Laminated substrate, light-emitting device, manufacturing method for laminated substrate, and manufacturing method for light-emitting device

Abstract

To provide a laminated substrate with excellent thermal conductivity, in which the occurrence of separation or crack on the inside can be reduced.SOLUTION: A laminated substrate 1 includes a metal plate 3, a first ceramic material 4, and a first metal body 5. The first metal body 5 is disposed between a first surface of the metal plate 3 and a first surface of the first ceramic material 4, and in 80% or more of a side surface 4C continuing from a first surface 4A of the first ceramic material 4.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a bonded substrate, a light-emitting device, a method for manufacturing a bonded substrate, and a method for manufacturing a light-emitting device. [Background technology]

[0002] In light-emitting devices having light-emitting elements such as light-emitting diodes, the amount of light emitted by the mounted light-emitting elements is increasing year by year, and the light-emitting elements are becoming more highly integrated. As a result, the amount of heat generated is increasing, and measures to deal with the heat are becoming an issue.

[0003] A laminated substrate in which a copper circuit plate is bonded to a ceramic plate by active metal brazing is known as a substrate for a light emitting device, and a technique for dividing an aggregated large laminated substrate into individual pieces is also known.

[0004] For example, in order to prevent misalignment of the bonding material and the copper circuit plate during bonding, a method has been reported in which a planar ceramic substrate that can be formed by arranging multiple ceramic substrates is aligned and bonded to the substrate using a positioning jig and a temporary fixing material, and then the ceramic substrate is divided between the copper circuit plates to produce multiple substrates (see, for example, Patent Document 1).

[0005] Also, in order to suppress warping and deformation during the manufacture of large-sized substrates, a slitted circuit substrate has been reported in which dividing grooves are provided on the circuit side or both main sides of a ceramic circuit substrate, the dividing grooves being 1.0 mm or more away from the ends of the circuit pattern, and the bottom thickness of the dividing grooves being 0.2 to 0.5 mm (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2014-175425 A [Patent Document 2] JP 2005-129625 A Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present disclosure is to provide a bonded substrate that reduces the occurrence of internal peeling and chipping and has excellent thermal conductivity, and a method for manufacturing the same. [Means for solving the problem]

[0008] A bonded substrate according to one embodiment of the present disclosure includes a metal plate, a first ceramic, and a first metal body disposed between a first surface of the metal plate and a first surface of the first ceramic, and on 80% or more of a side surface connected to the first surface of the first ceramic.

[0009] Moreover, a light emitting device according to an embodiment of the present disclosure includes the bonded substrate and a light emitting element disposed on the bonded substrate.

[0010] Furthermore, a manufacturing method for a bonded substrate according to one embodiment of the present disclosure includes: placing a first bonding material in the recess and on the first surface of a first ceramic plate having a first surface, a recess recessed from the first surface, and a second surface opposite the first surface; placing the first surface of the first ceramic plate and a first surface of a metal plate via the first bonding material; firing the first ceramic plate, the first bonding material, and the metal plate; polishing or grinding the second surface of the first ceramic plate in a laminate in which the first bonding material becomes a first metal body by the firing and the metal plate and the first ceramic plate are bonded together by the first metal body; and cutting the laminate from the metal plate toward the first ceramic plate so as to pass through the first metal body arranged in the recess in the laminate in which a portion of the first metal body is exposed from the first ceramic plate by the polishing or grinding.

[0011] Furthermore, a manufacturing method for a light emitting device according to an embodiment of the present disclosure includes manufacturing a bonded substrate by the manufacturing method for a bonded substrate, and arranging a light emitting element on the bonded substrate. Effect of the Invention

[0012] According to an embodiment of the present disclosure, it is possible to provide a bonded substrate that reduces the occurrence of internal peeling and chipping and has excellent thermal conductivity, and a manufacturing method thereof. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a side view illustrating an example of a bonded substrate according to the present embodiment. [Diagram 2] FIG. 2 is a bottom view illustrating an example of a bonded substrate according to the present embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a side view diagrammatically illustrating another example of a bonded substrate according to the present embodiment. [Diagram 5] FIG. 11 is a bottom view illustrating a schematic diagram of another example of a bonded substrate according to the present embodiment. [Figure 6] 6 is a cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] 1 is a perspective view showing a schematic diagram of a light-emitting module according to an embodiment of the present invention; [Figure 8] 1 is a perspective view showing a schematic diagram of a light-emitting module according to an embodiment of the present invention with a portion of the configuration thereof omitted. [Figure 9] 1 is a plan view showing a schematic diagram of a light-emitting module according to an embodiment of the present invention; [Figure 10] 8 is a cross-sectional view taken along line XX in FIG. 7. [Figure 11] 10 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12] 4 is a flowchart showing an example of a method for manufacturing a bonded substrate according to the present embodiment. [Figure 13] 10 is a flowchart showing another example of the method for manufacturing a bonded substrate according to the embodiment. [Figure 14] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 15]3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 16] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 17] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 18] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 19] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 20] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 21] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 22] 3A to 3C are cross-sectional views each showing a schematic diagram of a manufacturing process in a method for manufacturing a bonded substrate according to the present embodiment. [Figure 23] FIG. 2 is a cross-sectional view showing a schematic example of a bonded substrate according to the present embodiment disposed on a second substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, a manufacturing method according to an embodiment of the present invention, a bonded substrate (hereinafter sometimes referred to as a "bonded substrate according to an embodiment") obtained by the manufacturing method, and a light-emitting device (hereinafter sometimes referred to as a "light-emitting device according to an embodiment") will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "upper", "lower", and other terms including these terms) are used as necessary. However, the use of these terms is for the purpose of facilitating understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of these terms. In addition, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or members.

[0015] In addition, the embodiments shown below are examples of laminated substrates, light-emitting devices, etc. for embodying the technical ideas of the present invention, and do not limit the present invention to the following. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are intended to be illustrative, and not to limit the scope of the present invention, unless otherwise specified. In addition, the contents described in one embodiment can be applied to other embodiments and modified examples. In addition, the size and positional relationship of the members shown in the drawings may be exaggerated to clarify the explanation. In addition, in order to avoid the drawings becoming overly complicated, a schematic diagram in which some elements are omitted, or an end view showing only the cut surface as a cross-sectional view may be used.

[0016] <Bonded Substrate According to the Embodiment> A bonded substrate 1, which is an example of a bonded substrate according to an embodiment, will be described with reference to Figs. 1 to 3. Fig. 1 is a side view that shows the bonded substrate 1. Fig. 2 is a bottom view that shows the bonded substrate 1. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2.

[0017] The laminated substrate 1 has a metal plate 3, a first ceramic 4, and a first metal body 5, and the first metal body 5 is disposed between a first surface 3A of the metal plate 3 and a first surface 4A of the first ceramic 4, as well as over 80% of a side surface 4C connected to the first surface 4A of the first ceramic 4.

[0018] Fig. 4 to Fig. 6 are diagrams illustrating a bonded substrate 2 which is another example of the bonded substrate according to the embodiment. Fig. 4 is a side view illustrating the bonded substrate 2. Fig. 5 is a bottom view illustrating the bonded substrate 2. Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 5.

[0019] The bonded substrate 2 is an embodiment in which the bonded substrate 1 further includes a second ceramic 6 and a second metal body 7. The bonded substrate 2 includes a metal plate 3, a first ceramic 4, a first metal body 5, a second ceramic 6, and a second metal body 7. The first metal body 5 is disposed between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and on 80% or more of the side surface 4C connected to the first surface 4A of the first ceramic 4. The second metal body 7 is disposed between the second surface 3B of the metal plate 3 and the first surface 6A of the second ceramic 6.

[0020] Hereinafter, the configurations of the bonded substrate 1 and the bonded substrate 2 will be described.

[0021] (metal plate) The metal plate 3 is a metal plate having excellent heat dissipation properties. The metal plate 3 has a first surface 3A and a second surface 3B opposite to the first surface 3A. The shape of the metal plate 3 in a plan view is, for example, rectangular, and is not particularly limited.

[0022] The metal plate 3 is preferably a metal such as copper, nickel, aluminum, molybdenum, or a laminate of two or more of these metals, or an alloy of two or more of these metals. The thickness of the metal plate 3 can be, for example, from 100 μm to 700 μm, and is preferably from 300 μm to 500 μm.

[0023] (First Ceramics) The first ceramic 4 is an insulating, plate-like member. The first ceramic 4 has a first surface 4A, a second surface 4B opposite to the first surface 4A, and a side surface 4C other than the first surface 4A and the second surface 4B. The shape of the first ceramic 4 in plan view is, for example, rectangular, and the first metal body 5 is disposed on 80% or more, preferably 90% or more, and more preferably 100% of the side surface 4C of the first ceramic 4. Disposing the first metal body 5 on 100% of the side surface 4C of the first ceramic 4 means that the first metal body 5 covers the entire circumference of the side surface 4C of the first ceramic 4. The thickness of the first ceramic 4 can be, for example, 50 μm or more and 300 μm or less, and preferably 80 μm or more and 150 μm or less.

[0024] The first ceramic 4 is fired and shaped, and is not in a softened state before firing. The first ceramic 4 may be formed by firing ceramics, or a commercially available product may be used. The first ceramic 4 may be a ceramic containing at least one of silicon nitride, aluminum nitride, boron nitride, magnesium oxide, and aluminum oxide, and preferably contains silicon nitride or aluminum nitride. The first ceramic 4 is preferably a nitride-based ceramic such as silicon nitride, aluminum nitride, or boron nitride, but may be an oxide-based ceramic such as aluminum oxide, silicon oxide, calcium oxide, or magnesium oxide. The first ceramic 4 may also be beryllium oxide, silicon carbide, mullite, borosilicate glass, or the like.

[0025] (first metal body) The first metal body 5 is a metal body formed by sintering the first bonding material 5a. The first metal body 5 is disposed between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and on 80% or more of the side surface 4C connected to the first surface 4A of the first ceramic 4. The first metal body 5 is preferably disposed over the entire surface (100%) of the first surface 3A of the metal plate 3. The first metal body 5 is preferably disposed over the entire surface (100%) of the side surface 4C of the first ceramic 4.

[0026] The first metal body 5 is mainly composed of metal and contains at least one of Cu, Cr, Ni, Ag, Al, Zn, Sn, and an Ag-Cu alloy. The first metal body 5 contains Ag and Cu, and the total content of Ag and Cu is preferably 80 mass % or more of the entire first metal body 5. Furthermore, the first metal body 5 preferably further contains an active metal element such as Ti, Ce, Zr, or Mg.

[0027] (Second Ceramics) The second ceramic 6 is an insulating, plate-like member. The second ceramic 6 has a first surface 6A and a second surface 6B opposite to the first surface 6A. The shape of the second ceramic 6 in a plan view is, for example, rectangular, and is not particularly limited. The material, shape, etc. of the second ceramic 6 can be appropriately selected from the items described for the first ceramic 4.

[0028] (Second metal body) The second metal body 7 is a metal body formed by sintering the second bonding material 7a. The second metal body 7 is disposed between the second surface 3B of the metal plate 3 and the first surface 6A of the second ceramic 6. The second metal body 7 is preferably disposed over the entire surface (100%) of the second surface 3B of the metal plate 3. The components of the second metal body 7 can be appropriately selected from those described for the first metal body 5.

[0029] In the bonded substrate 1, the thermal conductivity of the first metal body 5 is preferably higher than that of the first ceramic 4. In addition, in the bonded substrate 2, the thermal conductivity of the first metal body 5 is preferably higher than that of the first ceramic 4 and that of the second ceramic 6.

[0030] In the bonded substrate 1, the side surface of the metal plate 3 and the side surface of the first metal body 5 are preferably flush with each other. In the bonded substrate 2, the side surface of the metal plate 3 and the side surfaces of the first metal body 5 and the second ceramic 6 are preferably flush with each other.

[0031] In the laminated substrate 1 and the laminated substrate 2 having the above configuration, the first metal body 5 is disposed between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and on 80% or more of the side surface 4C connected to the first surface 4A of the first ceramic 4, so that the metal body is disposed on the bottom surface and the edge portion of the laminated substrate 1 and the laminated substrate 2. As a result, when mounted on another mounting substrate using a conductive paste, for example, a fillet can be formed, and the laminated substrate 1 and the laminated substrate 2 having excellent thermal conductivity can be provided. In other words, the conductive paste such as silver paste wets the first metal body 5 disposed on the side surface 4C of the first ceramic 4 to form a fillet, and a thermal conduction path that does not pass through the first ceramic 4 is formed, so that the thermal conductivity is further improved.

[0032] Moreover, the bonded substrate 1 and the bonded substrate 2 can reduce the occurrence of peeling and chipping, particularly inside the first ceramic 4. Furthermore, the bonded substrate 1 and the bonded substrate 2 can suppress warping of the metal plate 3, and the bonded substrate 2 can further suppress warping of the metal plate.

[0033] <Light-emitting device according to an embodiment> The light emitting device 100 according to the embodiment includes the bonded substrate 1 or the bonded substrate 2 according to the embodiment, and a light emitting element 30 disposed on the bonded substrate 1 or the bonded substrate 2. The light emitting device 100 preferably further includes a covering member 70 disposed around the light emitting element 30.

[0034] Fig. 7 is a perspective view showing a light emitting module according to the present embodiment. Fig. 8 is a perspective view showing a light emitting module according to the present embodiment with a portion of the configuration omitted. Fig. 9 is a plan view showing a light emitting module according to the present embodiment. Fig. 10 is a cross-sectional view taken along line XX in Fig. 7. Fig. 11 is a cross-sectional view taken along line XI-XI in Fig. 7.

[0035] As shown in Figures 7 to 11, the light emitting device 100 of this embodiment has a first substrate 10, which is a laminated substrate of this embodiment, a second substrate 20, a light emitting element 30, a wire 40, a first frame portion 50, a second frame portion 60, and a covering member 70.

[0036] The light emitting device 100 may include a light-transmitting member 80 that covers the upper surfaces of the multiple light emitting elements 30. The light emitting device 100 may also include a reflective member 90 that exposes the upper surfaces of the multiple light emitting elements 30 and covers the side surfaces in an element mounting region 10r of the upper surface 10a of the first substrate 10. Hereinafter, a case in which the light emitting device 100 includes the light-transmitting member 80 and the reflective member 90 will be described.

[0037] In Fig. 8, for convenience of illustration, parts of the covering member 70, the first frame portion 50, the second frame portion 60, and the light-transmitting member 80 are omitted, and parts of the wire 40 and the light-emitting element 30 are visualized. In Fig. 9, for convenience of illustration, the covering member 70 is omitted, and the wire 40, the first frame portion 50, the second frame portion 60, and the like are visualized.

[0038] The first substrate 10 has an element mounting region 10r and a first terminal 11 arranged outside the element mounting region 10r on its upper surface 10a. A light emitting element 30 is arranged in the element mounting region 10r of the first substrate 10. The second substrate 20 has a substrate mounting region 20r on which the first substrate 10 is mounted, and a second terminal 22 arranged outside the substrate mounting region 20r on its upper surface 20a.

[0039] The first substrate 10 is placed on the substrate mounting region 20r of the second substrate 20. A first frame portion 50 surrounding the element mounting region 10r is disposed on the inside of the first terminals 11 on the upper surface 10a of the first substrate 10. A second frame portion 60 surrounding the first substrate 10 is disposed on the outside of the second terminals 22 on the upper surface 20a of the second substrate 20.

[0040] The first terminal 11 of the first substrate 10 is electrically connected to the second terminal 22 of the second substrate 20 by the wire 40. The first terminal 11, the second terminal 22, and the wire 40 are located between the first frame portion 50 and the second frame portion 60 in a plan view. The first terminal 11, the second terminal 22, and the wire 40 are covered by a covering member 70.

[0041] (Light emitting element) The light emitting element 30 is, for example, substantially rectangular in plan view. The light emitting element 30 can be, for example, square in plan view with one side of 40 μm to 100 μm. The light emitting element 30 includes a semiconductor laminate and positive and negative electrodes disposed on the surface of the semiconductor laminate. The light emitting element 30 includes positive and negative electrodes on the same side, and is flip-chip mounted on the first substrate 10 with the surface including the electrodes as the lower surface. In this case, the upper surface opposite to the surface on which the electrodes are disposed is the main light extraction surface of the light emitting element 30. In the light emitting device 100, the light emitting elements 30 are mounted on the first substrate 10 in a line arrangement with a predetermined interval therebetween in each of the row and column directions. The size and number of the light emitting elements 30 to be used can be appropriately selected depending on the form of the light emitting module to be obtained. In particular, it is preferable to mount a larger number of smaller light emitting elements 30 at a higher density. This makes it possible to control the irradiation range of the light emitted from the light emitting device 100 with a larger number of divisions. Such a light emitting device 100 can be used as a light source for a high-resolution lighting system. For example, the number of light emitting elements 30 included in the light emitting device 100 can be set to 1,000 or more and 20,000 or less.

[0042] The light emitting element 30 can be selected from those with any wavelength. For example, a light emitting element 30 that emits blue light or green light can be selected from those with nitride semiconductors (In X Al Y Ga 1-X-YN, 0≦X, 0≦Y, X+Y≦1) can be selected. As the light emitting element 30 that emits red light, a semiconductor represented by GaAlAs or AlInGaP can be used. Furthermore, a semiconductor light emitting element made of a material other than these can also be used. The composition and emitted color of the light emitting element 30 used can be appropriately selected depending on the purpose.

[0043] The light emitting element 30 is bonded to the wiring arranged in the element mounting region 10r of the first substrate 10 by a conductive bonding member. When the light emitting element 30 is flip-chip mounted on the first substrate 10, bumps made of metal materials such as Au, Ag, Cu, and Al can be used as the bonding member. In addition, solder such as AuSn alloy and Sn-based lead-free solder can be used as the bonding member. In addition, a conductive adhesive material containing conductive particles such as metal in resin can be used as the bonding member. A plating method may be used to bond the light emitting element 30 to the first substrate 10. For example, Cu can be used as a plating material. In addition, the electrode of the light emitting element 30 and the wiring of the first substrate 10 may be directly connected to each other without a bonding member.

[0044] (Covering material) The covering member 70 is a light-shielding member that covers the wires 40 on the outer side of the element mounting region 10r. As an example, the covering member 70 is arranged in a frame shape in a plan view so as to cover the wires 40 and surround the element mounting region 10r. The covering member 70 is arranged so as to be in contact with the first frame portion 50 and the second frame portion 60.

[0045] The covering member 70 is disposed apart from the light emitting element 30 in plan view. The distance between the light emitting element 30 and the covering member 70 may be 100 μm or more and 500 μm or less. In addition, in plan view, the width of the covering member 70 located on the long side of the first substrate 10 is wider than the width of the covering member 70 located on the short side of the first substrate 10. It is preferable that the height of the covering member 70 (i.e., the distance from the upper surface 20a of the second substrate 20 to the upper surface of the covering member 70) is disposed so that it is highest directly above the top 40t of the wire 40. In other words, it is preferable that the covering member 70 is disposed so that the top 70t of the covering member 70 overlaps the top 40t of the wire 40. It is also preferable that the position of the top 70t of the covering member 70 is disposed so as to be located above the top of the first frame portion 50. In this specification, the width of the covering member 70 located on the long side and short side of the first substrate 10 refers to the width in a direction perpendicular to the long side and short side of the first substrate 10 in a plan view. Also, the height of the covering member 70 refers to the distance from the top surface of the second substrate 20 to the top surface of the covering member 70.

[0046] Examples of the covering member 70 include resins containing fillers with light-shielding properties. Examples of the resin base material include silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, and acrylic resins. Examples of the fillers with light-shielding properties include light-absorbing substances such as pigments, carbon black, titanium black, and graphite, and light-reflecting substances such as titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass fillers. Specifically, the exterior color of the covering member 70 may be white with excellent light reflectivity, black with excellent light absorption, or gray with light reflectivity and light absorption properties. The covering member 70 may also be formed by laminating a plurality of resin layers. In particular, in consideration of deterioration of the resin due to light absorption, it is preferable that the covering member 70 use a white resin with light reflectivity at least on the outermost surface.

[0047] The light emitting device 100 having the above configuration can be used as a light source for a vehicle headlight, for example. In this case, for example, a configuration is adopted in which light is emitted from the light source to the outside via a lens. In the light emitting device 100, the light emitting elements 30 are turned on by an external power switch. Note that the light emitting device 100 is configured so that some or all of the preset light emitting elements 30 can be individually driven.

[0048] <Method for manufacturing bonded substrate according to embodiment> A manufacturing method for a bonded substrate according to a first embodiment includes: arranging a first bonding material in the recess and on the first surface of a first ceramic plate having a first surface, a recess recessed from the first surface, and a second surface opposite the first surface; arranging the first surface of the first ceramic plate and a first surface of a metal plate via the first bonding material; firing the first ceramic plate, the first bonding material, and the metal plate; polishing or grinding the second surface of the first ceramic plate in a laminate in which the first bonding material becomes a first metal body by the firing and the metal plate and the first ceramic plate are bonded together by the first metal body; and cutting the laminate from the metal plate toward the first ceramic plate so as to pass through the first metal body arranged in the recess in the laminate in which a portion of the first metal body is exposed from the first ceramic plate by the polishing or grinding. This makes it possible to suitably manufacture the bonded substrate 1 of this embodiment.

[0049] A manufacturing method of a bonded substrate according to a second embodiment includes: before the firing, arranging the first surface of a second ceramic plate and a second surface of the metal plate opposite the first surface via a second bonding material; in the firing, firing the second bonding material and the second ceramic plate together with the first ceramic plate, the first bonding material, and the metal plate; in the polishing or grinding, the laminate further includes the second bonding material becoming a second metal body by the firing, and the metal plate and the second ceramic plate being bonded together by the second metal body; and in the cutting, cutting the laminate in which the second ceramic plate, the second metal body, the metal plate, the first metal body, and the first ceramic plate are bonded together from the second ceramic plate toward the metal plate and the first ceramic plate. This allows the bonded substrate 2 of this embodiment to be suitably manufactured.

[0050] Fig. 12 is a flowchart showing a method S1 for manufacturing a bonded substrate according to the first embodiment. Fig. 13 is a flowchart showing a method S2 for manufacturing a bonded substrate according to the second embodiment.

[0051] 14 to 22 are diagrams that diagrammatically show an example of the manufacturing steps in the manufacturing method of the light-emitting module according to the present embodiment. Specifically, Fig. 14 to Fig. 22 are cross-sectional views that illustrate the manufacturing steps in the manufacturing method of the bonded substrate. In the explanation of the manufacturing method, "preparing" a member is not limited to manufacturing the member, but also includes acquiring the member, such as purchasing the member or receiving the member.

[0052] (Place the first bonding material) The step of placing the first bonding material (S10) involves placing a first bonding material 5a in the recess 4D of a first ceramic plate 4a having a first surface 4A, a recess 4D recessed from the first surface 4A, and a second surface 4B opposite the first surface 4A, and on the first surface 4A (see Figures 14 and 15).

[0053] The first ceramic plate 4a may be a plate made by firing a predetermined green sheet or ceramic powder, which has been solidified and fired. The recesses 4D are preferably formed by irradiating a laser after firing the ceramics, or by polishing or grinding with a dicer, but may also be formed by forming recesses in a green sheet before firing and firing the green sheet. The first ceramic plate 4a may also be a plate made by stacking a plurality of predetermined green sheets. The inner wall of the recesses 4D becomes the side surface 4C of the first ceramic 4.

[0054] FIG. 14 is a cross-sectional view showing a first ceramic plate 4a having a first surface 4A, a recess 4D recessed from the first surface 4A, and a second surface 4B opposite to the first surface 4A. Here, for simplification, the first ceramic plate 4a including one first ceramic 4 in the width direction of FIG. 14 is shown, but the first ceramic plate 4a may include an aggregate of a plurality of first ceramics 4 in the width direction and depth direction of FIG. 14. The recess 4D can be appropriately formed so as to have a planar shape of the first ceramic 4 in the intended bonded substrate. For example, by using a first ceramic plate 4a in which the recess 4D is lattice-shaped in top view, a large number of bonded substrates can be manufactured.

[0055] The recesses 4D in the first ceramic plate 4a having the recesses 4D can be formed by processing such as laser processing and dicing. The cross-sectional shape of the recesses 4D may be rectangular or tapered. The width of the recesses 4D can be appropriately selected depending on the accuracy of polishing or grinding, and can be, for example, 50 μm or more and 300 μm or less. The depth of the recesses 4D can be, for example, 50 μm or more and 300 μm or less, and preferably 80 μm or more and 150 μm or less.

[0056] Next, the first bonding material 5a is placed in the recess 4D and on the first surface 4A of the first ceramic plate 4a as shown in Fig. 15. The first bonding material 5a can be placed by, for example, screen printing.

[0057] The first bonding material 5a is a member containing metal and having fluidity, and is preferably an active metal brazing material. The first bonding material 5a can be applied and disposed so as to be in close contact with the inside of the recess 4D and the surface of the first surface 4A. Here, the first bonding material 5a is disposed so as to fill the recess 4D and also to be applied to the first surface 4A, so that the surface of the first bonding material 5a is not uneven. The first bonding material 5a is preferably disposed so as to have a uniform thickness from the first surface 4A. The first bonding material 5a becomes the first metal body 5 by firing.

[0058] The first bonding material 5a includes at least one selected from Cu, Cr, Ni, Ag, Al, Zn, Sn, and an Ag-Cu alloy. Among these, an Ag-Cu alloy is preferred because it can be fired at a relatively low temperature of 780° C. to 850° C. In addition, at least one of Cu and Ag, which have high electrical conductivity, is preferred.

[0059] The first bonding material 5a preferably contains an active metal powder. The active metal powder may be at least one selected from TiH2, CeH2, ZrH2, and MgH2. Among these, TiH2 is preferable. By containing TiH2, it reacts with the nitrogen contained in the first ceramic plate 4a and forms a metal compound layer that becomes a reaction layer such as TiN at the interface with the first ceramic plate 4a. This improves the adhesion between the first metal body 5 formed by firing the first bonding material 5a and the first ceramic plate 4a, and the first metal body 5 is firmly adhered to the inside of the recess 4D and the first surface 4A.

[0060] The first bonding material 5a may contain an organic binder. The viscosity of the first bonding material 5a can be adjusted by the type and amount of the organic binder. The organic binder may be, for example, a solvent generally used as a conductive paste, or a resin material such as acrylic, epoxy, urethane, ethyl cellulose, silicone, phenol, polyimide, polyurethane, melamine, or urea. The organic binder is decomposed and evaporated by firing, which will be described later.

[0061] The first bonding material 5a may contain an inorganic filler other than metal. By containing an inorganic filler, the volumetric shrinkage of the first bonding material 5a during firing can be reduced. As the inorganic filler, for example, AlN, Si3N4, etc. can be used.

[0062] In terms of mass% relative to the total amount of the first bonding material 5a, the total content of silver and copper is preferably 80 mass% or more, the content of TiH2 as the metal active powder is preferably 0.5 mass% or more and 10 mass% or less, the content of the organic binder is preferably 0.1 mass% or more and 10 mass% or less, and the content of the inorganic filler is preferably 1 mass% or more and 20 mass% or less.

[0063] (Placing the metal plate) In the step S20 of arranging the metal plate, the first surface 4A of the first ceramic plate 4a and the first surface 3A of the metal plate 3a are arranged via the first bonding material 5a (see FIG. 16). This allows a pre-fired laminate for producing the bonded substrate 1 to be obtained. The metal plate 3a may be an assembly of a plurality of metal plates 3, which are cut into individual metal plates 3 as described below.

[0064] (Place the second ceramic plate) In the method for producing a bonded substrate according to the second embodiment, when a bonded substrate 2 further having a second ceramic 6 and a second metal body 7 is produced from the bonded substrate 1, the method further includes arranging a second ceramic plate 6a (S25) (see FIG. 17). This makes it possible to obtain a pre-fired laminate for producing the bonded substrate 2.

[0065] In the step S25 of arranging the second ceramic plate 6a, before the firing, the first surface 6A of the second ceramic plate 6a and the second surface 3B of the metal plate 3a are arranged via the second bonding material 7a.

[0066] The second bonding material 7a is a member containing metal and having fluidity, and is preferably an active metal brazing material. The second bonding material 7a may be applied to the first surface 6A of the second ceramic plate 6a or may be applied to the second surface 3B of the metal plate 3a, and can be appropriately selected.

[0067] The components of the second bonding material 7a can be appropriately selected from those described for the first bonding material 5a.

[0068] The first bonding material 5a disposed in the recess 4D of the first ceramic plate 4a and on the first surface 4A may be the same as or different from the second bonding material 7a disposed on the first surface 6A side of the second ceramic plate 6a, but is preferably the same. The first bonding material 5a preferably has a lower content of organic solvent than the second bonding material 7a, and preferably has a smaller volume shrinkage rate associated with drying during firing.

[0069] (Firing) Next, in firing S30, the first bonding material 5a and the second bonding material 7a are fired to obtain a layered body having the first metal body 5 and the second metal body 7 (see FIG. 18).

[0070] In the firing step S30, the first bonding material 5a is fired to bond the first ceramic plate 4a and the metal plate 3a together. The first bonding material 5a is fired to obtain the first metal body 5.

[0071] In the method for producing a bonded substrate of the second embodiment, the first bonding material 5a and the second bonding material 7a are fired to bond the first ceramic plate 4a and the metal plate 3a, and the second ceramic plate 6a and the metal plate 3a. Here, Fig. 17 and Fig. 18 are diagrams showing the laminate before and after firing, respectively, in the method for producing a bonded substrate of the second embodiment.

[0072] The firing temperature can be 700° C. or higher and 1200° C. or lower, and preferably 800° C. or higher and 1100° C. or lower. -5 It is preferable to use a vacuum atmosphere of 0.1 Pa or less or an Ar atmosphere of 99.9% or more.

[0073] By firing the first bonding material 5a and the second bonding material 7a, the organic solvent is decomposed and volatilized and removed. By removing the organic solvent, the volumes of the first metal body 5 and the second metal body 7 shrink relative to the volumes of the first bonding material 5a and the second bonding material 7a. To prevent the first metal body 5 and the second metal body 7 from deforming or peeling off from the first ceramic plate 4a and the second ceramic plate 6a in the resulting fired laminate due to this shrinkage, and to reduce warping of the first ceramic plate 4a and the second ceramic plate 6a, it is preferable to perform firing under load. The load is set to, for example, 0.001 kg / cm in the stacking direction so that the load on the laminate before firing is uniform. 2 More than 2kg / cm 2 It can be as follows:

[0074] Moreover, by firing, a metal compound layer containing a reaction product of the nonmetallic element contained in the first ceramic plate 4a and the second ceramic plate 6a and the active metal element contained in the first bonding material 5a and the second bonding material 7a is formed. That is, the first metal body 5 has a metal compound layer that changes from the active metal powder at the interface between the first ceramic plate 4a and the first metal body 5. When the second metal body 7 is included, the second metal body 7 has a metal compound layer that changes from the active metal powder at the interface between the second ceramic plate 6a and the second metal body 7. Here, it is preferable that the metal compound layer contains TiN, which is a reaction product of the nitrogen contained in the first ceramic plate 4a and the second ceramic plate 6a and the TiH2 contained in the active metal powder of the first bonding material 5a and the second bonding material 7a. The first ceramic plate 4a and the first metal body 5 and the second ceramic plate 6a and the second metal body 7 each have a metal compound layer at the interface, thereby improving the reliability of the bonding.

[0075] (Polishing or grinding) Next, in polishing or grinding S40, the second surface 4B of the first ceramic plate 4a is polished or ground in the obtained fired laminate (see FIG. 18). By polishing or grinding, a laminate is obtained in which a part of the first metal body 5 is exposed from the first ceramic plate 4a (see FIG. 19).

[0076] The polishing or grinding step S40 involves polishing or grinding the second surface 4B of the first ceramic plate 4a in a laminate in which the first bonding material 5a becomes the first metal body 5 by firing and the metal plate 3a and the first ceramic plate 4a are bonded together by the first metal body 5.

[0077] In the polishing or grinding step S40 of the manufacturing method for a bonded substrate according to the second embodiment, the laminate is further fired so that the second bonding material 7a becomes a second metal body 7, and the metal plate 3a and the first ceramic plate 4a are bonded together by the second metal body 7. Furthermore, the second surface 6B of the second ceramic plate 6a may be polished or ground.

[0078] It is preferable that second surface 4B of first ceramic plate 4a and first metal body 5 are polished or ground so that second surface 4B of first ceramic plate 4a and the exposed surface of first metal body 5 are flush with each other.

[0079] (Plating) After polishing or grinding and before cutting, the method may optionally further include plating S45 on the resulting polished or ground laminate (see FIG. 19) (see FIG. 22).

[0080] In plating S45, after polishing or grinding and before cutting, a first conductive member 8 is placed on the second surface 4B of the first ceramic plate 4a and the exposed surface 5A of the first metal body 5, and plating 8a is applied to the first conductive member 8 (see FIG. 22).

[0081] The first conductive member 8 can be formed by, for example, sputtering a metal such as copper. The plating 8a can be formed by electroless plating, and a plated wiring can be formed. Metal sputtering and plating may be performed through a mask.

[0082] Furthermore, in the manufacturing method of the bonded substrate of the second embodiment, it is preferable to include disposing a second conductive member 9 on the second surface 6B of the second ceramic plate 6a after polishing or grinding and before cutting. Furthermore, plating 9a may be applied to the second conductive member 9 (see FIG. 22).

[0083] (Cutting the laminate) In cutting the laminate S50, the obtained polished or ground laminate (see FIG. 19) is cut (see FIG. 20) to obtain individual bonded substrates (see FIG. 21). The laminate before cutting is preferably an aggregate of a plurality of bonded substrates.

[0084] In the manufacturing method of the bonded substrate of the second embodiment, cutting the laminate (S50) involves cutting the laminate from the metal plate 3a toward the first ceramic plate 4a so as to pass through the first metal body 5 arranged in the recess 4D in a laminate in which a portion of the first metal body 5 has been exposed from the first ceramic plate 4a by polishing or grinding (see the dashed arrow in Figure 20).

[0085] In the manufacturing method of the bonded substrate of the second embodiment, cutting the laminate (S50) involves cutting the laminate in which the second ceramic plate 6a, the second metal body 7, the metal plate 3a, the first metal body 5, and the first ceramic plate 4a are bonded together from the second ceramic plate 6a toward the metal plate 3a and the first ceramic plate 4a (see the dashed arrow in Figure 20).

[0086] It is preferable to cut the laminate by at least one of irradiation with a water jet laser and dicing with a dicer. The cutting is performed in the stacking direction of the laminate along the shape of the pre-formed recess 4D so as to pass through the first metal body 5 arranged in the recess 4D of the first ceramic plate 4a.

[0087] The manufacturing method for a bonded substrate having the above-mentioned configuration can particularly reduce the occurrence of interlayer delamination between the first ceramic 4 and the metal plate 3 and chipping of the first ceramic 4, and can manufacture a bonded substrate with reduced internal delamination and chipping.

[0088] Here, the inventors have found the following problems with the conventional technology through their research. That is, when a conventional large-sized substrate in which a copper plate is sandwiched between two ceramic plates via an active metal brazing material is used and cut from the copper plate toward the ceramic plate by irradiation with a water jet laser or dicing with a dicer, there are problems such as peeling between the ceramic plate and the copper plate and chipping inside the ceramic plate. The method for manufacturing a bonded substrate of this embodiment, in particular by removing the first ceramic plate 4a at the cut location in advance and replacing it with the first metal body 5, has been found to be capable of solving the problems with the conventional technology and producing a bonded substrate with reduced internal peeling and chipping.

[0089] Moreover, the method for manufacturing a bonded substrate according to the present embodiment can manufacture a bonded substrate having excellent thermal conductivity. That is, in the manufactured bonded substrate, the first metal body 5 is disposed between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and on 80% or more of the side surface 4C connected to the first surface 4A of the first ceramic 4, so that the first metal body 5 is disposed on the bottom surface and peripheral portion of the bonded substrate, and therefore when the substrate is mounted on another mounting substrate using, for example, a conductive paste, a fillet can be formed, and a bonded substrate having excellent thermal conductivity can be manufactured.

[0090] <Method of Manufacturing the Light-Emitting Device According to the Embodiment> The method for manufacturing a light emitting device according to the embodiment includes manufacturing a bonded substrate by the method for manufacturing a bonded substrate according to the embodiment described above (S1 or S2), and arranging a light emitting element on the bonded substrate.

[0091] (Placing the light-emitting element) Arranging the light-emitting element S3 can be achieved by simply arranging the light-emitting element 30 on the bonded substrate, and a conventionally known method can be appropriately selected. For example, the light-emitting element may be arranged after the bonded substrate is manufactured, or during the manufacturing process of the bonded substrate.

[0092] When arranging a light emitting element in the manufacturing process of the bonded substrate, for example, as shown in Fig. 22, a second conductive member 9 may be arranged on the second surface 6B of the second ceramic plate 6a of the laminated body after polishing or grinding and before cutting, and a light emitting element 30 may be arranged on the laminated body obtained by further plating 9a on the second conductive member 9 via, for example, a conductive bonding member. Thereafter, the laminated body is cut in the direction of the dashed arrow in Fig. 22 to obtain individual bonded substrates.

[0093] As shown in Figure 23, when the laminated substrate of this embodiment is mounted on the second substrate 20 using conductive paste 25, the first metal body 5 is positioned between the first surface of the metal plate 3 and the first surface of the first ceramic 4, and on 80% or more of the side surface 4C connected to the first surface 4A of the first ceramic 4, and since the metal body is positioned on the bottom surface and peripheral portion of the laminated substrate, a fillet can be formed and a laminated substrate with excellent thermal conductivity can be manufactured.

[0094] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0095] In addition to the above-described embodiment, the following supplementary notes are further disclosed. (Appendix 1) A metal plate; First ceramics; A laminated substrate having a first metal body disposed between the first surface of the metal plate and the first surface of the first ceramic, and on 80% or more of the side surface connected to the first surface of the first ceramic. (Appendix 2) The second ceramic; 2. The laminated substrate according to claim 1, further comprising a second metal body disposed between a second surface of the metal plate opposite the first surface and the first surface of the second ceramic. (Appendix 3) the first metal body includes silver and copper, 3. The laminated substrate according to claim 1, wherein the total content of silver and copper is 80 mass % or more of the first metal body as a whole. (Appendix 4) 4. The laminated substrate according to claim 1, wherein the first metal body has a thermal conductivity higher than a thermal conductivity of the first ceramic. (Appendix 5) 5. The bonded substrate according to claim 1, wherein the first metal body is disposed over the entire side surface of the first ceramic. (Appendix 6) 6. The bonded substrate according to claim 1, wherein the first metal body is disposed on the entire surface of the first surface of the metal plate. (Appendix 7) 7. The laminated substrate according to claim 1, wherein a side surface of the metal plate and a side surface of the first metal body are flush with each other. (Appendix 8) A laminated substrate according to any one of appendix 1 to 7, A light emitting device comprising: a light emitting element disposed on the bonded substrate. (Appendix 9) 9. The light emitting device according to claim 8, further comprising a covering member disposed around the light emitting element. (Appendix 10) A first ceramic plate has a first surface, a recess recessed from the first surface, and a second surface opposite to the first surface; a first bonding material is disposed in the recess and on the first surface; Arranging the first surface of the first ceramic plate and the first surface of a metal plate via the first bonding material; Firing the first ceramic plate, the first bonding material, and the metal plate; The first bonding material becomes a first metal body by the firing, and in a laminate in which the metal plate and the first ceramic plate are bonded together by the first metal body, polishing or grinding the second surface of the first ceramic plate; and cutting the laminate from the metal plate toward the first ceramic plate so as to pass through the first metal body arranged in the recess, in the laminate in which a portion of the first metal body is exposed from the first ceramic plate by the polishing or grinding. (Appendix 11) Before the firing, the first surface of the second ceramic plate and a second surface of the metal plate opposite to the first surface are arranged via a second bonding material; In the firing, the second bonding material and the second ceramic plate are fired together with the first ceramic plate, the first bonding material, and the metal plate; In the polishing or grinding, the laminate is further formed such that the second bonding material becomes a second metal body by the firing, and the metal plate and the second ceramic plate are bonded together by the second metal body, The method for manufacturing a bonded substrate according to claim 10, wherein the cutting includes cutting the laminate in which the second ceramic plate, the second metal body, the metal plate, the first metal body, and the first ceramic plate are bonded together from the second ceramic plate toward the metal plate and the first ceramic plate. (Appendix 12) 12. The method for producing a laminated substrate according to claim 10 or 11, wherein in the cutting, the laminate is cut by at least one of irradiation with a water jet laser and dicing with a dicer. (Appendix 13) 13. The method for producing a laminated substrate according to any one of claims 10 to 12, wherein in the placing, the first bonding material is an active metal brazing material. (Appendix 14) 14. The method for producing a bonded substrate according to any one of claims 10 to 13, wherein the firing is performed at a firing temperature of 800°C or higher and 1100°C or lower. (Appendix 15) A method for manufacturing a bonded substrate described in any one of Appendix 10 to 14, wherein, in the polishing or grinding, the second surface of the first ceramic plate and the first metal body are polished or ground so that the second surface of the first ceramic plate and the exposed surface of the first metal body are flush with each other. (Appendix 16) The method for manufacturing a bonded substrate described in Appendix 15, further comprising, after the polishing or grinding and before the cutting, placing a first conductive member on the second surface of the first ceramic plate and the exposed surface of the first metal body, and plating the first conductive member. (Appendix 17) 12. The method for producing a bonded substrate according to claim 11, further comprising arranging a second conductive member on the second surface of the second ceramic plate after the polishing or grinding and before the cutting. (Appendix 18) 18. The method for manufacturing a bonded substrate according to any one of claims 10 to 17, wherein, in disposing a first bonding material in the recesses and on the first surface of the first ceramic plate, the recesses on the first surface of the first ceramic plate have a lattice shape when viewed from above. (Appendix 19) Producing a laminated substrate by the method for producing a laminated substrate according to any one of claims 10 to 18; and arranging a light emitting element on the bonded substrate. [Explanation of symbols]

[0096] 1 Laminated substrate 2 Laminated substrate 3 metal plate 3a metal plate 3A 1st page 3B 2nd side 4. First Ceramics 4a First ceramic plate 4A 1st page 4B 2nd side 4C side 4D Recess 5 First metal body 5a 1st bonding material 5A Exposed surface 6. Second Ceramics 6a Second ceramic plate 6A 1st page 6B 2nd side 7 Second metal body 7a Second bonding material 8 First conductive member 8a Plating 9 Second conductive member 9a Plating 10 First board 10a top surface 10r Element mounting area 11 1st terminal 20 Second board 20a top surface 20r Substrate placement area 22 2nd terminal 25 Conductive Paste 30 Light emitting element 40 Wire 40t top 50 First frame 60 Second frame section 70 Covering material 70t top 80 Translucent material 90 Reflective material 100 Light emitting device

Claims

1. A metal plate; A first ceramic; A laminated substrate having a first metal body disposed between the first surface of the metal plate and the first surface of the first ceramic, and on 80% or more of a side surface connected to the first surface of the first ceramic.

2. A second ceramic; and The bonded substrate according to claim 1 , further comprising: a second metal body disposed between a second surface of the metal plate opposite to the first surface and the first surface of the second ceramic.

3. the first metal body includes silver and copper, 3 . The laminated substrate according to claim 1 , wherein the total content of silver and copper is 80 mass % or more of the first metal body as a whole.

4. The bonded substrate according to claim 1 , wherein the first metal body has a thermal conductivity higher than a thermal conductivity of the first ceramic.

5. The bonded substrate according to claim 1 , wherein the first metal body is disposed over the entire side surface of the first ceramic.

6. The bonded substrate according to claim 1 , wherein the first metal body is disposed over the entire first surface of the metal plate.

7. The bonded substrate according to claim 1 , wherein a side surface of the metal plate and a side surface of the first metal body are flush with each other.

8. A laminated substrate according to claim 1 or 2, A light emitting device comprising: a light emitting element disposed on the bonded substrate.

9. The light emitting device according to claim 8 , further comprising a covering member disposed around the light emitting element.

10. A first ceramic plate has a first surface, a recess recessed from the first surface, and a second surface opposite to the first surface; and a first bonding material is disposed in the recess and on the first surface; Arranging the first surface of the first ceramic plate and a first surface of a metal plate via the first bonding material; Firing the first ceramic plate, the first bonding material, and the metal plate; The first bonding material becomes a first metal body by the firing, and in a laminate in which the metal plate and the first ceramic plate are bonded together by the first metal body, polishing or grinding the second surface of the first ceramic plate; and cutting the laminate from the metal plate toward the first ceramic plate so as to pass through the first metal body arranged in the recess, in the laminate in which a portion of the first metal body is exposed from the first ceramic plate by the polishing or grinding.

11. Before the firing, the first surface of the second ceramic plate and a second surface of the metal plate opposite to the first surface are arranged via a second bonding material; In the firing, the second bonding material and the second ceramic plate are fired together with the first ceramic plate, the first bonding material, and the metal plate; In the polishing or grinding, the laminate is further formed such that the second bonding material becomes a second metal body by the firing, and the metal plate and the second ceramic plate are bonded together by the second metal body, 11. The method for manufacturing a bonded substrate according to claim 10, wherein the cutting step includes cutting the laminate in which the second ceramic plate, the second metal body, the metal plate, the first metal body, and the first ceramic plate are bonded together from the second ceramic plate toward the metal plate and the first ceramic plate.

12. The method for producing a bonded substrate according to claim 10 or 11, wherein in the cutting, the laminate is cut by at least one of irradiation with a water jet laser and dicing with a dicer.

13. The method for manufacturing a laminated substrate according to claim 10 or 11, wherein in the disposing, the first bonding material is an active metal brazing material.

14. The method for producing a bonded substrate according to claim 10 or 11, wherein the firing temperature is 800° C. or more and 1100° C. or less.

15. The method for manufacturing a laminated substrate according to claim 10 or 11, wherein in the polishing or grinding, the second surface of the first ceramic plate and the first metal body are polished or ground so that the second surface of the first ceramic plate and the exposed surface of the first metal body are flush with each other.

16. 16. The method for manufacturing a laminated substrate according to claim 15, further comprising: after the polishing or grinding and before the cutting, arranging a first conductive member on the second surface of the first ceramic plate and the exposed surface of the first metal body, and plating the first conductive member.

17. The method for producing a bonded substrate according to claim 11 , further comprising arranging a second conductive member on the second surface of the second ceramic plate after the polishing or grinding and before the cutting.

18. 12. The method for manufacturing a laminated substrate according to claim 10, wherein, in disposing a first bonding material in the recesses and on the first surface of the first ceramic plate, the recesses in the first surface of the first ceramic plate are lattice-shaped when viewed from above.

19. Manufacturing a bonded substrate by the method for manufacturing a bonded substrate according to claim 10 or 11; and arranging a light emitting element on the bonded substrate.

Images