Housing

Abstract

To provide a housing that can be stacked, that can compress the packaging volume when packaging the housing of an electronic device, and that can reduce the number of packaging members.SOLUTION: The housing has a bottom plate part that mounts an electronic device and a peripheral wall part that slopes outward from the bottom plate periphery and stands up to form an opening facing the bottom plate part. The housing can be stacked in the same direction as the direction in which the opening opens. The housing has a convex top surface that protrudes from the bottom plate part without reaching the opening and a protruding part that has a concave surface that forms a hollow on the opposite side of the convex top surface. The protruding part has a projecting part that further projects from the protruding part.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a housing, and more particularly to an electronic device housing. [Background technology]

[0002] Generally, in a conventional stacking structure of housings, a cut is provided in a wall that constitutes a surface perpendicular to the bottom surface, allowing two housings to be stacked together (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-222865 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the conventional technology has the following problems. First, it is necessary to make a cut in the plane perpendicular to the bottom surface of the case and in the plane diagonally opposite the plane, and the width of the cut needs to be greater than the thickness of the mating surface. If the part is to be used in an electronic device, the cut needs to be blocked by another mating part when assembling the case.

[0005] In addition, because the housings are stacked on top of each other with their open tops facing each other, the units are packaged alternately, which poses the problem that they are difficult to remove from the packaging box when unpacking.

[0006] Furthermore, because the housings are stacked in a staggered fashion, it is not possible to stack three or more housings.

[0007] The present invention has been made in consideration of the above points, and aims to provide a housing that can be stacked, can compress the packaging volume when packaging the electronic device housing, and can reduce the amount of packaging materials. [Means for solving the problem]

[0008] The housing of the present invention has a bottom plate portion for mounting an electronic device and a peripheral wall portion that rises at an outward angle from the periphery of the bottom plate portion and forms an opening facing the bottom plate portion, and is a housing that can be stacked in the same direction in which the opening opens, and is characterized in that it has a protruding portion having a convex top surface that protrudes from the bottom plate portion without reaching the opening, and having a concave surface that forms a hollow portion on the opposite side to the convex top surface, and the protruding portion has a protrusion portion that protrudes further from the protruding portion. Effect of the Invention

[0009] According to the present invention, by providing a housing with multiple concave and convex shapes, it becomes possible to stack two or more housings without misalignment, which results in the effect of compressing the packaging volume when packaging the housings and reducing the amount of packaging materials required. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic exploded perspective view showing an electronic device housing according to a first embodiment of the present invention; [Diagram 2] 2 is a schematic perspective view showing an internal structure of the housing of the first embodiment as viewed from an opening side. FIG. [Diagram 3] 3 is a cross-sectional view of the housing taken along line aa in FIG. 2. [Figure 4] 3 is a cross-sectional view of the housing taken along line bb in FIG. 2. [Diagram 5] 1 is a schematic perspective view of the housing of the first embodiment, seen from the external design surface on the rear side of the opening. FIG. [Figure 6] FIG. 2 is a schematic cross-sectional view of the first embodiment before two housings, an upper housing and a lower housing, are superimposed on each other. [Figure 7] 1 is a schematic cross-sectional view showing a state in which two overlapping housings, an upper housing and a lower housing, of the first embodiment are stacked together. FIG. [Figure 8] 1 is a partial cross-sectional view showing a state in which two overlapping housings are stacked with their bottom plate portions facing upward in the first embodiment. FIG. [Figure 9] 1 is a schematic perspective view showing a packaging state in which a plurality of housings are stacked in a packaging box according to a first embodiment. FIG. [Figure 10] FIG. 11 is a schematic perspective view showing the internal structure of a housing according to a second embodiment of the present invention as viewed from the opening side. [Figure 11] FIG. 11 is a partial cross-sectional view showing a state in which two overlapping housings are stacked with their bottom plate portions facing downward in the second embodiment. [Figure 12] FIG. 11 is a partial cross-sectional view showing a state in which two overlapping housings with their bottom plate portions facing downwards are stacked together in the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an electronic device housing according to an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the following embodiment. Note that in the embodiment, components having substantially the same functions and configurations are denoted by the same reference numerals, and duplicated explanations will be omitted.

[0012] (First embodiment) (Configuration Description) FIG. 1 is a schematic exploded perspective view showing an electronic device housing according to an embodiment. As shown in FIG. 1, the electronic device housing according to the embodiment has a substantially rectangular parallelepiped appearance, and is configured by fitting a cylindrical box-shaped lid body LID and a housing 11 (housing body) to each other at their respective openings OPN. An electronic circuit board SUB is accommodated inside the opening OPN of the housing 11. Note that, although various electronic components are mounted on the electronic circuit board SUB in the figure to configure an electronic circuit, the electronic components and electronic circuits are omitted in the figure for the sake of simplicity. In addition, power cables and signal cables from the electronic circuit board SUB, openings for these cables, and screws for fastening and fixing the housing 11 and the lid body LID are not shown in the figure for the sake of simplicity.

[0013] Fig. 2 is a schematic perspective view showing the internal structure of the housing 11 of this embodiment as viewed from the opening OPN side. Fig. 3 is a cross-sectional view of the housing 11 taken along line aa in Fig. 2. Fig. 4 is a cross-sectional view of the housing 11 taken along line bb in Fig. 2. Fig. 5 is a schematic perspective view showing the appearance of the housing 11 as viewed from the external design surface on the back side of the opening.

[0014] 2 to 5, the housing 11 is composed of a bottom plate portion 12 on which an electronic circuit board SUB (see FIG. 1) is mounted on the inside, and a peripheral wall portion 13. The peripheral wall portion 13 is inclined outwardly from the periphery of the bottom plate portion 12 and rises up, forming an opening OPN facing the bottom plate portion 12. Thus, two or more housings 11 can be stacked with their respective openings OPN facing in the same direction.

[0015] The housing 11 has a protrusion 14 protruding from the bottom plate portion 12, and a protrusion 16 and boss 15 protruding further from the protrusion 14. The protrusion 14 has a convex top surface PTS on the opening OPN side, and a concave surface COX forming a hollow portion on the opposite side to the convex top surface PTS. The protrusion 16 protrudes from the convex top surface PTS. The multiple protrusions 14 are preferably arranged on the bottom plate portion 12 at positions that correspond to the respective distributed loads, taking into consideration the balance of the mass of the housing 11. The multiple bosses 15 are preferably arranged on the bottom plate portion 12 at positions that take into consideration the balance of the electronic circuit board SUB (see FIG. 1).

[0016] The boss 15 has a screw seat on its convex top surface PTS. The height of the protrusion 16 and the boss 15 is set so as not to reach the opening OPN for mounting the electronic circuit board SUB (see FIG. 1).

[0017] As shown in FIGS. 4 and 5, the housing 11 has, on the design surface on the bottom plate portion 12 side, a concave surface COX of the protrusion 14 and a concave surface COX2 forming a hollow portion on the side opposite the convex top surface PTS of the boss 15.

[0018] 4, the boss 15 which is a protrusion from the bottom plate portion 12 has a frustum-shaped side surface SDC. The concave surface COX2 of the boss 15 has a complementary shape which fits loosely with the frustum-shaped side surface SDC of the boss 15.

[0019] 6 and 7 are cross-sectional views showing a state in which two housings 11, an upper one and a lower one, are prepared (FIG. 6), the protrusion 16 of the lower housing 11 is aligned with the concave surface COX of the upper protrusion 14, and the protrusion 16 is fitted into the concave surface COX of the upper protrusion 14, and the protrusion 16 abuts against the ceiling of the concave surface COX (FIG. 7). FIG. 7 shows the state in which the upper and lower housings 11 are stacked.

[0020] As shown in FIG. 7, the protrusion 16, the protruding portion 14, and the peripheral wall portion 13 are set as follows, for example, so that the peripheral wall portion 13 of the lower housing 11 does not contact the design surface of the upper housing 11. Here, the height of the peripheral wall portion 13 is HW, the depth of the concave surface COX of the protrusion 14 is D, and the height of the concave surface COX of the protrusion 16 from the depth is HP, based on the design surface (outer surface) of the bottom plate portion 12. In this case, an example of a condition for ensuring a gap G so that the peripheral wall portion 13 of the lower housing 11 does not contact the upper housing 11 is, for example, as follows. Since HW>HP+D and HP>D, HW>HP+D>2D, in order to obtain G of several tens of millimeters, the angle from the normal line of the peripheral wall portion 13 is set to, for example, 5 degrees or more in percentage degrees.

[0021] Normally, when two housings 11 are stacked with the bottom plate portion 12 facing upward, the positions of the two housings 11 relative to each other cannot be determined, and the internal structure of the housings 11 damages the bottom plate portion 12 and the peripheral wall portion 13 of the housings 11. Conversely, the same occurs when the bottom plate portion 12 is stacked with the bottom plate portion 12 facing downward. However, according to this embodiment, when two housings 11 are stacked, the position is determined by fitting the protrusion portion 16 into the protrusion portion 14, and the housings 11 can be stacked in a fixed direction without damaging the design surface of the housings 11. Also, if the housings 11 have a mass that exerts rigidity without bending, three or more housings can be stacked.

[0022] (Explanation of operation) 8 shows a partial cross-sectional view of two housings 11 with bottom plate portion 12 facing upward, with protrusion 16 of upper housing 11 fitted into protrusion 14 of the lower housing, and the housings 11 stacked together. At this time, a gap A is generated between protrusion 16 of upper housing 11 and protrusion 14 of lower housing 11, but if the relationship between the internal structure of peripheral wall portion 13 of upper housing 11 and distance B between peripheral wall portion 13 of lower housing 11 is B>A, then the two housings 11 can be stacked without damaging each other.

[0023] (Explanation of effect) As described above, according to the first embodiment, by arranging the protruding portion 14 on the design surface of the housing 11 and the convex projection portion 16 on the structural surface in multiple locations, multiple housings 11 can be stacked in the same orientation. Fig. 9 is a schematic perspective view showing a packaging state in which multiple housings 11 are stacked in a packaging box BOX. As shown in Fig. 9, this embodiment is expected to reduce the packaging material normally used between the housings 11 to prevent damage, and to reduce the packaging volume when placed in a packaging box.

[0024] (Second embodiment) In the first embodiment, the protrusions 14 and 16 dedicated to the stack were described, but in the second embodiment, since the housing 11 of the electronic device is often provided with a boss 15 having a screw seat on the top surface for fixing the screw, a linear protrusion shape is provided on the side of the boss 15.

[0025] 10 is a schematic perspective view showing the internal structure of the housing 11 of this embodiment as seen from the opening OPN side. The second embodiment is the same as the first embodiment, except that the protrusions 14 and the protrusions 16 of the first embodiment are omitted, and a plurality of linear protrusions RIM, for example, four protrusions, are provided at equal intervals and protrude from the frustum-shaped side surfaces SDC or the concave surfaces COX of the four bosses 15 at the four corners, which are the protrusions, and extend in the height direction of the bosses 15.

[0026] 11 is a partially cutaway perspective view showing a state in which two housings 11, an upper one and a lower one, are overlapped with the boss 15 of the lower housing 11 aligned with the concave surface COX2 of the upper boss 15, the lower boss 15 fits into the concave surface COX2 of the upper boss 15, and the lower linear protrusions RIM abut against the inner surface of the upper concave surface COX2. The height C of the linear protrusions RIM from the frustum-shaped side surface SDC of the boss 15 is set so as to secure a gap G for preventing the peripheral wall portion 13 of the lower housing 11 from contacting the upper housing 11 of the boss 15.

[0027] (Explanation of effect) As described above, according to the second embodiment, the same effect as in the first embodiment can be obtained with a simple structure without providing a protruding portion with a protrusion.

[0028] (Third embodiment) As shown in Figure 12, the third embodiment is the same as the second embodiment except that the linear protrusions RIM on the frustum-shaped side surface SDC of the boss 15 of the second embodiment are omitted, and instead a plurality of linear protrusions RIM2, for example four, are provided at equal intervals on the inner surface of the concave surface COX2 of the boss 15 extending in the height direction of the boss 15.

[0029] 12 is a partially cutaway perspective view showing a state in which two upper and lower housings 11 are overlapped with the boss 15 of the lower housing 11 aligned with the concave surface COX2 of the upper boss 15, the lower boss 15 fits into the concave surface COX2 of the upper boss 15, and the linear protrusions RIM2 on the inner surface of the concave surface COX2 of the upper boss 15 abut against the frustum-shaped side surface SDC of the lower boss 15. The height C2 of the linear protrusions RIM2 on the inner surface of the concave surface COX2 of the boss 15 from the inner surface is set so as to secure a gap G for preventing the peripheral wall portion 13 of the lower housing 11 from contacting the upper housing 11 of the boss 15.

[0030] (Explanation of effect) As described above, according to the third embodiment, the same effect as in the first embodiment can be obtained with a simple structure without providing a protruding portion with a protrusion.

[0031] In the above embodiments, examples of the resin material for the lid body LID and the housing 11 include engineering plastics such as ABS (acrylonitrile butadiene styrene), ASA (acrylate styrene acrylonitrile), and AES (acrylonitrile ethylene propylene diene styrene).

[0032] It should be noted that the present invention also includes combinations of the second and third embodiments with the first embodiment. The housing according to the present invention can also be applied to a cover that constitutes the housing, and is included in the present invention.

Claims

1. A housing having a bottom plate portion on which an electronic device is mounted and a peripheral wall portion that rises from a peripheral edge of the bottom plate portion at an inclination outwardly and forms an opening facing the bottom plate portion, the housing being stackable in the same direction in which the opening opens, a protruding portion having a convex top surface protruding from the bottom plate portion without reaching the opening, and a concave surface forming a hollow portion on the opposite side to the convex top surface; The housing is characterized in that the protrusion has a protrusion that further protrudes from the protrusion.

2. The housing according to claim 1 , wherein the protrusion protrudes from the convex top surface.

3. The protrusion has a frustum-shaped side surface, the concave surface of the protrusion has a shape complementary to the frustum-shaped side surface, The housing according to claim 1 , wherein the protrusion protrudes from the frustum-shaped side surface or the concave surface of the protruding portion.

4. The housing according to claim 3 , wherein the protrusion is a boss.

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