Substrate transport device and substrate transport method

Abstract

To explain a substrate transport device and a substrate transport method, capable of appropriately transporting a substrate by a transportation arm even if the substrate is a non-flat substrate with a warp.SOLUTION: A substrate transport device comprises a transportation arm. The transportation arm contains: a base part; at least one arm part that is connected to the base part so as to be extended from the base part, and is extended so as to surround an outer periphery of a substrate; and a plurality of suction parts that are provided to the at least one arm part, and contains a suction port that sucks a peripheral edge part on a back surface of the substrate; and a plurality of suction passages that are provided to the at least one arm part. The plurality of suction parts contain: a first suction part group containing a first suction part and a second suction part; and a second suction part group containing a third suction part and a fourth suction part. The plurality of suction passages contain: a first suction path connected to the suction port of the first and second suction parts; and a second suction path connected to the suction port of the third and fourth suction parts.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a substrate transport apparatus and a substrate transport method. [Background technology]

[0002] Patent Document 1 discloses a substrate transport device provided in a substrate processing apparatus for processing substrates such as semiconductor wafers. The substrate transport device is configured to be movable between different processing modules, for example, to transport a substrate from one processing module to another processing module in the substrate processing apparatus. The substrate transport device is configured to be movable between a carrier and a processing module, for example, to take out a substrate from a carrier that stores multiple substrates and transport the substrate to a processing module, and to return a substrate that has been processed in the processing module to the carrier. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-183704 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure describes a substrate transport apparatus and a substrate transport method that are capable of appropriately transporting a substrate using a transport arm, even if the substrate is not flat due to warping or the like. [Means for solving the problem]

[0005] An example of a substrate transport device includes a transport arm, a drive unit for moving the transport arm, and a control unit configured to control the drive unit. The transport arm includes a base unit, at least one arm unit connected to the base unit so as to extend from the base unit and extend to surround the outer periphery of the substrate, a plurality of suction units provided on the at least one arm unit and each including a suction port for suctioning the peripheral portion on the rear surface of the substrate, and a plurality of suction passages provided on the at least one arm unit. The plurality of suction units include a first suction unit group including a first suction unit and a second suction unit, and a second suction unit group including a third suction unit and a fourth suction unit. The plurality of suction passages include a first suction passage connected to the suction ports of the first suction unit and the second suction unit, and a second suction passage connected to the suction ports of the third suction unit and the fourth suction unit. Effect of the Invention

[0006] According to the substrate transport apparatus and substrate transport method of the present disclosure, even if the substrate is not flat due to warping or the like, the substrate can be appropriately transported by the transport arm. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view that illustrates an example of a substrate processing system. [Diagram 2] FIG. 2 is a side view that diagrammatically illustrates an example of a substrate processing system. [Diagram 3] FIG. 3 is a perspective view that illustrates a schematic example of a processing station. [Figure 4] FIG. 4 is a perspective view showing an example of a transfer arm. [Diagram 5] FIG. 5 is a plan view showing the upper surface side of the transfer arm illustrated in FIG. [Figure 6] FIG. 6 is a plan view showing the lower surface side of the transport arm illustrated in FIG. [Figure 7] FIG. 7 is a perspective view showing an example of a suction pad provided on the transport arm illustrated in FIG. [Figure 8]FIG. 8 is a cross-sectional view showing the suction pad of FIG. [Figure 9] FIG. 9 is a block diagram showing an example of a main part of a substrate processing system. [Figure 10] FIG. 10 is a schematic diagram illustrating an example of a hardware configuration of the controller. [Figure 11] FIG. 11 is a flowchart illustrating an example of a substrate transport procedure performed by the substrate transport device. [Figure 12] FIG. 12 is a plan view that illustrates a schematic diagram of another example of a processing station. [Figure 13] FIG. 13 is a schematic side view of the processing station illustrated in FIG. [Figure 14] FIG. 14 is a perspective view mainly showing a support column of a substrate transport device provided in the processing station illustrated in FIG. [Figure 15] FIG. 15 is a plan view showing another example of the transfer arm. [Figure 16] FIG. 16 is a plan view showing another example of the transfer arm. [Figure 17] FIG. 17 is a plan view showing another example of the transfer arm. [Figure 18] FIG. 18 is a plan view showing another example of the transfer arm. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In the following description, the same elements or elements having the same functions are designated by the same reference numerals, and duplicated descriptions are omitted. In this specification, when referring to the top, bottom, right, and left of a figure, the directions of the reference numerals in the figure are used as the reference. Some drawings show an orthogonal coordinate system defined by the X-axis, Y-axis, and Z-axis. In this specification, the X-axis and Y-axis correspond to the horizontal direction, and the Z-axis corresponds to the up-down direction.

[0009] [Substrate processing system] 1 and 2, a substrate processing system 1 (substrate processing apparatus) configured to process a substrate W will be described. The substrate processing system 1 may be configured to perform various processes, such as a photolithography process, a cleaning process, and an etching process, on the substrate W. The photolithography process may include, for example, a process of forming a photosensitive thin film (e.g., a resist film) on the surface of the substrate W, and a process of developing the photosensitive thin film after exposure.

[0010] The substrate W may be disk-shaped or may be a plate-shaped other than a circle, such as a polygon. The substrate W may have a cutout portion cut out of a portion. The cutout portion may be, for example, a notch (a U-shaped, V-shaped, or other groove) or a linear portion extending linearly (so-called orientation flat). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, a FPD (Flat Panel Display) substrate, or any other type of substrate.

[0011] The substrate processing system 1 includes a cassette station 2 into which a cassette 5 capable of accommodating a plurality of substrates W is loaded and unloaded, and a processing station 3 equipped with a plurality of various processing devices that perform predetermined processing on the substrates W. The substrate processing system 1 includes an interface station 4 that transfers the substrates W between the cassette station 2 and an exposure device (not shown). The exposure device may be adjacent to the interface station 4 on the opposite side to the processing station 3. As illustrated in FIGS. 1 and 2, two processing stations 3 may be installed between the cassette station 2 and the interface station 4. One processing station 3 or three or more processing stations 3 may be installed between the cassette station 2 and the interface station 4.

[0012] The cassette station 2 includes a plurality of cassette mounting stages 21 and substrate transport devices 2b and 2c. The plurality of cassette mounting stages 2a may be arranged, for example, along the X direction (the width direction of the substrate processing system 1). Each of the plurality of cassette mounting stages 2a is configured to be capable of mounting one cassette 5 thereon.

[0013] The substrate transport devices 2b and 2c are configured to transport the substrate W between the cassette 5 placed on the cassette mounting table 2a and the processing station 3. The substrate transport devices 2b and 2c are each configured to be movable, for example, in each of the X-axis direction (horizontal direction), Y-axis direction (horizontal direction), Z-axis direction (up and down direction), and around the Z axis (θ direction). Therefore, the substrate transport devices 2b and 2c may each include a drive mechanism in at least one of the X-axis direction, Y-axis direction, Z-axis direction, and θ direction as necessary, or may include a drive mechanism in all directions.

[0014] At least one of the substrate transport devices 2b, 2c is capable of transferring the substrate W to and from the cassette 5, and is also capable of transferring the substrate W to and from the processing station 3. Transferring the substrate W to and from the processing station 3 by the substrate transport devices 2b, 2c may include transferring the substrate W to and from the block G3. An inspection device (not shown) for inspecting the substrate W may be provided at a position accessible to at least one of the substrate transport devices 2b, 2c.

[0015] The processing station 3 is configured to perform various photolithography processes on the substrate W. The processing station 3 may include a plurality of modules 3a stacked in the vertical direction, as illustrated in Fig. 2. As illustrated in Figs. 1 and 2, each module 3a may include, for example, blocks G1 and G2 and a substrate transport space 3b extending along the Y-axis direction. The blocks G1 and G2 may be aligned in the X-axis direction so as to face each other with the substrate transport space 3b therebetween.

[0016] The block G1 includes at least one thin film processing apparatus U1. The thin film processing apparatus U1 may be an apparatus that supplies a processing liquid to the substrate W to perform film processing, or may be an apparatus that supplies a predetermined gas to the substrate W to perform film processing. The thin film processing apparatus U1 may include, for example, a thin film forming apparatus, a developing processing apparatus, etc. The thin film forming apparatus may include, for example, a photosensitive thin film forming apparatus, an anti-reflection film forming apparatus, etc. The photosensitive thin film forming apparatus may be an apparatus for forming a resist film used as a mask when forming a pattern of a film on the lower layer side. The anti-reflection film forming apparatus may be an apparatus for forming an anti-reflection film for efficiently performing a light irradiation process, for example, an exposure process. The developing processing apparatus may be an apparatus for removing a part of the exposed resist film to form an uneven shape as the mask. The thin film processing may include forming a thin film and performing a developing process. In the example of FIG. 1, a plurality of thin film processing apparatuses U1 are arranged in a line along the Y-axis direction, but the number, arrangement, and type of the thin film processing apparatuses U1 may be selected arbitrarily.

[0017] The block G2 includes a plurality of heat treatment devices U2, a hydrophobization treatment device (not shown), and a peripheral exposure device U3. The plurality of heat treatment devices U2 are configured to perform heat treatment (e.g., heating, cooling) of the substrate W. The plurality of heat treatment devices U2 may be arranged vertically and horizontally in the block G2. The hydrophobization treatment device is configured to hydrophobize the surface of the substrate W in order to increase the fixation between the substrate W and a treatment liquid that becomes a photosensitive thin film. The peripheral exposure device U3 is configured to expose a portion of the photosensitive thin film formed on the surface of the substrate W that is located at the peripheral portion. The hydrophobization treatment device and the peripheral exposure device U3 may be arranged vertically and horizontally in the block G2. The number and arrangement of the heat treatment devices U2, the hydrophobization treatment device, and the peripheral exposure device U3 may be selected arbitrarily.

[0018] As illustrated in Fig. 1, in plan view, a substrate transfer space 3b is formed in an area sandwiched between blocks G1 and G2. In the substrate transfer space 3b, for example, a substrate transfer device 3c is disposed. The substrate transfer device 3c includes a transfer arm 10 that is movable in each of the directions, for example, the X direction (horizontal direction), the Y direction (horizontal direction), the Z direction (up and down direction), and around a vertical axis (θ direction). The substrate transfer device 3c may include a drive mechanism DM (see Fig. 3) for movement in each of the directions.

[0019] The substrate transport device 3c moves within the substrate transport space 3b and can transport the substrate W to predetermined devices in the surrounding blocks G1, G2, G3, G4, etc. As illustrated in Fig. 1, when there are multiple processing stations 3, the substrate transport device 3c provided in the processing station 3 located on the interface station 4 side can transport the substrate W to predetermined devices in block G5 (described later) in addition to blocks G1, G2, G4.

[0020] A plurality of substrate transport devices 3c may be arranged vertically. One substrate transport device 3c can transport the substrate W to a predetermined device in an upper module 3a among a plurality of modules 3a stacked vertically. Another substrate transport device 3c can transport the substrate W to a predetermined device in a lower module 3a. The number of substrate transport devices 3c and the number of modules 3a corresponding to one substrate transport device 3c can be selected arbitrarily, such as providing a substrate transport device 3c for each module 3a.

[0021] The substrate transport space 3b or the blocks G1, G2 may include a shuttle transport device (not shown) configured to transport substrates W linearly between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0022] The block G3 may be disposed in the cassette station 2 so as to be located near the substrate transfer space 3b of the processing station 3. The block G3 may be provided in the processing station 3. The block G3 may include a plurality of delivery devices (not shown) arranged vertically.

[0023] 1, block G4 is disposed in the substrate transport space 3b at the boundary between the two processing stations 3. Block G4 may include a plurality of transfer devices (not shown) arranged vertically. Each transfer device may be configured to be accessible by one substrate transport device 3c of the two processing stations 3 and the other substrate transport device 3c of the two processing stations 3, respectively.

[0024] 1, block G5 may be disposed in the interface station 4 so as to be located near the substrate transport space 3b in the processing station 3. Block G5 may be disposed in the processing station 3. Block G5 may include a plurality of transfer devices (not shown) arranged vertically. Each transfer device may be configured to be accessible by the substrate transport device 3c and the substrate transport devices 4a and 4b (described later) of the interface station 4, respectively.

[0025] The interface station 4 connects the processing station 3 to an exposure device (not shown) so as to transfer the substrate W between them. The exposure device may be adjacent to the interface station 4, for example, located on the opposite side of the interface station 4 from the processing station 3.

[0026] The interface station 4 includes substrate transport devices 4a and 4b. Each of the substrate transport devices 4a and 4b is configured to be movable in, for example, the X direction (horizontal direction), the Y direction (horizontal direction), the Z direction (up and down direction), and around the Z axis (θ direction). Each of the substrate transport devices 4a and 4b may include a drive mechanism in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction as necessary, or may include a drive mechanism in all directions.

[0027] At least one of the substrate transport devices 4b, 4c is capable of transferring the substrate W to and from the processing station 3, and is also capable of transferring the substrate W to and from the exposure device. The transfer of the substrate W to and from the processing station 3 by the substrate transport devices 4b, 4c may include the transfer of the substrate W to and from the block G5.

[0028] A cleaning device that cleans the surface of the substrate W and the above-mentioned edge exposure device U3 may be provided in the interface station 4 at a position accessible to at least one of the substrate transport devices 4b and 4c.

[0029] As described above, the inspection device may be provided in the cassette station 2. The inspection device may be provided in the processing station 3 or the interface station 4 at a position accessible to any of the substrate transport devices 3c, 4b, 4c provided therein.

[0030] The above-described substrate processing system 1 includes a controller Ctr (controller). The controller Ctr is configured to control the substrate processing system 1 partially or entirely.

[0031] [Details of the substrate transport device] Next, substrate transport device 3c will be described in detail with reference to Figures 3 to 8. Note that substrate transport devices 2b, 2c, 4a, and 4b may also have the same configuration as substrate transport device 3c.

[0032] As described above, the substrate transport device 3c is configured to transport the substrate W to the blocks G1 to G5. As illustrated in Fig. 3, the block G2 may include a temporary placement unit UT for correcting the holding position when the substrate W is held by the transport arm 10. Each of the units constituting the blocks G1 to G5 (thin film processing device U1, heat processing device U2, hydrophobization processing device, peripheral exposure device U3, delivery device, etc.) may include an opening OP provided in a side wall facing the substrate transport space 3b. The substrate transport device 3c loads and unloads the substrate W to and from each unit through the opening OP.

[0033] As illustrated in FIGS. 3 and 5, the substrate transfer device 3c includes a lifting table 3d, a rotation mechanism 3e, a driving mechanism DM (driving unit), at least one transfer arm 10, suction pumps P1 and P2, and sensors SE1 and SE2.

[0034] The lifting platform 3d supports the rotation mechanism 3e and the transport arm 10, as illustrated in Fig. 3. The lifting platform 3d is configured to be movable up and down along a Z-axis guide rail (not shown) extending along the Z-axis direction. The Z-axis guide rail is covered by a cover body 3f. The cover body 3f is configured to slide along a Y-axis guide rail 3g that extends linearly in the Y-axis direction.

[0035] The rotation mechanism 3e is attached on the lift table 3d. The rotation mechanism 3e is configured to rotate a base 3h that holds at least one transfer arm 10 around the Z axis (θ direction). The drive mechanism DM is configured to perform vertical movement of the lift table 3d along the Z axis guide rail, horizontal movement of the cover body 3f along the Y axis guide rail 3g, rotation of the base 3h by the rotation mechanism 3e, and forward and backward movement of at least one transfer arm 10 relative to the base 3h (described later). The drive mechanism DM may be a rotary motor, a linear actuator, or the like.

[0036] At least one of the transport arms 10 is configured to be capable of moving forward and backward along the longitudinal direction (X-axis direction) of the base 3h. When the substrate transport device 3c includes multiple transport arms 10, the multiple transport arms 10 may be held on the base 3h so as to be stacked vertically, and may be configured to be capable of moving forward and backward independently of each other relative to the base 3h. The configuration of one of the transport arms 10 will be described below, but the other transport arms 10 may be configured in the same way.

[0037] The transfer arm 10 includes a base portion 20, a pair of arm portions 30, four suction portions 40, and two suction passages 50, as illustrated in FIGS.

[0038] The base portion 20 and the pair of arm portions 30 are flat plate-shaped. The pair of arm portions 30 are integrally connected to the base portion 20 so as to extend in the same direction from the base portion 20. The pair of arm portions 30 extend in a substantially arc shape so as to surround the outer periphery of the substrate W, as illustrated in FIG.

[0039] As illustrated in Figures 4 and 5, one arm portion 30A (first arm portion) of the pair of arm portions 30 is provided with two connection holes 31 (31A, 31B). The connection holes 31A, 31B extend in the thickness direction of the arm portion 30A so as to penetrate through the arm portion 30A. The connection hole 31A is disposed on the tip side of the arm portion 30A, and the connection hole 31B is disposed on the base portion 20 side of the arm portion 30A.

[0040] Two connection holes 31 (31C, 31D) are provided in the other arm portion 30B (second arm portion) of the pair of arm portions 30. The connection holes 31C, 31D extend in the thickness direction of the arm portion 30B so as to penetrate through the arm portion 30B. The connection hole 31C is disposed on the tip side of the arm portion 30B, and the connection hole 31D is disposed on the base portion 20 side of the arm portion 30B.

[0041] Each of the four suction portions 40 includes a suction port 41 that suctions the peripheral portion Wc of the rear surface Wb of the substrate W. Two of the four suction portions 40, 40A and 40B, are attached to the arm portion 30A from the lower surface S2 (see FIGS. 4 to 6) side of the transport arm 10. Two of the four suction portions 40, 40C and 40D, are attached to the arm portion 30B from the lower surface S2 side of the transport arm 10.

[0042] 5, the distances between adjacent suction portions 40 may be approximately equal. Specifically, the distance L1 between the suction ports 41 of adjacent suction portions 40A and 40B, the distance L2 between the suction ports 41 of adjacent suction portions 40C and 40D, the distance L3 between the suction ports 41 of adjacent suction portions 40A and 40C, and the distance L4 between the suction ports 41 of adjacent suction portions 40B and 40D may all be approximately equal. Here, "approximately equal" may include an error of, for example, about ±40 mm.

[0043] The suction portion 40A (first suction portion, first suction portion group) is located so as to correspond to the connection hole 31A, and the suction portion 40B (third suction portion, second suction portion group) is located so as to correspond to the connection hole 31B. That is, the suction portion 40A is disposed on the tip side of the arm portion 30A, and the suction portion 40B is disposed on the base portion 20 side of the arm portion 30A.

[0044] The suction portion 40C (second suction portion, first suction portion group) is located to correspond to the connection hole 31C, and the suction portion 40D (fourth suction portion, second suction portion group) is located to correspond to the connection hole 31D. That is, the suction portion 40C is disposed on the tip side of the arm portion 30B, and the suction portion 40D is disposed on the base portion 20 side of the arm portion 30B.

[0045] 7 and 8, the suction section 40 includes a pad body 42 and a holding member 43. The pad body 42 includes a substantially circular suction surface 42a that holds the substrate W by vacuum suction, and a suction port 41 provided at substantially the center of the suction surface 42a. The pad body 42 is attached to a through hole 43a provided at the tip of the holding member 43 via a sealing member 44 (e.g., an O-ring). Therefore, the suction port 41 is fluidly connected to a flow path 43b provided inside the holding member 43 in an airtight state.

[0046] A cylindrical connection part 45 is provided at the base end of the holding member 43. The inner space of the connection part 45 is fluidly connected to the flow path 43b. That is, the flow path 43b extends from the tip end to the base end of the holding member 43. The connection part 45 is attached to the connection hole 31 by being inserted into the connection hole 31 from the lower surface S2 side of the transfer arm 10. A sealing member 46 (e.g., an O-ring) is attached to the outer periphery of the connection part 45. Therefore, the inner space of the connection part 45 and the flow path 43b are fluidly connected to the connection hole 31 while maintaining airtightness.

[0047] 4 to 6, the two suction passages 50 are recessed grooves provided in the base portion 20 and the pair of arm portions 30. A cover member (not shown) is attached to the upper portion of the suction passage 50 by adhesive or the like. Therefore, the inside of the suction passage 50 is kept airtight.

[0048] One of the two suction passages 50, a suction passage 50A (a first suction passage), extends on an upper surface S1 (one of the main surfaces) of the transport arm 10. Specifically, as illustrated in FIG. 5, the suction passage 50A includes a first passage 51, a second passage 52, and a third passage 53. The first passage 51 extends in the base portion 20 along the width direction of the base portion 20. The second passage 52 branches off from the first passage 51 and extends to the vicinity of the tip of the arm portion 30A. The third passage 53 branches off from the first passage 51 and extends to the vicinity of the tip of the arm portion 30B.

[0049] An end of the second passage 52 is connected to the connection hole 31A. An end of the third passage 53 is connected to the connection hole 31C. Therefore, the suction passage 50A is fluidly connected to the suction ports 41 of the adsorption portions 40A and 40C.

[0050] The other suction passage 50B (second suction passage) of the two suction passages 50 extends on the upper surface S1 (one main surface) and the lower surface S2 (the other main surface) of the transport arm 10. Specifically, as illustrated in FIG. 5 and FIG. 6, the suction passage 50B includes a first passage 54 (first portion), a second passage 55 (first portion), a third passage 56 (first portion), and a fourth passage 57 (second portion). The first passage 54 extends along the width direction of the base portion 20 on the upper surface S1 of the base portion 20. The second passage 55 branches off from the first passage 54 and extends to the vicinity of the center of the arm portion 30A. The third passage 54 branches off from the first passage 54 and extends to the vicinity of the center of the arm portion 30B. The fourth passage 57 extends along the width direction of the base portion 20 on the lower surface S2 of the base portion 20.

[0051] The tip of the second passage 55 is connected to the connection hole 31B. The tip of the third passage 56 is connected to the connection hole 31D. The end of the fourth passage 57 on the center side of the base portion 20 is connected to the first passage 54 via a through hole 58. The through hole 58 extends in the thickness direction of the base portion 20 so as to penetrate the base portion 20. Therefore, the suction passage 50B is fluidly connected to the suction ports 41 of the adsorption portions 40B and 40D.

[0052] The suction pump P1 is connected to the first passage 51 via a pipe D1. The suction pump P1 operates based on a control signal from the controller Ctr and is configured to generate negative pressure at the suction ports 41 of the adsorption units 40A and 40C through the suction passage 50A. The suction pump P2 is connected to the fourth passage 57 via a pipe D2. The suction pump P2 operates based on a control signal from the controller Ctr and is configured to generate negative pressure at the suction ports 41 of the adsorption units 40B and 40D through the suction passage 50B.

[0053] The sensor SE1 (first sensor) is configured to detect the magnitude of the pressure in the pipe D1. The sensor SE1 is configured to transmit data on the magnitude of the detected pressure to the controller Ctr. The sensor SE2 (second sensor) is configured to detect the magnitude of the pressure in the pipe D2. The sensor SE2 is configured to transmit data on the magnitude of the detected pressure to the controller Ctr.

[0054] [Controller Details] The controller Ctr is configured to control the substrate processing system 1 partially or entirely. As illustrated in FIG. 9, the controller Ctr has a reading unit M1, a storage unit M2, a processing unit M3, an instruction unit M4, and a communication unit M5 as functional modules. These functional modules are merely a division of the functions of the controller Ctr into a plurality of modules for convenience, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being realized by the execution of a program, and may be realized by a dedicated electric circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) integrating the same.

[0055] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM records a program for operating each unit of the substrate processing system 1. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. In the following, each unit of the substrate processing system 1 may include a driving mechanism DM, suction pumps P1 and P2, and sensors SE1 and SE2.

[0056] The memory unit M2 is configured to store various data. The memory unit M2 may store, for example, a program read from a recording medium RM by the reader M1, setting data input by an operator via an external input device (not shown), etc. The memory unit M2 may store, for example, data on processing conditions (processing recipes) for processing the substrate W. The memory unit M2 may store, for example, data on the magnitude of pressure detected by the sensors SE1 and SE2.

[0057] The processing unit M3 is configured to process various data. For example, the processing unit M3 may generate control signals for operating each unit of the substrate processing system 1 based on the various data stored in the storage unit M2.

[0058] The processing unit M3 may execute a process of changing the moving speed of the transfer arm 10 by the driving mechanism DM based on the detection results of the sensors SE1 and SE2, for example.

[0059] For example, when the back surface Wb of the substrate W is sucked by the suction port 41 of the suction unit 40A, 40C, the pressure of the suction passage 50A drops below a predetermined value. Similarly, when the back surface Wb of the substrate W is sucked by the suction port 41 of the suction unit 40B, 40D, the pressure of the suction passage 50B drops below a predetermined value. On the other hand, when the back surface Wb of the substrate W is not sucked by at least one of the suction ports 41 of the suction units 40A, 40C due to warping of the substrate W, the at least one of the suction ports 41 is opened. Therefore, the pressure of the suction passage 50A is kept higher than a predetermined value by the vacuum pump P1 drawing the suction passage 50A. Similarly, when the back surface Wb of the substrate W is not sucked by at least one of the suction ports 41 of the suction units 40B, 40D due to warping of the substrate W, the at least one of the suction ports 41 is opened. Therefore, the suction pump P2 draws a vacuum in the suction passage 50B, so that the pressure in the suction passage 50B continues to be higher than a predetermined value.

[0060] Therefore, when the pressure detected by the sensor SE1 is equal to or lower than a predetermined value, the processing unit M3 may determine that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40A, 40C. Similarly, when the pressure detected by the sensor SE2 is equal to or lower than a predetermined value, the processing unit M3 may determine that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40B, 40D.

[0061] When the processor M3 determines that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40A to 40D, the processor M3 may execute a process of controlling the drive mechanism DM to move the transport arm 10 at a predetermined speed V1 (first speed). When the processor M3 determines that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40A and 40C but not by the remaining suction ports 41, the processor M3 may execute a process of controlling the drive mechanism DM to move the transport arm 10 at a predetermined speed V2 (second speed). Similarly, when the processor M3 determines that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40B and 40D but not by the remaining suction ports 41, the processor M3 may execute a process of controlling the drive mechanism DM to move the transport arm 10 at the speed V2. Here, the speed V1 may be a transport speed set in the substrate transport device 3c. The speed V2 is lower than the speed V1, and may be, for example, about 50% to 90% of the speed V1.

[0062] When the back surface Wb of the substrate W is attracted by the suction ports 41 of the suction units 40A and 40C but not by the remaining suction ports 41, the suction units 40A and 40C (first suction unit group) located at the tip side of the transport arm 10 exert the suction function. On the other hand, when the back surface Wb of the substrate W is attracted by the suction ports 41 of the suction units 40B and 40D but not by the remaining suction ports 41, the suction units 40B and 40D (second suction unit group) located on the base unit 20 side of the transport arm 10 exert the suction function. In the case of the transport arm 10 having the configuration exemplified in such Figs. 4 to 6, the speed V2 may be set to, for example, about 90% of the speed V1.

[0063] When the pressures detected by the sensors SE1 and SE2 are both higher than a predetermined value, the processor M3 may execute a process of controlling the drive mechanism DM not to move the transport arm 10. That is, when the processor M3 determines that the back surface Wb of the substrate W is not being sucked by the suction ports 41 of the suction units 40A-40D, the processor M3 keeps the transport arm 10 stopped. In this case, the processor M3 may issue an alarm from an alarm unit (not shown). The alarm unit may issue an alarm by, for example, displaying an alarm (e.g., characters, figures, etc.) on a display (not shown), or by issuing an alarm sound or alarm guidance from a speaker (not shown).

[0064] The processing unit M3 may execute a process of changing the moving speed of the transfer arm 10 by the drive mechanism DM based on, for example, the detection results by the sensors SE1 and SE2 and the moving direction of the transfer arm 10. The moving direction may include, for example, at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction. For example, when the transfer arm 10 is moved along the Z-axis, the processing unit M3 may move the transfer arm 10 at a speed V1. For example, when the transfer arm 10 is moved along any of the X-axis direction, the Y-axis direction, and the θ-axis direction, the processing unit M3 may move the transfer arm 10 at a speed V2.

[0065] For example, when the transfer arm 10 is moved along at least two directions of the X-axis, Y-axis, Z-axis, and θ-direction, the processing unit M3 may calculate in advance the travel time of the transfer arm 10 to the destination and select a route by which the transfer arm 10 reaches the destination in the shortest time. Specifically, when the transfer arm 10 is set to move in the Z-axis direction at a speed V1 and in the Z-axis direction at a speed V2 (for example, 60% of the speed V1), the processing unit M3 may calculate in advance the travel time for each of a first route along which the transfer arm 10 moves linearly to the destination and a second route along which the transfer arm 10 moves in the Z-axis direction and the X-axis direction, and select the route with the shortest travel time.

[0066] The instruction unit M4 is configured to transmit the control signal generated in the processing unit M3 to each unit of the substrate processing system 1.

[0067] The hardware of the controller Ctr may be configured, for example, by one or more control computers. The controller Ctr may include a circuit C1 as a hardware configuration, as exemplified in FIG. 10. The circuit C1 may be configured by electric circuit elements. The circuit C1 may include, for example, a processor C2, a memory C3, a storage C4, a driver C5, and an input / output port C6.

[0068] The processor C2 may be configured to execute a program in cooperation with at least one of the memory C3 and the storage C4 and to input and output signals via the input / output port C6, thereby realizing each of the functional modules described above. The memory C3 and the storage C4 may function as the storage unit M2. The driver C5 may be a circuit configured to drive each of the components of the substrate processing system 1. The input / output port C6 may be configured to mediate the input and output of signals between the driver C5 and each of the components of the substrate processing system 1.

[0069] The substrate processing system 1 may include one controller Ctr, or may include a controller group (controller) composed of a plurality of controllers Ctr. When the substrate processing system 1 includes a controller group, each of the above-mentioned functional modules may be realized by one controller Ctr, or may be realized by a combination of two or more controllers Ctr. When the controller Ctr is composed of a plurality of computers (circuits C1), each of the above-mentioned functional modules may be realized by one computer (circuit C1), or may be realized by a combination of two or more computers (circuits C1). The controller Ctr may have a plurality of processors C2. In this case, each of the above-mentioned functional modules may be realized by one processor C2, or may be realized by a combination of two or more processors C2.

[0070] [Board transport method] Next, a method for transporting the substrate W by the substrate transport device 3c will be described with reference to FIG.

[0071] First, the transport arm 10 of the substrate transport device 3c receives the substrate W from another device or the like (step S11 in FIG. 11). Next, the controller Ctr instructs the suction pumps P1 and P2 to draw a vacuum through the suction passage 50, generating a negative pressure in the suction port 41 of the adsorption unit 40 (step S12 in FIG. 11).

[0072] In step S12, the controller Ctr may operate the suction pump P1 to generate a negative pressure at the suction ports 41 of the suction units 40A and 40C, and then operate the suction pump P2 to generate a negative pressure at the suction ports 41 of the suction units 40B and 40D. In this case, the back surface Wb of the substrate W is preferentially sucked by the suction ports 41 of the suction units 40A and 40C (first suction unit group) located on the tip side of the arm units 30A and 30B. Therefore, the substrate W tends to be more easily held by suction to the transport arm 10 compared to the case where the back surface Wb of the substrate W is sucked by the suction ports 41 of the suction units 40B and 40D (second suction unit group) located on the base unit 20 side of the arm units 30A and 30B. Therefore, even if an inertial force acts on the substrate W when the transport arm 10 moves in the extension direction of the arm portion 30, or even if a centrifugal force acts on the substrate W when the transport arm 10 rotates in the θ direction, the substrate W can be transported appropriately.

[0073] Next, the controller Ctr judges whether the magnitudes of the pressures detected by the sensors SE1 and SE2 are both equal to or less than a predetermined value (step S13 in FIG. 11). If the result of the judgment by the controller Ctr is that the pressures detected by both the sensors SE1 and SE2 are equal to or less than the predetermined value ("YES" in step S13 in FIG. 11), the controller Ctr may control the drive mechanism DM to move the transport arm 10 to the destination at a speed V1 (step S14 in FIG. 11). When the transport arm 10 reaches the destination at the speed V1, the transport process of the substrate W is completed.

[0074] On the other hand, if the controller Ctr determines that the pressures detected by both of the sensors SE1 and SE2 are not equal to or less than the predetermined value (step S13 in FIG. 11: NO), the process proceeds to step S15. In step S15, the controller Ctr determines whether the pressure detected by one of the sensors SE1 and SE2 is equal to or less than the predetermined value (step S15 in FIG. 11).

[0075] If the controller Ctr determines that the detected pressure of one of the sensors SE1, SE2 is equal to or lower than a predetermined value ("YES" in step S15 of FIG. 11), the controller Ctr may control the drive mechanism DM to move the transport arm 10 to the destination at a speed V2 (step S16 of FIG. 11). When the transport arm 10 reaches the destination at the speed V1, the transport process of the substrate W is completed. Note that, if the path of the transport arm 10 to the destination includes movement in the Z-axis direction, the transport arm 10 may be moved in the Z-axis direction at the speed V1.

[0076] On the other hand, if the controller Ctr determines that the pressure detected by one of the sensors SE1, SE2 is not equal to or less than the predetermined value ("NO" in step S15 of FIG. 11), the controller Ctr controls the drive mechanism DM to keep the transport arm 10 stopped (step S17 of FIG. 11). In this case, the controller Ctr may control an alarm unit (not shown) to cause the abandoned unit to issue an alarm. With the above, the transport process of the substrate W is completed.

[0077] [Effect] According to the above example, the substrate W is adsorbed by at least one of the suction ports 41 of the first suction section group (suction sections 40A, 40C) and the suction ports 41 of the second suction section group (suction sections 40B, 40D) by suction through the suction passage 50. Therefore, even if the substrate W is warped, the substrate W is adsorbed and held by at least two suction sections 40. Therefore, even if the substrate W is warped and not flat, the substrate W can be appropriately transported by the transport arm 10.

[0078] According to the above example, when a pressure drop is detected by the sensor SE1, it can be determined that the substrate W is adsorbed to the suction port 41 of the first suction unit group (suction units 40A and 40C). Similarly, when a pressure drop is detected by the sensor SE2, it can be determined that the substrate W is adsorbed to the suction port 41 of the second suction unit group (suction units 40B and 40D). In this case, based on the detection results by the sensors SE1 and SE2, it is determined whether the substrate W is adsorbed to the suction port 41 of the first suction unit group, the suction port 41 of the second suction unit group, or the suction port 41 of the first and second suction unit groups. Therefore, by changing the moving speed of the transport arm 10 depending on the number of suction ports 41 adsorbing the substrate W, it is possible to appropriately transport the substrate W while preventing the substrate W from being displaced relative to the transport arm 10 or falling off from the transport arm 10.

[0079] According to the above example, the movement speed of the transport arm 10 can be controlled based on the detection results by the sensors SE1 and SE2 as well as the movement direction of the transport arm 10. In this case, by changing the movement speed of the transport arm 10 taking into consideration the magnitude of the inertial force acting on the substrate W as well as the suction state of the substrate W, it is possible to appropriately transport the substrate W while preventing the substrate W from shifting from the transport arm 10 or falling off from the transport arm 10.

[0080] According to the above example, when it is determined as a result of detection by the sensors SE1, SE2 that the back surface Wb of the substrate W is attracted by the suction ports 41 of the suction units 40A to 40D, the transport arm 10 may be moved at a speed V1. In this case, since the substrate W is attracted by the suction ports 41 of the four suction units 40A to 40D, the substrate W is unlikely to shift in position relative to the transport arm 10 or fall off from the transport arm 10. Therefore, by moving the transport arm 10 at a relatively high speed V1, it is possible to efficiently transport the substrate W.

[0081] Incidentally, when the substrate W is adsorbed by the suction ports 41 of two suction parts 40, the substrate W is less easily held by the transport arm 10 compared to when the substrate W is adsorbed by the suction ports 41 of four suction parts 40. However, according to the above example, when it is determined that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of two of the four suction parts 40 as a result of detection by the sensors SE1 and SE2, the transport arm 10 may be moved at a speed V2 slower than the speed V1. In this case, even when the substrate W is adsorbed by the suction ports 41 of the two suction parts 40, it is possible to appropriately transport the substrate W while preventing the substrate W from shifting in position relative to the transport arm 10 or falling off from the transport arm 10 without stopping the transport of the substrate W as a suction error.

[0082] According to the above example, when it is determined that the substrate W is not being adsorbed by the suction ports 41 in the first and second suction portion groups, a suction error occurs and the transport arm 10 can be stopped. In this case, it is possible to prevent the substrate W from being transported when the substrate W is not held by the transport arm 10 with sufficient force.

[0083] According to the above example, the arm parts 30A and 30B may extend in the same direction from the base part 20. The suction part 40A may be arranged on the tip side of the arm part 30A, the suction part 40B may be arranged on the tip side of the arm part 30B, the suction part 40C may be arranged on the base part 20 side of the arm part 30A, and the suction part 40D may be arranged on the base part 20 side of the arm part 30B. In this case, even if the substrate W is warped, the substrate W is suction-held by at least two suction parts 40. More specifically, in this case, the suction parts 40A and 40C constituting the first suction part group may be located on the tip side of the arm parts 30A and 30B, respectively, and the suction parts 40B and 40D constituting the second suction part group may be located on the base part 20 side of the arm parts 30A and 30B, respectively. Therefore, the substrate W is suctioned by at least one of the tip side and the base part 20 side of the arm parts 30A and 30B. Therefore, even if the substrate W is not flat due to warping or the like, the substrate W can be appropriately transported by the transport arm 10.

[0084] According to the above example, the suction passage 50A may be provided on the upper surface S1 side of the transport arm 10. The suction passage 50B may include first to third passages 54-56 provided on the upper surface S1 side of the transport arm 10, and a fourth passage 57 communicating with the first passage 54 through a through hole 58 provided in the transport arm 10 and provided on the lower surface S2 side of the transport arm 10. In this case, the suction passages 50A and 50B, which are different systems of suction passages 50, are fluidically independent while passing through the upper surface S1 or the lower surface S2 of the transport arm 10. Therefore, it is possible to independently suck the substrate W by the suction port 41 connected to the suction passage 50A and the suction port 41 connected to the suction passage 50B while making the paths of the suction passages 50A and 50B compact.

[0085] According to the above example, the drive mechanism DM can move the transport arm 10 along at least one of the X-axis, Y-axis, Z-axis, and θ-directions. In this case, the substrate W can be transported in various directions by the transport arm 10.

[0086] According to the above example, the transport arm 10 can be moved along the Z axis at a speed V1. When the substrate W is transported along the Z axis direction (vertical direction), the substrate W is less likely to become misaligned with respect to the transport arm 10 or to fall off the transport arm 10. Therefore, by moving the transport arm 10 at a relatively high speed V1, the substrate W can be transported efficiently.

[0087] On the other hand, when the substrate W is transported along any one of the X-axis, Y-axis, and θ-directions, the substrate W is relatively more likely to become displaced relative to the transport arm 10 or to fall off from the transport arm 10 due to the action of inertial force on the substrate W, compared to when the substrate W is transported along the Z-axis direction (vertical direction). However, according to the above example, the transport arm 10 can be moved along any one of the X-axis, Y-axis, and θ-directions at a speed V2 slower than the speed V1. In this case, the inertial force acting on the substrate W is weakened, so that the substrate W can be appropriately transported while preventing the substrate W from becoming displaced relative to the transport arm 10 or to fall off from the transport arm 10.

[0088] [Variations] The disclosure in this specification should be considered to be illustrative and not restrictive in all respects. Various omissions, substitutions, modifications, etc. may be made to the above examples without departing from the scope of the claims and the gist thereof.

[0089] (1) The substrate processing system 1 in the present disclosure is not limited to the configuration or operation described above. For example, in the above example, the substrate W is transferred between the interface station 4 and the exposure device, but the substrate processing system 1 does not need to be directly connected to the exposure device. In this case, for example, the substrate W may be transported from the cassette station 2 to the processing station 3, where it is subjected to necessary processing, and then transported back to the cassette station 2 to be taken out to the outside. Furthermore, the substrate processing system 1 does not need to include any of the devices exemplified as processing devices, and the processing of the substrate W in the device does not need to be performed.

[0090] (2) The substrate transport device 3c may have a configuration as illustrated in FIGS. 12 to 14. More specifically, the substrate transport device 3c includes arm units 3i and 3j, a base unit 3k, and a support 100. As illustrated in FIGS. 12 and 13, the tip end of the arm unit 3i is connected to a base 3h so as to be rotatable around the Z axis (θ direction). The tip end of the arm unit 3j is connected to a base end of the arm unit 3i so as to be rotatable around the Z axis (θ direction). The base end of the arm unit 3j is connected to a base unit 3k so as to be rotatable around the Z axis (θ direction). The arm units 3i and 3j rotate relative to each other, causing the base 3h and the transport arm 10 to advance and retreat relative to the base unit 3k.

[0091] As illustrated in FIGS. 13 and 14, the support 100 includes a lifting mechanism 101 and a slider 102. The lifting mechanism 101 is configured to move the slider 102 up and down. The lifting mechanism 101 may be configured, for example, by an endless belt 104 stretched around a pair of pulleys 103. In this case, the slider 102 may be connected to the endless belt 104. The slider 102 is connected to the base portion 3k via a connecting member 3l. Therefore, in accordance with the operation of the lifting mechanism 101, the transport arm 10 moves up and down via the slider 102, the connecting member 3l, the base portion 3k, and the arm portions 3i and 3j.

[0092] (3) As illustrated in Fig. 15, the substrate transfer device 3c may evacuate the suction passages 50A and 50B using a suction pump P1, sensors SE1 and SE2, and valves VL1 and VL2. The suction pump P1 is connected to the first passage 51 via a pipe D1 and is connected to the fourth passage 57 via a pipe D2. The pipe D1 is provided with a sensor SE1 and a valve VL1. The pipe D2 is provided with a sensor SE2 and a valve VL2. The valves VL1 and VL2 are configured to open and close the pipes D1 and D2, respectively, in response to a control signal from a controller Ctr.

[0093] According to the example of FIG. 15, the controller Ctr instructs the suction pump P1 and the valves VL1 and VL2 to draw a vacuum through the suction passages 50A and 50B with the valves VL1 and VL2 open, and generates a negative pressure at the suction port 41 of the suction unit 40. At this time, if the substrate W is adsorbed to the suction port 41 of the suction units 40A to 40D, the detected pressures of the sensors SE1 and SE2 are both equal to or lower than a predetermined value, so the controller Ctr maintains the valves VL1 and VL2 in an open state. On the other hand, if the substrate W is adsorbed to the suction port 41 of the first suction unit group (suction units 40A and 40C) and the substrate W is not adsorbed to the suction port 41 of the second suction unit group (suction units 40B and 40D), the detected pressure of the sensor SE2 becomes higher than the predetermined value. Therefore, the controller Ctr closes the valve VL2 while maintaining the valve VL1 in an open state. Similarly, when the substrate W is adsorbed to the suction port 41 of the second suction portion group (suction portions 40B, 40D) and the substrate W is not adsorbed to the suction port 41 of the first suction portion group (suction portions 40A, 40C), the detected pressure of the sensor SE1 becomes higher than a predetermined value. Therefore, the controller Ctr closes the valve VL1 while keeping the valve VL2 open. The controller Ctr may close the valves VL1, VL2 after a predetermined time has elapsed since the detected pressures of the sensors SE1, SE2 became higher than the predetermined value.

[0094] (4) The two suction passages 50 may be configured as illustrated in FIG. 16. More specifically, the suction passage 50A extends on the upper surface S1 of the transport arm 10. The suction passage 50A includes a first passage 51, a second passage 52, and a third passage 53. The first passage 51 extends in the base portion 20 along the width direction of the base portion 20. The second passage 52 branches off from the first passage 51 and extends to the vicinity of the tip of the arm portion 30A. The third passage 53 branches off from the first passage 51 and extends to the vicinity of the center of the arm portion 30B.

[0095] The tip of the second passage 52 is connected to the connection hole 31A. The tip of the third passage 53 is connected to the connection hole 31D. Therefore, the suction passage 50A is fluidly connected to the suction ports 41 of the suction parts 40A and 40D. In other words, the suction parts 40A and 40D constituting the first suction part group are located on the diagonal of the arm parts 30A and 30B, respectively.

[0096] The suction passage 50B extends on the upper surface S1 and the lower surface S2 of the transport arm 10. The suction passage 50B includes a first passage 54, a second passage 55, a third passage 56, and a fourth passage 57. The first passage 54 extends along the width direction of the base portion 20 on the upper surface S1 of the base portion 20. The second passage 55 branches off from the first passage 54 and extends to the vicinity of the center of the arm portion 30A. The third passage 54 extends from the base portion 20 to the vicinity of the center of the arm portion 30B outside the third passage 53 of the suction passage 50A. The fourth passage 57 extends along the width direction of the base portion 20 on the lower surface S2 of the base portion 20.

[0097] The end of the first passage 54 on the arm portion 30B side is connected to the fourth passage 57 via a through hole 58. The tip of the second passage 55 is connected to the connection hole 31B. The tip of the third passage 56 is connected to the connection hole 31C. The end of the third passage 56 on the base portion 20 is connected to the fourth passage 57 via a through hole 59. The through holes 58 and 59 extend in the thickness direction of the base portion 20 so as to penetrate the base portion 20. Therefore, the suction passage 50B is fluidly connected to the suction ports 41 of the suction portions 40B and 40C. In other words, the suction portions 40B and 40C constituting the second suction portion group are located on the diagonal lines of the arm portions 30A and 30B, respectively.

[0098] 16, even if the substrate W is warped, the substrate W is adsorbed and held by at least two suction parts 40. Therefore, even if the substrate W is warped and not flat, the substrate W can be appropriately transported by the transport arm 10. Moreover, according to the embodiment illustrated in FIG. 16, the suction parts 40A and 40D constituting the first suction part group are located on a diagonal line of the arm parts 30A and 30B, respectively, and the suction parts 40B and 40C constituting the second suction part group are located on another diagonal line of the arm parts 30A and 30B, respectively. Therefore, even if a centrifugal force acts on the substrate W when the transport arm 10 rotates, the substrate W can be appropriately transported.

[0099] (5) The two suction passages 50 may be configured as illustrated in FIG. 17. More specifically, the suction passage 50A extends on the upper surface S1 of the transport arm 10. The suction passage 50A includes a first passage 51, a second passage 52, and a third passage 53. The first passage 51 extends along the width direction of the base portion 20 on the arm portion 30A side of the base portion 20. The second passage 52 extends from the first passage 51 to the vicinity of the tip of the arm portion 30A. The third passage 53 branches off from the vicinity of the center of the second passage 52 and extends.

[0100] The tip of the second passage 52 is connected to the connection hole 31A. The tip of the third passage 53 is connected to the connection hole 31B. Therefore, the suction passage 50A is fluidly connected to the suction ports 41 of the suction parts 40A and 40B. In other words, both of the suction parts 40A and 40B constituting the first suction part group are disposed on the arm part 30A.

[0101] The suction passage 50B extends on the upper surface S1 of the transport arm 10. The suction passage 50B includes a first passage 54, a second passage 55, and a third passage 56. The first passage 54 extends along the width direction of the base portion 20 on the arm portion 30B side of the base portion 20. The second passage 55 extends from the first passage 54 to the vicinity of the tip of the arm portion 30B. The third passage 56 branches off from the vicinity of the center of the second passage 55 and extends.

[0102] The tip of the second passage 55 is connected to the connection hole 31C. The tip of the third passage 56 is connected to the connection hole 31D. Therefore, the suction passage 50B is fluidly connected to the suction ports 41 of the suction parts 40C and 40D. In other words, the suction parts 40C and 40D constituting the second suction part group are both disposed on the arm part 30B.

[0103] 17, the suction parts 40A and 40B constituting the first suction part group are located on the arm part 30A, and the suction parts 40C and 40D constituting the second suction part group are located on the arm part 30B. Therefore, even if the substrate W is warped, the substrate W is suction-held by at least two suction parts 40. Therefore, even if the substrate W is not flat due to warping, the substrate W can be appropriately transported by the transport arm 10. When the substrate W is suctioned by the suction ports 41 of the suction parts 40A and 40B constituting the first suction part group or the suction ports 41 of the suction parts 40C and 40D constituting the second suction part group, the speed V2 may be set to about 50%.

[0104] (6) The transfer arm 10 may include four suction passages 50 (50A to 50D), as illustrated in Fig. 18. The suction passage 50A extends on the upper surface S1 of the transfer arm 10. The suction passage 50A extends from a region of the base portion 20 on the arm portion 30A side to near the tip of the arm portion 30A. The tip of the suction passage 50A is connected to the connection hole 31A.

[0105] The suction passage 50B extends on the upper surface S1 and the lower surface S2 of the transport arm 10. The suction passage 50B includes a portion extending through the region of the base portion 20 on the arm portion 30A side on the lower surface S2, and a portion extending to the vicinity of the center of the arm portion 30A on the upper surface S1. These portions are connected by a through hole. The tip of the suction passage 50B is connected to the connection hole 31B. The suction passage 50B may extend on the upper surface S1 so as not to intersect with other suction passages 50.

[0106] The suction passage 50C extends on the upper surface S1 of the transfer arm 10. The suction passage 50C extends from a region of the base portion 20 on the arm portion 30B side to near the tip of the arm portion 30A. The tip of the suction passage 50C is connected to the connection hole 31C.

[0107] The suction passage 50D extends on the upper surface S1 and the lower surface S2 of the transport arm 10. The suction passage 50D includes a portion extending through the region of the base portion 20 on the arm portion 30B side on the lower surface S2, and a portion extending to the vicinity of the center of the arm portion 30B on the upper surface S1. These portions are connected by a through hole. The tip of the suction passage 50D is connected to the connection hole 31D. The suction passage 50D may extend on the upper surface S1 so as not to intersect with other suction passages 50.

[0108] 18, the substrate W is sucked through the suction passages 50A-50D and adsorbed at the suction ports 41 of at least two of the adsorption units 40A-40D. That is, even if the substrate W is warped, the substrate W is adsorbed and held at at least two of the adsorption units 40. Therefore, even if the substrate W is warped and not flat, the substrate W can be appropriately transported by the transport arm 10.

[0109] 18, the substrate transport apparatus 3c may include a plurality of suction pumps. Each suction pump may be connected to a corresponding suction passage 50A-50D and configured to generate a negative pressure at the suction port 41 of each of the adsorption units 40A-40D through each of the suction passages 50A-50D. The substrate transport apparatus 3c may also include a plurality of sensors configured to detect the pressure in each of the suction passages 50A-50D.

[0110] 18, when the detection result by the multiple sensors shows that the substrate W is adsorbed by the suction ports 41 of three or more of the multiple suction parts 40, the transport arm 10 may be moved at a speed V1. When the detection result by the multiple sensors shows that the substrate W is adsorbed by the suction ports 41 of two of the multiple suction parts 40, the transport arm 10 may be moved at a speed V2 slower than the speed V1. When the detection result by the multiple sensors shows that the substrate W is adsorbed by the suction ports 41 of one or less of the multiple suction parts 40, the transport arm 10 may not be moved.

[0111] [Other examples] Example 1. An example of a substrate transport device includes a transport arm, a drive unit for moving the transport arm, and a control unit configured to control the drive unit. The transport arm includes a base unit, at least one arm unit connected to the base unit so as to extend from the base unit and extend to surround the outer periphery of the substrate, a plurality of suction units provided on the at least one arm unit and each including a suction port for suctioning the peripheral portion on the back surface of the substrate, and a plurality of suction passages provided on the at least one arm unit. The plurality of suction units includes a first suction unit group including a first suction unit and a second suction unit, and a second suction unit group including a third suction unit and a fourth suction unit. The plurality of suction passages includes a first suction passage connected to the suction ports of the first suction unit and the second suction unit, and a second suction passage connected to the suction ports of the third suction unit and the fourth suction unit. In this case, the substrate is sucked through the first and second suction passages by at least one of the suction ports of the first suction section group (first and second suction sections) and the suction ports of the second suction section group (third and fourth suction sections). Therefore, even if the substrate is warped, the substrate is sucked and held by at least two suction sections. Therefore, even if the substrate is warped or not flat, the substrate can be appropriately transported by the transport arm.

[0112] Example 2 The apparatus of Example 1 may further include a first sensor configured to detect the pressure in the first suction passage and a second sensor configured to detect the pressure in the second suction passage, and the control unit may be configured to execute a process of changing the moving speed of the transport arm by the drive unit based on the detection results by the first sensor and the second sensor. In this case, when the first sensor detects a pressure drop, it is determined that the substrate is adsorbed to the suction port of the first suction unit group. Similarly, when the second sensor detects a pressure drop, it is determined that the substrate is adsorbed to the suction port of the second suction unit group. Therefore, based on the detection results by the first and second sensors, it is determined whether the substrate is adsorbed by the suction port of the first suction unit group, the suction port of the second suction unit group, or the suction port of the first and second suction unit groups. Therefore, by changing the moving speed of the transport arm depending on the number of suction ports adsorbing the substrate, it is possible to appropriately transport the substrate while preventing the substrate from being displaced relative to the transport arm or falling off the transport arm.

[0113] Example 3 In the apparatus of Example 2, the control unit may be configured to execute a process of changing the moving speed of the transport arm by the drive unit based on the detection results by the first and second sensors and the moving direction of the transport arm. Incidentally, the magnitude of the inertial force acting on the substrate may differ depending on the moving direction of the transport arm. However, according to Example 2, the moving speed of the transport arm is controlled based on the moving direction of the transport arm in addition to the detection results by the first and second sensors. Therefore, by changing the moving speed of the transport arm taking into account the magnitude of the inertial force acting on the substrate in addition to the suction state of the substrate, it is possible to appropriately transport the substrate while preventing the substrate from being displaced relative to the transport arm or falling off the transport arm.

[0114] Example 4 In the apparatus of Example 2 or Example 3, the control unit may be configured to execute a process of controlling the drive unit to move the transfer arm at a first speed when it is determined that the back surface of the substrate is attracted by the suction ports of the first to fourth suction units as a result of detection by the first and second sensors. In this case, since the substrate is attracted by the suction ports of the four suction units, the substrate is less likely to shift in position relative to the transfer arm or to fall off from the transfer arm. Therefore, by moving the transfer arm at a relatively high first speed, it is possible to efficiently transfer the substrate.

[0115] Example 5 In the apparatus of Example 4, the control unit may be configured to execute a process of controlling the drive unit to move the transport arm at a second speed slower than the first speed when it is determined that the pressure in one of the first suction passage and the second suction passage is higher than a predetermined threshold and the pressure in the other of the first suction passage and the second suction passage is equal to or lower than the threshold as a result of detection by the first sensor and the second sensor. In this case, the substrate is adsorbed by the suction ports of the two adsorption units. Therefore, the substrate is less retained by the transport arm compared to the case where the substrate is adsorbed by the suction ports of the four adsorption units. However, in the fifth example, the transport arm is moved at a second speed slower than the first speed. Therefore, since the inertial force acting on the substrate is weakened, it is possible to appropriately transport the substrate while preventing the substrate from being displaced relative to the transport arm or falling off the transport arm, without stopping the substrate transport as a suction error even when the substrate is adsorbed by the suction ports of the two adsorption units.

[0116] Example 6 In the device of Example 2, the control unit may be configured to execute a process of controlling the drive unit to move the transport arm at a first speed when it is determined that the back surface of the substrate is adsorbed by the suction port in the first suction unit group and the suction port in the second suction unit group as a result of detection by the first sensor and the second sensor, execute a process of controlling the drive unit to move the transport arm at a second speed slower than the first speed when it is determined that the back surface of the substrate is adsorbed by the suction port in the first suction unit group or the suction port in the second suction unit group, and execute a process of controlling the drive unit not to move the transport arm when it is determined that the back surface of the substrate is adsorbed by one or less of the suction ports in the first suction unit group and the second suction unit group. In this case, the same effect as the devices of Examples 4 and 5 can be obtained. In addition, in the case of Example 6, when the substrate is adsorbed by one or less suction ports of the suction units, the transport of the substrate is stopped as a suction error. Therefore, it is possible to prevent the substrate from being transported when the substrate is extremely poorly held by the transport arm.

[0117] Example 7 In any of the devices of Examples 1 to 6, at least one arm section may include a pair of a first arm section and a second arm section extending in the same direction from a base section, and the first suction section may be disposed on the tip side of the first arm section, the second suction section may be disposed on the tip side of the second arm section, the third suction section may be disposed on the base side of the first arm section, and the fourth suction section may be disposed on the base side of the second arm section. In the case of Example 7, even if the substrate is warped, the substrate is suction-held by at least two suction sections. More specifically, in the case of Example 7, the first and second suction sections constituting the first suction section group are located on the tip side of the first and second arm sections, respectively, and the third and fourth suction sections constituting the second suction section group are located on the base side of the first and second arm sections, respectively. Therefore, the substrate is suctioned by at least one of the tip side and the base side of the first and second arm sections. Therefore, even if the substrate is not flat due to warping or the like, the substrate can be appropriately transported by the transport arm. In particular, when the substrate is adsorbed at the tip side of the first and second arm parts, the substrate tends to be more easily maintained in the transport arm compared to when the substrate is adsorbed at the base side of the first and second arm parts. Therefore, even if an inertial force acts on the substrate when the transport arm moves in the extension direction of the first and second arm parts, or a centrifugal force acts on the substrate when the transport arm rotates, the substrate can be appropriately transported.

[0118] Example 8 In any of the devices of Examples 1 to 6, at least one arm section includes a pair of a first arm section and a second arm section extending in the same direction from a base section, and the first suction section is disposed on the tip side of the first arm section, the second suction section is disposed on the base side of the second arm section, the third suction section is disposed on the tip side of the second arm section, and the fourth suction section may be disposed on the base side of the first arm section. In the case of Example 8, even if the substrate has warpage or the like, the substrate is suction-held by at least two suction sections. Therefore, even if the substrate is not flat due to warpage or the like, the substrate can be appropriately transported by the transport arm. In addition, in the case of Example 8, the first and second suction sections constituting the first suction section group are located on the diagonal lines of the first and second arm sections, respectively, and the third and fourth suction sections constituting the second suction section group are located on the other diagonal lines of the first and second arm sections, respectively. Therefore, even if centrifugal force acts on the substrate when the transport arm rotates, the substrate can be transported appropriately.

[0119] Example 9 In the apparatus of Example 7 or Example 8, the first suction passage may be provided on one main surface of the transfer arm, and the second suction passage may include a first portion provided on one main surface of the transfer arm and a second portion communicating with the first portion through a through hole provided in the transfer arm and provided on the other main surface of the transfer arm. In this case, the first and second suction passages, which are suction passages of different systems, are fluidically independent while passing through each main surface of the transfer arm. Therefore, it is possible to independently suck the substrate by the suction port connected to the first suction passage and the suction port connected to the second suction passage while making the paths of the first and second suction passages compact.

[0120] Example 10. In the apparatus of Examples 1 to 6, at least one arm section may include a pair of a first arm section and a second arm section extending in the same direction from a base section, and the first suction section may be disposed on the tip side of the first arm section, the second suction section may be disposed on the base side of the first arm section, the third suction section may be disposed on the tip side of the second arm section, and the fourth suction section may be disposed on the base side of the second arm section. In the case of Example 10, even if the substrate is warped, the substrate is suction-held by at least two suction sections. More specifically, in the case of Example 10, the first and second suction sections constituting the first suction section group are located on the first arm section, and the third and fourth suction sections constituting the second suction section group are located on the second arm section. Therefore, even if the substrate is warped, the substrate is suction-held by at least two suction sections. Therefore, even if the substrate is not flat due to warping, the substrate can be appropriately transported by the transport arm.

[0121] Example 11 In any of the devices of Examples 1 to 10, the drive unit may be configured to move the transport arm along at least one of an X-axis extending horizontally, a Y-axis extending horizontally and perpendicular to the X-axis, a Z-axis extending vertically and perpendicular to both the X-axis and the Y-axis, and a θ direction around the Z-axis. In this case, the substrate can be transported in various directions by the transport arm.

[0122] Example 12 In the apparatus of Example 11, the control unit may be configured to execute a process of controlling the drive unit to move the transport arm along the Z axis at a first speed, and execute a process of controlling the drive unit to move the transport arm along any one of the X axis, Y axis, and θ direction at a second speed slower than the first speed. When the substrate is transported along the Z axis direction (vertical direction), the substrate is less likely to be displaced from the transport arm or to fall off from the transport arm. Therefore, by moving the transport arm at a relatively fast first speed, the substrate can be transported efficiently. On the other hand, when the substrate is transported along the X axis direction, Y axis direction, or θ direction, the substrate is more likely to be displaced from the transport arm or to fall off from the transport arm due to the action of inertia force on the substrate, compared to when the substrate is transported along the Z axis direction (vertical direction). However, in Example 12, in this case, the transport arm is moved at a second speed slower than the first speed. This weakens the inertial force acting on the substrate, making it possible to properly transport the substrate while preventing the substrate from shifting position relative to the transport arm or falling off the transport arm.

[0123] Example 13: Another example of a substrate transport device includes a transport arm, a drive unit for moving the transport arm, and a control unit configured to control the drive unit. The transport arm includes a base unit, at least one arm unit connected to the base unit so as to extend from the base unit and extend to surround the outer periphery of the substrate, a plurality of suction units provided on the at least one arm unit and each including a suction port for suctioning the peripheral portion on the back surface of the substrate, and a plurality of suction passages provided on the at least one arm unit. The plurality of suction passages are respectively connected to the suction ports of the different plurality of suction units. In this case, the substrate is sucked through the plurality of suction passages and sucked at the suction ports of at least two of the plurality of suction units. That is, even if the substrate is warped, the substrate is sucked and held at at least two suction units. Therefore, even if the substrate is not flat due to warping, the substrate can be appropriately transported by the transport arm.

[0124] Example 14: The device of Example 13 may further include a plurality of sensors configured to detect the pressure in each of the suction passages, and the control unit may be configured to execute a process of changing the moving speed of the transfer arm by the drive unit based on the detection results of the plurality of sensors. In this case, the same effects as those of the device of Example 2 can be obtained.

[0125] Example 15. In the apparatus of Example 14, the control unit may be configured to execute a process of controlling the drive unit to move the transfer arm at a first speed when it is determined that the back surface of the substrate is adsorbed by the suction ports of three or more of the plurality of suction units as a result of detection by the plurality of sensors, execute a process of controlling the drive unit to move the transfer arm at a second speed slower than the first speed when it is determined that the back surface of the substrate is adsorbed by the suction ports of two of the plurality of suction units, and execute a process of controlling the drive unit not to move the transfer arm when it is determined that the back surface of the substrate is adsorbed by the suction ports of one or less of the plurality of suction units. In this case, the same action and effect as the apparatus of Example 6 can be obtained.

[0126] Example 16. An example of a substrate transport method is a method of transporting a substrate to each of a plurality of processing modules configured to process the substrate by a transport arm provided in a substrate transport device. The transport arm includes a base portion, at least one arm portion connected to the base portion so as to extend from the base portion and extend to surround the outer periphery of the substrate, a plurality of suction units provided on the at least one arm portion and each including a suction port for suctioning the peripheral portion on the back surface of the substrate, and a plurality of suction passages provided on the at least one arm portion. The plurality of suction units include a first suction unit group including a first suction unit and a second suction unit, and a second suction unit group including a third suction unit and a fourth suction unit. The plurality of suction passages include a first suction passage connected to the suction ports of the first suction unit and the second suction unit, and a second suction passage connected to the suction ports of the third suction unit and the fourth suction unit. The substrate transport method includes a first step of detecting the pressure in the first suction passage by a first sensor, a second step of detecting the pressure in the second suction passage by a second sensor, and a third step of changing the moving speed of the transport arm based on the detection results by the first sensor and the second sensor. In this case, the same effects as those of the apparatuses of Examples 1 and 2 can be obtained.

[0127] Example 17 In the method of Example 16, the third step may include moving the transfer arm at a first speed when it is determined that the back surface of the substrate is adsorbed by the suction ports in the first suction unit group and the suction ports in the second suction unit group as a result of detection by the first sensor and the second sensor, moving the transfer arm at a second speed slower than the first speed when it is determined that the back surface of the substrate is adsorbed by the suction ports in the first suction unit group or the suction ports in the second suction unit group, and not moving the transfer arm when it is determined that the back surface of the substrate is adsorbed by one or less of the suction ports in the first suction unit group and the second suction unit group. In this case, the same effects as those of the apparatus of Example 6 can be obtained. [Explanation of symbols]

[0128] 1...substrate processing system, 3c...substrate transfer device, 10...transfer arm, 20...base portion, 30...arm portion, 30A...arm portion (first arm portion), 30B...arm portion (second arm portion), 40...suction portion, 40A...suction portion (first suction portion, first suction portion group), 40B...suction portion (third suction portion, second suction portion group), 40C...suction portion (second suction portion, first suction portion group), 40D...suction portion (fourth suction portion, second suction portion group), 41...suction port, 50...suction passage, 50A...suction passage (first suction passage), 5 0B...suction passage (second suction passage), 54...first passage (first part), 55...second passage (first part), 56...third passage (first part), 57...fourth passage (second part), 58...through hole, Ctr...controller (control part), DM...driving mechanism (driving part), S1...upper surface (one of the main surfaces), S2...lower surface (the other main surface), SE1...sensor (first sensor), SE2...sensor (second sensor), V1...speed (first speed), V2...speed (second speed), W...substrate, Wb...rear surface, Wc...periphery.

Claims

1. A transport arm; A drive unit that moves the transfer arm; A control unit configured to control the drive unit, The transport arm includes: A base portion; at least one arm portion connected to the base portion so as to extend from the base portion and extend so as to surround an outer periphery of the substrate; a plurality of suction units provided on the at least one arm unit, each including a suction port for suctioning a peripheral portion of a rear surface of the substrate; a plurality of suction passages provided in the at least one arm portion; The plurality of suction portions include a first suction portion group including a first suction portion and a second suction portion; a second suction portion group including a third suction portion and a fourth suction portion; The plurality of suction passages include a first suction passage connected to the suction ports of the first suction portion and the second suction portion; a second suction passage connected to the suction ports of the third suction portion and the fourth suction portion.

2. a first sensor configured to detect pressure in the first suction passage; a second sensor configured to detect pressure in the second suction passage; The apparatus according to claim 1 , wherein the control unit is configured to execute a process of changing a moving speed of the transport arm caused by the drive unit based on detection results by the first sensor and the second sensor.

3. 3. The apparatus of claim 2, wherein the control unit is configured to execute a process of changing a speed at which the transport arm is moved by the drive unit based on detection results by the first sensor and the second sensor and a movement direction of the transport arm.

4. The apparatus of claim 2, wherein the control unit is configured to execute a process of controlling the drive unit to move the transport arm at a first speed when it is determined as a result of detection by the first sensor and the second sensor that the back surface of the substrate is adsorbed by the suction ports of the first to fourth suction units.

5. 5. The apparatus of claim 4, wherein the control unit is configured to execute a process of controlling the drive unit to move the transport arm at a second speed slower than the first speed when it determines, as a result of detection by the first sensor and the second sensor, that the pressure in one of the first suction passage and the second suction passage is higher than a predetermined threshold value and that the pressure in the other of the first suction passage and the second suction passage is equal to or lower than the threshold value.

6. The control unit detects a result of the detection by the first sensor and the second sensor, executing a process of controlling the drive unit to move the transport arm at a first speed when it is determined that the back surface of the substrate is attracted by the suction ports of the first suction unit group and the suction ports of the second suction unit group; when it is determined that the back surface of the substrate is attracted by the suction port of the first suction unit group or the suction port of the second suction unit group, executing a process of controlling the drive unit to move the transport arm at a second speed slower than the first speed; The apparatus of claim 2, further comprising: a control unit that controls the drive unit so as not to move the transport arm when it is determined that the back surface of the substrate is being adsorbed by one or less of the suction ports in the first suction unit group and the second suction unit group.

7. the at least one arm portion includes a pair of a first arm portion and a second arm portion extending in the same direction from the base portion, the first suction portion is disposed on a tip side of the first arm portion, the second suction portion is disposed on a tip side of the second arm portion, the third suction portion is disposed on a side of the first arm portion facing the base portion, The device according to claim 1 , wherein the fourth suction portion is disposed on a side of the second arm portion facing the base portion.

8. the at least one arm portion includes a pair of a first arm portion and a second arm portion extending in the same direction from the base portion, the first suction portion is disposed on a tip side of the first arm portion, the second suction portion is disposed on a side of the second arm portion facing the base portion, the third suction portion is disposed on a tip side of the second arm portion, The device according to claim 1 , wherein the fourth suction portion is disposed on a side of the first arm portion that faces the base portion.

9. the first suction passage is provided on one main surface side of the transfer arm, The second suction passage includes: A first portion provided on one main surface side of the transport arm; 9. The apparatus according to claim 7, further comprising: a second portion communicating with the first portion through a through hole provided in the transfer arm and provided on the other main surface side of the transfer arm.

10. the at least one arm portion includes a pair of a first arm portion and a second arm portion extending in the same direction from the base portion, the first suction portion is disposed on a tip side of the first arm portion, the second suction portion is disposed on a side of the first arm portion facing the base portion, the third suction portion is disposed on a tip side of the second arm portion, The device according to claim 1 , wherein the fourth suction portion is disposed on a side of the second arm portion that faces the base portion.

11. 2. The apparatus according to claim 1, wherein the drive unit is configured to move the transport arm along at least one of an X-axis extending along a horizontal direction, a Y-axis extending along the horizontal direction and perpendicular to the X-axis, a Z-axis extending along a vertical direction and perpendicular to both the X-axis and the Y-axis, and a θ direction around the Z-axis.

12. The control unit is performing a process of controlling the drive unit to move the transport arm along the Z axis at a first speed; 12. The apparatus of claim 11, further comprising: a process for controlling the drive unit to move the transport arm along any one of the X-axis, the Y-axis, and the θ-direction at a second speed slower than the first speed.

13. A transport arm; A drive unit that moves the transfer arm; A control unit configured to control the drive unit, The transport arm includes: A base portion; at least one arm portion connected to the base portion so as to extend from the base portion and extend so as to surround an outer periphery of the substrate; a plurality of suction units provided on the at least one arm unit, each including a suction port for suctioning a peripheral portion of a rear surface of the substrate; a plurality of suction passages provided in the at least one arm portion; A substrate transport device, wherein the plurality of suction passages are respectively connected to the suction ports of different of the plurality of adsorption portions.

14. a plurality of sensors configured to detect pressure in each of the plurality of suction passages, The apparatus according to claim 13 , wherein the control unit is configured to execute a process of changing a moving speed of the transport arm caused by the drive unit based on detection results by the plurality of sensors.

15. The control unit detects the result of the detection by the plurality of sensors. executing a process of controlling the drive unit to move the transport arm at a first speed when it is determined that the back surface of the substrate is attracted by the suction ports of three or more of the plurality of suction units; when it is determined that the back surface of the substrate is attracted by the suction ports of two of the plurality of suction units, executing a process of controlling the drive unit to move the transport arm at a second speed that is slower than the first speed; The apparatus of claim 14, configured to execute a process of controlling the drive unit so as not to move the transport arm when it is determined that the back surface of the substrate is being adsorbed by the suction port in one or less of the plurality of adsorption units.

16. 1. A substrate transport method for transporting a substrate to each of a plurality of processing modules configured to process the substrate by a transport arm of a substrate transport apparatus, comprising: The transport arm includes: A base portion; at least one arm portion connected to the base portion so as to extend from the base portion and extend so as to surround an outer periphery of the substrate; a plurality of suction units provided on the at least one arm unit, each including a suction port for suctioning a peripheral portion of a rear surface of the substrate; a plurality of suction passages provided in the at least one arm portion; The plurality of suction portions include a first suction portion group including a first suction portion and a second suction portion; a second suction portion group including a third suction portion and a fourth suction portion, The plurality of suction passages include a first suction passage connected to the suction ports of the first suction portion and the second suction portion; a second suction passage connected to the suction ports of the third suction portion and the fourth suction portion, The substrate transport method includes: a first step of detecting a pressure in the first suction passage by a first sensor; a second step of detecting a pressure in the second suction passage with a second sensor; and a third step of changing a moving speed of the transport arm based on detection results by the first sensor and the second sensor.

17. The third step includes detecting, as a result of detection by the first sensor and the second sensor, moving the transport arm at a first speed when it is determined that the back surface of the substrate is attracted by the suction ports of the first suction portion group and the suction ports of the second suction portion group; moving the transport arm at a second speed slower than the first speed when it is determined that the back surface of the substrate is attracted by the suction port of the first suction portion group or the suction port of the second suction portion group; The method according to claim 16, further comprising not moving the transport arm when it is determined that the back surface of the substrate is being adsorbed by one or less of the suction ports in the first suction portion group and the second suction portion group.

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