Electronic component package

Abstract

To provide an electronic component package that can suppress wire-bonding failures.SOLUTION: An electronic component package (100A, 100B) includes a substrate (10), a first conductor pattern (20) and a second conductor pattern (21), an electronic component (30), an adhesive (40), and a bonding wire (50). The substrate has a main surface (10a). The main surface has a first area (10aa) and a second area (10ab). The first conductor pattern is arranged in the first area, and the second conductor pattern is arranged in the second area. The electronic component is mounted on the first conductor pattern with the adhesive in-between. The bonding wire connects the electric component to the second conductor pattern. A solvent contained in the adhesive is more likely to flow within the first area than to flow from the first area to the second area.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to electronic component packages. [Background technology]

[0002] For example, JP 2020-167366 A (Patent Document 1) describes a semiconductor light emitting device. The semiconductor light emitting device described in Patent Document 1 has a substrate, a semiconductor light emitting element, and a wire. The substrate has a base material and a conductive portion. The base material has a main surface. The main surface has a first region and a second region. The conductive portion has a first portion and a second portion. The first portion and the second portion are disposed on the first region and the second region, respectively. The semiconductor light emitting element is disposed on the first portion. The wire connects the semiconductor light emitting element and the second portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-167366 A [Summary] The semiconductor light-emitting element is mounted on the first part using, for example, an adhesive. Since the adhesive contains a solvent such as an epoxy resin, the solvent may seep out and adhere to the second part when the semiconductor light-emitting element is mounted on the first part using the adhesive. If the solvent adheres to the second part, it may cause a failure when connecting a wire to the second part.

[0004] The electronic component package of the present disclosure includes a substrate, a first conductor pattern and a second conductor pattern, an electronic component, an adhesive, and a bonding wire. The substrate has a main surface. The main surface has a first region and a second region. The first conductor pattern and the second conductor pattern are disposed on the first region and the second region, respectively. The electronic component is mounted on the first conductor pattern with the adhesive interposed therebetween. The bonding wire connects the electronic component and the second conductor pattern. A solvent contained in the adhesive flows more easily within the first region than from the first region to the second region. [Brief description of the drawings]

[0005] [Figure 1] FIG. 2 is a plan view of the electronic component package 100A. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] 3A to 3C are process diagrams showing a manufacturing method of the electronic component package 100A. [Figure 4] FIG. 11 is a cross-sectional view illustrating a die bonding step S2. [Diagram 5] FIG. 11 is a cross-sectional view illustrating a wire bonding step S3. [Figure 6] FIG. 11 is a cross-sectional view illustrating a reflector forming step S4. [Figure 7] FIG. 11 is a cross-sectional view illustrating a resin sealing step S5. [Figure 8] FIG. 2 is a plan view of an electronic component package 100B. [Figure 9] 9 is a cross-sectional view taken along line IX-IX in FIG. 8. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] [Detailed Description] The details of the embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and redundant description will not be repeated.

[0007] (First embodiment) A description will be given of an electronic component package according to a first embodiment. The electronic component package according to the first embodiment is designated as electronic component package 100A.

[0008] <Configuration of electronic component package 100A> The configuration of the electronic component package 100A will be described below.

[0009] Fig. 1 is a plan view of the electronic component package 100A. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. In Fig. 1, a reflector 60 and a sealing resin 70 are omitted. As shown in Figs. 1 and 2, the electronic component package 100A has a base material 10, a conductor pattern 20, a conductor pattern 21, an electronic component 30, an adhesive 40, a bonding wire 50, a reflector 60, and a sealing resin 70.

[0010] The substrate 10 has a main surface 10a and a main surface 10b. The main surface 10a and the main surface 10b are end surfaces in the thickness direction of the substrate 10. The main surface 10b is the surface opposite to the main surface 10a. The constituent material of the substrate 10 is an insulating material. The substrate 10 is composed of, for example, reinforcing fibers and a resin material impregnated into the reinforcing fibers. The resin material is, for example, BT (bismaleimide triazine) resin. However, the constituent material of the substrate 10 is not limited to this.

[0011] The main surface 10a has a first region 10aa and a second region 10ab. The first region 10aa and the second region 10ab are aligned along a first direction DR1 in a plan view (when viewed from the main surface 10a side along the normal direction of the main surface 10a). The boundary between the first region 10aa and the second region 10ab is along, for example, a second direction DR2 in a plan view. The second direction DR2 is a direction perpendicular to the first direction DR1. The base material 10 has a through hole 10c and a through hole 10d formed therein. The through hole 10c and the through hole 10d penetrate the base material 10 in the thickness direction. The through hole 10c and the through hole 10d are located at both ends of the base material 10 in the first direction DR1 in a plan view.

[0012] The conductor pattern 20 and the conductor pattern 21 are disposed on the first region 10aa and the second region 10ab, respectively. In a plan view, one end of the conductor pattern 20 in the first direction DR1 is spaced apart from the other end of the conductor pattern 21 in the first direction DR1. The conductor pattern 20 has a die pad 20a. In a plan view, the die pad 20a is at one end of the conductor pattern 20 in the first direction DR1. The other end of the conductor pattern 20 extends to reach the through hole 10c. One end of the conductor pattern 20 extends to reach the through hole 10d.

[0013] The electronic component package 100A further includes a conductor pattern 22, a conductor pattern 23, a conductor layer 24, and a conductor layer 25. The conductor pattern 22 and the conductor pattern 23 are disposed on the main surface 10b. The conductor pattern 22 and the conductor pattern 23 are located at both ends of the main surface 10b in the first direction DR1, respectively. The conductor layer 24 and the conductor layer 25 are located on the inner wall surface of the through hole 10c and the inner wall surface of the through hole 10d, respectively. The conductor pattern 20 and the conductor pattern 22 are connected by the conductor layer 24, and the conductor pattern 21 and the conductor pattern 23 are connected by the conductor layer 25.

[0014] The constituent material of the conductor pattern 20, the conductor pattern 21, the conductor pattern 22, the conductor pattern 23, the conductor layer 24, and the conductor layer 25 is, for example, copper or a copper alloy. However, the constituent material of the conductor pattern 20, the conductor pattern 21, the conductor pattern 22, the conductor pattern 23, the conductor layer 24, and the conductor layer 25 is not limited thereto.

[0015] The electronic component 30 is mounted on the conductive pattern 20 with an adhesive 40 interposed therebetween. More specifically, the electronic component 30 is mounted on the die pad 20a with the adhesive 40 interposed therebetween. The electronic component 30 has a first surface 30a and a second surface 30b. The first surface 30a and the second surface 30b are end surfaces in the thickness direction of the electronic component 30. The second surface 30b is the surface opposite to the first surface 30a. The electronic component 30 has an electrode 31 on the first surface 30a and an electrode 32 on the second surface 30b. The electrode 32 faces the die pad 20a. The adhesive 40 is interposed between the electrode 32 and the die pad 20a. The electronic component 30 is, for example, an LED (Light Emitting Diode). However, the electronic component 30 is not limited to an LED. The electronic component 30 may be a phototransistor or a diode.

[0016] The adhesive 40 is a conductive adhesive. More specifically, the adhesive is made of a solvent and conductive particles contained in the solvent. The solvent is, for example, an epoxy resin. The conductive particles are, for example, silver particles.

[0017] The solvent contained in the adhesive 40 flows more easily within the first region 10aa than from the first region 10aa to the second region 10ab. More specifically, the surface roughness in the second region 10ab is greater than the surface roughness in the first region 10aa. The surface roughness in the first region 10aa and the surface roughness in the second region 10ab are evaluated, for example, by the arithmetic mean roughness (Ra).

[0018] A method for making the solvent contained in the adhesive 40 flow more easily within the first region 10aa than from the first region 10aa to the second region 10ab is not limited to making the surface roughness of the first region 10aa different from that of the second region 10ab. For example, only the first region 10aa may be exposed to plasma to make the solvent contained in the adhesive 40 flow more easily within the first region 10aa than from the first region 10aa to the second region 10ab.

[0019] In this case, the ease of flow of the solvent contained in the adhesive 40 is evaluated by measuring the contact angle of the solvent contained in the adhesive 40 with the first region 10aa (second region 10ab) when the solvent is dropped onto the first region 10aa (second region 10ab). The contact angle is measured using a contact angle meter. The larger the contact angle, the higher the fluidity of the adhesive contained in the adhesive 40, so the contact angle of the solvent contained in the adhesive 40 in the first region 10aa is smaller than the contact angle of the solvent contained in the adhesive 40 in the second region 10ab.

[0020] One end of the bonding wire 50 is connected to the conductive pattern 21, and the other end is connected to the electrode 31. In this manner, the bonding wire 50 connects the electronic component 30 and the conductive pattern 21. The bonding wire 50 is made of, for example, gold.

[0021] The reflector 60 is disposed on the main surface 10a. The reflector 60 is disposed along the outer periphery of the main surface 10a in a plan view. The reflector 60 is made of a material that reflects the light generated by the electronic component 30 (LED). The reflector 60 is made of, for example, a resin material and a filler contained in the resin material. The filler is made of, for example, titanium oxide.

[0022] The sealing resin 70 fills the space defined by the base material 10 and the reflector 60. The sealing resin 70 seals the conductor pattern 20, the conductor pattern 21, the electronic component 30, the adhesive 40, and the bonding wire 50. The constituent material of the sealing resin 70 is, for example, a resin material that transmits light generated by the electronic component 30 (LED). The electronic component package 100A does not need to have the reflector 60. In this case, the sealing resin 70 is disposed on the main surface 10a so as to seal the conductor pattern 20, the conductor pattern 21, the electronic component 30, the adhesive 40, and the bonding wire 50.

[0023] <Method of Manufacturing Electronic Component Package 100A> A method for manufacturing the electronic component package 100A will be described below.

[0024] Fig. 3 is a process diagram showing a method for manufacturing the electronic component package 100A. As shown in Fig. 3, the method for manufacturing the electronic component package 100A includes a preparation step S1, a die bonding step S2, a wire bonding step S3, a reflector forming step S4, a resin sealing step S5, and a singulation step S6.

[0025] In the preparation step S1, a base material 10 is prepared. At this stage, the base material 10 has a conductor pattern 20, a conductor pattern 21, a conductor pattern 22, a conductor pattern 23, a conductor layer 24, and a conductor layer 25. After the preparation step S1, a die bonding step S2 is performed.

[0026] 4 is a cross-sectional view illustrating the die bonding step S2. As shown in FIG. 4, in the die bonding step S2, the electronic component 30 is mounted on the die pad 20a with the adhesive 40 interposed therebetween. In the die bonding step S2, first, the adhesive 40 is applied onto the die pad 20a. Second, the electronic component 30 is placed on the applied adhesive 40. Third, the applied adhesive 40 is heated and cured. As a result, the electronic component 30 is connected to the die pad 20a using the adhesive 40.

[0027] In the die bonding step S2, the solvent contained in the adhesive 40 may seep out from the area where the adhesive 40 is applied to the surrounding area. After the die bonding step S2, a wire bonding step S3 is performed.

[0028] Fig. 5 is a cross-sectional view for explaining the wire bonding step S3. As shown in Fig. 5, in the wire bonding step S3, the electronic component 30 (electrodes 31) and the conductor pattern 21 are connected by wire bonding. After the wire bonding step S3, the reflector forming step S4 is performed. Fig. 6 is a cross-sectional view for explaining the reflector forming step S4. As shown in Fig. 6, in the reflector forming step S4, for example, transfer molding is performed to form the reflector 60. After the reflector forming step S4, the resin sealing step S5 is performed.

[0029] 7 is a cross-sectional view for explaining the resin sealing step S5. As shown in FIG. 7, in the resin sealing step S5, for example, sealing resin 70 is potted from a dispenser into a space defined by the substrate 10 and the reflector 60, and the potted sealing resin 70 is heated and cured, thereby sealing the conductive pattern 20, the conductive pattern 21, the electronic component 30, the adhesive 40, and the bonding wire 50 with the sealing resin 70. After the resin sealing step S5, a singulation step S6 is performed. In the singulation step S6, the substrate 10 is cut to obtain a plurality of electronic component packages 100A. In this manner, the electronic component packages 100A shown in FIG. 1 and FIG. 2 are formed.

[0030] <Effects of 100A Electronic Component Package> The effects of the electronic component package 100A will be described below.

[0031] As described above, in the die bonding step S2, the solvent contained in the adhesive 40 may seep out around the area where the adhesive 40 is applied. If the seeped out solvent adheres to the conductive pattern 21, the bonding between the bonding wire 50 and the conductive pattern 21 becomes insufficient at the area where the solvent adheres, which causes wire bonding defects.

[0032] In the electronic component package 100A, for example, the surface roughness of the second region 10ab is larger than that in the second region 10ab, or the contact angle of the solvent contained in the adhesive 40 is smaller in the first region 10aa than in the second region 10ab, so that the solvent contained in the adhesive 40 flows more easily within the first region 10aa than from the first region 10aa to the second region 10ab. Therefore, in the electronic component package 100A, even if the solvent contained in the adhesive 40 seeps out to the surroundings, it is difficult for it to flow to the second region 10ab (it tends to remain in the first region 10aa), and wire bonding defects caused by the solvent contained in the adhesive 40 adhering to the conductor pattern 21 are suppressed.

[0033] In addition, in the electronic component package 100A, the adhesion between the sealing resin 70 and the main surface 10a is improved by roughening the second region 10ab or by exposing the first region 10aa to plasma. Therefore, the electronic component package 100A can also suppress peeling of the sealing resin 70.

[0034] Second embodiment An electronic component package according to the second embodiment will be described. The electronic component package according to the second embodiment is designated as electronic component package 100B. Here, differences from electronic component package 100A will be mainly described, and overlapping descriptions will not be repeated.

[0035] <Configuration of Electronic Component Package 100B> The configuration of the electronic component package 100B will be described below.

[0036] Fig. 8 is a plan view of the electronic component package 100B. Fig. 9 is a cross-sectional view taken along line IX-IX in Fig. 8. The reflector 60 and the sealing resin 70 are omitted in Fig. 8. As shown in Figs. 7 and 8, the electronic component package 100B includes a base material 10, a conductor pattern 20, a conductor pattern 21, a conductor pattern 22, a conductor pattern 23, a conductor layer 24, and a conductor layer 25, an electronic component 30, an adhesive 40, a bonding wire 50, a reflector 60, and a sealing resin 70.

[0037] In the electronic component package 100B, the solvent contained in the adhesive 40 is more likely to flow within the first region 10aa than from the first region 10aa to the second region 10ab. In these respects, the configuration of the electronic component package 100B is common to the configuration of the electronic component package 100A.

[0038] In the electronic component package 100B, the resin layer 11 is disposed in the second region 10ab. From another perspective, in the electronic component package 100B, the constituent material of the first region 10aa is different from the constituent material of the second region 10ab (constituent material of the resin layer 11). It is preferable that the constituent material of the second region 10ab is selected so that the contact angle of the solvent contained in the adhesive 40 in the second region 10ab is larger than the contact angle of the solvent in the first region 10aa.

[0039] In addition, in the electronic component package 100B, since the resin layer 11 is disposed in the second region 10ab, there is a step at the boundary between the first region 10aa and the second region 10ab in a plan view, where the second region 10ab side is higher. In these respects, the configuration of the electronic component package 100B is different from the configuration of the electronic component package 100B.

[0040] <Effects of Electronic Component Package 100B> The effects of the electronic component package 100B will be described below.

[0041] In the electronic component package 100B, there is a step at the boundary between the first region 10aa and the second region 10ab, where the second region 10ab side is higher. Therefore, in the electronic component package 100B, the solvent contained in the adhesive 40 flows more easily within the first region 10aa than from the first region 10aa to the second region 10ab. In this way, the electronic component package 100B also suppresses wire bonding defects caused by the solvent contained in the adhesive 40 adhering to the conductor pattern 21.

[0042] When the constituent materials forming the second region 10ab are selected such that the contact angle of the solvent contained in the adhesive 40 in the second region 10ab is larger than the contact angle of the solvent in the first region 10aa, the solvent contained in the adhesive 40 is less likely to flow further from the first region 10aa to the second region 10ab, thereby further suppressing wire bonding defects caused by the solvent contained in the adhesive 40 adhering to the conductor pattern 21.

[0043] (Additional Note) The above embodiment includes the following configurations.

[0044] <Appendix 1> A substrate; A first conductor pattern and a second conductor pattern, Electronic components, Adhesive and and a bonding wire. The substrate has a main surface, the main surface has a first region and a second region; the first conductor pattern and the second conductor pattern are disposed on the first region and the second region, respectively; the electronic component is mounted on the first conductor pattern via the adhesive, the bonding wire connects the electronic component and the second conductor pattern; An electronic component package, wherein a solvent contained in the adhesive flows more easily within the first region than from the first region to the second region.

[0045] <Appendix 2> 2. The electronic component package of claim 1, wherein the surface roughness in the second region is greater than the surface roughness in the first region.

[0046] <Appendix 3> 3. The electronic component package of claim 1, wherein a contact angle of the solvent in the first region is smaller than a contact angle of the solvent in the second region.

[0047] <Appendix 4> 4. The electronic component package of claim 1, wherein a constituent material of the first region is different from a constituent material of the second region.

[0048] <Appendix 5> The electronic component package according to any one of claims 1 to 4, wherein a step is provided at a boundary between the first region and the second region such that the second region side is higher.

[0049] <Appendix 6> Further comprising a sealing resin, The electronic component package of any one of claims 1 to 5, wherein the sealing resin is arranged on the main surface so as to cover the first conductor pattern, the second conductor pattern, the adhesive, the electronic component, and the bonding wires.

[0050] Although the embodiment of the present disclosure has been described above, the above-mentioned embodiment can be modified in various ways. The scope of the present invention is not limited to the above-mentioned embodiment. The scope of the present invention is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. [Explanation of symbols]

[0051] 100A, 100B electronic component package, 10 substrate, 10a main surface, 10aa first region, 10ab second region, 10b main surface, 10c, 10d through holes, 11 resin layer, 20 conductive pattern, 20a die pad, 21, 22, 23 conductive pattern, 24, 25 conductive layer, 30 electronic component, 30a first surface, 30b second surface, 31, 32 electrodes, 40 adhesive, 50 bonding wire, 60 reflector, 70 sealing resin, DR1 first direction, DR2 second direction, S1 preparation process, S2 die bonding process, S3 wire bonding process, S4 reflector formation process, S5 resin sealing process, S6 singulation process.

Claims

1. A substrate; A first conductor pattern and a second conductor pattern, Electronic components, Adhesive and and a bonding wire. The substrate has a main surface, the main surface has a first region and a second region; the first conductor pattern and the second conductor pattern are disposed on the first region and the second region, respectively; the electronic component is mounted on the first conductor pattern via the adhesive, the bonding wire connects the electronic component and the second conductor pattern; An electronic component package, wherein a solvent contained in the adhesive flows more easily within the first region than from the first region to the second region.

2. The electronic component package of claim 1 , wherein a surface roughness in the second region is greater than a surface roughness in the first region.

3. The electronic component package of claim 1 , wherein a contact angle of the solvent in the first region is smaller than a contact angle of the solvent in the second region.

4. 2. The electronic component package of claim 1, wherein the material forming the first region is different from the material forming the second region.

5. The electronic component package according to claim 1 , wherein a step is provided at a boundary between the first region and the second region, the step being higher on the second region side.

6. Further comprising a sealing resin, 4. The electronic component package according to claim 2, wherein the sealing resin is disposed on the main surface so as to cover the first conductor pattern, the second conductor pattern, the adhesive, the electronic component, and the bonding wires.

Images