversion device 4 of the third embodiment, the first accommodation chamber 121 is located below the second accommodation chamber 122. The through bus bar portion 152 penetrates the partition wall 12c in the vertical direction between the first accommodation chamber and the second accommodation chamber at one location inside the housing 12. According to the third embodiment, a power conversion device can be provided that realizes reducing the lateral length of the housing by configuring the accommodation chamber in the housing to have an upper and lower two-layer structure.

[0069] Other embodiments The disclosure of this specification is not limited to the exemplified embodiments. The disclosure includes the exemplified embodiments and modifications by those skilled in the art based thereon. For example, the disclosure is not limited to the combination of parts and elements shown in the embodiments, and can be implemented in various modifications. The disclosure can be implemented by various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure includes those in which parts and elements of the embodiments are omitted. The disclosure includes the replacement or combination of parts and elements between one embodiment and another embodiment. The disclosed technical scope is not limited to the description of the embodiments. The disclosed technical scope is indicated by the description of the claims, and should be interpreted as including all modifications within the meaning and scope equivalent to the description of the claims.

[0070] A power conversion device capable of achieving the object disclosed in the specification may have at least the first accommodating chamber 121 and the second accommodating chamber 122 inside the housing 12. Therefore, the power conversion device may have a single or multiple chambers inside the housing 12 in addition to the first accommodating chamber 121 and the second accommodating chamber 122.

[0071] The power conversion device in the above-described embodiment may be configured without the terminal block unit 13. In this case, the following configuration may be adopted as an example. The relay bus bar 153 is directly connected to one end of the capacitor bus bar that is connected to the capacitor element. The other end of the capacitor bus bar is connected to the terminal portion 90a of the semiconductor device. As another example, a nut member 172 may be built into the capacitor case that forms the smoothing capacitor 5, and the terminal portion 90a and the terminal portion 5b may be coupled to the first terminal portion 153a.

[0072] The relay bus bar 153 may be in contact with the partition wall 12c via an insulating member so as to be capable of conducting heat transfer therethrough. The insulating member is a sheet-like member, grease, a gel-like substance, a gap filler, or the like, made of an insulating material.

[0073] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple dependent claims. Some of the claims may be described in a multiple dependent form, where the subsequent claim alternatively refers to the preceding claim. Furthermore, some of the claims may be described in a multiple dependent form, where the subsequent claim alternatively refers to the preceding claim. The claims described in these multiple dependent forms define multiple technical ideas.

[0074] (Technical thought 1) a housing (12) having a first storage chamber (121) and a second storage chamber (122) therein; A partition wall (12c) that separates the first storage chamber and the second storage chamber; A plurality of semiconductor devices (90) that are accommodated in the first accommodation chamber and form a power conversion circuit; a smoothing capacitor (5) accommodated in the first accommodation chamber and connected to the semiconductor device; a noise filter (7) accommodated in the second accommodation chamber and connected to the smoothing capacitor; a cooling passage (124) formed in the partition wall through which cooling water flows; a communication bus bar (15) provided across the first housing chamber and the second housing chamber and included in an electric power path connecting a terminal portion of the noise filter and a terminal portion (90a) of the semiconductor device; Equipped with The power conversion device includes a through bus bar portion (152) that extends across the first accommodating chamber and the second accommodating chamber at one location inside the housing and penetrates the partition wall.

[0075] (Technical thought 2) The power conversion device described in Technical Idea 1, wherein, when the partition wall is viewed in a plane, the through busbar portion penetrates the partition wall in an area farther from the semiconductor device than a side portion (51) of the smoothing capacitor that is closest to the semiconductor device.

[0076] (Technical Thought 3) A power conversion device as described in Technical Idea 2, wherein, when the partition wall is viewed in a plane, the through busbar portion penetrates the partition wall outside an outer surface portion of the smoothing capacitor located on the opposite side to the semiconductor device.

[0077] (Technical Thought 4) the communication bus bar further includes a first bus bar portion (151) extending along the cooling passage toward the through bus bar portion in the second accommodating chamber, and a second bus bar portion (153) extending along the cooling passage from a side of the through bus bar portion toward the semiconductor device in the first accommodating chamber, The power converter according to any one of Technical Ideas 1 to 3, wherein the through busbar portion penetrates the partition wall at a position adjacent to the cooling passage.

[0078] (Technical Thought 5) The power conversion device according to Technical Concept 4, wherein the first bus bar portion is provided between the smoothing capacitor and the cooling passage in contact with the partition wall via an insulator.

[0079] (Technical Thought 6) a terminal block unit (13) having a resin molded portion (131, 132) incorporating a relay bus bar (153) to be connected to a terminal portion of the semiconductor device; The relay bus bar has a P-side bus bar included in a P line (10) on a high potential side and an N-side bus bar included in an N line (11) on a low potential side, A power conversion device described in any one of technical ideas 1 to 3, wherein the P-side bus bar and the N-side bus bar include a bus bar terminal portion (153a) that is connected to a terminal portion of the semiconductor device, and a pair of extension portions (1533) that are bent from the bus bar terminal portion and built into the resin molded portion, and extend toward the partition wall in an opposing orientation to each other.

[0080] (Technical Thought 7) A power conversion device described in technical idea 6, wherein the P-side bus bar and the N-side bus bar have a contact heat dissipation portion (153a1) that extends from the bus bar terminal portion toward the partition wall and contacts the partition wall via an insulator.

[0081] (Technical Thought 8) The first storage chamber is located above the second storage chamber, A power conversion device described in any one of Technical Ideas 1 to 7, wherein the through busbar portion extends in the vertical direction between the first accommodating chamber and the second accommodating chamber at one location inside the housing and penetrates the partition wall.

[0082] (Technical Thought 9) The second storage chamber is located above the first storage chamber, A power conversion device described in any one of Technical Ideas 1 to 7, wherein the through busbar portion extends in the vertical direction between the first accommodating chamber and the second accommodating chamber at one location inside the housing and penetrates the partition wall.

[0083] (Technical Thought 10) an input bus bar (14) included in an input line connecting a DC power source (2) and the noise filter; an output bus bar (16) included in an output line connected to the semiconductor device; A power conversion device according to any one of Technical Ideas 1, 2, 3, 8, and 9, wherein the input bus bar and the output bus bar extend from a same side wall (12a) of the housing to the outside of the housing. [Explanation of symbols]

[0084] 5...smoothing capacitor, 7...noise filter, 10...P line, 11...N line, 12...housing; 12c...partition wall; 13...terminal block unit; 14...input bus bar; 15...connection bus bar, 16...output bus bar, 90...semiconductor device, 121...first chamber, 122... second chamber; 124... cooling passage; 131, 132... resin molded portion; 151...first bus bar portion, 152...through bus bar portion, 153... relay bus bar (second bus bar portion), 153a... first terminal portion (bus bar terminal portion) 153a1…Contact heat dissipation part

Claims

1. A housing (12) having a first storage chamber (121) and a second storage chamber (122) therein; a partition wall (12c) separating the first storage chamber and the second storage chamber; A plurality of semiconductor devices (90) housed in the first housing chamber to form a power conversion circuit; a smoothing capacitor (5) accommodated in the first accommodation chamber and connected to the semiconductor device; a noise filter (7) accommodated in the second accommodation chamber and connected to the smoothing capacitor; a cooling passage (124) formed in the partition wall through which cooling water flows; a connecting bus bar (15) provided across the first housing chamber and the second housing chamber and included in a power path connecting a terminal portion of the noise filter and a terminal portion (90a) of the semiconductor device; an input bus bar (14) included in an input line connecting a DC power supply (2) and the noise filter; an output bus bar (16) included in an output line connected to the semiconductor device; Equipped with the input bus bar extends from the second housing chamber to the outside of the housing, the output bus bar extends from the first accommodating chamber to the outside of the housing, The power conversion device includes a through bus bar portion (152) that extends between the first and second accommodating chambers at one location inside the housing and penetrates the partition wall.

2. 2. The power conversion device according to claim 1, wherein, when the partition wall is viewed in a plane, the through busbar portion penetrates the partition wall in an area farther from the semiconductor device than a side portion (51) of the smoothing capacitor that is closest to the semiconductor device.

3. The power conversion device according to claim 2 , wherein the through busbar portion penetrates the partition wall outside an outer surface portion of the smoothing capacitor located on the opposite side from the semiconductor device when the partition wall is viewed in a plan view.

4. the communication bus bar further includes a first bus bar portion (151) extending along the cooling passage in the second accommodating chamber toward the through bus bar portion, and a second bus bar portion (153) extending along the cooling passage from the through bus bar portion side toward the semiconductor device in the first accommodating chamber, The power conversion device according to claim 1 , wherein the through bus bar portion penetrates the partition wall at a position adjacent to the cooling passage.

5. The power conversion device according to claim 4 , wherein the first bus bar portion is provided between the smoothing capacitor and the cooling passage in contact with the partition wall via an insulator.

6. a terminal block unit (13) having a resin molded portion (131, 132) incorporating a relay bus bar (153) connected to a terminal portion of the semiconductor device; The relay bus bar has a P-side bus bar included in a P line (10) on the high potential side and an N-side bus bar included in an N line (11) on the low potential side, A power conversion device as described in any one of claims 1 to 3, wherein the P-side bus bar and the N-side bus bar include a bus bar terminal portion (153a) that is connected to a terminal portion of the semiconductor device, and a pair of extension portions (1533) that bend from the bus bar terminal portion and are built into the resin molded portion, and extend toward the partition wall in an opposing orientation.

7. The power conversion device according to claim 6, wherein the P-side bus bar and the N-side bus bar have a contact heat dissipation portion (153a1) that extends from the bus bar terminal portion toward the partition wall and contacts the partition wall via an insulator.

8. The first storage chamber is located above the second storage chamber, The power conversion device according to claim 1 , wherein the through busbar portion extends vertically between the first accommodating chamber and the second accommodating chamber at one location inside the housing and penetrates the partition wall.

9. The second storage chamber is located above the first storage chamber, The power conversion device according to claim 1 , wherein the through busbar portion extends vertically between the first accommodating chamber and the second accommodating chamber at one location inside the housing and penetrates the partition wall.

10. A power conversion device described in any one of claims 1 to 3, wherein the input bus bar and the output bus bar extend from the same side wall (12a) of the housing to the outside of the housing.

11. A housing (12) having a first storage chamber (121) and a second storage chamber (122) therein; a partition wall (12c) separating the first storage chamber and the second storage chamber; A plurality of semiconductor devices (90) housed in the first housing chamber to form a power conversion circuit; a smoothing capacitor (5) accommodated in the first accommodation chamber and connected to the semiconductor device; a noise filter (7) accommodated in the second accommodation chamber and connected to the smoothing capacitor; a cooling passage (124) formed in the partition wall through which cooling water flows; a connecting bus bar (15) provided across the first housing chamber and the second housing chamber and included in a power path connecting a terminal portion of the noise filter and a terminal portion (90a) of the semiconductor device; a terminal block unit (13) having a resin molded portion (131, 132) incorporating a relay bus bar (153) connected to a terminal portion of the semiconductor device; Equipped with the communication bus bar has a through bus bar portion (152) that extends across the first accommodating chamber and the second accommodating chamber at one location inside the housing and penetrates the partition wall, The relay bus bar has a P-side bus bar included in a P line (10) on the high potential side and an N-side bus bar included in an N line (11) on the low potential side, The P-side bus bar and the N-side bus bar are a power conversion device including a bus bar terminal portion (153a) that is connected to a terminal portion of the semiconductor device, and a pair of extension portions (1533) that are bent from the bus bar terminal portion and built into the resin molded portion, and that extend toward the partition wall in an opposing orientation.

Images