Manufacturing method for touch panel

Abstract

To provide a touch panel capable of displaying and sensing along a curved surface, or a touch panel with high detection sensitivity even when curved along a curved surface.SOLUTION: A display panel with flexibility is disposed along a curved surface of a supporter having the curved surface on a surface, a first film layer is pasted by an adhesive layer along a surface of the display panel, second to n-th film layers (n is an integer of 2 or more) are sequentially pasted by the adhesive layer along a surface of the first film layer, and a touch sensor with flexibility is pasted by the adhesive layer along a surface of the n-th film layer.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] One aspect of the present invention relates to a display device. In particular, the display device is flexible and displays images along a curved surface. Further, one embodiment of the present invention relates to a touch panel. The present invention also relates to a touch panel that is flexible and can be arranged along a curved surface. One aspect relates to an electronic device including a display unit.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the present invention more specifically disclosed herein The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, The driving method thereof or the manufacturing method thereof can be given as an example. [Background technology]

[0003] In recent years, display devices are expected to be used for a variety of purposes, and diversification is required. For example, the development of smartphones and tablet devices equipped with touch panels as mobile information terminals. is currently underway.

[0004] In addition, Patent Document 1 discloses a film substrate on which transistors and other semiconductor devices are mounted as switching elements. A flexible active matrix type light emitting device having an organic EL element is disclosed. . [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2003-174153 A Summary of the Invention [Problem to be solved by the invention]

[0006] As an electronic device equipped with a touch panel, the touch panel is arranged along the curved surface of the housing. It is expected that this will enable the addition of new functions and applications that have never been seen before. Therefore, a user interface and a display device that has been thinned to a degree that the display device has flexibility are required. Therefore, there is a demand for touch panels that have the added function of allowing input by touching the screen with a finger or the like.

[0007] One aspect of the present invention is a touch panel capable of performing display and sensing along a curved surface. It is also an object of the present invention to provide a sensor that has high detection sensitivity even when bent along a curved surface. It is an object of the present invention to provide a touch panel having a curved surface. It is an object of the present invention to provide an electronic device capable of detecting and sensing a signal. One of the objectives of the present invention is to provide an electronic device having a good detection sensitivity of a touch panel even on a curved surface. Let us assume that.

[0008] Another object of the present invention is to provide a novel display device. Another object of the present invention is to provide a novel touch panel. Another object of the present invention is to provide a novel electronic device.

[0009] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. Problems other than those mentioned above are not necessarily solved. It will become clear from the description of the specification, etc., and problems other than those mentioned above will not be identified from the description of the specification, etc. It is possible to extract [Means for solving the problem]

[0010] According to one aspect of the present invention, a display panel having flexibility is formed along a curved surface of a support having a curved surface. A process of placing the panel on the display panel and attaching a film layer to the surface of the display panel using an adhesive layer. and attaching a flexible touch sensor to the surface of the film layer by means of an adhesive layer. and attaching a conductive film to the touch panel.

[0011] In another aspect of the present invention, a flexible support is provided along the curved surface of the support. and attaching a first filter to the display panel by an adhesive layer along the surface of the display panel. a step of attaching a film layer to the first film layer; and a step of attaching a second film layer to the first film layer by an adhesive layer along the surface of the first film layer. A step of sequentially attaching n film layers (n is an integer of 2 or more) and a step of attaching the surface of the nth film layer and attaching a flexible touch sensor to the touch panel by an adhesive layer along the touch panel. This is a method for manufacturing a touch panel.

[0012] In addition, after the step of attaching the touch sensor, a n-th the step of laminating n+1 to m-th film layers (m being an integer of n+1 or more) in order; is preferred.

[0013] Another aspect of the present invention is a display device comprising a display panel and first to n-th film layers (n is 2 or more). A touch panel including a configuration in which a touch sensor is stacked in order, The panel has a curved surface and maintains its shape even without a support. It is a touch panel that maintains the same image quality.

[0014] In the above touch panel, the display panel has a thickness of 1 μm or more and 300 μm or less. The touch sensor has a thickness of 1 μm or more and 300 μm or less, and the film layer has a thickness of It is preferable that the thickness is 1 μm or more and 300 μm or less.

[0015] In the above touch panel, the display panel, the first to nth film layers, and the touch panel Two adjacent touch sensors are bonded together with an adhesive layer, the thickness of which is It is preferable that the thickness is 300 nm or more and 300 μm or less. Effect of the Invention

[0016] According to one aspect of the present invention, a touch panel capable of displaying and sensing along a curved surface is provided. Alternatively, a touch panel that has high detection sensitivity even when bent along a curved surface can be provided. We can provide a touch panel.

[0017] Alternatively, a novel display device (display panel), touch sensor, or touch panel can be provided. The description of these effects does not preclude the existence of other effects. It is not necessary for one embodiment of the present invention to have all of these effects. The effects are self-evident from the description in the specification, drawings, claims, etc. Other effects can be extracted from the descriptions in the drawings, claims, etc. [Brief description of the drawings]

[0018] [Figure 1] 1 shows an example of the configuration of an electronic device and an example of the configuration of a touch panel. [Diagram 2] An example of a touch panel configuration. [Diagram 3] An example of a touch panel configuration. [Figure 4] 1A to 1C are diagrams illustrating an example of a method for manufacturing a touch panel. [Diagram 5] Example of electronic device configuration. [Figure 6] 1 shows an example of a touch sensor configuration. [Figure 7] 1 shows an example of a touch sensor configuration. [Figure 8] An example of a display panel configuration. [Figure 9] 1 shows an example of a circuit configuration that can be applied to a display panel. [Figure 10] An example of a display panel configuration. [Figure 11] An example of a display panel configuration. [Figure 12] 13 shows configuration examples of electronic devices and lighting devices. [Figure 13] Example of electronic device configuration. [Figure 14] FIG. 11 is a diagram illustrating a layered structure according to the third embodiment. [Figure 15] 11 is a photograph of a touch panel according to Example 3. [Figure 16] 1 is a circuit diagram and a timing chart according to a first embodiment. [Figure 17] FIG. 2 is a circuit diagram according to the first embodiment. [Figure 18] 4 shows input / output characteristics according to the first embodiment. [Figure 19] 6 is a calculation result of the output characteristics of the circuit according to the first embodiment. [Figure 20] 5A to 5C are photographs showing the state during measurement and the measurement results of electromagnetic noise according to Example 1. [Figure 21] FIG. 11 is a schematic top view of an evaluation element according to Example 2. [Figure 22] 6 is a measurement result of resistance value according to Example 2. [Figure 23] 11 shows output characteristics of a touch sensor according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the present invention can be realized by the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0020] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and the repeated explanations are omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be used.

[0021] In each figure described in this specification, the size, layer thickness, or area of ​​each component is indicated by the following formula: The figures may be exaggerated for clarity and are not necessarily limited to scale. stomach.

[0022] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The numbers are added for the purpose of convenience and are not intended to be limiting.

[0023] (Embodiment 1) In this embodiment, a touch panel according to one embodiment of the present invention and an electronic device including the touch panel will be described. An example of the device will now be described with reference to the drawings.

[0024] [Configuration example] 1(A1) and 1(A2) are schematic perspective views of an electronic device 10. 1(A1) shows the front, right side, and top of the electronic device 10, and FIG. 1(A2) shows the back, left side, and In addition, in the cutting line AB shown in Figures 1(A1) and 1(A2), the A side is the electron microscope. Side A is the front side of device 10, and side B is the rear side of electronic device 10.

[0025] The electronic device 10 includes a touch panel 100 that is provided on the surface of a housing 101 so as to be capable of displaying information. The touch panel 100 is provided on the top surface, the back surface, the front surface, the bottom surface, the right surface, the left surface, the Of the six faces, some areas of the top, front, and back faces are placed along the surface. In addition, the housing 101 has a curved surface at least on which the touch panel 100 is disposed. Yes.

[0026] FIG. 1(B) is a schematic cross-sectional view taken along line AB in FIG. 1(A1) and (A2). The cutting line AB cuts the housing 101 in a region including a curved surface.

[0027] The touch panel 100 is provided along the surface of a support 103. The support 103 is The touch panel 100 is covered with a light-transmitting exterior member. 102 is provided. The touch panel 100 of the housing 101 overlaps at least the display part. In the region, it is preferable that a light-transmitting exterior member 102 is applied. 3 and the exterior member 102 may be part of the housing 101.

[0028] The curved surface of the support 103 is obtained by deforming a flat surface without expanding or contracting it. It is preferable that the surface be a developable surface.

[0029] The support 103 has a function of maintaining the shape of the touch panel 100. A material having a higher rigidity than the panel 100 can be used. For example, resin, glass, or Metals and the like can be used.

[0030] The support 103 is used as a support for the touch panel 100 in a manufacturing process example of the touch panel 100 described later. The support for defining the shape of the housing 101 may be used. If the support 103 is not necessary in the portion, it may not be provided. It may be a part of it.

[0031] The exterior member 102 can be made of a light-transmitting material, such as glass or acrylic. In addition, the surface of the exterior member 102 may be used as a touch surface. In order to achieve this function, it is preferable that the exterior member 102 is made of an insulating material. The use of such a material is preferable because it can improve the detection sensitivity of the touch panel 100 .

[0032] In addition, when the surface of the touch panel 100 is to function as a touch surface, the exterior member 10 The touch panel 100 may be configured so that the surface thereof is exposed without providing the touch panel 2. It is preferable to coat the surface of the chip panel 100 with a highly hard material.

[0033] FIG. 1(C) is an enlarged schematic cross-sectional view of the area surrounded by the dashed line in FIG. 1(B). FIG. 2(A) is a schematic diagram showing the components shown in FIG. 1(C) in an expanded (separated) form.

[0034] The touch panel 100 includes a display panel 111, a touch sensor 112, and a plurality of films. A display panel 111 is disposed on the support 103 side, and an exterior member 102 is disposed on the support 103 side. A touch sensor 112 is located on the side of the display panel 110, and these are stacked. Between the film 111 and the touch sensor 112, there are n layers (n is an integer of 2 or more). Hereinafter, the display panel 111 and the touch sensor 112 are sandwiched between the display panel 111 and the touch sensor 112. Among the multiple film layers supported, the film layer closest to the display panel 111 side is The closest one is the film layer 113(2), and so on. The layer close to 112 will be referred to as film layer 113(n). When there is no need to distinguish between the individual film layers, they will simply be referred to as film layer 113.

[0035] As shown in FIG. 1C, the two film layers 113 are bonded together by an adhesive layer 114. It is preferable that the film layer 113(1) and the display panel 111 are bonded together. Similarly, the film layer 113(n) and the touch sensor 112 are bonded by an adhesive layer 114. It is preferable that the above is done.

[0036] The display panel 111 is flexible and is provided along the surface of the support 103. The film layer 113(1) is provided along the surface of the display panel 111. 13(2) is provided along the surface of the film layer 113(1). Layer 113(n) is provided along the surface of film layer 113(n-1). Sensors 112 are disposed along the surface of film layer 113(n).

[0037] In this way, a plurality of film layers 113 are provided between the display panel 111 and the touch sensor 112. By sandwiching the display panel 111 and the touch sensor 112, the distance between the display panel 111 and the touch sensor 112 can be increased. By doing so, the wiring and electrodes constituting the display panel 111 and the touch sensor 11 It is possible to reduce the parasitic capacitance between the wiring and electrodes that constitute the display. Noise generated when the panel 111 is driven affects the touch sensor 112. As a result, the problem of the detection sensitivity of the touch sensor 112 decreasing can be suppressed.

[0038] In order to increase the distance between the display panel 111 and the touch sensor 112, the display panel 111 and the touch sensor 112 are integrated. By sandwiching multiple film layers 113, the spacer is prevented from being broken. Therefore, noise from the display panel 111 is easily scattered between the multiple film layers 113. In some cases, the influence on the touch sensor 112 may be reduced.

[0039] The display panel 111 has a thickness of 1 μm to 300 μm, preferably 3 μm to 200 μm. It is preferable that the thickness is 5 to 100 μm, and more preferably 5 to 100 μm. It is preferable that the thickness is about 50 μm.

[0040] The touch sensor 112 has a thickness of, for example, 1 μm or more and 300 μm or less, preferably 3 μm or less. The thickness is preferably from 5 μm to 200 μm, and more preferably from 5 μm to 100 μm. Typically, it is preferably about 50 μm.

[0041] If the thickness of the display panel 111 or the touch sensor 112 is less than 1 μm, The mechanical strength of the touch sensor 111 or the touch sensor 112 is insufficient, and the cause of the damage is In addition, if the thickness is greater than 500 μm, the flexibility is poor. In addition, the difference between the inner diameter and the outer diameter becomes large when the display panel 111 or the display panel 110 is bent. The stress on the touch sensor 112 increases, and the display panel 111 or the touch sensor 112 There is a risk that the substrate having the semiconductor device and wiring and elements provided on the substrate may be damaged.

[0042] The thickness of the film layer 113 may be appropriately set depending on the number of layers and the radius of curvature of the curved surface, etc. , 300 μm or less, preferably 250 μm or less, more preferably 200 μm or less, Preferably 150 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. m or less, and 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, More preferably, the thickness is 20 μm or more. The thinner the film layer 113, the smaller the bending angle. However, it is easy to provide the display panel 111 and the touch sensor 11 along a curved surface having a radius of curvature. Increasing the distance between 2 may complicate the manufacturing process due to the increased number of layers. If the thickness exceeds 500 μm, the film may become too thin depending on the radius of curvature of the curved surface of the support 103. There is a risk that wrinkles, cracks, etc. may occur on the surface of layer 113.

[0043] The thickness of the adhesive layer 114 is 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less, more preferably 50 μm or less, and 300 nm or more, preferably It may be 1 μm or more, more preferably 5 μm or more, and further preferably 10 μm or more.

[0044] It is preferable that the film layer 113 and the adhesive layer 114 are made of a material having a low relative dielectric constant. By using such a film layer 113, the touch sensor 112 and the display panel 111 can be easily connected. It is possible to reduce the number of film layers 113 stacked while reducing the parasitic capacitance between the film layers 113. For example, the material constituting the film layer 113 or the adhesive layer 114 has a relative dielectric constant of 2.0 or more. and 10.0 or less, preferably 2.0 or more and 5.0 or less, more preferably 2.0 or more and 4.5 or less. It is preferable to use a material having a viscosity of 2.0 or more and more preferably 4.0 or less.

[0045] The material used for the film layer 113 and the adhesive layer 114 should have a high transmittance for visible light. It is preferable that the wavelength of the light is within the visible light range (for example, light having a wavelength of 400 nm or more and 700 nm or less). transmittance to the It is preferable to use a material with a refractive index of 90% or more.

[0046] The film layer 113 can be made of a light-transmitting insulating material. For example, Either an organic insulating material or an inorganic insulating material can be used. The material used may be in the form of a sheet, or a viscous material may be used. Alternatively, the insulating material may be a mixture of two or more organic insulating materials, or the mixture may be a mixture of two or more organic insulating materials. It may be a laminated structure of two or more inorganic insulating materials, or an organic insulating material and an inorganic insulating material. A laminated structure in which the layers are combined may also be used.

[0047] The material used for the film layer 113 is, for example, polyethylene terephthalate (PET). ), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin , polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, poly Examples include styrene resin, polyamide-imide resin, and polyvinyl chloride resin. It is preferable to use a material with a low thermal expansion coefficient, for example, a material with a thermal expansion coefficient of 30×10 -6 / K or later The following polyamide-imide resin, polyimide resin, PET, etc. can be suitably used. In addition, resin-impregnated fibrous substrates (also called prepregs) and inorganic fillers are used to make organic resins. It is also possible to use substrates that have been mixed with grease to reduce their thermal expansion coefficient.

[0048] When the above-mentioned materials contain fibrous bodies, the fibrous bodies are made of high strength organic or inorganic compounds. High strength fibers are specifically fibers with high tensile modulus or Young's modulus. Representative examples are polyvinyl alcohol fibers, polyester fibers, and polyvinyl alcohol fibers. Mid fiber, polyethylene fiber, aramid fiber, polyparaphenylene benzobisoxy Examples of the fiberglass include Sasol fiber, glass fiber, and carbon fiber. Examples of glass fibers include those made of glass fiber such as sappan, S-glass, D-glass, and Q-glass. Alternatively, it is used in the form of a nonwoven fabric, and the structure in which the fiber body is impregnated with resin and the resin is hardened is made flexible. As a substrate having flexibility, a substrate made of a fiber body and a resin may be used. The use of a structure is preferable because it improves reliability against damage caused by bending or local pressure. stomach.

[0049] The material used for the adhesive layer 114 may be a material having adhesiveness, or a thermosetting resin or a photocurable resin. Resins, two-liquid mixed curable resins, and other curable resins can be used. Resins such as urethane, epoxy, silicone resins, or resins with siloxane bonds Fat can be used.

[0050] In addition, when a material having adhesive properties is used as the film layer 113, the adhesive layer 114 and Similar materials can be used, in which case adhesive layer 114 may not be used.

[0051] As described above, the thinner the film layer 113, the smaller the curvature ratio of the curved surface of the support 103. In addition, when the radius of curvature is large, a relatively thick film is required. Layer 113 may be used.

[0052] Here, the thickness of the film layer 113 is T, and the curvature radius of the part of the support 103 with the smallest curvature radius is When the radius of curvature is R, the ratio T / R is, for example, 0.2 or less, preferably 0. The thickness of the film layer 113 is set to be 1 or less, more preferably 0.05 or less. For example, when the radius of curvature R is 4 mm and the thickness T of the film layer 113 is 100 μm, , the value of T / R is 0.025.

[0053] In reality, the thickness of the film layer 111 and the thickness of the adhesive layer 114 are different from each other. Since the radius of curvature when bending 13 is large, the allowable thickness of the film layer 113 is It may be larger than the above range. Layer 113(1) has the smallest thickness tolerance.

[0054] If the multiple film layers 113 are made of the same material and have the same thickness, the manufacturing cost is reduced. In addition, the touch sensor 11 may be formed of a plurality of film layers 113. A film closer to 2 may be used which is thicker.

[0055] As shown in FIG. 2(B), a material in which a film layer 113 and an adhesive layer 114 are integrated is used. For example, the film layer 113 may have a sticky adhesive layer 114 on one or both sides. In this case, the film layer 1 closest to the touch sensor 112 may be an adhesive film. 13(n), or the film layer 113(1) closest to the display panel 111, may include a touch sensor. Adhesive layers are provided on both sides of the film layer 113 to adhere to the sensor 112 or the display panel 111. It is preferable to use a film having a thickness of 114.

[0056] As shown in FIG. 3, an adhesive layer 11 is provided between the touch sensor 112 and the exterior member 102. Alternatively, one or more film layers 113 may be provided via the film layer 14. 13, the distance between the exterior member 102 functioning as the touch surface and the touch sensor 112 This allows easy adjustment of the circuit design for driving the touch panel 100. This makes it possible to easily optimize the detection sensitivity of touch panel 100 without having to adjust the touch sensitivity.

[0057] In FIG. 3, two film layers 113 are sandwiched between the exterior member 102 and the touch sensor 112. Here, the touch sensor 112 is sandwiched between the exterior member 102 and the touch sensor 112. Among the multiple film layers supported, the film layer closest to the exterior member 102 side is called the film layer 113(m) (m is an integer equal to or greater than n+1), and the film layer closest to the touch sensor 112 is denoted as film layer 113(n+1).

[0058] [Example of how to create] Next, an example of a method for producing touch panel 100 will be described with reference to FIG.

[0059] First, the support 103 is prepared. The support 103 is a member to be later incorporated into the housing 101. Alternatively, when the touch panel 100 is mounted on the housing 101, When a support member other than the housing 101 is used or when a part of the housing 101 is used as the support member, A functional support 103 may be used.

[0060] Next, the display panel 111 is curved and placed along the surface of the support 103 (FIG. 4( At this time, the support 103 and the display panel 111 are bonded to each other with adhesive or pressure sensitive adhesive. It is preferable to fix the touch panel 100 to the support 103 by using a fixing member such as a fixing member. In this case, it is preferable to use an adhesive or pressure sensitive adhesive that can be easily peeled off.

[0061] Next, along the surface of the display panel 111, the film layer 113 is attached to the adhesive layer 114 (not shown). At this time, the film layer 113 is attached to the surface (FIGS. 4(B1) and 4(B2)). The film layer 113 is disposed so that the end portion of the film layer 113 is located outside the display panel 111 so as to cover the entire display panel 111. It is preferable to attach the film so that it is positioned on the side of the film.

[0062] In this manner, the process of attaching the film layer 113 is repeated for each of the film layers 113. By performing this process, a laminated structure of a plurality of film layers 113 can be formed.

[0063] Next, a tape is applied along the surface of the film layer 113 (specifically, the film layer 113(n)). The touch sensor 112 is attached by an adhesive layer 114 (not shown) (FIG. 4(C1), ( C2).

[0064] As shown in FIG. 3, a film layer is further provided along the surface of the touch sensor 112. In this case, the same process as for the film layer 113 may be carried out.

[0065] FIG. 4(D) shows the state where the touch panel 100 is removed from the support 103. Even when removed from the support 103, the touch panel 100 maintains its shape. It is possible.

[0066] Through the above steps, the touch panel 100 can be manufactured.

[0067] Here, for example, along a flat surface, a display panel 111, n film layers 113, and The touch panel is formed by stacking the touch sensor 112 in this order, and the touch panel is then aligned along the support 103. In the case where the touch sensor 112 is curved, the touch sensor 112 located farthest from the support 103 is curved. However, as the touch sensor 112 is bent, an external force is generated in the direction of the tension, and the touch sensor 112 is damaged. This may happen.

[0068] However, the display panel 111, the n film layers 1 13, and the touch sensor 112 are sequentially provided on the display panel 111. When the display panel 1 or the touch sensor 112 is curved, the stress applied thereto is reduced, and The substrate constituting the touch sensor 11 or the touch sensor 112, or the wiring and elements provided on the substrate, etc. This reduces damage and allows for a highly reliable touch panel 100 to be achieved.

[0069] In addition, the display panel 111, the film layer 113, or the touch sensor 112 may be arranged along a curved surface. When bending the material, the stress applied to them increases according to their thickness. The thicknesses of the display panel 111, the n film layers 113, and the touch sensor 112 are The thickness is thin enough that stress due to its own thickness does not cause failure.

[0070] In addition, when a flat touch panel is curved, the curved shape is maintained without a support. However, the present fabrication method The touch panel 100 thus fabricated is removed from the support 103 as shown in FIG. Even when the curved shape is not supported by the support 103, the curved shape is maintained. It is possible.

[0071] In addition, when a flat touch panel is curved and fixed to a support, Since the coil is constantly under stress, there is a risk that its long-term reliability may deteriorate. However, in the touch panel 100 produced by this example of the production method, the curved shape is maintained. Therefore, unintended stress is not applied to the touch panel 100, resulting in a highly reliable touch panel. 100 can be achieved.

[0072] In addition, by applying this example of the manufacturing method, the distance between the display panel 111 and the touch sensor 112 There is no limit to the number of film layers 113 to increase the thickness. When the number of layers is extremely increased and the distance between the display panel 111 and the touch sensor 112 is increased, Even if the touch panel is flat, the curved shape can be maintained without any problems. When the panel is curved, the distance between the display panel 111 and the touch sensor 112 is increased. This will damage the touch sensor 112.

[0073] In addition, by applying this manufacturing method example, the display panel 111 and the touch sensor Since the stress applied to the electrodes 112 and the like can be made extremely small, when the touch panel 100 is curved, The tolerance of the radius of curvature can be made extremely small. Even when the touch sensor 112 is pressed against the display panel 111, the distance between the display panel 111 and the touch sensor 112 is set sufficiently large. This makes it possible to improve the detection sensitivity of touch panel 100.

[0074] In the above description, the display surface side of the touch panel 100 (the side on which the touch sensor 112 is provided) The above description is given of a case where the display surface side is convex, but the present invention is also applicable to a case where the display surface side is concave. Can be used.

[0075] [About electronic devices] FIG. 5 shows an electronic device in which the position of the touch panel 100 is different from that in FIGS. 1(A1) and 1(A2). 5(A1) and (A2), the case 101 is touched over most of its rear surface. 5B1 and 5B2, the right side of the housing 101 is provided with a switch panel 100. A touch panel 100 is provided across the front and left side surfaces of the device. In 1) and (C2), the housing 101 is rotated from the rear to the right side, front, and left side, and then back again. An example in which a touch panel 100 is provided across the entire surface is shown.

[0076] The shape of the electronic device is not limited to this, and a touch panel may be provided along the curved surface of the housing. In this embodiment, the surface of the housing is convex. However, it is also possible to use a concave shape or a shape that includes both convex and concave shapes, such as a wave. The same can be applied to the surface shape of the mold.

[0077] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0078] (Embodiment 2) In this embodiment, a touch sensor that can be applied to the touch panel of one embodiment of the present invention will be described. Next, an example of the sensor and the display panel will be described.

[0079] [Touch sensor] 6 is a perspective schematic diagram of the touch sensor 112. FIG. 7 is a cross-sectional view of the touch sensor 112 taken along a line CD in FIG. FIG. 1 is a schematic cross-sectional view taken along line EF.

[0080] As the touch sensor 112, for example, a capacitive touch sensor can be used. Capacitive touch panels include surface capacitive touch panels and projected capacitive touch panels. There are two types of methods, self-capacitance type and mutual capacitance type, mainly depending on the driving method. The capacitive method is preferable because it allows simultaneous multi-point detection. A case where a touch sensor of the above type is applied will be described.

[0081] The touch sensor 112 is formed by connecting a plurality of substrates 201 and 202, both of which are flexible. The electrode 221 and the plurality of electrodes 222 are connected to one of the plurality of wirings 211. The electrode 222 is electrically connected to one of the plurality of wirings 212. 11 and wiring 212 extend to the outer periphery of the substrate 201 and are connected to a flexible printed circuit board (FPC). The NI 8110 is electrically connected to a NI 8110-printed circuit (PCI-Printed Circuit) 205.

[0082] The electrode 221 has a shape extending in one direction. The electrode 221 is sandwiched between two electrodes 222. Electrical connection is made by the intersecting wiring 223. Also, the wiring 223 and the electrode 221 A dielectric layer 224 is provided between the wiring 222 and the touch sensor 112 to form a capacitance. A plurality of electrodes 222 electrically connected by 23 are arranged in one direction. By arranging a plurality of electrodes 221 in a direction intersecting the direction of the magnetron, a plurality of capacitances are formed. The structure is arranged in a trix shape.

[0083] The electrode 221, the electrode 222, and the wiring 223 preferably have light-transmitting properties. As shown in FIG. 6, the electrodes 221 and 222 are arranged so that there is as little space as possible between them. It is preferable to arrange the electrodes 221 and 222 in such a way that the gaps between the electrodes 221 and 222 are not formed. Alternatively, a dummy electrode including the same conductive film as the wiring 223 may be provided. By minimizing the gap between the electrode 221 and the electrode 222, the unevenness of the transmittance can be reduced. As a result, unevenness in the luminance of light passing through the touch sensor 112 can be reduced.

[0084] Examples of the conductive material having a light-transmitting property include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide doped with gallium, or graphite A phenomenology can be used.

[0085] After forming a film of a conductive material having light transmitting properties on the substrate 201 by a sputtering method, By using various patterning techniques such as lithography, unnecessary parts are removed to form the electrode 22. 1, electrodes 222 and wiring 223 can be formed. Graphene can be produced by a method other than CVD. Alternatively, the graphene oxide may be dispersed in a solution, which is then reduced to form the graphene oxide.

[0086] The wiring 212 is electrically connected to the electrode 222. The surface of the FPC 205 is exposed at the connecting layer 255. The wiring 211 electrically connected to the electrode 221 can be electrically connected to the This can be considered as a configuration.

[0087] The wiring 211 and the wiring 212 may be made of, for example, aluminum, gold, platinum, silver, nickel, etc. Titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, etc. The above-mentioned metal materials and alloy materials containing these metal materials can be used.

[0088] The connection layer 255 is an anisotropic conductive film (ACF). Conductive Film) and Anisotropic Conductive Paste (ACP) c Conductive Paste) can be used.

[0089] In the cross-sectional configuration example shown in FIG. 7(A), an electrode 221 and an electrode 222 are formed on an insulating layer 220. The substrate 201 and the insulating layer 220 are bonded to each other via an adhesive layer 231. In addition, the substrate 202 and the substrate 201 on which the electrodes and the like are provided are bonded by an adhesive layer 232. It is being done.

[0090] The adhesive layer 231 and the adhesive layer 232 are translucent. Specifically, acrylic, urethane, epoxy, or siloxane bonded materials can be used. Resins having such a structure can be used.

[0091] In addition, it is preferable that a protective layer 235 is provided on the surface of the substrate 202. 35 can also be called a ceramic coat, and is used to apply a touch sensor 112 to a finger or stylus. In particular, the exterior member 102 has a function of protecting the surface of the substrate 202 when the substrate 202 is operated. The protective layer 235 is preferably made of, for example, silicon oxide, aluminum oxide, Uses inorganic insulating materials such as yttrium oxide and yttria-stabilized zirconia (YSZ) The protective layer 235 can be formed by a sputtering method, a sol-gel method, or the like. In particular, when the protective layer 235 is formed by the aerosol deposition method, it is possible to form the protective layer 235 with high density at a low temperature. This is preferable because it is possible to form a thin film and increase the mechanical strength.

[0092] The protective layer 235 may be provided at least on the touch surface side. Although the case where 35 is provided on the surface of the substrate 202 has been shown, it may be provided on the surface of the substrate 201 .

[0093] In addition, the adhesive layer 231 may not be provided. 7C shows a structure in which an insulating layer 220 is provided on the insulating layer 220. In this embodiment, the electrode 220 is not provided, and the electrodes 221, 222, etc. are provided on the substrate 201. The configuration is shown.

[0094] This concludes the explanation of the touch sensor.

[0095] [Display Panel] FIG. 8 is a schematic perspective view of the display panel 111. As shown in FIG.

[0096] The display panel 111 includes a display unit 491 including a plurality of pixels and a display unit for supplying signals and power to the display unit 491. The display portion 491 includes a pixel having a transistor and a display It is preferable that the display device includes a display element. Representative examples of the display element include an organic EL element and a liquid crystal element. , electronic ink, electronic liquid powder, electrophoretic elements, etc. can be used.

[0097] In addition, in FIG. 8, the display panel 111 includes not only a display unit 491 but also a driving circuit 493. The driver circuit 493 may be, for example, a scanning line driver circuit or a signal line driver circuit. A circuit that functions as such can be applied.

[0098] When a scanning line driver circuit is used as the driver circuit 493, for example, a circuit as shown in FIG. Circuit A shown in FIG. 9 includes transistors M1 to M15. Each transistor is made up of a semiconductor having a channel formed therein. It is preferable that an oxide semiconductor be used as the transistor. By using such a transistor in a circuit, Reduces shoot-through current compared to when using CMOS circuits made of low-temperature polysilicon, etc. This makes it possible to reduce noise generated by the circuit. The detection sensitivity of 0 can be improved.

[0099] The wiring 457 in FIG. 8 is electrically connected to the FPC 495. A signal and power for driving the display panel 111 can be supplied from the wiring 457 to the can.

[0100] In addition, in FIG. 8, IC470 is mounted on FPC495 using the COF method. The IC470 is used as a scanning line driver circuit or a signal line driver circuit. In addition, the display panel 111 may include a scanning line driver circuit and a signal line driver circuit. In some cases, the device has a circuit that functions as a driving circuit, and in other cases, the device has a circuit that functions as a scanning line driving circuit or a signal line driving circuit. A circuit for driving the display panel 111 is provided externally, and a signal for driving the display panel 111 is sent via the FPC 495. When inputting, the IC 470 may not be provided.

[0101] [Cross-sectional configuration example 1] An example of the cross-sectional structure of the display panel 111 will be described below. A case where a light emitting device using an organic EL element as 111 is applied will be described.

[0102] FIG. 10(A) shows a schematic cross-sectional view taken along the cutting lines GH, IJ, and KL shown in FIG. The display panel shown in Figure 10(A) is a top-emission type display using a color-coded method. It is a panel.

[0103] The display panel shown in FIG. 10A includes a display portion 491, a driver circuit 493, and an FPC 495. The organic EL elements and transistors included in the display unit 491 and the driving circuit 493 are formed on the substrate 4 20, the substrate 428, and the adhesive layer 407.

[0104] The display panel shown in FIG. 10(A) includes a substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a A resistor 455, an insulating layer 463, an insulating layer 465, an insulating layer 405, an organic EL element 450 (lower The electrode 401, the EL layer 402, and the upper electrode 403, the adhesive layer 407, the substrate 428, and the wiring The substrate 428, the adhesive layer 407, and the top electrode 403 are transparent to visible light. .

[0105] In the display portion 491 of the display panel shown in FIG. 10(A), an adhesive layer 422 and an insulating layer 424 are A transistor 455 and an organic EL element 450 are provided on the substrate 420 via the light emitting diode 451. The organic EL element 450 includes a lower electrode 401 on an insulating layer 465 and an EL layer 402 on the lower electrode 401. 402 and an upper electrode 403 on the EL layer 402. The lower electrode 401 is a transistor The lower electrode 401 is electrically connected to the source electrode or drain electrode of the lower electrode 455. The end of the lower electrode 401 is covered with an insulating layer 405.

[0106] The driver circuit 493 includes a plurality of transistors. 1 shows one of the transistors included in the semiconductor memory device.

[0107] The wiring 457 transmits signals (video signals, clock signals, star signals, etc.) from the outside to the driving circuit 493. The external input terminal is electrically connected to the external input terminal that transmits the external signal (such as a power-on signal or a reset signal) or potential. An example is shown in which an FPC495 is provided as an external input terminal.

[0108] In order to prevent an increase in the number of processes, the wiring 457 is made of the same material as the electrodes and wiring used in the display unit and the driving circuit. It is preferable to use the same material and process for manufacturing the wiring 457. In this example, the source electrode and drain electrode are fabricated using the same material and process as those in the above.

[0109] The insulating layer 463 has an effect of suppressing diffusion of impurities into a semiconductor that constitutes a transistor. In addition, the insulating layer 465 has a planarization function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating film having the following properties.

[0110] [Cross-sectional configuration example 2] FIG. 10B shows a cross-sectional structure example of a display panel different from the above. The display panel is a bottom-emission type display panel using a color filter system.

[0111] The display panel shown in FIG. 10(B) includes a substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a A resistor 454, a transistor 455, an insulating layer 463, a coloring layer 432, an insulating layer 465, and a conductive layer 435, insulating layer 467, insulating layer 405, organic EL element 450 (lower electrode 401, EL layer 402 and upper electrode 403 ), adhesive layer 407 , substrate 428 , and wiring 457 . Substrate 420, adhesive layer 422, insulating layer 424, insulating layer 463, insulating layer 465, insulating layer 467 , and the lower electrode 401 is transparent to visible light.

[0112] In the display portion 491 of the display panel shown in FIG. 10B, the adhesive layer 422 and the insulating layer 424 are A switching transistor 454 and a current control transistor 455 are provided on the substrate 420 via the The organic EL element 450 is provided between the insulating layer 46 and the insulating layer 455. 7, a lower electrode 401 on the lower electrode 401, an EL layer 402 on the EL layer 402, and an upper electrode The lower electrode 401 is connected to the source of the transistor 455 through a conductive layer 435. The end of the lower electrode 401 is electrically connected to the insulating layer 40. The upper electrode 403 is preferably reflective to visible light. The display has a colored layer 432 on an insulating layer 463 that overlaps with an organic EL element 450 .

[0113] The driver circuit 493 includes a plurality of transistors. Of the transistors included, two are shown.

[0114] The wiring 457 is electrically connected to an external input terminal for transmitting signals and potentials from the outside to the driving circuit 493. This example shows an example where an FPC495 is provided as an external input terminal. In addition, an example in which the wiring 457 is manufactured using the same material and in the same process as the conductive layer 435 is shown here. vinegar.

[0115] The insulating layer 463 has an effect of suppressing diffusion of impurities into a semiconductor that constitutes a transistor. In addition, the insulating layers 465 and 467 reduce surface unevenness caused by transistors and wirings. It is preferable to select an insulating film having a planarizing function to reduce the thickness of the insulating film.

[0116] [Cross-sectional configuration example 3] FIG. 11 shows a cross-sectional configuration example of a display panel different from the above. The display panel shown in FIG. The display panel is a top-emission type that uses a color filter system.

[0117] The display panel shown in FIG. 11 includes a substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a 455, insulating layer 463, insulating layer 465, insulating layer 405, organic EL element 450 (lower electrode 4 01, EL layer 402 and upper electrode 403), adhesive layer 407, light shielding layer 431, colored layer 43 2, an overcoat 453, an insulating layer 226, an adhesive layer 426, a substrate 428, and a wiring 457 The substrate 428, the adhesive layer 426, the insulating layer 226, the overcoat 453, the adhesive layer 4 07 and the upper electrode 403 are transparent to visible light.

[0118] In the configuration shown in FIG. 11, an insulating layer 496 is provided on the insulating layer 405. By providing an insulating layer 496 that functions as a spacer on 05, the distance between the substrates is kept constant or more. This can prevent the signal from becoming too small.

[0119] In the display section 491 of the display panel shown in FIG. A transistor 455 and an organic EL element 450 are provided on a substrate 420. The element 450 includes a bottom electrode 401 on an insulating layer 465, an EL layer 402 on the bottom electrode 401, and , and an upper electrode 403 on the EL layer 402. The lower electrode 401 is The end of the lower electrode 401 is electrically connected to the source electrode or drain electrode of the insulating layer. The lower electrode 401 is preferably covered with a transparent conductive layer 405. The lower electrode 401 preferably reflects visible light. The panel has a color layer 432 that overlaps with the organic EL element 450 via an adhesive layer 407, and the adhesive The light-shielding layer 431 overlaps the insulating layer 405 with the layer 407 interposed therebetween.

[0120] The driver circuit 493 includes a plurality of transistors. One of the transistors is shown.

[0121] The wiring 457 is electrically connected to an external input terminal for transmitting signals and potentials from the outside to the driving circuit 493. This example shows an example where an FPC495 is provided as an external input terminal. In addition, the wiring 457 is connected to the same source and drain electrodes of the transistor 455. The connecting body 497 on the insulating layer 226 is made of the same material and in the same process. 6, the overcoat 453, the adhesive layer 407, the insulating layer 465, and the insulating layer 463. The connector 497 is connected to the wiring 457 through the opening. The FPC 495 and the wiring 457 are electrically connected via a connector 497.

[0122] [Example of manufacturing method] Here, a method for forming a flexible touch sensor or display panel will be described.

[0123] For the sake of convenience, the configuration including the pixels and driving circuits in the display panel, the color filters, etc. A structure including an optical member, or a structure including electrodes and wiring in a touch sensor is called an element layer. The element layer includes, for example, a display element, and in addition to the display element, The display device may include wiring for use in the display device and elements such as transistors for use in pixels and circuits.

[0124] In addition, the support having an insulating surface on which the element layer is formed is referred to as a substrate. Let us assume that.

[0125] As a method for forming an element layer on a flexible substrate, a method for forming an element layer directly on the substrate can be used. and a method of forming an element layer on a supporting substrate having a different rigidity from the substrate, and then bonding the element layer and the supporting substrate. and a method of peeling off the substrate and transferring the element layer onto the substrate.

[0126] When the material constituting the base material has heat resistance against the heat applied in the process of forming the element layer, It is preferable to form the element layer directly on the substrate, since this simplifies the process. When the element layer is formed in a state where the substrate is fixed to the support substrate, the substrate can be easily transported within and between devices. This is preferable because it makes things easier.

[0127] In addition, when a method is used in which an element layer is formed on a supporting substrate and then transferred to the substrate, the supporting substrate is first A release layer and an insulating layer are laminated on the support substrate, and an element layer is formed on the insulating layer. The support substrate and the element layer are peeled off and transferred to the substrate. The material should be selected so that peeling occurs at the interface of the edge layer or in the release layer. In the step of forming the element layer, a treatment is performed at a temperature higher than the heat resistance temperature of the base material by the method. This makes it possible to improve reliability.

[0128] The peeling layer is a layer containing a high melting point metal material such as tungsten and an oxide layer of the metal material. A layer containing a material is laminated, and silicon nitride or silicon oxynitride is laminated on the peeling layer as an insulating layer. It is preferable to use a multi-layer laminate. When a high melting point metal material is used, high temperature can be obtained during the formation of the element layer. The impurities contained in the element layer can be removed by a high-temperature process, thereby improving reliability. and the crystallinity of the semiconductor contained in the element layer can be improved. .

[0129] Peeling can be achieved by applying mechanical force to pull the film off or by removing the peeling layer by etching. Alternatively, a liquid may be dropped onto a portion of the peeling interface and allowed to penetrate into the entire peeling interface. Alternatively, the peeling can be performed by applying heat to the peeling interface, taking advantage of the difference in thermal expansion. Separation may also be performed.

[0130] In addition, when peeling is possible at the interface between the support substrate and the insulating layer, it is not necessary to provide a peeling layer. For example, glass is used as the support substrate, and an organic resin such as polyimide is used as the insulating layer. A part of the organic resin is locally heated by laser light or the like to form a starting point for peeling; The separation can be performed at the interface between the glass and the insulating layer. A layer of highly thermally conductive material such as a metal or semiconductor is placed between the insulating layers, and heat is applied to the layer by passing an electric current through it. The organic resin can be heated to make it easier to peel off. The insulating layer containing the compound may also be used as a substrate.

[0131] Examples of flexible substrates include polyethylene terephthalate (PET), poly Polyester resins such as ethylene naphthalate (PEN), polyacrylonitrile resins, Polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethylene Polyethersulfone (PES) resin, Polytetrafluoroethylene (PTFE), Polyamide Resin, cycloolefin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride In particular, it is preferable to use a material having a low thermal expansion coefficient. For example, Thermal expansion coefficient is 30 x 10 -6 / K or less polyamide-imide resin, polyimide resin, P ET, etc. can be suitably used. In addition, a substrate in which a fiber body is impregnated with a resin (prepreg, etc.) It is also possible to use a substrate with a lower thermal expansion coefficient by mixing inorganic fillers into organic resin. can.

[0132] When the above-mentioned materials contain fibrous bodies, the fibrous bodies are made of high strength organic or inorganic compounds. High strength fibers are specifically fibers with high tensile modulus or Young's modulus. Representative examples are polyvinyl alcohol fibers, polyester fibers, and polyvinyl alcohol fibers. Mid fiber, polyethylene fiber, aramid fiber, polyparaphenylene benzobisoxy Examples of the fiberglass include Sasol fiber, glass fiber, and carbon fiber. Examples of glass fibers include those made of glass fiber such as sappan, S-glass, D-glass, and Q-glass. Alternatively, it is used in the form of a nonwoven fabric, and the structure in which the fiber body is impregnated with resin and the resin is hardened is made flexible. As a substrate having flexibility, a substrate made of a fiber body and a resin may be used. The use of a structure is preferable because it improves reliability against damage caused by bending or local pressure. stomach.

[0133] [Examples of materials] Next, materials that can be used for the display panel will be described. The description of the configuration described above will be omitted.

[0134] The light-emitting element may be a self-emitting element that is illuminated by a current or a voltage. The category includes devices whose light intensity can be controlled. For example, light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0135] The structure of the transistor in the display panel is not particularly limited. For example, The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top gate type or a bottom gate type structure. The semiconductor material is not particularly limited, and examples thereof include silicon, germanium, and oxide semiconductors. This is also fine.

[0136] The state of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region In particular, when a semiconductor having crystallinity is used, the transistor This is preferable because it is possible to suppress deterioration of the transistor characteristics.

[0137] Here, it is preferable to use a polycrystalline semiconductor for the transistor. It is preferable to use polycrystalline silicon. Polycrystalline silicon can be formed at a lower temperature than single crystal silicon. It has high field effect mobility and high reliability compared to amorphous silicon. By applying such a polycrystalline semiconductor to pixels, the aperture ratio of the pixels can be improved. In addition, even when the pixels are extremely fine, the gate driver circuit and the source driver circuit This makes it possible to form the display and pixels on the same substrate, reducing the number of components that make up electronic devices. It is possible.

[0138] Alternatively, it is preferable to use an oxide semiconductor for the transistor. It is preferable to use an oxide semiconductor having a larger band gap than silicon. By using semiconductor materials with a wide band gap and low carrier density, This is preferable because it can reduce the current in the off state.

[0139] For example, the oxide semiconductor contains at least indium (In) or zinc (Zn). More preferably, In-M-Zn oxide (wherein M is Al, Ti, Ga , Ge, Y, Zr, Sn, La, Ce or Hf).

[0140] For example, oxide semiconductors include indium oxide, tin oxide, zinc oxide, and In-Zn oxide. compounds, Sn-Zn oxides, Al-Zn oxides, Zn-Mg oxides, Sn-Mg acids oxides, In-Mg oxides, In-Ga oxides, In-Ga-Zn oxides (IGZO (also written as In-Al-Zn oxide, In-Sn-Zn oxide, Sn-Ga- Zn-based oxide, Al-Ga-Zn-based oxide, Sn-Al-Zn-based oxide, In-Hf-Z n-based oxides, In-Zr-Zn-based oxides, In-Ti-Zn-based oxides, In-Sc-Zn In-Y-Zn oxide, In-La-Zn oxide, In-Ce-Zn oxide oxides, In-Pr-Zn oxides, In-Nd-Zn oxides, In-Sm-Zn oxides In-Eu-Zn oxide, In-Gd-Zn oxide, In-Tb-Zn oxide , In-Dy-Zn oxide, In-Ho-Zn oxide, In-Er-Zn oxide, In-Tm-Zn oxide, In-Yb-Zn oxide, In-Lu-Zn ​​oxide, I n-Sn-Ga-Zn oxide, In-Hf-Ga-Zn oxide, In-Al-Ga- Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, I An n-Hf-Al-Zn oxide can be used.

[0141] Here, the In-Ga-Zn oxide is an oxide having In, Ga, and Zn as the main components. The ratio of In, Ga, and Zn does not matter. The metal elements may be included.

[0142] Oxide semiconductor films are roughly classified into non-single-crystal oxide semiconductor films and single-crystal oxide semiconductor films. The non-single-crystal oxide semiconductor film is called CAAC-OS (C Axis Aligned Crystal-Oxide Semiconductor Film). (stalline oxide semiconductor) film, polycrystalline oxide semiconductor The term CAAC-OS refers to a film, a microcrystalline oxide semiconductor film, an amorphous oxide semiconductor film, etc. is one of the oxide semiconductor films having a plurality of crystal parts aligned along the c-axis.

[0143] In particular, the semiconductor layer has a plurality of crystal parts, and the crystal parts have a c-axis aligned with a surface on which the semiconductor layer is formed. or an oxide having a crystal orientation perpendicular to the upper surface of the semiconductor layer and no grain boundary between adjacent crystal portions. It is preferable to use an oxide semiconductor film. Since such an oxide semiconductor does not have a crystal grain boundary, Therefore, when a flexible device formed by applying one embodiment of the present invention is bent, the stress Therefore, the occurrence of cracks in the oxide semiconductor film is suppressed. Such an oxide semiconductor can be suitably used in devices such as display devices that are used in a curved state. This can be done.

[0144] In addition, by using such materials for the semiconductor layer, fluctuations in electrical properties are suppressed, and reliability is improved. This makes it possible to realize highly reliable transistors.

[0145] In addition, due to its low off-state current, the charge stored in the capacitance through the transistor can be released for a long period of time. By applying such a transistor to a pixel, It is also possible to stop the drive circuit while maintaining the brightness of the image displayed in the display area. As a result, it is possible to realize electronic equipment with extremely reduced power consumption.

[0146] In addition to the gate, source, and drain of the transistor, the various wiring that makes up the touch panel Possible materials for the wires and electrodes include aluminum, titanium, chromium, nickel, Kel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten A single metal consisting of arsenic or an alloy consisting mainly of this metal is used in a single-layer structure or a multilayer structure. For example, a single-layer structure of an aluminum film containing silicon, an aluminum film on a titanium film, A two-layer structure in which an aluminum film is laminated on a tungsten film, a two-layer structure in which an aluminum film is laminated on a tungsten film, a copper-magnesium film, A two-layer structure in which a copper film is laminated on a titanium film. a two-layer structure in which a copper film is laminated on a tungsten film; a two-layer structure in which a titanium film or a titanium nitride film is laminated on a tungsten film; Then, an aluminum film or a copper film is laminated on the titanium film or the titanium nitride film, and A three-layer structure in which a titanium film or titanium nitride film is formed on the first layer, a molybdenum film or a nitride film A molybdenum film and an aluminum film or a molybdenum nitride film are laminated on the molybdenum film or the molybdenum nitride film. A three-layer structure is formed by laminating a copper film on a silicon substrate and then forming a molybdenum film or a molybdenum nitride film on the copper film. The structure includes transparent conductive materials including indium oxide, tin oxide, or zinc oxide. In addition, when copper containing manganese is used, the controllability of the shape by etching is improved. Therefore, it is preferable.

[0147] The light-emitting element of the display panel includes a pair of electrodes and an EL layer provided between the pair of electrodes. One of the pair of electrodes functions as an anode and the other functions as a cathode.

[0148] The light-emitting element is available in a top emission structure, bottom emission structure, and dual emission structure. The electrode on the light extraction side is provided with a conductive film that transmits visible light. In addition, a conductive film that reflects visible light can be used for the electrode on the side from which light is not extracted. preferable.

[0149] The conductive film that transmits visible light is, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide with added metals. It can also be formed using gold, silver, platinum, magnesium , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. A laminated film of the above materials can also be used as the conductive film. For example, a laminated film of silver and magnesium can be used. It is preferable to use a laminated film of an alloy of tungsten and ITO, since the electrical conductivity can be increased. Graphene or the like may also be used.

[0150] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, etc. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above-mentioned metal materials and alloys may be used. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO, or the like can be used.

[0151] The electrodes may be formed by vapor deposition or sputtering. The shape is created using a discharge method such as the ink jet method, a printing method such as the screen printing method, or a plating method. It can be achieved.

[0152] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode and the upper electrode, the EL layer Holes are injected from the anode side and electrons are injected from the cathode side. The injected electrons and holes are They recombine in the L layer, and the light-emitting material contained in the EL layer emits light.

[0153] The EL layer has at least a light-emitting layer. The EL layer has a hole-injecting layer as a layer other than the light-emitting layer. high hole transporting material, hole blocking material, high electron transporting material, electron injection The material contains a highly conductive material or a bipolar material (a material with high electron transport and hole transport properties). The insulating layer may further include a layer containing the insulating layer.

[0154] The EL layer can be made of either low molecular weight compounds or high molecular weight compounds. Each of the layers constituting the EL layer may be formed by deposition (including vacuum deposition). The insulating layer can be formed by a method such as a transfer method, a printing method, an ink-jet method, or a coating method.

[0155] The light emitting element is preferably provided between a pair of insulating films having high gas barrier properties. This makes it possible to prevent impurities such as water from entering the light emitting element, improving the reliability of the display panel. The decline can be suppressed.

[0156] Insulating films with high gas barrier properties include silicon nitride films and silicon oxynitride films. Examples of the film include a film containing silicon, and a film containing nitrogen and aluminum, such as an aluminum nitride film. Furthermore, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

[0157] For example, the water vapor permeability of an insulating film with high gas barrier properties is 1×10 -5 g / m 2 ·day Less than or equal to 1×10 -6 g / m 2 ·day or less, preferably 1×10 -7 g / m 2 ·day or less, more preferably 1×10 -8 g / m 2 ·day or less.

[0158] For the flexible substrate, a flexible material is used. For example, an organic resin or a flexible Furthermore, the thickness of the glass can be adjusted to the desired thickness. The substrate from which the light is emitted is made of a material that transmits visible light. If no filtering is required, a metal substrate or the like can also be used.

[0159] Since organic resin has a smaller specific gravity than glass, it is possible to use organic resin as a flexible substrate. This is preferable because it allows the display panel to be lighter in weight than when glass is used.

[0160] As a material having flexibility and light transmission, for example, polyethylene terephthalate (PE T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Examples of resins that can be used include polystyrene resins, polyamide-imide resins, and polyvinyl chloride resins. It is preferable to use a material with a low expansion coefficient, for example, polyamide-imide resin, polyimide Resin, PET, etc. can be suitably used. In addition, a substrate in which a fiber body is impregnated with resin (printed film) can be used. Use boards with a lower thermal expansion coefficient by mixing inorganic fillers with organic resins. It is also possible.

[0161] When a fibrous body is contained in a flexible and light-transmitting material, the fibrous body is an organic compound or In the present embodiment, high-strength fibers made of inorganic compounds are used. Specifically, high-strength fibers have a tensile modulus or Young's modulus. It refers to fibers with a high elasticity, and typical examples are polyvinyl alcohol fibers, polyester fibers, etc. Fibers made of styrene, polyamide, polyethylene, aramid, polyparaphenylene Examples of the fiber include benzobisoxazole fiber, glass fiber, and carbon fiber. Examples of the glass fibers include those using E glass, S glass, D glass, Q glass, and the like. These are used in the form of woven or nonwoven fabric, and the fibers are impregnated with resin and the resin is hardened. A structure may be used as a flexible substrate. Using a resin structure improves reliability against damage caused by bending or localized pressure. Therefore, it is preferable.

[0162] In order to improve the light extraction efficiency, the refractive index of the flexible and light-transmitting material is preferably high. For example, by dispersing an inorganic filler having a high refractive index in an organic resin, the organic resin This allows the realization of a substrate with a higher refractive index than a substrate made only of resin. The use of a small inorganic filler is preferred since it does not impair optical transparency.

[0163] The thickness of the metal substrate is preferably 10 μm or more and 200 μm or less in order to obtain flexibility and bendability. The thickness is preferably 20 μm or more and 50 μm or less. This makes it possible to effectively dissipate heat generated by the light emission of the light emitting element.

[0164] The material constituting the metal substrate is not particularly limited, but examples thereof include aluminum, copper, and nickel. Nickel, or an alloy of metals such as aluminum alloy or stainless steel is preferably used. It is possible.

[0165] As for the flexible substrate, the layer using the above-mentioned material protects the surface of the device from scratches, etc. A hard coat layer (such as a silicon nitride layer) that can disperse pressure, or a layer of a material that can disperse pressure (such as For example, the material may be laminated with an aramid resin layer. In order to prevent the deterioration of the lifespan of active elements (especially organic EL elements, etc.), It may also comprise a membrane.

[0166] The flexible substrate may be used by laminating a plurality of layers. This configuration improves the barrier properties against water and oxygen, making the display panel highly reliable. It is possible.

[0167] For example, a flexible substrate having a glass layer, an adhesive layer, and an organic resin layer laminated from the side closest to the organic EL element is used. The thickness of the glass layer is 20 μm or more and 200 μm or less. The glass layer having such a thickness is preferably 25 μm or more and 100 μm or less. In addition, the organic resin layer can be made thicker and more flexible than the conventional organic resin layer. The thickness is set to 10 μm or more and 200 μm or less, and preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer on the outer side of the glass layer, the glass layer is prevented from cracking or cracking. The glass material and the organic resin can suppress the cracking and improve the mechanical strength. By applying this composite material to the substrate, a highly reliable flexible display panel can be created. It can be said that:

[0168] The adhesive layer may be a photo-curable adhesive such as an ultraviolet-curable adhesive, a reaction-curable adhesive, a heat-curable adhesive, or Various curing adhesives such as anaerobic adhesives can be used. Resin, acrylic resin, silicone resin, phenol resin, polyimide resin, imide resin Fat, PVC (Polyvinyl chloride) resin, PVB (Polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resins. In particular, epoxy resins and other resins have low moisture permeability. A material that is easy to apply is preferable. A two-part mixed resin may also be used. An adhesive sheet or the like may also be used. This is also fine.

[0169] The resin may contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that adsorbs moisture by chemical adsorption, such as calcium chloride or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be prevented from adsorbing to the functional element. This is preferable because it is possible to suppress the intrusion of foreign matter and improve the reliability of the display panel.

[0170] In addition, by mixing a filler having a high refractive index or a light scattering material into the resin, a light emitting element can be formed. For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0171] This concludes the description of the display panel.

[0172] In this specification and the like, the term "display element," "display device having a display element," "light-emitting element," A light-emitting device, which is a device having a light-emitting element, can be used in various forms or in various As an example of a display element, a display device, a light-emitting element, or a light-emitting device, EL elements (EL elements containing organic and inorganic materials, organic EL elements, inorganic EL elements), LE D (white LED, red LED, green LED, blue LED, etc.), transistor (current-dependent transistors that emit light when exposed to light, electron emitters, liquid crystal elements, electronic ink, electrophoretic elements, graphene rating light valve (GLV), plasma display (PDP), MEMS Display element using microelectromechanical system, digital micromirror DMD (Digital Micro Shutter), DMS (Digital Micro Shutter), IMOD (Interface Modulation Device) Fairing modulation elements, electrowetting elements, shutters MEMS display element using the optical interference method, MEMS display element using the optical interference method, Piezoelectric ceramic display , carbon nanotubes, etc., which use electromagnetic effects to improve contrast, brightness, reflectance, and transparency. There are display devices that have a display medium that changes transmittance, etc. An example of a display device using electron emission elements is a flat panel display. Field Emission Display (FED) or Single Ended Emission Display (SED) D:Surface-conduction Electron-emitter Di An example of a display device using liquid crystal elements is a liquid crystal display. (Transmissive LCD, Semi-transmissive LCD, Reflective LCD, Direct-view LCD LCDs, projection LCDs, etc. Electronic ink, electronic liquid powder, An example of a display device using an electrophoretic element is electronic paper. When realizing a transmissive or reflective LCD, part of the pixel electrode Alternatively, the entire electrode may function as a reflective electrode. may be made to contain aluminum, silver, or the like. In this case, it is possible to provide a memory circuit such as an SRAM under the reflective electrode. This makes it possible to further reduce power consumption.

[0173] In this specification, a pixel having an active element (active element, nonlinear element) Uses an active matrix system or a passive matrix system that does not have active elements in the pixels. There can be.

[0174] In the active matrix method, various elements, not just transistors, are used as active elements. For example, MIM (Metal Insulator Metal) or TFD (Thin Film Diode) can also be used. These elements have fewer manufacturing steps, which reduces manufacturing costs and improves yields. In addition, since these elements are small in size, the aperture ratio can be improved. This allows for lower power consumption and higher brightness.

[0175] The passive matrix method does not use active elements, so there are fewer manufacturing steps and manufacturing costs are lower. In addition, since no active elements are used, the aperture ratio is It is possible to improve the light emitting performance, thereby achieving low power consumption and high brightness.

[0176] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0177] (Embodiment 3) In this embodiment, a touch panel, a touch sensor, a display panel, or The electronic device and the lighting device to which the light emitting device can be applied will be described with reference to FIGS. 12 and 13. do.

[0178] Examples of electronic devices include television sets (also known as televisions or television receivers). (hereinafter referred to as "computer monitors"), digital cameras, digital video cameras, digital photo frames, mobile phones (also called mobile phones or mobile phone devices), portable game machines, Examples of the device include portable information terminals, audio playback devices, and large game machines such as pachinko machines.

[0179] In addition, a device manufactured by applying one embodiment of the present invention is flexible, and therefore can be installed in houses and buildings. It can also be installed along the curved surfaces of interior or exterior walls, or the interior or exterior of a vehicle. It is.

[0180] FIG. 12A shows an example of a mobile phone. A mobile phone 7400 includes a housing 740. In addition to the display unit 7402 incorporated in the 1, the operation buttons 7403 and the external connection port 7404 , a speaker 7405, a microphone 7406, etc. A display device manufactured according to one embodiment of the present invention is used for the display portion 7402. According to one aspect of the present invention, a highly reliable mobile phone having a curved display is provided. It can be provided with good yield.

[0181] In the mobile phone 7400 shown in FIG. 12A, when a display portion 7402 is touched by a finger or the like, You can also make calls, enter text, and perform any other functions. The operation can be performed by touching the display portion 7402 with a finger or the like.

[0182] In addition, the operation button 7403 can be used to turn the power on and off, and to display the display unit 7402. For example, from the email composition screen, you can change the type of image displayed on the You can then switch to the main menu screen.

[0183] FIG. 12B shows an example of a wristwatch-type portable information terminal. The housing 7101, the display unit 7102, the band 7103, the buckle 7104, the operation button 7 105, input / output terminal 7106, etc.

[0184] The portable information terminal 7100 is capable of carrying out mobile telephone calls, e-mails, viewing and creating documents, playing music, and internet connections. It can run various applications such as internet communication and computer games. Cut.

[0185] The display unit 7102 has a curved display surface, and displays information along the curved display surface. The display unit 7102 is equipped with a touch sensor, and the screen can be operated by touching it with a finger or a stylus. For example, the icon 7 displayed on the display unit 7102 can be operated by touching the You can launch the application by touching 107.

[0186] The operation button 7105 is used to set the time, turn the power on and off, and turn wireless communication on and off. It supports various functions such as auto-start, silent mode and power saving mode. For example, an operation system built into the portable information terminal 7100 can be The function of the operation button 7105 can also be freely set using the stem.

[0187] In addition, the mobile information terminal 7100 is capable of performing short-distance wireless communication according to a communication standard. For example, by communicating with a wireless headset, a hands-free You can also make calls.

[0188] The portable information terminal 7100 also includes an input / output terminal 7106, and is connected to other information terminals via a connector. Data can be exchanged directly through the input / output terminal 7106. The charging operation can be performed by wireless power supply without going through the input / output terminal 7106. You may go.

[0189] The display portion 7102 of the portable information terminal 7100 has a display device manufactured by applying one embodiment of the present invention. According to one aspect of the present invention, a curved display panel is incorporated in the display device. This makes it possible to provide highly reliable portable information terminals with a high yield.

[0190] 12C to 12E show an example of a lighting device. The lighting device 7210 and the lighting device 7220 are each provided with a base 72 01 and a light emitting part supported by a base part 7201.

[0191] The lighting device 7200 shown in FIG. 12C includes a light-emitting unit 7202 having a wavy light-emitting surface. This makes it a highly designed lighting device.

[0192] The light-emitting portion 7212 of the lighting device 7210 shown in FIG. 12D has two convexly curved Therefore, the light emitting units are arranged symmetrically around the lighting device 7210. It can illuminate in all directions.

[0193] The lighting device 7220 shown in FIG. 12(E) has a light-emitting portion 7222 that is curved in a concave shape. Therefore, the light emitted from the light emitting unit 7222 is focused on the front surface of the lighting device 7220. It is suitable for brightly illuminating a large area.

[0194] In addition, the light-emitting devices 7200, 7210, and 7220 each include Since the light-emitting part is flexible, it is possible to attach the light-emitting part to a plastic member or a movable frame. The light emitting surface of the light emitting portion may be freely curved depending on the application.

[0195] In this embodiment, the illumination device in which the light-emitting unit is supported by the base is illustrated. The housing may be fixed to the ceiling or hung from the ceiling. The light surface can be curved, so a specific area can be brightened by curving the light-emitting surface in a concave shape. The light can be curved convexly to illuminate an entire room.

[0196] In addition, by applying a touch panel to the light-emitting part, the color and brightness of the light can be changed by touching the light-emitting part. This makes it possible to realize a new lighting device that can change the brightness (also called dimming).

[0197] FIG. 13A is a perspective view illustrating the external shape of the mobile information terminal 330. FIG. FIG. 13(C) is a top view of the portable information terminal 330. FIG. 13(C) is a top view of the portable information terminal 340. FIG.

[0198] The portable information terminals 330 and 340 are selected from, for example, a telephone, a notebook, or an information viewing device. It has one or more functions. Specifically, it can be used as a smartphone. can.

[0199] The mobile information terminals 330 and 340 can display text and image information on multiple surfaces. For example, three operation buttons 339 can be displayed on one surface (see FIG. 13(A), Also, information 337 shown in a dashed rectangle can be displayed on another surface (see FIG. 13). (B) and (C)). Examples of information 337 include e-mail and SNS (social networking sites). Networking services) and telephone calls, as well as e-mail and SNS notifications. The subject, the sender name of the email or SNS, the date and time, the time, the remaining battery level, the antenna The strength of the signal reception, etc. Or, instead of the information 337, Alternatively, an operation button 339, an icon, etc. may be displayed. In the above example, information 337 is displayed on the upper side. However, one embodiment of the present invention is not limited to this. For example, as shown in FIG. 13C, a mobile information terminal 340 is displayed on the side. Good too.

[0200] For example, the user of the mobile information terminal 330 may store the mobile information terminal 330 in a breast pocket of a suit. When the item is stored, the display (information 337 in this example) can be confirmed.

[0201] Specifically, the telephone number or name of the caller of the incoming call is displayed on the mobile information terminal 330. The user takes the mobile information terminal 330 out of his pocket and You can check the display and decide whether or not to answer the call without having to turn your phone back on.

[0202] The housing 335 of the portable information terminal 330 and the housing 336 of the portable information terminal 340 each have A display device manufactured according to one embodiment of the present invention can be used for the display portion 333. According to one embodiment of the present invention, a display device having a curved display portion and high reliability can be manufactured with high yield. Can be provided well.

[0203] Also, as in the case of a portable information terminal 345 shown in FIG. 13(D), information may be displayed on three or more screens. Here, information 355, information 356, and information 357 are displayed on different sides. Here is an example.

[0204] A display portion 358 of a housing 351 of a portable information terminal 345 is provided with one embodiment of the present invention. According to one embodiment of the present invention, a display device having a curved display portion can be used. Moreover, highly reliable display devices can be provided with a high yield.

[0205] The display portion of the electronic device or the light-emitting portion of the lighting device according to one embodiment of the present invention can be used. The above touch panel, touch sensor, display panel, or light-emitting device can be applied. This has led to thinner, lighter, and more multifunctional electronic devices, while at the same time realizing high detection sensitivity. The electronic device may be an electronic device.

[0206] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. EXAMPLES

[0207] [Electromagnetic noise from display panels] In this example, a display panel according to one embodiment of the present invention was manufactured, and electromagnetic noise from the display panel was We will explain the results of our survey on this issue.

[0208] As described above, the electromagnetic noise generated when the display panel is driven is significant for the touch sensor. When the touch sensor is folded, the detection sensitivity of the touch sensor may be reduced. Reducing the electromagnetic noise generated by the display panel improves the detection sensitivity of the touch sensor. This is useful because it leads to

[0209] One of the causes of electromagnetic noise from display panels is the gate driver circuit (scanning One of the problems is electromagnetic noise from the gate driver circuit (the gate line driver circuit). A circuit that functions as such is preferably used.

[0210] As a method to reduce electromagnetic noise from the shift register circuit, It is effective to change the waveform of the input signal. A signal with a gentle rising and falling potential gradient is used. The closer it is to the in-wave, the more electromagnetic noise can be reduced. The method of generating the delay line is to add a delay circuit or a capacitance to the wiring. More preferably, the current supply capability of the signal generating circuit is weakened. Such a waveform may be generated.

[0211] FIG. 16A shows a shift register circuit of one embodiment of the present invention. The circuit shown in FIG. 16(A) is a circuit that is a partial circuit of the circuit shown in FIG. The transistors M21 to M28 constituting the circuit are preferably made of the above-mentioned oxide semiconductor. In addition, a transistor having a gate electrode formed in the gate electrode formation region can be applied. For example, if such a circuit is input with an input signal of the waveform shown in FIG. By using a signal to drive the circuit shown in Figure 16(A), the generation of electromagnetic noise from the circuit is suppressed. The shift register circuit according to one embodiment of the present invention can be implemented using a CMOS circuit, which will be described later. This is because the circuit is constructed using unipolar transistors. One of the reasons is that it was made using amorphous silicon and low-temperature polysilicon. When constructing the circuit using transistors that use silicon as a semiconductor layer, such as silicon-based transistors, In this case, it is necessary to add capacitance to node N1 to prevent leakage current. A required current increases, and power consumption may increase as compared to the case where an oxide semiconductor is used.

[0212] Here, the shift register circuit is provided with an n-channel transistor as shown in FIG. Consider the case where a CMOS circuit combining a p-channel transistor and a For example, FIG. 17B shows a shift register circuit (circuit B) to which the above-mentioned CMOS circuit is applied. ) is shown below.

[0213] Here, each of the transistors in FIG. 17(A) and (B) is a semiconductor in which a channel is formed. Assume that silicon such as low-temperature polysilicon is used for the body layer. An example of the input / output characteristics of a MOS circuit is shown in Figure 18(A). In a CMOS circuit using a transistor, when the input voltage is inverted, as shown in Figure 18(B), This means that the input signal is not an ideal square wave. If a signal with a gentle rising and falling potential gradient is used, the leakage current caused by the through current is reduced. This means that power consumption increases.

[0214] Here, in the circuit A shown in FIG. 9 and the circuit B shown in FIG. 17(B), Charge consumption when rise time is changed The magnitude of the input signal (ption) was estimated by calculation and compared. When the high level potential at which the signal saturates is taken as 100%, the potential level is between 10% and 90%. The time it takes to rise.

[0215] The calculation results are shown in Figure 19. In circuit B, the longer the rise time of the input signal, the On the other hand, in Circuit A, the rise time of the input signal is It can be seen that the power consumption is almost constant regardless of the length.

[0216] Next, we created a flexible display panel by applying the circuit shown in Figure 9 to the gate driver. Here, a top-emission LCD panel with a color filter system was used as the display panel. The transistors in the pixels and driving circuits of the organic EL panel The transistor used for the display panel has a semiconductor layer made of CAAC-OS. The thickness was approximately 50 μm.

[0217] When an image was displayed on the flexible display panel, the light emitted from the display panel was The electromagnetic noise generated by the antenna was measured using a spectrum analyzer. With the spectrum analyzer probe placed directly above the gate driver, The strength of the electromagnetic noise was measured. In addition, the waveform of the input signal to the gate driver was Measurements were performed under two conditions: a square wave and a waveform with a gradual rise. In the latter case, the signal was increased by adding a capacitance to the input terminal of the display panel. The waveforms generated had rise times of about 50ns to about 800ns. In the example, a capacitance was added, but adding a resistance would produce the same effect. The source-sink current of the signal output transistor in the external control circuit that drives the EL panel is It can be reduced.

[0218] The measurement results are shown in Figure 20(B). Compared to when a square wave was used as the input signal (dashed line), When a waveform with a gradual rise is used (solid line), the voltage emitted from the display panel is It was confirmed that the magnetic noise was reduced. It was also confirmed that the current was reduced by approximately 20%.

[0219] At least a part of this embodiment may be appropriately combined with the embodiment described in this specification. This can be implemented. EXAMPLES

[0220] In this example, a semiconductor device that can be used for a touch panel and a touch sensor according to one embodiment of the present invention will be described. The change in resistance value when the transparent conductive film is bent was investigated. We created a touch sensor and investigated the change in the output signal when it was bent and when it was not bent. I looked it up.

[0221] [Bending test of transparent conductive film] FIG. 21 shows a schematic top view of an evaluation element prepared for a bending test of a transparent conductive film. The evaluation element has two metal wirings on a flexible substrate and a transparent substrate electrically connected to the metal wirings. A transparent electrode is electrically connected to both ends of the transparent electrode. The metal wiring is electrically connected to the FPC. The transparent electrode has a length L of 75 mm. The transparent electrode has a rectangular pattern with a width W of 300 μm. The indium tin oxide film containing silicon was used. A tungsten film of 0 nm was used.

[0222] The bending test was performed by bending the transparent electrode in a direction parallel to the long side of the electrode as shown in FIG. The measurement was performed by bending a substrate having flexibility. While this was being done, the resistance value of the evaluation element was measured.

[0223] The measurement results are shown in Figure 22. In Figure 22, the vertical axis shows resistance and the horizontal axis shows the inverse of the radius of curvature. As shown in Figure 22, the resistance does not change even if the radius of curvature becomes smaller. In other words, even if the radius of curvature is 4 mm or less, or even about 2 mm, the resistance of the transparent conductive film No change in the value was observed. Therefore, this type of transparent conductive film can be used as a flexible touch sensor. The present invention can be suitably used for a display panel, a touch panel, and the like.

[0224] [Touch sensor bending test] Next, we fabricated a flexible touch sensor using the above-mentioned transparent conductive film as a pair of electrodes. A mutual capacitance type electrostatic capacitance touch sensor was used. The thickness of the flexible touch sensor is about 50 μm. The transmittance of the flexible touch sensor is 80% to The answer is 85%.

[0225] Next, the touch sensor was placed flat and with a radius of curvature of 4 mm. When the touch sensor is bent 180 degrees, the output is The output signal was measured.

[0226] The measurement results are shown in Figure 23(A) and (B). Figure 23(A) shows the results when the touch sensor is arranged flatly. FIG. 23(B) shows the measurement results when the touch sensor is bent. In addition, in Fig. 23(A) and (B), the solid line indicates the state where the object to be detected is not in contact, and the broken line indicates the state where the object to be detected is not in contact. The line indicates the measurement result when the object to be detected is in contact with the sensor. The output signal was roughly the same in both the curved and bent states. It was confirmed that the ion exchange reaction functioned as a catalyst.

[0227] At least a part of this embodiment may be appropriately combined with the embodiment described in this specification. This can be implemented. EXAMPLES

[0228] In this example, a touch panel was manufactured by a method for manufacturing a touch panel according to one embodiment of the present invention. did.

[0229] The touch panel was manufactured by the method exemplified in the manufacturing method example of the first embodiment. The layered structure of a touch panel is shown in Fig. 14. Here, a color filter type is used as the display panel. The organic EL panel is a top-emission type that uses the OLED technology. The transistors in the driver circuits are transistors that use CAAC-OS in their semiconductor layers. In addition, a mutual capacitance type electrostatic capacitance touch sensor was applied to the touch sensor. The thickness of the display panel and the touch sensor was approximately 50 μm. The film layer is a PET film with a thickness of about 50 μm, and the adhesive layer is a PET film with a thickness of about 25 μm. A silicone resin was used.

[0230] The support is made of epoxy resin with a curved surface of 4 mm radius on both sides. The above-mentioned touch panel is formed along both side surfaces and the top surface of the support by the manufacturing method exemplified in embodiment 1. It was formed.

[0231] A photograph of the fabricated touch panel is shown in Figure 15. In the usage form shown in Figure 15, The text information is displayed in the area located on the front side of the support, and the screen information is displayed in the area located on the side of the support. By controlling the rider, text information can be scrolled up and down. Multi-touch operation is possible without any problems in the areas located on the sides and top of the device. In this way, by placing the control unit on the side of the panel, It is convenient to hold and operate a mobile terminal by hand.

[0232] At least a part of this embodiment may be appropriately combined with the embodiment described in this specification. This can be implemented. [Explanation of symbols]

[0233] 10 Electronic equipment 100 Touch Panel 101 Case 102 Exterior materials 103 Support 111 Display Panel 112 Touch Sensor 113 Film Layer 114 Adhesive layer 201 Substrate 202 Substrate 205 FPC 211 Wiring 212 Wiring 220 Insulating layer 221 Electrode 222 Electrode 223 Wiring 224 Dielectric Layer 226 Insulating Layer 231 Adhesive layer 232 Adhesive layer 235 Protective layer 255 connection layers 330 Mobile Information Terminal 333 Display section 335 Case 336 Case 337 Information 339 Operation Button 340 Mobile Information Terminal 345 Mobile Information Terminal 351 Case 355 Information 356 Information 357 Information 358 Display section 401 Lower electrode 402 EL layer 403 Upper electrode 405 Insulation Layer 407 Adhesive layer 420 Substrate 422 Adhesive layer 424 Insulating layer 426 Adhesive layer 428 Substrate 431 Light blocking layer 432 Colored layer 435 Conductive Layer 450 Organic EL element 453 Overcoat 454 Transistor 455 Transistor 457 Wiring 463 Insulating Layer 465 Insulating Layer 467 Insulating Layer 470 IC 491 Display section 493 Drive circuit 495 FPC 496 Insulating Layer 497 Connectors 7100 Portable Information Terminal 7101 Case 7102 Display section 7103 Band 7104 Buckle 7105 Operation button 7106 Input / output terminal 7107 Icon 7200 Lighting Equipment 7201 Daibu 7202 Light emitting part 7203 Operation switch 7210 Lighting equipment 7212 Light emitting part 7220 Lighting Equipment 7222 Light emitting part 7400 Mobile Phone 7401 Case 7402 Display section 7403 Operation button 7404 External connection port 7405 Speaker 7406 Mike

Claims

[Claim 1] placing a display panel on the support so that the display panel bends along a curved surface of the support; attaching a film layer onto the display panel so as to bend along a curved surface of the display panel; and attaching a touch sensor onto the film layer so that the touch sensor bends along the curved surface of the film layer.

Images