Light-emitting device

Abstract

To provide a light-emitting device capable of enhancing a bonding force between a transmissive performance member and a base body via a bonding member while relaxing a stress to the transmissive performance member.SOLUTION: A light-emitting device comprises: a side wall part that includes a first upper surface; a base body that includes a second upper surface surrounding a periphery with the side wall part; a light emitting element that is arranged onto the second upper surface; a plurality of bonding members that are arranged so as to be separated from the first upper surface; a transmissive performance member that includes a first region that is arranged to an upper direction of the first upper surface, and a second region arranged to the upper direction of the second upper surface, and is bonded with a part of the first upper surface by each bonding member; and a first coated film that is provided to the first region of the lower surface of the transmissive performance member. In the first region, there is a part where the first coated film is not provided.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a light emitting device. [Background technology]

[0002] 2. Description of the Related Art A known light emitting device has a structure in which a light emitting element is disposed in a recess provided in a base, and a light transmissive member is bonded to the base so as to cover the upper part of the recess. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-137428 A [Patent Document 2] JP 2020-92265 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a light emitting device capable of increasing the bonding strength between the light transmissive member and the base via a bonding member while mitigating stress on the light transmissive member. [Means for solving the problem]

[0005] According to one aspect of the present invention, a light emitting device comprises a base having a sidewall portion having a first upper surface and a second upper surface surrounded by the sidewall portion, a light emitting element arranged on the second upper surface, a plurality of bonding members arranged at a distance from each other on the first upper surface, a translucent member having a lower surface including a first region arranged above the first upper surface and a second region arranged above the second upper surface, the translucent member being joined to a portion of the first upper surface by the bonding member, and a first coating film provided in the first region of the lower surface of the translucent member, wherein there is a portion in the first region where the first coating film is not provided. Effect of the Invention

[0006] According to the light emitting device of the present invention, it is possible to strengthen the bonding strength between the light transmissive member and the base via the bonding member while reducing stress on the light transmissive member. [Brief description of the drawings]

[0007] [Figure 1A] 1 is a schematic top view of a light emitting device according to one embodiment of the present invention; [Figure 1B] 1 is a schematic bottom view of a light emitting device according to one embodiment of the present invention. [Figure 2A] FIG. 2 is a schematic cross-sectional view taken along line IIA-IIA in FIG. [Figure 2B] 2 is a schematic cross-sectional view showing an enlarged view of a joining member and its surrounding area in the light-emitting device of the embodiment of the present invention. FIG. [Diagram 3] FIG. 2 is a schematic top view of a base and a light-emitting element according to one embodiment of the present invention. [Figure 4] 3A and 3B are schematic top views showing examples of arrangement of bonding members in the light emitting device according to one embodiment of the present invention. [Diagram 5] FIG. 2 is a schematic bottom view of a light-transmitting member according to an embodiment of the present invention. [Figure 6] FIG. 2 is a schematic cross-sectional view showing a partially enlarged light-transmitting member according to one embodiment of the present invention. [Figure 7] FIG. 2 is an exploded perspective view that illustrates a jig for forming a first coating film on a light-transmitting member according to one embodiment of the present invention. [Figure 8A] 8 is a schematic bottom view of the jig shown in FIG. 7 and the light-transmitting member housed in the jig. [Figure 8B] 8B is a schematic cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A. [Figure 9] 8 is a schematic perspective view of the upper surface side of the jig shown in FIG. 7 and a light-transmitting member housed in the jig. [Figure 10A] 3A and 3B are schematic top views showing examples of arrangement of bonding members in the light emitting device according to one embodiment of the present invention. [Figure 10B] 10B is a schematic cross-sectional view taken along line XB-XB in FIG. 10A. [Figure 11]3A and 3B are schematic top views showing examples of arrangement of bonding members in the light emitting device according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the embodiments will be described with reference to the drawings. In each drawing, the same components are given the same reference numerals. Note that since each drawing is a schematic illustration of the embodiment, the scale, intervals, or positional relationships of each component may be exaggerated, some components may be omitted, or end views showing only the cut surfaces may be used as cross-sectional views.

[0009] [First embodiment] FIG. 1A is a schematic top view of a light emitting device 1 according to a first embodiment of the present invention. FIG. 1B is a schematic bottom view of the light emitting device 1. FIG. FIG. 2A is a schematic cross-sectional view taken along line IIA-IIA in FIG. FIG. 2B is an enlarged schematic cross-sectional view showing the joining member and its surrounding area.

[0010] The light emitting device 1 of the first embodiment of the present invention includes a base 10, a light emitting element 20, a light-transmitting member 40, and a bonding member 30.

[0011] As shown in FIG. 2A, the base 10 supports the light-emitting element 20. The base 10 includes an insulating base material, a first lower surface wiring 71, a second lower surface wiring 72, a first upper surface wiring 81, and a second upper surface wiring 82. The insulating base material is made of, for example, ceramic. Examples of ceramics include aluminum nitride, aluminum oxide, and mullite. The base 10 has a sidewall portion 15 having a first upper surface 11, and a second upper surface 12 surrounded by the sidewall portion 15. An inner wall surface 16 of the sidewall portion 15 and the second upper surface 12 define a recess. The second upper surface 12 is the bottom of the recess.

[0012] As shown in Fig. 1A, the base 10 is generally rectangular in top view. A generally rectangular shape has four sides and four corners. The corners can be right angles, rounded, or partially removed as shown in Fig. 1A.

[0013] 1B, the bottom surface 13 of the base 10 has a first bottom surface wiring 71 and a second bottom surface wiring 72. An anode potential is applied to one of the first bottom surface wiring 71 and the second bottom surface wiring 72, and a cathode potential is applied to the other.

[0014] 2A, the light-emitting element 20 is disposed on the second upper surface 12 of the base 10. The light-emitting element 20 is located in a space 61 defined by the inner wall surface 16 of the side wall portion 15 of the base 10, the second upper surface 12, and the light-transmitting member 40.

[0015] The light emitting element 20 emits, for example, ultraviolet light. The light emitting device 1 of this embodiment can be used, for example, for hardening a resin material or a glass material by the ultraviolet light emitted by the light emitting element 20. The light emitting element 20 may emit visible light.

[0016] FIG. 3 is a top view of the base body 10 and the light emitting element 20. As shown in FIG.

[0017] The second upper surface 12 of the base 10 has a first upper surface wiring 81, a second upper surface wiring 82, and a third upper surface wiring 83. The light emitting element 20 is disposed on the first upper surface wiring 81. A lower surface electrode is disposed on the lower surface of the light emitting element 20. The lower surface electrode is joined to the first upper surface wiring 81 via, for example, solder or conductive paste, and is electrically connected to the first upper surface wiring 81.

[0018] Moreover, an upper surface electrode is disposed on the upper surface of the light emitting element 20. The upper surface electrode is electrically connected to a second upper surface wiring 82 via a metal wire (e.g., an Au wire). One of the first upper surface wiring 81 and the second upper surface wiring 82 is electrically connected to one of the first lower surface wiring 71 and the second lower surface wiring 72 disposed on the lower surface 13 of the base 10, and the other of the first upper surface wiring 81 and the second upper surface wiring 82 is electrically connected to the other of the first lower surface wiring 71 and the second lower surface wiring 72.

[0019] An ESD (Electro Static Discharge) protection diode 21 is disposed on the third upper surface wiring 83. The ESD protection diode 21 is, for example, a Zener diode. A lower surface electrode is formed on the lower surface of the ESD protection diode 21. The lower surface electrode is joined to the third upper surface wiring 83 via, for example, solder or conductive paste, and is electrically connected to the third upper surface wiring 83. An upper surface electrode is formed on the upper surface of the ESD protection diode 21. The upper surface electrode is electrically connected to the second upper surface wiring 82 via a metal wire (for example, an Au wire). The third upper surface wiring 83 is electrically connected to the lower surface wiring connected to the first upper surface wiring 81, of the first lower surface wiring 71 and the second lower surface wiring 72.

[0020] 2A, the light-transmitting member 40 is disposed on the base 10 so as to cover the space 61 in which the light-emitting element 20 is disposed. The light-transmitting member 40 protects the light-emitting element 20 from the outside. The light-transmitting member 40 is translucent to the light emitted by the light-emitting element 20. The light-transmitting member 40 is made of glass (e.g., borosilicate glass), sapphire, or the like.

[0021] The light-transmitting member 40 may function as a lens that collects or diffuses the light emitted by the light-emitting element 20. As an example of such a light-transmitting member 40, a shape having a convex portion 44 as shown in FIG. 2A may be mentioned. The light-transmitting member 40 shown in FIG. 1A has a flange portion 45. The flange portion 45 is located between the outer periphery of the convex portion 44 and the corner portion of the substantially rectangular base body 10 in a top view. Four flange portions 45 are provided corresponding to the four corner portions of the base body 10. In the example shown in FIG. 2A, the light-transmitting member 40 has a shape having one convex portion 44 with a convex upper surface. The light-transmitting member 40 may have a shape having one recessed portion with a concave upper surface or may be flat. A plurality of convex portions and recessed portions may be arranged.

[0022] 2A, the lower surface 43 of the light-transmitting member 40 includes a first region 41 disposed above the first upper surface 11 of the base 10, and a second region 42 disposed above the second upper surface 12. The second region 42 faces the upper surface of the light-emitting element 20 across a space 61.

[0023] As described below, the lower surface 43 of the light-transmitting member 40 is joined to a part of the first upper surface 11 of the base 10 by the joining member 30. That is, between the lower surface 43 of the light-transmitting member 40 and the first upper surface 11 of the base 10, there are a portion where the joining member 30 is arranged and a portion where the joining member 30 is not arranged. FIG. 2A is a cross-sectional view of the entire light-emitting device 1 including the portion where the joining member 30 is not arranged. FIG. 2B is an enlarged cross-sectional view of the portion where the joining member 30 is arranged.

[0024] Fig. 4 is a top view showing an example of the arrangement of the bonding members 30 in the light emitting device 1 of the present embodiment. In Fig. 4, the inner wall surface 16 of the side wall portion 15 of the base 10 is represented by a dashed line. That is, this dashed line also represents the boundary between the first region 41 and the second region 42 of the light-transmitting member 40 in the top view.

[0025] The bonding members 30 are, for example, thermosetting resin members. The bonding members 30 are arranged on the first upper surface 11 of the base 10 in an uncured state. A plurality of bonding members 30 are arranged on the first upper surface 11 at intervals along the sides of the base 10 in a plan view. The area of ​​the bonding members 30 on the first upper surface 11 is not particularly limited as long as the bonding strength between the light-transmitting member 40 and the base 10 can be ensured. The proportion of the area of ​​the bonding members 30 on the first upper surface 11 is preferably, for example, 20% or more and 80% or less.

[0026] Hereinafter, a method for bonding the light-transmitting member 40 and the base 10 by the bonding member 30 will be described. After the bonding member 30 is disposed on the first upper surface 11, the light-transmitting member 40 is disposed on the base 10 so that the lower surface 43 of the light-transmitting member 40 faces the first upper surface 11 and the upper side of the space 61. The uncured bonding member 30 is disposed between the lower surface 43 of the light-transmitting member 40 and the first upper surface 11 of the base 10. At this time, a part of the uncured bonding member 30 crushed between the lower surface 43 of the light-transmitting member 40 and the first upper surface 11 of the base 10 spreads to the second region 42 of the light-transmitting member 40. Thereafter, the bonding member 30 is cured, for example, by heating.

[0027] The uncured bonding member 30 may wet and rise from the first upper surface 11 to the side surface of the light-transmitting member 40. In this case, the cured bonding member 30 forms a so-called fillet as shown in Fig. 2B. This can further strengthen the bonding strength between the light-transmitting member 40 and the first upper surface 11 of the base 10.

[0028] 4 shows an example in which two bonding members 30 are arranged per side of the base 10, but one or three or more bonding members 30 may be arranged per side of the base 10. Furthermore, two bonding members 30 adjacent to each other in a direction along the side of the base 10 may be partially connected to each other. In the example shown in FIG. 4, bonding members 30 are not arranged at the four corners of the substantially rectangular base 10 or on the perpendicular bisectors of the sides of the base 10. Furthermore, as shown in FIG. 11, bonding members 30 may be arranged at the four corners of the substantially rectangular base 10 and in the center of the sides of the base 10.

[0029] The bonding member 30 is bonded to the first upper surface 11 of the base 10 and the first region 41 of the lower surface 43 of the light-transmitting member 40 facing the first upper surface 11. Furthermore, the bonding member 30 is also bonded to a part of the second region 42. The bonding member 30 bonded to a part of the second region 42 is located on the upper side in the space 61. It is preferable that the bonding member 30 is not arranged in a region located above the light-emitting element 20 in the second region 42. For example, in the example shown in FIG. 3, the light-emitting element 20, which is rectangular in top view, is arranged rotated 45 degrees with respect to the rectangular base 10. Each of the four corners of the light-emitting element 20 is arranged on the perpendicular bisector of the side of the base 10. In contrast, the bonding member 30 is not arranged on the perpendicular bisector of the side of the base 10. This can reduce the incidence of light from the light-emitting element 20 into the bonding member 30.

[0030] The bonding member 30 is disposed partially, not entirely, on the first upper surface 11. Due to such partial disposition of the bonding member 30, in the portion where the bonding member 30 is not disposed, as shown in FIG. 2A, there is a gap 62 provided between the lower surface 43 of the light-transmitting member 40 and the first upper surface 11 of the base 10 by the lower surface 43 of the light-transmitting member 40, the first upper surface 11 of the side wall portion 15, and the bonding member 30. The gap 62 penetrates from the space 61 in which the light-emitting element 20 is disposed to the outside of the light-emitting device 1. That is, the space 61 in which the light-emitting element 20 is disposed is a non-airtight space with respect to the outside of the light-emitting device 1. In the example shown in FIG. 4, three gaps 62 are provided per side of the base 10. Also, the gap 62 may be one, two, or four or more gaps per side of the base 10. The height of the gap 62 (the thickness of the bonding member 30 between the first upper surface 11 of the sidewall portion 15 and the light-transmitting member 40) can be, for example, 1 μm or more and 100 μm or less. The height of the gap 62 is preferably 10 μm or more and 50 μm or less. Note that, in the case where a first coating film 51 described below is provided, the height of the gap 62 refers to the thickness of the bonding member 30 between the first upper surface 11 of the sidewall portion 15 and the lower surface of the first coating film 51.

[0031] According to this embodiment, by disposing the bonding member 30 partially on the first upper surface 11, the stress applied to the light-transmitting member 40 can be reduced compared to when the bonding member 30 is disposed over the entire first upper surface 11.

[0032] Moreover, the bonding member 30 is disposed not only in the first region 41 of the lower surface 43 of the light-transmitting member 40 located above the first upper surface 11 of the base 10, but also in the second region 42 located above the second upper surface 12 across the space 61. This makes it possible to increase the contact area between the bonding member 30 and the lower surface 43 of the light-transmitting member 40, thereby strengthening the bonding strength between the bonding member 30 and the light-transmitting member 40. In other words, the bonding strength between the light-transmitting member 40 and the base 10 via the bonding member 30 can be strengthened.

[0033] 4, the multiple bonding members 30 include bonding members 30 located on either side of the center of the lower surface 43 of the light-transmitting member 40 in a plan view. That is, it is preferable that the bonding members 30 are not biased to a specific region along the outer periphery of the base 10. It is also preferable that the portion where the bonding members 30 are not arranged is not biased to a specific region along the outer periphery of the base 10. This makes it easier to prevent excessive stress from being applied to the bonding portion between the light-transmitting member 40 and the base 10, and to maintain a stable bonding state.

[0034] A first coating film is disposed on the lower surface 43 of the light-transmitting member 40, as described below.

[0035] FIG. 5 is a bottom view of the light-transmitting member 40. As shown in FIG. 5, the first coating film 51 is shown as a solid portion. Also, in Fig. 5, the boundary between the first region 41 and the second region 42 (the portion where the inner wall surface 16 of the side wall portion 15 of the base 10 is located) is shown by a two-dot chain line. FIG. 6 is a schematic cross-sectional view showing a part of the light-transmitting member 40 in an enlarged scale.

[0036] The bonding strength between the first coating film 51 and the bonding member 30 is higher than that between the light-transmitting member 40 and the bonding member 30. That is, the affinity between the material of the outermost surface of the first coating film 51 and the material of the bonding member 30 is higher than the affinity between the material of the light-transmitting member 40 and the material of the bonding member 30. This can improve the bonding strength between the light-transmitting member 40 and the base 10 via the bonding member 30, compared to a case where the bonding member 30 is bonded to the light-transmitting member 40 without the first coating film 51. The first coating film 51 is disposed at least in the first region 41, thereby obtaining the effect of improving the bonding strength described above. The first coating film 51 may be, for example, a metal layer made of a single material such as gold (Au), silver (Ag), copper (Cu), nickel (Ni), titanium (Ti), chromium (Gr), tin (Sn), aluminum (Al), palladium (Pd), platinum (Pt), rhodium (Rh), tungsten (W), molybdenum (Mo), iron (Fe), or a composite material thereof, titanium oxide (TiO 2 ), zirconium oxide (ZrO 2 ), tantalum oxide (TaO 2 ), silicon oxide (SiO 2 ) and the like.

[0037] 5, the first coating film 51 is provided on the entire second region 42 of the lower surface 43 of the light-transmitting member 40 and on most of the first region 41. The proportion of the area of ​​the first coating film 51 in the first region 41 is preferably, for example, 70% or more and 95% or less. The first coating film 51 can serve as an anti-reflection film that suppresses reflection of light from the light-emitting element 20 on the lower surface 43 of the light-transmissive member 40 and allows the light from the light-emitting element 20 to efficiently enter the light-transmissive member 40.

[0038] When the first coating film 51 is an anti-reflection film, it may be, for example, a multi-layer film including a first film 51a and a second film 51b that are alternately laminated and have different refractive indices. In this case, the first film 51a and the second film 51b are alternately laminated in this order from the lower surface 43 side of the light-transmitting member 40, and the outermost surface of the first coating film 51 is the second film 51b. For example, the first film 51a may be made of tantalum oxide (Ta 2 O5 ), and the second film 51b is silicon oxide (SiO 2 ) Therefore, the outermost surface of the first coating film 51 is silicon oxide.

[0039] The bonding member 30 is bonded to the light-transmitting member 40 via the outermost surface (second film 51b) of the first coating film 51. The affinity between the second film 51b, which is the outermost surface of the first coating film 51, and the resin of the bonding member 30 is higher than the affinity between the material of the light-transmitting member 40 and the resin of the bonding member 30. This can improve the bonding strength between the light-transmitting member 40 and the base 10.

[0040] As shown in Fig. 5, there is a portion 41a where the first coating film 51 is not provided in the first region 41 of the lower surface 43 of the light-transmitting member 40. The multiple portions 41a where the first coating film 51 is not provided are located on either side of the center of the lower surface 43 in a plan view. For example, as shown in Fig. 4, the portion 41a where the first coating film 51 is not provided is located on the lower surface of the flange portion 45 of the light-transmitting member 40. In other words, the portions 41a where the first coating film 51 is not provided are located at the four corners of the substantially rectangular base 10.

[0041] The flange 45 of the light-transmitting member 40 and each of the four corners of the base 10 have a portion where the bonding member 30 is not disposed. In a portion 41a on the underside 43 of the light-transmitting member 40 where the first coating film 51 is not provided, the glass constituting the light-transmitting member 40 is exposed. The bonding member 30 is not disposed in the exposed portion of the glass where the affinity with the bonding member 30 is lower than that of the first coating film 51.

[0042] Light from the light-emitting element 20 enters the light-transmitting member 40 from the second region 42 of the lower surface 43 of the light-transmitting member 40 facing the space 61 in which the light-emitting element 20 is disposed. Therefore, when the first coating film 51 is made to function as an anti-reflection film, it is preferable to dispose it at least in the second region 42. In this embodiment, by forming the first coating film 51 on the entire surface of the second region 42, it is possible to efficiently allow the light from the light-emitting element 20 to enter the light-transmitting member 40 over the entire surface of the second region 42. This can improve the light extraction efficiency of the light-emitting device 1 by, for example, 2 to 4%.

[0043] The first region 41 of the light-transmitting member 40 facing the first upper surface 11 of the base 10 is a region that serves to bond to the base 10 via the bonding member 30, and almost no light from the light-emitting element 20 is incident on the light-transmitting member 40 via the first region 41. Therefore, from the viewpoint of functioning as an anti-reflection film, the first covering film 51 is not necessary in the first region 41.

[0044] However, according to the present embodiment, the first coating film 51 is also formed in the first region 41 in order to increase the affinity with the bonding member 30 as described above. That is, the first coating film 51 formed in the first region 41 functions as an adhesive film that increases the adhesion with the bonding member 30. A film having an anti-reflection function and high adhesion can be formed on the lower surface 43 of the light-transmitting member 40 in a single film formation process, as described below.

[0045] However, the first coating film 51 is not disposed over the entire surface of the first region 41, but there is a portion 41a in the first region 41 where the first coating film 51 is not provided. This can reduce stress on the light-transmitting member 40 and suppress peeling of the first coating film 51 from the lower surface 43 of the light-transmitting member 40, compared to the case where the first coating film 51 is disposed over the entire surface of the first region 41.

[0046] In addition, by positioning the portions 41a where the first coating film 51 is not provided on either side of the center of the lower surface 43 in a plan view, it is possible to suppress bias of stress on the light-transmitting member 40 and effectively relieve the stress. For example, in the example shown in FIG. 4 and FIG. 5, the portions 41a where the first coating film 51 is not provided are not disposed in the region of the first region 41 that is located below the convex portion 44. The portions 41a where the first coating film 51 is not provided are disposed at the four corners of the substantially rectangular base 10, that is, at the four flange portions 45. By positioning the portions 41a where the first coating film 51 is not provided at such positions, it is possible to suppress bias of stress on the light-transmitting member 40 and effectively relieve the stress. The proportion of the area occupied by the portions 41a where the first coating film 51 is not provided in the first region 41 is not particularly limited as long as it is within a range in which the bonding strength between the light-transmitting member 40 and the base 10 can be ensured.

[0047] 6, a second coating film 52 functioning as an anti-reflection film can be provided on the upper surface 44a (upper surface of the convex portion 44) of the light-transmitting member 40. The second coating film 52 suppresses reflection at the interface between the upper surface 44a of the light-transmitting member 40 and the outside (air) of the light-transmitting member 40, and increases the efficiency of extracting light from the upper surface 44a of the light-transmitting member 40 to the outside.

[0048] The second coating film 52 includes a third film 52a and a fourth film 52b that are alternately laminated and have different refractive indices. The third film 52a and the fourth film 52b are alternately laminated in this order from the upper surface 44a side of the light-transmitting member 40, and the outermost surface of the second coating film 52 is the fourth film 52b. For example, the third film 52a is made of tantalum oxide (Ta 2 O 5 ), and the fourth film 52b is silicon oxide (SiO 2 ) Therefore, the outermost surface of the second coating film 52 is silicon oxide.

[0049] When the first coating film 51 is formed only on the first region 41 of the lower surface 43 of the light-transmitting member 40, it can be formed by, for example, using a mask and a method such as sputtering or vapor deposition. Next, a method for forming the first covering film 51 and the second covering film 52 on the light-transmitting member 40 will be described with reference to FIGS.

[0050] FIG. 7 is an exploded perspective view that illustrates a jig 100 for forming the first coating film 51 and the second coating film 52 on the light-transmitting member 40. As shown in FIG. FIG. 8A is a schematic bottom view of the jig 100 and the light-transmitting member 40 housed in the jig 100. FIG. FIG. 8B is a schematic cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A. 9 is a schematic perspective view of the jig 100 and the upper surface 44a side of the light-transmitting member 40 housed in the jig 100. The material of the jig 100 is not particularly limited as long as it can hold the light-transmitting member 40. The jig 100 can be made of, for example, brass, stainless steel, or the like.

[0051] The jig 100 has a first member 110 and a second member 120, both of which are plate-shaped. A first through hole 112 is formed in the center of the first member 110. The first member 110 is provided with four claw portions 111 that extend from the inner periphery of the first through hole 112 toward the center of the first through hole 112 in a plan view.

[0052] A second through hole 122 is formed in the center of the second member 120. Four support portions 121 are provided around the second through hole 122, and are recessed to form a step between the support portions and a surface 123 of the second member 120.

[0053] 8B, the light-transmitting member 40 is disposed between the first member 110 and the second member 120. The surface of the flange portion 45 of the light-transmitting member 40 on the convex portion 44 side is disposed on the support portion 121 of the second member 120. The convex portion 44 is exposed from the second through-hole 122.

[0054] The first member 110 is overlaid on the surface 123 of the second member 120. As shown in Fig. 8A, in a plan view of the lower surface 43 of the light-transmitting member 40, the claw portions 111 of the first member 110 cover and conceal part of the lower surface 43 of the light-transmitting member 40. Most of the lower surface 43 of the light-transmitting member 40 other than the part covered and concealed by the claw portions 111 is exposed from the first through-holes 112. In this state, a first coating film 51 is formed on the lower surface 43 of the light-transmitting member 40.

[0055] 5, the first coating film 51 is not formed on a portion 41a of the lower surface 43 of the light-transmitting member 40, and the first coating film 51 is formed on the portion other than the portion 41a. The portion 41a of the lower surface 43 of the light-transmitting member 40 where the first coating film 51 is not formed is the portion that was covered and hidden by the claw portion 111 of the first member 110 in FIG. 8A.

[0056] 9, the upper surface 44a of the protrusion 44 is exposed from the second member 120. In this state, the second coating film 52 is formed on the upper surface 44a of the protrusion 44. At this time, the claw portions 111 of the first member 110 prevent the light-transmitting member 40 from falling off from the first member 110 side.

[0057] [Second embodiment] FIG. 10A is a top view showing an example of the arrangement of the bonding members 30 in the light emitting device according to the second embodiment. FIG. 10B is a schematic cross-sectional view taken along line XB-XB in FIG. 10A.

[0058] In the example shown in Fig. 10B, the upper surface of the light-transmitting member 140 is a flat surface. As shown in Fig. 10A, the bonding members 30 are located at the four corners of the substantially rectangular base 10. The bonding members 30 are also located not only in a first region 141 on the lower surface 143 of the light-transmitting member 140 located above the first upper surface 11 of the base 10, but also in a second region 142 located above the second upper surface 12 of the base 10 across a space 61. In the light-emitting device of this embodiment, too, the stress on the light-transmitting member 140 can be alleviated, and a stable bonding state can be maintained.

[0059] The above describes the embodiments of the present invention with reference to specific examples. However, the present invention is not limited to these specific examples. All forms that can be implemented by a person skilled in the art through appropriate design modifications based on the above-described embodiments of the present invention also belong to the scope of the present invention as long as they include the gist of the present invention. In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modified examples and examples of modifications, and these modified examples and examples of modifications also belong to the scope of the present invention. [Explanation of symbols]

[0060] Reference Signs List 1...light emitting device, 10...base, 11...first upper surface, 12...second upper surface, 15...side wall portion, 20...light emitting element, 30...jointing member, 40...light-transmitting member, 41...first region, 42...second region, 43...lower surface, 44...protruding portion, 44a...upper surface, 51...first covering film, 51a...first film, 51b...second film, 52...second covering film, 52a...third film, 52b...fourth film, 61...space, 62...gap

Claims

1. a base having a sidewall portion having a first upper surface and a second upper surface surrounded by the sidewall portion; A light emitting element disposed on the second upper surface; A plurality of bonding members disposed on the first upper surface at a distance from each other; a translucent member having a lower surface including a first region disposed above the first upper surface and a second region disposed above the second upper surface, the translucent member being joined to a portion of the first upper surface by the joining member; a first coating film provided on the first region of the lower surface of the light-transmitting member; Equipped with A light emitting device, wherein the first region has a portion where the first coating film is not provided.

2. The light emitting device according to claim 1 , wherein the joining member is joined to the first region of the lower surface of the light-transmitting member.

3. The light emitting device according to claim 1 , wherein the portions where the first coating film is not provided are located on either side of the center of the lower surface of the light-transmitting member in a plan view of the lower surface.

4. In a plan view, the base is substantially rectangular, The light emitting device according to claim 3 , wherein the portions where the first coating film is not provided are located at the four corners of the substantially rectangular base.

5. The light emitting device according to claim 1 , wherein the bonding member is not disposed in a portion where the first coating film is not provided.

6. The light emitting device according to claim 1 , wherein the bonding member is bonded to the light-transmitting member via an outermost surface of the first coating film.

Images