Sensor device and manufacturing method thereof
JP2025039247APending Publication Date: 2025-03-21TOPPAN HOLDINGS INC
Patent Information
- Application Number
- JP2023146194
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-08
- Publication Date
- 2025-03-21
Smart Images
Figure 2025039247000001_ABST
Abstract
To improve the sensitivity of a piezoelectric element.SOLUTION: A sensor device includes: a plurality of lower electrodes 11 provided on a base material 10; a plurality of conductive adhesive layers 12 provided on each of the plurality of lower electrodes 11; a plurality of intermediate electrodes 13 provided on each of the plurality of conductive adhesive layers 12; a dielectric layer 14 provided in common on the plurality of intermediate electrodes 13; and an upper electrode 15 provided on the dielectric layer 14.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
Sensor device and manufacturing method of the same
JP2021027270A