Material testing systems with sensor status tests

Abstract

To provide material testing systems, non-transitory computer-readable media, and methods.SOLUTION: Described herein are examples of material testing systems that allow testing of one or more test sensors of a material testing machine. In some examples, such testing may ensure each test sensor is functioning correctly. In some examples, the testing may be conducted manually, periodically, and / or automatically in response to any indication that a test sensor may be malfunctioning. In some examples, further testing using the material testing machine may be prohibited if the test results indicate that one or more of the sensors are malfunctioning. This prohibition can ensure that the testing conducted using the material testing machine remains reliable and usable, rather than being rendered untrustworthy by the malfunctioning test sensors.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] This application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 529,507, filed July 28, 2023, entitled “Material Testing Systems with Sensor Status Tests,” the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE This disclosure relates generally to materials testing systems, and more particularly to materials testing systems with sensor condition testing. [Background technology]

[0003] Materials testing machines are used to test attributes (e.g., tensile / compressive strength) of various material specimens. Sensors in the materials testing machine can obtain measurements during testing of various material specimens, and attributes of the specimens can be evaluated based on the sensor measurements.

[0004] By comparing such a system with the present disclosure described in the remainder of this application with reference to the drawings, the limitations and disadvantages of the conventional and traditional approaches will become apparent to one skilled in the art. Summary of the Invention

[0005] The present disclosure relates to a materials testing system with sensor condition testing substantially as illustrated and / or described in connection with at least one of the drawings and more fully as claimed.

[0006] These and other advantages, aspects, and novel features of the present disclosure, as well as details of illustrated examples of the disclosure, will become more fully understood from the following description and drawings. [Brief description of the drawings]

[0007] [Figure 1]FIG. 1 illustrates an exemplary materials testing system according to aspects of the present disclosure.

[0008] [Diagram 2] FIG. 2 is a block diagram of the materials testing system of FIG. 1 according to an embodiment of the present disclosure.

[0009] [Diagram 3] FIG. 3 is a flow diagram illustrating an example materials testing workflow of the materials testing system of FIGS. 1 and 2 in accordance with an embodiment of the present disclosure.

[0010] [Figure 4] FIG. 3 is a flow diagram illustrating an exemplary test method development process for the materials testing system of FIGS. 1 and 2 in accordance with an embodiment of the present disclosure.

[0011] [Figure 5a] 4 illustrates an example of a visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the materials testing workflow of FIG. 3 in accordance with an embodiment of the present disclosure. FIG. [Figure 5b] 4 illustrates an example of a visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the materials testing workflow of FIG. 3 in accordance with an embodiment of the present disclosure. FIG. [Figure 5c] 4 illustrates an example of a visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the materials testing workflow of FIG. 3 in accordance with an embodiment of the present disclosure. FIG. [Figure 5d] 4 illustrates an example of a visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the materials testing workflow of FIG. 3 in accordance with an embodiment of the present disclosure. FIG. [Figure 5e] 4 illustrates an example of a visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the materials testing workflow of FIG. 3 in accordance with an embodiment of the present disclosure. FIG. [Figure 5f] 4 illustrates an example of a visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the materials testing workflow of FIG. 3 in accordance with an embodiment of the present disclosure. FIG.

[0012] [Figure 6a] 5 illustrates an example of visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the test method creation process of FIG. 4 in accordance with an embodiment of the present disclosure. [Figure 6b] 5 illustrates an example of visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the test method creation process of FIG. 4 in accordance with an embodiment of the present disclosure.

[0013] [Figure 7] FIG. 3 is a flow diagram illustrating an example sensor testing process of the materials testing system of FIGS. 1 and 2 according to an aspect of the present disclosure.

[0014] [Figure 8] 8 illustrates an exemplary visual output of the user interface of the materials testing system of FIGS. 1 and 2 during the sensor testing process of FIG. 7 in accordance with an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The figures are not necessarily to scale. Where appropriate, the same or similar reference numbers are used in the figures to refer to similar or identical components. For example, a reference number utilizing a letter (e.g., gripper 124a, gripper 124b) refers to the same reference number without the letter (e.g., gripper 124).

[0016] The present disclosure relates to a materials testing system that enables testing of one or more test sensors of a materials testing machine to determine whether the sensor(s) are still operating properly. In some examples, testing may be performed manually, periodically, and / or automatically in response to some indication that the test sensor may be malfunctioning. In some examples, further testing using the materials testing machine may be prohibited if the test results indicate that one or more of the sensors are malfunctioning. This prohibition can ensure that tests performed using the materials testing machine are not compromised by malfunctioning test sensors, but remain reliable and usable.

[0017] Some examples of the present disclosure relate to a materials testing system comprising a materials testing machine including a test sensor, a test actuator, and a test controller configured to control the test actuator; and a computing device configured to communicate with the materials testing machine, the computing device including processing circuitry configured to: perform a sensor testing method using the materials testing machine, the sensor testing method including a method for testing a test sensor of the materials testing machine; determine whether the test sensor of the materials testing machine is operating correctly based on test results of the sensor testing method; and inhibit further test methods from being performed using the materials testing machine in response to a determination that the test sensor is not operating correctly.

[0018] In some examples, determining whether the test sensor is operating correctly includes determining whether a measurement of the test sensor during performance of the sensor test method is within a specified tolerance range of an expected measurement, and the test results include the measurement of the test sensor during performance of the sensor test method. In some examples, the computing device further includes memory circuitry that stores a time parameter, and the processing circuitry is further configured to, in response to determining that the test sensor is operating correctly, perform the sensor test method again after a time delay, the time delay being determined based on the time parameter stored in the memory circuitry. In some examples, the sensor test method includes a first sensor test method, the test results include a first test result, the test sensor includes the first test sensor, and the materials testing machine further includes a second test sensor, and the processing circuitry is further configured to, in response to determining that the first test sensor is operating correctly, perform a second sensor test method using the materials testing machine, and determine whether the second test sensor of the materials testing machine is operating correctly based on the second test result of the second sensor test method.

[0019] In some examples, the processing circuitry is further configured to, in response to determining that the second test sensor is operating correctly, sequentially perform additional sensor test methods for each additional test sensor of the materials testing machine until each additional test sensor is determined to be operating correctly or until the additional test sensor is determined to be not operating correctly. In some examples, the system further includes a user interface configured to output an input prompt for a sensor test method and to receive one or more user inputs responsive to the input prompt, the processing circuitry further configured to identify one or more test parameters of the sensor test method based on the one or more inputs and generate the sensor test method based on the one or more test parameters. In some examples, the processing circuitry is further configured to determine whether there is an indication that the test sensor of the materials testing machine is not operating correctly based on an event record stored in the memory circuitry of the computing device, the event record including a log of events occurring during setup, execution, or analysis of the test method, and the sensor test method is performed in response to determining that there is an indication that the test sensor is not operating correctly.

[0020] Some examples of the present disclosure relate to a non-transitory computer-readable medium including machine-readable instructions that, when executed by a processor, cause the processor to: perform a sensor testing method using a materials testing machine, the materials testing machine including a test sensor, a test actuator, and a test controller configured to control the test actuator, the sensor testing method including a method for testing the test sensor of the materials testing machine; determine whether the test sensor of the materials testing machine is operating correctly based on test results of the sensor testing method; and, in response to a determination that the test sensor is not operating correctly, prohibit further test methods from being performed using the materials testing machine.

[0021] In some examples, determining whether the test sensor is operating correctly includes determining whether a measurement of the test sensor during performance of the sensor test method is within a specified tolerance range of an expected measurement, and the test results include the measurement of the test sensor during performance of the sensor test method. In some examples, the non-transitory computer-readable medium further includes a time parameter, and the machine-readable instructions, when executed by the processor, further cause the processor to perform the sensor test method again after a time delay in response to determining that the test sensor is operating correctly, the time delay being determined based on the time parameter. In some examples, the sensor test method includes a first sensor test method, the test results include a first test result, the test sensor includes the first test sensor, and the materials testing machine further includes a second test sensor, and the machine-readable instructions, when executed by the processor, further cause the processor to perform a second sensor test method using the materials testing machine in response to determining that the first test sensor is operating correctly, and determine whether the second test sensor of the materials testing machine is operating correctly based on the second test result of the second sensor test method.

[0022] In some examples, the machine-readable instructions, when executed by the processor, in response to determining that the second test sensor is operating correctly, cause the processor to sequentially perform additional sensor test methods for each additional test sensor of the materials testing machine until each additional test sensor is determined to be operating correctly or until the additional test sensor is determined to be not operating correctly. In some examples, the machine-readable instructions, when executed by the processor, further cause the processor to output an input prompt via a user interface regarding a sensor test method, receive one or more user inputs responsive to the input prompt via the user interface, identify one or more test parameters of the sensor test method based on the one or more inputs, and generate the sensor test method based on the one or more test parameters. In some examples, the machine-readable instructions, when executed by the processor, further cause the processor to determine whether there is an indication that a test sensor of the materials testing machine is not operating correctly based on an event record stored in the memory circuitry of the computing device, the event record including a log of events occurring during setup, execution, or analysis of the test method, and the sensor test method is performed in response to determining that there is an indication that the test sensor is not operating correctly.

[0023] Some examples of the disclosure relate to a method for performing a sensor testing method using a materials testing machine, the materials testing machine including a test sensor, a test actuator, and a test controller configured to control the test actuator, the sensor testing method including a method for testing the test sensor of the materials testing machine, determining, via processing circuitry of a computing device, whether the test sensor of the materials testing machine is operating correctly based on test results of the sensor testing method, and in response to determining that the test sensor is not operating correctly, inhibiting further test methods from being performed using the materials testing machine.

[0024] In some examples, determining whether the test sensor is operating correctly includes determining whether a measurement of the test sensor during performance of the sensor test method is within a specified tolerance range of an expected measurement, and the test results include the measurement of the test sensor during performance of the sensor test method. In some examples, the method further includes, in response to determining that the test sensor is operating correctly, performing the sensor test method again after a time delay, the time delay being determined based on a time parameter stored in the memory circuitry of the computing device. In some examples, the sensor test method includes a first sensor test method, the test results include a first test result, the test sensor includes the first test sensor, and the materials testing machine further includes a second test sensor, and the method further includes, in response to determining that the first test sensor is operating correctly, performing a second sensor test method using the materials testing machine, and determining, via the processing circuitry, whether the second test sensor of the materials testing machine is operating correctly based on a second test result of the second sensor test method.

[0025] In some examples, the method further includes, in response to determining that the second test sensor is operating correctly, sequentially performing additional sensor testing methods for each additional test sensor of the materials testing machine until each additional test sensor is determined to be operating correctly or the additional test sensor is determined to be not operating correctly. In some examples, the method further includes determining, via the processing circuitry, whether there is an indication that a test sensor of the materials testing machine is not operating correctly based on an event record stored in the memory circuitry of the computing device, the event record including a log of events occurring during setup, execution, or analysis of the test method, and the sensor testing method is performed in response to determining that there is an indication that the test sensor is not operating correctly.

[0026] 1 illustrates an exemplary materials testing system 100. As shown, the materials testing system 100 includes a materials testing machine 102 (also known as a general purpose testing machine) and a computing system 200 connected to the materials testing machine 102 through a cable 106. Although the connection is illustrated as being physically connected, in some examples the connection may be wireless rather than wired.

[0027] 1, the materials testing machine 102 includes a frame 112. In some examples, the frame 112 provides rigid structural support to other components of the materials testing machine 102. As shown, the frame 112 includes a top plate 114 and a bottom base 116 connected by two posts 118. In some examples, the posts 118 of the frame 112 may house guide rails and / or a drive shaft 212 of the materials testing machine 102 (see, e.g., FIG. 2).

[0028] 1, a movable crosshead 120 extends between the posts 118. In some examples, the movable crosshead 120 may be connected to guide rails and / or drive shafts 212 housed in the posts 118 and / or may be configured to move toward and / or away from the base 116 through actuation (e.g., motorized) of the drive shaft(s) 212. Although one movable crosshead 120 is shown in the example of FIG. 1, in some examples, the materials testing machine 102 may have multiple movable crossheads 120 and / or other moving members.

[0029] 1, fixtures 122 are attached to the bottom base 116 of the frame 112 and to the movable crosshead 120. As shown, the lower fixture 122a includes a gripper 124a and the upper fixture 122b includes both a test sensor 126 and a gripper 124b. Although one test sensor 126 and two grippers 124 are shown in the example of FIG. 1, in some examples, the test machine 102 may include more or fewer test sensors 126 and / or grippers 124.

[0030] In the example of FIG. 1, the grippers 124 hold a test specimen 128. The test specimen 128 is shown as a rope (e.g., made of steel), but in some examples may be any other type of material and / or component. While grippers 124a and / or grippers 124b are shown as rope holders, in some examples they may alternatively or additionally be configured as bolt holders, wedge grippers, side-acting grippers, manual grippers, roller grippers, capstan grippers, and / or syringe grippers. In some examples, one or both of the grippers 124 may be replaced by a compression platen configured to compress the test specimen 128.

[0031] 1, the test sensor 126 is coupled to the gripper 124 such that the force acting on the gripper 124 (and / or the specimen 128, the crosshead 120, etc.) can be measured. In some examples, the test sensor 126 may be a load cell and / or a transducer. In some examples, the test sensor 126 may be some other type of sensor.

[0032] In some examples, the materials testing machine 102 may be configured for static mechanical testing. For example, the materials testing machine 102 may be configured for compressive strength testing, tensile strength testing, shear strength testing, flexural strength testing, flexural strength testing, tear strength testing, peel strength testing (e.g., strength of adhesive bonds), torsional strength testing, and / or any other compressive and / or tensile testing. Additionally or alternatively, the materials testing machine 102 may be configured to perform dynamic testing.

[0033] In some examples, the materials testing machine 102 is configured to interface with a computing system 200 to perform a test method. For example, the computing system 200 may communicate with a controller 214 (see, e.g., FIG. 2 ) of the materials testing machine 102 to perform the test method. In some examples, an operator (or other user) may first use the computing system 200 to set up the test method, then use the computing system 200 to run the test method, and finally use the computing system 200 to analyze the results of the test method.

[0034] 2 is a block diagram illustrating details of the computing system 200 and additional details of the materials testing machine 102. In the example of FIG. 2, the exemplary materials testing machine 102 includes one or more actuators 210 coupled to one or more drive shafts 212. In some examples, the actuators 210 may be used to provide forces to and / or induce movement of the drive shafts 212. In some examples, the actuators 210 may include electric motors, pneumatic actuators, hydraulic actuators, piezoelectric actuators, relays, and / or switches.

[0035] The drive shaft 212 is further shown connected to the moveable crosshead 120 such that movement of the drive shaft(s) 212 via the actuator(s) 210 results in movement of the moveable crosshead 120. Although the term drive shaft 212 is used in the example of FIG. 2, in some examples the drive shaft 212 may be some other mechanical means for moving the moveable crosshead 120 despite guidance from the actuator(s) 210.

[0036] The exemplary materials testing machine 102 further includes a controller 214 in electrical communication with the actuator(s) 210. In some examples, the controller 214 may include processing circuitry and / or memory circuitry. In some examples, the controller 214 may be configured to control the materials testing machine 102 based on one or more commands, control inputs, and / or test parameters. In some examples, the controller 214 may be configured to convert commands, control inputs, and / or test parameters (e.g., received from the computing system 200) into appropriate (e.g., electrical) signals that can be delivered to the actuator(s) 210, thereby controlling the operation of the materials testing machine 102 (e.g., via the actuator(s) 210). For example, the controller 214 may provide one or more signals instructing the actuator(s) 210 to provide more or less power, thereby increasing or decreasing the force applied.

[0037] 2, the controller 214 is also in electrical communication with the fixture 122 (e.g., the gripper 124 and the test sensor 126). In some examples, the controller 214 may be configured to convert commands, control inputs, and / or test parameters (e.g., received from the computing system 200) into appropriate (e.g., electrical) signals that can be delivered to the gripper 124 to thereby control the operation of the gripper 124 (e.g., gripping or releasing). In some examples, the controller 214 may be configured to convert commands, control inputs, and / or parameters (e.g., received from the computing system 200) into appropriate (e.g., electrical) signals that can be delivered to the sensor(s) 126 to thereby control the operation of the sensor(s) 126. In some examples, the controller 214 may be configured to convert measurement data received from the sensor(s) 126 and / or transmit the measurement data to the computing system 200.

[0038] The example controller 214 is also in electrical communication with a control panel 216 of the materials testing machine 102. In some examples, the control panel 216 may include one or more input devices (e.g., buttons, switches, slides, knobs, microphones, dials, and / or other electromechanical input devices). In some examples, the control panel 216 may be used by an operator to directly control the materials testing machine 102. In some examples, the controller 214 may be configured to convert commands, control inputs, and / or test parameters received via the control panel 216 into appropriate (e.g., electrical) signals that can be delivered to the actuator(s) 210 and / or gripper(s) 124 to control the materials testing machine 102.

[0039] The controller 214 is also shown in electrical communication with a network interface 218b of the materials testing machine 102. In some examples, the network interface 218b includes hardware, firmware, and / or software for connecting the materials testing machine 102 to a complementary network interface 218a of the computing system 200. In some examples, the controller 214 may receive information (e.g., commands) from the computing system 200 through the network interface 218 and / or send information (e.g., measurement data from the sensor(s) 126) to the computing system 200 through the network interface 218.

[0040] 2, computing system 200 includes a computing device 202 and a user interface (UI) 204 interconnected with each other. As shown, UI 204 may include one or more input devices 206 configured to receive input from a user and one or more output devices 208 configured to provide output to the user.

[0041] In some examples, the one or more input devices 206 may include one or more touch screens, mice, keyboards, buttons, switches, slides, knobs, microphones, dials, and / or other input devices 206. In some examples, the one or more output devices 208 may include one or more displays / touch screens, speakers, lights, haptic devices, and / or other output devices 208. In some examples, the output device(s) 208 (e.g., a display screen) of the UI 204 may output one or more representations of a materials testing workflow 300 configured to guide a user in the setup, execution, and / or analysis of a test method performed by the materials testing machine 102. In some examples, the output device(s) 208 (e.g., a display screen) of the UI 204 may output one or more representations of a test method creation process 400 configured to assist a user in easily and / or quickly generating a test method and / or a materials testing workflow 300.

[0042] In the example of Figure 2, the exemplary computing device 202 includes a network interface 218a. As shown, one network interface 218a communicates with a network interface 218b of the materials testing machine 102 through a cable 106. As shown, the computing device 102 further includes a network interface 218a that communicates with a network 220 (e.g., the Internet). In the example of Figure 2, the computing device 202 communicates with a remote interface 230 through the network 220 and the network interface 218a. As shown, the network interface 218a is electrically connected to a common electrical bus 220 of the computing device 202.

[0043] The computing device 202 further includes processing circuitry 224 coupled to the common electrical bus 220. In some examples, the processing circuitry 224 may include one or more processors. In some examples, the processing circuitry 224 is configured to process information received from the UI 204, the data import device(s) 108, and / or the materials testing machine 102. In some examples, the processing circuitry 224 is configured to send commands and / or test parameters to the materials testing machine 102 (e.g., via the network interface(s) 218a). In some examples, the processing circuitry 224 is configured to output information to an operator through the UI 204. In some examples, the processing circuitry 224 is configured to execute machine-readable instructions stored in the memory circuitry 226.

[0044] The example computing device 202 further includes memory circuitry 226 coupled to the common electrical bus 220. As shown, the memory circuitry 226 includes a number of parameters 232 (and / or parameter values), one or more data repositories 234, a materials testing workflow 300, a test method creation process 400, and a sensor testing process 700.

[0045] In some examples, the data repository 234 may include a number of different data structures (e.g., databases, lookup tables, etc.). The data repository 234 may store both historical data (e.g., previous workflows 300, test methods, parameters 232, test results, reports, prompts 602, user inputs, etc.) and current data (e.g., mappings between user inputs and parameters 232). In some examples, the historical data may be associated with timestamps and / or other data (e.g., similar timestamps). In the example of FIG. 2, the repository 234 is shown as part of the memory circuitry 226 of the computing device 202, but in some examples, the repository 234 may be separate from the computing device 202 and / or in communication with the computing device 202 (e.g., via the network interface 218a).

[0046] 2, materials testing workflow 300, test method creation process 400, and / or sensor testing process 700 are shown as part of memory circuitry 226, although in some examples they may be implemented using discrete circuitry (e.g., in processing circuitry 224). In some examples, materials testing workflow 300, test method creation process 400, and / or sensor testing process 700 are implemented using non-transitory machine-readable instructions stored in memory circuitry 226.

[0047] In some examples, the processing circuitry 224 is configured to execute the machine-readable instructions of the materials testing workflow 300 to guide a user in setting up, executing, and / or analyzing a test method on the materials testing machine 102. In some examples, setting up (and / or creating) a test method may include setting values ​​for a number of (e.g., test, sample, analysis, etc.) parameters 232 that define the test method and / or analysis of the test results. In some examples, the UI 204 is configured to display (and / or otherwise output) one or more workflow screens 500 that display the parameters 232 and / or allow a user to manually set the parameters 232 during execution of the materials testing workflow 300.

[0048] In some examples, during the sensor testing process 700, one or more sensor test methods are set up and / or executed to test the test sensor(s) 126 of the materials testing machine 102. In some examples, the test method(s) may be executed manually (e.g., via the materials testing workflow 300). In some examples, the test method(s) may be executed automatically, for example, in response to the expiration of a particular time limit and / or an indication that one or more of the sensors 126 are malfunctioning. In some examples, if the test results of the sensor test method(s) indicate that one or more of the sensors 126 are malfunctioning, execution of further test methods (e.g., to test the analyte 128) may be inhibited. In some examples, this inhibition may continue until the test results of the sensor test method(s) indicate that all of the test sensors 126 are functioning properly.

[0049] In some examples, during the test method creation process 400, the computing device 202 is configured to receive input from a user (e.g., via the UI 204) and use the input to generate and / or set parameters 232 (e.g., test, sample, analysis, etc.) that define, set up, and / or create the test method. In some examples, the number of user inputs required in the prompts may be much less than the number of parameters 232 and / or a single user input may serve as the basis for setting several different parameters 232. Various analyses may also be used to optimize the parameters 232 to comply with certain standards, to save time, and / or to reduce the possibility of errors. Because the number of user input prompts is much less than the number of parameters 232, the process of configuring the test method (and / or test result analysis) may be significantly shortened and / or simplified as compared to manual configuration using the materials testing workflow 300.

[0050] 3 is a flow diagram illustrating example workflow states of an example materials testing workflow 300. Although a particular order of workflow states is illustrated, in some instances, a user's progression through materials testing workflow 300 may be customizable such that additional and / or fewer workflow states may be implemented during operation. In addition, many alternative progressions through workflow 300 may be possible.

[0051] In some examples, a user may be required to log in and / or be authenticated before using and / or proceeding with materials testing workflow 300. In some examples, user authentication may occur via biometric authentication (e.g., fingerprint, retina, face, etc.), proximity authentication (e.g., RFID, NFC, Bluetooth, barcode, etc.), cloud-based authentication (e.g., Oauth, Google, single sign-on), passkey authentication, and / or multi-factor authentication.

[0052] Although materials testing workflow 300 may be described below for purposes of understanding as performing certain specific operations, it should be understood that one or more of the above-described components of materials testing system 100 (e.g., processing circuitry 224, UI 204, etc.) may perform these operations on behalf of (and / or under the direction of) materials testing workflow 300.

[0053] In some examples, the materials testing workflow 300 progresses through workflow states to guide a user in setting up, running, and analyzing a test method on the materials testing machine 102. In some examples, a particular workflow state may be associated with an output of the UI 204 (e.g., workflow screen 500, see FIG. 5). Some of the preliminary workflow states may also be associated with one or more parameters 232 (e.g., displayed and / or set via the workflow screen 500). In some examples, the parameter(s) 232 may be used to define and / or run a test method and / or analyze the results of the test method.

[0054] 3, the first workflow state is a sample setup state 302 (and / or multiple sample setup states 302). During the exemplary sample setup state(s) 302, the materials testing workflow 300 prompts the operator for sample parameters 232 including information regarding the set of sample specimens 128 and (e.g., generic) test parameters 232 including information regarding the set of test methods that will be used to test the sample specimens 128. The information prompted for (and / or collected) during the sample setup state(s) 302 may be information applicable to all specimens 128 and test methods, such as, for example, the date(s) the test(s) will be performed, the date the specimens 128 were manufactured / shipped / packaged, the operator's identification (e.g., number, name, etc.), the fixture(s)' identification (e.g., number(s), name(s), etc.), and / or other information related to all testing of all specimens 128.

[0055] 3, the specimen setup state 302 is followed by one or more test specimen and / or test method setup states 304. During the test specimen and / or test method setup state(s) 304, the materials testing workflow 300 prompts the operator for (and / or collects) specimen parameters 232 that contain information about the particular analyte 128 of the sample and / or test parameters 232 that contain information about the particular test method that will be used to test the particular analyte 128.

[0056] For example, the test parameters 232 may include the date the test is to be performed, identification information for the test (e.g., number, name, type, description, etc.), target start / end positions for the gripper(s) 124, target start / end positions for the crosshead 120, target distance / direction traveled by the crosshead 120, target speed of movement of the crosshead 120, expected result(s) of the test (e.g., location / type of failure, distance traveled before failure, force applied before failure, post-test characteristics of the sample, etc.), time(s) at which the sensor(s) 126 should take the measurement(s), and / or other information related to the particular test method. As another example, the subject parameters 232 may include the date the subject 128 was manufactured / shipped / packaged, identification information for the subject 128 (e.g., number, name, description, etc.), pre-test characteristics of the subject 128 (e.g., measurements / dimensions, material type, weight, color, shape, modulus of elasticity, ultimate tensile strength, etc.), and / or other information associated with a particular subject.

[0057] 5a-c show exemplary workflow screens 500a-c that may be presented via the UI 204 during the test subject and / or test method setup state(s) 304. In the example of FIG. 5a, the workflow screen 500a presents several different types of test methods that may be selected. The workflow screen 500b in FIG. 5b presents several different subject parameters 232 that may be specified. FIG. 5c shows an exemplary workflow screen 500c that displays several test parameters 232 that may be specified.

[0058] The workflow screens 500a-c have a number of input fields 502 in which information (e.g., for subject / test parameters 232) can be displayed and / or entered. In fact, some of the input fields 502 may already have information entered in them. In some examples, each input field 502 corresponds to a sample parameter 232 and / or a test parameter 232, and the information present therein may be used to configure the sample parameter 232 and / or the test parameter 232.

[0059] 3, the test object and / or test method setup state 304 is followed by a run test method state 306 (and / or run test method states 306). During the run test method state(s) 306, the computing device 202 communicates with the materials testing machine 102 (e.g., via the network interface 218) to execute the test method on the test object 128. In some examples, execution of the test method may include using the materials testing machine 102 according to the (e.g., test / object / sample) parameters 232 that were set during the test object and / or test method setup state(s) 304 and / or the specimen setup state(s) 302. For example, the processing circuitry 224 of the computing device 202 may determine and / or send one or more parameters 232 and / or commands to the materials testing machine 102, and the controller 214 of the materials testing machine 102 may control the actuator(s) 210 of the materials testing machine 102 to perform the test method according to the command(s) and / or parameter(s) 232. In some examples, the execution of the test method (e.g., via the test method execution state(s) 306) may result in some movement and / or motion of the materials testing machine 102, some force applied to the specimen 128, and / or some (e.g., force) measurement(s) of the test sensor(s) 126 over some period of time.

[0060] 3, the run test method state 306 is followed by one or more post-test analysis setup states 308. During the post-test analysis setup state(s) 308, the materials testing workflow 300 prompts the operator for (and / or collects) information related to the test method analysis performed during the run test method state 306 and / or one or more reports of that analysis.

[0061] For example, the information prompted for (and / or collected) during the post-test analyte analysis setup state(s) 308 may include post-test characteristics of the analyte 128 (e.g., analyte parameters 232), the actual parameters of the test (e.g., test parameters 232), the actual results of the test (e.g., test parameters 232), the test result report format(s) (e.g., report parameters 232), and / or other information related to the test method and / or analysis of the test sample. As another example, the information prompted for (and / or collected) during the post-test analyte analysis setup state(s) 308 may include calculated analysis parameters 232, such as, for example, one or more algorithms that may be used to evaluate the results of the test method (and / or generate additional test results), and / or one or more thresholds and / or threshold ranges by which the test results may be determined, e.g., to determine whether the analyte 128 passed or failed the test. The post-test analyte analysis setup state(s) 308, although shown as a separate state in FIG. 3, may in some examples be integrated into the test analyte and / or test method setup state(s) 304.

[0062] Figures 5d-f show workflow screens 500d-f that may be presented via the UI 204 during the post-test analyte analysis setup state(s) 308. The exemplary workflow screens 500d and 500e in Figures 5d and 5e show various calculated analysis parameters 232 that may be set during the post-test analyte analysis setup state(s) 308. Figure 5f shows an exemplary workflow screen 500f with various report parameters 232 that may be set during the post-test analyte analysis setup state(s) 308 to configure a report.

[0063] In the example of FIG. 3 , the one or more post-test analyte analysis setup states 308 are followed by one or more post-test analyte analysis calculation states 310 of the materials testing workflow 300. During the post-test analyte analysis calculation state(s) 310, the processing circuitry 224 of the computing device 202 may perform one or more calculations based on information (e.g., calculated analysis parameters 232) collected during the previous post-test analyte analysis setup state(s) 308 as well as the results of the test method. In some examples, the results of the test method may include measurements of forces and / or loads exerted on the analyte 128 (and / or measured by the test sensor 126) over a period of time (e.g., of the test method). In some examples, during the post-test analyte analysis calculation state(s) 310, the processing circuitry 224 of the computing device 202 may additionally (or alternatively) perform one or more calculations based on information (e.g., sample / analyte / test parameters 232) related to the analyte and / or test method.

[0064] For example, the processing circuitry 224 may use the test results and / or the samples, analytes, tests, and / or calculated analytical parameters 232 to estimate the strength, reliability, quality, grade, resilience, and / or other properties of the specimen 128. As another example, the processing circuitry 224 may use the test results and / or the samples, analytes, tests, and / or calculated analytical parameters 232 to make hypotheses about the structure and / or composition of the specimen 128. As another example, the processing circuitry may use the test results and / or the samples, analytes, tests, and / or calculated analytical parameters 232 to make hypotheses about the future performance of the specimen 128.

[0065] In the example of FIG. 3, the materials testing workflow 300 cycles through states 304-310 for all test methods and / or test specimens of the test sample (set up in state 302). As shown, after state 310, the materials testing workflow 300 cycles through the next test method and / or test specimen in state 314 (if there is another test method or test specimen) and then returns to state 304. Once states 304-310 have been completed for all test methods and / or test specimens of the test sample, the materials testing workflow 300 transitions to one or more report states 316, where the materials testing workflow 300 can provide reports on the results and / or analysis of the test sample as specified by the operator. In some examples, the one or more reports may be provided to the remote interface 230 over the network 220.

[0066] 4 is a flow diagram illustrating an example operation of a test method creation process 400. In some examples, during the test method creation process 400, the computing device 202 is configured to receive user input (e.g., via the UI 204) and use the user input to generate and / or set parameters 232 (e.g., test, sample, analysis, etc.) that would otherwise be set through the materials testing workflow 300. In some examples, a user may be required to log in and / or be authenticated as discussed above before using and / or proceeding with the test method creation process 400. Although the test method creation process 400 may be described below as performing certain operations for purposes of understanding, it should be understood that one or more of the above-described components of the materials testing system 100 (e.g., processing circuitry 224, UI 204, etc.) may perform these operations on behalf of (and / or at the direction of) the test method creation process 400.

[0067] 4, the test method creation process 400 begins at block 402, where the test method creation process 400 outputs one or more questions and / or other prompts (e.g., via the UI 204) to elicit input from an operator and / or other user. In some examples, the questions and / or other prompts may be intended to obtain input regarding the user's testing intent, desires, goals, and / or subjects, which may be translated into parameters 232 that define the test method and / or test result analysis. As shown, at block 402, the test method creation process 400 also receives the user input that the prompt(s) are intended to elicit.

[0068] 6a and 6b show examples of creation screens 600 that may be displayed during block 402 (and / or other blocks) of test method creation process 400. In the example of FIG. 6a and 6b, creation screen 600a includes a number of prompts 602, each of which is adjacent to an input field 502. As shown, some of the input fields 502 include drop-down menus with several options to choose from, while other input fields 502 allow free-form text entry. Most of the input fields 502 have some information entered into them, while at least one input field 502 is left empty.

[0069] The example workflow screen 600b in FIG. 6b further illustrates an example result curve graph 604, which may additionally be used to receive input from a user (e.g., via a cursor). For example, a user may interact with the graph 604 to select a particular portion (e.g., A, B, C, D, or E). In some examples, selecting a particular portion of the result curve graph 604 may involve selecting a particular option from the input field 502. In the example of FIG. 6B, the user has selected portion E of the result curve graph 604, resulting in a selection of "break point" (rather than, e.g., elasticity, yield strength, ultimate strength, etc.) in response to a prompt 602 regarding the most relevant attribute of the specimen 128. In some examples, a different selection of the most relevant attribute of the specimen 128 (e.g., via the graph 604 or input field 502d) may result in different calculated analysis parameters 232 being selected by the test method creation process 400.

[0070] 4, the test method creation process 400 determines whether any input fields 502 from block 402 remain empty and / or unpopulated (e.g., after an indication is received that the user has finished entering information) in block 404. If any empty and / or unpopulated input fields 502 remain, the test method creation process 400 identifies one or more suggested inputs for the empty input fields 502 in block 5406.

[0071] In some examples, identifying the suggested input may include an analysis of previous inputs (e.g., stored in the data repository 234) to identify the most recently and / or most used input(s) for a particular (e.g., empty) input field 502. In some examples, the test method creation process 400 may additionally (or alternatively) consider other factors, such as the logged in user and / or the materials testing machine 102 being used (e.g., to determine the most recently / most used input for a particular user and / or testing machine 102). For example, a particular materials testing machine 102 (and / or fixture 122, gripper 124, sensor 126, etc.) may always be used for compression, in which case the test method creation process 400 may suggest "squeezed" as an answer to the question "Will the specimen be bent, stretched, or squeezed?" In some examples, the test method creation process 400 may additionally take into account other previous inputs (e.g., to determine the most recently / most frequently used inputs when a particular pattern of inputs exists).

[0072] In some examples, more complex analysis may be used where the test method creation process 400 uses previous input data (e.g., stored in the repository 234) to attempt to identify one or more input patterns that match the pattern of the current input. In some examples, one or more machine learning algorithms (e.g., cluster analysis, K-nearest neighbors, etc.) may be used for pattern matching. This pattern matching may then be used to identify the inputs to suggest.

[0073] In some examples, the suggested inputs identified in block 406 may be output to the user via the UI 204. In some examples, the test method creation process 400 may provide an explanation as to why the suggestions are being made. In some examples, the suggested inputs may be implemented and / or used as actual inputs (e.g., in response to inputs received via the UI 204 accepting the suggestions). Although block 406 is described as occurring after the user input is completed in block 402, in some examples, the suggestion(s) of block 406 may be made while the user is entering the inputs, such that the user can view the suggested inputs prior to actually selecting the inputs themselves.

[0074] 6a and 6b show examples of suggested inputs, for example, presented on creation screen 600a. In the example of FIG. 6a, the suggested inputs are the grayed-out inputs in input fields 502a and 502b. In some examples, multiple input suggestions may be made. For example, both American Society for Testing and Materials (ASTM) and International Organization for Standardization (ISO) may be suggested for input field 502a, and the user may be allowed to select one (or both) of these suggestions. In some examples, a single input suggestion may be made from several possible options. For example, in the example of FIG. 6b, input field 502c shows a suggestion to use the stress and strain axes rather than other potential axis options (e.g., load and displacement, load and time, etc.).

[0075] In the example of FIG. 4, after block 406, the test method creation process 400 proceeds to block 408 where the test method creation process 400 identifies one or more parameters 232 (and / or parameter values) of the materials testing workflow 300 based on the input(s) received in block 402 and / or block 406. In some examples, this identification may include converting a single input to multiple parameters 232 (and / or parameter values) such that all parameters 232 can be set with less input than would be required to set each parameter 232 individually. In some examples, the conversion may use one or more data structures (e.g., in the data repository 234) that map the input to the parameters 232. Such data structures may be particularly beneficial when there are a limited number of known inputs that may be entered in response to a particular prompt 602 and / or when a drop-down menu input field 502 is used (e.g., providing a limited number of known inputs as options). In some examples, if a parameter 232 cannot be directly mapped to an input, the parameter 232 may be assigned a default value (e.g., stored in memory circuitry 226) that is known to be generally applicable in most situations.

[0076] If appropriate, after block 408, the test method creation process 400 identifies one or more parameters 232 (and / or parameter values) to be suggested to the user in block 410. In some examples, after block 408, a parameter 232 (single or multiple) (and / or parameter value(s)) may be suggested if one or more parameters 232 (and / or parameter values) remain unspecified and / or unset. In some examples, a parameter 232 (and / or parameter value) may be suggested even if the parameter 232 (and / or parameter value) was set in block 408 if the proposed change to the parameter 232 (and / or parameter value) would save time, reduce the possibility of error, and / or change the parameter 232 (and / or test method) to comply with a particular standard.

[0077] In some examples, the test method development process 400 identifies proposed parameter(s) 232 based on one or more inputs received at block 402 and / or block 406. For example, one of the user inputs at block 402 may identify a particular standard, and the test method development process 400 may evaluate the parameters 232 in light of the standard and identify one or more parameters 232 that should be adjusted to meet the standard (e.g., in light of the materials testing machine 102, other parameters 232, and / or other inputs).

[0078] In some examples, the test method creation process 400 identifies the proposed parameter(s) 232 based on one or more other current and / or previous parameters 232. For example, the test method creation process 400 may evaluate previous parameters 232 in light of current analyte parameters 232 (e.g., indicating that the analyte 128 is a particular material) and identify one or more particular test parameters 232 as having been most frequently / recently used in the past in combination with the analyte parameters 232.

[0079] In some examples, the test method creation process 400 may use more complex analysis in which the test method creation process 400 uses previous parameters 232 and / or inputs (e.g., stored in repository 234) to attempt to identify one or more patterns that match the patterns of the current parameters 232 and / or inputs. In some examples, one or more machine learning algorithms (e.g., cluster analysis, K-nearest neighbors, etc.) may be used for pattern matching. In some examples, the test method creation process 400 may additionally (or alternatively) identify suggested parameter(s) 232 based on previous test results (e.g., stored in repository 234).

[0080] In some examples, the suggested parameters 232 identified in block 410 may be output to a user via the UI 204. In some examples, the test method creation process 400 may provide an explanation as to why the suggestions are being made. In some examples, the suggested parameter(s) 232 may be used as the actual parameter(s) 232 (e.g., in response to input received via the UI 204 accepting the suggestions).

[0081] 4, after block 410, the test method creation process 400 proceeds to block 412, where the test method creation process 400 uses the parameters 232 identified in block 410 and / or block 408 (and / or input received in blocks 402 and / or block 406) to generate a materials testing workflow 300. In some examples, in generating the materials testing workflow 300 using the parameters 232, the test method creation process 400 may define a test method.

[0082] After block 412, the test method creation process 400 generates one or more documents based on the received inputs, the current parameters 232 (and / or parameter values), and / or the generated materials testing workflow 300 (and / or test method) in block 414. For example, the document(s) may provide instructions on how to use the materials testing workflow 300 and / or how to set up the test method, how to run the test method, and / or how to analyze the results of the test method. Such documents may be useful to an operator tasked with using the generated materials testing workflow 300 and / or setting up, running, and / or analyzing the results of the test method.

[0083] After block 414, the test method creation process 400 generates and / or provides a tutorial (e.g., via the UI 204) in block 416. In some examples, the tutorial may instruct a user how to set up the materials testing machine 102, how to operate the materials testing machine 102, how to navigate through the materials testing workflow 300, and / or how to set up a test method (e.g., via the materials testing workflow 300), how to run the test method, and / or how to analyze the results of the test method. In some examples, the tutorial may provide access to a human or automated helper to provide guidance on how to set up the materials testing machine 102, how to operate the materials testing machine 102, how to navigate through the materials testing workflow 300, and / or how to set up a test method, how to run the test method, and / or how to analyze the results of the test method.

[0084] In the example of FIG. 4 , after block 416, the test method creation process 400 proceeds to block 418 where the test method creation process 400 allows a user to use and / or proceed through the generated materials testing workflow 300. By allowing the user to proceed through the workflow 300, the user is allowed to view and / or modify any desired parameters 232. For example, the user may use the test method creation process 400 to simply set many values ​​for the parameters 232, but may realize that some parameters 232 must be set in a certain way to define the test method and / or analyze the test results as desired. In such an example, the user may manually customize the parameters 232 to the extent desired.

[0085] In some examples, block 418 may include using (and / or via communication with) the materials testing machine 102 to execute the test method defined by the identified parameters 232 of the workflow 300. For example, a user may use the run test method state(s) 306 of the workflow 300 to execute the test method using the set parameters 232. Then, in block 420, the results of the test method are compiled and / or output via one or more reports (e.g., via post-test states 308, 310, and / or 316 of the workflow 300).

[0086] In some examples, the report(s) may be provided to a remote user over a network 220 (e.g., the Internet) using a remote interface 230. In such examples, the report may take the form of a website, web platform, or other online interface.

[0087] Although blocks 418 and 420 are illustrated as part of test method development process 400 for purposes of completeness and understanding, one of ordinary skill in the art will appreciate that blocks 418 and 420 may occur outside of test method development process 400. As illustrated, test method development process 400 ends after block 420.

[0088] FIG. 7 is a flow diagram illustrating an example operation of a sensor testing process 700. In some examples, during the sensor testing process 700, one or more sensor test methods are set up and / or performed to test the test sensor(s) 126 of the materials testing machine 102. In some examples, by periodically testing the test sensors 126 via the test methods, the sensor testing process 700 ensures that the test sensors 126 are functioning properly and are not compromised by specific issues, such as sensor drift, overload, miscalibration, and / or other issues that affect the reliability, accuracy, and / or correct function of the test sensor(s) 126. In some examples, if the test results indicate that one or more of the sensors 126 are malfunctioning, the execution of further test methods (e.g., of the analytes 128) may be prohibited. This prohibition can ensure that tests performed using the materials testing machine are not rendered unreliable by malfunctioning test sensors and remain reliable and usable. In some examples, the inhibition may be ended manually and / or when test results indicate that all of the sensors 126 are functioning properly.

[0089] In some examples, as discussed above, a user may be required to log in and / or be authenticated before using and / or proceeding with sensor testing process 700. Although sensor testing process 700 may be described below for purposes of understanding as performing certain operations, it should be understood that one or more of the above-described components of materials testing system 100 (e.g., processing circuitry 224, UI 204, etc.) may perform these operations on behalf of (and / or at the direction of) sensor testing process 700.

[0090] 7, the sensor testing process 700 begins at block 702, where the sensor testing process 700 sets up one or more test methods for testing the test sensor(s) 126 of the materials testing machine 102. In some examples, one or more of the test methods may be set up using the materials testing workflow 300. In some examples, one or more of the test methods may be set up and / or created using the creation process 400.

[0091] In some examples, each test sensor 126 of the materials testing machine 102 is associated with its own unique test method. In some examples, a particular test sensor 126 may be associated with a particular test method by specifying (e.g., via the test parameter(s) 232) that the particular test sensor 126 is to be used for a test.

[0092] In some examples, the analyte 128 in the test recipe for the test sensor 126 may be an item of known weight (e.g., specified as part of the sample / analyte parameter(s) 232). This allows the sensor testing process 700 to determine whether the test sensor 126 is functioning properly by comparing the weight (and / or force) measurements of the test sensor 126 during the test recipe to the known weight (and / or force). In some examples, it may be determined that the test sensor 126 passes the test if the measured weight is the same as the known weight or within some tolerance of the known weight. In some examples, the tolerance may be specified as part of the analysis parameter(s) 232.

[0093] 8 illustrates an exemplary creation screen 600c that may be displayed when using the creation process 400 to create a test method for testing a test sensor 126 of a materials testing machine 102. As shown, the creation screen 600c has a prompt 602 similar to the creation screen 600a of FIG. 6a. However, the information entered into the input fields 502 of the creation screen 600c differs from the creation screen 600a.

[0094] 8, the information entered into input fields 502 in creation screen 600c is geared toward creating a test method for testing a test sensor 126 on a materials testing machine 102. In particular, creation screen 600c shows information in input field 502e that identifies a test subject 128 as corresponding to identifier TSW50. In some examples, this identifier may correspond to an item of known weight (e.g., 50 pounds) that will be used as the test subject 128 to test the test sensor(s) 126.

[0095] 8, the suggested inputs are entered in other input fields 502 of the creation screen 600c. In some examples, the creation process 400 may identify the suggested inputs based on an identifier for the subject 128 in input field 502c. For example, one or more of the data repositories 234 may store one or more data structures that map the identifier for the subject 128 with other information related to the subject 128, the test method, and / or the results analysis. In some examples, the identifier for the subject 128 may be considered an input and / or subject parameter 232.

[0096] In some examples, one or more other parameters 232 that are not a traditional part of the materials testing workflow 300 may also be provided in block 702. For example, the sensor testing process 700 may prompt and / or receive input specifying one or more time parameters 232 representing the duration, frequency, number of intervening test methods / samples / analytes 128, and / or other variables indicating how often the test method(s) should be performed (e.g., for all test sensors 126 or for a particular test sensor 126).

[0097] As another example, the sensor testing process 700 may prompt and / or receive input specifying one or more log parameters 232 that represent one or more conditions that may trigger the need for the test sensor(s) 126 to be tested via the appropriate test method(s). In some examples, the materials testing system 100 may maintain a data log (e.g., via one or more data repositories 234) that records measurements (and other data) of the test sensor(s) 126 from previous sensor measurements, previous test results, previous test methods, and / or previous materials testing workflows 300. In some examples, the sensor testing process 700 may analyze the log data to determine whether any of the conditions represented by the log parameters 232 have been met to determine whether the sensor(s) 126 need to be tested via the appropriate test method(s).

[0098] Examples of conditions represented by log parameters 232 may include certain data trends, such as, for example, a sequence of test method measurements (e.g., made by a test sensor 126) that indicate potential sensor drift, sensor overload, and / or miscalibration (e.g., in view of other measurements by the same test sensor 126 during previous test methods and / or by other test sensors 126). Another example may include one or more thresholds that sensor measurements should not reach (or should reach very rarely).

[0099] 7, after block 702, the sensor testing process 700 proceeds to block 704 where the sensor testing process 700 determines whether the time parameter 232 indicates that it is time for the sensor test method(s) to be performed. In some examples, when determining whether it is time for the sensor test method(s) to be performed, the sensor testing process 700 may further consider data from a (date / time / test method / sample / analyte 128) counter of the computing device 202 (e.g., implemented via machine-readable instructions in the processing circuitry 224 and / or memory circuitry 226). If the sensor testing process 700 determines that it is time for the sensor test method(s) to be performed, the sensor testing process 700 proceeds to block 708 where the sensor testing process 700 executes the test method(s) set up in block 702. However, if the sensor testing process 700 determines that it is not yet time for the sensor testing method(s) to be performed, the sensor testing process 700 proceeds to block 706 .

[0100] At block 706, the sensor testing process 700 analyzes the data log (e.g., stored via the data repository 234) to see if there is evidence that any of the conditions represented by the log parameters 232 have been met. If no such evidence is found, the sensor testing process 700 returns to the test time decision block 704. However, if the sensor testing process 700 finds evidence that one or more of the conditions represented by the log parameters 232 have been met, the sensor testing process 700 proceeds to block 708, where the sensor testing process 700 executes the sensor testing method(s).

[0101] 7 and discussed above as occurring in a particular order, in some examples, blocks 704 and 706 may be reversed in order, such that block 706 is performed first and block 704 is performed second (e.g., if the outcome of block 706 is "no"). In any case, if the outcome of either blocks 704 and / or 706 is "yes," sensor testing process 700 then proceeds to block 708, where sensor testing process 700 performs a sensor testing method(s).

[0102] In some examples, the computing device 202 communicates with the materials testing machine 102 (e.g., via the network interface 218) to execute the sensor testing method(s), as discussed above. In some examples, execution of the sensor testing method(s) may include using the materials testing machine 102 in accordance with the (e.g., test / subject / sample) parameters 232 set by the creation process 400 and / or during the materials testing workflow 300, as discussed above. Although the sensor testing method(s) are shown as being executed automatically by the sensor testing process 700, in some examples they may be executed manually at any time by a user (e.g., via the materials testing workflow 300).

[0103] 7, after executing the sensor test method in block 708, the sensor testing process 700 proceeds to block 710 where the sensor testing process 700 analyzes the test results of the sensor testing method to determine whether the particular test sensor 126 tested by the test method passed the test. In some examples, the analysis of the test results may include comparing one or more force measurements of the test sensor 126 and / or one or more statistically representative values ​​(e.g., mean, mode, median, etc.) of the one or more force measurements to one or more expected measurements and / or one or more threshold tolerance ranges (e.g., represented via analysis parameters 232). For example, the sensor testing process 700 may compare the average force measurement of the test sensor 126 to the expected force measurement and determine that the test sensor 126 passed the test method because, although not exactly the same, the average force measurement is within an acceptable range of the expected force measurement (e.g., ±2 pounds).

[0104] As shown, if the sensor testing process 700 determines that the test sensor 126 passed the test method, then the sensor testing process 700 proceeds after block 710 to block 712. In block 712, the sensor testing process 700 determines whether there is another test sensor 126 on the materials testing machine 102 that needs to be tested (or has not yet been tested) (and / or whether there is another associated test method that needs to be performed or has not yet been performed). If so, the sensor testing process 700 returns to block 708 where the next test method is performed.

[0105] If, at block 710, it is determined that all test sensors 126 have passed the test method(s) and, at block 712, no additional test sensors 126 are found that require testing, the sensor testing process 700 proceeds to block 714, where the sensor testing process 700 enables additional test methods to be performed (e.g., on the specimens 128 that require testing) using the materials testing machine 102. In some examples, a user may manually enable additional test methods to be performed. After enabling at block 714, the sensor testing process 700 returns to block 704 (although in some examples, the sensor testing process 700 may instead return to block 702 or end).

[0106] However, if at block 710 the test sensor 126 is found to not pass the test method, the sensor testing process 700 proceeds to block 716 where further test methods are prohibited from being performed using the materials testing machine 102. In some examples, this prohibition can ensure that the test results of other test methods are reliable and are not corrupted by a malfunctioning test sensor(s) 126. In some examples, the sensor testing process 700 may proceed to block 716 only if a certain number (e.g., stored in the memory circuitry 226) of test sensors 126 have failed the test method. Although illustrated as returning to block 708 after block 716, in some examples the sensor testing process 700 may instead end after block 716.

[0107] The disclosed sensor testing process 700 allows for testing of one or more test sensors 126 of the materials testing machine 102 to ensure that each test sensor 126 is functioning properly. Testing may be performed manually, periodically, and / or in response to some indication that a test sensor 126 may be malfunctioning. In some examples, further test methods (e.g., those not performed to test the test sensor(s) 126) may be prohibited from being performed if the test results indicate that one or more of the sensors 126 are malfunctioning and / or until the test results indicate that all of the sensors 126 are functioning properly. This prohibition can ensure that the test results of other test methods are not rendered unreliable by a malfunctioning test sensor 126 and are reliable and usable.

[0108] The method and / or system can be implemented in hardware, software, and / or a combination of hardware and software. The method and / or system can be implemented centrally in at least one computing system, or in a distributed manner where different elements are distributed across several interconnected computing or cloud systems. Any kind of computing system or other device adapted to perform the methods described herein is suitable. A typical combination of hardware and software can include a general-purpose computing system, together with a program or other code that, when loaded and executed, controls the computing system to perform the methods described herein. Another typical embodiment can include an application-specific integrated circuit or chip. Some embodiments can include a non-transitory machine-readable (e.g., computer-readable) medium (e.g., a flash drive, an optical disk, a magnetic storage disk, etc.), which stores one or more lines of code executable by a machine, thereby causing the machine to perform a process as described herein.

[0109] Although the method and / or system have been described with reference to certain specific embodiments, those skilled in the art will recognize that various modifications can be made and equivalents can be substituted without departing from the scope of the method and / or system. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the disclosure without departing from its scope. Therefore, the method and / or system is not limited to the particular embodiments disclosed, but it is contemplated that the method and / or system will include all embodiments falling within the scope of the appended claims.

[0110] As used herein, "and / or" means any one or more of the items in the list linked by "and / or." As an example, "x and / or y" means any element of the three-element set {(x),(y),(x,y)}. In other words, "x and / or y" means "one or both of x and y." As another example, "x, y and / or z" means any element of the seven-element set {(x),(y),(z),(x,y),(x,z),(y,z),(x,y,z)}. In other words, "x, y and / or z" means "one or more of x, y and z."

[0111] As used herein, the term "for example" emphasizes a list of one or more non-limiting examples, instances, or illustrations.

[0112] As used herein, the terms "coupled," "coupled to," and "coupled with" refer to a structural and / or electrical connection, whether by attaching, adhering, connecting, joining, fastening, linking, and / or otherwise securing. As used herein, the term "attach" refers to attaching, coupling, connecting, joining, fastening, linking, and / or otherwise securing. As used herein, the term "connect" refers to attaching, adhering, coupling, joining, fastening, linking, and / or otherwise securing.

[0113] As used herein, the terms "circuitry" and "circuitry" refer to physical electronic components (i.e., hardware) and any software and / or firmware ("code") that may comprise, be executed by, and / or be otherwise associated with the hardware. As used herein, for example, a particular processor and memory may include a first "circuitry" when executing a first one or more lines of code, and a second "circuitry" when executing a second one or more lines of code. As used herein, whenever circuitry includes the hardware and code (if either is necessary) necessary to perform a function, the circuitry is "operable" and / or "configured" to perform that function, regardless of whether performance of that function is disabled or enabled (e.g., by a user-configurable setting, factory trim, etc.).

[0114] As used herein, control circuitry can include digital and / or analog circuitry, discrete and / or integrated circuitry, microprocessors, DSPs, etc., software, hardware and / or firmware that constitutes part or all of the controller and / or is located on one or more boards used to control the welding process and / or devices such as power supplies and wire feeders.

[0115] As used herein, the term "processor" refers to processing devices, apparatus, programs, circuits, components, systems, and subsystems, whether implemented in hardware, tangibly embodied software, or both, and whether programmable or not. As used herein, the term "processor" includes, but is not limited to, one or more computing devices, hardwired circuits, devices and systems that modify signals, devices and machines for controlling systems, central processing units, programmable devices and systems, field programmable gate arrays, application specific integrated circuits, systems on chips, systems with discrete elements and / or circuits, state machines, virtual machines, data processors, processing facilities, and any combination of the above. A processor may be, for example, any type of general purpose microprocessor or general purpose microcontroller, a digital signal processing (DSP) processor, an application specific integrated circuit (ASIC), a graphics processing unit (GPU), a reduced instruction set computer (RISC) processor with an advanced RISC machine (ARM) core, etc. A processor may be coupled to and / or integrated into a memory device.

[0116] As used herein, the terms "memory" and / or "memory device" refer to computer hardware or circuitry that stores information for use by a processor and / or other digital devices. The memory and / or memory device can be any suitable type of computer memory or any other type of electronic storage medium, such as read-only memory (ROM), random access memory (RAM), cache memory, compact disc read-only memory (CDROM), electro-optical memory, magneto-optical memory, programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), computer readable medium, etc. Memory may include, for example, non-transitory memory, non-transitory processor-readable medium, non-transitory computer-readable medium, non-volatile memory, dynamic RAM (DRAM), volatile memory, ferroelectric RAM (FRAM), first-in-first-out (FIFO) memory, last-in-first-out (LIFO) memory, stacked memory, non-volatile RAM (NVRAM), static RAM (SRAM), cache, buffer, semiconductor memory, magnetic memory, optical memory, flash memory, flash card, compact flash card, memory card, secure digital memory card, micro card, mini card, expansion card, smart card, memory stick, multimedia card, picture card, flash storage, subscriber identity module (SIM) card, hard drive (HDD), solid state drive (SSD), etc. Memory may be configured to store code, instructions, applications, software, firmware, and / or data and may be external, internal, or both to the processor.

Claims

1. A materials testing system comprising: A materials testing machine comprising a test sensor, a test actuator, and a test controller configured to control the test actuator; 1. A computing device configured to communicate with the materials testing machine, the computing device including: performing a sensor testing method using the materials testing machine, the sensor testing method including a method for testing the test sensor on the materials testing machine; determining whether the test sensor of the materials testing machine is operating properly based on a test result of the sensor testing method; in response to determining that the test sensor is not operating properly, inhibiting further testing methods from being performed using the materials testing machine; and A computing device configured to: A system comprising:

2. 2. The system of claim 1, wherein determining whether the test sensor is operating correctly includes determining whether a measurement value of the test sensor during execution of the sensor testing method is within a specified tolerance range of expected measurement values, and the test results include the measurement value of the test sensor during execution of the sensor testing method.

3. 2. The system of claim 1, wherein the computing device further includes a memory circuitry that stores a time parameter, and the processing circuitry is further configured to, in response to determining that the test sensor is operating correctly, execute the sensor testing method again after a time delay, the time delay being determined based on the time parameter stored in the memory circuitry.

4. The sensor testing method includes a first sensor testing method, the test results include a first test result, the test sensor includes a first test sensor, the materials testing machine further includes a second test sensor, and the processing circuitry further includes: responsive to determining that the first test sensor is operating correctly, performing a second sensor testing method using the materials testing machine; determining whether the second test sensor of the materials testing machine is operating properly based on a second test result of the second sensor testing method; The system of claim 1 configured to:

5. 5. The system of claim 4, wherein the processing circuitry is further configured, in response to determining that the second test sensor is operating correctly, to sequentially perform additional sensor testing methods for each additional test sensor of the materials testing machine until each additional test sensor is determined to be operating correctly or until the additional test sensor is determined to be not operating correctly.

6. Furthermore, 1. A user interface, comprising: outputting a prompt for the sensor test method; receiving one or more user inputs responsive to the input prompts; A user interface configured to Equipped with The processing circuitry further comprises: identifying one or more test parameters of the sensor test method based on the one or more inputs; generating the sensor test method based on the one or more test parameters; The system of claim 1 configured to:

7. 2. The system of claim 1, wherein the processing circuitry is further configured to determine whether there is an indication that the test sensor of the materials testing machine is not operating properly based on an event record stored in the memory circuitry of the computing device, the event record including a log of events occurring during setup, execution, or analysis of a test method, and the sensor test method is executed in response to a determination that there is an indication that the test sensor is not operating properly.

8. A non-transitory computer-readable medium containing machine-readable instructions that, when executed by a processor, cause the processor to: performing a sensor testing method using a materials testing machine, the materials testing machine including a test sensor, a test actuator, and a test controller configured to control the test actuator, the sensor testing method including a method for testing the test sensor of the materials testing machine; determining whether the test sensor of the materials testing machine is operating properly based on a test result of the sensor testing method; in response to determining that the test sensor is not operating properly, inhibiting further testing methods from being performed using the materials testing machine; and A non-transitory computer-readable medium for causing

9. 9. The non-transitory computer-readable medium of claim 8, wherein determining whether the test sensor is operating correctly includes determining whether a measurement value of the test sensor during execution of the sensor testing method is within a specified tolerance range of expected measurement values, and the test results include the measurement value of the test sensor during execution of the sensor testing method.

10. 9. The non-transitory computer-readable medium of claim 8, further comprising a time parameter, the machine-readable instructions, when executed by the processor, further causing the processor to, in response to determining that the test sensor is operating correctly, execute the sensor testing method again after a time delay, the time delay being determined based on the time parameter.

11. The sensor testing method includes a first sensor testing method, the test results include a first test result, the test sensor includes a first test sensor, the materials testing machine further includes a second test sensor, and the machine readable instructions when executed by the processor further cause the processor to: responsive to determining that the first test sensor is operating correctly, performing a second sensor testing method using the materials testing machine; determining whether the second test sensor of the materials testing machine is operating properly based on a second test result of the second sensor testing method; The non-transitory computer-readable medium of claim 8 .

12. The machine-readable instructions, when executed by the processor, further cause the processor to: in response to determining that the second test sensor is operating correctly, having the processor sequentially perform additional sensor testing methods for each additional test sensor of the materials testing machine until each additional test sensor is determined to be operating correctly or until each additional test sensor is determined to be not operating correctly; The non-transitory computer-readable medium of claim 11 .

13. The machine-readable instructions, when executed by the processor, further cause the processor to: outputting, via a user interface, a prompt regarding the sensor test method; receiving, via the user interface, one or more user inputs responsive to the input prompts; identifying one or more test parameters of the sensor test method based on the one or more inputs; generating the sensor test method based on the one or more test parameters; The non-transitory computer-readable medium of claim 8 .

14. 9. The non-transitory computer-readable medium of claim 8, wherein the machine-readable instructions, when executed by the processor, further cause the processor to determine whether there is an indication that the test sensor of the materials testing machine is not operating properly based on an event record stored in memory circuitry of the computing device, the event record including a log of events occurring during setup, execution, or analysis of a test method, and the sensor test method is executed in response to a determination that there is an indication that the test sensor is not operating properly.

15. 1. A method comprising: performing a sensor testing method using a materials testing machine, the materials testing machine including a test sensor, a test actuator, and a test controller configured to control the test actuator, the sensor testing method including a method for testing the test sensor of the materials testing machine; determining, via processing circuitry of a computing device, whether the test sensor of the materials testing machine is operating properly based on test results of the sensor testing method; in response to determining that the test sensor is not operating properly, inhibiting further testing methods from being performed using the materials testing machine; and The method includes:

16. 16. The method of claim 15, wherein determining whether the test sensor is operating correctly includes determining whether a measurement value of the test sensor during execution of the sensor testing method is within a specified tolerance range of expected measurement values, and the test results include the measurement value of the test sensor during execution of the sensor testing method.

17. 16. The method of claim 15, further comprising, in response to determining that the test sensor is operating correctly, performing the sensor testing method again after a time delay, the time delay being determined based on a time parameter stored in memory circuitry of the computing device.

18. The sensor testing method includes a first sensor testing method, the test results include a first test result, the test sensor includes a first test sensor, the materials testing machine further includes a second test sensor, and the method includes: responsive to determining that the first test sensor is operating correctly, performing a second sensor testing method using the materials testing machine; determining, via the processing circuitry, whether the second test sensor of the materials testing machine is operating properly based on a second test result of the second sensor testing method; The method of claim 15 further comprising:

19. 20. The method of claim 18, further comprising, in response to determining that the second test sensor is operating correctly, sequentially performing additional sensor testing methods for each additional test sensor of the materials testing machine until each additional test sensor is determined to be operating correctly or until the additional test sensor is determined to be not operating correctly.

20. 16. The method of claim 15, further comprising: determining, via the processing circuitry, whether there is an indication that the test sensor of the materials testing machine is not operating properly based on an event record stored in the memory circuitry of the computing device, the event record including a log of events occurring during setup, execution, or analysis of a test method, and the sensor testing method being executed in response to a determination that there is an indication that the test sensor is not operating properly.

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