Electronic apparatus and microphone module mounting method

Abstract

To secure airtightness of a microphone element.SOLUTION: An electronic apparatus includes: a plate part in which a conductive tape is stuck on its surface; a casing member that is provided so as to be erected from an edge part of the plate part, and has an erected wall in which a microphone hole is penetrated and formed; a microphone element for acquiring sound information through the microphone hole; a microphone module having a flexible substrate mounted with the microphone element; an adhesive member for fixing the microphone element to the wall surface of the erected wall; a ground member which is fixed to the surface of the flexible substrate, and is electrically connected to the conductive tape; and a conductive connection member for electrically connecting between the ground member and the conductive tape, in a state where movement of the flexible substrate in a direction at which the microphone element approaches the wall surface of the erected wall is permitted.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an electronic device equipped with a microphone module and a method for mounting the microphone module. [Background technology]

[0002] Electronic devices such as notebook PCs may include a microphone module (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-087451 Summary of the Invention [Problem to be solved by the invention]

[0004] The microphone module requires that the microphone element be attached to the wall surface of the housing member through which the microphone hole is formed. The microphone element is fixed to the wall surface of the housing member, for example, using an adhesive material. This is to ensure air tightness of the microphone element and prevent sound leakage inside and outside the housing.

[0005] In some microphone modules, the flexible substrate on which the microphone element is mounted is grounded (frame grounded) to a housing member near the microphone element. This grounding is achieved, for example, by adhesively fixing a ground member fixed to the flexible substrate to a conductive material provided on the housing member.

[0006] However, if the ground member is fixed before the microphone element is fixed during the manufacture of an electronic device, the flexible substrate is fixed to the housing member, making it difficult to adjust the position of the microphone element. In that case, it has been found that the microphone element cannot be closely attached to the wall surface, and the desired air tightness cannot be ensured. In particular, when the microphone element is closely attached to the wall surface of the vertical wall that forms the side surface of the housing, and the ground member is fixed to the inner surface of the housing member perpendicular to the vertical wall, the above problem becomes more pronounced. This is because if the flexible substrate is fixed to the housing member first, it becomes even more difficult to closely attach the microphone element mounted on the flexible substrate to the vertical wall.

[0007] The present invention has been made in consideration of the problems with the conventional technology described above, and aims to provide an electronic device and a method for mounting a microphone module that can ensure air tightness of the microphone element. [Means for solving the problem]

[0008] An electronic device according to a first aspect of the present invention comprises a housing member having a plate portion with a conductive tape attached to a surface thereof and a standing wall that is arranged to rise from the edge of the plate portion and has a microphone hole formed therethrough; a microphone module having a microphone element that acquires sound information through the microphone hole and a flexible substrate on which the microphone element is mounted; an adhesive member that fixes the microphone element to a wall surface of the standing wall; a ground member that is fixed to a surface of the flexible substrate and electrically connected to the conductive tape; and a conductive connecting member that electrically connects between the ground member and the conductive tape while allowing the flexible substrate to move in a direction such that the microphone element approaches the wall surface of the standing wall.

[0009] A method for mounting a microphone module according to a second aspect of the present invention is a method for mounting a microphone module to a housing member of an electronic device, the housing member having a plate portion with a conductive tape attached to a surface thereof, and a standing wall arranged to rise from an edge of the plate portion and having a microphone hole formed therethrough. The microphone module has a microphone element that acquires sound information through the microphone hole, and a flexible substrate on which the microphone element is mounted. The method for mounting the microphone module includes a first step of peeling off a first release paper that covers a first adhesive member for fixing the microphone element to a wall surface of the standing wall, and a second release paper that covers a second adhesive member provided on a ground member fixed to a surface of the flexible substrate, a second step of fixing the ground member to a flexible conductive connecting member arranged to be movable relative to the conductive tape using the second adhesive member, thereby electrically connecting the ground member and the conductive tape in a state in which movement of the flexible substrate in a direction approaching the wall surface of the standing wall is permitted, and a third step of fixing the microphone element to the wall surface of the standing wall using the first adhesive member. Effect of the Invention

[0010] According to the above aspect of the present invention, the air tightness of the microphone element can be ensured. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment viewed from above. [Diagram 2] FIG. 2 is a plan view illustrating a schematic internal structure of the first housing. [Diagram 3] FIG. 3 is a diagram illustrating an example of the arrangement of the conductive tape shown in FIG. [Figure 4] FIG. 4 is a schematic cross-sectional side view of my module and its surroundings. [Diagram 5] FIG. 5 is a side cross-sectional view that typically illustrates an operation of attaching the microphone module illustrated in FIG. 4 to a housing member. [Figure 6A] FIG. 6A is a schematic cross-sectional side view of a conductive connection member and its surrounding area. [Figure 6B] FIG. 6B is a side cross-sectional view that typically shows a state in which the conductive connection member shown in FIG. 6A has been moved in the Y1 direction. [Figure 7] FIG. 7 is a flowchart showing a procedure of a method for attaching the microphone module of this embodiment. [Figure 8] FIG. 8 is a schematic cross-sectional side view of a microphone module and its surroundings in a first housing according to a comparative example. [Figure 9A] FIG. 9A is a schematic cross-sectional side view of a conductive connection member and its surrounding area according to a first modified example. [Figure 9B] FIG. 9B is a side cross-sectional view that typically shows a state in which the conductive connection member shown in FIG. 9A has been moved in the Y1 direction. [Figure 10A] FIG. 10A is a schematic cross-sectional side view of a conductive connection member and its surrounding area according to a second modified example. [Figure 10B] FIG. 10B is a side cross-sectional view that typically shows a state in which the conductive connection member shown in FIG. 10A has been moved in the Y1 direction. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

[0013] Fig. 1 is a schematic plan view of an electronic device 10 according to an embodiment, seen from above. As shown in Fig. 1, the electronic device 10 according to the present embodiment is a clamshell-type notebook PC, in which a first housing 11 and a second housing 12 are connected by a hinge 14 so as to be relatively rotatable. In the present embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a tablet PC, a display device, a smartphone, or a portable game machine.

[0014] The second housing 12 is a flat box body and is adjacent to the first housing 11. Inside the second housing 12, various electronic components such as a motherboard equipped with a CPU, a storage device, and a battery device are housed. A keyboard 16 and a touch pad 17 are located on the top surface of the second housing 12.

[0015] The first housing 11 is a flat box that is thinner than the second housing 12. The first housing 11 is equipped with a display panel 18. In the following, the first housing 11 and each of the components equipped therein will be described with reference to the direction as seen by an operator viewing a display surface 18a of the display panel 18, with the left-right direction referred to as the X1 and X2 directions, the up-down direction referred to as the Y1 and Y2 directions, and the depth direction referred to as the Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may be similarly referred to as the Y direction and the Z direction.

[0016] A display surface 18a of the display panel 18 faces the Z1 side surface (front surface 11a) of the first housing 11. The first housing 11 has a housing member 20 that forms the back surface 11b (Z2 side surface) and the four side surfaces 11c, and a bezel member 21 that forms the peripheral portion of the front surface 11a. The bezel member 21 is a frame-shaped thin plate that surrounds the outer peripheral edge of the display panel 18. Substantially the entire front surface 11a of the first housing 11, including the bezel member 21, is covered with a touch glass 22. The hinge 14 is connected to the Y2 side edge of the first housing 11.

[0017] The display panel 18 is composed of, for example, a liquid crystal display or an organic EL display. The display panel 18 has a structure in which, for example, glass, a liquid crystal layer, a light guide plate, etc. are laminated and the outer peripheral edges of each layer are fixed to each other with double-sided tape, adhesive, etc. The touch glass 22 covers the display surface 18a to form a touch panel that accepts touch operations on the display panel 18.

[0018] Fig. 2 is a plan view that diagrammatically shows the internal structure of the first housing 11. In Fig. 2, the touch glass 22 and the bezel member 21 are omitted, and only the outer shape of the display panel 18 is shown by a two-dot chain line.

[0019] As shown in FIG. 2, the housing member 20 has a plate portion 24 and a standing wall 25 provided to stand from the outer peripheral edge of the plate portion 24. The plate portion 24 is a rectangular plate and forms the back surface 11b of the first housing 11. The plate portion 24 is, for example, a flat plate or a shallow dome-shaped plate slightly curved toward the back surface 11b. The standing wall 25 is a wall portion standing from the outer peripheral edge of the plate portion 24 in the Z1 direction and forms each side surface 11c of the first housing 11. The Z1 side surface (upper end surface) of the standing wall 25 becomes the attachment surface of the bezel member 21. Reference symbol 20a in FIG. 1 and FIG. 2 is a protrusion that protrudes in the Y1 direction from approximately the center of the Y1 side edge of the housing member 20. The protrusion 20a enlarges the installation space of a camera module 34 described later. The protrusion 20a may be omitted.

[0020] The housing member 20 has a configuration in which a resin frame constituting the standing wall 25 is joined by injection molding to the edge of a plate portion 24, which is, for example, a laminated plate of carbon fiber reinforced resin. The housing member 20 may have a configuration in which the plate portion 24 and the standing wall 25 are integrally molded from the same metal material, resin material, or the like.

[0021] As shown in FIG. 2, attached to the inside of the housing member 20 are a double-sided adhesive tape 26, a bracket 28, a conductive tape 30, a wiring portion 32, a camera module 34, and a microphone module 36.

[0022] The double-sided adhesive tape 26 is, for example, a pair of left and right double-sided adhesive tapes in the shape of a strip extending in the Y direction. The double-sided adhesive tape 26 is for fixing the display panel 18 to the housing member 20. The double-sided adhesive tape 26 adhesively fixes the back surface of the display panel 18 opposite the display surface 18a to the inner surface 24a of the plate portion 24 (the surface behind the back surface 11b).

[0023] The brackets 28 are provided, for example, in pair on the left and right sides along the Y2 side edge of the first housing 11, and are adhesively fixed to the inner surface 24a. The brackets 28 are metal parts for screwing the hinge 14. The brackets 28 are electrically connected to the second housing 12 via the metal hinge 14.

[0024] The conductive tape 30 is a thin, single-sided adhesive tape made of a highly conductive material such as aluminum or copper. The conductive tape 30 in this embodiment is an aluminum tape. The conductive tape 30 is attached to the inner surface 24a of the plate portion 24. The conductive tape 30 is used for the frame ground of the display panel 18, the camera module 34, and the microphone module 36, and is electrically connected to the second housing 12 via the bracket 28.

[0025] Fig. 3 is a diagram illustrating an example of the arrangement of the conductive tape 30 shown in Fig. 2. In Fig. 3, the conductive tape 30 is clearly shown with a dot pattern.

[0026] As shown in FIG. 2 and FIG. 3, the conductive tape 30 of this embodiment has a first portion 30a to a fourth portion 30d. The first portion 30a to the third portion 30c are provided along the edges of the plate portion 24 on the Y1, X1, and X2 sides, and are generally formed into an inverted U-shape. The first portion 30a extends in the X direction along the Y1 side edge of the plate portion 24. The second portion 30b extends in the Y direction along the X1 side edge of the plate portion 24, and its Y2 side end is connected to the bracket 28. The third portion 30c extends in the Y direction along the X2 side edge of the plate portion 24, and its Y2 side end is connected to the bracket 28. The fourth portion 30d is provided at a position closer to the Y2 side than the center of the plate portion 24, and is formed into a horizontal J-shape. The fourth portion 30d is connected to a connector 32a of the wiring portion 32 described later and to the left and right brackets 28, respectively. The conductive tape 30 is fastened together with the screws that secure the hinge 14 to the bracket 28, so that electrical continuity with the bracket 28 is ensured.

[0027] As shown in FIG. 2, the wiring section 32 is composed of a wide flexible board. The wiring section 32 is placed on the inner surface 24a of the plate section 24 and the Z1 side surface of the conductive tape 30 attached thereto. The wiring section 32 is a part of wiring for connecting the camera module 34 and the microphone module 36 to the motherboard on the second housing 12 side. The wiring section 32 is an assembly of a flexible board 34a of the camera module 34 and a flexible board 42 of each microphone module 36, which will be described later. A connector 32a connected to a predetermined relay board is mounted on the Y2 side end of the wiring section 32. The wiring section 32 is connected to the motherboard via this relay board. The wiring section 32 may be connected to the motherboard directly without using the relay board.

[0028] The camera module 34 is a substrate (PCB) on which a camera lens, an IR LED, etc. are mounted. The camera lens is a camera that can be used for video recording, etc., and is configured with an image sensor provided on the back side of a centrally located focusing lens. The IR LED is an infrared camera that can be used for face recognition, etc. The camera module 34 is connected to the wiring section 32 via a flexible substrate 34a.

[0029] A pair of microphone modules 36, one on the left and one on the right, constitute a stereo microphone. Only one microphone module 36 may be used. The left and right microphone modules 36 differ in the shape of a flexible substrate 42 and the arrangement of microphone elements 40, which will be described later, but may have the same or similar basic configuration. Therefore, in the following, the left and right microphone modules 36 will not be distinguished from each other, and will be collectively described with the same reference numerals.

[0030] 2 and 4, the microphone module 36 includes a microphone element 40 and a flexible substrate 42. As shown in FIG.

[0031] The microphone element 40 is, for example, a MEMS microphone formed by shielding a MEMS chip or IC chip having a diaphragm mounted on a substrate (PCB: Printed circuit board). A microphone hole 44 is formed through the standing wall 25 at a position facing the microphone module 36. The microphone element 40 is adhesively fixed to the wall surface (inner wall surface) 25a of the standing wall 25, and can acquire sound information outside the first housing 11 through the microphone hole 44.

[0032] 2 illustrates a configuration in which a concave recess is provided in wall surface 25a of standing wall 25, and microphone element 40 is disposed in this recess. This recess is intended to absorb the thickness of microphone element 40 in the Y direction and to narrow the width of bezel member 21, but may be omitted.

[0033] The microphone element 40 is mounted on the Y1 side end of the flexible printed circuit (FPC) 42. The flexible printed circuit 42 is a wiring that connects the microphone element 40 and the wiring portion 32. The flexible printed circuit 42 has a horizontal portion 42a placed on the inner surface 24a and an upright portion 42b bent from the horizontal portion 42a.

[0034] The horizontal placement portion 42a is provided between the standing portion 42b and the wiring portion 32. The horizontal placement portion 42a has, for example, a serpentine shape and is extendable. This allows the horizontal placement portion 42a to adjust the position of the microphone element 40 mounted on the standing portion 42b in the XY directions. The serpentine shape of the horizontal placement portion 42a is for adjusting the positional relationship between the camera module 34 and the microphone element 40, which are connected to the same wiring portion 32. The standing portion 42b is a portion on which the microphone element 40 is mounted. The standing portion 42b is a portion that is made to stand up in the Z direction by bending the end of the horizontal placement portion 42a on the opposite side to the wiring portion 32 side.

[0035] The microphone element 40 is fixed to the wall surface 25a of the standing wall 25 using an adhesive member 46 provided on the back surface of the standing portion 42b. The adhesive member 46 is, for example, a double-sided adhesive tape. The standing portion 42b and the adhesive member 46 sandwiched between the microphone element 40 and the wall surface 25a are each formed with holes 44a, 44b communicating with the microphone hole 44. As a result, the microphone element 40 can acquire sound information outside the first housing 11 through the microphone hole 44 and the holes 44a, 44b while being closely fixed to the wall surface 25a via the adhesive member 46.

[0036] 2 and 4, a ground member 48 is fixed to the Z2 side surface of the horizontal placement portion 42a of the flexible substrate 42. The ground member 48 is a member that electrically connects the flexible substrate 42 and the conductive tape 30 and serves to frame ground the microphone module 36.

[0037] The ground member 48 is a conductive adhesive tape made of a highly conductive material such as aluminum or copper. One surface of the ground member 48, which is fixed to a conductive connection member 50 described below, is provided with an adhesive 52 containing a conductive filler. The other surface of the ground member 48, which is fixed to a conductive portion exposed on the surface of the flexible substrate 42, is also provided with an adhesive containing a conductive filler. This gives the ground member 48 high conductivity in the thickness direction.

[0038] The ground member 48 is disposed in a position as close as possible to the microphone element 40 in the horizontally placed portion 42a of the flexible substrate 42. This is to ground the noise generated by the microphone element 40 in a position as close as possible and to suppress the noise from affecting other devices in the first housing 11. The ground member 48 in this embodiment is provided in a position close to the bending portion of the horizontally placed portion 42a to the standing portion 42b. This position is a portion that extends in a straight line from the standing portion 42b, and corresponds to the straight portion before the horizontally placed portion 42a begins to meander (see FIG. 2). In other words, if the ground member 48 is fixed to the surface of the conductive tape 30, it will be difficult to adjust the position of the microphone element 40 at least in the Y1 direction.

[0039] To allow such position adjustment of the microphone element 40 in the Y1 direction, the electronic device 10 of this embodiment has a conductive connection member 50 interposed between the ground member 48 and the conductive tape 30 (see FIG. 4).

[0040] The conductive connection member 50 is a flexible conductive member that electrically connects between the ground member 48 and the conductive tape 30. The conductive connection member 50 is provided so as to be movable at least in the Y direction relative to the conductive tape 30. This allows the conductive connection member 50 to allow the ground member 48 and the flexible substrate 42 fixed thereto to move relative to the conductive tape 30 in the Y direction. At that time, the conductive connection member 50 can maintain the electrical connection state between the ground member 48 and the conductive tape 30.

[0041] Fig. 6A is a schematic cross-sectional side view of the conductive connection member 50 and its surroundings. Fig. 6B is a cross-sectional side view showing a state in which the conductive connection member 50 shown in Fig. 6A has been moved in the Y1 direction.

[0042] 3, 6A, and 6B, the conductive connection member 50 is a tongue-shaped cut-and-raised piece formed on a part of the conductive tape 30. Hereinafter, the "conductive connection member 50" may also be referred to as the "cut-and-raised piece 50."

[0043] The cut-and-raised piece 50 is configured by cutting out a part of the conductive tape 30 into a substantially U-shape, and one side (connecting side 50a) on the Y1 side is not cut off from the conductive tape 30. The connecting side 50a is the side closest to the wall surface 25a of the standing wall 25 that fixes the microphone element 40, and extends along the longitudinal direction (X direction) of the standing wall 25. This allows the cut-and-raised piece 50 to move at least in the Y1 direction (and Z direction) while remaining electrically connected to the conductive tape 30. That is, the conductive tape 30 is formed of a thin aluminum tape or the like. Therefore, the cut-and-raised piece 50 has flexibility. Furthermore, the cut-and-raised piece 50 can be lifted from the inner surface 24a to which the conductive tape 30 is attached by bending the connecting side 50a. The shape of the cut-and-raised piece 50 is not limited as long as it can floatingly support the microphone element 40 (ground member 48) so that it can move toward the standing wall 25.

[0044] The Z1 side surface of the cut-and-raised piece 50 is fixed to the Z2 side surface of the grounding member 48 via an adhesive 52. A non-adhesive layer 53 is provided on the Z2 side surface of the cut-and-raised piece 50. The non-adhesive layer 53 is formed by covering an adhesive layer originally provided on the Z2 side surface of the conductive tape 30 forming the cut-and-raised piece 50 with a resin film or the like. This allows the cut-and-raised piece 50 to move smoothly relative to the inner surface 24a and the surrounding conductive tape 30 without adhering to them (see FIG. 6B). Note that FIG. 6B shows an exaggerated view of the movement of the cut-and-raised piece 50. In reality, the cut-and-raised piece 50 moves in a manner such that it is crushed in the Y1 direction while slightly floating up as shown in FIG. 4.

[0045] Next, one procedure for attaching the microphone module 36 will be described.

[0046] Fig. 5 is a side cross-sectional view that typically shows an operation for attaching the microphone module 36 shown in Fig. 4 to the housing member 20. Fig. 7 is a flow chart showing one procedure of a method for attaching the microphone module 36 of this embodiment.

[0047] First, prior to the step of attaching the microphone module 36 to the housing member 20 , the conductive tape 30 is attached to the housing member 20 .

[0048] In step S1 of FIG. 7, the conductive tape 30 is shaped into a predetermined shape as shown in FIG. 3 to form the cut-and-raised piece 50. The conductive tape 30 can be shaped into a predetermined shape by punching out a large-sized material such as an aluminum tape that serves as the base. The cut-and-raised piece 50 can be formed by punching out three sides other than the connecting side 50a at the same time as or before or after punching out the conductive tape 30. Also, before or after punching out the cut-and-raised piece 50, a resin film or the like is attached to the adhesive layer of the original conductive tape 30 that remains on one side of the cut-and-raised piece 50 to form a non-adhesive layer 53. Then, the conductive tape 30 with the cut-and-raised piece 50 thus formed is attached to a predetermined position on the inner surface 24a of the housing member 20.

[0049] Next, the microphone module 36 is attached to the housing member 20 to which the conductive tape 30 has been attached. The microphone module 36 is prepared in advance as an assembly part integrated with the wiring section 32 and the camera module 34 as shown in FIG.

[0050] In step S2, the first release paper 46a covering the adhesive member 46 for fixing the microphone element 40 and the second release paper 52a covering the adhesive 52 for fixing the ground member 48 are peeled off (see FIG. 5). The release papers 46a and 52a are thin films such as resin films that cover the adhesive surfaces to protect the adhesive member 46 and the adhesive 52 and prevent erroneous adhesion. The release papers 46a and 52a can be easily peeled off by hand, tweezers, or the like. In this embodiment, the release papers 46a and 52a may be peeled off simultaneously or approximately simultaneously, or one may be peeled off first and then the other.

[0051] In step S3, the ground member 48 is fixed to the Z1 side surface of the cut-and-raised piece 50 with adhesive 52. This electrically connects the microphone module 36 to the conductive tape 30, and frame-grounds the microphone module 36 to the housings 11 and 12.

[0052] In step S4, the microphone element 40 is fixed to the wall surface 25a of the standing wall 25 with an adhesive member 46. In step S3, the ground member 48 fixed to the flexible substrate 42 is connected to the conductive tape 30 via a flexible cut-and-raised piece 50. Therefore, even after the ground member 48 is fixed to the cut-and-raised piece 50, the position of the flexible substrate 42 can be adjusted in the Y1 direction (see FIGS. 4 to 6B).

[0053] Therefore, as shown in Fig. 4, when the microphone element 40 is pulled in the Y1 direction to adhere to the wall surface 25a, the cut-and-raised piece 50 flexibly deforms, allowing the flexible substrate 42 and the microphone element 40 to move in the Y1 direction. At this time, the electrical connection between the ground member 48, the cut-and-raised piece 50, and the conductive tape 30 is maintained. As a result, the microphone element 40 can be reliably adhered to the wall surface 25a via the adhesive member 46 (see Fig. 4). This ensures air tightness of the microphone element 40.

[0054] Here, as a comparative example, a process for attaching microphone module 36 to first housing 11A having a configuration without conductive connecting member 50 will be described with reference to Fig. 8. Fig. 8 is a schematic side cross-sectional view of microphone module 36 and its surrounding area in first housing 11A according to the comparative example.

[0055] In the first housing 11A of the comparative example shown in Fig. 8, the conductive connection member 50 is not provided on the conductive tape 30. Therefore, the ground member 48 is directly adhesively fixed to the surface of the conductive tape 30. Therefore, in this configuration, if the ground member 48 is fixed to the conductive tape 30 before the microphone element 40, it may not be possible to closely contact the wall surface 25a of the standing wall 25 as shown in Fig. 8. That is, the flexible substrate 42 is fixed to the conductive tape 30 via the ground member 48 and cannot move in the Y1 direction. This is because the position of the microphone element 40 cannot be adjusted in the Y1 direction.

[0056] Therefore, in the first housing 11A of the comparative example, if the release papers 46a and 52a are peeled off in advance as in step S2 of FIG. 7, it is necessary to first fix the microphone element 40 to the standing wall 25 with the adhesive member 46, and then fix the ground member 48 to the conductive tape 30 with the adhesive 52. Alternatively, in the first housing 11A of the comparative example, it is necessary to first peel off the first release paper 46a to adhere and fix the microphone element 40 to the wall surface 25a, and then peel off the second release paper 52a and fix the ground member 48 to the conductive tape 30. However, the microphone module 36 mounted on the electronic device 10, for example a notebook PC, is very thin and small. For this reason, it is troublesome to follow the above-mentioned work procedure, and there is a concern that some workers will not follow this work procedure. In that case, the microphone element 40 will not adhere to the standing wall 25 as shown in FIG. 8, and air tightness cannot be ensured, which may reduce the sound collection efficiency of the microphone element 40 and cause sound leakage inside and outside the first housing 11A.

[0057] In this respect, in the present embodiment, there is no need to impose restrictions on the order in which the release papers 46a and 52a are peeled off or the order in which the microphone element 40 and the ground member 48 are fixed. Therefore, for example, the microphone module 36 can be attached by a simple procedure shown in FIG. 7, and high work efficiency can be obtained. That is, in the method of attaching the microphone module 36 according to the present embodiment, the release papers 46a and 52a are peeled off in advance substantially simultaneously, and then the ground member 48, which only needs to be pressed from above, is fixed first, and then the microphone element 40 can be fixed to the standing wall 25 while adjusting its position via the conductive connecting member 50. Therefore, in the electronic device 10 of the present embodiment, the assembly work of the microphone module 36 is simple, and work efficiency is improved.

[0058] The conductive connection member may have a configuration other than the above-described cut-and-raised piece 50. Figures 9A and 9B are schematic side cross-sectional views of a conductive connection member 60 and its surrounding area according to a first modified example.

[0059] The conductive connection member 60 shown in Fig. 9A and Fig. 9B is a conductive sheet fixed to the surface of the conductive tape 30. Hereinafter, the "conductive connection member 60" may be referred to as the "conductive sheet 60". The conductive sheet 60 is a flexible strip-shaped sheet made of a highly conductive material such as aluminum or copper. The conductive sheet 60 is folded back in a substantially S-shape by providing two bends 60a, 60b between one end (first end) and the other end (second end).

[0060] The conductive sheet 60 has a first end electrically connected to the surface of the conductive tape 30, and a second end on the opposite side fixed to the ground member 48 using an adhesive 52. Since the conductive sheet 60 is simply made of an aluminum sheet or the like, there is a possibility that sufficient conduction between the conductive sheet 60 and the conductive tape 30 cannot be ensured by simply fixing the first end to the surface of the conductive tape 30. Therefore, the conductive sheet 60 can be fixed to the conductive tape 30 via a conductive adhesive tape 62. In this way, high conductivity can be ensured between the conductive sheet 60 and the conductive tape 30. The conductive adhesive tape 62 may be, for example, the same or similar to the ground member 48. Reference numeral 62a in FIG. 9A and FIG. 9B denotes an adhesive containing a conductive filler, and is provided on both sides of the conductive adhesive tape 62 in the Z direction.

[0061] Like the cut-and-raised piece 50 described above, such a conductive sheet 60 can also allow the ground member 48 and the flexible substrate 42 to move relative to the conductive tape 30 in the Y direction (see FIG. 9B). At that time, the conductive sheet 60 can maintain the electrical connection between the ground member 48 and the conductive tape 30. Therefore, even in the configuration using the conductive sheet 60 shown in FIG. 9A, the microphone element 40 can be reliably attached to the wall surface 25a of the standing wall 25 by using a procedure similar to the attachment method shown in FIG.

[0062] The cut-and-raised piece 50 can be formed by using the conductive tape 30 that is originally attached to the inner surface 24a of the plate portion 24. Therefore, the cut-and-raised piece 50 has the advantage that no additional parts cost is required and the thickness in the Z direction can be suppressed compared to a configuration using the conductive sheet 60. On the other hand, a configuration using the conductive sheet 60 has the advantage that the cut-and-raised processing of the conductive tape 30 is not required.

[0063] 10A and 10B are schematic cross-sectional side views of a conductive connecting member 70 and its surrounding area according to a second modified example.

[0064] The conductive connection member 70 shown in FIG. 10A and FIG. 10B is a modified version of the conductive sheet 60 shown in FIG. 9A and FIG. 9B. Hereinafter, the "conductive connection member 70" may be referred to as the "conductive sheet 70". The conductive sheet 70 may be made of the same or similar material as the conductive sheet 60 described above, but is different in that it has only one bent portion 70a and is folded back in a substantially U-shape. With such a conductive sheet 70, the same effect as with the configuration using the conductive sheet 60 described above can be obtained. Note that the conductive sheet 70 has fewer bent portions than the conductive sheet 60, and therefore has the advantage of being simple in configuration and capable of suppressing the thickness in the Z direction. On the other hand, the conductive sheet 60 has more bent portions than the conductive sheet 70, and therefore has the advantage of smoothing the movement of the flexible substrate 42 and the microphone element 40 in the Y1 direction. When a conductive sheet is used as the conductive connection member, the number of bent portions may be three or more.

[0065] As described above, in the electronic device 10 of this embodiment, the ground member 48 fixed to the surface of the flexible substrate 42 of the microphone module 36 and the conductive tape 30 attached to the inner surface 24a of the housing member 20 are electrically connected by the conductive connection member 50 (60, 70). The conductive connection member 50 (60, 70) electrically connects the ground member 48 and the conductive tape 30 in a state in which the flexible substrate 42 is permitted to move in the Y1 direction in which the microphone element 40 approaches the wall surface 25a of the standing wall 25.

[0066] Therefore, the electronic device 10 can reliably attach the microphone element 40 to the wall surface 25a of the standing wall 25 without strictly specifying the order of the steps of connecting the ground member 48 and the conductive tape 30 and fixing the microphone element 40 to the standing wall 25. This is because the floating effect of the conductive connecting member 50 (60, 70) allows the position of the microphone element 40 to be adjusted even after the ground member 48 is connected to the conductive tape 30. Therefore, the electronic device 10 can improve the work efficiency of the installation work of the microphone element 40. Moreover, the electronic device 10 can ensure air tightness of the microphone element 40 against the wall surface 25a. As a result, the electronic device 10 can suppress sound leakage inside and outside the first housing 11 of the microphone element 40.

[0067] In particular, the ground member 48 can be provided at a position close to the bending portion of the horizontal placement portion 42a of the flexible substrate 42 to the upright portion 42b. In this way, the noise of the microphone element 40 can be grounded at a position as close as possible. However, such an arrangement of the ground member 48 makes it more difficult to adjust the position of the microphone element 40 after the ground member 48 is fixed to the conductive tape 30 (plate portion 24). Since the distance between the microphone element 40 and the ground member 48 is close, it is difficult to ensure an adjustment width. In addition, the position adjustment using the meandering shape of the horizontal placement portion 42a is also not possible. However, in the electronic device 10, the position of the microphone element 40 can be adjusted by the conductive connection member 50 (60, 70) despite such an arrangement of the ground member 48. In other words, the electronic device 10 can easily ensure air tightness of the microphone element 40. Moreover, the electronic device 10 can further suppress the influence of noise from the microphone element 40 on other devices.

[0068] In addition, in the mounting method of the microphone module 36 of this embodiment, the release papers 46a, 52a covering the adhesive member 46 and the adhesive 52 are peeled off simultaneously or in random order. Then, the ground member 48 is pressed against the conductive connection member 50 (60, 70) from above and fixed, and then the microphone element 40 is fixed to the standing wall 25 via the conductive connection member 50 (60, 70) while adjusting its position. That is, in this mounting method, the ground member 48 can be connected to the conductive tape 30 by simply pressing the ground member 48 from above against the conductive connection member 50 (60, 70) on the inner surface 24a of the plate part 24, which is a flat surface having a wide area. Next, the microphone element 40 can be smoothly brought into close contact with the wall surface 25a of the standing wall 25 having a narrow area perpendicular to the inner surface 24a while adjusting its position. As a result, this mounting method can achieve high work efficiency.

[0069] It should be noted that the present invention is not limited to the above-described embodiment, and can of course be freely modified without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0070] 10 Electronic equipment 11,11A 1st housing 12 Second cabinet 18 Display Panel 20 Housing material 24 Plate section 25 Standing Wall 30 Conductive Tape 34 Camera Module 34a, 42 Flexible substrate 36 Microphone Module 40 Microphone element 44 Microphone hole 46 Adhesive material 48 Grounding material 50 Conductive connection member (cut-out piece) 52,62a Adhesive 53 Non-adhesive layer 60,70 Conductive connection material (conductive sheet)

Claims

1. An electronic device, a housing member having a plate portion with a conductive tape attached to a surface thereof and a standing wall provided to stand from an edge of the plate portion and having a microphone hole formed therethrough; a microphone module including a microphone element that acquires sound information through the microphone hole and a flexible substrate on which the microphone element is mounted; an adhesive member for fixing the microphone element to a wall surface of the standing wall; a ground member fixed to a surface of the flexible substrate and electrically connected to the conductive tape; a conductive connection member that electrically connects the ground member and the conductive tape in a state in which the flexible substrate is permitted to move in a direction in which the microphone element approaches the wall surface of the standing wall; Equipped 1. An electronic device comprising:

2. 2. The electronic device according to claim 1, the conductive connection member is formed of a flexible cut-and-raised piece formed on a part of the conductive tape, The cut-and-raised piece has a first surface fixed to the grounding member, and a non-adhesive layer is provided on a second surface on the back side of the first surface.

1. An electronic device comprising:

3. 3. The electronic device according to claim 2, The cut-and-raised piece has a connecting side that is bendably connected to the conductive tape, The connecting edge is located closest to the standing wall among the edges forming the outer periphery of the cut-and-raised piece, and extends along the longitudinal direction of the standing wall.

1. An electronic device comprising:

4. 2. The electronic device according to claim 1, the conductive connection member is made of a flexible conductive sheet having one or more bent portions between a first end and a second end opposite to the first end, The conductive sheet has the first end electrically connected to the surface of the conductive tape and the second end fixed to the ground member.

1. An electronic device comprising:

5. The electronic device according to any one of claims 1 to 4, The flexible substrate is A horizontal placement portion placed on a surface of the plate portion; An upright portion is bent from the horizontal placement portion and fixed to a wall surface of the upright wall; having The ground member is provided at a position close to a bent portion of the horizontal placement portion toward the standing portion.

1. An electronic device comprising:

6. A method for attaching a microphone module to a housing member of an electronic device, comprising the steps of: The housing member has a plate portion having a surface with a conductive tape attached thereto, and a standing wall provided to stand from an edge of the plate portion and having a microphone hole formed therethrough, The microphone module includes a microphone element that acquires sound information through the microphone hole, and a flexible substrate on which the microphone element is mounted, The method for installing the microphone module is as follows: a first step of peeling off a first release paper covering a first adhesive member for fixing the microphone element to a wall surface of the standing wall and a second release paper covering a second adhesive member provided on a ground member fixed to a surface of the flexible substrate; a second step of electrically connecting the ground member and the conductive tape by using the second adhesive member to a flexible conductive connection member that is movable relative to the conductive tape, while allowing the flexible board to move in a direction in which the microphone element approaches a wall surface of the standing wall; a third step of fixing the microphone element to a wall surface of the standing wall using the first adhesive member; have A method for mounting a microphone module.

Images