Lithography device, stage device and article producing method

Abstract

To provide a technology advantageous for suppressing a decline of positional measurement accuracy caused by stage deformation.SOLUTION: A lithography device for transferring an original pattern onto a substrate includes a stage mechanism that holds the substrate, an encoder system that includes an encoder head and encoder scale, and the stage comprises a scale holding part that holds the encoder scale by suction, and the scale holding part includes multiple suction parts that can be controlled individually.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a lithography apparatus, a stage apparatus, and a method for manufacturing an article. [Background technology]

[0002] Lithography apparatuses such as imprint apparatuses and exposure apparatuses can be configured to transfer a pattern of an original to a plurality of shot areas of a substrate. In the imprint apparatus, the pattern of the original is transferred to the substrate by contacting the original with an imprint material arranged on the substrate and then curing the imprint material. In the exposure apparatus, the pattern of the original is projected onto a photoresist applied to the substrate and exposed to light, thereby transferring the pattern of the original to the photoresist as a latent image. In order to transfer the pattern of the original to a plurality of shot areas of the substrate, a stage holding the substrate can be feedback-controlled. In the feedback control, the position of the stage is measured using a measuring device such as an encoder, and the position of the stage is controlled based on the difference between a target position and a measured value. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-253839 A Summary of the Invention [Problem to be solved by the invention]

[0004] The encoder system may include, for example, an encoder scale fixed to the stage and an encoder head arranged to face the encoder scale. In order to improve the throughput of the manufacture of articles, the stage is driven at high acceleration, and a motor driving the stage generates heat, which may cause the stage to deform. The encoder scale fixed to the stage is affected by the deformation of the stage and deforms, which may reduce the measurement accuracy of the position of the stage.

[0005] An object of the present invention is to provide an advantageous technique for suppressing a decrease in measurement accuracy of the stage position due to deformation of the stage. [Means for solving the problem]

[0006] One aspect of the present invention relates to a lithography apparatus that transfers a pattern of an original onto a substrate, the lithography apparatus comprising a stage mechanism including a stage that holds a substrate, and an encoder system including an encoder head and an encoder scale, the stage including a scale holding portion that holds the encoder scale by suction force, the scale holding portion including a plurality of suction portions that can individually control suction. Effect of the Invention

[0007] According to the present invention, an advantageous technique is provided for suppressing a decrease in measurement accuracy of the stage position due to deformation of the stage. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing the configuration of a lithography apparatus. [Diagram 2] AA arrow view of Figure 1. [Diagram 3] FIG. 2 is a perspective view taken along the line B-B of FIG. [Figure 4] Cross section taken along CC in Figure 2. [Diagram 5] Top view (a) and DD cross-sectional view (b) of the stage mechanism. [Figure 6] 1 illustrates the operation of a lithographic apparatus configured as an imprint apparatus; [Figure 7] 11A to 11C are diagrams illustrating a method of controlling the operating states of a plurality of suction units. [Figure 8] 6A to 6C are diagrams illustrating an example of an operating state of a plurality of suction units. [Figure 9] 4A to 4C are diagrams illustrating a process for transferring a pattern to a central shot area (i-th shot area) among a plurality of shot areas on a substrate. [Figure 10]1A and 1B are diagrams illustrating a process for transferring a pattern to an (i+1)th shot area that is a shot area subsequent to the i-th shot area (a shot area in the center of a substrate 1). [Figure 11] FIG. [Figure 12] 13A to 13C are diagrams showing other examples of the arrangement of a plurality of suction parts or non-suction areas. [Figure 13] FIG. 13 is a diagram showing a modified encoder system. [Figure 14] 13A and 13B are diagrams showing a first configuration example and a second configuration example of the second embodiment; [Figure 15] FIG. 13 shows a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] In this specification and drawings, directions are described according to the XYZ coordinate system. In the XYZ coordinate system, the Z axis is defined parallel to the vertical direction. The X direction, Y direction, and Z direction are directions parallel to the X axis, Y axis, and Z axis, respectively. The θ direction is a rotation direction around the Z axis. The XY direction is a direction parallel to the XY plane, and driving in the XY direction means driving in the X direction, driving in the Y direction, or driving in the X direction and the Y direction.

[0011] Hereinafter, the lithography apparatus 100 and the stage device STM of the first embodiment will be described with reference to FIG. 1, FIG. 2, FIG. 3, and FIG. 4. The stage device STM may be understood as a stage mechanism. FIG. 1 is a diagram showing the configuration of the lithography apparatus 100. FIG. 2 is a view seen from the arrow AA in FIG. 1. FIG. 3 is a perspective view of FIG. 1 at BB. FIG. 4 is a cross-sectional view taken along line CC in FIG. 2. FIG. 5(a) is a top view of the stage mechanism STM, and FIG. 5(b) is a cross-sectional view taken along line DD in FIG. 5(a). Here, an example in which the lithography apparatus 100 is configured as an imprint apparatus will be described. However, the lithography apparatus 100 may be configured as an exposure apparatus that transfers the pattern of the original onto the substrate 1 by projecting the pattern of the original onto the substrate 1 using a projection optical system. The imprint apparatus as the lithography apparatus 100 transfers the pattern of the mold 10 to the substrate 1 (the imprint material thereon) by bringing the mold 10 as the original into contact with the imprint material arranged on the substrate 1 and then curing the imprint material. The substrate 1 usually has a plurality of shot areas, and the pattern of the mold 10 is transferred to each shot area.

[0012] As the imprint material, a curable composition (sometimes called an uncured resin) that is cured by applying energy for curing is used. As the energy for curing, electromagnetic waves, heat, etc. can be used. The electromagnetic waves can be, for example, light having a wavelength selected from the range of 10 nm to 1 mm, such as infrared rays, visible light, and ultraviolet rays. The curable composition can be a composition that is cured by irradiation with light or by heating. Among these, the photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The imprint material can be arranged on the substrate in the form of droplets, or in the form of islands or a film formed by connecting a plurality of droplets. The imprint material may also be supplied in the form of a film on the substrate by a spin coater or a slit coater. The viscosity of the imprint material (viscosity at 25°C) may be, for example, 1 mPa·s or more and 100 mPa·s or less. Examples of materials that can be used for the substrate include glass, ceramics, metals, semiconductors (Si, GaN, SiC, etc.), and resins. If necessary, a member made of a material different from that of the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

[0013] The lithography apparatus 100 includes a stage mechanism STM including a stage 4 (XY movable part) that holds a substrate 1. The stage 4 includes a chuck device 2 that chucks the substrate 1. The chuck device 2 can be, for example, a vacuum chuck or an electrostatic chuck. The stage mechanism STM includes an XY movable part as a stage 4 that can move in the XY directions, a Y movable part 5 that can move in the Y direction, and a stage base 6 that supports the stage 4 and the Y movable part 5. The stage 4 holds the substrate 1 and is arranged to be movable in the XY directions while using the upper surface of the stage base 6 as a guide surface. The stage 4 can be floated above the guide surface of the stage base 6 by an air guide 21. The stage 4 is guided by the Y movable part 5 via a lateral air guide 24, and is driven in the X direction by an X linear motor consisting of an X linear motor movable part 25 and an X linear motor fixed part 26. An X encoder scale 30 is arranged on the Y movable part 5, and an X encoder head 31 can be provided on the stage 4 so as to face the X encoder scale 30. X encoder scale 30 and X encoder head 31 constitute an X encoder that measures the X direction position of stage 4 relative to Y movable part 5 .

[0014] The Y movable part 5 may have a guide surface 36 that guides the stage 4 so that the stage 4 can move in the X direction relative to the Y movable part 5. The Y movable part 5 may be provided with an X linear motor fixing part 26. The Y movable part 5 may be guided by the stage base 6 via the bottom air guide 22, guided by the first and second Y guides 37 via the side air guides 23, and driven in the Y direction by the first and second Y linear motors. The first Y linear motor may be composed of a Y linear motor moving part 27R provided in the Y movable part 5 and a Y linear motor fixing part 28R fixed to the stage base 6. The second Y linear motor may be composed of a Y linear motor moving part 27L provided in the Y movable part 5 and a Y linear motor fixing part 28L fixed to the stage base 6.

[0015] The position in the Y direction of Y movable part 5 can be measured by first and second Y encoders. The first Y encoder can be composed of Y encoder scale 32 provided on first Y guide 37, and Y encoder head 33 provided on Y movable part 5 to face Y encoder scale 32. The first Y encoder can be composed of Y encoder scale 34 provided on second Y guide 37, and Y encoder head 35 provided on Y movable part 5 to face Y encoder scale 34.

[0016] The first and second Y encoders can measure the Y-direction position and θ-direction rotation of the Y movable part 5 relative to the stage base 6. The Y-direction position of the Y movable part 5 relative to the stage base 6 can be detected based on the measurement value of either the first or second Y encoder, or based on both the first and second Y encoders. In the latter case, the Y-direction position of the Y movable part 5 relative to the stage base 6 can be detected based on the average value of the measurement values ​​of both the first and second Y encoders. Alternatively, the Y-direction position of the Y movable part 5 relative to the stage base 6 can be detected based on the measurement values ​​of both the first and second Y encoders and the measurement value of the X encoder.

[0017] The rotation angle in the θ direction of Y movable part 5 relative to stage base 6 can be identified based on the difference between the measurement values ​​of the first and second Y encoders and the interval between the first and second Y encoders. That is, using one X encoder and two Y encoders, the position of stage 4 relative to stage base 6 can be measured for three horizontal axes (position in the X direction, position in the Y direction, and rotation angle in the θ direction).

[0018] The mold 10 has a pattern area 47 having a pattern to be transferred to the substrate 1, and is held by a mold head 11 provided on a mold stage 12. The mold stage 12 can be driven at least in the Z direction by an actuator 15. The actuator 15 can drive the mold stage 12 so that the mold 10 is pressed against the imprint material on the substrate 1, or the mold 10 is separated from the imprint material on the substrate 1. The actuator 15 may drive the mold stage 12 so as to adjust the inclination (rotation around the X-axis and rotation around the Y-axis) of the mold stage 12 (mold 10).

[0019] The mold stage 12 and the mold head 11 may have an opening (not shown) that passes curing light (e.g., ultraviolet light) irradiated from a light source (not shown) via a collimator lens 13. A load cell may be disposed on the mold stage 12 for detecting the pressing force when the mold 10 is pressed against the imprint material on the substrate 1. The lithography apparatus 100 may include a gap measurement sensor 14 for measuring the height of the substrate 1 held by the stage 4.

[0020] The lithography apparatus 100 may include a TTM (through-the-mold) type alignment detection system 16 for aligning the mold 10 to the substrate 1. The alignment detection system 16 may be disposed on the mold stage 12. The alignment detection system 16 may have an optical system and an imaging system for detecting an alignment mark formed on the mold 10, a reference mark (not shown) disposed on the stage 4, an alignment mark formed on the substrate 1, and the like. The alignment detection system 16 can detect the relative positional deviations in the X and Y directions between the alignment mark of the substrate 1 and the alignment mark of the mold 10 when the imprint material on the substrate 1 held by the stage 4 is in contact with the mold 10.

[0021] The lithography apparatus 100 may include a supply unit 17. The supply unit 17 may be configured with a dispense head including a nozzle that drops the imprint material. The supply unit 17 has a function of supplying, applying, or placing the imprint material onto each of a plurality of shot areas of the substrate 1. The supply unit 17 employs, for example, a piezo jet method or a micro solenoid method, and supplies a minute volume of the imprint material onto the substrate 1. By moving the stage 4 while discharging the imprint material from the supply unit 17, it becomes possible to apply the imprint material onto the substrate 1.

[0022] The lithography apparatus 100 may include an off-axis detection system 18. The off-axis detection system 18 may be supported by a support top plate 20. The off-axis detection system 18 may have an optical system and an imaging system for detecting a reference mark (not shown) arranged on the stage 4 without the mold 10, an alignment mark on the substrate 1, and the like. The off-axis detection system 18 may detect the position of the alignment mark on the substrate 1 relative to the reference mark on the stage 4. In the lithography apparatus 100, the positional relationship between the mold 10 and the stage 4 can be obtained by the alignment detection system 16, and the positional relationship between the stage 4 and the alignment mark on the substrate 1 can be obtained by the off-axis detection system 18. Based on these positional relationships, the mold 10 and the substrate 1 can be relatively aligned.

[0023] The lithography apparatus 100 may include a control unit 19. The control unit 19 may control the operation of the lithography apparatus 100. The control unit 19 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these.

[0024] Lithography apparatus 100 includes an encoder system as a second measurement system that measures the relative position between mold head 11 and stage 4 about three axes, in addition to a first measurement system that measures the relative position between stage base 6 and stage 4 about three axes. The encoder system as the second measurement system may include, for example, encoder scales 40, 41 and encoder heads 42, 43, 44, 45.

[0025] A purge plate 46 is mounted on the stage 4, and the height of the upper surface of the purge plate 46 is the same as or slightly lower than the upper surface of the substrate 1. The purge plate 46 has two recesses, in which an encoder scale 40 and an encoder scale 41 are disposed, respectively. Similar to the purge plate 46, the height of the upper surfaces of the encoder scales 40 and 41 is approximately the same as or slightly lower than the upper surface of the substrate 1.

[0026] The encoder scale 40 is provided with a diffraction grating for measurement in the X direction and a diffraction grating for measurement in the Y direction. The encoder scale 40 and the encoder heads 42 and 43 provided on the mold head 11 constitute a first encoder that measures the relative positions in the X and Y directions between the mold head 11 and the stage 4. The encoder heads 42 and 43 are arranged rotated 90 degrees from each other, and can simultaneously measure the diffraction grating for measurement in the X direction and the diffraction grating for measurement in the Y direction of the encoder scale 40. For example, the encoder head 42 measures the diffraction grating for measurement in the X direction provided on the encoder scale 40, and the encoder head 43 measures the diffraction grating for measurement in the Y direction provided on the encoder scale 40.

[0027] Similarly, the encoder scale 41 is provided with a diffraction grating for measurement in the X direction and a diffraction grating for measurement in the Y direction. The encoder scale 41 and the encoder heads 44, 45 provided on the mold head 11 constitute a second encoder that measures the relative positions in the X and Y directions between the mold head 11 and the stage 4. The encoder heads 44, 45 are arranged rotated 90 degrees from each other, and can simultaneously measure the diffraction grating for measurement in the X direction and the diffraction grating for measurement in the Y direction of the encoder scale 41. For example, the encoder head 44 measures the diffraction grating for measurement in the X direction provided on the encoder scale 41, and the encoder head 45 measures the diffraction grating for measurement in the Y direction provided on the encoder scale 41.

[0028] Based on the outputs of the first and second encoders, the relative position between the mold head 11 and the stage 4 can be measured in three axes. For example, the relative position between the mold head 11 and the stage 4 in the X direction can be detected based on one of the two measurement values ​​in the X direction measured by the encoder head 43 and the encoder head 45. Alternatively, the relative position between the mold head 11 and the stage 4 in the X direction can be detected based on the average value of the two measurement values ​​in the X direction. The relative position in the θ direction between the mold head 11 and the stage 4 can be obtained by dividing the difference between the two measurement values ​​in the X direction measured by the encoder head 43 and the encoder head 45 by the interval between the two encoder heads 43 and 45. Also, the relative position in the Y direction between the mold head 11 and the stage 4 can be detected based on one of the two measurement values ​​in the Y direction measured by the encoder head 43 and the encoder head 45. Alternatively, the relative position in the Y direction between the mold head 11 and the stage 4 can be detected based on the average value of the two measurement values ​​in the Y direction.

[0029] The periodic directions of the diffraction gratings for X-direction measurement and the diffraction gratings for Y-direction measurement provided on each of the encoder scales 40, 41 may coincide with the X and Y directions, or may intersect with the X and Y directions at 45 degrees, for example. In the former, the output values ​​of the encoder heads 42-45 give the measurement values ​​in the X or Y directions. In the latter, the measurement values ​​in the X and Y directions can be obtained by processing the output values ​​of the encoder heads 42-45.

[0030] A method for fixing the encoder scales 40, 41 to the purge plate 46 (stage 4) is shown in Fig. 2. Fig. 5(a) is a top view of the stage 4, and Fig. 5(b) is a DD cross-sectional view of Fig. 5(a).

[0031] As shown in FIG. 5(a), the encoder scale 40 may be held by a scale holder 110 of the purge plate 46. Although not shown, the encoder scale 41 may be held by a scale holder having a similar configuration to the scale holder 110. The scale holder 110 holds the encoder scale 40 by suction force. The suction force may be, for example, a vacuum suction force, an electrostatic suction force, or an electromagnetic suction force. The scale holder 110 may be a recess recessed into the uppermost surface of the purge plate 46. The scale holder 110 may have a plurality of suction sections 50 arranged therein, each divided by a bank 51 into the same size as the shot area. Each suction section 50 is an area that generates a suction force that locally attracts the encoder scale 40. The plurality of suction sections 50 may be configured to be capable of individually controlling suction.

[0032] One suction control unit 54 may be provided for each suction unit 50. In other words, a plurality of suction control units 54 may be provided so that one suction control unit 54 is assigned to one suction unit 50. Each suction control unit 54 controls the operation state of the suction unit 50 to which it is assigned. The plurality of suction control units 54 may be individually controlled by the control unit 19. The control unit 19 may be configured to individually control the operation state of each of the plurality of suction units 50. This may be achieved by the control unit 19 individually controlling the plurality of suction control units 54. The control unit 19 may be configured to control the operation state of each of the plurality of suction units 50 according to the position of a shot region in which a pattern of an imprint material (curable composition) should be formed among the plurality of shot regions of the substrate 1. For example, the control unit 19 may be configured to control, among the plurality of suction units 50, at least the suction unit 50 facing any one of the encoder heads 42 to 45 to a non-suction state. Alternatively, the control unit 19 may control the suction force of at least one of the suction units 50 facing any one of the encoder heads 42 to 45 to be weaker than the suction forces of the other suction units 50. This can be achieved by providing each suction control unit 54 with a function for adjusting the suction force. The concept of making the suction force of a certain suction unit 50 weaker than the suction forces of the other suction units 50 includes setting the operating state of a certain suction unit 50 to a non-suction state and setting the operating state of the other suction units 50 to a suction state. A configuration capable of individually controlling suction by a plurality of suction units 50 can provide various degrees of freedom in addition to the above examples.

[0033] For example, the control unit 19 can control a selected suction unit 50 from among the multiple suction units 50 to a non-suction state, and control the remaining suction units 50 to a suction state. The selected suction unit 50 can be a suction unit from among the multiple suction units 50 that faces the encoder head during a predetermined period. The selected suction unit may be a suction unit 50 arranged in a region of the multiple suction units 50 that includes a region that faces the encoder head during a predetermined period. Alternatively, the control unit 19 can make the suction force of the selected suction unit 50 from among the multiple suction units 50 weaker than the suction forces of the other suction units. The selected suction unit may be a suction unit 50 arranged in a region of the multiple suction units 50 that includes a region that faces the encoder head during a predetermined period. Alternatively, the control unit 19 can change the suction units 50 that are controlled to be in the suction state and the suction units 50 that are in the non-suction state depending on the passage of time or the operation of the lithography apparatus 100. The above-mentioned control can contribute to reducing deformation of the encoder scales 40, 41.

[0034] In one example, each suction unit 50 may be configured to locally suction the encoder scale 40 by forming a reduced pressure state lower than atmospheric pressure. Such suction may be defined as vacuum suction. Each suction control unit 54 may cause the suction unit 50 assigned to it to suction the encoder scale 40 by creating a reduced pressure state for the suction unit 50, and may cause the suction unit 50 to release the suction of the suction unit 50 assigned to it by opening the suction unit 50 to the atmosphere. The suction control unit 54 may include, for example, a valve that connects the suction unit 50 to a reduced pressure source or a reduced pressure line, or provides atmospheric pressure to the suction unit 50. The multiple suction units 50 may be isolated from each other by, for example, a separation wall 51.

[0035] Fig. 6 illustrates an operation of the lithography apparatus 100 configured as an imprint apparatus. The operation illustrated in Fig. 6 is controlled by the control unit 19. In step S301, the substrate 1 is loaded onto the stage 4 and held by the stage 4 (more specifically, the chuck device 2 mounted on the stage 4).

[0036] In step S302 (application step), the supply unit 17 applies or places the imprint material on the shot area to which the pattern is to be transferred immediately after among the multiple shot areas of the substrate 1. In the following, unless contrary to the context, the "shot area" means the shot area to which the pattern is to be transferred immediately after. The application or placement of the imprint material on the shot area of ​​the substrate 1 can be performed by discharging the imprint material from the supply unit 17 while moving the stage 4 (i.e., the substrate 1). In step S303, the stage 4 is driven so that the shot area of ​​the substrate 1 moves directly below the pattern area 47 of the mold 10, and the actuator 15 drives the mold head 11 downward so that the pattern area 47 comes into contact with the imprint material above the shot area.

[0037] In step S304 (alignment step), while the imprint material on the shot area of ​​the substrate 1 is in contact with the pattern area 47 of the mold 10, alignment between the shot area and the pattern area 47 is performed using the alignment detection system 16. In this alignment, an alignment error between the shot area and the pattern area 47 is detected using the alignment detection system 16, and the stage 4 can be driven so that the alignment error falls within a tolerance range.

[0038] In step S305 (curing step), curing light is irradiated from a light source (not shown) to the imprint material via the collimator lens 13 and the mold 10, thereby curing the imprint material. In step S306 (separating step), the actuator 15 drives the mold head 11 upward so that the pattern area 47 is separated from the cured imprint material on the shot area. This completes the transfer (imprinting) of the pattern to one shot area.

[0039] In step S307, control unit 19 determines whether the pattern has been transferred to all shot areas of substrate 1 to which the pattern should be transferred, and if any shot areas to which the pattern has not been transferred remain, performs steps S302 to S306 on those shot areas. In step S308, substrate 1 is unloaded from stage 4 (more specifically, chuck device 2 mounted on stage 4).

[0040] If there is a large alignment error between the shot area and the pattern area 47 of the mold 10 at the start of step S304 (alignment step), it will take a long time to complete the alignment in step S304. Therefore, the first and second measurement systems may be used together in steps S302 to S306. Alternatively, the second measurement system of the first and second measurement systems may be used in steps S302 to S306. Note that the first measurement system may be used to control the stage 4 in at least steps S301 and S308 out of steps S301 to S308.

[0041] The encoder system as the second measurement system is a system that measures the relative position between mold head 11 and stage 4, and as described above, may include encoder scales 40, 41 and encoder heads 42, 43, 44, 45. Based on the measurement results of the relative position between mold head 11 and stage 4 obtained using the encoder system, control unit 19 may control the position of stage 4 so that the relative position between mold head 11 and stage 4 coincides with a target relative position.

[0042] The control unit 19 suppresses a decrease in measurement accuracy due to deformation of the encoder scales 40, 41 by individually controlling suction by the multiple suction units 50, thereby realizing a highly accurate encoder system. An example of a method for controlling the operating state of the multiple suction units 50 will be described below with reference to Figures 7, 8, 9, 10, and 11. Note that in each drawing, the suction units 50 shown in white are in the suction state, and the suction units 50 shown in gray are in the non-suction state.

[0043] 7 illustrates a method for controlling the operating state of a plurality of suction units 50 associated with the operation in which the substrate 1 is loaded onto the chuck device 2 of the stage 4 in step S301 and the substrate 1 is held by the stage 4 (chuck device 2). In step S301, the control unit 19 controls the position of the stage 4 so that the stage 4 stands still based on the measurement result by the first measurement system. In step S301, the stage 4 is placed at a position for loading the substrate 1. In the example of FIG. 7, step S301 includes steps S301a, S301b, and S301c. The substrate 1 may be loaded onto the stage 4 in any state of steps S301a, S301b, and S301c.

[0044] In step S301a, the control unit 19 can control all of the multiple suction units 50 to the suction state. Thus, in step S301a, the encoder scales 40, 41 are held by all of the suction units 50. In the state of step S301a, if the purge plate 46 is deformed due to heat generated by a linear motor or the like, stress is applied to the encoder scales 40, 41, which can cause the encoder scales 40, 41 to deform. In this state, if the encoder scales 40, 41 are used by the encoder system to measure the relative position between the mold head 11 and the stage 4, an error can occur in the measurement result of the relative position.

[0045] Therefore, in step S301b, while the stage 4 is stopped, the control unit 19 can control all of the suction units 50 to a non-suction state. Therefore, in step S301b, the encoder scales 40, 41 are not attracted by any of the suction units 50, and the stress applied to the encoder scales 40, 41 is alleviated, and deformation of the encoder scales 40, 41 is reduced.

[0046] Next, in step S301c, all of the suction units 50 may be controlled to the suction state in a state in which deformation of the encoder scales 40, 41 is reduced in step S301b. Thus, in step S301c, the encoder scales 40, 41 are held by all of the suction units 50 in a state in which deformation of the encoder scales 40, 41 is reduced.

[0047] 8 illustrates an example of the operation state of the plurality of suction units 50 at a certain timing during the execution of steps S302 to S306. More specifically, FIG. 8 illustrates an example of the operation state of the plurality of suction units 50 when the pattern area 47 of the mold 10 is brought into contact with the imprint material on the shot area in the center of the substrate 1 to align the shot area with the pattern area 47. At this timing, the control unit 19 may control the suction units 50 belonging to the non-suction area 48 facing the encoder heads 42, 43, 44, and 45 to a non-suction state, and control the other suction units 50 to a suction state. The execution period of steps S302 to S306 may include a period during which the suction units 50 belonging to the non-suction area 48 facing the encoder heads 42, 43, 44, and 45 are controlled to a non-suction state, and the other suction units 50 are controlled to a suction state. This can prevent the encoder scales 40, 41 from moving relative to the purge plate 46 when the stage 4 is driven, while suppressing deformation of the encoder scales 40, 41 in the areas facing the encoder heads 42, 43, 44, 45. Therefore, in steps S302 to S306, the relative position between the mold head 11 and the stage 4 can be measured with high accuracy, and the relative position between the mold head 11 and the stage 4 can be controlled with high accuracy.

[0048] FIG. 9 shows a process (steps S302 to S306) for transferring a pattern to a central shot area (i-th shot area) of the multiple shot areas of the substrate 1. The left side of FIG. 9 illustrates an example of the operating states of the multiple suction units 50 when the supply unit 17 applies or places an imprint material on the i-th shot area of ​​the substrate 1 in step S302. At this timing, the shot area to be imprinted i may be located below the supply unit 17. In the example shown in FIG. 9, when the i-th shot area is located below the pattern area 47, the suction units 50 belonging to the non-suction area 48 that faces the encoder heads 42, 43, 44, and 45 are controlled to a non-suction state, and the other suction units 50 are controlled to a suction state. This is an advantageous control method in terms of avoiding the occurrence of a suction unit 50 whose operating state is changed in the subsequently executed steps S303 to S306.

[0049] 9 illustrates an example of the operating state of the plurality of suction units 50 in steps S303-S306. In steps S303-S306, the control unit 19 can control the suction units 50 belonging to the non-suction region 48 facing the encoder heads 42, 43, 44, and 45 to a non-suction state, and control the other suction units 50 to a suction state. This can prevent the encoder scales 40 and 41 from moving relative to the purge plate 46 due to driving of the stage 4, and can suppress deformation of the encoder scales 40 and 41 in the regions facing the encoder heads 42, 43, 44, and 45. Therefore, in steps S302 to S306, the relative position between the mold head 11 and the stage 4 can be measured with high accuracy, and the relative position between the mold head 11 and the stage 4 can be controlled with high accuracy.

[0050] Fig. 10 shows the process (steps S302 to S306) for transferring a pattern to the (i+1)th shot area, which is the next shot area to the i-th shot area (the shot area in the center of the substrate 1) in which a pattern was formed in the process shown in Fig. 9. In this example, the (i+1)th shot area is the shot area immediately to the left of the i-th shot area.

[0051] The left side of Fig. 10 illustrates an example of the operation states of the plurality of suction units 50 when the supply unit 17 applies or places the imprint material on the (i+1)th shot area of ​​the substrate 1 in step S302. At this timing, the (i+1)th shot area may be located below the supply unit 17. In the example shown in Fig. 10, when the (i+1)th shot area is located below the pattern area 47, the suction units 50 belonging to the non-suction area 49 that will face the encoder heads 42, 43, 44, and 45 are controlled to the non-suction state, and the other suction units 50 are controlled to the suction state. This is an advantageous control method in terms of avoiding the occurrence of a suction unit 50 whose operation state is changed in the subsequently executed steps S303-S306.

[0052] 10 illustrates an example of the operating state of the plurality of suction units 50 in steps S303-S306. In steps S303-S306, the control unit 19 can control the suction units 50 belonging to the non-suction region 49 facing the encoder heads 42, 43, 44, and 45 to a non-suction state and control the other suction units 50 to a suction state. This can prevent the encoder scales 40 and 41 from moving relative to the purge plate 46 due to driving of the stage 4, while suppressing deformation of the encoder scales 40 and 41 in the regions facing the encoder heads 42, 43, 44, and 45. Therefore, in steps S302 to S306, the relative position between the mold head 11 and the stage 4 can be measured with high accuracy, and the relative position between the mold head 11 and the stage 4 can be controlled with high accuracy.

[0053] The change from the non-suction region 48 set for processing the i-th shot region to the non-suction region 49 set for processing the (i+1)-th shot region can be performed in parallel with the execution of step S302 for the (i+1)-th shot region, for example. This is advantageous in preventing a decrease in throughput due to the change of the non-suction region.

[0054] In one example, the non-suction region may be the region facing the encoder heads 42, 43, 44, and 45 in step S304 (alignment step), as described above. In another example, the non-suction region may be the region including the region facing the encoder heads 42, 43, 44, and 45 in step S304 (alignment step). Fig. 11 shows an example in which a wide region including the region facing the encoder heads 42, 43, 44, and 45 in step S304 (alignment step) is set as the non-suction region 55.

[0055] 9 and 10 may be understood as an operation during a period in which an imprint material is placed in a shot region of the substrate 1, and then the mold 10 is brought into contact with the imprint material and the imprint material is hardened in a state in which the stage 4 is disposed so that the shot region faces the pattern region 47. The control unit 19 may control the multiple suction units 50 so that the suction force of a selected suction unit 50 among the multiple suction units 50 is made weaker than the suction forces of the other suction units. The selected suction unit may be a suction unit among the multiple suction units 50 that faces at least the encoder head in the above state.

[0056] 9 and 10, the dimensions of each suction unit 50 can be determined to be equivalent to the pattern region of the mold 10 or the shot region of the substrate 1. For example, the arrangement pitch of the suction units 50 can be the same as the arrangement pitch of the shot regions. In another aspect, the multiple suction units 50 may be arranged to form multiple rows and multiple columns.

[0057] FIG. 12(a) shows another arrangement example of the plurality of suction units 50 or the non-suction region 56. In the example of FIG. 12(a), the plurality of suction units 50 include a plurality of strip-shaped suction units 50 extending in a direction (X direction) connecting the pattern region 47 of the mold 10 and the supply unit 17. Each suction unit 50 constitutes a strip-shaped region extending in the X direction. From another perspective, the plurality of suction units 50 are arranged to constitute a one-dimensional array, that is, to constitute an array along a single direction (Y direction). In the example of FIG. 12(a), when a pattern is continuously formed for a plurality of shot regions arranged along the X direction, it is not necessary to change the suction units 50 to be in a non-suction state (i.e., it is not necessary to change the non-suction region 56). For example, the suction units 50 corresponding to the first row are set to a non-suction state, and the suction units corresponding to the other rows are set to a suction state, so that a pattern can be continuously formed for a plurality of shot regions constituting the first row. Next, the suction units 50 corresponding to the second row are set to a non-suction state, and the suction units corresponding to the other rows are set to a suction state, so that patterns can be continuously formed for the multiple shot areas that make up the second row.

[0058] FIG. 12(b) shows yet another example of the arrangement of the plurality of suction parts 50 or the non-suction region 57. In the example of FIG. 12(b), the plurality of suction parts 50 include a suction part 50 arranged in an inner region of the scale holder 110 and a suction part 50 arranged in an outer region of the scale holder 110. The outer region is a region surrounding the outer region. As shown in FIG. 12(b), for example, when the inner suction part 50 faces all of the encoder heads 42, 43, 44, and 45 in the alignment process, the inner suction part 50 can be set to a non-suction state (non-suction region 57). On the other hand, for example, when the outer suction part 50 faces at least one of the encoder heads 42, 43, 44, and 45 in the alignment process, the outer suction part 50 can be set to a non-suction state (non-suction region 57).

[0059] As described above, the suction force generated by each suction unit 50 can be, for example, a vacuum suction force, an electrostatic suction force, or an electromagnetic suction force. When using electrostatic suction force, an individual electrode may be provided for each of the multiple suction units 50, and the supply of electric charge to the electrodes may be individually controlled. When using electromagnetic suction force, a coil (electromagnet) may be provided for each of the multiple suction units 50, and the supply of electric current to the coils may be individually controlled, while a magnetic body may be provided on the rear surface of the encoder scales 40, 41.

[0060] The encoder system serving as the second measurement system is not limited to the above example as long as it can measure the three-axis positions of the stage 4 (the position in the X direction, the position in the Y direction, and the rotation angle in the θ direction). For example, the first encoder measures the relative position only in the X direction, and the second encoder measures the relative positions in the X and Y directions, and the three-axis positions can be obtained based on these measurement results.

[0061] The dimensions, configurations, and arrangements of the encoder scale and the encoder heads can be changed as appropriate. FIG. 13 shows a modified encoder system. In the first encoder, four encoder heads 42, 42, 43, and 43 are assigned to the encoder scale 40, and in the second encoder, four encoder heads 44, 44, 45, and 45 are assigned to the encoder scale 41. FIG. 13(b) shows a state in which a shot area located in the +Y direction with respect to the center of the substrate 1 is imprinted. In each encoder, the measurement can be continued using the encoder head on the -Y direction side. FIG. 13(c) shows a state in which a shot area located in the -Y direction with respect to the center of the substrate 1 is imprinted. In each encoder, the measurement can be continued using the encoder head on the +Y direction side. In this modified example, the dimension in the Y direction of each encoder scale is smaller than the dimension in the Y direction of the substrate 1. In the example of FIG. 13, the suction unit facing the encoder head is controlled to a non-suction state, and the other suction units are controlled to a suction state.

[0062] The lithography apparatus 100 and stage device STM of the second embodiment will be described below. Matters not mentioned in the second embodiment may follow the first embodiment. FIG. 14(a) shows the stage device STM in the lithography apparatus 100 of a first configuration example of the second embodiment. In the second embodiment, the stage device STM includes a second scale holder 200 in addition to a first scale holder configured with a plurality of suction units 50. The second scale holder 200 has a structure that makes it difficult for the encoder scales 40, 41 to be affected by deformation of the purge plate 46.

[0063] In a first configuration example of the second embodiment, the second scale holding unit 200 can be configured to hold each of the encoder scales 40 and 41 by a plurality of (here, three) leaf springs 70. One end of each leaf spring 70 can be connected to the encoder scale, and the other end can be fixed to the purge plate 46 by a leaf spring fixing unit 71. Each leaf spring 70 regulates the position of the encoder scale by its longitudinal direction, and has degrees of freedom in the rotational direction and the transverse direction. Each of the encoder scales 40 and 41 is held about three horizontal axes by the three leaf springs 70 without transmitting the deformation of the purge plate 46 to the encoder scale. In this configuration, even if all the suction units 50 that suction the encoder scales 40 and 41 are put into a non-suction state in step S301b, the encoder scales 40 and 41 do not shift in position. Furthermore, when the encoder scales 40 and 41 are sucked by one or more suction units 50, the encoder scales 40 and 41 do not shift in position. By providing the second scale holding unit 200 in addition to the first scale holding unit 110 in this manner, it is possible to more reliably prevent the encoder scales 40, 41 from shifting in position.

[0064] FIG. 14(b) shows a stage device STM in a lithography apparatus 100 of a second configuration example of the second embodiment. In the second configuration example, the second scale holder 200 can be configured to hold each side of the encoder scales 40, 41 by suction using a plurality of (here, three) side suction parts 73. The horizontal positions of the encoder scales 40, 41 can be maintained by the second scale holder 200. The sides of the encoder scales 40, 41 can have a configuration that allows suction by the side suction parts 73. The suction by the side suction parts 73 can be, for example, vacuum suction, electrostatic suction, or electromagnetic suction. If the second scale holder 200 is maintained in an suction state when all the suction parts 50 of the first scale holder 110 are put into a non-suction state in step S301b, it is possible to prevent the encoder scales 40, 41 from being displaced. During the period in which one or more suction portions 50 of the first scale holding portion 110 are in the suction state, the second scale holding portion 200 may be in the non-suction state.

[0065] The lithography apparatus 100 and stage device STM of the third embodiment will be described below. Matters not mentioned as the second embodiment may follow the first or second embodiment. Fig. 15 shows the stage device STM in the lithography apparatus 100 of the third embodiment. In the third embodiment, two or more encoder scale reference marks 75 serving as a reference for the position of the encoder are provided, and similarly, two or more stage reference marks 76 serving as a reference for the position of the stage 4 are provided on the stage 4.

[0066] By performing position measurement of each reference mark with the off-axis detection system 18, it is possible to measure the position coordinates of each reference mark in two axial directions in the X and Y directions. Therefore, by using the measurement results of the two encoder scale reference marks 75 in two axial directions in the X and Y directions, it is possible to calculate the position coordinates of the encoder scales 40 and 41 in three axial directions in the X, Y, and θ directions. Similarly, it is possible to calculate the position coordinates of the stage 4 in three axial directions in the X, Y, and θ directions by using the two stage reference marks 76. By comparing the position coordinates of the encoder scales 40 and 41 and the stage 4 in three axial directions in the X, Y, and θ directions, it is possible to manage the positions of the encoder scales 40 and 41 relative to the stage 4. According to the third embodiment, it is possible to prevent in-plane deformation of the encoder scales 40 and 41 by controlling the operating state of the multiple suction units 50 of the encoder scales 40 and 41. In addition, it is possible to manage the positions between the encoder scales 40 and 41 and the stage 4 by using the respective reference marks. This allows the encoder position measurement to be performed with higher accuracy.

[0067] Hereinafter, an article manufacturing method for manufacturing an article using the lithography apparatus 100 will be described. The article may be, for example, a semiconductor IC element, a liquid crystal display element, or a MEMS. The article manufacturing method may include a transfer step of transferring a pattern of an original to a substrate using the lithography apparatus, and a processing step of obtaining an article by processing the substrate that has undergone the transfer step. When the lithography apparatus is an exposure apparatus, the transfer step may include an exposure step of exposing a substrate (wafer, glass substrate, etc.) coated with a photosensitive agent, and a development step of the substrate (photosensitive agent) that has undergone the exposure step. When the lithography apparatus is an imprint apparatus, the transfer step may include a contact step of contacting an original with an imprint material on a substrate, a curing step of curing the imprint material, and a separation step of separating the original from the cured imprint material. The processing step may include, for example, etching, resist peeling, dicing, bonding, packaging, and the like. (Document title) Claims (Item 1) A lithography apparatus for transferring a pattern of an original onto a substrate, comprising: a stage mechanism including a stage for holding a substrate; an encoder system including an encoder head and an encoder scale; the stage includes a scale holder that holds the encoder scale by suction force, The scale holding unit includes a plurality of suction units capable of individually controlling suction. 1. A lithography apparatus comprising: (Item 2) 2. The lithography apparatus according to item 1, further comprising a control unit that controls an operating state of each of the plurality of suction units in accordance with a position of the stage. (Item 3) the substrate has a plurality of shot areas; the control unit individually controls an operation state of each of the plurality of suction units in accordance with a position of a shot area in which a pattern is to be formed. 3. The lithography apparatus according to item 2, (Item 4) The control unit controls a selected one of the plurality of suction units to a non-suction state, the selected suction unit includes a suction unit that faces the encoder head during a predetermined period among the plurality of suction units; 4. The lithography apparatus according to item 3, (Item 5) The control unit weakens a suction force of a selected suction unit among the plurality of suction units compared to a suction force of the other suction units, the selected suction unit includes a suction unit that faces the encoder head during a predetermined period among the plurality of suction units; 4. The lithography apparatus according to item 3, (Item 6) The control unit weakens a suction force of a selected suction unit among the plurality of suction units compared to a suction force of the other suction units, the selected suction unit is a suction unit that is arranged in a region that includes a region facing the encoder head during a predetermined period among the plurality of suction units; 4. The lithography apparatus according to item 3, (Item 7) the control unit, while the stage is stationary, places all of the plurality of suction units in a non-suction state and then places all of the plurality of suction units in a suction state. 4. The lithography apparatus according to item 3, (Item 8) The plurality of suction units are arranged to form a plurality of rows and a plurality of columns. 8. A lithographic apparatus according to any one of items 1 to 7, characterized in that (Item 9) The plurality of suction units are arranged to form a plurality of strip-shaped regions. 8. A lithographic apparatus according to any one of items 1 to 7, characterized in that (Item 10) the scale holder includes an inner region and an outer region surrounding the inner region, The plurality of suction sections include one suction section constituting the inner region and one suction section constituting the outer region, 8. A lithographic apparatus according to any one of items 1 to 7, characterized in that (Item 11) Further comprising a second scale holding unit that regulates a horizontal position of the encoder scale. 11. A lithographic apparatus according to any one of items 1 to 10, characterized in that (Item 12) the encoder scale has a first reference mark; the stage has a second reference mark; 12. A lithographic apparatus according to any one of items 1 to 11, characterized in that (Item 13) a printing plate is configured to transfer a pattern of the printing plate to the substrate by contacting the printing plate with an imprint material on the substrate and curing the imprint material; 13. A lithographic apparatus according to any one of items 1 to 12, characterized in that (Item 14) a control unit that controls the plurality of suction units so that a suction force by a selected suction unit among the plurality of suction units is weaker than a suction force by other suction units during a period in which the imprint material is placed in a shot region of the substrate, and then the original is brought into contact with the imprint material and the imprint material is hardened in a state in which the stage is disposed so that the shot region faces a pattern region of the original, the selected suction unit is at least one of the plurality of suction units that faces the encoder head in the state; Item 14. A lithographic apparatus according to item 13, characterized in that (Item 15) a supply unit that supplies an imprint material to the shot area of ​​the substrate, the plurality of suction units include a plurality of strip-shaped suction units extending in a direction connecting the pattern area of ​​the original and the supply unit; 15. A lithographic apparatus according to item 13 or 14, (Item 16) an exposure apparatus configured to transfer a pattern of the original onto the substrate by projecting the pattern of the original onto the substrate by a projection optical system; 13. A lithographic apparatus according to any one of items 1 to 12, characterized in that (Item 17) A transfer step of transferring a pattern of a master onto a substrate using the lithography apparatus according to any one of items 1 to 16; a processing step of obtaining an article by processing the substrate that has been subjected to the transfer step; A method for manufacturing an article, comprising: (Item 18) A stage apparatus including a stage for holding a substrate and an encoder scale, the stage includes a scale holder that holds the encoder scale by suction force, The scale holding unit includes a plurality of suction units capable of individually controlling suction. A stage apparatus comprising:

[0068] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0069] 1: substrate, 2: chuck, 4: stage (XY movable part), 10: master, 40: 41: encoder scale, 42-45: encoder head, 50: suction part, 110: scale holding part

Claims

1. A lithography apparatus for transferring a pattern of an original onto a substrate, comprising: a stage mechanism including a stage for holding a substrate; an encoder system including an encoder head and an encoder scale; the stage includes a scale holder that holds the encoder scale by suction force, The scale holding unit includes a plurality of suction units capable of individually controlling suction.

1. A lithography apparatus comprising:

2. 2. The lithography apparatus according to claim 1, further comprising a control unit that controls an operating state of each of the plurality of suction units in accordance with a position of the stage.

3. the substrate has a plurality of shot areas; the control unit individually controls an operation state of each of the plurality of suction units in accordance with a position of a shot area in which a pattern is to be formed. A lithographic apparatus according to claim 2 .

4. The control unit controls a selected one of the plurality of suction units to a non-suction state, the selected suction unit includes a suction unit that faces the encoder head during a predetermined period among the plurality of suction units; A lithographic apparatus according to claim 3 .

5. The control unit weakens a suction force of a selected suction unit among the plurality of suction units compared to a suction force of the other suction units, the selected suction unit includes a suction unit that faces the encoder head during a predetermined period among the plurality of suction units; A lithographic apparatus according to claim 3 .

6. The control unit weakens a suction force of a selected suction unit among the plurality of suction units compared to a suction force of the other suction units, the selected suction unit is a suction unit that is arranged in a region that includes a region facing the encoder head during a predetermined period among the plurality of suction units; A lithographic apparatus according to claim 3 .

7. the control unit, while the stage is stationary, places all of the plurality of suction units in a non-suction state and then places all of the plurality of suction units in a suction state. A lithographic apparatus according to claim 3 .

8. The plurality of suction units are arranged to form a plurality of rows and a plurality of columns. A lithographic apparatus according to claim 1 .

9. The plurality of suction units are arranged to form a plurality of strip-shaped regions. A lithographic apparatus according to claim 1 .

10. the scale holder includes an inner region and an outer region surrounding the inner region, The plurality of suction sections include one suction section constituting the inner region and one suction section constituting the outer region. A lithographic apparatus according to claim 1 .

11. a second scale holding unit that regulates a horizontal position of the encoder scale, A lithographic apparatus according to claim 1 .

12. the encoder scale has a first reference mark; the stage has a second reference mark; A lithographic apparatus according to claim 1 .

13. a printing plate is configured to transfer a pattern of the printing plate to the substrate by contacting the printing plate with an imprint material on the substrate and curing the imprint material; A lithographic apparatus according to claim 1 .

14. a control unit that controls the plurality of suction units so that a suction force by a selected suction unit among the plurality of suction units is weaker than a suction force by other suction units during a period in which the imprint material is placed in a shot region of the substrate, and then the original is brought into contact with the imprint material and the imprint material is hardened in a state in which the stage is disposed so that the shot region faces a pattern region of the original, the selected suction unit is at least one of the plurality of suction units that faces the encoder head in the state; A lithographic apparatus according to claim 13 .

15. a supply unit that supplies an imprint material to the shot area of ​​the substrate, the plurality of suction units include a plurality of strip-shaped suction units extending in a direction connecting the pattern area of ​​the original and the supply unit; A lithographic apparatus according to claim 13 .

16. an exposure apparatus configured to transfer a pattern of the original onto the substrate by projecting the pattern of the original onto the substrate by a projection optical system; A lithographic apparatus according to claim 1 .

17. A transfer step of transferring a pattern of an original onto a substrate using a lithography apparatus according to any one of claims 1 to 16; a processing step of obtaining an article by processing the substrate that has been subjected to the transfer step; A method for manufacturing an article, comprising:

18. A stage apparatus including a stage for holding a substrate and an encoder scale, the stage includes a scale holder that holds the encoder scale by suction force, The scale holding unit includes a plurality of suction units capable of individually controlling suction. A stage apparatus comprising:

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