Curable resin film composite sheet and method of manufacturing cured sealing body

Abstract

To provide a curable resin film composite sheet capable of forming a cured sealing body without fixing to a rigid support.SOLUTION: A curable resin film composite sheet includes a curable resin film and a support sheet supporting the curable resin film, and seals, with a sealing material, an object to be sealed of the curable resin film or a cured product of the curable resin film on a first surface that is a surface opposite the surface in contact with the support sheet, in a state where the outer periphery of the support sheet is fixed directly or through other layer to an annular jig. The curable resin film composite sheet is used to manufacture a cured sealing body including a cured product of the curable resin film, the object to be sealed on a cured product of the curable resin film, and a cured product of the sealing material to seal the object to be sealed.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for producing a curable resin film composite sheet and a cured sealed article. [Background technology]

[0002] In recent years, electronic devices have become smaller, lighter, and more functional, and semiconductor chips are sometimes mounted in packages that are close to the size of the chips. Such packages are sometimes called CSPs (Chip Scale Packages). Examples of CSPs include WLPs (Wafer Level Packages), which are completed through processing up to the final packaging process at wafer size, and PLPs (Panel Level Packages), which are completed through processing up to the final packaging process at panel size, which is several hundred millimeters on each side and is larger than the wafer size.

[0003] WLP and PLP are classified into Fan-In type and Fan-Out type. In Fan-Out type WLP (hereinafter also referred to as "FOWLP") and PLP (hereinafter also referred to as "FOPLP"), a semiconductor chip is covered with an encapsulant in an area larger than the chip size to form a hardened encapsulated body of the semiconductor chip, and a redistribution layer and external electrodes are formed not only on the circuit surface of the semiconductor chip but also on the surface area of ​​the encapsulant.

[0004] FOWLPs and FOPLPs are manufactured, for example, through an arrangement process in which a plurality of semiconductor chips are arranged on a temporary fixing sheet, a sealing process in which the plurality of semiconductor chips are covered with a thermosetting sealing material and the sealing material is thermally cured to obtain a hardened sealing body, a peeling process in which the hardened sealing body is peeled off from the temporary fixing sheet, and a rewiring layer formation process in which a rewiring layer is formed on the surface of the exposed semiconductor chip side.

[0005] Patent Document 1 describes a method for manufacturing a semiconductor package using a semiconductor process sheet having a laminated structure including at least an adhesive-reduced adhesive layer, an adhesive layer, and a substrate located therebetween, the double-sided adhesive sheet having a first adhesive surface and an opposite second adhesive surface, and a partial sealant layer releasably adhered to the second adhesive surface of the double-sided adhesive sheet, the method including a chip mounting step of mounting a plurality of semiconductor chips on the partial sealant layer of the semiconductor process sheet, the first adhesive surface of which is attached to a support; a sealing step of supplying a sealant on the semiconductor process sheet so as to embed the plurality of semiconductor chips, and hardening the sealant and the partial sealant layer to form a sealant portion; a detaching step including separating the sealant portion from the second adhesive surface; a wiring forming step of forming a wiring structure portion including wiring for each semiconductor chip on the sealant portion; and a singulation step of dividing the sealant portion and the wiring structure portion into individual semiconductor chips to obtain a semiconductor package. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2019-91845 A Summary of the Invention [Problem to be solved by the invention]

[0007] As in the method described in Patent Document 1, a hard support is attached to one side of a double-sided adhesive sheet, a curable resin film (the partial sealant layer of Patent Document 1) is laminated to the other side, an object to be sealed is placed on the curable resin film, and the object to be sealed is sealed with a sealant while the sealant and curing resin film are cured, thereby obtaining a cured sealed body in which the object to be sealed is sealed with the cured product of the sealant and the cured product of the curable resin film. However, in processes using a hard support, the hard support itself is difficult to handle, and operations such as attaching and removing the hard support are complicated. Therefore, a technology for producing a cured encapsulated body with good productivity without using a hard support is desired.

[0008] In view of the above problems, an object of the present invention is to provide a curable resin film composite sheet that can form a cured sealed body without being fixed to a rigid support, and a method for producing the cured sealed body. [Means for solving the problem]

[0009] Means for Solving the Problems The present inventors have conducted extensive research to solve the above problems, and as a result have found that the above problems can be solved by the present invention described below, and have completed the present invention. That is, the present invention provides the following [1] to [4]. [1] A curable resin film and a support sheet that supports the curable resin film, A curable resin film composite sheet used to produce a cured sealed body having the cured product of the curable resin film, the sealed object on the cured product of the curable resin film, and the cured product of the sealant that seals the sealed object, by sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film, which is the surface opposite to the surface in contact with the support sheet, with a sealant, while the outer periphery of the support sheet is fixed to a ring-shaped jig directly or via another layer. [2] The curable resin film composite sheet according to [1] above, wherein the support sheet has a substrate layer which is a resin film. [3] A fixing step of fixing a curable resin film composite sheet having a curable resin film and a support sheet supporting the curable resin film to an annular jig at an outer periphery of the support sheet directly or via another layer; A placement step of placing an object to be sealed on a first surface of the curable resin film, the first surface being opposite to the surface in contact with the support sheet; a sealing step of sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film with a sealing material to obtain a cured and sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealing material sealing the object to be sealed; and a peeling step of peeling the cured sealed body from the support sheet, in this order. [4] a fixing step of fixing the support sheet to an annular jig at an outer periphery of the support sheet directly or via another layer; a lamination step of laminating a curable resin film on the support sheet to form a laminate (1) having the support material and the curable resin film; A placement step of placing an object to be sealed on a first surface of the curable resin film, the first surface being opposite to the surface in contact with the support sheet; a sealing step of sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film with a sealing material to obtain a cured and sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealing material sealing the object to be sealed; and a peeling step of peeling the cured sealed body from the support sheet, in this order. Effect of the Invention

[0010] According to the present invention, it is possible to provide a curable resin film composite sheet capable of forming a cured sealed body without being fixed to a hard support, and a method for producing the cured sealed body. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic cross-sectional view of a curable resin film composite sheet 11, which is an example of the curable resin film composite sheet of the present embodiment. [Diagram 2] FIG. 1 is a schematic cross-sectional view of a curable resin film composite sheet 12, which is an example of the curable resin film composite sheet of the present embodiment. [Diagram 3] FIG. 2 is a schematic cross-sectional view of a curable resin film composite sheet 13, which is an example of the curable resin film composite sheet of the present embodiment. [Figure 4] 1 is a schematic cross-sectional view showing an example of use of the curable resin film composite sheet of the present embodiment. FIG. [Diagram 5] 3A to 3C are schematic cross-sectional views showing a part of an example of a method for producing a cured sealed body according to the present embodiment. [Figure 6] 3A to 3C are schematic cross-sectional views showing a part of an example of a method for producing a cured sealed body according to the present embodiment. [Figure 7] 3A to 3C are schematic cross-sectional views showing a part of an example of a method for producing a cured sealed body according to the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] As used herein, the term "active ingredient" refers to the components contained in the target composition excluding diluent solvents. In this specification, the weight average molecular weight (Mw) is a value calculated as standard polystyrene measured by gel permeation chromatography (GPC), specifically, a value measured based on the method described in the examples. In this specification, for example, "(meth)acrylic acid" refers to both "acrylic acid" and "methacrylic acid", and similar terms. In this specification, the lower limit and upper limit described in stages for the preferred numerical range (e.g., range of content, etc.) can be independently combined. For example, the description "preferably 10 to 90, more preferably 30 to 60" can be combined with the "preferable lower limit (10)" and the "more preferable upper limit (60)" to form "10 to 60."

[0013] In this specification, the term "energy ray" refers to electromagnetic waves or charged particle beams that have an energy quantum, and examples of such beams include ultraviolet rays, radioactive rays, and electron beams. In this specification, "energy ray curable" means a property that is cured by irradiation with energy rays, and "non-energy ray curable" means a property that is not cured even when irradiated with energy rays. The energy ray used in this embodiment is preferably ultraviolet ray, from the viewpoints of the ready availability of components having energy ray curability, the ease of handling of an energy ray irradiation device, and the like. In this specification, the thickness of each layer constituting the curable resin film composite sheet can be measured by observing the cross section of the curable resin film composite sheet with a scanning electron microscope. As the scanning electron microscope, "FE-SEM S-4700" manufactured by Hitachi High-Tech Corporation can be used.

[0014] [Curing resin film composite sheet] The curable resin film composite sheet of the present embodiment is A curable resin film and a support sheet that supports the curable resin film, The curable resin film composite sheet is used to produce a cured sealed body having the cured product of the curable resin film, the sealed object on the cured product of the curable resin film, and the cured product of the sealant that seals the sealed object, by sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film, which is the surface opposite to the surface in contact with the support sheet, with a sealant while the outer periphery of the support sheet is fixed to a ring-shaped jig directly or via another layer.

[0015] As described above, the curable resin film composite sheet of the present embodiment is used to produce a cured sealed body. By sealing an object to be sealed on the curable resin film of the curable resin film composite sheet of the present embodiment, a cured sealed body in which the occurrence of warping is suppressed can be produced. Furthermore, the curable resin film composite sheet of this embodiment is used to manufacture a cured sealed body in a state where the outer periphery of the support sheet is fixed to an annular jig directly or via another layer. Therefore, the cured sealed body can be manufactured with good productivity without attaching the curable resin film to the hard support via a double-sided adhesive sheet or the like. As a result, it is possible to reduce the number of components of the hard support and the work of attaching and removing the hard support, thereby simplifying the manufacturing process.

[0016] Hereinafter, the curable resin film composite sheet of the present embodiment will be described with reference to the drawings.

[0017] 1 to 3 are schematic cross-sectional views illustrating an example of the curable resin film composite sheet of the present embodiment. The curable resin film composite sheet 11 shown in Figure 1 has a support sheet 5, a curable resin film 10 laminated on one surface of the support sheet 5, and a ring-shaped double-sided adhesive sheet 6 laminated on the surface of the curable resin film 10 opposite the support sheet 5. The curable resin film composite sheet 11 shown in FIG. 1 is used for producing a cured sealed body in a state where the outer periphery of the support sheet 5 is fixed to an annular jig via a ring-shaped double-sided adhesive sheet 6.

[0018] The curable resin film composite sheet 12 shown in Figure 2 has a support sheet 5, a curable resin film 10 laminated on one surface of the support sheet 5, and a ring-shaped double-sided adhesive sheet 6 laminated in a curable resin film non-laminated area A, which is an area of ​​the support sheet 5 where the curable resin film 10 is not laminated. The curable resin film composite sheet 12 shown in FIG. 2 is used for producing a cured sealed body in a state where the outer periphery of the support sheet 5 is fixed to an annular jig via a ring-shaped double-sided adhesive sheet 6.

[0019] The curable resin film composite sheet 13 shown in FIG. 3 has a support sheet 5 and a curable resin film 10 laminated on one surface of the support sheet 5 . The curable resin film composite sheet 13 shown in Figure 3 is used to manufacture a cured sealed body, with the outer periphery of the support sheet 5 in the curable resin film non-laminated area B, which is the area of ​​the support sheet 5 where the curable resin film 10 is not laminated, fixed to a ring-shaped jig.

[0020] The shape of the curable resin film composite sheet in plan view is not particularly limited, but from the viewpoint of productivity of the cured sealed product, a substantially rectangular shape is preferable. In this embodiment, "approximately rectangular" refers to, for example, a square or a rectangle, but also includes a shape in which at least one corner is notched, or a shape in which at least one corner is rounded and curved, and at least one side may be formed by a curve or a broken line.

[0021] Hereinafter, each member constituting the curable resin film composite sheet will be described.

[0022] <Curing resin film> The size of the curable resin film in a planar view may be adjusted depending on the size of the cured sealed body to be formed. For example, when the curable resin film has a substantially rectangular shape in a planar view, the length of one side may be 100 to 1,000 mm, 150 to 800 mm, or 200 to 700 mm.

[0023] When the curable resin film and the support sheet are substantially rectangular in plan view, it is preferable that each of the four sides constituting the outer edge of the curable resin film in plan view is substantially parallel to the outer edge of the support sheet in plan view. In this embodiment, "substantially parallel" does not only mean that they are strictly parallel, but also means that the angle between the two lines is 10° or less.

[0024] The thickness of the curable resin film is preferably 10 to 300 μm, more preferably 13 to 250 μm, even more preferably 17 to 150 μm, and even more preferably 20 to 100 μm. When the thickness of the curable resin film is equal to or greater than the lower limit, the occurrence of warping of the cured encapsulated body tends to be sufficiently suppressed. When the thickness of the curable resin film is equal to or less than the upper limit, the economic efficiency is excellent. When the encapsulated object is a semiconductor chip and the cured product of the curable resin film is used as a back surface protective film for the semiconductor chip, the semiconductor package tends to be easily miniaturized. In addition, when the curable resin film includes multiple layers, the thicknesses of the layers may be set so that the total thickness is in the same numerical range as the thickness of the curable resin film. In this case, the thicknesses of the multiple layers may all be the same, or a layer having a thickness different from the other layers may be present.

[0025] The curable resin film may be a thermosetting resin film in which a curing reaction proceeds by heating, or an energy ray curable resin film in which a curing reaction proceeds by irradiation with energy rays. The curable resin film may be both thermosetting and energy ray curable, but is preferably thermosetting from the viewpoint of being cured simultaneously with the sealing material in the sealing step described later.

[0026] The curable resin film may be a single layer, or may have a laminated structure of two or more layers. When the curable resin film has a laminated structure of two or more layers, it may have two or more layers having thermosetting properties, may have two or more layers having energy ray curing properties, or may have a layer having thermosetting properties and a layer having energy ray curing properties. The thermosetting resin film and the energy ray curable resin film are not particularly limited, and known thermosetting resin films and energy ray curable resin films can be appropriately used.

[0027] (Thermosetting resin film) The thermosetting resin film is preferably formed using a thermosetting resin composition containing a polymer component (A) and a thermosetting component (B). The thermosetting resin composition may further contain one or more members selected from the group consisting of a colorant (C), a coupling agent (D) and an inorganic filler (E).

[0028] [Polymer component (A)] The polymer component (A) preferably has a weight average molecular weight (Mw) of 20,000 or more, and refers to a compound having at least one type of repeating unit. When the thermosetting resin composition contains the polymer component (A), the flexibility and shape retention of the curable resin film can be improved. The weight average molecular weight (Mw) of the polymer component (A) is preferably from 20,000 to 3,000,000, more preferably from 50,000 to 2,000,000, even more preferably from 100,000 to 1,500,000, and still more preferably from 200,000 to 1,000,000.

[0029] The content of the polymer component (A) is preferably 5 to 50 mass %, more preferably 8 to 40 mass %, and further preferably 10 to 30 mass %, based on the total amount (100 mass %) of the active ingredients of the thermosetting resin composition.

[0030] Examples of the polymer component (A) include acrylic polymers, polyesters, phenoxy resins, polycarbonates, polyethers, polyurethanes, polysiloxanes, and rubber polymers. The polymer component (A) may be used alone or in combination of two or more kinds. In this specification, an acrylic polymer having an epoxy group and a phenoxy resin having an epoxy group are thermosetting, but as long as they are compounds having at least one type of repeating unit, they are included in the concept of polymer component (A).

[0031] The polymer component (A) preferably contains an acrylic polymer (A1). The content of the acrylic polymer (A1) in the polymer component (A) is preferably 60 to 100 mass%, more preferably 70 to 100 mass%, even more preferably 80 to 100 mass%, and still more preferably 90 to 100 mass%, based on the total amount (100 mass%) of the polymer component (A).

[0032] -Acrylic polymer (A1)- The acrylic polymer (A1) may be a polymer containing an alkyl (meth)acrylate as a main component. Specifically, an acrylic polymer containing a structural unit (a1) derived from an alkyl (meth)acrylate (a1') having an alkyl group having 1 to 18 carbon atoms (hereinafter also referred to as "monomer (a1')") is preferred, and an acrylic copolymer containing, together with the structural unit (a1), a structural unit (a2) derived from a functional group-containing monomer (a2') (hereinafter also referred to as "monomer (a2')") is more preferred. The acrylic polymer (A1) may be used alone or in combination of two or more kinds.

[0033] From the viewpoint of imparting flexibility and shape retention to the curable resin film, the number of carbon atoms in the alkyl group of the monomer (a1') is preferably 1 to 18, more preferably 1 to 12, and further preferably 1 to 8. The alkyl group may be a linear alkyl group or a branched alkyl group. The monomer (a1') may be used alone or in combination of two or more kinds.

[0034] The monomer (a2') is preferably at least one selected from the group consisting of hydroxy group-containing monomers and epoxy group-containing monomers. The monomer (a2') may be used alone or in combination of two or more kinds.

[0035] The acrylic polymer (A1) may contain structural units derived from monomers other than the structural units (a1) and (a2) described above, as long as the effects of the present invention are not impaired. Examples of such other monomers include vinyl acetate, styrene, ethylene, and α-olefins.

[0036] [Thermosetting component (B)] The thermosetting component (B) serves to thermally cure the curable resin film to form a hard cured resin layer, and is preferably a compound having a weight average molecular weight (Mw) of less than 20,000. The weight average molecular weight (Mw) of the thermosetting component (B) is preferably 10,000 or less, and more preferably 100 to 10,000.

[0037] From the viewpoint of obtaining a curable resin film that can effectively suppress warping of the cured sealed body, the thermosetting component (B) preferably contains an epoxy compound (B1), which is a compound having an epoxy group, and a thermosetting agent (B2), and more preferably contains a curing accelerator (B3) in addition to the epoxy compound (B1) and the thermosetting agent (B2).

[0038] Examples of the epoxy compound (B1) include epoxy compounds having two or more functional groups in the molecule, such as polyfunctional epoxy resins, bisphenol A diglycidyl ether and its hydrogenated products, orthocresol novolac epoxy resins, dicyclopentadiene type epoxy resins, biphenyl type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, and phenylene skeleton type epoxy resins. The epoxy compound (B1) may be used alone or in combination of two or more kinds.

[0039] The heat curing agent (B2) functions as a curing agent for the epoxy compound (B1). The heat curing agent (B2) is preferably a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, an acid anhydride, etc. Among these, from the viewpoint of obtaining a curable resin film that can effectively suppress warping of a cured sealed body, a phenolic hydroxyl group, an amino group, and an acid anhydride are preferred, a phenolic hydroxyl group and an amino group are more preferred, and an amino group is even more preferred.

[0040] The curing accelerator (B3) is a compound that has the function of increasing the rate of thermal curing when the curable resin film is thermally cured. Examples of the curing accelerator (B3) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. The curing accelerator (B3) may be used alone or in combination of two or more kinds.

[0041] [Colorant (C)] The thermosetting resin composition may further contain a colorant (C). By including the colorant (C) in the thermosetting resin composition, it is possible to impart the effect of making it easier to judge from the appearance whether or not the cured product of the curable resin film is present when the curable resin film is thermally cured, and it is also possible to impart the effect of blocking infrared rays and the like generated from surrounding devices, thereby preventing malfunction of objects to be sealed, such as semiconductor chips.

[0042] As the colorant (C), organic or inorganic pigments and dyes can be used. For example, among organic or inorganic pigments, black pigments include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, etc. Among these, carbon black is preferred from the viewpoint of enhancing the reliability of an object to be sealed such as a semiconductor chip when the cured product of the curable resin film is used as a back surface protective film for the object to be sealed such as a semiconductor chip. The colorant (C) may be used alone or in combination of two or more kinds.

[0043] [Coupling Agent (D)] The thermosetting resin composition may further contain a coupling agent (D). By including the coupling agent (D) in the thermosetting resin composition, it is possible to improve the adhesion between the curable resin film and the object to be encapsulated such as a semiconductor chip, etc. In addition, it is possible to improve the water resistance without impairing the heat resistance of the cured product of the curable resin film.

[0044] As the coupling agent (D), a compound that reacts with functional groups possessed by the polymer component (A), the thermosetting component (B), etc. is preferred, and specifically, a silane coupling agent is preferred. The coupling agent (D) may be used alone or in combination of two or more kinds.

[0045] [Inorganic filler (E)] From the viewpoint of forming a curable resin film capable of effectively suppressing warping of a cured sealed article, the thermosetting resin composition preferably contains an inorganic filler (E). By containing the inorganic filler (E) in the curable resin film, the difference in shrinkage stress between the two surfaces of the cured encapsulant can be adjusted to be small when the encapsulant is cured, making it possible to produce a flatter cured encapsulant. In addition, the thermal expansion coefficient of the cured product of the curable resin film can be adjusted to an appropriate range, and when the cured product of the curable resin film is used as a back surface protection film for an encapsulated object such as a semiconductor chip, the reliability of the encapsulated object can be improved. Furthermore, the moisture absorption rate of the cured product of the curable resin film can be reduced.

[0046] Examples of the inorganic filler (E) include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, etc., beads obtained by shaping these into spherical particles, single crystal fibers, and glass fibers. The inorganic filler (E) may be used alone or in combination of two or more kinds. Among these, silica and alumina are preferred from the viewpoint of forming a curable resin film that can effectively suppress warping of the cured sealed body.

[0047] [Other additives] The thermosetting resin composition may further contain additives other than the above-mentioned components (A) to (E) to the extent that the effects of the present invention are not impaired. Examples of other additives include a crosslinking agent, a leveling agent, a plasticizer, an antistatic agent, an antioxidant, an ion trapping agent, a gettering agent, and a chain transfer agent.

[0048] (Energy ray curable resin film) Since the adhesive strength of the energy ray-curable resin film can be easily adjusted, it is easy to fix the object to be sealed on the curable resin film more reliably.

[0049] The energy ray curable resin film is preferably a photocurable resin film, and is preferably formed from a photocurable resin composition containing a photocurable component and a photopolymerization initiator. The light used to cure the photocurable resin film is preferably ultraviolet light. That is, the photocurable resin film is preferably an ultraviolet light curable resin film. Examples of the photocurable component include an acrylic polymer having a photocurable double bond such as a (meth)acryloyl group or a vinyl group, a monomer or oligomer having a photocurable double bond, an epoxy resin having a photocurable double bond, and a phenol resin having a photocurable double bond.

[0050] Examples of the photopolymerization initiator include 1-hydroxycyclohexylphenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzyl phenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, and 8-chloroanthraquinone. The photopolymerization initiator may be used alone or in combination of two or more kinds.

[0051] The photocurable resin composition may contain other components in addition to the photocurable component and the photopolymerization initiator depending on the purpose. Examples of the other components include the components described above as the components that may be contained in the thermosetting resin composition.

[0052] <Support sheet> The support sheet is preferably a pressure-sensitive adhesive sheet having a substrate and a pressure-sensitive adhesive layer on at least one side of the substrate. The pressure-sensitive adhesive sheet may be a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer only on one side of the substrate (hereinafter also referred to as a "single-sided pressure-sensitive adhesive sheet"), or a double-sided pressure-sensitive adhesive sheet having pressure-sensitive adhesive layers on both sides of the substrate, but is preferably a single-sided pressure-sensitive adhesive sheet.

[0053] (Adhesive layer) The pressure-sensitive adhesive layer can be formed, for example, from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin. The adhesive resin may be, for example, a polymer that has adhesiveness by itself and has a weight average molecular weight (Mw) of 10,000 or more. Note that the adhesive resin may not have adhesiveness by itself, but may exhibit adhesiveness by adding a tackifier or plasticizer.

[0054] Examples of the adhesive resin include acrylic resins, urethane resins, polyisobutylene resins, polyester resins, olefin resins, silicone resins, polyvinyl ether resins, etc. Among these, from the viewpoint of imparting excellent adhesive strength to the adhesive layer, it is preferable that the adhesive resin contains an acrylic resin.

[0055] When the pressure-sensitive adhesive composition contains a pressure-sensitive adhesive resin having a functional group, it is preferable that the pressure-sensitive adhesive composition further contains a crosslinking agent that reacts with the pressure-sensitive adhesive resin having a functional group to crosslink the pressure-sensitive adhesive resins with each other using the functional group as a crosslinking starting point. Examples of the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, an aziridine-based crosslinking agent, and a metal chelate-based crosslinking agent. The crosslinking agent may be used alone or in combination of two or more kinds.

[0056] The pressure-sensitive adhesive composition may contain, in addition to the above-mentioned components, pressure-sensitive adhesive additives used in general pressure-sensitive adhesives, so long as the effects of the present invention are not impaired. Examples of the adhesive additives include tackifiers, antioxidants, softeners (plasticizers), rust inhibitors, pigments, dyes, retarders, reaction accelerators (catalysts), and ultraviolet absorbers. The pressure-sensitive adhesive additives may be used alone or in combination of two or more kinds.

[0057] The adhesive layer of the adhesive sheet may have a mechanism for reducing the adhesive strength of the adhesive layer when peeled off from the adherend, or may not have such a mechanism. As an adhesive layer having a mechanism for reducing the adhesive strength of the adhesive layer when peeled off from the adherend, an energy ray curable adhesive layer whose adhesive strength is reduced by irradiation with energy rays is preferable from the viewpoint that the adhesive strength can be reduced by a simple means of irradiation with energy rays. When the curable resin film is energy ray curable, the energy ray curable component contained in the energy ray curable resin film reacts with the energy ray curable component contained in the energy ray curable adhesive layer, which may cause a problem that it is difficult to peel off the cured sealed body from the adhesive layer. On the other hand, when the curable resin film is thermosetting, it is possible to prevent such a problem from occurring. Therefore, when the curable resin film is thermosetting, an energy ray curable adhesive layer can be preferably used. The adhesive layer may be a heat-peelable adhesive layer. Examples of the heat-peelable adhesive layer include an adhesive layer itself containing heat-expandable particles, and the heat-expandable particles expand when heated, forming unevenness on the surface of the adhesive layer and reducing the adhesive strength, or an adhesive layer in which the substrate contains heat-expandable particles, and the heat-expandable particles in the substrate expand when heated, forming unevenness on the surface of the adhesive layer and reducing the adhesive strength. The heat-peelable adhesive layer can also be suitably used when the curable resin film is energy ray curable.

[0058] Here, in the conventional manufacturing method of the cured sealed body, from the viewpoint of productivity of the cured sealed body, a manufacturing method has been adopted in which a hard support is attached to one surface of a double-sided pressure-sensitive adhesive sheet, and a cured sealed body is manufactured on the surface of the double-sided pressure-sensitive adhesive sheet opposite to the hard support. In such a manufacturing method, since it is difficult to peel off the cured sealed body from the double-sided pressure-sensitive adhesive sheet attached to the hard support, a method has been adopted in which heat-expanding particles are blended into one of the pressure-sensitive adhesive layers of the double-sided pressure-sensitive adhesive sheet, and the heat-expanding particles are expanded by heating to reduce the peeling force between the pressure-sensitive adhesive layer and the adherend. However, since the heat-expanding particles are particulate, they may fall off during the manufacturing process of the cured sealed body, causing defects, and it is desirable to avoid their use as much as possible. Since the curable resin film composite sheet of the present embodiment is used with the support sheet fixed to the annular jig, it is not necessary to support the curable resin film composite sheet with a hard support, and no thermally expandable particles are required to peel off the hard support, so that the occurrence of the above-mentioned problems caused by the thermally expandable particles can be suppressed.

[0059] The energy ray-curable pressure-sensitive adhesive layer is formed from an energy ray-curable pressure-sensitive adhesive composition. The energy ray curable adhesive composition may be, for example, a composition containing an energy ray curable polymer in which an energy ray curable double bond such as a (meth)acryloyl group or a vinyl group is introduced into the side chain of the polymer listed as the adhesive resin, or a composition containing a monomer or oligomer having an energy ray curable double bond. When these compositions are used as light ray curable adhesive compositions, the composition preferably further contains a photopolymerization initiator. The light used to cure the light ray curable adhesive is preferably ultraviolet light. That is, the light ray curable adhesive is preferably an ultraviolet light curable adhesive. The photopolymerization initiator may be the same as the photopolymerization initiator that may be contained in the photocurable resin composition. The energy ray-curable pressure-sensitive adhesive composition may contain, in addition to the energy ray-curable polymer and photopolymerization initiator, the above-mentioned crosslinking agent, other pressure-sensitive adhesive additives, and the like, if necessary.

[0060] From the viewpoints of releasability and adhesion to an adherend, the thickness of the pressure-sensitive adhesive layer is preferably 1 to 100 μm, more preferably 3 to 80 μm, even more preferably 5 to 50 μm, and even more preferably 10 to 35 μm.

[0061] (base material) The substrate is preferably a resin film. From the viewpoint of heat resistance, the resin constituting the resin film is preferably a resin selected from the group consisting of aromatic polyimide, aromatic polyamide, aromatic polyamideimide, aromatic polysulfone, aromatic polyethersulfone, polyphenylene sulfide, aromatic polyetherketone, polyarylate, aromatic polyetheretherketone, and polyethylene naphthalate. Here, in this embodiment, since the sealing object is sealed with the sealing material while the outer periphery of the support sheet is fixed to the annular jig, unlike the case where the support sheet is fixed to the hard support like a double-sided adhesive sheet, it has an independent region that is not laminated to the hard support. Therefore, in order to prevent the occurrence of slackness, it is preferable to use a resin with higher heat resistance. If the curable resin film does not have a curable resin film non-laminated region on the support sheet as shown in FIG. 1, the cured product of the curable resin film can be formed in the independent region that is not laminated to the hard support, which can reinforce the heat resistance of the support sheet. On the other hand, when a curable resin film composite sheet having a curable resin film non-laminated region is used for the support sheet 5 around the curable resin film as shown in FIG. 2 and FIG. 3, the effect of reinforcing the heat resistance of the support sheet by the cured product of the curable resin film cannot be sufficiently obtained, so it is preferable to use a resin with high heat resistance for the resin film.

[0062] Conventionally, a curable resin film composite sheet in which a curable resin film and a support sheet are laminated has been known, but the support sheet is used for dicing a semiconductor wafer or the like having a cured product of the curable resin film formed on the back surface, and in order to maintain suitability for the expanding process and the pick-up process following the dicing process, the support sheet is generally required to have extensibility or flexibility. The support sheet according to the present embodiment is not primarily intended to be used for dicing, and does not need to have such extensibility or flexibility. Therefore, the above-mentioned highly heat-resistant resin, which is difficult to obtain these characteristics, can also be used. The thickness of the substrate is preferably 5 to 500 μm, more preferably 15 to 300 μm, and further preferably 20 to 200 μm.

[0063] <Ring-shaped double-sided adhesive sheet> As the ring-shaped double-sided pressure-sensitive adhesive sheet, a known double-sided pressure-sensitive adhesive sheet can be used. The ring-shaped double-sided pressure-sensitive adhesive sheet may be a single layer, or may have a laminated structure in which pressure-sensitive adhesive layers are laminated on both sides of a core sheet. The thickness of the ring-shaped double-sided pressure-sensitive adhesive sheet is not particularly limited, but is, for example, 20 to 150 μm. The ring-shaped double-sided pressure-sensitive adhesive sheet has an annular shape in a plan view, and the shapes of its outer edge and inner edge may be determined according to the shape of the annular jig to be used.

[0064] <Other materials> The curable resin film composite sheet of the present embodiment may have a release film on the surface opposite to the support sheet. As the release film, a conventionally known one can be used, and for example, one having a release layer that has been subjected to a release treatment with a release agent on a base material for the release film can be mentioned.

[0065] <Method for producing curable resin film composite sheet> The method for producing the curable resin film composite sheet of this embodiment is not particularly limited, and it can be produced, for example, by a method in which a curable resin film is formed on a support sheet, and if necessary, a ring-shaped double-sided adhesive sheet is laminated in a predetermined position. The method for forming a curable resin film on a support sheet may be a method in which a thermosetting resin composition or an energy ray curable resin composition (hereinafter, also simply referred to as a "curable resin composition"), which is a material for forming the curable resin film, is directly applied onto a support sheet and dried, or a method in which a curable resin film is formed on a release film by a similar method, and the curable resin film is then bonded to the support sheet.

[0066] [Method of manufacturing hardened encapsulated body] Next, a method for producing the cured encapsulated body of this embodiment will be described. The method for producing the cured encapsulated body of the present embodiment includes the steps of: A fixing step of fixing a curable resin film composite sheet having a curable resin film and a support sheet supporting the curable resin film to an annular jig at an outer periphery of the support sheet directly or via another layer; A placement step of placing an object to be sealed on a first surface of the curable resin film, the first surface being opposite to the surface in contact with the support sheet; a sealing step of sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film with a sealing material to obtain a cured and sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealing material sealing the object to be sealed; and a peeling step of peeling the cured sealed body from the support sheet, in this order.

[0067] Hereinafter, each step in the method for producing a cured encapsulated body according to this embodiment will be described.

[0068] <Fixed process> The fixing process is a process of fixing a curable resin film composite sheet having a curable resin film and a support sheet supporting the curable resin film to a ring-shaped jig at the outer periphery of the support sheet, directly or via another layer. 4(a) to (c) show a state in which the curable resin film composite sheets 11 to 13 shown in FIGS. 1 to 3 are fixed to an annular jig 9 at the outer periphery of a support sheet 5, respectively. The curable resin film composite sheet 11 shown in FIG. 4( a ) is fixed to an annular jig 9 at the outer periphery of a support sheet 5 via a curable resin film 10 and a ring-shaped double-sided adhesive sheet 6 . The curable resin film composite sheet 12 shown in FIG. 4( b ) is fixed to an annular jig 9 at the outer periphery of a support sheet 5 via a ring-shaped double-sided adhesive sheet 6 . The curable resin film composite sheet 13 shown in FIG. 4( c ) is fixed directly to an annular jig 9 at the outer periphery of the support sheet 5 . The following steps will be described using the curable resin film composite sheet 11 shown in FIG. 4(a) as an example.

[0069] <Placement process> Figure 5(a) shows a step of placing an object to be sealed 3 on a first surface S1, which is the surface opposite to the surface in contact with the support sheet 5, of the curable resin film 10 of the curable resin film composite sheet 11.

[0070] Examples of the object to be sealed include semiconductor chips, semiconductor wafers, semiconductor packages, electronic components, LED elements, etc., among which semiconductor chips are preferred. The semiconductor may be a simple substance of silicon, or a compound semiconductor such as gallium nitride or silicon carbide. The semiconductor package may be in a state before being singulated, but is preferably a semiconductor package chip after being singulated. The semiconductor chip may be any known one, and an integrated circuit composed of circuit elements such as transistors, resistors, and capacitors is formed on the circuit surface of the semiconductor chip. The layout of the semiconductor chips, the number of chips to be arranged, etc. may be appropriately determined depending on the desired package form, production volume, etc. For disposing the semiconductor chip, a known device such as a flip chip bonder or a die bonder can be used. It is preferable that the semiconductor chip is arranged so that the back surface opposite to the circuit surface is covered with the surface of the curable resin film. In this case, after arrangement, the circuit surface of the semiconductor chip is exposed. The following description will be given based on such an example.

[0071] The manufacturing method of the cured encapsulant of this embodiment is preferably applied to the manufacture of packages such as FOWLP, FOPLP, etc., in which an area of ​​a semiconductor chip larger than the chip size is covered with an encapsulant and a redistribution layer is formed not only on the circuit surface of the semiconductor chip but also on the surface area of ​​the encapsulant. Therefore, the semiconductor chip is arranged on a portion of the surface of the curable resin film, and it is preferable that a plurality of semiconductor chips are arranged on the surface in a state aligned at regular intervals, and it is even more preferable that a plurality of semiconductor chips are arranged on the surface in a state aligned in a matrix of multiple rows and multiple columns in a state aligned at regular intervals. The distance between the semiconductor chips may be appropriately determined depending on the desired package shape and other factors.

[0072] In the placement step, after placing the objects to be sealed on the curable resin film, it is preferable to perform a curing treatment of the curable resin film (hereinafter also referred to as a "curing treatment before the sealing step") before the sealing step, from the viewpoint of increasing the adhesive strength between the objects to be sealed and the curable resin film and from the viewpoint of preventing unintended movement of the objects to be sealed during the sealing step. The curing treatment of the curable resin film may be carried out by irradiation with energy rays, heating, or the like depending on the type of the curable resin film. When the curable resin film is a thermosetting resin film, it is preferable to carry out a heat treatment simultaneously with the sealing step, together with a curing treatment before the sealing step, or without carrying out a curing treatment before the sealing step, and further, if necessary, a heat treatment after the sealing step may be carried out. When the curable resin film is subjected to a curing treatment multiple times, the degree of curing progress in each curing treatment may be appropriately adjusted as desired.

[0073] <Sealing process> FIG. 5(b) shows a process for sealing an object to be sealed 3 with a sealing material and curing the sealing material to obtain a cured sealed body 1 having a cured product 2 of a curable resin film cured by a curing treatment performed simultaneously with the sealing material or prior to the sealing step, an object to be sealed 3 on the cured product 2 of the curable resin film, and a cured product 4 of the sealing material that seals the object to be sealed 3.

[0074] The cured product 4 of the sealing material covers the entire exposed surfaces of the objects 3 to be sealed and the surfaces of the cured product 2 of the curable resin film which are the gaps between the plurality of objects 3 to be sealed.

[0075] The encapsulant serves to protect the semiconductor chip and associated elements from the external environment. The sealing material is preferably a thermosetting sealing material that contains a thermosetting resin. The encapsulant may be in a solid form such as granules, pellets, or a film at room temperature, or may be in a liquid form in the form of a composition. From the viewpoint of workability, an encapsulant in the form of a film is preferred. The method for sealing the object to be sealed with the sealing material can be appropriately selected and applied from methods applied in conventional sealing processes according to the type of sealing material. For example, a transfer molding method, a roll lamination method, a vacuum pressing method, a vacuum lamination method, a spin coating method, a die coating method, a compression molding method, etc. can be applied.

[0076] In addition, when the curable resin film is thermosetting and has not been completely cured before the sealing step, it is preferable to thermally cure the sealing material and the curable resin film at the same time.

[0077] In the sealing step, the sealing material or the curable resin film may be completely cured, but it is not necessary to completely cure it. If the sealing material is not completely cured, it is preferable to perform a heat treatment after the sealing step to completely cure the sealing material or the curable resin film.

[0078] <Peeling process> FIG. 5( c ) shows a step of peeling off cured encapsulant 1 from support sheet 5 . The method for peeling off the cured sealed body 1 from the support sheet 5 may be appropriately determined depending on the type of the support sheet 5. For example, when the support sheet 5 is an adhesive sheet having an energy ray-curable adhesive layer on the surface in contact with the cured sealed body 1, the adhesive sheet can be irradiated with energy rays to reduce the adhesive strength of the energy ray-curable adhesive layer, and then the cured sealed body 1 can be peeled off from the adhesive sheet.

[0079] In addition, in the case of using a curable resin film composite sheet having no curable resin film non-laminated area on a support sheet as shown in FIG. 1, when peeling off the support sheet 5, if necessary, the end of the cured product 2 of the curable resin film where the cured product 4 of the encapsulant is not laminated may be cut and separated. In FIG. 5(c), the end of the cured product 2 of the curable resin film is cut so that the side of the cured product 4 of the sealing material and the side of the cured product 2 of the curable resin film are flush with each other, and then the cured sealing body 1 is peeled off.

[0080] On the other hand, when a curable resin film composite sheet having a curable resin film non-laminated region is used as the support sheet 5 around the curable resin film as shown in Fig. 2 and Fig. 3, there is an advantage that it is not necessary to cut the end of the cured product 2 of the cured resin film. Furthermore, when the size of the formed cured sealed body 1 is larger than the cured product 2 of the curable resin film, the cured sealed body 1 can be formed so that the cured product 4 of the sealant covers the end of the cured product 2 of the curable resin film. By having the cured sealed body 1 configured in this way, it is possible to prevent problems such as the cured product 2 of the curable resin film peeling off from the cured product 4 of the sealant when peeling off the cured sealed body 1 from the support sheet 5.

[0081] The cured encapsulated body peeled off from the support sheet as described above may be subjected to a heat treatment after the encapsulation step, if necessary. The heat treatment can increase the degree of curing of the thermosetting component contained in the encapsulant, etc., and improve the ability to protect the encapsulated object.

[0082] The cured encapsulated body manufactured through the above steps may be further processed as required. An example of such a process will be described below. In the following description, a semiconductor chip CP is used as the object 3 to be encapsulated.

[0083] The manufacturing method of this embodiment may include the following grinding step (1), rewiring layer forming step, and dicing step (1) in this order, as desired. However, when the dicing step (2) described below is performed, the dicing step (1) may be omitted. Grinding step (1): A step of grinding the surface of the curable resin film of the cured sealed body opposite the cured body. Rewiring layer formation process: A process for forming a rewiring layer on the surface of the cured encapsulant ground in the grinding process (1). Dicing process (1): A process of dicing the cured sealing body on which the rewiring layer has been formed in the rewiring layer forming process. Each step will be described below.

[0084] <Grinding process (1)> FIG. 6(a) shows a step of grinding the surface of the cured sealed body 1 opposite to the cured material 2 of the curable resin film by grinding means 110. In the grinding step (1), the cured sealing body 1 is ground, so that electrodes (not shown) of the semiconductor chip CP, which is the object to be sealed, are exposed on the grinding surface of the cured sealing body 1 after grinding. When grinding the surface of the cured sealed body 1 opposite the cured material 2 of the curable resin film, it is preferable to fix the surface of the curable resin film of the cured sealed body 1 facing the cured material 2 with a temporary fixing sheet or the like (not shown). The grinding means 110 may be a grinder or other known grinding devices. From the viewpoint of workability, the cured encapsulated body 1 may be diced into a predetermined size including one or more chips prior to the grinding step (1).

[0085] <Rewiring layer formation process> FIG. 6(b) shows a step of forming a rewiring layer 101 and external terminal electrodes 100 that are electrically connected to the electrodes of the semiconductor chip CP exposed on the grinding target surface of the cured sealed body 1 after the grinding step (1). The material of the rewiring layer 101 is not limited as long as it is a conductive material, and examples of the material include metals such as gold, silver, copper, and aluminum; alloys containing these metals; etc. The rewiring layer 101 can be formed by a known method such as a subtractive method or a semi-additive method, and one or more insulating layers may be provided as necessary. The external terminal electrodes 100 are electrically connected to external electrode pads of the rewiring layer 101. The external terminal electrodes 100 can be formed, for example, by soldering solder balls or the like.

[0086] <Dicing process (1)> FIG. 6(c) shows a step of dicing the cured sealing body 1 on which the rewiring layer 101 and the external terminal electrodes 100 have been formed. The dicing step (1) may be performed for each semiconductor chip, or may be performed for a predetermined size including a plurality of semiconductor chips. The method for dicing the cured sealed body 1 is not particularly limited, and may be performed by a known cutting means such as a dicing saw.

[0087] By going through the above steps, a cured encapsulated body 1 is obtained, which has a rewiring layer 101 formed on one surface and a cured product 2 of the curable resin film on the other surface. The cured product 2 of the curable resin film can function as a back surface protective film for the semiconductor chip CP, which plays a role in protecting the semiconductor chip CP from external impacts, etc. The back surface protective film can also be used for identifying and decorating the semiconductor chip by laser marking, and can also function as a light-shielding layer that prevents malfunction of the circuit. The back surface protective film may have a light transmittance of a predetermined level or more for the purpose of performing an infrared inspection or the like to check for the presence or absence of cracks in the object to be sealed. When the cured product 2 of the curable resin film contained in the cured sealing body 1 produced through the above-mentioned steps is used as a back surface protective film, if necessary, laser printing, further dicing, etc. may be performed on the surface of the cured product 2 of the curable resin film to form a semiconductor chip having a back surface protective film and a rewiring layer.

[0088] On the other hand, if necessary, the cured product of the curable resin film in the cured sealed body produced through the above steps may be ground, and a separate back surface protective film may be formed on the surface to be ground. When the cured product of the curable resin film is ground and a separate back surface protective film is formed, the method may include the following grinding step (2), back surface protective film forming step, and dicing step (2) in this order. Grinding step (2): A step of grinding the surface of the cured resin film of the cured sealed body on the cured product side. Back surface protective film formation process: A process for forming a back surface protective film on the surface of the cured encapsulated body ground in the grinding process (2). Dicing process (2): A process of dicing the cured encapsulant on which the back surface protective film has been formed in the back surface protective film forming process.

[0089] <Grinding process (2)> FIG. 7(a) shows a step of grinding the surface of the cured resin film of the cured sealed body 1 on the side of the cured material 2 by grinding means 110. When grinding the surface of the cured sealed body 1 on the side of the cured material 2 of the curable resin film, it is preferable to fix the surface of the cured sealed body 1 on the side of the rewiring layer 101 with a temporary fixing sheet or the like (not shown). The grinding means 110 may be the same as that used in the grinding step (1) above. In the grinding step (2), a part of the cured material 2 of the curable resin film may be ground, or the entire cured material 2 of the curable resin film may be ground. However, it is preferable to perform a thinning process of the semiconductor chip while removing the cured material 2 of the curable resin film. By performing a thinning process of the semiconductor chip simultaneously with the grinding step (2), the semiconductor chip is in a thick state in the arrangement step, making it easy to handle. In this case, the entire cured material 2 of the curable resin film is ground.

[0090] <Back side protective film formation process> FIG. 7(b) shows a step of forming a back surface protective film 120 on the surface of the cured resin film on the side of the cured material 2 of the cured sealed body 1 ground in the grinding step (2). The back surface protection film can be formed, for example, by a method in which a back surface curable resin film is attached to the surface of the cured product side of the curable resin film of the cured sealed body ground in the grinding step (2) and then cured. The curable resin film for the back surface can be any general curable resin film used to form a back surface protective film for a semiconductor chip, and may be of the same material and configuration as the curable resin film of this embodiment, for example. The back surface protective film formed by the above method may then be laser-printed by a known method.

[0091] <Dicing process (2)> FIG. 7(c) shows a step of dicing the cured sealing body 1 on which the rear surface protective film 120 has been formed. The dicing step (2) can be carried out in the same manner as the dicing step (1). The semiconductor chip manufactured through the above steps is then mounted on a semiconductor substrate or the like by a known method.

[0092] [Variations] In the manufacturing method of the cured sealed body according to the embodiment described above, the curable resin film composite sheet is attached to an annular jig and a fixing process is carried out, but in the fixing process, only the support sheet may be attached to the annular jig and the curable resin film may be laminated on the support sheet later. The method for producing such a cured encapsulant includes the following steps: A fixing step of fixing the support sheet to an annular jig at an outer periphery of the support sheet directly or via another layer; a lamination step of laminating a curable resin film on the support sheet to form a laminate (1) having the support material and the curable resin film; A placement step of placing an object to be sealed on a first surface of the curable resin film, the first surface being opposite to the surface in contact with the support sheet; a sealing step of sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film with a sealing material to obtain a cured and sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealing material sealing the object to be sealed; and a peeling step of peeling the cured sealing body from the support sheet, in this order. The laminate (1) corresponds to the curable resin film composite sheet described above, and the manufacturing method of the cured sealed body according to this embodiment is the same as the manufacturing method of the cured sealed body according to the above-mentioned embodiment, except that the laminate (1) equivalent to the above-mentioned curable resin film composite sheet is completed in the lamination process. [Explanation of symbols]

[0093] 1 Cured encapsulant 2. Hardened resin film 3. Sealing object 4. Hardened sealing material 5 Support Sheet 6 Ring-shaped double-sided adhesive sheet 9 Circular jig 10. Curable resin film 11. Curable resin film composite sheet 12. Curable resin film composite sheet 13. Curable resin film composite sheet 100 External terminal electrode 101 Redistribution layer 110 Grinding means 120 Backside protective film

Claims

1. A curable resin film and a support sheet that supports the curable resin film, A curable resin film composite sheet used to produce a cured sealed body having the cured product of the curable resin film, the sealed object on the cured product of the curable resin film, and the cured product of the sealant that seals the sealed object, by sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film, which is the surface opposite to the surface in contact with the support sheet, with a sealant, while the outer periphery of the support sheet is fixed to a ring-shaped jig directly or via another layer.

2. The curable resin film composite sheet according to claim 1 , wherein the support sheet has a substrate which is a resin film.

3. A fixing step of fixing a curable resin film composite sheet having a curable resin film and a support sheet supporting the curable resin film to an annular jig at an outer periphery of the support sheet directly or via another layer; A placement step of placing an object to be encapsulated on a first surface of the curable resin film, the first surface being the surface opposite to the surface in contact with the support sheet; a sealing step of sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film with a sealing material to obtain a cured and sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealing material sealing the object to be sealed; and a peeling step of peeling the cured sealed body from the support sheet, in this order.

4. A fixing step of fixing the support sheet to an annular jig at an outer periphery of the support sheet directly or via another layer; a lamination step of laminating a curable resin film on the support sheet to form a laminate (1) having the support material and the curable resin film; A placement step of placing an object to be encapsulated on a first surface of the curable resin film, the first surface being the surface opposite to the surface in contact with the support sheet; a sealing step of sealing an object to be sealed on a first surface of the curable resin film or a cured product of the curable resin film with a sealing material to obtain a cured and sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealing material sealing the object to be sealed; and a peeling step of peeling the cured sealed body from the support sheet, in this order.

Images