Electronic device

Abstract

To provide an electronic device that can inhibit a circuit board from being subjected to water.SOLUTION: An electronic device 100 has a first circuit board 10, a second circuit board 20, a first housing member 30 with a first housing part SP1 that houses the first circuit board 10, and a second housing member 40 with a second housing part SP2 that houses the second circuit board 20. The first housing member 30 and the second housing member 40, when assembled, form a hollow space SP3 through which the cooling water CW1 flows by means of their opposing surfaces SF32 and SF42. Each of the housing parts SP1, SP2 and the hollow part SP3 are separated from each other by the first housing member 30 and the second housing member 40.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] One example of an electronic device is the technology disclosed in Patent Document 1. Patent Document 1 discloses a circuit board, an electronic component disposed on the circuit board, and a heat conductive member disposed on the electronic component. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2022 / 192031 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, the electronic device may be configured such that a cooling unit through which a liquid coolant flows is disposed in a space that accommodates the circuit board. In this case, there is a risk that the liquid coolant leaking from the cooling unit may splash onto the circuit board.

[0005] One disclosed object is to provide an electronic device capable of preventing a circuit board from becoming wet. [Means for solving the problem]

[0006] The electronic device disclosed herein comprises: At least one circuit board (10, 20); a housing including a first housing member (30) and a second housing member (40), in which at least one of the first housing member and the second housing member is provided with a housing portion (SP1, SP2) for housing a circuit board; When the first housing member and the second housing member are assembled, a hollow space (SP3) through which the liquid refrigerant flows is formed by their opposing surfaces (SF32, SF42). At least one of the first housing member and the second housing member is provided with an inlet / outlet port (42c, 42d) that is connected to the hollow portion, The housing portion and the hollow portion are separated by a first housing member and a second housing member.

[0007] In this way, in the electronic device, the housing portion in which the circuit board is housed and the hollow portion through which the liquid refrigerant flows are separated by the first housing member and the second housing member. Therefore, even if the liquid refrigerant leaks from the hollow portion, the electronic device can prevent the liquid refrigerant from entering the housing portion. In other words, the electronic device can prevent the circuit board from becoming wet.

[0008] The aspects disclosed in this specification adopt different technical means to achieve their respective objectives. The claims and the parenthetical symbols described in this section are illustrative of the corresponding relationship with the embodiments described below, and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become clearer by referring to the following detailed description and the attached drawings. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a schematic configuration of an electronic device. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 2 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 2 is a perspective view showing a schematic configuration of a first circuit board side. [Diagram 5] 4 is a perspective view showing a schematic configuration of a mounting surface side of a first housing member. FIG. [Figure 6] 4 is a perspective view showing a schematic configuration of an opposing surface side of a first housing member. FIG. [Figure 7] FIG. 4 is a perspective view showing a schematic configuration of a second circuit board side. [Figure 8] 4 is a perspective view showing a schematic configuration of a mounting surface side of a second housing member. FIG. [Figure 9]4 is a perspective view showing a schematic configuration of an opposing surface side of a second housing member. FIG. [Figure 10] FIG. 1 is an exploded perspective view showing a schematic configuration of an electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a number of embodiments of the present disclosure will be described with reference to the drawings. In the following, three mutually orthogonal directions are referred to as an X direction, a Y direction, and a Z direction.

[0011] An electronic device 100 of this embodiment will be described with reference to Figs. 1 to 10. The electronic device 100 mainly includes a first circuit board 10, a second circuit board 20, a first housing member 30, and a second housing member 40. In this embodiment, as an example, the electronic device 100 includes a first cover 51, a second cover 52, a third cover 53, and a fourth cover 54. The electronic device 100 is configured to cool the first circuit board 10 and the second circuit board 20 with cooling water CW1. The cooling water CW1 corresponds to a liquid refrigerant.

[0012] The electronic device 100 is configured to be mountable on a moving body such as a vehicle. For example, the electronic device 100 can be applied to an electronic control device. The electronic device 100 can also be applied to an integrated control device in which multiple functions are integrated. Furthermore, the electronic device 100 can also be applied to an electronic control device for automatic driving. Each component will be described below.

[0013] <1st circuit board> As shown in Fig. 2, Fig. 3, etc., first circuit board 10 includes wiring board 11, mounted components 12, heat conductive member 13, first connector 14, etc. Wiring board 11 includes, for example, an electrically insulating base material such as resin, and conductive wiring such as copper. Wiring board 11 is a so-called printed wiring board. Wiring board 11 includes a mounting surface SF11 on which mounted components 12 are mounted, and a back surface SF12 which is the surface opposite to mounting surface SF11. Wiring board 11 is disposed along the XY plane.

[0014] The mounted components 12 are mounted on the mounting surface SF11. The mounted components 12 are electrically connected to the wiring of the wiring board 11. An SoC or the like can be used for the mounted components 12. Thus, the first circuit board 10 is configured so that the mounted components 12 execute arithmetic processing. The first circuit board 10 can also be regarded as a single electronic control device. SoC is an abbreviation for System on a Chip.

[0015] In addition, wiring board 11 may have circuit components mounted thereon other than mounted components 12. The number of mounted components 12 mounted on wiring board 11 is not particularly limited. Wiring board 11 may have circuit components mounted on its rear surface SF12.

[0016] The mounted components 12 are circuit components that generate heat when they operate. The mounted components 12 correspond to heat-generating components. In this embodiment, therefore, an example is adopted in which the mounted components 12 are provided with a thermally conductive member 13. The mounted components 12 are disposed facing a mounting surface SF31 of a first housing member 30, which will be described later. The mounted components 12 are mounted on the first housing member 30 via the thermally conductive member 13. The thermally conductive member 13 is in contact with the first housing member 30.

[0017] The heat conductive member 13 is a member for lowering the thermal resistance between the mounted components 12 and the first housing member 30. A heat dissipation gel, a heat dissipation sheet, or the like can be used as the heat conductive member 13. The heat conductive member 13 is also sometimes called a thermal interface material. The mounting surface SF31 corresponds to the opposite surface.

[0018] The first connector 14 is mounted on the mounting surface SF11. The first connector 14 is electrically connected to the wiring of the wiring board 11. The first connector 14 is an interface for electrically connecting the first circuit board 10 and the second circuit board 20.

[0019] <Second circuit board> 2, 3, etc., the second circuit board 20 includes a wiring board 21, mounted components 22, a heat conductive member 23, a second connector 24, etc. The second circuit board 20 is configured similarly to the first circuit board 10. In other words, components with the same names but different reference numerals are similar to the components of the first circuit board 10.

[0020] The mounted components 22 are disposed facing a mounting surface SF41 of a second housing member 40, which will be described later. The mounted components 22 are mounted on the second housing member 40 via a thermally conductive member 23. The mounting surface SF41 corresponds to the opposite surface.

[0021] The second circuit board 20 is electrically connected to the first circuit board 10 by connecting the second connector 24 to the first connector 14. The first connector 14 and the second connector 24 can also be called board-connecting connectors.

[0022] Second circuit board 20 differs from first circuit board 10 in the number of mounted components 22 and the contents of the arithmetic processing of mounted components 22. Wiring board 21 has a mounting surface SF21 on which mounted components 22 are mounted, and a back surface SF22 opposite mounting surface SF21. Mounted components 22 correspond to heat-generating components.

[0023] In this embodiment, an electronic device 100 including a first circuit board 10 and a second circuit board 20 is used. However, the electronic device 100 may also be configured to include only one of the first circuit board 10 and the second circuit board 20. Furthermore, the electronic device 100 may also be configured to include only one of the first circuit board 10 and the second circuit board 20 that includes a heat-generating component. Hereinafter, when there is no need to distinguish between the first circuit board 10 and the second circuit board 20, the first circuit board 10 and the second circuit board 20 will also be collectively referred to as the circuit boards 10, 20.

[0024] <Case> 1, 2, and 3, the housing includes a first housing member 30 and a second housing member 40. The housing also includes a first cover 51, a second cover 52, a third cover 53, and a fourth cover 54. The housing is configured by assembling the first housing member 30, the second housing member 40, the first cover 51, the second cover 52, the third cover 53, and the fourth cover 54.

[0025] First, the first housing member 30 will be described with reference to Fig. 2 to Fig. 6. As shown in Fig. 2, Fig. 3, and Fig. 4, the first housing member 30 is a member that houses the first circuit board 10. The first housing member 30 can also be said to be a member on which the first circuit board 10 is mounted. Therefore, the first housing member 30 can also be said to be a mounted member or a first mounted member.

[0026] 5, 6, etc., the first housing member 30 has a base 31 and side walls 32 and 33. The base 31 has a mounting surface SF31 on which the first circuit board 10 is mounted, and an opposing surface SF32 that is the surface opposite the mounting surface SF31. The opposing surface SF32 is a surface that faces the second housing member 40 when the first housing member 30 and the second housing member 40 are assembled together.

[0027] The base 31 is provided with side walls 32, 33 at both ends in the Y direction. The side walls 32, 33 are provided to protrude in the Z direction from the base 31. The side walls 32, 33 are provided along the X direction. The first housing member 30 is provided with a first accommodating portion SP1 that accommodates the first circuit board 10 in an area sandwiched between the side walls 32, 33. The first accommodating portion SP1 is an area facing the mounting surface SF31 and is an area between the side walls 32, 33.

[0028] The mounting surface SF11 faces the mounting surface SF31 when the first circuit board 10 is housed in the first housing member 30. Meanwhile, the back surface SF12 is exposed. Therefore, the first cover 51 is attached to the first housing member 30 in an area facing the mounting surface SF31. That is, the first cover 51 is attached to the first housing member 30 so as to cover the back surface SF12.

[0029] Furthermore, the first housing member 30 has a third cover 53 and a fourth cover 54 attached to the end portion along the Y direction of the base 31. However, the first housing member 30 may have a side wall portion at the end portion in the X direction that surrounds the first circuit board 10 together with the side wall portions 32 and 33. Also, the first housing member 30 may have a side wall portion at only one of the ends in the X direction.

[0030] The base 31 includes a cooling portion 31a. The cooling portion 31a is a part that forms a hollow portion SP3, which will be described later. A facing surface SF32 of the cooling portion 31a is provided with a first recess 31b that is recessed from the surrounding area. The facing surface SF32 of the cooling portion 31a is a portion that comes into contact with the cooling water CW1. The first recess 31b corresponds to a recess.

[0031] 2, 5, 6, etc., the base 31 is provided with a first opening 34. The first opening 34 is a through hole that reaches from the mounting surface SF31 to the opposing surface SF32. The first opening 34 is provided biased toward the side wall portion 33 rather than the side wall portion 32. Part of the connected first connector 14 and second connector 24 are disposed in the first opening 34.

[0032] 6, the base 31 is provided with a seal portion 35 around the first opening 34. The seal portion 35 is provided on the opposing surface SF32. The seal portion 35 is a portion where a connector seal member 80, which will be described later, is disposed. Here, as an example, a groove-shaped seal portion 35 in which the connector seal member 80 is disposed is used.

[0033] Next, the second housing member 40 will be described with reference to Figs. 2, 3, and 7 to 9. As shown in Figs. 2, 3, and 7, the second housing member 40 is a member that houses the second circuit board 20. The second housing member 40 can also be said to be a member on which the second circuit board 20 is mounted. Therefore, the second housing member 40 can also be said to be a mounted member or a second mounted member.

[0034] 7, 8, etc., the second housing member 40 has a base 41 and side wall portions 42 and 43. The base 41 has a mounting surface SF41 on which the second circuit board 20 is mounted, and an opposing surface SF42 that is the surface opposite the mounting surface SF41. The opposing surface SF42 is a surface that faces the first housing member 30 when the first housing member 30 and the second housing member 40 are assembled together.

[0035] The base 41 is provided with side walls 42, 43 at both ends in the Y direction. The side walls 42, 43 are provided to protrude in the Z direction relative to the base 41. The side walls 42, 43 are provided along the X direction. The second housing member 40 is provided with a second accommodation portion SP2 that accommodates the second circuit board 20 in an area sandwiched between the side walls 42, 43. The second accommodation portion SP2 is an area facing the mounting surface SF41 and is an area between the side walls 42, 43.

[0036] When the second circuit board 20 is housed in the second housing member 40, the mounting surface SF21 faces the mounting surface SF41. Meanwhile, the back surface SF22 is exposed. Therefore, the second cover 52 is attached to the second housing member 40 in an area facing the mounting surface SF41. That is, the second cover 52 is attached to the second housing member 40 so as to cover the back surface SF22.

[0037] Furthermore, the second housing member 40 has a third cover 53 and a fourth cover 54 attached to the end portion along the Y direction of the base 41. In this manner, the third cover 53 and the fourth cover 54 are provided commonly to the first housing member 30 and the second housing member 40. However, in the present disclosure, the third cover 53 and the fourth cover 54 do not have to be provided. Also, in the present disclosure, electrical components such as an external connection connector may be attached instead of the third cover 53 and the fourth cover 54.

[0038] The second housing member 40 may be provided with a side wall portion at an end in the X direction that surrounds the second circuit board 20 together with the side wall portions 42 and 43. The second housing member 40 may be provided with a side wall portion at only one of the ends in the X direction.

[0039] The base 41 includes a cooling portion 41a. The cooling portion 41a is a part that forms a hollow portion SP3, which will be described later. In other words, the cooling portion 41a is a portion that forms the hollow portion SP3 together with the cooling portion 31a. The opposing surface SF42 of the cooling portion 41a is provided with a second recess 41b that is recessed more than the surrounding area. The opposing surface SF42 of the cooling portion 41a is a portion that comes into contact with the cooling water CW1. The second recess 41b corresponds to a recess.

[0040] In this manner, the hollow portion SP3 is formed by the first recess 31b and the second recess 41b facing each other. Therefore, the electronic device 100 can have a hollow portion SP3 that is wider than a hollow portion in which one of the first recess 31b and the second recess 41b is formed as a flat surface. Therefore, the electronic device 100 can increase the amount of the cooling water CW1. Therefore, the electronic device 100 can efficiently cool the circuit board.

[0041] 2, 8, 9, etc., the base 41 is provided with a second opening 44. The second opening 44 is a through hole that reaches from the mounting surface SF41 to the opposing surface SF42. The second opening 44 is provided biased toward the side wall portion 43 rather than the side wall portion 42. In the second opening 44, parts of the connected first connector 14 and second connector 24 are disposed.

[0042] 9, the base 41 is provided with a seal portion 45 around the second opening 44. The seal portion 45 is provided on the opposing surface SF42. The seal portion 45 is a portion where a connector seal member 80, which will be described later, is disposed. Here, as an example, a groove-shaped seal portion 45 in which the connector seal member 80 is disposed is used.

[0043] 9, there are provided an outlet portion 42a and an inlet portion 42b that are continuous with the side wall portion 42. The outlet portion 42a and the inlet portion 42b are provided integrally with the side wall portion 42. Therefore, it can be said that the outlet portion 42a and the inlet portion 42b are provided adjacent to each other on the same side wall portion 42.

[0044] The outflow portion 42a is a portion to which an outflow pipe through which the cooling water CW1 flows is attached. The outflow portion 42a is provided with an outflow port 42c which is a through hole connected to the hollow portion SP3. The cooling water CW1 flowing through the hollow portion SP3 is discharged into the outflow pipe through the outflow port 42c.

[0045] The inlet portion 42b is a portion to which an inlet pipe through which the cooling water CW1 flows is attached. The inlet portion 42b is provided with an inlet 42d, which is a through hole that connects to the hollow portion SP3. The cooling water CW1 is supplied from the inlet pipe through the inlet 42d to the hollow portion SP3.

[0046] The second housing member 40 also has a wall portion 41c that protrudes into the hollow portion SP3. The wall portion 41c is a portion that protrudes from the opposing surface SF42 of the cooling portion 41a. The wall portion 41c has a height, for example, approximately equal to the depth of the second recess 41b. However, the wall portion 41c may have a height approximately equal to the depth of the hollow portion SP3 in the Z direction. The height is the length in the Z direction. The length of the hollow portion SP3 corresponds to the distance between the opposing surfaces SF32, 42 in the hollow portion SP3.

[0047] The wall portion 41c is disposed between the outlet 42c and the inlet 42d. That is, the wall portion 41c is connected between the outlet 42c and the inlet 42d in the wall on the side wall portion 42 side of the second recess 41b. The wall portion 41c is provided along the Y direction without reaching the wall on the side wall portion 43 side of the second recess 41b. In this manner, the wall portion 41c partially divides the hollow portion SP3 into the outlet 42c side and the inlet 42d side. This wall portion 41c may be provided on at least one of the first housing member 30 and the second housing member 40. The wall portion 41c may also be called a flow straightening portion or a flow straightening wall that straightens the flow of the liquid refrigerant.

[0048] The outlet 42c and the inlet 42d correspond to the outflow and inflow ports. The outlet pipe and the inlet pipe correspond to the pipes. The outlet pipe can also be said to be attached to the outlet 42c. The inlet pipe can also be said to be attached to the inlet 42d.

[0049] In the present embodiment, as an example, the outlet portion 42a and the inlet portion 42b are provided in the second housing member 40. However, the outlet portion 42a and the inlet portion 42b may be provided in the first housing member 30. Also, the outlet portion 42a may be provided in one of the first housing member 30 and the second housing member 40, and the inlet portion 42b may be provided in the other.

[0050] Alternatively, one of the outlet portion 42a and the inlet portion 42b may be provided on the side wall portion 42, and the other may be provided on the side wall portion 43. In other words, the electronic device 100 may be configured so that the cooling water CW1 flows linearly.

[0051] In this manner, the electronic device 100 includes a first housing portion SP1 and a second housing portion SP2 as housing portions. The first housing member 30 and the second housing member 40 include the housing portions SP1 and SP2. Therefore, the first housing member 30 and the second housing member 40 correspond to housing housing members. However, the present disclosure may also be adopted in a configuration in which the housing portions SP1 and SP2 are provided in at least one of the first housing member 30 and the second housing member 40.

[0052] The first housing member 30 and the second housing member 40 are mainly made of a metal such as aluminum. However, the present disclosure is not limited to this. Only one of the first housing member 30 and the second housing member 40 may be mainly made of a metal. Furthermore, the first housing member 30 and the second housing member 40 may be mainly made of a resin.

[0053] <Electronic equipment> Here, the assembly of the components as described above and the electronic device 100 in the assembled state will be described.

[0054] 10, electronic device 100 includes, as separate components, first circuit board 10, second circuit board 20, first housing member 30, second housing member 40, first cover 51, and second cover 52. Furthermore, electronic device 100 includes, as separate components, seal member 60, gasket 70, and connector seal member 80.

[0055] The electronic device 100 is formed by stacking and assembling these components. The electronic device 100 is assembled so that the opposing surface SF32 of the first housing member 30 and the SF42 of the second housing member 40 face each other. The first housing member 30 and the second housing member 40 are fixed by a screw member 1, which is a male screw. The first housing member 30 is provided with a screw opening 1a into which the screw member 1 is inserted, as shown in FIG. 6. Meanwhile, the second housing member 40 is provided with a screw hole portion 1b into which the screw member 1 is fastened, as shown in FIG. 9. The screw hole portion 1b is formed with a female screw. The first housing member 30 and the second housing member 40 are fixed by fastening the screw member 1 to the screw hole portion 1b with the screw member 1 inserted into the screw opening portion 1a.

[0056] In addition, a hollow portion SP3 is formed by the opposing surfaces SF32, SF42 of the first housing member 30 and the second housing member 40 when they are assembled together. The hollow portion SP3 is a space through which the cooling water CW1 flows. Therefore, the hollow portion SP3 can also be called a refrigerant flow path.

[0057] 2, 3, 6, and 9, a seal member 60 that surrounds the entire periphery of the hollow portion SP3 is provided between the first housing member 30 and the second housing member 40. It can also be said that the seal member 60 is provided in the opposing region between the first housing member 30 and the second housing member 40. In other words, the first housing member 30 and the second housing member 40 are fixed together with the seal member 60 disposed in the opposing region.

[0058] The seal member 60 is a member for preventing the cooling water CW1 from leaking from the hollow portion SP3. The seal member 60 may be an O-ring, a caulking material, or the like.

[0059] The seal member 60 contacts the first housing member 30 and the second housing member 40. More specifically, the seal member 60 contacts the opposing surfaces SF32, SF42. Furthermore, by being fixed with the screw members 1 as described above, the seal member 60 is disposed in a state in which it is pressed from the opposing surfaces SF32, SF42. This enables the electronic device 100 to prevent the cooling water CW1 from leaking from the hollow portion SP3.

[0060] 6 and 9, the screw members 1 are provided at multiple locations on the outer periphery of the seal member 60. That is, the screw members 1 are provided at multiple locations so as to surround the seal member 60. The screw members 1 are provided at multiple locations on each side of the seal member 60 along the Y direction. The screw members 1 are also provided at multiple locations on each side of the seal member 60 along the X direction. Furthermore, the screw members 1 are provided at two locations that sandwich the outlet 42c and at two locations that sandwich the inlet 42d.

[0061] This allows the first housing member 30 and the second housing member 40 to press the entire periphery of the seal member 60 in the electronic device 100, improving the sealing performance. That is, the electronic device 100 can improve the leak prevention function provided by the seal member 60.

[0062] The electronic device 100 does not necessarily have to include the seal member 60. For example, by welding the first housing member 30 and the second housing member 40 to surround the entire periphery of the hollow portion SP3, it is possible to prevent the cooling water CW1 from leaking from the hollow portion SP3.

[0063] 2, 3, 6, and 9, a gasket 70 that surrounds the entire periphery of the seal member 60 is provided in the opposing region between the first housing member 30 and the second housing member 40. It can also be said that the gasket 70 is provided on the outer periphery of the seal member 60. In other words, the first housing member 30 and the second housing member 40 are fixed together with the gasket 70 disposed in the opposing region.

[0064] As described above, the electronic device 100 includes the seal member 60 to prevent the cooling water CW1 from leaking from the hollow portion SP3. However, the cooling water CW1 may leak due to deterioration of the seal member 60. The gasket 70 is a member for preventing the leaked cooling water CW1 from splashing violently even if the cooling water CW1 leaks. The gasket 70 corresponds to a splash prevention member.

[0065] The material of the gasket 70 is not particularly limited. It is preferable that the gasket 70 contacts both of the opposing surfaces SF32, SF42. However, it is sufficient that the gasket 70 contacts at least one of the opposing surfaces SF32, SF42. The gasket 70 may also be employed in a portion that protrudes from at least one of the opposing surfaces SF32, SF42.

[0066] This allows the electronic device 100 to prevent the leaked liquid refrigerant from flowing out forcefully even if the cooling water CW1 leaks from the hollow portion SP3. The screw members 1 may be provided at multiple locations on the outer periphery of the gasket 70. The electronic device 100 does not necessarily have to include the gasket 70.

[0067] As described above, the second housing member 40 includes the wall portion 41c. Therefore, when the first housing member 30 and the second housing member 40 are assembled, the wall portion 41c is disposed in the hollow portion SP3. This causes the cooling water CW1 to flow in a U-shape within the hollow portion SP3. Therefore, the electronic device 100 can be configured such that the cooling water CW1 can easily flow throughout the entire hollow portion SP3.

[0068] More specifically, in the present embodiment, as an example, a configuration is adopted in which an inlet 42d and an outlet 42c are provided on one side wall 42. Therefore, the cooling water CW1 flows from the inlet 42d into the hollow portion SP3, flows through the entire area of ​​the hollow portion SP3, and is easily discharged from the outlet 42c. This makes it possible to prevent the cooling water CW1 from stagnating in a part of the hollow portion SP3. Therefore, the electronic device 100 can have a large cooling space. However, the electronic device 100 does not necessarily have to include the wall portion 41c.

[0069] 2 and 3, a gap SP4 that communicates with the external space is provided between the opposing surfaces SF32 and SF42 on the outer periphery of the seal member 60. That is, in the electronic device 100, when the first housing member 30 and the second housing member 40 are assembled, the opposing surfaces SF32 and SF42 on the outer periphery of the seal member 60 are in a non-contact state. The gap SP4 can be said to be an opposing region between the opposing surfaces SF32 and SF42 around the periphery of the seal member 60.

[0070] The external space is a space in which the electronic device 100 is disposed. The external space can also be referred to as a peripheral space of the electronic device 100. This allows the electronic device 100 to allow the cooling water CW1 to escape to the external space even if the cooling water CW1 leaks from the hollow portion SP3. However, the electronic device 100 does not necessarily need to have the gap SP4. The gap SP4 may be provided only in a portion of the periphery of the seal member 60.

[0071] Furthermore, a connector seal member 80 is provided between the first housing member 30 and the second housing member 40 around the first opening 34 and the second opening 44. That is, the first housing member 30 and the second housing member 40 are fixed in a state in which the connector seal member 80 is disposed on the seal portions 35, 45.

[0072] The connector seal member 80 contacts the seal portions 35, 45. More specifically, by being fixed with the screw member 1 as described above, the connector seal member 80 is disposed in a state in which it is pressed by the seal portions 35, 45. This enables the electronic device 100 to prevent the first connector 14 and the second connector 24 from becoming wet even if the cooling water CW1 leaks from the hollow portion SP3.

[0073] In this manner, the first housing member 30 and the second housing member 40 are fixed together with the screw member 1 to form a base portion of the housing having a hollow portion SP3 and a space SP4. Then, as shown in Figs. 4, 7, etc., the first circuit board 10 and the second circuit board 20 are mounted on the base portion. That is, the first circuit board 10 is mounted on the first housing member 30. The second circuit board 20 is mounted on the second housing member 40. The housing members 30, 40 and the circuit boards 10, 20 are fixed together with screws or the like.

[0074] 2 and 3, the first circuit board 10 and the second circuit board 20 are fixed so as to sandwich the base 31 of the first housing member 30 and the base 41 of the second housing member 40. Furthermore, cooling sections 31a and 41a are arranged between the first circuit board 10 and the second circuit board 20. Thus, the hollow section SP3 is provided between the first circuit board 10 and the second circuit board 20. Therefore, the electronic device 100 can cool the first circuit board 10 and the second circuit board 20 by the cooling water CW1 flowing through the single hollow section SP3. In other words, the hollow section SP3 can be said to be a refrigerant space provided in common to the first circuit board 10 and the second circuit board 20.

[0075] Furthermore, it is preferable that the circuit boards 10 and 20 are disposed so that the mounted components 12 and 22 face the cooling sections 31a and 41a, respectively. This allows the electronic device 100 to efficiently cool the mounted components 12 and 22.

[0076] In particular, the electronic device 100 includes a first circuit board 10 and a second circuit board 20. In addition, the electronic device 100 is expected to increase the number of mounted components 12, 22 and the amount of calculation of each mounted component 12, 22 due to the integration of functions. Therefore, the amount of heat generated by the electronic device 100 may increase. In response to this, the electronic device 100 can cool the first circuit board 10 and the second circuit board 20 with the cooling water CW1. Therefore, the electronic device 100 can operate the first circuit board 10 and the second circuit board 20 at an appropriate temperature. That is, the electronic device 100 can withstand an increase in the number of mounted components 12, 22 and the amount of calculation of each mounted component 12, 22. Furthermore, the electronic device 100 can maintain stable operation even if the number of mounted components 12, 22 and the amount of calculation of each mounted component 12, 22 increase.

[0077] In this embodiment, as an example, the first housing member 30 and the second housing member 40 are made mainly of metal. Therefore, the electronic device 100 can improve the cooling effect of the circuit boards 10, 20 by the cooling water CW1.

[0078] However, the present disclosure is not limited thereto. Only one of the first housing member 30 and the second housing member 40 may be mainly made of metal. In a configuration in which a circuit board is mounted on only one of the first housing member 30 and the second housing member 40, it is preferable that the one on which the circuit board is mounted is mainly made of metal. In other words, it is preferable that the one of the first housing member 30 and the second housing member 40 on which the storage portions SP1 and SP2 are formed is mainly made of metal. This allows the electronic device 100 to improve the cooling effect of the circuit board by the cooling water CW1.

[0079] The first housing member 30 has two side walls 32, 33 that sandwich the first housing portion SP1. Similarly, the second housing member 40 has two side walls 42, 43 that sandwich the second housing portion SP2. This allows the electronic device 100 to further prevent the cooling water CW1 from entering the housing portions SP1, SP2 even if the cooling water CW1 leaks from the hollow portion SP3.

[0080] By the way, pipes through which the cooling water CW1 flows are attached to the outflow portion 42a and the inflow portion 42b. Therefore, there is a possibility that the cooling water CW1 will flow from the attachment portion between the outflow portion 42a or the inflow portion 42b and the pipes.

[0081] However, as shown in FIG. 2, FIG. 7, etc., the second housing member 40 has a side wall 42 between the second housing portion SP2 and the outflow portion 42a and inflow portion 42b. Similarly, as shown in FIG. 2, FIG. 4, etc., the first housing member 30 has a side wall 32 between the first housing portion SP1 and the outflow portion 42a and inflow portion 42b. That is, the side wall 32 separates the outflow portion 42a and inflow portion 42b from the first housing portion SP1. The side wall 42 separates the outflow portion 42a and inflow portion 42b from the second housing portion SP2. Therefore, the electronic device 100 can prevent the cooling water CW1 leaking from the attachment portion between the outflow portion 42a and inflow portion 42b and the pipe from contacting each of the circuit boards 10 and 20.

[0082] <Effects> As described above, in the electronic device 100, the accommodation sections SP1, SP2 in which the circuit boards 10, 20 are accommodated and the hollow section SP3 through which the cooling water CW1 flows are separated by the first housing member 30 and the second housing member 40. That is, the accommodation sections SP1, SP2 and the hollow section SP3 are partitioned by at least the bases 31, 41. Furthermore, the accommodation sections SP1, SP2 and the hollow section SP3 are separate spaces.

[0083] Therefore, even if the cooling water CW1 leaks from the hollow portion SP3, the electronic device 100 can prevent the cooling water CW1 from entering the accommodation portions SP1 and SP2. That is, the electronic device 100 can prevent the circuit boards 10 and 20 from becoming wet.

[0084] Although the present disclosure has been described based on the embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also encompasses various modifications and modifications within the equivalent range. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more than one element, or less than one element are also within the scope and concept of the present disclosure.

[0085] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple dependent claims. Some of the claims may be described in a multiple dependent form, where the subsequent claim alternatively refers to the preceding claim. Furthermore, some of the claims may be described in a multiple dependent form, where the subsequent claim alternatively refers to the preceding claim. The claims described in these multiple dependent forms define multiple technical ideas.

[0086] (Technical thought 1) At least one circuit board (10, 20); a housing including a first housing member (30) and a second housing member (40), in which at least one of the first housing member and the second housing member is provided with a housing portion (SP1, SP2) for housing the circuit board; When the first housing member and the second housing member are assembled together, a hollow space (SP3) through which a liquid refrigerant flows is formed by their opposing surfaces (SF32, SF42), At least one of the first housing member and the second housing member is provided with an inlet / outlet port (42c, 42d) connected to the hollow portion, The electronic device has an accommodation portion and a hollow portion separated by the first housing member and the second housing member.

[0087] (Technical thought 2) a seal member (60) surrounding the hollow portion is provided between the first housing member and the second housing member, The electronic device according to Technical Idea 1, wherein the sealing member is in contact with the first housing member and the second housing member.

[0088] (Technical Thought 3) The electronic device according to Technical Concept 2, wherein a shatterproof member (70) surrounding the seal member is provided in an opposing region between the first housing member and the second housing member.

[0089] (Technical Thought 4) The electronic device according to Technical Idea 2 or 3, wherein a gap (SP4) connecting to an external space is provided between the opposing surfaces on the outer periphery of the sealing member.

[0090] (Technical Thought 5) The electronic device according to any one of Technical Concepts 2 to 4, wherein the first housing member and the second housing member are fixed by a screw member (1) in an assembled state.

[0091] (Technical Thought 6) The electronic device described in Technical Idea 5, wherein the screw members are provided at multiple locations on the outer periphery of the sealing member.

[0092] (Technical Thought 7) The electronic device according to any one of Technical Ideas 1 to 6, wherein the accommodating housing member of the first housing member and the second housing member in which the accommodating portion is formed is made primarily of metal.

[0093] (Technical Thought 8) An electronic device described in any one of Technical Ideas 1 to 7, wherein the accommodating housing member of the first housing member and the second housing member in which the accommodating portion is formed has two side wall portions (32, 33, 42, 43) that sandwich the accommodating portion.

[0094] (Technical Thought 9) The opposing surface has a recess (31b, 41b) recessed from the surrounding area, The electronic device according to any one of Technical Concepts 1 to 8, wherein the hollow portion is formed by the recesses facing each other.

[0095] (Technical Thought 10) The circuit board includes a first circuit board and a second circuit board, the first housing member includes a first housing portion that houses the first circuit board as the housing portion, the second housing member includes a second accommodating portion that accommodates the second circuit board as the accommodating portion, The electronic device according to any one of Technical Concepts 1 to 9, wherein the hollow portion is provided between the first circuit board and the second circuit board.

[0096] (Technical Thought 11) At least one of the circuit boards has a heat generating component (12, 22) mounted thereon, The electronic device according to Technical Concept 10, wherein the heat generating components are disposed facing each other on the opposite surface (SF31, SF41) of the opposing surface.

[0097] (Technical Thought 12) The first circuit board includes a first connector (14); the second circuit board includes a second connector (24) electrically connected to the first connector, the first housing member is provided with a first opening (34) in which a part of the first connector and the second connector that are connected to each other are disposed; the second housing member is provided with a second opening (44) in which a part of the first connector and the second connector that are connected to each other are disposed; The electronic device described in Technical Idea 10 or 11, wherein a connector seal member (80) is provided between the first housing member and the second housing member, around the first opening and the second opening.

[0098] (Technical Thought 13) 13. The electronic device according to any one of Technical Concepts 1 to 12, wherein a pipe through which the liquid coolant flows is attached to the inlet / outlet port.

[0099] (Technical Thought 14) the first housing member and the second housing member each include a wall portion (41c) protruding into the hollow portion, The electronic device according to any one of Technical Concepts 1 to 13, wherein the wall portion is disposed between the inlet and the outlet of the outlet port. [Explanation of symbols]

[0100] 1...screw member, 1a...screw opening, 1b...screw hole, 10...first circuit board, 11...wiring board, 12...mounted component, 13...thermal conductive member, 14...first connector, SF11...mounting surface, SF12...rear surface, 20...second circuit board, 21...wiring board, 22...mounted component, 23...thermal conductive member, 24...second connector, SF21...mounting surface, SF22...rear surface, 30...first housing member, 31...base, 31a...cooling portion, 31b...first recess, 32, 33...side wall portion, 34...first opening, 35...sealing portion, SF31...mounting surface, SF32...opposing surface, 40...second Housing member, 41...base, 41a...cooling portion, 41b...second recess, 41c...wall portion, 42, 43...side wall portions, 42a...outflow portion, 42b...inflow portion, 42c...outflow outlet, 42d...inflow port, 44...second opening, 45...sealing portion, SF41...mounting surface, SF42...opposing surface, 51...first cover, 52...second cover, 53...third cover, 54...fourth cover, 60...sealing member, 70...gasket, 80...sealing member for connector, SP1...first housing portion, SP2...second housing portion, SP3...hollow portion, SP4...space, CW1...cooling water, 100...electronic device

Claims

1. At least one circuit board (10, 20); a housing including a first housing member (30) and a second housing member (40), in which a housing portion (SP1, SP2) for housing the circuit board is provided in at least one of the first housing member and the second housing member; When the first housing member and the second housing member are assembled together, a hollow portion (SP3) through which a liquid refrigerant flows is formed by their opposing surfaces (SF32, SF42), At least one of the first housing member and the second housing member is provided with an inlet / outlet port (42c, 42d) connected to the hollow portion, The electronic device, wherein the storage portion and the hollow portion are separated by the first housing member and the second housing member.

2. A seal member (60) surrounding the hollow portion is provided between the first housing member and the second housing member, The electronic device according to claim 1 , wherein the seal member is in contact with the first housing member and the second housing member.

3. 3. The electronic device according to claim 2, further comprising a shatterproof member (70) surrounding the seal member in an area where the first housing member and the second housing member face each other.

4. The electronic device according to claim 3 , wherein a gap (SP4) communicating with an external space is provided between the opposing surfaces on an outer periphery of the sealing member.

5. 4. The electronic device according to claim 2, wherein the first housing member and the second housing member are fixed to each other by a screw member (1) in an assembled state.

6. The electronic device according to claim 5 , wherein the screw members are provided at a plurality of positions on the outer periphery of the seal member.

7. The electronic device according to any one of claims 1 to 4, wherein the first housing member and the second housing member in which the housing portion is formed are made primarily of metal.

8. The electronic device according to any one of claims 1 to 4, wherein the accommodating housing member of the first housing member and the second housing member in which the accommodating portion is formed has two side wall portions (32, 33, 42, 43) that sandwich the accommodating portion.

9. The opposing surface has a recess (31b, 41b) recessed from the surrounding area, 5. The electronic device according to claim 1, wherein the hollow portion is formed by opposing the recesses.

10. The circuit board includes a first circuit board and a second circuit board, the first housing member includes a first housing portion that houses the first circuit board as the housing portion, the second housing member includes a second accommodating portion that accommodates the second circuit board as the accommodating portion, 5. The electronic device according to claim 1, wherein the hollow portion is provided between the first circuit board and the second circuit board.

11. At least one of the circuit boards has a heat generating component (12, 22) mounted thereon, The electronic device according to claim 10 , wherein the heat generating component is disposed opposite the opposing surface (SF31, SF41).

12. The first circuit board includes a first connector (14); the second circuit board includes a second connector (24) electrically connected to the first connector; the first housing member is provided with a first opening (34) in which a part of the first connector and the second connector connected to each other are disposed; the second housing member is provided with a second opening (44) in which a part of the first connector and the second connector connected to each other are disposed; The electronic device according to claim 10, wherein a connector seal member (80) is provided between the first housing member and the second housing member around the first opening and the second opening.

13. 5. The electronic device according to claim 1, wherein a pipe through which the liquid coolant flows is attached to the inlet / outlet.

14. The first housing member and the second housing member each include a wall portion (41c) protruding into the hollow portion, 5. The electronic device according to claim 1, wherein the wall portion is disposed between an inlet and an outlet of the outlet port.

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