Light-emitting device

Abstract

To provide a light-emitting device capable of improving bonding strength between a light source and a reflective member.SOLUTION: A light-emitting device comprises: a wiring board having a first wiring and a second wiring on its upper surface; a reflective member located above the wiring board, and having a first through hole including a first inclined surface that expands upward; a light source located above the reflective member, and having a first electrode and a second electrode; and a bonding member that includes a first conductive part located within the first through hole and electrically connecting the first wiring and the first electrode, and a resin part in contact with the first inclined surface, the light source, and the first conductive part.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] SUMMARY OF THE PRESENT EMBODIMENT An embodiment of the present invention relates to a light emitting device. [Background technology]

[0002] Light-emitting devices that combine a wiring board, a light source, and a reflective member are widely used, for example, in backlights for liquid crystal displays, etc. For example, Patent Document 1 discloses a light-emitting device that includes a wiring board, a light source located on the wiring board, and a reflective member located on the wiring board around the light source. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2021-125453 A Summary of the Invention [Problem to be solved by the invention]

[0004] There is a demand for a light emitting device with improved bonding strength between a light source and a reflective member. An object of an embodiment of the present invention is to provide a light emitting device that can improve the bonding strength between a light source and a reflective member. [Means for solving the problem]

[0005] According to one aspect of the present invention, a light emitting device includes a wiring board having a first wiring and a second wiring on an upper surface thereof, a reflective member located above the wiring board and having a first through hole including a first inclined surface extending upward, a light source located above the reflective member and having a first electrode and a second electrode, a first conductive portion located within the first through hole electrically connecting the first wiring and the first electrode, and a bonding member including a resin portion in contact with the first inclined surface, the light source, and the first conductive portion. Effect of the Invention

[0006] According to the light emitting device of one embodiment of the present invention, the bonding strength between the light source and the reflective member can be improved. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a schematic top view of the light emitting device according to the embodiment. [Diagram 2] FIG. 2 is a schematic top view of one light-emitting region of the light-emitting device according to the embodiment. [Diagram 3] 3 is a schematic cross-sectional view of the light emitting device taken along line III-III in FIG. [Figure 4] 4 is a schematic enlarged view of the light emitting device in part IV of FIG. 3. [Diagram 5] FIG. 2 is a schematic top view of a light source and a wiring substrate. [Figure 6] FIG. 2 is a schematic top view of an electrode and a reflecting member of a light source. [Figure 7A] FIG. 2 is a schematic cross-sectional view of a light source according to the present embodiment. [Figure 7B] FIG. 11 is a schematic cross-sectional view of a modified example of the light source according to the embodiment. [Figure 7C] FIG. 13 is a schematic top view of a modified example of the light source according to the embodiment. [Figure 7D] 7D is a schematic cross-sectional view of the light source taken along line VIID-VIID in FIG. 7C. [Figure 8] FIG. 11 is a schematic cross-sectional view of a modified version of the light emitting device according to the embodiment. [Figure 9] 13A and 13B are schematic top views of modified examples of electrodes and reflective members of a light source. [Figure 10] 10 is a schematic cross-sectional view of the light emitting device taken along line XX in FIG. [Figure 11] 13A and 13B are schematic top views of modified examples of electrodes and reflective members of a light source. [Figure 12] 12 is a schematic cross-sectional view of the light emitting device taken along line XII-XII in FIG. 11. [Figure 13] FIG. 11 is a schematic cross-sectional view of a modified version of the light emitting device according to the embodiment. [Figure 14] FIG. 11 is a schematic cross-sectional view of a modified version of the light emitting device according to the embodiment. [Figure 15A]5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the embodiment. [Figure 15B] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a modified example of the light emitting device according to the embodiment. [Figure 15C] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a modified example of the light emitting device according to the embodiment. [Figure 15D] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a modified example of the light emitting device according to the embodiment. [Figure 15E] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a modified example of the light emitting device according to the embodiment. [Figure 16] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the embodiment. [Figure 17] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the embodiment. [Figure 18] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the embodiment. [Figure 19] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the embodiments will be described with reference to the drawings. Since each drawing is a schematic illustration of the embodiment, the scale, interval, or positional relationship of each member may be exaggerated, or some of the members may be omitted. In this specification, the direction of the Z-axis arrow is defined as the upward direction, and the direction opposite to the direction of the Z-axis arrow is defined as the downward direction. Viewing an object from above is called a top view, and a top view is synonymous with a plan view. In addition, an end view showing only a cut surface may be shown as a cross-sectional view.

[0009] In the following description, components having substantially the same functions are indicated by common reference symbols, and descriptions may be omitted. In addition, terms indicating a specific direction or position (for example, "upper", "lower", and other terms including these terms) may be used. However, these terms are merely used for the sake of clarity of the relative direction or position in the referenced drawings. As long as the relationship of the relative direction or position by terms such as "upper" and "lower" in the referenced drawings is the same, the arrangement in drawings other than this disclosure, actual products, etc. may not be the same as that in the referenced drawings. In this specification, "parallel" includes not only cases where two straight lines, sides, faces, etc. do not intersect even when extended, but also cases where the angle formed by the two straight lines, sides, faces, etc. is within a range of 10°. In this specification, the positional relationship expressed as "upper" includes cases where they are in contact and cases where they are not in contact but are located above.

[0010] [Embodiment] A light emitting device 1000 according to an embodiment will be described with reference to Figs. 1 to 14. Fig. 1 is a view of the light emitting device 1000 as viewed from the light emitting surface side. As shown in Fig. 1, two directions parallel to the light emitting surface of the light emitting device 1000 and perpendicular to each other are defined as the X direction and the Y direction. A direction perpendicular to the X direction and the Y direction is defined as the Z direction. In this specification, a plane parallel to the X direction and the Y direction may be referred to as the XY plane. Also, a direction inclined from the X direction at an angle of 0° or more and less than 360° in the XY plane may be referred to as the horizontal direction, and the Z direction may be referred to as the vertical direction.

[0011] The light emitting device 1000 includes a wiring board 10, a reflecting member 20, a light source 30, and a bonding member 40. The wiring board 10 has a first wiring 11P and a second wiring 12P on an upper surface 10A. The reflecting member 20 is located on the upper side of the wiring board 10. The reflecting member 20 has a first through hole 21H. The first through hole 21H of the reflecting member 20 includes a first inclined surface 21A that widens upward. The light source 30 is located on the upper side of the reflecting member 20. The light source 30 has a first electrode 31E and a second electrode 32E. The bonding member 40 includes a first conductive portion 41E and a resin portion 40R. The first conductive portion 41E is located in the first through hole 21H. The first conductive portion 41E electrically connects the first wiring 11P and the first electrode 31E. The resin portion 40R contacts the first inclined surface 21A, the light source 30, and the first conductive portion 41E.

[0012] The resin portion 40R is in contact with the first inclined surface 21A and the light source 30, so that the bonding strength between the light source 30 and the reflecting member 20 can be improved.

[0013] Each element constituting the light emitting device 1000 will be described in detail below.

[0014] (wiring board 10) The wiring board 10 is a member that supplies power to the light source 30. The wiring board 10 has an insulating base material 10S and a conductive wiring 10P. The base material 10S may be a rigid board or a flexible board. In order to reduce the size of the light emitting device 1000 in the vertical direction, it is preferable that the base material 10S is a flexible board. The base material 10S may be a single layer in the vertical direction, or may be a laminate of multiple layers. For example, the base material 10S may be a single-layer flexible board or may be a laminate of multiple rigid boards. For example, a resin such as polyimide can be used as a material for the base material 10S. As shown in FIG. 3 and FIG. 4, the wiring board 10 has wiring 10P located on the upper surface of the base material 10S. The number of wiring 10P provided in the wiring board 10 may be two, three, or four or more. As shown in FIG. 5, the wiring 10P of this embodiment includes a first wiring 11P, a second wiring 12P, and a third wiring 13P. 5, the reflecting member 20 is omitted in order to make the shape of the wiring 10P easier to understand. The wiring 10P is a metal film, for example, a copper film. The wiring 10P can be formed by a known method such as electrolytic plating, electroless plating, vapor deposition, or sputtering.

[0015] (Reflective member 20) The reflective member 20 is a member that has reflectivity to the light emitted by the light source 30. The reflectance of the reflective member 20 to the light from the light source 30 can be, for example, 60% or more, preferably 70% or more, and more preferably 90% or more. In this specification, the reflectance is the reflectance to the peak wavelength of the light source 30.

[0016] The material of the reflective member 20 may be, for example, a resin member containing a gas such as nitrogen and / or oxygen, or a resin member containing light scattering particles. The reflective member 20 preferably contains a resin member as a base material. When the reflective member 20 contains a resin member, the thermal expansion coefficients of the reflective member 20 and the resin part 40R are easily made close to each other. This makes it easier to improve the adhesion between the reflective member 20 and the resin part 40R. The resin member of the reflective member 20 may be, for example, a thermoplastic resin such as an acrylic resin, a polycarbonate resin, a cyclic polyolefin resin, a polyethylene terephthalate resin, or a polyester resin, or a thermosetting resin such as an epoxy resin or a silicone resin. The light scattering particles of the reflective member 20 may be, for example, particles of titania, silica, alumina, zinc oxide, magnesium oxide, zirconia, yttria, calcium fluoride, magnesium fluoride, niobium pentoxide, barium titanate, tantalum pentoxide, barium sulfate, or glass. The reflective member 20 may contain both a gas and light scattering particles.

[0017] As shown in FIG. 3, the reflective member 20 is located on the upper side of the wiring board 10. The reflective member 20 is preferably in contact with the upper surface of the wiring board 10. This makes it easier to miniaturize the light emitting device 1000 in the vertical direction. Also, as in the light emitting device 1001 shown in FIG. 8, the wiring board 10 and the reflective member 20 may be fixed by a first adhesive layer 81 disposed between the wiring board 10 and the reflective member 20. The first adhesive layer 81 may be made of, for example, a resin member containing light scattering particles. For example, the resin member of the first adhesive layer 81 may be made of the same material as the resin member of the reflective member 20. For example, the light scattering particles of the first adhesive layer 81 may be made of the same material as the light scattering particles of the reflective member 20. For example, the first adhesive layer 81 may be made of a sheet-shaped optical transparent adhesive.

[0018] As shown in FIG. 6, the reflecting member 20 of this embodiment has a plurality of through holes (hereinafter referred to as reflecting through holes 20H) including a first through hole 21H, a second through hole 22H, a third through hole 23H, and a fourth through hole 24H. The first through hole 21H of the reflecting member 20 includes a first inclined surface 21A that spreads upward. As shown in FIG. 4, in a cross-sectional view, the first inclined surface 21A of the reflecting member 20 that defines the first through hole 21H is inclined so that the lateral length of the first through hole 21H increases from the lower surface side of the reflecting member 20 toward the upper surface side of the reflecting member 20. The second through hole 22H of the reflecting member 20 includes a second inclined surface 22A that spreads upward. The third through hole 23H of the reflecting member 20 includes a third inclined surface 23A that spreads upward. The fourth through hole 24H of the reflecting member 20 includes a fourth inclined surface 24A that spreads upward. The inner surface defining the reflective through-hole 20H does not have to be inclined in the vertical direction. The reflective through-hole 20H of this embodiment is circular when viewed from above. The reflective through-hole 20H may be elliptical or polygonal, such as triangular, rectangular, hexagonal, or octagonal, when viewed from above.

[0019] In top view, a part of the wiring 10P of the wiring board 10 is exposed from the reflective through-hole 20H of the reflective member 20. In this embodiment, in top view, a part of the first wiring 11P is exposed from the first through-hole 21H, a part of the second wiring 12P is exposed from the second through-hole 22H, a part of the second wiring 12P is exposed from the third through-hole 23H, and a part of the third wiring 13P is exposed from the fourth through-hole 24H.

[0020] (Light source 30) As shown in FIG. 3, the light source 30 is located above the reflecting member 20. The light source 30 has at least a pair of positive and negative electrodes 30E. As shown in FIG. 5 and FIG. 6, the light source 30 of this embodiment has a plurality of electrodes 30E including a first electrode 31E, a second electrode 32E, a third electrode 33E, and a fourth electrode 34E. As shown in FIG. 1, the light emitting device 1000 includes a plurality of light sources 30 including a first light source 30A, a second light source 30B, a third light source 30C, and a fourth light source 30D. The number of light sources 30 included in the light emitting device 1000 may be one.

[0021] As shown in FIG. 7A, the light source 30 includes a light emitting element 30L. The light emitting element 30L includes a semiconductor laminate. The semiconductor laminate includes, for example, a substrate such as sapphire or gallium nitride, an n-type semiconductor layer disposed on the substrate, a p-type semiconductor layer, and a light emitting layer sandwiched between the n-type semiconductor layer and the p-type semiconductor layer. The light emitting element 30L also includes an n-side electrode electrically connected to the n-type semiconductor layer, and a p-side electrode electrically connected to the p-type semiconductor layer. The n-side electrode and the p-side electrode form a part of the lower surface of the light emitting element 30L. Furthermore, the light source 30 includes an n-side metal post electrically connected to the n-side electrode, and a p-side post electrically connected to the p-side electrode. The first electrode 31E of this embodiment includes both an n-side electrode and an n-side metal post. The light source 30 may not include an n-side metal post. When the light source 30 does not include an n-side metal post, the first electrode 31E is formed by the n-side electrode. The second electrode 32E of this embodiment includes both a p-side electrode and a p-side metal post. The light source 30 may not include a p-side metal post. When the light source 30 does not include a p-side metal post, the second electrode 32E is configured by a p-side electrode. The p-side metal post and the n-side metal post include, for example, copper (Cu) and / or nickel (Ni). The third electrode 33E of this embodiment includes both an n-side electrode and an n-side metal post, similar to the first electrode 31E. The fourth electrode 34E of this embodiment includes both a p-side electrode and a p-side metal post, similar to the second electrode 32E. The first electrode 31E may include both a p-side electrode and a p-side metal post, the second electrode 32E may include both an n-side electrode and an n-side metal post, the third electrode 33E may include both a p-side electrode and a p-side metal post, and the fourth electrode 34E may include both an n-side electrode and an n-side metal post. Furthermore, the light source 30 does not have to include a substrate of sapphire, gallium nitride, etc. This makes it easier to reduce the size of the light source 30 in the vertical direction.

[0022] The structure of the light emitting layer may be a structure having a single active layer such as a double heterostructure or a single quantum well structure (SQW), or a structure having a group of active layers such as a multiple quantum well structure (MQW). The light emitting layer can emit visible light or ultraviolet light. The light emitting layer can emit visible light ranging from blue to red. Examples of semiconductor laminates including such a light emitting layer include In x Al y Ga 1-x-y N (0≦x, 0≦y, x+y≦1). The semiconductor laminate can include at least one light-emitting layer capable of emitting the above-mentioned light. For example, the semiconductor laminate may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have a structure in which a structure including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in sequence is repeated multiple times. When the semiconductor laminate includes multiple light-emitting layers, the semiconductor laminate may include light-emitting layers having different peak wavelengths, or may include light-emitting layers having the same peak wavelength. Note that the same peak wavelength may have a variation of, for example, about several nm. The combination of such light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected from combinations of blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. The light-emitting layer may include multiple active layers having different peak wavelengths, or may include multiple active layers having the same peak wavelength.

[0023] In this embodiment, the light emitting element 30L includes two semiconductor laminates, a first semiconductor laminate and a second semiconductor laminate, which are located laterally apart on the substrate. The n-type semiconductor layer of the first semiconductor laminate is electrically connected to the first electrode 31E, and the p-type semiconductor layer of the first semiconductor laminate is electrically connected to the second electrode 32E. The n-type semiconductor layer of the second semiconductor laminate is electrically connected to the third electrode 33E, and the p-type semiconductor layer of the second semiconductor laminate is electrically connected to the fourth electrode 34E. As shown in FIG. 5, the second electrode 32E and the third electrode 33E are electrically connected via the second wiring 12P of the wiring substrate 10. As a result, the first semiconductor laminate and the second semiconductor laminate are connected in series.

[0024] The light source 30 of this embodiment includes one light-emitting element 30L. Each of the light sources 30, the first light source 30A, the second light source 30B, the third light source 30C, and the fourth light source 30D, may include a plurality of light-emitting elements 30L. The peak wavelengths of the plurality of light-emitting elements included in each light source 30 may be the same or different. For example, when each light source 30 includes two light-emitting elements, the peak wavelengths of the light-emitting elements can be selected by combinations such as blue light and green light, blue light and red light, ultraviolet light and blue light, ultraviolet light and green light, ultraviolet light and red light, or green light and red light. For example, when each light source 30 includes three light-emitting elements, the peak wavelengths of the light-emitting elements can be selected by combinations such as blue light and green light and red light, ultraviolet light and green light and red light, ultraviolet light and blue light and green light, ultraviolet light and blue light and red light, ultraviolet light and green light and red light.

[0025] As shown in Fig. 7A, the light source 30 may further include a translucent member (hereinafter, referred to as a first light source translucent member 35). The first light source translucent member 35 covers the upper surface and side surfaces of the light emitting element 30L. The first light source translucent member 35 can protect the light emitting element 30L. The first light source translucent member 35 may be disposed so as to expose at least a part of the upper surface of the light emitting element 30L. This makes it easier to miniaturize the light source 30 in the vertical direction.

[0026] In a cross-sectional view, the side surface of the first light source translucent member 35 may be parallel to the Z-axis direction or may be inclined with respect to the Z-axis direction. When the side surface of the first light source translucent member 35 is inclined with respect to the Z-axis direction in a cross-sectional view, the side surface of the first light source translucent member 35 may be inclined so that the lateral length of the first light source translucent member 35 in the cross-sectional view becomes longer toward the bottom, or may be inclined so that the lateral length becomes shorter toward the bottom. In addition, a pair of side surfaces of the first light source translucent member 35 in the cross-sectional view may be inclined with respect to the Z-axis direction at the same angle. In a cross-sectional view, the side surface of the first light source translucent member 35 may have unevenness.

[0027] For example, the first light source translucent member 35 has translucency for the light emitted by the light emitting element 30L. The first light source translucent member 35 includes a translucent resin, and may further include a phosphor. As the translucent resin, for example, a silicone resin or an epoxy resin may be used. As the phosphor, an yttrium-aluminum-garnet phosphor (for example, (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride phosphors, LSN phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA phosphors (e.g., SrLiAl3N4:Eu), CASN phosphors (e.g., CaAlSiN3:Eu) or SCASN phosphors (e.g., (Sr,Ca)AlSiN3:Eu), nitride phosphors such as KSF phosphors (e.g., K2SiF6:Mn), KSAF phosphors (e.g., K2(Si 1-x Al x )F 6-x:Mn where x satisfies 0 < x < 1), or a fluoride-based phosphor such as an MGF-based phosphor (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), a quantum dot having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), a II-VI group quantum dot (e.g., CdSe), a III-V group quantum dot (e.g., InP), or a quantum dot having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2), etc. can be used. As the phosphor added to the first light source light-transmitting member 35, one type of phosphor may be used, or a plurality of types of phosphors may be used.

[0028] Further, a wavelength conversion sheet containing the above-described phosphor may be disposed above the light-emitting device 1000. The wavelength conversion sheet can be a planar light source that absorbs a part of the blue light from the light source 30 and emits yellow light, green light, and / or red light to emit white light. For example, white light can be obtained by combining a light source 30 capable of emitting blue light and a wavelength conversion sheet containing a phosphor capable of emitting yellow light. Alternatively, a light source 30 capable of emitting blue light and a wavelength conversion sheet containing a red phosphor and a green phosphor may be combined. Further, a light source 30 capable of emitting blue light and a plurality of wavelength conversion sheets may be combined. As the plurality of wavelength conversion sheets, for example, a wavelength conversion sheet containing a phosphor capable of emitting red light and a wavelength conversion sheet containing a phosphor capable of emitting green light can be selected. Further, a light source 30 having a light-emitting element 30L capable of emitting blue light and a first light source light-transmitting member 35 containing a phosphor capable of emitting red light and a wavelength conversion sheet containing a phosphor capable of emitting green light may be combined.

[0029] As the phosphor capable of emitting yellow light used in the wavelength conversion sheet, for example, the above-mentioned yttrium-aluminum-garnet phosphor is preferably used. In addition, as the phosphor capable of emitting green light used in the wavelength conversion sheet, it is preferable to use quantum dots having a narrow half-width of the emission peak wavelength, for example, the above-mentioned perovskite structure quantum dots, III-V group quantum dots, or quantum dots having a chalcopyrite structure. In addition, as the phosphor capable of emitting red light used in the wavelength conversion sheet, it is preferable to use quantum dots having a narrow half-width of the emission peak wavelength, for example, the above-mentioned KSF phosphor, KSAF phosphor, III-V group quantum dots, or quantum dots having a chalcopyrite structure, similar to the phosphor capable of emitting green light.

[0030] A bandpass filter that transmits light in a specific wavelength region and reflects light in other wavelength regions may be disposed between the wavelength conversion sheet and the light source 30. For example, a dichroic sheet is used as the bandpass filter. It is preferable that the bandpass filter transmits only blue light and reflects light of other colors (green light and red light). This allows only blue light from the light source 30 to be incident on the wavelength conversion sheet, so that the wavelength conversion sheet can easily emit white light by using the bandpass filter in combination with a wavelength conversion sheet that absorbs a part of the blue light from the light source 30 and emits white light. In addition, it is possible to reduce the return of light (e.g., green light, red light, etc.) other than blue light that has passed through the bandpass filter and been reflected by the wavelength conversion sheet to the light source 30 side. This reduces the luminance unevenness of the light emitting device 1000.

[0031] A diffusion sheet may be disposed between the bandpass filter and the light source 30. The diffusion sheet transmits light from the light source 30 and can diffuse the transmitted light when it is emitted from the diffusion sheet to the bandpass filter side. This can reduce the luminance unevenness of the light emitting device 1000. The diffusion sheet is preferably made of a material that has low absorption of the light emitted by the light emitting element 30L. Examples of the diffusion sheet include polycarbonate, polystyrene, acrylic, and polyethylene. The diffusion sheet may include minute irregularities on the emission surface, or may include an optical film having light diffusibility. The diffusion sheet may be composed of a single layer, or may be composed of a laminate of multiple layers.

[0032] Also, a prism sheet may be disposed so as to face the surface of the wavelength conversion sheet opposite to the light source 30. A plurality of prisms extending in one direction are arranged on the surface of the prism sheet. The prism sheet may be a single prism sheet or a plurality of prism sheets may be stacked. When a plurality of prism sheets are stacked, for example, one of the prism sheets may be a prism extending in the X direction and the other may be a prism extending in the Y direction. This allows the light emitted from the prism sheet to be aligned in a direction perpendicular to the exit surface of the prism sheet, thereby increasing the luminance of the light emitting device 1000 when viewed from above.

[0033] The light source 30 may further include a covering member 36. The covering member 36 has reflectivity for the light emitted by the light emitting element 30L. The covering member 36 is disposed on the lower surface of the light emitting element 30L. The covering member 36 is disposed so that the lower surface of the electrode 30E of the light source 30 is exposed from the covering member 36. The covering member 36 is also disposed on the lower surface of the first light source translucent member 35 that covers the side surface of the light emitting element 30L.

[0034] In this embodiment, the resin portion 40R and the covering member 36 are in contact with each other. The covering member 36 preferably contains a resin member as a base material. When the covering member 36 contains a resin member, the thermal expansion coefficients of the covering member 36 and the resin portion 40R are easily made close to each other. This makes it easier to improve the adhesion between the covering member 36 and the resin portion 40R. For example, a resin member containing a gas such as nitrogen and / or oxygen, or a resin member containing light scattering particles, etc. can be used for the covering member 36. For example, a material similar to that of the resin member of the reflecting member 20 can be used for the resin member of the covering member 36. For example, a material similar to that of the light scattering particles of the reflecting member 20 can be used for the light scattering particles of the resin member of the covering member 36. The covering member 36 may contain both a gas and light scattering particles.

[0035] As shown in FIG. 7B, the light source 30 can include a light adjustment member (hereinafter, referred to as a light source light adjustment member 37). The light source light adjustment member 37 constitutes at least a part of the upper surface of the light source 30. The light source light adjustment member 37 is located above the light emitting element 30L. When viewed from above, the light source light adjustment member 37 and the light emitting element 30L overlap, and the light source light adjustment member 37 is located above the light emitting element 30L at the overlapping portion. The light source light adjustment member 37 is located above the first light source translucent member 35, and adjusts the amount and / or emission direction of light emitted from the upper surface of the first light source translucent member 35. The light source light adjustment member 37 has reflectivity and translucency with respect to the light emitted by the light emitting element 30L. A part of the light emitted from the upper surface of the first light source translucent member 35 is reflected by the light source light adjustment member 37, and the other part passes through the light source light adjustment member 37. The transmittance of the light source light adjusting member 37 with respect to the peak wavelength of the light emitting element 30L is, for example, preferably 1% to 50%, more preferably 3% to 30%. By including the light source light adjusting member 37 in the light source 30, it is possible to prevent the area directly above the light source 30 from becoming too bright. This makes it easier to reduce luminance unevenness of the light emitting device 1000.

[0036] The light source light adjustment member 37 may be, for example, a resin member containing a gas such as nitrogen and / or oxygen, or a resin member containing light scattering particles. The resin member of the light source light adjustment member 37 may be made of the same material as the resin member of the reflecting member 20. The light scattering particles of the light source light adjustment member 37 may be made of the same material as the light scattering particles of the reflecting member 20. The light source light adjustment member 37 may contain both a gas and light scattering particles. The light source light adjustment member 37 may also be, for example, a metal member such as aluminum or silver, or a dielectric multilayer film.

[0037] As shown in FIG. 7A, the light source 30 may not include the light source light adjustment member 37. That is, the upper surface of the light source 30 may be composed of the upper surface of the light emitting element 30L and / or the upper surface of the first light source translucent member 35. In this way, the light source 30 can be more easily miniaturized in the vertical direction than when the light source 30 includes the light source light adjustment member 37 located on the upper side of the light emitting element 30L. In another embodiment of the light source 30, the light source 30 may not include the covering member 36. That is, the lower surface of the light source 30 may be composed of the lower surface of the light emitting element 30L and the lower surface of the first light source translucent member 35. In another embodiment of the light source 30, the light source 30 may be only the light emitting element 30L. In another embodiment of the light source 30, the light source 30 may not include the first light source translucent member 35 and the covering member 36, and the light source light adjustment member 37 may be located on the upper surface of the light emitting element 30L. In another embodiment of the light source 30, the light source 30 does not include the first light source transmissive member 35, and the light source light adjustment member 37 is located on the upper surface of the light emitting element 30L, and the covering member 36 is located on the lower surface of the light emitting element 30L.

[0038] As shown in FIG. 7C and FIG. 7D, the light source 30 may include a plurality of light-emitting elements 30L. The plurality of light-emitting elements 30L include a first light-emitting element 30L1, a second light-emitting element 30L2, and a third light-emitting element 30L3. The peak wavelength of the first light-emitting element 30L1, the peak wavelength of the second light-emitting element 30L2, and the peak wavelength of the third light-emitting element 30L3 are not particularly limited. For example, the peak wavelength of the first light-emitting element 30L1, the peak wavelength of the second light-emitting element 30L2, and the peak wavelength of the third light-emitting element 30L3 may be the same or different from each other. It is preferable that the peak wavelength of the first light-emitting element 30L1 is 430 nm or more and 480 nm or less, the emission peak wavelength of the second light-emitting element 30L2 is 500 nm or more and 580 nm or less, and the emission peak wavelength of the third light-emitting element 30L3 is 430 nm or more and 480 nm or less. The light source 30 includes the first light emitting element 30L1 and the third light emitting element 30L3 that emit blue light, and the second light emitting element 30L2 that emits green light, so that color reproducibility is improved when the light emitting device is used in a liquid crystal display device. By using a light emitting element that emits green light, the half width of the green light can be made shorter than when green light is obtained using a green phosphor, so that color reproducibility is improved.

[0039] 7C, it is preferable that the second light-emitting element 30L2 emitting green light is located between the first light-emitting element 30L1 and the third light-emitting element 30L3 emitting blue light, so that the blue light and the green light are easily mixed.

[0040] As shown in FIG. 7D, it is preferable that at least a part of the outer surface 351 of the first light source translucent member 35 covering the side surfaces of the first light emitting element 30L1, the second light emitting element 30L2, and the third light emitting element 30L3 is covered with the covering member 36. In this way, the light from the first light emitting element 30L1, the light from the second light emitting element 30L2, and the light from the third light emitting element 30L3 are easily mixed in the first light source translucent member 35. This makes it easier to improve the color mixing of the light source 30. It is preferable that the first light source translucent member 35 covering the side surfaces of the first light emitting element 30L1, the second light emitting element 30L2, and the third light emitting element 30L3 contains a phosphor capable of emitting red light. In this way, the light source 30 can emit blue light, green light, and red light. In this embodiment, the covering member 36 covering at least a part of the outer surface 351 of the first light source translucent member 35 and the covering member 36 disposed on the lower surface of the light emitting element 30L are integrally formed of the same material. The covering member 36 covering at least a part of the outer surface 351 of the first light source translucent member 35 and the covering member 36 disposed on the lower surface of the light emitting element 30L may be separate members. Also, at least a part of the outer surface 351 of the first light source translucent member 35 covering the side surfaces of the first light emitting element 30L1, the second light emitting element 30L2, and the third light emitting element 30L3 may not be covered by the covering member 36. In this way, it becomes easier to extract light from the first light emitting element 30L1, the second light emitting element 30L2, and the third light emitting element 30L3.

[0041] As shown in Fig. 7D, the light source 30 may further include a translucent member (hereinafter referred to as a second light source translucent member 38) between the first light source translucent member 35 and the light source light adjustment member 37 in the up-down direction. At least a part of an outer surface 381 of the second light source translucent member 38 is exposed from the covering member 36. In this way, light from the first light emitting element 30L1, light from the second light emitting element 30L2, and light from the third light emitting element 30L3 can be extracted from the outer surface 381 of the second light source translucent member 38. Note that in Fig. 7C, the light source light adjustment member 37 and the second light source translucent member 38 are omitted.

[0042] The shape of the light source 30 as viewed from above is not particularly limited. The shape of the light source 30 as viewed from above can be, for example, a circle, a triangle, a rectangle, a hexagon, or an octagon. When the shape of the light source 30 as viewed from above is a rectangle, a pair of outer edges of the light source 30 may be parallel to the X direction or may be inclined with respect to the X direction. In this embodiment, a pair of outer edges of the light source 30 are parallel to the X direction.

[0043] (Joint member 40) The bonding member 40 is a member that electrically connects the wiring board 10 and the light source 30. As shown in FIG. 3 and FIG. 4, the bonding member 40 includes a conductive part 40E having electrical conductivity and a resin part 40R having electrical insulation. As a material for the conductive part 40E of the bonding member 40, known materials such as solder such as tin-bismuth-based, tin-copper-based, tin-silver-based, and gold-tin-based, conductive paste such as silver, gold, and palladium, bumps, anisotropic conductive materials, and brazing materials such as low-melting point metals can be used. As a base material for the resin part 40R of the bonding member 40, for example, a material similar to that of the resin part of the reflecting member 20 can be used. The resin part 40R of the bonding member 40 may contain light scattering particles similar to those of the reflecting member 20. The resin part 40R of the bonding member 40 preferably has adhesiveness. The adhesive resin part 40R comes into contact with the reflecting member 20 and the light source 30, which makes it easier to improve the bonding strength between the reflecting member 20 and the light source 30. The adhesive resin portion 40R may be made of known materials such as rosin resin, terpene resin, petroleum resin, styrene resin, phenol resin, xylene resin, and acrylic resin. The pre-hardened joint member 40 may be a conductive paste containing a mixture of metal particles such as solder and flux. The conductive portion 40E can be formed by heating the paste to a temperature equal to or higher than the melting point of the metal particles to melt the metal particles, and then hardening the molten metal particles by cooling. The resin portion 40R can also be formed by the flux contained in the conductive paste.

[0044] As shown in FIG. 5, the conductive portion 40E of the present embodiment includes a first conductive portion 41E, a second conductive portion 42E, a third conductive portion 43E, and a fourth conductive portion 44E. The bonding member 40 includes the first conductive portion 41E in contact with the resin portion 40R. The first conductive portion 41E electrically connects the first wiring 11P of the wiring board 10 and the first electrode 31E of the light source 30. The first conductive portion 41E is located in the first through hole 21H of the reflecting member 20. The resin portion 40R contacts the first inclined surface 21A of the reflecting member 20 and the light source 30. The light emitting device 1000 includes the resin portion 40R in contact with the reflecting member 20 and the light source 30, which makes it easier to improve the bonding strength between the light source 30 and the reflecting member 20.

[0045] Since the first inclined surface 21A is expanded upward, the contact area between the resin part 40R and the first inclined surface 21A can be increased more easily than when the inner surface defining the first through hole 21H of the reflecting member 20 is not inclined with respect to the Z-axis direction. This makes it easier to improve the bonding strength between the resin part 40R and the reflecting member 20. Also, since the first inclined surface 21A is expanded upward, voids generated in the resin part 40R can be moved to the outside of the resin part 40R more easily than when the first inclined surface 21A is expanded downward. This makes it easier to increase the contact area between the resin part 40R and the first inclined surface 21A, making it easier to improve the bonding strength between the resin part 40R and the reflecting member 20.

[0046] The second conductive portion 42E electrically connects the second wiring 12P of the wiring substrate 10 and the second electrode 32E of the light source 30. The third conductive portion 43E electrically connects the second wiring 12P of the wiring substrate 10 and the third electrode 33E of the light source 30. The fourth conductive portion 44E electrically connects the third wiring 13P of the wiring substrate 10 and the fourth electrode 34E of the light source 30. The second conductive portion 42E is located in the second through hole 22H of the reflecting member 20. The third conductive portion 43E is located in the third through hole 23H of the reflecting member 20. The fourth conductive portion 44E is located in the fourth through hole 24H of the reflecting member 20.

[0047] As shown in FIG. 3 and FIG. 4, it is preferable that one resin part 40R contacts the first conductive part 41E and the second conductive part 42E. In this way, it is easy to increase the contact area between the resin part 40R and the light source 30 and / or the contact area between the resin part 40R and the reflecting member 20. This makes it easy to improve the bonding strength between the light source 30 and the reflecting member 20. It is preferable that one resin part 40R contacts the first conductive part 41E, the second conductive part 42E, the third conductive part 43E, and the fourth conductive part 44E. In this way, it is easy to further increase the contact area between the resin part 40R and the light source 30 and / or the contact area between the resin part 40R and the reflecting member 20. The light emitting device may include a plurality of resin parts 40R that are in contact with and spaced apart from a plurality of conductive parts 40E, respectively.

[0048] The resin portion 40R is preferably in contact with the second inclined surface 22A and the light source 30. This makes it easier to improve the bonding strength between the light source 30 and the reflecting member 20. The resin portion 40R is preferably in contact with the third inclined surface 23A and the light source 30. This makes it easier to improve the bonding strength between the light source 30 and the reflecting member 20. The resin portion 40R is preferably in contact with the fourth inclined surface 24A and the light source 30. This makes it easier to improve the bonding strength between the light source 30 and the reflecting member 20. It is preferable that one resin portion 40R is in contact with the first inclined surface 21A and the second inclined surface 22A. This makes it easier to increase the area of ​​contact between the resin portion 40R and the reflecting member 20, so it is easier to improve the bonding strength between the resin portion 40R and the reflecting member 20. It is preferable that one resin portion 40R is in contact with the first inclined surface 21A, the second inclined surface 22A, the third inclined surface 23A, and the fourth inclined surface 24A.

[0049] 6, it is preferable that a part of the resin part 40R is located outside the light source 30 in a top view. This makes it easier to increase the contact area between the resin part 40R and the light source 30 and / or the contact area between the resin part 40R and the reflective member 20. This makes it easier to improve the bonding strength between the light source 30 and the reflective member 20.

[0050] As shown in FIG. 6, it is preferable that a part of the first electrode 31E overlaps with the first inclined surface 21A in a top view. This makes it easier to increase the area of ​​the first electrode 31E in a top view. This makes it easier for heat from the light source 30 to be transferred to the wiring board 10 via the first electrode 31E, making it easier to improve the heat dissipation of the light emitting device 1000. It is preferable that a part of the second electrode 32E overlaps with the second inclined surface 22A in a top view. It is preferable that a part of the third electrode 33E overlaps with the third inclined surface 23A in a top view. It is preferable that a part of the fourth electrode 34E overlaps with the fourth inclined surface 24A in a top view.

[0051] In a top view, the length from the center of a part of the first through hole 21H that opens on the lower surface of the reflecting member to the center of a part of the second through hole 22H that opens on the lower surface of the reflecting member is preferably longer than the length from the center of the first electrode 31E to the center of the second electrode 32E. In this way, it is easy to increase the distance from the first through hole 21H to the second through hole 22H. This makes it easy to reduce the connection between the first through hole 21H and the second through hole 22H. Similarly, in a top view, the length from the center of a part of the first through hole 21H that opens on the lower surface of the reflecting member to the center of a part of the third through hole 23H that opens on the lower surface of the reflecting member is preferably longer than the length from the center of the first electrode 31E to the center of the third electrode 33E. In a top view, the length from the center of a part of the first through hole 21H that opens on the lower surface of the reflecting member to the center of a part of the fourth through hole 24H that opens on the lower surface of the reflecting member is preferably longer than the length from the center of the first electrode 31E to the center of the fourth electrode 34E. In this specification, the center of each member means the geometric center of gravity of each member.

[0052] It is preferable that the first conductive portion 41E contacts the first inclined surface 21A. This makes it easier to increase the volume of the first conductive portion 41E. This makes it easier for heat from the light source 30 to be transferred to the wiring board 10 via the first conductive portion 41E, making it easier to improve the heat dissipation of the light emitting device 1000. Note that the first conductive portion 41E does not have to contact the first inclined surface 21A. This makes it easier to increase the area where the first inclined surface 21A and the resin portion 40R contact each other. This makes it easier to improve the bonding strength between the reflective member 20 and the resin portion 40R.

[0053] A cross section perpendicular to the upper surface 10A of the wiring board 10 passing through the first electrode 31E and the second electrode 32E is defined as a first cross section. As shown in FIG. 4, in the first cross section, the first inclined surface 21A includes a first inclined first surface 21A1 located on the second electrode 32E side and a first inclined second surface 21A2 facing the first inclined first surface 21A1. The length in the vertical direction of a part of the resin part 40R in contact with the first inclined first surface 21A1 is defined as a first length L1. The length in the vertical direction of a part of the resin part 40R in contact with the first inclined second surface 21A2 is defined as a second length L2. It is preferable that the second length L2 is longer than the first length L1. This makes it easier to increase the area where the resin part 40R and the first inclined second surface 21A2 contact each other. This makes it easier to improve the bonding strength between the resin portion 40R and the reflective member 20 near the outer periphery of the light source 30 where the resin portion 40R and the reflective member 20 are likely to separate due to warping of the wiring board 10 caused by heat from the light source 30.

[0054] As shown in FIG. 4, in the first cross section, the minimum length from the upper end of the part of the first conductive part 41E in contact with the first inclined surface 21A to the upper end of the part of the second conductive part 42E in contact with the second inclined surface 22A is defined as the third length L3. In the first cross section, the minimum length from the first wiring 11P to the second wiring 12P is defined as the fourth length L4. It is preferable that the third length L3 is shorter than the fourth length L4. In this way, it is easy to increase the volume of the first conductive part 41E and / or the second conductive part 42E. As a result, heat from the light source 30 is easily transferred to the wiring board 10 via the first conductive part 41E and / or the second conductive part 42E, and therefore it is easy to improve the heat dissipation of the light emitting device 1000.

[0055] The refractive index of the base material of the resin part 40R is preferably higher than that of the base material of the reflecting member 20. In this way, the light emitted from the light source 30 and traveling downward is easily totally reflected at the interface between the resin part 40R and the reflecting member 20. This makes it easier to reduce the light that escapes downward from the light emitting device 1000, and therefore makes it easier to improve the light extraction efficiency of the light emitting device 1000. In this specification, unless otherwise specified, the refractive index is a value at the peak wavelength of the light source. In addition, the refractive index can be measured, for example, with an Abbe refractometer. If the size of a member makes it impossible to measure with an Abbe refractometer, the member can be identified, and the refractive index can be obtained from the measurement results of a member similar to the identified member.

[0056] As in the light emitting device 1002 shown in FIG. 9 and FIG. 10, the reflecting member 20 preferably includes a recess (hereinafter, referred to as a reflecting recess 20G) on the upper surface that is connected to the reflecting through hole 20H. In this way, it is easy to move voids generated in the reflecting through hole 20H to the outside of the reflecting through hole 20H via the reflecting recess 20G. This makes it easy to reduce voids located in the reflecting through hole 20H, and therefore makes it easy to increase the volume of the bonding member 40 located in the reflecting through hole 20H. As a result, it is easy to improve the bonding strength between the wiring board 10 and the light source 30. The number of reflecting recesses 20G connected to one reflecting through hole 20H in the reflecting member 20 is not particularly limited. The reflecting member 20 preferably includes a plurality of reflecting recesses 20G connected to one reflecting through hole 20H. In this way, it is easy to move voids generated in the reflecting through hole 20H to the outside of the reflecting through hole 20H via the plurality of reflecting recesses 20G. In the top view, it is preferable that the reflecting recess 20G extends to the outside of the light source 30. By doing so, it becomes easier to move voids occurring between the reflecting member 20 and the light source 30 to the outside of the light source 30 when viewed from above.

[0057] As in the light-emitting device 1003 shown in FIG. 12, the light-emitting device 1003 may include a conductive connecting member 10C in contact with the wiring 10P and the bonding member 40. As shown in FIG. 12, the connecting member 10C of this embodiment includes a first connecting portion 11C in contact with the first wiring 11P and the first conductive portion 41E, and a second connecting portion 12C in contact with the second wiring 12P and the second conductive portion 42E. The connecting member 10C may include a third connecting portion in contact with the second wiring 12P and the third conductive portion 43E, and a fourth connecting portion in contact with the third wiring 13P and the fourth conductive portion 44E. In a top view, at least a part of the connecting member 10C is located inside the reflective through-hole 20H. As shown in FIG. 11, the first connecting portion 11C is preferably located inside the first through-hole 21H and outside the first through-hole 21H. This makes it easier to increase the volume of the first connecting portion 11C. This makes it easier for heat from the light source 30 to be transferred to the wiring board 10 via the first connecting portion 11C, and therefore makes it easier to improve the heat dissipation of the light emitting device 1003. The second connecting portion 12C is preferably located inside the second through hole 22H and outside the second through hole 22H. The maximum length of the first connecting portion 11C in the vertical direction is preferably longer than the maximum length of the first wiring 11P in the vertical direction. This makes it easier to increase the volume of the first connecting portion 11C. As in the light emitting device 1004 shown in FIG. 13, the first connecting portion 11C may be located only inside the first through hole 21H. By positioning the first connecting portion 11C inside the first through hole 21H, it makes it easier to reduce the volume of the first conductive portion 41E. This makes it easier to reduce the variation in the shape of the first conductive portion 41E. As the material of the connecting member 10C, for example, a material similar to the conductive portion 40E of the bonding member 40 or a material similar to the wiring 10P can be used. The thermal conductivity of the connecting member 10C is preferably higher than the thermal conductivity of the conductive portion 40E. This makes it easier for heat from the light source 30 to be transferred to the wiring board 10 via the connecting member 10C.

[0058] As shown in FIG. 3, the light emitting device 1000 includes a light guide member 50. The light guide member 50 is a member having translucency for light emitted by the light source 30. The transmittance of the light guide member 50 for the peak wavelength of the light source 30 is, for example, preferably 60% or more, more preferably 80% or more. The light emitting device 1000 has a first surface 501 that is a light emitting surface, and a second surface 502 located on the opposite side of the first surface 501. The light guide member 50 has a through hole (hereinafter, referred to as a light guide through hole 50H) that penetrates from the first surface 501 to the second surface 502. The light source 30 is located in the light guide through hole 50H of the light guide member 50. As a result, the light guide member 50 surrounds the light source 30 in a top view. The light guide through hole 50H in this embodiment is circular in a top view. The light guiding through hole 50H may be elliptical or polygonal, such as triangular, rectangular, hexagonal, or octagonal, when viewed from above.

[0059] The light guide member 50 may be made of, for example, the same material as the resin member of the reflecting member 20. Alternatively, the light guide member 50 may be made of glass or the like. The light guide member 50 may contain phosphors and / or light scattering particles.

[0060] The light guide member 50 is located above the reflection member 20. In this embodiment, the reflection member 20 and the light guide member 50 are fixed by a second adhesive layer 82 disposed between the reflection member 20 and the light guide member 50. The second adhesive layer 82 can be made of, for example, a resin member containing light scattering particles. For example, the same material as the resin member of the reflection member 20 can be used as the resin member of the second adhesive layer 82. For example, the same material as the light scattering particles of the reflection member 20 can be used as the light scattering particles of the second adhesive layer 82. A sheet-shaped optical transparent adhesive may be used as the second adhesive layer 82. The reflection member 20 and the light guide member 50 may be directly bonded to each other without providing the second adhesive layer 82.

[0061] The refractive index of the base material of the second adhesive layer 82 is preferably lower than the refractive index of the base material of the light guiding member 50. This makes it easier for a part of the light traveling from the light guiding member 50 to the second adhesive layer 82 to be totally reflected at the interface between the light guiding member 50 and the second adhesive layer 82. This makes it possible to reduce the light that escapes downward from the light emitting device 1000, thereby improving the light extraction efficiency of the light emitting device 1000.

[0062] The number of light guide members 50 included in the light emitting device 1000 may be one or more. In this embodiment, the light emitting device 1000 includes a plurality of light guide members 50 including a first light guide section 50A, a second light guide section 50B, a third light guide section 50C, and a fourth light guide section 50D. As shown in FIG. 1, the first light guide section 50A and the second light guide section 50B are adjacent to each other in the X direction. The third light guide section 50C and the fourth light guide section 50D are adjacent to each other in the X direction. The first light guide section 50A and the third light guide section 50C are adjacent to each other in the Y direction. The second light guide section 50B and the fourth light guide section 50D are adjacent to each other in the Y direction. The first light source 30A is located in the light guide through hole 50H of the first light guide section 50A. The second light source 30B is located in the light guide through hole 50H of the second light guide section 50B. The third light source 30C is located in a light guide through hole 50H of the third light guide section 50C. The fourth light source 30D is located in a light guide through hole 50H of the fourth light guide section 50D.

[0063] The light guide member 50 is partitioned by partitioning grooves 50G. One area partitioned by the partitioning grooves 50G is the light emitting area 100A. In this embodiment, the first light guiding section 50A, the second light guiding section 50B, the third light guiding section 50C, and the fourth light guiding section 50D partitioned by the partitioning grooves 50G are different light emitting areas 100A. One light emitting area 100A can be a driving unit of local dimming. The number of light emitting areas 100A constituting the light emitting device 1000 is not particularly limited. For example, the light emitting device 1000 may include one light emitting area 100A, or the light emitting device 1000 may include multiple light emitting areas 100A. In addition, a planar light source device having a larger area may be formed by arranging multiple light emitting devices 1000. A member having reflectivity to light emitted by the light source 30 may be arranged in the partitioning grooves 50G. This can improve the contrast between the light emitting area in the light emitting state and the light emitting area in the non-light emitting state. In addition, in the light-emitting module, a member having reflectivity to the light emitted by the light source 30 does not necessarily have to be disposed in the partitioning groove 50G.

[0064] In this embodiment, the light guide member 50 includes a lattice-shaped partition groove 50G including a first partition groove 51G extending in the Y direction and a second partition groove 52G extending in the X direction. The first partition groove 51G extending in the Y direction is between the first light guide portion 50A and the second light guide portion 50B. The second partition groove 52G extending in the X direction is between the first light guide portion 50A and the third light guide portion 50C. The partition groove 50G preferably penetrates from the first surface 501 to the second surface 502 of the light guide member 50. In this manner, the light guide member 50 can be divided into a plurality of portions, which makes it easier to reduce warping of the light guide member 50 and / or the wiring board 10 caused by, for example, a difference in thermal expansion coefficient between the light guide member 50 and the wiring board 10. The partition groove 50G may be a recess that opens only on the first surface 501 side of the light guide member 50, or may be a recess that opens only on the second surface 502 side of the light guide member 50. When the partition groove 50G is a recess, the partition groove 50G has a bottom surface formed by the light-guiding member 50.

[0065] The side surface of the partitioning groove 50G may be parallel to the Z-axis direction or may be inclined with respect to the Z-axis direction. When the side surface of the partitioning groove 50G is inclined with respect to the Z-axis direction, the distance between the opposing side surfaces of the partitioning groove 50G may become shorter or longer as it goes downward.

[0066] As shown in FIG. 1, it is preferable that the reflecting member 20 is exposed from the partitioning groove 50G in top view. In this way, it is easy to reduce the brightness in the vicinity of the partitioning groove 50G from being too low. In top view, the brightness in the vicinity of the partitioning groove 50G may be adjusted by appropriately adjusting the vertical length of the reflecting member 20 located in the partitioning groove 50G. As in the light-emitting device 1001 shown in FIG. 8, the reflecting member 20 may be separated into a plurality of parts for each light-emitting region 100A. In this way, it is easy to reduce warping of the wiring board 10 and / or the reflecting member 20 due to the difference in thermal expansion coefficient between the wiring board 10 and the reflecting member 20.

[0067] As shown in FIG. 3, the light guide member 50 preferably has a hole (hereinafter, referred to as a light guide hole 51C) that opens on the first surface 501 and / or the second surface 502 of the light guide member 50. In a top view, the light guide hole 51C is located between the light guide through hole 50H and the partition groove 50G. In this embodiment, the light guide hole 51C is a recess that opens only on the first surface 501 side. The light guide hole 51C may be a recess that opens only on the second surface 502 side, or may be a through hole that penetrates from the first surface 501 to the second surface 502 of the light guide member 50. The light guide member 50 includes the light guide hole 51C, so that the surface area of ​​the light guide member 50 can be increased. In this way, the amount of light extracted from the surface of the light guide member 50 to the outside of the light guide member 50 can be increased. This makes it easier to adjust the brightness of the light emitting device 1000, and therefore makes it easier to reduce uneven brightness of the light emitting device 1000. The depth of the recess in the up-down direction is, for example, 0.1 times or more the maximum length in the up-down direction of the light guiding member 50. The light guiding member 50 may include one light guiding hole 51C, or two or more light guiding holes 51C.

[0068] The shape of the light guide hole 51C in the top view is not particularly limited. As shown in FIG. 1, the shape of the light guide hole 51C in this embodiment in the top view is a circle. The light guide hole 51C in the top view may include a linear portion. In this specification, the linear portion includes a straight line, a curved line, or a bent line. The shape of the light guide hole 51C in the top view may be a V-shape or an L-shape extending in two directions. The shape of the light guide hole 51C in the top view may be an ellipse or a polygon such as a triangle, a rectangle, a hexagon, or an octagon.

[0069] In this specification, a point on the outer edge of the first light guiding section 50A located on the first surface 501 that is farthest from the center of the first light source 30A is referred to as a first point P1, and a point on the outer edge of the first light guiding section 50A located on the first surface 501 that is closest to the center of the first light source 30A is referred to as a second point P2. In this embodiment, the first point P1 is located at each corner of the first light guiding section 50A, and the second point P2 is located at the center of each side of the first light guiding section 50A. There may be one or more first points P1 and second points P2.

[0070] As shown in FIG. 2, in a top view, a first virtual straight line IL connects the center of the first light source 30A and the first point P1. In a top view, a second virtual straight line IIL connects the center of the first light source 30A and the second point P2. In the first surface 501, a range that passes through the center of the first light source 30A and forms an angle of 10° or less with the first virtual straight line IL is defined as a first region 51R. In the first surface 501, a range that passes through the center of the first light source 30A and forms an angle of 10° or less with the second virtual straight line IIL is defined as a second region 52R. In FIG. 2, the range located in the first region 51R is indicated by hatching that slopes upward to the right, and the range located in the second region 52R is indicated by hatching that slopes upward to the left. It is preferable that the density of the light guide holes 51C in the first region 51R is higher than the density of the light guide holes 51C in the second region 52R. The first point P1, which is far from the first light source 30A, tends to have lower brightness than the second point P2, which is close to the first light source 30A. However, the density of the light guide holes 51C in the first region 51R is high, which makes it easier to increase the amount of light extracted from the light guide member 50 to the outside in the vicinity of the first point P1. This makes it easier to reduce the difference between the brightness at the first point P1 and the brightness at the second point P2, which makes it easier to reduce the brightness unevenness of the light emitting device 1000. The density of the light guide holes 51C in the first region 51R is the ratio of the area of ​​the light guide holes 51C located in the first region 51R to the area of ​​the first region 51R in a top view. When a plurality of light guide holes 51C are located in the first region 51R, the density of the light guide holes 51C in the first region 51R is the ratio of the total area of ​​the light guide holes 51C located in the first region 51R to the area of ​​the first region 51R in a top view.

[0071] The shape of the light guide hole 51C provided in the first light guide section 50A and the shape of the light guide hole 51C provided in the second light guide section 50B may be the same or different. In addition, the number of the light guide holes 51C provided in the first light guide section 50A and the number of the light guide holes 51C provided in the second light guide section 50B may be the same or different. For example, before forming the light guide holes 51C in the light guide member 50, the luminance unevenness of the first light guide section 50A and the luminance unevenness of the second light guide section 50B are confirmed. After confirming the luminance unevenness of the first light guide section 50A and the luminance unevenness of the second light guide section 50B, the light guide holes 51C suitable for each of the first light guide section 50A and the second light guide section 50B are formed in the light guide member 50. In this way, the luminance unevenness of the light emitting device 1000 can be reduced. For example, if the luminance unevenness is suppressed to a desired range before forming the light guiding hole 51C in the light guiding member 50, it is not necessary to provide the light guiding hole 51C in the light guiding member 50. The luminance unevenness of the first light guiding section 50A and the luminance unevenness of the second light guiding section 50B can be confirmed, for example, by measuring the luminance with a two-dimensional color luminance meter (CA-2500 manufactured by Konica Minolta).

[0072] The maximum length of the light guide member 50 in the vertical direction is preferably, for example, 150 μm or more and 800 μm or less. The light guide member 50 may be configured as a single layer in the vertical direction, or may be configured as a laminate of multiple layers. When the light guide member 50 is configured as a laminate, a light-transmitting adhesive may be disposed between each layer. Each layer of the laminate may use a different type of main material.

[0073] There is no particular limitation on the method for forming the light guiding hole 51C in the light guiding member 50. For example, the light guiding hole 51C can be formed in the light guiding member 50 by a known method such as laser processing or drilling. Note that the light guiding member including the light guiding hole 51C may be formed by a method such as injection molding, transfer molding, or compression molding using a mold or the like.

[0074] (Translucent member 60) 3, the light emitting device 1000 includes a light-transmitting member 60. The light-transmitting member 60 is a member that transmits light emitted by the light source 30. The light-transmitting member 60 covers the light source 30.

[0075] The light-transmitting member 60 of this embodiment has a first light-transmitting portion 61 and a second light-transmitting portion 62. In this embodiment, the first light-transmitting portion 61 and the second light-transmitting portion 62 are separate bodies. The first light-transmitting portion 61 and the second light-transmitting portion 62 may be integrally formed of the same material. The transmittance of each of the first light-transmitting portion 61 and the second light-transmitting portion 62 for the peak wavelength of the light source 30 is, for example, preferably 60% or more, more preferably 80% or more. The transmittance of each of the first light-transmitting portion 61 and the second light-transmitting portion 62 for the peak wavelength of the light source 30 is preferably higher than the transmittance of the resin portion 40R for the peak wavelength of the light source 30. In this way, the light extraction efficiency of the light-emitting device 1000 is easily improved.

[0076] 3, the first light transmitting portion 61 is preferably in contact with a side surface of the light source 30. This allows light from the light source 30 to easily enter the first light transmitting portion 61. The first light transmitting portion 61 is preferably in contact with the light guide member 50. This allows light from the light source 30 to easily enter the light guide member 50.

[0077] It is preferable that the entire upper surface of the light source 30 is exposed from the first light transmitting portion 61. In this way, the light emitting device 1000 can be easily miniaturized in the vertical direction. The first light transmitting portion 61 may cover the entire upper surface of the light source 30, or may cover a part of the light source 30. By the first light transmitting portion 61 covering the entire upper surface of the light source 30, it becomes easy to adjust the luminance in the area directly above the light source 30. For example, the luminance in the area directly above the light source 30 can be adjusted by changing the thickness of the first light transmitting portion 61 in the portion covering the upper surface of the light source 30. This makes it easy to adjust the luminance, and therefore makes it easy to reduce the luminance unevenness of the light emitting device 1000. When the first light transmitting portion 61 covers the upper surface of the light source 30, the second light transmitting portion 62 may or may not cover the upper surface of the light source 30 via the first light transmitting portion 61.

[0078] 3, the first light transmitting portion 61 of the light-transmitting member 60 is preferably in contact with the second surface 502, which is the lower surface of the light-guiding member 50. This makes it easier to improve the bonding strength between the light-transmitting member 60 and the light-guiding member 50. The first light transmitting portion 61 of the light-transmitting member 60 is preferably in continuous contact with the second surface 502 of the light-guiding member 50 and the inner surface that defines the light-guiding through hole 50H. This makes it easier to improve the bonding strength between the light-transmitting member 60 and the light-guiding member 50.

[0079] The first light transmitting section 61 may be composed of a single layer in the up-down direction, or may be composed of a laminate of multiple layers. The first light transmitting section 61 may contain phosphor and / or light scattering particles. When the first light transmitting section 61 is a laminate, each layer may or may not contain phosphor and / or light scattering particles. For example, the first light transmitting section 61 may be composed of a layer containing phosphor and a layer not containing phosphor. As a material for the first light transmitting section 61, for example, a material similar to that of the resin member of the reflecting member 20 can be used.

[0080] The second light transmitting portion 62 in this embodiment is located above the light source 30. The second light transmitting portion 62 is located above the first light transmitting portion 61. It is preferable that the second light transmitting portion 62 contacts the upper surface of the light source 30 and / or the upper surface of the first light transmitting portion 61. This makes it easier to reduce the size of the light emitting device 1000 in the vertical direction.

[0081] The second light transmitting portion 62 in this embodiment is located between the light source 30 and a light adjustment member 70 described later. In this manner, the light source 30 and the light adjustment member 70 can be fixed by the second light transmitting portion 62. In addition, since the second light transmitting portion 62 is located between the light guide member 50 and the light adjustment member 70, the light emitted from the light guide member 50 is easily incident on the light adjustment member 70 via the second light transmitting portion 62.

[0082] The second light-transmitting portion 62 may be made of, for example, the same material as the resin material of the reflecting member 20. Alternatively, the second light-transmitting portion 62 may be made of a sheet-shaped optical transparent adhesive (OCA) or hot melt resin. The second light-transmitting portion 62 may contain phosphors and / or light-scattering particles.

[0083] As in the light-emitting device 1005 shown in FIG. 14, the light-guiding member 50 may not be provided. In the light-emitting device 1005, the light-emitting region 100A is defined by the outer edge of the first light-transmitting portion 61. The first light-transmitting portion 61 preferably has a hole portion (hereinafter referred to as a light-transmitting hole portion 60C) that opens on the upper surface and / or the lower surface. In this embodiment, the light-transmitting hole portion 60C is a recess that opens only on the upper surface side of the first light-transmitting portion 61. The light-transmitting hole portion 60C may be a recess that opens only on the lower surface side of the first light-transmitting portion 61, or may be a through hole that penetrates from the upper surface to the lower surface of the first light-transmitting portion 61. The first light-transmitting portion 61 includes the light-transmitting hole portion 60C, so that the surface area of ​​the first light-transmitting portion 61 can be increased. In this way, the amount of light extracted from the surface of the first light-transmitting portion 61 to the outside of the first light-transmitting portion 61 can be increased. This makes it easier to adjust the luminance of the light emitting device 1005, and therefore makes it easier to reduce uneven luminance of the light emitting device 1005.

[0084] As shown in FIG. 14, it is preferable that the reflective member 20 is exposed from the first light transmitting portion 61 between the plurality of first light transmitting portions 61. In this way, it is easy to prevent the brightness from becoming too low in the vicinity between the plurality of first light transmitting portions 61. Between the plurality of first light transmitting portions 61, the length in the vertical direction of the reflective member 20 exposed from the first light transmitting portion 61 may be appropriately adjusted. For example, the reflective member 20 may include a recess 20A and / or a protrusion on the upper surface. By positioning the recess 20A of the reflective member 20 between the plurality of first light transmitting portions 61, it is easy to prevent the brightness from becoming too bright in the vicinity between the plurality of first light transmitting portions 61. By positioning the protrusion of the reflective member 20 between the plurality of first light transmitting portions 61, it is easy to prevent the brightness from becoming too dark in the vicinity between the plurality of first light transmitting portions 61. In addition, the reflective member 20 may be divided into a plurality of portions for each light emitting region 100A. In this way, warping of the wiring board 10 and / or the reflecting member 20 due to the difference in thermal expansion coefficient between the wiring board 10 and the reflecting member 20 can be easily reduced.

[0085] (Light adjustment member 70) As shown in FIG. 3, the light emitting device 1000 includes a light adjusting member 70. The light adjusting member 70 has reflectivity and translucency for the light emitted by the light source 30. A part of the light emitted from the light source 30 is reflected by the light adjusting member 70, and the other part is transmitted through the light adjusting member 70. The transmittance of the light adjusting member 70 for the peak wavelength of the light source 30 is lower than the transmittance of the light guiding member 50 for the peak wavelength of the light source 30. For example, the transmittance of the light adjusting member 70 for the peak wavelength of the light source 30 is preferably 1% or more and 50% or less, and more preferably 3% or more and 30% or less. The light adjusting member 70 may be formed of a single layer or may be formed of a laminate of multiple layers.

[0086] 3, the light adjustment member 70 of this embodiment is located above the light source 30. A part of the light adjustment member 70 and the light source 30 overlap in a top view, and the light adjustment member 70 is located above the light source 30 at the overlapping part. By positioning the light adjustment member 70 above the light source 30, it becomes easier to prevent the area directly above the light source 30 from becoming too bright.

[0087] 2, in a top view, at least a part of the outer edge of the light adjustment member 70 is preferably located outside the outer edge of the light guide through hole 50H of the light guide member 50. This can prevent the vicinity of the outer edge of the light guide through hole 50H from becoming too bright. In a top view, the entire outer edge of the light adjustment member 70 may be located outside the outer edge of the light guide through hole 50H. This can further prevent the vicinity of the outer edge of the light guide through hole 50H from becoming too bright.

[0088] The light adjustment member 70 has a third surface 701 facing the upper surface of the light source 30, and a fourth surface 702 located on the opposite side of the third surface 701. The light adjustment member 70 preferably has a hole (hereinafter referred to as a light adjustment hole 70A) that opens to the third surface 701 and / or the fourth surface 702. In this embodiment, the light adjustment hole 70A is a through hole that penetrates from the third surface 701 to the fourth surface 702. The light adjustment hole 70A may be a recess that opens only to the third surface 701 side, or the light adjustment hole 70A may be a recess that opens only to the fourth surface 702 side. The light adjustment member 70 has the light adjustment hole 70A, which makes it easier to adjust the brightness in the area directly above the light adjustment member 70. For example, by changing the size or position of the light adjustment hole 70A, it becomes easier to adjust the light from the light source 30 that is blocked by the light adjustment member 70. This makes it easier to adjust the luminance in the area directly above the light adjusting member 70, making it easier to reduce luminance unevenness in the light emitting device 1000.

[0089] The light adjustment hole 70A of the light adjustment member 70 is preferably located away from the light source 30 in top view. This makes it easier to reduce the area directly above the light source 30 from becoming too bright. The shape of the light adjustment hole 70A in top view is not particularly limited. As shown in FIG. 2, the shape of the light adjustment hole 70A in top view may include a linear portion. The shape of the light adjustment hole 70A in top view may be a circle, an ellipse, or a polygon such as a triangle, a rectangle, a hexagon, or an octagon.

[0090] In top view, it is preferable that the plurality of light adjustment holes 70A surround the light source 30. This makes it easier to adjust the brightness of the light emitting device 1000 in the X direction and / or Y direction. In top view, the light adjustment holes 70A may surround the light source 30 without interruption. This makes it easier to adjust the brightness of the light emitting device 1000 in the X direction and / or Y direction.

[0091] The light adjusting member 70 can be configured by a resin member and a reflector contained in the resin member. For example, the same material as the resin member of the reflecting member 20 can be used as the resin member of the light adjusting member 70. For the reflector of the light adjusting member 70, the same material as the light scattering particles of the reflecting member 20 can be used. A gas such as nitrogen or oxygen may be used as the reflector of the light adjusting member 70. Furthermore, the light adjusting member 70 may contain both light scattering particles and a gas as the reflector.

[0092] Next, an example of a method for manufacturing the light emitting device 1000 will be described with reference to FIGS. 15A to 19.

[0093] As shown in FIG. 15A, an intermediate body 200 including a wiring board 10 and a reflective member 20 located on the upper side of the wiring board 10 is prepared. The intermediate body 200 can be prepared by manufacturing or by receiving, including purchasing. The wiring board 10 includes a wiring 10P. The reflective member 20 includes a reflective through-hole 20H. At least a part of the wiring 10P is exposed from the reflective member 20 in the reflective through-hole 20H. A reflective member that does not include a reflective through-hole 20H may be referred to as an intermediate reflective member. The step of preparing the intermediate body 200 may include a step of forming an intermediate reflective member on the wiring board 10 and a step of forming a reflective through-hole 20H in the intermediate reflective member. The reflective member 20 can be created by forming the reflective through-hole 20H in the intermediate reflective member. The reflective through-hole 20H can be formed by a known method such as laser processing and drill processing. For example, a CO2 laser may be used to form the reflective through-hole 20H. In addition, debris generated by using a CO2 laser may be removed by a UV laser. In each process, the fact that intermediate parts may be prepared through transfer or the like will be omitted as appropriate.

[0094] The intermediate body 200 may include a conductive connecting member 10C that contacts the wiring 10P. For example, as shown in FIG. 15B, first, an intermediate reflective member 20M is formed to cover the upper surface of the wiring 10P and the upper surface of the connecting member 10C. The method of forming the intermediate reflective member 20M is not particularly limited. For example, the intermediate reflective member 20M may be formed by applying a liquid intermediate reflective member 20M before curing to the upper surface of the wiring 10P and the upper surface of the connecting member 10C, and curing the intermediate reflective member 20M before curing. Alternatively, the intermediate reflective member 20M in the A-stage state may be disposed on the upper surface of the wiring 10P and the upper surface of the connecting member 10C, and the intermediate reflective member 20M in the A-stage state may be cured to form the intermediate reflective member 20M. In this specification, the A-stage state refers to an uncured state. The uncured state refers to a state before the curing reaction progresses, that is, a state before an operation for progressing the curing reaction is performed. Examples of the operation for progressing the curing reaction include heating and light irradiation. In addition, the curing reaction may proceed slightly before the operation for proceeding with the curing reaction, but the uncured state also includes such a state. Furthermore, the A-stage state is not liquid and does not have flowability. For example, a liquid resin material containing a solvent such as cyclohexane is applied onto a support, and then most of the solvent is evaporated to make the material non-flowable on the support, which can be used as a member in the A-stage state.

[0095] After forming the intermediate reflection member 20M that covers the upper surface of the wiring 10P and the upper surface of the connecting member 10C, as shown in FIG. 15C, the reflection member 20 is created by forming the reflection through hole 20H in the intermediate reflection member 20M. In this manner, an intermediate body 200 including the wiring board 10 and the reflection member 20 located on the upper side of the wiring board 10 may be prepared. In the reflection through hole 20H, at least a part of the connecting member 10C is exposed from the reflection member 20. Since the intermediate body 200 includes the connecting member 10C, for example, when the reflection through hole 20H is formed by irradiation of laser light, it is easy to reduce damage to the wiring 10P by the laser light. In a top view, the connecting member 10C may be located at least in a part of the reflection through hole 20H. In a top view, it is preferable that the connecting member 10C is located on the entire surface of the reflection through hole 20H. In this manner, when the reflection through hole 20H is formed by irradiation of laser light, it is easy to further reduce damage to the wiring 10P by the laser light.

[0096] The intermediate 200 may include a first adhesive layer 81 located between the wiring board 10 and the reflective member 20. For example, as shown in FIG. 15D, a reflective member 20 and a first adhesive layer 81 covering the lower surface of the reflective member 20 are prepared. The reflective member 20 includes a plurality of reflective through holes 20H including a first through hole 21H and a second through hole 22H. The first adhesive layer 81 includes a plurality of adhesive through holes 80H including a first adhesive through hole 81H connected to the first through hole 21H and a second adhesive through hole 82H connected to the second through hole 22H. After bonding a reflective member not including a through hole and the first adhesive layer, the reflective through hole 20H and the adhesive through hole 80H may be formed by a known method such as laser processing and drilling, or the reflective member 20 including the reflective through hole 20H and the first adhesive layer 81 including the adhesive through hole 80H may be bonded together. 15E, the wiring board 10 and the reflective member 20 are fixed via the first adhesive layer 81. In this manner, an intermediate body 200 including the wiring board 10 and the reflective member 20 located on the upper side of the wiring board 10 may be prepared.

[0097] After preparing the intermediate body 200, as shown in FIG. 16, the wiring board 10 and the light source 30 are electrically connected by the bonding member 40 arranged in the reflective through hole. The bonding member 40 includes a conductive portion 40E and a resin portion 40R. The conductive portion 40E electrically connects the wiring board 10 and the light source 30. The resin portion 40R contacts the conductive portion 40E, the light source 30, and the reflective member 20. The resin portion 40R contacts the light source 30 and the reflective member 20, which makes it easier to improve the bonding strength between the light source 30 and the reflective member 20. As the bonding member 40 before curing, a conductive paste in which metal particles that become the conductive portion 40E and flux that becomes the resin portion 40R are mixed may be used. In this way, the conductive portion 40E and the resin portion 40R can be formed in the same process. In addition, the resin portion 40R that contacts the conductive portion 40E may be formed after the conductive portion 40E is formed.

[0098] After electrically connecting the wiring board 10 and the light source 30 with the bonding member 40, the light guide member 50 is disposed on the upper side of the reflecting member 20 as shown in FIG. 17. The light guide member 50 includes a light guide through hole 50H. The light source 30 is located within the light guide through hole 50H. The reflecting member 20 and the light guide member 50 are fixed together by a second adhesive layer 82 disposed between the reflecting member 20 and the light guide member 50.

[0099] After arranging the light guiding member 50 on the upper side of the reflecting member 20, a first light transmitting portion 61 covering the side surface of the light source 30 is formed as shown in Fig. 18. After forming the first light transmitting portion 61 covering the side surface of the light source 30, the light adjusting member 70 is fixed to the first light transmitting portion 61 by the second light transmitting portion 62. In this manner, the light emitting device 1000 shown in Fig. 3 can be manufactured. When the light emitting device does not include the second light transmitting portion 62, the first light transmitting portion 61 and the light adjusting member 70 may be directly bonded to each other.

[0100] In this specification, a light adjusting member 70 that does not include a light adjusting hole portion 70A may be referred to as a light adjusting intermediate member 71. As shown in Fig. 19, the light adjusting intermediate member 71 may be fixed to the first light transmitting portion 61 by the second light transmitting portion 62. After the light adjusting intermediate member 71 and the first light transmitting portion 61 are fixed by the second light transmitting portion 62, the light adjusting hole portion 70A may be formed in the light adjusting intermediate member 71 in a known direction such as laser processing or drilling. By forming the light adjusting hole portion 70A in the light adjusting intermediate member 71, the light adjusting member 70 can be produced.

[0101] This specification discloses a light emitting device described in the following items. [Item 1] a wiring board having a first wiring and a second wiring on an upper surface thereof; a reflecting member located above the wiring board and having a first through hole including a first inclined surface that widens upward; a light source located above the reflecting member and having a first electrode and a second electrode; a bonding member including a first conductive portion located in the first through hole and electrically connecting the first wiring and the first electrode, and a resin portion in contact with the first inclined surface, the light source, and the first conductive portion; A light emitting device comprising: [Item 2] the bonding member further includes a second conductive portion that electrically connects the second wiring and the second electrode, the reflecting member has a second through hole including a second inclined surface that widens upward, The second conductive portion is located within the second through hole, 2. The light emitting device according to item 1, wherein the resin portion is in contact with the second inclined surface and the second conductive portion. [Item 3] 3. The light-emitting device according to item 2, wherein in a first cross section passing through the first electrode and the second electrode and perpendicular to the top surface of the wiring substrate, a minimum length from an upper end of a part of the first conductive portion that contacts the first inclined surface to an upper end of a part of the second conductive portion that contacts the second inclined surface is shorter than a minimum length from the first wiring to the second wiring. [Item 4] 4. The light emitting device according to claim 1, wherein a part of the resin portion is located outside the light source when viewed from above. [Item 5] in a first cross section passing through the first electrode and the second electrode and perpendicular to the top surface of the wiring substrate, the first inclined surface includes a first inclined first surface located on the second electrode side and a first inclined second surface opposed to the first inclined first surface, 5. The light emitting device according to claim 1, wherein a length in the vertical direction of a part of the resin part that is in contact with the first inclined second surface is longer than a length in the vertical direction of a part of the resin part that is in contact with the first inclined first surface. [Item 6] The reflective member includes a resin material, the light source includes a light emitting element and a coating member including a resin material, 6. The light emitting device according to claim 1, wherein the resin portion is in contact with the covering member. [Item 7] 7. The light emitting device according to claim 1, wherein a refractive index of a base material of the resin portion is higher than a refractive index of a base material of the reflective member. [Item 8] 8. The light emitting device according to claim 1, further comprising a conductive connecting member that is in contact with the first wiring and the first conductive portion and is located inside the first through hole in a top view.

[0102] The above describes the embodiments of the present invention with reference to specific examples. However, the present invention is not limited to these specific examples. All forms that can be implemented by a person skilled in the art through appropriate design modifications based on the above-described embodiments of the present invention also belong to the scope of the present invention as long as they include the gist of the present invention. In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modified examples and examples of modifications, and these modified examples and examples of modifications also belong to the scope of the present invention. [Explanation of symbols]

[0103] 10 Wiring board 20 Reflective material 30 light source 40 Joint materials 50 Light guide member 60 Translucent material 70 Light adjustment materials 81 1st adhesive layer 82 Second adhesive layer 90 Insulating layer 1000, 1001, 1002, 1003, 1004, 1005 Light-emitting device

Claims

1. a wiring board having a first wiring and a second wiring on an upper surface thereof; a reflecting member located above the wiring board and having a first through hole including a first inclined surface that widens upward; a light source located above the reflecting member and having a first electrode and a second electrode; a bonding member including a first conductive portion located in the first through hole and electrically connecting the first wiring and the first electrode, and a resin portion in contact with the first inclined surface, the light source, and the first conductive portion; A light emitting device comprising:

2. the bonding member further includes a second conductive portion electrically connecting the second wiring and the second electrode, the reflecting member has a second through hole including a second inclined surface that widens upward, The second conductive portion is located in the second through hole, The light emitting device according to claim 1 , wherein the resin portion is in contact with the second inclined surface and the second conductive portion.

3. 3. The light-emitting device of claim 2, wherein in a first cross section passing through the first electrode and the second electrode and perpendicular to the top surface of the wiring substrate, the minimum length from an upper end of a portion of the first conductive portion that contacts the first inclined surface to an upper end of a portion of the second conductive portion that contacts the second inclined surface is shorter than the minimum length from the first wiring to the second wiring.

4. The light emitting device according to claim 1 , wherein a part of the resin portion is located outside the light source when viewed from above.

5. in a first cross section passing through the first electrode and the second electrode and perpendicular to the top surface of the wiring substrate, the first inclined surface includes a first inclined first surface located on the second electrode side and a first inclined second surface opposed to the first inclined first surface, 4. The light emitting device according to claim 1, wherein a length in the vertical direction of a portion of the resin part in contact with the first inclined second surface is longer than a length in the vertical direction of a portion of the resin part in contact with the first inclined first surface.

6. The reflective member includes a resin material, the light source includes a light emitting element and a coating member including a resin material, The light emitting device according to claim 1 , wherein the resin portion is in contact with the covering member.

7. The light emitting device according to claim 1 , wherein a refractive index of a base material of the resin portion is higher than a refractive index of a base material of the reflective member.

8. The light emitting device according to claim 1 , further comprising a conductive connecting member that is in contact with the first wiring and the first conductive portion and is located inside the first through hole in a top view.

Images