Substrate work system and arrangement determination method for backup pin

Abstract

To provide a substrate work system capable of easily performing work for determining the arrangement of a backup pin even in a case where the arrangement of the backup pin is different for each condition such as the kind of a substrate work device or a stop position of a substrate.SOLUTION: A substrate work system 100 comprises: a substrate work device 10 including a backup section 32 (12, 22) including a backup pin 321 (121, 221) supporting a substrate P, on which a component E is mounted, from a lower side; and a control section 31 (11, 21) for determining the arrangement of the backup pin 321 (121, 221) on the basis of pin arrangement data DA1 representing the arrangement of the backup pin 121, 221, 321 with respect to the substrate P and pin arrangement possible position data DA2 representing a position where the backup pin 321 (121, 221) can be arranged in the substrate work device 10.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present invention relates to a board working system and a method for determining the placement of backup pins, and more particularly to a board working system and a method for determining the placement of backup pins that support a board from below. [Background technology]

[0002] 2. Description of the Related Art Conventionally, a board working system is known that determines the arrangement of backup pins that support a board from below (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a board working system that determines the arrangement of backup pins that support a board from below. The board working system includes a solder printer, an adhesive applicator, an electronic component mounter including backup pins, and a host computer. The host computer determines the arrangement of the backup pins in the electronic component mounter. Specifically, the host computer creates backup pin coordinate data based on the position of the backup pin designated by an operator. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4452686 Summary of the Invention [Problem to be solved by the invention]

[0005] In the board work system described in the above Patent Document 1, not only the component mounter but also the solder printer and adhesive applicator may include backup pins. In this case, the arrangement of the backup pins in the solder printer and adhesive applicator must be determined, but since the positions where the backup pins can be arranged differ depending on the type of device, the worker must determine the arrangement of the backup pins for each type of device. In addition, even if the type of device is the same, if the stop position of the board is different, the worker must determine the arrangement of the backup pins for each stop position of the board. As such, since the worker must determine the arrangement of the backup pins for each condition such as the type of board work device or the stop position of the board, there is a problem that the work of determining the arrangement of the backup pins becomes cumbersome.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a board working system and a method for determining the placement of backup pins that can easily determine the placement of backup pins even when the placement of backup pins varies depending on conditions such as the type of board working device or the stopping position of the board. [Means for solving the problem]

[0007] A board working system according to a first aspect of the present invention comprises a board working device including a backup unit having backup pins that support, from below, a board on which components are mounted, and a control unit that determines the arrangement of the backup pins based on pin arrangement data that represents the arrangement of the backup pins relative to the board and pin arrangeable position data that represents positions where the backup pins can be arranged on the board working device.

[0008] In the board working system according to the first aspect of the present invention, as described above, a control unit is provided that determines the arrangement of the backup pins based on pin arrangement data that indicates the arrangement of the backup pins on the board and pin arrangement possible position data that indicates the positions where the backup pins can be arranged on the board working device. This allows the worker to automatically determine the arrangement of the backup pins for each condition, such as the type of board working device or the stopping position of the board, by simply creating one pin arrangement data, so that the worker does not need to determine the arrangement of the backup pins for each condition. As a result, even if the arrangement of the backup pins differs depending on the type of board working device or the stopping position of the board, the task of determining the arrangement of the backup pins can be easily performed.

[0009] In the board working system according to the first aspect of the present invention, as described above, the control unit aligns the pin arrangement data with the possible pin arrangement position data based on the stopping position of the board in the board working device, and determines the arrangement of the backup pin. This makes it possible to align the pin arrangement data with the possible pin arrangement position data even when the relative positions of the pin arrangement data and the possible pin arrangement position data differ for each condition, so that the arrangement of the backup pin for each condition can be appropriately determined.

[0010] In this case, preferably, the control unit, after aligning the pin arrangement data with the possible pin arrangement position data, determines, as the arrangement of the backup pin, a position where the position of the backup pin in the pin arrangement data coincides with a position where the backup pin in the possible pin arrangement position data can be arranged. With this configuration, the position where the position of the backup pin in the pin arrangement data coincides with a position where the backup pin in the possible pin arrangement position data can be arranged is determined as the arrangement of the backup pin, so that the arrangement of the backup pin can be easily and appropriately determined.

[0011] In a configuration in which a position where the backup pin is to be placed in the pin arrangement data matches a position where the backup pin can be placed in the pin arrangeable position data, as the arrangement of the backup pin, the control unit preferably excludes, with the pin arrangement data and the pin arrangeable position data aligned, a position where the backup pin is to be placed in the pin arrangement data matches a position where the backup pin cannot be placed in the pin arrangeable position data, from the arrangement of the backup pin. With this configuration, a position where the backup pin cannot be placed in the pin arrangeable position data is not determined as a position where the backup pin is to be placed, so that the arrangement of the backup pin can be more appropriately determined.

[0012] In the configuration in which a position where the backup pin is to be placed in the pin placement data coincides with a position where the backup pin can be placed in the possible pin placement position data, as the placement of the backup pin, preferably, the pin placement data is configured to represent the positions where the backup pin is to be placed and the positions where the backup pin is not to be placed by a plurality of areas partitioned in a matrix, and the possible pin placement position data is configured to represent the positions where the backup pin can be placed and the positions where the backup pin cannot be placed by a plurality of areas partitioned in a matrix. With this configuration, since both the pin placement data and the possible pin placement position data are represented by a plurality of areas partitioned in a matrix, it is possible to easily align the pin placement data with the possible pin placement position data, and to easily determine whether the position where the backup pin is to be placed in the pin placement data coincides with the position where the backup pin can be placed in the possible pin placement position data.

[0013] In the above-mentioned configuration for aligning the pin arrangement data with the pin arrangement possible position data, preferably the control unit acquires an offset value of the position of the board relative to the position of the backup unit based on the stopping position of the board in the board working device, and aligns the pin arrangement data with the pin arrangement possible position data based on the acquired offset value. With this configuration, it is possible to appropriately align the pin arrangement data with the pin arrangement possible position data by utilizing the fact that the offset value of the board position relative to the position of the backup unit corresponds to a value by which the pin arrangement data should be offset with respect to the pin arrangement possible position data.

[0014] In this case, preferably, the board working device includes a component mounting device that mounts components on the board, and the control unit sets the stop position of the board so that the center of the arrangement of components used for mounting the board in the component mounting device corresponds to the center of the board in the transport direction, and acquires the offset value based on the set stop position of the board. With this configuration, it is possible to set a stop position of the board that can shorten the distance between the components used for mounting the board and the board and shorten the time required to mount the components on the board, and acquire the offset value. As a result, it is possible to appropriately align the pin arrangement data with the pin arrangement possible position data while shortening the time required to mount the components on the board.

[0015] In the board working system according to the first aspect, when the number of backup pins to be arranged exceeds the number of available backup pins, the control unit preferably adjusts the number of backup pins to be arranged so that the number of backup pins to be arranged is equal to the number of available backup pins. With this configuration, it is possible to avoid deciding on an arrangement of backup pins that exceeds the number of available backup pins, and therefore to avoid the trouble of arranging the backup pins due to an insufficient number of backup pins.

[0016] In this case, preferably, the control unit adjusts the number of backup pins to be placed based on the priority of backup pin placement by deleting backup pins to be placed until the number of backup pins to be placed is equal to the number of available backup pins. With this configuration, backup pins in the pin placement data can be deleted based on the priority of backup pin placement, so that the number of backup pins to be placed can be appropriately adjusted.

[0017] A method for determining the placement of a backup pin according to a second aspect of the present invention is a method for determining the placement position of a backup pin in a board working system equipped with a board working device including a backup unit having backup pins that support from below a board on which components are mounted, and comprises a step of determining the placement of the backup pin based on pin placement data representing the placement of the backup pin relative to the board and pin placement possible position data representing possible positions of the backup pin on the board working device.

[0018] In the backup pin arrangement determination method according to the second aspect of the present invention, as described above, a step of determining the arrangement of the backup pins is provided based on pin arrangement data representing the arrangement of the backup pins relative to the board and pin arrangement possible position data representing the possible positions of the backup pins in the board working device. This allows the worker to automatically determine the arrangement of the backup pins for each condition, such as the type of board working device or the stopping position of the board, by simply creating one pin arrangement data, so that the worker does not need to determine the arrangement of the backup pins for each condition. As a result, it is possible to provide a backup pin arrangement determination method that can easily perform the task of determining the arrangement of the backup pins even when the arrangement of the backup pins differs depending on the type of board working device or the stopping position of the board. Effect of the Invention

[0019] According to the present invention, as described above, even when the arrangement of the backup pins differs depending on conditions such as the type of board working device or the stopping position of the board, the task of determining the arrangement of the backup pins can be easily performed. [Brief description of the drawings]

[0020] [Figure 1] 1 is a block diagram showing a board working system according to one embodiment; [Diagram 2] FIG. 2A is a block diagram showing the configuration of a printing machine, FIG. 2B is a block diagram showing the configuration of a dispenser device, and FIG. 2C is a block diagram showing the configuration of a component mounting device. [Diagram 3] FIG. 1 is a schematic plan view showing a component mounting apparatus according to an embodiment. [Figure 4] 1 is a schematic side view showing a component mounting apparatus according to an embodiment; [Diagram 5] FIG. 2 is a block diagram showing a control configuration of the component mounting apparatus according to the embodiment. [Figure 6] FIG. 2 is a schematic plan view showing a backup base according to one embodiment. [Figure 7] FIG. 4 is a schematic diagram for explaining pin arrangement data according to an embodiment. [Figure 8] 5A and 5B are schematic diagrams for explaining the arrangement of backup pins with respect to a substrate according to one embodiment. [Figure 9] FIG. 1 is a schematic diagram (1) for explaining pin arrangement possible position data according to an embodiment. [Figure 10] FIG. 13 is a schematic diagram (2) for explaining pin arrangement possible position data according to an embodiment. [Figure 11] 11 is a schematic diagram for explaining a relationship between pin arrangement possible position data and a reference position in a component mounting device according to an embodiment. FIG. [Figure 12] FIG. 1 is a schematic diagram (1) for explaining alignment between pin arrangement data and pin arrangement possible position data according to an embodiment. [Figure 13]FIG. 11 is a schematic diagram (2) for explaining alignment between the pin arrangement data and the pin arrangement possible position data according to an embodiment. [Figure 14] FIG. 11 is a schematic diagram for explaining an offset value according to an embodiment. [Figure 15] 11A and 11B are schematic diagrams for explaining adjustment of the number of backup pins of the pin layout data according to an embodiment; [Figure 16] 11 is a flowchart illustrating a control process related to the arrangement of the backup pin according to an embodiment. [Figure 17] 17 is a flowchart for explaining details of step S5 in FIG. 16. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0022] The configuration of a board working system 100 according to an embodiment of the present invention will be described with reference to FIGS.

[0023] (Configuration of the circuit board processing system) The board processing system 100 is configured to mount components E on a board P to manufacture a board P on which the components E are mounted. The components E include small piece-like electronic components such as LSIs, ICs, transistors, capacitors, and resistors.

[0024] As shown in Fig. 1, the board work system 100 includes a component mounting line 1 and an external PC 2. The component mounting line 1 includes a plurality of board work devices 10. The plurality of board work devices 10 includes a printer 10a, a print inspection device 10b, a dispenser device 10c, a plurality of component mounting devices 10d, an appearance inspection device 10e, and a reflow device 10f. The component mounting line 1 is configured such that a board P is transported from the upstream side (left side) to the downstream side (right side) along the manufacturing line.

[0025] The printer 10a is a screen printer and has a function of applying cream solder onto the mounting surface of the substrate P.

[0026] The print inspection machine 10b has a function of inspecting the condition of the cream solder printed by the printer 10a.

[0027] The dispenser device 10c has a function of applying cream solder, adhesive, and the like to the substrate P.

[0028] The component mounting apparatus 10d has a function of mounting components E on the board P on which cream solder has been printed. A plurality of component mounting apparatuses 10d are arranged along the transport direction of the board P.

[0029] As shown in FIG. 1, the appearance inspection apparatus 10e has a function of inspecting the appearance of a board P on which components E are mounted by the component mounting apparatus 10d.

[0030] The reflow apparatus 10f has a function of performing a heat treatment to melt the solder and join the component E to the electrode portion of the board P. The reflow apparatus 10f is configured to perform the heat treatment while transporting the board P on the lane.

[0031] The external PC (personal computer) 2 is used to create pin arrangement data DA1, which will be described later. The external PC 2 is connected to each device of the component mounting line 1 so as to be able to communicate with each other. The external PC 2 includes a control unit 2a, a storage unit 2b, a display unit 2c, and an operation unit 2d. The control unit 2a is a control circuit that includes a processor such as a CPU (central processing unit) and controls each unit of the external PC 2. The storage unit 2b includes a non-volatile recording medium such as a hard disk drive and stores information. The storage unit 2b stores the pin arrangement data DA1, etc. The display unit 2c includes a monitor such as a liquid crystal monitor and is configured to be able to display a screen for operating the external PC 2. The operation unit 2d includes input devices such as a keyboard and a mouse and receives operations from an operator.

[0032] (Board work device including backup unit) As shown in FIG. 2, the board working system 100 includes a printing machine 10a, a dispenser apparatus 10c, and a component mounting apparatus 10d as board working apparatuses 10 including a backup unit.

[0033] The printer 10a includes a control unit 11 and a backup unit 12. The control unit 11 is a control circuit that includes a processor such as a CPU (Central Processing Unit) and controls each unit of the printer 10a. The backup unit 12 has a backup pin 121 that supports the substrate P from below, and a backup base 122 that supports the backup pin 121 from below.

[0034] The dispenser device 10c includes a control unit 2a and a backup unit 22. The control unit 2a is a control circuit that includes a processor such as a CPU (Central Processing Unit) and controls each part of the dispenser device 10c. The backup unit 22 has a backup pin 221 that supports the substrate P from below, and a backup base 222 that supports the backup pin 221 from below.

[0035] The component mounting apparatus 10d includes a control unit 31 and a backup unit 32. The control unit 31 is a control circuit that includes a processor such as a CPU (Central Processing Unit) and controls each unit of the component mounting apparatus 10d. The backup unit 32 has backup pins 321 that support the substrate P from below, and a backup base 322 that supports the backup pins 321 from below.

[0036] (Configuration of component mounting equipment) As an example of the board working device 10 including a backup unit, the configuration of a component mounting device 10d will be described. As shown in Fig. 3 to Fig. 5, the component mounting device 10d includes a control unit 31, a backup unit 32, a base 41, a board transport unit 42, a head unit 43, a head horizontal movement mechanism unit 44, a component imaging unit 45, a board imaging unit 46, and a storage unit 47. In the following description, the board transport direction is defined as the X direction, the direction perpendicular to the X direction in the horizontal plane is defined as the Y direction, and the up-down direction perpendicular to the X direction and the Y direction is defined as the Z direction.

[0037] The base 41 is a base on which each component is arranged in the component mounting apparatus 10d. A board transport unit 42, a rail unit 442, and a component imaging unit 45 are provided on the base 41. A control unit 31 is also provided inside the base 41. The base 41 also has a plurality of component supply units 48 arranged along the X direction on both sides in the Y direction (Y1 direction side and Y2 direction side) for supplying components E.

[0038] Component supply unit 48 is a tape feeder that supplies components E by feeding a component supply tape that stores components E. The component supply tape is wound around a reel. The reel is set in component supply unit 48. Component supply unit 48 is configured to intermittently feed the component supply tape in response to a component suction operation by head unit 43.

[0039] The board transport section 42 is configured to carry in the board P before mounting, transport it in the X direction, and carry out the board P after mounting. The board transport section 42 is configured to transport the carried-in board P to a stop position and fix it at the stop position with a board fixing mechanism (not shown) such as a clamp mechanism. The board transport section 42 includes a pair of conveyor sections 421 and a transport motor 422 that drives the pair of conveyor sections 421. The board transport section 42 is configured to transport the board P in the X direction while supporting both ends of the board P in the width direction (Y direction) from the lower side (Z2 direction side) by the pair of conveyor sections 421. The pair of conveyor sections 421 are configured to be able to adjust the distance in the Y direction between the pair of conveyor sections 421 in accordance with the width of the board P in the Y direction. The conveyor section 421 on the Y2 direction side is a fixed conveyor, and the conveyor section 421 on the Y1 direction side is a movable conveyor. The movable conveyor section 421 moves relative to the fixed conveyor section 421, whereby the distance in the Y direction between the pair of conveyors 421 is adjusted.

[0040] The head unit 43 is a head unit for mounting components. The head unit 43 mounts components E on the board P fixed at a stop position. The head unit 43 includes a plurality (five) of heads (mounting heads) 431. A nozzle 431a for adsorbing the component E is attached to the tip of the head 431. The head 431 is configured to be able to adsorb the component E to the nozzle 431a by negative pressure supplied from a negative pressure supply unit (not shown).

[0041] The head unit 43 includes a Z-axis motor 432 that moves the nozzle 431a of the head 431 in the Z direction, and an R-axis motor 433 that rotates the nozzle 431a of the head 431 about a rotation axis extending in the Z direction. The head 431 is configured to be movable in the Z direction between a predetermined lowered position and a predetermined raised position by the Z-axis motor 432. In addition, the head 431 is configured to be rotated by the R-axis motor 433 while holding the component E, thereby adjusting the orientation of the component E that is being picked up.

[0042] The head horizontal movement mechanism 44 is configured to move the head unit 43 in the horizontal direction (X direction and Y direction). The head horizontal movement mechanism 44 includes a support part 441 that supports the head unit 43 so as to be movable in the X direction, and a rail part 442 that supports the support part 441 so as to be movable in the Y direction. The support part 441 has a ball screw shaft 441a extending in the X direction, and an X-axis motor 441b that rotates the ball screw shaft 441a. The head unit 43 is provided with a ball nut (not shown) that engages with the ball screw shaft 441a of the support part 441. The head unit 43 is configured to be movable in the X direction along the support part 441 together with the ball nut that engages with the ball screw shaft 441a by rotating the ball screw shaft 441a by the X-axis motor 441b.

[0043] The rail portion 442 has a pair of guide rails 442a that support both ends of the support portion 441 in the X direction so as to be movable in the Y direction, a ball screw shaft 442b extending in the Y direction, and a Y-axis motor 442c that rotates the ball screw shaft 442b. The support portion 441 is provided with a ball nut (not shown) that engages with the ball screw shaft 442b of the rail portion 442. The support portion 441 is configured to be movable in the Y direction along the pair of guide rails 442a of the rail portion 442 together with the ball nut that engages with the ball screw shaft 442b by rotating the ball screw shaft 442b by the Y-axis motor 442c.

[0044] The head unit 43 is configured to be movable in the horizontal direction on the base 41 by the support parts 441 and rail parts 442 of the head horizontal movement mechanism part 44. This allows the head 431 of the head unit 43 to move above the component supply part 48 and pick up the component E supplied from the component supply part 48. The head 431 of the head unit 43 can also move above the substrate P fixed at the stop position and mount the picked up component E on the substrate P.

[0045] The backup unit 32 supports the substrate P arranged at the stop position from below. The backup unit 32 includes a plurality of backup pins 321 and a backup base 322. The backup pins 321 support the support surface (lower surface) PA of the substrate P from below. The upper ends of the backup pins 321 abut against the support surface PA of the substrate P. The backup base 322 supports the lower ends of the backup pins 321. Specifically, as shown in FIG. 6, the backup base 322 is formed with a plurality of pin arrangement holes 323. The plurality of pin arrangement holes 323 are arranged in a matrix. The lower ends of the backup pins 321 are inserted and fixed into some of the plurality of pin arrangement holes 323. Details of the determination of the arrangement of the backup pins 321 will be described later.

[0046] 3 to 5, the component imaging section 45 is a camera for component recognition. The component imaging section 45 images the component E picked up by the nozzle 431a of the head 431 while the head 431 of the head unit 43 is transporting the component E to the board P. The component imaging section 45 is fixed on the upper surface of the base 41, and images the component E picked up by the nozzle 431a of the head 431 from the lower side (Z2 direction side) of the component E. Based on the image of the component E picked up by the component imaging section 45, the control section 31 acquires (recognizes) the holding state of the component E (the rotational attitude and the pick-up position relative to the head 431).

[0047] The board imaging unit 46 is a camera for board recognition. Before the head 431 of the head unit 43 starts mounting the components E on the board P, the board imaging unit 46 captures an image of a position recognition mark (not shown) attached to the upper surface of the board P from above, with the board P fixed at the stop position. The position recognition mark is a mark for recognizing the position of the board P. Based on the image of the position recognition mark captured by the board imaging unit 46, the control unit 31 acquires (recognizes) the accurate position and attitude of the board P fixed at the stop position. The board imaging unit 46 is attached to the head unit 43. The board imaging unit 46 is configured to be movable in the horizontal direction together with the head unit 43.

[0048] The storage unit 47 includes a non-volatile recording medium such as a hard disk drive and stores information. The storage unit 47 stores pin arrangement possible position data DA2 (described later), data on the number of backup pins 321 that can be used in the component mounting device 10d, a mounting program, and the like.

[0049] The control unit 31 is configured to control the board transport unit 42, the component supply unit 48, the X-axis motor 441b, the Y-axis motor 442c, etc. based on the mounting program stored in the memory unit 47, thereby causing the head unit 43 to mount components E on the board P, thereby controlling the production of the board P.

[0050] (Determining the placement of backup pins) 7 to 15, the determination of the arrangement of the backup pins in each board working apparatus 10 (printing machine 10a, dispenser apparatus 10c, and multiple component mounting apparatuses 10d) equipped with a backup unit will be described. The determination of the arrangement of the backup pins in component mounting apparatus 10d will be mainly described.

[0051] Here, in this embodiment, the control unit 31 of the component mounting apparatus 10d (the control unit 11 of the printing machine 10a, the control unit 2a of the dispenser apparatus 10c) determines the arrangement of the backup pins 321 (121, 221) based on the pin arrangement data DA1 representing the arrangement of the backup pins 121, 221 and 321 relative to the substrate P and the pin arrangement possible position data DA2 representing the possible positions of the backup pins 321 (121, 221) in the component mounting apparatus 10d (the printing machine 10a, the dispenser apparatus 10c), as shown in Figures 7 to 13.

[0052] <Pin configuration data> 7 and 8, the control unit 2a of the external PC 2 creates pin layout data DA1 based on an operation by an operator. The control unit 2a of the external PC 2 also stores the created pin layout data DA1 in the storage unit 2b.

[0053] The pin arrangement data DA1 is data that represents the arrangement of the backup pins with respect to the board P, independent of each board work apparatus 10 (printer 10a, dispenser apparatus 10c, and multiple component mounting apparatuses 10d) for which the arrangement of the backup pins is to be determined. The pin arrangement data DA1 is used in common by each board work apparatus 10 for which the arrangement of the backup pins is to be determined. That is, in this embodiment, the pin arrangement data DA1 commonly represents the arrangement of the backup pins 121 of the printer 10a, the backup pins 221 of the dispenser apparatus 10c, and the backup pins 321 of the multiple component mounting apparatuses 10d.

[0054] The pin arrangement data DA1 is configured to represent positions where the backup pins 121, 221, and 321 are arranged and positions where the backup pins 121, 221, and 321 are not arranged by a plurality of regions partitioned in a matrix shape. In the example shown in Fig. 7, the positions where the backup pins 121, 221, and 321 are arranged are represented by "1", and the positions where the backup pins 121, 221, and 321 are not arranged are represented by "0".

[0055] The pin arrangement data DA1 is created by defining the presence or absence of the backup pins 121, 221, and 321, the maximum number of rows, the maximum number of columns, the row pitch, the column pitch, the board coordinate system, the board origin, and the offset value from the board origin. For example, the maximum number of rows is defined as 10, the maximum number of columns as 15, the row pitch as 10 mm, and the column pitch as 10 mm.

[0056] When the pitch of the pin placement holes on the backup base is common among the target board work devices 10 (printer 10a, dispenser device 10c, and multiple component mounting devices 10d) for which the placement of the backup pins is to be determined, the row pitch and column pitch are defined to match the common pitch among the target board work devices 10. For example, when the pitch of the pin placement holes on the backup base is common to all the target board work devices 10 at 10 mm, the row pitch and column pitch are defined as 10 mm.

[0057] Furthermore, when the pitch of the pin arrangement holes in the backup bases differs in each of the target board working devices 10, the row pitch and column pitch are defined as a common multiple of the pitch of the pin arrangement holes in the backup bases in each of the target board working devices 10. For example, when the pitch of the pin arrangement holes in the backup bases in each of the target board working devices 10 is a mixture of 5 mm and 10 mm, the row pitch and column pitch are defined as 10 mm, which is the common multiple of 5 mm and 10 mm.

[0058] Also, for example, the board coordinate system is defined as + on the Y axis with the upward direction and + on the X axis with the top surface of the board P viewed from the front. Also, for example, the board origin is defined as the lower right corner of the board P with the top surface of the board P viewed from the front. Also, for example, the offset value in the X direction from the board origin is defined as 5 mm, and the offset value in the Y direction from the board origin is defined as 5 mm. Then, the position (1, 1) of the matrix of the pin arrangement data DA1 is defined as the position (5 mm, 5 mm) of the board P. With these definitions, each position of the matrix of the pin arrangement data DA1 represents each position of the board P. Then, among each position of the matrix of the pin arrangement data DA1, the positions corresponding to the positions of the board P where the backup pins 121, 221, and 321 are to be arranged are defined as the positions where the backup pins 121, 221, and 321 are to be arranged (i.e., defined as "1"). Furthermore, among the positions in the matrix of the pin arrangement data DA1, positions other than those corresponding to positions on the substrate P where the backup pins 121, 221, and 321 are to be arranged are defined as positions where the backup pins 121, 221, and 321 are not to be arranged (i.e., defined as "0"). Note that, as long as it is possible to define the positions of the backup pins 121, 221, and 321 relative to the reference position of the substrate P, the substrate coordinate system, the substrate origin, the offset value from the substrate origin, and the like are not particularly limited. For example, the substrate origin may be the lower left corner, upper left corner, upper right corner, or center of the substrate P.

[0059] <Pin placement possible position data> 9 and 10, the control unit 11 of the printing machine 10a, the control unit 21 of the dispenser device 10c, and the control unit 31 of the component mounting device 10d each create pin arrangement possible position data DA2 corresponding to their own machine based on the operation of the worker. In addition, the control unit 11 of the printing machine 10a, the control unit 21 of the dispenser device 10c, and the control unit 31 of the component mounting device 10d each store the created pin arrangement possible position data DA2 in a memory unit (such as the memory unit 47) of their own machine.

[0060] The pin arrangement possible position data DA2 depends on each of the board work devices 10 (the printer 10a, the dispenser device 10c, and the multiple component mounting devices 10d) for which the arrangement of the backup pins is to be determined, and is data that is provided individually for each of the target board work devices 10. For convenience, an example of the pin arrangement possible position data DA2 for the component mounting device 10d will be described below.

[0061] The pin arrangement position data DA2 is configured to represent positions where the backup pin 321 can be arranged and positions where the backup pin 321 cannot be arranged by a plurality of regions partitioned in a matrix. In the examples shown in Fig. 9 and Fig. 10, the positions where the backup pin 321 can be arranged are represented by "1", and the positions where the backup pin 321 cannot be arranged are represented by "0". Moreover, the example shown in Fig. 9 represents an example where there are only positions where the backup pin 321 can be arranged, and there are no positions where the backup pin 321 cannot be arranged. Moreover, the example shown in Fig. 10 represents an example where there are both positions where the backup pin 321 can be arranged and positions where the backup pin 321 cannot be arranged.

[0062] The pin arrangement possible position data DA2 is created by defining whether the backup pin 321 can be arranged, the maximum Y-direction address, the maximum X-direction address, the Y-direction pitch, and the X-direction pitch. The pin arrangement possible position data DA2's whether the backup pin 321 can be arranged, the maximum Y-direction address, the maximum X-direction address, the Y-direction pitch, and the X-direction pitch are defined to match the whether the backup pin 321 can be arranged, the maximum Y-direction address, the maximum X-direction address, the Y-direction pitch, and the X-direction pitch, respectively, of the pin arrangement hole of the backup base in the component mounting device 10d.

[0063] For example, it is assumed that the maximum Y-direction address of the pin arrangement hole 323 of the backup base 322 of the component mounting device 10d is 15, the maximum X-direction address is 18, the Y-direction pitch is 10 mm, and the X-direction pitch is 10 mm. In this case, the values ​​of the pin arrangement possible position data DA2 corresponding to the component mounting device 10d are defined so that the maximum Y-direction address is 15, the maximum X-direction address is 18, the Y-direction pitch is 10 mm, and the X-direction pitch is 10 mm. With these definitions, each position of the matrix of the pin arrangement possible position data DA2 represents each position of the backup base 322. Then, among each position of the matrix of the pin arrangement possible position data DA2, the position corresponding to the position of the backup base 322 where the backup pin 321 can be arranged is defined as the position where the backup pin 321 can be arranged (i.e., defined as "1"). Furthermore, among the positions in the matrix of the pin placement possible position data DA2, the positions corresponding to the positions of the backup base 322 where the backup pin 321 cannot be placed due to the influence of an interfering object or the like are defined as positions where the backup pin 321 cannot be placed (i.e., defined as "0").

[0064] 11, each position of the matrix of the pin arrangement possible position data DA2 in the component mounting apparatus 10d is defined based on a reference position in the component mounting apparatus 10d. Specifically, each position of the matrix of the pin arrangement possible position data DA2 in the component mounting apparatus 10d is defined by an origin as a reference position and an offset value from the origin. For example, the origin is defined as the position of the lower right corner of the pin arrangement possible position data DA2 (for example, the position of the lower right corner of the backup base 322). Also, for example, the offset value in the X direction from the origin is defined as 5 mm, and the offset value in the Y direction from the origin is defined as 5 mm. Then, the position of (1, 1) in the matrix of the pin arrangement possible position data DA2 is defined as a position (5 mm, 5 mm) from the origin in the component mounting apparatus 10d. With these definitions, the relationship between each position of the matrix of the pin arrangement possible position data DA2 and the position in the component mounting apparatus 10d is defined. In addition, as long as it is possible to define each position in the matrix of the pin arrangement possible position data DA2 with respect to the reference position of the component mounting apparatus 10d, the origin and the offset value from the origin are not particularly limited.

[0065] An example of the pin arrangement possible position data DA2 of the component mounting apparatus 10d has been described above. Although detailed description is omitted, the pin arrangement possible position data DA2 of the printing machine 10a and the dispenser apparatus 10c are similar.

[0066] <Alignment of pin layout data and available pin layout position data> 12 to 14, in this embodiment, the control unit 11 of the printer 10a, the control unit 21 of the dispenser device 10c, and the control unit 31 of the component mounting device 10d each align the pin arrangement data DA1 and the pin arrangement possible position data DA2 of the own device based on the stopping position of the board P in the own device, and determine the arrangement of the backup pins 121, 221, or 321 of the own device. For convenience, an example of the component mounting device 10d will be described below.

[0067] With the pin arrangement data DA1 and the pin arrangement possible position data DA2 aligned, the control unit 31 determines, as the arrangement of the backup pin 321, a position where the position of the backup pin 321 in the pin arrangement data DA1 coincides with a position where the backup pin 321 in the pin arrangement possible position data DA2 can be arranged. That is, the control unit 31 determines, as the arrangement of the backup pin 321, a position where the position of "1" in the pin arrangement data DA1 coincides with the position of "1" in the pin arrangement possible position data DA2.

[0068] Furthermore, with the pin arrangement data DA1 and the pin arrangement possible position data DA2 aligned, the control unit 31 excludes a position where the position for placing the backup pin 321 in the pin arrangement data DA1 matches a position where the backup pin 321 in the pin arrangement possible position data DA2 cannot be placed, from the arrangement of the backup pin 321. In other words, the control unit 31 excludes a position where the position of "1" in the pin arrangement data DA1 matches a position of "0" in the pin arrangement possible position data DA2, from the arrangement of the backup pin 321.

[0069] The example shown in Fig. 12 is an example in which the pin arrangement data DA1 shown in Fig. 7 and the pin arrangement possible position data DA2 shown in Fig. 9 are aligned. In this case, the positions of all "1" in the pin arrangement data DA1 match the positions of "1" in the pin arrangement possible position data DA2. Therefore, the positions of all "1" in the pin arrangement data DA1 are determined as the arrangement of the backup pin 321.

[0070] The example shown in Fig. 13 is an example in which the pin arrangement data DA1 shown in Fig. 7 and the pin arrangement possible position data DA2 shown in Fig. 10 are aligned. In this case, some of the positions of "1" in the pin arrangement data DA1 match with the positions of "1" in the pin arrangement possible position data DA2, and some of the positions of "1" in the pin arrangement data DA1 match with the positions of "0" in the pin arrangement possible position data DA2. For this reason, among the positions of "1" in the pin arrangement data DA1, the positions that match with the positions of "0" in the pin arrangement possible position data DA2 are excluded, and only the positions that match with the positions of "1" in the pin arrangement possible position data DA2 are determined as the positions of the backup pin 321.

[0071] Also, in this embodiment, as shown in FIG. 14, the control unit 31 acquires an offset value OV of the position of the substrate P relative to the position of the backup unit 32 based on the stopping position of the substrate P in the component mounting device 10d, and aligns the pin arrangement data DA1 and the pin arrangement possible position data DA2 based on the acquired offset value OV.

[0072] Assuming that the substrate P is located at the stop position, the control unit 31 acquires the length in the X direction from the reference position of the backup base 322 (the end position on the X1 direction side in FIG. 14) to the reference position of the substrate P (the end position on the X1 direction side in FIG. 14) as the offset value OV. Then, the control unit 31 divides the acquired offset value OV by the column direction pitch of the pin arrangement data DA1 to acquire a converted offset value that converts the acquired offset value OV into the number of columns of the pin arrangement data DA1. Then, the control unit 31 aligns the pin arrangement data DA1 and the pin arrangement possible position data DA2 by offsetting the pin arrangement data DA1 with respect to the pin arrangement possible position data DA2 based on the converted offset value.

[0073] For example, assume that the offset value OV is 35 mm, and the column pitch of the pin arrangement data DA1 is 10 mm. In this case, the conversion offset value=35 mm / 10 mm=3.5. Since the number of columns is an integer value, the conversion offset value=3 when the decimal point is discarded. In this case, as in the example shown in FIG. 12 and FIG. 13, the pin arrangement data DA1 is offset by three columns with respect to the pin arrangement possible position data DA2, so that the pin arrangement data DA1 and the pin arrangement possible position data DA2 are aligned. Note that the component mounting device 10d is configured such that the end position of the backup base 322 on the Y2 direction side coincides with the position of the fixed-side conveyor unit 421 (i.e., the end position of the board P on the Y2 direction side), so the offset value in the Y direction (row direction) is 0. In the case where the component mounting apparatus 10d is configured such that the position of the end of the backup base 322 on the Y2 direction side does not coincide with the position of the fixed-side conveyor section 421, the offset value in the Y direction (row direction) may be calculated in the same manner as the offset value in the X direction (column direction).

[0074] Here, in the case where the component mounting device 10d is configured to have a stopper that abuts against the substrate P and stops the substrate P at a stop position, the stop position of the substrate P is a fixed position corresponding to the stopper. In this case, the offset value OV is a fixed value. On the other hand, in the case where the component mounting device 10d is configured not to have a stopper and the stop position of the substrate P is arbitrarily changeable, the stop position of the substrate P is a variable position. In this case, the offset value OV is a variable value. Note that, in the case where the stop position of the substrate P is arbitrarily changeable, the component mounting device 10d acquires the position of the substrate P based on the output of the encoder of the transport motor 422 of the substrate transport unit 42, and stops the substrate P at the stop position.

[0075] When the stop position of the board P can be arbitrarily changed, the control unit 31 sets the stop position of the board P so that the center in the X direction of the arrangement of the components E (component supply unit 48) used for mounting the board P in the component mounting device 10d corresponds (coincides) with the center in the X direction of the board P, and acquires the offset value OV based on the set stop position of the board P. Note that in Fig. 14, the components E (component supply unit 48) used for mounting the board P in the component mounting device 10d are illustrated by hatching. The control unit 31 also acquires the offset value OV by the following formula (1), and acquires the converted offset value by the following formula (2). OV = (L1 - L2 / 2) (1) O.V. T =OV / PX (2) Where: OV: Offset value L1: Length in the X direction between the reference position (the end position in the X1 direction) of the backup base 322 and the center position in the X direction of the arrangement of the part E L2: Length of the substrate P in the X direction O.V. T :Conversion offset value PX: Column pitch of pin layout data DA1 It is.

[0076] The control unit 31 acquires the arrangement of the components E (component supply unit 48) used for mounting the board P in the component mounting device 10d based on component arrangement position information related to the arrangement position of the components E (component supply unit 48) used for mounting the board P in the component mounting device 10d, which is included in the mounting program, and acquires the center position in the X direction of the acquired arrangement of the components E. Then, the control unit 31 acquires the length L1 from the center position in the X direction of the acquired arrangement of the components E and the reference position (the end position in the X1 direction) of the backup base 322. The control unit 31 also acquires the length L2 in the X direction of the board P based on board size information related to the size of the board P, which is included in the mounting program.

[0077] The above describes an example of the component mounting apparatus 10d. Although detailed description is omitted, the control unit 11 of the printer 10a and the control unit 21 of the dispenser apparatus 10c also align the pin arrangement data DA1 and the pin arrangement possible position data DA2 in the same manner as the control unit 31 of the component mounting apparatus 10d.

[0078] <Adjusting the number of pins> 15, each of the control unit 11 of the printing machine 10a, the control unit 21 of the dispenser apparatus 10c, and the control unit 31 of the component mounting apparatus 10d adjusts the number of backup pins 121, 221, or 321 arranged in the respective apparatuses. For convenience, an example of the component mounting apparatus 10d will be described below.

[0079] In this embodiment, when the number of backup pins 321 to be placed exceeds the number of available backup pins 321, the control unit 31 adjusts the number of backup pins 321 to be placed so that the number of backup pins 321 to be placed is equal to the number of available backup pins 321. Specifically, the control unit 31 adjusts the number of backup pins 321 to be placed by deleting backup pins 321 to be placed until the number of backup pins 321 to be placed is equal to the number of available backup pins 321, based on the priority of the placement of the backup pins 321.

[0080] Specifically, the control unit 31 determines the priority of the backup pins 321 at each position based on a predetermined condition for determining priority. Then, the control unit 31 deletes the backup pins 321 in ascending order of priority until the number of backup pins 321 to be placed becomes equal to the number of available backup pins 321. For example, the control unit 31 sorts the backup pins 321 at each position in order of priority (ascending order) using the position in the X direction as a first key (first priority determination condition) and the position in the Y direction as a second key (second priority determination condition). Then, the control unit 31 deletes the backup pins 321 in ascending order of priority until the number of backup pins 321 to be placed becomes equal to the number of available backup pins 321.

[0081] The above describes an example of the component mounting apparatus 10d. Although detailed description is omitted, the control unit 11 of the printer 10a and the control unit 21 of the dispenser apparatus 10c also adjust the number of backup pins 121 or 221 in the same manner as the control unit 31 of the component mounting apparatus 10d.

[0082] (Control process for backup pin placement) The control process for the arrangement of the backup pins will be described based on a flowchart with reference to Fig. 16 and Fig. 17. Of the processes in the flowchart, the processes for determining the arrangement of the backup pins (S3, S4, S5) are performed in each board working device 10 (printing machine 10a, dispenser device 10c, and multiple component mounting devices 10d) for which the arrangement of the backup pins is to be determined, but for convenience, an example of the component mounting device 10d will be described below.

[0083] 16, in step S1, the control unit 2a of the external PC 2 creates pin arrangement data DA1. Then, in step S2, the control unit 31 of the component mounting apparatus 10d reads a mounting program. Then, in step S3, the control unit 31 of the component mounting apparatus 10d acquires and reads the pin arrangement data DA1 from the external PC 2. Then, in step S4, the control unit 31 of the component mounting apparatus 10d acquires an offset value OV. Then, in step S5, the control unit 31 of the component mounting apparatus 10d determines the arrangement of the backup pins 321.

[0084] 17, in step S11, the control unit 31 of the component mounting apparatus 10d aligns the pin arrangement data DA1 and the pin arrangement possible position data DA2 based on the offset value OV. Then, in step S12, the control unit 31 of the component mounting apparatus 10d excludes positions where the positions at which the backup pins 321 are to be arranged in the pin arrangement data DA1 match with positions at which the backup pins 321 cannot be arranged in the pin arrangement possible position data DA2, from the arrangement of the backup pins 321. Then, in step S13, the control unit 31 of the component mounting apparatus 10d determines whether the number of backup pins 321 to be arranged exceeds the number of available backup pins 321.

[0085] If it is determined that the number of backup pins 321 to be placed does not exceed the number of available backup pins 321, the process proceeds to step S6. If it is determined that the number of backup pins 321 to be placed exceeds the number of available backup pins 321, the process proceeds to step S14. Then, in step S14, the control unit 31 of the component mounting apparatus 10d adjusts the number of backup pins 321 to be placed so that the number of backup pins 321 to be placed is equal to the number of available backup pins 321. In this way, the control unit 31 of the component mounting apparatus 10d determines the placement of the backup pins 321.

[0086] 16, in step S6, the control unit 31 of the component mounting apparatus 10d controls the head unit 43 to place the backup pins 321 on the backup base 322 so as to achieve the determined arrangement of the backup pins 321. As a result, the backup pins 321 are automatically placed on the backup base 322. Then, the control process ends.

[0087] An example of the component mounting apparatus 10d has been described above. The control unit 11 of the printer 10a and the control unit 21 of the dispenser apparatus 10c also perform the process of the flowchart, similar to the component mounting apparatus 10d. Therefore, it is possible to automatically determine the arrangement of the backup pins for each type of board working apparatus 10, such as the printer 10a, the dispenser apparatus 10c, and the component mounting apparatus 10d, using one common pin arrangement data DA1. In addition, each control unit 31 of the multiple component mounting apparatuses 10d performs the process of the flowchart. Therefore, even if the stop positions of the board P are different in the multiple component mounting apparatuses 10d, it is possible to automatically determine the arrangement of the backup pins for each stop position of the board P using one common pin arrangement data DA1.

[0088] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0089] In this embodiment, as described above, the control units 11, 21, 31 are provided to determine the arrangement of the backup pins 121, 221, 321 based on the pin arrangement data DA1 representing the arrangement of the backup pins 121, 221, 321 on the board P and the pin arrangement possible position data DA2 representing the possible positions of the backup pins 121, 221, 321 in the board working device 10 (printer 10a, dispenser device 10c, multiple component mounting devices 10d). As a result, the arrangement of the backup pins 121, 221, 321 for each condition, such as the type of board working device 10 or the stopping position of the board P, can be automatically determined by the worker simply creating one pin arrangement data DA1, so that the worker does not need to determine the arrangement of the backup pins 121, 221, 321 for each condition. As a result, even if the arrangement of the backup pins 121, 221, 321 varies depending on the type of substrate working device 10 or conditions such as the stopping position of the substrate P, the arrangement of the backup pins 121, 221, 321 can be easily determined.

[0090] Furthermore, in this embodiment, as described above, the control units 11, 21, 31 align the pin arrangement data DA1 and the pin arrangement possible position data DA2 based on the stop position of the board P in the board working device 10 (printer 10a, dispenser device 10c, multiple component mounting devices 10d) and determine the arrangement of the backup pins 121, 221, 321. As a result, even if the positions of the pin arrangement data DA1 and the pin arrangement possible position data DA2 differ for each condition, the pin arrangement data DA1 and the pin arrangement possible position data DA2 can be aligned, so that the arrangement of the backup pins 121, 221, 321 for each condition can be appropriately determined.

[0091] In this embodiment, as described above, the control units 11, 21, 31 align the pin arrangement data DA1 and the pin arrangement possible position data DA2, and determine the positions where the backup pins 121, 221, 321 in the pin arrangement data DA1 are arranged and the positions where the backup pins 121, 221, 321 in the pin arrangement possible position data DA2 can be arranged as the arrangements of the backup pins 121, 221, 321. As a result, the positions where the backup pins 121, 221, 321 in the pin arrangement data DA1 are arranged and the positions where the backup pins 121, 221, 321 in the pin arrangement possible position data DA2 can be arranged are determined as the arrangements of the backup pins 121, 221, 321, so that the arrangements of the backup pins 121, 221, 321 can be easily and appropriately determined.

[0092] Furthermore, in this embodiment, as described above, the control units 11, 21, 31, after aligning the pin arrangement data DA1 with the pin arrangement possible position data DA2, exclude positions where the positions at which the backup pins 121, 221, 321 in the pin arrangement data DA1 are to be arranged coincide with positions at which the backup pins 121, 221, 321 in the pin arrangement possible position data DA2 cannot be arranged from the arrangement of the backup pins 121, 221, 321. As a result, the positions at which the backup pins 121, 221, 321 in the pin arrangement possible position data DA2 cannot be arranged are not determined as positions at which the backup pins 121, 221, 321 are to be arranged, so that the arrangement of the backup pins 121, 221, 321 can be more appropriately determined.

[0093] In this embodiment, as described above, the pin arrangement data DA1 is configured to represent positions where the backup pins 121, 221, 321 are arranged and positions where the backup pins 121, 221, 321 are not arranged by a plurality of areas partitioned in a matrix, and the pin arrangement possible position data DA2 is configured to represent positions where the backup pins 121, 221, 321 can be arranged and positions where the backup pins 121, 221, 321 cannot be arranged by a plurality of areas partitioned in a matrix. As a result, since both the pin arrangement data DA1 and the pin arrangement possible position data DA2 are represented by a plurality of areas partitioned in a matrix, it is easy to align the pin arrangement data DA1 with the pin arrangement possible position data DA2, and it is easy to determine whether the positions where the backup pins 121, 221, 321 of the pin arrangement data DA1 are arranged coincide with the positions where the backup pins 121, 221, 321 of the pin arrangement possible position data DA2 can be arranged.

[0094] Furthermore, in this embodiment, as described above, the control units 11, 21, 31 acquire the offset value OV of the position of the substrate P relative to the positions of the backup units 12, 22, 32 based on the stopping position of the substrate P in the substrate working device 10, and align the pin arrangement data DA1 with the pin arrangement possible position data DA2 based on the acquired offset value OV. This makes it possible to appropriately align the pin arrangement data DA1 with the pin arrangement possible position data DA2 by utilizing the fact that the offset value OV of the position of the substrate P relative to the positions of the backup units 12, 22, 32 corresponds to the value by which the pin arrangement data DA1 should be offset with respect to the pin arrangement possible position data DA2.

[0095] In this embodiment, as described above, the board working device 10 includes a component mounting device 10d that mounts components E on the board P, and the control unit 31 sets the stop position of the board P so that the center of the arrangement of components E used for mounting the board P in the component mounting device 10d in the transport direction of the board P corresponds to the center of the board P in the transport direction, and acquires the offset value OV based on the set stop position of the board P. This makes it possible to set a stop position of the board P that can shorten the distance between the components E used for mounting the board P and the board P and shorten the time required for mounting the components E on the board P, and acquire the offset value OV. As a result, it is possible to appropriately align the pin arrangement data DA1 with the pin arrangement possible position data DA2 while shortening the time required for mounting the components E on the board P.

[0096] Furthermore, in this embodiment, as described above, when the number of backup pins 121, 221, 321 to be arranged exceeds the number of available backup pins 121, 221, 321, the control units 11, 21, 31 adjust the number of backup pins 121, 221, 321 to be arranged so that the number of backup pins 121, 221, 321 to be arranged is equal to the number of available backup pins 121, 221, 321. This makes it possible to avoid deciding on an arrangement of backup pins 121, 221, 321 that exceeds the number of available backup pins 121, 221, 321, and therefore makes it possible to avoid trouble caused by an insufficient number of backup pins 121, 221, 321 when arranging the backup pins 121, 221, 321.

[0097] Furthermore, in this embodiment, as described above, the control units 11, 21, 31 adjust the number of backup pins 121, 221, 321 to be placed based on the placement priority of the backup pins 121, 221, 321 by deleting backup pins 121, 221, 321 to be placed until the number of backup pins 121, 221, 321 to be placed becomes equal to the number of available backup pins 121, 221, 321. This makes it possible to delete backup pins 121, 221, 321 from the pin placement data DA1 based on the placement priority of the backup pins 121, 221, 321, and therefore to appropriately adjust the number of backup pins 121, 221, 321 to be placed.

[0098] (Modification) The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

[0099] For example, in the above embodiment, a printing machine, a dispenser device, and a component mounting device are provided as the board working device including the backup unit, but the present invention is not limited to this. In the present invention, only one or two of the printing machine, the dispenser device, and the component mounting device may be provided as the board working device including the backup unit. In addition, other than the printing machine, the dispenser device, and the component mounting device may be provided as the board working device including the backup unit.

[0100] In the above embodiment, the control unit of the external PC creates the pin arrangement data, but the present invention is not limited to this. In the present invention, the control unit of a board working device (printing machine, dispenser device, component mounting device, etc.) may create the pin arrangement data. In this case, the other board working devices may obtain the pin arrangement data from the board working device that created the pin arrangement data.

[0101] In the above embodiment, the control unit of the board working device (printing machine, dispenser device, component mounting device, etc.) creates the pin arrangement possible position data, but the present invention is not limited to this. In the present invention, the control unit of the external PC may create the pin arrangement possible position data of each board working device.

[0102] In the above embodiment, the control unit of the board working device (printing machine, dispenser device, component mounting device, etc.) determines the arrangement of the backup pins, but the present invention is not limited to this. In the present invention, the control unit of the external PC may determine the arrangement of the backup pins of each board working device. In this case, each board working device may obtain the arrangement of its own backup pins from the external PC.

[0103] In the above embodiment, the pitch of the matrix of the pin layout data is defined so that the positions of the matrix of the pin layout data and the positions of the matrix of the pin layout possible position data match when the alignment is performed, but the present invention is not limited to this. In the present invention, the pitch of the matrix of the pin layout data may be defined so that the positions of the matrix of the pin layout data and the positions of the matrix of the pin layout possible position data are slightly shifted when the alignment is performed. In this case, the position where the backup pin of the pin layout data is placed and the position where the backup pin of the pin layout possible position data can be placed do not completely match when the alignment is performed, but a position that can be considered to match may be determined as the placement of the backup pin. For example, when the position where the backup pin of the pin layout data is placed and the position where the backup pin of the pin layout possible position data can be placed are within an allowable range when the alignment is performed, they may be considered to match.

[0104] In the above embodiment, for convenience of explanation, the control process is described using a flow-driven flow in which the control process is performed in order according to the processing flow, but the present invention is not limited to this. In the present invention, the control process may be performed by an event-driven process in which the process is executed on an event-by-event basis. In this case, the control process may be performed completely in an event-driven manner, or may be performed by combining event-driven and flow-driven processes. [Explanation of symbols]

[0105] 10. Circuit board working device 10a Printing machine (substrate work device) 10c Dispenser device (substrate work device) 10d Component mounting equipment (substrate work equipment) 11, 21, 31 Control section 12, 22, 32 Backup section 100 PCB Work System 121, 221, 321 Backup pins E Parts OV offset value P board

Claims

1. a board working device including a backup unit having backup pins that support, from below, a board on which components are mounted; a control unit that determines an arrangement of the backup pin based on pin arrangement data that represents an arrangement of the backup pin with respect to the board and pin arrangeable position data that represents positions where the backup pin can be arranged on the board working device.

2. 2. The board working system according to claim 1, wherein the control unit aligns the pin arrangement data with the pin arrangement possible position data based on a stop position of the board in the board working device, and determines an arrangement of the backup pins.

3. 3. The board work system according to claim 2, wherein the control unit, after aligning the pin arrangement data with the possible pin arrangement position data, determines, as the arrangement of the backup pin, a position where a position at which the backup pin is to be arranged in the pin arrangement data coincides with a position at which the backup pin can be arranged in the possible pin arrangement position data.

4. 4. The board work system according to claim 3, wherein the control unit, after aligning the pin arrangement data with the possible pin arrangement position data, excludes a position where a position at which the backup pin is to be placed in the pin arrangement data coincides with a position at which the backup pin cannot be placed in the possible pin arrangement position data, from the arrangement of the backup pin.

5. the pin arrangement data is configured to represent positions where the backup pins are arranged and positions where the backup pins are not arranged by a plurality of regions partitioned in a matrix form, 4. The board working system according to claim 3, wherein the pin arrangement position data is configured to represent positions where the backup pin can be arranged and positions where the backup pin cannot be arranged by a plurality of regions partitioned in a matrix.

6. 3. The board working system according to claim 2, wherein the control unit obtains an offset value of a position of the board relative to a position of the backup unit based on a stop position of the board in the board working device, and aligns the pin arrangement data with the pin arrangement possible position data based on the obtained offset value.

7. the board working device includes a component mounting device that mounts the components on the board, The control unit sets a stop position of the board so that the center of the arrangement of the components used to mount the board in the component mounting device in the transport direction of the board corresponds to the center of the board in the transport direction, and acquires the offset value based on the set stop position of the board.

8. 2. The board working system according to claim 1, wherein, when the number of the backup pins to be placed exceeds the number of the backup pins available for use, the control unit adjusts the number of the backup pins to be placed so that the number of the backup pins to be placed is equal to the number of the backup pins available for use.

9. 9. The board working system according to claim 8, wherein the control unit adjusts the number of the backup pins to be placed based on a priority of the placement of the backup pins by deleting the backup pins to be placed until the number of the backup pins to be placed becomes equal to the number of the available backup pins.

10. 1. A method for determining a placement position of a backup pin in a board working system including a board working device including a backup unit having a backup pin that supports a board on which components are mounted from below, the method comprising: determining an arrangement of the backup pin based on pin arrangement data representing an arrangement of the backup pin with respect to the board and pin arrangeable position data representing possible positions of the backup pin on the board working device.

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