Manufacturing method of substrate with protective member

Abstract

To provide a manufacturing method of a substrate with a protective member capable of determining the presence / absence of abnormality in the quality of the protective member which is formed on the substrate.SOLUTION: A manufacturing method of a substrate with a protective member in which a protective member in a size corresponding to the substrate is provided on one face of the substrate, includes: a protective member formation step of forming the protective member having a width larger than a width of the substrate on the one face of the substrate; a removal step of cutting the protective member along a peripheral edge of the substrate with a cutter after the protective member formation step, thereby separating the protective member into a marginal portion protruding from the peripheral edge of the substrate and a main body portion of the protective member inside of the peripheral edge of the substrate, and removing the marginal portion; and a determination step of observing a peripheral edge of the main body portion after the removal step and determining the presence / absence of occurrence of abnormality at the peripheral edge of the main body portion.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method for producing a substrate with a protective member. [Background technology]

[0002] A wafer having a plurality of devices, such as ICs (Integrated Circuits), formed on its front side is ground on its back side by a grinding device and processed to a predetermined thickness. The wafer processed to the predetermined thickness is cut by a dicing device or the like according to the size of each device, and divided into a plurality of device chips corresponding to each device. The device chips thus obtained are then incorporated into electronic devices or the like.

[0003] In order to reduce the impact applied to the surface of the wafer during the above-mentioned wafer grinding, a protective member is formed on the surface of the wafer. For example, Patent Document 1 describes a protective member forming method for forming a protective member on the surface of a substrate having unevenness such as device patterns and bumps on the surface.

[0004] In the protective member forming method of Patent Document 1, first, a resin film without an adhesive layer is adhered to the surface of a substrate, and liquid resin is supplied to the surface of the resin film. Then, a cover film is placed on the liquid resin, and the cover film is pressed downward. This causes the liquid resin to be spread over the surface of the resin film. The liquid resin is then cured to complete the protective member.

[0005] Furthermore, Patent Document 2 describes a method for removing an excess portion of a protective member that protrudes from the peripheral edge of a substrate when the protective member has a width larger than the width of the substrate. In the method of Patent Document 2, a cutter is cut into the protective member along the peripheral edge of the substrate, so that the protective member is separated into the excess portion that protrudes from the peripheral edge of the substrate and a main body portion that is located inside the peripheral edge of the substrate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent Publication No. 2021-27239 [Patent Document 2] JP 2022-162633 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, when the protective member is cut by the method described in the above-mentioned Patent Document 2, the protective member may be partially peeled off from the substrate, or burrs may be generated from the protective member. In particular, when the protective member is composed of multiple layers, the probability of the above-mentioned quality abnormalities occurring is higher than when the protective member is composed of a single layer. Furthermore, if a protective member with a quality abnormality is used as is, the quality of the final product will also be reduced.

[0008] SUMMARY OF THE PRESENT EMBODIMENTS An object of the present invention is to provide a method for manufacturing a substrate with a protective member, which is capable of determining whether or not there is an abnormality in the quality of the protective member formed on the substrate. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a method for manufacturing a substrate with a protective member, in which a protective member of a size corresponding to the substrate is provided on one side of the substrate, the method including: a protective member forming step of forming a protective member having a width greater than a width of the substrate on the one side of the substrate; a removal step of, after the protective member forming step, cutting into the protective member with a cutter along the periphery of the substrate, thereby separating the protective member into an excess portion extending beyond the periphery of the substrate and a main portion of the protective member that is inside the periphery of the substrate, and removing the excess portion; and a determination step of, after the removal step, observing the periphery of the main portion and determining whether or not an abnormality has occurred at the periphery of the main portion.

[0010] Preferably, the method further includes a reference image acquisition step of acquiring a reference image that serves as a basis for judgment in the judgment step by photographing the protective member at a portion corresponding to the peripheral edge of the substrate after the protective member forming step and before the removal step, and a judgment target image acquisition step of acquiring a judgment target image that is the subject of judgment in the judgment step by photographing the peripheral edge of the main body portion of the protective member after the removal step and before the judgment step, and in the judgment step, the reference image and the judgment target image are compared.

[0011] Preferably, in the judgment step, a difference image is formed including a first region composed of pixels with low brightness and a second region composed of pixels with higher brightness than the pixels constituting the first region by taking the difference between the brightness of each of the plurality of pixels constituting the image to be judged and the brightness of each of the plurality of pixels constituting the reference image, and if the size of the second region indicated by the difference image exceeds a threshold value, it is judged that an abnormality has occurred.

[0012] Preferably, the method further includes, after the removing step and before the determining step, a pressing step of pressing the periphery of the body portion with a roller.

[0013] Preferably, after the determining step, the method further includes a pressing step of pressing the periphery of the main body portion with a roller.

[0014] Preferably, the method further includes a peeling step of peeling the main body portion from the substrate when it is determined in the determination step that an abnormality has occurred, and after the peeling step, a protective member forming step using a new protective member, the removal step and the determination step are performed.

[0015] Preferably, the protective member forming step includes a resin film adhering step of adhering one side of a resin film having a width greater than the width of the substrate to the one side of the substrate, a liquid resin supplying step of supplying liquid resin to the side of the resin film opposite to the one side, and a cover film positioning step of placing a cover film having a width greater than the width of the substrate on top of the resin and hardening the resin. Effect of the Invention

[0016] In a method for manufacturing a substrate with a protective member according to one aspect of the present invention, a cutter is used to cut into the protective member along the periphery of the substrate, thereby separating the protective member into an excess portion that protrudes beyond the periphery of the substrate and a main portion of the protective member that is inside the periphery of the substrate, and then the periphery of the main portion is observed to determine whether there is an abnormality in quality at the periphery of the main portion. Thus, it is possible to determine whether there is an abnormality in quality of the protective member formed on the substrate. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view of a substrate. [Diagram 2] FIG. 2 is a cross-sectional view of the substrate. [Diagram 3] FIG. 3 is a cross-sectional view of the substrate with a protection member. [Figure 4] FIG. 4 is a flow diagram of a method for producing a substrate with a protective member. [Diagram 5] FIG. 5 is a flow chart further dividing the protective member forming step according to the first embodiment. [Figure 6] FIG. 6 is a cross-sectional view showing the substrate, the resin film, etc. when the resin film disposing step is performed. [Figure 7] FIG. 7 is a cross-sectional view showing the substrate, the resin film, the liquid resin, etc. when the resin supplying step is performed. [Figure 8] FIG. 8 is a cross-sectional view showing the substrate, the resin film, the liquid resin, the cover film, etc. when the cover film disposing step is performed. [Figure 9] FIG. 9 is a cross-sectional view showing the substrate, the protective member, etc. when the reference image acquisition step is performed. [Figure 10] FIG. 10 is a top view of the support member. [Figure 11] FIG. 11 is an example of an image acquired in the reference image acquisition step. [Figure 12] FIG. 12 is a cross-sectional view showing the substrate, the protective member, etc. when the removal step is performed. [Figure 13] FIG. 13 is an example of an image acquired in the determination target image acquiring step. [Figure 14] FIG. 14 is an image showing the difference between the image acquired in the reference image acquisition step S2 and the image acquired in the judgment target image acquisition step S5. [Figure 15] FIG. 15 is an enlarged view of part A in FIG. [Figure 16] FIG. 16 is an enlarged view of part B in FIG. [Figure 17] FIG. 17 is a flow diagram of a protective member forming step according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, a substrate used in a method for producing a substrate with a protective member according to a first embodiment will be described. FIG.

[0019] The substrate 11 of the first embodiment is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. That is, as shown in Fig. 1, the substrate 11 is configured in a substantially disk shape having a substantially circular front surface 11a and a substantially circular back surface 11b opposite the front surface 11a. A notch 11c is formed in a part of the periphery of the substrate 11 to indicate the crystal orientation of the substrate 11.

[0020] The diameter of the substrate 11 (the width of the front surface 11a or the back surface 11b) is, for example, 100 mm or more and 450 mm or less, typically 300 mm. The thickness of the substrate 11 is, for example, 0.1 mm or more and 1.0 mm or less, typically 0.775 mm. The material, shape, diameter (the width of the front surface 11a or the back surface 11b) and thickness of the substrate 11 are not limited to these. An orientation flat may be formed on the substrate 11 instead of the notch 11c. Furthermore, the substrate 11 does not need to have the notch 11c or the orientation flat formed thereon.

[0021] A plurality of linear streets 13 having a predetermined width are set in a lattice pattern on the surface 11a of the substrate 11. The surfaces 11a of the substrate 11 are divided into a plurality of regions by the streets 13, and a device 15 such as an IC (Integrated Circuit) is provided in each of the plurality of regions.

[0022] On the surface of the device 15, a roughly spherical bump (protrusion) 17 made of a metal material such as gold, silver, copper, or aluminum is formed. The bump 17 is formed by joining a solder ball to the surface of the device 15 or by electroplating. The diameter of the bump 17 is, for example, 5 μm or more and 100 μm or less, typically 20 μm. The bump 17 is electrically connected to the device 15 and functions as an electrode (terminal) when inputting and outputting an electrical signal to the device 15. However, the shape, size, and material of the bump 17 are not limited to these.

[0023] Fig. 2 is a cross-sectional view of a substrate. As shown in Fig. 2, bumps 17 are formed on the surface of device 15, which creates an uneven structure on the surface 11a side of substrate 11. In other words, the size of the step between the recesses and protrusions that make up this uneven structure corresponds to the diameter of bump 17. However, bumps 17 do not necessarily have to be formed on surface 11a of substrate 11.

[0024] Fig. 3 is a cross-sectional view of a substrate 19 with a protective member manufactured by the manufacturing method of a substrate with a protective member according to the first embodiment. As shown in Fig. 3, a protective member 21 is provided on a surface 11a of the substrate 11 so as to cover the surface 11a of the substrate 11. The protective member 21 is disposed on the surface 11a of the substrate 11, and is configured in a disk shape having approximately the same diameter as the substrate 11.

[0025] This protective member 21 has a disk-shaped resin film 23 having approximately the same diameter as the substrate 11. Specifically, the resin film 23 has one surface (second surface) 23b having an approximately circular shape that contacts the surface 11a of the substrate 11, and the other surface (first surface) 23a opposite to the one surface 23b.

[0026] The material of the resin film 23 is, for example, a polymer material such as polyolefin or polyethylene. The resin film 23 may be a laminate of two or more layers made of any resin selected from these materials. The thickness of the resin film 23 is, for example, 80 μm or more and 250 μm or less, and is typically 150 μm. However, the thickness and material of the resin film 23 are not limited to these.

[0027] The thickness of the resin film 23 is sufficiently smaller than the diameter of the bumps 17. One surface 23b of the resin film 23 is in close contact with the surface 11a of the substrate 11. Therefore, on the other surface 23a of the resin film 23, an uneven structure 29 is formed that reflects the uneven structure of the bumps 17 formed on the surface 11a of the substrate 11.

[0028] A resin layer 25 is provided on the other surface 23a of the resin film 23. The resin layer 25 is formed so as to cover the other surface 23a of the resin film 23, and is configured in a disk shape having approximately the same diameter as the resin film 23. Specifically, the resin layer 25 has one surface (second surface) 25b having a substantially circular shape in contact with the other surface 23a of the resin film 23, and the other surface (first surface) 25a opposite to the one surface 25b.

[0029] The resin layer 25 is a cured product of an ultraviolet curable resin. Examples of the ultraviolet curable resin include epoxy resin and acrylic resin. The thickness of the resin layer 25 is, for example, 80 μm or more and 400 μm or less, typically 200 μm. However, the thickness and material of the resin layer 25 are not limited to these.

[0030] The thickness of the resin layer 25 is sufficiently larger than the size of the step between the recesses and protrusions on the other surface 23a of the resin film 23 (i.e., the size of the uneven structure 29). The uneven structure 29 of the resin film 23 is completely embedded and absorbed on the one surface 25b side of the resin layer 25. Therefore, the other surface (first surface) 25a of the resin layer 25 is approximately flat.

[0031] A cover film 27 configured in a disk shape having approximately the same diameter as the resin layer 25 is provided on the other surface 25a of the resin layer 25 so as to cover the other surface 25a of the resin layer 25. The cover film 27 has one surface (second surface) 27b having an approximately circular shape that contacts the other surface 25a of the resin layer 25, and another surface (first surface) 27a opposite to the one surface 27b. The other surface 27a of the cover film 27 is exposed to the outside as the surface of the protective member 21.

[0032] The cover film 27 is formed of a material and with a thickness that transmits ultraviolet light for curing the ultraviolet curable resin that constitutes the resin layer 25. For example, the thickness of the cover film 27 is 80 μm or more and 150 μm or less, typically 80 μm. With such a thickness, ultraviolet light can properly transmit through the cover film 27 and cure the resin layer 25. However, the thickness of the cover film 27 is not limited to this.

[0033] Next, a method for manufacturing a substrate with a protective member used in manufacturing the above-mentioned substrate 19 with a protective member will be described. Fig. 4 is a flow diagram of the method for manufacturing a substrate with a protective member according to the first embodiment. As shown in Fig. 4, the method for manufacturing a substrate with a protective member according to the first embodiment includes a protective member forming step S1, a reference image obtaining step S2, a removing step S3, a pressing step S4, a judgment target image obtaining step S5, a judgment step S6, and a peeling step S7.

[0034] In the protective member forming step S1, a protective member 21 is formed on the substrate 11. Fig. 5 is a flow diagram further dividing the protective member forming step S1. As shown in Fig. 5, the protective member forming step S1 includes a resin film adhering step S11, a resin supplying step S12, and a cover film arranging step S13.

[0035] Fig. 6 is a cross-sectional view showing the substrate 11, the resin film 45, etc. when the resin film adhering step S11 is performed. In the resin film adhering step S11, a resin film adhering device 42 shown in Fig. 6 is used. The resin film adhering device 42 includes a vacuum chamber 2. The vacuum chamber 2 includes a lower chamber 2a having a recessed portion opening upward, and an upper chamber 2b arranged above the lower chamber 2a and having a recessed portion opening downward. A negative pressure source 6 is connected to the lower chamber 2a. A negative pressure source 40 is connected to the upper chamber 2b.

[0036] The opening at the top end of the lower chamber 2a and the opening at the bottom end of the upper chamber 2b are roughly the same shape. Therefore, when the upper chamber 2b is placed on the lower chamber 2a so that their openings overlap, a sealed space that is isolated from the outside is formed inside the upper chamber 2b and the lower chamber 2a. Note that each opening is larger than the substrate 11 so that the substrate 11 can be accommodated inside the sealed space.

[0037] A support table 4 for supporting the substrate 11 is provided in the recess of the lower chamber 2a. The support table 4 is configured in a substantially disk shape having a substantially circular front surface 4a and a substantially circular back surface 4b. The front surface 4a of the support table 4 has a diameter (width) slightly larger than that of the substrate 11 so that the front surface 4a can contact the entire back surface 11b of the substrate 11 and hold the substrate 11. For example, the diameter (width) of the front surface 4a is larger than the diameter (width) of the substrate 11 by a range of 0.2 mm to 20 mm, and is typically 1 mm larger.

[0038] For example, the height of the support table 4 is adjusted so that when the substrate 11 is placed on the surface 4a, the surface 11a of the substrate 11 and the opening of the lower chamber 2a are at approximately the same height. Alternatively, the height of the support table 4 is adjusted so that the opening of the lower chamber 2a is higher than the surface 11a of the substrate 11. In these cases, when the resin film 45 is placed on the support table 4 and brought into close contact with the substrate 11 as described below, the resin film 45 does not come into close contact with an unnecessarily wide area of ​​the side surface of the substrate 11.

[0039] The support table 4 may have a configuration capable of sucking and holding the substrate 11. Specifically, the support table 4 may have a through hole having one end that opens to the surface 4a of the support table 4 and the other end that is connected to a negative pressure source (not shown). With the substrate 11 in contact with the surface 4a of the support table 4, negative pressure from the negative pressure source is applied to the surface 4a of the support table 4 via the through hole, whereby the substrate 11 is sucked to the surface 4a of the support table 4 and held thereon.

[0040] One end of an exhaust path 6a is connected to the bottom wall of the lower chamber 2a. The other end of the exhaust path 6a is connected to the negative pressure source 6. That is, the lower chamber 2a is connected to the negative pressure source 6 via the exhaust path 6a. Moreover, one end of an exhaust path 40a is connected to the ceiling of the upper chamber 2b. The other end of the exhaust path 40a is connected to the negative pressure source 40. That is, the upper chamber 2b is connected to the negative pressure source 40 via the exhaust path 40a.

[0041] In the resin film adhesion step S11, first, with the upper chamber 2b not overlapping the lower chamber 2a, the substrate 11 is placed on the support table 4 so that the back surface 11b of the substrate 11 faces the front surface 4a of the support table 4. Next, a resin film 45, which will later become the resin film 23, is placed on the front surface 11a of the substrate 11.

[0042] The resin film 45 used has a width (or diameter) larger than the opening of the lower chamber 2a so that a space 38a closed by the lower chamber 2a and the resin film 45 can be formed when the resin film 45 is placed on the surface 11a of the substrate 11. That is, the resin film 45 has a size that protrudes from the periphery of the opening of the lower chamber 2a. Specifically, the width (or diameter) of the resin film 45 is larger than the width of the lower chamber 2a (width of the opening) by a range of 10 mm to 150 mm, typically 60 mm.

[0043] Thereafter, the upper chamber 2b is placed on the top of the lower chamber 2a with the resin film 45 sandwiched therebetween. As a result, the top of the lower chamber 2a and the second surface (lower surface) 45b of the resin film 45 come into close contact with each other, forming a space 38a closed by the lower chamber 2a and the resin film 45. In addition, the bottom of the upper chamber 2b and the first surface (upper surface) 45a of the resin film 45 come into close contact with each other, forming a space 38b closed by the upper chamber 2b and the resin film 45.

[0044] When the resin film 45 is disposed on the surface 11a of the substrate 11 in this manner, the interior of the vacuum chamber 2 is divided into an upper space 38b and a lower space 38a by the resin film 45. Then, when the negative pressure source 6 and the negative pressure source 40 are operated, the spaces 38a and 38b are evacuated and reduced in pressure. The degree of vacuum (atmospheric pressure) inside the vacuum chamber 2 is, for example, 1000 Pa or less, typically 100 Pa, for both the spaces 38a and 38b. Thereafter, only the negative pressure source 40 that reduces the pressure of the space 38b is stopped, and the space 38b is opened to the atmosphere.

[0045] As a result, a large pressure difference is instantaneously generated between the spaces 38a and 38b with the resin film 45 sandwiched therebetween. This pressure difference applies a force to the resin film 45 toward the substrate 11, and the resin film 45 adheres to the surface 11a of the substrate 11 so as to conform to the unevenness of the surface 11a of the substrate 11. As described above, by using the vacuum chamber 2, the resin film 45 can be adhered to the surface 11a of the substrate 11. After the resin film 45 is adhered to the substrate 11, the negative pressure source 6 is stopped, and the space 38a is opened to the atmosphere.

[0046] Then, for example, the upper chamber 2b rises, the lower chamber 2a and the upper chamber 2b are separated, and the substrate 11 and the resin film 45 in close contact with the substrate 11 are transported from the support table 4. After this, the portion of the resin film 45 protruding from the periphery of the substrate 11 is cut off. However, the resin film 45 is cut to a size sufficiently larger than the substrate 11 so that the liquid resin supplied in the next resin supplying step S12 does not adhere to the substrate 11.

[0047] Fig. 7 is a cross-sectional view showing the substrate 11, the resin film 45, the liquid resin 31, etc. when the resin supplying step S12 is performed. In the resin supplying step S12, a resin layer forming apparatus 44 shown in Fig. 7 is used. The resin layer forming apparatus 44 includes a support table 34. A resin supplying unit 8 for supplying the liquid resin 31 to a first surface 45a of the resin film 45 is arranged next to the support table 34.

[0048] The resin supply unit 8 has a shaft (not shown) extending vertically, an arm (not shown) provided at the upper end of the shaft and extending horizontally, and a nozzle 10 provided at the tip of the arm and facing downward. The shaft is configured to be rotatable around a rotation axis (not shown) extending vertically.

[0049] The resin supply unit 8 is connected to one end of a resin supply pipe (not shown). The other end of the resin supply pipe is connected to a tank (not shown) that stores resin. By opening a valve or the like provided on the resin supply pipe, liquid resin 31 flows from the tank through the resin supply pipe to the nozzle 10 and is dripped downward from the nozzle 10.

[0050] In the resin supplying step S12, first, the substrate 11 to which the resin film 45 is adhered is carried into the support table 34. Next, the position of the nozzle 10 is adjusted by rotating the shaft portion of the resin supplying unit 8. Specifically, the nozzle 10 is positioned above the substrate 11 placed on the support table 34. Thereafter, the liquid resin 31 is supplied from the nozzle 10 of the resin supplying unit 8 to the first surface 45a of the resin film 45.

[0051] The liquid resin 31 is the ultraviolet curable resin constituting the above-mentioned resin layer 25 before curing, and has a predetermined fluidity. The amount of the liquid resin 31 supplied to the first surface 45a of the resin film 45 is adjusted according to the thickness of the resin layer 25 formed after the liquid resin 31 is cured. In other words, the liquid resin 31 is supplied to the first surface 45a in an amount such that the thickness of the cured resin layer 25 is 80 μm or more and 400 μm or less.

[0052] After the supply of resin from the resin supplying unit 8 to the substrate 11 is completed, the shaft portion of the resin supplying unit 8 is rotated again, whereby the nozzle 10 moves (retracts) from above the support table .

[0053] 8 is a cross-sectional view showing the substrate 11, the resin film 45, the liquid resin 31, the cover film 49, etc., when the cover film disposing step S13 is performed. In the cover film disposing step S13, the resin layer forming apparatus 44 is subsequently used. As shown in FIG. 8, the resin layer forming apparatus 44 has a pressing unit 12 arranged above the support table 34. The pressing unit 12 includes a pressing member 14.

[0054] The pressing member 14 is a substantially disk-shaped member having a substantially circular first surface 14a and a substantially circular flat second surface (pressing surface) 14b, and is made of a material and has a thickness that transmits ultraviolet light. For example, one end of a suction hole (not shown) provided in the pressing member 14 opens on the second surface 14b. The other end of this suction hole is connected to a negative pressure source. In other words, negative pressure from the negative pressure source acts on the second surface 14b through the suction hole.

[0055] The light source 16 is provided on the first surface 14a of the pressing member 14. The light source 16 emits light (ultraviolet light) having a wavelength capable of curing the ultraviolet-curable liquid resin 31. The wavelength of the light emitted by the light source 16 is, for example, not less than 200 nm and not more than 400 nm, typically 365 nm. As described above, the pressing member 14 transmits the light emitted by the light source 16.

[0056] In the cover film arrangement step S13, first, a negative pressure source applies a negative pressure to the second surface 14b in a state in which the cover film 49 is in contact with the second surface 14b. As a result, the cover film 49 is held by the pressing member 14.

[0057] The cover film 49 is configured in a disk shape having a substantially circular first surface 49a and a substantially circular second surface 49b, and has a diameter (width) slightly larger than that of the substrate 11. Specifically, the cover film 49 is larger than the diameter (width) of the substrate 11 by 30 mm or more and 200 mm or less, and is typically larger by 100 mm.

[0058] Next, the pressing unit 12 lowers the pressing member 14 while holding the cover film 49 on the second surface 14b. As a result, the liquid resin 31 is pressed from above by the second surface 14b through the cover film 49, and the liquid resin 31 is spread out. Then, the pressing unit 12 causes the light source 16 to emit ultraviolet rays, and the liquid resin 31 is cured by the ultraviolet rays emitted from the light source 16. When the liquid resin 31 is completely cured and the resin layer 47 is formed, the pressing unit 12 stops the emission of ultraviolet rays from the light source 16.

[0059] Thereafter, the pressing unit 12 stops the negative pressure source connected to the suction hole provided in the pressing member 14. This releases the cover film 49 from the second surface 14b of the pressing member 14. When the pressing unit 12 is raised in this state, the cover film 49 remains on the resin layer 47 formed by the hardening of the liquid resin 31. That is, a protective member 51 in which the resin film 45, the resin layer 47, and the cover film 49 are integrated is formed on the front surface 11a of the substrate 11. This completes the series of steps in the protective member formation step S1.

[0060] After the protective member forming step S1, a reference image obtaining step S2 and a removal step S3 are performed. In the reference image obtaining step S2, the substrate 11 and the protective member 51 are photographed from above by a camera. In addition, in the removal step S3, the portion of the protective member 51 that protrudes from the periphery of the substrate 11 is cut off by a cutter. As a result, a substrate with protective member 19 in which the substrate 11 and the protective member 21 are integrated as shown in FIG. 3 is formed.

[0061] 9 is a cross-sectional view showing the substrate 11, the protective member 51, etc. when the reference image acquisition step S2 is performed. In the reference image acquisition step S2, the cutting device 46 shown in FIG. 9 is used. The cutting device 46 includes a cutting unit 18.

[0062] The cutting unit 18 includes a spindle 22. One end (base end) of the spindle 22 is connected to a rotation drive source (not shown) such as a motor. Power from this rotation drive source rotates the spindle 22 around a rotation axis 30 passing through its central axis. The spindle 22 is also supported by a Z-axis movement mechanism (not shown) together with the rotation drive source. Therefore, when the Z-axis movement mechanism is operated, the spindle 22 moves up and down along the Z axis.

[0063] A support member 20 is fixed to the other end (tip) of the spindle 22. The support member 20 is configured in a substantially disk shape having a substantially circular first surface 20a and a substantially circular second surface 20b. The tip of the spindle 22 is fixed to the first surface 20a of the support member 20.

[0064] On the other hand, on the second surface 20b side, a cutter 24 used to cut the protective member 51, a pressing roller 26, and a camera 28 for photographing the area below are fixed in a manner that allows fine adjustment of their respective positions. As shown in Fig. 10, the cutter 24 having cutting teeth, the roller 26, and the camera 28 are arranged on the second surface 20b of the support member 20 along the circumference of a single circle that is centered at the center of the second surface 20b and has a smaller diameter than the second surface 20b. Note that this circle has a diameter equal to that of the substrate 11, for example.

[0065] Furthermore, the cutter 24, the roller 26, and the camera 28 are configured to pass through the same space in succession in this order when the support member 20 is rotated in a predetermined rotation direction. Specifically, the cutter 24, the roller 26, and the camera 28 are disposed on the second surface 20b so that, for example, when the support member 20 is rotated in the direction of the arrow shown in Fig. 10, the cutter 24, the roller 26, and the camera 28 pass through one space below the support member 20 in this order.

[0066] An output device 32 is connected to the camera 28 arranged on the support member 20. The output device 32 is, for example, a display or the like, and outputs the image captured by the camera 28 in a form that can be visually recognized by an operator. The camera 28 may be a visible camera having sensitivity to light in the visible range, or an infrared camera having sensitivity to light in the infrared range, so long as it can capture an image of the vicinity of the boundary between the substrate 11 and the protective member 51. The camera 28 may be connected to the output device 32 by wire or wirelessly. That is, the image captured by the camera 28 may be output to the output device 32 wirelessly.

[0067] A support table 36 is disposed below the cutting unit 18. The support table 36 is configured in a substantially disk shape having a substantially circular front surface 36a and a substantially circular back surface 36b. The front surface 36a of the support table 36 has a diameter (width) slightly larger than that of the substrate 11 so that the front surface 36a can contact the entire back surface 11b of the substrate 11 and hold the substrate 11. For example, the diameter (width) of the front surface 4a is 50 mm larger than the diameter (width) of the substrate 11.

[0068] The support table 36 has an upper end that opens to a surface 36a of the support table 36, and has a groove 36c that is configured in an annular shape along the circumferential direction of the support table 36. This groove 36c serves as an escape groove for allowing the blades that constitute the cutter 24 to escape and preventing interference between the support table 4 and the cutter 24 in a removal step S3 that will be described later.

[0069] 9, in the reference image acquisition step S2, first, the substrate 11 on which the protective member 51 is formed is placed on the surface 36a of the support table 36. Next, the rotation drive source rotates the spindle 22 once around the rotation axis 30. As a result, the camera 28 moves along the circumference of a circle having the same diameter as the substrate 11.

[0070] While moving along the circumference due to the rotation of spindle 22, camera 28 captures images of protective member 51 and substrate 11 supported on support table 36 below. Specifically, camera 28 captures images of the portion where protective member 51 and substrate 11 contact each other along the circumferential direction of protective member 51. As described above, camera 28 moves along the circumference of a circle having the same diameter as substrate 11. Therefore, by capturing the image, an image of an area including a portion corresponding to the periphery of substrate 11 is captured.

[0071] FIG. 11 is an example of an image acquired in the reference image acquisition step S2. The image 37 shown in FIG. 11 is obtained, for example, by focusing the camera 28 on the vicinity of the boundary between the substrate 11 and the protective member 51 and capturing an image along the circumferential direction of the cover film 49. The image 37 in FIG. 10 captures an area including a first end 39 corresponding to the periphery of the substrate 11 and a second end 41 located a predetermined distance toward the center from the first end 39. This image 37 will later be a reference image for determining whether or not there is an abnormality in the quality of the protective member 21. Note that the notch 13c of the substrate 11 appears in this image 37.

[0072] After the reference image acquisition step S2, a removal step S3 is performed. Fig. 12 is a cross-sectional view showing the substrate 11, the protective member 51, etc., when the removal step S3 is performed. In the removal step S3, the Z-axis movement mechanism lowers the cutting unit 18 along the Z-axis. This causes the cutter 24 to cut into a portion of the protective member 51 that corresponds to the periphery of the substrate 11. Thereafter, the spindle 22 is rotated once around the rotation axis 30, so that the cutter 24 makes one revolution along the periphery of the substrate 11 while cutting into the protective member 51.

[0073] As a result, protective member 51 is separated into a main body portion 33 located inside the periphery of substrate 11 and an excess portion 35 protruding from the periphery of substrate 11. Then, excess portion 35 is removed from substrate 11. This main body portion 33 corresponds to protective member 21 shown in FIG.

[0074] After the removal step S3 is started, a pressing step S4 and a determination target image acquisition step S5 are executed successively. In the pressing step S4, the peripheral edge of the main body portion 33 of the protection member 51 is pressed by the roller 26 provided on the support member 20. Then, in the determination target image acquisition step S5, the peripheral edge of the main body portion 33 of the protection member 51 is photographed by the camera 28.

[0075] As described above, in this embodiment, the cutter 24, the roller 26, and the camera 28 are disposed so as to pass through the same space in this order when the support member 20 is rotated in a predetermined rotation direction. Furthermore, before the removal step S3 is started, the heights of the cutter 24, the roller 26, and the camera 28 are adjusted so that when the protective member 51 is cut by the cutter 24, the roller 26 comes into contact with the protective member 51 and the focus of the camera 28 is set near the boundary between the substrate 11 and the protective member 51.

[0076] Therefore, after the cutter 24 cuts into the protective member 51, the peripheral edge of the main body portion 33 is continuously pressed by the roller 26, and the vicinity of the boundary between the substrate 11 and the protective member 51 is photographed by the camera 28. That is, in this embodiment, during the execution of the removing step S3, the pressing step S4, the determination target image obtaining step S5, and the removing step S3 are executed in parallel.

[0077] However, the pressing step S4 and the determination target image acquisition step S5 may be executed after the removal step S3 is completed. In the present embodiment, the pressing step S4 is started before the determination target image acquisition step S5, but the determination target image acquisition step S5 may be started before the pressing step S4.

[0078] Fig. 13 is an example of an image acquired in judgment target image acquisition step S5. The area captured in image 43 acquired in judgment target image acquisition step S5 in Fig. 13 is the same area as the area captured when image 37 serving as the reference image shown in Fig. 11 was acquired. Image 43 acquired in judgment target image acquisition step S5 becomes a judgment target image for determining the presence or absence of an abnormality in the quality of protective member 21.

[0079] Next, in judgment step S6, the image 37 obtained in the reference image acquisition step S2 is compared with the image 43 obtained in the judgment target image acquisition step S5, and it is determined whether or not there is an abnormality in the main body portion 33 of the protective member 21.

[0080] Specifically, for example, by taking the difference between the luminance of each of the plurality of pixels constituting image 37 obtained in reference image acquisition step S2 and the luminance of each of the plurality of pixels constituting image 43 obtained in judgment target image acquisition step S5, an image (first difference image) indicating the presence or absence of an abnormality in the quality of protective member 21 is formed. That is, by taking the difference in luminance of corresponding pixels (pixels at the same position) between image 37 and image 43, new pixels constituting this image (first difference image) are formed.

[0081] Then, a binarization process is applied to the image (first difference image) to form a difference image (second difference image) including a first region made up of pixels with low brightness and a second region made up of pixels with higher brightness than the pixels making up the first region. Note that in this embodiment, the first difference image is subjected to binarization process to obtain the second difference image, but a binarized difference image may be formed by first performing binarization process on each of the images 37 and 43 and then taking the difference in brightness between those pixels.

[0082] 14 is a difference image (second difference image) 53 obtained from the image 37 acquired in the reference image acquisition step S2 and the image 43 acquired in the judgment target image acquisition step S5. FIG. 15 is an enlarged view of a portion indicated by A in the difference image 53 shown in FIG. 14, and FIG. 16 is an enlarged view of a portion indicated by B in the difference image 53 shown in FIG. 14. In the difference images 53 shown in FIG. 14, FIG. 15, and FIG. 16, the black portion is the first region, and the white portion is the second region. The second region is a portion where the luminance of the image 43 has changed with respect to the image 37, and is a portion where an abnormality is suspected on the periphery of the protective member 21. Here, the abnormality is, for example, peeling of the protective member 21 from the substrate 11.

[0083] In the determination step S6, the size of the second region is calculated. Specifically, the area of ​​the second region, the length of the second region (the distance in the direction from the first end 39 to the second end 41, e.g., the distance a in FIG. 15 and the distance c in FIG. 16), or the width of the second region (the distance in the direction perpendicular to the direction from the first end 39 to the second end 41, e.g., the distance b in FIG. 15 and the distance d in FIG. 16) is calculated.

[0084] If the size of the second region exceeds a predetermined first threshold, the operator determines that there is an abnormality in the main body portion 33 of the protective member 21. For example, if the area of ​​portion A is 7 mm 2 and the area threshold is 3 mm 2 When the first threshold value is set to 1, the area of ​​portion A exceeds the threshold value, and the operator determines that "anomaly exists." The determination of the presence or absence of an abnormality and the setting of the threshold value may be performed by a computer, not by an operator. For example, the cutting device 46 may include a controller having a processing device and a storage device, and the processing device may determine the presence or absence of an abnormality by referring to the first threshold value stored in the storage device.

[0085] If the operator determines that "abnormality exists" in the determination step S6, then a peeling step S7 is performed in which the protective member 21 is peeled off from the substrate 11. For example, the resin film 23 is heated and softened by a heat sealer, so that the protective member 21 can be peeled off from the substrate 11. Then, after a new protective member 21 is formed on the substrate 11 again in the protective member forming step S1, the reference image obtaining step S2, the removing step S3, the pressing step S4, the determination target image obtaining step S5, and the determination step S6 are performed in sequence. However, the method of peeling off the protective member 21 from the substrate 11 in the peeling step S7 is not limited to the above-mentioned method.

[0086] On the other hand, if the operator determines that there is "no abnormality" in the determination step S6, the method for manufacturing a substrate with a protection member, which is composed of the series of steps described above, ends.

[0087] As described above, in the method for manufacturing a substrate with a protective member according to the first embodiment, the periphery of main body portion 33 of protective member 21 is observed to determine whether or not there is an abnormality in the quality of the periphery of main body portion 33. Therefore, it is possible to determine whether or not there is an abnormality in the quality of protective member 21 formed on the substrate.

[0088] Fig. 16 is a flow diagram of a method for manufacturing a substrate with a protective member according to the second embodiment. As shown in Fig. 16, the method for manufacturing a substrate with a protective member according to the second embodiment includes a protective member forming step S21, a reference image obtaining step S22, a removing step S23, a pressing step S24, a judgment object image obtaining step S25, a first judgment step S26, a second judgment step S27, and a peeling step S28.

[0089] The protective member forming step S21, the reference image acquiring step S22, the removal step S23, the pressing step S24, the judgment object image acquiring step S25, and the first judgment step S26 are respectively the same as the protective member forming step S1, the reference image acquiring step S2, the removal step S3, the pressing step S4, the judgment object image acquiring step S5, and the judgment step S6 in the manufacturing method for a substrate with a protective member according to the first embodiment.

[0090] That is, the method for manufacturing a substrate with a protective member according to the second embodiment differs from the method for manufacturing a substrate with a protective member according to the first embodiment in that it includes a second determination step S27 and a peeling step S28 that is executed based on the result of the second determination step. In the second determination step S27, it is determined whether or not the magnitude of the abnormality detected in the first determination step S26 exceeds a predetermined second threshold value.

[0091] If the magnitude of the abnormality does not exceed the second threshold, a pressing step S24 is executed. For example, if the area of ​​the peeled portion does not exceed the second threshold, the peripheral edge of the main body portion 33 of the protective member 21 is pressed again by the roller 26, so that the protective member 21 adheres closely to the substrate 11, and the peeled portion is repaired.

[0092] On the other hand, in the second judgment step S27, if the magnitude of the abnormality detected in the first judgment step S26 exceeds a predetermined second threshold, a peeling step S28 is executed to peel off the protective member 21 from the substrate 11. Then, after a new protective member 21 is formed on the substrate 11 again in the protective member formation step S21, the reference image acquisition step S22, the removal step S23, the pressing step S24, the judgment target image acquisition step S25, and the first judgment step S26 are executed in sequence.

[0093] As described above, in the method for manufacturing a substrate with a protective member according to the second embodiment, the periphery of main body portion 33 of protective member 21 is observed to determine whether or not there is an abnormality in the quality of the periphery of main body portion 33. Therefore, it is possible to determine whether or not there is an abnormality in the quality of protective member 21 formed on the substrate.

[0094] Various modifications can be made to the methods and devices described in the above-described embodiments. For example, in the reference image acquisition step S2, the removal step S3, and the judgment target image acquisition step S5 according to the first embodiment, the cutting unit 18 is rotated to cut and photograph the protective member 21, but the support table 38 that holds the substrate 11 may also rotate. That is, the support table 38 may be connected to a rotary drive source, and the support table 4 may be rotated around the rotation axis by the power obtained from the rotary drive source.

[0095] The resin layer 25 may be made of a cured thermosetting resin. In this case, in the cover film disposing step S13, the liquid resin 31 is cured by being heated by a heating device such as a heater instead of being irradiated with ultraviolet rays.

[0096] Also, the reference image acquiring step S2 and the reference image acquiring step S22 may be omitted. That is, in the determination step S6 and the first determination step S26, an abnormality in the peripheral edge of the protective member 21 may be determined using only the determination target image without using the reference image.

[0097] In this case, the operator recognizes in advance the brightness and shape characteristics of the part of the image that is recognized as abnormal. Alternatively, when a computer is used to judge the presence or absence of an abnormality, a storage device stores these characteristics. Then, the operator or computer judges whether or not this characteristic appears in the image to be judged. However, when there is a mark or the like on the periphery of the protective member 21, using the above-mentioned reference image is easier to eliminate the influence of the mark or the like and to improve the accuracy of the judgment.

[0098] In the above-described embodiment, the image captured by the camera 28 is used to determine the presence or absence of an abnormality, but a fiber sensor or a color sensor may be used instead of the camera 28. The fiber sensor has a light-projecting unit that emits light, and a light-receiving unit into which the light emitted by the light-projecting unit is reflected by the object to be measured and the reflected light is incident. The light-projecting unit is composed of a fluorescent lamp, an LED (Light Emitting Diode), or the like. The light-receiving unit is composed of a CCD (Charge Coupled Device) image sensor, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, or the like.

[0099] For example, when light is incident on a portion where protective member 21 has peeled off, the light is scattered (diffusely reflected) by the air layer, reducing the amount of light reflected by substrate 11, and the intensity of light incident on the light-receiving portion becomes smaller than that of a portion where protective member 21 has not peeled off. Therefore, by measuring the intensity of light incident on the light-receiving portion, the presence or absence of peeling at the periphery of protective member 21 can be determined.

[0100] Similarly to the fiber sensor, the color sensor has a light-projecting unit that emits light, and a light-receiving unit into which the light emitted by the light-projecting unit is reflected by the object to be measured and the reflected light is incident. The color sensor can detect the intensity of each of the blue, red, and green light components. When light is incident on a portion of the protective member 21 where there is peeling, the light is scattered (diffusely reflected) by the air layer, so that the amount of light reflected by the substrate 11 is reduced, and the light incident on the light-receiving unit becomes whiter than the portion of the protective member 21 where there is no peeling. Therefore, by measuring the intensity of each component of the light incident on the light-receiving unit, the presence or absence of peeling at the periphery of the protective member 21 can be determined.

[0101] In addition, the structures, methods, and the like according to the above-described embodiments and modified examples may be modified and implemented without departing from the scope of the present invention. [Explanation of symbols]

[0102] 11: Substrate 11a: Surface 11b: Back side 11c: Notch 13: Street 15: Device 17: Bump 19: Substrate with protective material 21: Protective materials 23: Resin film 23a: 1st page 23b: 1st page 25: Resin layer 25a: 1st page 25b: 2nd side 27: Cover film 27a: 1st page 27b: 2nd side 29: Uneven structure 31: Liquid resin 31a: 1st part 31b :Second part 33: Main body 35: Excess part 37: Image 39:First end 41:Second end 43: Image 45: Resin film 45a: 1st page 45b: 2nd side 47: Resin layer 47a: 1st page 47b: Side 2 49: Cover film 49a: 1st page 49b: Side 2 51: Protective material 53: Image 2: Vacuum chamber 2a: Upper chamber 2b: Lower chamber 4: Support table 4a: surface 4b: Back 6: Negative pressure source 6a: Exhaust duct 8: Resin supply unit 10: Nozzle 12: Pressing unit 14: Pressing member 14a: Side 1 14b: Second surface (pressure surface) 16:Light source 18: Cutting unit 20: Support member 20a: Side 1 20b: 2nd side 22: Spindle 24: Cutter 26: Roller 28: Camera 30: Rotation axis 32: Output device 34: Support table 34a: Surface 34b: Back side 36: Support table 36a: surface 36b: Back side 36c: Groove 38a: Space 38b: Space 40: Negative pressure source 40a: Exhaust passage 42: Resin film adhesion device 44:Resin layer forming device 46: Cutting device

Claims

1. A method for manufacturing a substrate with a protective member, the method comprising the steps of: providing a protective member having a size corresponding to a substrate on one surface of the substrate, the method comprising the steps of: a protective member forming step of forming a protective member having a width larger than a width of the substrate on the one surface of the substrate; a removing step of, after the protective member forming step, cutting the protective member along a peripheral edge of the substrate with a cutter to separate the protective member into an excess portion sticking out from the peripheral edge of the substrate and a main portion of the protective member located inside the peripheral edge of the substrate, and removing the excess portion; After the removing step, a determining step of observing the periphery of the main body portion and determining whether or not an abnormality has occurred at the periphery of the main body portion.

2. a reference image acquiring step of acquiring a reference image serving as a reference for judgment in the judgment step by photographing the protective member at a portion corresponding to the edge of the substrate after the protective member forming step and before the removing step, and a judgment object image acquiring step of acquiring a judgment object image serving as a judgment object in the judgment step by photographing the edge of the main body portion of the protective member after the removing step and before the judgment step, 2. The method for manufacturing a substrate with a protection member according to claim 1, wherein in the determining step, the reference image is compared with the determination target image.

3. In the determination step, a difference is calculated between the luminance of each of a plurality of pixels constituting the determination target image and the luminance of each of a plurality of pixels constituting the reference image, thereby forming a difference image including a first region composed of pixels having a low luminance and a second region composed of pixels having a higher luminance than the pixels constituting the first region; The method for manufacturing a substrate with a protection member according to claim 2 , wherein it is determined that an abnormality has occurred when a size of the second region indicated by the difference image exceeds a threshold value.

4. The method for manufacturing a substrate with a protection member according to claim 1 , further comprising a pressing step of pressing the peripheral edge of the main body portion with a roller after the removing step and before the determining step.

5. 4. The method for manufacturing a substrate with a protection member according to claim 1, further comprising, after the determining step, a pressing step of pressing the peripheral edge of the main body portion with a roller.

6. The method further includes a peeling step of peeling the main body portion from the substrate when it is determined in the determining step that an abnormality has occurred, 4. The method for manufacturing a substrate with a protective member according to claim 1, further comprising the steps of: performing the protective member forming step using a new protective member, the removing step, and the determining step after the peeling step.

7. The protective member forming step includes: a resin film adhering step of adhering one surface of a resin film having a width larger than a width of the substrate to the one surface of the substrate; a liquid resin supplying step of supplying a liquid resin to a surface of the resin film opposite to the one surface; The method for manufacturing a substrate with a protection member according to claim 1 , further comprising a cover film disposing step of disposing a cover film having a width larger than the width of the substrate on the resin and hardening the resin.

Images