Curable resin film, method for manufacturing cured sealing body, curable resin film composite sheet and cured sealing body

Abstract

To provide a curable resin film which enables formation of a cured sealing body excellent in peelability from a support material.SOLUTION: A curable resin film is used to seal a sealing object on a first surface, which is one surface of a curable resin film or a cured product of the curable resin film, with a sealing material and to manufacture a curable sealing body comprising a cured product of the curable resin film, the sealing object on the cured product of the curable resin film and a cured product of the sealing material which seals the sealing object, wherein the curable sealing body has, in a plan view, an excess region of the cured product of the sealing material surrounding the outer edge of the cured product of the curable resin film, and the curable resin film is previously formed so as to form the excess region in the cured sealing body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a curable resin film, a method for producing a cured sealed article, a curable resin film composite sheet, and a cured sealed article. [Background technology]

[0002] In recent years, electronic devices have become smaller, lighter, and more functional, and semiconductor chips are sometimes mounted in packages that are close to the size of the chips. Such packages are sometimes called CSPs (Chip Scale Packages). Examples of CSPs include WLPs (Wafer Level Packages), which are completed through processing up to the final packaging process at wafer size, and PLPs (Panel Level Packages), which are completed through processing up to the final packaging process at panel size, which is several hundred millimeters on each side and is larger than the wafer size.

[0003] WLP and PLP are classified into Fan-In type and Fan-Out type. In Fan-Out type WLP (hereinafter also referred to as "FOWLP") and PLP (hereinafter also referred to as "FOPLP"), a semiconductor chip is covered with an encapsulant in an area larger than the chip size to form a hardened encapsulated body of the semiconductor chip, and a redistribution layer and external electrodes are formed not only on the circuit surface of the semiconductor chip but also on the surface area of ​​the encapsulant.

[0004] FOWLPs and FOPLPs are manufactured, for example, through an arrangement process in which a plurality of semiconductor chips are arranged on a temporary fixing sheet, a sealing process in which the plurality of semiconductor chips are covered with a thermosetting sealing material and the sealing material is thermally cured to obtain a hardened sealing body, a peeling process in which the hardened sealing body is peeled off from the temporary fixing sheet, and a rewiring layer formation process in which a rewiring layer is formed on the surface of the exposed semiconductor chip side.

[0005] Patent Document 1 describes a method for manufacturing a semiconductor package using a semiconductor process sheet having a laminated structure including at least an adhesive-reduced adhesive layer, an adhesive layer, and a substrate located therebetween, the double-sided adhesive sheet having a first adhesive surface and an opposite second adhesive surface, and a partial sealant layer releasably adhered to the second adhesive surface of the double-sided adhesive sheet, the method including a chip mounting step of mounting a plurality of semiconductor chips on the partial sealant layer of the semiconductor process sheet, the first adhesive surface of which is attached to a support; a sealing step of supplying a sealant on the semiconductor process sheet so as to embed the plurality of semiconductor chips, and hardening the sealant and the partial sealant layer to form a sealant portion; a detaching step including separating the sealant portion from the second adhesive surface; a wiring forming step of forming a wiring structure portion including wiring for each semiconductor chip on the sealant portion; and a singulation step of dividing the sealant portion and the wiring structure portion into individual semiconductor chips to obtain a semiconductor package. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2019-91845 A Summary of the Invention [Problem to be solved by the invention]

[0007] As described in Patent Document 1, a curable resin film (the partial sealant layer of Patent Document 1) is laminated on a support such as a double-sided adhesive sheet, an object to be sealed is placed on the curable resin film, and the object to be sealed is sealed with a sealant while the sealant and curing resin film are cured, thereby obtaining a cured sealed body in which the object to be sealed is sealed with the cured product of the sealant and the cured product of the curable resin film.

[0008] FIG. 8 shows a schematic cross-sectional view of a cured encapsulant 1' manufactured by a conventional method before the support material is peeled off. The cured sealed body 1' shown in Figure 8 has a cured product 2 of the curable resin film, an object to be sealed 3 on the cured product 2 of the curable resin film, and a cured product 4 of a sealing material that seals the object to be sealed 3, and a support material 5 is attached to the surface of the cured product 2 of the curable resin film opposite the object to be sealed 3. The support material 5 supports each component until the cured sealing body 1' is formed, and is peeled off from the cured sealing body 1' after the cured sealing body 1' is formed. However, when the cured sealed body 1' manufactured by the conventional method was peeled off from the support material 5, destruction such as peeling off at the interface between the cured material 2 of the curable resin film and the cured material 4 of the sealing material could occur at the end of the cured sealed body 1'.

[0009] In view of the above problems, an object of the present invention is to provide a curable resin film capable of forming a cured sealed body having excellent peelability from a support material, a method for producing a cured sealed body, a curable resin film composite sheet, and a cured sealed body having excellent peelability from a support material. [Means for solving the problem]

[0010] Means for Solving the Problems The present inventors have conducted extensive research to solve the above problems, and as a result have found that the above problems can be solved by the present invention described below, and have completed the present invention. That is, the present invention provides the following [1] to [8]. [1] A curable resin film, The curable resin film is used to seal an object to be sealed on a first surface, which is one surface of the curable resin film or a cured product of the curable resin film, with a sealant, to produce a cured sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealant that seals the object to be sealed, the cured sealing body has an excess region of the cured material of the sealing material surrounding an outer edge of the cured material of the curable resin film in a plan view, The curable resin film is formed in advance so that the excess region is formed in the cured sealed body. [2] The cured resin film described in [1] above, wherein the cured sealed body and the curable resin film are approximately rectangular in plan view, and each of the four sides constituting the outer edge of the cured resin film in plan view is approximately parallel to the outer edge of the cured sealed body in plan view. [3] The curable resin film according to [2] above, wherein the length of each of the four sides constituting the outer edge of the curable resin film in a planar view is 5 to 30 mm shorter than the length of a side constituting the outer edge of the cured sealed body in a planar view that is approximately parallel to the side. [4] A lamination step of laminating a curable resin film on a support material to form a laminate (1) having the support material and the curable resin film, the support material having a curable resin film non-laminated region that is a region in which the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; a placement step of placing an object to be encapsulated on a first surface of the curable resin film opposite to a surface of the curable resin film that contacts the support; a sealing step of sealing the sealing object on the first surface with a sealing material to obtain a cured and sealed body having a cured product of the curable resin film, the sealing object on the cured product of the curable resin film, and a cured product of the sealing material sealing the sealing object; a peeling step of peeling the cured sealing body from the support material, The cured sealed body formed in the sealing step is a cured product of the sealing material in contact with the non-laminated area of ​​the support material. [5] The method for producing a cured sealed body according to the above [4], wherein the support material is an adhesive sheet having an adhesive layer on at least the surface in contact with the curable resin film. [6] A double-sided pressure-sensitive adhesive sheet and a curable resin film laminated on one surface of the double-sided pressure-sensitive adhesive sheet, the double-sided pressure-sensitive adhesive sheet has a curable resin film non-laminated region, which is a region where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; A curable resin film composite sheet used for producing a cured sealed body having a cured product of the curable resin film, the object to be sealed on a first surface, which is the surface of the curable resin film or the cured product of the curable resin film opposite to the surface in contact with the double-sided pressure-sensitive adhesive sheet, and a cured product of the sealing material that seals the object to be sealed. [7] A curable resin film composite sheet having a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on at least one surface, and a curable resin film laminated on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive sheet has a curable resin film non-laminated region, which is a region where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; The pressure-sensitive adhesive sheet and the curable resin film are substantially rectangular in plan view, and in the curable resin film composite sheet, four sides constituting an outer edge of the curable resin film in plan view are each substantially parallel to an outer edge of the pressure-sensitive adhesive sheet in plan view; The length of each of the four sides constituting the outer edge of the curable resin film in a plan view is 5 to 30 mm shorter than the length of a side constituting the outer edge of the pressure-sensitive adhesive sheet that is approximately parallel to the side. A curable resin film composite sheet used for producing a cured sealed body having a cured product of the curable resin film, the object to be sealed on a first surface, which is the surface of the curable resin film or the cured product of the curable resin film opposite to the surface in contact with the pressure-sensitive adhesive layer, and a cured product of the sealing material sealing the object to be sealed. [8] A cured sealed body comprising: a cured product of a curable resin film; an object to be sealed on the cured product of the curable resin film; and a cured product of a sealing material that seals the object to be sealed, the cured product having, in a planar view, an excess area of ​​the cured product of the sealing material that surrounds an outer edge of the cured product of the curable resin film. Effect of the Invention

[0011] According to the present invention, it is possible to provide a curable resin film capable of forming a cured sealed body having excellent peelability from a support material, a method for producing a cured sealed body, a curable resin film composite sheet, and a cured sealed body having excellent peelability from a support material. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1(a) is a schematic cross-sectional view and FIG. 1(b) is a schematic transparent plan view illustrating a cured sealed body 1 obtained using the curable resin film of this embodiment before the support material is peeled off. [Diagram 2] 2(a) and 2(b) are a cross-sectional view and a plan view of a curable resin film composite sheet 11, which is an example of the curable resin film composite sheet of the first aspect of this embodiment. [Diagram 3] 1 is a schematic cross-sectional view of a cured sealed body 1 formed on a curable resin film composite sheet 11. FIG. [Figure 4] 4(a) and 4(b) are a cross-sectional view and a plan view of a curable resin film composite sheet 12, which is an example of the curable resin film composite sheet of the second aspect of this embodiment. [Diagram 5] 3A to 3C are schematic cross-sectional views showing a part of an example of a method for producing a cured sealed body according to the present embodiment. [Figure 6] 3A to 3C are schematic cross-sectional views showing a part of an example of a method for producing a cured sealed body according to the present embodiment. [Figure 7] 3A to 3C are schematic cross-sectional views showing a part of an example of a method for producing a cured sealed body according to the present embodiment. [Figure 8] FIG. 1 is a schematic cross-sectional view of a cured sealed body 1′ manufactured by a conventional method before a supporting material is peeled off. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] As used herein, the term "active ingredient" refers to the components contained in the target composition excluding diluent solvents. In this specification, the weight average molecular weight (Mw) is a value calculated as standard polystyrene measured by gel permeation chromatography (GPC), specifically, a value measured based on the method described in the examples. In this specification, for example, "(meth)acrylic acid" refers to both "acrylic acid" and "methacrylic acid", and similar terms. In this specification, the lower limit and upper limit described in stages for the preferred numerical range (e.g., range of content, etc.) can be independently combined. For example, the description "preferably 10 to 90, more preferably 30 to 60" can be combined with the "preferable lower limit (10)" and the "more preferable upper limit (60)" to form "10 to 60."

[0014] In this specification, the term "energy ray" refers to electromagnetic waves or charged particle beams that have an energy quantum, and examples of such beams include ultraviolet rays, radioactive rays, and electron beams. The ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, etc. as an ultraviolet ray source. The electron beam can be generated by an electron beam accelerator or the like. In this specification, "energy ray curable" means a property that is cured by irradiation with energy rays, and "non-energy ray curable" means a property that is not cured even when irradiated with energy rays. In this specification, the thickness of each layer constituting the curable resin film and the curable resin film composite sheet can be measured by observing the cross section of the curable resin film or the curable resin film composite sheet with a scanning electron microscope. As the scanning electron microscope, "FE-SEM S-4700" manufactured by Hitachi High-Tech Corporation can be used.

[0015] [Hardening resin film] The curable resin film of this embodiment is A curable resin film, The curable resin film is used to seal an object to be sealed on a first surface, which is one surface of the curable resin film or a cured product of the curable resin film, with a sealant, to produce a cured sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealant that seals the object to be sealed, the cured sealing body has an excess region of the cured material of the sealing material surrounding an outer edge of the cured material of the curable resin film in a plan view, The curable resin film is a curable resin film that is formed in advance so as to form the excess region in the cured sealed body.

[0016] As described above, the curable resin film of the present embodiment is used to produce a cured sealed body. By sealing an object to be sealed on the curable resin film of the present embodiment, a cured sealed body in which the occurrence of warping is suppressed can be produced. Furthermore, the cured sealed body produced using the curable resin film of this embodiment has excellent releasability from the support material, which is the temporary fixing layer.

[0017] FIG. 1(a) is a schematic cross-sectional view of a cured sealed body 1, which is an example of a cured sealed body obtained using the curable resin film of this embodiment before the support material is peeled off, and FIG. 1(b) is a schematic transparent plan view of the cured sealed body 1. In FIG. 1(a), the cured sealing body 1 has a cured product 2 of the curable resin film of this embodiment, an object to be sealed 3 on the cured product 2 of the curable resin film, and a cured product 4 of a sealing material that seals the object to be sealed 3, and a support material 5 is attached to the surface of the cured product 2 of the curable resin film opposite the object to be sealed 3. 1(b), the rectangular region indicated by the dashed line is the region in the cured sealed body 1 where the cured product 2 of the curable resin film is present, and the region between the outer edge of the cured sealed body 1 indicated by the solid line and the outer edge of the cured product 2 of the curable resin film indicated by the dashed line is the excess region A of the cured product 4 of the sealing material. The excess region A surrounds the outer edge of the cured product 2 of the curable resin film. The excess region A is shown in FIG. 1( a ) as a region where the cured sealing material 4 is laminated directly on the support material 5 . In FIG. 1(b), the cured sealed body 1 and the cured product 2 of the curable resin film are approximately rectangular, and the four sides constituting the outer edge of the cured product 2 of the curable resin film in a planar view are each approximately parallel to the outer edge of the cured sealed body 1 in a planar view.

[0018] 1(a), in the cured sealed body 1, the cured product 4 of the sealing material covers the entire exposed surface of the object to be sealed 3 and the entire surface of the cured product 2 of the curable resin film which is the gap between the multiple objects to be sealed 3, and further contacts the support material 5 in the excess region A. As a result, the end of the cured product 2 of the curable resin film is covered by the cured product 4 of the sealing material, and thus, when the cured sealed body 1 is peeled off from the support material 5, damage to the end of the cured product 2 of the curable resin film is suppressed.

[0019] The shape of the curable resin film in a planar view is not particularly limited as long as it is pre-formed so as to form an excess area in the cured sealed body, but from the viewpoint of productivity of the cured sealed body, it is preferably approximately rectangular. In this embodiment, "approximately rectangular" refers to, for example, a square or a rectangle, but also includes a shape in which at least one corner is notched or a shape in which at least one corner is curved, and at least one side may be formed by a curve or a broken line. In addition, in this embodiment, "substantially parallel" does not only mean that they are strictly parallel, but also means that the angle between the two lines is 10° or less.

[0020] When the cured sealed body and the curable resin film are substantially rectangular in plan view, the length of each of the four sides constituting the outer edge of the curable resin film in plan view is preferably 5 to 30 mm shorter, more preferably 6 to 20 mm shorter, and even more preferably 7 to 15 mm shorter than the length of the side constituting the outer edge of the cured sealed body in plan view that is substantially parallel to the side. When the shape of the cured sealed body or the curable resin film is a shape in which at least one corner is notched or at least one corner is curved, the intersection of the lines extending two sides constituting the corner is regarded as the apex of the corner, and the distance between the apexes is regarded as the length of the side constituting the outer edge of the cured sealed body or the curable resin film in plan view.

[0021] The size of the curable resin film in a planar view may be adjusted depending on the size of the cured sealed body to be formed. For example, when the curable resin film has a substantially rectangular shape in a planar view, the length of one side may be 100 to 1,000 mm, 150 to 800 mm, or 200 to 700 mm.

[0022] The thickness of the curable resin film is preferably 10 to 300 μm, more preferably 13 to 250 μm, even more preferably 17 to 150 μm, and even more preferably 20 to 100 μm. When the thickness of the curable resin film is equal to or greater than the lower limit, the occurrence of warping of the cured encapsulated body tends to be sufficiently suppressed. When the thickness of the curable resin film is equal to or less than the upper limit, the economic efficiency is excellent. When the encapsulation object 3 is a semiconductor chip and the cured product of the curable resin film is used as a back surface protection film for the semiconductor chip, the semiconductor package tends to be easily miniaturized. In addition, when the curable resin film includes multiple layers, the thicknesses of the layers may be set so that the total thickness is in the same numerical range as the thickness of the curable resin film. In this case, the thicknesses of the multiple layers may all be the same, or a layer having a thickness different from the other layers may be present.

[0023] The curable resin film may be a thermosetting resin film in which a curing reaction proceeds by heat treatment, or an energy ray curable resin film in which a curing reaction proceeds by energy ray irradiation. The curable resin film may be both thermosetting and energy ray curable.

[0024] The curable resin film may be a single layer, or may have a laminated structure of two or more layers. When the curable resin film has a laminated structure of two or more layers, it may have two or more layers having thermosetting properties, may have two or more layers having energy ray curing properties, or may have a layer having thermosetting properties and a layer having energy ray curing properties. The thermosetting resin film and the energy ray curable resin film are not particularly limited, and known thermosetting resin films and energy ray curable resin films can be appropriately used.

[0025] <Thermosetting resin film> The thermosetting resin film is preferably formed using a thermosetting resin composition containing a polymer component (A) and a thermosetting component (B). The thermosetting resin composition may further contain one or more members selected from the group consisting of a colorant (C), a coupling agent (D) and an inorganic filler (E).

[0026] (Polymer component (A)) The polymer component (A) preferably has a weight average molecular weight (Mw) of 20,000 or more, and refers to a compound having at least one type of repeating unit. When the thermosetting resin composition contains the polymer component (A), the flexibility and shape retention of the curable resin film can be improved. The weight average molecular weight (Mw) of the polymer component (A) is preferably from 20,000 to 3,000,000, more preferably from 50,000 to 2,000,000, even more preferably from 100,000 to 1,500,000, and still more preferably from 200,000 to 1,000,000.

[0027] The content of the polymer component (A) is preferably 5 to 50 mass %, more preferably 8 to 40 mass %, and further preferably 10 to 30 mass %, based on the total amount (100 mass %) of the active ingredients of the thermosetting resin composition.

[0028] Examples of the polymer component (A) include acrylic polymers, polyesters, phenoxy resins, polycarbonates, polyethers, polyurethanes, polysiloxanes, and rubber polymers. The polymer component (A) may be used alone or in combination of two or more kinds. In this specification, an acrylic polymer having an epoxy group and a phenoxy resin having an epoxy group are thermosetting, but as long as they are compounds having at least one type of repeating unit, they are included in the concept of polymer component (A).

[0029] The polymer component (A) preferably contains an acrylic polymer (A1). The content of the acrylic polymer (A1) in the polymer component (A) is preferably 60 to 100 mass%, more preferably 70 to 100 mass%, even more preferably 80 to 100 mass%, and still more preferably 90 to 100 mass%, based on the total amount (100 mass%) of the polymer component (A).

[0030] [Acrylic polymer (A1)] The acrylic polymer (A1) may be a polymer containing an alkyl (meth)acrylate as a main component. Specifically, an acrylic polymer containing a structural unit (a1) derived from an alkyl (meth)acrylate (a1') having an alkyl group having 1 to 18 carbon atoms (hereinafter also referred to as "monomer (a1')") is preferred, and an acrylic copolymer containing, together with the structural unit (a1), a structural unit (a2) derived from a functional group-containing monomer (a2') (hereinafter also referred to as "monomer (a2')") is more preferred. The acrylic polymer (A1) may be used alone or in combination of two or more kinds.

[0031] From the viewpoint of imparting flexibility and shape retention to the curable resin film, the number of carbon atoms in the alkyl group of the monomer (a1') is preferably 1 to 18, more preferably 1 to 12, and further preferably 1 to 8. The alkyl group may be a linear alkyl group or a branched alkyl group. The monomer (a1') may be used alone or in combination of two or more kinds.

[0032] The monomer (a2') is preferably at least one selected from the group consisting of hydroxy group-containing monomers and epoxy group-containing monomers. The monomer (a2') may be used alone or in combination of two or more kinds.

[0033] The acrylic polymer (A1) may contain structural units derived from monomers other than the structural units (a1) and (a2) described above, as long as the effects of the present invention are not impaired. Examples of such other monomers include vinyl acetate, styrene, ethylene, and α-olefins.

[0034] (Thermosetting component (B)) The thermosetting component (B) serves to thermally cure the curable resin film to form a hard cured resin layer, and is preferably a compound having a weight average molecular weight (Mw) of less than 20,000. The weight average molecular weight (Mw) of the thermosetting component (B) is preferably 10,000 or less, and more preferably 100 to 10,000.

[0035] From the viewpoint of obtaining a curable resin film that can effectively suppress warping of the cured sealed body, the thermosetting component (B) preferably contains an epoxy compound (B1), which is a compound having an epoxy group, and a thermosetting agent (B2), and more preferably contains a curing accelerator (B3) in addition to the epoxy compound (B1) and the thermosetting agent (B2).

[0036] Examples of the epoxy compound (B1) include epoxy compounds having two or more functional groups in the molecule, such as polyfunctional epoxy resins, bisphenol A diglycidyl ether and its hydrogenated products, orthocresol novolac epoxy resins, dicyclopentadiene type epoxy resins, biphenyl type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, and phenylene skeleton type epoxy resins. The epoxy compound (B1) may be used alone or in combination of two or more kinds.

[0037] The heat curing agent (B2) functions as a curing agent for the epoxy compound (B1). The heat curing agent (B2) is preferably a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, an acid anhydride, etc. Among these, from the viewpoint of obtaining a curable resin film that can effectively suppress warping of a cured sealed body, a phenolic hydroxyl group, an amino group, and an acid anhydride are preferred, a phenolic hydroxyl group and an amino group are more preferred, and an amino group is even more preferred. The heat curing agent (B2) may be used alone or in combination of two or more kinds.

[0038] The curing accelerator (B3) is a compound that has the function of increasing the rate of thermal curing when the curable resin film is thermally cured. Examples of the curing accelerator (B3) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. The curing accelerator (B3) may be used alone or in combination of two or more kinds.

[0039] (Colorant (C)) The thermosetting resin composition may further contain a colorant (C). By including the colorant (C) in the thermosetting resin composition, it is possible to impart the effect of making it easier to judge from the appearance whether or not the cured product of the curable resin film is present when the curable resin film is thermally cured, and it is also possible to impart the effect of blocking infrared rays and the like generated from surrounding devices, thereby preventing malfunction of objects to be sealed, such as semiconductor chips.

[0040] As the colorant (C), organic or inorganic pigments and dyes can be used. For example, among organic or inorganic pigments, black pigments include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, etc. Among these, carbon black is preferred from the viewpoint of enhancing the reliability of an object to be sealed such as a semiconductor chip when the cured product of the curable resin film is used as a back surface protective film for the object to be sealed such as a semiconductor chip. The colorant (C) may be used alone or in combination of two or more kinds.

[0041] (Coupling Agent (D)) The thermosetting resin composition may further contain a coupling agent (D). By including the coupling agent (D) in the thermosetting resin composition, it is possible to improve the adhesion between the curable resin film and the object to be encapsulated such as a semiconductor chip, etc. In addition, it is possible to improve the water resistance without impairing the heat resistance of the cured product of the curable resin film.

[0042] As the coupling agent (D), a compound that reacts with functional groups possessed by the polymer component (A), the thermosetting component (B), etc. is preferred, and specifically, a silane coupling agent is preferred. The coupling agent (D) may be used alone or in combination of two or more kinds.

[0043] (Inorganic filler (E)) From the viewpoint of forming a curable resin film capable of effectively suppressing warping of a cured sealed article, the thermosetting resin composition preferably contains an inorganic filler (E). By containing the inorganic filler (E) in the curable resin film, the difference in shrinkage stress between the two surfaces of the cured encapsulant can be adjusted to be small when the encapsulant is cured, making it possible to produce a flatter cured encapsulant. In addition, the thermal expansion coefficient of the cured product of the curable resin film can be adjusted to an appropriate range, and when the cured product of the curable resin film is used as a back surface protection film for an encapsulated object such as a semiconductor chip, the reliability of the encapsulated object can be improved. Furthermore, the moisture absorption rate of the cured product of the curable resin film can be reduced.

[0044] Examples of the inorganic filler (E) include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, etc., beads obtained by shaping these into spherical particles, single crystal fibers, and glass fibers. The inorganic filler (E) may be used alone or in combination of two or more kinds. Among these, silica and alumina are preferred from the viewpoint of forming a curable resin film that can effectively suppress warping of the cured sealed body.

[0045] (Other additives) The thermosetting resin composition may further contain additives other than the above-mentioned components (A) to (E) to the extent that the effects of the present invention are not impaired. Examples of other additives include a crosslinking agent, a leveling agent, a plasticizer, an antistatic agent, an antioxidant, an ion trapping agent, a gettering agent, and a chain transfer agent.

[0046] <Energy ray curable resin film> Since the adhesive strength of the energy ray-curable resin film can be easily adjusted, it is easy to fix the object to be sealed on the curable resin film more reliably.

[0047] The energy ray curable resin film is preferably a photocurable resin film, and is preferably formed from a photocurable resin composition containing a photocurable component and a photopolymerization initiator. The light used to cure the photocurable resin film is preferably ultraviolet light. That is, the photocurable resin film is preferably an ultraviolet light curable resin film. Examples of the photocurable component include an acrylic polymer having a photocurable double bond such as a (meth)acryloyl group or a vinyl group, a monomer or oligomer having a photocurable double bond, an epoxy resin having a photocurable double bond, and a phenol resin having a photocurable double bond.

[0048] Examples of the photopolymerization initiator include 1-hydroxycyclohexylphenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzyl phenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, and 8-chloroanthraquinone. The photopolymerization initiator may be used alone or in combination of two or more kinds.

[0049] The photocurable resin composition may contain other components in addition to the photocurable component and the photopolymerization initiator depending on the purpose. Examples of the other components include the components described above as the components that may be contained in the thermosetting resin composition.

[0050] <Method for producing curable resin film> The method for producing the curable resin film of this embodiment is not particularly limited, and examples thereof include a method in which a thermosetting resin composition or an energy ray curable resin composition (hereinafter, also simply referred to as a "curable resin composition"), which is a material for forming the curable resin film, is applied onto an adhesive sheet or a release film and dried to form a film, and then molded so as to form an excess area in the cured sealed body. In addition, according to the method of applying the curable resin composition onto the adhesive sheet, a composite sheet of a curable resin film and an adhesive sheet, such as the curable resin film composite sheet of the first or second aspect of this embodiment described later, can be obtained. In addition, in the method of applying the curable resin composition onto a release film, a curable resin film is formed on the release film. The curable resin film on the release film may be laminated with an adhesive sheet or the like to form a composite sheet as necessary, or may be directly attached to a hard support or the like described later for use. Examples of the method of forming the curable resin film in advance so that an excess area is formed in the cured sealed body include a method of cutting the curable resin film with a punching blade or a laser depending on the size of the excess area of ​​the cured sealed body to be formed, and a method of removing the curable resin film other than the part to be formed into the desired shape by chemical etching or plasma etching. When the curable resin film is cut, the unnecessary part around the desired shape is usually removed. When the curable resin film on the release film or the curable resin film on the adhesive sheet is cut with a punching blade, the punching blade may enter the release film or the adhesive sheet to form a groove, or the groove may not be formed. When a groove is formed, its depth is usually about 5 to 40% of the thickness of the release film or the adhesive sheet.

[0051] Next, the curable resin film composite sheet of the present embodiment will be described.

[0052] [First embodiment of curable resin film composite sheet] The curable resin film composite sheet of the first aspect of this embodiment is A double-sided pressure-sensitive adhesive sheet and a curable resin film laminated on one surface of the double-sided pressure-sensitive adhesive sheet, the double-sided pressure-sensitive adhesive sheet has a curable resin film non-laminated region, which is a region where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; The curable resin film composite sheet is used to seal an object to be sealed on a first surface, which is the surface of the curable resin film or the cured product of the curable resin film opposite to the surface in contact with the double-sided pressure-sensitive adhesive sheet, with a sealant, and to produce a cured sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealant that seals the object to be sealed.

[0053] FIG. 2(a) is a schematic cross-sectional view of a curable resin film composite sheet 11, which is an example of the curable resin film composite sheet of the first aspect of this embodiment, and FIG. 2(b) is a schematic plan view of the curable resin film composite sheet 11. 2(a), the curable resin film composite sheet 11 has a double-sided adhesive sheet 6 and a curable resin film 10 laminated on one surface of the double-sided adhesive sheet 6. The curable resin film composite sheet 11 has a curable resin film non-laminated region B near its end, which is a region where the curable resin film 10 is not laminated and where the double-sided adhesive sheet 6 is exposed. In the schematic plan view of FIG. 2(b), the curable resin film non-laminated region B is formed so as to surround the outer edge of the curable resin film 10. In FIG. 2(b), the double-sided adhesive sheet 6 and the curable resin film 10 are approximately rectangular, and the four sides constituting the outer edge of the curable resin film 10 in a planar view are each approximately parallel to the outer edge of the double-sided adhesive sheet 6 in a planar view.

[0054] The curable resin film composite sheet of the first aspect is suitable for the method for producing a cured sealed product of the present embodiment described below. 3 shows a schematic cross-sectional view of a cured sealed body 1 formed using a curable resin film composite sheet 11. In the cured sealed body 1, the cured product 4 of the sealing material covers the entire exposed surface of the object to be sealed 3 and the entire surface of the cured product 2 of the curable resin film which is the gap between the plurality of objects to be sealed 3, and also contacts the curable resin film non-laminated region B of the double-sided adhesive sheet 6. As a result, the end of the cured product 2 of the curable resin film is covered by the cured product 4 of the sealing material, and thus, when the cured sealed body 1 is peeled off from the double-sided adhesive sheet 6, damage to the end of the cured product 2 of the curable resin film is suppressed.

[0055] Since the curable resin film composite sheet of the first embodiment includes a double-sided pressure-sensitive adhesive sheet as a support material for the curable resin film, the surface of the curable resin film composite sheet opposite to the curable resin film can be attached to a hard support such as a glass plate, a metal plate, etc. By producing a cured sealed body in a state in which the curable resin film composite sheet is attached to a hard support, it is possible to produce a cured sealed body with excellent flatness.

[0056] From the viewpoints of productivity and handling, the shape of the double-sided pressure-sensitive adhesive sheet in the curable resin film composite sheet of the first embodiment is preferably approximately rectangular in plan view. From a similar viewpoint, it is preferable that the double-sided adhesive sheet and the curable resin film are approximately rectangular in plan view, and that the four sides constituting the outer edge of the curable resin film in plan view are each approximately parallel to the outer edge of the double-sided adhesive sheet in plan view. When the double-sided pressure-sensitive adhesive sheet and the curable resin film are approximately rectangular in plan view, the length of each of the four sides constituting the outer edge of the curable resin film in plan view is preferably 5 to 30 mm shorter, more preferably 6 to 20 mm shorter, and even more preferably 7 to 15 mm shorter than the length of a side constituting the outer edge of the double-sided pressure-sensitive adhesive sheet in plan view that is approximately parallel to said sides.

[0057] Next, the members constituting the curable resin film composite sheet of the first embodiment will be described.

[0058] <Curing resin film> A preferred embodiment of the curable resin film in the curable resin film composite sheet of the first embodiment is the same as the preferred embodiment of the curable resin film of the present embodiment.

[0059] <Double-sided adhesive sheet> The double-sided pressure-sensitive adhesive sheet is a member that is peeled off from the cured sealed body after the cured sealed body is formed, and serves as a temporary fixing layer. The double-sided pressure-sensitive adhesive sheet may, for example, have a pressure-sensitive adhesive layer (X1), a substrate layer (Y), and a pressure-sensitive adhesive layer (X2) in this order. The double-sided pressure-sensitive adhesive sheet may have other layers, such as a primer layer and an antistatic layer. Here, the pressure-sensitive adhesive layer (X1) is a layer that adheres to a curable resin film, and the pressure-sensitive adhesive layer (X2) is a layer that adheres to a hard support.

[0060] (Adhesive layer) The pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet can be formed, for example, from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin. The adhesive resin may be, for example, a polymer that has adhesiveness by itself and has a weight average molecular weight (Mw) of 10,000 or more. Note that the adhesive resin may not have adhesiveness by itself, but may exhibit adhesiveness by adding a tackifier or plasticizer.

[0061] Examples of the adhesive resin include acrylic resins, urethane resins, polyisobutylene resins, polyester resins, olefin resins, silicone resins, polyvinyl ether resins, etc. Among these, from the viewpoint of imparting excellent adhesive strength to the adhesive layer, it is preferable that the adhesive resin contains an acrylic resin.

[0062] When the pressure-sensitive adhesive composition contains a pressure-sensitive adhesive resin having a functional group, it is preferable that the pressure-sensitive adhesive composition further contains a crosslinking agent that reacts with the pressure-sensitive adhesive resin having a functional group to crosslink the pressure-sensitive adhesive resins with each other using the functional group as a crosslinking starting point. Examples of the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, an aziridine-based crosslinking agent, and a metal chelate-based crosslinking agent. The crosslinking agent may be used alone or in combination of two or more kinds.

[0063] The pressure-sensitive adhesive composition may contain, in addition to the above-mentioned components, pressure-sensitive adhesive additives used in general pressure-sensitive adhesives, so long as the effects of the present invention are not impaired. Examples of the adhesive additives include tackifiers, antioxidants, softeners (plasticizers), rust inhibitors, pigments, dyes, retarders, reaction accelerators (catalysts), and ultraviolet absorbers. The pressure-sensitive adhesive additives may be used alone or in combination of two or more kinds.

[0064] From the viewpoint of facilitating peeling from an adherend, the double-sided pressure-sensitive adhesive sheet preferably has an action mechanism that reduces the adhesive strength of the pressure-sensitive adhesive layer when peeled from the adherend. Examples of such double-sided pressure-sensitive adhesive sheets include double-sided pressure-sensitive adhesive sheets in which at least one of the pressure-sensitive adhesive layer (X1) and the pressure-sensitive adhesive layer (X2) is an energy ray-curable pressure-sensitive adhesive layer whose adhesive strength decreases when irradiated with energy rays, or a heat-peelable pressure-sensitive adhesive layer whose adhesive strength decreases when heated. In addition, it is preferable that only one of the adhesive layer (X1) and the adhesive layer (X2) is an adhesive layer having an action mechanism for reducing the adhesive strength, or that the adhesive layer (X1) and the adhesive layer (X2) have different action mechanisms for reducing the adhesive strength of the adhesive layers, since this makes it possible to prevent the adhesive strength of one of the adhesive layers from being unintentionally reduced when performing a process to reduce the adhesive strength of the other adhesive layer.

[0065] Furthermore, in order to peel off at least one of the rigid support and the cured sealed body from the state where they are bonded with a double-sided pressure-sensitive adhesive sheet, it is preferable to use a heat-peelable pressure-sensitive adhesive layer whose adhesive strength decreases by heating. By using a heat-peelable pressure-sensitive adhesive layer, the contact area between the pressure-sensitive adhesive layer and the adherend after heating is significantly reduced, so that it is easy to peel off either one of the rigid support and the cured sealed body from the state where they are bonded with a double-sided pressure-sensitive adhesive sheet. In order to prevent the residue of the heat-peelable pressure-sensitive adhesive layer from adhering to the adherend, it is preferable that the pressure-sensitive adhesive layer (X2) that adheres to the rigid support is a heat-peelable pressure-sensitive adhesive layer. From this viewpoint, it is preferable that the double-sided pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer (X2) that is a heat-peelable pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer (X1) that is a pressure-sensitive adhesive layer that does not have a mechanism for reducing adhesive strength or is an energy ray-curable pressure-sensitive adhesive layer. However, when the pressure-sensitive adhesive layer (X2) is a heat-peelable pressure-sensitive adhesive layer and at least one of the pressure-sensitive adhesive layer (X2) itself and the base material contains heat-expandable particles described below, if the pressure-sensitive adhesive layer (X2) is peeled off from the hard support and then the pressure-sensitive adhesive layer (X1) is irradiated with energy rays through the pressure-sensitive adhesive layer (X2), the energy rays may be diffused non-uniformly in the pressure-sensitive adhesive layer (X2), and the pressure-sensitive adhesive layer (X1) may not be irradiated with energy rays evenly. In such a case, it is preferable that the pressure-sensitive adhesive layer (X1) is a pressure-sensitive adhesive layer that does not have a mechanism for reducing adhesive strength. In addition, regardless of whether the adhesive layer (X2) is a heat-peelable adhesive layer, when the curable resin film is an energy ray curable resin film, etc., by irradiating the curable resin film or the adhesive layer (X1) with energy rays, when the adhesive layer (X1) is finally peeled off from the cured product 2 of the curable resin film, the adhesive layer may be stuck and may not be peeled off. From the viewpoint of avoiding such a situation, it is preferable that the adhesive layer (X1) is an adhesive layer that does not have a function of reducing adhesive strength. If the adhesive layer (X1), which is an adhesive layer that does not have a function of reducing adhesive strength, is attached to the cured sealed body 1' manufactured by the conventional method described above, when peeled off from the hard support, the possibility of occurrence of destruction such as peeling at the interface between the cured product of the curable resin film and the cured product of the sealing material at the end of the cured sealed body 1' increases. If the cured sealed body 1 is obtained using the curable resin film composite sheet of this embodiment, the possibility of occurrence of destruction such as peeling at the interface is reduced.

[0066] [Energy ray curable adhesive layer] The energy ray-curable adhesive layer is preferably a light ray-curable adhesive layer, and the light ray-curable adhesive layer is preferably formed from a light ray-curable adhesive composition containing a light ray-curable polymer and a photopolymerization initiator. The light used to cure the light ray-curable adhesive layer is preferably ultraviolet light. That is, the light ray-curable adhesive layer is preferably an ultraviolet light-curable adhesive layer.

[0067] The photocurable adhesive composition may be, for example, a composition containing a photocurable polymer in which a photocurable double bond such as a (meth)acryloyl group or a vinyl group has been introduced into the side chain of the polymer listed as the above-mentioned adhesive resin, or a composition containing a monomer or oligomer having a photocurable double bond. Note that it is preferable that these compositions further contain a photopolymerization initiator. The photopolymerization initiator may be the same as the photopolymerization initiator that may be contained in the photocurable resin composition. The photocurable pressure-sensitive adhesive composition may contain, in addition to the photocurable polymer and photopolymerization initiator, the above-mentioned crosslinking agent, tackifier, other pressure-sensitive adhesive additives, and the like, as necessary.

[0068] From the viewpoints of peelability during light irradiation and adhesion to an adherend, the thickness of the photocurable pressure-sensitive adhesive layer is preferably 1 to 100 μm, more preferably 3 to 80 μm, even more preferably 5 to 50 μm, and even more preferably 10 to 35 μm.

[0069] [Heat-peelable adhesive layer] The heat-peelable adhesive layer refers to an adhesive layer having an action mechanism that reduces adhesive strength when heated, and examples of such an adhesive layer include one in which the adhesive layer itself contains heat-expandable particles, and the heat-expandable particles expand when heated, forming unevenness on the surface of the adhesive layer and reducing adhesive strength, and one in which the base material contains heat-expandable particles, and the heat-expandable particles in the base material expand when heated, forming unevenness on the surface of the adhesive layer and reducing adhesive strength.

[0070] The thermally expandable particles are thermally expandable particles that expand when subjected to a specific heat treatment. The thermally expandable particles are preferably microencapsulated foaming agents that are composed of an outer shell made of a thermoplastic resin and an encapsulated component that is encapsulated in the outer shell and vaporizes when heated to a predetermined temperature. As the microencapsulated foaming agent, known foaming agents can be used.

[0071] The pressure-sensitive adhesive layer containing thermally expandable particles can be formed using a pressure-sensitive adhesive composition containing thermally expandable particles (hereinafter also referred to as "pressure-sensitive adhesive composition (1)"). The pressure-sensitive adhesive composition (1) contains a polymer component, and may contain a crosslinking agent, a tackifier, other pressure-sensitive adhesive additives, and the like, as necessary. The polymer component may be the same as the adhesive resin, and the preferred embodiments are also the same. The crosslinking agent, tackifier, and other adhesive additives may be the same as those described above, and the preferred embodiments are also the same. When the pressure-sensitive adhesive layer contains thermally expandable particles, the thickness of the pressure-sensitive adhesive layer before the thermal expansion treatment is preferably 10 to 125 μm.

[0072] <Base material> The substrate of the double-sided pressure-sensitive adhesive sheet may be a non-thermally expandable substrate, or it is a thermally expandable substrate when the double-sided pressure-sensitive adhesive sheet has a heat-peelable pressure-sensitive adhesive layer in which heat-expandable particles in the substrate expand when heated, forming irregularities on the surface of the pressure-sensitive adhesive layer and reducing the adhesive strength.

[0073] (Non-thermal expansion substrate) Examples of materials for forming the non-thermally expandable substrate include paper, resin, and metal, and can be appropriately selected depending on the application. The thickness of the non-thermally expandable substrate is preferably 5 to 500 μm, more preferably 15 to 300 μm, and further preferably 20 to 200 μm.

[0074] (Thermal expansion substrate) The thermally expandable substrate is preferably formed from a resin composition containing a resin and thermally expandable particles (hereinafter also referred to as "resin composition (2)").

[0075] An example of the resin contained in the resin composition (2) is one containing one or more resins selected from the group consisting of acrylic urethane resins and olefin resins.

[0076] The thickness of the thermally expandable substrate before the thermal expansion treatment is preferably 10 to 140 μm, and more preferably 20 to 125 μm.

[0077] The double-sided pressure-sensitive adhesive sheet does not necessarily have to have a substrate, and may be composed, for example, of only the energy ray-curable pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer containing thermally expandable particles described above.

[0078] <Other materials> The curable resin film composite sheet of the first embodiment may have a release film on the side of the curable resin film opposite the double-sided pressure-sensitive adhesive sheet. As the release film, a conventionally known one can be used, and for example, one having a release layer that has been subjected to a release treatment with a release agent on a base material for the release film can be mentioned.

[0079] <Method for producing the curable resin film composite sheet according to the first embodiment> The method for producing the curable resin film composite sheet of the first embodiment is not particularly limited, but an example thereof includes a method in which a curable resin composition is applied onto a release film and dried to form a curable resin film on the release film, and the curable resin film on the release film is bonded to a double-sided pressure-sensitive adhesive sheet so as to form a curable resin film non-laminated area to form a composite sheet.

[0080] [Curable resin film composite sheet of the second embodiment] The curable resin film composite sheet of the second aspect of this embodiment is A curable resin film composite sheet having a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on at least one surface thereof, and a curable resin film laminated on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive sheet has a curable resin film non-laminated region, which is a region where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; The pressure-sensitive adhesive sheet and the curable resin film are substantially rectangular in plan view, and in the curable resin film composite sheet, four sides constituting an outer edge of the curable resin film in plan view are each substantially parallel to an outer edge of the pressure-sensitive adhesive sheet in plan view; The length of each of the four sides constituting the outer edge of the curable resin film in a plan view is 5 to 30 mm shorter than the length of a side constituting the outer edge of the pressure-sensitive adhesive sheet that is approximately parallel to the side. The curable resin film composite sheet is used to seal an object to be sealed on a first surface, which is the surface of the curable resin film or the cured product of the curable resin film opposite to the surface in contact with the pressure-sensitive adhesive layer, with a sealant, and to produce a cured sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealant that seals the object to be sealed.

[0081] FIG. 4(a) is a schematic cross-sectional view of a curable resin film composite sheet 12, which is an example of the curable resin film composite sheet of the second aspect of this embodiment, and FIG. 4(b) is a schematic plan view of the curable resin film composite sheet 12. 4(a), the curable resin film composite sheet 12 has an adhesive sheet 7 having an adhesive layer on at least one surface, and a curable resin film 10 laminated on one surface of the adhesive sheet 7. The curable resin film composite sheet 12 has a curable resin film non-laminated region C near the end, which is a region where the curable resin film 10 is not laminated and where the adhesive sheet 7 is exposed. In the schematic plan view of FIG. 4(b), the curable resin film non-laminated region C is formed so as to surround the outer edge of the curable resin film 10. In FIG. 4(b), the adhesive sheet 7 and the curable resin film 10 are substantially rectangular, and the four sides constituting the outer edge of the curable resin film 10 in a plan view are each substantially parallel to the outer edge of the adhesive sheet 7 in a plan view.

[0082] The curable resin film composite sheet of the second embodiment is suitable for the method for producing a cured sealed product of the present embodiment described below. The curable resin film composite sheet of the second embodiment includes a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on at least one surface thereof as a support material for the curable resin film. From the viewpoint that it is possible to produce a cured sealed body having superior flatness by producing a cured sealed body in a state where the curable resin film composite sheet is attached to a hard support, it is preferable that the pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on at least one surface is a double-sided pressure-sensitive adhesive sheet. In this case, it can be used in the same manner as the curable resin film composite sheet of the first embodiment. Furthermore, when the adhesive sheet having an adhesive layer on at least one surface is a single-sided adhesive sheet having an adhesive layer only on the curable resin film side, for example, the area of ​​the single-sided adhesive sheet where the curable resin film is not laminated may be attached to an annular jig directly or via a ring-shaped double-sided adhesive sheet so as to form a curable resin film non-laminated area C, and then used for producing a cured sealed body, or the curable resin film composite sheet 12 may be fixed by another method.

[0083] In the curable resin film composite sheet of the second embodiment, the adhesive sheet having an adhesive layer on at least one surface and the curable resin film are approximately rectangular in plan view, and the four sides constituting the outer edge of the curable resin film in plan view are each approximately parallel to the outer edge of the adhesive sheet having an adhesive layer on at least one surface in plan view. In the curable resin film composite sheet of the second embodiment, the length of each of the four sides constituting the outer edge of the curable resin film in a planar view is 5 to 30 mm shorter than the length of a side constituting the outer edge of the pressure-sensitive adhesive sheet that is approximately parallel to the side, more preferably 6 to 20 mm shorter, and even more preferably 7 to 15 mm shorter.

[0084] <Curing resin film> A preferred embodiment of the curable resin film in the curable resin film composite sheet of the second embodiment is the same as the preferred embodiment of the curable resin film of the present embodiment.

[0085] <Adhesive sheet having an adhesive layer on at least one surface> As described above, the PSA sheet having a PSA layer on at least one surface may be a double-sided PSA sheet or a single-sided PSA sheet. The double-sided pressure-sensitive adhesive sheet may be the same as the double-sided pressure-sensitive adhesive sheet described in the curable resin film composite sheet of the first embodiment above.

[0086] (single-sided adhesive sheet) The pressure-sensitive adhesive layer of the single-sided pressure-sensitive adhesive sheet may be the same as the pressure-sensitive adhesive layer that may be present in the double-sided pressure-sensitive adhesive sheet of the curable resin film composite sheet of the first embodiment.

[0087] The substrate of the single-sided pressure-sensitive adhesive sheet preferably has at least one layer of resin film. When the area of ​​the single-sided pressure-sensitive adhesive sheet where the curable resin film is not laminated is attached to the annular jig, it has an independent area that is not laminated to the hard support, unlike the case where the double-sided pressure-sensitive adhesive sheet is fixed to the hard support. Therefore, in order to prevent the occurrence of loosening, it is preferable to use a resin with higher heat resistance for the resin film used as the substrate. Therefore, in this case, it is preferable that the resin constituting the resin film is a resin selected from the group consisting of aromatic polyimide, aromatic polyamide, aromatic polyamideimide, aromatic polysulfone, aromatic polyethersulfone, polyphenylene sulfide, aromatic polyether ketone, polyarylate, aromatic polyether ether ketone and polyethylene naphthalate from the viewpoint of heat resistance.

[0088] <Other materials> The curable resin film composite sheet of the second embodiment may have a release film on the surface of the curable resin film opposite the double-sided pressure-sensitive adhesive sheet. The release film may be the same as that which the curable resin film composite sheet of the first embodiment may have.

[0089] <Method for producing the curable resin film composite sheet according to the second embodiment> The method for producing the curable resin film composite sheet of the second embodiment is not particularly limited, but examples include a method in which a curable resin composition is applied onto a release film and dried to form a curable resin film on the release film, and the curable resin film on the release film is bonded to the adhesive surface of a pressure-sensitive adhesive sheet having an adhesive layer on at least one surface so as to form a curable resin film non-laminated area, thereby forming a composite sheet.

[0090] [Method of manufacturing hardened encapsulated body] Next, a method for producing the cured encapsulated body of this embodiment will be described. The method for producing the cured encapsulated body of the present embodiment includes the steps of: a lamination step of laminating a curable resin film on a support material to form a laminate (1) having the support material and the curable resin film, the support material having a curable resin film non-laminated region which is a region in a plan view where the curable resin film is not laminated and surrounds an outer edge of the curable resin film; a placement step of placing an object to be encapsulated on a first surface of the curable resin film opposite to a surface of the curable resin film that contacts the support; a sealing step of sealing the sealing object on the first surface with a sealing material to obtain a cured and sealed body having a cured product of the curable resin film, the sealing object on the cured product of the curable resin film, and a cured product of the sealing material sealing the sealing object; a peeling step of peeling the cured sealing body from the support material, In the method for producing a cured sealed body, the cured sealed body formed in the sealing step is in contact with the non-curable resin film-laminated region of the support material.

[0091] Hereinafter, each step in the method for producing a cured encapsulated body according to this embodiment will be described.

[0092] <Lamination process> Figure 5(a) shows a process of laminating a curable resin film 10 on a support material 5 to form a laminate (1) having the support material 5 and the curable resin film 10, and having a curable resin film non-laminated region D, which is an area in which the curable resin film 10 is not laminated in a plan view of the support material 5 and which surrounds the outer edge of the curable resin film 10.

[0093] The support material 5 is preferably an adhesive sheet having an adhesive layer at least on the surface in contact with the curable resin film 10. The adhesive sheet may be a double-sided adhesive sheet or a single-sided adhesive sheet having an adhesive layer only on the curable resin film 10 side. Furthermore, by adjusting the adhesiveness of the curable resin film 10, the base material, hard support, and the like explained in the curable resin film composite sheet of the first embodiment above can also be used as the support material 5.

[0094] The laminate (1) formed using a double-sided pressure-sensitive adhesive sheet as the support material 5 corresponds to the curable resin film composite sheet of the first aspect of this embodiment described above, and its preferred aspects are also the same. When a double-sided pressure-sensitive adhesive sheet is used as the support material 5, it is preferable to attach a hard support to the pressure-sensitive adhesive layer on the side opposite to the curable resin film 10, from the viewpoint of enabling the production of a flatter cured sealed body. The hard support is preferably attached to the entire adhesive surface of the double-sided pressure-sensitive adhesive sheet. Therefore, the hard support is preferably plate-shaped. The surface area of ​​the hard support is preferably equal to or larger than the area of ​​the adhesive surface of the double-sided pressure-sensitive adhesive sheet. Examples of materials for the hard support include non-metallic inorganic materials such as glass; resin materials such as epoxy resin, ABS resin, acrylic resin, engineering plastic, and super engineering plastic; and composite materials such as glass epoxy resin. Of these, glass is preferred. Examples of engineering plastics include nylon, polycarbonate (PC), and polyethylene terephthalate (PET). Examples of super engineering plastics include polyphenylene sulfide (PPS), polyethersulfone (PES), and polyetheretherketone (PEEK). The hard support may be made of a material that is elastically deformable such as rubber or silicone as long as it is hard enough to prevent displacement or inclination of the object to be sealed during the placement and sealing steps. The thickness of the hard support is appropriately selected depending on the object to be sealed and the type of sealing material, but is preferably from 20 μm to 50 mm, and more preferably from 60 μm to 20 mm. The hard support is preferably, for example, attached to a double-sided pressure-sensitive adhesive sheet in the positioning step, and peeled off from the double-sided pressure-sensitive adhesive sheet in the peeling step described below.

[0095] An example of the laminate (1) formed using a single-sided adhesive sheet having an adhesive layer only on the curable resin film side as the support material 5 is the curable resin film composite sheet of the second aspect of this embodiment described above, and the single-sided adhesive sheet may be used for producing a cured sealed body in a state where it is attached to an annular jig directly or via a ring-shaped double-sided adhesive sheet.

[0096] <Placement process> FIG. 5(b) shows a step of placing an object to be sealed 3 on a first surface S1, which is the surface of the curable resin film 10 opposite to the surface in contact with the support material 5.

[0097] Examples of the object to be sealed include semiconductor chips, semiconductor wafers, semiconductor packages, electronic components, LED elements, etc., among which semiconductor chips are preferred. The semiconductor may be a simple substance of silicon, or a compound semiconductor such as gallium nitride or silicon carbide. The semiconductor package may be in a state before being singulated, but is preferably a semiconductor package chip after being singulated. The semiconductor chip may be any known one, and an integrated circuit composed of circuit elements such as transistors, resistors, and capacitors is formed on the circuit surface of the semiconductor chip. The layout of the semiconductor chips, the number of chips to be arranged, etc. may be appropriately determined depending on the desired package form, production volume, etc. For disposing the semiconductor chip, a known device such as a flip chip bonder or a die bonder can be used. It is preferable that the semiconductor chip is arranged so that the back surface opposite to the circuit surface is covered with the surface of the curable resin film. In this case, after arrangement, the circuit surface of the semiconductor chip is exposed. The following description will be given based on such an example.

[0098] The manufacturing method of the cured encapsulant of this embodiment is preferably applied to the manufacture of packages such as FOWLP, FOPLP, etc., in which an area of ​​a semiconductor chip larger than the chip size is covered with an encapsulant and a redistribution layer is formed not only on the circuit surface of the semiconductor chip but also on the surface area of ​​the encapsulant. Therefore, the semiconductor chip is arranged on a portion of the surface of the curable resin film, and it is preferable that a plurality of semiconductor chips are arranged on the surface in a state aligned at regular intervals, and it is even more preferable that a plurality of semiconductor chips are arranged on the surface in a state aligned in a matrix of multiple rows and multiple columns in a state aligned at regular intervals. The distance between the semiconductor chips may be appropriately determined depending on the desired package shape and other factors.

[0099] In the placement step, after placing the objects to be sealed on the curable resin film, it is preferable to perform a curing treatment of the curable resin film (hereinafter also referred to as a "curing treatment before the sealing step") before the sealing step, from the viewpoint of increasing the adhesive strength between the objects to be sealed and the curable resin film and from the viewpoint of preventing unintended movement of the objects to be sealed during the sealing step. The curing treatment of the curable resin film may be carried out by irradiation with energy rays, heating, or the like depending on the type of the curable resin film. When the curable resin film is a thermosetting resin film, it is preferable to carry out a heat treatment simultaneously with the sealing step, together with a curing treatment before the sealing step, or without carrying out a curing treatment before the sealing step, and further, if necessary, a heat treatment after the sealing step may be carried out. When the curable resin film is subjected to a curing treatment multiple times, the degree of progress of curing in each curing treatment may be appropriately adjusted as desired.

[0100] <Sealing process> FIG. 5(c) shows a process for sealing an object to be sealed 3 with a sealing material to obtain a cured sealed body 1 having a cured product 2 of a curable resin film cured by a curing treatment simultaneously with the sealing material or prior to the sealing step, the object to be sealed 3 on the cured product 2 of the curable resin film, and a cured product 4 of the sealing material that seals the object to be sealed 3.

[0101] The cured product 4 of the sealing material covers the entire exposed surface of the object to be sealed 3 and the entire surface of the cured product 2 of the curable resin film which is the gap between multiple objects to be sealed 3, and is also in contact with the non-laminated areas D of the support material 5 where the curable resin film is not laminated.

[0102] The sealing material has a function of protecting the object to be sealed 3 and its associated elements from the external environment. The sealing material is preferably a thermosetting sealing material that contains a thermosetting resin. The encapsulant may be in a solid form such as granules, pellets, or a film at room temperature, or may be in a liquid form in the form of a composition. From the viewpoint of workability, an encapsulant in the form of a film is preferred. The method for sealing the object to be sealed with the sealing material can be appropriately selected and applied from methods applied in conventional sealing processes according to the type of sealing material. For example, a transfer molding method, a roll lamination method, a vacuum pressing method, a vacuum lamination method, a spin coating method, a die coating method, a compression molding method, etc. can be applied.

[0103] In addition, when the curable resin film is thermosetting and has not been completely cured before the sealing step, it is preferable to thermally cure the sealing material and the curable resin film at the same time.

[0104] In the sealing step, the sealing material or the curable resin film may be completely cured, but it is not necessary to completely cure it. If the sealing material or the curable resin film is not completely cured in the sealing step, it is preferable to perform a heat treatment after the sealing step to completely cure the sealing material or the curable resin film.

[0105] <Peeling process> FIG. 5( d ) shows a step of peeling off the cured encapsulant 1 from the support material 5 . The method for peeling off the cured sealing body 1 from the support material 5 may be appropriately determined depending on the type of the support material 5. For example, when the support material 5 is an adhesive sheet having an energy ray-curable adhesive layer on the surface in contact with the cured sealed body 1, the adhesive sheet can be irradiated with energy rays to reduce the adhesive strength of the energy ray-curable adhesive layer, and then the cured sealed body 1 can be peeled off from the adhesive sheet. Furthermore, when the support material 5 is an adhesive sheet having a heat-peelable adhesive layer on the surface that comes into contact with the cured sealed body 1, the adhesive sheet can be heated to reduce the adhesive strength of the heat-peelable adhesive layer, and then the cured sealed body 1 can be peeled off from the adhesive sheet. In the cured sealed body 1' manufactured by the conventional method shown in Fig. 8, when the support material 5 is an adhesive sheet having an adhesive layer that does not have an action mechanism for reducing adhesive strength on the surface that contacts the cured sealed body 1', when the cured sealed body 1' is peeled off from the adhesive sheet, the possibility of occurrence of damage such as peeling of the interface between the cured product of the curable resin film and the cured product of the sealant increases at the end of the cured sealed body 1'. However, in the cured sealed body 1 manufactured by the manufacturing method of the cured sealed body according to the present embodiment, even when the support material 5 is an adhesive sheet having an adhesive layer that does not have an action mechanism for reducing adhesive strength on the surface that contacts the cured sealed body 1, the possibility of occurrence of such damage such as peeling of the interface is reduced.

[0106] Furthermore, when the support material 5 is the above-mentioned double-sided adhesive sheet and a hard support is attached to the surface of the double-sided adhesive sheet opposite the curable resin film 10, the hard support and the double-sided adhesive sheet may be separated first and then the cured sealed body 1 may be peeled off from the double-sided adhesive sheet, or the cured sealed body 1 may be peeled off from the double-sided adhesive sheet with the hard support still attached. In an embodiment in which the adhesive layer on one side of a double-sided adhesive sheet is a heat-peelable adhesive layer and the adhesive layer on the other side is an adhesive layer that is not a heat-peelable adhesive layer, a hard support is attached to the heat-peelable adhesive layer, and the cured sealed body 1 is attached to the adhesive layer that is not a heat-peelable adhesive layer (i.e., when the adhesive layer (X2) is a heat-peelable adhesive layer and the adhesive layer (X1) is not a heat-peelable adhesive layer), from the standpoint of facilitating peeling of the cured sealed body 1 from the double-sided adhesive sheet, it is preferable to first perform a heat treatment to reduce the adhesive strength of the heat-peelable adhesive layer, separate the hard support and the double-sided adhesive sheet, and then peel the cured sealed body 1 from the double-sided adhesive sheet. In addition, in an embodiment in which the adhesive layer on one side of the double-sided adhesive sheet is a heat-peelable adhesive layer and the adhesive layer on the other side is an adhesive layer that is not a heat-peelable adhesive layer, the cured sealed body 1 is attached to the heat-peelable adhesive layer, and a hard support is attached to the adhesive layer that is not a heat-peelable adhesive layer (i.e., when the adhesive layer (X1) is a heat-peelable adhesive layer and the adhesive layer (X2) is not a heat-peelable adhesive layer), from the viewpoint of facilitating peeling of the cured sealed body 1 from the double-sided adhesive sheet, it is preferable to first perform a heat treatment to reduce the adhesive strength of the heat-peelable adhesive layer, and then peel the cured sealed body 1 from the double-sided adhesive sheet.

[0107] The cured sealant peeled off from the support as described above may be subjected to a heat treatment after the sealing step, if necessary. The heat treatment can increase the degree of curing of the thermosetting component contained in the sealant, etc., and improve the ability to protect the object to be sealed.

[0108] The cured encapsulated body manufactured through the above steps may be further processed as required. An example of such a process will be described below. In the following description, a semiconductor chip CP is used as the object 3 to be encapsulated.

[0109] The manufacturing method of this embodiment may include the following grinding step (1), rewiring layer forming step, and dicing step (1) in this order, as desired. However, when the dicing step (2) described below is performed, the dicing step (1) may be omitted. Grinding step (1): A step of grinding the surface of the curable resin film of the cured sealed body opposite the cured body. Rewiring layer formation process: A process for forming a rewiring layer on the surface of the cured encapsulant ground in the grinding process (1). Dicing process (1): A process of dicing the cured sealing body on which the rewiring layer has been formed in the rewiring layer forming process. Each step will be described below.

[0110] <Grinding process (1)> FIG. 6(a) shows a step of grinding the surface of the cured sealed body 1 opposite to the cured material 2 of the curable resin film by grinding means 110. In the grinding step (1), the cured sealing body 1 is ground, so that electrodes (not shown) of the semiconductor chip CP, which is the object to be sealed, are exposed on the grinding surface of the cured sealing body 1 after grinding. When grinding the surface of the cured sealed body 1 opposite the cured material 2 of the curable resin film, it is preferable to fix the surface of the curable resin film of the cured sealed body 1 facing the cured material 2 with a temporary fixing sheet or the like (not shown). The grinding means 110 may be a grinder or other known grinding devices. From the viewpoint of workability, the cured encapsulated body 1 may be diced into a predetermined size including one or more chips prior to the grinding step (1).

[0111] <Rewiring layer formation process> FIG. 6(b) shows a step of forming a rewiring layer 101 and external terminal electrodes 100 that are electrically connected to the electrodes of the semiconductor chip CP exposed on the grinding target surface of the cured sealed body 1 after the grinding step (1). The material of the rewiring layer 101 is not limited as long as it is a conductive material, and examples of the material include metals such as gold, silver, copper, and aluminum; alloys containing these metals; etc. The rewiring layer 101 can be formed by a known method such as a subtractive method or a semi-additive method, and one or more insulating layers may be provided as necessary. The external terminal electrodes 100 are electrically connected to external electrode pads of the rewiring layer 101. The external terminal electrodes 100 can be formed, for example, by soldering solder balls or the like.

[0112] <Dicing process (1)> FIG. 6(c) shows a step of dicing the cured sealing body 1 on which the rewiring layer 101 and the external terminal electrodes 100 have been formed. The dicing step (1) may be performed for each semiconductor chip, or may be performed for a predetermined size including a plurality of semiconductor chips. The method for dicing the cured sealed body 1 is not particularly limited, and may be performed by a known cutting means such as a dicing saw.

[0113] By going through the above steps, a cured encapsulated body 1 is obtained, which has a rewiring layer 101 formed on one surface and a cured product 2 of the curable resin film on the other surface. The cured product 2 of the curable resin film can function as a back surface protective film for the semiconductor chip CP, which plays a role in protecting the semiconductor chip CP from external impacts, etc. The back surface protective film can also be used for identifying and decorating the semiconductor chip by laser marking, and can also function as a light-shielding layer that prevents malfunction of the circuit. The back surface protective film may have a light transmittance of a predetermined level or more for the purpose of performing an infrared inspection or the like to check for the presence or absence of cracks in the object to be sealed. When the cured product 2 of the curable resin film contained in the cured sealing body 1 produced through the above-mentioned steps is used as a back surface protective film, if necessary, laser printing, further dicing, etc. may be performed on the surface of the cured product 2 of the curable resin film to form a semiconductor chip having a back surface protective film and a rewiring layer.

[0114] On the other hand, if necessary, the cured product of the curable resin film in the cured sealed body produced through the above steps may be ground, and a separate back surface protective film may be formed on the surface to be ground. When the cured product of the curable resin film is ground and a separate back surface protective film is formed, the method may include the following grinding step (2), back surface protective film forming step, and dicing step (2) in this order. Grinding step (2): A step of grinding the surface of the cured resin film of the cured sealed body on the cured product side. Back surface protective film formation process: A process for forming a back surface protective film on the surface of the cured encapsulated body ground in the grinding process (2). Dicing process (2): A process of dicing the cured encapsulant on which the back surface protective film has been formed in the back surface protective film forming process.

[0115] <Grinding process (2)> FIG. 7(a) shows a step of grinding the surface of the cured resin film of the cured sealed body 1 on the side of the cured material 2 by grinding means 110. When grinding the surface of the cured sealed body 1 on the side of the cured material 2 of the curable resin film, it is preferable to fix the surface of the cured sealed body 1 on the side of the rewiring layer 101 with a temporary fixing sheet or the like (not shown). The grinding means 110 may be the same as that used in the grinding step (1) above. In the grinding step (2), a part of the cured material 2 of the curable resin film may be ground, or the entire cured material 2 of the curable resin film may be ground. However, it is preferable to perform a thinning process of the semiconductor chip while removing the cured material 2 of the curable resin film. By performing a thinning process of the semiconductor chip simultaneously with the grinding step (2), the semiconductor chip is in a thick state in the arrangement step, making it easy to handle. In this case, the entire cured material 2 of the curable resin film is ground.

[0116] <Back side protective film formation process> FIG. 7(b) shows a step of forming a back surface protective film 120 on the surface of the cured resin film on the side of the cured material 2 of the cured sealed body 1 ground in the grinding step (2). The back surface protection film can be formed, for example, by a method in which a back surface curable resin film is attached to the surface of the cured product side of the curable resin film of the cured sealed body ground in the grinding step (2) and then cured. The curable resin film for the back surface can be any general curable resin film used to form a back surface protective film for a semiconductor chip, and may be of the same material and configuration as the curable resin film of this embodiment, for example. The back surface protective film formed by the above method may then be laser-printed by a known method.

[0117] <Dicing process (2)> FIG. 7(c) shows a step of dicing the cured sealing body 1 on which the rear surface protective film 120 has been formed. The dicing step (2) can be carried out in the same manner as the dicing step (1). The semiconductor chip manufactured through the above steps is then mounted on a semiconductor substrate or the like by a known method.

[0118] In other words, the method for manufacturing a cured sealed body according to the above embodiment is a method for manufacturing a cured sealed body as follows. That is, the method for producing the cured encapsulated body according to this embodiment is as follows: a placement step of placing an object to be sealed on a first surface of a curable resin film composite sheet, the first surface being a surface of the curable resin film opposite to a surface of the curable resin film that contacts the support material, the curable resin film having a curable resin film non-laminated area that is an area where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; a sealing step of sealing the sealing object on the first surface with a sealing material to obtain a cured and sealed body having a cured product of the curable resin film, the sealing object on the cured product of the curable resin film, and a cured product of the sealing material sealing the sealing object; a peeling step of peeling the cured sealing body from the support material, In the method for producing a cured sealed body, the cured sealed body formed in the sealing step is in contact with the non-curable resin film-laminated region of the support material. The method for producing such a cured sealed body is similar to the method for producing a cured sealed body according to the above-mentioned embodiment, except that it does not include a lamination step, and the placement step is performed using a curable resin film composite sheet in which a support material and a curable resin film are pre-laminated, and the above-mentioned curable resin film composite sheet can be used. EXAMPLES

[0119] Next, specific examples of the present invention will be described, but the present invention is not limited to these examples in any way. The physical properties in the examples described below were measured by the following methods.

[0120] <Weight average molecular weight (Mw)> Measurements were carried out using a gel permeation chromatograph (manufactured by Tosoh Corporation, product name "HLC-8020") under the conditions below, and values ​​measured in terms of standard polystyrene were used. (Measurement conditions) Column: "TSK guard column HXL-L", "TSK gel G2500HXL", "TSK gel G2000HXL", and "TSK gel G1000HXL" (all manufactured by Tosoh Corporation) connected in series Column temperature: 40℃ Developing solvent: Tetrahydrofuran ·Flow rate: 1.0mL / min

[0121] [Method for evaluating peelability] A cured sealing body was produced using the curable resin film composite sheet according to the following procedure, and the peelability of the cured sealing body from the support sheet was evaluated. (Lamination process) A double-sided adhesive sheet (manufactured by Nitto Denko Corporation, product name: REVALPHA) having a heat-peelable adhesive layer on one side and a pressure-sensitive adhesive layer on the other side was cut into a 600 mm x 600 mm square, and attached onto a hard support (42Alloy) with the heat-peelable adhesive layer as the attachment surface. Next, the curable resin films prepared in Example 1 and Comparative Example 1 were attached to the surface of the double-sided adhesive sheet opposite the hard support to prepare a curable resin film composite sheet. At this time, the curable resin film of Example 1 (a square of 590 mm x 590 mm in plan view) was attached so that in the obtained curable resin film composite sheet, the double-sided adhesive sheet had a curable resin film non-laminated region that was an area in which the curable resin film was not laminated in plan view and surrounded the outer edge of the curable resin film, and the four sides constituting the outer edge of the curable resin film in plan view were each approximately parallel to the outer edge of the double-sided adhesive sheet in plan view. The distance between the corresponding sides of the double-sided adhesive sheet and the curable resin film was 5 mm. In addition, the curable resin film of Comparative Example 1 (a square of 600 mm x 600 mm in plan view) was also attached so that each of the four sides constituting the outer edge of the curable resin film in plan view was approximately parallel to the outer edge of the double-sided adhesive sheet in plan view. However, since the curable resin film of Comparative Example 1 was the same size as the double-sided adhesive sheet, no non-laminated area of ​​the curable resin film was formed.

[0122] (Placement process) Next, a flip-chip type semiconductor chip (1 mm x 1 mm square, thickness: 500 μm) was placed on the curable resin film of the curable resin film composite sheet with a hard support obtained above, with the non-circuit forming surface facing the curable resin film. 1156 flip-chip type semiconductor chips were arranged in 34 rows and 34 columns with an interval of 0.26 mm. Next, the curable resin film composite sheet with a hard support on which the flip-chip type semiconductor chips were arranged was placed in an oven and heated at 130°C for 2 hours to cure the curable resin film.

[0123] (Sealing process) Thereafter, the encapsulant was compression molded in a mold so that the flip-chip type semiconductor chip on the cured product of the curable resin film was sealed, and a panel level package was produced as a cured sealed body. At this time, the size of the mold was 600 mm x 600 mm, and the depth was 700 μm. In the curable resin film of Example 1, a gap of 5 mm in width was generated between the outer edge of the curable resin film and the end of the mold, and the encapsulant was made to contact the curable resin film non-laminated area of ​​the double-sided adhesive sheet. As a result, as shown in the cross-sectional schematic diagram of FIG. 1(a), in the cured sealed body obtained in Example 1, the end of the cured product of the curable resin film was covered with the cured product of the encapsulant. On the other hand, the sealing material did not come into contact with the double-sided pressure-sensitive adhesive sheet in the curable resin film of Comparative Example 1. As a result, in the cured sealed body obtained in Comparative Example 1, the edges of the cured product of the curable resin film were exposed and not covered by the cured product of the sealing material.

[0124] (Peeling process) After removing the panel level package from the mold, the double-sided adhesive sheet was heated at 180°C for 1 minute to peel the hard support from the double-sided adhesive sheet, and then the cured sealing body was peeled off from the pressure-sensitive adhesive layer. At this time, the edge of the cured sealing body peeled off from the double-sided adhesive sheet was visually inspected to see if any damage had occurred in the cured product of the curable resin film. If no damage had occurred, it was rated as A, and if damage had occurred, it was rated as B. The results are shown in Table 1.

[0125] [Warp suppression evaluation method] The panel level package after peeling from the double-sided adhesive sheet obtained in the above [Method of evaluating peelability] was placed in an oven and heated at 175°C for 4 hours to carry out the main curing process of the encapsulant. The panel level package after the encapsulant curing obtained in this way was placed on a flat horizontal surface with the surface on which the cured product of the curable resin film was formed facing down. The distance between the end of the panel level package and the horizontal surface was measured, and a value of A was given when it was 5 mm or less, and a value of B was given when it exceeded 5 mm. Note that the evaluation result of the curable resin film of Comparative Example 1 for peelability was B, so this evaluation was not carried out. The results are shown in Table 1.

[0126] Example 1 (1) Preparation of thermosetting resin composition The components shown below in type and amount (all "active ingredient ratio") were mixed, diluted with methyl ethyl ketone, and stirred uniformly to prepare a solution of a curable resin composition with a solids concentration (active ingredient concentration) of 61 mass %. Acrylic polymer: amount blended = 21 parts by weight An acrylic polymer obtained by copolymerizing 55 parts by mass of n-butyl acrylate, 10 parts by mass of methyl acrylate, 20 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight (Mw): 800,000, glass transition temperature: -28°C) Epoxy compound (1): amount blended = 10 parts by weight Liquid bisphenol A epoxy resin (manufactured by Nippon Shokubai Co., Ltd., product name "BPA328", epoxy equivalent = 220~240g / eq) Epoxy compound (2): amount blended = 2.0 parts by weight Solid bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "Epicoat 1055", epoxy equivalent = 800-900g / eq) Epoxy compound (3): amount blended = 5.6 parts by mass Dicyclopentadiene type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., product name "XD-1000L", epoxy equivalent = 274~286g / eq) Heat curing agent: amount blended = 0.5 parts by weight Dicyandiamide (manufactured by ADEKA Corporation, product name "ADEKA Hardener EH-3636AS", active hydrogen amount = 21g / eq) Curing accelerator: amount mixed = 0.5 parts by weight 2-Phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., product name "Curezol 2PHZ") Silane coupling agent: amount blended = 0.4 parts by mass Epoxy group-containing oligomer-type silane coupling agent (manufactured by Mitsubishi Chemical Corporation, product name "MSEP2") ·Inorganic filler (1): Blending amount = 6 parts by mass Spherical silica filler (manufactured by Admatechs Co., Ltd., product name "SC2050MA", average particle size = 0.5 μm) ·Inorganic filler (2): Blending amount = 54 parts by mass Spherical silica filler (manufactured by Tatsumori Co., Ltd., product name "SV-10", average particle size = 8 μm)

[0127] (2) Formation of a curable resin film The solution of the thermosetting resin composition prepared above was applied onto the release-treated surface of a PET (polyethylene terephthalate) release film to form a coating film, and the coating film was dried at 120°C for 2 minutes to form a curable resin film with a thickness of 25 μm.

[0128] (3) Forming of hardening resin film The curable resin film formed in (2) above was punched out and cut into a square of 590 mm x 590 mm, and unnecessary parts around the punched area were removed to obtain a molded curable resin film having thermosetting properties.

[0129] Comparative Example 1 In "(3) Molding of a curable resin film" of Example 1, a molded curable resin film having thermosetting properties was obtained in the same manner as in Example 1, except that the curable resin film was punched and cut into a square of 600 mm x 600 mm.

[0130] [Table 1]

[0131] The results in Table 1 show that the curable resin film of this embodiment can form a cured sealed body that is suppressed from warping and has excellent releasability from the support material. [Explanation of symbols]

[0132] 1, 1' cured encapsulant 2. Hardened product of curable resin film 3. Sealing object 4. Hardened sealing material 5 Support material 6 Double-sided adhesive sheet 7. Adhesive sheet having an adhesive layer on at least one surface 10. Curable resin film 11. Curable resin film composite sheet 12. Curable resin film composite sheet 100 External terminal electrode 101 Redistribution layer 110 Grinding means (1) Laminate A Excess area of ​​hardened encapsulant B~D Curable resin film non-laminated area

Claims

1. A curable resin film, The curable resin film is used to seal an object to be sealed on a first surface, which is one surface of the curable resin film or a cured product of the curable resin film, with a sealant, to produce a cured sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealant that seals the object to be sealed, the cured sealing body has an excess region of the cured material of the sealing material surrounding an outer edge of the cured material of the curable resin film in a plan view, The curable resin film is formed in advance so that the excess region is formed in the cured sealed body.

2. The cured resin film according to claim 1, wherein the cured sealing body and the curable resin film are approximately rectangular in plan view, and each of the four sides constituting the outer edge of the cured resin film in plan view is approximately parallel to the outer edge of the cured sealing body in plan view.

3. The length of each of the four sides constituting the outer edge of the curable resin film in a planar view is 5 to 30 mm shorter than the length of a side constituting the outer edge of the cured sealed body in a planar view that is approximately parallel to the side. The curable resin film according to claim 2.

4. A lamination process of laminating a curable resin film on a support material to form a laminate (1) having the support material and the curable resin film, the support material having a curable resin film non-laminated region which is a region where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; a placement step of placing an object to be encapsulated on a first surface of the curable resin film opposite to a surface of the curable resin film that contacts the support; a sealing step of sealing the sealing object on the first surface with a sealing material to obtain a cured and sealed body having a cured product of the curable resin film, the sealing object on the cured product of the curable resin film, and a cured product of the sealing material sealing the sealing object; a peeling step of peeling the cured sealing body from the support material, The cured sealed body formed in the sealing step is a cured product of the sealing material in contact with the non-laminated area of ​​the support material.

5. The method for producing a cured sealed body according to claim 4 , wherein the support material is an adhesive sheet having an adhesive layer on at least a surface thereof that comes into contact with the curable resin film.

6. A double-sided pressure-sensitive adhesive sheet and a curable resin film laminated on one surface of the double-sided pressure-sensitive adhesive sheet, the double-sided pressure-sensitive adhesive sheet has a curable resin film non-laminated region, which is a region where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; A curable resin film composite sheet used for producing a cured sealed body having a cured product of the curable resin film, the object to be sealed on a first surface, which is the surface of the curable resin film or the cured product of the curable resin film opposite to the surface in contact with the double-sided adhesive sheet, and a cured product of the sealing material that seals the object to be sealed.

7. A curable resin film composite sheet having a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on at least one surface thereof, and a curable resin film laminated on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive sheet has a curable resin film non-laminated region, which is a region where the curable resin film is not laminated in a plan view and surrounds an outer edge of the curable resin film; The pressure-sensitive adhesive sheet and the curable resin film are substantially rectangular in plan view, and in the curable resin film composite sheet, four sides constituting an outer edge of the curable resin film in plan view are each substantially parallel to an outer edge of the pressure-sensitive adhesive sheet in plan view; The length of each of the four sides constituting the outer edge of the curable resin film in a plan view is 5 to 30 mm shorter than the length of a side constituting the outer edge of the pressure-sensitive adhesive sheet that is approximately parallel to the side. A curable resin film composite sheet used for sealing an object to be sealed on a first surface, which is the surface of the curable resin film or the cured product of the curable resin film opposite to the surface in contact with the pressure-sensitive adhesive layer, with a sealing material, to produce a cured sealed body having the cured product of the curable resin film, the object to be sealed on the cured product of the curable resin film, and a cured product of the sealing material that seals the object to be sealed.

8. A cured sealed body comprising: a cured product of a curable resin film; an object to be sealed on the cured product of the curable resin film; and a cured product of a sealing material that seals the object to be sealed, and having, in a planar view, an excess area of ​​the cured product of the sealing material that surrounds the outer edge of the cured product of the curable resin film.

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