Valve assembly and system used to control flow rate of fluid
Patent Information
- Application Number
- JP2024209398
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2020-09-02
- Filing Date
- 2024-12-02
- Publication Date
- 2025-02-28
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 2025028093000001_ABST
Abstract
Description
[Technical field]
[0001] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 900,322, filed Sep. 13, 2019, the entire disclosure of which is incorporated herein by reference. [Background technology]
[0002] Equipment used in the manufacture of semiconductor wafers is required to operate with high precision to maintain desired production yields. In the process of producing integrated circuits, semiconductor wafers are treated with certain chemicals in a process chamber. Mass flow controllers (MFCs) are used in aligned configurations to deliver these chemicals to the process chamber in a timely and consistent manner and at consistent flow rates. This can be extremely challenging as MFCs must hold very tight accuracy, operate at multiple set points, and be constantly stopped and restarted during the wafer manufacturing process. To manage such accuracy, current state of the art MFCs are equipped with processor-based control units, numerous sensors, and advanced diagnostic systems. However, these high-end MFCs are quite expensive and may far exceed the needs of manufacturers. Summary of the Invention
[0003] For a more complete understanding of the features and advantages of the present disclosure, reference is now made to the detailed description taken in conjunction with the accompanying drawings, in which corresponding numerals in the different figures refer to corresponding parts and in which: [Brief description of the drawings]
[0004] [Figure 1A] FIG. 1A is an illustration of a valve assembly and fluid handling system that manages the proper supply of fluids for a manufacturing operation, such as a semiconductor processing manufacturing operation, in accordance with certain example embodiments. [Figure 1B]FIG. 1B is an illustration of a valve assembly and fluid handling system that manages the proper supply of fluids for a manufacturing operation, such as a semiconductor processing manufacturing operation, in accordance with certain example embodiments. [Figure 1C] FIG. 1C is an illustration of a valve assembly and fluid handling system that manages the proper supply of fluids for a manufacturing operation, such as a semiconductor processing manufacturing operation, in accordance with certain example embodiments. [Diagram 2] FIG. 2 is a flow diagram of an algorithm used to generate parametric values, communicate the parametric values, and control the flow rate of a valve assembly based on the parametric values, according to an example embodiment. [Diagram 3] FIG. 3 is a diagram of a computing machine and system application modules according to an example embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0005] Although the making and use of various embodiments of the present disclosure are discussed in detail below, it should be understood that the present disclosure provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely exemplary and do not define the scope of the present disclosure. For purposes of clarity, the present disclosure may not describe all features of an actual implementation. Of course, it will be understood that in developing any such actual embodiment, many implementation-specific decisions must be made to achieve the developer's specific goals, such as compliance with system-related and business-related constraints that vary from implementation to implementation. Moreover, it will be understood that such a development effort may be complex and time-consuming, but would be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure.
[0006] As previously mentioned, current state of the art commercial MFCs can be quite expensive and far in excess of a manufacturer's needs. Even if a particular MFC meets the needs of a particular manufacturer, that manufacturer's manufacturing facility may already have its own processor-based control units, sensors, and advanced diagnostic systems. As an example, process chambers used in etching processes to etch circuits onto semiconductor wafers use separate control units, sensors, and diagnostic systems. In these particular cases, current state of the art commercial MFCs provide hardware and functional services that are redundant, thus increasing manufacturing costs. Thus, there is a need for a valve assembly that can be integrated with a manufacturer's manufacturing operations and, using parametric variables provided by those operations, can operate at multiple set points and maintain the mass flow rate of fluids with very tight accuracy while constantly stopping and restarting during the manufacturing process.
[0007] Provided herein is a valve assembly for controlling a fluid flow rate. The valve assembly includes a valve block having an upstream reservoir, a downstream reservoir, and a valve seat for communicating a fluid from an upstream location to a downstream location. The valve assembly further includes a stand-alone valve having a movable member, a sensor chip package having at least one sensor coupled to the stand-alone valve, and a controller interface. The controller interface transmits at least one measured parametric value provided by the at least one sensor and receives a control signal used to adjust a valve stroke of the stand-alone valve. The control signal is determined based on the at least one measured parametric value.
[0008] In some embodiments, a control signal for the standalone valve is determined based on the at least one measured parametric value and the at least one other parametric value. In some embodiments, the valve assembly may also include a control unit having an interface for communicating with a controller interface of the standalone valve. The control unit may also include another interface for receiving the at least one other parametric value. The at least one other parametric value is indicative of a pressure of at least one selected from the group including at least one upstream pressure sensor positioned at an upstream location from the standalone valve and at least one downstream pressure sensor positioned at a downstream location from the standalone valve. The control unit may also generate a control signal for adjusting the valve stroke based on the at least one parametric value and the at least one other parametric value.
[0009] In some additional embodiments, the sensor chip package comprises a position sensor. The sensor chip package generates at least one parametric value indicative of at least one selected from the group including a position of the movable member and an obstruction of the non-movable member. The sensor chip package may also comprise at least one upstream pressure sensor positioned in an upstream reservoir or an upstream channel of the valve block. The sensor chip package may also comprise at least one downstream pressure sensor positioned in a downstream reservoir or a downstream channel of the valve block. The sensor chip package may also comprise a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir. The sensor chip package may also comprise a temperature sensor positioned in at least one selected from the group including an upstream reservoir, an upstream channel, a downstream reservoir, a downstream channel, and a valve seat.
[0010] In some embodiments, the sensor chip package can generate a parametric value indicative of a position of the moving member. The sensor chip package can also generate a parametric value indicative of a blockage of a non-moving member. The sensor chip package can also generate one or more parametric values indicative of pressure in at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor positioned in the valve block. The sensor chip package can also generate a parametric value indicative of heat.
[0011] In some other embodiments, the sensor chip package can generate a parametric value indicative of a position of the movable member. The sensor chip package can also generate a parametric value indicative of a blockage of the non-movable member. The sensor chip package can also generate a parametric value indicative of a pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor. The sensor chip package can also generate a parametric value indicative of a temperature of at least one selected from the group including an upstream reservoir, an upstream channel, a valve seat, a downstream reservoir, and a downstream channel.
[0012] Also provided herein is a fluid processing system for use in a manufacturing facility. The fluid processing system includes a valve block, a stand-alone valve, an upstream fluid source fluidly coupled to the stand-alone valve, a downstream process tool fluidly coupled to the stand-alone valve, and a control unit. The valve block includes an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from an upstream location to a downstream location. The stand-alone valve has a movable member, and a sensor chip package has at least one sensor coupled to the valve. The control unit includes an interface communicatively coupled to the stand-alone valve and the sensor chip package. The control unit generates a control signal used to control a stroke of the stand-alone valve based on at least one parametric value from the sensor chip package.
[0013] In some embodiments, the control unit interface is communicatively coupled to at least one selected from the group including at least one upstream pressure sensor positioned at an upstream location and at least one downstream pressure sensor positioned at a downstream location. In these embodiments, the interface generates a control signal used to control the stroke of the stand-alone valve based on at least one parametric value from the sensor chip package and at least one other parametric value indicative of pressure from the group including at least one upstream pressure sensor positioned at an upstream location from the valve block and at least one downstream pressure sensor positioned at a downstream location from the valve block.
[0014] The sensor chip package includes a position sensor. The sensor chip package generates a parametric value indicative of at least one selected from the group including a position of the movable member and an obstruction of the non-movable member. In some embodiments, the sensor chip package can also include an upstream pressure sensor positioned in an upstream reservoir of the valve block. In some embodiments, the sensor chip package can also include a downstream pressure sensor positioned in a downstream reservoir of the valve block. In some embodiments, the sensor chip package can also include a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir. In some embodiments, the sensor chip package includes a temperature sensor positioned in at least one selected from the group including an upstream reservoir, an upstream channel, a downstream reservoir, a downstream channel, and a valve seat.
[0015] The sensor chip package generates a parametric value indicative of a position of at least one selected from the group including a position of a moving member and an obstruction of a non-moving member. In some embodiments, the sensor chip package generates one or more parametric values indicative of a pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor. In some embodiments, the sensor chip package generates a parametric value indicative of a temperature of at least one selected from the group including an upstream reservoir, a valve seat, and a downstream reservoir. In some embodiments, the upstream fluid source comprises an upstream pressure sensor. In some embodiments, the downstream process tool comprises a downstream pressure sensor.
[0016] As used herein, upstream or upstream side refers to the location or side closest to the fluid source, for example, after an upstream valve or before a downstream valve in an MFC. As used herein, MFC high pressure (HP) side or HP side refers to the upstream or upstream side. As used herein, downstream or downstream side refers to the location or side furthest from the fluid source. As used herein, position predetermined value or values refers to a priori variables including a valve seat position value based on variables including a valve seat position value and a fluid flow rate. As used herein, valve seat opening refers to the instantaneous position of the valve in either a closed or open state, or any position between the closed and open states. As used herein, a volume is a reservoir of known volume used in a flow line as a location to make pressure measurements of a fluid flowing through the flow line. As used herein, the term "parametric value" refers to a variable having a parameter and a value. As used herein, a control signal refers to an encoded signal that may also be a variable.
[0017] 1A-1C, a valve assembly and fluid processing system for managing the proper supply of fluid for a manufacturing operation, such as a semiconductor processing manufacturing operation, is shown according to an example embodiment. Essentially, the fluid processing system is a third party system. The valve assembly includes a valve 10 (piezo or solenoid), a sensor chip package 12, and a valve block 14. The valve assembly may also include a control unit 20, which may be part of the fluid processing system to which the valve assembly is communicatively coupled. Additionally, the control unit 20 may be a processing unit associated with the valve assembly, or may be a processing unit provided by an integrated fluid processing system to perform a specific task. The fluid processing system includes a fluid source 16 and a process tool 18. The control unit 20, in combination with feedback from the valve assembly and the fluid processing system, controls the valve assembly to maintain a desired fluid flow rate of fluid communicated between the fluid source 16 at an upstream location and the process tool 18 at a downstream location based on the parametric values read. Additionally, any changes to the actual flow rate, which is based on the desired flow rate, are communicated to the process tool 18 in the form of at least one parametric value, such as an absolute pressure value.
[0018] The valve 10 is coupled to a valve block 14. The valve 10 includes movable members such as a stem 10A and a disc 10B. The valve block 14 includes channels including an upstream inlet channel 14A, a downstream outlet channel 14B, an upstream reservoir 14C, a valve seat 14D, and a downstream reservoir 14E. Any flow path between a fluid source 16 and a process tool 18 has a known volume and can be used by a control unit 20, along with parametric values described herein, to control the position of the stem 10A or disc 10B. The stem 10A and disc 10B respond to commands from the control unit 20A. The stroke of the valve 10 is represented by the stem 10A and disc 10B when they are fully open, fully closed, or somewhere between fully open and fully closed. The valve 10 is fully closed when the disc 10B is flush with the seat 14C. In response to an opening action, fluid flows from the upstream channel 14A into the upstream reservoir 14C, through the valve seat 14D, the downstream reservoir 14E, and the downstream outlet channel 14B at a rate determined by the degree to which the valve seat 14C is open. Obviously, the degree to which the valve seat 14C is open is based on several parametric values, such as the set point, the fluid type, the position of the movable member, the current flow rate, the temperature, and the pressure.
[0019] In one embodiment, the valve assembly includes only a single valve 10 and a sensor chip package 12, and the sensor chip package 12 has a position sensor. In another embodiment, the sensor chip package 12 includes a position sensor and at least one selected from the group including an absolute pressure sensor and a differential pressure sensor. In other words, the sensor chip package 12 can include a position sensor and at least one absolute pressure sensor or at least one differential pressure sensor, or can include a position sensor and a combination of one or more absolute pressure sensors and one or more differential pressure sensors. In some embodiments, the sensor chip package 12 can include a differential pressure (DP) sensor or a temperature sensor, or both. These sensors can be positioned in any flow path of the valve block 14, such as the inlet channel 14A, the outlet channel 14B, the upstream reservoir 14C, the valve seat 14D, and the downstream reservoir 14E.
[0020] In FIG. 1A, the manufacturer's fluid processing system includes a universal gas box as the fluid source 16, and the process tool 18 includes a process chamber 18A and a gas manifold 18B. In FIG. 1B, the manufacturer's fluid processing system includes a fluid source 16 from an upstream process, and the process tool 18 includes a process chamber 18A. In this embodiment, the process gas is supplied to the process chamber 18A by positioning a valve between the universal gas box and the process chamber near the lid of the chamber. In FIG. 1C, the fluid source 16 is helium, and the process tool 18 includes a wafer chuck 18C. In the embodiments of FIG. 1A, FIG. 1B, and FIG. 1C, a pressure sensor 30 is positioned upstream of the valve assembly to measure the pressure in volume 1 (V1) and generate a parametric value P1. In addition to this embodiment, a pressure sensor 32 is positioned downstream of the valve assembly to measure the pressure in volume 2 (V2) and generate a parametric value P2. However, depending on the configuration of the valve assembly, the pressure sensors 30 and 32 may not be required. 1A and 1C, sensors integrated within the manufacturer's fluid source 16 and process tool 18 are used to measure pressure and generate parametric values P0 and P3, respectively. In the embodiment of FIG. 1B, another sensor 34 is positioned between the fluid source 16 and V1 and measures pressure and generates parametric value P0. Pressure sensors 30 and 32 can be gauge sensors, differential pressure sensors, or absolute pressure sensors, or any combination thereof.
[0021] In addition to each embodiment, the sensor chip package 12 communicates the position of the stem 10A and / or disc 10B, or other movable flow restricting mechanism, such as a ball on a valve seat, to the control unit 20 for reading and processing. A priori information describing the stroke of the stem 10A and / or disc 10B, such as information describing position 0 being the valve closed, information describing position 10 being fully open, and various variables describing positions in between, can be stored in a memory or hard disk associated with the control unit 20 and correlated with the stored flow values. In some of these embodiments, the sensor chip package 12 includes, in addition to the position sensor, an upstream absolute pressure sensor, for example, positioned in the upstream inlet channel 14A to measure absolute pressure and communicate a parametric value P1. In some of these embodiments, the sensor chip package 12 includes, in addition to the position sensor, an upstream absolute pressure sensor, for example, positioned in the downstream outlet channel 14B to measure absolute pressure and communicate a parametric value P2. In some of these embodiments, the sensor chip package 12 may include, in addition to the position sensor, both an upstream absolute pressure sensor and a downstream absolute pressure sensor that measure absolute pressure and communicate the parametric values P1 and P2. In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a differential pressure sensor that measures differential pressure (DP). In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a differential pressure sensor that measures pressure and generates the parametric values DP and P1 or P2 or both, and one or both of the upstream absolute pressure sensor and the downstream absolute pressure sensor. In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a temperature sensor that measures the temperature of the orifice and the reservoir 14C. In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a temperature sensor that measures the temperature of the orifice and the reservoir 14C. In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a temperature sensor.In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a temperature sensor and at least one selected from the group including a differential pressure sensor, an upstream absolute pressure sensor, and a downstream absolute pressure sensor. Obviously, the sensor chip package 12 included with the valve assembly may depend on the sensor configuration of the manufacturer's fluid processing system.
[0022] In each of the above-described embodiments, the position of the valve stem 10A and / or valve disc 10B and the parametric values of absolute pressure P0-P3 are communicated to and read by the control unit 20 to control the operation of the valve assembly. In some embodiments, the position of the valve stem 10A and / or valve disc 10B and the parametric values of absolute pressure P0-P3 and at least one selected from the group including the parametric values of DP and temperature are communicated to and read by the control unit 20 to control the operation of the valve assembly. Additionally, if P3 is updated, the updated P3 is provided to the process tool 18 used to adjust the operation of either the process chamber 18A or the wafer chuck 18B. In some embodiments, the valve assembly can be included in the process tool 18, for example, in the gas manifold 18B or on top of the process chamber 18A.
[0023] 2, a flow diagram of an algorithm used to generate, communicate, and control flow through a valve assembly based on a parametric value is shown, according to an example embodiment. The algorithm is generally shown as 60. The algorithm 60 begins at block 62, where the algorithm generates at least one parametric value in a valve assembly. The generated parametric value is indicative of a position of the stem 10A or disc 10B, or both. In addition to the parametric value indicative of the position of the stem 10A or disc 10B, the algorithm may generate at least one other parametric value indicative of absolute pressure from at least one selected from the group including an upstream absolute pressure sensor and at least one downstream absolute pressure sensor. The other parametric values generated may include DP and temperature.
[0024] In one embodiment, the fluid treatment system can include one or more upstream absolute pressure sensors positioned at one or more upstream locations from the valve assembly. One or more downstream absolute pressure sensors can be positioned at downstream locations from the valve assembly. Essentially, the absolute pressure sensors measure pressure and algorithm 60 generates P0 and P3. In some embodiments, depending on the manufacturer's equipment, sensor 30 or sensor 32, or both, are used to measure pressure and algorithm 60 generates P1 and P2 in addition to P0 and P3.
[0025] In one embodiment, the sensor chip package 12 can include at least one selected from the group including an upstream absolute pressure sensor positioned in the upstream inlet channel 14A of the valve block 14 and a downstream absolute pressure sensor positioned in the downstream outlet channel 14B of the valve block 14. In addition, the sensor chip package 12 of the valve 10 can include a differential pressure sensor to measure a differential pressure. Furthermore, the sensor chip package 12 of the valve 10 can include a temperature sensor to measure a temperature. More specifically, a sensor chip package 12 having a particular sensor configuration can be coupled to the valve 10 based on the particular sensor configuration of the fluid processing system.
[0026] The algorithm 60 generates at least one selected from the group including parametric values indicative of the position of the stem 10A or disc 10B, parametric values P0 and P3 indicative of absolute pressure at the fluid source 16 and process tool 18, and parametric values P1 and P2 indicative of upstream and downstream absolute pressures at locations within the valve assembly or external to the valve assembly. In some embodiments, a parametric value indicative of differential pressure (DP) is generated. In some embodiments, a parametric value indicative of temperature is generated. In some embodiments, parametric values of DP and temperature are generated.
[0027] In block 64, the algorithm 60 communicates the parametric values generated from the sensor chip package 12 and other sensors from the fluid processing system for further processing. In block 66, the communicated parametric values, including the position of the stem 10A or disc 10B, absolute pressure, and optional differential pressure and temperature, are read, processed, and used, along with the stored a priori information, to determine a desired flow rate. This desired flow rate may be based on the set point, fluid type, position of the stem 10A and / or disc 10B, and the current flow rate, temperature, and pressure (absolute and differential). In block 68, the position of the stem 10A and disc 10B is adjusted using the determined flow rate and stored correlation variables representing various positions of the stem 10A and disc 10B. In block 70, at least one of the parametric values, such as any adjustment to P3, is communicated to the process tool 18.
[0028] Referring now to FIG. 3, a computing machine 100 and a system application module 200 are shown according to an example embodiment. The computing machine 100 may correspond to any of a variety of computers, mobile devices, laptop computers, Internet of Things (IoT), servers, embedded systems, or computing systems presented herein. The module 200 may include one or more hardware or software elements, such as other OS applications and user and kernel space applications, designed to facilitate the computing machine 100 to execute the various methods and processing functions presented herein. The computing machine 100 may include various internal or attached components, such as a processor 110, a system bus 120, a system memory 130, a storage medium 140, an input / output interface 150, a network 170, such as a network interface 160 for communicating with a cellular / GPS, Bluetooth, Wi-Fi, or Devicenet, EtherCAT, Analog, RS485, etc., and one or more sensors 180.
[0029] The computing machine may be implemented as a conventional computer system, an embedded controller, a laptop, a server, a mobile device, a smart phone, a wearable computer, a customized machine, any other hardware platform, or any combination or plurality of them. The computing machine may be a distributed system configured to function using multiple computing machines interconnected via a data network or bus system.
[0030] The processor 110 can be designed to execute code instructions to perform the operations and functions described herein, manage request flow and address mapping, perform calculations and generate commands. The processor 110 can be configured to monitor and control the operation of components in the computing machine. The processor 110 can be a general purpose processor, a processor core, a multiprocessor, a reconfigurable processor, a microcontroller, a digital signal processor ("DSP"), an application specific integrated circuit ("ASIC"), a controller, a state machine, gate logic, a discrete hardware component, any other processing unit, or any combination or plurality thereof. The processor 110 can be a single processing unit, multiple processing units, a single processing core, multiple processing cores, a dedicated processing core, a coprocessor, or any combination thereof. According to certain embodiments, the processor 110 can be a software-based or hardware-based virtual computing machine executing in one or more other computing machines, along with other components of the computing machine 100.
[0031] The system memory 130 may include non-volatile memory, such as read-only memory ("ROM"), programmable read-only memory ("PROM"), erasable programmable read-only memory ("EPROM"), flash memory, or any other device capable of storing program instructions or data with or without the application of power. The system memory 130 may also include volatile memory, such as random access memory ("RAM"), static random access memory ("SRAM"), dynamic random access memory ("DRAM"), and synchronous dynamic random access memory ("SDRAM"). Other types of RAM may also be used to implement the system memory 130. The system memory 130 may be implemented using a single memory module or multiple memory modules. Although the system memory 130 is shown as being part of the computing machine, those skilled in the art will understand that the system memory 130 may be separate from the computing machine 100 without departing from the scope of the subject technology. It should also be understood that the system memory 130 may include or operate in conjunction with a non-volatile storage device, such as the storage medium 140.
[0032] The storage medium 140 may include a hard disk, a floppy disk, a compact disk read-only memory ("CD-ROM"), a digital versatile disk ("DVD"), a Blu-ray disk, a magnetic tape, a flash memory, other non-volatile memory devices, a solid-state drive ("SSD"), any magnetic storage device, any optical storage device, any electrical storage device, any semiconductor storage device, any physically based storage device, any other data storage device, or any combination or plurality of such. The storage medium 140 may store one or more operating systems, application programs and program modules, data, or any other information. The storage medium 140 may be part of a computing machine or may be connected to a computing machine. The storage medium 140 may also be part of one or more other computing machines in communication with the computing machine, such as a server, a database server, cloud storage, network attached storage, etc.
[0033] The application module 200 and other OS application modules may include one or more hardware or software elements configured to facilitate a computing machine to execute various methods and processing functions presented herein. The application module 200 and other OS application modules may include one or more algorithms or sequences of instructions stored as software or firmware in association with the system memory 130, the storage medium 140, or both. Thus, the storage medium 140 may represent an example of a machine or computer readable medium that may store instructions or code for execution by the processor 110. A machine or computer readable medium may generally refer to any medium or media used to provide instructions to the processor 110. Such machine or computer readable media associated with the application module 200 and other OS application modules may include computer software products. It should be understood that the computer software products including the application module 200 and other OS application modules may also be associated with one or more processes or methods of delivering the application module 200 and other OS application modules to a computing machine via a network, any signal-carrying medium, or any other communication or delivery technology. Application module 200 and other OS application modules may also include hardware circuitry or information for configuring hardware circuitry, such as microcode, or configuration information for an FPGA or other PLD. In one example embodiment, application module 200 and other OS application modules may include algorithms capable of performing the functional operations described by the flowcharts (modes of operation) of the computer system presented herein.
[0034] Input / output ("I / O") interface 150 can be configured to couple to one or more external devices, receive data from one or more external devices, and transmit data to one or more external devices. Such external devices, along with various internal devices, may also be known as peripheral devices. I / O interface 150 can include both electrical and physical connections to couple various peripheral devices to computing machine or processor 110. I / O interface 150 can be configured to communicate data, address, and control signals between the peripheral devices and computing machine or processor 110. I / O interface 150 can be configured to implement any standard interface, such as Small Computer System Interface ("SCSI"), Serial Attached SCSI ("SAS"), Fibre Channel, Peripheral Component Interconnect ("PCI"), PCI Express (PCIe), serial bus, parallel bus, Advanced Technology Attachment ("ATA"), Serial ATA ("SATA"), Universal Serial Bus ("USB"), Thunderbolt, FireWire, various video buses, etc. I / O interface 150 may be configured to implement only one interface or bus technology. Alternatively, I / O interface 150 may be configured to implement multiple interface or bus technologies. I / O interface 150 may be configured to operate as part of, as all of, or in conjunction with system bus 120. I / O interface 150 may include one or more buffers for buffering transmissions between one or more external devices, internal devices, computing machines, or processors 110.
[0035] I / O interface 150 can couple the computing machine to a variety of input devices, including a mouse, touch screen, scanner, electronic digitizer, sensor, receiver, touch pad, track ball, camera, microphone, keyboard, any other pointing device, or any combination thereof. I / O interface 150 can couple the computing machine to a variety of output devices, including video displays, speakers, printers, projectors, haptic feedback devices, automation controls, robotic components, actuators, motors, fans, solenoids, valves, pumps, transmitters, signalers, lights, etc.
[0036] The computing machine 100 may operate in a networked environment, with logical connections through the NIC 160 to one or more other systems or computing machines over a network. The network may include a wide area network (WAN), a local area network (LAN), an intranet, the Internet, a wireless access network, a wired network, a mobile network, a telephone network, an optical network, or a combination thereof. The network may be a packet-switched network, a circuit-switched network of any topology and may use any communication protocol. The communication links in the network may involve a variety of digital or analog communication media, such as fiber optic cables, free-space optics, wave guides, electrical conductors, wireless links, antennas, radio frequency communications, and the like.
[0037] The one or more sensors 180 can be a position sensor and a pressure sensor. The pressure sensor can be an absolute pressure (P) sensor or a differential pressure (DP) sensor. The position sensor can be a capacitive sensor, an optical sensor, a strain gauge sensor, or a magnetic sensor. The sensor 180 can be a conventional sensor or a semiconductor-based sensor.
[0038] The processor 110 may be connected to other elements of a computing machine or to various peripherals discussed herein via a system bus 120. It should be understood that the system bus 120 may be internal to the processor 110, external to the processor 110, or both. According to some embodiments, the processor 110, other elements of the computing machine, or any of the various peripherals discussed herein may be incorporated into a single device, such as a system on a chip ("SOC"), system on a package ("SOP"), or ASIC device.
[0039] The embodiments may include a computer program that embodies the functions described and illustrated herein, the computer program being implemented in a computer system that includes instructions stored in a machine-readable medium and a processor that executes the instructions. However, it should be apparent that there may be many different ways to implement the embodiments in computer programming, and the embodiments should not be construed as being limited to any one set of computer program instructions unless otherwise disclosed in the exemplary embodiments. Furthermore, a skilled programmer would be able to write such a computer program to implement one of the disclosed embodiments based on the accompanying flowcharts, algorithms, and related descriptions in the body of the application. Thus, disclosure of a particular set of program code instructions is not deemed necessary to fully understand how to make and use the embodiments. Furthermore, one skilled in the art would understand that one or more aspects of the embodiments described herein may be performed by hardware, software, or a combination thereof, such that they may be embodied in one or more computing systems. Furthermore, any reference to a computer-executed act should not be construed as being performed by a single computer, since two or more computers may perform the act.
[0040] The example embodiments described herein can be used with computer hardware and software to perform the methods and processing functions described above. The systems, methods and procedures described herein can be embodied in a programmable computer, computer executable software, or digital circuitry. The software can be stored on a computer readable medium. For example, computer readable media can include floppy disks, RAM, ROM, hard disks, removable media, flash memory, memory sticks, optical media, magneto-optical media, CD-ROMs, and the like. Digital circuitry can include integrated circuits, gate arrays, building block logic, field programmable gate arrays (FPGAs), and the like.
[0041] The example systems, methods, and acts described in the embodiments presented above are exemplary, and in alternative embodiments, certain acts may be performed in different orders, in parallel with one another, omitted entirely, and / or combined between different example embodiments, and / or certain additional acts may be performed, without departing from the scope and spirit of the various embodiments. Accordingly, such alternative embodiments are included in the description herein.
[0042] As used herein, the singular forms "a", "an" and "the" are intended to include the plural, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising" as used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. As used herein, phrases such as "between X and Y" and "between about X and Y" should be interpreted to include X and Y. As used herein, phrases such as "between about X and Y" mean "between about X and about Y." As used herein, phrases such as "from about X to Y" mean "from about X to about Y."
[0043] As used herein, "hardware" may include a combination of discrete components, an integrated circuit, an application specific integrated circuit, a field programmable gate array, or other suitable hardware. As used herein, "software" may include one or more objects, agents, threads, lines of code, subroutines, separate software applications, two or more lines of code or other suitable software structures operating in one or more processors (wherein the processor may include one or more microcomputers or other suitable data processing units, memory devices, input / output devices, displays, data input devices such as keyboards or mice, peripherals such as printers and speakers, associated drivers, control cards, power supplies, network devices, docking station devices, or other suitable devices operating under the control of a software system with a processor or other devices), two or more software applications, or other suitable software structures. In one exemplary embodiment, the software may include one or more lines of code or other suitable software structures operating in a general-purpose software application, such as an operating system, and one or more lines of code or other suitable software structures operating in a dedicated software application. As used herein, "couple" and cognate terms such as "couples" and "coupled" may include a physical connection (such as through copper conductors), a virtual connection (such as through randomly assigned memory locations in a data memory device), a logical connection (such as through logic gates in a semiconductor device), any other suitable connection, or a suitable combination of such connections.The term "data" may refer to any suitable structure for using, transporting, or storing data, such as a data field, a data buffer, a data message having a data value and sender / recipient address data, a control message having a data value and one or more operators that cause a receiving system or component to perform some function with the data, or other suitable hardware or software component for the electronic processing of data.
[0044] Generally, a software system is a system that runs on a processor to perform a given function in response to a given data field. For example, a system can be defined by the function that the system performs and the data field on which the system performs the function. As used herein, a NAME system (where NAME is typically the name of the generic function performed by the system) refers to a software system that runs on a processor and is configured to perform a disclosed function on a disclosed data field. Unless a specific algorithm is disclosed, any suitable algorithm known to one of ordinary skill in the art to perform a function with the associated data field is contemplated as being within the scope of this disclosure. For example, a message system that generates a message including a sender address field, a recipient address field, and a message field includes software operating on a processor that can obtain the sender address field, the recipient address field, and the message field from a suitable system or device of the processor, such as a buffer device or system, assemble the sender address field, the recipient address field, and the message field into a suitable electronic message format (such as an email message, a TCP / IP message, or any other suitable message format having sender address fields, recipient address fields, and message fields), and transmit the electronic message using the electronic messaging system and device of the processor over a communication medium, such as a network. One of ordinary skill in the art will be able to provide specific encoding for a particular application based on the above disclosure, which is intended to illustrate exemplary embodiments of the present disclosure, but is not intended to provide guidance to persons other than those skilled in the art, such as persons unfamiliar with programming in a suitable programming language or with processors.Specific algorithms for performing certain functions may be provided in flowchart form or other suitable format, and data fields and associated functions may be shown in an exemplary sequence of operations, which sequence may be rearranged as suitable and is not intended as limiting unless expressly stated to be limiting.
[0045] As used herein, the singular forms "a", "an" and "the" are intended to include the plural, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising" as used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. As used herein, phrases such as "between X and Y" and "between about X and Y" should be interpreted to include X and Y. As used herein, phrases such as "between about X and Y" mean "between about X and about Y." As used herein, phrases such as "from about X to Y" mean "from about X to about Y."
[0046] The above disclosed embodiments are presented for the purpose of illustration and to enable those skilled in the art to practice the present disclosure, but the present disclosure is not intended to be exhaustive or limited to the disclosed forms. Many insubstantial modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the present disclosure. The claims are intended to broadly encompass the disclosed embodiments and any such modifications. Furthermore, the following clauses represent further embodiments of the present disclosure and should be considered to be within the scope of the present disclosure.
[0047] Article 1. a valve block having an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from the upstream location to the downstream location; a stand-alone valve having a moveable member; a sensor chip package having at least one sensor coupled to a stand-alone valve; a controller interface that transmits at least one measured parametric value provided by the at least one sensor and receives a control signal used to adjust a valve stroke of the stand-alone valve, the control signal being determined based on the at least one measured parametric value; and A valve assembly for controlling a fluid flow comprising:
[0048] Clause 2. The valve assembly of clause 1, wherein the control signal for the stand-alone valve is determined based on at least one measured parametric value and at least one other parametric value.
[0049] Clause 3. The method further comprises a control unit having an interface for communicating with the controller interface of the stand-alone valve; the control unit has another interface for receiving at least one other parametric value, the at least one other parametric value being indicative of at least one pressure selected from the group including at least one upstream pressure sensor positioned at an upstream position from the standalone valve and at least one downstream pressure sensor positioned at a downstream position from the standalone valve; 13. The valve assembly of claim 1, wherein the control unit generates a control signal that effects adjustment of the valve stroke based on the at least one parametric value and the at least one other parametric value.
[0050] Clause 4. The valve assembly of clause 1, wherein the sensor chip package comprises a position sensor.
[0051] Clause 5. The valve assembly of clause 4, wherein the sensor chip package generates at least one parametric value indicative of at least one selected from the group consisting of a position of the moving member and a disturbance of the non-moving member.
[0052] Article 6. The sensor chip package is At least one selected from the group including: an upstream pressure sensor positioned in an upstream reservoir or upstream channel of the valve block; a downstream pressure sensor positioned in a downstream reservoir or downstream channel of the valve block; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and a temperature sensor positioned in at least one selected from the group including the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and the valve seat; 5. The valve assembly of claim 4, further comprising:
[0053] Article 7. The sensor chip package is a position of at least one selected from the group consisting of a position of a moving member and a blockage of a non-moving member; a pressure of at least one selected from the group consisting of an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor; 7. The valve assembly of claim 6, further comprising:
[0054] Article 8. The sensor chip package is a position of at least one selected from the group consisting of a position of a moving member and a blockage of a non-moving member; a pressure of at least one selected from the group consisting of an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor; a temperature of at least one selected from the group including an upstream reservoir, a valve seat, and a downstream reservoir; 7. The valve assembly of claim 6, further comprising:
[0055] Article 9. a valve block having an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from the upstream location to the downstream location; a stand-alone valve having a moveable member; a sensor chip package having at least one sensor coupled to the valve; an upstream fluid source fluidly coupled to the stand-alone valve; a downstream process tool fluidly coupled to the stand-alone valve; a control unit having an interface communicatively coupled to the stand-alone valve and sensor chip package; Equipped with A fluid handling system for use in a manufacturing facility, wherein the control unit generates a control signal used to control the stroke of a stand-alone valve based on at least one parametric value from the sensor chip package.
[0056] Clause 10. The interface is communicatively coupled to at least one selected from the group including at least one upstream pressure sensor positioned at an upstream location and at least one downstream pressure sensor positioned at a downstream location; The fluid processing system of claim 9, wherein the interface generates a control signal used to control the stroke of the stand-alone valve based on at least one parametric value from the sensor chip package and at least one other parametric value from a group including at least one upstream pressure sensor positioned at an upstream position from the valve block and at least one downstream pressure sensor positioned at a downstream position from the valve block.
[0057] Clause 11. The fluid processing system of clause 9, wherein the sensor chip package comprises a position sensor.
[0058] Clause 12. The fluid handling system of clause 11, wherein the sensor chip package generates at least one parametric value indicative of at least one selected from the group consisting of a position of a moving member and a disturbance of a non-moving member.
[0059] Article 13. The sensor chip package is at least one selected from the group including an upstream pressure sensor positioned in an upstream reservoir of the valve block, a downstream pressure sensor positioned in a downstream reservoir of the valve block, a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir, and a temperature sensor positioned in at least one selected from the group including the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and the valve seat; 13. The fluid treatment system of claim 12, further comprising:
[0060] Article 14. The sensor chip package is a position of at least one selected from the group consisting of a position of a moving member and a blockage of a non-moving member; a pressure of at least one selected from the group consisting of an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor; 14. The fluid treatment system of claim 13, further comprising:
[0061] Article 15. The sensor chip package is a position of at least one selected from the group consisting of a position of a moving member and a blockage of a non-moving member; a pressure of at least one selected from the group consisting of an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor; a temperature of at least one selected from the group including an upstream reservoir, a valve seat, and a downstream reservoir; 14. The fluid treatment system of claim 13, further comprising:
[0062] Clause 16. The fluid treatment system of clause 9, wherein the upstream fluid source comprises at least one upstream pressure sensor.
[0063] Clause 17. The fluid processing system of clause 9, wherein the downstream process tool comprises a downstream pressure sensor.
[0064] Clause 18. A method of using a valve assembly to control a fluid flow rate in a fluid processing system, comprising: generating a first parametric value indicative of a position of a moveable member of a stand-alone valve in a valve assembly; generating a second parametric value indicative of absolute pressure upstream of the valve assembly; generating a third parametric value indicative of a pressure at a process tool downstream of the valve assembly; adjusting the position of the valve based on the first parametric value, the second parametric value, the third parametric value, and at least one other parametric value selected from the group including a set point, a current fluid flow rate, a fluid type, at least one other pressure, a temperature, and a differential pressure; A method comprising:
[0065] Article 19. generating another parametric value indicative of pressure from an upstream location between the fluid source and the valve assembly; generating another parametric value indicative of pressure from an upstream location between the process tool and the valve assembly; 19. The method of claim 18, further comprising:
[0066] Article 20. generating another parametric value indicative of pressure in an upstream inlet channel of the valve assembly; generating another parametric value indicative of pressure in a downstream outlet channel of the valve assembly; 19. The method of claim 18, further comprising:
Claims
1. a valve block having an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from the upstream location to the downstream location; a stand-alone valve having a moveable member; a sensor chip package having at least one sensor coupled to the stand-alone valve; a controller interface that transmits at least one measured parametric value provided by the at least one sensor and receives a control signal used to adjust a valve stroke of the stand-alone valve, the control signal being determined based on the at least one measured parametric value; and A valve assembly for controlling a fluid flow comprising:
2. The valve assembly of claim 1 , wherein the control signal for the stand-alone valve is determined based on the at least one measured parametric value and at least one other parametric value.
3. a control unit having an interface in communication with the controller interface of the stand-alone valve; the control unit has another interface for receiving at least one other parametric value, the at least one other parametric value being indicative of at least one pressure selected from the group consisting of at least one upstream pressure sensor positioned at an upstream position from the stand-alone valve and at least one downstream pressure sensor positioned at a downstream position from the stand-alone valve; 2. The valve assembly of claim 1, wherein the control unit generates the control signal to effect a valve stroke adjustment based on the at least one parametric value and the at least one other parametric value.
4. The valve assembly of claim 1 , wherein the sensor chip package comprises a position sensor.
5. 5. The valve assembly of claim 4, wherein the sensor chip package generates the at least one parametric value indicative of at least one selected from the group consisting of a position of the moveable member and a disturbance of a non-movable member.
6. The sensor chip package includes: at least one selected from the group including: an upstream pressure sensor positioned in an upstream reservoir or upstream channel of the valve block; a downstream pressure sensor positioned in a downstream reservoir or downstream channel of the valve block; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and a temperature sensor positioned in at least one selected from the group including the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and the valve seat; The valve assembly of claim 4 further comprising:
7. The sensor chip package includes: a position of at least one selected from the group consisting of a position of the movable member and a blockage of a non-movable member; a pressure of at least one selected from the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; 7. The valve assembly of claim 6, wherein the at least one parametric value is indicative of:
8. The sensor chip package includes: a position of at least one selected from the group consisting of a position of the movable member and a blockage of a non-movable member; a pressure of at least one selected from the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; a temperature of at least one selected from the group consisting of the upstream reservoir, the upstream channel, the valve seat, the downstream reservoir, and the downstream channel; 7. The valve assembly of claim 6, wherein the at least one parametric value is indicative of:
9. a valve block having an upstream reservoir, a downstream reservoir, and a valve seat for communicating fluid from the upstream location to the downstream location; a stand-alone valve having a moveable member; a sensor chip package having at least one sensor coupled to the stand-alone valve; an upstream fluid source fluidly coupled to the stand-alone valve; a downstream process tool fluidly coupled to the stand-alone valve; a control unit having an interface communicatively coupled to the stand-alone valve and the sensor chip package; Equipped with A fluid processing system for use in a manufacturing facility, wherein the control unit generates a control signal used to control a stroke of the stand-alone valve based on at least one parametric value from the sensor chip package.
10. the interface is communicatively coupled to at least one selected from the group consisting of at least one upstream pressure sensor positioned at an upstream location and at least one downstream pressure sensor positioned at a downstream location; 10. The fluid treatment system of claim 9, wherein the interface generates the control signal used to control the stroke of the standalone valve based on the at least one parametric value from the sensor chip package and at least one other parametric value from a group including the at least one upstream pressure sensor positioned at an upstream position from the valve block and the at least one downstream pressure sensor positioned at a downstream position from the valve block.
11. The fluid treatment system of claim 9 , wherein the sensor chip package comprises a position sensor.
12. 12. The fluid treatment system of claim 11, wherein the sensor chip package generates the at least one parametric value indicative of at least one selected from the group consisting of a position of the moveable member and a disturbance of a non-movable member.
13. The sensor chip package includes: at least one selected from the group including: an upstream pressure sensor positioned in an upstream reservoir of the valve block; a downstream pressure sensor positioned in a downstream reservoir of the valve block; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and a temperature sensor positioned in at least one selected from the group including the upstream reservoir, the upstream channel, the downstream reservoir, the downstream channel, and the valve seat; The fluid treatment system of claim 12 further comprising:
14. The sensor chip package includes: a position of at least one selected from the group consisting of a position of the movable member and a blockage of a non-movable member; a pressure of at least one selected from the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; The fluid treatment system of claim 13 , further comprising:
15. The sensor chip package includes: a position of at least one selected from the group consisting of a position of the movable member and a blockage of a non-movable member; a pressure of at least one selected from the group consisting of the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor; a temperature of at least one selected from the group consisting of the upstream reservoir, the valve seat, and the downstream reservoir; and The fluid treatment system of claim 13 , further comprising:
16. The fluid treatment system of claim 9 , wherein the upstream fluid source comprises an upstream pressure sensor.
17. The fluid treatment system of claim 9 , wherein the downstream process tool comprises a downstream pressure sensor.
18. 1. A method of using a valve assembly to control a fluid flow in a fluid processing system, comprising: generating a first parametric value indicative of a position of a moveable member of a stand-alone valve in the valve assembly; generating a second parametric value indicative of absolute pressure upstream of the valve assembly; generating a third parametric value indicative of a pressure at a process tool downstream of the valve assembly; adjusting a valve position based on the first parametric value, the second parametric value, the third parametric value, and at least one other parametric value selected from the group including a set point, a current fluid flow rate, a fluid type, at least one other pressure, a temperature, and a differential pressure; A method comprising:
19. generating another parametric value indicative of pressure from an upstream location between a fluid source and the valve assembly; generating another parametric value indicative of pressure from an upstream location between the process tool and the valve assembly; 20. The method of claim 18, further comprising:
20. generating another parametric value indicative of pressure in an upstream inlet channel of the valve assembly; generating another parametric value indicative of pressure in a downstream outlet channel of the valve assembly; 20. The method of claim 18, further comprising: