Electronic apparatus

The electronic device addresses the limitation of existing devices by using a piezoelectric sensor to detect deformations within the housing, allowing it to differentiate between pressing on the top/bottom and side surfaces, thereby improving user interaction and feedback.

JP2025037302AActive Publication Date: 2025-03-18MURATA MFG CO LTD
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Patent Information

Application Number
JP2023144132
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-06
Publication Date
2025-03-18
Estimated Expiration
2043-09-06

AI Technical Summary

Technical Problem

Existing electronic devices with pressing sensors cannot detect which part of the housing has been pressed, as they only monitor deformations of the operation plate and not other parts of the housing.

Method used

An electronic device with a hollow housing, a continuous set within the housing, and a piezoelectric sensor that detects deformation of the continuous set, allowing the device to differentiate between pressing on the housing's top/bottom surfaces and its side surfaces by outputting signals of different polarities.

Benefits of technology

The device effectively detects which part of the housing is pressed by distinguishing between the polarity of signals generated from pressing in different directions, enhancing user interaction and feedback.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide an electronic apparatus capable of detecting a pressed portion of a housing.SOLUTION: The electronic apparatus comprises a housing having a hollow shape, a partition placed in the housing, and a sensor provided at the partition and detecting deformation of the partition. The partition connects a first portion at the inner surface of the housing and a second portion opposite to the first portion.SELECTED DRAWING: Figure 3
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Description

[Technical field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] Patent Document 1 describes a display device including a pressure sensor, an operation plate, and a housing. The operation plate is fitted into the housing so as to cover the opening surface of the housing. The pressure sensor includes a piezoelectric film. The pressure sensor is fixed to the operation plate. The pressure sensor detects deformation of the operation plate. Specifically, a user presses the operation plate. The piezoelectric film of the pressure sensor deforms in accordance with the deformation of the operation plate. The piezoelectric film is polarized according to the amount of displacement of the piezoelectric film. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2016 / 208560 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 does not disclose detection of deformation other than that of the operation plate. For example, Patent Document 1 does not disclose a configuration for detecting which part of the housing is pressed.

[0005] An object of the present invention is to provide an electronic device that can detect which part of the housing is pressed. [Means for solving the problem]

[0006] An electronic device according to an embodiment of the present invention includes: A housing having a hollow shape; A partition disposed within the housing; a sensor disposed on the partition and configured to detect deformation of the partition; Equipped with The partition connects a first portion on the inner surface of the housing and a second portion opposite to the first portion. Effect of the Invention

[0007] An electronic device according to an embodiment of the present invention can detect which part of the housing is pressed. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an electronic device 1. As shown in FIG. [Diagram 2] FIG. 2 is a top view of the electronic device 1. As shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. [Figure 4] 4(A) and 4(B) are diagrams showing deformation states of the housing 10, the partition 11, and the piezoelectric sensor 12, respectively. [Diagram 5] Fig. 5(A) is a diagram showing an example of a signal SL1 when the housing 10 is pressed in the thickness direction, and Fig. 5(B) is a diagram showing an example of a signal SL2 when the housing 10 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned. [Figure 6] FIG. 6 is a diagram showing an electronic device 1a according to a first modification of the electronic device 1. As shown in FIG. [Figure 7] Fig. 7(A) is a top view showing an electronic device 1b according to a second modified example of the electronic device 1. Fig. 7(B) is a cross-sectional view taken along line AA in Fig. 7(A). [Figure 8] 8A and 8B are diagrams showing electronic devices 1c and 1d according to a second modification of the electronic device 1, respectively. [Figure 9] 9A, 9B, and 9C are diagrams showing electronic devices 1e, 1f, and 1g according to a third modification of the electronic device 1, respectively. [Figure 10] 10A, 10B, and 10C are diagrams showing electronic devices 1h, 1i, and 1j according to a fourth modification of the electronic device 1, respectively. [Figure 11]11(A), 11(B), 11(C) and 11(D) are diagrams showing electronic devices 1k, 1m, 1n and 1o according to a fifth modification of the electronic device 1, respectively. [Figure 12] FIG. 12 is a diagram showing the results of an experiment using the electronic devices 1, 1a, and 1o. [Figure 13] 13A, 13B, and 13C are diagrams illustrating electronic devices 1p, 1q, and 1r according to a sixth modification of the electronic device 1, respectively. [Figure 14] 14(A), 14(B), and 14(C) are diagrams showing electronic devices 1s, 1t, and 1u according to a seventh modification of the electronic device 1, respectively. [Figure 15] FIG. 15 is a diagram showing an electronic device 1v according to an eighth modification of the electronic device 1. As shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] [First embodiment] Hereinafter, an electronic device 1 according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view of the electronic device 1. In Fig. 1, a partition 11 and a piezoelectric sensor 12 are shown in a see-through manner by dashed lines. Fig. 2 is a top view of the electronic device 1. In Fig. 2, the piezoelectric sensor 12 is shown in a see-through manner by dashed lines. Fig. 3 is a cross-sectional view taken along line AA in Fig. 2.

[0010] The electronic device 1 includes a housing 10, a partition 11, and a piezoelectric sensor 12, as shown in FIGS.

[0011] In this embodiment, the housing 10 has a rectangular parallelepiped shape as shown in Fig. 1. As an example, the housing 10 has a length of about 7 mm, a width of about 25 mm, and a thickness of about 5 mm. The housing 10 has a hollow shape. The housing 10 is pressed by a user. When pressed by the user, the housing 10 elastically deforms.

[0012] The housing 10 does not necessarily have to have a rectangular parallelepiped shape, but may have a cube, a perfect sphere, an ellipsoid, or the like.

[0013] The partition 11 has a rectangular shape in a plan view. The partition 11 is disposed inside the housing 10. The partition 11 connects two opposing side surfaces SF1 and SF2 among the side surfaces of the housing 10. The side surfaces SF1 and SF2 are arranged in the short-side direction of the housing 10 (the up-down direction of the paper surface in FIG. 2). The side surfaces SF1 and SF2 correspond to the first portion and the second portion, respectively, in the present application. The partition 11 may also connect two side surfaces SF3 and SF4 arranged in the long-side direction of the housing 10. The partition 11 is slightly closer to the bottom surface side than the center in the thickness direction of the housing 10. However, in the present invention, the partition 11 does not need to be slightly closer to the bottom surface side than the thickness direction of the housing 10. For example, the partition 11 may be disposed in the center in the thickness direction. The shape of the partition 11 in a plan view is not particularly limited.

[0014] The piezoelectric sensor 12 has long sides and short sides, and has a sheet shape in a plan view. The piezoelectric sensor 12 is disposed on the partition 11. The piezoelectric sensor 12 is fixed in the center of the partition 11 with an adhesive (not shown) such as double-sided tape in a plan view. The piezoelectric sensor 12 is not in contact with the housing 10. There is a gap between the piezoelectric sensor 12 and the housing 10. For this reason, even if the housing 10 is impacted by, for example, the electronic device 1 being dropped, the vibrations generated in the housing 10 by the impact are unlikely to be transmitted to the piezoelectric sensor 12. Therefore, the piezoelectric sensor 12 is unlikely to malfunction due to the impact from the drop or the like.

[0015] As shown in FIG. 3, the piezoelectric sensor 12 includes a piezoelectric film 120 , a first electrode 121 and a second electrode 122 .

[0016] The piezoelectric film 120 has a sheet shape having long and short sides. The piezoelectric film 120 is, for example, a film formed from a chiral polymer. The chiral polymer is, for example, polylactic acid (PLA), particularly L-type polylactic acid (PLLA) or D-type polylactic acid (PDLA). PLA made of a chiral polymer has a helical main chain structure. The piezoelectric film 120 has a piezoelectric constant of d14. The piezoelectric film 120 has piezoelectricity by being uniaxially stretched and orienting the molecules. As shown in FIG. 2, the stretching direction OD of the piezoelectric film 120 forms an angle of 45 degrees with respect to the direction in which the long side of the piezoelectric film 120 extends. However, the angle between the stretching direction OD and the direction in which the long side of the piezoelectric film 120 extends may be about 45 degrees ±10 degrees. The piezoelectric film 120 is polarized according to the amount of deformation of the piezoelectric film 120. The direction of polarization when piezoelectric film 120 is stretched in the direction in which the long sides of piezoelectric film 120 extend is opposite to the direction of polarization when piezoelectric film 120 is stretched in the direction in which the short sides of piezoelectric film 120 extend. The direction of polarization when piezoelectric film 120 is bent convexly toward the top surface of piezoelectric film 120 is opposite to the direction of polarization when piezoelectric film 120 is bent convexly toward the bottom surface of piezoelectric film 120. Note that the above angle is an example, and for example, the angle between the stretching direction OD and the direction in which the long sides of piezoelectric film 120 extend may be 0 degrees.

[0017] The first electrode 121 is, for example, a signal electrode. As shown in Fig. 3, the first electrode 121 is disposed on one main surface of the piezoelectric film 120. The first electrode 121 is fixed to the main surface with an adhesive (not shown).

[0018] The second electrode 122 is, for example, a reference electrode. As shown in Fig. 3, the second electrode 122 is disposed on one of the main surfaces of the piezoelectric film 120 on which the first electrode 121 is not disposed. The second electrode 122 is fixed to the main surface by an adhesive (not shown).

[0019] It is not necessary that the first electrode 121 is a signal electrode and the second electrode 122 is a reference electrode. The first electrode 121 may be a reference electrode and the second electrode 122 may be a signal electrode.

[0020] The piezoelectric sensor 12 detects the deformation of the partition 11. When a user presses the housing 10, the housing 10 is deformed. As the housing 10 is deformed, the partition 11 connected to the housing 10 is deformed. As the partition 11 is deformed, the piezoelectric sensor 12 arranged on the partition 11 is deformed. The piezoelectric sensor 12 outputs a signal according to the deformation of the piezoelectric sensor 12.

[0021] 4(A) and 4(B) are diagrams showing deformation states of the housing 10, the partition 11, and the piezoelectric sensor 12, respectively.

[0022] Piezoelectric sensor 12 outputs signals of different polarities when pressed along the short side direction of housing 10 (the direction in which side SF1 and side SF2 face each other) and when pressed along the thickness direction of housing 10. The short side direction of housing 10 corresponds to a first direction in this application. The thickness direction of housing 10 corresponds to a direction other than the first direction in this application.

[0023] For example, as shown in FIG. 4(A), when the housing 10 is pressed in the thickness direction of the housing 10 (the up-down direction on the paper in FIG. 4(A)), the top and bottom surfaces of the housing 10 are recessed, and the vicinity of the center of the sides SF1, SF2 are deformed so as to protrude in the short side direction of the housing 10 (the left-right direction on the paper in FIG. 4(A)). At this time, the partition 11 is deformed so that the top and bottom surfaces of the partition 11 stretch, as shown in FIG. 4(A). In particular, since the partition 11 is disposed closer to the bottom side than the center in the thickness direction of the housing 10, the amount of stretch on the top side is greater than the amount of stretch on the bottom side. Since the piezoelectric sensor 12 is disposed on the top surface of the partition 11, it is deformed so as to stretch significantly along the short side direction of the housing 10.

[0024] On the other hand, as shown in Fig. 4(B), when the housing 10 is pressed in the short direction of the housing 10 (the left-right direction on the paper in Fig. 4(B)), the sides SF1 and SF2 are recessed and the top and bottom surfaces of the housing 10 are deformed so as to protrude. At this time, the partition 11 is deformed so that the top and bottom surfaces of the partition 11 are contracted, as shown in Fig. 4(B). In particular, the partition 11 is disposed closer to the bottom surface side than the center of the housing 10 in the thickness direction.

[0025] FIG. 5(A) is a diagram showing an example of a signal SL1 when the housing 10 is pressed in the thickness direction. FIG. 5(B) is a diagram showing an example of a signal SL2 when the housing 10 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned. When the housing 10 is pressed in the thickness direction, the piezoelectric sensor 12 is deformed so as to extend along the short side direction of the housing 10. On the other hand, when the housing 10 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned, the piezoelectric sensor 12 is deformed so as to contract along the short side direction of the housing 10. That is, when the housing 10 is pressed in the thickness direction and when the housing 10 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned, the piezoelectric sensor 12 expands and contracts in opposite directions. For this reason, as shown in FIG. 5(A) and FIG. 5(B), the polarity of the signal SL1 when the housing 10 is pressed in the thickness direction is inverted with respect to the polarity of the signal SL2 when the housing 10 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned. By utilizing the inversion of the polarity of the signal, the electronic device 1 can distinguish between pressure on the top and bottom surfaces of the housing 10 and pressure on surfaces other than the top and bottom surfaces (for example, side surfaces SF1, SF2 or SF3, SF4 of the housing 10). In other words, the electronic device 1 can detect that different surfaces of the housing 10 are being pressed.

[0026] The deformation of the housing 10 is not limited to the state shown in Fig. 4(A) and Fig. 4(B). For example, only one of the faces of the housing 10 may be pressed. Even in such a case, it is possible to detect the pressure on the top and bottom faces of the housing 10 and the pressure on faces other than the top and bottom faces (for example, the side faces SF1, SF2 or SF3, SF4 of the housing 10) in a distinguishable manner.

[0027] The same effect can be achieved even if the partition 11 does not connect the side surfaces SF1 and SF2, but connects the side surfaces SF3 and SF4. In this case, the side surfaces SF3 and SF4 correspond to the first and second portions in the present application. The piezoelectric sensor 12 outputs signals having different polarities when the housing 10 is pressed in the thickness direction and when the housing 10 is pressed in the direction in which the side surfaces SF3 and SF4 are aligned. Therefore, the electronic device 1 can detect the case in which the housing 10 is pressed in the thickness direction and the case in which the side surfaces SF3 and SF4 are aligned separately.

[0028] [Variation 1] Hereinafter, an electronic device 1a according to a first modification of the electronic device 1 will be described with reference to the drawings. FIG 6 is a diagram showing an electronic device 1a according to a first modification of the electronic device 1.

[0029] 6, in the electronic device 1a, the partition 11 is disposed in a position very close to the bottom or top surface of the housing 10. In this modification, the partition 11 is disposed in a position close to the top surface of the housing 10 within the housing 10. The distance between the partition 11 and the top surface of the housing 10 in this modification is shorter than the distance between the partition 11 and the bottom surface of the housing 10 in the first embodiment.

[0030] When the side surfaces SF1 and SF2 of the housing 10 are pressed, the partition 11 bends convexly upward if it is disposed near the top surface of the housing 10. When the side surfaces SF1 and SF2 of the housing 10 are pressed, the partition 11 bends convexly downward if it is disposed near the bottom surface of the housing 10. On the other hand, when the partition 11 is disposed at the center in the thickness direction, it is difficult to bend upward or downward even if the side surfaces SF1 and SF2 of the housing 10 are pressed. The deformation amount of the partition 11 with respect to the same pressing force becomes larger as the partition 11 is disposed near the top surface or the bottom surface of the housing 10. In other words, the sensitivity of the piezoelectric sensor 12 improves as the partition 11 is disposed near the top surface or the bottom surface of the housing 10. The distance between the partition 11 and the top surface of the housing 10 in this modification is shorter than the distance between the partition 11 and the bottom surface of the housing 10 in the first embodiment. Therefore, the sensitivity of the piezoelectric sensor 12 in this modified example is higher than the sensitivity of the piezoelectric sensor 12 in the first embodiment.

[0031] [Variation 2] Hereinafter, electronic devices 1b, 1c, and 1d according to Modification 2 of electronic device 1 will be described with reference to the drawings. Fig. 7(A) is a top view showing electronic device 1b according to Modification 2 of electronic device 1. Fig. 7(B) is a cross-sectional view taken along line AA in Fig. 7(A). Figs. 8(A) and 8(B) are views showing electronic devices 1c and 1d according to Modification 2 of electronic device 1, respectively.

[0032] The electronic devices 1b, 1c, and 1d differ from the electronic device 1 in that they include partitions 11b, 11c, and 11d that are different from the partition 11. The partitions 11b, 11c, and 11d do not connect the two side surfaces SF3 and SF4.

[0033] As shown in Fig. 7(A), electronic device 1b has partition 11b instead of partition 11. As shown in Fig. 7(A) and Fig. 7(B), partition 11b extends from side surface SF3 toward side surface SF4. Partition 11b does not contact side surface SF4. The other configuration of partition 11b is the same as that of partition 11, and therefore description thereof will be omitted.

[0034] As shown in Fig. 8(A), electronic device 1c has partition 11c instead of partition 11. The extension direction of partition 11c is inclined with respect to the longitudinal direction of housing 10 (the left-right direction on the paper in Fig. 8(A)). In Fig. 8(A), partition 11c extends from the side formed by the bottom surface and side surface SF3 of housing 10 toward the upper right direction on the paper. The other configuration of electronic device 1c is the same as that of electronic device 1, so a description thereof will be omitted.

[0035] As shown in FIG. 8B, the electronic device 1d includes a partition 11d instead of the partition 11. The partition 11d includes a first member 110d and a second member 111d. The first member 110d extends from the side surface SF3 toward the side surface SF4. The second member 111d extends from the side surface SF4 toward the side surface SF3. The second member 111d does not contact the first member 110d. In FIG. 8B, the piezoelectric sensor 12 is disposed in the first member 110d, but may be disposed in the second member 111d. In FIG. 8B, the second member 111d is larger than the first member 110d, but the size of the first member 110d and the size of the second member 111d may be the same or different. The other configurations of the electronic device 1d are the same as those of the electronic device 1, and therefore will not be described.

[0036] Partitions 11b, 11c, and 11d do not connect side surface SF3 and side surface SF4, but connect side surface SF1 and side surface SF2. Therefore, in electronic devices 1b, 1c, and 1d, similar to electronic device 1, piezoelectric sensor 12 outputs signals of different polarities depending on whether pressure is applied along the short direction of housing 10 or along the thickness direction. Therefore, electronic devices 1b, 1c, and 1d can distinguish between pressure applied to the top and bottom surfaces of housing 10 and pressure applied to side surfaces SF1 and SF2.

[0037] In the electronic device 1d, the first member 110d and the second member 111d may be in contact with each other. The first member 110d and the second member 111d in contact with each other may connect the side surface SF3 and the side surface SF4. When the housing 10 is pressed in the direction in which the side surfaces SF3 and SF4 are aligned, the piezoelectric sensor 12 deforms in the same manner as when the housing 10 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned. Therefore, the electronic device 1d can detect pressure applied to the side surfaces SF3 and SF4 of the housing 10 and pressure applied to the top and bottom surfaces separately.

[0038] [Variation 3] Hereinafter, with reference to the drawings, a description will be given of electronic devices 1e, 1f, and 1g according to Modification 3 of the electronic device 1. Fig. 9(A), Fig. 9(B), and Fig. 9(C) are diagrams showing electronic devices 1e, 1f, and 1g according to Modification 3 of the electronic device 1, respectively.

[0039] 9(A), the electronic device 1e is different from the electronic device 1d in that the piezoelectric sensor 12 is disposed across both the first member 110d and the second member 111d of the partition 11d. The other configurations of the electronic device 1e are the same as those of the electronic device 1d, and therefore will not be described.

[0040] As shown in FIG. 9B, the electronic device 1f is different from the electronic device 1e in that it includes a partition 11f different from the partition 11d. The partition 11f includes a first member 110f and a second member 111f. In FIG. 9B, the first member 110f extends from a side formed by the bottom surface of the housing 10 and the side surface SF3 toward the upper right direction of the paper, and the second member 111f extends from a side formed by the top surface of the housing 10 and the side surface SF4 toward the lower left direction of the paper. The second member 111f does not contact the first member 110f. The piezoelectric sensor 12 is disposed across the first member 110f and the second member 111f. The other configurations of the electronic device 1f are the same as those of the electronic device 1, so a description thereof will be omitted.

[0041] As shown in FIG. 9(C), the electronic device 1g is different from the electronic device 1e in that the electronic device 1g includes a partition 11g different from the partition 11d. The partition 11g includes a third member 112g in addition to the first member 110d and the second member 111d. The third member 112g is disposed between the first member 110d and the second member 111d. The third member 112g is not in contact with the first member 110d and the second member 111d. The piezoelectric sensor 12 is disposed across the first member 110d, the second member 111d, and the third member 112g. The other configurations of the electronic device 1g are the same as those of the electronic device 1e, and therefore will not be described.

[0042] The electronic devices 1e, 1f, and 1g have the same effects as the electronic devices 1b, 1c, and 1d.

[0043] 9(A) to 9(C), the electronic device of the present application may be configured such that the piezoelectric sensor 12 is in contact with a plurality of members each in contact with opposing side surfaces of the housing 10. In other words, the electronic device may be configured such that a plurality of first members and the piezoelectric sensor 12 are in continuous contact with opposing side surfaces of the housing 10. Even in such a configuration, the piezoelectric sensor 12 can obtain a sufficient output because each of the plurality of partitions is in contact with the opposing side surfaces.

[0044] [Variation 4] Hereinafter, with reference to the drawings, a description will be given of electronic devices 1h, 1i, and 1j according to Modification 4 of the electronic device 1. Fig. 10(A), Fig. 10(B), and Fig. 10(C) are diagrams showing electronic devices 1h, 1i, and 1j according to Modification 4 of the electronic device 1, respectively.

[0045] The electronic devices 1h, 1i, and 1j differ from the electronic device 1 in that the volume of the partition is larger than the volume of the portion of the housing 10 where the partition is not disposed.

[0046] 10(A), the electronic device 1h includes a partition 11h that is different from the partition 11. The partition 11h is disposed in all parts of the housing 10 except for the vicinity of the top surface of the housing 10. The other configurations of the electronic device 1h are the same as those of the electronic device 1, and therefore will not be described.

[0047] 10(B), electronic device 1i differs from electronic device 1h in that it includes partition 11i that is different from partition 11h. Partition 11i is disposed in all parts of housing 10 except for the vicinity of the top surface and the vicinity of the bottom surface of housing 10. The distance between partition 11h and the top surface of housing 10 is approximately the same as the distance between partition 11h and the bottom surface of housing 10. Other configurations of electronic device 1i are the same as those of electronic device 1h, so description thereof will be omitted.

[0048] 10(C), electronic device 1j differs from electronic device 1i in that electronic device 1j includes partition 11j that is different from partition 11i. The distance between partition 11j and the top surface of housing 10 is different from the distance between partition 11j and the bottom surface of housing 10. Other configurations of electronic device 1j are the same as those of electronic device 1i, and therefore description thereof will be omitted.

[0049] When the top and bottom surfaces of the housing 10 are pressed, the pressing force of the top and bottom surfaces of the housing 10 is transmitted to the partition, and the partition bends upward or downward in a convex manner, similar to the top or bottom surface of the housing 10. The larger the volume of the partition, the easier the pressing force is transmitted to the partition. Therefore, for the same pressing force, the larger the volume of the partition, the greater the amount of deformation of the partition. In other words, the larger the volume of the partition, the higher the sensitivity of the piezoelectric sensor 12. The volume of the partitions 11h, 11i, and 11j in the fourth modification is larger than the volume of the part of the housing 10 where the partitions 11h, 11i, and 11j are not arranged. Therefore, the sensitivity of the piezoelectric sensor 12 in the fourth modification is higher than the sensitivity of the piezoelectric sensor 12 in the first embodiment.

[0050] [Variation 5] Hereinafter, with reference to the drawings, a description will be given of electronic devices 1k, 1m, 1n, and 1o according to Modification 5 of electronic device 1. Fig. 11(A), Fig. 11(B), Fig. 11(C), and Fig. 11(D) are diagrams showing electronic devices 1k, 1m, 1n, and 1o according to Modification 5 of electronic device 1, respectively.

[0051] The electronic devices 1k, 1m, 1n, and 1o differ from the electronic device 1 in that a plurality of members included in the partition are arranged in the thickness direction of the housing 10.

[0052] As shown in FIG. 11(A), the electronic device 1k includes a partition 11k including a first member 110k and a second member 111k. The first member 110k and the second member 111k are aligned in the thickness direction of the housing 10. A gap exists between the first member 110k and the second member 111k. The volume of the second member 111k is larger than the volume of the gap. The piezoelectric sensor 12 is disposed in the first member 110k. Other configurations of the electronic device 1k are the same as those of the electronic device 1, and therefore description thereof will be omitted.

[0053] 11(B), electronic device 1m differs from electronic device 1k in that it includes partition 11m different from partition 11k. Partition 11m includes second member 111m different from second member 111k. The volume of second member 111m is smaller than the volume of the gap between first member 110k and second member 111m. Other configurations of electronic device 1m are the same as those of electronic device 1k, so description thereof will be omitted.

[0054] 11(C), the electronic device 1n differs from the electronic device 1m in that the second member 111m of the partition 11m does not contact the bottom surface of the housing 10. The other configurations of the electronic device 1n are the same as those of the electronic device 1m, and therefore will not be described.

[0055] As shown in FIG. 11(D), the electronic device 1o is different from the electronic device 1k in that it includes a partition 11o different from the partition 11k. Unlike the partition 11k, the partition 11o includes three members. The partition 11o includes a first member 110o, a second member 111o, and a third member 112o. The partition 11o includes a first member 110o, a second member 111o, and a third member 112o. The first member 110o, the second member 111o, and the third member 112o are aligned in the thickness direction of the housing 10. The first member 110o, the second member 111o, and the third member 112o are not in contact with each other. The other configurations of the electronic device 1o are the same as those of the electronic device 1k, and therefore will not be described.

[0056] The volumes of the partitions 11k, 11m, 11o of the electronic devices 1k, 1m, 1n, 1o of the fifth modification are larger than the volumes of the portions of the housing 10 where the partitions 11k, 11m, 11o are not arranged. Therefore, the sensitivity of the piezoelectric sensor 12 of each of the electronic devices 1k, 1m, 1n, 1o of the fifth modification is also higher than the sensitivity of the piezoelectric sensor 12 of the first embodiment.

[0057] [Experiments using electronic devices 1, 1a, and 1o] Hereinafter, an experiment using the electronic devices 1, 1a, and 1o will be described with reference to the drawings. Fig. 12 is a diagram showing the results of an experiment using the electronic devices 1, 1a, and 1o. Fig. 12 shows the output of the piezoelectric sensor 12 when the housing 10 of the electronic devices 1, 1a, and 1o is pressed in the thickness direction of the housing 10 and the output of the piezoelectric sensor 12 when pressed in the direction in which the side surfaces SF1 and SF2 are aligned. In the table in Fig. 12, the output of the piezoelectric sensor 12 when the housing 10 of the electronic device 1o is pressed in the thickness direction is used as the reference.

[0058] 12, in electronic device 1, when housing 10 is pressed in the thickness direction, the output of piezoelectric sensor 12 is 8%, that is, the polarity of the signal of piezoelectric sensor 12 is positive. Similarly, in each of electronic devices 1a and 1o, when housing 10 is pressed in the thickness direction, the polarity of the signal of piezoelectric sensor 12 is positive.

[0059] 12, when the housing 10 of the electronic device 1 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned, the output of the piezoelectric sensor 12 is -4%, that is, the polarity of the signal of the piezoelectric sensor 12 is negative. Similarly, when the housing 10 of each of the electronic devices 1a and 1o is pressed in the thickness direction, the polarity of the signal of the piezoelectric sensor 12 is negative.

[0060] As described above, in the electronic devices 1, 1a, and 1o, the polarity of the signal output by the piezoelectric sensor 12 differs when the housing 10 is pressed in the thickness direction and when the housing 10 is pressed in the direction in which the side surfaces SF1 and SF2 are aligned. Therefore, the electronic devices 1, 1a, and 1o can distinguish between pressure on the side surfaces SF1 and SF2 of the housing 10 and pressure on the top and bottom surfaces of the housing 10 by detecting whether the polarity of the signal output by the piezoelectric sensor 12 is positive or negative.

[0061] Furthermore, as described in Modification 1, when the side surfaces SF1, SF2 of the housing 10 are pressed, the amount of deformation of the partition 11 becomes greater the closer the partition 11 is disposed to the top or bottom surface of the housing 10. The partition 11 in the electronic device 1a is disposed to a position closer to the top or bottom surface of the housing 10 compared to the partition 11 in the electronic device 1. For this reason, as shown in Fig. 12, when the housing 10 is pressed in the direction in which the side surfaces SF1, SF2 are aligned, the output of the piezoelectric sensor 12 in the electronic device 1a becomes greater than the output of the piezoelectric sensor 12 in the electronic device 1.

[0062] Furthermore, as described in Modifications 4 and 5, when the top and bottom surfaces of the housing 10 are pressed, the larger the volume of the partition 11, the more easily the pressing force is transmitted to the partition 11. The volume of the partition 11o in the electronic device 1o is larger than the volumes of the partitions 11 in the electronic devices 1 and 1a. For this reason, as shown in Fig. 12, when the housing 10 is pressed in the thickness direction, the output of the piezoelectric sensor 12 in the electronic device 1o is larger than the output of the piezoelectric sensor 12 in the electronic devices 1 and 1a.

[0063] [Variation 6] Hereinafter, with reference to the drawings, a description will be given of electronic devices 1p, 1q, and 1r according to Modification 6 of the electronic device 1. Fig. 13(A), Fig. 13(B), and Fig. 13(C) are diagrams showing electronic devices 1p, 1q, and 1r according to Modification 6 of the electronic device 1, respectively.

[0064] The electronic devices 1p, 1q, and 1r differ from the electronic device 1 in that a piezoelectric sensor 12 is sandwiched between the electronic devices.

[0065] As shown in FIG. 13(A), the electronic device 1p includes a partition 11p. The partition 11p includes a first member 110p and a second member 111p. The first member 110p and the second member 111p are aligned in the thickness direction of the housing 10. The first member 110p and the second member 111p are not in contact with each other, and a gap GP1 exists between the first member 110p and the second member 111p. The piezoelectric sensor 12 is disposed in the first member 110p. The piezoelectric sensor 12 is disposed between the first member 110p and the second member 111p, that is, in the gap GP1. The other configurations of the electronic device 1p are the same as those of the electronic device 1, and therefore will not be described.

[0066] 13B, the electronic device 1q differs from the electronic device 1p in that the second member 111p contacts the upper surface of the housing 10. Other configurations of the electronic device 1q are the same as those of the electronic device 1p, and therefore will not be described.

[0067] 13(C), the electronic device 1r differs from the electronic device 1q in that the first member 110p is in contact with the bottom surface of the housing 10. Other configurations of the electronic device 1r are the same as those of the electronic device 1q, and therefore will not be described.

[0068] In the electronic devices 1p, 1q, and 1r, the piezoelectric sensor 12 is disposed in the gap GP1. Therefore, even if the housing 10 is impacted by, for example, the electronic devices 1p, 1q, and 1r being dropped, the vibrations generated in the housing 10 by the impact are not transmitted to the piezoelectric sensor 12. Therefore, the piezoelectric sensor 12 is less likely to malfunction due to the impact of the drop or the like. In addition, the volume of the partition 11p in each of the electronic devices 1p, 1q, and 1r is larger than the volume of the portion of the housing 10 where the partition 11p is not disposed. Therefore, the sensitivity of the piezoelectric sensor 12 in each of the electronic devices 1p, 1q, and 1r is also higher than the sensitivity of the piezoelectric sensor 12 in the first embodiment.

[0069] [Variation 7] Hereinafter, with reference to the drawings, a description will be given of electronic devices 1s, 1t, and 1u according to Modification 7 of the electronic device 1. Fig. 14(A), Fig. 14(B), and Fig. 14(C) are diagrams showing electronic devices 1s, 1t, and 1u according to Modification 7 of the electronic device 1, respectively.

[0070] The electronic devices 1s, 1t, and 1u differ from the electronic device 1r in that a single partition surrounds the piezoelectric sensor 12.

[0071] As shown in Fig. 14(A), the electronic device 1s includes a partition 11s. Within the partition 11s, there is a gap GP2 that is larger than the piezoelectric sensor 12. The piezoelectric sensor 12 is disposed within the gap GP2. The gap GP2 is located on the side surface SF1 of the housing 10. The gap GP2 contacts the side surface SF1 of the housing 10. Other configurations of the electronic device 1s are the same as those of the electronic device 1r, and therefore will not be described.

[0072] 14(B), the electronic device 1t includes a partition 11t that is different from the partition 11s. The partition 11t does not contact the bottom or top surface of the housing 10. The other configurations of the electronic device 1t are the same as those of the electronic device 1s, and therefore will not be described.

[0073] As shown in Fig. 14(C), the electronic device 1u includes a partition 11u that is different from the partition 11t. In the partition 11u, the gap GP2 is located closer to the center of the partition 11u in the short side direction than the gap GP2 in the partition 11t. The gap GP2 does not contact the side surface SF2. Therefore, in the electronic device 1u, the entire surface of the piezoelectric sensor 12 is surrounded by the partition 11u. The other configurations of the electronic device 1u are the same as those of the electronic device 1t, and therefore will not be described.

[0074] The volume of the partition 11p in each of the electronic devices 1p, 1q, and 1r is larger than the volume of the portion where the partition 11p is not arranged in the housing 10. Therefore, the sensitivity of the piezoelectric sensor 12 in each of the electronic devices 1p, 1q, and 1r is also higher than the sensitivity of the piezoelectric sensor 12 in the first embodiment.

[0075] The partitions 11s, 11t, and 11u may be connected to ground, in which case the piezoelectric sensor 12 surrounded by the partitions 11s, 11t, and 11u is less susceptible to the effects of external noise, and the sensitivity of the piezoelectric sensor 12 is increased.

[0076] [Variation 8] Hereinafter, the eighth modification of the electronic device 1 will be described with reference to the drawings. Fig. 15 is a diagram showing an electronic device 1v according to the eighth modification of the electronic device 1.

[0077] As shown in Fig. 15, electronic device 1v includes components 20, 21, and 22. In this modification, housing 10 surrounds components 20, 21, and 22. Electronic device 1v is, for example, a small electronic device such as a smartphone or a TWS (True Wireless Stereo) earphone. Housing 10 is, for example, a smartphone case or an earphone housing. Each of components 20, 21, and 22 is, for example, a battery, a board, a Bluetooth (registered trademark) module, or the like, for implementing the functions of electronic device 1v.

[0078] In such electronic device 1v, for example, when component 21 connects side SF1 and side SF2 of housing 10, component 21 functions as partition 11 in the first embodiment. Piezoelectric sensor 12 is disposed on component 21. At this time, when housing 10 is pressed in the thickness direction, piezoelectric sensor 12 disposed on the upper surface of component 21 is deformed so as to be greatly expanded along the short side direction of housing 10. On the other hand, when housing 10 is pressed in the short side direction, piezoelectric sensor 12 disposed on the upper surface of component 21 is deformed so as to be greatly contracted along the short side direction of housing 10. As a result, in electronic device 1v, since the polarity of the signal is different between the pressure on the top and bottom surfaces of housing 10 and the pressure on the sides SF1 and SF2, it is possible to distinguish and detect the pressure on the top and bottom surfaces of housing 10 and the pressure on the sides SF1 and SF2.

[0079] 15, even if there is no space for attaching the piezoelectric sensor 12 to the housing 10 of the electronic device 1v, it is possible to detect which part of the housing 10 is being pressed by simply placing the piezoelectric sensor 12 on the part 21 connecting the two side surfaces of the housing 10. In other words, there is no need to provide a space for attaching the piezoelectric sensor 12 to the housing 10, and the electronic device 1v can be made smaller and more space-saving.

[0080] If the electronic device 1v has electrodes as components, the electrodes may be used as the first electrode 121 and the second electrode 122 of the piezoelectric sensor 12. In this case, only the piezoelectric film 120 needs to be attached to the component 21 connecting the two side surfaces of the housing 10.

[0081] [Other embodiments] The description of the present embodiment should be considered as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims, not by the above-described embodiments. Furthermore, the scope of the present invention includes the scope equivalent to the claims.

[0082] The electronic devices according to the present invention are not limited to the electronic devices 1, 1a to 1k, and 1m to 1v, and may be modified within the scope of the invention. The configurations of the electronic devices 1, 1a to 1k, and 1m to 1v may be combined in any desired manner.

[0083] In addition, when the partition 11 connects the side SF3 and the side SF4 in addition to the side SF1 and SF2, the electronic device 1 can detect a pressure in the direction in which the side SF3 and SF4 are arranged. Here, since the area of ​​the side SF3 and SF4 is smaller than the area of ​​the side SF1 and SF2, if the pressure is the same, the deformation amount of the side SF3 and SF4 is smaller than the deformation amount of the side SF1 and SF2. Therefore, the deformation amount of the partition 11 when the side SF3 and SF4 are pressed is smaller than the deformation amount of the partition 11 when the side SF1 and SF2 are pressed, so the deformation amount of the piezoelectric sensor 12 when the side SF3 and SF4 are pressed is small. Therefore, the output of the piezoelectric sensor 12 when the side SF3 and SF4 are pressed is smaller than the output of the piezoelectric sensor 12 when the side SF1 and SF2 are pressed. Therefore, the electronic device 1 may detect whether the side SF1 and SF2 or the side SF3 and SF4 are pressed based on the magnitude of the output of the piezoelectric sensor 12. Specifically, when the piezoelectric sensor 12 outputs a negative signal with respect to the reference potential, if the magnitude of the signal is smaller than a predetermined threshold, the electronic device 1 may detect that the side surfaces SF3 and SF4 are pressed, and if the magnitude of the signal is larger than the predetermined threshold, the electronic device 1 may detect that the side surfaces SF1 and SF2 are pressed. In other words, the electronic device 1 may detect which pair of opposing surfaces of the rectangular parallelepiped housing 10 is pressed.

[0084] The present invention has the following structure:

[0085] (1) A housing having a hollow shape; A partition disposed within the housing; a sensor disposed on the partition and configured to detect deformation of the partition; Equipped with The partition connects a first portion on the inner surface of the housing and a second portion opposite to the first portion. electronic equipment.

[0086] (2) The sensor outputs signals of different polarities depending on whether the sensor is compressed along a first direction in which the first portion and the second portion of the housing face each other or along a direction other than the first direction. (1) An electronic device as described in (1).

[0087] (3) The volume of the partition is larger than the volume of a portion of the housing where the partition is not disposed. An electronic device as described in (1) or (2).

[0088] (4) The sensor is disposed near either the first portion or the second portion. An electronic device described in any one of (1) to (3).

[0089] (5) The sensor is not in contact with the housing. An electronic device described in any one of (1) to (4).

[0090] (6) The partition includes a first member and a second member, The sensor is disposed on the first member or the second member, A gap exists between the first member and the second member, The sensor is disposed in the gap. An electronic device described in any one of (1) to (5).

[0091] (7) The divider is connected to ground. An electronic device according to any one of (1) to (6). [Explanation of symbols]

[0092] 1,1a~1k,1m~1v:Electronic equipment 10: Housing 11, 11b-11d, 11f-11u: Shikiri 12: Piezoelectric sensor 120: Piezoelectric film 121: 1st electrode 122:Second electrode 20, 21, 22: Parts 110d, 110f, 110k, 110o, 110p: first member 111d, 111f, 111k, 111m, 111o, 111p: second member 112g, 112o: third member GP1,GP2: air gap OD: Stretching direction SF1~SF4: Side SL1, SL2: Signal

Claims

1. A housing having a hollow shape; A partition disposed within the housing; a sensor disposed on the partition and configured to detect deformation of the partition; Equipped with The partition connects a first portion on the inner surface of the housing and a second portion opposite to the first portion. electronic equipment.

2. The sensor outputs signals of different polarities depending on whether the sensor is compressed along a first direction in which the first portion and the second portion of the housing face each other or along a direction other than the first direction.

2. The electronic device according to claim 1.

3. The volume of the partition is larger than the volume of a portion of the housing where the partition is not disposed.

3. The electronic device according to claim 1 or 2.

4. The sensor is disposed near either the first portion or the second portion.

3. The electronic device according to claim 1 or 2.

5. The sensor is not in contact with the housing.

3. The electronic device according to claim 1 or 2.

6. The partition includes a first member and a second member, The sensor is disposed on the first member or the second member, A gap exists between the first member and the second member, The sensor is disposed in the gap.

3. The electronic device according to claim 1 or 2.

7. The divider is connected to ground.

3. The electronic device according to claim 1 or 2.

Citation Information

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